CN202469983U - Led灯的散热结构 - Google Patents

Led灯的散热结构 Download PDF

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Publication number
CN202469983U
CN202469983U CN2012200708948U CN201220070894U CN202469983U CN 202469983 U CN202469983 U CN 202469983U CN 2012200708948 U CN2012200708948 U CN 2012200708948U CN 201220070894 U CN201220070894 U CN 201220070894U CN 202469983 U CN202469983 U CN 202469983U
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China
Prior art keywords
led
metalwork
dividing plate
heat dissipation
led lamp
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Expired - Fee Related
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CN2012200708948U
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English (en)
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周南庆
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Mainhouse Xiamen Electronics Co Ltd
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Mainhouse Xiamen Electronics Co Ltd
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

本实用新型公开了一种LED灯的散热结构,包括作为散热体的塑料壳体及金属件,该塑料壳体外侧成型有若干鳍片;所述的金属件为两端开放的筒状体,在筒状体的内侧中部成型有隔板,所述LED灯的LED芯片固定在该隔板的下方,该金属件与塑料壳体注塑后结构在一起,LED灯的线路板设置在该隔板的上方。该隔板的设置使LED芯片完全与金属件接触,从而更利于芯片的散热。

Description

LED灯的散热结构
技术领域
[0001] 本实用新型涉及一种灯具,尤指一种LED灯的散热结构。
背景技术
[0002] LED节能灯与普通的节能灯相比,具有光效高、耗电少、寿命长等优点,因此越来越受到人们的青睐。但是,LED芯片的发热量较高,必须设置特殊的散热结构。
[0003] 如图1、2、3所示,现有的LED灯主要由灯头I '、壳体2'、金属件3'、LED芯片4'及灯罩5'组成,在壳体2'之内安装有线路板等。为了达到良好的散热效果,一般LED灯的整个壳体I'都被设计成一个散热体,即在该壳体I '的外侧成型有若干鳍片,为了降低成本,该壳体I '通常为塑料制成,具有鳍片的塑料壳体虽然可以起到散热的效果,但是,LED芯片4'的热量却不易被传导至壳体I '上,为此,需要增加一个金属件3 ',将该金属件3'与壳体I'注塑结合在一起,之后将LED芯片4'固定在金属件3'上,这样即可由金属件3'将LED芯片4'发出的热量传导至壳体I'上,再由壳体I'的鳍片将热量散发出去。然而由于壳体I '内要安装线路板,因此金属件3 '也必须为中空结构,为了固定LED芯片4',中空的金属件3'下方设置有凸沿31',这种结构使LED芯片4 '只有边缘与散热材料接触,热量只能从边缘处散发出去,中间部分则悬空,没有贴到散热材料,因此散热效果较差,芯片易损坏,有待改进。
实用新型内容
[0004] 本实用新型所要解决的技术问题在于提供一种LED灯的散热结构,该散热结构即可使LED芯片与散热材料充分接触以提高散热效果,又可保证具有足够的线路板安装空间。
[0005] 为解决上述技术问题,本实用新型的技术解决方案是:
[0006] —种LED灯的散热结构,包括作为散热体的塑料壳体及金属件,该塑料壳体外侧成型有若干鳍片;所述的金属件为两端开放的筒状体,在筒状体的内侧中部成型有隔板,所述LED灯的LED芯片固定在该隔板的下方,该金属件与塑料壳体注塑后结构在一起,LED灯的线路板设置在该隔板的上方。
[0007] 所述的塑料壳体内侧中部也可设置有隔板,该隔板紧贴在所述金属件的隔板上方。
[0008] 采用上述方案后,由于本实用新型将金属件甚至塑料壳体由隔板区隔出两部分,隔板的下方将LED芯片固定其上,这样芯片完全与金属件接触,金属件的隔板上方又可与塑料壳体的隔板接触,因此可顺利将LED芯片发出的热量传导至塑料壳体,从而更利于芯片的散热。而隔板上方可以做为LED灯线路板的安装空间,又可阻隔LED芯片的热量传导至线路板,防止线路板过热而损坏。
附图说明[0009] 图I是现有LED灯的立体分解图一;
[0010] 图2是现有LED灯的立体分解图二 ;
[0011] 图3是现有LED灯的组合剖视图;
[0012] 图4是本实用新型的立体分解图一;
[0013] 图5是本实用新型的立体分解图二 ;
[0014] 图6是本实用新型的组合剖视图。
具体实施方式 [0015] 下面结合附图和具体实施例对本实用新型作进一步详述。
[0016] 本实用新型所揭示的是一种LED灯的散热结构,如图4、5、6所示,为本实用新型的较佳实施例。所述的LED灯与现有的LED灯相同,也包括灯头I、塑料壳体2、金属件3、LED芯片4以及灯罩5,在LED芯片4外侧还可设置透镜6,该塑料壳体2之内则安装有线路板等,其外侧成型有若干鳍片。
[0017] 本实用新型的改进之处在于作为散热体的塑料壳体2及金属件3。所述的金属件3为两端开放的筒状体,在筒状体的内侧中部成型有隔板31,所述的LED芯片4固定在该隔板31的下方,该金属件3与塑料壳体2注塑后结构在一起。由于所述的LED芯片4完全紧贴在金属件3上,因此可将芯片散发出的热量顺利通过金属件3传导至塑料壳体2上,从而更利于LED芯片4的散热。而金属件3的隔板31上方的空间可以用来安装线路板,不会影响产品的正常使用。
[0018] 另外,所述的塑料壳体2内侧中部也可设置隔板21,该隔板21紧贴在所述金属件3的隔板31上方。在塑料壳体2内设置了隔板21之金属件3上的热量更容易被传导至塑 料壳体2上,从而可以更进一步的利于芯片散热。此外,还可以阻隔芯片的热量传导至所述隔板21上的线路板上,防止线路板过热而损坏。
[0019] 以上所述,仅为本实用新型的较佳实施例而已,并非用来限定本实用新型实施的范围。故但凡依本实用新型的权利要求和说明书所做的变化或修饰,皆应属于本实用新型 专利涵盖的范围之内。

Claims (2)

1. 一种LED灯的散热结构,包括作为散热体的塑料壳体及金属件,该塑料壳体外侧成型有若干鳍片;其特征在于:所述的金属件为两端开放的筒状体,在筒状体的内侧中部成型有隔板,所述LED灯的LED芯片固定在该隔板的下方,该金属件与塑料壳体注塑后结构在一起,LED灯的线路板设置在该隔板的上方。
2.根据权利要求I所述的LED灯的散热结构,其特征在于:所述的塑料壳体内侧中部也可设置有隔板,该隔板紧贴在所述金属件的隔板上方。
CN2012200708948U 2012-02-29 2012-02-29 Led灯的散热结构 Expired - Fee Related CN202469983U (zh)

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Application Number Priority Date Filing Date Title
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Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN2012200708948U CN202469983U (zh) 2012-02-29 2012-02-29 Led灯的散热结构
EP12869620.0A EP2821696A4 (en) 2012-02-29 2012-08-22 BEAM STRUCTURE OF AN LED LAMP
US14/005,504 US20150003082A1 (en) 2012-02-29 2012-08-22 Led lamp radiating structure
GB1317093.1A GB2514201A (en) 2012-02-29 2012-08-22 LED Lamp radiating structure
PCT/CN2012/080442 WO2013127161A1 (zh) 2012-02-29 2012-08-22 Led灯的散热结构
ZA2014/04341A ZA201404341B (en) 2012-02-29 2014-06-12 Led lamp radiating structure

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CN202469983U true CN202469983U (zh) 2012-10-03

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EP (1) EP2821696A4 (zh)
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GB (1) GB2514201A (zh)
WO (1) WO2013127161A1 (zh)
ZA (1) ZA201404341B (zh)

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CN106151932A (zh) * 2015-04-16 2016-11-23 正屋(厦门)电子有限公司 一种双面led灯结构
CN106907695A (zh) * 2017-03-29 2017-06-30 周翔 一种led灯散热件及其加工方法

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CN113531503A (zh) * 2021-07-08 2021-10-22 中节能晶和科技有限公司 一种led灯具散热结构及其制造方法

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Publication number Priority date Publication date Assignee Title
CN106151932A (zh) * 2015-04-16 2016-11-23 正屋(厦门)电子有限公司 一种双面led灯结构
CN105444063A (zh) * 2015-12-25 2016-03-30 珠海市洁源电器有限公司 导热塑件与装载电源基板注塑一体成型的led灯及工艺
CN105444063B (zh) * 2015-12-25 2018-05-04 珠海市洁源电器有限公司 导热塑件与装载电源基板注塑一体成型的led灯及工艺
CN106907695A (zh) * 2017-03-29 2017-06-30 周翔 一种led灯散热件及其加工方法

Also Published As

Publication number Publication date
US20150003082A1 (en) 2015-01-01
EP2821696A4 (en) 2015-11-04
GB2514201A (en) 2014-11-19
ZA201404341B (en) 2015-08-26
EP2821696A1 (en) 2015-01-07
GB201317093D0 (en) 2013-11-06
WO2013127161A1 (zh) 2013-09-06

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