CN108886002A - 芯片封装设备及其方法 - Google Patents

芯片封装设备及其方法 Download PDF

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Publication number
CN108886002A
CN108886002A CN201680083539.5A CN201680083539A CN108886002A CN 108886002 A CN108886002 A CN 108886002A CN 201680083539 A CN201680083539 A CN 201680083539A CN 108886002 A CN108886002 A CN 108886002A
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China
Prior art keywords
chip
platform
bonding
pickup
processing device
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CN201680083539.5A
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CN108886002B (zh
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俞峰
王宏刚
李洋
王永新
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Capcon Ltd
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Capcon Ltd
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Die Bonding (AREA)
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Abstract

一种芯片封装设备，包括：至少一个芯片供给装置；至少一个芯片处理装置，其被构造成处理对应的芯片供给装置所提供的芯片；至少一个芯片移送装置，每个芯片移送装置分别具有多个键合头，每个键合头用于移送经相应的芯片处理装置处理后的一个芯片；其中，每个芯片处理装置包括至少两个拾取平台，每个拾取平台被构造成可同时布置多个芯片，并且相应的芯片移送装置上的多个键合头被构造成可从每个拾取平台一次性同时拾取多个芯片。以及一种用于封装芯片的方法。

Description

芯片封装设备及其方法 技术领域
本发明涉及半导体工业先进封装领域，尤其涉及一种用于芯片封装的设备以及方法。
背景技术
微电子电路的生产包括芯片的封装，即将芯片安装至基片或晶圆上。其中，基片起着安放、固定、保护芯片和增强电热性能等的作用，同时还是沟通芯片内部世界与外部电路的桥梁，芯片上的接点电连接到基片，再通过基片与其他器件建立电连接。因此，封装对集成电路起着重要的作用。封装的方式有很多，包括引线键合、脚带自动键合、倒装键合、正装键合等。在倒装键合工艺中，芯片被布置在基片上并且芯片的用于与外部部件形成电连接的凸点朝下，即朝向基片，其基本工作流程包括从晶圆拾取芯片、翻转芯片使其上下方向颠倒过来、施加助焊剂至芯片、在检测摄像头处对准位置、将芯片键合至基片上。而在正装键合工艺中，芯片被布置在基片上并且芯片的凸点是朝上的，也即芯片的凸点背离基片。所以，与倒装键合工艺相比，正装键合工艺不需要翻转芯片的步骤。
当前，使用微电子芯片的电子产品的消费需求不断增加，而产品之间的竞争也越来越激烈。一种微电子产品想要在这残酷的竞争中获胜，产品的上市时间是一个关键。也就是说，产品从设计到上市的这一过程必须尽可能短，以能推出在设计上最为新颖并且在技术上最为领先的产品。为此，微电子产品的生产厂家一直渴望能够有更为创新的技术来提高产品的生产效率，降低单位产品成本，以提供技术上尽可能领先、性价比尽可能高的产品，来提高其产品的市场竞争优势，满足市场的巨大消费需求。此外，还希望产品具有更为强大的功能。为实现此目的，其中的一个手段是将不同类型的芯片键合至同一个基片上，以获得能够完成更为复杂的任务的电路。
在现有技术中，芯片封装设备通常包括单个键合头，该单个键合头重复地在晶圆与基片之间运动，键合头在每一个循环中可以键合一个芯片至基片上。对于所述传统的键合设备而言，如果想要提高生产效率，只有加快设备的运行速度。但是在生产实践中已经发现，通过提高机器速度来获得更高的生产效率的效果十分有限，因为芯片是逐个地被拾取和键合，针对在后芯片的工作循环必须在针对在先芯片的工作循环完成之后才能开始。
此外，传统的芯片封装设备在一个工作流程中只能处理一种晶圆，从而只能将一种芯片键合至一个基片上。如果想要将多种芯片同时键合至同一个基片上，需要将多台设备连线组装在一起。这种通过将多台设备连线组合的方式使得生产线变得十分庞大复杂，而且可靠性难以得到保证。
为此，现有技术中仍然存在着进一步提高芯片封装生产效率的技术需求，同时也还希望能够以单个设备来处理更为复杂的封装生产任务。
发明内容
在一个方面，本发明提供了一种芯片封装设备，包括：至少一个芯片供给装置；至少一个芯片处理装置，其被构造成处理对应的芯片供给装置所提供的芯片；至少一个芯片移送装置，每个芯片移送装置分别具有多个键合头，每个键合头用于移送经相应的芯片处理装置处理后的一个所述芯片；其中，每个所述芯片处理装置包括至少两个拾取平台，每个拾取平台被构造成可同时布置多个所述芯片，并且相应的芯片移送装置上的多个键合头被构造成可从每个拾取平台一次性同时拾取多个所述芯片。
在依据本发明的芯片封装设备中，由于设置有至少两个拾取平台，可将多个拾取平台设置为轮流进行芯片装载，从而实现芯片处理装置的不间断工作，有效地提高芯片封装设备的整体加工效率。
同时，由于在该芯片封装设备的芯片处理装置中的拾取平台可同时布置多个芯片，设备中的芯片移送装置的多个键合头被设置成具有与拾取平台上的多个芯片在位置上相互对应，从而所述多个键合头可从所述拾取平台一次性同时拾取多个所述 芯片。这样的构造相比现有技术中键合头直接从比如晶圆中逐个地检测、选择、对准和拾取芯片的技术方案，可以极大地提高设备的生产效率。
优选地，每个所述芯片处理装置包括第一拾取平台和第二拾取平台，相应的芯片移送装置依次从所述第一拾取平台和第二拾取平台拾取多个芯片。由于设置有两个拾取平台，并且两个拾取平台被设置成交替地处于装载位置和拾取位置，使得在一个拾取平台完成装载步骤而继续进行拾取步骤时，芯片处理装置可以继续工作，对另一个拾取平台实施芯片装载步骤，从而实现芯片处理装置的不间断工作，有效地提供芯片封装设备的整体加工效率。
优选地，每个所述拾取平台可在装载位置和拾取位置之间运动，所述拾取平台在处于所述装载位置时适于被布置多个所述芯片，所述拾取平台在处于所述拾取位置时适于让所述多个键合头一次性地同时拾取多个所述芯片。
优选地，每个所述芯片处理装置被设置成所述第一拾取平台和第二拾取平台交替地处于装载位置和拾取位置。
优选地，所述芯片封装设备具有独立工作的第一芯片供给装置和第二芯片供给装置。
优选地，所述第一芯片供给装置和第二芯片供给装置分别提供不同的芯片。
优选地，所述芯片封装设备具有独立工作的第一芯片处理装置和第二芯片处理装置，其分别处理相应的第一芯片供给装置和第二芯片供给装置所提供的芯片。
优选地，所述芯片封装设备具有独立工作的第一芯片移送装置和第二芯片移送装置，其分别移送经相应的第一芯片处理装置和第二芯片处理装置处理后的芯片。
优选地，所述芯片封装设备还包括键合平台，基片被布置在所述键合平台上，并且所述芯片被所述键合头键合至所述基片上。
优选地，所述键合平台上设置有加热装置，该加热装置适于加热布置于键合平台上的基片以使其与芯片粘合。
在另一个方面，本发明提供一种用于封装芯片的方法，包括：提供第一芯片处理装置，该第一芯片处理装置包括第一拾取平台和第二拾取平台；使所述第一拾取平台和第二拾取平台交替地处于装载位置和拾取位置，其中，所述拾取平台在处于 所述装载位置时适于被布置多个所述芯片，所述拾取平台在处于所述拾取位置时适于让芯片移送装置的多个键合头一次性地同时拾取多个所述芯片。
优选地，还提供第二芯片处理装置，该第二芯片处理装置与所述第一芯片处理装置独立地处理不同的芯片。
优选地，还包括提供键合平台，该键合平台用于布置晶圆，所述芯片被所述键合头键合至所述晶圆上。
优选地，还包括启动键合平台上的加热装置，以加热布置于键合平台上的晶圆从而使芯片粘结至晶圆上。
优选地，所述芯片移送装置上还设置有摄像装置，该摄像装置用于对所述拾取平台上的多个芯片逐一地进行检测以确定各个芯片的位置是否符合要求。
优选地，所述芯片移送装置逐一地将芯片放置到基片上以实施键合。
本发明的其他方面以及进一步的优点将在下文中参考具体实施例以及附图进行说明。
附图说明
图1示出了根据本发明的一个实施例的芯片封装设备的透视图；
图2为图1所示芯片封装设备的局部透视图，其中的部分壳体和组件已被去除，以能更好地示出其内部构造；
图3为图1所示芯片封装设备的俯视图，其中的部分壳体和组件已被去除，以能更好地示出其内部构造；
图4为图1中的芯片封装设备的芯片供给装置和芯片处理装置的一部分的透视图；
图5为图1中的芯片封装设备的芯片处理装置的一部分的透视图；
图6为图1所示芯片封装设备的局部放大透视图，其中主要示出了芯片移送装置；
图7为图6中的芯片移送装置的键合头部分的局部放大透视图；
图8为图1中的芯片封装设备的多个键合头在拾取芯片时的示意图；
图9为图1中的芯片封装设备的键合平台部分的示意图；
图10A-10C例示了可使用本发明的设备实施的几种键合情形；
图11为根据本发明的用于封装芯片的方法的一个实施例的流程框图。
具体实施方式
在详细解释本发明的任何实施例之前，应当明白，本发明的应用不限于在以下描述中所讨论的以及在附图中所示出的有关产品构造和方法流程的细节。本发明能够具有其它的实施例，并能够以各种不同的方式来实践或实施。
在本文中，术语“芯片”也可根据具体情况被称为“管芯”，但是，本领域技术人员可以明白，适用于本发明的设备和方法的元器件或产品包括管芯或芯片，例如包括但不限于：集成电路(IC)、分立器件、模组、模块等，这些元器件或产品均应当视为“芯片”或“管芯”在此语境下的等同方式。
在本文中，除非另有特别说明，术语“上”、“下”、“左”、“右”、“前”、“后”、“里”、“外”、“横向”、“纵向”、“中间”、“侧向”等均是相对附图的页面所显示的方位所做的描述。
在本文中，术语“第一”、“第二”等的使用仅仅是为了区分不同的部件或步骤，以表示这些部件或步骤相互独立，但不能用于解释这些部件或步骤之间存在有关重要性、次序、位置等方面的限定。
根据本发明的芯片封装设备以及方法可用于加工多种合适的芯片。然而，作为举例，下文仅以集成芯片的加工来具体描述其具体实施例。本领域技术人员根据本发明的精神和原理将明白，这些实施例中的芯片也可替换为其他合适的芯片，而这样的实施方式也是落入本发明的范围内的。
图1示出了根据本发明的一种具体的芯片封装设备。整体而言，在横向上，该芯片封装设备主要由芯片供给部分A、芯片加工部分C和基片供给部分B组成，其中基片供给部分B包括基片支架11和机械手12。在加工过程时，晶圆盒被提供至芯片供给部分A内，而机械手12从基片支架11处取得基片并放置于加工部分C内 的规定位置，之后完成加工处理，也即晶圆上的芯片被键合至基片上，直至完成所需的封装。图中示出的设备具有安装在框架上的外壳和众多可以打开并关闭的门，比如晶圆盒装载门、横梁门等，这些门或者用来装载物件比如芯片或基片，或者用于安装、观察或检修设备的各个模块或部件。所以，这些门的设置可以根据具体需要进行设置，并且可以设置成仅仅在所有的门均被安全关闭时才能启动设备并进行加工操作。
需要说明的是，本领域技术人员可以明白，本文所述的基片泛指一切可用于承载芯片或其他微电子元件的载体，比如其可以是基底、基板、晶圆等。
参照图2，其为图1中所示芯片封装设备在部分罩壳已被去除后的示意图，并且还去除了基片供给部分B中的基片支架11和机械手12，以能更好地示出其内部构造。继续参见图3，其为图1中所示芯片封装设备在部分罩壳已被去除后的俯视图。结合图2和图3可以看出，芯片供给部分A包括沿纵向对称布置的独立工作的第一芯片供给装置20和第二芯片供给装置20’，加工部分C包括对称布置并且独立工作的第一芯片处理装置30和第二芯片处理装置30’、第一芯片移送装置40和第二芯片移送装置40’。本领域技术人员根据本发明的精神和原理将明白，根据本发明的芯片封装设备也可以仅仅具有一个或者多于两个芯片供给装置、芯片处理装置、芯片移送装置，这样的实施方式也均落入本发明的范围内。根据本发明的芯片封装设备的第一芯片供给装置20和第二芯片供给装置20’、第一芯片处理装置30和第二芯片处理装置30’、第一芯片移送装置40和第二芯片移送装置40’可以分别基本相同，也可以不相同。在本实施例中，所述装置为相同，所以在以下的描述中将仅仅以第一芯片供给装置20、第一芯片处理装置30、第一芯片移送供给装置40来进行介绍。另外，根据本发明的设备中的各个装置是在统一的控制系统下相互独立工作的。
参见图4，其为图1中的芯片封装设备的芯片供给装置20和芯片处理装置30的一部分的透视图。如图所示，芯片供给装置20中的装载台21用于装载晶圆盒，并且装载台21可竖向移动以调节至合适高度。芯片处理装置30包括从晶圆盒抓取晶圆的抓手31。如图4所示，抓手31支撑在一个滑轨32上并可沿滑轨32移动。在需要抓取晶圆时，抓手31沿滑轨32向晶圆盒移动，在从晶圆盒抓取到一片晶圆后再向晶圆台移动并将晶圆放置在晶圆台33上，然后继续移动远离晶圆台33至安 全位置。晶圆台33可以竖向移动并且转动，以对准晶圆的位置。然后，晶圆台33上的摄像头将检测晶圆以寻找状态良好的芯片。一旦找到状态良好的芯片，晶圆台33上的推出器34将该芯片与晶圆分离。
参见图5，其为图1中的芯片封装设备的芯片处理装置30的另外一部分的透视图。如图5所示，芯片处理装置30进一步包括抓手36、第一拾取平台37和第二拾取平台37’。所述抓手36用于抓取晶圆台33上已被分离的芯片并放置在拾取平台37和37’上的工位上。而图中示出的第一拾取平台37和第二拾取平台37’具有相同的结构和功能，均用于接纳抓手36所移送的芯片。如图所示，拾取平台37上设置有多个工位39，而拾取平台37’上也设置有多个工位39’,每个工位用于放置一个芯片。每个拾取平台上的工位数量是固定的。为此，可以提供多种台板，每种台板上设置有不同数量的工位，从而可以在操作前按照需要选择具有相应工位数量的台板。此外，所述拾取平台上可以设置真空装置，以用于固定被放置在台板上的芯片。
依据本发明的芯片封装设备的每个所述拾取平台可在装载位置和拾取位置之间运动，所述拾取平台在处于所述装载位置时适于被加载多个所述芯片，所述拾取平台在处于所述拾取位置时适于让所述多个键合头一次性地同时拾取多个所述芯片。继续参见图5，每个拾取平台是可以沿竖向调节其高度的，当其降低至接近抓手36的高度时，即为达到装载位置，转手36可以将芯片逐个放置在拾取平台的各个工位上。相反地，当拾取平台升起至接近键合头的位置时，即为达到拾取位置，所述多个键合头可以一次性地同时将拾取平台上的芯片拾起并移送至基片。另外，所述第一拾取平台37和第二拾取平台37’被设置成交替地处于装载位置和拾取位置。也就是说，当第一拾取平台37处于下方的装载位置时，第二拾取平台37’处于上方的拾取位置，而当第一拾取平台37装满芯片并上升至拾取位置以供键合头拾取时，第二拾取平台37’上的芯片已被键合头取走而下降至下方的装载位置以供抓手加载芯片。这样的设置可以有效地提供设备的加工效率。键合头在拾取芯片时需要对拾取平台上的多个芯片逐个进行检查以确定其位置等各个方面是否符合要求并做出相应的调整，这使得抓取步骤十分花费时间。可以想象，在仅仅设置一个拾取平台的芯片封装设备中，芯片处理装置的芯片分离步骤必须停止，以等待芯片抓取步骤的完成。相反地，在本发明中，由于设置有两个拾取平台，并且两个拾取 平台被设置成交替地处于装载位置和拾取位置，使得在一个拾取平台完成装载步骤而继续进行拾取步骤时，芯片处理装置可以继续工作，对另一个拾取平台实施芯片装载步骤，从而实现芯片处理装置的不间断工作，有效地提供芯片封装设备的整体加工效率。
现参见图6和图7，详细介绍芯片封装设备中的芯片移送装置40。如图所示，芯片移送装置40主要包括安装在一起的多个键合头41(在图中为6个)和驱动机构(未示出)以及摄像头47。该摄像头47用于检查拾取平台上的芯片的位置是否符合要求等。键合头41安装在一根横梁42上，同时该横梁42的两端分别安装在两根纵向导轨43上。所述多个键合头41可一起在横梁42的长度方向上沿横梁42移动，而该横梁42可沿所述纵向导轨43移动，从而实现所述多个键合头41可一起在水平的横向和纵向上移动。另外，所述多个键合头41被设置成可分别独立地在竖直方向上相对所述横梁42移动，并且所述多个键合头41被设置成可分别独立地绕各自的轴线旋转。据此，所述键合头41具有充分的移动自由度来完成任何细微的运动，以完成精密的操作过程。此外，键合头41还可被设置成相互之间的水平距离可被调节，使得每个键合头41的位置对准拾取平台37上的台板38的相应工位39的位置。
根据本发明的设备上的芯片移送装置上的多个键合头被构造成可从每个拾取平台一次性同时拾取多个所述芯片。参照图8，所述芯片移送装置上的各个键合头41的位置与拾取平台37的台板上的芯片70的位置对准，从而所述多个键合头可从所述拾取平台一次性同时拾取多个所述芯片70。这样的构造相比现有技术中键合头直接从比如晶圆中逐个地检测、选择、对准和拾取芯片的技术方案，可以极大地提高设备的生产效率。
图9示出了图1所示芯片封装设备中的键合平台50的示意图。该键合平台50布置于芯片封装设备的大致中间位置，如图1所示。参见图9，键合平台50包括用于支撑基片的支撑板51。支撑板51上设置有可提供负压的多个真空孔53，以提供负压而将基片吸附固定在支撑板51上。支撑板51上还设置有可被控制上下移动的多个支柱54。支撑板下方设置有加热板52，其可被启动以对支撑板51加热。在操作的过程中，机械手12从基片支架11处抓取基片并放置在支撑板51上方，此时支柱54是升起至支撑板的表面之上的，所以基片实际上被支柱支撑着。之后，机 械手12离开，支柱54缩回至支撑板之下，使得晶片被支撑板支撑。之后，启动加热装置即加热板52，加热板52的热量传递至支撑板51，并进一步传递至基片。当基片被加热到合适温度时，附接至基片上的芯片因为底部的粘结剂被熔化而被牢固地粘结至基片上。
图10A-10C示出了可使用本发明的芯片封装设备进行实施的几种具体情形。如图10A所示，本发明的设备可用于将相同的芯片70键合至基片80上，此时，只要在加工的过程中使第一芯片供给装置和第二芯片供给装置分别提供相同的晶圆即可，相同的芯片被两个独立工作的芯片处理装置和芯片移送装置处理并移送至所述单个基片上进行键合。再如图10B和10C所示，通过在第一芯片供给装置和第二芯片供给装置分别提供不同的晶圆，不同的芯片D1和D2被两个独立工作的芯片处理装置和芯片移送装置处理并移送至所述单个基片上进行键合，也就是说，该实施例实现了单机同时处理两种不同的芯片，并且实现了在同一个基片上同时键合两种不同的芯片。其中，图10B实现的是不同的芯片分别均键合至基片上，而图10C实现的是一个芯片D1被叠加键合至另一个芯片D2上。本领域技术人员基于本发明的精神和原理可以想到，还可以在芯片封装设备上加入更多的装置，从而可以在同一基片上键合更多不同类别的芯片，以实现更为复杂的加工。
以下将详细描述根据本发明的用于封装芯片的方法。作为举例，该方法是具体按照如图11所示的流程来完成的，并且该方法是通过如图1所示的设备来完成的。但是，需要指出的是，本发明的芯片封装方法也可以用于封装芯片之外的合适元器件，并且也可以使用不同于如图1所示的设备的其他装置来实现。
参照图11，其中详细列出了所述例示性方法的主要步骤。为进行加工操作，首先需要在芯片供给部分加入晶圆盒，并且通过机械手将基片装载至键合平台。之后，启动芯片封装设备，芯片处理装置中的第一拾取平台下降至装载位置，而第二拾取平台上升至拾取位置。与此同时，设备的芯片处理装置中的抓手将在设备的控制系统的控制下从晶圆盒中抓取晶圆，并将该晶圆放置在晶圆台上，晶圆台将晶圆张开以让摄像头检测晶圆，找出状态良好的芯片，并通过推出器将芯片从晶圆分离。之后，抓手将分离出的芯片抓取并放置到第一拾取平台的指定工位上。当有足够的芯片被装载至第一拾取平台上时，第一拾取平台上升至拾取位置，而键合头移动至第一拾取平台上方，通过其中的摄像头逐个地检测各个芯片的位置是否对准。在各个 芯片的位置符合要求后，所述多个键合头同时将第一拾取平台上的多个芯片同时抓起，之后继续移动至键合平台上方，并将所述多个芯片逐个地放置在基片上的预定位置。在所述第一拾取平台装满芯片并上升至拾取位置以供键合头拾取时，第二拾取平台37’下降至装载位置，抓手进而将分离出的芯片抓取并放置到第二拾取平台的指定工位上，直至第二拾取平台被装满芯片。作为举例，可对设备的系统进行如下设定，即，在其中一个拾取平台装满芯片时，另一个拾取平台上的芯片正好被芯片移送装置检测完毕并取走。从而，当第二拾取平台被装满芯片而上升至拾取位置时，第一拾取平台上的芯片正好被键合头取走而下降至装载位置。这样，在本发明中，由于设置有两个拾取平台，并且两个拾取平台被设置成交替地处于装载位置和拾取位置，使得在一个拾取平台完成装载步骤而继续进行拾取步骤时，芯片处理装置可以继续工作，对另一个拾取平台实施芯片装载步骤，从而实现芯片处理装置的不间断工作，有效地提供芯片封装设备的整体加工效率。
以上已经通过一个或多个优选实施例和一个或多个替代性的实施例描述了本发明。此外，还描述了本发明的多个方面。本领域技术人员在任何情况下均不应当将所述多个方面或实施例解释为是限制性的，而应当解释为是示例性的。很清楚的是，本发明的范围将根据权利要求来确定。

Claims (16)

  1. 一种芯片封装设备，包括：
    至少一个芯片供给装置(20)；
    至少一个芯片处理装置(30)，其被构造成处理对应的芯片供给装置(20)所提供的芯片(70,D1,D2)；
    至少一个芯片移送装置(40)，每个芯片移送装置(40)分别具有多个键合头(41)，每个键合头(41)用于移送经相应的芯片处理装置(30)处理后的一个所述芯片(70,D1,D2)；
    其中，每个所述芯片处理装置(30)包括至少两个拾取平台(37,37’)，每个拾取平台(37,37’)被构造成可同时布置多个所述芯片(70,D1,D2)，并且相应的芯片移送装置(40)上的多个键合头(41)被构造成可从每个拾取平台(37,37’)一次性同时拾取多个所述芯片(70,D1,D2)。
  2. 根据权利要求1所述的芯片封装设备，其特征在于，每个所述芯片处理装置(30)包括第一拾取平台(37)和第二拾取平台(37’)，相应的芯片移送装置(40)依次从所述第一拾取平台(37)和第二拾取平台(37’)拾取多个所述芯片(70,D1,D2)。
  3. 根据权利要求2所述的芯片封装设备，其特征在于，每个所述拾取平台(37,37’)可在装载位置和拾取位置之间运动，所述拾取平台(37,37’)在处于所述装载位置时适于被加载多个所述芯片(70,D1,D2)，所述拾取平台(37,37’)在处于所述拾取位置时适于让所述多个键合头一次性地同时拾取多个所述芯片(70,D1,D2)。
  4. 根据权利要求3所述的芯片封装设备，其特征在于，每个所述芯片处理装置(30)被设置成所述第一拾取平台(37)和第二拾取平台(37’)交替地处于装载位置和拾取位置。
  5. 根据权利要求1所述的芯片封装设备，其特征在于，所述芯片封装设备具有独立工作的第一芯片供给装置(20)和第二芯片供给装置(20’)。
  6. 根据权利要求5所述的芯片封装设备，其特征在于，所述第一芯片供给装置(20)和第二芯片供给装置(20’)分别提供不同的芯片(70,D1,D2)。
  7. 根据权利要求5所述的芯片封装设备，其特征在于，所述芯片封装设备具有独立工作的第一芯片处理装置(30)和第二芯片处理装置(30’)，其分别处理相应的第一芯片供给装置(20)和第二芯片供给装置(20’)所提供的芯片(70,D1,D2)。
  8. 根据权利要求7所述的芯片封装设备，其特征在于，所述芯片封装设备具有独立工作的第一芯片移送装置(40)和第二芯片移送装置(40’)，其分别移送经相应的第一芯片处理装置(30)和第二芯片处理装置(30’)处理后的芯片。
  9. 根据权利要求1所述的芯片封装设备，其特征在于，所述芯片封装设备还包括键合平台(50)，基片(80)被布置在所述键合平台(50)上，所述芯片被所述键合头(41)键合至所述基片(80)上。
  10. 根据权利要求9所述的芯片封装设备，其特征在于，所述键合平台(50)上设置有加热装置(52)，该加热装置(50)适于加热布置于键合平台(50)上的基片(80)以使其与芯片(70,D1,D2)粘合。
  11. 一种用于封装芯片的方法，包括：
    提供第一芯片处理装置，该第一芯片处理装置包括第一拾取平台和第二拾取平台；
    使所述第一拾取平台和第二拾取平台交替地处于装载位置和拾取位置，其中，所述拾取平台在处于所述装载位置时适于被加载多个所述芯片，所述拾取平台在处于所述拾取位置时适于让芯片移送装置的多个键合头一次性地同时拾取多个所述芯片。
  12. 根据权利要求11所述的方法，其特征在于，还提供第二芯片处理装置，该第二芯片处理装置与所述第一芯片处理装置独立地处理不同的芯片。
  13. 根据权利要求11所述的方法，其特征在于，还包括提供键合平台，该键合平台用于布置晶圆，所述芯片被所述键合头键合至所述晶圆上。
  14. 根据权利要求13所述的方法，其特征在于，还包括启动键合平台上的加热装置，以加热布置于键合平台上的晶圆从而使芯片粘结至晶圆上。
  15. 根据权利要求11所述的方法，其特征在于，所述芯片移送装置上还设置有摄像装置，该摄像装置用于对所述拾取平台上的多个芯片逐一地进行检测以确定各个芯片的位置是否符合要求。
  16. 根据权利要求11所述的方法，其特征在于，所述芯片移送装置逐一地将芯片放置到基片上以实施键合。
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US20190080942A1 (en) 2019-03-14
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US11189507B2 (en) 2021-11-30
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