WO2017096627A1 - 柔性显示模组的绑定方法 - Google Patents

柔性显示模组的绑定方法 Download PDF

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Publication number
WO2017096627A1
WO2017096627A1 PCT/CN2015/097206 CN2015097206W WO2017096627A1 WO 2017096627 A1 WO2017096627 A1 WO 2017096627A1 CN 2015097206 W CN2015097206 W CN 2015097206W WO 2017096627 A1 WO2017096627 A1 WO 2017096627A1
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WO
WIPO (PCT)
Prior art keywords
flexible display
display panel
binding
transfer
fixing portion
Prior art date
Application number
PCT/CN2015/097206
Other languages
English (en)
French (fr)
Inventor
朱剑磊
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to US15/580,289 priority Critical patent/US10405436B2/en
Priority to PCT/CN2015/097206 priority patent/WO2017096627A1/zh
Priority to JP2018518626A priority patent/JP2018538561A/ja
Priority to KR1020177036235A priority patent/KR101978595B1/ko
Priority to EP15910101.3A priority patent/EP3388887A4/en
Priority to CN201580009067.4A priority patent/CN107111170B/zh
Publication of WO2017096627A1 publication Critical patent/WO2017096627A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Definitions

  • the invention relates to the technical field of flexible display modules, and in particular to a binding method of a flexible display module.
  • the flexible display module mainly comprises a flexible display panel and a corresponding driving circuit.
  • the external driving chip needs to be connected through the conductive medium on the flexible display panel.
  • This process is generally called bonding.
  • the conductive medium used for the connection in the bonding process is generally an ACF (Anisotropic Conductive Film), which is characterized in that it is electrically conductive only in the direction of the pressure, and is not in other directions without being subjected to pressure. Turn on.
  • ACF Application Function
  • the flexible display panel is easily deformed due to the high temperature hot pressing environment in the binding process, which may result in inaccurate binding alignment, which seriously affects the quality of the product. .
  • the industry usually firstly presses the flexible display panel on the rigid carrier board through the colloid, and then binds it, and finally uses the laser scanning method to peel off the flexible display panel from the rigid carrier board.
  • a new problem arises when peeling off the flexible display panel: since the temperature of the pressing process in the bonding process is mostly between 150 degrees and 200 degrees, the existing colloid generated between the flexible display panel and the rigid carrier plate is generated. The effect is that the solidification state of the colloid located in the binding region changes, and subsequent use of laser peeling is difficult.
  • Embodiments of the present invention provide a binding method for a flexible display module with high yield.
  • a binding method of a flexible display module includes a flexible display panel having a first binding area and a driving integrated circuit having a second binding area, and the binding method includes:
  • the first binding zone and the second binding zone are pressed at a second temperature.
  • the surface of the flexible display panel facing away from the first binding area by the adhesive pasting the transfer plate comprises:
  • the transfer wheel includes a plurality of vacuum suction holes through which the transfer plate is adsorbed to the outer surface of the transfer wheel When the transfer roller is embossed onto the flexible display panel, the vacuum suction hole is sequentially released, so that the transfer plate is separated from the transfer wheel and attached to the flexible display panel. .
  • the surface of the flexible display panel facing away from the first binding area by the adhesive pasting the transfer plate comprises:
  • the transfer machine platform includes a plurality of vacuum suction holes through which the flexible display panel is adsorbed to the transfer machine platform, and the outer surface of the transfer wheel is provided with the rotation a printing plate, when the transfer roller is embossed onto the flexible display panel, the vacuum suction hole is sequentially released, so that the flexible display panel is separated from the transfer machine platform and fits in the same On the transfer plate.
  • the flattening the flexible display panel comprises:
  • the first bonding area includes a plurality of elongated pads, and the pads are tensioned in the length direction of the pads.
  • the tensioning the pad comprises:
  • the flexible display panel includes opposing first and second perimeters, the first perimeter and the second perimeter being perpendicular to a length direction of the pad;
  • the solidifying the colloid of the first binding zone to form the fixing portion comprises:
  • the colloid is irradiated with ultraviolet light to form the fixing portion, and the colloid is an ultraviolet curable adhesive.
  • irradiating the colloid with ultraviolet light comprises: uniformly irradiating the patterned colloid with the ultraviolet light.
  • illuminating the colloid with ultraviolet light comprises: ultraviolet light illuminating the colloid uniformly coated on the transfer sheet at an angle facing the first binding zone.
  • the breaking the fixing portion, separating the flexible display panel and the transfer plate comprises:
  • the fixing portion is heated or laser-irradiated to cause the fixing portion to lose its viscosity, thereby separating the flexible display panel and the transfer sheet.
  • the breaking the fixing portion, separating the flexible display panel and the transfer plate comprises:
  • the fixing portion is heated or laser-irradiated to cause the fixing portion to lose its viscosity, thereby separating the flexible display panel and the transfer sheet.
  • the first binding area of the flexible display panel is fixed to the transfer plate by a fixing portion, so that the first binding area can be flattened by flattening the transfer plate, so that The problem that the binding alignment is difficult due to the size extension inherent in the flexible display panel occurs, and the first binding area and the second binding area can be effectively guaranteed when pre-compression is performed on the basis of the flexible display panel.
  • the alignment is accurate.
  • the pre-compression After the pre-compression is completed, that is, by breaking the fixing portion to separate the flexible display panel and the transfer plate, since the first temperature is a low temperature temperature, it is connected to the flexible display panel and the transfer plate
  • the curing state of the fixing portion does not change, and the fixing portion can be easily broken to separate the flexible display panel and the transfer sheet from the flexible substrate and the electronic device in the flexible display panel.
  • the problem that the circuit is damaged by increasing the amount of laser irradiation and time.
  • the four sides of the flexible display panel are flattened and then pressed to form a flexible display module, and the unfolded flexible display panel maintains a good flatness, so that the flexible display panel needs to be pressed.
  • the region can be completely adhered to the platform for pressing, so that the first binding region and the second binding region can be uniformly heated during the pressing process, further securing the first binding a pair of the zone and the second binding zone Bit precision and binding quality. Therefore, the flexible display module completed by the binding method is high in yield.
  • FIG. 1 is a schematic structural diagram of a flexible display screen used in a binding method of a flexible display module according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a process corresponding to multiple steps in a binding method of a flexible display module according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a bonding action of a flexible display panel and the transfer board in a binding method of a flexible display module according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of another bonding action of a flexible display panel and a transfer board in a binding method of a flexible display module according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of an action of a flexible display panel being flattened in step Step 1 in a binding method of a flexible display module according to an embodiment of the present invention.
  • FIG. 9 is a schematic diagram of an operation of peeling off a flexible display panel from a transfer board in a binding method of a flexible display module according to an embodiment of the present invention.
  • FIG. 10 is another schematic diagram of an operation of peeling off a flexible display panel from a transfer board in a binding method of a flexible display module according to an embodiment of the present invention.
  • an embodiment of the present invention provides a method for binding a flexible display module.
  • the flexible display module includes a flexible display panel 1 having a first binding area 10 (as shown in FIG. 1 ). Show) And the driver integrated circuit 4 (shown in FIG. 3) having the second binding area 40, the binding method mainly includes the following steps:
  • Step 1 attaching the transfer sheet 2 through the colloid 3 on the surface 11 of the flexible display panel 1 facing away from the first binding region 10, and solidifying the colloid facing the first binding region 10 to form a fixing portion 30, as shown in FIG. 2, the shaded portion in the figure represents the fixing portion 30.
  • Step 2 Flatten the transfer plate 2, and the transfer plate 2 drives the first binding region 10 to be flattened by the fixing portion 30.
  • Step 3 align the second binding area 40 with the first binding area 10, and pre-compress the second binding area 40 and the first binding area 10 at a first temperature, As shown in Figure 3.
  • Step 4 Breaking the fixing portion, separating the flexible display panel 1 and the transfer sheet 2, as shown in FIG.
  • Step 5 Flatten the flexible display panel 1 and press the second binding area 40 and the first binding area 10 at a second temperature to form a flexible display module.
  • the first binding region 10 of the flexible display panel 1 is fixed to the transfer plate 2 by the fixing portion 30, so that the first transfer unit 2 can be used to flatten the first transfer region 2
  • a binding area 10 is flattened, so that the problem that the binding alignment is difficult due to the dimensional extension inherent in the flexible display panel 1 does not occur, and the pre-compression on the basis of the pre-compression is effectively ensured.
  • the alignment of a binding zone 10 and the second binding zone 40 is accurate.
  • the first temperature is defined as The low temperature, including but not limited to the temperature in the range of 60° to 90°, so that the curing state of the fixing portion 30 connected between the flexible display panel 1 and the transfer sheet 2 does not change, and
  • the fixing portion 30 is easily broken to separate the flexible display panel 1 and the transfer sheet 2, thereby avoiding the generation of the flexible substrate, the electronic device, and the circuit in the flexible display panel 1 by increasing the amount of laser irradiation and time. The problem of damage.
  • the flexible display panel 1 is flattened, and the second binding zone 40 and the first binding zone 10 are pressed at a second temperature (the second temperature is higher than the first temperature, Including, but not limited to, a temperature in the range of 150° to 200°) to form a flexible display module, the flat display panel 1 that is flattened maintains a good flatness, so that the flexible display panel 1 needs to be pressed.
  • the merged area can be completely adhered to the platform for pressing, so that the first binding zone 10 and the second binding zone 40 can be uniformly heated during the pressing process, further ensuring the The alignment of the first binding zone 10 and the second binding zone 40 Degree and binding quality. Therefore, the flexible display module completed by the binding method is high in yield.
  • the flattening described in this embodiment includes, but is not limited to, a flattened structure (such as the transfer plate 2, the first binding zone 10) in a manner of opening, unfolding, pulling apart, and the like. Or the flexible display panel 1) achieves a flat state.
  • step Step1 of the binding method of the flexible display module the flexible display panel 1 and the transfer plate 2 may be in the transfer machine 20.
  • steps to achieve the fit the following steps to achieve the fit:
  • the flexible display panel 1 is flattened and placed on the transfer machine platform 21 of the transfer machine 20, and the transfer wheel 22 of the transfer machine 20 passes the transfer plate 2 through a plurality of vacuum suction holes Adsorbed on the outer surface of the transfer wheel 22, when the transfer wheel 22 is roll-embossed to the flexible display panel 1, the vacuum suction holes are sequentially released, so that the transfer plate 2 is detached
  • the transfer roller 22 is attached to the flexible display panel 1.
  • the curved line head and the straight line arrow indicate the moving directions of the transfer wheel 22 and the transfer machine stage 21, respectively.
  • the bonded transfer sheet 2 and the flexible display panel 1 can already have a good flatness, and thus The flattening action in step 2 is performed more smoothly and smoothly. It should be understood that although the flexible display panel 1 has been placed flat on the transfer machine platform 21 after being attached to the transfer sheet 2, the next step of the binding method of the flexible display module It is carried out in the binding machine, so the flexible display panel 1 and the transfer plate 2 are moved, and bending or the like may occur during the movement, so that it is still required before the binding alignment is performed. Perform the flattening action in step 2 to ensure the accuracy of the alignment in the binding alignment process.
  • the transfer plate 2 may be first removed from the transfer machine platform 21, and then cured.
  • the glue of the binding zone 10 is formed to form the fixing portion 30, and the curing operation can be performed directly on the transfer machine platform 21.
  • the colloid of the first binding zone 10 is first cured to form the fixing portion 30, and then the transfer plate 2 and the flexible display panel 1 are removed from the transfer machine platform 21,
  • the first binding zone 10 and the transfer plate 2 are secured to each other to prevent the first binding zone 10 from moving relative to the transfer plate 2 before the fixing portion 30 is formed, thereby causing subsequent A misalignment occurs when binding the alignment.
  • step Step1 of the binding method of the flexible display module the flexible display panel 1 and the transfer plate 2 may also be transferred.
  • the machine 20 achieves the fitting by the following steps:
  • the flexible display panel 1 is flattened, and the flexible display panel 1 is adsorbed on the transfer machine platform 21 of the transfer machine 20 by a plurality of vacuum suction holes, and the outer surface of the transfer wheel 22 of the transfer machine 20 Provided with the transfer plate 2, when the transfer wheel 22 is roll-embossed to the flexible display panel 1, the vacuum suction holes are sequentially released, so that the flexible display panel 1 is detached from the rotation
  • the printer platform is attached to the transfer sheet 2.
  • the transfer plate 2 may be first removed from the transfer wheel 22, and then cured.
  • the gel of the first binding zone 10 forms the fixing portion 30, and the curing operation can be performed directly on the transfer roller 22.
  • the colloid of the first binding zone 10 is first cured to form the fixing portion 30, and then the transfer plate 2 and the flexible display panel 1 are removed from the transfer wheel 22 to ensure The first binding zone 10 and the transfer plate 2 are fixed to each other to prevent the first binding zone 10 from moving relative to the transfer plate 2 before the fixing portion 30 is formed, thereby causing subsequent binding A misalignment occurs when the alignment is determined.
  • the flexible display panel 1 is first flattened, and then attached to the transfer plate 2 to ensure the first binding area 10 In the flat state, the transfer plate 2 is fixed to each other, so that in the subsequent process, even if the tension is not applied to the flexible display panel 1, the first binding region 10 may be The transfer plate 2 is fixed and kept in a flat state, which is advantageous for the subsequent bonding alignment process to proceed smoothly.
  • the first binding area 10 includes a plurality of elongated pads 100 .
  • the pad 100 is tensioned in the length direction of the pad (in the direction indicated by the double-headed arrow in FIG. 8). Since the pad 100 is tensioned in the longitudinal direction thereof, the spacing between the adjacent pads 100 does not change during the tensioning operation, which facilitates the smoothing of the subsequent bonding alignment process.
  • a first tensioning force F and a second tensioning force F′ may be applied on the opposite first and second perimeters 13 and 14 of the flexible display panel 1 to respectively tension the flexible display panel 1
  • the first perimeter 13 and the second perimeter 14 are both perpendicular to the length direction of the pad 100, and the first tension force F is opposite to the direction of the force of the second tension force F' and Both are parallel to the length direction of the pad 100.
  • the colloid 3 is purple An abbreviation of Ultraviolet Rays (UV) curing adhesive, which is irradiated with ultraviolet light to form the fixing portion 30.
  • UV Ultraviolet Rays
  • step Step 1 of the binding method of the flexible display module the colloid facing the first binding region 10 may be solidified to form the fixing portion 30 by the following steps:
  • UV curable glue Forming a UV curable glue on the transfer plate 2, the ultraviolet light uniformly illuminates the UV curable adhesive to form the fixing portion 30;
  • the transfer sheet 2 is uniformly coated with an ultraviolet light-curable adhesive, and the ultraviolet light-curable adhesive facing the first binding region 10 is irradiated only by strictly controlling the ultraviolet light to form the fixing portion 30.
  • the transfer plate 2 only needs to be temporarily fixed by the flexible display panel 1. Therefore, the colloid of the fixing portion 30 does not need to be completely cured, and the degree of curing only needs to ensure the first The binding zone 10 does not move relative to the transfer sheet 2. Therefore, when curing is performed, weak ultraviolet light curing can be used, and the irradiation time is appropriately reduced.
  • step 3 of the binding method of the flexible display module first attaching each of the binding surface of the first binding area 10 or the binding surface of the second binding area 40
  • the anisotropic conductive film (ACF) is then subjected to alignment and pre-compression of the first binding zone 10 and the second binding zone 40.
  • the anisotropic conductive film is used to realize electrical connection between the first binding region 10 and the second binding region 40.
  • the fixing portion 30 may be broken to separate the flexible display panel 1 and the transfer plate 2 by the following steps. :
  • a force F away from the flexible display panel 1 is applied to the periphery of the transfer sheet 2, and a region other than a portion of the transfer sheet 2 connected to the fixing portion 30 is separated from the flexible display panel 1 ;
  • the fixing portion 30 is heated to cause the fixing portion 30 to lose its viscosity, thereby separating the flexible display panel 1 and the transfer sheet 2.
  • the fixing portion 30 may be directly heated, or the transfer plate 2 may be heated, and the transfer sheet 2 transfers heat to the fixing portion 30, thereby heating the fixing portion 30.
  • the goal of. When the transfer sheet 2 is heated, most of the transfer sheet 2 is separated from the flexible display panel 1 to avoid the flexible display panel 1 due to high temperature when the transfer sheet 2 is heated. Flexible substrates, circuits, and electronics are compromised.
  • the colloid 3 since the colloid 3 only solidifies the colloid facing the first binding zone 10 to form the fixing portion 30, the colloid 3 includes even
  • the other portion than the fixing portion 30 is also easily torn by the force F, that is, the region of the transfer sheet 2 excluding the portion connected to the fixing portion 30 can be easily handled by the force F.
  • the flexible display panel 1 is separated.
  • the fixing portion 30, such as laser irradiation may also be broken by other non-contact methods.
  • a force F′ away from the transfer plate 2 can be simultaneously applied to the periphery of the flexible display panel 1 such that the transfer plate 2 is separated from the flexible display panel 1 More thorough, it is advantageous to smoothly peel the flexible display panel 1 from the transfer sheet 2.
  • the transfer plate 2 is a material that can be bent and rebounded under certain conditions and has good heat conductivity.
  • the transfer plate 2 can be made of a metal plate material or a soft glass material.
  • step 5 of the binding method of the flexible display module when the flexible display panel 1 is flattened, a sheet may be applied to the four corners of the flexible display panel 1.
  • the pressing force F tensions the flexible display panel 1 in the direction in which the arrow is directed (that is, in a direction away from the center of the flexible display panel 1).
  • the flat display panel 1 that is flattened maintains a good flatness, so that the area on the flexible display panel 1 that needs to be pressed can be completely adhered to the platform for pressing, so that the first A binding zone 10 and the second binding zone 40 can be uniformly heated during the pressing process, further ensuring the alignment precision and binding of the first binding zone 10 and the second binding zone 40. quality.

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Abstract

一种柔性显示模组的绑定方法，所述柔性显示模组包括具有第一绑定区（10）的柔性显示面板（1）和具有第二绑定区（40）的驱动集成电路（4），所述绑定方法包括：通过胶体（3）粘贴转印板（2）至所述柔性显示面板（1）背离所述第一绑定区（10）的表面（11）；固化正对所述第一绑定区（10）的胶体（3）以形成固定部（30）；展平所述转印板（2），以通过所述固定部（30）展平所述第一绑定区（10）；对位所述第二绑定区（40）与所述第一绑定区（10）；在第一温度下，预压合所述第一绑定区（10）与所述第二绑定区（40）；破坏所述固定部（30），分离所述柔性显示面板（1）和所述转印板（2）；展平所述柔性显示面板（1）；在第二温度下，压合所述第一绑定区（10）与所述第二绑定区（40），以形成柔性显示模组。通过该柔性显示模组的绑定方法形成的所述柔性显示模组良品率高。

Description

柔性显示模组的绑定方法 技术领域
本发明涉及柔性显示模组技术领域，特别涉及一种柔性显示模组的绑定方法。
背景技术
随着显示技术的发展，柔性显示模组将得到越来越多的应用。现今柔性显示模组主要包括柔性显示面板和对应的驱动电路，当柔性显示面板制作完成后，需要在柔性显示面板上通过导电介质连接外部驱动芯片，这个过程一般称之为绑定(bonding)。绑定工艺中用于实现连接的导电介质一般为ACF(Anisotropic Conductive Film，各向异性导电膜)，其特点是只在受到压力的方向上实现电性导通，在没有受到压力的其他方向不导通。然而如果直接在柔性显示面板上进行绑定，由于绑定工艺中的高温热压环境，容易使柔性显示面板发生变形，也就会导致出现绑定对位不准的现象，严重影响产品的质量。
为解决上述问题，业内人士通常先将柔性显示面板通过胶体贴合在刚性承载板上，然后再进行绑定，最后采用激光扫描的方法将柔性显示面板从刚性承载板上剥离下来。但是在剥离柔性显示面板时出现了新的问题：由于绑定工艺中本压的温度大多在150度～200度之间，会对现有设置在柔性显示面板和刚性承载板之间的胶体产生影响，使得位于绑定区域的胶体的固化状态发生变化，在后续使用激光剥离产生困难。此时需要加大激光量以促进胶体分解，但是加大激光照射量和时间会使得柔性显示面板的柔性基板发生碳化和形变，产生大量微粒，甚至影响柔性显示面板上的TFT(Thin Film Transistor，薄膜晶体管)器件和电路的性能，最终导致柔性显示模组的良品率偏低。
发明内容
本发明的实施例提供了一种良品率高的柔性显示模组的绑定方法。
为了实现上述目的，本发明实施方式采用如下技术方案：
提供一种柔性显示模组的绑定方法，所述柔性显示模组包括具有第一绑定区的柔性显示面板和具有第二绑定区的驱动集成电路，所述绑定方法包括：
通过胶体粘贴转印板至所述柔性显示面板背离所述第一绑定区的表面；
固化正对所述第一绑定区的胶体以形成固定部；
展平所述转印板，以通过所述固定部展平所述第一绑定区；
对位所述第二绑定区与所述第一绑定区；
在第一温度下，预压合所述第一绑定区与所述第二绑定区；
破坏所述固定部，分离所述柔性显示面板和所述转印板；
展平所述柔性显示面板；
在第二温度下，压合所述第一绑定区与所述第二绑定区。
优选的，所述通过胶体粘贴转印板至所述柔性显示面板背离所述第一绑定区的表面包括：
展平所述柔性显示面板并放置在转印机平台上，转印轮包括若干个真空吸孔，通过所述真空吸孔，吸附所述转印板至所述转印轮的外表面，当所述转印轮滚动压印到所述柔性显示面板时，有序地放开所述真空吸孔，使得所述转印板脱离所述转印轮，并贴合在所述柔性显示面板上。
优选的，所述通过胶体粘贴转印板至所述柔性显示面板背离所述第一绑定区的表面包括：
展平所述柔性显示面板，转印机平台包括若干个真空吸孔，通过所述真空吸孔，吸附所述柔性显示面板至所述转印机平台，转印轮外表面设置有所述转印板，当所述转印轮滚动压印到所述柔性显示面板时，有序地放开所述真空吸孔，使得所述柔性显示面板脱离所述转印机平台，并贴合在所述转印板上。
优选的，所述展平所述柔性显示面板包括：
所述第一绑定区上包括若干个长条形焊盘，在焊盘的长度方向上张紧所述焊盘。
优选的，所述张紧所述焊盘包括：
所述柔性显示面板包括相对的第一周边和第二周边，所述第一周边和所述第二周边均垂直于所述焊盘的长度方向；
在所述第一周边上施加第一张紧力，在所述第二周边上施加第二张紧力，所述第一张紧力与所述第二张紧力的力的方向相反，且均平行于所述焊盘的长度方向。
优选的，所述固化正对所述第一绑定区的胶体以形成固定部包括：
采用紫外光照射所述胶体，以形成所述固定部，所述胶体为紫外光固化胶。
优选的，采用紫外光照射所述胶体包括：所述紫外光均匀照射图案化的所述胶体。
优选的，采用紫外光照射所述胶体包括：紫外光以正对所述第一绑定区的角度，照射被均匀涂覆在所述转印板上的所述胶体。
优选的，所述破坏所述固定部，分离所述柔性显示面板和所述转印板包括：
在所述转印板的周边施加远离所述柔性显示面板的力，使所述转印板除与固定部连接的部分以外的区域均与所述柔性显示面板分离；
加热或者激光照射所述固定部，促使所述固定部失去粘性，进而分离所述柔性显示面板和所述转印板。
优选的，所述破坏所述固定部，分离所述柔性显示面板和所述转印板包括：
在所述转印板的周边施加远离所述柔性显示面板的力，同时在所述柔性显示面板的周边施加远离所述转印板的力，使所述转印板除与固定部连接的部分以外的区域均与所述柔性显示面板相分离；
加热或者激光照射所述固定部，促使所述固定部失去粘性，进而分离所述柔性显示面板和所述转印板。
相较于现有技术，通过本发明所述绑定方法制备柔性显示模组时：
所述柔性显示面板的所述第一绑定区通过固定部与所述转印板相互固定，因此可以通过展平所述转印板带动所述第一绑定区实现展平，从而不会出现所述柔性显示面板固有的因尺寸延展而导致绑定对位困难的问题，能够有效保障在此基础上进行预压合时，所述第一绑定区与所述第二绑定区的对位精确。完成预压合后，即通过破坏所述固定部以分离所述柔性显示面板和所述转印板，由于第一温度是低温温度，因此连接在所述柔性显示面板和所述转印板之间的所述固定部的固化状态不会发生变化，可以容易地破坏所述固定部以分离所述柔性显示面板和所述转印板，避免产生所述柔性显示面板内的柔性基板、电子器件和电路因加大激光照射量和时间而发生损伤的问题。最后，展平所述柔性显示面板的四周后进行压合，以形成柔性显示模组，被展开的所述柔性显示面板保持有良好的平整度，因此所述柔性显示面板上需要进行压合的区域可以完整地紧贴在用以进行压合的平台上，使所述第一绑定区和所述第二绑定区可以在压合过程中均匀受热，进一步保障了所述第一绑定区与所述第二绑定区的对 位精度和绑定质量。因此，通过上述绑定方法绑定完成的所述柔性显示模组良品率高。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种柔性显示模组的绑定方法中采用的柔性显示屏的结构示意图。
图2至图5为本发明实施例提供的一种柔性显示模组的绑定方法中多个步骤对应的制程的结构示意图。
图6为本发明实施例提供的一种柔性显示模组的绑定方法中柔性显示面板与所述转印板的一种贴合动作示意图。
图7为本发明实施例提供的一种柔性显示模组的绑定方法中柔性显示面板与转印板的另一种贴合动作示意图。
图8为本发明实施例提供的一种柔性显示模组的绑定方法中柔性显示面板在步骤Step1中被展平的动作示意图。
图9为本发明实施例提供的一种柔性显示模组的绑定方法中柔性显示面板自转印板上剥离的动作示意图。
图10为本发明实施例提供的一种柔性显示模组的绑定方法中柔性显示面板自转印板上剥离的另一种动作示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请一并参阅图1至图5，本发明实施例提供一种柔性显示模组的绑定方法，所述柔性显示模组包括具有第一绑定区10的柔性显示面板1(如图1所示) 和具有第二绑定区40的驱动集成电路4(如图3所示)，所述绑定方法主要包括如下步骤：
Step1：在所述柔性显示面板1背离所述第一绑定区10的表面11上通过胶体3贴合转印板2，并且固化正对所述第一绑定区10的胶体以形成固定部30，如图2所示，图中阴影部分代表所述固定部30。
Step2：展平所述转印板2，所述转印板2通过所述固定部30带动所述第一绑定区10实现展平。
Step3：对位所述第二绑定区40与所述第一绑定区10，并在第一温度下，预压合所述第二绑定区40与所述第一绑定区10，如图3所示。
Step4：破坏所述固定部，分离所述柔性显示面板1和所述转印板2，如图4所示。
Step5：展平所述柔性显示面板1，在第二温度下，压合所述第二绑定区40与所述第一绑定区10，以形成柔性显示模组。
在本实施例中，所述柔性显示面板1的所述第一绑定区10通过固定部30与所述转印板2相互固定，因此可以通过展平所述转印板2带动所述第一绑定区10实现展平，从而不会出现所述柔性显示面板1固有的因尺寸延展而导致绑定对位困难的问题，能够有效保障在此基础上进行预压合时，所述第一绑定区10与所述第二绑定区40的对位精确。完成预压合后，即通过破坏所述固定部30以分离所述柔性显示面板1和所述转印板2，由于预压合是在第一温度下进行的，定义所述第一温度为低温温度，包括但不限于60°至90°范围内的温度，因此连接在所述柔性显示面板1和所述转印板2之间的所述固定部30的固化状态不会发生变化，可以容易地破坏所述固定部30以分离所述柔性显示面板1和所述转印板2，避免产生所述柔性显示面板1内的柔性基板、电子器件和电路因加大激光照射量和时间而发生损伤的问题。最后，展平所述柔性显示面板1，并在第二温度下压合所述第二绑定区40与所述第一绑定区10(所述第二温度高于所述第一温度，包括但不限于150°至200°范围内的温度)，以形成柔性显示模组，被展平的所述柔性显示面板1保持有良好的平整度，因此所述柔性显示面板1上需要进行压合的区域可以完整地紧贴在用以进行压合的平台上，使所述第一绑定区10和所述第二绑定区40可以在压合过程中均匀受热，进一步保障了所述第一绑定区10与所述第二绑定区40的对位精 度和绑定质量。因此，通过上述绑定方法绑定完成的所述柔性显示模组良品率高。
应当理解的是，本实施例所述展平，包括但不限于以张开、展开、拉开等方式使被展平的结构(例如所述转印板2、所述第一绑定区10或者所述柔性显示面板1)实现平整状态。
作为本发明的一种优选实施例，请参阅图6，在所述柔性显示模组的绑定方法的步骤Step1中，所述柔性显示面板1与所述转印板2可以在转印机20中通过以下步骤实现贴合：
展平所述柔性显示面板1，并放置在所述转印机20的转印机平台21上，所述转印机20的转印轮22通过若干个真空吸孔将所述转印板2吸附在所述转印轮22的外表面，当所述转印轮22滚动压印到所述柔性显示面板1时，有序地放开所述真空吸孔，使得所述转印板2脱离所述转印轮22贴合到所述柔性显示面板1上。如图6所示，图中的弧形线头和直线箭头分别表示所述转印轮22和所述转印机平台21的运动方向。
通过上述步骤实现所述柔性显示面板1与所述转印板2的贴合时，贴合后的转印板2和所述柔性显示面板1已经能够处于一个较好的平整度了，因此在步骤Step2中的展平动作更够更加顺利地进行。应当理解的是，虽然在所述柔性显示面板1与所述转印板2贴合后已经平整地放置在转印机平台21上了，但是所述柔性显示模组的绑定方法的下一步是在绑定机中进行的，因此会对所述柔性显示面板1和所述转印板2进行移动，在移动过程中可能出现弯折等情况，因此在进行绑定对位前，仍然需要进行步骤Step2中的展平动作用以保证绑定对位工序中对位的精准度。
进一步的，完成所述柔性显示面板1与所述转印板2的贴合后，可以先将所述转印板2自所述转印机平台21上取下来，再固化正对所述第一绑定区10的胶体以形成固定部30，也可以直接在所述转印机平台21上进行固化动作。优选的，先对所述第一绑定区10的胶体进行固化以形成固定部30，然后再从所述转印机平台21上取下所述转印板2和所述柔性显示面板1，保证所述第一绑定区10与所述转印板2相互固定，避免所述第一绑定区10在所固定部30未形成前相对于所述转印板2发生移动，从而导致后续绑定对位时发生错位。
作为本发明的另一种优选实施例，请参阅图7，在所述柔性显示模组的绑定方法的步骤Step1中，所述柔性显示面板1与所述转印板2也可以在转印机20中通过以下步骤实现贴合：
展平所述柔性显示面板1，所述柔性显示面板1被若干个真空吸孔吸附在所述转印机20的转印机平台21上，所述转印机20的转印轮22外表面设置有所述转印板2，当所述转印轮22滚动压印到所述柔性显示面板1时，有序地放开所述真空吸孔，使得所述柔性显示面板1脱离所述转印机平台贴合到所述转印板2上。
应当理解的是，完成所述柔性显示面板1与所述转印板2的贴合后，可以先将所述转印板2自所述转印轮22上取下来，再固化正对所述第一绑定区10的胶体以形成固定部30，也可以直接在所述转印轮22上进行固化动作。优选的，先对所述第一绑定区10的胶体进行固化以形成固定部30，然后再从所述转印轮22上取下所述转印板2和所述柔性显示面板1，保证所述第一绑定区10与所述转印板2相互固定，避免所述第一绑定区10在所固定部30未形成前相对于所述转印板2发生移动，从而导致后续绑定对位时发生错位。
进一步的，在所述柔性显示模组的绑定方法的步骤Step1中，首先展平所述柔性显示面板1，然后与所述转印板2贴合，可以保证所述第一绑定区10在平整的状态下与所述转印板2相互固定，这样在后续工艺中，即使不再对所述柔性显示面板1施加张紧力，所述第一绑定区10也可以因为与所述转印板2相固定而保持平整状态，有利于后续绑定对位工序的顺利进行。
同时，请参阅图8，所述第一绑定区10上包括若干个长条形焊盘100。当所述柔性显示面板1被展平时，所述焊盘100在焊盘的长度方向(如图8中双向箭头所示方向)上被张紧。由于所述焊盘100在其长度方向上被张紧，因此相邻的焊盘100之间的间距不会在该张紧动作中发生变化，有利于后续绑定对位工序的顺利进行。具体而言，可以在所述柔性显示面板1的相对的第一周边13和第二周边14上分别施加第一张紧力F和第二张紧力F’以张紧所述柔性显示面板1，所述第一周边13和所述第二周边14均垂直于所述焊盘100的长度方向，所述第一张紧力F与所述第二张紧力F’的力的方向相反且均平行于所述焊盘100的长度方向。
进一步的，在所述柔性显示模组的绑定方法的步骤Step1中，胶体3为紫 外光(Ultraviolet Rays，UV)固化胶的缩写，利用紫外光照射所述紫外光固化胶以形成所述固定部30。
进一步的，在所述柔性显示模组的绑定方法的步骤Step1中，可以通过以下步骤实现固化正对所述第一绑定区10的胶体以形成固定部30：
在所述转印板2上形成图案化的紫外光固化胶，所述紫外光均匀照射所述紫外光固化胶以形成所述固定部30；
或者，所述转印板2上均匀涂覆紫外光固化胶，通过严格控制所述紫外光仅照射正对所述第一绑定区10的紫外光固化胶以形成所述固定部30。
应当理解的是，所述转印板2只需要所述柔性显示面板1实现临时的固定即可，因此上述固定部30的胶体并不需要被完全固化，其固化程度只需要保证所述第一绑定区10不会相对于所述转印板2移动即可。因此，在进行固化时，可以使用弱紫外光固化，并适当减少照射时间。
进一步的，所述柔性显示模组的绑定方法的步骤Step3中，首先在所述第一绑定区10的绑定表面或者在所述第二绑定区40的绑定表面上贴附各向异性导电膜(Anisotropic Conductive Film，ACF)，然后再进行所述第一绑定区10和所述第二绑定区40的对位和预压合。所述各向异性导电膜用以实现所述第一绑定区10和所述第二绑定区40的电连接。
进一步的，请参阅图9，在所述柔性显示模组的绑定方法的步骤Step4中，可以通过如下步骤破坏所述固定部30，以分离所述柔性显示面板1和所述转印板2：
在所述转印板2的周边施加远离所述柔性显示面板1的力F，使所述转印板2除与所述固定部30连接的部分以外的区域均与所述柔性显示面板1分离；
加热所述固定部30，促使所述固定部30失去粘性，从而分离所述柔性显示面板1和所述转印板2。
在上述步骤中，可以通过直接加热所述固定部30，也可以通过加热所述转印板2，所述转印板2将热量传递至所述固定部30，从而达到加热所述固定部30的目的。加热所述转印板2时，先将所述转印板2大部分区域与所述柔性显示面板1相分离，可以避免在加热转印板2的时候，由于高温导致所述柔性显示面板1的柔性基板、电路和电子器件受到损害。再者，胶体3由于仅固化正对所述第一绑定区10的胶体以形成固定部30，因此胶体3即使包括了除 固定部30以外的其他部分，也容易在力F的作用下被撕裂，也即所述转印板2除与固定部30连接的部分以外的区域均能够在力F的作用下容易地与所述柔性显示面板1分离。
应当理解的是，在本发明实施例中，也可以通过其他非接触式的方法破坏所述固定部30，例如激光照射。
进一步的，请一并参阅图10，可以同时在所述柔性显示面板1的周边施加远离所述转印板2的力F’，使得所述转印板2与所述柔性显示面板1分离地更加彻底，有利于顺利将所述柔性显示面板1自所述转印板2上剥离。
进一步的，所述转印板2为一种在一定情况下可以弯曲和回弹并且导热良好的材质，优选的，所述转印板2可以为金属板材质或者软玻璃材质。
优选的，如图5所示，在所述柔性显示模组的绑定方法的步骤Step5中，展平所述柔性显示面板1时，可以在所述柔性显示面板1的四个角上施加张紧力F，按照箭头指向的方向(也即背离所述柔性显示面板1中心的方向)张紧所述柔性显示面板1。被展平的所述柔性显示面板1保持有良好的平整度，因此所述柔性显示面板1上需要进行压合的区域可以完整地紧贴在用以进行压合的平台上，使所述第一绑定区10和所述第二绑定区40可以在压合过程中均匀受热，进一步保障了所述第一绑定区10与所述第二绑定区40的对位精度和绑定质量。
以上对本发明实施例所提供的所述柔性显示模组的绑定方法进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (10)

  1. 一种柔性显示模组的绑定方法，所述柔性显示模组包括具有第一绑定区的柔性显示面板和具有第二绑定区的驱动集成电路，其特征在于，所述绑定方法包括：
    通过胶体粘贴转印板至所述柔性显示面板背离所述第一绑定区的表面；
    固化正对所述第一绑定区的胶体以形成固定部；
    展平所述转印板，以通过所述固定部展平所述第一绑定区；
    对位所述第二绑定区与所述第一绑定区；
    在第一温度下，预压合所述第一绑定区与所述第二绑定区；
    破坏所述固定部，分离所述柔性显示面板和所述转印板；
    展平所述柔性显示面板；
    在第二温度下，压合所述第一绑定区与所述第二绑定区。
  2. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述通过胶体粘贴转印板至所述柔性显示面板背离所述第一绑定区的表面包括：
    展平所述柔性显示面板并放置在转印机平台上，转印轮包括若干个真空吸孔，通过所述真空吸孔，吸附所述转印板至所述转印轮的外表面，当所述转印轮滚动压印到所述柔性显示面板时，有序地放开所述真空吸孔，使得所述转印板脱离所述转印轮，并贴合在所述柔性显示面板上。
  3. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述通过胶体粘贴转印板至所述柔性显示面板背离所述第一绑定区的表面包括：
    展平所述柔性显示面板，转印机平台包括若干个真空吸孔，通过所述真空吸孔，吸附所述柔性显示面板至所述转印机平台，转印轮外表面设置有所述转印板，当所述转印轮滚动压印到所述柔性显示面板时，有序地放开所述真空吸孔，使得所述柔性显示面板脱离所述转印机平台，并贴合在所述转印板上。
  4. 如权利要求2或者3所述的柔性显示模组的绑定方法，其特征在于，所述展平所述柔性显示面板包括：
    所述第一绑定区上包括若干个长条形焊盘，在焊盘的长度方向上张紧所述焊盘。
  5. 如权利要求4所述的柔性显示模组的绑定方法，其特征在于，所述张 紧所述焊盘包括：
    所述柔性显示面板包括相对的第一周边和第二周边，所述第一周边和所述第二周边均垂直于所述焊盘的长度方向；
    在所述第一周边上施加第一张紧力，在所述第二周边上施加第二张紧力，所述第一张紧力与所述第二张紧力的力的方向相反，且均平行于所述焊盘的长度方向。
  6. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述固化正对所述第一绑定区的胶体以形成固定部包括：
    采用紫外光照射所述胶体，以形成所述固定部，所述胶体为紫外光固化胶。
  7. 如权利要求6所述的柔性显示模组的绑定方法，其特征在于，采用紫外光照射所述胶体包括：所述紫外光均匀照射图案化的所述胶体。
  8. 如权利要求6所述的柔性显示模组的绑定方法，其特征在于，采用紫外光照射所述胶体包括：紫外光以正对所述第一绑定区的角度，照射被均匀涂覆在所述转印板上的所述胶体。
  9. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述破坏所述固定部，分离所述柔性显示面板和所述转印板包括：
    在所述转印板的周边施加远离所述柔性显示面板的力，使所述转印板除与固定部连接的部分以外的区域均与所述柔性显示面板分离；
    加热或者激光照射所述固定部，促使所述固定部失去粘性，进而分离所述柔性显示面板和所述转印板。
  10. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述破坏所述固定部，分离所述柔性显示面板和所述转印板包括：
    在所述转印板的周边施加远离所述柔性显示面板的力，同时在所述柔性显示面板的周边施加远离所述转印板的力，使所述转印板除与固定部连接的部分以外的区域均与所述柔性显示面板相分离；
    加热或者激光照射所述固定部，促使所述固定部失去粘性，进而分离所述柔性显示面板和所述转印板。
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US20180168050A1 (en) 2018-06-14
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