WO2015183021A1 - Dispositif d'éclairage à diode électroluminescente - Google Patents

Dispositif d'éclairage à diode électroluminescente Download PDF

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Publication number
WO2015183021A1
WO2015183021A1 PCT/KR2015/005373 KR2015005373W WO2015183021A1 WO 2015183021 A1 WO2015183021 A1 WO 2015183021A1 KR 2015005373 W KR2015005373 W KR 2015005373W WO 2015183021 A1 WO2015183021 A1 WO 2015183021A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
heat
control chip
substrate
Prior art date
Application number
PCT/KR2015/005373
Other languages
English (en)
Korean (ko)
Inventor
박태관
김정두
강기태
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020150073590A external-priority patent/KR20150138040A/ko
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Publication of WO2015183021A1 publication Critical patent/WO2015183021A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks

Definitions

  • the present invention relates to a light emitting diode illumination device, and more particularly to a light emitting diode illumination device capable of effectively dissipating heat generated by the light emitting diode illumination device.
  • incandescent lamps have been widely used for indoor or outdoor lighting in buildings for a long time.
  • incandescent lamps have disadvantages such as short lifespan, poor durability, limited color selection range of light and low energy efficiency.
  • LEDs Light emitting diodes
  • Korean Patent Publication No. 2014-0005455 (The heat dissipation structure of the LED bulb, published date: 2014.01.15, prior art) is a technology related to the heat dissipation structure of the LED lighting device.
  • a light emitting diode lighting device is used in addition to a light emitting diode such as an AC driving IC for driving an AC light emitting diode which is directly driven by AC, an electronic component that generates heat is used.
  • the light emitting diode lighting apparatus as in the prior art has a problem that only heat generated from the light emitting diode is to be radiated.
  • An object of the present invention is to provide a light emitting diode lighting device for radiating heat generated from an electronic component mounted such as a light emitting diode as well as heat generated from a light emitting diode.
  • a light emitting diode lighting apparatus comprising: a housing having an accommodation space therein; A heat sink coupled to the housing and dissipating conducted heat; A substrate provided on the heat sink; A light emitting diode mounted on the substrate and emitting light by an applied electric power; A control chip mounted on the substrate and controlling driving of the light emitting diode; And a heat bridge in contact with an upper surface of the control chip and transferring heat generated from the control chip to the heat sink.
  • the heat bridge may be bent such that one side is in contact with the upper surface of the control chip, the other side is in contact with the heat sink.
  • a hole through which the heat bridge may pass may be formed in the substrate so that the heat bridge contacts the heat sink.
  • the plurality of light emitting diodes may be mounted, and the plurality of light emitting diodes may be mounted along the edge shape of the substrate, and the control chip may be mounted on the substrate so as to be surrounded by the plurality of light emitting diodes.
  • the heat bridge may include a first contact portion in contact with an upper surface of the control chip and a second contact portion in contact with the heat sink, and the first contact portion and the second contact portion may have a step.
  • the heat sink may be formed larger than the substrate, and the heat bridge may contact a position where the heat sink is exposed.
  • the substrate is formed to have a length in one direction
  • the plurality of light emitting diodes, the plurality of light emitting diodes are arranged in the longitudinal direction of the substrate
  • the control chip is mounted on one side in the longitudinal direction of the substrate Can be.
  • a coupling groove for coupling the other side of the heat bridge may be formed on the side surface of the heat sink, and the heat bridge may be bent in a 'c' shape.
  • the heat bridge may be formed to completely cover the upper surface of the control chip.
  • the light emitting diode may be an AC light emitting diode capable of AC driving
  • the control chip may be an AC driving control chip for driving the AC light emitting diode.
  • the terminal may further include a terminal for receiving power from an external power source, and the terminal may be formed on an outer surface of the housing.
  • the LED lighting apparatus of the present invention transfers the heat generated from the LED and the control chip to the heat sink through the substrate to dissipate heat and at the same time install a heat bridge on the upper surface of the control chip, the heat bridge Since heat is transferred to the heat sink, the heat generated from the control chip can be more effectively radiated.
  • FIG. 1 is a perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.
  • FIG 3 is a cross-sectional view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.
  • FIG. 4 is a diagram illustrating a path through which heat generated from a control chip of the LED lighting apparatus according to an embodiment of the present invention is transferred to the heat sink 130.
  • FIG. 5 is a view showing a light emitting diode lighting apparatus according to another embodiment of the present invention.
  • FIG. 6 is a view showing that the heat bridge of the LED lighting apparatus according to another embodiment of the present invention is installed.
  • FIG. 1 is a perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention
  • Figure 2 is an exploded perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention
  • 3 is a cross-sectional view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.
  • the LED lighting apparatus 100 of the present invention includes a housing 110, a substrate 120, a heat sink 130, a light emitting diode 140, a control chip 150, and a heat bridge 160.
  • the housing 110 is provided with a socket base at a lower portion thereof, and a receiving space having an open upper portion thereof is formed therein.
  • a circuit board including a protection circuit capable of controlling power supplied from the outside or protecting the light emitting diode 140 is accommodated in the accommodation space of the housing 110, and a heat sink 130 is inserted therein.
  • the substrate 120 is disposed on the housing 110, and the light emitting diode 140 and the control chip 150 are mounted.
  • the substrate 120 of the present invention is formed in a circular shape, a hole is formed to be screwed to the heat sink 130.
  • the substrate 120 has a through hole through which the heat bridge 160 can penetrate near the mounting position of the control chip 150.
  • the heat sink 130 is formed in a cylindrical shape, the diameter of the heat sink is reduced toward the bottom to be inserted into the receiving space of the housing 110.
  • the upper surface of the heat sink 130 is formed with a screw groove so that the substrate 120 and the heat bridge 160 can be screwed. Since the substrate 120 is coupled to the upper surface of the heat sink 130, heat generated from the light emitting diode 140 and the control chip 150 is transferred to the heat sink 130 through the substrate 120 to radiate heat. do.
  • the heat sink 130 and the heat bridge 160 may be coupled using heat conduction bonding, not screw coupling.
  • the heat sink 130 may use any metal having high thermal conductivity for heat dissipation performance, and may be made of metal such as aluminum or aluminum alloy in consideration of cost.
  • a plurality of light emitting diodes 140 are mounted on the substrate 120, and in one embodiment of the present invention, a plurality of light emitting diodes 140 are mounted in a circular shape along the edge of the substrate 120.
  • the light emitting diode 140 according to an embodiment of the present invention uses a light emitting diode 140 that operates in an AC direct drive method.
  • the control chip 150 is mounted on the substrate 120, and omits a conventional power supply device including an SMPS or PSU and integrates a circuit for driving the AC LED 140 in an AC direct connection type. Therefore, like a conventional lighting device, it is possible to omit a device for converting alternating current into direct current or a power supply device having a large volume and weight, thereby reducing the size of the light emitting diode lighting device (100).
  • Heat generated while the power is applied to the light emitting diode 140 and the control chip 150 is basically transferred to the heat sink 130 through the substrate 120 to radiate heat.
  • the heat bridge 160 is installed on the control chip 150.
  • the heat bridge 160 is provided to additionally transfer heat generated from the control chip 150 to the heat sink 130.
  • one side of the heat bridge 160 is provided in contact with the top surface of the control chip 150, and the other side contacts the heat sink 130 by passing through a through hole formed in the substrate 120.
  • a terminal formed on the outside of the housing and configured to transfer power supplied from the outside to the substrate side may be further provided.
  • the heat bridge 160 has one side and the other side due to a height difference between the top surface of the control chip 150 and the top surface of the heat sink 130 exposed through the through hole of the substrate 120. It is formed stepped.
  • the through hole formed in the substrate 120 is formed to have a size corresponding to the size of the heat bridge 160 so that the other side of the heat bridge 160 can pass therethrough.
  • the heat bridge 160 is inserted into the through hole of the substrate 120, and one side of the heat bridge 160 contacts the top surface of the control chip 150 while covering the control chip 150.
  • the heat bridge 160 may partially cover the top surface of the control chip 150 or may completely cover the top surface of the control chip 150.
  • the heat bridge 160 is fixed by screwing in the state in which the heat bridge 160 is inserted into the through hole of the substrate 120.
  • heat dissipation grease or the like may be applied to an upper surface of the control chip 150 as necessary.
  • the heat bridge 160 may use any metal having high thermal conductivity for heat dissipation performance, and may be made of metal such as aluminum or aluminum alloy in consideration of cost.
  • a cap for spreading the light emitted from the light emitting diodes 140 may be further provided to cover the open upper surface of the housing 110.
  • the cap may be formed in a hemispherical shape, and is made of a synthetic resin of a light transmitting material such as polycarbonate material.
  • FIG. 4 is a diagram illustrating a path through which heat generated from a control chip of the LED lighting apparatus according to an embodiment of the present invention is transferred to the heat sink 130.
  • Heat generated from the control chip 150 is transferred to the heat sink 130 through the substrate 120 to the bottom and heat sink 130 through the heat bridge 160 to the top, as shown in FIG. It is moved in the direction of delivery. Therefore, the heat generated from the control chip 150 can be discharged more efficiently. Furthermore, since the heat bridge 160 is made of the same material as the heat sink 130, heat dissipation of the control chip 150 is more effectively performed.
  • FIG. 5 is a view showing a light emitting diode lighting apparatus according to another embodiment of the present invention.
  • the LED lighting apparatus 200 includes a housing 210, a substrate 220, a heat sink 230, a light emitting diode 240, a control chip 250, and a heat bridge 260. Include.
  • the housing 210 has a circular hollow and is formed in a shape extending in one direction.
  • the housing 210 may be partially or entirely formed in a transparent or translucent manner so that light emitted from the light emitting diode 140 may be emitted in a circular cross section.
  • the substrate 220 and the heat sink 230 may be inserted in the longitudinal direction of the housing 210 in the hollow of the housing 210.
  • the substrate 220 is formed to extend in one direction so as to be inserted into the hollow of the housing 210, and the light emitting diode 240 and the control chip 250 are mounted on one surface thereof.
  • a conductive pattern may be formed on the mounting surface of the substrate 220 such that power supplied from the outside may be supplied to the light emitting diode 240 and the control chip 250.
  • the substrate 220 may be a metal core PCB (MCPCB) based on metal having high thermal conductivity, but is not limited thereto.
  • the heat sink 230 is installed below the substrate 220, and is formed to extend in one direction like the substrate 220. In this case, the heat sink 230 may be formed to be longer than the substrate 220 by a predetermined distance.
  • a structure in which the heat sink 230 is inserted into the housing 210 will be described. However, the heat sink 230 may not be installed inside the housing 210 and may be exposed to the outside. That is, the heat sink 230 and the housing 210 may have a structure that is coupled to each other by a coupling protrusion or a coupling groove.
  • a plurality of light emitting diodes 240 may be mounted on one surface of the substrate 220, and in another embodiment of the present invention, the light emitting diodes 240 may be mounted along the length direction of the substrate 220.
  • the control chip 250 may be mounted on one side of the substrate 220, and supply the light emitting diode 240 by supplying an AC power supplied from the outside to the light emitting diode 240 which may be driven in alternating current by an AC direct connection type. Can be driven.
  • heat generated from the light emitting diode 240 and the control chip 250 is transferred to the heat sink 230 through the substrate 220, and more efficiently radiate heat generated from the control chip 250.
  • a heat bridge 260 is further provided.
  • the heat bridge 260 is formed to cover the upper portion of the control chip 250 to be in contact with the upper portion of the control chip 250, and is provided to transfer the heat of the control chip 250 to the heat sink 230. Accordingly, the heat bridge 260 is formed in a shape bent to form a step, as in one embodiment, one side of the heat bridge 260 is in contact with the top of the control chip 250, the other side is the heat May contact the sink 230. The step formed in the heat bridge 260 is due to the step between the top surface of the control chip 250 and the top surface of the heat sink 230.
  • the other side of the heat bridge 260 may be formed to be longer than the substrate 220 to contact the exposed heat sink 230, and the heat bridge 260 and the heat sink 230 may be bonded to each other by screwing or heat conducting. Can be combined using.
  • a through hole is formed in the substrate 220 may be in contact with the heat bridge 260 and the heat sink 230 through the through hole.
  • 6 (a) and 6 (b) are a perspective view and a cross-sectional view respectively showing that the heat bridge of the light emitting diode lighting apparatus according to another embodiment of the present invention is installed.
  • the LED lighting apparatus includes a housing 310, a substrate 320, a heat sink 330, a light emitting diode 340, a control chip 350, and a heat bridge 360. .
  • a housing 310 a substrate 320
  • a heat sink 330 a heat sink 330
  • a light emitting diode 340 a control chip 350
  • a heat bridge 360 a heat bridge 360
  • the heat bridge 360 is coupled to the heat sink 330, and the heat bridge 360 covers an upper portion of the control chip 350 mounted on the substrate 320. It may be formed in a shape bent in a 'c' shape to be in direct contact with the heat sink 330 in a covered state. One side of the heat bridge 360 is bent and extended to the heat sink 330 in the state covering the top of the control chip 350, and then bent again to contact the heat sink 330, the other side and the heat sink 330 Can be contacted.
  • the other end of the heat bridge 360 is in contact with the heat sink 330.
  • a separate configuration is not added for coupling between the heat bridge 360 and the heat sink 330, and the heat sink has a structure such as a clip due to the elasticity of the heat bridge 360.
  • 330 may be combined.
  • a coupling groove 331 may be formed at one side of the heat sink 330 such that the heat bridge 360 is coupled thereto. Accordingly, the heat bridge 360 may be coupled to the heat sink 330 by being caught by the coupling groove 331 formed in the upper portion of the control chip 350 and the heat sink 330.
  • the heat bridge 360 when the heat bridge 360 is bonded to the heat sink 330 using an adhesive material, as described above, the heat bridge 360 and the heat sink are not formed in the heat sink 330. 330 may be combined.
  • control chip 160 heat bridge

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne un dispositif d'éclairage à diode électroluminescente. Le dispositif d'éclairage à diode électroluminescente selon un mode de réalisation de la présente invention peut comprendre : un boîtier dans lequel un espace de réception est formé ; un dissipateur thermique qui est couplé au boîtier et émet de la chaleur conduite ; un substrat installé sur le dissipateur thermique ; une diode électroluminescente qui est montée sur le substrat et émet de la lumière par application d'une puissance électrique ; une puce de commande qui est montée sur le substrat et commande l'attaque de la diode électroluminescente ; et un pont thermique qui est adjacent à la surface supérieure de la puce de commande et transfère de la chaleur générée dans la puce de commande au dissipateur thermique. Selon la présente invention, le dispositif d'éclairage à diode électroluminescente de la présente invention a pour effet d'émettre plus efficacement la chaleur générée dans la puce de commande étant donné que la chaleur est transférée au dissipateur thermique par l'intermédiaire du pont thermique grâce à l'installation du pont thermique sur la surface supérieure de la puce de commande et, en même temps, la chaleur est émise par transfert de la chaleur générée dans la diode électroluminescente et la puce de commande par l'intermédiaire du substrat au dissipateur thermique.
PCT/KR2015/005373 2014-05-30 2015-05-28 Dispositif d'éclairage à diode électroluminescente WO2015183021A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2014-0066539 2014-05-30
KR20140066539 2014-05-30
KR1020150073590A KR20150138040A (ko) 2014-05-30 2015-05-27 발광 다이오드 조명 장치
KR10-2015-0073590 2015-05-27

Publications (1)

Publication Number Publication Date
WO2015183021A1 true WO2015183021A1 (fr) 2015-12-03

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PCT/KR2015/005373 WO2015183021A1 (fr) 2014-05-30 2015-05-28 Dispositif d'éclairage à diode électroluminescente

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030096585A1 (en) * 2001-11-16 2003-05-22 Alcatel Radiocommunications device including a heat dissipation system
US20080298066A1 (en) * 2004-04-15 2008-12-04 Koninklijke Philips Electronics, N.V. Lamp Unit
KR20100033142A (ko) * 2008-09-19 2010-03-29 화우테크놀러지 주식회사 엘이디 램프의 전원공급제어부 방열구조
US20110181851A1 (en) * 2008-09-19 2011-07-28 Carl Zeiss Smt Gmbh Temperature-control device for an optical assembly
KR20120086394A (ko) * 2011-01-26 2012-08-03 이정훈 발광 다이오드 모듈 및 조명 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030096585A1 (en) * 2001-11-16 2003-05-22 Alcatel Radiocommunications device including a heat dissipation system
US20080298066A1 (en) * 2004-04-15 2008-12-04 Koninklijke Philips Electronics, N.V. Lamp Unit
KR20100033142A (ko) * 2008-09-19 2010-03-29 화우테크놀러지 주식회사 엘이디 램프의 전원공급제어부 방열구조
US20110181851A1 (en) * 2008-09-19 2011-07-28 Carl Zeiss Smt Gmbh Temperature-control device for an optical assembly
KR20120086394A (ko) * 2011-01-26 2012-08-03 이정훈 발광 다이오드 모듈 및 조명 장치

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