WO2017156671A1 - 芯片封装设备及其方法 - Google Patents
芯片封装设备及其方法 Download PDFInfo
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- WO2017156671A1 WO2017156671A1 PCT/CN2016/076233 CN2016076233W WO2017156671A1 WO 2017156671 A1 WO2017156671 A1 WO 2017156671A1 CN 2016076233 W CN2016076233 W CN 2016076233W WO 2017156671 A1 WO2017156671 A1 WO 2017156671A1
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims description 51
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000003213 activating effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 44
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000004377 microelectronic Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
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- 230000002860 competitive effect Effects 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Definitions
- the present invention relates to the field of advanced packaging in the semiconductor industry, and more particularly to an apparatus and method for chip packaging.
- microelectronic circuits includes the packaging of the chip, that is, mounting the chip on a substrate or wafer.
- the substrate plays the role of placing, fixing, protecting the chip and enhancing the electrothermal performance, and is also a bridge between the internal world and the external circuit of the chip.
- the contacts on the chip are electrically connected to the substrate, and then established through the substrate and other devices. Electrical connection. Therefore, packaging plays an important role in integrated circuits. There are many ways to package, including wire bonding, automatic tape bonding, flip bonding, and positive bonding.
- the chip In the flip-chip bonding process, the chip is placed on the substrate and the bumps of the chip for making electrical connections with the external components face down, ie toward the substrate, the basic workflow of which involves picking up the chip from the wafer, flipping the chip so that The up and down direction is reversed, flux is applied to the chip, the position is aligned at the inspection camera, and the chip is bonded to the substrate.
- the chip In the dressing bonding process, the chip is placed on the substrate and the bumps of the chip are upward, that is, the bumps of the chip face away from the substrate. Therefore, the formal bonding process does not require the step of flipping the chip compared to the flip-chip bonding process.
- microelectronics product wants to win in this brutal competition, and time to market is a key.
- the process from design to launch must be as short as possible to deliver the most innovative and technologically advanced products.
- manufacturers of microelectronic products have been eager to have more innovative technologies to improve product production efficiency, reduce unit product costs, and provide products that are as technically as possible as possible and cost-effective as possible to improve their products.
- Market competitive advantage to meet the huge consumer demand of the market.
- I hope that the product has more powerful features.
- One way to achieve this is to bond different types of chips to the same substrate to obtain circuits that can perform more complex tasks.
- chip package devices typically include a single bond head that repeatedly moves between the wafer and the substrate, and the bond head can bond one chip to the substrate in each cycle.
- the bond head can bond one chip to the substrate in each cycle.
- the conventional bonding device if it is desired to increase the production efficiency, only the running speed of the device is accelerated.
- the effect of obtaining higher productivity by increasing the speed of the machine is very limited, because the chips are picked up and bonded one by one, and the work cycle for the latter chip must work for the previous chip. It can't be started until the loop is complete.
- the present invention provides a chip package apparatus comprising: at least one chip supply device; at least one chip processing device configured to process a chip provided by a corresponding chip supply device; at least one chip transfer device, each Each of the chip transfer devices has a plurality of bond heads, each bond head for transferring one of the chips processed by the corresponding chip processing device; wherein each of the chip processing devices includes at least two pick-up platforms, Each pick-up platform is configured to simultaneously arrange a plurality of said chips, and a plurality of bond heads on respective chip transfer devices are configured to pick up a plurality of said chips simultaneously from each pick-up platform at a time.
- a plurality of pick-up platforms can be set to take turns to perform chip loading, thereby achieving uninterrupted operation of the chip processing device, effectively improving the overall chip packaging device. Processing efficiency.
- the pickup platform in the chip processing apparatus of the chip package device can simultaneously arrange a plurality of chips
- a plurality of bonding heads of the chip transfer device in the device are disposed to have positions with a plurality of chips on the pickup platform Corresponding to each other, so that the plurality of bonding heads can simultaneously pick up a plurality of said ones from the picking platform at the same time chip.
- the bonding head directly detects, selects, aligns, and picks up the chip one by one from the wafer, which can greatly improve the production efficiency of the device.
- each of the chip processing devices includes a first picking platform and a second picking platform, and the corresponding chip transferring device sequentially picks up a plurality of chips from the first picking platform and the second picking platform. Since two picking platforms are provided, and the two picking platforms are arranged to be alternately in the loading position and the picking position, the chip processing apparatus can continue to work while the picking step completes the loading step while one picking platform completes the picking step The picking platform implements a chip loading step, thereby realizing the uninterrupted operation of the chip processing device, and effectively providing the overall processing efficiency of the chip packaging device.
- each of the picking platforms is moveable between a loading position and a picking position, the picking platform being adapted to be arranged with a plurality of said chips when in said loading position, said picking platform being in said picking The position is adapted to allow the plurality of bond heads to simultaneously pick up a plurality of the chips at a time.
- each of said chip processing devices is arranged such that said first picking platform and said second picking platform are alternately in a loading position and a picking position.
- the chip package device has a first chip supply device and a second chip supply device that operate independently.
- the first chip supply device and the second chip supply device respectively provide different chips.
- the chip package device has a first chip processing device and a second chip processing device that operate independently, which respectively process the chips provided by the corresponding first chip supply device and the second chip supply device.
- the chip package device has a first chip transfer device and a second chip transfer device that operate independently, and respectively transfer the chips processed by the corresponding first chip processing device and the second chip processing device.
- the chip package apparatus further includes a bonding platform on which the substrate is disposed, and the chip is bonded to the substrate by the bonding head.
- the bonding platform is provided with a heating device adapted to heat the substrate disposed on the bonding platform to bond it to the chip.
- the present invention provides a method for packaging a chip, comprising: providing a first chip processing device, the first chip processing device including a first picking platform and a second picking platform; causing the first picking platform And the second picking platform alternately in a loading position and a picking position, wherein the picking platform is at The loading position is adapted to be arranged with a plurality of said chips, said picking platform being adapted to allow a plurality of bonding heads of the chip transfer device to simultaneously pick up a plurality of said chips at a time when in said picking position.
- a second chip processing device is also provided, the second chip processing device processing the different chips independently of the first chip processing device.
- the method further includes providing a bonding platform for arranging the wafer, the chip being bonded to the wafer by the bonding head.
- the method further includes activating a heating device on the bonding platform to heat the wafer disposed on the bonding platform to bond the chip to the wafer.
- the chip transfer device is further provided with an image pickup device for detecting one by one of the plurality of chips on the pick-up platform to determine whether the positions of the respective chips meet the requirements.
- the chip transfer device places the chip one by one onto the substrate to perform bonding.
- Figure 1 shows a perspective view of a chip package device in accordance with one embodiment of the present invention
- FIG. 2 is a partial perspective view of the chip packaging apparatus of FIG. 1 with portions of the housing and components removed to better illustrate the internal configuration thereof;
- FIG. 3 is a top plan view of the chip package device of FIG. 1 with portions of the housing and components removed to better illustrate its internal configuration;
- FIG. 4 is a perspective view of a portion of a chip supply device and a chip processing device of the chip package device of FIG. 1;
- Figure 5 is a perspective view of a portion of the chip processing apparatus of the chip package apparatus of Figure 1;
- Figure 6 is a partially enlarged perspective view of the chip package device of Figure 1, mainly showing the chip transfer device;
- Figure 7 is a partially enlarged perspective view of the bonding head portion of the chip transfer device of Figure 6;
- FIG. 8 is a schematic view of a plurality of bonding heads of the chip packaging device of FIG. 1 when picking up a chip;
- FIG. 9 is a schematic view of a bonding platform portion of the chip package device of FIG. 1;
- FIG. 11 is a block flow diagram of one embodiment of a method for packaging a chip in accordance with the present invention.
- the term "chip” may also be referred to as a "die” as the case may be, but those skilled in the art will appreciate that components or products suitable for use in the apparatus and methods of the present invention include a die or chip, such as This includes, but is not limited to, integrated circuits (ICs), discrete devices, modules, modules, etc. These components or products should be considered equivalent to "chip” or “die” in this context.
- ICs integrated circuits
- the chip package apparatus and method according to the present invention can be used to process a variety of suitable chips.
- suitable chips for example, specific embodiments thereof are specifically described below only with the processing of integrated chips.
- the chips in these embodiments can be replaced with other suitable chips, and such embodiments are also within the scope of the present invention.
- Figure 1 shows a specific chip package device in accordance with the present invention.
- the chip package device is mainly composed of a chip supply portion A, a chip processing portion C, and a substrate supply portion B, wherein the substrate supply portion B includes a substrate holder 11 and a robot 12.
- the wafer cassette is supplied into the chip supply portion A, and the robot 12 takes the substrate from the substrate holder 11 and places it in the processing portion C.
- the specified position is then processed, that is, the chip on the wafer is bonded to the substrate until the desired package is completed.
- the device shown in the figures has a housing mounted on the frame and a plurality of doors that can be opened and closed, such as wafer cassette loading doors, beam doors, etc., which are used to load objects such as chips or substrates, or for mounting Observe, or inspect, the various modules or components of the equipment. Therefore, the settings of these doors can be set according to specific needs, and can be set to start the device and perform the machining operation only when all the doors are safely closed.
- the substrate described herein generally refers to any carrier that can be used to carry a chip or other microelectronic component, such as a substrate, a substrate, a wafer, or the like.
- the chip supply portion A includes the independently operated first chip supply device 20 and the second chip supply device 20' which are symmetrically arranged in the longitudinal direction
- the processing portion C includes the first arrangement which is symmetrically arranged and operates independently.
- First chip supply device 20 and second chip supply device 20', first chip processing device 30 and second chip processing device 30', first chip transfer device 40 and second chip transfer device of chip package device according to the present invention 40' can be basically the same or different.
- the devices are the same, so in the following description, only the first chip supply device 20, the first chip processing device 30, and the first chip transfer supply device 40 will be described.
- the various devices in the device according to the invention operate independently of each other under a unified control system.
- Chip processing device 30 includes a gripper 31 that grabs a wafer from a wafer cassette. As shown in FIG. 4, the grip 31 is supported on a slide rail 32 and movable along the slide rail 32.
- the gripper 31 moves along the slide rail 32 to the wafer cassette, and after grabbing a wafer from the wafer cassette, the wafer is moved to the wafer table and placed on the wafer table 33, and then Continue moving away from wafer table 33 to safety Full position.
- Wafer table 33 can be moved vertically and rotated to align the position of the wafer.
- the camera on wafer table 33 will then detect the wafer to find a chip in good condition. Once the chip in good condition is found, the ejector 34 on the wafer table 33 separates the chip from the wafer.
- the chip processing apparatus 30 further includes a gripper 36, a first picking platform 37, and a second picking platform 37'.
- the gripper 36 is used to grasp the chips that have been separated on the wafer table 33 and placed on the stations on the picking platforms 37 and 37'.
- the first picking platform 37 and the second picking platform 37' shown in the figures have the same structure and function, both for receiving the chip transferred by the gripper 36.
- the picking platform 37 is provided with a plurality of stations 39
- the picking platform 37' is also provided with a plurality of stations 39', each station for placing one chip. The number of stations on each picking platform is fixed.
- a variety of platens can be provided, each with a different number of stations, so that the platen with the corresponding number of stations can be selected as needed before operation.
- a vacuum device may be disposed on the pickup platform for fixing the chip placed on the platen.
- Each of the picking platforms of the chip package apparatus according to the present invention is movable between a loading position and a picking position, the picking platform being adapted to be loaded with a plurality of the chips when in the loading position, the picking platform When in the picking position, it is suitable for the plurality of bonding heads to simultaneously pick up a plurality of the chips at a time.
- each picking platform can be adjusted in its vertical direction. When it is lowered to a height close to the gripper 36, that is, to reach the loading position, the hand 36 can place the chips one by one on the picking platform. On the bit.
- the plurality of bonding heads can simultaneously pick up and transfer the chips on the picking platform to the substrate at one time.
- the first picking platform 37 and the second picking platform 37' are disposed to be alternately in the loading position and the picking position. That is, when the first picking platform 37 is in the lower loading position, the second picking platform 37' is in the upper picking position, and when the first picking platform 37 is filled with the chip and raised to the picking position for the picking head to pick up At this time, the chip on the second pick-up platform 37' has been removed by the bonding head and lowered to the lower loading position for the gripper to load the chip.
- Such an arrangement can effectively provide processing efficiency of the device.
- the pick-up head needs to check a plurality of chips on the pick-up platform one by one to determine whether the position and the like meet the requirements and make corresponding adjustments when picking up the chip, which makes the grabbing step very time consuming. It is conceivable that in a chip package device in which only one pick-up platform is provided, the chip separation step of the chip processing device must be stopped to wait for the completion of the chip capture step.
- the platform is arranged to be alternately in the loading position and the picking position such that when one picking platform completes the loading step and continues the picking step, the chip processing device can continue to operate, performing a chip loading step on the other picking platform, thereby implementing the chip processing device
- the uninterrupted work effectively provides the overall processing efficiency of the chip packaging equipment.
- the chip transfer device 40 mainly includes a plurality of bonding heads 41 (six in the drawing) and a driving mechanism (not shown) and a camera 47 mounted together.
- the camera 47 is used to check whether the position of the chip on the pickup platform meets the requirements or the like.
- the bonding head 41 is mounted on a beam 42 while the two ends of the beam 42 are mounted on the two longitudinal rails 43, respectively.
- the plurality of bond heads 41 can be moved together along the beam 42 in the length direction of the beam 42, and the beam 42 can be moved along the longitudinal rails 43, thereby enabling the plurality of bond heads 41 to be horizontal together. Move horizontally and vertically.
- the plurality of bonding heads 41 are disposed to be independently movable in the vertical direction with respect to the beam 42, and the plurality of bonding heads 41 are disposed to be independently rotatable about respective axes . Accordingly, the bonding head 41 has sufficient freedom of movement to perform any fine movement to complete a precise operation process. Further, the bonding heads 41 can also be arranged such that the horizontal distance between each other can be adjusted such that the position of each of the bonding heads 41 is aligned with the position of the corresponding station 39 of the platen 38 on the picking platform 37.
- a plurality of bond heads on a chip transfer device on a device in accordance with the present invention are configured to pick up a plurality of said chips simultaneously from each picking platform at a time.
- the position of each of the bond heads 41 on the chip transfer device is aligned with the position of the chip 70 on the platen of the pick-up platform 37 so that the plurality of bond heads can be disposable from the pick-up platform
- a plurality of the chips 70 are picked up at the same time.
- the bonding head directly detects, selects, aligns, and picks up the chip one by one from the wafer, which can greatly improve the production efficiency of the device.
- FIG. 9 shows a schematic diagram of a bonding platform 50 in the chip package apparatus shown in FIG. 1.
- the bonding platform 50 is disposed at a substantially intermediate position of the chip package device, as shown in FIG.
- the bonding platform 50 includes a support plate 51 for supporting the substrate.
- the support plate 51 is provided with a plurality of vacuum holes 53 for providing a negative pressure to provide a negative pressure to adsorb and fix the substrate on the support plate 51.
- a plurality of struts 54 that can be controlled to move up and down are also provided on the support plate 51.
- Below the support plate is provided a heating plate 52 which can be activated to heat the support plate 51.
- the robot 12 grabs the substrate from the substrate holder 11 and places it above the support plate 51, at which time the post 54 is raised above the surface of the support plate, so the substrate is actually supported by the support With. After the machine The robot 12 is removed and the post 54 is retracted below the support plate so that the wafer is supported by the support plate. Thereafter, the heating means, i.e., the heating plate 52, is activated, and the heat of the heating plate 52 is transferred to the support plate 51 and further transferred to the substrate. When the substrate is heated to a suitable temperature, the chip attached to the substrate is firmly bonded to the substrate because the adhesive at the bottom is melted.
- the heating means i.e., the heating plate 52
- FIGS 10A-10C illustrate several specific scenarios that can be implemented using the chip package device of the present invention.
- the apparatus of the present invention can be used to bond the same chip 70 to the substrate 80, in this case, as long as the first chip supply device and the second chip supply device respectively provide the same during processing.
- the wafer is ready, and the same chip is processed by two independently operating chip processing devices and chip transfer devices and transferred to the single substrate for bonding.
- 10B and 10C by providing different wafers in the first chip supply device and the second chip supply device, the different chips D1 and D2 are processed by two independently working chip processing devices and chip transfer devices.
- FIG. 10B realizes that different chips are respectively bonded to the substrate
- FIG. 10C realizes that one chip D1 is superposed and bonded to the other chip D2.
- a method for packaging a chip according to the present invention will be described in detail below.
- the method is specifically implemented in accordance with the flow shown in FIG. 11, and the method is accomplished by the apparatus shown in FIG.
- the chip packaging method of the present invention can also be used to package suitable components other than the chip, and can also be implemented using other devices than the device shown in FIG.
- the main steps of the exemplary method are listed in detail.
- the chip package device is activated, the first pick-up platform in the chip processing device is lowered to the loading position, and the second pick-up platform is raised to the pick-up position.
- the gripper in the chip processing device of the device will grab the wafer from the wafer cassette under the control of the control system of the device, and place the wafer on the wafer table, and the wafer table will open the wafer. Let the camera detect the wafer, find the chip in good condition, and separate the chip from the wafer through the ejector.
- the gripper then grabs the separated chip and places it on the designated station of the first picking platform.
- the first picking platform rises to the picking position, and the bonding head moves over the first picking platform, and the cameras therein detect one by one whether the positions of the respective chips are aligned one by one. .
- the plurality of bonding heads simultaneously pick up the plurality of chips on the first picking platform, and then continue to move over the bonding platform, and place the plurality of chips one by one on the base. The predetermined location on the film.
- the second picking platform 37' When the first picking platform is filled with chips and raised to the picking position for picking up by the bonding head, the second picking platform 37' is lowered to the loading position, and the gripper then grabs and places the separated chips into the second picking At the designated station of the platform until the second picking platform is filled with chips.
- the system of the device can be set such that when one of the pick-up platforms is full of chips, the chip on the other pick-up platform is just detected and removed by the chip transfer device.
- the chip on the first pick-up platform is just removed by the bond head and lowered to the loading position.
- the chip processing device since two pickup platforms are provided, and the two pickup platforms are disposed alternately in the loading position and the pickup position, when the pickup step is completed by one pickup platform and the pickup step is continued, the chip processing device The operation can be continued, and the chip loading step is implemented on another picking platform, thereby realizing the uninterrupted work of the chip processing device, and effectively providing the overall processing efficiency of the chip packaging device.
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Abstract
Description
Claims (16)
- 一种芯片封装设备,包括:至少一个芯片供给装置(20);至少一个芯片处理装置(30),其被构造成处理对应的芯片供给装置(20)所提供的芯片(70,D1,D2);至少一个芯片移送装置(40),每个芯片移送装置(40)分别具有多个键合头(41),每个键合头(41)用于移送经相应的芯片处理装置(30)处理后的一个所述芯片(70,D1,D2);其中,每个所述芯片处理装置(30)包括至少两个拾取平台(37,37’),每个拾取平台(37,37’)被构造成可同时布置多个所述芯片(70,D1,D2),并且相应的芯片移送装置(40)上的多个键合头(41)被构造成可从每个拾取平台(37,37’)一次性同时拾取多个所述芯片(70,D1,D2)。
- 根据权利要求1所述的芯片封装设备,其特征在于,每个所述芯片处理装置(30)包括第一拾取平台(37)和第二拾取平台(37’),相应的芯片移送装置(40)依次从所述第一拾取平台(37)和第二拾取平台(37’)拾取多个所述芯片(70,D1,D2)。
- 根据权利要求2所述的芯片封装设备,其特征在于,每个所述拾取平台(37,37’)可在装载位置和拾取位置之间运动,所述拾取平台(37,37’)在处于所述装载位置时适于被加载多个所述芯片(70,D1,D2),所述拾取平台(37,37’)在处于所述拾取位置时适于让所述多个键合头一次性地同时拾取多个所述芯片(70,D1,D2)。
- 根据权利要求3所述的芯片封装设备,其特征在于,每个所述芯片处理装置(30)被设置成所述第一拾取平台(37)和第二拾取平台(37’)交替地处于装载位置和拾取位置。
- 根据权利要求1所述的芯片封装设备,其特征在于,所述芯片封装设备具有独立工作的第一芯片供给装置(20)和第二芯片供给装置(20’)。
- 根据权利要求5所述的芯片封装设备,其特征在于,所述第一芯片供给装置(20)和第二芯片供给装置(20’)分别提供不同的芯片(70,D1,D2)。
- 根据权利要求5所述的芯片封装设备,其特征在于,所述芯片封装设备具有独立工作的第一芯片处理装置(30)和第二芯片处理装置(30’),其分别处理相应的第一芯片供给装置(20)和第二芯片供给装置(20’)所提供的芯片(70,D1,D2)。
- 根据权利要求7所述的芯片封装设备,其特征在于,所述芯片封装设备具有独立工作的第一芯片移送装置(40)和第二芯片移送装置(40’),其分别移送经相应的第一芯片处理装置(30)和第二芯片处理装置(30’)处理后的芯片。
- 根据权利要求1所述的芯片封装设备,其特征在于,所述芯片封装设备还包括键合平台(50),基片(80)被布置在所述键合平台(50)上,所述芯片被所述键合头(41)键合至所述基片(80)上。
- 根据权利要求9所述的芯片封装设备,其特征在于,所述键合平台(50)上设置有加热装置(52),该加热装置(50)适于加热布置于键合平台(50)上的基片(80)以使其与芯片(70,D1,D2)粘合。
- 一种用于封装芯片的方法,包括:提供第一芯片处理装置,该第一芯片处理装置包括第一拾取平台和第二拾取平台;使所述第一拾取平台和第二拾取平台交替地处于装载位置和拾取位置,其中,所述拾取平台在处于所述装载位置时适于被加载多个所述芯片,所述拾取平台在处于所述拾取位置时适于让芯片移送装置的多个键合头一次性地同时拾取多个所述芯片。
- 根据权利要求11所述的方法,其特征在于,还提供第二芯片处理装置,该第二芯片处理装置与所述第一芯片处理装置独立地处理不同的芯片。
- 根据权利要求11所述的方法,其特征在于,还包括提供键合平台,该键合平台用于布置晶圆,所述芯片被所述键合头键合至所述晶圆上。
- 根据权利要求13所述的方法,其特征在于,还包括启动键合平台上的加热装置,以加热布置于键合平台上的晶圆从而使芯片粘结至晶圆上。
- 根据权利要求11所述的方法,其特征在于,所述芯片移送装置上还设置有摄像装置,该摄像装置用于对所述拾取平台上的多个芯片逐一地进行检测以确定各个芯片的位置是否符合要求。
- 根据权利要求11所述的方法,其特征在于,所述芯片移送装置逐一地将芯片放置到基片上以实施键合。
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SG11201807973RA SG11201807973RA (en) | 2016-03-14 | 2016-03-14 | Chip packaging apparatus and method thereof |
KR1020187029567A KR102281279B1 (ko) | 2016-03-14 | 2016-03-14 | 칩 패키징 장치 및 그 방법 |
US16/084,611 US11189507B2 (en) | 2016-03-14 | 2016-03-14 | Chip packaging apparatus and method thereof |
PCT/CN2016/076233 WO2017156671A1 (zh) | 2016-03-14 | 2016-03-14 | 芯片封装设备及其方法 |
MYPI2018001570A MY198186A (en) | 2016-03-14 | 2016-03-14 | Chip packaging apparatus and method thereof |
CN201680083539.5A CN108886002B (zh) | 2016-03-14 | 2016-03-14 | 芯片封装设备及其方法 |
PH12018501980A PH12018501980A1 (en) | 2016-03-14 | 2018-09-13 | Chip packaging apparatus and method thereof |
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PCT/CN2016/076233 WO2017156671A1 (zh) | 2016-03-14 | 2016-03-14 | 芯片封装设备及其方法 |
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PH (1) | PH12018501980A1 (zh) |
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US11774935B2 (en) | 2016-10-08 | 2023-10-03 | Capcon Limited | Apparatus, control method and control device of semiconductor packaging |
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SG11201807973RA (en) * | 2016-03-14 | 2018-10-30 | Capcon Ltd | Chip packaging apparatus and method thereof |
CN109461667A (zh) * | 2018-12-06 | 2019-03-12 | 深圳市佳思特光电设备有限公司 | 半导体芯片封装键合设备及实现方法 |
CN111261558B (zh) * | 2020-01-21 | 2022-11-15 | 深圳中科系统集成技术有限公司 | 一种微电子器件一体化辅助封装装置 |
CN113314441B (zh) * | 2021-05-28 | 2024-03-08 | 安徽光智科技有限公司 | 元器件封装设备及其使用方法 |
KR102631885B1 (ko) | 2023-06-13 | 2024-02-01 | 주식회사 모든다해 | 분광화상을 이용한 전지셀 이물 검출 방법 및 장치 |
CN117059519B (zh) * | 2023-08-09 | 2024-04-26 | 广东省航瑞智能科技有限公司 | 一种多功能芯片组装一体机 |
CN117497434B (zh) * | 2023-12-29 | 2024-04-09 | 砺铸智能设备(天津)有限公司 | 一种芯片倒装设备及其方法 |
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- 2016-03-14 WO PCT/CN2016/076233 patent/WO2017156671A1/zh active Application Filing
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KR20180124077A (ko) | 2018-11-20 |
SG11201807973RA (en) | 2018-10-30 |
PH12018501980A1 (en) | 2019-07-01 |
US20190080942A1 (en) | 2019-03-14 |
KR102281279B1 (ko) | 2021-07-23 |
MY198186A (en) | 2023-08-09 |
CN108886002A (zh) | 2018-11-23 |
US11189507B2 (en) | 2021-11-30 |
CN108886002B (zh) | 2022-07-01 |
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