WO2017150243A1 - 駆動装置、リソグラフィ装置、冷却方法、および物品の製造方法 - Google Patents
駆動装置、リソグラフィ装置、冷却方法、および物品の製造方法 Download PDFInfo
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- WO2017150243A1 WO2017150243A1 PCT/JP2017/006096 JP2017006096W WO2017150243A1 WO 2017150243 A1 WO2017150243 A1 WO 2017150243A1 JP 2017006096 W JP2017006096 W JP 2017006096W WO 2017150243 A1 WO2017150243 A1 WO 2017150243A1
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- Prior art keywords
- refrigerant
- coil
- temperature
- housing
- condensing
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
- H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/19—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
- H02K9/20—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil wherein the cooling medium vaporises within the machine casing
Definitions
- the present invention relates to a driving device, a lithography apparatus, a cooling method, and an article manufacturing method.
- a driving device having an electromagnetic actuator driven by a coil and a magnet
- the coil generates heat when a current flows through the coil. Therefore, for example, when the driving device is mounted on a stage apparatus such as a lithography apparatus that transfers the pattern formed on the mask to the substrate, the temperature of the space around the stage apparatus fluctuates.
- a measuring instrument such as a laser interferometer is used for position measurement of the stage device, this temperature variation becomes an error factor of position measurement.
- Patent Document 1 discloses a technique related to coil cooling.
- the stator of the drive device described in Patent Literature 1 includes a first casing of a sealed container in which a coil and a first refrigerant are accommodated, and a second casing provided on the upper surface of the first casing.
- the first refrigerant is a substance in which a gas and a liquid are in an equilibrium state
- the second refrigerant circulating in the second housing is a refrigerant whose temperature is adjusted to a predetermined temperature.
- the first refrigerant is vaporized while taking heat of the coil in contact with the first refrigerant in the liquid state.
- the first refrigerant is returned to the liquid state again by cooling the vaporized first refrigerant with the second refrigerant.
- Patent Document 1 the heat of the first refrigerant taken away from the coil by the first refrigerant is gradually transferred to the upper surface of the first casing, and a temperature difference is generated between the first casing and the second casing.
- the first refrigerant begins to condense.
- the first refrigerant continues to vaporize until the condensation of the first refrigerant is started. Since the fluctuation of the pressure of the first refrigerant is faster than the movement of heat to the coil, the pressure inside the first housing rises before the condensation starts.
- the present invention has been made in view of the above problems, and an object thereof is to provide a driving apparatus, a lithography apparatus, and a cooling method that can reduce temperature fluctuations of a coil.
- the present invention includes a magnet and a coil, an electromagnetic actuator that drives an object when a current flows through the coil, a first refrigerant that cools the coil by evaporating from a liquid state, and the first in a liquid state.
- a storage means for storing the coil immersed in the refrigerant; a condensing means for condensing the first refrigerant in a gaseous state; and a detection means for detecting a change in temperature or volume of the first refrigerant.
- the condensing means includes adjusting means for adjusting the amount of condensation of the first refrigerant based on the detection result of the detecting means.
- FIG. 1A is a front view illustrating a configuration of a stage device (positioning device) 100 and an interferometer 60 that measures the position of the stage device 100 according to the first embodiment.
- FIG. 1B is a view of the stage apparatus 100 as viewed from the + Z direction.
- a vertical axis is a Z axis, and two axes orthogonal to each other in a plane perpendicular to the Z axis are an X axis and a Y axis.
- the stage device 100 is a device for positioning the object 2.
- the stage apparatus 100 includes a stage (object) 6 on which the object 2 and a mirror 4 that extends in the Y-axis direction and reflects the measurement light from the interferometer 60 are mounted, and a driving apparatus 200 that drives the stage 6.
- the driving device 200 includes a magnet 8 and a coil 10, and includes an electromagnetic actuator that is driven when a current flows through the coil 10.
- the electromagnetic actuator according to the present embodiment includes a plurality of coils 10 as the stator 12 of the drive device 200, and a magnet on which the magnet 8 is mounted as the mover 18 (not shown in FIG. 1B) of the drive device 200. It shall be movable (moving magnet type).
- the mover 18 moves along the X-axis direction that is the arrangement direction of the plurality of coils 10.
- the stage apparatus 100 has two stators 12 and two movers 18 provided in parallel to one stage 6. Thereby, the object 2 is moved while restricting the tilt in the rotation direction around the Z axis.
- One mover 18 is connected to two magnets 8 positioned opposite to the stator 12, that is, on the ⁇ Y direction side and the + Y direction side with respect to the stator 12, and one magnet 8 connected to the two magnets 8.
- a yoke 20 is provided. In FIG. 1A, the magnet on the + Y direction side is not shown.
- the driving device 200 also has a current source 11, and the current source 11 supplies current to the coil 10 at a predetermined position via the wiring 13 in accordance with the target position of the stage 6.
- the stator 12 includes a first housing (first housing means) 14 that houses the plurality of coils 10, and a second housing 16 that is provided on the top of the first housing 14.
- the second housing (second housing means) 16 is a housing configured along the first housing, and houses the refrigerant 28 therein.
- the second casing 16 has a supply port 16a for supplying the refrigerant 28 provided at one end and a discharge port 16b for discharging the refrigerant 28 provided at the other end.
- the refrigerant 28 circulates inside the second housing 16 and the flow path of the circulation system 80 (shown in FIG. 2). That is, the refrigerant 28 flows through a system independent of the refrigerant 24 (detailed later) supplied to the first housing.
- the interferometer 60 has a light source 62, a beam splitter 64, a reference mirror 66, and a detector 68.
- the laser beam 70 emitted from the light source 62 is branched by the beam splitter 64 into light directed to the reference mirror 66 and the measurement mirror 4.
- the beam splitter 64 causes the light reflected by the reference mirror 66 and the light reflected by the mirror 4 to enter the detector 68.
- the detector 68 measures the X position of the stage 6 by measuring the intensity of interference fringes generated by superimposing the respective lights.
- FIG. 2 is a diagram illustrating a configuration of the drive device 200 according to the first embodiment.
- FIG. 1A shows an AA arrow view
- FIG. 1A shows a circulatory system 80 that is not shown.
- the driving device 200 has condensing means for condensing the refrigerant 24 that has become a gas state by vaporization.
- the condensing unit has an adjusting unit that adjusts the amount of condensation of the refrigerant 24 based on the detection result of the detecting unit 38 that detects a change in the state of the refrigerant 24 in the gaseous state.
- the detection means 38 will be described later.
- the adjusting means is means for adjusting the heat of the refrigerant 24 in the gas state (heat of the refrigerant 24) in at least one of the inside of the first housing 14 and the space (communication space) communicating with the inside of the first housing 14. is there.
- the condensing means condenses the refrigerant 24 using the refrigerant 28 that flows in a system independent of the refrigerant 24.
- a circulation system 80 and a Peltier element 32 as an adjusting means are provided.
- the Peltier element 32 radiates the heat inside the first housing 14 to the flow path of the refrigerant 28.
- flowing in a system independent of the refrigerant 24 means flowing in a space separated from the space through which the refrigerant 24 flows.
- the condensing means may have condensing fins 34 and heat radiating fins 36.
- the first housing 14 accommodates a refrigerant (first refrigerant) 24 that cools the coil 10 by being vaporized from the liquid state, and the coil 10 that is immersed in the liquid state refrigerant 24.
- first refrigerant first refrigerant
- the inside of the first housing 14 is a closed space that is sealed so that gas hardly flows between the inside and the outside of the first housing 14. If a sealing member such as an O-ring is used, a wiring (not shown) or wiring 13 connected to the detection means 38 to be described later is connected to the inside of the first housing 14 or a predetermined amount of refrigerant 24 is inserted. For this purpose, an opening (not shown) that can be opened and closed may be provided in the first housing 14.
- the refrigerant 24 has a boiling point close to the management temperature of the environment where the stage apparatus 100 is used, and exists in an equilibrium state between a liquid state and a gas state. When the coil 10 generates heat, the coil 10 can be immediately cooled by vaporizing the refrigerant 24.
- the gaseous refrigerant 24 exists in the upper space 26 in the first housing 14. In the present specification, the reference numeral 24 indicates only the liquid state refrigerant 24.
- a refrigerant having low conductivity is preferable. Short circuit of the coil 10 can be prevented by using a refrigerant having low conductivity.
- water, alcohol, ether, hydrofluoroether (hereinafter referred to as HFE), fluorinate, or the like can be used if the management temperature is about room temperature.
- the space 26 may be decompressed in advance. Thereby, the boiling point of the refrigerant
- the space 26 is depressurized to about 60 kPa (abs), thereby enclosing the HFE in an equilibrium state between a gas state and a liquid state in the first housing 14. be able to.
- the first housing 14 further accommodates a support member 25 for supporting the coil 10 and a condensation fin 34 described later.
- a member 30 made of a heat insulating material is provided on the movable element 18 side outside the second housing 16. Even if the heat of the stator 12 fluctuates, the heat can be prevented (reduced) from being transmitted to the mover 18 and the object 2.
- the second housing 16 itself may be made of a heat insulating material.
- foamed plastic such as polystyrene or polyurethane, glass wool, or the like may be used.
- the circulation system 80 has a mechanism for supplying the refrigerant 28 whose temperature is adjusted to the supply port 16a, circulating the refrigerant 28 so that the refrigerant 28 discharged from the discharge port 16b is recovered and supplied to the supply port 16a again.
- the refrigerant 28 may be a material in a liquid state or a material in a gas state at the management temperature of the stage apparatus 100.
- the circulation system 80 includes a cooler 82, a tank 84, a pump 86, a heat exchanger 88, and a sensor 90 that measures the temperature of the heat exchanger 88.
- the cooler 82 once cools the refrigerant 28 collected from the second housing 16. Waste heat generated during cooling is discarded outside the circulation system 80.
- the refrigerant 28 cooled by the cooler 82 is temporarily stored in the tank 84.
- the pump 86 sends the refrigerant 28 in the tank 84 to the heat exchanger 88 by a predetermined amount per unit time.
- the sensor 90 measures the temperature of the refrigerant 28 adjusted by the heat exchanger 88, and the heat exchanger 88 adjusts the temperature of the refrigerant 28 so that the measurement result by the sensor 90 indicates a predetermined temperature.
- the circulation system 80 may not be a system in which the refrigerant 28 circulates.
- the Peltier element 32 is provided at a joint portion between the first housing 14 and the second housing 16, and from one of the inside of the first housing 14 or the inside of the second housing 16, that is, the second refrigerant. It is an element capable of transferring heat to the other side.
- the heat calculated by the control unit 40 described later based on the detection result of the detection unit 38 is moved from the refrigerant 28 to the first housing 14 in accordance with an instruction from the control unit 40.
- Peltier element 32 may be provided on the second housing 16 side in the first housing 14 or on the first housing 14 side in the second housing 16.
- a condensation fin 34 is provided on the Peltier element 32 side of the first casing 14, and a heat radiation fin 36 having the same shape as the condensation fin 34 is provided on the Peltier element 32 side of the second casing 16.
- the condensing portion of the condensing fin 34 and the heat dissipating portion of the heat dissipating fin 36 are provided so as to face in opposite directions with respect to the Peltier element 32.
- the condensation fin 34 is a portion where the condensed refrigerant 24 gathers.
- the heat radiating fins 36 are portions that radiate heat transferred from the inside of the first housing 14 by the Peltier element 32 into the refrigerant 28.
- the condensing fins 34 and the heat radiating fins 36 are preferably formed in a plurality of needle shapes.
- the contact area with the vaporized refrigerant 24 can be increased, and the condensation efficiency can be increased.
- the efficiency of exhaust heat to the second refrigerant can be increased.
- the condensing fins 34 and the radiating fins 36 have the same shape for simplification of explanation, but the condensing fins 34 and the radiating fins 36 may have different shapes.
- the detection means 38 is a means for detecting a pressure change of the refrigerant 24 in a gas state.
- the detection means 38 includes a sensor 38a and a calculation unit 38b.
- the sensor 38 a is provided at the bottom inside the first housing 14, and measures the pressure received from the liquid state refrigerant 24 that changes according to the pressure change of the gaseous state refrigerant 24.
- the calculation unit 38b connected to the sensor 38a calculates the difference between the pressure detected by the sensor 38a and a predetermined pressure.
- the predetermined pressure is a saturated vapor pressure of the refrigerant 24 in a state where no current is passed through the coil 10 (hereinafter referred to as an idle state).
- the function of the calculation unit 38b may be provided in the control unit 40.
- the control unit 40 has a CPU and a memory (ROM, RAM, etc.).
- the control unit 40 is connected to the detection unit 38 and corresponds to the amount of the refrigerant 24 to be condensed (hereinafter referred to as a target condensation amount) in order to reduce the temperature fluctuation of the coil 10 based on the detection result of the detection unit 38. Determine the amount of heat to heat. Further, based on the target condensation amount, the amount of heat to be moved from the second refrigerant 6 to the first housing 14 by the Peltier element 32 is determined.
- the target condensation amount is preferably a condensation amount that reduces the pressure change detected by the detection means 38 (makes the change amount close to zero).
- the calculation method of the target condensation amount in case the Peltier device 32 moves the heat corresponding to the pressure change which the detection means 38 detected is demonstrated.
- the volume of the first housing 14 is V
- the density of the refrigerant 24 in the gas state is ⁇ [g / l]
- the pressure inside the first housing 14 in the idle state is P0 [Pa]
- the gas state in the idle state is Let the volume of the refrigerant 24 be Vg.
- values of V, ⁇ , Vg, P0, and the latent heat L [J / g] of the refrigerant 24 are stored in advance.
- the amount of change in pressure measured by the sensor 38a is P [Pa]
- the amount of refrigerant 24 vaporized in accordance with the change in pressure P0 to pressure P is ⁇ m [g]
- the control unit 40 calculates the heat quantity Q of the heat to be moved by the Peltier element 32 based on the formula (4), and instructs the Peltier element 32.
- the Peltier element 32 moves the amount of heat Q, and the refrigerant 24 is condensed.
- the refrigerant 24 that has become a gas state inside the first housing 14 is again brought into a liquid state by condensation, so that the pressure inside the first housing 14 returns to a predetermined pressure.
- the detection means 38 detects that the pressure inside the first housing 14 has dropped below a predetermined pressure, the Peltier element 32 moves the heat inside the first housing 14 to the second refrigerant and condenses it. Adjustments may be made to reduce the amount.
- control unit 40 does not necessarily have to calculate every hour as long as the heat quantity Q can be acquired.
- the amount of heat Q may be determined based on the correspondence between the pressure change calculated from the calculation unit 38b and the amount of heat Q.
- the control unit 40 may perform follow-up control of the condensation amount adjustment by PID control.
- the Peltier element 32 adjusts the amount of condensation of the refrigerant 24 based on the detection result of the detection means 38.
- the pressure of the refrigerant 24 and the boiling point of the refrigerant 24 can be maintained at predetermined values, and an increase in the temperature of the coil 10 due to an increase in the boiling point of the refrigerant 24 can be suppressed.
- the temperature fluctuation of the coil 10 is reduced as compared with the case where the condensation amount of the refrigerant 24 is not adjusted using the detection unit 38 and the Peltier element 32. can do.
- the speed at which a change in gas pressure is transmitted to a position separated by a predetermined distance is faster than the speed at which heat is transmitted through a space for a predetermined distance. That is, according to the present embodiment, the pressure change of the refrigerant 24 is faster in response than the speed at which heat corresponding to the temperature rise of the coil 10 is transmitted to the refrigerant 28 via the space 26. Since the refrigerant 24 is condensed based on the pressure change having a quick response, the rise in the boiling point of the refrigerant 24 is suppressed as compared with the driving device described in Patent Document 1 in which the change in the state of the refrigerant 24 by the detection unit is not detected. 10 temperature fluctuations can be reduced.
- the sensor 38 a may not be provided at the bottom of the first housing 14. For example, it may be provided in the space 26. Since the Peltier element 32 can radiate the heat inside the first housing 14 to the outside of the first housing 14, the circulation system 80 including the flow path of the refrigerant 28 may be omitted.
- the driving device 200 may be provided with a stirring unit that stirs the refrigerant 24 inside the first housing 14.
- the stirring unit includes a method of rotating a bladed member, a method of rotating a sphere having a hole, and the like. It is preferable to select a stirrer having a small calorific value. By stirring, it is possible to suppress a decrease in the contact area between the refrigerant 24 and the coil 10 due to the bubbles generated by the vaporization of the refrigerant 24 adhering to the coil 10.
- an encoder (not shown) may be used instead of the interferometer 60.
- the temperature change of the part holding the encoder and the encoder scale can be reduced, and the deterioration of the measurement accuracy of the position of the stage apparatus 100 can be suppressed.
- FIG. 3 is a diagram illustrating a configuration of the driving apparatus 300 according to the second embodiment.
- the condensing means according to this embodiment also condenses the refrigerant 24 using the refrigerant 28 that flows in a system independent of the refrigerant 24. It differs from the driving device 200 in that a temperature control means for controlling the temperature of the refrigerant 28 instead of the Peltier element 32 is used as the adjustment means. Since other configurations are the same as those of the driving device 200, description thereof is omitted.
- the temperature control means is a heat exchanger 88.
- the cooling method of the coil 10 in the driving device 300 is as follows.
- the detection result of the pressure by the detecting means 38 is sent to the control unit 40, and the control unit 40 determines the temperature of the refrigerant 28 flowing inside the second housing 16.
- the controller 40 sets the determined temperature for the heat exchanger 88.
- the detection means 38 adjusts the temperature of the refrigerant 28 flowing through the second housing 16 where the pressure is detected to be low.
- the heat exchanger 88 lowers the temperature of the refrigerant 28, so that the temperature of the second housing 16 is lower than that of the first housing 14. Therefore, the heat transfer from the first housing 14 to the refrigerant 28 can increase the condensation of the refrigerant 24. Thereby, the pressure of the changed refrigerant 24 can be brought close to or matched with the pressure in the idle state.
- the control unit 40 returns the temperature set in the heat exchanger 88 to the temperature before the change when the pressure change detected by the detection unit 38 is lost.
- the temperature of the refrigerant 28 determined by the control unit 40 may be a predetermined temperature lower than before the detection unit 38 detects the pressure change, or may be different depending on the pressure change detected by the detection unit 38. It may be set.
- the heat exchanger 88 adjusts the amount of condensation of the refrigerant 24 based on the detection result of the detection means 38.
- the pressure of the refrigerant 24 and the boiling point of the refrigerant 24 can be maintained at predetermined values, and an increase in the temperature of the coil 10 due to an increase in the boiling point of the refrigerant 24 can be suppressed.
- the temperature variation of the coil 10 is reduced as compared with the case where the condensation amount of the refrigerant 24 is not adjusted using the detection unit 38 and the heat exchanger 88. Can be reduced.
- This embodiment can move a large amount of heat from the inside of the first housing 14 to the inside of the second housing 16 as compared with the case where a Peltier element is used. Therefore, it is particularly suitable as a driving device for a stage apparatus in which the amount of current flowing through the coil 10 is large.
- the stage apparatus 100 has a fine movement stage and a coarse movement stage that moves with a larger movement amount than the fine movement stage, it is preferably used as a drive apparatus for the coarse movement stage.
- FIG. 4 is a diagram illustrating a configuration of a driving device 400 according to the third embodiment.
- the condensing means according to this embodiment also condenses the refrigerant 24 using the refrigerant 28 that flows in a system independent of the refrigerant 24.
- the adjustment unit is different from the driving device 300 in that in addition to the heat exchanger 88, a flow rate control unit that controls the flow rate of the refrigerant 28 is used. Since other configurations are the same as those of the driving device 300, description thereof is omitted.
- the flow rate control means is a pump 86.
- the cooling method of the coil 10 in the drive device 400 is as follows.
- the detection result of the pressure by the detection means 38 is sent to the control unit 40, and the control unit 40 determines the flow rate of the refrigerant 28 that flows inside the second housing 16.
- the control unit 40 instructs the heat exchanger 88 to set the temperature of the refrigerant 28 lower by a predetermined temperature, and instructs the pump 86 to increase the flow rate of the refrigerant 28 flowing through the second housing 16. As the temperature of the second housing 16 is lower than that of the first housing 14, heat is transferred from the first housing 14 to the refrigerant 28.
- the control unit 40 returns the temperature set in the heat exchanger 88 and the flow rate of the refrigerant 28 set in the pump 86 to the values before the change when the pressure change detected by the detecting means 38 disappears.
- the driving device 400 has the same effect as that of the second embodiment. Furthermore, compared with the case where the amount of condensation is adjusted using only the heat exchanger 88 and the sensor 90, the amount of condensation per unit time of the refrigerant 24 can be increased by using the pump 86.
- FIG. 5 is a diagram illustrating a configuration of a driving device 500 according to the fourth embodiment.
- the drive device 500 does not have the second housing 16, the condensation fins 34, and the heat radiation fins 36 as compared with the drive device 300. Instead, the condenser 71, the cylinder 72, the pressure control unit 73, the detection means 74, and a space 75 communicating with the inside of the housing 14 are provided.
- the condensing means according to this embodiment also condenses the refrigerant 24 using the refrigerant 28 that flows in a system independent of the refrigerant 24.
- the condensing means according to the present embodiment is a circulation system 80 and a condenser 71 in which the refrigerant 28 is circulated.
- the adjusting means according to this embodiment is a heat exchanger 88.
- the piston 72a separates the space 76, which is also a part of the space 75, from the space 77 in which the pressure is controlled by the pressure control unit 73.
- the space 75 is back-pressured to a predetermined pressure by the pressure control unit 73.
- the predetermined pressure is the saturated vapor pressure (predetermined pressure) of the refrigerant 24 at the management temperature of the first housing 16. That is, it is the pressure inside the casing 16 while the coil 10 is not generating heat (when no current is passed through the coil 10), for example, the pressure control unit 73 inputs and outputs compressed air to and from the space 77.
- An adjustable pressure control valve is preferred.
- the position of the piston 72a moves so that the pressure in the space 76 and the space 77 is maintained. That is, the space 75 is a space whose volume is variable according to the volume of the refrigerant 24.
- the refrigerant 24 performs the mechanical work of moving the piston 72a against the back pressure.
- the amount of the refrigerant 24 enclosed is preferably an amount in which the space 75 and the space 76 have substantially the same volume in the idle state. It is possible to prevent a collision with the inner wall of the cylinder 72 when the piston 72a moves and to continuously convert the heat of the refrigerant 24 into mechanical work.
- the space 75 communicates with the upper part of the inside of the housing 14 and is connected to the piping 78, the space 76, the space 76, the space 71a through which the refrigerant 24 of the condenser 71 passes, and the lower part of the inside of the housing 14.
- a pipe 79 that communicates and condenses and through which the liquid state refrigerant 24 passes is included.
- the condenser 71 is separated into a space 71 a through which the refrigerant 24 flows and a space 71 b through which the refrigerant 28 flows, and exchanges (moves) heat between the refrigerant 28 and the space 75.
- the condenser 71 is, for example, a heat pump.
- the detecting means 74 has a sensor 74a for detecting the position of the piston 72a and a calculating unit 74b for calculating a difference between the position detected by the sensor 74a and the reference position.
- the calculation unit 74b inputs the calculation result to the control unit 40. That is, the detecting means 74 detects a change in the state of the gaseous refrigerant 24, specifically, a change in the volume of the first refrigerant, by detecting a change in the position of the piston 72a.
- the reference position refers to the position of the piston 72a in the idle state.
- the control unit 40 determines the temperature of the refrigerant 28 flowing inside the second housing 16 based on the detection result of the detection means 74.
- the controller 40 sets the determined temperature for the heat exchanger 88.
- the heat exchanger 88 adjusts the temperature of the refrigerant 28, thereby adjusting the condensation amount of the refrigerant 24 that is condensed in the condenser 71.
- the control unit 40 determines the temperature of the refrigerant 28 flowing inside the second housing 16 so that the volume of the refrigerant 24 is returned to the volume in the idle state based on the detection result of the detection unit 74.
- the controller 40 sets the determined temperature for the heat exchanger 88.
- the control unit 40 may obtain a target condensation amount and a set temperature corresponding to the target condensation amount based on the following calculation, or may set a predetermined temperature that is determined in advance.
- the target condensation amount is the target condensation amount C2.
- C2 (P ⁇ A ⁇ ⁇ x / ⁇ t) / L [g / sec] (2)
- the set temperature of the refrigerant 28 corresponding to the target condensation amount is calculated, and the heat exchanger 88 reduces the temperature of the refrigerant 28 in response to an instruction from the control unit 40.
- the amount of condensation of the refrigerant 24 in the condenser 71 can be increased, and the changed volume of the refrigerant 24 can be brought close to or coincident with the volume of the idle state.
- the position of the piston 72a approaches the reference position.
- the control unit 40 returns the temperature set in the heat exchanger 88 to the temperature before the change.
- the condensation amount may be adjusted by increasing the temperature set in the heat exchanger 88.
- the heat exchanger 88 adjusts the amount of condensation of the refrigerant 24 based on the detection result of the detection means 74.
- the pressure of the refrigerant 24 and the boiling point of the refrigerant 24 can be maintained at predetermined values, and an increase in the temperature of the coil 10 due to an increase in the boiling point of the refrigerant 24 can be suppressed.
- the temperature variation of the coil 10 is reduced as compared with the case where the condensation amount of the refrigerant 24 is not adjusted using the detection unit 74 and the heat exchanger 88. Can be reduced.
- the refrigerant 24 performs the mechanical work of moving the piston 72a against the back pressure. Therefore, the heat deprived from the coil 10 can be converted into mechanical work and consumed. Compared with the first to third embodiments, the amount of exhaust heat in the circulation system 80 can be reduced.
- the refrigerant 24 is condensed in the space 75, the heat of the refrigerant 24 can be released at a position away from the mover 18. Therefore, it is possible to make it difficult for heat to be transmitted to the stage 6 that moves together with the movable element 18. Furthermore, since the position of the space 75 can be determined freely, there is no need to provide the second housing 16 in a narrow space as in the first to third embodiments, and the degree of freedom in designing the drive device can be increased. .
- the Peltier element 32 may be used as in the first embodiment, or the pump 86 may be used as in the third embodiment. Alternatively, these may be used in combination as appropriate.
- FIG. 6 is a diagram showing a configuration of a lithography apparatus 800 having a stage apparatus 100 on which the driving apparatus 200 is mounted.
- the lithography apparatus 800 is an exposure apparatus that exposes light to the substrate 810.
- the light source 802, the illumination optical system 806, and the projection optical system 808 are provided as a pattern forming unit that forms a pattern on the substrate 810.
- the KrF excimer laser light (wavelength 248 nm) emitted from the light source 802 passes through the light guide unit 804, the illumination optical system 806, and the projection optical system 808, and is applied to the substrate 810 (object) placed on the stage apparatus 100. Irradiated.
- the projection optical system 808 reduces and projects a pattern such as a circuit pattern formed on a reticle (mask) 812 on the substrate 810. As a result, the pattern of the reticle 812 is transferred onto the substrate 810.
- Stage device 100 positions substrate 810, which is also object 2 described above.
- the interferometer 60 measures the position of the substrate 810 by measuring the position and orientation of the stage 6.
- the mount 814 is a device that removes vibration so that vibration from the installation surface 816 is not transmitted to the support member that supports the projection optical system.
- Stage device 100 positions reticle 812.
- the control unit 40 controls the positioning of the reticle 812 and the substrate 810 based on the measurement by the interferometer 60.
- the stage apparatus 100 can suppress the heat generation of the coil 10 as in the first embodiment. As a result, heat generated in the coil 10 is transmitted to the substrate, and deterioration in overlay accuracy due to deformation of the substrate can be suppressed. Further, it is possible to suppress a decrease in the positioning accuracy of the stage apparatus 100 caused by the temperature variation of the air in the optical path of the interferometer 60.
- the driving device 200 may be mounted on a stage device 817 that moves the reticle 812. Further, the stage device 100 and the stage device 817 may be mounted with any of the driving devices 300, 400, 500, or a driving device having a combination of these.
- the lithography apparatus 800 is not limited to the above-described apparatus.
- Various exposure apparatuses that form a pattern by exposing the substrate using light rays such as g-line (wavelength 436 nm), ArF laser light (wavelength 193 nm), EUV light (wavelength 13 nm) may be used.
- It may be an imprint apparatus that forms a cured resist pattern using a mold in which a three-dimensional pattern is formed, or a drawing apparatus that draws a pattern by irradiating a substrate with a charged particle beam.
- the driving devices 200 to 500 have a plurality of first housings 14, and each first housing 14 may accommodate one coil 10.
- the number of the coils 10 accommodated in one first housing 14 may not be all of the coils 10 of the stator 12.
- the stator 12 may be configured by connecting the divided first housings 14 each containing the coils 10 one by one or a predetermined number.
- the Peltier element 32 may also be provided with one yoke 20 or one predetermined number of coils 10 even if one long Peltier element 32 is not provided for all the coils 10. When the first housing 14 is divided, the Peltier elements 32 are required as many as the number of the first housings 14.
- the control unit 40 does not have to calculate the target condensation amount every time.
- the target condensation amount may be determined from the table.
- the control unit 40 may be an assembly of separate control boards or a single control board as long as all the functions executed by the control unit 40 are provided.
- the means for detecting the change in the state of the refrigerant 24 in the gas state may be a means for detecting at least one of the pressure change, the volume change, and the temperature change of the refrigerant 24 in addition to the detection means 38 and 74. That's fine.
- the sensor of the means for detecting the temperature change is preferably arranged in the liquid state refrigerant 24 in the first housing 14.
- the temperature rise of the coil 10 can be detected earlier than the time until the heat corresponding to the temperature change of the coil 10 is transmitted to the refrigerant 28 via the space 26.
- the driving devices 200 to 500 are not limited to the moving magnet method in which the mover 18 moves, but may be a moving coil method in which the coil 10 moves. Not only a stage device that moves the object 2 linearly, but also a device that moves the object 2 in the rotation direction. In addition to the stage device for positioning the substrate 810, for example, a stage device for positioning an optical element may be used.
- the driving devices 200 to 500 are not limited to stage devices mounted on the lithography apparatus, but may be driving mechanisms mounted on other devices that require highly accurate positioning.
- a driving mechanism such as a masking blade that blocks exposure light or a reaction force canceller that reduces reaction force accompanying movement of the stage apparatus may be used.
- a drive mechanism that drives a supply unit that supplies a mold or an imprint material on which a three-dimensional shape pattern is formed may be used.
- a pattern formed using a lithographic apparatus is temporarily used when manufacturing various articles.
- the article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold.
- the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA.
- the mold include an imprint mold.
- the pattern formed using the lithography apparatus is subjected to etching or ion implantation in a substrate processing step for manufacturing an article, and then the resist mask is removed.
- an exposure apparatus, a drawing apparatus, or the like is used as the lithography apparatus, the resist is developed before the above-described processing steps.
- the resist cured pattern formed by using an imprint apparatus as a lithography apparatus may be used as a constituent member of at least a part of the article.
- known processing steps development, oxidation, film formation, vapor deposition, planarization, resist peeling, dicing, bonding, packaging, etc.
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Abstract
Description
図1(a)は、第1実施形態に係るステージ装置(位置決め装置)100およびステージ装置100の位置を計測する干渉計60の構成を示す正面図である。図1(b)はステージ装置100を+Z方向から見た図である。鉛直方向の軸をZ軸、当該Z軸に垂直な平面内で互いに直交する2軸をX軸及びY軸としている。
Vg=V-V1=一定が成り立つ。
G=P・Vg・ρ/P0[g]・・・(1)
(P+ΔP)・Vg={P0・Vg・(ρ+Δm)}/ρ ・・・(2)
M=Δm=ρ・vg・ΔP/P0・・・(3)
Q=M・L=ρ・vg・ΔP・L/P0・・・(4)
駆動装置200におけるコイル10の冷却方法について説明する。駆動装置200を駆動させるため、電流源11がコイル10に電流を流し始める。電流を流している間、検出手段38は常時、あるいは所定の時間間隔で冷媒24の圧力を検出する。コイル10が発熱すると、冷媒24が気化してコイル10を冷却する。気体状態の冷媒24が増加したことによって冷媒24のセンサ38aが圧力の増加を検出すると、算出部38bが所定の圧力との差を算出する。検出手段38は、算出した圧力変化を制御部40に送る。
図3は、第2実施形態に係る駆動装置300の構成を示す図である。本実施形態に係る凝縮手段も、冷媒24とは独立した系を流れる冷媒28を用いて冷媒24を凝縮させる。調整手段として、ペルチェ素子32の代わりに冷媒28の温度を制御する温度制御手段を用いる点が、駆動装置200とは異なる。その他の構成は駆動装置200と同様であるため説明を省略する。なお、循環系80においては、温度制御手段とは熱交換器88である。
図4は、第3実施形態に係る駆動装置400の構成を示す図である。本実施形態に係る凝縮手段も、冷媒24とは独立した系を流れる冷媒28を用いて冷媒24を凝縮させる。調整手段として、熱交換器88に加え、さらに冷媒28の流量を制御する流量制御手段を用いる点が、駆動装置300とは異なる。その他の構成は駆動装置300と同様であるため説明を省略する。なお、循環系80においては、流量度制御手段とはポンプ86である。
図5は、第4実施形態に係る駆動装置500の構成を示す図である。駆動装置500は、駆動装置300と比べて、第2筐体16、凝縮フィン34、および放熱フィン36が無い。代わりに凝縮器71、シリンダ72、圧力制御部73、検出手段74、および筐体14の内部と連通する空間75を有する。本実施形態に係る凝縮手段も、冷媒24とは独立した系を流れる冷媒28を用いて冷媒24を凝縮させる。本実施形態に係る凝縮手段は、冷媒28を循環させている循環系80と凝縮器71である。本実施形態に係る調整手段は熱交換器88である。
コイル10に電流が流れ、発熱すると、コイル10と接触している冷媒24がコイル10の熱を吸収して気化する。冷媒24が気化すると、冷媒24の圧力が増加しそうになる。このとき、気体状態の冷媒24がピストン72aを移動させながら断熱膨張することによって、冷媒24の圧力の増加および冷媒24の圧力の増加に伴う沸点の上昇を低減することができる。
C2=(P・A・Δx/Δt)/L[g/sec] ・・・(2)
図6は、駆動装置200を搭載したステージ装置100を有するリソグラフィ装置800の構成を示す図である。リソグラフィ装置800は、基板810に光を露光する露光装置である。
第1実施形態、第2実施形態、および第3実施形態のうち、2つ以上の実施形態を組み合わせて実施してもよい。例えば、冷媒24の凝縮量を調整する調整手段として、第2実施形態の温度制御手段および第3実施形態の流量制御手段を両方使用してもよい。駆動装置200~500は複数の第1筐体14を有しており、それぞれの第1筐体14が1つのコイル10を収容していてもよい。
リソグラフィ装置を用いて形成したパターンは、各種物品を製造する際に一時的に用いられる。物品とは、電気回路素子、光学素子、MEMS、記録素子、センサ、或いは、型等である。電気回路素子としては、DRAM、SRAM、フラッシュメモリ、MRAMのような、揮発性或いは不揮発性の半導体メモリや、LSI、CCD、イメージセンサ、FPGAのような半導体素子等が挙げられる。型としては、インプリント用のモールド等が挙げられる。
Claims (13)
- 磁石とコイルを有し、前記コイルに電流が流れることで物体を駆動する電磁アクチュエータと、
液体状態から気化することで前記コイルを冷却する第1冷媒と、液体状態の前記第1冷媒に浸された前記コイルと、を収容する収容手段と、
気体状態の前記第1冷媒を凝縮する凝縮手段と、
前記第1冷媒の温度または体積の変化を検出する検出手段と、を有し、
前記凝縮手段は、前記検出手段の検出結果に基づいて前記第1冷媒の凝縮量を調整する調整手段を有することを特徴とする駆動装置。 - 前記調整手段は、前記収容手段の内部および前記収容手段の内部と連通する空間の少なくとも一方における気体状態の前記第1冷媒の熱を調整することで、前記凝縮量を調整することを特徴とする請求項1に記載の駆動装置。
- 前記凝縮手段は前記空間に存在する気体状態の前記第1冷媒を凝縮させることを特徴とする請求項2に記載の駆動装置。
- 前記収容手段の内部と連通し、前記第1冷媒の状態変化に応じて体積が変わる空間を有し、
前記検出手段は、前記空間の体積の変化を検出することによって前記第1冷媒の体積の変化を検出することを特徴とする請求項1に記載の駆動装置。 - 前記空間は、前所定の圧力で背圧されていることを特徴とする請求項4に記載の駆動装置。
- 前記所定の圧力は、前記コイルが発熱していない間の前記収容手段の内部の圧力と同じであることを特徴とする請求項5に記載の駆動装置。
- 前記調整手段は、前記収容手段の内部の熱を前記収容手段の内部と連通していない空間に移動させるペルチェ素子であることを特徴とする請求項1に記載の駆動装置。
- 前記凝縮手段は、前記第1冷媒とは独立した系を流れる第2冷媒を用いて気体状態の前記第1冷媒を凝縮し、
前記調整手段は、前記第2冷媒の流量を制御する流量制御手段および前記第2冷媒の温度を制御する温度制御手段の少なくとも一方であることを特徴とする請求項1に記載の駆動装置。 - 前記調整手段は前記温度制御手段であって、前記第2冷媒の温度を低下させて前記凝縮量を増加させることを特徴とする請求項8に記載の駆動装置。
- 前記調整手段は前記流量制御手段であって、前記第2冷媒の流量を増加させて単位時間当たりの凝縮量を増加させることを特徴とする請求項8に記載の駆動装置。
- 請求項1乃至10のいずれか1項に記載の駆動装置を有し、基板の位置を位置決めする位置決め装置と、
前記基板に対してパターンを形成するパターン形成部とを有することを特徴とするリソグラフィ装置。 - 電磁アクチュエータのコイルを液体状態の冷媒に浸しておき、前記冷媒が液体状態から気化することで前記コイルを冷却するコイルの冷却方法であって
前記気化により気体状態になった前記第1冷媒の温度または圧力の変化を検出する検出工程と、
気体状態の前記第1冷媒を凝縮させる凝縮工程と、を有し、
前記凝縮工程は、前記検出工程における検出結果に基づいて前記第1冷媒の凝縮量を調整する工程を有することを特徴とするコイルの冷却方法。 - 請求項11に記載のリソグラフィ装置を用いて、基板上にパターンを形成する工程と、前記工程でパターンの形成された基板を加工する工程と、
を有することを特徴とする物品の製造方法。
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CN201780013965.6A CN108700831B (zh) | 2016-02-29 | 2017-02-20 | 驱动单元、光刻设备、冷却方法和物品的制造方法 |
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CN108390511A (zh) * | 2018-04-26 | 2018-08-10 | 北京建筑大学 | 一种开关磁阻电机及其控制方法、装置和系统 |
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JP7025256B2 (ja) * | 2018-03-16 | 2022-02-24 | キヤノン株式会社 | ステージ装置、リソグラフィ装置、および物品の製造方法 |
JP7202142B2 (ja) * | 2018-10-30 | 2023-01-11 | キヤノン株式会社 | 冷却装置、光源装置、露光装置及び物品の製造方法 |
JP7280152B2 (ja) * | 2019-09-03 | 2023-05-23 | 富士フイルム株式会社 | 電子カセッテ |
JP7483397B2 (ja) | 2020-02-07 | 2024-05-15 | キヤノン株式会社 | 搬送システム |
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Also Published As
Publication number | Publication date |
---|---|
EP3425452A4 (en) | 2019-10-23 |
KR102190676B1 (ko) | 2020-12-14 |
EP3425452A1 (en) | 2019-01-09 |
JP2017156465A (ja) | 2017-09-07 |
CN108700831A (zh) | 2018-10-23 |
US20180364593A1 (en) | 2018-12-20 |
CN108700831B (zh) | 2021-08-10 |
TWI635694B (zh) | 2018-09-11 |
TW201735508A (zh) | 2017-10-01 |
KR20180115292A (ko) | 2018-10-22 |
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