WO2010038983A2 - Dispositif dissipateur thermique en spirale et dispositif d'éclairage par del en forme d'ampoule utilisant celui-ci - Google Patents

Dispositif dissipateur thermique en spirale et dispositif d'éclairage par del en forme d'ampoule utilisant celui-ci Download PDF

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Publication number
WO2010038983A2
WO2010038983A2 PCT/KR2009/005599 KR2009005599W WO2010038983A2 WO 2010038983 A2 WO2010038983 A2 WO 2010038983A2 KR 2009005599 W KR2009005599 W KR 2009005599W WO 2010038983 A2 WO2010038983 A2 WO 2010038983A2
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
led package
led lighting
led
central passage
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Application number
PCT/KR2009/005599
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English (en)
Korean (ko)
Other versions
WO2010038983A3 (fr
Inventor
이재영
정상동
임현철
Original Assignee
주식회사 아모럭스
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Application filed by 주식회사 아모럭스 filed Critical 주식회사 아모럭스
Publication of WO2010038983A2 publication Critical patent/WO2010038983A2/fr
Publication of WO2010038983A3 publication Critical patent/WO2010038983A3/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a heat dissipation device and a bulb type LED lighting device using the same, and in particular, a heat dissipation device that maximizes the light emission characteristics and lifetime of the LED by efficiently dissipating heat generated from the bulb type LED lighting device and the bulb type LED using the same It relates to a lighting device.
  • red, green, and blue LEDs are produced in a single package to generate white light by three-element light (in this case, The voltage and current applied to each LED must be precisely adjusted so that the illumination of each light is uniform.), And the light emitted from the blue or yellow LED passes through the yellow or blue phosphor so that the short wavelength is light of various wavelengths. In this case, a pseudo white is obtained, or near ultraviolet rays pass through a phosphor, and a white color is produced like a fluorescent lamp.
  • LED light emitting diode
  • a white light source combining a blue LED, an ultraviolet LED, and a fluorescent material is the mainstream.
  • the fluorescent material may be coated on a hemispherical cover of a lighting fixture, or a method of attaching a phosphor tape to the front surface, and in some cases, may be configured by coating a phosphor on the surface of the LED.
  • the white light source using the LED as described above has been spotlighted as a new illumination light source because of its excellent luminous efficiency, high luminous intensity, high speed response and long life.
  • the illuminance of 40 to 60W incandescent light bulbs can be replaced with 5-10W power using about 80 LEDs, and the 100W incandescent light bulb can implement the same illuminance at about 13W power using 128 LEDs.
  • much less power is consumed to achieve the same illuminance environment as compared to conventional "A" type (ie bulb type) incandescent bulbs as well as fluorescent lamps.
  • the lighting LED having the above characteristics is generated a lot of heat in the process of converting electrical energy into light, this heat not only lowers the light emitting characteristics of the LED, but also acts as a factor to shorten the life of the LED Have
  • the LED (LED) lighting fixture 100 is a light source unit in which a plurality of LEDs 111 are installed on the PCB 113, and the PCB 113 And a heat dissipation means (130) bonded to the housing and a housing (150) for receiving and supporting the light source unit and the heat dissipation means (130), and a power connection part for connecting the PCB (113) and the power to the housing (150). 151).
  • the heat dissipation means 130 is formed in a vertical cylindrical shape around the housing 150 and the heat dissipation fins 133 for extending the heat dissipation area are protruded at a predetermined interval around the heat dissipation fins 133 and the heat dissipation fin gap space 131 is alternately arranged unevenly.
  • the heat dissipation fin 133 and the clearance space 131 is arranged in a cylindrical shape at a predetermined interval around the heat dissipation means 130, this configuration is the surface area by the heat dissipation fin 133 in an environment where the ventilation is smoothly Due to expansion, heat dissipation is achieved.
  • the lower point 133a adjacent to the PCB 113 and the PCB 113 are most
  • the temperature difference between the distant upper point 133b is less than 10% (see FIG. 1)
  • the temperature difference between the heat dissipation fin 133 and the clearance gap 131 is less than 10% (see FIG. 2).
  • Heat dissipation for heat dissipation increases efficiency as the temperature difference between the heat dissipation fin 133 and the gap space 131 increases, but when the temperature difference is less than 10% as described above, heat dissipation is not performed properly.
  • a fan is used to force air convection for efficient heat dissipation.
  • the life of the fan is shorter than that of the LED. .
  • the heat dissipation area is far from the luminaire body by attaching a heat dissipation plate 230 having a lamp structure on the side end of the PCB 200 on which the LED 210 is mounted and having an uneven portion 231 formed thereon. It is a technology that expands the convection space required for heat dissipation by expanding.
  • the lighting fixture having a structure as shown in Figure 3 has a problem that can not be used as a fully embedded lighting fixture due to the structure of the heat sink 230, the LED is mounted on a flat structure PCB, but the direct portion is bright but side As it is relatively dark, the light distribution characteristics are bad, and in order to solve this problem, when a separate reflector is to be installed and used at the center, there is a problem in that the size of the lighting fixture is increased.
  • an LED package having a structure in which a plurality of LEDs are mounted on a plurality of metal PCBs for high illumination and attached to a polygonal pipe serving as a heat sink, but this is the same as described above between the metal PCB and the pipes.
  • the heat dissipation does not occur smoothly due to the transfer interface, there is a problem that is not suitable as a heat dissipation structure of the high illuminance (that is, high watt) LED lighting fixture.
  • an object of the present invention is to provide a spiral heat dissipation device and a bulb-type LED lighting device using the same while mounting a plurality of LEDs on the substrate surface using a polygonal metal PCB (maximum heat dissipation effect). There is.
  • Another object of the present invention by using a metal PCB made of a polygonal (metal PCB) by combining a plurality of LED-mounted LED package on the substrate surface with a heat dissipation device to implement a high-illuminance LED lighting fixture It is to provide an LED lighting device that can be easily utilized as a recessed lighting fixture by implementing the LED lighting fixture in a compact size.
  • Still another object of the present invention is to provide an LED lighting apparatus that can easily and easily manufacture an LED lighting apparatus having high light intensity and excellent light distribution characteristics, thereby increasing assembly and mass productivity and reducing manufacturing costs.
  • the spiral heat dissipation device for LED lighting apparatus is disposed between a plurality of LED integrated LED package and a screw cap for applying power to the LED package and having a central passage; And a heat dissipation fin formed integrally with the body and extending helically on the outer circumferential surface at equal intervals along the longitudinal direction of the body.
  • the heat radiation fin is preferably formed so that the conduction of heat and the flow of air continuously along the air inlet space from the lower side to the upper side thereof so that a blocking phenomenon does not occur.
  • the body has a plurality of convection holes for communicating the central passage and the outside, and forms a seating groove in the inner side of the central passage.
  • the body has a snap coupling portion that can be snapped to the outer upper end of the central passage.
  • the bulb type LED lighting device includes a LED package mounted with a plurality of LEDs on a metal substrate; A screw cap for applying power to the LED package; A heat dissipation device in which the LED package is mounted at one side and the screw cap is mounted at the other side; And a glove for casing the LED package, wherein the heat dissipation device comprises: a body having a central passage disposed between the LED package having a plurality of LEDs integrated therein and a screw cap for applying power to the LED package; And a heat dissipation fin formed integrally with the body and extending helically on the outer circumferential surface at equal intervals along the longitudinal direction of the body.
  • the bulb type LED lighting device includes a LED package mounted with a plurality of LEDs on a metal substrate; A screw cap for applying power to the LED package; The LED package is mounted on one side, and the screw cap is mounted on the other side, and a body and a body having a central passage are disposed between the LED package in which a plurality of LEDs are integrated and a screw cap for applying power to the LED package.
  • a heat dissipation device having a heat dissipation fin formed integrally with an outer circumferential surface and extending in a spiral shape at equal intervals along the longitudinal direction of the body; And a cylindrical elongated hemispherical glove for casing the LED package.
  • the body is provided with a seating groove in the inner side of the central passage, and is installed in the seating groove further includes an LED driving circuit for driving the LED package.
  • the body is snap-coupled with the screw cap to form a snap-coupled snap portion on the outer upper end of the central passage.
  • the body further includes a flange for screwing to form a threaded portion in the lower portion, the flange is snapped to the glove by forming a snapping portion on the outer peripheral surface.
  • the metal substrate is made of a polygonal surface including a lower surface, preferably consisting of a plurality of unit substrates or an integral single substrate bent into polygons.
  • the heat dissipation efficiency is improved through a heat dissipation device that can effectively dissipate heat transferred from the LED package despite mounting and mounting a plurality of LEDs on the surface of the substrate using a metal substrate made of a polygonal pipe. It can be increased to realize a high illumination LED lighting device.
  • FIG. 1 is a front view showing the structure of a conventional LED lighting fixture.
  • FIG. 2 is a cross-sectional view showing the structure of a conventional LED lighting fixture shown in FIG.
  • FIG. 3 is a cross-sectional view showing the structure of another conventional LED lighting fixture.
  • Figure 4 is a perspective view of the bulb-type LED lighting apparatus according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view taken along line A-A 'of the bulb-type LED lighting device of FIG.
  • FIG. 6 is an exploded cross-sectional view separating the cross-sectional view of FIG.
  • FIG. 7 is a front view of the bulb-type LED lighting apparatus according to an embodiment of the present invention.
  • FIG. 8 is a plan view of the bulb-type LED lighting apparatus according to an embodiment of the present invention.
  • Figure 4 is a perspective view of a bulb-type LED lighting apparatus according to an embodiment of the present invention.
  • the bulb type LED lighting device 1 includes an LED package 10, a spiral heat sink 30, a cylindrical hemispherical globe 50, and a screw cap 70. ).
  • the LED package 10 includes a plurality of LEDs 13 mounted on an outer surface of a metal PCB 11 made of an octagonal pipe including a bottom surface.
  • the LED package 10 is cased by the glove 50 to the outside.
  • a heat dissipation device 30 for dissipating heat from the plurality of LEDs 13 is formed above the casing-treated LED package 10 by the glove 50.
  • the heat dissipation device 30 is formed by winding a heat dissipation fin in a spiral shape so as to be spaced apart at equal intervals.
  • the screw cap 70 is coupled to the upper portion of the heat dissipation device 30 to be inserted into a conventional socket.
  • FIG. 5 is a cross-sectional view taken along line A-A 'of the bulb-type LED lighting device of FIG.
  • the bulb type LED lighting device 1 includes an LED package 10 from below, a globe 50 casing the LED package 10, and an LED lighting device above the globe 50. 1) and a heat dissipation device (30) for dissipating heat transferred from, and a screw cap (70) for socket connection.
  • the LED package 10 includes a metal PCB 11 made of a polygonal (eg, octagonal) pipe including a bottom surface of a metal material, and a plurality of mounted on the outer surface of the metal substrate 11. LED 13 is provided.
  • a metal PCB 11 made of a polygonal (eg, octagonal) pipe including a bottom surface of a metal material, and a plurality of mounted on the outer surface of the metal substrate 11.
  • LED 13 is provided.
  • the metal substrate 11 is preferably made of a plate of a material having excellent thermal conductivity (for example, aluminum, copper, iron, or an alloy thereof).
  • the metal substrate 11 corresponding to the side of the octagonal pipe is composed of eight rectangular unit boards or an integral single board bent in an octagon.
  • a plurality of LEDs 13 are mounted on these unit substrates, for example, five LEDs 13 can be mounted in two rows.
  • the LED 13 can be mounted on the metal substrate 11 of the octagonal lower surface. This is to improve the light distribution to the lower side as well as the side light distribution.
  • the metal substrate 11 forms a plurality of through holes (not shown) through which the screws (not shown) penetrate, and uses the screws (not shown) in the screw holes 37 formed in the LED mounting portion 33 to mount the LED mounting portions (not shown). 33).
  • the LED mounting portion 33 includes a wiring hole 39 for connecting the wirings of the plurality of LEDs 13 to the upper portion of the lower passage 33a.
  • Such a preferable structure of the metal substrate 11 is that the direct mounting of a plurality of LEDs 13 on the surface of the metal substrate 11 eliminates the presence of an interface on the heat transfer path, thereby degrading the heat transferability by the interface effect. Can be prevented.
  • the metal substrate 11 is composed of an octagonal structure including a lower surface in the embodiment of Figure 4, it is possible to use a hexagonal, 10 or 12 polygonal pipe structure other than the octagon.
  • a hexagonal, 10 or 12 polygonal pipe structure other than the octagon since a plurality of LEDs 13 are mounted on the outer surface of the polygonal substrate and the lower surface of the polygonal substrate to form a three-dimensional lighting structure, a problem in which a large illuminance difference is generated between the direct portion and the side of the lighting device can be solved. Properties are greatly improved.
  • the flange 38 screwed by the screw coupling portion 38a to the upper portion of the LED package 10 described above serves to reflect light from the LED 13 and to the snap coupling portion 34 provided on the outside. Snaps the glove 50.
  • the flange 38 screws the heat dissipation device 30 to the screw coupling portion 38b provided inside the groove thereof.
  • the heat dissipation device 30 is formed in a central body having a cylindrical shape having a hollow, which is an upper passageway 31b, and a spiral shape on the outer circumferential surface of the body 31 and integrally formed with the body 31.
  • the heat radiation fin 32 is provided.
  • the heat dissipation area that can be in contact with the outside air is increased, as well as the conduction of heat conducted under the body 31 and convection by the external air occurs simultaneously. While circulating along the top, conduction and heat dissipation are made upward.
  • the heat dissipation fins 32 are formed in a spiral shape, but the blocking phenomenon does not occur when heat conduction or air flow is continuously performed along the air inlet space S1 from the lower side to the upper side, but a plurality of the heat dissipation fins are spaced apart.
  • the stacked structure formed by sequentially stacking a plurality of heat dissipation fins is not contiguous, and thus, conduction of heat along the plurality of heat dissipation fins is not achieved, and the flow of air is cut off, causing a blocking phenomenon.
  • the heat dissipation fin 32 structure of the present invention has higher heat dissipation efficiency than the conventional stacked heat dissipation fin structure.
  • the heat dissipation device 30 including the body 31 and the heat dissipation fins 32 transmits heat generated when the LED package 10 is driven to the upper side through the upper passage 31b to deteriorate the LED package 10. prevent.
  • the heat dissipation device 30 is made of a material having excellent thermal conductivity, for example, copper, aluminum or magnesium, or an alloy thereof, and the heat dissipation device 30 is copper, aluminum or magnesium, or the like.
  • a nano-size carbon nanotubes or carbon nanofibers as a pigment (pigment) may be reduced weight while improving the heat dissipation effect.
  • the body 31 of the heat dissipation device 30 is copper, aluminum, magnesium, or the like, or heat transfer by including about 0.1 to 20 wt.% Of nanoscale carbon nanotubes or carbon nanofibers in these alloys.
  • the weight can be reduced by about 20% while improving the properties to improve the heat dissipation effect.
  • the melting point of the alloy increases.
  • the melting point of an aluminum alloy containing 10 wt.% Of carbon nanotubes or carbon nanofibers is 1000 ° C or higher. It is characterized by ultra-light, super heat and ultra high strength that can withstand temperatures much higher than the melting point of 600 ⁇ 700 °C of aluminum that does not contain them.
  • the lower portion of the body 31 is provided with a convection hole 36 for convection of air and forms a seating groove 31a in the upper inner side of the body 31.
  • the connection housing 71 of the screw cap 70 is seated in the seating recess 31a, and the inside of the connection housing 73 is seated with the insulator 73 seated with the LED driving circuit 12 inserted therein.
  • the LED driving circuit 12 is formed of a circuit for driving a plurality of LEDs 13 constituting the LED package 10 is separated from the LED package 10 and the seating groove inside the body 31 of the heat dissipation device 30. It is seated at 31a.
  • connection housing 71 is seated in the seating groove 31a of the body 31 and at the same time, the connection housing 71 of the screw cap 70 is snapped by the upper snap coupling portion 35 of the heat dissipation device 30.
  • the screw cap 70 has a plurality of holes 72 formed in the connection housing 71, and forms a pair of electrical contacts 70a and 70b for insertion into a conventional socket.
  • the wires (not shown) drawn out from the LED package 10 are sequentially passed through the lower passage 33a and the upper passage 31b and connected to the LED driving circuit 12, and then the wires (not shown) from the LED driving circuit 12. C) is connected to a pair of electrical contacts 70a and 70b of the screw cap 70.
  • the glove 50 which is casing the LED package 10 is detachably coupled to the opening of the upper portion by the snap coupling portion 34 on the outside of the flange 38.
  • the glove 50 is made of a cylindrical or semi-spherical shape, one side of which is transparent or semitransparent.
  • the light emitted from the LED 13 is yellow or blue phosphor by treating the LED 13 of the LED package 10 to employ a blue or yellow LED and to coat or impregnate the yellow or blue phosphor on the globe 50. White light can be obtained while passing through.
  • FIG. 6 is an exploded cross-sectional view of the cross-sectional view of FIG.
  • connection housing 71 a pair of electrical contacts 70a and 70b for connecting a socket are fastened to the connection housing 71.
  • the connecting housing 71 is snap-coupled with the heat dissipation device 30 by the snap coupling part 35 while inserting the insulator 73 on which the LED driving circuit 12 is inserted.
  • the connecting housing 71 is seated in the mounting groove 31a of the heat dissipation device 30 with the insulator 73 inserted therein.
  • FIG. 7 is a front view of the bulb-type LED lighting apparatus according to an embodiment of the present invention.
  • a spiral heat dissipation device 30 is shown in an upper portion of the glove 50, and two contact points 70a and 70 are connected to a connection housing 71 in which a hole 72 is formed in an upper portion of the heat dissipation device 30.
  • the screw cap 70 with 70b) is shown.
  • FIG. 8 is a plan view of the bulb-type LED lighting apparatus according to an embodiment of the present invention.
  • connection housing 71 in which the two contacts 70a and 70b and the hole 72 are formed is shown, and the heat dissipation fin 32 is shown.
  • a spiral heat dissipation device provides more efficient heat dissipation characteristics to dissipate heat transferred from the LED package. It can have a high illumination LED lighting device can be implemented. This efficient heat dissipation allows more LEDs to be mounted compared to conventional LED lighting devices that consume the same power, and thus may have greater illuminance than conventional methods.
  • LED lighting apparatus can be applied to a new lighting device that can replace incandescent bulbs and fluorescent lamps.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne un dispositif dissipateur thermique et un dispositif d'éclairage par DEL en forme d'ampoule utilisant celui-ci. Ce dispositif dissipateur thermique comprend: plusieurs DEL intégrées sur la surface d'un substrat par une carte à circuit imprimé (PCB) métallique polygonale et qui peut maximiser l'émission thermique. Le dissipateur thermique selon l'invention comprend: un corps qui possède un passage central et qui est installé entre un boîtier de DEL dans lequel la pluralité de DEL est intégrée et un bouchon fileté qui alimente en électricité le boîtier de DEL; et des tiges de dissipation thermique qui sont intégrées avec le corps et s'étendent en spirale sur le plan extérieur du corps, des intervalles uniformes étant formés entre les tiges de dissipation thermique le long de la longueur du corps. Cette invention permet une émission efficace de la chaleur conduite à partir du boîtier de DEL même si la pluralité de DEL sont montées de manière dense.
PCT/KR2009/005599 2008-10-01 2009-09-30 Dispositif dissipateur thermique en spirale et dispositif d'éclairage par del en forme d'ampoule utilisant celui-ci WO2010038983A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0096647 2008-10-01
KR1020080096647A KR101007913B1 (ko) 2008-10-01 2008-10-01 나선형 방열장치 및 이를 이용한 전구형 ｌｅｄ 조명장치

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WO2010038983A2 true WO2010038983A2 (fr) 2010-04-08
WO2010038983A3 WO2010038983A3 (fr) 2010-07-22

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Cited By (5)

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WO2011088003A3 (fr) * 2010-01-12 2011-10-06 Ge Lighting Solutions, Llc. Composites polymères thermoconducteurs transparents pour la gestion thermique d'une source lumineuse
CN102401263A (zh) * 2011-11-30 2012-04-04 何军 一种螺旋灯罩式的led节能灯
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8227961B2 (en) 2010-06-04 2012-07-24 Cree, Inc. Lighting device with reverse tapered heatsink
US8596821B2 (en) 2010-06-08 2013-12-03 Cree, Inc. LED light bulbs
KR101157065B1 (ko) * 2011-02-07 2012-06-21 나노엘이디(주) 방열 및 방수 기능을 갖는 엘이디 램프
KR101289462B1 (ko) * 2011-06-08 2013-07-29 오명호 Ｌｅｄ 전구
KR101227526B1 (ko) * 2011-09-05 2013-01-31 엘지전자 주식회사 조명 장치
KR101227527B1 (ko) 2011-09-05 2013-01-31 엘지전자 주식회사 조명 장치
KR101315700B1 (ko) 2011-09-08 2013-10-10 엘지이노텍 주식회사 조명 장치
KR101896669B1 (ko) * 2011-11-17 2018-09-07 엘지이노텍 주식회사 조명 장치
KR102288143B1 (ko) * 2019-10-31 2021-08-10 주식회사 피티지 조명기구용 방열장치
KR102310367B1 (ko) * 2021-03-12 2021-10-07 한상현 차량용 미세 먼지 감지 센서

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050068776A1 (en) * 2001-12-29 2005-03-31 Shichao Ge Led and led lamp
JP2005286267A (ja) * 2004-03-31 2005-10-13 Hitachi Lighting Ltd 発光ダイオードランプ
KR200407799Y1 (ko) * 2005-11-24 2006-02-03 장인성 조명등
JP2006310212A (ja) * 2005-05-02 2006-11-09 Citizen Electronics Co Ltd バルブ型ｌｅｄ光源
JP2006313717A (ja) * 2005-04-08 2006-11-16 Toshiba Lighting & Technology Corp 電球型ランプ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100460064B1 (ko) * 2002-07-11 2004-12-04 주식회사 하이닉스반도체 반도체 소자의 금속배선 형성방법
US20070159828A1 (en) 2006-01-09 2007-07-12 Ceramate Technical Co., Ltd. Vertical LED lamp with a 360-degree radiation and a high cooling efficiency

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050068776A1 (en) * 2001-12-29 2005-03-31 Shichao Ge Led and led lamp
JP2005286267A (ja) * 2004-03-31 2005-10-13 Hitachi Lighting Ltd 発光ダイオードランプ
JP2006313717A (ja) * 2005-04-08 2006-11-16 Toshiba Lighting & Technology Corp 電球型ランプ
JP2006310212A (ja) * 2005-05-02 2006-11-09 Citizen Electronics Co Ltd バルブ型ｌｅｄ光源
KR200407799Y1 (ko) * 2005-11-24 2006-02-03 장인성 조명등

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp
WO2011088003A3 (fr) * 2010-01-12 2011-10-06 Ge Lighting Solutions, Llc. Composites polymères thermoconducteurs transparents pour la gestion thermique d'une source lumineuse
US8541933B2 (en) 2010-01-12 2013-09-24 GE Lighting Solutions, LLC Transparent thermally conductive polymer composites for light source thermal management
JP2016076495A (ja) * 2010-01-12 2016-05-12 ジーイー ライティング ソリューションズ エルエルシー 光源温度管理用の透明熱伝導性高分子複合材
CN102401263A (zh) * 2011-11-30 2012-04-04 何军 一种螺旋灯罩式的led节能灯
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US10139095B2 (en) 2012-05-04 2018-11-27 GE Lighting Solutions, LLC Reflector and lamp comprised thereof

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