WO2017159590A1 - 静電チャック - Google Patents
静電チャック Download PDFInfo
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- WO2017159590A1 WO2017159590A1 PCT/JP2017/009894 JP2017009894W WO2017159590A1 WO 2017159590 A1 WO2017159590 A1 WO 2017159590A1 JP 2017009894 W JP2017009894 W JP 2017009894W WO 2017159590 A1 WO2017159590 A1 WO 2017159590A1
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- WIPO (PCT)
- Prior art keywords
- support plate
- electrostatic chuck
- heater
- resin layer
- heater element
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Definitions
- An aspect of the present invention generally relates to an electrostatic chuck.
- an electrostatic chuck is used as means for adsorbing and holding a processing object such as a semiconductor wafer or a glass substrate.
- the electrostatic chuck applies electrostatic attraction power to a built-in electrode and attracts a substrate such as a silicon wafer by electrostatic force.
- IC chips including semiconductor elements such as transistors have been required to be reduced in size and improved in processing speed.
- Etching processing accuracy indicates whether a pattern having a designed width and depth can be formed by processing a wafer.
- the semiconductor element can be miniaturized and the integration density can be increased. That is, by increasing the processing accuracy, it is possible to reduce the size and speed of the chip.
- the processing accuracy such as etching depends on the temperature of the wafer during processing. Therefore, in a substrate processing apparatus having an electrostatic chuck, it is required to stably control the wafer temperature during processing. For example, the performance (temperature uniformity) that makes the temperature distribution in the wafer surface uniform is required. Further, a performance (temperature controllability) that intentionally makes a difference in temperature within the wafer surface is required.
- a method for controlling the temperature of the wafer a method using an electrostatic chuck incorporating a heater (heating element) or a cooling plate is known. In general, temperature uniformity is in a trade-off relationship with temperature controllability.
- the wafer temperature is affected by variations in cooling plate temperature, heater temperature, support plate thickness supporting the heater, and resin layer thickness variation around the heater.
- the heater built-in method for example, bonding method
- the heater built-in method is one of the important elements.
- an RF (Radio Frequency) voltage high frequency voltage
- a general heater generates heat under the influence of a high frequency. Then, the temperature of the wafer is affected. Moreover, when the RF voltage is applied, a leakage current flows to the equipment side. Therefore, a mechanism such as a filter is required on the equipment side.
- a wafer is irradiated with plasma having various intensities and various distributions. When plasma is irradiated onto a wafer, temperature uniformity and temperature controllability are required at the same time as controlling the wafer temperature to a temperature suitable for the process.
- the present invention has been made on the basis of recognition of such a problem, and an object thereof is to provide a highly reliable electrostatic chuck that can withstand thermal, electrical, and mechanical loads.
- a ceramic dielectric substrate on which an object to be processed is placed a base plate provided at a position separated from the ceramic dielectric substrate in the stacking direction, and supporting the ceramic dielectric substrate, and the ceramic dielectric
- a heater plate provided between a substrate and the base plate, wherein the heater plate is provided between the ceramic dielectric substrate and the base plate, and includes a first support plate including metal, and the first plate.
- a second support plate including a metal provided between the support plate and the base plate, a first resin layer provided between the first support plate and the second support plate, A second resin layer provided between the first resin layer and the second support plate; and a first conductive layer provided between the first resin layer and the second resin layer.
- Part and the stacking direction A heater element that has a second conductive portion that is spaced apart from the first conductive portion in an in-plane direction perpendicular to the first conductive portion, and generates heat when a current flows; and the in-plane direction of the first conductive portion
- a first space portion partitioned by the first side end portion, the first resin layer, and the second resin layer, and the first resin layer includes: The electrostatic chuck is in contact with the second resin layer between one conductive portion and the second conductive portion.
- the first space (gap) is provided at the end of the first conductive portion of the heater element. Even if the heater element is thermally expanded, the first conductive portion is deformed so as to fill the first space portion. For this reason, when a heater element deform
- the first conductive portion has a second side end portion that is spaced apart from the first side end portion in the in-plane direction
- the heater plate includes:
- the chuck has a second space section defined by the second side end portion, the first resin layer, and the second resin layer.
- the second space (gap) is provided at the end of the first conductive portion of the heater element. Even if the heater element is thermally expanded, the first conductive portion is deformed so as to fill the second space portion. For this reason, when a heater element deform
- the width of the first space portion along the stacking direction is equal to or less than the width of the first conductive portion along the stacking direction.
- This is an electrostatic chuck.
- the electrostatic chuck even if the heater element is deformed due to thermal expansion, the space is filled, so that the stress applied to the first resin layer and the second resin layer can be reduced. Therefore, peeling between the heater element and the first resin layer and peeling between the heater element and the second resin layer can be suppressed. It is possible to suppress the temperature change of the processing object caused by the peeling.
- the electrostatic chuck is characterized by being narrowed.
- the electrostatic chuck even if the heater element is deformed due to thermal expansion, the space is filled, so that the stress applied to the first resin layer and the second resin layer can be reduced. Therefore, peeling between the heater element and the first resin layer and peeling between the heater element and the second resin layer can be suppressed. It is possible to suppress the temperature change of the processing object caused by the peeling.
- a boundary between the first space portion and the first resin layer is from the first side end portion in the in-plane direction. As it moves away, it approaches a virtual surface that extends in the in-plane direction through the center in the stacking direction of the first conductive portion, and the boundary between the first space portion and the second resin layer is the surface.
- the electrostatic chuck is characterized by approaching the imaginary surface as the distance from the first side end portion increases in the inward direction.
- the electrostatic chuck even if the heater element is deformed due to thermal expansion, the space is filled, so that the stress applied to the first resin layer and the second resin layer can be reduced. Therefore, peeling between the heater element and the first resin layer and peeling between the heater element and the second resin layer can be suppressed. It is possible to suppress the temperature change of the processing object caused by the peeling.
- the first conductive portion has an upper surface facing the first resin layer, and the first space portion and the first space portion
- the boundary between the first resin layer and the second resin layer approaches an imaginary plane that extends in the in-plane direction through the upper surface as the distance from the first side end portion increases in the in-plane direction. is there.
- the electrostatic chuck even if the heater element is deformed due to thermal expansion, the space is filled, so that the stress applied to the first resin layer and the second resin layer can be reduced. Therefore, peeling between the heater element and the first resin layer and peeling between the heater element and the second resin layer can be suppressed. It is possible to suppress the temperature change of the processing object caused by the peeling.
- the first conductive portion has a lower surface facing the second resin layer, and the first space portion and the first
- the electrostatic chuck is characterized in that a boundary between the second resin layer and the resin layer approaches a virtual surface extending in the in-plane direction through the lower surface as the distance from the first conductive portion increases in the in-plane direction.
- the electrostatic chuck even if the heater element is deformed due to thermal expansion, the space is filled, so that the stress applied to the first resin layer and the second resin layer can be reduced. Therefore, peeling between the heater element and the first resin layer and peeling between the heater element and the second resin layer can be suppressed. It is possible to suppress the temperature change of the processing object caused by the peeling.
- the first conductive portion includes an upper surface facing the first resin layer, and a lower surface facing the second resin layer.
- the width of one of the upper surface and the lower surface along the in-plane direction is narrower than the width of the other surface of the upper surface and the lower surface along the in-plane direction. It is an electrostatic chuck.
- the electrostatic chuck even if the heater element is deformed due to thermal expansion, the space is filled, so that the stress applied to the first resin layer and the second resin layer can be reduced. Therefore, peeling between the heater element and the first resin layer and peeling between the heater element and the second resin layer can be suppressed. It is possible to suppress the temperature change of the processing object caused by the peeling.
- the length along the in-plane direction of the lower surface of the first conductive portion is along the in-plane direction of the upper surface of the first conductive portion.
- the electrostatic chuck is longer than the length.
- the temperature below the heater element is lower than the temperature above the heater element, and the heat distribution may be biased in the vertical direction. According to this electrostatic chuck, it is possible to suppress such an uneven distribution of heat in the vertical direction.
- the length along the in-plane direction of the upper surface of the first conductive portion is along the in-plane direction of the lower surface of the first conductive portion.
- the electrostatic chuck is longer than the length.
- the upper surface of the heater element since the upper surface of the heater element is long, the upper part of the heater element on which the object to be processed is arranged can be easily heated. Further, since the lower surface of the heater element is relatively short, the lower portion of the heater element can be easily cooled. Thereby, temperature followability (ramp plate) can be improved.
- An eleventh invention is the electrostatic chuck according to any one of the eighth to tenth inventions, wherein the one surface and the side surface of the first conductive portion are connected by a curved surface. is there.
- the electrostatic chuck even if the heater element is deformed due to thermal expansion, the space is filled, so that the stress applied to the first resin layer and the second resin layer can be reduced. Therefore, peeling between the heater element and the first resin layer and peeling between the heater element and the second resin layer can be suppressed. It is possible to suppress the temperature change of the processing object caused by the peeling.
- a twelfth aspect of the invention is an electrostatic chuck according to any one of the eighth to eleventh aspects, wherein a side surface of the first conductive portion is rougher than the other surface.
- the electrostatic chuck even if the heater element is deformed due to thermal expansion, the space is filled, so that the stress applied to the first resin layer and the second resin layer can be reduced. Therefore, peeling between the heater element and the first resin layer and peeling between the heater element and the second resin layer can be suppressed. It is possible to suppress the temperature change of the processing object caused by the peeling.
- the stacking direction of one of the first support plate and the second support plate and the first conductive portion is stacked.
- the distance between the center virtual plane extending through the center in the in-plane direction is the other support plate of the first support plate and the second support plate, the center virtual surface,
- the electrostatic chuck is characterized in that the one surface is shorter than the distance between the one support plate and the central virtual surface.
- the electrostatic chuck even if the heater element is deformed due to thermal expansion, the space is filled, so that the stress applied to the first resin layer and the second resin layer can be reduced. Therefore, peeling between the heater element and the first resin layer and peeling between the heater element and the second resin layer can be suppressed. It is possible to suppress the temperature change of the processing object caused by the peeling.
- a fourteenth invention is the electrostatic chuck according to any one of the first to thirteenth inventions, wherein the first support plate is electrically joined to the second support plate. .
- This electrostatic chuck can shield the heater element from high frequency. Thereby, it can suppress that a heater element generates heat to abnormal temperature. Moreover, the impedance of the heater plate can be suppressed.
- the area of the region where the first support plate is joined to the second support plate is smaller than the area of the upper surface of the first support plate.
- the electrostatic chuck is smaller than the area of the lower surface of the support plate.
- This electrostatic chuck can shield the heater element from high frequency. Thereby, it can suppress that a heater element generates heat to abnormal temperature. Moreover, the impedance of the heater plate can be suppressed.
- the upper surface of the first support plate has first irregularities
- the lower surface of the second support plate is a second surface.
- An electrostatic chuck characterized by having irregularities.
- the bonding area between the first support plate and the heater element can be increased, and the first support The adhesive strength between the plate and the heater element can be improved.
- the lower surface of the second support plate has the second unevenness
- the bonding area between the second support plate and the heater element can be increased, and the second support plate and the heater element The adhesive strength between them can be improved.
- the upper surface of the first support plate has the first unevenness
- the distance between the heater element and the object to be processed can be further shortened. Thereby, the speed which raises the temperature of a process target object can be improved.
- a seventeenth aspect of the invention is the electrostatic chuck according to the sixteenth aspect of the invention, wherein the first unevenness follows the shape of the heater element, and the second unevenness follows the shape of the heater element. It is.
- the adhesion area between the first support plate and the heater element can be increased, and the adhesion strength between the first support plate and the heater element can be improved. . Further, the adhesion area between the second support plate and the heater element can be increased, and the adhesion strength between the second support plate and the heater element can be improved. Furthermore, the distance between the heater element and the object to be processed can be further shortened. Thereby, the speed which raises the temperature of a process target object can be improved.
- the distance between the first concave-convex concave portion and the second concave-convex concave portion is the distance between the first concave-convex convex portion and the second concave-convex convex portion.
- An electrostatic chuck characterized by being shorter than the distance between the convex and concave portions.
- the adhesion area between the first support plate and the heater element can be increased, and the adhesion strength between the first support plate and the heater element can be improved. . Further, the adhesion area between the second support plate and the heater element can be increased, and the adhesion strength between the second support plate and the heater element can be improved. Furthermore, the distance between the heater element and the object to be processed can be further shortened. Thereby, the speed which raises the temperature of a process target object can be improved.
- the nineteenth invention is the electrostatic chuck according to any one of the sixteenth to eighteenth inventions, wherein the height of the first unevenness is different from the height of the second unevenness.
- the adhesion area between the first support plate and the heater element can be increased, and the adhesion strength between the first support plate and the heater element can be improved. . Further, the adhesion area between the second support plate and the heater element can be increased, and the adhesion strength between the second support plate and the heater element can be improved. Furthermore, the distance between the heater element and the object to be processed can be further shortened. Thereby, the speed which raises the temperature of a process target object can be improved.
- the heater element has a belt-like heater electrode, and the heater electrodes are provided independently of each other in a plurality of regions.
- An electrostatic chuck characterized by the following.
- the heater electrodes are provided in a plurality of regions independently of each other, the temperature in the surface of the processing object can be controlled independently for each region. Thereby, it is possible to intentionally make a difference in the in-plane temperature of the processing object (temperature controllability).
- the heater elements are provided in a plurality, and the plurality of heater elements are provided in different states from each other. It is an electrostatic chuck.
- the in-plane temperature of the processing object can be controlled independently for each region. Thereby, it is possible to intentionally make a difference in the in-plane temperature of the processing object (temperature controllability).
- the heater plate is a conductive bypass provided between the first support plate and the second support plate.
- the electrostatic chuck further includes a layer.
- this electrostatic chuck According to this electrostatic chuck, a greater degree of freedom can be given to the arrangement of terminals for supplying power to the heater element.
- the bypass layer By providing the bypass layer, it is not necessary to directly join the terminal having a large heat capacity to the heater element as compared with the case where the bypass layer is not provided. Thereby, the uniformity of the temperature distribution in the surface of a process target object can be improved.
- the heater element is electrically joined to the bypass layer, and is electrically insulated from the first support plate and the second support plate. This is an electrostatic chuck.
- the twenty-fourth invention is the electrostatic chuck according to the twenty-second or twenty-third invention, wherein the bypass layer is thicker than the first resin layer.
- this electrostatic chuck According to this electrostatic chuck, a greater degree of freedom can be given to the arrangement of terminals for supplying power to the heater element.
- the electrical resistance of the bypass layer can be suppressed, and the heat generation amount of the bypass layer can be suppressed.
- a twenty-fifth aspect of the invention is an electrostatic chuck according to any one of the twenty-second to twenty-fourth aspects, wherein the thickness of the bypass layer is larger than the thickness of the heater element.
- this electrostatic chuck According to this electrostatic chuck, a greater degree of freedom can be given to the arrangement of terminals for supplying power to the heater element.
- the electrical resistance of the bypass layer can be suppressed, and the heat generation amount of the bypass layer can be suppressed.
- the twenty-sixth invention is the electrostatic chuck according to any one of the twenty-second to twenty-fifth inventions, wherein the bypass layer is provided between the heater element and the base plate.
- the bypass layer suppresses the heat supplied from the heater element from being transmitted to the base plate. That is, the bypass layer has a heat insulating effect on the base plate side as viewed from the bypass layer, and can improve the uniformity of the temperature distribution in the surface of the processing object.
- a twenty-seventh aspect of the invention is the electrostatic chuck according to any one of the twenty-second to twenty-fifth aspects, wherein the bypass layer is provided between the heater element and the ceramic dielectric substrate. It is.
- the heat of the heater element having the highest temperature can be quickly transferred to the base plate, and the temperature follow-up performance (run) can be reduced when the temperature of the object to be processed is lowered. Plate) can be further improved.
- a twenty-eighth aspect of the present invention is the electrostatic chuck according to any one of the twenty-second to twenty-seventh aspects, wherein the heater plate further includes a space provided on a side of the bypass layer.
- This electrostatic chuck deforms so as to fill the space even if the bypass layer is thermally expanded. For this reason, the stress concerning the resin layer etc. which adjoin a bypass layer can be reduced. Therefore, peeling of the resin layer adjacent to the bypass layer can be suppressed. For example, the resistance to the load of the heater plate can be improved, and the reliability of the electrostatic chuck can be further improved. Furthermore, the temperature change of the processing object which arises by peeling of the layer adjacent to a bypass layer can be suppressed.
- the size relationship between the cross-sectional area of the first space portion and the cross-sectional area of the space portion on the side of the bypass layer is the thickness of the heater element and the bypass layer
- the electrostatic chuck is characterized in that it has the same magnitude relationship of thickness.
- the thickness is thick, the volume increase due to thermal expansion increases. For this reason, the one where the cross-section record of a space part is large is advantageous to peeling prevention of an adjacent layer. Therefore, according to this electrostatic chuck, peeling of the layer adjacent to the first conductive portion and the bypass layer can be further suppressed. It is possible to more reliably suppress the temperature change of the object to be processed due to the occurrence of peeling.
- the side end of the first space portion is located on the first support plate side or the side with respect to the center in the thickness direction of the first conductive portion.
- the side edge of the space part on the side of the bypass layer is shifted in the same direction as the side edge of the first space part with respect to the center in the thickness direction of the bypass layer. This is an electrostatic chuck.
- this electrostatic chuck it is not necessary to use a complicated method for forming the first space portion and the space portion of the bypass layer, and the formation of the space portion of the first space portion and the bypass layer is facilitated. be able to.
- the heater element includes a first surface on the first support plate side, a second surface on the second support plate side, The width of the first surface is different from the width of the second surface, and the bypass layer includes a third surface on the first support plate side and a fourth surface on the second support plate side.
- the width of the third surface is different from the width of the fourth surface, and the width relationship of the third surface with respect to the fourth surface is the width of the first surface with respect to the second surface.
- This is an electrostatic chuck characterized by having the same magnitude relationship.
- the heater element includes a first surface on the first support plate side, a second surface on the second support plate side, The width of the first surface is different from the width of the second surface, and the bypass layer includes a third surface on the first support plate side and a fourth surface on the second support plate side.
- the width of the third surface is different from the width of the fourth surface, and the width relationship of the third surface with respect to the fourth surface is the width of the first surface with respect to the second surface.
- the electrostatic chuck is opposite to the magnitude relationship of
- the direction of the stress applied by the thermal expansion of the bypass layer can be made opposite to the direction of the stress applied by the thermal expansion of the heater element. Thereby, the influence of stress can be suppressed more.
- the area of the upper surface of the first support plate is larger than the area of the lower surface of the second support plate. It is an electric chuck.
- a terminal for supplying power to the heater element can be more easily connected on the second support plate side as viewed from the heater element.
- the first support plate has a plurality of support portions, and the plurality of support portions are provided independently of each other. This is an electrostatic chuck.
- This electrostatic chuck can intentionally provide a temperature difference in the radial direction within the surface of the first support plate (temperature controllability).
- a temperature difference can be provided in a step shape from the center to the outer periphery within the plane of the first support plate. Thereby, a temperature difference can be intentionally provided within the surface of the processing object (temperature controllability).
- the heater element when the surface of the first support plate on the second support plate side is viewed along the stacking direction, the heater element A first region that overlaps with the heater element, and a second region that does not overlap with the heater element, and in a cross section parallel to the stacking direction, the second region is the second region compared to the first region.
- An electrostatic chuck that protrudes toward the support plate.
- the adhesion between the layer adjacent to the first support plate and the first support plate can be improved. Thereby, the soaking
- a surface of the second support plate on the first support plate side overlaps the heater element when viewed along the stacking direction;
- This is an electrostatic chuck.
- the adhesion between the layer adjacent to the second support plate and the second support plate can be improved. Thereby, the soaking
- the surface of the first support plate on the second support plate side has irregularities in the shape of the heater element.
- the surface of the support plate on the first support plate side has irregularities that are in the shape of the heater element.
- thermostatic chuck it is possible to achieve the thermal uniformity and withstand voltage characteristics as designed. Moreover, the speed which raises the temperature of a process target object can be improved. Therefore, for example, both “heating performance (heating rate) of the heater”, “temperature uniformity”, and “voltage resistance reliability” can be achieved.
- the distance along the stacking direction between the second region and the fourth region is the stacking direction between the first region and the third region.
- the electrostatic chuck is characterized by being shorter than the distance along.
- the adhesion between the layer adjacent to the first support plate and the first support plate is high. Further, the adhesion between the layer adjacent to the second support plate and the second support plate is high. As a result, it is possible to achieve the thermal uniformity and withstand voltage characteristics as designed. Moreover, the speed which raises the temperature of a process target object can be improved. Therefore, for example, both “heating performance (heating rate) of the heater”, “temperature uniformity”, and “voltage resistance reliability” can be achieved.
- a highly reliable electrostatic chuck that can withstand thermal, electrical, and mechanical loads is provided.
- FIG. 2A and FIG. 2B are schematic cross-sectional views showing the electrostatic chuck according to the present embodiment. It is a typical perspective view showing the heater plate of this embodiment.
- FIG. 4A and FIG. 4B are schematic perspective views showing the heater plate of the present embodiment. It is a typical exploded view showing the heater plate of this embodiment. It is sectional drawing showing a part of heater plate of this embodiment. It is a photographic image of the heater plate of this embodiment.
- FIGS. 8A to 8D are cross-sectional views showing the heater plate.
- FIG. 9A and FIG. 9B are cross-sectional views showing the heater plate.
- FIG. 10B are cross-sectional views showing a part of a modified example of the heater plate of the present embodiment.
- FIG. 11A and FIG. 11B are cross-sectional views showing a part of a modified example of the heater plate of the present embodiment.
- 12A and 12B are cross-sectional views showing a part of a modification of the heater plate of the present embodiment. It is a typical exploded view showing the modification of the heater plate of this embodiment.
- FIG. 14A and FIG. 14B are schematic cross-sectional views illustrating an example of the manufacturing method of this embodiment. It is typical sectional drawing which illustrates another example of the manufacturing method of this embodiment. It is a typical exploded view showing the electrostatic chuck concerning this embodiment.
- FIG. 17A and FIG. 17B are electric circuit diagrams showing an electrostatic chuck.
- FIG. 18A and FIG. 18B are schematic plan views illustrating specific examples of the heater plate of the present embodiment.
- FIG. 19A and FIG. 19B are schematic plan views illustrating the heater element of this example. It is a typical top view which illustrates the heater element of this example.
- FIG. 21A and FIG. 21B are schematic plan views illustrating the bypass layer of this example. 22 (a) to 22 (c) are enlarged views schematically showing a part of the heater plate of this example.
- FIG. 23A and FIG. 23B are schematic views for explaining the shape of the surface of the heater plate of the present embodiment. It is a typical sectional view showing the heater plate of this embodiment.
- FIG. 25A and FIG. 25B are schematic cross-sectional views showing an electrostatic chuck according to a modification of the present embodiment.
- FIG. 26A and FIG. 26B are schematic plan views illustrating modifications of the first support plate of the present embodiment. It is a typical top view showing the modification of the 1st support plate of this embodiment. It is typical sectional drawing showing the heater plate of this modification.
- FIG. 29A to FIG. 29D are cross-sectional views illustrating modifications of the heater plate of the present embodiment.
- 30 (a) to 30 (d) are cross-sectional views illustrating modifications of the heater plate of the present embodiment.
- FIG. 31A to FIG. 31D are cross-sectional views showing modifications of the heater plate of the present embodiment.
- FIG. 32A to FIG. 32D are cross-sectional views showing modifications of the heater plate of the present embodiment.
- FIG. 1 is a schematic perspective view showing an electrostatic chuck according to the present embodiment.
- FIG. 2A and FIG. 2B are schematic cross-sectional views showing the electrostatic chuck according to the present embodiment.
- FIG. 1 shows a cross-sectional view of a part of the electrostatic chuck.
- FIG. 2A is a schematic cross-sectional view taken along the cut plane A1-A1 shown in FIG. 1, for example.
- FIG. 2B is a schematic enlarged view of the region B1 shown in FIG.
- the electrostatic chuck 10 includes a ceramic dielectric substrate 100, a heater plate 200, and a base plate 300.
- the ceramic dielectric substrate 100 is provided at a position away from the base plate 300 in the stacking direction (Z direction).
- the heater plate 200 is provided between the base plate 300 and the ceramic dielectric substrate 100.
- the adhesive 403 is provided between the base plate 300 and the heater plate 200.
- An adhesive 403 is provided between the heater plate 200 and the ceramic dielectric substrate 100.
- Examples of the material of the adhesive 403 include heat-resistant resins such as silicone having relatively high thermal conductivity.
- the thickness of the adhesive 403 is, for example, about 0.1 millimeter (mm) or more and 1.0 mm or less. The thickness of the adhesive 403 is the same as the distance between the base plate 300 and the heater plate 200 or the distance between the heater plate 200 and the ceramic dielectric substrate 100.
- the ceramic dielectric substrate 100 is a flat base material made of, for example, a polycrystalline ceramic sintered body, and the first main surface 101 on which the processing object W such as a semiconductor wafer is placed and the first main surface 101 are: And a second main surface 102 on the opposite side.
- the direction connecting the first main surface 101 and the second main surface 102 is the Z direction, and one of the directions orthogonal to the Z direction is orthogonal to the X direction, the Z direction, and the X direction.
- the direction to do is called the Y direction.
- the Z direction is substantially parallel to the stacking direction of the base plate 300, the heater plate 200, and the ceramic dielectric substrate 100.
- the in-plane direction is one direction parallel to a plane including the X direction and the Y direction.
- Examples of the crystal material included in the ceramic dielectric substrate 100 include Al 2 O 3 , Y 2 O 3, and YAG. By using such a material, infrared transmittance, insulation resistance, and plasma durability in the ceramic dielectric substrate 100 can be enhanced.
- An electrode layer 111 is provided inside the ceramic dielectric substrate 100.
- the electrode layer 111 is interposed between the first main surface 101 and the second main surface 102. That is, the electrode layer 111 is formed so as to be inserted into the ceramic dielectric substrate 100.
- the electrode layer 111 is integrally sintered with the ceramic dielectric substrate 100.
- the electrode layer 111 is not limited to be interposed between the first main surface 101 and the second main surface 102, and may be attached to the second main surface 102.
- the electrostatic chuck 10 generates a charge on the first main surface 101 side of the electrode layer 111 by applying a suction holding voltage to the electrode layer 111, and holds the processing target W by electrostatic force.
- the heater plate 200 generates heat when the heater current flows, and the temperature of the processing object W can be increased as compared with the case where the heater plate 200 does not generate heat.
- the electrode layer 111 is provided along the first main surface 101 and the second main surface 102.
- the electrode layer 111 is an adsorption electrode for adsorbing and holding the processing object W.
- the electrode layer 111 may be monopolar or bipolar.
- the electrode layer 111 may be a tripolar type or other multipolar type. The number of the electrode layers 111 and the arrangement of the electrode layers 111 are appropriately selected.
- the ceramic dielectric substrate 100 includes a first dielectric layer 107 between the electrode layer 111 and the first main surface 101, and a second dielectric layer 109 between the electrode layer 111 and the second main surface 102.
- the infrared spectral transmittance of at least the first dielectric layer 107 of the ceramic dielectric substrate 100 is preferably 20% or more. In the present embodiment, the infrared spectral transmittance is a value in terms of a thickness of 1 mm.
- the infrared spectral transmittance of at least the first dielectric layer 107 of the ceramic dielectric substrate 100 is 20% or more, infrared rays emitted from the heater plate 200 in a state where the processing object W is placed on the first main surface 101. Can efficiently pass through the ceramic dielectric substrate 100. Therefore, it becomes difficult for heat to accumulate in the processing object W, and the controllability of the temperature of the processing object W is improved.
- the temperature of the processing object W is likely to increase as the plasma power increases.
- the heat transmitted to the processing object W by the plasma power is efficiently transmitted to the ceramic dielectric substrate 100.
- the heat transmitted to the ceramic dielectric substrate 100 by the heater plate 200 is efficiently transmitted to the processing object W. Therefore, heat is efficiently transmitted and it becomes easy to maintain the processing target W at a desired temperature.
- the infrared spectral transmittance of the second dielectric layer 109 is desirably 20% or more. Since the infrared spectral transmittance of the first dielectric layer 107 and the second dielectric layer 109 is 20% or more, the infrared rays emitted from the heater plate 200 are more efficiently transmitted through the ceramic dielectric substrate 100, and are to be processed. The temperature controllability of the object W can be improved.
- the base plate 300 is provided on the second main surface 102 side of the ceramic dielectric substrate 100 and supports the ceramic dielectric substrate 100 via the heater plate 200.
- a communication path 301 is provided in the base plate 300. That is, the communication path 301 is provided inside the base plate 300.
- An example of the material of the base plate 300 is aluminum.
- the base plate 300 serves to adjust the temperature of the ceramic dielectric substrate 100. For example, when the ceramic dielectric substrate 100 is cooled, a cooling medium is introduced into the communication path 301. The inflowing cooling medium passes through the communication path 301 and flows out of the communication path 301. Thereby, the heat of the base plate 300 can be absorbed by the cooling medium, and the ceramic dielectric substrate 100 mounted thereon can be cooled.
- the ceramic dielectric substrate 100 when the ceramic dielectric substrate 100 is heated, it is possible to put a heating medium in the communication path 301.
- a heater (not shown) can be built in the base plate 300. As described above, when the temperature of the ceramic dielectric substrate 100 is adjusted by the base plate 300, the temperature of the processing object W attracted and held by the electrostatic chuck 10 can be easily adjusted.
- a convex portion 113 is provided on the first main surface 101 side of the ceramic dielectric substrate 100 as necessary.
- a groove 115 is provided between the convex portions 113 adjacent to each other. The grooves 115 communicate with each other. A space is formed between the back surface of the processing object W mounted on the electrostatic chuck 10 and the groove 115.
- the introduction path 321 that penetrates the base plate 300 and the ceramic dielectric substrate 100 is connected to the groove 115.
- a transmission gas such as helium (He)
- He helium
- FIG. 3 is a schematic perspective view showing the heater plate of the present embodiment.
- FIG. 4A and FIG. 4B are schematic perspective views showing the heater plate of the present embodiment.
- FIG. 5 is a schematic exploded view showing the heater plate of the present embodiment.
- FIG. 3 is a schematic perspective view of the heater plate according to the present embodiment as viewed from the upper surface (the surface on the ceramic dielectric substrate 100 side).
- FIG. 4A is a schematic perspective view of the heater plate according to the present embodiment as viewed from the lower surface (the surface on the base plate 300 side).
- FIG. 4B is a schematic enlarged view of the region B2 shown in FIG.
- the heater plate 200 of the present embodiment includes a first support plate 210, a first resin layer 220, a heater element (heat generation layer) 230, a second resin layer 240, A second support plate 270 and a power supply terminal 280 are provided.
- the surface 211 (upper surface) of the first support plate 210 forms the upper surface of the heater plate 200.
- the surface 271 (lower surface) of the second support plate 270 forms the lower surface of the heater plate 200.
- the first support plate 210 and the second support plate 270 are support plates that support the heater element 230 and the like. In this example, the first support plate 210 and the second support plate 270 sandwich and support the first resin layer 220, the heater element 230, and the second resin layer 240.
- the first support plate 210 is provided between the ceramic dielectric substrate 100 and the base plate 300.
- the second support plate 270 is provided between the first support plate 210 and the base plate 300.
- the first resin layer 220 is provided between the first support plate 210 and the second support plate 270.
- the second resin layer 240 is provided between the first resin layer 220 and the second support plate 270.
- the heater element 230 is provided between the first resin layer 220 and the second resin layer 240.
- the first support plate 210 has a relatively high thermal conductivity.
- Examples of the material of the first support plate 210 include a metal containing at least one of aluminum, copper, and nickel, and graphite having a multilayer structure. From the viewpoint of achieving both “in-plane temperature uniformity of the object to be processed” and “high throughput”, which are generally contradictory, and from the viewpoint of contamination and magnetism of the chamber, Aluminum or aluminum alloy is suitable.
- the thickness (length in the Z direction) of the first support plate 210 is, for example, about 0.1 mm or more and 5.0 mm or less. More preferably, the thickness of the first support plate 210 is, for example, about 0.3 mm or more and 1.0 mm or less.
- the first support plate 210 improves the uniformity of the temperature distribution in the surface of the heater plate 200.
- the first support plate 210 suppresses the warp of the heater plate 200.
- the first support plate 210 improves the strength of adhesion between the heater plate 200 and the ceramic dielectric substrate 100.
- RF Radio Frequency
- high frequency voltage high frequency voltage
- the heater element 230 may generate heat under the influence of the high frequency.
- the temperature controllability of the heater element 230 decreases.
- the first support plate 210 blocks the heater element 230 and the bypass layer 250 from high frequencies. Thereby, the first support plate 210 can suppress the heater element 230 from generating heat to an abnormal temperature.
- the material, thickness, and function of the second support plate 270 can be freely set according to required performance, dimensions, and the like.
- the material, thickness, and function of the second support plate 270 may be the same as the material, thickness, and function of the first support plate 210, respectively.
- the first support plate 210 is electrically joined to the second support plate 270.
- contact is included in the range of “joining” in the present specification. The details of the electrical connection between the second support plate 270 and the first support plate 210 will be described later.
- the first support plate 210 and the second support plate 270 have a relatively high thermal conductivity. Thereby, the first support plate 210 and the second support plate 270 improve the thermal diffusibility of the heat supplied from the heater element 230. Moreover, the 1st support plate 210 and the 2nd support plate 270 suppress the curvature of the heater plate 200, for example by having moderate thickness and rigidity. Furthermore, the first support plate 210 and the second support plate 270 improve the shielding performance against an RF voltage applied to, for example, an electrode of a wafer processing apparatus. For example, the influence of the RF voltage on the heater element 230 is suppressed. Thus, the first support plate 210 and the second support plate 270 have a function of thermal diffusion, a function of suppressing warpage, and a function of a shield against RF voltage.
- the material of the first resin layer 220 examples include polyimide and polyamideimide.
- the thickness (length in the Z direction) of the first resin layer 220 is about 20 ⁇ m or more and 0.20 mm or less, for example, 50 ⁇ m.
- the first resin layer 220 joins the first support plate 210 and the heater element 230 to each other.
- the first resin layer 220 electrically insulates between the first support plate 210 and the heater element 230.
- the first resin layer 220 has a function of electrical insulation and a function of surface bonding.
- the material and thickness of the second resin layer 240 are approximately the same as the material and thickness of the first resin layer 220, respectively.
- the second resin layer 240 joins the heater element 230 and the second support plate 270 to each other.
- the second resin layer 240 electrically insulates between the heater element 230 and the second support plate 270.
- the second resin layer 240 has a function of electrical insulation and a function of surface bonding.
- Examples of the material of the heater element 230 include metals including at least one of stainless steel, titanium, chromium, nickel, copper, and aluminum.
- the thickness (length in the Z direction) of the heater element 230 is about 10 ⁇ m or more and 0.20 mm or less, for example, 30 ⁇ m.
- the heater element 230 is electrically insulated from the first support plate 210 and the second support plate 270.
- the heater element 230 generates heat when current flows, and controls the temperature of the processing target W. For example, the heater element 230 heats the processing object W to a predetermined temperature. For example, the heater element 230 makes the temperature distribution in the surface of the processing object W uniform. For example, the heater element 230 intentionally makes a difference in the in-plane temperature of the processing object W.
- the heater element 230 has a belt-like heater electrode 239.
- the power supply terminal 280 is electrically joined to the heater element 230. In a state where the heater plate 200 is provided between the base plate 300 and the ceramic dielectric substrate 100, the power supply terminal 280 is provided from the heater plate 200 toward the base plate 300. The power supply terminal 280 supplies power supplied from the outside of the electrostatic chuck 10 to the heater element 230.
- the heater plate 200 has a plurality of power supply terminals 280.
- the heater plate 200 shown in FIGS. 3 to 5 has eight power supply terminals 280.
- the number of power supply terminals 280 is not limited to “8”.
- One power supply terminal 280 is electrically joined to one heater electrode 239.
- the hole 273 passes through the second support plate 270.
- the power supply terminal 280 is electrically joined to the heater electrode 239 through the hole 273.
- the current flows through the heater element 230 as indicated by the arrow Cc shown in FIG. It flows through a predetermined zone (area). Details of the zone of the heater element 230 will be described later.
- the current flowing to the heater element 230 flows to the power supply terminal 280 and flows from the power supply terminal 280 to the outside of the electrostatic chuck 10 as indicated by arrows Cd and Ce shown in FIG.
- the heater element 230 and the power supply terminal 280 there are a portion where the current enters the heater element 230 and a portion where the current exits from the heater element 230. That is, a pair exists at the joint between the heater element 230 and the power supply terminal 280. Since the heater plate 200 shown in FIGS. 3 to 5 has eight power supply terminals 280, there are four pairs at the joint between the heater element 230 and the power supply terminal 280.
- the heater element 230 is provided between the first support plate 210 and the second support plate 270.
- the uniformity of the temperature distribution in the surface of the heater plate 200 can be improved, and the uniformity of the temperature distribution in the surface of the processing object W can be improved.
- the first support plate 210 and the second support plate 270 can block the heater element 230 (and a bypass layer 250 described later) from high frequency, and suppress the heater element 230 from generating heat to an abnormal temperature. .
- the power supply terminal 280 is provided from the heater plate 200 toward the base plate 300. Therefore, electric power can be supplied to the power supply terminal 280 from the side of the lower surface 303 (see FIGS. 2A and 2B) of the base plate 300 through a member called a socket. Thus, the heater wiring is realized while suppressing the power supply terminal 280 from being exposed in the chamber in which the electrostatic chuck 10 is installed.
- the first support plate 210 and the second support plate 270 are manufactured by first machining aluminum.
- the inspection of the first support plate 210 and the second support plate 270 is performed using, for example, a three-dimensional measuring instrument.
- the first resin layer 220 and the second resin layer 240 are manufactured by cutting the polyimide film by laser, machining, die cutting, or melting.
- the inspection of the first resin layer 220 and the second resin layer 240 is performed using, for example, visual observation.
- a heater pattern is formed by cutting a metal containing at least one of stainless steel, titanium, chromium, nickel, copper, and aluminum by etching, machining, die cutting, etc. using photolithography technology or printing technology. To do. Thereby, the heater element 230 is manufactured. Further, the resistance value of the heater element 230 is measured.
- stacked each member of the heater plate 200 is crimped
- the heater plate 200 of this embodiment is manufactured.
- inspection etc. are suitably performed with respect to the heater plate 200 after manufacture.
- FIG. 6 is a cross-sectional view showing a part of the heater plate of the present embodiment.
- FIG. 7 is a photographic image of the heater plate of this embodiment. In FIG. 7, a cross section corresponding to the region B3 shown in FIG. 6 is observed.
- the heater electrode 239 is disposed independently in a plurality of regions.
- the heater electrode 239 (heater element 230) includes the first conductive portion 21 and the second conductive portion 22.
- the second conductive portion 22 is separated from the first conductive portion 21 in the in-plane direction Dp (for example, the X direction).
- the first conductive part 21 and the second conductive part 22 are part of the heater electrode 239.
- the distance between the first conductive portion 21 and the second conductive portion 22 (the width L8 of the separation portion 235 between the first conductive portion 21 and the second conductive portion 22) is, for example, 500 ⁇ m or more. is there.
- the heater electrode 239 is arranged in a plurality of regions, whereby the temperature in the surface of the processing object W can be controlled for each region. A specific example of the heater electrode 239 pattern will be described later with reference to FIGS. 19A, 19B, and 20.
- the first conductive portion 21 has a side end portion 21a (first side end portion) and a side end portion 21b (second side end portion).
- the side end portion 21 a and the side end portion 21 b are both end portions in the in-plane direction Dp of the first conductive portion 21.
- the side end portion 21a is located on the second conductive portion 22 side.
- the side end 21b is an end opposite to the side end 21a, and is separated from the side end 21a in the in-plane direction Dp.
- the second conductive portion 22 has a side end 22a (third side end) and a side end 22b (fourth side end).
- the side end portion 22a and the side end portion 22b are both end portions in the in-plane direction Dp of the second conductive portion 22.
- the side end 22a is located on the first conductive portion 21 side.
- the side end 22b is an end opposite to the side end 22a, and is separated from the side end 22a in the in-plane direction Dp.
- the heater plate 200 has first to fourth space portions 23a to 23d.
- the first space portion 23a is a space partitioned (enclosed) by the side end portion 21a, the first resin layer 220, and the second resin layer 240.
- the first space portion 23 a is adjacent to the side end portion 21 a in the in-plane direction Dp, and is located between the first conductive portion 21 and the second conductive portion 22.
- the second space portion 23b is a space defined by the side end portion 21b, the first resin layer 220, and the second resin layer 240.
- the second space portion 23a is adjacent to the side end portion 21b in the in-plane direction Dp.
- the first conductive portion 21 is located between the first space portion 23a and the second space portion 23b.
- the third space 23c is a space defined by the side end 22a, the first resin layer 220, and the second resin layer 240.
- the third space portion 23 c is adjacent to the side end portion 22 a in the in-plane direction Dp, and is located between the first conductive portion 21 and the second conductive portion 22.
- the fourth space 23d is a space defined by the side end 22b, the first resin layer 220, and the second resin layer 240.
- the fourth space portion 23d is adjacent to the side end portion 22b in the in-plane direction Dp.
- the second conductive portion 22 is located between the third space portion 23c and the fourth space portion 23d.
- the width L2 along the Z direction of the first space portion 23a is equal to or smaller than the width L1 along the Z direction of the first conductive portion 21.
- the width of the second space portion 23b along the Z direction is equal to or smaller than the width of the first conductive portion 21 along the Z direction.
- the width along the Z direction of the third space portion 23c and the width along the Z direction valley of the fourth space portion 23d are respectively the widths along the Z direction of the second conductive portion 22. It is as follows.
- the first resin layer 220 and the second resin layer 240 are in contact with each other between the regions of the heater electrode 239 that are spaced apart from each other.
- the width L ⁇ b> 2 along the Z direction of the first space portion 23 a becomes narrower as the distance from the side end portion 21 a increases in the in-plane direction Dp.
- the first resin layer 220 is in contact with the second resin layer 240 between the first conductive portion 21 and the second conductive portion 22.
- the length L3 along the in-plane direction Dp of the first space 23a is about 1 to 15 times the width L1 along the Z direction of the first conductive portion 21.
- the width L1 along the Z direction of the first conductive portion 21 is, for example, 30 ⁇ m (10 ⁇ m or more and 50 ⁇ m or less).
- the first space portion 23a has a shape crushed from the upper side and the lower side as the distance from the side end portion 21a increases. That is, the boundary between the first space portion 23a and the first resin layer 220 approaches the virtual plane P1 (virtual line) shown in FIG. 6 as it moves away from the side end portion 21a in the in-plane direction Dp. Further, the boundary between the first space portion 23a and the second resin layer 240 approaches the virtual surface P1 as the distance from the side end portion 21a increases in the in-plane direction Dp.
- the virtual plane P1 is a plane that passes through the vicinity of the center of the first conductive portion 21 in the Z direction and is parallel to the in-plane direction Dp.
- the second to fourth space portions 23b to 23d have a shape crushed from the upper side and the lower side.
- the heater electrode 239 undergoes thermal expansion.
- the thermal expansion coefficient of the first resin layer 220 and the thermal expansion coefficient of the heater electrode 239 may be different.
- the temperature of the first resin layer 220 and the temperature of the heater electrode 239 may be different.
- the heater electrode 239 is deformed by thermal expansion, stress is applied to the first resin layer 220. Due to this stress, the first resin layer 220 and the heater electrode 239 may be peeled off. In the region where the peeling occurs, heat conduction from the heater electrode 239 to the processing target W is hindered. For this reason, the temperature of the processing object W may fall locally.
- the second resin layer 240 and the heater electrode 239 may peel off. In the region where the peeling occurs, heat conduction from the heater electrode 239 to the cooling medium is hindered. For this reason, the temperature of the processing object W may rise locally. When a local temperature change occurs in the processing object W, the accuracy of processing such as etching is lowered. As a result, the yield of semiconductor chips and the like may be reduced.
- a gap (first to fourth space portions 23a to 23d, etc.) is formed at each side end portion of the heater electrode 239 provided separately in a plurality of regions. Is provided.
- the heater electrode 239 can expand toward the gap. Even if the heater electrode 239 is deformed by thermal expansion, the gap is filled, so that the stress applied to the first resin layer 220 and the second resin layer 240 can be reduced.
- peeling with the heater electrode 239 and the 1st resin layer 220 and peeling with the heater electrode 239 and the 2nd resin layer 240 can be suppressed. Therefore, it can suppress that heat conduction is inhibited locally and can suppress a local temperature change of processing object W. That is, temperature uniformity and temperature controllability can be improved, and the temperature of the processing object can be controlled stably. Processing accuracy such as etching and the yield can be improved.
- FIG. 8A to FIG. 8D, FIG. 9A and FIG. 9B are sectional views showing the heater plate.
- FIG. 8A to FIG. 8D show simulation conditions.
- FIG. 8A shows the structure of the heater plate used in the simulation.
- FIGS. 8B and 8C are enlarged sectional views of the region B4 shown in FIG.
- FIG. 8B shows the structure of the heater plate H1 according to the comparative example, and
- FIG. 8C shows the structure of the heater plate H2 according to the example.
- the heater plate H ⁇ b> 2 has a space portion 23, similar to the heater plate 200 described above.
- the space 23 is partitioned by the side end of the heater element 230 (heater electrode 239), the first resin layer 220, and the second resin layer 240.
- the space portion 23 is not provided. Except for this, the heater plate H1 is the same as the heater plate H2.
- the stress generated in the heater plate when the heater element 230 generates heat in a state where the displacement in the Z direction is constrained was calculated.
- FIG. 9 (a) and 9 (b) show the results of the simulation.
- FIG. 9A shows the magnitude of stress generated in the first resin layer 220 and the second resin layer 240 in the heater plate H1 according to the comparative example.
- FIG. 9B shows the magnitude of stress generated in the first resin layer 220 and the second resin layer 240 in the heater plate H2 according to the embodiment.
- the stress is large in the vicinity of the side end portion of the heater element 230. Moreover, the stress which arises in the heater plate H2 which concerns on an Example is smaller than the stress which arises in the heater plate H1 which concerns on a comparative example.
- the maximum value of stress in the heater plate H1 is about 110 megapascals. On the other hand, the maximum value of the stress in the heater plate H2 is about 54 megapascals.
- the stress generated in the first resin layer 220 and the second resin layer 240 is provided by providing the space portion adjacent to the side end portion of the heater element. Can be relaxed. Thereby, peeling can be suppressed and the temperature of a process target object can be controlled stably.
- the heater plate 200 of this embodiment is formed by pressure bonding. If the pressure for pressure bonding is small, the adhesion between the members becomes insufficient, and heat conduction is hindered. For this reason, each member of the heater plate 200 is pressure-bonded with sufficient pressure. At this time, the space at the side end of the heater electrode 239 is crushed from the upper side and the lower side. For this reason, the first to fourth space portions 23a to 23d become small, and the stress caused by thermal expansion may not be sufficiently reduced.
- the first to fourth space portions 23a to 23d having an appropriate size can be formed by adjusting the pressure bonding conditions and the configuration (material, etc.) of the laminated body. In addition, when the first to fourth space portions 23a to 23d are too large, the contact between the first resin layer 220 and the second resin layer 240 becomes insufficient, and heat conduction may be hindered.
- FIG. 10A and FIG. 10B are cross-sectional views showing a part of a modified example of the heater plate of the present embodiment.
- the 1st space part 23a has the shape crushed from the lower side as it distanced from the side edge part 21a. That is, the boundary between the first space portion 23a and the second resin layer 240 approaches the virtual surface P2 (virtual line) shown in FIG. 10A as it moves away from the side end portion 21a in the in-plane direction Dp. .
- the boundary between the first space 23a and the first resin layer 220 extends along the virtual plane P2.
- the virtual surface P2 is a surface that passes through the upper surface 21U of the first conductive portion 21 and extends in the in-plane direction Dp.
- the upper surface 21U is a surface facing the first resin layer 220, and the first conductive portion 21 is in contact with the first resin layer 220 on the upper surface 21U.
- the second to fourth space portions 23b to 23d have a shape crushed from the lower side.
- the first space portion 23a has a shape crushed from the upper side as the distance from the side end portion 21a increases. That is, the boundary between the first space portion 23a and the first resin layer 220 approaches the virtual surface P3 (virtual line) shown in FIG. 10B as it moves away from the side end portion 21a in the in-plane direction Dp. .
- the boundary between the first space 23a and the second resin layer 240 extends along the virtual plane P3.
- the virtual surface P3 is a surface that passes through the lower surface 21L of the first conductive portion 21 and extends in the in-plane direction Dp.
- the lower surface 21L is a surface facing the second resin layer 240, and the first conductive portion 21 is in contact with the second resin layer 240 on the lower surface 21L.
- the second to fourth space portions 23b to 23d have a shape crushed from the lower side.
- first to fourth space portions 23a to 23d have a shape crushed from either the upper side or the lower side, the first to fourth space portions can be compared with the shape crushed from both sides during crimping. It is easy to ensure the size of 23a to 23d.
- the shape of the first to fourth space portions 23a to 23d can be adjusted by adjusting the pressure bonding conditions and the configuration (material, etc.) of the laminated body.
- the width along the in-plane direction Dp of the upper surface 21U is substantially the same as the width along the in-plane direction Dp of the lower surface 21L.
- FIG. 11A and FIG. 11B are cross-sectional views showing a part of a modified example of the heater plate of the present embodiment.
- the width of the upper surface of the heater electrode 239 is different from the width of the lower surface of the heater electrode 239.
- the width L4 along the in-plane direction Dp of the upper surface 21U of the first conductive portion 21 is different from the width L5 along the in-plane direction Dp of the lower surface 21L of the first conductive portion 21.
- the width along the in-plane direction Dp of one surface of the upper surface 21U and the lower surface 21L is shorter than the width along the in-plane direction Dp of the other surface of the upper surface 21U and the lower surface 21L.
- FIG. 11A shows an example in which the width of the upper surface of the heater electrode 239 is narrower than the width of the lower surface of the heater electrode 239.
- the width L4 is narrower than the width L5.
- FIG. 11B shows an example in which the width of the lower surface of the heater electrode 239 is narrower than the width of the upper surface of the heater electrode 239.
- the width L5 is narrower than the width L4.
- the heater electrode 239 has a side surface that connects the upper surface and the lower surface.
- the side surface is a surface that is in contact with the space portion (gap) adjacent to the heater electrode 239. This side surface is rougher than the surface of the upper surface and the lower surface of the heater electrode 239 that is wider in the in-plane direction.
- the first conductive portion 21 has a side surface S1 and a side surface S2 that connect the upper surface 21U and the lower surface 21L.
- the side surface S1 is a surface in contact with the first space portion 23a
- the side surface S2 is a surface in contact with the second space portion 23b.
- Each of the side surface S1 and the side surface S2 is rougher than the surface of the upper surface 21U and the lower surface 21L that is wider along the in-plane direction Dp.
- each of the side surface S1 and the side surface S2 is rougher than the lower surface 21L.
- each of the side surface S1 and the side surface S2 is rougher than the upper surface 21U.
- the narrower surface and the side surface of the upper surface 21U and the lower surface 21L are connected by a curved surface.
- the connection portion B5 between the side surface S1 and the upper surface 21U and the connection portion B6 between the side surface S2 and the upper surface 21U are curved.
- the connection portion B7 between the side surface S1 and the lower surface 21L and the connection portion B8 between the side surface S2 and the lower surface 21L are curved. That is, the corners of the heater electrode 239 are rounded.
- stress concentration is suppressed by rounding the corners.
- the stress applied to the first resin layer 220 due to the thermal expansion of the heater electrode 239 is suppressed.
- peeling with the heater electrode 239 and the 1st resin layer 220 can be suppressed more. Therefore, the stability of heat conduction from the heater electrode 239 to the processing object W is improved.
- the stress applied to the second resin layer 240 due to the thermal expansion of the heater electrode 239 is suppressed.
- peeling with the heater electrode 239 and the 2nd resin layer 240 can be suppressed more. Therefore, the stability of heat conduction from the heater electrode 239 to the cooling medium is improved.
- FIGS. 12A and 12B are cross-sectional views showing a part of a modification of the heater plate of the present embodiment.
- the width of the upper surface of the heater electrode 239 is different from the width of the lower surface of the heater electrode 239.
- the shape of the resin layer that is in contact with the narrower surface of the upper surface and the lower surface of the heater electrode 239 has irregularities according to the arrangement of the heater electrode 239.
- the support plate in contact with the resin layer also has irregularities. The unevenness increases the adhesion area between the layers, and the adhesion strength can be improved.
- the width L4 along the in-plane direction Dp of the upper surface 21U is narrower than the width L5 along the in-plane direction Dp of the lower surface 21L.
- the upper surface 21U is located between the virtual surface P1 (central virtual surface) and the first support plate 210.
- a distance L6 (shortest distance) between the first support plate 210 and the virtual plane P1 is shorter than a distance between the second support plate 270 and the virtual plane P1.
- the width L5 along the in-plane direction Dp of the lower surface 21L is narrower than the width L4 along the in-plane direction Dp of the upper surface 21U.
- the lower surface 21L is located between the virtual surface P1 and the second support plate 270.
- a distance L7 between the second support plate 270 and the virtual surface P1 is shorter than a distance L6 between the first support plate 210 and the virtual surface P1.
- FIG. 13 is a schematic exploded view showing a modification of the heater plate of the present embodiment.
- the heater plate 200 may include a bypass layer 250 and a third resin layer 260.
- the bypass layer 250 is provided between the second resin layer 240 and the second support plate 270.
- the third resin layer 260 is provided between the bypass layer 250 and the second support plate 270. Except this, the same description as the above-described heater plate can be applied to the heater plate of the modification shown in FIG.
- the third resin layer 260 joins the bypass layer 250 and the second support plate 270 to each other.
- the third resin layer 260 electrically insulates between the bypass layer 250 and the second support plate 270.
- the third resin layer 260 has a function of electrical insulation and a function of surface bonding.
- the material and thickness of the third resin layer 260 are approximately the same as the material and thickness of the first resin layer 220, respectively.
- the second resin layer 240 joins the heater element 230 and the bypass layer 250 to each other.
- the second resin layer 240 electrically insulates between the heater element 230 and the bypass layer 250.
- the bypass layer 250 is disposed substantially parallel to the first support plate 210 and is disposed substantially parallel to the second support plate 270.
- the bypass layer 250 has a plurality of bypass portions 251.
- the bypass layer 250 has, for example, eight bypass parts 251.
- the number of bypass units 251 is not limited to “8”.
- the bypass layer 250 has a plate shape. When viewed perpendicular to the surface of the bypass layer 250 (surface 251a of the bypass portion 251), the area of the bypass layer 250 is larger than the area of the heater element 230 (area of the heater electrode 239). Details of this will be described later.
- the bypass layer 250 has conductivity.
- the bypass layer 250 is electrically insulated from the first support plate 210 and the second support plate 270.
- Examples of the material of the bypass layer 250 include metals including stainless steel.
- the thickness of the bypass layer 250 (the length in the Z direction) is, for example, about 0.03 mm or more and 0.30 mm or less.
- the bypass layer 250 is thicker than the first resin layer 220.
- the bypass layer 250 is thicker than the second resin layer 240.
- the bypass layer 250 is thicker than the third resin layer 260.
- the material of the bypass layer 250 is the same as the material of the heater element 230.
- the bypass layer 250 is thicker than the heater element 230. Therefore, the electrical resistance of the bypass layer 250 is lower than the electrical resistance of the heater element 230. Thereby, even when the material of the bypass layer 250 is the same as the material of the heater element 230, the heat generation of the bypass layer 250 like the heater element 230 can be suppressed. That is, the electrical resistance of the bypass layer 250 can be suppressed, and the heat generation amount of the bypass layer 250 can be suppressed.
- the means for suppressing the electrical resistance of the bypass layer 250 and suppressing the heat generation amount of the bypass layer 250 may be realized by using a material having a relatively low volume resistivity instead of the thickness of the bypass layer 250. That is, the material of the bypass layer 250 may be different from the material of the heater element 230. Examples of the material of the bypass layer 250 include metals including at least one of stainless steel, titanium, chromium, nickel, copper, and aluminum.
- the power supply terminal 280 is electrically joined to the heater element 230 via the bypass layer 250.
- One power supply terminal 280 is electrically joined to one bypass layer 250.
- the current that has flowed to the bypass layer 250 flows from the bypass layer 250 to the heater element 230.
- the current flowing to the heater element 230 flows through a predetermined zone (region) of the heater element 230 and flows from the heater element 230 to the bypass layer 250.
- the current that has flowed to the bypass layer 250 flows from the bypass layer 250 to the power supply terminal 280.
- the current that flows to the power supply terminal 280 flows to the outside of the electrostatic chuck 10.
- the bypass layer 250 is provided between the heater element 230 and the second support plate 270. That is, the bypass layer 250 is provided between the heater element 230 and the base plate 300.
- the thermal conductivity of stainless steel is lower than that of aluminum and copper. Therefore, the bypass layer 250 suppresses the heat supplied from the heater element 230 from being transmitted to the second support plate 270. That is, the bypass layer 250 has a heat insulating effect on the second support plate 270 side when viewed from the bypass layer 250, and can improve the uniformity of the temperature distribution in the surface of the processing object W.
- the bypass layer 250 can have a greater degree of freedom with respect to the arrangement of the power supply terminals 280. By providing the bypass layer 250, it is not necessary to directly join the power supply terminal having a large heat capacity to the heater element 230 as compared to the case where the bypass layer 250 is not provided. Thereby, the uniformity of the temperature distribution in the surface of the processing target W can be improved. Further, it is not necessary to join the power supply terminal 280 to the thin heater element 230 as compared with the case where the bypass layer 250 is not provided. Thereby, the reliability of the heater plate 200 can be improved.
- FIG. 14A and FIG. 14B are schematic cross-sectional views illustrating an example of the manufacturing method of this embodiment.
- FIG. 15 is a schematic cross-sectional view illustrating another example of the manufacturing method according to this embodiment.
- Fig.14 (a) is typical sectional drawing showing the state before joining a bypass layer and a heater element.
- FIG. 14B is a schematic cross-sectional view illustrating a state after the bypass layer and the heater element are joined.
- FIG. 15 is a schematic cross-sectional view illustrating an example of a bonding process between the bypass layer and the power supply terminal.
- each member of the heater plate 200 is prepared in the same manner as the manufacturing method described with reference to FIG. Subsequently, as shown in FIG. 14A and FIG. 14B, the heater element 230 and the bypass layer 250 are joined.
- the heater element 230 and the bypass layer 250 are joined by soldering, brazing, welding, or contact.
- the second resin layer 240 is provided with a hole 241.
- the hole 241 passes through the second resin layer 240.
- the heater element 230 and the bypass layer 250 are joined by performing spot welding from the side of the bypass layer 250 as indicated by an arrow C11 illustrated in FIG.
- joining of the heater element 230 and the bypass layer 250 is not limited to welding.
- the heater element 230 and the bypass layer 250 may be joined by joining using laser light, soldering, brazing, or contact. Then, the laminated body which laminated
- the power feeding terminal 280 and the bypass layer 250 are joined.
- the power supply terminal 280 and the bypass layer 250 are joined by welding, laser, soldering, brazing, or the like.
- the second support plate 270 is provided with a hole 273.
- the hole 273 passes through the second support plate 270.
- a hole 261 is provided in the third resin layer 260.
- the hole 261 passes through the third resin layer 260.
- the heater plate has the bypass layer 250 and the third resin layer 260
- the bypass layer 250 and the third resin layer 260 may be omitted as in the case of the heater plate described with reference to FIGS. Since the configuration other than the bypass layer 250 and the third resin layer 260 is the same, detailed description thereof is omitted.
- FIG. 16 is a schematic exploded view showing the electrostatic chuck according to the present embodiment.
- FIG. 17A and FIG. 17B are electric circuit diagrams showing an electrostatic chuck.
- FIG. 17A is an electric circuit diagram illustrating an example in which the first support plate and the second support plate are electrically joined.
- FIG. 17B is an electric circuit diagram illustrating an example in which the first support plate and the second support plate are not electrically joined.
- the first support plate 210 is electrically joined to the second support plate 270.
- the first support plate 210 and the second support plate 270 are joined by, for example, welding, joining using laser light, soldering, or contact.
- the first support plate 210 is the second support plate. 270 may be electrically joined or not electrically joined. Then, the etching rate when plasma is generated may vary. Even if the first support plate 210 is not electrically joined to the second support plate 270, current may flow to the heater element 230 when the plasma is generated, and the heater element 230 may generate heat. In other words, if the first support plate 210 is not securely joined to the second support plate 270, the heater element 230 may generate heat due to a current other than the heater current.
- the first support plate 210 is electrically joined to the second support plate 270.
- the current flows from the first support plate 210 to the second support plate 270, or the current flows from the second support plate 270 to the first support plate 210, resulting in an etching rate when plasma is generated.
- the occurrence of variations can be suppressed.
- the heater element 230 can be prevented from generating heat due to a current other than the heater current.
- the heater element 230 and the bypass layer 250 can be shielded from high frequencies. Thereby, it is possible to suppress the heater element 230 from generating heat to an abnormal temperature. Moreover, the impedance of the heater plate 200 can be suppressed.
- FIG. 18A and FIG. 18B are schematic plan views illustrating specific examples of the heater plate of the present embodiment.
- FIG. 19A, FIG. 19B, and FIG. 20 are schematic plan views illustrating the heater element of this example.
- FIG. 21A and FIG. 21B are schematic plan views illustrating the bypass layer of this example. 22 (a) to 22 (c) are enlarged views schematically showing a part of the heater plate of this example.
- FIG. 18A is a schematic plan view of the heater plate of this specific example as viewed from above.
- FIG. 18B is a schematic plan view of the heater plate of this specific example viewed from the lower surface.
- FIG. 19A is a schematic plan view illustrating an example of the heater element region.
- FIG. 19B and FIG. 20 are schematic plan views illustrating another example of the heater element region.
- At least one of the plurality of bypass portions 251 of the bypass layer 250 has a notch 253 at the edge.
- four notches 253 are provided in the bypass layer 250 shown in FIG. 20, four notches 253 are provided.
- the number of notches 253 is not limited to “4”. Since at least one of the plurality of bypass layers 250 has the cutout portion 253, the second support plate 270 can contact the first support plate 210.
- the first support plate 210 is electrically joined to the second support plate 270 in the regions B11 to B14 and the regions B31 to B34. Yes.
- Each of the regions B11 to B14 corresponds to each of the regions B31 to B34. That is, in the specific examples shown in FIGS. 18A to 20, the first support plate 210 is electrically connected to the second support plate 270 in four regions, and the second support plate 270 in eight regions. The support plate 270 is not electrically joined.
- 22 (a) to 22 (c) are enlarged views showing an example of the region B31 (region B11).
- 22A is a schematic plan view of the region B31
- FIG. 22B is a schematic cross-sectional view of the region B31
- FIG. 22C is a part of FIG. 22B. It is sectional drawing expanded further.
- FIG. 22B schematically shows a cut surface A2-A2 of FIG. Since the other regions B12 to B14 and the regions B32 to B34 are the same as the regions B11 and B31, detailed description thereof is omitted.
- the junction area JA is provided in the area B31.
- the joint area JA joins the first support plate 210 and the second support plate 270 to each other.
- the joining area JA is provided on the outer edge of the first support plate 210 and the second support plate 270 corresponding to the notch 253 of the bypass layer 250.
- the joining area JA is formed by, for example, laser welding from the second support plate 270 side. Thereby, the joining area JA is formed in a spot shape.
- the bonding area JA may be formed from the first support plate 210 side.
- region JA is not restricted to laser welding, Another method may be sufficient.
- the shape of the bonding area JA is not limited to a spot shape, and may be an elliptical shape, a semicircular shape, a square shape, or the like.
- the area of the joint area JA where the first support plate 210 is joined to the second support plate 270 is smaller than the area of the surface 211 (see FIG. 3) of the first support plate 210.
- the area of the bonding area JA is smaller than the area of the difference obtained by subtracting the area of the heater element 230 from the area of the surface 211.
- the area of the bonding area JA is smaller than the area of the area that does not overlap the heater element 230 when projected onto a plane parallel to the surface 211 of the first support plate 210.
- the area of the joint area JA where the first support plate 210 is joined to the second support plate 270 is smaller than the area of the surface 271 of the second support plate 270 (see FIG. 4A).
- the area of the bonding area JA is smaller than the area of the difference obtained by subtracting the area of the heater element 230 from the area of the surface 271. In other words, the area of the bonding area JA is smaller than the area of the area that does not overlap the heater element 230 when projected onto a plane parallel to the surface 271 of the second support plate 270.
- the diameter of the joining area JA formed in a spot shape is, for example, 1 mm (0.5 mm or more and 3 mm or less).
- the diameters of the first support plate 210 and the second support plate 270 are, for example, 300 mm.
- the diameters of the first support plate 210 and the second support plate 270 are set according to the processing object W to be held.
- the area of the bonding area JA is sufficiently smaller than the area of the surface 211 of the first support plate 210 and the area of the surface 271 of the second support plate 270.
- the area of the bonding region JA is, for example, 1/5000 or less of the area of the surface 211 (area of the surface 271).
- the area of the bonding area JA is more specifically the area when projected onto a plane parallel to the surface 211 of the first support plate 210.
- the area of the bonding area JA is an area in a top view.
- the number of joining areas JA is not limited to four.
- the number of the joining areas JA may be an arbitrary number.
- twelve bonding areas JA may be provided on the first support plate 210 and the second support plate 270 every 30 °.
- the shape of the bonding area JA is not limited to a spot shape.
- the shape of the bonding area JA may be elliptical, rectangular, or linear.
- the joining area JA may be formed in an annular shape along the outer edges of the first support plate 210 and the second support plate 270.
- the second support plate 270 has a hole 273 (see FIG. 4B and FIG. 15).
- the first support plate 210 does not have a hole through which the power supply terminal 280 passes. Therefore, the area of the surface 211 of the first support plate 210 is larger than the area of the surface 271 of the second support plate 270.
- the heater electrode 239 is arranged to draw a substantially circle.
- the heater electrode 239 is disposed in the first region 231, the second region 232, the third region 233, and the fourth region 234.
- the first region 231 is located at the center of the heater element 230.
- the second region 232 is located outside the first region 231.
- the third region 233 is located outside the second region 232.
- the fourth region 234 is located outside the third region 233.
- the heater electrode 239 disposed in the first region 231 is not electrically joined to the heater electrode 239 disposed in the second region 232.
- the heater electrode 239 disposed in the second region 232 is not electrically joined to the heater electrode 239 disposed in the third region 233.
- the heater electrode 239 disposed in the third region 233 is not electrically joined to the heater electrode 239 disposed in the fourth region 234. That is, the heater electrode 239 is provided in a plurality of regions in an independent state.
- the first conductive portion 21 described with reference to FIG. 5 is the heater electrode 239 disposed in the second region 232
- the second conductive portion 22 is the heater electrode 239 disposed in the third region 233. It is.
- the first conductive portion 21 may be the heater electrode 239 disposed in the third region 233
- the second conductive portion 22 may be the heater electrode 239 disposed in the fourth region 234. .
- the heater plate 200 has a space 50 provided on the side of the bypass layer 250. As shown in FIG. In other words, the space 50 is a space defined by the side end of the bypass layer 250, the second resin layer 240, and the third resin layer 260.
- the magnitude relationship between the cross-sectional area of the first space portion 23 a provided on the side of the heater element 230 and the cross-sectional area of the space portion 50 provided on the side of the bypass layer 250 depends on the thickness of the heater element 230 and the bypass layer. This is the same as the thickness relationship of 250 thicknesses.
- the bypass layer 250 is thicker than the heater element 230. Therefore, in this example, the cross-sectional area of the space portion 50 on the side of the bypass layer 250 is larger than the cross-sectional area of the first space portion 23 a on the side of the heater element 230. On the contrary, when the heater element 230 is thicker than the bypass layer 250, the cross-sectional area of the first space portion 23 a is larger than the cross-sectional area of the space portion 50. Become.
- the first resin layer 220 is in contact with the second resin layer 240, and the first space 23a has a side end 23s in a direction away from the side end of the heater element 230.
- the side end 23s is an end portion of a contact surface between the first resin layer 220 and the second resin layer 240.
- the third resin layer 260 is in contact with the second resin layer 240, and the space 50 has a side end 50 s in a direction away from the side end of the bypass layer 250.
- the side end 23s of the first space portion 23a is shifted to the first support plate 210 side or the second support plate 270 side with respect to the center in the thickness direction of the heater element 230 (first conductive portion 21).
- the side end 50 s of the space portion 50 on the side of the bypass layer 250 is shifted in the same direction as the side end 23 s of the first space portion 23 a with respect to the center in the thickness direction of the bypass layer 250.
- the side end 23s of the first space 23a is shifted to the first support plate 210 side. Therefore, the side end 50 s of the space 50 is also shifted to the first support plate 210 side. On the other hand, when the side end 23s is shifted to the second support plate 270 side, the side end 50s is also shifted to the second support plate 270 side.
- the heater plate 200 is manufactured by pressure bonding the laminated members
- the pressing force toward the first support plate 210 is strong, as shown in FIG. And the side end 50s is shifted to the first support plate 210 side.
- the pressing force toward the second support plate 270 is strong, the side end 23 s and the side end 50 s shift to the second support plate 270 side.
- the space part 50 when the space part 50 is provided on the side of the bypass layer 250, the space part 50 is deformed so as to be filled even if the bypass layer 250 is thermally expanded. For this reason, the stress concerning the 2nd resin layer 240 adjacent to the bypass layer 250, the 3rd resin layer 260, etc. can be reduced. Therefore, peeling of the second resin layer 240 and the third resin layer 260 adjacent to the bypass layer 250 can be suppressed. For example, the resistance to the load of the heater plate 200 can be improved, and the reliability of the electrostatic chuck 10 can be further improved. Furthermore, the temperature change of the process target W which arises by peeling of the layer adjacent to the bypass layer 250 can be suppressed.
- the heater element 230 and the bypass layer 250 are thick, the volume increase due to thermal expansion increases. For this reason, the one where the cross-section record of a space part is large is advantageous to peeling prevention of an adjacent layer. Therefore, by making the cross-sectional area of the first space portion 23a and the cross-sectional area of the space portion 50 the same as the size relationship of the thickness of the heater element 230 and the thickness of the bypass layer 250, the heater element 230 and The peeling of the layer adjacent to the bypass layer 250 can be further suppressed. The temperature change of the processing target object W accompanying generation
- first space portion 23a and the space portion 50 by shifting the side end 50s of the space portion 50 in the same direction as the side end 23s of the first space portion 23a.
- the formation of the first space 23s and the space 50 can be facilitated.
- the first space portion 23s and the space portion 50 can be formed by manufacturing the heater plate 200 by pressing the laminated members.
- the heater electrode 239 is arranged so as to draw at least a part of a substantially fan shape.
- the heater electrode 239 includes a first region 231a, a second region 231b, a third region 231c, a fourth region 231d, a fifth region 231e, a sixth region 231f, and a seventh region.
- the region 232a, the eighth region 232b, the ninth region 232c, the tenth region 232d, the eleventh region 232e, and the twelfth region 232f are arranged.
- the heater electrode 239 arranged in an arbitrary region is not electrically joined to the heater electrode 239 arranged in another region. That is, the heater electrode 239 is provided in a plurality of regions in an independent state. As shown in FIGS. 19A and 19B, the region where the heater electrode 239 is disposed is not particularly limited.
- the heater element 230 has more regions.
- the first region 231 shown in FIG. 19A is further divided into four regions 231a to 231d.
- the second area 232 shown in FIG. 19A is further divided into eight areas 232a to 232h.
- the third area 233 shown in FIG. 19A is further divided into eight areas 233a to 233h.
- the fourth area 234 shown in FIG. 19A is further divided into 16 areas 234a to 234p.
- the number and shape of the regions of the heater element 230 in which the heater electrode 239 is disposed may be arbitrary.
- the bypass portion 251 of the bypass layer 250 has a fan shape.
- a plurality of fan-shaped bypass portions 251 are arranged apart from each other, and the bypass layer 250 has a substantially circular shape as a whole.
- the separation portion 257 between the adjacent bypass portions 251 extends in the radial direction from the center 259 of the bypass layer 250.
- the separation portion 257 between the adjacent bypass portions 251 extends radially from the center 259 of the bypass layer 250.
- the area of the surface 251 a of the bypass part 251 is larger than the area of the separation part 257.
- the area of the bypass layer 250 (area of the surface 251a of the bypass portion 251) is larger than the area of the heater element 230 (area of the heater electrode 239).
- the shape of the plurality of bypass portions 251 of the bypass layer 250 may be, for example, a curved fan shape.
- the number and shape of the plurality of bypass portions 251 provided in the bypass layer 250 may be arbitrary.
- the region of the heater element 230 shown in FIG. 19A is taken as an example.
- the heater electrode 239 is disposed so as to draw a substantially circle, and a plurality of fan-shaped bypass portions 251 are arranged apart from each other. Therefore, when viewed perpendicular to the surface 251 a of the bypass portion 251, the heater electrode 239 intersects with the separation portion 257 between the adjacent bypass portions 251. Further, when viewed perpendicular to the surface 251 a of the bypass portion 251, each region of the adjacent heater element 230 (the first region 231, the second region 232, the third region 233, and the fourth region 234). ) Between the adjacent bypass portions 251 intersects with the separation portion 257 between the adjacent bypass portions 251.
- a plurality of imaginary lines connecting each of the joint portions 255a to 255h between the heater element 230 and the bypass layer 250 and the center 203 of the heater plate 200 are , Do not overlap each other.
- the joint portions 255 a to 255 h between the heater element 230 and the bypass layer 250 are arranged in different directions as viewed from the center 203 of the heater plate 200.
- the power supply terminal 280 exists on an imaginary line connecting each of the joint portions 255a to 255h and the center 203 of the heater plate 200.
- the joint portions 255 a and 255 b are portions that join the heater electrode 239 and the bypass layer 250 disposed in the first region 231.
- the joint portions 255a and 255b correspond to the first region 231.
- One of the joint portion 255a and the joint portion 255b is a portion where current enters the heater element 230.
- the other of the joining portion 255a and the joining portion 255b is a portion where current flows out of the heater element 230.
- the joint portions 255 c and 255 d are portions that join the heater electrode 239 and the bypass layer 250 disposed in the second region 232.
- the joint portions 255 c and 255 d correspond to the second region 232.
- One of the joint portion 255c and the joint portion 255d is a portion where current enters the heater element 230.
- the other of the joining portion 255c and the joining portion 255d is a portion where current flows out of the heater element 230.
- the joint portions 255e and 255f are portions that join the heater electrode 239 and the bypass layer 250 disposed in the third region 233.
- the joint portions 255e and 255f correspond to the third region 233.
- One of the joint portion 255e and the joint portion 255f is a portion where current enters the heater element 230.
- the other of the joining portion 255e and the joining portion 255f is a portion where the current exits from the heater element 230.
- the joint portions 255g and 255h are portions that join the heater electrode 239 and the bypass layer 250 disposed in the fourth region 234.
- the joint portions 255g and 255h correspond to the fourth region 234.
- One of the junction 255g and the junction 255h is a portion where current enters the heater element 230.
- the other of the joining portion 255g and the joining portion 25h is a portion where current flows out of the heater element 230.
- the joint portions 255a and 255b exist on a circle different from the circle passing through the joint portions 255c and 255d with the center 203 of the heater plate 200 as the center.
- the joint portions 255a and 255b exist on a circle different from the circle passing through the joint portions 255e and 255f with the center 203 of the heater plate 200 as the center.
- the joints 255a and 255b exist on a circle different from the circle passing through the joints 255g and 255h with the center 203 of the heater plate 200 as the center.
- the joint portions 255c and 255d exist on a circle different from the circle passing through the joint portions 255e and 255f with the center 203 of the heater plate 200 as the center.
- the joint portions 255c and 255d exist on a circle different from the circle passing through the joint portions 255g and 255h with the center 203 of the heater plate 200 as the center.
- the joint portions 255e and 255f exist on a circle different from the circle passing through the joint portions 255g and 255h with the center 203 of the heater plate 200 as the center.
- the heater plate 200 has lift pin holes 201.
- the heater plate 200 has three lift pin holes 201.
- the number of lift pin holes 201 is not limited to “3”.
- the power supply terminal 280 is provided in a region on the side of the center 203 of the heater plate 200 when viewed from the lift pin hole 201.
- the heater electrode 239 is arranged in a plurality of regions, the temperature in the surface of the processing object W can be controlled independently for each region. Thereby, it is possible to intentionally make a difference in the in-plane temperature of the processing object W (temperature controllability).
- FIG. 23A and FIG. 23B are schematic views for explaining the shape of the surface of the heater plate of the present embodiment.
- FIG. 23A is a graph illustrating an example of a result of measurement of the shape of the surface 271 of the second support plate 270 by the inventor.
- FIG. 23B is a schematic cross-sectional view illustrating the shape of the surface of the heater plate 200 of the present embodiment.
- each member of the heater plate 200 is pressure-bonded in a stacked state.
- the first unevenness is generated on the surface 211 (upper surface) of the first support plate 210.
- the second unevenness is generated on the surface 271 (lower surface) of the second support plate 270.
- a third unevenness is generated on the surface 213 (lower surface) of the first support plate 210.
- a fourth unevenness is generated on the surface 275 (upper surface) of the second support plate 270.
- the inventor measured the shape of the surface 271 of the second support plate 270.
- An example of the measurement result is as shown in FIG.
- the shape of the surface 211 (upper surface) of the first support plate 210 and the shape of the surface 271 of the second support plate 270 are the same as the shape of the heater element 230.
- the heater element 230 is arranged.
- the shape of the heater element 230 refers to the thickness of the heater element 230 and the width of the heater element 230 (the width of the heater electrode 239).
- the distance D1 in the direction is such that the convex portion 211b (first concave / convex convex portion 211b) of the surface 211 of the first support plate 210 and the convex portion 271b (second concave / convex portion of the surface 271 of the second supporting plate 270). It is shorter than the distance D2 in the Z direction between the convex portion 271b).
- the distance D3 in the Z direction between the concave portion 211a of the surface 211 of the first support plate 210 and the convex portion 211b of the surface 211 of the first support plate 210 (the uneven height of the surface 211 of the first support plate 210) (The height of the first unevenness) is a distance D4 (Z4) between the concave portion 271a of the surface 271 of the second support plate 270 and the convex portion 271b of the surface 271 of the second support plate 270.
- the unevenness height of the surface 271 of the second support plate 270 is shorter than the height of the second unevenness. That is, the unevenness height (first unevenness height) of the surface 211 of the first support plate 210 is higher than the unevenness height (second unevenness height) of the surface 271 of the second support plate 270. Low.
- the width of the concave portion 271a of the surface 271 of the second support plate 270 is approximately the same as the width of the region between the two adjacent heater electrodes 239 (the slit portion of the heater element 230).
- the width of the concave portion 271a of the surface 271 of the second support plate 270 is, for example, not less than 0.25 times and not more than 2.5 times the width of the region between two adjacent heater electrodes 239.
- the width of the convex portion 271b of the surface 271 of the second support plate 270 is approximately the same as the width of the heater electrode 239.
- the width of the convex portion 271b of the surface 271 of the second support plate 270 is, for example, not less than 0.8 times and not more than 1.2 times the width of the heater electrode 239.
- the uneven height D4 of the surface 271 of the second support plate 270 is approximately the same as the thickness of the heater element 230 (the thickness of the heater electrode 239).
- the uneven height D4 of the second support plate 270 is not less than 0.8 times and not more than 1.2 times the thickness of the heater element 230.
- the width of the recess 211a of the surface 211 of the first support plate 210 is approximately the same as the width of the region between the two adjacent heater electrodes 239.
- the width of the convex portion 211 b of the surface 211 of the first support plate 210 is approximately the same as the width of the heater electrode 239.
- the uneven height D 3 of the surface 211 of the first support plate 210 is lower than the thickness of the heater element 230.
- the height of the surface 271 of the second support plate 270 changes gradually from the convex portion 271b toward the adjacent concave portion 271a.
- the height of the surface 271 of the second support plate 270 continuously decreases from the center in the width direction of the convex portion 271b toward the center in the width direction of the adjacent concave portion 271a.
- the center in the width direction of the convex portion 271b is a position overlapping with the center in the width direction of the heater electrode 239 in the surface 271 in the Z direction.
- the center in the width direction of the concave portion 271a is a position overlapping in the Z direction with the center in the width direction of the region between the two adjacent heater electrodes 239 in the surface 271.
- the height of the surface 271 of the second support plate 270 changes in a wave shape with the portion overlapping with the heater electrode 239 as the apex and the portion not overlapping with the heater electrode 239 as the lowest point.
- the height of the surface 211 of the first support plate 210 changes in a wave shape with the portion overlapping the heater electrode 239 as the apex and the portion not overlapping with the heater electrode 239 as the lowest point.
- the bonding area between the first support plate 210 and the heater element 230 can be further increased, and the first The adhesive strength between the one support plate 210 and the heater element 230 can be improved.
- the adhesion area of the 1st support plate 210 and the adhesive agent 403 can be made wider according to the 1st unevenness
- transformation of the heater plate 200 can be reduced.
- the surface 271 of the second support plate 270 has the second unevenness, the adhesion area between the second support plate 270 and the bypass layer 250 can be increased, and the second support plate 270 can be increased.
- the adhesive strength between the bypass layer 250 can be improved.
- the adhesion area of the 2nd support plate 270 and the adhesive agent 403 can be made wider according to the 2nd unevenness
- the joint strength between the second support plate 270 and the adhesive 403 can also be improved.
- the second support plate 270 has irregularities, the rigidity of the second support plate 270 increases. For this reason, even if the 2nd support plate 270 is thin, the curvature and deformation
- the surface 211 of the first support plate 210 has the first unevenness, the distance between the heater element 230 and the processing object W can be further shortened. Thereby, the speed which raises the temperature of the processing target object W can be improved.
- the heights of the first and second irregularities can be controlled by, for example, the pressure bonding conditions and the configuration (materials) of the laminate.
- the first support plate 210 has a surface 213 on the second support plate 270 side and a surface 211 opposite to the surface 213.
- the surface 213 faces the first resin layer 220 and is in contact with, for example, the first resin layer 220.
- the surface 213 of the first support plate 210 has a first region R1 and a second region R2.
- the first region R1 overlaps the heater electrode 239 (heater element 230) when viewed along the Z direction (viewed from above).
- the first region R1 overlaps with the first conductive portion 21 or the second conductive portion 22 when viewed along the Z direction.
- the second region R2 does not overlap the heater electrode 239 (heater element 230) when viewed along the Z direction.
- the second region R2 protrudes toward the second support plate 270 as compared with the first region R1. .
- the position of the second region R2 in the Z direction is between the position of the first region R1 in the Z direction and the second support plate 270.
- the surface 213 (lower surface) of the first support plate 210 has irregularities that are in the shape of the heater element 230.
- the first region R1 corresponds to the concave portion of the first support plate 210
- the second region R2 corresponds to the convex portion of the first support plate 210.
- irregularities that are in the shape of the heater element 230 are formed on the surface 211 (upper surface) of the first support plate 210.
- the second support plate 270 has a surface 275 (upper surface) on the first support plate 210 side and a surface 271 (lower surface) opposite to the surface 275.
- the surface 275 faces the third resin layer 260 (or the second resin layer 240) and is in contact with, for example, the third resin layer 260 (or the second resin layer 240).
- the surface 275 (upper surface) of the second support plate 270 has a third region R3 and a fourth region R4.
- the third region R3 overlaps the heater element 230 when viewed along the Z direction.
- the third region R3 overlaps the first conductive portion 21 or the second conductive portion 22 when viewed along the Z direction.
- the fourth region R4 does not overlap the heater element 230 when viewed along the Z direction.
- the fourth region R4 protrudes toward the first support plate 210 as compared with the third region R3.
- the position of the fourth region R4 in the Z direction is between the position of the third region R3 in the Z direction and the first support plate 210.
- the surface 275 (upper surface) of the second support plate 270 has irregularities that are in the shape of the heater element 230.
- the third region R3 corresponds to the concave portion of the second support plate 270
- the fourth region R4 corresponds to the convex portion of the second support plate 270.
- irregularities that are in the shape of the heater element 230 are formed on the surface 271 (lower surface) of the second support plate 270.
- the distance D5 along the Z direction between the second region R2 and the fourth region R4 is shorter than the distance D6 along the Z direction between the first region R1 and the third region R3.
- the first support plate 210 and the second support plate 270 are uneven. Such unevenness is formed by the high adhesion of the members stacked in the heater plate 200. That is, since the unevenness is formed on the surface 213 (lower surface) of the first support plate 210, the adhesion between the surface (for example, the first resin layer 220) close to the surface 213 and the surface 213 is high. Further, since the unevenness is formed on the surface 275 (upper surface) of the second support plate 270, the adhesion between the surface (for example, the third resin layer 260) close to the surface 275 and the surface 275 is high.
- peeling of the 1st support plate 210 and peeling of the 2nd support plate 270 can be suppressed, and reliability can be improved. For example, it is possible to suppress heat non-uniformity and deterioration of withstand voltage characteristics due to local peeling. It is possible to achieve the designed thermal uniformity and withstand voltage characteristics.
- the heat conductivity of the heater plate 200 can be improved due to the high adhesion. Further, due to the unevenness of the first support plate 210, for example, the distance between the heater element 230 and the object to be processed can be shortened. Thereby, the rate of temperature increase of the object to be processed can be improved. Therefore, for example, it is possible to achieve both “heating performance (temperature increase rate) of the heater”, “temperature uniformity”, and “withstand voltage reliability”.
- the distance D7 along the Z direction between the first region R1 and the second region R2 is shorter than the distance D5. Further, the distance D8 along the Z direction between the third region R3 and the fourth region R4 is shorter than the distance D5.
- the unevenness formed on the surface 213 of the first support plate 210 may be too large, and the strain generated in the first support plate 210 and the first resin layer 220 may be too large.
- the unevenness formed on the second support plate 270 is too large, and the distortion generated in the second support plate 270 and the second resin layer 240 may be too large.
- each of the distance D7 and the distance D8 is shorter than the distance D5.
- the strain generated in the first support plate 210 and the first resin layer 220 becomes too large while ensuring the adhesion between the first support plate 210 and the layer adjacent to the first support plate 210. Can be prevented.
- the strain generated in the second support plate 270 and the third resin layer 260 is excessively increased while ensuring the adhesion between the layer adjacent to the second support plate 270 and the second support plate 270. I can prevent it.
- the heater element 230 itself is likely to be distorted (thermal strain) due to heat generated by the heater element 230. Therefore, in the example shown in FIG. 23B, the distance D7 is shorter than the distance D8. That is, the structural strain of the first support plate 210 and the like on the heater element 230 side is made smaller than the structural strain of the second support plate 270 and the like on the bypass layer 250 side. Thereby, the tolerance with respect to the thermal strain of the heater plate 200 whole can be improved.
- either the distance D7 or the distance D8 may be substantially zero. That is, either the surface 213 or the surface 275 may be flat. Irregularities may be formed on either the surface 213 or the surface 275.
- FIG. 24 is a schematic cross-sectional view showing the heater plate of the present embodiment. As shown in FIG. 24, even in the heater plate 200 that does not include the bypass layer 250 and the third resin layer 260, the first support plate 210 and the second support plate 270 have the shape of the heater element 230. It has irregularities.
- the first unevenness is generated on the surface 211 of the first support plate 210.
- the second unevenness is generated on the surface 271 of the second support plate 270.
- a third unevenness is generated on the surface 213 of the first support plate 210.
- a fourth unevenness is generated on the surface 275 of the second support plate 270.
- the second region R2 protrudes toward the second support plate 270 compared to the first region R1.
- the fourth region R4 protrudes toward the first support plate 210 compared to the third region R3.
- the relationship between the distances D1 to D8 is the same as the relationship between the distances D1 to D8 described with reference to FIG.
- FIG. 25A and FIG. 25B are schematic cross-sectional views showing an electrostatic chuck according to a modification of the present embodiment.
- FIG. 25A is a schematic cross-sectional view showing an electrostatic chuck according to a modification of the present embodiment.
- FIG. 25B is a schematic cross-sectional view showing the heater plate of this modification.
- FIG. 24A and FIG. 25B correspond to schematic cross-sectional views taken along the cut plane A1-A1 shown in FIG. 1, for example.
- the electrostatic chuck 10a shown in FIG. 25 (a) includes a ceramic dielectric substrate 100, a heater plate 200a, and a base plate 300.
- the ceramic dielectric substrate 100 and the base plate 300 are as described above with reference to FIGS.
- the heater plate 200a of this example has a plurality of heater elements.
- the heater plate 200a shown in FIG. 25B includes a first resin layer 220, a first heater element (heat generation layer) 230a, a second resin layer 240, and a second heater element (heat generation layer).
- 230 b a third resin layer 260, a bypass layer 250, a fourth resin layer 290, and a second support plate 270.
- the first resin layer 220 is provided between the first support plate 210 and the second support plate 270.
- the first heater element 230 a is provided between the first resin layer 220 and the second support plate 270.
- the second resin layer 240 is provided between the first heater element 230 a and the second support plate 270.
- the second heater element 230 b is provided between the second resin layer 240 and the second support plate 270.
- the third resin layer 260 is provided between the second heater element 230 b and the second support plate 270.
- the bypass layer 250 is provided between the third resin layer 260 and the second support plate 270.
- the fourth resin layer 290 is provided between the bypass layer 250 and the second support plate 270. That is, in this specific example, the first heater element 230a is provided in a state independent of the second heater element 230b in a different layer.
- the materials, thicknesses, and functions of the first heater element 230a and the second heater element 230b are the same as those of the heater element 230 described above with reference to FIGS.
- the fourth resin layer 290 is the same as the first resin layer 220 described above with reference to FIGS.
- the temperature in the surface of the processing object W is independent for each predetermined region. Can be controlled.
- FIG. 26A, FIG. 26B, and FIG. 27 are schematic plan views illustrating modifications of the first support plate of the present embodiment.
- FIG. 28 is a schematic cross-sectional view showing a heater plate of this modification.
- FIG. 26A shows an example in which the first support plate is divided into a plurality of support portions.
- FIG. 26B and FIG. 27 show another example in which the first support plate is divided into a plurality of support portions.
- FIG. 28 for convenience of explanation, the heater plate shown in FIG. 26A and the graph of the temperature of the upper surface of the first support plate are shown together.
- the graph shown in FIG. 28 is an example of the temperature of the upper surface of the first support plate.
- the horizontal axis of the graph shown in FIG. 28 represents the position of the upper surface of the first support plate 210a.
- the vertical axis of the graph shown in FIG. 28 represents the temperature of the upper surface of the first support plate 210a.
- the bypass layer 250 and the third resin layer 260 are omitted.
- the first support plate 210a is divided into a plurality of support portions. More specifically, in the modification shown in FIG. 26A, the first support plate 210a is concentrically divided into a plurality of support portions, and includes a first support portion 216 and a second support portion. 217, a third support portion 218, and a fourth support portion 219. In the modification shown in FIG. 26A, the first support plate 210a is concentrically divided into a plurality of support portions, and includes a first support portion 216 and a second support portion. 217, a third support portion 218, and a fourth support portion 219. In the modification shown in FIG.
- the first support plate 210b is concentrically and radially divided into a plurality of support portions, and includes a first support portion 216a, a second support portion 216b, 3 support part 216c, 4th support part 216d, 5th support part 216e, 6th support part 216f, 7th support part 217a, 8th support part 217b, and 9th It has a support part 217c, a tenth support part 217d, an eleventh support part 217e, and a twelfth support part 217f.
- the first support plate 210c has more support portions.
- the first support portion 216 shown in FIG. 26A is further divided into four support portions 216a to 216d.
- the second support portion 217 shown in FIG. 26A is further divided into eight support portions 217a to 217h.
- the third support portion 218 shown in FIG. 26A is further divided into eight regions 218a to 218h.
- the fourth support portion 219 shown in FIG. 26A is further divided into 16 support portions 219a to 219p.
- the number and shape of the support portions provided on the first support plate 210 may be arbitrary.
- the first resin layer 220, the heater element 230, the second resin layer 240, the bypass layer 250, the third resin layer 260, the second support plate 270, and the power supply terminal 280 are respectively 3 to 5 and 13 as described above.
- the first support plate 210a shown in FIG. 26 (a) is taken as an example.
- the first support portion 216 is provided on the first region 231 of the heater element 230 and corresponds to the first region 231 of the heater element 230.
- the second support portion 217 is provided on the second region 232 of the heater element 230 and corresponds to the second region 232 of the heater element 230.
- the third support portion 218 is provided on the third region 233 of the heater element 230 and corresponds to the third region 233 of the heater element 230.
- the fourth support portion 219 is provided on the fourth region 234 of the heater element 230 and corresponds to the fourth region 234 of the heater element 230.
- the first support part 216 is not electrically joined to the second support part 217.
- the second support part 217 is not electrically joined to the third support part 218.
- the third support part 218 is not electrically joined to the fourth support part 219. That is, the plurality of support portions 216 to 219 are provided independently of each other.
- a temperature difference in the radial direction can be intentionally provided in the plane of the first support plates 210a, 210b, 210c (temperature controllability).
- a temperature difference can be provided stepwise from the first support portion 216 to the fourth support portion 219 as shown in the graph diagram of FIG.
- a temperature difference can be intentionally provided in the surface of the processing object W (temperature controllability).
- FIG. 29A to FIG. 29D are cross-sectional views illustrating modifications of the heater plate of the present embodiment.
- FIG. 29A shows a part of the heater element 230
- FIG. 29B shows a part of the bypass layer 250
- FIG. 29C shows a part of the heater element 230 and the bypass layer 250
- FIG. 29D shows a modification of the heater element 230 and the bypass layer 250.
- Each of the heater electrodes 239 has a first surface MP1 (upper surface) on the first support plate 210 side and a second surface MP2 (lower surface) on the second support plate side.
- the first surface MP1 faces the first resin layer 220.
- the second surface MP2 faces away from the first surface MP1. That is, the second surface MP2 faces the second resin layer 240.
- the width W1 of the first surface MP1 is different from the width W2 of the second surface MP2.
- the width W1 of the first surface MP1 is narrower than the width W2 of the second surface MP2. That is, the width of the heater electrode 239 becomes narrower toward the upper side (the ceramic dielectric substrate 100 side).
- Each heater electrode 239 has a pair of side surfaces SF1 connecting the first surface MP1 and the second surface MP2.
- the side surface SF1 has a curved shape.
- Each side surface SF1 has, for example, a concave curved surface shape.
- Each side surface SF1 may be planar, for example.
- the angle ⁇ 1 formed between the first surface MP1 and the side surface SF1 is different from the angle ⁇ 2 formed between the second surface MP2 and the side surface SF1.
- the surface roughness of the side surface SF1 is rougher than the surface roughness of at least one of the first surface MP1 and the second surface MP2.
- 1st surface MP1 contacts the 1st resin layer 220, for example.
- the second surface MP2 is in contact with the second resin layer 240.
- the bypass part 251 (bypass layer 250) includes a third conductive part 33 and a fourth conductive part 34.
- the fourth conductive portion 34 is separated from the third conductive portion 33 in the in-plane direction Dp (for example, the X direction).
- the third conductive part 33 and the fourth conductive part 34 are part of the bypass part 251.
- the space part 50 is provided on each side of the third conductive part 33 and the fourth conductive part 34, for example. In other words, the space part 50 is provided on each side of the plurality of bypass parts 251.
- Each bypass section 251 has a third surface MP3 (upper surface) on the first support plate 210 side and a fourth surface MP4 (lower surface) on the second support plate 270 side.
- the third surface MP3 faces the second resin layer 240.
- the fourth surface MP4 faces away from the third surface MP3. That is, the fourth surface MP4 faces the third resin layer 260.
- the width W3 of the third surface MP3 is different from the width W4 of the fourth surface MP4.
- the width W3 of the third surface MP3 is narrower than the width W4 of the fourth surface MP4. That is, the width of the bypass portion 251 becomes narrower toward the upper side (the ceramic dielectric substrate 100 side).
- the width relationship between the third surface MP3 and the fourth surface MP4 is the same as the width relationship between the first surface MP1 and the second surface MP2.
- Each bypass part 251 has a pair of side surface SF2 which connects 3rd surface MP3 and 4th surface MP4.
- Each side surface SF2 has, for example, a concave curved surface shape.
- Each side surface SF2 may be planar, for example.
- the angle ⁇ 3 formed by the third surface MP3 and the side surface SF2 is different from the angle ⁇ 4 formed by the fourth surface MP4 and the side surface SF2.
- the surface roughness of the side surface SF2 is rougher than the surface roughness of at least one of the third surface MP3 and the fourth surface MP4.
- the third surface MP3 is in contact with the second resin layer 240, for example.
- the fourth surface MP4 is in contact with the third resin layer 260.
- the width W1 of the first surface MP1 is different from the width W2 of the second surface MP2.
- the width W1 of the first surface MP1 is smaller than the width W2 of the second surface MP2.
- a contact area with 1st surface MP1 becomes small, the stress added to the layer which contacts 1st surface MP1 can be reduced, and peeling of the layer which contacts 1st surface MP1 can be suppressed.
- peeling of the first resin layer 220 can be suppressed.
- the amount of heat generated on the second surface MP2 side where heat easily escapes from the base plate 300 is larger than the amount of heat generated on the first surface MP1 side, and is perpendicular to the first surface MP1 and the second surface MP2 (Z Variation in heat distribution in the direction).
- the soaking property can be further improved.
- the side surface SF1 has a concave curved surface shape. Therefore, the stress applied to the layer adjacent to the side surface SF1 can be reduced, and peeling of the layer adjacent to the side surface SF1 can be suppressed.
- the angle ⁇ 1 formed between the first surface MP1 and the side surface SF1 is different from the angle ⁇ 2 formed between the second surface MP2 and the side surface SF1.
- the width relationship between the third surface MP3 and the fourth surface MP4 is the same as the width relationship between the first surface MP1 and the second surface MP2.
- the widths of the first surface MP1 and the third surface MP3 are narrower than the widths of the second surface MP2 and the fourth surface MP4. In this case, variation in heat distribution in the Z direction can be further suppressed.
- the heater element 230 is provided on the bypass layer 250.
- the bypass layer 250 may be provided on the heater element 230. That is, the bypass layer 250 may be provided between the heater element 230 and the ceramic dielectric substrate 100.
- a bypass layer 250 is provided between the first resin layer 220 and the heater element 230, and a third resin layer 260 is provided between the heater element 230 and the bypass layer 250.
- the bypass layer 250 may be provided between the first support plate 210 and the first resin layer 220, and the third resin layer 260 may be provided between the first support plate 210 and the bypass layer 250. Good.
- the heat of the heater element 230 having the highest temperature is transferred to the base plate at the moment when the voltage supply to the heater plate 200 is cut off. 300 can be quickly transmitted, and the temperature followability (ramp plate) when the temperature of the processing object W is lowered can be further improved.
- the position where the bypass layer 250 is disposed may be an arbitrary position between the first support plate 210 and the second support plate 270.
- FIGS. 30A and 30C are cross-sectional views illustrating modifications of the heater plate of the present embodiment.
- the width W1 of the first surface MP1 is wider than the width W2 of the second surface MP2. That is, the width of the heater electrode 239 becomes narrower toward the lower side (base plate 300 side).
- the width W3 of the third surface MP3 is wider than the width W4 of the fourth surface MP4.
- the width of the bypass portion 251 becomes narrower as it goes downward.
- the width W1 of the first surface MP1 may be wider than the width W2 of the second surface MP2.
- the stress applied to the layer in contact with the second surface MP2 can be reduced, and peeling of the layer in contact with the second surface MP2 can be suppressed.
- heat can be easily held on the first surface MP1 side, and heat can be easily cooled on the second surface MP2 side, so that temperature followability (ramplate) can be further improved.
- the width relationship between the third surface MP3 and the fourth surface MP4 is the same as the width relationship between the first surface MP1 and the second surface MP2, and the first surface MP1 and the third surface MP3. Is wider than the width of the second surface MP2 and the fourth surface MP4.
- the heat can be easily held on the first surface MP1 and the third surface MP3 side, and the heat can be easily cooled on the second surface MP2 and the fourth surface MP4 side, so that the temperature followability can be further improved.
- the bypass layer 250 may be provided on the heater element 230.
- FIG. 31A to FIG. 31D are cross-sectional views showing modifications of the heater plate of the present embodiment.
- the width W1 of the first surface MP1 is smaller than the width W2 of the second surface MP2.
- the width W3 of the third surface MP3 is wider than the width W4 of the fourth surface MP4.
- the width relationship between the third surface MP3 and the fourth surface MP4 is opposite to the width relationship between the first surface MP1 and the second surface MP2.
- the width relationship between the third surface MP3 and the fourth surface MP4 may be opposite to the width relationship between the first surface MP1 and the second surface MP2.
- the direction of the stress applied by the thermal expansion of the bypass layer 250 can be made opposite to the direction of the stress applied by the thermal expansion of the heater element 230. Thereby, the influence of stress can be suppressed more.
- the bypass layer 250 may be provided on the heater element 230.
- FIG. 32A to FIG. 32D are cross-sectional views showing modifications of the heater plate of the present embodiment.
- the width W1 of the first surface MP1 is made larger than the width W2 of the second surface MP2, and the width W3 of the third surface MP3 is set to be the fourth surface MP4. It may be narrower than the width W4.
- the bypass layer 250 may be provided on the heater element 230.
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Abstract
Description
プラズマエッチング装置などにおけるプロセスでは、様々な強度および様々な分布のプラズマがウェーハに照射される。プラズマがウェーハに照射される場合には、ウェーハの温度をプロセスに適した温度に制御すると同時に、温度均一性および温度制御性が求められる。さらに、生産性を向上させるためには、ウェーハの温度を所定の温度に比較的短い時間で到達させることが求められる。急激な温度変化や、熱の供給や、高周波電圧の印加がある。これらにより、静電チャックには熱的・電気的・機械的な負荷が発生することになる。静電チャックにはこれらの負荷に耐え、ウェーハ温度を制御する高い信頼性が求められる。このような要求を同時に満足することは、困難である。
図1は、本実施形態にかかる静電チャックを表す模式的斜視図である。
図2(a)及び図2(b)は、本実施形態にかかる静電チャックを表す模式的断面図である。
図1では、説明の便宜上、静電チャックの一部において断面図を表している。図2(a)は、例えば図1に表した切断面A1-A1における模式的断面図である。図2(b)は、図2(a)に表した領域B1の模式的拡大図である。
セラミック誘電体基板100は、ベースプレート300と積層方向(Z方向)において離れた位置に設けられている。ヒータプレート200は、ベースプレート300と、セラミック誘電体基板100と、の間に設けられている。
図4(a)及び図4(b)は、本実施形態のヒータプレートを表す模式的斜視図である。
図5は、本実施形態のヒータプレートを表す模式的分解図である。
図3は、本実施形態のヒータプレートを上面(セラミック誘電体基板100の側の面)から眺めた模式的斜視図である。図4(a)は、本実施形態のヒータプレートを下面(ベースプレート300の側の面)から眺めた模式的斜視図である。図4(b)は、図4(a)に表した領域B2における模式的拡大図である。
これに対して、本実施形態では、第1の支持板210は、ヒータエレメント230およびバイパス層250を高周波から遮断する。これにより、第1の支持板210は、ヒータエレメント230が異常温度に発熱することを抑制することができる。
本実施形態にかかるヒータプレート200の製造方法では、例えば、まずアルミニウムの機械加工を行うことで、第1の支持板210および第2の支持板270を製造する。第1の支持板210および第2の支持板270の検査は、例えば三次元測定器などを用いて行われる。
このようにして、本実施形態のヒータプレート200が製造される。
なお、製造後のヒータプレート200に対しては、検査などが適宜行われる。
図6は、本実施形態のヒータプレートの一部を表す断面図である。
図7は、本実施形態のヒータプレートの写真像である。図7では、図6に表した領域B3に対応する断面を観察している。
本実施形態において、ヒータ電極239は、複数の領域に独立して配置されている。例えば、図6に表したように、ヒータ電極239(ヒータエレメント230)は、第1の導電部21と、第2の導電部22と、を有する。第2の導電部22は、面内方向Dp(例えばX方向)において第1の導電部21と離間している。第1の導電部21及び第2の導電部22は、ヒータ電極239の一部である。第1の導電部21と第2の導電部22との間の距離(第1の導電部21と第2の導電部22との間の離間部分235の幅L8)は、例えば、500μm以上である。このように、ヒータ電極239が、複数の領域に配置されることによって、処理対象物Wの面内の温度を各領域ごとに制御することができる。なお、ヒータ電極239のパターンの具体例については、図19(a)、図19(b)及び図20に関して後述する。
第1の空間部23aは、側端部21aと、第1の樹脂層220と、第2の樹脂層240と、によって区画された(囲まれた)空間である。第1の空間部23aは、面内方向Dpにおいて側端部21aと隣接しており、第1の導電部21と第2の導電部22との間に位置する。
図8(a)~図8(d)、図9(a)及び図9(b)は、ヒータプレートを表す断面図である。
図8(a)~図8(d)は、シミュレーションの条件を表している。図8(a)は、シミュレーションに用いたヒータプレートの構造を示す。図8(b)及び図8(c)は、図8(a)に表した領域B4の拡大断面図である。図8(b)は、比較例に係るヒータプレートH1の構造を示し、図8(c)は、実施例に係るヒータプレートH2の構造を示す。
図10(a)に表した例においては、第1の空間部23aは、側端部21aから遠ざかるにつれて、下側から潰された形状を有している。すなわち、第1の空間部23aと第2の樹脂層240との境界は、面内方向Dpにおいて側端部21aから遠ざかるにつれて、図10(a)に示した仮想面P2(仮想線)に近づく。また、第1の空間部23aと第1の樹脂層220との境界は、仮想面P2に沿って延びている。なお、仮想面P2は、第1の導電部21の上面21Uを通り、面内方向Dpに延在する面である。上面21Uは、第1の樹脂層220と対向する面であり、第1の導電部21は、上面21Uにおいて第1の樹脂層220と接している。第2~第4の空間部23b~23dも、同様に、下側から潰された形状を有している。
図11(a)及び図11(b)に表した例においては、ヒータ電極239の上面の幅は、ヒータ電極239の下面の幅と異なる。具体的には、例えば、第1の導電部21の上面21Uの面内方向Dpに沿った幅L4は、第1の導電部21の下面21Lの面内方向Dpに沿った幅L5とは異なる。言い換えると、上面21U及び下面21Lのうち一方の面の面内方向Dpに沿った幅は、上面21U及び下面21Lのうち他方の面の面内方向Dpに沿った幅よりも短い。
例えば、第1の導電部21は、上面21Uと下面21Lとをつなぐ側面S1及び側面S2を有する。側面S1は、第1の空間部23aと接する面であり、側面S2は、第2の空間部23bと接する面である。側面S1及び側面S2のそれぞれは、上面21U及び下面21Lのうち面内方向Dpに沿った幅が広い方の面よりも粗い。例えば、図11(a)に表した例では、側面S1及び側面S2のそれぞれは、下面21Lよりも粗い。また、図11(b)に表した例では、側面S1及び側面S2のそれぞれは、上面21Uよりも粗い。
図12(a)及び図12(b)に表した例においても、ヒータ電極239の上面の幅は、ヒータ電極239の下面の幅と異なる。この例では、ヒータ電極239の上面及び下面のうち、幅が狭い方の面に接する樹脂層の形状は、ヒータ電極239の配置にならった凹凸を有する。また、その樹脂層と接する支持板も凹凸を有する。凹凸によって層同士の接着面積が広くなり、接着強度を向上させることができる。
図13に表したように、ヒータプレート200は、バイパス層250と、第3の樹脂層260と、を有していてもよい。バイパス層250は、第2の樹脂層240と第2の支持板270との間に設けられている。第3の樹脂層260は、バイパス層250と、第2の支持板270と、の間に設けられている。これ以外については、図13に表した変形例のヒータプレートには、上述のヒータプレートと同様の説明を適用できる。
図14(a)及び図14(b)は、本実施形態の製造方法の一例を例示する模式的断面図である。
図15は、本実施形態の製造方法の他の一例を例示する模式的断面図である。
図14(a)は、バイパス層とヒータエレメントとを接合する前の状態を表す模式的断面図である。図14(b)は、バイパス層とヒータエレメントとを接合した後の状態を表す模式的断面図である。図15は、バイパス層と給電端子との接合工程の一例を例示する模式的断面図である。
このようにして、本実施形態のヒータプレート200が製造される。
図17(a)及び図17(b)は、静電チャックを表す電気回路図である。
図17(a)は、第1の支持板と第2の支持板とが電気的に接合された例を表す電気回路図である。図17(b)は、第1の支持板と第2の支持板とが電気的に接合されていない例を表す電気回路図である。
図18(a)及び図18(b)は、本実施形態のヒータプレートの具体例を表す模式的平面図である。
図19(a)、図19(b)及び図20は、本具体例のヒータエレメントを例示する模式的平面図である。
図21(a)及び図21(b)は、本具体例のバイパス層を例示する模式的平面図である。
図22(a)~図22(c)は、本具体例のヒータプレートの一部を模式的に表す拡大図である。
図18(a)は、本具体例のヒータプレートを上面から眺めた模式的平面図である。図18(b)は、本具体例のヒータプレートを下面から眺めた模式的平面図である。図19(a)は、ヒータエレメントの領域の一例を例示する模式的平面図である。図19(b)及び図20は、ヒータエレメントの領域の他の一例を例示する模式的平面図である。
複数のバイパス層250のうちの少なくともいずれかが切り欠き部253を有するため、第2の支持板270は、第1の支持板210と接触可能である。
接合部255c、255dは、ヒータプレート200の中心203を中心とし接合部255e、255fを通る円とは異なる円の上に存在する。接合部255c、255dは、ヒータプレート200の中心203を中心とし接合部255g、255hを通る円とは異なる円の上に存在する。
接合部255e、255fは、ヒータプレート200の中心203を中心とし接合部255g、255hを通る円とは異なる円の上に存在する。
図23(a)は、本発明者が第2の支持板270の面271の形状を測定した結果の一例を例示するグラフ図である。図23(b)は、本実施形態のヒータプレート200の表面の形状を説明する模式的断面図である。
図24に表したように、バイパス層250及び第3の樹脂層260を有しないヒータプレート200においても、第1の支持板210及び第2の支持板270は、ヒータエレメント230の形状にならった凹凸を有する。
図25(a)は、本実施形態の変形例にかかる静電チャックを表す模式的断面図である。図25(b)は、本変形例のヒータプレートを表す模式的断面図である。図24(a)および図25(b)は、例えば図1に表した切断面A1-A1における模式的断面図に相当する。
図28は、本変形例のヒータプレートを表す模式的断面図である。
図26(a)は、第1の支持板が複数の支持部に分割された一例を表す。図26(b)及び図27は、第1の支持板が複数の支持部に分割された他の一例を表す。
図29(a)は、ヒータエレメント230の一部を表し、図29(b)は、バイパス層250の一部を表す。また、図29(c)は、ヒータエレメント230及びバイパス層250の一部を表し、図29(d)は、ヒータエレメント230及びバイパス層250の変形例を表す。
各ヒータ電極239のそれぞれは、第1の支持板210側の第1面MP1(上面)と、第2の支持板側の第2面MP2(下面)と、を有する。第1面MP1は、第1の樹脂層220と対向する。第2面MP2は、第1面MP1と反対側を向く。すなわち、第2面MP2は、第2の樹脂層240と対向する。
図30(a)及び図30(c)に表したように、この例において、第1面MP1の幅W1は、第2面MP2の幅W2よりも広い。すなわち、ヒータ電極239の幅は、下方(べースプレート300側)に向かうほど狭くなる。同様に、図30(b)及び図30(c)に表したように、第3面MP3の幅W3は、第4面MP4の幅W4よりも広い。バイパス部251の幅は、下方に向かうほど狭くなる。
図31(a)及び図31(c)に表したように、この例において、第1面MP1の幅W1は、第2面MP2の幅W2よりも狭い。一方、図31(b)及び図31(c)に表したように第3面MP3の幅W3は、第4面MP4の幅W4よりも広い。この例において、第3面MP3の第4面MP4に対する幅の大小関係は、第1面MP1の第2面MP2に対する幅の大小関係と反対である。
図32(a)~図32(c)に表したように、第1面MP1の幅W1を、第2面MP2の幅W2より広くし、第3面MP3の幅W3を、第4面MP4の幅W4より狭くしてもよい。また、図32(d)に表したように、バイパス層250をヒータエレメント230の上に設けてもよい。
また、前述した各実施の形態が備える各要素は、技術的に可能な限りにおいて組み合わせることができ、これらを組み合わせたものも本発明の特徴を含む限り本発明の範囲に包含される。
Claims (38)
- 処理対象物が載置されるセラミック誘電体基板と、
積層方向において前記セラミック誘電体基板と離れた位置に設けられ前記セラミック誘電体基板を支持するベースプレートと、
前記セラミック誘電体基板と前記ベースプレートとの間に設けられたヒータプレートと、
を備え、
前記ヒータプレートは、
前記セラミック誘電体基板と前記ベースプレートとの間に設けられ金属を含む第1の支持板と、
前記第1の支持板と前記ベースプレートとの間に設けられ金属を含む第2の支持板と、
前記第1の支持板と前記第2の支持板との間に設けられた第1の樹脂層と、
前記第1の樹脂層と前記第2の支持板との間に設けられた第2の樹脂層と、
前記第1の樹脂層と前記第2の樹脂層との間に設けられ、第1の導電部と、前記積層方向に対して垂直な面内方向において前記第1の導電部と離間した第2の導電部と、を有し、電流が流れることにより発熱するヒータエレメントと、
前記第1の導電部の前記面内方向における第1の側端部と、前記第1の樹脂層と、前記第2の樹脂層と、によって区画された第1の空間部と、
を有し、
前記第1の樹脂層は、前記第1の導電部と前記第2の導電部との間において、前記第2の樹脂層と接していることを特徴とする静電チャック。 - 前記第1の導電部は、前記面内方向において前記第1の側端部と離間した第2の側端部を有し、
前記ヒータプレートは、前記第2の側端部と、前記第1の樹脂層と、前記第2の樹脂層と、によって区画された第2の空間部を有することを特徴とする請求項1記載の静電チャック。 - 前記第1の空間部の前記積層方向に沿った幅は、前記第1の導電部の前記積層方向に沿った幅以下であることを特徴とする請求項1又は2に記載の静電チャック。
- 前記第1の空間部の前記積層方向に沿った幅は、前記面内方向において前記第1の側端部から遠ざかるにつれて狭くなることを特徴とする請求項1~3のいずれか1つに記載の静電チャック。
- 前記第1の空間部と前記第1の樹脂層との境界は、前記面内方向において前記第1の側端部から遠ざかるにつれて、前記第1の導電部の前記積層方向における中央を通り前記面内方向に延在する仮想面に近づき、
前記第1の空間部と前記第2の樹脂層との境界は、前記面内方向において前記第1の側端部から遠ざかるにつれて、前記仮想面に近づくことを特徴とする請求項1~4のいずれか1つに記載の静電チャック。 - 前記第1の導電部は、前記第1の樹脂層と対向する上面を有し、
前記第1の空間部と前記第2の樹脂層との境界は、前記面内方向において前記第1の側端部から遠ざかるにつれて、前記上面を通り前記面内方向に延在する仮想面に近づくことを特徴とする請求項1~4のいずれか1つに記載の静電チャック。 - 前記第1の導電部は、前記第2の樹脂層と対向する下面を有し、
前記第1の空間部と前記第2の樹脂層との境界は、前記面内方向において前記第1の導電部から遠ざかるにつれて、前記下面を通り前記面内方向に延在する仮想面に近づくことを特徴とする請求項1~4のいずれか1つに記載の静電チャック。 - 前記第1の導電部は、前記第1の樹脂層と対向する上面と、前記第2の樹脂層と対向する下面と、を有し、
前記上面及び前記下面のうち一方の面の前記面内方向に沿った幅は、前記上面及び前記下面の他方の面の前記面内方向に沿った幅よりも狭いことを特徴とする請求項1~7のいずれか1つに記載の静電チャック。 - 前記第1の導電部の前記下面の前記面内方向に沿った前記長さは、前記第1の導電部の前記上面の前記面内方向に沿った前記長さよりも長いことを特徴とする請求項8記載の静電チャック。
- 前記第1の導電部の前記上面の前記面内方向に沿った前記長さは、前記第1の導電部の前記下面の前記面内方向に沿った前記長さよりも長いことを特徴とする請求項8記載の静電チャック。
- 前記一方の面と前記第1の導電部の側面とは、曲面によって接続されていることを特徴とする請求項8~10のいずれか1つに記載の静電チャック。
- 前記第1の導電部の側面は、前記他方の面よりも粗いことを特徴とする請求項8~11のいずれか1つに記載の静電チャック。
- 前記第1の支持板及び前記第2の支持板のうち一方の支持板と、前記第1の導電部の前記積層方向における中央を通り前記面内方向に延在する中央仮想面と、の間の距離は、前記第1の支持板及び前記第2の支持板のうち他方の支持板と、前記中央仮想面と、の間の距離よりも短く、
前記一方の面は、前記一方の支持板と前記中央仮想面との間に位置することを特徴とする請求項8~12のいずれか1つに記載の静電チャック。 - 前記第1の支持板は、前記第2の支持板と電気的に接合されたことを特徴とする請求項1~13のいずれか1つに記載の静電チャック。
- 前記第1の支持板が前記第2の支持板と接合された領域の面積は、前記第1の支持板の上面の面積よりも狭く、前記第2の支持板の下面の面積よりも狭いことを特徴とする請求項14記載の静電チャック。
- 前記第1の支持板の上面は、第1の凹凸を有し、
前記第2の支持板の下面は、第2の凹凸を有することを特徴とする請求項1~15のいずれか1つに記載の静電チャック。 - 前記第1の凹凸は、前記ヒータエレメントの形状にならい、
前記第2の凹凸は、前記ヒータエレメントの形状にならったことを特徴とする請求項16記載の静電チャック。 - 前記第1の凹凸の凹部と、前記第2の凹凸の凹部と、の間の距離は、前記第1の凹凸の凸部と、前記第2の凹凸の凸部と、の間の距離よりも短いことを特徴とする請求項17記載の静電チャック。
- 前記第1の凹凸の高さは、前記第2の凹凸の高さとは異なることを特徴とする請求項16~18のいずれか1つに記載の静電チャック。
- 前記ヒータエレメントは、帯状のヒータ電極を有し、
前記ヒータ電極は、複数の領域において互いに独立した状態で設けられたことを特徴とする請求項1~19のいずれか1つに記載の静電チャック。 - 前記ヒータエレメントは、複数設けられ、
前記複数の前記ヒータエレメントは、互いに異なる層に独立した状態で設けられたことを特徴とする請求項1~20のいずれか1つに記載の静電チャック。 - 前記ヒータプレートは、前記第1の支持板と、前記第2の支持板と、の間に設けられ導電性を有するバイパス層をさらに有することを特徴とする請求項1~20のいずれか1つに記載の静電チャック。
- 前記ヒータエレメントは、前記バイパス層と電気的に接合され、前記第1の支持板および前記第2の支持板とは電気的に絶縁されたことを特徴とする請求項22記載の静電チャック。
- 前記バイパス層の厚さは、前記第1の樹脂層の厚さよりも厚いことを特徴とする請求項22又は23に記載の静電チャック。
- 前記バイパス層の厚さは、前記ヒータエレメントの厚さよりも厚いことを特徴とする請求項22~24のいずれか1つに記載の静電チャック。
- 前記バイパス層は、前記ヒータエレメントと、前記ベースプレートと、の間に設けられたことを特徴とする請求項22~25のいずれか1つに記載の静電チャック。
- 前記バイパス層は、前記ヒータエレメントと、前記セラミック誘電体基板と、の間に設けられたことを特徴とする請求項22~25のいずれか1つに記載の静電チャック。
- 前記ヒータプレートは、前記バイパス層の側方に設けられた空間部をさらに有することを特徴とする請求項22~27のいずれか1つに記載の静電チャック。
- 前記第1の空間部の断面積及び前記バイパス層の側方の前記空間部の断面積の大小関係は、前記ヒータエレメントの厚さ及び前記バイパス層の厚さの大小関係と同じであることを特徴とする請求項28記載の静電チャック。
- 前記第1の空間部の側端は、前記第1の導電部の厚さ方向の中央に対して前記第1の支持板側又は前記第2の支持板側にずれ、
前記バイパス層の側方の前記空間部の側端は、前記バイパス層の厚さ方向の中央に対して前記第1の空間部の側端と同じ方向にずれることを特徴とする請求項28又は29に記載の静電チャック。 - 前記ヒータエレメントは、前記第1の支持板側の第1面と、前記第2の支持板側の第2面と、を有し、
前記第1面の幅は、前記第2面の幅と異なり、
前記バイパス層は、前記第1の支持板側の第3面と、前記第2の支持板側の第4面と、を有し、
前記第3面の幅は、前記第4面の幅と異なり、
前記第3面の前記第4面に対する幅の大小関係は、前記第1面の前記第2面に対する幅の大小関係と同じであることを特徴とする請求項22~30のいずれか1つに記載の静電チャック。 - 前記ヒータエレメントは、前記第1の支持板側の第1面と、前記第2の支持板側の第2面と、を有し、
前記第1面の幅は、前記第2面の幅と異なり、
前記バイパス層は、前記第1の支持板側の第3面と、前記第2の支持板側の第4面と、を有し、
前記第3面の幅は、前記第4面の幅と異なり、
前記第3面の前記第4面に対する幅の大小関係は、前記第1面の前記第2面に対する幅の大小関係と反対であることを特徴とする請求項22~30のいずれか1つに記載の静電チャック。 - 前記第1の支持板の上面の面積は、前記第2の支持板の下面の面積よりも広いことを特徴とする請求項1~32のいずれか1つに記載の静電チャック。
- 前記第1の支持板は、複数の支持部を有し、
前記複数の支持部は、互いに独立した状態で設けられたことを特徴とする請求項1~33のいずれか1つに記載の静電チャック。 - 前記第1の支持板の前記第2の支持板側の面は、前記積層方向に沿ってみたときに、前記ヒータエレメントと重なる第1領域と、前記ヒータエレメントと重ならない第2領域と、を有し、
前記積層方向に対して平行な断面において、前記第2領域は、前記第1領域に比べて前記第2の支持板側に突出していることを特徴とする請求項1~34のいずれか1つに記載の静電チャック。 - 前記第2の支持板の前記第1の支持板側の面は、前記積層方向に沿ってみたときに、前記ヒータエレメントと重なる第3領域と、前記ヒータエレメントと重ならない第4領域と、を有し、
前記積層方向に対して平行な断面において、前記第4領域は、前記第3領域に比べて前記第1の支持板側に突出していることを特徴とする請求項35記載の静電チャック。 - 前記第1の支持板の前記第2の支持板側の面は、前記ヒータエレメントの形状にならった凹凸を有し、
前記第2の支持板の前記第1の支持板側の面は、前記ヒータエレメントの形状にならった凹凸を有することを特徴とする請求項35又は36に記載の静電チャック。 - 前記第2領域と前記第4領域との間の前記積層方向に沿った距離は、前記第1領域と前記第3領域との間の前記積層方向に沿った距離よりも短いことを特徴とする請求項36記載の静電チャック。
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