JPWO2021039497A1 - - Google Patents

Info

Publication number
JPWO2021039497A1
JPWO2021039497A1 JP2021542774A JP2021542774A JPWO2021039497A1 JP WO2021039497 A1 JPWO2021039497 A1 JP WO2021039497A1 JP 2021542774 A JP2021542774 A JP 2021542774A JP 2021542774 A JP2021542774 A JP 2021542774A JP WO2021039497 A1 JPWO2021039497 A1 JP WO2021039497A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021542774A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021039497A1 publication Critical patent/JPWO2021039497A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021542774A 2019-08-29 2020-08-18 Pending JPWO2021039497A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019156716 2019-08-29
PCT/JP2020/031099 WO2021039497A1 (ja) 2019-08-29 2020-08-18 基体構造体及び基体構造体を用いた対象物載置装置

Publications (1)

Publication Number Publication Date
JPWO2021039497A1 true JPWO2021039497A1 (ja) 2021-03-04

Family

ID=74684581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021542774A Pending JPWO2021039497A1 (ja) 2019-08-29 2020-08-18

Country Status (2)

Country Link
JP (1) JPWO2021039497A1 (ja)
WO (1) WO2021039497A1 (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151237A (ja) * 1997-07-31 2002-05-24 Toshiba Ceramics Co Ltd カーボンヒータ
JP2011222257A (ja) * 2010-04-08 2011-11-04 Sumitomo Electric Ind Ltd ウェハ加熱用ヒータユニットおよびそれを搭載した半導体製造装置
JP2011256072A (ja) * 2010-06-09 2011-12-22 Ngk Spark Plug Co Ltd 発熱体を有するセラミック基板及びその製造方法
WO2017081951A1 (ja) * 2015-11-12 2017-05-18 京セラ株式会社 ヒータ
JP2017084523A (ja) * 2015-10-26 2017-05-18 日本発條株式会社 ヒータユニット
WO2017159590A1 (ja) * 2016-03-14 2017-09-21 Toto株式会社 静電チャック
WO2017163409A1 (ja) * 2016-03-25 2017-09-28 株式会社日立国際電気 基板支持台、基板処理装置および半導体装置の製造方法
WO2018016588A1 (ja) * 2016-07-20 2018-01-25 Toto株式会社 静電チャック
WO2018064308A1 (en) * 2016-09-30 2018-04-05 Momentive Performance Materials Inc. Heating apparatus with controlled thermal contact

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151237A (ja) * 1997-07-31 2002-05-24 Toshiba Ceramics Co Ltd カーボンヒータ
JP2011222257A (ja) * 2010-04-08 2011-11-04 Sumitomo Electric Ind Ltd ウェハ加熱用ヒータユニットおよびそれを搭載した半導体製造装置
JP2011256072A (ja) * 2010-06-09 2011-12-22 Ngk Spark Plug Co Ltd 発熱体を有するセラミック基板及びその製造方法
JP2017084523A (ja) * 2015-10-26 2017-05-18 日本発條株式会社 ヒータユニット
WO2017081951A1 (ja) * 2015-11-12 2017-05-18 京セラ株式会社 ヒータ
WO2017159590A1 (ja) * 2016-03-14 2017-09-21 Toto株式会社 静電チャック
WO2017163409A1 (ja) * 2016-03-25 2017-09-28 株式会社日立国際電気 基板支持台、基板処理装置および半導体装置の製造方法
WO2018016588A1 (ja) * 2016-07-20 2018-01-25 Toto株式会社 静電チャック
WO2018064308A1 (en) * 2016-09-30 2018-04-05 Momentive Performance Materials Inc. Heating apparatus with controlled thermal contact

Also Published As

Publication number Publication date
WO2021039497A1 (ja) 2021-03-04

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