WO2017181860A1 - 柔性基板的剥离方法 - Google Patents

柔性基板的剥离方法 Download PDF

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Publication number
WO2017181860A1
WO2017181860A1 PCT/CN2017/079893 CN2017079893W WO2017181860A1 WO 2017181860 A1 WO2017181860 A1 WO 2017181860A1 CN 2017079893 W CN2017079893 W CN 2017079893W WO 2017181860 A1 WO2017181860 A1 WO 2017181860A1
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WO
WIPO (PCT)
Prior art keywords
flexible substrate
substrate
base substrate
protective film
ultraviolet light
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Application number
PCT/CN2017/079893
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English (en)
French (fr)
Inventor
谢明哲
谢春燕
刘陆
王和金
郭远征
Original Assignee
京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/574,068 priority Critical patent/US10882221B2/en
Publication of WO2017181860A1 publication Critical patent/WO2017181860A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/44—Number of layers variable across the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Definitions

  • the present disclosure relates to the field of flexible display technologies, and in particular, to a method of peeling a flexible substrate.
  • the flexible display device is a display device formed based on a flexible substrate.
  • Flexible display devices are becoming more and more widely used due to their characteristics of being deformable and bendable.
  • the flexible substrate In the process of fabricating the flexible display device, the flexible substrate needs to be peeled off from the base substrate. Before the flexible substrate is peeled off, the protective film needs to be adhered to the flexible substrate through the adhesive, and then the flexible substrate is irradiated by laser stripping technology. The flexible substrate is separated from the substrate, and finally the tool is inserted from the side of the adhesive between the protective film and the substrate to cut the adhesive to remove the flexible substrate.
  • the adhesive adheres again due to the high adhesive adhesion, making the peeling of the flexible substrate less efficient.
  • a method of stripping a flexible substrate comprising the steps of:
  • the method further includes:
  • the barrier layer pattern Located at the periphery of the flexible substrate.
  • step (c) includes:
  • the ultraviolet light is transmitted through the base substrate to illuminate a predetermined area in the area covered by the protective film on the base substrate, and the predetermined area is a partial area around the flexible substrate.
  • the barrier layer pattern comprises a plurality of sub-blocking structures arranged on a periphery of the flexible substrate.
  • the sub-blocking structure is a rectangular structure.
  • the width of the rectangular structure ranges from 0.1 mm to 1.0 mm, and the width direction of the rectangular structure is parallel to the arrangement direction of the rectangular structure.
  • the ratio of the width of the rectangular structure to the width of the gap ranges from 1:1 to 1:5, and the width direction of the rectangular structure is parallel to the arrangement direction of the rectangular structure, and the gap width is The distance between the gaps of the adjacent two sub-blocking structures.
  • the barrier layer pattern is formed of a metal material.
  • the thickness of the barrier layer is in a range of to
  • the flexible substrate is a transparent substrate.
  • the method further includes:
  • a display element is formed on the flexible substrate.
  • FIG. 1 is a flow chart of a method for peeling a flexible substrate according to an embodiment of the present disclosure
  • FIG. 2 is a side view of a laminate in a process of preparing a flexible substrate according to an embodiment of the present disclosure
  • FIG. 3 is a side view of a laminate in a process of preparing a flexible substrate according to an embodiment of the present disclosure
  • FIG. 4 is a top plan view of a laminate in a process of preparing a flexible substrate according to an embodiment of the present disclosure
  • FIG. 5 is a laminate in a process of preparing a flexible substrate according to an embodiment of the present disclosure. Side view.
  • FIG. 1 is a flow chart of a method for peeling a flexible substrate according to an embodiment of the present disclosure. As shown in FIG. 1, the method includes:
  • Step 101 Form a flexible substrate on the base substrate, wherein a planar area of the flexible substrate is smaller than a planar area of the base substrate.
  • a flexible substrate 2 is prepared on the base substrate 1. Further, the planar area of the flexible substrate 2 is smaller than the planar area of the base substrate 1, and the base substrate 1 completely covers the flexible substrate 2.
  • the base substrate 1 is a transparent substrate. Preferably, the base substrate 1 is a glass substrate.
  • the barrier layer pattern 3 may be formed on the base substrate 1 on which the flexible substrate 2 is formed, so that in the subsequent step, the periphery of the flexible substrate 2 is also That is, the region of the barrier layer pattern 3 and the base substrate 1 still have a certain adhesive force to prevent the flexible substrate 2 from falling off the base substrate 1.
  • a patterning process such as photoresist coating, exposure, development, etching, and stripping of the photoresist may be performed.
  • a barrier layer pattern 3 is formed on the base substrate 1. As shown in FIG. 4, the barrier pattern 3 is located on the periphery of the flexible substrate 2.
  • the barrier layer pattern 3 includes a plurality of sub-barrier structures arranged on the periphery of the flexible substrate 2.
  • the sub-blocking structure may be a rectangular structure or other graphic structure, which is not limited by the embodiments of the present disclosure.
  • the width of the rectangular structure ranges from 0.1 mm (mm) to 1.0 mm, and the width direction of the rectangular structure is parallel to the arrangement direction of the rectangular structure, that is, The width direction of the rectangular structure is parallel to the boundary of the adjacent flexible substrate 2.
  • the width of the rectangular structure is the distance between the two sides a and b of the sub-blocking structure.
  • the width of the rectangular structure and the gap width between two adjacent sub-blocking structures may be arranged according to a certain ratio, the gap width being two adjacent sub-blocking structures.
  • the width of the rectangular structure is The ratio of the gap width ranges from 1:1 to 1:5, and the sub-barrier structure can be arranged in different ratios in order to carry out the adhesion between the periphery of the flexible substrate 2 and the substrate 1 in a subsequent step. control.
  • the barrier layer pattern 3 is formed of a metal material, and the metal material is selected from the group consisting of Ag, Al, Mo, and the like.
  • the thickness of the barrier layer pattern 3 ranges from (A) to
  • the display element may be formed on the flexible substrate 2 before the barrier layer pattern 3 is formed, or may be formed while forming the barrier layer pattern 3.
  • a display element is formed on the flexible substrate 2.
  • Step 102 attaching a protective film by ultraviolet light-reducing adhesive on the base substrate on which the flexible substrate is formed, wherein a planar area of the flexible substrate is smaller than a planar area of the protective film, and the protective film passes through The ultraviolet light reducing adhesive is adhered to the base substrate.
  • the protective film 5 is pasted on the base substrate 1 on which the flexible substrate 2 is formed by ultraviolet (UV) degreaser 4 so that the protective film 5 can cover the area where the flexible substrate 2 is located and The area around the periphery of the flexible substrate 2.
  • UV ultraviolet
  • the "ultraviolet light-reducing adhesive” mentioned in the present disclosure which means an adhesive which can significantly reduce the viscosity when irradiated with ultraviolet light.
  • the ultraviolet light reducing adhesive are, for example, an aliphatic urethane acrylate oligomer, an aromatic urethane acrylate oligomer, and the like.
  • a commercially available product of the ultraviolet light-reducing adhesive is, for example, PL2360UV produced by Hongrui New Materials Co., Ltd.
  • the planar area of the flexible substrate 2 is smaller than the planar area of the protective film 5. After the ultraviolet light-reducing adhesive 4 is irradiated with ultraviolet light, the adhesive force is greatly reduced to remove the flexible substrate 2 from the base substrate 1.
  • Step 103 irradiate the substrate substrate with an area covered by the protective film on the substrate by ultraviolet light.
  • the barrier layer pattern 3 may be disposed on the base substrate 1, the barrier layer pattern 3 may not be provided, in order to prevent the flexible substrate 2 from appearing on the substrate substrate 1 before the separation of the protective film 5 and the flexible substrate 2 is performed.
  • all regions or partial regions covered by the protective film 5 on the base substrate 1 may be irradiated with ultraviolet light, and embodiments of the present disclosure are exemplified by the following two aspects:
  • the barrier layer pattern 3 when the barrier layer pattern 3 is formed on the base substrate 1, it can be irradiated with ultraviolet light.
  • the substrate substrate 1 may be irradiated with ultraviolet light from the substrate substrate 1 side toward the flexible substrate 2 side, and the irradiation region is the entire region covered by the protective film 5, and after being irradiated with ultraviolet light, the ultraviolet light is irradiated.
  • the adhesion of the ultraviolet light-reducing adhesive 4 is largely lowered, so that the flexible substrate 2 can be easily removed from the base substrate 1 in a subsequent step.
  • the barrier layer pattern 3 blocks the ultraviolet light during the ultraviolet light irradiation to prevent the ultraviolet light from being irradiated onto the barrier layer pattern 3 by the ultraviolet light.
  • the glue 4 since the ultraviolet light-reducing adhesive 4 at the corresponding barrier pattern 3 is not irradiated by ultraviolet light, the adhesive force remains unchanged, so that the flexible substrate 2 and the substrate substrate 1 have a certain adhesive force, which can be protected. Before the film 5 and the flexible substrate 2 are peeled off, the occurrence of the flexible substrate 2 falling from the base substrate 1 or the like is prevented from occurring.
  • a portion of the substrate substrate 1 covered by the protective film 5 may be irradiated with ultraviolet light:
  • a predetermined area in a region covered by the protective film 5 on the base substrate 1 may be irradiated with ultraviolet light through the base substrate 1.
  • the predetermined area is a partial area covered by the protective film 5, for example, the pre- The area may be a region where the flexible substrate 2 is located and a partial region of the periphery of the flexible substrate 2, that is, a portion covered by the protective film 5 except for a partial region of the periphery of the flexible substrate 2; the preset region is also It may be a partial area of the periphery of the flexible substrate 2, which is not limited by the embodiment of the present disclosure.
  • the ultraviolet light-reducing adhesive 4 located in the predetermined area is greatly reduced in adhesion after being irradiated with ultraviolet light, so that the flexible substrate 2 can be easily peeled off from the base substrate 1 in a subsequent step.
  • the ultraviolet light-reducing adhesive located outside the preset area is not irradiated by ultraviolet light, and the adhesive force remains unchanged, so that the flexible substrate 2 and the base substrate 1 have a certain adhesive force, and the protective film 5 and the flexible film can be performed. Before the substrate 2 is peeled off, the occurrence of the flexible substrate 2 falling from the base substrate 1 or the like is prevented from occurring.
  • the substrate surface of the flexible substrate 2 may be rectangular, has four sides, and correspondingly has four peripheral regions.
  • the region covered by the protective film 5 is irradiated with ultraviolet light, a part of the four peripheral regions may not be irradiated. Only the region where the flexible substrate 2 is located and the region of the remaining portion of the four peripheral regions of the periphery of the flexible substrate 2 are irradiated.
  • the flexible substrate 2 can absorb ultraviolet light. Energy is transmitted through the flexible substrate 2 to the ultraviolet light located in the corresponding region of the flexible substrate 2 The amount of ultraviolet light on the viscous adhesive 4 is greatly reduced, and is close to none. Therefore, the ultraviolet viscous adhesive 4 located in the flexible substrate 2 region still maintains an effective adhesive force, and the adhesion of the protective film 5 and the flexible substrate 2 can be ensured. Keep the relative position of the two after peeling off.
  • the barrier layer pattern 3 when the barrier layer pattern 3 is formed on the base substrate 1, a portion of the substrate substrate 1 covered by the protective film 5 may be irradiated with ultraviolet light, and the partial region may be referred to the second aspect.
  • the definition of the preset area Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the above two aspects are intended to be included within the scope of the present invention. The embodiments of the present disclosure do not describe this.
  • the ultraviolet light irradiation process may be continued for a preset duration, and the preset duration may be set by a specific case, which is not limited by the embodiment of the present disclosure.
  • Step 104 After the ultraviolet light irradiation is completed, the protective film and the flexible substrate are peeled off from the base substrate.
  • the flexible substrate 2 can absorb the energy of the ultraviolet light to generate heat, which can cause a gap between the flexible substrate 2 and the base substrate 1, and the adhesion between the flexible substrate 2 and the substrate 1 decreases.
  • the flexible substrate 2 can be peeled off from the base substrate 1 with a small external force, and since the adhesion of the ultraviolet light-reducing adhesive 4 is lowered by the ultraviolet light, the blade can be easily peeled off from the base substrate 1 at the same time.
  • the substrate 2 and the protective film 5 are adhered to each other, and the flexible substrate 2 and the protective film 5 are peeled off from each other, and the relative positions are not changed.
  • a method for peeling off a flexible substrate provided by an embodiment of the present disclosure, by forming a flexible substrate on a base substrate, pasting a protective film on the base substrate on which the flexible substrate is formed by ultraviolet light ultraviolet light reducing adhesive, using ultraviolet light
  • the region covered by the protective film on the substrate is irradiated through the base substrate, and after the ultraviolet light irradiation is completed, the protective film and the flexible substrate are peeled off from the substrate.
  • the viscosity of the ultraviolet light reducing adhesive can be adjusted by the difference of the patterning of the barrier layer pattern, and the viscosity of the ultraviolet light reducing adhesive can also be adjusted by the difference of the ultraviolet irradiation region, thereby The integrated peeling of the flexible substrate and the protective film is achieved.
  • the hardware may be used to execute the related hardware, and the program may be stored in a computer readable storage medium.
  • the storage medium mentioned above may be a read only memory, a magnetic disk or an optical disk.

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Abstract

一种柔性基板的剥离方法，属于柔性显示技术领域。所述方法包括下列步骤：（a）在衬底基板（1）上形成柔性基板（2），其中所述柔性基板（2）的平面面积小于所述衬底基板（1）的平面面积；（b）在形成有所述柔性基板（2）的衬底基板（1）上通过紫外光减黏胶（4）粘贴保护膜（5），其中所述柔性基板（2）的平面面积小于所述保护膜（5）的平面面积，并且所述保护膜（5）还通过所述紫外光减黏胶（4）粘贴到所述衬底基板（1）；（c）用紫外光透过所述衬底基板（1）照射所述衬底基板（1）上所述保护膜（5）覆盖的区域；和（d）在所述紫外光照射完成后，从所述衬底基板（1）剥离所述保护膜（5）和所述柔性基板（2）。通过在衬底基板（1）上形成柔性基板（2），并采用紫外光减黏胶（4）粘贴保护膜（5），避免了对黏胶进行切割后黏胶会再次粘合的问题，提高了剥离柔性基板（2）的效率，增加了剥离柔性基板（2）的灵活性。

Description

柔性基板的剥离方法 技术领域
本公开内容涉及柔性显示技术领域，特别涉及一种柔性基板的剥离方法。
背景技术
柔性显示装置是一种基于柔性基板制作形成的显示装置。由于柔性显示装置具有可变形、可弯曲等特点，柔性显示装置得到越来越广泛的应用。
在制作柔性显示装置的过程中，需要从衬底基板上剥离柔性基板，在剥离柔性基板前，需要通过黏胶将保护膜粘贴在柔性基板上，再采用激光剥离技术对柔性基板进行照射，使得柔性基板与衬底基板分离，最后从保护膜与衬底基板之间的黏胶的侧面插入刀具，对黏胶进行切割，以便取下柔性基板。
在实现本公开内容的过程中，发明人发现现有技术至少存在以下问题：
在对黏胶进行切割后，由于黏胶黏着力较高，黏胶会再次粘合，使得剥离柔性基板的效率较低。
发明内容
为了解决现有技术的问题，本公开内容的实施例提供了一种柔性基板的剥离方法。所述技术方案如下：
一方面，提供了一种柔性基板的剥离方法，所述方法包括下列步骤：
(a)在衬底基板上形成柔性基板，其中所述柔性基板的平面面积小于所述衬底基板的平面面积；
(b)在形成有所述柔性基板的衬底基板上通过紫外光减黏胶粘贴保护膜，其中所述柔性基板的平面面积小于所述保护膜的平面面积，并且所述保护膜还通过所述紫外光减黏胶粘贴到所述衬底基板；
(c)用紫外光透过所述衬底基板照射所述衬底基板上所述保护膜覆盖的区域；和
(d)在所述紫外光照射完成后，从所述衬底基板剥离所述保护膜和所述柔性基板。
可选的，在步骤(b)之前，所述方法还包括：
在形成有所述柔性基板的衬底基板上形成阻挡层图形，所述阻挡层图形 位于所述柔性基板的外围。
可选的，步骤(c)包括：
用所述紫外光透过所述衬底基板照射所述衬底基板上所述保护膜覆盖的区域中的预设区域，所述预设区域为所述柔性基板外围的部分区域。
可选的，所述阻挡层图形包括多个子阻挡结构，所述多个子阻挡结构阵列排布在所述柔性基板的外围。
可选的，所述子阻挡结构为矩形结构。
可选的，所述矩形结构的宽度的取值范围为0.1mm至1.0mm，所述矩形结构的宽度方向与所述矩形结构的排布方向平行。
可选的，所述矩形结构的宽度与空隙宽度的比例的取值范围为1∶1至1∶5，所述矩形结构的宽度方向与所述矩形结构的排布方向平行，所述空隙宽度为相邻两个子阻挡结构的间隙的距离。
可选的，所述阻挡层图形由金属材料形成。
可选的，所述阻挡层图形的厚度的取值范围为
Figure PCTCN2017079893-appb-000001
至
Figure PCTCN2017079893-appb-000002
可选的，所述柔性基板是透明基板。
可选的，在步骤(b)之前，所述方法还包括：
在所述柔性基板上形成显示元件。
附图说明
为了更清楚地说明本公开内容的实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本公开内容的实施例提供的一种柔性基板的剥离方法的流程图；
图2是本公开内容的实施例提供的一种柔性基板制备过程中的层叠体的侧视图；
图3是本公开内容的实施例提供的一种柔性基板制备过程中的层叠体的侧视图；
图4是本公开内容的实施例提供的一种柔性基板制备过程中的层叠体的俯视图；
图5是本公开内容的实施例提供的一种柔性基板制备过程中的层叠体 的侧视图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明实施方式作进一步地详细描述。
图1是本公开内容的实施例提供的一种柔性基板的剥离方法的流程图，如图1所示，该方法包括：
步骤101、在衬底基板上形成柔性基板，其中所述柔性基板的平面面积小于所述衬底基板的平面面积。
具体地，如图2所示，在衬底基板1上制备柔性基板2。进一步地，柔性基板2的平面面积小于衬底基板1的平面面积，且衬底基板1完全覆盖柔性基板2。其中，该衬底基板1是透明基板，优选地，该衬底基板1是玻璃基板。
需要说明的是，在衬底基板1上形成柔性基板2之后，还可以在形成有柔性基板2的衬底基板1上形成阻挡层图形3，以便在后续步骤中，柔性基板2的外围，也即是阻挡层图形3的区域与衬底基板1之间仍然具有一定的黏着力，防止柔性基板2从衬底基板1上掉落。
示例的，如图3所示，在形成有柔性基板2的衬底基板1的基础上，可以通过一次构图工艺，如光刻胶涂覆、曝光、显影、刻蚀和剥离光刻胶等工艺，在衬底基板1上形成阻挡层图形3。如图4所示，该阻挡层图形3位于柔性基板2的外围。
进一步地，如图4所示，该阻挡层图形3包括多个子阻挡结构，该多个子阻挡结构阵列排布在该柔性基板2的外围。该子阻挡结构可以为矩形结构，也可以为其他图形结构，本公开内容的实施例对此不做限定。
其中，当该子阻挡结构为矩形结构时，该矩形结构的宽度的取值范围为0.1mm(毫米)至1.0mm，该矩形结构的宽度方向与该矩形结构的排布方向平行，也即是该矩形结构的宽度方向与相邻的柔性基板2的边界平行，如图4所示，该矩形结构的宽度即为子阻挡结构的a、b两边之间的距离。
而且，具有矩形结构的子阻挡结构进行阵列排布时，可以根据该矩形结构的宽度和相邻两个子阻挡结构间的空隙宽度按照一定的比例排布，该空隙宽度为相邻两个子阻挡结构之间的最短距离。优选地，该矩形结构的宽度与 该空隙宽度的比例的取值范围为1∶1至1∶5，可以采用不同的比例排布子阻挡结构，以便在后续步骤中对柔性基板2的外围与衬底基板1之间的黏着力进行控制。
进一步地，该阻挡层图形3是由金属材料形成的，并且所述金属材料选自下列各项：Ag、Al、Mo等。优选地，该阻挡层图形3的厚度的取值范围为
Figure PCTCN2017079893-appb-000003
(埃)至
Figure PCTCN2017079893-appb-000004
另外，需要说明的是，在衬底基板1上制备完成柔性基板2之后，还可以在形成阻挡层图形3之前在该柔性基板2上形成显示元件，也可以在形成阻挡层图形3的同时在该柔性基板2上形成显示元件。
步骤102、在形成有所述柔性基板的衬底基板上通过紫外光减黏胶粘贴保护膜，其中所述柔性基板的平面面积小于所述保护膜的平面面积，并且所述保护膜还通过所述紫外光减黏胶粘贴到所述衬底基板。
具体地，如图5所示，在形成有柔性基板2的衬底基板1上通过紫外光(UV)减黏胶4粘贴保护膜5，使得该保护膜5能够覆盖柔性基板2所在的区域以及柔性基板2外围的区域。
对在本公开内容中提及的“紫外光减黏胶”没有特定限制，其是指当用紫外光照射时能够显著降低粘性的粘合剂。所述紫外光减黏胶的具体实例为例如脂肪族聚氨酯丙烯酸酸酯低聚物、芳香族聚氨酯丙烯酸酸酯低聚物等。所述紫外光减黏胶的可商购产品例如为由宏瑞新材料公司生产的PL2360UV。
其中，该柔性基板2的平面面积小于该保护膜5的平面面积，该紫外光减黏胶4经过紫外光照射后，黏着力大幅度下降，以便从衬底基板1上取下柔性基板2。
步骤103、用紫外光透过该衬底基板照射该衬底基板上该保护膜覆盖的区域。
实际应用中，由于衬底基板1上可以设置阻挡层图形3，也可以不设置阻挡层图形3，为了在进行保护膜5和柔性基板2剥离之前，防止出现柔性基板2从衬底基板1上掉落等情况，可以用紫外光照射该衬底基板1上该保护膜5覆盖的全部区域或部分区域，本公开内容的实施例以以下两方面进行举例说明：
第一方面，在衬底基板1上形成有阻挡层图形3时，可以用紫外光照射 该衬底基板1上该保护膜5覆盖的全部区域：
示例的，可以从衬底基板1侧透过该衬底基板1向柔性基板2侧照射紫外光，照射区域为保护膜5所覆盖的全部区域，经过紫外光照射后，被紫外光照射后的紫外光减黏胶4的黏着力大幅度下降，从而可以在后续步骤中方便地从衬底基板1上取下柔性基板2。
进一步地，由于衬底基板1上形成有阻挡层图形3，则在上述紫外光照射过程中，阻挡层图形3将紫外光阻挡，防止紫外光照射到该阻挡层图形3上的紫外光减黏胶4，由于对应阻挡层图形3处的紫外光减黏胶4未被紫外光照射，黏着力保持不变，使得柔性基板2与衬底基板1之间具有一定的黏着力，可以在进行保护膜5和柔性基板2剥离之前，防止出现柔性基板2从衬底基板1上掉落等情况。
第二方面，在衬底基板1上未形成有阻挡层图形3时，可以用紫外光照射该衬底基板1上该保护膜5覆盖的部分区域：
示例的，可以用紫外光透过该衬底基板1照射该衬底基板1上保护膜5覆盖的区域中的预设区域，该预设区域是保护膜5覆盖的部分区域，例如，该预设区域可以为柔性基板2所在的区域以及柔性基板2外围的部分区域，即除柔性基板2外围的部分区域以外，其他被保护膜5所覆盖的区域均为预设区域；该预设区域也可以为柔性基板2外围的部分区域，本公开内容的实施例对此不做限定。位于预设区域内的紫外光减黏胶4经过紫外光照射后黏着力大幅度下降，从而可以在后续步骤中方便地从衬底基板1上剥离柔性基板2。另外，位于预设区域以外的紫外光减黏胶未被紫外光照射，黏着力保持不变，使得柔性基板2与衬底基板1之间具有一定的黏着力，可以在进行保护膜5和柔性基板2剥离之前，防止出现柔性基板2从衬底基板1上掉落等情况。
例如，柔性基板2的基板面可以为矩形，有四边，相应的也具有四个周边区域，在用紫外光照射保护膜5覆盖的区域时，可以不照射上述四个周边区域中的部分区域，只照射柔性基板2所在的区域以及柔性基板2外围的四个周边区域中剩余部分的区域。
需要说明的是，在用紫外光透过该衬底基板1照射该衬底基板1上该保护膜5覆盖的区域，若紫外光照射到柔性基板2上，由于柔性基板2能够吸收紫外光的能量，透过柔性基板2传递到位于柔性基板2对应区域的紫外光 减黏胶4上的紫外光的量大大减少，趋近于无，因此位于柔性基板2区域的紫外光减黏胶4仍然保持有效的黏着力，可以保证保护膜5和柔性基板2的粘连，保持两者在剥离后相对位置不变。
值得说明的是，在衬底基板1上形成有阻挡层图形3时，也可以用紫外光照射该衬底基板1上该保护膜5覆盖的部分区域，该部分区域可以参考上述第二方面中预设区域的定义。凡在上述两方面的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。本公开内容的实施例对此不做赘述。
进一步地，上述紫外光照射过程可以持续预设时长，该预设时长可由具体情况设定，本公开内容的实施例对此不做限定。
步骤104、在该紫外光照射完成后，从衬底基板剥离保护膜和柔性基板。
在紫外光照射的过程中，柔性基板2可以吸收紫外光的能量产生热量，该热量可以使得柔性基板2与衬底基板1产生间隙，柔性基板2与衬底基板1之间的黏着力下降，只需微小外力即可从衬底基板1上剥离柔性基板2，而且由于紫外光减黏胶4的黏着力在紫外光的照射下降，因此可以方便地采用刀片从衬底基板1上同时剥离柔性基板2和保护膜5，且剥离下的柔性基板2和保护膜5相互粘连，相对位置不变。
本公开内容的实施例提供的柔性基板的剥离方法，通过在衬底基板上形成柔性基板，在形成有柔性基板的衬底基板上通过紫外光紫外光减黏胶粘贴保护膜，用紫外光透过衬底基板照射衬底基板上保护膜覆盖的区域，在紫外光照射完成后，从衬底基板剥离保护膜和柔性基板。通过在衬底基板上形成柔性基板，并采用紫外光减黏胶粘贴保护膜，避免了对黏胶进行切割后黏胶会再次粘合的问题，提高了剥离柔性基板的效率，增加了剥离柔性基板的灵活性。进一步地，本公开内容的实施例中，可以通过阻挡层图形的构图的不同来调节紫外光减黏胶的黏度，也可以通过紫外线照射的区域的不同来调节紫外光减黏胶的黏度，从而实现柔性基板和保护膜的一体化剥离。
上述所有可选技术方案，可以采用任意结合形成本公开的可选实施例，在此不再一一赘述。
本领域普通技术人员可以理解实现上述实施例的全部或部分步骤可以 通过硬件来完成，也可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，上述提到的存储介质可以是只读存储器，磁盘或光盘等。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (11)

  1. 一种柔性基板的剥离方法，所述方法包括下列步骤：
    (a)在衬底基板上形成柔性基板，其中所述柔性基板的平面面积小于所述衬底基板的平面面积；
    (b)在形成有所述柔性基板的衬底基板上通过紫外光减黏胶粘贴保护膜，其中所述柔性基板的平面面积小于所述保护膜的平面面积，并且所述保护膜还通过所述紫外光减黏胶粘贴到所述衬底基板；
    (c)用紫外光透过所述衬底基板照射所述衬底基板上所述保护膜覆盖的区域；和
    (d)在所述紫外光照射完成后，从所述衬底基板剥离所述保护膜和所述柔性基板。
  2. 根据权利要求1所述的方法，其中在步骤(b)之前，所述方法还包括：
    在形成有所述柔性基板的衬底基板上形成阻挡层图形，所述阻挡层图形位于所述柔性基板的外围。
  3. 根据权利要求1所述的方法，其中步骤(c)包括：
    用所述紫外光透过所述衬底基板照射所述衬底基板上所述保护膜覆盖的区域中的预设区域，所述预设区域为所述柔性基板外围的部分区域。
  4. 根据权利要求2所述的方法，其中所述阻挡层图形包括多个子阻挡结构，所述多个子阻挡结构阵列排布在所述柔性基板的外围。
  5. 根据权利要求4所述的方法，其中所述子阻挡结构为矩形结构。
  6. 根据权利要求5所述的方法，其中所述矩形结构的宽度的取值范围为0.1mm至1.0mm，所述矩形结构的宽度方向与所述矩形结构的排布方向平行。
  7. 根据权利要求5所述的方法，其中所述矩形结构的宽度与空隙宽度的比例的取值范围为1∶1至1∶5，所述矩形结构的宽度方向与所述矩形结构的排布方向平行，所述空隙宽度为相邻两个子阻挡结构的间隙的距离。
  8. 根据权利要求2所述的方法，其中所述阻挡层图形由金属材料形成。
  9. 根据权利要求2所述的方法，其中所述阻挡层图形的厚度的取值范围为
    Figure PCTCN2017079893-appb-100001
    至
    Figure PCTCN2017079893-appb-100002
  10. 根据权利要求1所述的方法，其中所述柔性基板是透明基板。
  11. 根据权利要求1所述的方法，其中在步骤(b)之前，所述方法还包括：
    在所述柔性基板上形成显示元件。
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