WO2012015143A1 - Ampoule à diode électroluminescente utilisant un conducteur thermique - Google Patents

Ampoule à diode électroluminescente utilisant un conducteur thermique Download PDF

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Publication number
WO2012015143A1
WO2012015143A1 PCT/KR2011/002559 KR2011002559W WO2012015143A1 WO 2012015143 A1 WO2012015143 A1 WO 2012015143A1 KR 2011002559 W KR2011002559 W KR 2011002559W WO 2012015143 A1 WO2012015143 A1 WO 2012015143A1
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WO
WIPO (PCT)
Prior art keywords
housing
heat dissipating
led
led bulb
thermal conductor
Prior art date
Application number
PCT/KR2011/002559
Other languages
English (en)
Inventor
Woo Sun Choi
Ho Seop Park
Original Assignee
Kumho Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kumho Electric Co., Ltd. filed Critical Kumho Electric Co., Ltd.
Publication of WO2012015143A1 publication Critical patent/WO2012015143A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates generally to an LED bulb using a thermal conductor and, more particularly, to an LED bulb using a thermal conductor, in which a housing is formed using a thermal conductor, and a heat dissipating plate is integrated with the housing by conducting insert injection molding, so that the LED bulb is capable of easily dissipating heat that is generated by an LED element.
  • LED light emitting diode
  • the LED is advantageous in that the efficiency with which power is converted into light is excellent, the efficiency of light per unit power is high, its life span is long, power consumption is low, and high luminous intensity is obtained.
  • Such LEDs have been used for a variety of purposes.
  • LED lights are advantageous because the processing speed is high and power consumption is low, whereas LED lights are disadvantageous because the light emitting part comprises a semiconductor element, so that it is more vulnerable to heat than are incandescent bulbs or fluorescent lights. That is, since LED lights are constructed so that a plurality of LED elements is mounted on an LED module, the amount of heat that is generated is large.
  • a conventional LED bulb mainly includes a light transmitting cover, a housing, a bottom case into which an inverter is inserted, and a socket.
  • the conventional LED bulb connects the inverter connected to the socket with an LED module having an LED element thereon via wires so as to supply power to the LED element.
  • the socket, the bottom case, the housing, and the light transmitting cover must be integrally fastened to and assembled with each other.
  • an increase in the number of assembling processes unnecessarily consumes assembling labor, managing labor, and material costs.
  • the conventional LED bulb is problematic in that the surface area of the housing is relatively small, and an additional heat dissipating structure is not provided, so that it is difficult to effectively dissipate heat emitted from the LED element.
  • it is impossible to supply a predetermined or more of electric current to the LED element, so that a relatively large number of LED modules are required to use the LED element as a lighting apparatus.
  • an object of the present invention is to provide an LED bulb using a thermal conductor, which is constructed so that a heat dissipating plate is integrated with a housing by insert injection molding.
  • Another object of the present invention is to provide an LED bulb using a thermal conductor, which does not require a bottom case into which an inverter is inserted, by using a connector fastened to the inverter.
  • a further object of the present invention is to provide an LED bulb using a thermal conductor, which is constructed so that a plurality of heat dissipating protrusions protrudes from an outer circumferential surface of a housing that is formed using a thermal conductor, thus increasing the surface area of the housing, therefore effectively dissipating the heat generated by an LED element.
  • Yet another object of the present invention is to provide an LED bulb using a thermal conductor, in which a housing and a light transmitting cover are constructed to be fastened to each other in a rotary locking manner, thus allowing the housing and the light transmitting cover to be fastened to each other in a simple manner.
  • the present invention provides an LED bulb using a thermal conductor, including an LED module having a PCB on which at least one LED element is mounted, a housing having a plurality of heat dissipating protrusions which protrude from an outer circumferential surface thereof, and made of a thermal conductor, with a thread being formed on a predetermined portion of the housing, a light transmitting cover having a thread by which the cover can be fastened to the thread which is formed on the predetermined portion of the housing, in a threaded manner, an inverter supplying a direct current to the LED module, a heat dissipating plate provided between the LED module and the housing to dissipate heat generated by the LED element, and a socket fastened to the housing.
  • the heat dissipating plate may be integrated with the housing by insert injection when the housing is formed.
  • the heat dissipating plate may further include a heat dissipating part which is provided on a lower portion of the heat dissipating plate that faces the housing, and has at least one of a wavy shape and an uneven shape.
  • the heat dissipating plate may be made of a material having heat conductivity.
  • the LED bulb may further include a connector coupled to the inverter by a one-touch-type coupling manner.
  • the plurality of heat dissipating protrusions may be radially arranged on the outer circumferential surface of the housing in such a way as to protrude in a direction perpendicular to an axial direction of the housing.
  • each of the heat dissipating protrusions may be tapered such that an area thereof increases in a direction from a lower portion to an upper portion of the housing.
  • the inverter may be connected to the socket via an electrode wire, and may convert an alternating current, input from an outside through the socket, into a direct current and then supply the direct current to the LED module.
  • the housing may be formed using a thermal conductive resin including thermal conductive plastics.
  • the present invention provides an LED bulb using a thermal conductor, which is constructed so that a heat dissipating plate is integrated with a housing by insert injection molding, thus allowing heat generated by an LED element to be easily dissipated.
  • the present invention provides an LED bulb using a thermal conductor, which does not require a bottom case into which an inverter is inserted, by using a connector fastened to the inverter, thus reducing the number of the assembling processes of the LED bulb, the assembling and managing labor, and material costs.
  • the present invention provides an LED bulb using a thermal conductor, which is constructed so that a plurality of heat dissipating protrusions protrudes from an outer circumferential surface of a housing that is formed using a thermal conductor, thus increasing the surface area of the housing, therefore effectively dissipating the heat generated by an LED element, and the housing is formed using a light thermal conductor, thus reducing the weight of the LED bulb.
  • the present invention provides an LED bulb using a thermal conductor, in which a housing and a light transmitting cover are constructed to be fastened to each other in a rotary locking manner, thus allowing the housing and the light transmitting cover to be fastened to each other in a simple manner.
  • FIG. 1 is a perspective view showing an LED bulb using a thermal conductor according to an embodiment of the present invention
  • FIG. 2 is a front view showing the LED bulb using the thermal conductor according to the embodiment of the present invention.
  • FIG. 3 is a sectional view showing the LED bulb using the thermal conductor according to the embodiment of the present invention.
  • FIG. 4 is an enlarged view illustrating a heat dissipating plate of FIG. 3;
  • FIG. 5 is an enlarged view illustrating another embodiment of the heat dissipating plate of FIG. 3;
  • FIG. 6 is an enlarged view illustrating a further embodiment of the heat dissipating plate of FIG. 3;
  • FIG. 7 is an enlarged view illustrating a connector and inverter fastening structure of FIG. 3;
  • FIG. 8 is an exploded perspective view showing the LED bulb using the thermal conductor according to the embodiment of the present invention.
  • FIG. 1 is a perspective view showing an LED bulb using a thermal conductor according to an embodiment of the present invention.
  • FIG. 2 is a front view showing the LED bulb using the thermal conductor according to the embodiment of the present invention.
  • FIG. 3 is a sectional view showing the LED bulb using the thermal conductor according to the embodiment of the present invention.
  • FIG. 4 is an enlarged view illustrating a heat dissipating plate of FIG. 3.
  • FIG. 5 is an enlarged view illustrating another embodiment of the heat dissipating plate of FIG. 3.
  • FIG. 6 is an enlarged view illustrating a further embodiment of the heat dissipating plate of FIG. 3.
  • FIG. 7 is an enlarged view illustrating a connector and inverter fastening structure of FIG. 3.
  • FIG. 8 is an exploded perspective view showing the LED bulb using the thermal conductor according to the embodiment of the present invention.
  • an LED bulb 100 using a thermal conductor of the present invention includes a light transmitting cover 10, a housing 20, and a socket 30.
  • the hemispherical light transmitting cover 10 and the housing 20 are fastened to each other in a rotary locking manner, namely, a threaded manner.
  • threads 10a and 20b are formed, respectively, on predetermined portions of the light transmitting cover 10 and the housing 20 so that they are fastened to each other in a threaded manner.
  • the light transmitting cover 10 and the housing 20 can be simply fastened to each other.
  • the light transmitting cover 10 has a hemispherical shape, but is not limited to the hemispherical shape. As long as only the area of the light transmitting cover 10 having the thread 10a to be fastened to the housing 20 has a circular shape, the light transmitting cover 10 may have any shape.
  • An LED module 50 is adhered to the housing 20 in such a way as to face the light transmitting cover 10, and includes a PCB on which a plurality of LED elements 40 is mounted.
  • the housing 20 includes a plurality of heat dissipating protrusions 20a which protrude from the outer circumferential surface of the housing 20.
  • the heat dissipating protrusions 20a protrude from the outer circumferential surface of the housing 20 in a direction perpendicular to an axial direction, and are radially arranged.
  • the heat dissipating protrusions 20a may protrude integrally from the outer circumferential surface of the housing 20.
  • each heat dissipating protrusion 20a is tapered such that its area increases in a direction from a lower portion to an upper portion of the housing 20.
  • the heat dissipating protrusion 20a is shaped such that its area is gradually increased in a direction from the lower portion of the housing 20, that is, a position adjacent to the socket 30, through a position adjacent to the middle portion of the housing 20, to the upper portion of the housing 20, that is, a position adjacent to the LED module 50.
  • the LED bulb 100 includes the plurality of heat dissipating protrusions 20a on the housing 20, thus enlarging the surface area of the housing 20. Especially, since the area of each heat dissipating protrusion 20a is increased towards a surface of the housing 20 to which the LED module 50 is adhered, namely, towards the upper portion of the housing 20, heat generated from the LED elements 40 can be dissipated as quickly as possible.
  • the housing 20 itself is made of a thermal conductor resin such as a plastic, thus reducing the weight of the LED bulb 100, and lowering the temperature of heat generated by the housing 20.
  • a heat dissipating plate 55 is integrated with the housing 20 in such a way as to be in contact with a surface of the housing 20.
  • the LED module 50 makes contact with a PCB on which the plurality of LED elements 40 is mounted and is furthermore assembled with the heat dissipating plate 55 which is formed in the housing 20 by insert injection.
  • Insert injection is a method of integrating different kinds or colors of plastics with each other or integrating plastics with parts (metal, electric wires, magnets, etc.) other than the plastics in a mold. This method provides a molded product having characteristics which are difficult to be achieved exclusively by the use of plastics.
  • the molded product is shown in FIGS. 4 to 6.
  • the heat dissipating plate 55 formed in the housing 20 by insert injection includes a heat dissipating part 60, and the housing 20 has a fastening hole 60a so that the heat dissipating part 60 is inserted into the fastening hole 60a.
  • heat dissipating parts 60 may be located, respectively, at positions where the heat dissipating plate 55 is trisected, and besides, fastening holes 60a may be preferably formed to correspond to the heat dissipating parts 60.
  • the housing 20 facing the heat dissipating part 60 also has a wavy shape to correspond to the wavy heat dissipating part 60 formed on the heat dissipating plate 55, so that the heat dissipating part 60 may be fastened to the housing 20.
  • the housing 20 facing the heat dissipating part 60 also has an uneven shape that corresponds to the uneven shape of the heat dissipating part 60 formed on the heat dissipating plate 55, so that the heat dissipating part 60 may be fastened to the housing 20.
  • the surface area of the heat dissipating part 60 is enlarged, thus allowing heat generated by the LED elements 40 to be more effectively dissipated.
  • the following table 1 shows the results of performing experiments on the LED bulb 100 according to the present invention.
  • the LED bulb described as an “aluminum housing” means an LED bulb that does not have the heat dissipating plate which is manufactured by insert injection molding.
  • the LED bulb described as a “heat dissipating plate (1mm)” means an LED bulb having a heat dissipating plate wich is manufactured by insert injection molding and has the thickness of 1mm.
  • the conventional LED bulb having the aluminum housing has a heat conductivity of 8.1 when the external average temperature of the housing and the maximum temperature of the housing are 45.4°C and 45.6°C, respectively.
  • the LED bulb 100 of the present invention which includes the heat dissipating plate 55 of 1mm has heat conductivity equal to that of the conventional LED bulb when the external average temperature of the housing 20 is 54.9°C, the maximum temperature of the housing 20 is 61.7°C, the average temperature of the surface of the heat dissipating plate 55 is 61.7°C, and the maximum temperature of the heat dissipating plate 55 is 61.9°C.
  • the inverter 70 is a device that converts alternating current into direct current.
  • the inverter 70 converts an alternating current, input from the socket 30 through electrode wires 70a, into a direct current, and supplies the direct current through the connector 45 to the LED module 50.
  • the connector 45 and the inverter 70 are constructed to be coupled to each other in a one-touch-type coupling manner.
  • pressure acts on ends of the connector 45 and the inverter 70, so that the connector 45 is coupled to the inverter 70. Since the connector 45 passes through the LED module 50 and is fitted over the inverter 70, direct current can be supplied to the LED module 50. This is shown in FIG. 7.
  • the present invention provides the LED bulb 100 which does not need the bottom case into which the inverter 70 is inserted, thus saving on resources including assembling processes, the labor used to assemble and manage, and material costs. Further, the connector 45 and the inverter 70 are coupled in a one-touch-type coupling manner, so that the connector 45 can be more easily coupled to the inverter 70.
  • each heat dissipating protrusion 20a has a tapered shape, but is not limited to the tapered shape. That is, the heat dissipating protrusion 20a may have the shape of a streamlined wedge or a right-angled triangular wedge. As such, the shape of the heat dissipating protrusion 20a may be freely changed depending on the shape of the housing 200.
  • the heat dissipating protrusion 20a protrudes integrally from the outer circumferential surface of the housing 20, but is not limited to the shape. That is, after a plurality of heat dissipating protrusions 20a is separately manufactured, the heat dissipating protrusions 20a may be adhered to the outer circumferential surface of the housing 20.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

La présente invention concerne une ampoule à LED utilisant un conducteur thermique. L'ampoule à LED comprend un module à LED ayant une carte de circuit imprimé sur laquelle au moins un élément à LED est monté. Un boîtier possède une pluralité de saillies de dissipation thermique qui dépassent de sa surface circonférentielle extérieure, et est constitué d'un conducteur thermique, avec un filetage formé sur une partie déterminée du boîtier. Un couvercle transmettant la lumière possède un filetage au moyen duquel le couvercle peut être fixé sur le filetage qui est formé sur la partie prédéterminée du boîtier, d'une manière filetée. Un onduleur fournit un courant continu au module à LED. Une plaque de dissipation thermique est disposée entre le module à LED et le boîtier afin de dissiper la chaleur générée par l'élément à LED. Une douille est fixée au boîtier.
PCT/KR2011/002559 2010-07-29 2011-04-12 Ampoule à diode électroluminescente utilisant un conducteur thermique WO2012015143A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2010-0073128 2010-07-29
KR20100073128 2010-07-29
KR10-2010-0101486 2010-10-18
KR1020100101486A KR101028339B1 (ko) 2010-07-29 2010-10-18 열전도체를 사용한 엘이디 전구

Publications (1)

Publication Number Publication Date
WO2012015143A1 true WO2012015143A1 (fr) 2012-02-02

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PCT/KR2011/002559 WO2012015143A1 (fr) 2010-07-29 2011-04-12 Ampoule à diode électroluminescente utilisant un conducteur thermique

Country Status (3)

Country Link
US (1) US20120025708A1 (fr)
KR (1) KR101028339B1 (fr)
WO (1) WO2012015143A1 (fr)

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CN103939754A (zh) * 2013-01-18 2014-07-23 合肥杰事杰新材料股份有限公司 一种led灯及其制备方法
US8824579B2 (en) 2011-09-23 2014-09-02 Nokia Siemens Networks Oy Codebook performance for non-linear arrays
PT107398A (pt) * 2014-01-12 2015-07-13 Octávio Adolfo Romão Viana Filme de politereftalato de etileno e grafeno e/ou óxido de grafeno

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KR101846403B1 (ko) 2011-07-08 2018-04-06 엘지이노텍 주식회사 조명 장치
CN103196042B (zh) * 2012-01-10 2016-08-24 欧司朗股份有限公司 照明装置及其制造方法
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TW201250154A (en) * 2012-07-23 2012-12-16 Kenner Material & System Co Ltd Structure of plastic heat sink for LED bulb and method of making the same
CN103196082B (zh) * 2013-04-15 2015-11-25 深圳市华星光电技术有限公司 背光模组及液晶显示器
KR102272782B1 (ko) * 2013-04-19 2021-07-08 코베스트로 엘엘씨 몰드 내 전자 인쇄 회로 기판 캡슐화 및 조립체
KR101718787B1 (ko) 2015-08-24 2017-03-23 주식회사 카즈머스 스마트 전구용 커넥터
CN105444063B (zh) * 2015-12-25 2018-05-04 珠海市洁源电器有限公司 导热塑件与装载电源基板注塑一体成型的led灯及工艺
KR101992286B1 (ko) * 2018-01-30 2019-07-19 주식회사 엔씽 식물 생장률 향상을 위한 ｌｅｄ 조명 장치

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KR20100007038U (ko) * 2008-12-31 2010-07-08 (주)카인스 글로브 교체가 용이하고 방열판 길이에 따른 부품의 호환성확보되고 조립성이 양호한 엘이디 전구 구조
KR100933990B1 (ko) * 2009-05-20 2009-12-28 주식회사 파인테크닉스 다운 램프용 발광다이오드형 조명등

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US8824579B2 (en) 2011-09-23 2014-09-02 Nokia Siemens Networks Oy Codebook performance for non-linear arrays
CN102606999A (zh) * 2012-04-01 2012-07-25 无锡优塑美科技有限公司 Led球泡灯用散热器
CN103939754A (zh) * 2013-01-18 2014-07-23 合肥杰事杰新材料股份有限公司 一种led灯及其制备方法
PT107398A (pt) * 2014-01-12 2015-07-13 Octávio Adolfo Romão Viana Filme de politereftalato de etileno e grafeno e/ou óxido de grafeno

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