WO2010053250A1 - Appareil d’éclairage à diode électroluminescente - Google Patents

Appareil d’éclairage à diode électroluminescente Download PDF

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Publication number
WO2010053250A1
WO2010053250A1 PCT/KR2009/004675 KR2009004675W WO2010053250A1 WO 2010053250 A1 WO2010053250 A1 WO 2010053250A1 KR 2009004675 W KR2009004675 W KR 2009004675W WO 2010053250 A1 WO2010053250 A1 WO 2010053250A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
light
heat
heat dissipation
Prior art date
Application number
PCT/KR2009/004675
Other languages
English (en)
Korean (ko)
Inventor
이정규
윤영철
황석배
Original Assignee
Lee Jung Kyu
Yoon Young Chul
Hwang Seuk Bae
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lee Jung Kyu, Yoon Young Chul, Hwang Seuk Bae filed Critical Lee Jung Kyu
Publication of WO2010053250A1 publication Critical patent/WO2010053250A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light emitting diode illumination device, and more particularly, to a light emitting diode and a light emitting diode illumination device that can attenuate the heat generated in the electronic device to amplify the illumination to emit bright light.
  • a light emitting diode is also called an LED.
  • the luminescence generated when a voltage is applied to a semiconductor is called luminescence (electric field emission), and the light emitting diode emits light by using the field emission.
  • the light emitting diode has a long lifespan, and since electric energy is directly converted into light energy, it has low power consumption and has high efficiency, and has a long life than general light bulbs (for example, incandescent lamps). have.
  • general light bulbs for example, incandescent lamps.
  • the light emitting diodes have been used in various electronic devices, card readers, electronic signs, headlamps of vehicles, instrument panels, and vehicle widths.
  • An object of the present invention for improving and solving the conventional problems as described above is to discharge the heat generated from the light emitting diode and the electronic device to amplify the light intensity into the air to extend the life of the electronic device mounted on the light emitting diode and the circuit board It is to provide a light emitting diode illumination device that can be extended.
  • the light emitting diode lighting apparatus for achieving the above object is a light emitting unit for emitting light using a light emitting diode, and coupled to the light emitting unit and is connected to an external power source to provide power to the light emitting unit And a heat dissipation part for dissipating heat generated from the socket part and the light emitting part to the outside.
  • the light emitting unit includes a light emitting diode module that emits light, a heat absorbing plate which is in contact with the light emitting diode module, and absorbs heat generated by the light emitting diode module, and the light is amplified and emitted by the light emitting diode module. And a circuit board on which the device is mounted and at least one connection pin connected to the circuit board and connected to an external power source through the socket part.
  • the heat absorbing plate is provided on the rear surface of the light emitting diode fixing frame on which the light emitting diode module is mounted.
  • the heat dissipation unit is provided to surround the light emitting unit, the heat dissipation body and the heat dissipation body is formed in the heat dissipation body and the socket coupling hole is formed to be coupled to the socket is inserted, the heat dissipation body And a first heat transfer piece to transfer to.
  • the heat dissipation body is formed with at least one cooling piece on the outer peripheral surface.
  • the heat dissipation body is preferably formed with at least one cooling hole so that the outside air flows into the inside.
  • the heat dissipation body may be formed to be separated at least one.
  • the first heat transfer piece protrudes from the inner circumferential surface of the distal end of the heat dissipation body so as to face the heat absorbing plate.
  • the heat dissipation unit is provided on the heat dissipation body, and further includes a second heat transfer piece for transferring heat generated from the circuit board to the heat dissipation body.
  • the second heat transfer piece is connected to the first heat transfer piece, and is formed on an inner wall of the heat dissipation body so as to face the circuit board.
  • the present invention further includes a light transmitting portion for transmitting the light emitted from the light emitting portion.
  • the LED lighting apparatus according to the present invention has the following effects.
  • the heat generated by the light emitting diodes and the electronic device is transmitted to the heat dissipation body by the respective heat transfer pieces, while the light emitting diodes amplifying the illuminance of the light emit light.
  • the heat generation of the electronic device mounted on the light emitting diode and the circuit board is attenuated, thereby extending the life.
  • FIG. 1 is a perspective view of a light emitting diode lighting apparatus according to an embodiment of the present invention.
  • Figure 2 is an exploded perspective view of a light emitting diode lighting apparatus according to an embodiment of the present invention.
  • Figure 3 is a perspective view of the heat absorbing plate in contact with the light emitting diode module according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view taken along the line A-A of FIG.
  • FIG. 5 is a state diagram used in the light emitting diode lighting apparatus according to an embodiment of the present invention.
  • Figure 6 is a perspective view of another embodiment in which a plurality of cooling holes are formed in the heat dissipation body.
  • FIG. 1 is a perspective view of a light emitting diode lighting apparatus according to an embodiment of the present invention
  • Figure 2 is an exploded perspective view of a light emitting diode lighting apparatus according to an embodiment of the present invention
  • Figure 3 according to an embodiment of the present invention 4 is a perspective view of a heat absorbing plate in contact with the light emitting diode module
  • FIG. 4 is a cross-sectional view taken along line AA of FIG.
  • the light emitting diode lighting apparatus of the present invention includes a light transmitting part 100, a light emitting part 200, a socket part 300, a heat radiating part 400, and the like.
  • the light transmitting part 100 includes a light transmitting member 110 and a housing 120.
  • the light transmitting member 110 is formed to transmit light to the outside, preferably, the light transmitting member 110 may be formed of a transparent synthetic resin or glass material. At this time, the light transmitting member 110 may be formed of a material of various colors according to the user's selection. In addition, the light transmitting member 110 may be manufactured by forming one side in a concave shape so that light is transmitted more effectively.
  • the housing 120 is formed to be coupled to the outer circumference of the light transmitting member 110 to fix the light transmitting member 110, the coupling piece 121 is formed along the circumference at one end. At this time, the coupling piece 121 is formed in a shape corresponding to the coupling groove 411 to be described later.
  • the light emitting unit 200 includes a light emitting diode module 210, a light emitting diode fixing frame 211, a heat absorbing plate 212, a circuit board 220, a connection pin 230, and the like.
  • the light emitting unit 200 receives external power to emit light to the light transmitting unit 100.
  • a light emitting diode (luminescent diode) is a well-known technique, and a detailed description thereof will be omitted.
  • the light emitting diode module 210 uses a surface mount device (SMD).
  • SMD surface mount device
  • the light emitting diode module 210 may be implemented in various colors according to a user's selection.
  • the light emitting diode module 210 includes a light emitting diode fixing frame 211.
  • the light emitting diode fixing frame 211 serves to protect and fix the light emitting diode module 210.
  • the light emitting diode fixing frame 211 is a component included in the known light emitting diode module 210, detailed description thereof will be omitted.
  • a rear end of the light emitting diode fixing frame 211 is provided with a heat absorbing plate 212 to suck the heat generated by the light emitting diode module 210.
  • the heat absorbing plate 212 is formed of a metal material to more effectively suck heat generated from the light emitting diode module.
  • the circuit board 220 is formed to mount the electronic device 221, and the electronic device 221 is mounted on both side surfaces of the circuit board 220.
  • the electronic device 221 mounted on the circuit board 220 includes an electronic device 221 capable of amplifying light of the light emitting diode 210 such as a resistor and a semiconductor.
  • connection pin 230 is provided with at least one, the connection pin 230 is connected to one side to the circuit board 220, the other side is connected to the socket 300 to be described later.
  • connection pin 230 is formed of a metal material, it is preferable to use a metal of excellent electrical conductivity (electrical conductivity).
  • the socket part 300 is formed of a synthetic resin material, the ground piece 310 is provided, and at least one coupling hole 311 is formed at an inner end of the ground piece 310.
  • Coupling sphere 311 is formed in a corresponding position so that the above-described connection pin 230 can be coupled.
  • the connection pin 230 coupled to the coupling sphere 311 protrudes to the outside of the ground piece 310, the protruding connection pin 230 is bent and fixed to the outer surface of the ground piece (310). That is, in one embodiment of the present invention, the connection pin 230 is contacted with an external power source to provide power to the circuit board 220.
  • guide grooves 312 may be formed on both side surfaces of the ground piece 310 so as to be fixed after bending the connecting pin 230.
  • connection pin 230 instead of the connection pin 230.
  • it can be formed.
  • the heat dissipation unit 400 is provided to surround the outer portion of the light emitting unit 200, and is provided with heat dissipation bodies 410a and 410b which are detachably formed. At this time, in one embodiment of the present invention is formed in a shape corresponding to each other so that the heat dissipating body (410a, 410b) can be used in pairs.
  • the heat dissipating bodies 410a and 410b may be made of silver or aluminum having excellent thermal conductivity as a metal material.
  • the coupling grooves 411a and 411b are formed at inner ends of the heat dissipation bodies 410a and 410b, and the coupling grooves 411a and 411b have a corresponding shape such that the coupling pieces 121 of the light transmitting part 100 are coupled to each other. Is formed.
  • one embodiment of the present invention is formed so as to fit the coupling piece 121 in the coupling grooves (411a, 411b), preferably forming a screw in the coupling groove (411a, 411b) and the coupling piece 121. It may be formed so that it can be fixed by screwing, or may be bonded using an adhesive material, of course.
  • the mounting grooves 412a and 412b are formed in the inner center spaced apart from the coupling grooves 411a and 411b formed in the heat dissipation bodies 410a and 410b.
  • the mounting grooves 412a and 412b are formed in a shape corresponding to the light emitting diode fixing frame 211 so as to couple the light emitting diode fixing frame 211.
  • first heat transfer pieces 413a and 413b are connected to the mounting grooves 412a and 412b, and the first heat transfer pieces 413a and 413b include the light emitting diode fixing frame 211 to the mounting grooves 412a and 412b.
  • the light emitting diode fixing frame 211 When coupled to the light emitting diode fixed frame 211 is formed in a position that can be in close contact with the back. That is, when the illumination intensity of the light emitting diode module 210 is amplified and diverged, heat is generated, and the light emitting diode fixing frame 211 to which the light emitting diode module 210 is fixed is configured to emit heat generated in the air.
  • the heat dissipation bodies 410a and 410b When the first heat transfer pieces 413a and 413b in close contact with the rear surface transmit heat to the heat dissipation bodies 410a and 410b, the heat dissipation bodies 410a and 410b are in contact with the outside air and are generated in the light emitting diode module 210. It is possible to extend the life by attenuating the heat generated.
  • the second heat transfer pieces 414a and 414b are connected to the first heat transfer pieces 413a and 413b, and the second heat transfer pieces 414a and 414b are connected to the light emitting diode module 210. It is formed to be in close contact with the electronic device 221. When the light is emitted from the light emitting diode module 210 and amplified, heat is generated not only in the light emitting diode module 210 but also in the electronic device 221, so that the heat of the electronic device 221 is attenuated. .
  • the socket coupling holes 415a and 415b are formed by being connected to the second heat transfer pieces 414a and 414b.
  • the fixing projections (313a, 313b) are formed by being connected to the second heat transfer pieces 414a and 414b.
  • cooling pieces 416a and 416b are formed on the outer circumferential surfaces of the heat dissipation bodies 410a and 410b to increase the contact surface with the air to more efficiently emit heat.
  • the cooling pieces 416a and 416b may be formed to be engraved on the heat dissipation bodies 410a and 410b, or may be embossed to protrude.
  • the heat dissipation body (410a, 410b) is formed in a circular shape, of course, may be formed in various shapes such as polygons.
  • FIG. 5 is a view showing a state of use of the LED lighting apparatus according to an embodiment of the present invention, by combining a light transmitting unit 100, a light emitting unit (not shown), a socket 300 and a heat dissipation unit 400 It shows that it can be used in combination with the general vehicle power socket 500 in an integrated state.
  • FIG. 6 is an exploded perspective view of another embodiment in which a plurality of cooling holes 418a and 418b are formed in the heat dissipating bodies 410a and 410b.
  • the cooling body 416a, 416b is engraved or embossed on the heat dissipating body 410a, 410b to increase the contact surface with air, the heat dissipation is shown.
  • the generated heat may be more effectively released and attenuated. .
  • one embodiment of the present invention shows a light emitting diode lighting apparatus applicable to a vehicle, it can be used in various industrial fields, that is, interior lighting apparatus.
  • the light emitting diode lighting apparatus of the embodiment of the present invention when applied to a vehicle, it is to provide a brightness of 50 lumens corresponding to the brightness of a conventional general light bulb so as to satisfy the prescribed brightness when inspecting the vehicle. desirable.
  • the light emitting diode may be formed to provide brightness of 60 to 100 lumens according to various applications.
  • the present invention can be used as a light emitting diode illumination device that can attenuate the heat generated in the light emitting diode and amplified illumination to emit bright light.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne un appareil d’éclairage à diode électroluminescente, la chaleur générée par les éléments électroniques et par les diodes électroluminescentes, dont l’intensité est intensifiée pour obtenir une émission de lumière plus claire, étant réduite. Pour atteindre l’objectif de la présente invention, l’appareil d’éclairage à diode électroluminescente de l’invention comprend une unité d’émission de lumière servant à émettre de la lumière au moyen de diodes électroluminescentes, une unité de socle couplée à l’unité d’émission de lumière et connectée à une source de courant extérieure pour alimenter en courant l’unité d’émission de lumière, et une unité de dissipation de chaleur servant à dissiper vers l’extérieur la chaleur générée par l’unité d’émission de courant.
PCT/KR2009/004675 2008-11-10 2009-08-21 Appareil d’éclairage à diode électroluminescente WO2010053250A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0111010 2008-11-10
KR1020080111010A KR101016496B1 (ko) 2008-11-10 2008-11-10 발광다이오드 조명장치

Publications (1)

Publication Number Publication Date
WO2010053250A1 true WO2010053250A1 (fr) 2010-05-14

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WO (1) WO2010053250A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012020366A1 (fr) * 2010-08-13 2012-02-16 Koninklijke Philips Electronics N.V. Lampe à del
WO2012127923A1 (fr) * 2011-03-18 2012-09-27 シャープ株式会社 Dispositif d'éclairage et équipement d'éclairage doté de celui-ci
CN103649637A (zh) * 2011-07-08 2014-03-19 Lg伊诺特有限公司 照明器件
WO2014097578A1 (fr) * 2012-12-20 2014-06-26 パナソニック株式会社 Lampe et dispositif d'éclairage
EP2827056A4 (fr) * 2012-01-20 2015-07-22 Dis Plus Ltd Lampe à diodes électroluminescentes à vocation générale
KR101822811B1 (ko) 2016-03-31 2018-03-08 주식회사 금호에이치티 전구형 엘이디 조명장치
EP3680550A1 (fr) * 2019-01-11 2020-07-15 Zumtobel Lighting GmbH Agencement d'éclairage pour un luminaire long

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101133230B1 (ko) * 2010-08-16 2012-04-05 하성백 발광 다이오드 조명장치
EP2738445B1 (fr) 2010-11-08 2018-01-10 LG Innotek Co., Ltd. Appareil d'éclairage
EP2458273B1 (fr) 2010-11-30 2014-10-15 LG Innotek Co., Ltd. Dispositif d'éclairage
TW201243228A (en) * 2011-04-19 2012-11-01 Everlight Electronics Co Ltd Light emitting diode lamp and assembling method thereof
KR20180065726A (ko) * 2016-12-08 2018-06-18 이장환 슬롯 타입 커넥터를 갖는 엘이디 조명 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040027642A (ko) * 2004-02-19 2004-04-01 (주) 케이티지 하이브리드 ic형 led 전등
JP2005093097A (ja) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd 照明装置
US20080175003A1 (en) * 2007-01-22 2008-07-24 Cheng Home Electronics Co., Ltd. Led sunken lamp

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496525B1 (ko) * 2005-03-23 2005-06-22 주식회사 누리플랜 엘이디 조명등
KR100898817B1 (ko) * 2007-03-30 2009-05-22 한국광기술원 열 방출이 가능한 발광 다이오드 전구

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093097A (ja) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd 照明装置
KR20040027642A (ko) * 2004-02-19 2004-04-01 (주) 케이티지 하이브리드 ic형 led 전등
US20080175003A1 (en) * 2007-01-22 2008-07-24 Cheng Home Electronics Co., Ltd. Led sunken lamp

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012020366A1 (fr) * 2010-08-13 2012-02-16 Koninklijke Philips Electronics N.V. Lampe à del
WO2012127923A1 (fr) * 2011-03-18 2012-09-27 シャープ株式会社 Dispositif d'éclairage et équipement d'éclairage doté de celui-ci
JP2012199008A (ja) * 2011-03-18 2012-10-18 Sharp Corp 照明装置、およびそれを備えた照明機器
CN103649637A (zh) * 2011-07-08 2014-03-19 Lg伊诺特有限公司 照明器件
EP2827056A4 (fr) * 2012-01-20 2015-07-22 Dis Plus Ltd Lampe à diodes électroluminescentes à vocation générale
WO2014097578A1 (fr) * 2012-12-20 2014-06-26 パナソニック株式会社 Lampe et dispositif d'éclairage
JP5612800B1 (ja) * 2012-12-20 2014-10-22 パナソニック株式会社 ランプ及び照明装置
KR101822811B1 (ko) 2016-03-31 2018-03-08 주식회사 금호에이치티 전구형 엘이디 조명장치
EP3680550A1 (fr) * 2019-01-11 2020-07-15 Zumtobel Lighting GmbH Agencement d'éclairage pour un luminaire long

Also Published As

Publication number Publication date
KR101016496B1 (ko) 2011-02-24
KR20100052121A (ko) 2010-05-19

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