WO2017095181A1 - Dispositif d'éclairage à diodes électroluminescentes - Google Patents

Dispositif d'éclairage à diodes électroluminescentes Download PDF

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Publication number
WO2017095181A1
WO2017095181A1 PCT/KR2016/014097 KR2016014097W WO2017095181A1 WO 2017095181 A1 WO2017095181 A1 WO 2017095181A1 KR 2016014097 W KR2016014097 W KR 2016014097W WO 2017095181 A1 WO2017095181 A1 WO 2017095181A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat sink
auxiliary heat
led
substrate
Prior art date
Application number
PCT/KR2016/014097
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English (en)
Korean (ko)
Inventor
방연호
박승곤
빈진혁
Original Assignee
주식회사 아모센스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 아모센스 filed Critical 주식회사 아모센스
Priority to CN201680070900.0A priority Critical patent/CN108291692B/zh
Publication of WO2017095181A1 publication Critical patent/WO2017095181A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

Definitions

  • the present invention relates to an LED lighting device, and more particularly to an LED lighting device (LED LIGHTING DEVICE) having a heat sink that emits heat generated when driving the LED module for illumination.
  • LED LIGHTING DEVICE LED lighting device having a heat sink that emits heat generated when driving the LED module for illumination.
  • An LED lighting apparatus is a lighting apparatus which uses LED as a light source.
  • the LED lighting device greatly varies overall light efficiency and product life by managing heat generated from a light source.
  • a conventional LED lighting apparatus includes an LED module and a heat sink.
  • the LED module is a substrate on which a plurality of LED elements 12 are mounted.
  • the substrate may be composed of a printed circuit board or a flexible printed circuit board.
  • the heat sink contacts the LED module to radiate heat generated by the LED module to the outside.
  • the heat sink is formed of aluminum (Al) and manufactured by die casting or extrusion.
  • the heat sink is made of a composite material in which a thermally conductive filler such as metal, ceramic, carbon, and the like are mixed.
  • Heat sinks made of composite materials can achieve the thermal conductivity required for general electronics (eg, about 1 to 30 W / mK), but it is difficult to replace aluminum having a thermal conductivity of about 230 W / mK. have.
  • a heat transfer adhesive is interposed between a heat sink and a substrate for transferring heat generated from the LED module to the heat sink.
  • the heat transfer adhesive is a thermal tape, thermal grease, etc. are mainly used, there is a problem that it is difficult to implement a constant heat dissipation performance due to the difference in heat dissipation effect according to the thermal conductivity, thickness and adhesive technology.
  • the heat sink is made of a composite material, but the area corresponding to the LED module is formed of another material having a higher thermal conductivity than the composite material, compared to the aluminum heat sink It is an object of the present invention to provide an LED lighting device that is inexpensive, light and secures equal or more heat dissipation performance.
  • an object of the present invention is to provide an LED lighting device that is manufactured by the insert molding method of inserting the substrate mounted with the LED module into the heat sink to implement a constant heat dissipation performance without using a heat transfer adhesive.
  • the LED lighting apparatus is an LED module mounted with a plurality of LED elements on one surface, the insert molded in the heat sink and heat sink coupled to the other surface of the LED module, one end of the LED An auxiliary heat dissipation substrate in contact with the other side of the module, wherein the auxiliary heat dissipation substrate has a higher thermal conductivity than the heat sink.
  • the heat sink may be a composite material in which at least one of a graphite filler and a carbon nanotube filler is mixed with a polymer material.
  • the auxiliary heat dissipation substrate may be any one of aluminum, copper, silver, and nickel, or may be a mixed material in which two or more of aluminum, copper, silver, and nickel are mixed.
  • the auxiliary heat dissipation substrate may be in contact with the other surface opposite to the region where the LED element is formed.
  • the auxiliary heat dissipation substrate may be formed in a column shape divided into upper, lower, and central portions, and a length of at least one of the upper and lower portions in a horizontal direction may be greater than that of the central portion.
  • the auxiliary heat dissipation substrate may have irregularities formed on at least one outer circumference of the upper and lower portions.
  • the auxiliary heat dissipation substrate may be formed in a plate shape, and one surface thereof may be exposed to the surface of the heat sink.
  • the auxiliary heat dissipation substrate may have at least one of at least one bend and a groove on an outer circumference thereof.
  • the LED lighting apparatus may further include an auxiliary heat dissipation extension substrate which is insert molded into the heat sink and one end of which is disposed on the other side of the auxiliary heat dissipation substrate.
  • an auxiliary heat dissipation extension substrate which is insert molded into the heat sink and one end of which is disposed on the other side of the auxiliary heat dissipation substrate.
  • at least a portion of the auxiliary heat dissipation extension substrate may be exposed to the outside of the protrusion of the heat sink.
  • the LED lighting apparatus includes an LED module having a plurality of LED elements mounted on one surface and a heat sink coupled to the other surface of the LED module, wherein the LED module is connected to the heat sink. It is insert molded and has a higher thermal conductivity than the heat sink.
  • the LED module may include a base substrate that is a metal substrate including at least one of aluminum and copper.
  • the LED lighting apparatus may be formed of a metal material having a higher thermal conductivity than that of the heat sink and insert molded into the heat sink, and may further include an auxiliary heat dissipation substrate having one end contacting the other surface of the LED module.
  • the auxiliary heat dissipation substrate may be one of aluminum, copper, silver, and nickel, or may be a mixed material in which two or more of aluminum, copper, silver, and nickel are mixed.
  • a part of the other end of the auxiliary heat dissipation substrate may be exposed to the outside of the protrusion of the heat sink.
  • the auxiliary heat dissipation substrate may be formed in a column shape divided into upper, lower, and central portions, and a length of at least one of the upper and lower portions in a horizontal direction may be greater than that of the central portion.
  • the auxiliary heat dissipation substrate may have irregularities formed on at least one outer circumference of the upper and lower portions.
  • the LED lighting apparatus is made of a composite material heat sink, but by forming a region corresponding to the LED module of a different material having a higher thermal conductivity than the composite material, it is inexpensive compared to the heat sink formed of aluminum material as a whole While light, there is an effect that can ensure a high heat dissipation performance than the heat sink formed of a composite material.
  • the LED lighting device can secure the heat dissipation performance required by the electronic components in general, it is possible to prevent the light efficiency degradation due to deterioration, and to extend the life of the lighting product.
  • the LED lighting device has an effect that can efficiently transfer the heat generated from the substrate to the heat sink without the use of a heat transfer adhesive.
  • the LED lighting apparatus inserts an auxiliary heat dissipation substrate having a higher thermal conductivity than that of the heat sink into the heat sink, thereby ensuring a higher heat capacity than the heat sink of the composite material and improving heat transfer efficiency.
  • the LED lighting device has the effect of reducing the manufacturing cost, raw material cost by simplifying the manufacturing process.
  • 1 is a view for explaining a conventional LED lighting device.
  • FIG. 2 is a view for explaining the LED lighting apparatus according to the first embodiment of the present invention.
  • FIG. 3 is a view for explaining the heat sink of FIG.
  • 4 and 5 are diagrams for explaining an example of the auxiliary heat dissipation substrate of FIG.
  • FIG. 6 is a view for explaining the LED lighting apparatus according to the first embodiment of the present invention.
  • FIG. 7 to 9 are views for explaining another example of the auxiliary heat dissipation substrate of FIG. 2.
  • FIG. 10 and 11 are views for explaining still another example of the auxiliary heat dissipation substrate of FIG.
  • FIGS. 12 to 14 are views for explaining the LED lighting apparatus according to a second embodiment of the present invention.
  • the LED lighting apparatus includes an LED module 110, a heat sink 130, an auxiliary heat dissipation substrate 150, a gasket 170, and a reflective member 190. It is configured by.
  • the LED module 110 includes a plurality of LED elements 114 mounted on the base substrate 112.
  • the base substrate 112 is an example of a printed circuit board or a flexible printed circuit board on which a circuit pattern is formed.
  • the heat sink 130 is a heat dissipation member for dissipating heat generated by the LED module 110 and is coupled to one surface of the LED module 110. Referring to FIG. 3, the heat sink 130 includes a main body 131 and a protrusion 132.
  • the main body 131 is formed in a plate shape of a composite material and is coupled to one surface of the LED module 110.
  • the main body 131 may have a first insertion groove 133 into which the LED module 110 is inserted.
  • the main body 131 is spaced apart from the first insertion groove 133 by a predetermined interval, and is wound around the outer circumference of the first insertion groove 133 to be coupled to the second insertion groove 134, one surface into which the gasket 170 is inserted.
  • a plurality of fastening holes 135 for fixing the gasket 170 and the reflective member 190 may be formed.
  • the protrusion 132 is formed on the other surface of the main body 131.
  • the protrusion 132 may be formed in a pin shape to maximize the air contact area, or may be formed in a plate shape vertically coupled to the main body 131. In this case, the shape of the protrusion 132 may be changed due to various factors such as heat dissipation performance and space.
  • the main body 131 and the protrusion 132 may be formed of the same composite material. That is, the main body 131 and the protrusion 132 are formed of a composite material in which a filler such as metal, ceramic, carbon, or the like is mixed with a polymer.
  • the composite material is an example of mixing a graphite filler or a carbon nanotube filler with a polymer.
  • graphite is a material in which a metal nano fusion is mixed with graphite.
  • Fillers ie, graphite, carbon nanotubes
  • the auxiliary heat dissipation substrate 150 is inserted and mounted inside the heat sink 130 through an insert molding process. That is, the auxiliary heat dissipation substrate 150 is insert molded and inserted into the main body 131 of the heat sink 130. One end of the auxiliary heat dissipation substrate 150 may be exposed to the surface of the main body 131 of the heat sink 130 (that is, the bottom surface of the first insertion groove 133) to directly contact the LED module 110. At this time, the auxiliary heat dissipation substrate 150 is in contact with a portion of the other surface of the LED module 110 opposite to the region where the LED element 114 is formed.
  • the auxiliary heat dissipation substrate 150 is formed of a metal material having a higher thermal conductivity than the heat sink 130. At this time, the auxiliary heat dissipation substrate 150 is one of copper (Cu), aluminum (Al), silver (Ag) and nickel (Ni), or an example that is formed of a mixed material of two or more mixed.
  • the auxiliary heat dissipation substrate 150 is inserted and mounted in the heat sink 130 through an insert molding process.
  • one end of the auxiliary heat dissipation substrate 150 may be exposed to the surface of the main body 131 of the heat sink 130 (that is, the bottom surface of the first insertion groove 133) to be in direct contact with the LED module 110. .
  • the auxiliary heat dissipation substrate 150 is formed in a dumbbell shape in which a recess is formed in the center to increase the bonding force with the heat sink 130. At this time, the auxiliary heat dissipation substrate 150 may have a bend formed on the outer circumference thereof and a slit may be formed therein to widen the bonding force and the contact area with the heat sink 130.
  • the auxiliary heat dissipation substrate 150 is formed in a pillar shape divided into an upper portion 151, a lower portion 152, and a central portion 153.
  • the upper portion 151, the lower portion 152 and the central portion 153 may be integrally formed, or may be combined after being manufactured separately.
  • the width (diameter) of the upper part 151 and the lower part 152 of the auxiliary heat dissipation base material 150 is formed to be larger than the width (diameter) of the central part 153, so that the groove is formed on the outer circumference of the central part 153. do.
  • irregularities such as a sawtooth shape may be formed on the outer circumferences of the upper part 151 and the lower part 152 of the auxiliary heat dissipation base material 150.
  • the auxiliary heat dissipation substrate 150 may have a slit 154 (or a hole) passing through at least one of the upper portion 151, the lower portion 152, and the central portion 153 to increase the bonding force with the heat sink 130.
  • the auxiliary heat dissipation substrate 150 has at least one surface of the upper portion 151 and the lower portion 152 exposed to the surface of the body portion 131 of the heat sink 130 (that is, the bottom surface of the first insertion groove 133). To be in direct contact with the LED module 110.
  • the heat sink 130 forms an auxiliary heat dissipation substrate 150 to which the LED module 110 is in direct contact, thereby increasing the thermal diffusion area to lower the temperature of the LED elements 114.
  • the heat sink 130 applied to the LED lighting apparatus according to the embodiment of the present invention is about 81 grams lighter in weight than the heat sink 130 made of aluminum alone, and is formed of only a composite material. Compared to the sink 130, heat dissipation characteristics are improved by about 5 ° C. That is, the heat sink 130 applied to the LED lighting apparatus according to the embodiment of the present invention has the effect of reducing the weight and heat dissipation characteristics.
  • the auxiliary heat dissipation substrate 150 may be formed in a plate shape having a predetermined area. That is, the auxiliary heat dissipation substrate 150 is formed in a plate shape in order to increase the area in contact with the heat sink 130 to secure heat capacity. At this time, the auxiliary heat dissipation substrate 150 is inserted and mounted inside the heat sink 130 through an insert molding process.
  • the auxiliary heat dissipation substrate 150 is inserted and mounted in the main body 131 through an insert molding process.
  • the auxiliary heat dissipation substrate 150 may be formed with a plurality of bent portions 155 and coupling holes 156 to increase coupling force with the heat sink 130 during insert molding.
  • One surface of the auxiliary heat dissipation substrate 150 is exposed to the surface of the main body 131 of the heat sink 130 (that is, the bottom surface of the first insertion groove 133) and is in direct contact with the LED module 110.
  • the LED lighting apparatus may further include a plurality of auxiliary heat dissipation extension substrates 160 having a dumbbell shape in order to increase the bonding force and the contact area of the auxiliary heat dissipation substrate 150 and the heat sink 130. Can be.
  • the auxiliary heat dissipation extension substrate 160 may be integrally formed with the auxiliary heat dissipation substrate 150 through a die casing process, or may be coupled to the auxiliary heat dissipation substrate 150 through a riveting process.
  • the auxiliary heat dissipation extension substrate 160 is insert molded into the heat sink 130, and one end of the auxiliary heat dissipation extension substrate 160 is disposed on the bottom surface of the auxiliary heat dissipation substrate 150 to contact the other surface of the auxiliary heat dissipation substrate 150. In this case, the other end portion of the auxiliary heat dissipation extension substrate 160 may be exposed to the outside through the protrusion 132 of the heat sink 130.
  • auxiliary heat dissipation extension substrate 160 is inserted into the main body 131 of the heat sink 130, and the other end thereof is inserted into the protrusion 132 of the heat sink 130.
  • one end of the auxiliary heat dissipation base material 150 is exposed to the surface of the main body 131 (that is, the bottom surface of the first insertion groove 133) to be in direct contact with the LED module 110.
  • a portion of the other end of the 160 may be exposed to the outside of the protrusion 132 of the heat sink 130.
  • the heat sink 130 increases the area in which the auxiliary heat dissipation substrate 150 and the LED module 110 are coupled to each other, thereby increasing the thermal diffusion area to lower the temperature of the LED element 114.
  • the gasket 170 has a coupling protrusion formed on one surface thereof, and the coupling protrusion is inserted into the second insertion groove 134 of the main body 131. In this case, the gasket 170 blocks water from flowing into the LED module 110 mounted on the heat sink 130.
  • the reflective member 190 is coupled to the upper portion 151 of the gasket 170 to reflect the light generated from the LED module 110 to the outside.
  • the gasket 170 and the reflective member 190 are coupled to the heat sink 130 through a coupling member (not shown).
  • the coupling member is a nut and bolt as an example, one end of the bolt is the heat sink 130 (that is, the fastening hole 135 formed in the body portion 131), the gasket 170 and the reflective member 190 After passing through, it is fastened with the nut.
  • the LED lighting apparatus includes the LED module 210, the heat sink 230, the gasket 250, and the reflective member 270.
  • the gasket 250 and the reflective member 270 are the same as the gasket 170 and the reflective member 190 of the first embodiment described above, a detailed description thereof will be omitted.
  • the LED module 210 includes a plurality of LED elements 214 mounted on the base substrate 212. At this time, the LED module 210 is composed of a printed circuit board made of a metal material with a circuit pattern. In the LED module 210, a plurality of LED elements 214 are mounted on the base substrate 212 through an SMT process.
  • the base substrate 212 is formed of a metal material having a higher thermal conductivity than the heat sink 230.
  • the base substrate 212 is an example of a metal substrate containing at least one of aluminum (Al), copper (Cu).
  • the base substrate 212 may be laminated with various material substrates in addition to the metal substrate, and a circuit pattern (not shown) made of metal is formed on one surface on which the LED element 214 is mounted.
  • the heat sink 230 serves to dissipate heat generated by the LED module 210.
  • the heat sink 230 is formed by inserting the LED module 210 is integrally formed with the LED module 210.
  • the heat sink 230 includes a main body 231 and a protrusion 232.
  • the main body 231 is formed in a plate shape of a composite material.
  • the main body 231 is integrally formed by insert molding the LED module 210 on one surface thereof.
  • the body portion 231 may be formed through the plurality of fastening holes 233 for fixing the insertion groove, the gasket 250 and the reflective member 270 into which the gasket 250 is inserted.
  • the body portion 231 has a plurality of protrusions 232 formed on the other surface thereof.
  • the protrusion 232 may be formed in a pin shape to maximize the air contact area, or may be formed in a plate shape vertically coupled with the main body 231.
  • the shape of the protrusion 232 may be changed due to various factors such as heat dissipation performance and space.
  • the main body 231 and the protrusion 232 may be formed of the same material. That is, the main body 231 and the protrusion 232 are formed of a composite material in which a filler such as metal, ceramic, carbon, or the like is mixed with a polymer.
  • the composite material is an example of mixing a graphite filler or a carbon nanotube filler with a polymer.
  • graphite is a material in which a metal nano fusion is mixed with graphite
  • the heat sink 230 may have a filler (that is, graphite and carbon nanotubes) of about 10% or more and 70% or less.
  • the LED lighting apparatus may further include an auxiliary heat dissipation substrate 290 inserted into the heat sink 230.
  • the auxiliary heat dissipation substrate 290 is inserted and mounted inside the body 231 through an insert molding process.
  • the auxiliary heat dissipation substrate 290 is formed of a metal material having a higher thermal conductivity than that of the heat sink 230.
  • the auxiliary heat dissipation substrate 290 is one of copper (Cu), aluminum (Al), silver (Ag) and nickel (Ni), or an example that is formed of a mixed material of two or more mixed.
  • One end of the auxiliary heat dissipation substrate 290 may be exposed to the outside of the main body 231 of the heat sink 230 to be in direct contact with the LED module 210.
  • the other end of the auxiliary heat dissipation substrate 290 may be exposed to the outside of the protrusion 232 of the heat sink 230.
  • the auxiliary heat dissipation substrate 290 is formed in a pillar shape divided into an upper portion, a lower portion, and a central portion. At this time, it may be formed integrally with the upper, lower and central portions, or may be combined after being manufactured separately.
  • Widths (diameters) of the upper and lower portions of the auxiliary heat dissipation base material 290 are formed in a dumbbell shape having grooves formed on the outer periphery of the central part as the width (diameter) of the auxiliary heat dissipation base material 290 is greater than that of the central part.
  • irregularities such as a sawtooth shape may be formed on outer peripheries of the upper and lower portions of the auxiliary heat dissipation substrate 290.
  • the heat sink 230 increases the area where the auxiliary heat dissipation substrate 290 and the LED module 210 are coupled to each other, thereby increasing the thermal diffusion area, thereby lowering the temperature of the LED element 214.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un dispositif d'éclairage à diodes électroluminescentes (DEL), pour lequel le dissipateur de chaleur est réalisé en un matériau composite, et une zone, qui correspond au module à DEL, est formée à l'aide d'un matériau présentant une conductivité thermique plus élevée que celle du matériau composite de telle sorte que, par comparaison avec un dissipateur de chaleur réalisé en aluminium, il soit moins coûteux et plus léger, et garantisse des performances de rayonnement thermique égales ou meilleures. Le dispositif d'éclairage à DEL selon la présente invention comprend : un module à DEL ayant une pluralité d'éléments à DEL montés sur une surface de ce dernier; un dissipateur de chaleur couplé à l'autre surface du module à DEL; et un substrat auxiliaire à rayonnement de chaleur, qui est inséré dans le dissipateur de chaleur, et dont une extrémité vient en contact avec l'autre surface du module à DEL, le substrat auxiliaire à rayonnement de chaleur présentant une conductivité thermique supérieure à celle du dissipateur de chaleur.
PCT/KR2016/014097 2015-12-02 2016-12-02 Dispositif d'éclairage à diodes électroluminescentes WO2017095181A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201680070900.0A CN108291692B (zh) 2015-12-02 2016-12-02 Led照明装置

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2015-0170926 2015-12-02
KR20150170864 2015-12-02
KR10-2015-0170864 2015-12-02
KR20150170927 2015-12-02
KR10-2015-0170927 2015-12-02
KR20150170926 2015-12-02

Publications (1)

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WO2017095181A1 true WO2017095181A1 (fr) 2017-06-08

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PCT/KR2016/014097 WO2017095181A1 (fr) 2015-12-02 2016-12-02 Dispositif d'éclairage à diodes électroluminescentes

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KR (1) KR101765857B1 (fr)
CN (1) CN108291692B (fr)
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KR102063612B1 (ko) * 2018-05-08 2020-02-11 이호창 열전도도가 향상된 히트싱크를 갖는 가로등 조명 기구
CN108954080A (zh) * 2018-06-04 2018-12-07 芜湖徽福电子科技有限公司 一种基于条形光源的防爆型led光源
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KR102305661B1 (ko) * 2019-10-01 2021-09-28 김덕곤 고효율 방열기능이 구비된 led 조명장치 및 그 구성방법
WO2021100888A1 (fr) * 2019-11-18 2021-05-27 한국생산기술연구원 Module de dissipation de chaleur comprenant une couche de dissipation de chaleur comprenant un composite métal-nano fritté lumineux, et dispositif d'éclairage le comprenant

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KR20170065011A (ko) 2017-06-12

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