WO2017168820A1 - 電子デバイスパッケージ用テープ - Google Patents

電子デバイスパッケージ用テープ Download PDF

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Publication number
WO2017168820A1
WO2017168820A1 PCT/JP2016/083696 JP2016083696W WO2017168820A1 WO 2017168820 A1 WO2017168820 A1 WO 2017168820A1 JP 2016083696 W JP2016083696 W JP 2016083696W WO 2017168820 A1 WO2017168820 A1 WO 2017168820A1
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WO
WIPO (PCT)
Prior art keywords
adhesive layer
electronic device
resin
tape
metal layer
Prior art date
Application number
PCT/JP2016/083696
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
佐野　透
二朗 杉山
真沙美 青山
邦彦 石黒
Original Assignee
古河電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to JP2018508367A priority Critical patent/JP6775005B2/ja
Priority to SG11201802282VA priority patent/SG11201802282VA/en
Priority to MYPI2018701080A priority patent/MY192601A/en
Priority to CN201680056349.4A priority patent/CN108076669B/zh
Priority to KR1020187009129A priority patent/KR102056178B1/ko
Publication of WO2017168820A1 publication Critical patent/WO2017168820A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds

Definitions

  • the present invention relates to an electronic device package tape, and more particularly to an electronic device package tape having a metal layer.
  • the linear expansion coefficient of the electronic device and the linear expansion coefficient of the circuit board may be greatly different.
  • the intermediate product is heated and cooled in the manufacturing process of the electronic device package, there is a difference in the amount of expansion and contraction between the electronic device and the circuit board. This difference causes warpage in the electronic device package.
  • Patent Document 3 discloses a flip chip type semiconductor back film in which a metal layer and an adhesive layer are provided on an adhesive layer of an adhesive tape in which an adhesive layer is laminated on a substrate.
  • the back surface of the semiconductor wafer is bonded onto the adhesive layer, and the semiconductor wafer is diced to form a chip.
  • the separated semiconductor chip is picked up from the adhesive tape with the adhesive layer and the metal layer attached to the back surface, and is flip-chip connected to the substrate.
  • the bump and the conductive material are pressed while the semiconductor chip is pressed by bringing the bump formed on the circuit surface side of the semiconductor chip into contact with a conductive material such as solder for bonding attached to the connection pad of the substrate. Is melted to ensure electrical continuity between the semiconductor chip and the substrate, and the semiconductor chip is fixed to the adherend.
  • the adhesive layer When melting the bump and the conductive material, if the adhesive layer is heated at a stretch at a high temperature, there is a problem that voids are generated in the adhesive layer due to bumping of moisture and volatile components contained in the adhesive layer. In order to suppress the generation of this void, the metal layer, the adhesive layer, and the semiconductor chip are laminated at a temperature that does not cause bumping of moisture and volatile components contained in the adhesive layer before flip chip connection. It is conceivable to pre-cure the adhesive layer.
  • the adhesive layer is pre-cured, the heat at this time causes warpage in the laminate of the metal layer, the adhesive layer, and the semiconductor chip due to the difference in the linear expansion coefficient between the semiconductor chip and the metal layer.
  • the bumps of the chip and the conductive material on the substrate side could not be connected well.
  • the present invention can suppress the occurrence of warping in the laminated body of the semiconductor, the adhesive layer and the semiconductor chip when the adhesive layer is pre-cured, and can be applied to the adhesive layer at the time of flip chip connection. It is an object of the present invention to provide an electronic device package tape capable of suppressing the generation of voids.
  • an electronic device package tape is provided by laminating a pressure-sensitive adhesive tape having a base film and a pressure-sensitive adhesive layer on the side opposite to the base film of the pressure-sensitive adhesive layer.
  • a pressure-sensitive adhesive tape having a base film and a pressure-sensitive adhesive layer on the side opposite to the base film of the pressure-sensitive adhesive layer.
  • an adhesive layer for adhering the metal layer to the back surface of the electronic device, the adhesive layer Provided on the opposite side of the metal layer to the pressure-sensitive adhesive layer, and an adhesive layer for adhering the metal layer to the back surface of the electronic device, the adhesive layer,
  • the storage elastic modulus at 25 ° C. after heating at 100 ° C. for 3 hours is 10 GPa or less, and the curing rate when heated at 100 ° C. for 3 hours is 10 to 100%.
  • the metal layer preferably contains copper or aluminum.
  • the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. It is preferable to do.
  • the pressure-sensitive adhesive layer contains an acrylic ester represented by CH 2 ⁇ CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms) and a hydroxyl group-containing It is preferable to contain an acrylic polymer comprising a monomer and an isocyanate compound having a radical-reactive carbon-carbon double bond in the molecule.
  • the semiconductor, the adhesive layer, and the semiconductor chip laminate when the adhesive layer is pre-cured, the semiconductor, the adhesive layer, and the semiconductor chip laminate can be prevented from warping, and the flip-chip connected to the adhesive layer can be prevented.
  • the generation of voids can be suppressed.
  • FIG. 1 is a cross-sectional view showing an electronic device package tape 10 according to an embodiment of the present invention.
  • the electronic device package tape 10 includes an adhesive tape 13 including a base film 11 and an adhesive layer 12 provided on the base film 11, and a metal layer 14 is formed on the adhesive layer 12. And an adhesive layer 15 provided on the metal layer 14.
  • the adhesive layer 15 may be indirectly provided on the metal layer 14 via a primer layer or the like for improving the adhesion with the metal layer 14.
  • a semiconductor chip will be described as an example of an electronic device.
  • the surface of the adhesive layer 15 opposite to the surface in contact with the metal layer 14 is preferably protected by a separator (release liner) (not shown).
  • the separator has a function as a protective material that protects the adhesive layer 15 until it is put to practical use.
  • a separator can be used as a support base material at the time of bonding the metal layer 14 to the adhesive layer 12 of the adhesive tape 13 in the manufacture process of the tape 10 for electronic device packages.
  • the pressure-sensitive adhesive tape 13, the metal layer 14, and the adhesive layer 15 may be cut (pre-cut) in a predetermined shape in advance according to the use process and the apparatus. Furthermore, the electronic device package tape 10 according to the present invention may be in the form of being cut every one semiconductor wafer W, or a long one in which a plurality of pieces cut every one semiconductor wafer W are formed. The form which wound the sheet
  • the base film 11 can be used without particular limitation as long as it is a conventionally known one, but when using a radiation curable material as the pressure-sensitive adhesive layer 12 described later, it has radiation transparency. It is preferable to use one.
  • the materials include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic.
  • Homopolymers or copolymers of ⁇ -olefins such as methyl acid copolymers, ethylene-acrylic acid copolymers, ionomers or mixtures thereof, polyurethane, styrene-ethylene-butene or pentene copolymers, polyamide-polyols Listed are thermoplastic elastomers such as copolymers, and mixtures thereof.
  • the base film 11 may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer.
  • the thickness of the base film 11 is not particularly limited and may be set as appropriate, but is preferably 50 to 200 ⁇ m.
  • the surface of the base film 11 is subjected to chemical or physical treatment such as chromic acid treatment, ozone exposure, flame exposure, high piezoelectric impact exposure, and ionizing radiation treatment.
  • chemical or physical treatment such as chromic acid treatment, ozone exposure, flame exposure, high piezoelectric impact exposure, and ionizing radiation treatment.
  • Surface treatment may be applied.
  • the pressure-sensitive adhesive layer 12 is provided directly on the base film 11, but a primer layer for improving adhesion, an anchor layer for improving machinability during dicing, stress You may provide indirectly through a relaxation layer, an antistatic layer, etc.
  • the resin used for the pressure-sensitive adhesive layer 12 is not particularly limited, and a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, or the like used for the pressure-sensitive adhesive may be used.
  • An acrylic pressure-sensitive adhesive having an acrylic polymer as a base polymer is preferable.
  • acrylic polymer examples include (meth) acrylic acid alkyl esters (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, A linear or branched alkyl ester of an alkyl group such as octadecyl ester or eicosyl ester having 1 to 30 carbon atoms,
  • the acrylic polymer contains units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or cycloalkyl ester, if necessary, for the purpose of modifying cohesive force, heat resistance and the like. May be.
  • Such monomer components include, for example, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxyl group-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; Styrene Contains sulfonic acid groups such as phonic acid, allyl sulf
  • a polyfunctional monomer or the like can be included as a monomer component for copolymerization as necessary.
  • examples of such polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) An acrylate etc. are mentioned. These polyfunctional monomers can also be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably
  • the acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more component monomers.
  • the pressure-sensitive adhesive layer 12 preferably has a composition that suppresses the inclusion of a low molecular weight substance from the viewpoint of preventing contamination of the wafer. From this point, the main component is an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000. Therefore, the pressure-sensitive adhesive can be of an appropriate crosslinking type by an internal crosslinking method, an external crosslinking method, or the like.
  • a polyfunctional isocyanate compound for example, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelate compound, an amino resin system
  • an appropriate external crosslinking agent such as a compound or a peroxide, or a method of mixing a low molecular compound having two or more carbon-carbon double bonds and crosslinking by irradiation with energy rays, etc.
  • a suitable method such as the above can be adopted.
  • the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive.
  • additives such as various tackifiers and anti-aging agents may be used for the pressure-sensitive adhesive in addition to the above components.
  • a radiation curable pressure-sensitive adhesive is suitable.
  • the radiation-curable pressure-sensitive adhesive include additive-type radiation-curable pressure-sensitive adhesives in which a radiation-curable monomer component or a radiation-curable oligomer component is blended with the above-mentioned pressure-sensitive adhesive.
  • Examples of the radiation curable monomer component to be blended include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra ( And (meth) acrylate, dipentaerystol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, and the like. These monomer components can be used alone or in combination of two or more.
  • the radiation curable oligomer component includes various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene, and those having a molecular weight in the range of about 100 to 30000 are suitable.
  • the compounding amount of the radiation-curable monomer component or oligomer component can be appropriately determined in accordance with the type of the pressure-sensitive adhesive layer, and the amount capable of reducing the adhesive strength of the pressure-sensitive adhesive layer. Generally, the amount is, for example, about 5 to 500 parts by weight, preferably about 70 to 150 parts by weight with respect to 100 parts by weight of the base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.
  • the radiation curable pressure-sensitive adhesive in addition to the additive-type radiation curable pressure-sensitive adhesive, a base polymer having a carbon-carbon double bond in the polymer side chain or in the main chain or at the main chain terminal was used.
  • An internal radiation-curable pressure-sensitive adhesive is also included.
  • the internal radiation curable pressure-sensitive adhesive does not need to contain an oligomer component that is a low-molecular component or does not contain much, so that the oligomer component or the like does not move through the pressure-sensitive adhesive over time and is stable. Since the adhesive layer of a layer structure can be formed, it is preferable.
  • the base polymer having a carbon-carbon double bond a polymer having a carbon-carbon double bond and having adhesiveness can be used without particular limitation.
  • a base polymer those having an acrylic polymer as a basic skeleton are preferable.
  • the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.
  • the method for introducing the carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods can be adopted. However, it is easy to introduce the carbon-carbon double bond into the polymer side chain in terms of molecular design. is there. For example, after a monomer having a functional group is copolymerized in advance with an acrylic polymer, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is converted into a radiation-curable carbon-carbon double bond. A method of performing condensation or addition reaction while maintaining the above.
  • combinations of these functional groups include carboxylic acid groups and epoxy groups, carboxylic acid groups and aziridyl groups, hydroxyl groups and isocyanate groups, and the like.
  • a combination of a hydroxyl group and an isocyanate group is preferable because of easy tracking of the reaction.
  • the functional group may be on either side of the acrylic polymer and the compound as long as the combination of these functional groups generates an acrylic polymer having the carbon-carbon double bond.
  • it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group.
  • examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate, and the like.
  • the acrylic polymer a copolymer obtained by copolymerizing the above-exemplified hydroxy group-containing monomer, an ether compound such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, or the like is used.
  • the base polymer having carbon-carbon double bonds can be used alone, but the radiation-curable monomer component does not deteriorate the properties.
  • photopolymerizable compounds such as oligomer components can also be blended.
  • the amount of the photopolymerizable compound is usually 30 parts by weight or less, preferably 0 to 10 parts by weight, based on 100 parts by weight of the base polymer.
  • the radiation curable pressure-sensitive adhesive preferably contains a photopolymerization initiator when cured by ultraviolet rays or the like.
  • Acrylic polymer A comprising an isocyanate compound having a radical reactive carbon-carbon double bond is preferred.
  • the number of carbon atoms in the alkyl group of the acrylic acid alkyl ester is less than 4, the polarity is high and the peel force becomes too large, so that the pickup property may be lowered.
  • the number of carbon atoms in the alkyl group of the acrylic acid alkyl ester exceeds 18, the glass transition temperature of the pressure-sensitive adhesive layer 12 becomes too high, and the adhesive properties at room temperature are deteriorated. As a result, the metal layer during dicing 15 peeling may occur.
  • the acrylic polymer A may contain units corresponding to other monomer components as necessary.
  • the acrylic polymer A an isocyanate compound having a radical reactive carbon-carbon double bond is used. That is, it is preferable that the acrylic polymer has a configuration in which a double bond-containing isocyanate compound is subjected to an addition reaction with a polymer based on a monomer composition such as an acrylic ester or a hydroxyl group-containing monomer. Accordingly, the acrylic polymer preferably has a radical reactive carbon-carbon double bond in its molecular structure.
  • the active energy ray hardening-type adhesive layer (ultraviolet ray hardening-type adhesive layer etc.) hardened
  • double bond-containing isocyanate compound examples include methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate, and the like.
  • a double bond containing isocyanate compound can be used individually or in combination of 2 or more types.
  • an external cross-linking agent can be appropriately used for the active energy ray-curable adhesive in order to adjust the adhesive strength before irradiation with active energy rays and the adhesive strength after irradiation with active energy rays.
  • Specific examples of the external crosslinking method include a method of adding a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, a melamine crosslinking agent, and reacting them.
  • a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, a melamine crosslinking agent, and reacting them.
  • the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive.
  • the amount of the external crosslinking agent used is generally 20 parts by weight or less (preferably 0.1 to 10 parts by weight) with respect to 100 parts by weight of the base polymer.
  • the active energy ray-curable pressure-sensitive adhesive may contain various conventionally known additives such as tackifiers, anti-aging agents, and foaming agents in addition to the above components, if necessary.
  • the thickness of the pressure-sensitive adhesive layer 12 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 ⁇ m. Moreover, the adhesive layer 12 may be comprised by the single layer, or may be comprised by multiple layers.
  • the metal constituting the metal layer 14 is not particularly limited.
  • the metal layer 14 may be at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel, and copper. This is preferable in terms of preventing warpage.
  • it is particularly preferable to contain copper from the viewpoint of high thermal conductivity and obtaining a heat dissipation effect.
  • the thickness of the metal layer 14 can be appropriately determined in consideration of heat dissipation, warpage prevention of the electronic device package, workability, and the like, and is usually in the range of 2 to 200 ⁇ m. If the metal layer 14 is 200 ⁇ m or less, it is easy to wind up, and if it is 50 ⁇ m or less, it is preferable in that it can contribute to thinning of the electronic device package. On the other hand, at least 2 ⁇ m is necessary from the viewpoint of heat dissipation.
  • a metal foil can be used, and the metal foil may be an electrolytic foil or a rolled foil.
  • the adhesive layer 15 is a film obtained by previously forming an adhesive.
  • the adhesive layer 15 is formed of at least a thermosetting resin, and is preferably formed of at least a thermosetting resin and a thermoplastic resin.
  • thermoplastic resin examples include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, Thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), polyamideimide resin, or fluorine resin Etc.
  • a thermoplastic resin can be used individually or in combination of 2 or more types. Among these thermoplastic resins, acrylic resins are less ionic impurities and have excellent stress relaxation properties, phenoxy resins are both high flexibility and strength and high toughness. This is particularly preferable because reliability can be easily secured.
  • the acrylic resin is not particularly limited, and is a straight chain or branched chain having 30 or less carbon atoms (preferably 1 to 18 carbon atoms, more preferably 6 to 10 carbon atoms, particularly preferably 8 or 9 carbon atoms).
  • Examples thereof include a polymer containing one or more esters of acrylic acid or methacrylic acid having an alkyl group as components. That is, in the present invention, acrylic resin has a broad meaning including methacrylic resin.
  • alkyl group examples include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group, and a 2-ethylhexyl group.
  • Octyl group isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group (lauryl group), tridecyl group, tetradecyl group, stearyl group, octadecyl group and the like.
  • the other monomer for forming the acrylic resin is not particularly limited.
  • acrylic acid Carboxyl group-containing monomers such as methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid or crotonic acid, acid anhydride monomers such as maleic anhydride or itaconic anhydride, (meth) 2-hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, (meth) Acrylic acid 10-hydroxydec Hydroxyl group-containing monomers such as 12-hydroxylauryl (meth) acrylic acid or (4-hydroxymethylcyclohexyl) -
  • thermosetting resin examples include an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, and a thermosetting polyimide resin.
  • a thermosetting resin can be used individually or in combination of 2 or more types.
  • an epoxy resin containing a small amount of ionic impurities that corrode semiconductor elements is particularly suitable.
  • a phenol resin can be used suitably as a hardening
  • the epoxy resin is not particularly limited.
  • bisphenol A type epoxy resin bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy.
  • Bifunctional epoxy such as resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, phenol novolac type epoxy resin, orthocresol novolak type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylolethane type epoxy resin
  • Epoxy such as resin, polyfunctional epoxy resin, hydantoin type epoxy resin, trisglycidyl isocyanurate type epoxy resin or glycidylamine type epoxy resin It can be used fat.
  • epoxy resin novolak type epoxy resin, biphenyl type epoxy resin, trishydroxyphenylmethane type epoxy resin, and tetraphenylolethane type epoxy resin are particularly preferable. This is because these epoxy resins are rich in reactivity with a phenol resin as a curing agent and are excellent in heat resistance and the like.
  • the phenol resin acts as a curing agent for the epoxy resin.
  • a novolak type phenol resin such as a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butylphenol novolak resin, a nonylphenol novolak resin, or a resol type.
  • examples thereof include phenol resins and polyoxystyrene such as polyparaoxystyrene.
  • a phenol resin can be used individually or in combination of 2 or more types. Of these phenol resins, phenol novolac resins and phenol aralkyl resins are particularly preferred. This is because the connection reliability of the semiconductor device can be improved.
  • the mixing ratio of the epoxy resin and the phenol resin is preferably such that, for example, the hydroxyl group in the phenol resin is 0.5 equivalent to 2.0 equivalents per equivalent of epoxy group in the epoxy resin component. More preferred is 0.8 equivalents to 1.2 equivalents. That is, if the blending ratio of both is out of the above range, sufficient curing reaction does not proceed and the properties of the cured epoxy resin are likely to deteriorate.
  • thermosetting acceleration catalyst is not particularly limited, and can be appropriately selected from known thermosetting acceleration catalysts.
  • stimulation catalyst can be used individually or in combination of 2 or more types.
  • thermosetting acceleration catalyst for example, an amine-based curing accelerator, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, a boron-based curing accelerator, a phosphorus-boron-based curing accelerator, or the like can be used.
  • epoxy resin curing agent it is preferable to use a phenol resin as described above, but known curing agents such as imidazoles, amines, and acid anhydrides can also be used.
  • the adhesive layer 15 has adhesion (adhesion) to the back surface (circuit non-formed surface) of the semiconductor wafer. Therefore, in order to crosslink the adhesive layer 15 to some extent in advance, a polyfunctional compound that reacts with a functional group at the end of the molecular chain of the polymer may be added as a crosslinking agent. Thereby, the adhesive property under high temperature can be improved and heat resistance can be improved.
  • the crosslinking agent is not particularly limited, and a known crosslinking agent can be used. Specifically, for example, an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent, a metal salt Examples thereof include a system crosslinking agent, a carbodiimide crosslinking agent, an oxazoline crosslinking agent, an aziridine crosslinking agent, and an amine crosslinking agent.
  • the crosslinking agent an isocyanate crosslinking agent or an epoxy crosslinking agent is suitable.
  • the said crosslinking agent can be used individually or in combination of 2 or more types.
  • the adhesive layer 15 can be appropriately mixed with other additives as necessary.
  • additives include fillers (fillers), flame retardants, silane coupling agents, ion trapping agents, bulking agents, antioxidants, antioxidants, and surfactants.
  • the filler may be either an inorganic filler or an organic filler, but an inorganic filler is preferred.
  • a filler such as an inorganic filler
  • the adhesive layer 15 can be improved in thermal conductivity, adjusted in elastic modulus, and the like.
  • the inorganic filler include silica, clay, gypsum, calcium carbonate, barium sulfate, alumina, beryllium oxide, silicon carbide, aluminum nitride, silicon nitride and other ceramics, aluminum, copper, silver, gold, nickel, chromium,
  • examples include various inorganic powders made of metals such as lead, tin, zinc, palladium, solder, alloys, and other carbon.
  • a filler can be used individually or in combination of 2 or more types. Among these, silica or alumina is particularly suitable as the filler, and fused silica is particularly suitable as the silica.
  • the average particle size of the inorganic filler is preferably in the range of 0.001 ⁇ m to 80 ⁇ m. The average particle diameter of the inorganic filler can be measured by, for example, a laser diffraction type particle size distribution measuring apparatus.
  • the blending amount of the filler is preferably 98% by weight or less (0% by weight to 98% by weight) with respect to the organic resin component, and particularly in the case of silica, 0% by weight to 70% by weight.
  • the content is preferably 10% by weight to 98% by weight.
  • examples of the flame retardant include antimony trioxide, antimony pentoxide, brominated epoxy resin and the like.
  • a flame retardant can be used individually or in combination of 2 or more types.
  • examples of the silane coupling agent include ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, and the like.
  • a silane coupling agent can be used individually or in combination of 2 or more types.
  • examples of the ion trapping agent include hydrotalcites and bismuth hydroxide. An ion trap agent can be used individually or in combination of 2 or more types.
  • the adhesive layer 15 contains, in particular, (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler from the viewpoint of adhesiveness and reliability. It is preferable to do.
  • epoxy resin By using an epoxy resin, high adhesiveness, water resistance, and heat resistance can be obtained.
  • epoxy resin the above-described known epoxy resins can be used.
  • curing agent The above-mentioned well-known hardening
  • Acrylic resin has both high flexibility and strength and high toughness.
  • a preferred acrylic resin has a Tg (glass transition temperature) of ⁇ 50 ° C. to 50 ° C., and is obtained by polymerizing a monomer having an epoxy group, glycidyl group, alcoholic hydroxyl group, phenolic hydroxyl group or carboxyl group as a crosslinkable functional group. It is a crosslinkable functional group-containing (meth) acrylic copolymer.
  • higher toughness can be obtained by containing acrylonitrile or the like and exhibiting rubber properties.
  • phenoxy resin has high strength because phenoxy resin has a long molecular chain and is similar in structure to epoxy resin, acts as a flexible material in a composition with high crosslink density, and imparts high toughness.
  • a tough composition can be obtained.
  • Preferable phenoxy resins are those having a main skeleton of bisphenol A type, and other preferable examples include commercially available phenoxy resins such as bisphenol F type phenoxy resin, bisphenol A / F mixed type phenoxy resin and brominated phenoxy resin.
  • Examples of the surface-treated inorganic filler include inorganic fillers surface-treated with a coupling agent.
  • the inorganic filler the above-described known inorganic fillers can be used, and silica and alumina are preferable. Due to the surface treatment with the coupling agent, the dispersibility of the inorganic filler is improved. For this reason, since it is excellent in fluidity
  • the surface treatment of the inorganic filler with the silane coupling agent is performed by dispersing the inorganic filler in the silane coupling agent solution by a known method, so that the hydroxyl group and the silane coupling agent present on the surface of the inorganic filler are mixed.
  • This is performed by reacting a hydrolyzable group such as an alkoxy group with a hydrolyzed silanol group to form a Si—O—Si bond on the surface of the inorganic filler.
  • the thickness of the adhesive layer 15 is not particularly limited, it is preferably 3 ⁇ m or more, more preferably 5 ⁇ m or more from the viewpoint of easy handling, and preferably 100 ⁇ m or less in order to contribute to thinning of the semiconductor package, More preferably, it is 50 ⁇ m or less.
  • the adhesive layer 15 may be composed of a single layer or a plurality of layers.
  • the adhesive layer 15 has a storage elastic modulus at 25 ° C. of 10 GPa or less after being heated at 100 ° C. for 3 hours. Storage modulus was measured at 0 ° C with a heating rate of 5 ° C / min and a frequency of 1 Hz using a dynamic viscoelasticity measuring device after the adhesive layer was heated at 100 ° C for 3 hours and sufficiently cooled. The value when the temperature reaches 25 ° C.
  • the adhesive layer 15 is pre-cured in the state of the laminated body of the metal layer 14, the adhesive layer 15 and the semiconductor chip C. Because the heat does not hold the warp of the laminate resulting from the difference in the linear expansion coefficient between the semiconductor chip C and the metal layer 14 even after cooling, the warp occurs in the pre-cured laminate. Can be suppressed. In addition, if the adhesive layer is cured until the storage elastic modulus at 25 ° C. after heating at 100 ° C. for 3 hours becomes 10 GPa or less, generation of voids during flip chip connection can be suppressed. it can.
  • the storage elastic modulus can be adjusted by the molecular weight of the polymer, and generally the lower the molecular weight, the lower the storage elastic modulus. Further, the storage elastic modulus can be adjusted by blending a plasticizer or a filler. Further, the meth) acrylic copolymer can be widely adjusted in the storage elastic modulus by a crosslinking agent.
  • the adhesive layer 15 has a curing rate of 10 to 100% when heated at 100 ° C. for 3 hours. If the curing rate of the adhesive layer 15 when heated at 100 ° C. for 3 hours is 10 to 100%, generation of voids in the adhesive layer 15 at the time of flip chip connection can be suppressed.
  • the adhesive layer 15 has a peeling force (23 ° C., peeling angle 180 degrees, linear speed 300 mm / min) with the metal layer 14 in the B stage (uncured state or semi-cured state) of 0.3 N or more. Is preferred. When the peeling force is less than 0.3 N, peeling between the semiconductor wafer W or the semiconductor chip C and the adhesive layer 15 or between the adhesive layer 15 and the metal layer 14 occurs when the semiconductor wafer W is diced. This may cause chipping (chip) in the semiconductor chip C.
  • the water absorption rate of the adhesive layer 15 is preferably 1.5 vol% or less.
  • the method for measuring the water absorption rate is as follows. That is, 50 ⁇ 50 mm adhesive layer 15 (film adhesive) was used as a sample, the sample was dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then the dry mass was measured. M1. The sample is immersed in distilled water at room temperature for 24 hours and then taken out. The surface of the sample is wiped off with a filter paper and quickly weighed to obtain M2.
  • the water absorption rate is calculated by the following equation (1).
  • d is the density of the film. If the water absorption exceeds 1.5 vol%, package cracks may occur during solder reflow due to the absorbed water.
  • the saturated moisture absorption rate of the adhesive layer 15 is preferably 1.0 vol% or less.
  • the method for measuring the saturated moisture absorption rate is as follows. That is, a circular adhesive layer 15 (film adhesive) having a diameter of 100 mm was used as a sample, the sample was dried at 120 ° C. for 3 hours in a vacuum dryer, allowed to cool in a desiccator, and then the dry mass was measured. To do. The sample is absorbed in a constant temperature and humidity chamber at 85 ° C. and 85% RH for 168 hours, then taken out, and weighed quickly to obtain M2.
  • the saturated moisture absorption rate is calculated by the following equation (2).
  • d is the density of the film.
  • the residual volatile content of the adhesive layer 15 is preferably 3.0 wt% or less.
  • the method for measuring the remaining volatile components is as follows. That is, the adhesive layer 15 (film adhesive) having a size of 50 ⁇ 50 mm is used as a sample, the initial mass of the sample is measured as M1, and the sample is heated at 200 ° C. for 2 hours in a hot air circulating thermostat, Weigh to M2.
  • the remaining volatile content is calculated by the following equation (3).
  • Residual volatile matter (wt%) [(M2-M1) / M1] ⁇ 100 (3) If the residual volatile content exceeds 3.0 wt%, the solvent is volatilized by heating during packaging, and voids are generated inside the adhesive layer 15, which may cause package cracks.
  • the ratio of the linear expansion coefficient of the metal layer 14 to the linear expansion coefficient of the adhesive layer 15 is preferably 0.2 or more. When the ratio is less than 0.2, peeling between the metal layer 14 and the adhesive layer 15 is likely to occur, and a package crack may occur during packaging, which may reduce reliability.
  • the separator is for improving the handleability of the adhesive layer 15 and protecting the adhesive layer 15.
  • polyester PET, PBT, PEN, PBN, PTT
  • polyolefin PP, PE
  • copolymer EVA, EEA, EBA
  • a film with improved adhesion and mechanical strength can be used.
  • the laminated body of these films may be sufficient.
  • the thickness of the separator is not particularly limited and may be set appropriately, but is preferably 25 to 50 ⁇ m.
  • the adhesive layer 15 can be formed using a conventional method of preparing a resin composition and forming it into a film-like layer. Specifically, for example, the resin composition is applied on a suitable separator (such as release paper) and dried (in the case where heat curing is necessary, heat treatment is performed as necessary to dry), Examples include a method of forming the adhesive layer 15.
  • the resin composition may be a solution or a dispersion.
  • the obtained adhesive layer 15 and a separately prepared metal layer 14 are bonded together.
  • the metal layer 14 a commercially available metal foil may be used. Thereafter, the adhesive layer 15 and the metal layer 14 are pre-cut into a circular label shape of a predetermined size using a pressing blade, and unnecessary peripheral portions are removed.
  • the base film 11 can be formed by a conventionally known film forming method.
  • the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method.
  • the pressure-sensitive adhesive layer composition is applied onto the substrate film 11 and dried (heat-crosslinked as necessary) to form the pressure-sensitive adhesive layer 12.
  • the coating method include roll coating, screen coating, and gravure coating.
  • the pressure-sensitive adhesive layer composition may be directly applied to the base film 11 to form the pressure-sensitive adhesive layer 12 on the base film 11, and the surface of the pressure-sensitive adhesive layer composition was peeled off.
  • the pressure-sensitive adhesive layer 12 may be transferred to the base film 11 after being applied to release paper or the like to form the pressure-sensitive adhesive layer 12. Thereby, the adhesive tape 13 in which the adhesive layer 12 was formed on the base film 11 is produced.
  • the adhesive tape 13 is laminated on the separator provided with the circular metal layer 14 and the adhesive layer 15 so that the metal layer 14 and the adhesive layer 12 are in contact with each other.
  • the adhesive tape 13 has a predetermined size.
  • the electronic device package tape 10 is made by pre-cutting into a circular label shape or the like.
  • the manufacturing method of the semiconductor device includes a step of attaching the semiconductor wafer W onto the adhesive tape integrated electronic device package tape 10 (mounting step), and a step of dicing the semiconductor wafer W to form the semiconductor chip C (dicing). Step), a step of separating the laminate of the metal layer 14, the adhesive layer 15 and the semiconductor chip C from the adhesive layer 12 of the adhesive tape 13 (pickup step), and a step of pre-curing the obtained laminate ( A pre-curing step) and a step of flip-chip connecting the semiconductor chip C onto the adherend 16 (flip chip connecting step).
  • the separator arbitrarily provided on the adhesive tape-integrated electronic device package tape 10 is appropriately peeled off, and the semiconductor wafer W is adhered to the adhesive layer 15 as shown in FIG. Then, this is adhered and held and fixed (mounting process). At this time, the adhesive layer 15 is in an uncured state (including a semi-cured state).
  • the adhesive tape integrated electronic device package tape 10 is attached to the back surface of the semiconductor wafer W.
  • the back surface of the semiconductor wafer W means a surface opposite to the circuit surface (also referred to as a non-circuit surface or a non-electrode forming surface).
  • the sticking method is not specifically limited, the method by pressure bonding is preferable.
  • the crimping is usually performed while pressing with a pressing means such as a crimping roll.
  • the semiconductor wafer W is diced.
  • the semiconductor wafer W is cut into a predetermined size and divided into pieces (small pieces), whereby the semiconductor chip C is manufactured.
  • the dicing is performed from the circuit surface side of the semiconductor wafer W according to a conventional method.
  • a cutting method called full cut that cuts up to the electronic device package tape 10 can be adopted. It does not specifically limit as a dicing apparatus used at this process, A conventionally well-known thing can be used.
  • the semiconductor wafer W is bonded and fixed with excellent adhesion by the electronic device package tape 10, chip chipping and chip jump can be suppressed, and damage to the semiconductor wafer W can be suppressed.
  • this expansion can be performed using a conventionally well-known expanding apparatus.
  • the semiconductor chip C is picked up, and the semiconductor chip C is peeled off from the adhesive tape 13 together with the adhesive layer 15 and the metal layer 14.
  • the pickup method is not particularly limited, and various conventionally known methods can be employed. For example, a method of pushing up individual semiconductor chips C from the side of the base film 11 of the electronic device package tape 10 with a needle and picking up the pushed-up semiconductor chips C with a pick-up device can be mentioned.
  • Pre-curing is performed in which the adhesive layer 15 in the laminate of the metal layer 14, the adhesive layer 15, and the semiconductor chip C is preliminarily cured so that no bumping occurs in the adhesive layer 15 in the subsequent flip chip connection process.
  • the pre-curing conditions may be set as appropriate as long as the adhesive layer 15 does not bump, but it is preferable to heat at 100 to 150 ° C. for about 4 hours to 15 minutes.
  • the picked-up semiconductor chip C is fixed to an adherend 16 such as a substrate by a flip chip bonding method (flip chip mounting method).
  • the semiconductor chip C is always placed on the adherend 16 such that the circuit surface (also referred to as a surface, a circuit pattern formation surface, an electrode formation surface, etc.) of the semiconductor chip C faces the adherend 16.
  • the circuit surface also referred to as a surface, a circuit pattern formation surface, an electrode formation surface, etc.
  • flux is first attached to the bumps 17 as connection portions formed on the circuit surface side of the semiconductor chip C.
  • the bumps 17 and the conductive material 18 are melted while bringing the bumps 17 of the semiconductor chip C into contact with the bonding conductive material 18 (solder or the like) attached to the connection pads of the adherend 16 and pressing them.
  • the electrical conduction between the semiconductor chip C and the adherend 16 can be ensured, and the semiconductor chip C can be fixed to the adherend 16 (flip chip bonding step).
  • a gap is formed between the semiconductor chip C and the adherend 16, and the gap distance is generally about 30 ⁇ m to 300 ⁇ m.
  • various substrates such as a lead frame and a circuit substrate (such as a wiring circuit substrate) can be used.
  • the material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate and a plastic substrate.
  • the plastic substrate include an epoxy substrate, a bismaleimide triazine substrate, and a polyimide substrate.
  • a chip-on-chip structure can be obtained by using another semiconductor chip as the adherend 16 and flip-chip connection of the semiconductor chip C.
  • Base film a-1 Zinc ionomer a (density 0.96 g / cm 3 , zinc ion content 4 mass) of ethylene-methacrylic acid-ethyl methacrylate (mass ratio 8: 1: 1) terpolymer synthesized by radical polymerization method %, Chlorine content of less than 1% by mass, Vicat softening point 56 ° C., melting point 86 ° C.) are melted at 140 ° C. and formed into a long film of 100 ⁇ m thickness using an extruder. A material film a-1 was produced.
  • Adhesive layer composition b-1 As the acrylic copolymer (A1) having a functional group, a copolymer comprising 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, the ratio of 2-ethylhexyl acrylate being 55 mol%, and the weight average molecular weight being 750,000 Was prepared. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value would be 25, and an acrylic copolymer (a1) having a glass transition temperature of ⁇ 50 ° C., a hydroxyl value of 10 gKOH / g, and an acid value of 5 mgKOH / g Was prepared.
  • ⁇ Adhesive tape (1)> The prepared pressure-sensitive adhesive layer composition b-1 was applied to a release liner made of a release-treated polyethylene-terephthalate film so that the thickness after drying was 10 ⁇ m, and dried at 110 ° C. for 3 minutes.
  • the pressure-sensitive adhesive tape (1) having the pressure-sensitive adhesive layer formed on the base film was prepared by bonding to the base film a-1.
  • adhesive layer composition c-1 10 parts by mass of acrylonitrile butadiene rubber (acrylonitrile content 40% by mass), 17 parts by mass of novolac type epoxy resin (manufactured by DIC Corporation, trade name “N-775”, epoxy equivalent 195, softening point 78 ° C.), liquid bisphenol A Type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name “YD-128”, Mw400, epoxy equivalent 190), 40 parts by mass, phenol resin as a curing agent (trade name “H-4”, manufactured by Meiwa Kasei Co., Ltd.) 32 parts by mass was dissolved in methyl ethyl ketone to prepare an adhesive layer composition solution.
  • novolac type epoxy resin manufactured by DIC Corporation, trade name “N-775”, epoxy equivalent 195, softening point 78 ° C.
  • liquid bisphenol A Type epoxy resin manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name “YD-12
  • Adhesive layer composition c-2 80 parts by mass of acrylic resin (Nagase ChemteX Corporation, trade name “Taisan Resin SG-P3”, Mw 850,000, Tg 12 ° C.) and 10 parts by mass of naphthalene type epoxy resin (manufactured by DIC Corporation, trade name “HP-4700”) Part, phenol resin as a curing agent (Maywa Kasei Co., Ltd., trade name “MEH7851”) 10 parts by mass was dissolved in methyl ethyl ketone to prepare an adhesive layer composition solution.
  • acrylic resin Naagase ChemteX Corporation, trade name “Taisan Resin SG-P3”, Mw 850,000, Tg 12 ° C.
  • naphthalene type epoxy resin manufactured by DIC Corporation, trade name “HP-4700”
  • phenol resin as a curing agent Maywa Kasei Co., Ltd., trade name “MEH7851”
  • Adhesive layer composition c-3 100 parts by mass of acrylic resin (manufactured by Nagase ChemteX Corporation, “Taisan Resin SG-70L”, Tg-13 ° C.), cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name “EOCN-1020”, epoxy Equivalent 198, softening point 64 ° C.) 353 parts by mass, liquid bisphenol A type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name “YD-128”, Mw 400, epoxy equivalent 190), imidazole as a curing agent ( 3 parts by mass of Shikoku Kasei Kogyo Co., Ltd., trade name “2PHZ-PW” and 330 parts by mass of silica filler (manufactured by Admatechs Co., Ltd., trade name “SO-C2”, average particle size 0.5 ⁇ m) in methyl ethoxylate
  • Adhesive layer composition c-4 100 parts by mass of bisphenol A type phenoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name “YP-50S”, Mw 60,000, Tg 84 ° C.) and cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name “EOCN-”) 1020 ", epoxy equivalent 198, softening point 64 ° C) 40 parts by mass, liquid bisphenol A type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name” YD-128 ", Mw400, epoxy equivalent 190), 100 parts by mass, curing agent 1.5 parts by mass of imidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name “2PHZ-PW”), silica filler (manufactured by Admatechs Co., Ltd., trade name “SO-C
  • Adhesive layer composition c-5 10 parts by mass of acrylonitrile butadiene rubber (acrylonitrile content 40% by mass), 17 parts by mass of novolac type epoxy resin (manufactured by DIC Corporation, trade name “N-775”, epoxy equivalent 195, softening point 78 ° C.), liquid bisphenol A Type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name “YD-128”, Mw400, epoxy equivalent 190), 40 parts by mass, phenol resin as a curing agent (trade name “H-4”, manufactured by Meiwa Kasei Co., Ltd.) 25 parts by mass was dissolved in methyl ethyl ketone to prepare an adhesive layer composition solution.
  • Adhesive layer composition c-6 100 parts by mass of bisphenol A type phenoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name “YP-50S”, Mw 60,000, Tg 84 ° C.) and cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name “EOCN-”) 1020 ", epoxy equivalent 198, softening point 64 ° C) 50 parts by mass, liquid bisphenol A type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name” YD-128 ", Mw400, epoxy equivalent 190), 100 parts by mass, curing agent 1.0 parts by mass of imidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name “2PHZ-PW”), silica filler (manufactured by Admatechs Co., Ltd., trade name “SO-
  • Adhesive layer composition c-7 100 parts by mass of acrylic resin (manufactured by Nagase ChemteX Corporation, trade name “Taisan Resin SG-708-6”, Tg 6 ° C.) and solid bisphenol A type epoxy resin (trade name “Epicoat 1004”, manufactured by Mitsubishi Chemical Corporation), 280 parts by mass of softening point 97 ° C., phenol resin as a curing agent (trade name “Mirex XLC-4L”, melting point 62 ° C., manufactured by Mitsui Chemicals, Inc.) 306 parts by mass, silica filler (manufactured by Admatechs Co., Ltd., trade name) 237 parts by mass of “SO-C2” (average particle size 0.5 ⁇ m) were dissolved or dispersed in methyl ethyl ketone to prepare an adhesive layer composition solution.
  • acrylic resin manufactured by Nagase ChemteX Corporation, trade name “Taisan Resin SG-708-6”, T
  • Adhesive layer composition c-8 100 parts by mass of acrylic resin (manufactured by Nagase ChemteX Corporation, “Taisan Resin SG-70L”, Tg-13 ° C.), cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name “EOCN-1020”, epoxy Equivalent 198, softening point 64 ° C.) 260 parts by mass, liquid bisphenol A type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name “YD-128”, Mw 400, epoxy equivalent 190), imidazole as a curing agent ( Methyl ethyl ketone containing 1 part by mass of Shikoku Kasei Kogyo Co., Ltd., trade name “2PHZ-PW”) and 330 parts by weight of silica filler (Admatex Corporation, trade name “SO-C2”, average particle size 0.5 ⁇ m). It melt
  • Adhesive layer (1) An adhesive layer composition c-1 was applied to a separator made of a polyethylene-terephthalate film that had been subjected to a mold release treatment so that the thickness after drying was 5 ⁇ m, and dried at 110 ° C. for 5 minutes. An adhesive film on which the adhesive layer (1) was formed was produced.
  • Adhesive layer composition c-2 was applied to a separator made of a polyethylene-terephthalate film subjected to a release treatment so that the thickness after drying was 5 ⁇ m, and dried at 110 ° C. for 5 minutes. An adhesive film on which the adhesive layer (2) was formed was produced.
  • Adhesive layer composition c-3 was applied to a separator made of a polyethylene-terephthalate film that had been subjected to a mold release treatment so that the thickness after drying was 5 ⁇ m, and dried at 110 ° C. for 5 minutes. An adhesive film on which the adhesive layer (3) was formed was produced.
  • Adhesive layer composition c-4 was applied to a separator made of a polyethylene-terephthalate film subjected to a release treatment so that the thickness after drying was 5 ⁇ m, and dried at 110 ° C. for 5 minutes. An adhesive film on which the adhesive layer (4) was formed was produced.
  • Adhesive layer composition c-5 was applied to a separator made of a polyethylene-terephthalate film subjected to a release treatment so that the thickness after drying was 5 ⁇ m, and dried at 110 ° C. for 5 minutes. An adhesive film on which the adhesive layer (5) was formed was produced.
  • Adhesive layer composition c-6 was applied to a separator made of a polyethylene-terephthalate film that had been subjected to a mold release treatment so that the thickness after drying was 5 ⁇ m, and dried at 110 ° C. for 5 minutes. An adhesive film on which the adhesive layer (6) was formed was produced.
  • Adhesive layer composition c-7 was applied to a separator made of a polyethylene-terephthalate film subjected to a release treatment so that the thickness after drying was 5 ⁇ m, and dried at 110 ° C. for 5 minutes. An adhesive film on which the adhesive layer (7) was formed was produced.
  • Adhesive layer composition c-8 was applied to a separator made of a polyethylene-terephthalate film that had been subjected to a mold release treatment so that the thickness after drying was 5 ⁇ m, and dried at 110 ° C. for 5 minutes. An adhesive film on which the adhesive layer (8) was formed was produced.
  • Metal layer The following were prepared as a metal layer.
  • a single-sided adhesive film was produced by bonding the adhesive layer (1) and the metal layer (1) obtained as described above under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s.
  • a single-sided adhesive film is pre-cut into a shape that can cover the wafer in a shape that allows the adhesive tape (1) to be bonded to the ring frame, and the adhesive layer of the adhesive tape (1) and the metal layer of the single-sided adhesive film
  • the electronic device package tape of Example 1 was fabricated by bonding the sides to each other so that the pressure-sensitive adhesive layer was exposed around the single-sided adhesive film.
  • Examples 2 to 4 and Comparative Examples 1 to 4 For the electronic device packages of Examples 2 to 4 and Comparative Examples 1 to 4 in the same manner as in Example 1 except that the combination of the adhesive tape, the adhesive layer composition and the metal layer was changed to the combination shown in Table 1. A tape was prepared.
  • the storage elastic modulus at 25 ° C. of the adhesive layer used in each example and each comparative example was measured as follows. On the 25 ⁇ m thick polyethylene terephthalate (PET) separator, the adhesive layer composition according to the adhesive layer used in each example and comparative example was applied and dried so that the film thickness after drying was 30 ⁇ m. Then, it is pasted on a 25 ⁇ m thick polyethylene terephthalate (PET) separator, the adhesive layer is peeled off from the separator, and the adhesive layers are pasted together to prepare a test piece having a thickness of 1 mm, a width of 5 mm, and a length of 25 mm. did. The obtained test piece was heated at 100 ° C.
  • PET polyethylene terephthalate
  • the curing rate was calculated
  • required as follows using the differential scanning calorimeter (DSC). First, using a differential scanning calorimeter (DSC), the total calorific value (H0) from the pre-curing sample of the adhesive layer 15 and the residual calorific value (Ht) from the cured sample when heated at 100 ° C. for 3 hours. It was measured. And hardening rate was computed by following Formula (4). The results are shown in Table 1. Curing rate (%) (H0 ⁇ Ht) / H0 ⁇ 100 (4)
  • the adhesive layer of the tape for electronic device packages according to each example and each comparative example is pasted on the back surface of a 200 ⁇ m thick silicon wafer with bumps (bump: copper pillar and solder, bump height: about 40 ⁇ m), and dicing is performed. And divided into 7.5 mm ⁇ 7.5 mm evaluation chips. After irradiating the adhesive layer from the base film side of the adhesive tape with ultraviolet rays of 200 mJ / cm 2 by an air-cooled high-pressure mercury lamp (80 W / cm, irradiation distance 10 cm), the laminate of the metal layer, adhesive layer and silicon chip, The adhesive layer was pre-cured by heating at 100 ° C. for 3 hours.
  • a glass epoxy substrate (glass epoxy base material: thickness 420 ⁇ m, copper wiring: thickness 9 ⁇ m, 80 ⁇ m pitch) was prepared, and a flip chip bonder (Shinkawa Co., Ltd., trade name “LFB-2301”) with the warpage amount of less than 3 mm was prepared. ”) was used to mount a bump of a semiconductor chip on a glass epoxy substrate (mounting condition: pressure head temperature 260 ° C./10 seconds / 1 MPa) to obtain a semiconductor device for evaluation.
  • Appearance images were taken using an ultrasonic diagnostic imaging apparatus (Hitachi Power Solutions Co., Ltd., trade name “FS300III”).
  • FS300III Ultrasonic diagnostic imaging apparatus
  • Adobe Photoshop registered trademark
  • the void portion of the adhesive layer was identified from the appearance image by color tone correction and two-gradation, and the ratio of the void portion was calculated from the histogram.
  • the area of the adhesive layer on the chip was taken as 100%, and the ratio occupied by the void portion was evaluated according to the following criteria.
  • Void portion occupies 10% or less: Excellent product ⁇
  • the percentage occupied by the void portion is more than 10% and 20% or less: ⁇ Void portion accounts for more than 20%: x
  • the storage elastic modulus of the adhesive layer after heating at 100 ° C. for 3 hours was 10 GPa or less, and the tape was heated at 100 ° C. for 3 hours. Since the curing rate of the adhesive layer at that time was 10 to 100%, both warpage evaluation and void evaluation were satisfactory.
  • the tapes for electronic device packages according to Comparative Example 1 and Comparative Example 4 have poor results in void evaluation because the curing rate of the adhesive layer when heated at 100 ° C. for 3 hours is less than 10%. became. Moreover, since the storage elastic modulus of the adhesive layer after heating for 3 hours at 100 ° C. was greater than 10 GPa, the tape for electronic device packaging according to Comparative Example 2 and Comparative Example 3 was inferior in warp evaluation.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packages (AREA)
PCT/JP2016/083696 2016-03-31 2016-11-14 電子デバイスパッケージ用テープ WO2017168820A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018508367A JP6775005B2 (ja) 2016-03-31 2016-11-14 電子デバイスパッケージ用テープ
SG11201802282VA SG11201802282VA (en) 2016-03-31 2016-11-14 Tape for electronic device packaging
MYPI2018701080A MY192601A (en) 2016-03-31 2016-11-14 Tape for electronic device packaging
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