CN105444063B - 导热塑件与装载电源基板注塑一体成型的led灯及工艺 - Google Patents

导热塑件与装载电源基板注塑一体成型的led灯及工艺 Download PDF

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CN105444063B
CN105444063B CN201511008330.6A CN201511008330A CN105444063B CN 105444063 B CN105444063 B CN 105444063B CN 201511008330 A CN201511008330 A CN 201511008330A CN 105444063 B CN105444063 B CN 105444063B
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CN105444063A (zh
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于美华
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ZHUHAI CITY ELECTRIC CO Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
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    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013—Conductive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
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    • F21Y2115/10—Light-emitting diodes [LED]

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  • Manufacturing & Machinery (AREA)
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Abstract

本发明涉及一种导热塑件与装载电源基板注塑一体成型的LED灯及工艺，该LED灯包括有灯壳和LED模组，所述灯壳由导热塑胶材料注塑成型，其内设有注塑连接一体的LED模组；所述LED模组包括铝基板和电源电路模块，所述铝基板上设有LED灯珠，所述LED灯珠与电源电路模块导通连接。本发明所述LED灯的灯壳在注塑过程已将LED模组注塑连接一体，可大大简化后续组装工序，生产效率显著提高，装配人员大大减少，同时灯体采用导热塑胶材料注塑，使LED灯的生产成本降低50％以上，市场竞争力极强，容易获得商业成功，而且结构非常巧妙、简洁。

Description

导热塑件与装载电源基板注塑一体成型的LED灯及工艺
技术领域
本发明属于LED照明灯具技术领域，特别涉及一种导热塑件与装载电源基板注塑一体成型的LED灯及工艺。
背景技术
LED灯具以其亮度高、节能环保、散热性好、性能稳定可靠、使用寿命长等优点被广大消费者喜欢、接受，已被普及应用，并逐渐取代传统的普能节能灯。
目前，现在市场上的LED灯具，如天花灯和筒灯等，包括有灯壳、设有LED灯珠的铝基板、电源电路模块、反光杯、透明灯罩和电源盖，构成组件较多，需要逐一装配到灯壳上，组装工序麻烦、耗时，组装效率极低，需要装配人员多，从而造成生产成本大大提高，而且人手组装，质量难以保证；另外，这些LED灯具的灯壳均采用金属材料制作，成本较高，同时反光杯蒸镀工艺废品率高，不仅增加了生产成本，还对环境污染大。
发明内容
为了解决现有技术中存在的上述技术问题，本发明提供了一种在灯壳注塑过程将LED模组注塑连接一体，大大简化后续组装工序，生产效率高，生产成本低，且结构非常巧妙、简洁，市场竞争力极强，容易获得商业成功的导热塑件与装载电源基板注塑一体成型的LED灯，以及该LED灯的加工工艺。
为解决上述技术问题，本发明采用如下技术方案：
一种导热塑件与装载电源基板注塑一体成型的LED灯，包括有灯壳和LED模组，所述灯壳由导热塑胶材料注塑成型，其内设有注塑连接一体的LED模组；所述LED模组包括铝基板和电源电路模块，所述铝基板上设有LED灯珠，所述LED灯珠与电源电路模块导通连接。
进一步地，所述LED模组还包括有复合支架，所述复合支架包括绝缘上层和导热金属下层，所述绝缘上层与导热金属下层注塑连接一体；所述铝基板和电源电路模块分别安装在复合支架的导热金属下层和绝缘上层上；所述LED模组设于灯壳内，且绝缘上层和导热金属下层的周向缘边与灯壳注塑连接一体。
进一步地，所述灯壳采用尼龙塑胶材料制作，所述绝缘上层采用PBT绝缘塑胶材料制，且两者注塑连接一体，所述导热金属下层是导热铝板支架。
进一步地，所述LED灯是筒灯，其灯壳内安装有反光杯，所述反光杯表面粘贴有反光膜。
一种导热塑件与装载电源基板注塑一体成型的LED灯的加工工艺，包括：
首先把导热金属下层固定在绝缘上层的注塑模具内，将导热金属下层与绝缘上层注塑连接一体，形成复合支架；
然后分别把铝基板和电源电路模块安装在复合支架的导热金属下层和绝缘上层上，并通过导线将铝基板上的LED灯珠与电源电路模块连接；形成LED模组；
最后把LED模组固定在灯壳的注塑模具内，将LED模组的绝缘上层和导热金属下层的周向缘边与灯壳注塑连接一体，形成LED灯体。
本发明的有益效果是：
本发明通过上述技术方案，即可在灯壳注塑过程将LED模组注塑连接一体，大大简化后续组装工序，生产效率显著提高，节省装配人员，同时灯体采用导热塑胶材料制作，降低了生产成本，市场竞争力极强，容易获得商业成功，而且结构非常巧妙、简洁。
附图说明
下面结合附图与具体实施例对本发明作进一步说明：
图1是本发明所述导热塑件与装载电源基板注塑一体成型的LED灯实施例的剖视结构示意图；
图2是本发明所述导热塑件与装载电源基板注塑一体成型的LED灯实施例中LED模组的结构示意图；
图3是本发明所述导热塑件与装载电源基板注塑一体成型的LED灯的加工工艺流程图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本发明。
如图1和图2中所示：
本发明实施例所述一种导热塑件与装载电源基板注塑一体成型的LED灯，该LED灯是天花灯，包括有灯壳1和LED模组2，所述灯壳1由导热塑胶材料注塑成型，其内设有注塑连接一体的LED模组2；所述LED模组2包括铝基板21和电源电路模块22，所述铝基板21上设有LED灯珠23，所述LED灯珠23可通过导线(图中未表示出来)与电源电路模块22导通连接。具体结构可以为：所述LED模组2还包括有铝基板21、电源电路模块22和复合支架24，所述复合支架24包括绝缘上层241和导热金属下层242，所述绝缘上层241与导热金属下层242注塑连接一体；所述铝基板21和电源电路模块22分别安装在复合支架24的导热金属下层242和绝缘上层241上；所述LED模组2设于灯壳1内，且绝缘上层241和导热金属下层242的周向缘边与灯壳1(二次)注塑连接一体。其中，所述灯壳1采用尼龙塑胶材料制作，所述绝缘上层241采用PBT绝缘塑胶材料制，且两者注塑连接一体；所述导热金属下层242是导热铝板支架。
如图3所示，本发明所述导热塑件与装载电源基板注塑一体成型的LED灯采用以下加工工艺制作而成，具体包括以下步骤：
步骤A1.把导热金属下层242固定在绝缘上层241的注塑模具内，将导热金属下层242与绝缘上层241注塑连接一体，形成复合支架24；
步骤A2.分别把铝基板21和电源电路模块22安装在复合支架24的导热金属下层242和绝缘上层241上，并通过导线将铝基板21上的LED灯珠23与电源电路模块22连接，形成LED模组2；
步骤A3.把LED模组2固定在灯壳1的注塑模具内，将LED模组2的绝缘上层241和导热金属下层242的周向缘边与灯壳1注塑连接一体，形成LED灯体。
这样，本发明所述LED灯的灯壳1在注塑过程已将LED模组2注塑连接一体，可大大简化后续组装工序(只需安装透明灯罩3和电源盖4)，生产效率显著提高，装配人员大大减少，同时灯体1采用导热塑胶材料注塑，不仅使LED灯的生产成本降低50％以上，市场竞争力极强，容易获得商业成功，而且结构非常巧妙、简洁。
当然，本发明所述LED灯也可以筒灯等LED灯具，所述LED模组2中的铝基板21和电源电路模块22也可直接固定在灯壳1的注塑模具内，与灯壳1注塑连接一体，而且作为筒灯，其灯壳1内安装有反光杯，所述反光杯表面粘贴有反光膜(图中未表示出来)，这样即可有效解决传统蒸镀反光杯难度大、报废率高的问题，产品成本降低。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (4)

1.一种导热塑件与装载电源基板注塑一体成型的LED灯，其特征在于，包括有灯壳(1)和LED模组(2)，所述灯壳(1)由导热塑胶材料注塑成型，其内设有注塑连接一体的LED模组(2)；所述LED模组(2)包括铝基板(21)和电源电路模块(22)，所述铝基板(21)上设有LED灯珠(23)，所述LED灯珠(23)与电源电路模块(22)导通连接；
所述LED模组(2)还包括有复合支架(24)，所述复合支架(24)包括绝缘上层(241)和导热金属下层(242)，所述绝缘上层(241)与导热金属下层(242)注塑连接一体；所述铝基板(21)和电源电路模块(22)分别安装在复合支架(24)的导热金属下层(242)和绝缘上层(241)上；所述LED模组(2)设于灯壳(1)内，且绝缘上层(241)和导热金属下层(242)的周向缘边与灯壳(1)注塑连接一体。
2.根据权利要求1所述的导热塑件与装载电源基板注塑一体成型的LED灯，其特征在于，所述灯壳(1)采用尼龙塑胶材料制作，所述绝缘上层(241)采用PBT绝缘塑胶材料制，且两者注塑连接一体；所述导热金属下层(242)是导热铝板支架。
3.根据权利要求1或2所述的导热塑件与装载电源基板注塑一体成型的LED灯，其特征在于，所述LED灯是筒灯，其灯壳(1)内安装有反光杯，所述反光杯表面粘贴有反光膜。
4.一种上述权利要求2所述导热塑件与装载电源基板注塑一体成型的LED灯的加工工艺，其特征在于，包括：
首先把导热金属下层(242)固定在绝缘上层(241)的注塑模具内，将导热金属下层(242)与绝缘上层(241)注塑连接一体，形成复合支架(24)；
然后分别把铝基板(21)和电源电路模块(22)安装在复合支架(24)的导热金属下层(242)和绝缘上层(241)上，并通过导线将铝基板(21)上的LED灯珠(23)与电源电路模块(22)连接；形成LED模组(2)；
最后把LED模组(2)固定在灯壳(1)的注塑模具内，将LED模组(2)的绝缘上层(241)和导热金属下层(242)的周向缘边与灯壳(1)注塑连接一体，形成LED灯体。
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