WO2011040671A1 - Appareil d'éclairage à diodes électroluminescentes - Google Patents

Appareil d'éclairage à diodes électroluminescentes Download PDF

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Publication number
WO2011040671A1
WO2011040671A1 PCT/KR2009/006869 KR2009006869W WO2011040671A1 WO 2011040671 A1 WO2011040671 A1 WO 2011040671A1 KR 2009006869 W KR2009006869 W KR 2009006869W WO 2011040671 A1 WO2011040671 A1 WO 2011040671A1
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WIPO (PCT)
Prior art keywords
heat dissipation
dissipation member
light emitting
emitting diode
heat
Prior art date
Application number
PCT/KR2009/006869
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English (en)
Korean (ko)
Inventor
이강민
Original Assignee
주식회사 렌즈
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Publication of WO2011040671A1 publication Critical patent/WO2011040671A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a luminaire, and more particularly, to a light emitting diode luminaire having a horizontal radiating fin and a vertical radiating fin and having a PCB made of alumina-based ceramic.
  • a light-emitting diode (LED) as a light source for generating light has a small power and a long life compared to a conventional light source, and has low power consumption and high-speed response characteristics because electrical energy is directly converted into light energy. I have it.
  • the lighting apparatus using the light emitting diode has a structure in which a printed circuit board (PCB) provided with a light emitting diode is accommodated in a case.
  • PCB printed circuit board
  • An object of the present invention is to provide a light emitting diode lighting device that can effectively radiate heat generated from the light emitting diode to the outside because it has a heat radiation fin in the horizontal direction and a heat radiation fin in the vertical direction.
  • Still another object of the present invention is to provide a light emitting diode luminaire capable of effectively dissipating heat generated from the light emitting diode to the outside because it includes a PCB made of alumina-based ceramic.
  • Still another object of the present invention is to provide a light emitting diode lighting device, which includes the first and second heat dissipation members and / or housings made of alumina-based ceramics, which can effectively discharge heat generated from the light emitting diodes to the outside. .
  • a light emitting diode lighting device comprises: a PCB in which a light emitting diode is installed; A first heat dissipation member installed under the PCB and provided with a plurality of first direction heat dissipation fins; And a second heat dissipation member installed under the first heat dissipation member to be in contact with the first heat dissipation member, the second heat dissipation member having a plurality of second direction heat dissipation fins formed in a direction different from the first direction. At least one of the second heat dissipation members may be in contact with the PCB to transfer heat generated from the light emitting diodes.
  • the first heat dissipation member may include a fin part in which the first direction heat dissipation fin is installed; And an insertion part in which the first direction heat dissipation fin is not installed, and at least a portion of the second heat dissipation member is installed to be inserted into the insertion part.
  • the first heat dissipation member is formed by stacking at least two heat sinks, a heat sink is formed with a spacer, and spaced between the heat sinks due to the spacers when the heat sink is stacked.
  • a through portion is formed in the center of the first heat dissipation member, and a second protrusion of the second heat dissipation member is inserted into the through portion to contact the PCB.
  • the first heat dissipation member is a body; And the first direction heat dissipation fin formed in a plurality of layers around the body.
  • a first protrusion protruding upward is formed around the second heat dissipation member, and the first protrusion is inserted into the insertion portion to perform heat transfer between the first heat dissipation member and the second heat dissipation member.
  • the second direction heat dissipation fin is formed on the outer surface of the first protrusion, the second heat dissipation member is accommodated in the housing, and the housing has a cutout formed at a position corresponding to the first protrusion.
  • the first heat dissipation member is exposed to the outside through the cutout, and the first direction heat dissipation fin is exposed to the outside.
  • the first direction is horizontal and the second direction is vertical.
  • the light emitting diode lighting device may be provided with a plurality of through holes penetrating the first direction heat radiation fins.
  • the PCB is preferably made of an alumina-based ceramic and has a substrate body on which the light emitting diodes are installed.
  • the alumina-based ceramic has an emissivity of at least 0.97 and an insulation strength of at least 10 KV / mm.
  • first heat dissipation member and the second heat dissipation member may be made of alumina-based ceramics.
  • the housing may also be made of alumina-based ceramics.
  • Figure 1a is a perspective view showing a light emitting diode lighting fixture according to a first embodiment of the present invention.
  • Figure 1b is a front view showing the light emitting diode luminaire of Figure 1;
  • FIG. 2 is an exploded perspective view showing the light emitting diode lighting fixture of FIG.
  • Figure 3 is a perspective view showing that the diffusion member is installed on the cover of the light emitting diode lighting fixture of FIG.
  • Figure 4 is an exploded perspective view showing a light emitting diode lighting fixture according to a second embodiment of the present invention.
  • FIG. 5 is an exploded perspective view showing a light emitting diode lighting fixture according to a third embodiment of the present invention.
  • Figure 6 is an exploded perspective view showing a light emitting diode lighting fixture according to a fourth embodiment of the present invention.
  • Figure 7 is a graph showing the temperature change of each part over time after the power is supplied to the light emitting diode lighting fixture of FIG.
  • 9a to 9c are views showing the temperature of each part when the temperature change of each part reaches a steady state after power is supplied to the light emitting diode luminaire according to the present invention.
  • 100, 100a, 100b, 100c light emitting diode lighting fixture
  • the present invention is characterized in that it can effectively transfer the heat generated in the light emitting diode to the outside.
  • the heat transfer is performed by the first and second heat dissipation members, and at least one of the first and second heat dissipation members may be in contact with the PCB on which the light emitting diode is installed to receive heat.
  • FIG. 1A is a perspective view showing a light emitting diode lighting fixture according to a first embodiment of the present invention
  • FIG. 1B is a front view of the light emitting diode lighting fixture
  • FIG. 2 is an exploded perspective view of the light emitting diode lighting fixture.
  • the light emitting diode lighting device 100 includes a PCB 10 in which the light emitting diodes 1 are installed, and first and second heat dissipation members 30 for dissipating heat generated from the light emitting diodes 1 to the outside. 50 is provided.
  • the PCB 10 is provided with a substrate body 11, an electrode provided on the substrate body 11 and electrically connected to an external power source (not shown), and electrically connected to the electrode and generating light by application of an external power source.
  • a light emitting diode 1 is provided.
  • the electrode and the light emitting diode 1 may be provided with an appropriate number to obtain the desired brightness.
  • the substrate body 11 may have a first through hole 12 for fixing the leg 22 of the lens member 21 and a second through hole 13 through which an electric wire (not shown) passes. .
  • the first and second through holes 12 and 13 may be formed as many as necessary according to product specifications.
  • the substrate body 11 is installed in the through part 36 to be in contact with the second heat dissipation member 50.
  • the substrate body 11 is formed of an alumina-based ceramic material having excellent heat dissipation and insulating properties in order to integrate the functions of a conventional printed circuit board and a heat sink into one.
  • the ceramic material has a high emissivity and a high dielectric strength instead of low thermal conductivity.
  • Alumina-based ceramic materials that satisfy these characteristics include N-9H of Nishimura, Japan.
  • the N-9H contains a small amount of impurities in 96% or more of alumina (Al 2 O 3 ).
  • the ceramic material emits heat generated in the light emitting diode 1 by emitting radiant heat, that is, thermal energy in the far infrared region, unlike conventional heat sinks emitting heat through heat conduction and convection.
  • Table 1 below shows the emissivity and thermal conductivity according to the material.
  • N-9H has a high emissivity of 0.97 and a low thermal conductivity of 39 W / mK.
  • N-9H is a material having a high insulation property with an insulation strength of 10KV / mm or more.
  • N-9H has the advantage that the price is low.
  • the substrate body 11 is formed by using a ceramic material such as N-9H having excellent emissivity and insulation and low cost, thereby maximizing heat dissipation efficiency using radiant heat and integrating the functions of a conventional printed circuit board and a heat sink. In this way, manufacturing cost can be reduced.
  • the LED lighting apparatus 100 includes a lens member 21 installed on the PCB 10, a cover 24 covering the lens member 21, and a guide member for guiding the lens member 21 ( 27).
  • the lens member 21 has a number of holes 25 corresponding to the number of light emitting diodes 1. Light of the light emitting diode 1 passes through the hole 25.
  • the cover 24 may be provided with a diffusion member 26 for uniformly diffusing the light of the light emitting diode (1).
  • the diffusion member 26 is a transparent or translucent material through which light can pass, and is a member widely used in lighting fixtures.
  • the cover 24 and the guide member 27 has a conventional structure and function.
  • the first heat dissipation member 30 is installed to be in contact with the second heat dissipation member 50 to receive heat from the second heat dissipation member 50.
  • the first heat dissipation member 30 is formed by stacking at least two heat dissipation plates 31.
  • the heat sink 31 includes a fin portion and an insertion portion.
  • the fin direction first heat radiation fins 32 are installed.
  • the heat sink 31 has a spacer 33 formed to protrude downward.
  • the spaces between the heat sinks 31 are separated by the spacers 33.
  • the first direction heat dissipation fins 32 are not housed in the housing 60 but are exposed to the outside. As such, the air may move through the spaced gaps between the heat sinks 31 and the first direction heat dissipation fins 32 may be exposed to the outside and directly contact with the outside air, thereby making the heat transfer more effective.
  • the drawing shows that the spacer 33 protrudes downward, but the spacer may protrude upward. Even when the spacer protrudes upward, the heat sink 31 may be spaced apart by the spacer 33.
  • the first heat dissipation member 30 has a through portion 36 formed at the center thereof.
  • the second protrusion 56 of the second heat dissipation member 50 is inserted into the through part 36 so that the second protrusion 56 is in contact with the PCB 10 to perform heat transfer.
  • a plurality of heat sinks 31 are inserted and stacked between the first protrusion 53 and the second protrusion 56.
  • the first direction radiation fin 32 is preferably formed in a horizontal direction, more preferably a plurality of through-holes 34 are formed in the first direction radiation fin 32. Since air may move through the through hole 34, heat emission may be effectively performed.
  • the first heat dissipation member 30 is made of aluminum alloy or made of alumina-based ceramic material.
  • alumina-based ceramic material examples include N-9H and N-6H of Nishimura, Japan.
  • N-6H has a high emissivity of 0.963 and a low thermal conductivity of 21.8 W / mK.
  • N-6H is a material having a high insulation property with an insulation strength of 10KV / mm or more.
  • the second heat dissipation member 50 is installed to contact the PCB 10 so that heat of the light emitting diode 1 can be transferred.
  • the second heat dissipation member 50 includes a second direction heat dissipation fin 52 formed in a plurality of directions different from the first direction, and first and second protrusions 53 and 56 protruding upward.
  • the second direction radiation fins 52 are preferably formed in the vertical direction.
  • the first protrusion 53 is formed at a position that can be inserted into the insertion portion. That is, the first protrusion 53 is inserted between the first direction heat dissipation fins 32 to transfer heat to the first heat dissipation member 30.
  • a plurality of second direction heat dissipation fins 52 are formed on the outer surface of the first protrusion 53, and the second direction heat dissipation fins 52 discharge heat transferred from the PCB 10 to the outside.
  • the second protrusion 56 is formed at the center of the second heat dissipation member 50.
  • the second protrusion 56 is in contact with the PCB 10 to receive heat.
  • a second direction heat dissipation fin 52 may be formed around the second protrusion 56.
  • the second protrusion 56 has a through hole 56a penetrating through the center thereof.
  • the second heat dissipation member 50 is installed to be received in the housing 60.
  • the housing 60 includes a cutout 62 formed at a position corresponding to the first protrusion 53, and a plurality of through holes 63.
  • the second direction heat dissipation fins 52 are directly exposed to the outside through the cutout 62.
  • the second heat dissipation member 50 and the housing 60 may be made of aluminum alloy or made of alumina-based ceramic material.
  • alumina-based ceramic material examples include N-9H and N-6H of Nishimura, Japan.
  • reference numeral 65 denotes a main PCB board controlling the operation of the light emitting diode 1 and electrically connected to an external power source and the PCB 10, and 66 is a connection pin for connecting to an external power source.
  • Figure 4 is an exploded perspective view showing a light emitting diode lighting fixture according to a second embodiment of the present invention.
  • the luminaire 100a has the same structure as the above-described first embodiment except for the number of heat sinks 32 and the substrate body 11a.
  • the same reference numerals as used in FIGS. 1 and 2 denote the same components having the same functions.
  • the substrate body 11a of the PCB 10a is formed of an alumina-based ceramic material having excellent heat dissipation and insulation properties, for example, N-9H, etc. in order to integrate the functions of a conventional printed circuit board and a heat sink into one.
  • grooves 14 are formed at edges at predetermined intervals, and the first protrusions 53 are inserted in the grooves 14.
  • Figure 5 is an exploded perspective view showing a light emitting diode lighting fixture according to a third embodiment of the present invention.
  • the lighting device 100b has the same structure as the first embodiment described above except that the structure of the first heat dissipation member 30b and the PCB 10 are installed to contact the first heat dissipation member 30b. .
  • the same reference numerals as those of FIGS. 1 and 2 denote the same components having the same functions.
  • the first heat dissipation member 30b includes a body 31b and a first direction heat dissipation fin 32b formed of a plurality of layers around the body 31b.
  • the first heat dissipation member 30 of the above-described embodiment is formed by stacking a plurality of heat dissipation plates 31, the first heat dissipation member 30b includes only one body 31b and has a first circumference around the body 31b.
  • Directional radiation fins 32b are formed of a plurality of layers.
  • the groove portion 35b is formed on the upper surface of the body 31b to allow the PCB 10 to be seated. Therefore, heat of the PCB 10 is transferred to the first heat dissipation member 30b, and heat of the first heat dissipation member 30b is transferred to the second heat dissipation member 50.
  • FIG. 6 is an exploded perspective view showing a light emitting diode lighting fixture according to a fourth embodiment of the present invention.
  • the lighting device 100c has a first structure except that the structure of the substrate body 11a, the structure of the first heat dissipation member 30c, and the PCB 10 are installed to contact the first heat dissipation member 30c. It has the same structure as in the embodiment.
  • FIG. 6 the same reference numerals as those of FIGS. 1 to 5 denote the same components having the same functions.
  • the substrate main body 11a has the same structure as the substrate main body 11a of the second embodiment.
  • the first heat dissipation member 30c is the third embodiment except that the groove 35b is not formed in the center of the body 31c and the number of the first direction heat dissipation fins 32c is different. 1 It has the same structure as the heat radiating member 30b. Therefore, heat of the PCB 10 is transferred to the first heat dissipation member 30c, and heat of the first heat dissipation member 30c is transferred to the second heat dissipation member 50.
  • FIG. 7 is a graph illustrating a temperature change of each part with time after power is supplied to the LED lighting fixture of FIG. 2.
  • the graph shows that the substrate body 11 is made of an alumina-based ceramic material (N-9H), the first and second heat dissipation members 30 and 50 are made of aluminum alloy, and the light emitting diodes 1 are formed of 3W. It is the result of numerical analysis that causes heat to be generated.
  • the temperature of the electrode is about 58 degrees
  • the temperature of the first heat dissipation member 30 is about 31 degrees
  • the temperature of the second heat dissipation member 50 is about 43 degrees. Since the second heat dissipation member 50 is in contact with the PCB 10, the temperature of the second heat dissipation member 50 is higher than the temperature of the second heat dissipation member 30.
  • Figure 8 is a graph showing the temperature change of each part over time after the power is supplied to a general light emitting diode lighting fixture.
  • the lighting fixture has a structure disclosed in FIG. 7, etc. of Korean Patent No. 10-899089.
  • the graph shows a case where 3 W of heat is generated in the light emitting diodes.
  • the temperature of the electrode is about 79 degrees
  • the temperature of the heat sink (corresponding to the first and second heat dissipation members 30b and 50 of the present invention) is about 64 degrees.
  • the lifetime of the light emitting diode is reduced by about 30% and the brightness is reduced by about 20%.
  • the lifetime of the light emitting diode is not reduced and the brightness is kept constant.
  • FIG. 9A and 9B show the temperature of each part when the temperature change of each part reaches a steady state after power is supplied to the LED lighting device according to the present invention.
  • the luminaire is the same as the luminaire of FIG. 5 except that the recess 35b is formed to pass therethrough. Therefore, in the luminaire, the PCB 10 is in direct contact with the second heat dissipation member 50.
  • the temperature distribution is obtained by numerical analysis, wherein the substrate body 11 is made of alumina-based ceramic material (N-9H), and the first and second heat dissipation members 30b and 50 are made of aluminum alloy. 100b).
  • 9A is a result of numerical analysis for generating 4W of heat
  • FIG. 9B is a result of numerical analysis for generating 3.2W of heat.
  • 9A shows that the substrate body 11 is about 68 to 69 ° C, the first heat dissipation member 30b is about 67 ° C, and the second heat dissipation member 50 is about 68 ° C.
  • 9B shows that the substrate body 11 is about 60 to 61 ° C, the first heat dissipation member 30b is about 59 ° C, and the second heat dissipation member 50 is about 60 ° C.
  • Figure 9c shows the temperature of each part when the temperature change of each part reaches a steady state after power is supplied to the light emitting diode luminaire of FIG.
  • the temperature distribution is that 4W heat is applied to the luminaire 100 of which the substrate body 11 is made of alumina-based ceramic material (N-9H) and the first and second heat dissipation members 30 and 50 are made of aluminum alloy. This is the result of numerical analysis.
  • the substrate body 11 is about 67 ⁇ 68 °C
  • the first heat dissipation member 30 is about 66 °C
  • the second heat dissipation member 50 is about 67 °C
  • this temperature is the same heat This is about 1 ° C. lower than in the case of FIG. 9A where this occurs.
  • the first heat dissipation member 30 of FIG. 9C is formed by stacking the heat dissipation plates 31 and the through hole 34 is formed in the first direction heat dissipation fin 32, so that the air flow is more smooth.
  • the lighting device 100, 100a, 100b, 100c according to the present invention is the first, second direction radiation fins 32 (for example, formed in different directions (for example, horizontal and vertical)) 32b, 32c, and 52, the first direction heat dissipation fins 32, 32b, and 32c are exposed to the outside, and the second direction heat dissipation fins 52 formed on the first protrusion 53 are exposed to the outside. Since the substrate bodies 11 and 11a are made of a ceramic material, heat generated from the light emitting diodes can be easily discharged to the outside.
  • the light emitting diode lighting device has the following effects.
  • the PCB is made of alumina-based ceramics, it is possible to effectively discharge the heat generated from the light emitting diode to the outside.
  • first and second heat dissipation members and / or housings made of alumina-based ceramics are provided, heat generated from the light emitting diodes can be effectively discharged to the outside.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne un appareil d'éclairage à diodes électroluminescentes comprenant : des broches à rayonnement thermique agencées horizontalement ; des broches à rayonnement thermique agencées verticalement ; et une carte de circuit imprimé constituée de céramique à base d'alumine. L'invention émet ainsi efficacement la chaleur générée par des diodes électroluminescentes vers l'extérieur.
PCT/KR2009/006869 2009-10-01 2009-11-20 Appareil d'éclairage à diodes électroluminescentes WO2011040671A1 (fr)

Applications Claiming Priority (2)

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KR1020090093994A KR101032091B1 (ko) 2009-10-01 2009-10-01 발광다이오드 조명기구
KR10-2009-0093994 2009-10-01

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WO2011040671A1 true WO2011040671A1 (fr) 2011-04-07

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Cited By (1)

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US11486569B2 (en) * 2017-09-05 2022-11-01 Shanghai Sansi Electronic Engineering Co. Ltd. Light source module and applied illuminating device thereof

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KR101251886B1 (ko) * 2011-05-27 2013-04-08 에이테크솔루션(주) 적층형 방열기 및 그 제조 방법
KR101095868B1 (ko) 2011-09-08 2011-12-21 이슬기 발광다이오드형 조명 모듈
KR101305571B1 (ko) 2011-09-27 2013-09-09 (주)오픈테크놀러지 Ｌｅｄ 투광기
KR101147884B1 (ko) * 2011-10-07 2012-05-24 우성전기주식회사 엘이디 조명등 및 터널등
KR101143778B1 (ko) * 2012-02-02 2012-05-11 유겐가이샤 아이피에프 신속한 방열 및 방폭 기능을 갖는 엘이디 조명기구
KR101363037B1 (ko) 2012-12-24 2014-02-14 주식회사 포스코티엠씨 적층부재가 적층되어 이루어진 방열 유니트 및, 이를 구비하는 led 조명등
KR101352428B1 (ko) 2013-04-03 2014-01-17 (주)이노비젼 방열성능을 조절할 수 있는 자연공냉식 ｌｅｄ 투광기
KR101336586B1 (ko) 2013-08-02 2013-12-05 이슬기 주유소 캐노피 설치용 발광다이오드 조명등
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