WO2011059268A2 - Appareil d'éclairage à del du type ampoule électrique - Google Patents

Appareil d'éclairage à del du type ampoule électrique Download PDF

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Publication number
WO2011059268A2
WO2011059268A2 PCT/KR2010/008010 KR2010008010W WO2011059268A2 WO 2011059268 A2 WO2011059268 A2 WO 2011059268A2 KR 2010008010 W KR2010008010 W KR 2010008010W WO 2011059268 A2 WO2011059268 A2 WO 2011059268A2
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
dissipation member
power
heat
led package
Prior art date
Application number
PCT/KR2010/008010
Other languages
English (en)
Korean (ko)
Other versions
WO2011059268A3 (fr
Inventor
정상동
이재영
윤태기
Original Assignee
주식회사 아모럭스
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Publication of WO2011059268A2 publication Critical patent/WO2011059268A2/fr
Publication of WO2011059268A3 publication Critical patent/WO2011059268A3/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a bulb-type LED lighting device, in particular, when assembling the connection between the LED package and the power board in a simple one-step, can effectively dissipate the internal heat generation, and the bulb-type LED lighting can be formed in a compact overall size Relates to a device.
  • white light sources using LEDs have been spotlighted as new lighting sources because of their excellent luminous efficiency, high luminous intensity, high speed response and long life. That is, the illuminance of 40 to 60W incandescent light bulbs can be replaced with 5-10W power using about 80 LEDs, and the 100W incandescent light bulb can implement the same illuminance at about 13W power using 128 LEDs. Therefore, the power consumed to implement the same illuminance environment is very low compared to the fluorescent lamp as well as the conventional "A" type incandescent lamp.
  • the lighting LED having the above characteristics is generated a lot of heat in the process of converting electrical energy into light, this heat not only lowers the light emitting characteristics of the LED, but also acts as a factor to shorten the life of the LED Have
  • the conventional LED lighting device adopts a variety of heat dissipation structures. Since these heat dissipation structures are manufactured with a focus on improving the heat dissipation effect, most of them are manufactured in a large size. There was a problem.
  • the conventional LED lighting device must be assembled using a large number of pieces (for example, screws) when assembling each component, and in particular, the mutual connection between the metal substrate on which the LED is mounted and the power substrate for powering the metal substrate. Since the connection of the part to be connected has been performed by welding, there exists a problem that reassembly remarkably falls. In particular, since the power boards are disposed without being exposed inside the housing forming the heat dissipation structure, and the metal substrate on which the LED is mounted should be exposed outside the housing, it is required to have an effective connection structure when electrically connecting them to each other. .
  • the FET device is a high-speed switching by adopting a switching mode power supply (SMPS) using a field effect transistor (FET) device to supply a stable direct current (DC) power supply by receiving AC power from the outside to the LED lighting device
  • SMPS switching mode power supply
  • FET field effect transistor
  • DC direct current
  • an object of the present invention is to provide a bulb-type LED lighting device consisting of a one-step connection between the LED package and the power substrate during assembly.
  • Another object of the present invention is to provide a bulb-type LED lighting device that can effectively dissipate heat generated from high-brightness LEDs and FET devices with high heat generation, and can form a compact overall size.
  • the present invention provides an LED package including a substrate on which a plurality of LEDs are mounted; A heat dissipation member having the LED package mounted at one side and having a plurality of heat dissipation fins for dissipating heat conducted from the LED package and having a space portion open at the other side thereof; A power substrate inserted into the space portion of the heat dissipation member and configured to apply power to the LED package; A screw cap coupled to the other side of the heat dissipation member in an insulated state to apply power to the power substrate; And a glove coupled to one side of the heat dissipation member for casing the LED package, wherein the power substrate is inserted into the heat dissipation member and electrically connected to the LED package one-step.
  • the power substrate may have a socket mounted on one surface thereof, and the LED package may include a connection pin inserted into the socket.
  • the heat dissipation member is formed with a first guide slot into which at least one end of both sides of the power substrate is inserted, and the first guide slot is connected when the power substrate is inserted into the heat dissipation member.
  • the pin and the socket are formed at a position where they can be interconnected.
  • the power substrate may include a heat dissipation pad in contact with the heat dissipation member for dissipating heat generated by the heat generating switching element to the heat dissipation member.
  • the heat dissipation member forms a contact protrusion contacting the heat dissipation pad on an inner circumferential surface, and the contact protrusion is in contact with the heat dissipation member to facilitate coupling when the power substrate is inserted into the heat dissipation member.
  • One surface of the contact protrusion may be formed to be inclined to be adjacent to the center of the heat dissipation member from the upper side to the lower side.
  • the plurality of heat dissipation fins may be arranged in parallel along the longitudinal direction of the heat dissipation member.
  • the heat dissipation fins may be manufactured to be wider from the upper side to the lower side.
  • the heat radiating fins may of course have a helical shape along the outer circumference of the heat radiating member.
  • an insulating member inserted between the screw cap and the heat dissipating member to insulate the screw cap from the heat dissipating member, wherein the insulating member is inserted into at least one of both sides of the power substrate on an inner circumferential surface thereof; Guide slots may be formed.
  • the screw cap is coupled to one side of the power substrate to the insulating member and assembled into a single unit, and then inserting the power substrate into the heat dissipation member to which the LED package is pre-coupled to couple the insulating member to the heat dissipation member.
  • the electrical connection is automatically made between the power substrate and the LED package in conjunction.
  • the insulating member may include a plurality of snap coupling protrusions that snap to the heat radiating member when the single unit is inserted into the heat radiating member; And at least one guide protrusion to guide the coupling direction when the single unit is inserted into the heat dissipation member.
  • the heat dissipation member has a space portion having one side open to allow the power substrate to be inserted therein, and guides both ends of the power substrate to insert the power substrate into the space portion, and the first power terminal and the LED of the power substrate.
  • a pair of first guide slots formed along the longitudinal direction on the inner circumferential surface of the space portion at a position at which the second power supply terminal of the package is automatically connected, and formed on the inner circumferential surface of the space portion along the longitudinal direction to be in contact with the heat radiation pad of the power substrate.
  • a body having a contact protrusion A fixing plate having a through hole through which a second power supply terminal is closed at the bottom of the body so as to mount the LED package on a lower side thereof; And a plurality of heat dissipation fins arranged radially along the outer circumference of the body to dissipate heat conducted through the fixing plate from the LED package.
  • the heat dissipation fins protrude in a straight direction along the longitudinal direction of the body, it is made of a shape that is wider from the upper side to the lower side, the heat dissipation member is formed from the lower end of the heat dissipation fins further skirt portion is coupled to the glove It may include.
  • the present invention can effectively dissipate high heat generated from a plurality of LEDs through a heat radiation fin made of a vertical or helical shape, and furthermore, by naturally transferring heat generated from a FET device mounted on a power substrate to a heat radiation fin through a heat radiation pad. Effective heat dissipation is achieved.
  • FIG. 1 is a perspective view showing a bulb-type LED lighting device according to an embodiment of the present invention
  • FIG. 2 and 3 is an exploded perspective view showing a light bulb-type LED lighting apparatus according to an embodiment of the present invention
  • Figure 4 is a plan view showing a bulb type LED lighting device according to an embodiment of the present invention shown in Figure 1,
  • FIG. 5 is a cross-sectional view taken along the line VV of FIG. 4;
  • FIG. 6 is a plan view showing a heat radiation member shown in FIG.
  • FIG. 7 is a cross-sectional view taken along the line VII-VII shown in FIG. 6,
  • FIG. 8 is a partial cutaway view showing the heat dissipation member shown in FIG. 2;
  • FIG. 9 is a perspective view showing the screw cap shown in FIG.
  • FIG. 10 is a perspective view showing another embodiment of the heat dissipation member
  • FIG. 11 is a longitudinal cross-sectional view of FIG. 10.
  • FIG. 1 is a combined perspective view showing a bulb-type LED lighting device according to an embodiment of the present invention
  • Figures 2 and 3 are exploded perspective view showing a bulb-type LED lighting device
  • Figure 4 is a bulb-type LED lighting device 5 is a cross-sectional view taken along the line V-V shown in FIG. 4
  • FIG. 6 is a plan view showing the heat dissipation unit shown in FIG. 2
  • FIG. 9 is a perspective view illustrating the screw cap illustrated in FIG. 2.
  • the bulb type LED lighting device 1 includes an LED package 10, a heat dissipation member 30, a globe 50, a power substrate 70, and a screw.
  • a cap 90 is provided.
  • the LED package 10 includes a substantially disk-shaped metal PCB 11 and a plurality of LEDs 12 mounted on an outer surface of the metal substrate 11.
  • the metal substrate 11 is preferably made of a plate of a material having excellent thermal conductivity (for example, aluminum, copper, iron, or an alloy thereof).
  • the metal substrate 11 is formed to be spaced apart from the inner circumferential surface of the glove 50 to prevent high temperature heat from being transferred directly to the glove 50.
  • the substrate 11 on which the plurality of LEDs 12 are mounted on the outer surface is made of an insulating resin like FR4 instead of a metal substrate, and from the front surface on which the LEDs 12 are mounted to the rear to improve heat dissipation characteristics. It is also possible to adopt a structure in which a plurality of conductive through holes are formed, and a conductive film is formed on the rear surface so that heat generated from the LED 12 is transferred to the heat radiating member 30 through the conductive through holes.
  • the metal substrate 11 includes a plurality of through holes 15 through which a plurality of pieces 13 for fixing to the heat dissipation member 30 pass.
  • a pair of connecting pins 17a and 17b electrically connected to the socket 75 of the power substrate 70 to be described later are mounted on the metal substrate 11 to receive power from the power substrate 70.
  • the pair of connection pins 17a and 17b are connected to the positive and negative wirings of a pattern (not shown) formed on the metal substrate 11 connecting the plurality of LEDs 12 in series.
  • connection pins 17a and 17b are connected to the socket 75 of the power substrate 70 inserted into the heat dissipation member 30 when the LED package 10 is fixed to the heat dissipation member 30. To this end, it penetrates through the fixing plate 32 (see FIG. 3) of the heat dissipation member 30 to be described later.
  • the heat radiating member 30 is for radiating heat generated from the LED package 10 to the outside of the LED lighting apparatus 1, and the body 31, the fixing plate 32, and a plurality of them. It includes a heat radiation fin (33).
  • the body 31 has a space portion 31a open at one side thereof so that the power substrate 70 can be inserted therein, and a skirt portion 31b is formed at the lower end of the body 31 to which the glove 50 is coupled. Is formed.
  • the body 31 has a pair of first guide slots 31c and 31d formed along the longitudinal direction of the body 31 on the inner circumferential surface of the space portion 31a to guide both ends of the power substrate 70. .
  • the pair of first guide slots 31c and 31d is inserted into the space portion 31a of the power substrate 70, so that the socket 75 of the power substrate 70 and the pair of connection pins 17a and 17b are formed. It is formed at the position to guide so that it may connect naturally.
  • the body 31 has a contact protrusion 31e formed on the inner circumferential surface of the space 31a in contact with the heat radiation pad 77 (see FIG. 5) of the power substrate 70 to be described later.
  • the contact protrusion 31e is formed along the longitudinal direction of the body 31, and the heat dissipation member 30 is formed so that one surface 31f of the contact protrusion 31e in contact with the heat radiation pad 77 goes from the upper side to the lower side.
  • the coupling operation of the power substrate 70 becomes easy.
  • the fixing plate 32 is formed at the bottom of the body 31 and at the same time the space 31a is closed, the metal substrate 11 is fixed through the plurality of pieces 13.
  • the fixing plate 32 is formed in a substantially circular shape like the metal substrate 11, and has a through hole through which the fastening hole 32a to which the plurality of pieces 13 is fastened and the pair of connecting pins 17a and 17b pass. 32b) are formed respectively.
  • the plurality of heat dissipation fins 33 are radially arranged at equal angles along the outer circumference of the body 31 and protrude with a constant thickness in a linear direction along the longitudinal direction of the body 31. Such a plurality of heat dissipation fins 33 are wider from the upper side to the lower side, and the inner vertical portion of the heat dissipation fin 33 is formed on the outer circumference of the body 31.
  • the spacing between the adjacent radiating fins is equally set so as not to disturb the natural convection flow of hot air rising from the lower side of the radiating fin 33.
  • the lower end of the heat dissipation fin 33 is connected to the skirt 31b of the body 31 to conduct heat conducted from the LED package 10 to the fixing plate 32 of the body 31 by the plurality of heat dissipation fins 33 as a whole. To pass.
  • each of the heat dissipation fins 33 generated from the LED package 10 and received heat through the fixing plate 32 has a plurality of heat dissipation fins uniformly provided with rising air around the plurality of heat dissipation fins 33 while being exposed to the air. 33) Heat exchange takes place as it passes through.
  • the plurality of heat dissipation fins 33 are arranged in the vertical direction so that air cooling is performed without disturbing the natural convection flow of the rising hot air. Therefore, not only efficient heat dissipation is performed through the plurality of heat dissipation fins 33, but also the overall size of the lighting apparatus 1 can be reduced by forming the size of the heat dissipation member 30 compactly.
  • the body 31, the fixing plate 32 and the plurality of heat dissipation fins 33 are preferably made of a metal material having high thermal conductivity, for example, aluminum alloy, etc., and can also be integrally manufactured through die casting.
  • the glove 50 is formed in a substantially spherical shape with one side open with a transparent or semi-transparent glass.
  • the globe 50 has an opening coupled to the body 31 to casing the LED package 10.
  • the glove 50 performs molding processing for waterproofing using epoxy in the circular insertion groove 31g formed at the upper end 51 along the inner side of the skirt portion 31b.
  • the power substrate 70 is for applying power to the LED package 10, and is a PCB for mounting a predetermined electronic component 71.
  • the power substrate 70 serves as a power supply device for converting an AC voltage into a DC voltage.
  • the FET element 73 is employed.
  • the power substrate 70 is inserted in a substantially vertical direction when inserted into the space 31a of the body 31 of the heat dissipation member 30 (see FIG. 5), and a pair of connection pins 17a, of the LED package 10 are provided.
  • a socket 75 electrically connected to 17b) is mounted.
  • the socket 75 is inserted in the direction in which the power board 70 is inserted so that the pair of connecting pins 17a and 17b may naturally be connected to the socket 75 when the power board 70 is inserted into the heat dissipation member 30. It is preferable to be located at the tip of.
  • the power substrate 70 includes a heat dissipation pad 77 on one side to transfer heat generated from the FET device 73 to the heat dissipation member 30.
  • the heat dissipation pad 77 is set at a position in contact with the FET element 73 and the heat dissipation member 10 moves the power substrate 70 to transfer heat generated from the FET element 73 to the heat dissipation member 30.
  • the contact projection 31e When contacted with the contact projection 31e. Accordingly, it is possible to prevent the power substrate 70 from being damaged or malfunction due to the heat generation of the FET element 73.
  • the screw cap (or base) 90 can be made of one of the E26 / E27 / E14 types, for example made of a metal material such as nickel (Ni), and is formed with a thread screwed into a conventional socket.
  • the screw cap 90 is formed with positive and negative electrical contacts 70a and 70b connected through a power line (not shown) drawn out from the power substrate 70.
  • the screw cap 90 includes an insulating member 93, and is connected to the heat dissipation device 30 through the insulating member 93.
  • the insulating member 93 serves as a medium for insulating and interconnecting the heat dissipation device 30 and the screw cap 90, and having a cylindrical portion 93a and an annular flange portion 93b. ) And a snap coupling portion 94.
  • the outer circumferential portion is directly press-bonded to the inner circumference of the screw cap 90, and second guide slots 95a and 95b are inserted into the inner circumferential surface at both ends of the power substrate 70.
  • the cylindrical portion 93a passes through a power line (not shown) for electrically connecting the power substrate 70 and the screw cap 90.
  • the annular flange portion 93b extends along the lower end of the cylindrical portion 93a and contacts the upper ends of the plurality of heat dissipation fins 33, thereby blocking contact between the screw cap 90 and the heat dissipation member 30.
  • the snap coupling portion 94 is a means for coupling the insulating member 93 to the heat dissipation member 30, and is snap-coupled to an inner circumferential surface of the open space portion 31a of the heat dissipation member 30.
  • the snap coupling portion 94 includes a plurality of round pieces 94a protruding in the circumferential direction at predetermined intervals along the lower end of the annular flange portion 93b, and protrude in the horizontal direction on the outer circumference of each round piece 94a. And a snap protrusion 94b.
  • the plurality of snap protrusions 94b are detachably snapped to the coupling groove 37 formed along the inner circumferential surface of the heat dissipation member 30.
  • the snap coupling portion 94 includes a guide protrusion 94c that crosses at approximately right angles to the snap protrusion 94b.
  • the guide protrusion 94c is inserted into the guide groove 38 crossing at right angles to the coupling groove 37 of the heat dissipation member 30.
  • the guide protrusion 94c has the correct coupling position.
  • the assembly structure between the snap coupling portion 94 and the heat dissipation member 30 serves as an assembly guide when assembling the insulating member 93 with the heat dissipation device 30, and thus, in the space 31 a inside the body 31. It serves to block the penetration of dust or moisture into the disposed power substrate 80.
  • a seal ring 97 is coupled between the insulating member 93 and the heat generating member 30 to further solidify the airtightness of the space 31 a inside the body 31.
  • the LED lighting device 1 of the present invention can be formed in a single unit by assembling and connecting the power substrate 70, the screw cap 90 and the insulating member 93 in advance in the manufacturing process, in this case
  • the single unit may be easily coupled to the heat dissipation member 30 to which the LED package 10 is coupled in advance.
  • the power board 70 is inserted into the space 31a of the body 31 while the single unit is held, so that both ends of the power board 70 are inserted into the first guide slots 31c and 31d.
  • the insulating member 93 is snap-coupled to the body 31 and a pair of connection pins 17a and 17b of the LED package 10 are correctly connected to the socket 75.
  • FIG. 1 to 9 illustrate a structure in which a socket 75 is installed on the power substrate 70 and a pair of connecting pins 17a and 17b are installed on the LED package 10. A pair of connecting pins 17a and 17b are installed at 70 and the socket 75 is installed at the LED package 10.
  • the first and second power terminals are installed in the power substrate 70 and the LED package 10, respectively, to insert the power substrate 70 into the space 31a of the body 31 to insulate the insulating member ( 93 may be employed as long as the first and second power terminals are coupled to the body 31 to connect the power board 70 and the LED package 10 to each other.
  • the LED lighting device 1 of the present invention for the waterproof / dustproof for the power substrate 70 and the LED package 10 built in the space portion 31a of the heat dissipation member 30, the heat dissipation member 30
  • the inner space of the insulating member 93 and the screw cap 90 is filled with any one of epoxy, silicon, and cement as a sealing material for waterproof / dustproof.
  • FIG. 10 is a perspective view showing another embodiment of the heat dissipation member 30, the heat dissipation member 30 described above has been described a plurality of heat dissipation fin 33 evenly arranged vertically, but is not limited to this, and Likewise, the heat radiation fins 33a may protrude in the helical direction along the outer circumference of the body 31.
  • the heat around the heat dissipation fins moves from the lower part of the body 31 to the upper side between the heat dissipation fins 33a, thereby performing heat exchange.
  • the heat dissipation efficiency can be improved, and the heat dissipation member 30 can be compactly formed.
  • the LED lighting device 1 of the present invention can maximize the heat dissipation efficiency by the heat dissipation fins 33 and 33a made of the above-described vertical or helical shape as well as excellent assemblability.
  • the bulb-type LED lighting device of the present invention is made of a screw cap (or base) structure of one of the E26 / E27 / E14 type is applied to the bulb type LED lighting lamp to replace the incandescent bulb.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne un appareil d'éclairage à DEL du type ampoule électrique dans lequel un bloc DEL et un support d'alimentation peuvent être raccordés rapidement et précisément en une seule opération au cours d'un processus d'assemblage, de la chaleur interne peut être dégagée efficacement et la dimension globale est compacte. L'invention comprend : un bloc qui comporte un support sur lequel est montée une pluralité de DEL ; un élément de rayonnement thermique ayant le bloc DEL monté sur un côté et qui est pourvu d'une pluralité de tiges de rayonnement thermique destinées à dégager la chaleur provenant du bloc DEL par conduction ; un support d'alimentation qui est inséré dans l'élément de rayonnement thermique et qui fournit une énergie au bloc DEL ; un culot à vis qui est accouplé avec l'autre côté de l'élément de rayonnement thermique à l'état isolé et qui fournit de l'énergie au support d'alimentation ; et un globe qui est accouplé avec le premier côté de l'élément de rayonnement thermique afin d'emboîter le bloc DEL, le support d'alimentation étant relié électriquement au bloc DEL en une seule opération tout en étant inséré dans l'élément de rayonnement thermique.
PCT/KR2010/008010 2009-11-13 2010-11-12 Appareil d'éclairage à del du type ampoule électrique WO2011059268A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090109948A KR101097118B1 (ko) 2009-11-13 2009-11-13 전구형 ｌｅｄ 조명장치
KR10-2009-0109948 2009-11-13

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WO2011059268A2 true WO2011059268A2 (fr) 2011-05-19
WO2011059268A3 WO2011059268A3 (fr) 2011-10-27

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WO (1) WO2011059268A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9239159B2 (en) 2011-12-16 2016-01-19 Samsung Electronics Co., Ltd. Heat-dissipating structure for lighting apparatus and lighting apparatus
CN109555986A (zh) * 2019-01-23 2019-04-02 广东凯晟照明科技有限公司 装配成型一体式光源

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101175360B1 (ko) 2011-04-08 2012-08-20 주식회사 삼광산전 Ｌｅｄ 램프
CN102913874A (zh) * 2011-08-01 2013-02-06 富瑞精密组件（昆山）有限公司 散热器及使用该散热器的发光二极管灯具
KR200470532Y1 (ko) 2012-04-05 2013-12-20 충-시엔 후앙 하나의 작업 공정에 의하여 일체로 형성된 관형 방열 시트
KR101362994B1 (ko) 2012-06-25 2014-02-18 남경 주식회사 셀 효과를 갖는 발광 다이오드 전구
US9807833B2 (en) 2013-11-26 2017-10-31 Lg Innotek Co., Ltd. Power apparatus for LED lighting

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090071473A (ko) * 2007-12-27 2009-07-01 도시바 쇼메이 프레시즌 가부시키가이샤 램프 소켓, 방전램프 유닛 및 발광장치
KR20090095903A (ko) * 2008-03-06 2009-09-10 화우테크놀러지 주식회사 소형 무팬(無 Ｆａｎ) 엘이디 조명기구
KR20090097055A (ko) * 2008-03-10 2009-09-15 민병현 조립형 엘이디 조명기기

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090071473A (ko) * 2007-12-27 2009-07-01 도시바 쇼메이 프레시즌 가부시키가이샤 램프 소켓, 방전램프 유닛 및 발광장치
KR20090095903A (ko) * 2008-03-06 2009-09-10 화우테크놀러지 주식회사 소형 무팬(無 Ｆａｎ) 엘이디 조명기구
KR20090097055A (ko) * 2008-03-10 2009-09-15 민병현 조립형 엘이디 조명기기

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9239159B2 (en) 2011-12-16 2016-01-19 Samsung Electronics Co., Ltd. Heat-dissipating structure for lighting apparatus and lighting apparatus
EP2792944A4 (fr) * 2011-12-16 2016-04-27 Samsung Electronics Co Ltd Structure de dissipation de chaleur pour appareil d'éclairage et appareil d'éclairage
CN109555986A (zh) * 2019-01-23 2019-04-02 广东凯晟照明科技有限公司 装配成型一体式光源
CN109555986B (zh) * 2019-01-23 2024-03-26 广东凯晟科技发展有限公司 装配成型一体式光源

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KR101097118B1 (ko) 2011-12-22
WO2011059268A3 (fr) 2011-10-27
KR20110053121A (ko) 2011-05-19

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