WO2012127923A1 - Dispositif d'éclairage et équipement d'éclairage doté de celui-ci - Google Patents

Dispositif d'éclairage et équipement d'éclairage doté de celui-ci Download PDF

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Publication number
WO2012127923A1
WO2012127923A1 PCT/JP2012/053014 JP2012053014W WO2012127923A1 WO 2012127923 A1 WO2012127923 A1 WO 2012127923A1 JP 2012053014 W JP2012053014 W JP 2012053014W WO 2012127923 A1 WO2012127923 A1 WO 2012127923A1
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WO
WIPO (PCT)
Prior art keywords
mounting member
light source
source module
lighting device
heat
Prior art date
Application number
PCT/JP2012/053014
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English (en)
Japanese (ja)
Inventor
良治 石村
花野　雅昭
良 阿部
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012127923A1 publication Critical patent/WO2012127923A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings

Definitions

  • the present invention relates to an illuminating device and an illuminating device including the illuminating device, and more particularly to an illuminating device provided with a member for improving the heat dissipation characteristics of a light source, and an illuminating device including the illuminating device.
  • LED light emitting diode
  • FIG. 6 is an exploded view for explaining the configuration of a conventional lighting device 91.
  • the illumination device 91 is provided with a base 99 at one end.
  • the lighting device 91 includes a trumpet-shaped member (heat sink) 92 that spreads in a trumpet shape toward the opening at the other end, and a translucent cover that is attached to the opening of the trumpet-shaped member 92 and has a phosphor layer on the inner surface.
  • a substrate 82 provided inside a substantially spherical body formed by the trumpet-shaped member 92 and the translucent cover 81, and an LED element 97 mounted on the outer surface of the substrate 82 facing the translucent cover 81. It has the structure provided with.
  • Japanese Patent Publication Japanese Patent Laid-Open No. 2001-243807 (published on September 7, 2001)” Japanese Patent Publication “JP 2001-243809 A (published September 7, 2001)”
  • ⁇ It is desirable that LED elements avoid high temperature conditions from the viewpoint of reliability and energy efficiency. Therefore, high heat dissipation is required for a lighting device using LED elements.
  • the structure of the conventional lighting device 91 shown in FIG. 6 there is an adhesive or air layer between the substrate 82 on which the LED element 97 is mounted and the trumpet-shaped member 92, and this adhesive or air layer. The thermal resistance due to. For this reason, the heat generated from the LED element 97 cannot be efficiently transmitted to the trumpet-shaped member 92. Therefore, the heat dissipation of the heat generated from the LED element 97 is reduced.
  • a joint (adhesive or air layer) between the substrate 82 and the trumpet-shaped member 92 exists in the heat conduction path from the LED element 97 as a light source, and the thermal resistance at the joint is the lighting device. There was a problem that the overall heat dissipation was reduced.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a highly reliable lighting device and a lighting device including the lighting device by improving the heat dissipation of a light source.
  • An illumination device is formed by a light source module having one or more light emitting surfaces, an end surface on which the light source module is placed, and an outer peripheral surface continuously formed on the end surface. And a mounting member having a mounting port on the opposite side of the end surface, wherein the mounting member is divided by a cross section passing through the end surface and the mounting port.
  • the mounting member is divided by the cross section passing through the end surface and the mounting opening, so that the heat generated in the light source module mounted on the end surface is dissipated through the outer peripheral surface formed continuously on the end surface. Is done. For this reason, unlike the structure of a prior art, there is no division
  • the lighting equipment according to the present invention is characterized by mounting the lighting device according to the present invention.
  • An illuminating device is provided with a mounting member that is formed by an end surface on which the light source module is mounted and an outer peripheral surface that is continuously formed on the end surface, and that has a mounting opening on the side opposite to the end surface of the outer peripheral surface.
  • the mounting member is divided by a cross section passing through the end surface and the attachment port. For this reason, the heat generated in the light source module placed on the end surface is radiated through the outer peripheral surface formed continuously on the end surface. Therefore, unlike the structure of the prior art, the mounting member does not have a dividing surface and no thermal resistance is generated. As a result, a highly reliable lighting device can be obtained by increasing the heat dissipation of the light source.
  • (A) is a perspective view which shows the structure of the illuminating device which concerns on Embodiment 1
  • (b) is the perspective view which looked at the mounting member provided in the said illuminating device from the attachment port side.
  • (A) is a front view which shows the external appearance of the said illuminating device
  • (b) is sectional drawing which shows the structure of the said regular illuminating device.
  • (A) is a perspective view which shows the simple model for demonstrating the effect
  • (b) is a perspective view which shows the simple model for demonstrating the effect
  • (A) is a perspective view which shows the structure except the cover of the illuminating device which concerns on Embodiment 2
  • (b) is a figure which shows typically the structure except the cover of the said illuminating device.
  • (A) is a front view which shows the external appearance of the said illuminating device
  • (b) is sectional drawing which shows the structure of the said illuminating device. It is an exploded view for demonstrating the structure of the conventional illuminating device.
  • FIG. 1A is a perspective view showing the configuration of the illumination device 1 according to Embodiment 1
  • FIG. 1B is a view of the mounting member 2 provided in the illumination device 1 viewed from the attachment port 6 side.
  • FIG. FIG. 2A is a front view showing the appearance of the lighting device 1
  • FIG. 2B is a cross-sectional view showing the configuration of the lighting device 1.
  • the illumination device 1 includes a plate-like light source module 7.
  • a light emitting surface 8 is mounted on the light source module 7.
  • the light emitting surface 8 is configured by a light emitting element such as an LED or an electroluminescence element.
  • the light source module 7 has a structure in which a substrate on which the light emitting element is mounted is provided. When using LED as a light emitting element, it is preferable to use what mounted several or single LED chip on the ceramic substrate. Further, a heat radiating member (not shown) that fixes the light emitting element to the substrate and enhances heat radiation of the light emitting element may be provided on the substrate as appropriate.
  • the lighting device 1 is provided with a mounting member 2.
  • the mounting member 2 is formed by semicircular end surfaces 4a and 4b on which the light source module 7 is mounted, and trumpet-shaped outer peripheral surfaces 5a and 5b formed continuously to the end surfaces 4a and 4b, and the outer peripheral surface 5a.
  • -It has the attachment port 6 on the opposite side to the end surfaces 4a and 4b of 5b.
  • the end surface 4a and the outer peripheral surface 5a constitute a divided portion 3a
  • the end surface 4b and the outer peripheral surface 5b constitute a divided portion 3b.
  • the division part 3 a and the division part 3 b constitute the mounting member 2.
  • the light source module 7 is disposed so as to straddle the end faces 4a and 4b at the center of the end faces 4a and 4b.
  • the mounting member 2 passes through the center of the end surfaces 4a and 4b crossing the light source module 7 and is divided into the end surface 4a and the outer peripheral surface 5a, and the end surface 4b and the outer peripheral surface 5b by a cross section perpendicular to the end surfaces 4a and 4b. Has been.
  • the heat generated from the light emitting surface 8 of the light source module 7 is dissipated from the end surface 4a through the outer peripheral surface 5a and from the end surface 4b through the outer peripheral surface 5b. 1 and 2, the outer peripheral surfaces 5a and 5b are provided outside to dissipate heat.
  • the resin cover is further provided, and the heat of the heat sink (mounting member 2) is positively transmitted to the resin cover. It does not matter as a configuration. In any configuration, since the heat radiation of the light source module can be improved, a highly reliable lighting device can be obtained.
  • the mounting member (heat sink) 2 is preferably made of a metal such as aluminum or a resin.
  • the mounting member (heat sink) 2 includes end faces 4 a and 4 b for mounting the light source module 7, and an attachment port 6 for attaching a power source to the back side of the end faces 4 a and 4 b.
  • the power supply is performed via the attachment port 6.
  • the lighting device 1 includes a base 9.
  • the base 9 is disposed on the opposite side of the end surfaces 4 a and 4 b of the mounting member 2 and holds the mounting member 2.
  • the base 9 is a member for connecting the external power source of the lighting device 1 and the light source module 7.
  • the illuminating device 1 of Embodiment 1 substitutes for an incandescent bulb
  • the base 9 has a structure equivalent to that of an incandescent bulb
  • the illuminating device 1 of Embodiment 1 and the incandescent bulb are combined. Can be easily replaced.
  • FIG. 3A is a perspective view showing a simple model for explaining the heat radiation action of the lighting device 1
  • FIG. 3B shows a simple model for explaining the heat radiation action of the conventional lighting device. It is a perspective view.
  • the mounting members (heat sinks) 2 and 92 are drawn as a cylindrical shape having a circular light source module mounting surface on one end surface.
  • the dividing surface of the mounting member (heat sink) 2 according to the present embodiment shown in FIG. 3A is a plane that bisects the cylindrical portion through the center of the mounting surface of the light source module 7.
  • the split surface of the conventional mounting member (heat sink) 92 shown in FIG. 3B is a plane that separates the light source module mounting surface portion 93a and the cylindrical portion 93b.
  • FIG. 4B When the divided surfaces of the respective heat sinks shown in FIGS. 3 (a) and 3 (b) are joined with an adhesive or double-sided tape, and the light source modules 7 and 97 are installed at the center of the circular end surface, FIG.
  • the heat from the light source module 97 is conducted to the end of the heat sink divided portion 93b on the side opposite to the divided portion 93a. It is necessary to pass through between the division part 93a and the division part 93b. For this reason, the thermal resistance generated on the split surface reduces the heat dissipation of the mounting member (heat sink) 92.
  • the heat from the light source module 7 is divided by the cross section through which the mounting member 2 passes through the end surface and the attachment port. In the middle of conducting to the end of 2), it does not pass through the dividing surface of the heat sink. Further, in the state where the heat generated from the light source module 7 is evenly transmitted to the divided mounting member (heat sink) 2, there is no temperature difference between the divided portions 3 a and 3 b of the divided mounting member (heat sink) 2. No heat transfer occurs between the divided parts 3a and 3b. For this reason, unlike the conventional configuration shown in FIG. 3, the thermal resistance of the dividing surface does not deteriorate the heat dissipation of the heat sink.
  • the thermal resistance generated on the dividing surface of the mounting member (heat sink) 92 varies depending on the presence of an air layer, as well as the thickness and physical properties of the adhesive and the double-sided tape interposed between the dividing portions 93a and 93b.
  • Table 1 shows the analysis values of the substrate temperature of the light source modules 7 and 97 when the thickness and thermal conductivity of the inclusions on both heat sink dividing surfaces shown in FIGS. Show.
  • the analysis values shown in Table 1 are for the case where the mounting members (heat sinks) 2 and 92 are made of aluminum, the outside air temperature is 35 ° C., and the heat generation amount of the light source modules 7 and 97 is 4.0 W. Yes.
  • the substrate temperature when the inclusions on both heat sink dividing surfaces are a double-sided tape having a thermal conductivity of 2.0 [W / mK] and a thickness of 0.1 mm is 80 in the conventional configuration shown in FIG. It was 69.7 ° C., and in the configuration of the present embodiment shown in FIG. When the thickness of the double-sided tape was increased to 0.5 mm, the substrate temperature in the conventional configuration was 81.9 ° C., and the substrate temperature in the configuration of the present embodiment was 79.9 ° C. Further, the substrate temperature when the inclusions of both heat sink dividing surfaces are air layers having a thermal conductivity of 0.029 [W / mK] and a thickness of 0.1 mm is 94.1 ° C. in the conventional configuration, In the configuration of the present embodiment, the temperature was 79.7 ° C. Thus, it can be said from Table 1 that the heat sink having the configuration according to the present embodiment maintains high heat dissipation regardless of the state of the divided surfaces.
  • the placement member 2 passes through the center of the end faces 4a and 4b and is perpendicular to the end faces 4a and 4b, so that the mounting member 2 is divided into two on the end face 4a and the outer peripheral face 5a
  • the present invention is not limited to this. It may be divided by a cross section passing through the end faces 4a and 4b and the attachment port 6 and obliquely intersecting the end faces 4a and 4b. Good.
  • the cross section is preferably a flat surface, but the present invention is not limited to this, and the cross section may be a curved surface, and may be formed with irregularities for fitting and being bent. Good. The same applies to the second embodiment to be described later.
  • FIG. 4A is a perspective view showing a configuration of the lighting device 1a according to Embodiment 2 except for the cover
  • FIG. 4B is a diagram schematically showing a configuration of the lighting device 1a except for the cover. It is.
  • FIG. 5A is a front view showing the appearance of the lighting device 1a
  • FIG. 5B is a cross-sectional view showing the configuration of the lighting device 1a.
  • the same reference numerals are given to the same components as those described in the first embodiment. Detailed description of these components will not be repeated.
  • the mounting member 2 has a cavity inside thereof.
  • the illumination device 1a according to the second embodiment is different from the illumination device 1 according to the first embodiment in that the power source circuit board 10 that connects the light source module 7 and a power supply circuit provided outside the illumination device 1a to the cavity. It is the point which stores.
  • the lighting device 1 a includes a plate-like light source module 7.
  • a light emitting surface 8 is mounted on the light source module 7.
  • the mounting member 2 is provided in the illuminating device 1a.
  • the mounting member 2 is formed by end surfaces 4a and 4b on which the light source module 7 is mounted, and trumpet-shaped outer peripheral surfaces 5a and 5b continuously formed on the end surfaces 4a and 4b, and end surfaces of the outer peripheral surfaces 5a and 5b.
  • a mounting port 6 is provided on the side opposite to 4a and 4b.
  • the end surface 4a and the outer peripheral surface 5a constitute a divided portion 3a
  • the end surface 4b and the outer peripheral surface 5b constitute a divided portion 3b.
  • the division part 3 a and the division part 3 b constitute the mounting member 2.
  • the light source module 7 is disposed at the center of the end faces 4a and 4b.
  • the mounting member 2 passes through the center of the end surfaces 4a and 4b crossing the light source module 7 and is divided into the end surface 4a and the outer peripheral surface 5a, and the end surface 4b and the outer peripheral surface 5b by a cross section perpendicular to the end surfaces 4a and 4b. Has been.
  • the lighting device 1 a includes a base 9.
  • the base 9 is disposed on the opposite side of the end surfaces 4 a and 4 b of the mounting member 2 and holds the mounting member 2.
  • the base 9 is a member for connecting the external power source of the lighting device 1 and the light source module 7.
  • a power supply circuit board 10 that connects the light source module 7 and a power supply circuit provided outside the illumination device 1a is accommodated in a cavity formed inside the mounting member 2.
  • the power circuit board 10 is provided inside the mounting member 2 to supply power to the light source module 7.
  • the power supply circuit board 10 converts the power supplied to the base 9 into an input suitable for the characteristics of the light source module 7.
  • the power supply circuit board 10 is preferably disposed in a cavity inside the mounting member 2 (heat sink), but may be disposed in the base 9.
  • Embodiments 1 and 2 have been studied as an alternative to incandescent bulbs.
  • an incandescent bulb base 9 is attached to the mounting port 6 of the mounting member 2 (heat sink), and the light source module 7 and the base 9 are installed in the space inside the mounting member 2 (heat sink).
  • the power supply circuit board 10 to be connected is accommodated.
  • die 9 of the illuminating device 1 is attached to the attachment part of lighting equipment.
  • the high heat dissipation of the mounting member 2 (heat sink) of the first and second embodiments is more suitable. Further, the mounting member 2 (heat sink) of the first and second embodiments can transmit more heat of the light source module 7 to the base 9 attached to the power supply attachment opening 6 as compared with the conventional heat sink.
  • the base 9 can be efficiently used as a heat radiating member.
  • the lighting devices according to Embodiments 1 and 2 have lower power consumption than conventional light bulbs, and are easily replaced with a light bulb by providing the same supply unit as the light bulb base. It can be applied to lighting equipment.
  • the lighting devices according to Embodiments 1 and 2 are characterized in that the mounting member 2 (heat sink) is divided in the vertical direction to widen the heat radiation area. If it is set as the illuminating device which uses such a heat sink, it can apply also to illuminating devices other than a light bulb, and can apply to indoor and outdoor lighting equipment. Furthermore, it is possible to substitute for lighting such as headlights and rear lights of automobiles.
  • the LED mounting portion and the heat radiating portion are either separate members or integrated, and when they are separate members, the heat resistance is reduced by heat resistance.
  • the problem of lowering occurs and it is integrated, there is a problem of assembling property and manufacturing cost.
  • the mounting member 2 heat sink
  • the heat transfer path from the light source module 7 to the end of the mounting member 2 (heat sink) There is no connection part between members, and the thermal resistance can be kept low.
  • the divided portions 3a and 3b of the mounting member 2 can be formed at a low cost such as a press, can be easily assembled, and can be reduced in cost.
  • the heat conduction path from the light source module 7 is not blocked, and the heat dissipation of the lighting device is improved. be able to. Furthermore, the processing cost and the assembling property are not deteriorated.
  • the heat from the light source module 7 is conducted to the end without passing through the dividing surface of the mounting member 2 (heat sink). For this reason, the ideal heat dissipation state without heat resistance, such as an adhesive agent and an air layer, can be obtained.
  • the dividing surface of the mounting member 2 (heat sink) symmetrical, it is possible to produce in a single line. It also leads to reduction.
  • the power circuit board is accommodated in the cavity in the mounting member 2 (heat sink), and the heat from the light source module 7 is efficiently conducted to the end of the mounting member 2 (heat sink).
  • the base located at can be efficiently used as a heat radiating part. Further, heat generated from the power circuit board inside the mounting member 2 (heat sink) is also efficiently radiated by the mounting member 2 (heat sink) base 9.
  • the cross section is formed so as to intersect the light source module.
  • the heat generated from the light source module is spread uniformly and radially on the end surface. For this reason, the illuminating device with much more favorable heat dissipation of a light source can be obtained.
  • the cross section is formed to be bent for fitting the divided mounting members.
  • the lighting device preferably further includes a holding member that is disposed on the opposite side of the end face of the mounting member and holds the mounting member.
  • the heat transferred to the mounting member is further dissipated through a holding member such as a resin cover (glove), a base, etc., so that heat dissipation can be further improved, and further, assembly is improved, The cost can be reduced.
  • a holding member such as a resin cover (glove), a base, etc.
  • the lighting device preferably further includes a power circuit board provided inside the mounting member to supply power to the light source module.
  • the power supply circuit board is provided inside the mounting member, the heat generated from the power supply circuit board can be efficiently radiated by the high heat dissipation of the mounting member.
  • the mounting member is divided into two elements by the cross section.
  • the present invention can be applied to an illuminating device and an illuminating device including the illuminating device, and in particular, to an illuminating device provided with a member for improving the heat dissipation characteristics of the light source and the illuminating device including the illuminating device. can do.
  • the present invention can be applied not only to lighting equipment installed indoors, but also to lighting equipment installed outdoors, and lighting of automobile headlights and the like.

Abstract

Un dispositif d'éclairage (1) est pourvu : d'un module source de lumière (7) possédant une surface d'émission de lumière (8) ; et d'un élément de montage (2) formé par les surfaces d'extrémité (4a, 4b) sur lesquelles est placé le module source de lumière (7) et par les surfaces périphériques extérieures (5a, 5b) qui sont formées de manière à être continues avec les surfaces d'extrémité (4a, 4b), l'élément de montage (2) comportant une ouverture d'installation (6) sur le côté opposé aux surfaces d'extrémité (4a, 4b) des surfaces périphériques extérieures (5a, 5b). L'élément de montage (2) est séparé par un plan en coupe transversale traversant les surfaces d'extrémité (4a, 4b) et l'ouverture d'installation (6), et le plan en coupe transversale est formé de manière à couper le module source de lumière (7).
PCT/JP2012/053014 2011-03-18 2012-02-09 Dispositif d'éclairage et équipement d'éclairage doté de celui-ci WO2012127923A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011061029A JP2012199008A (ja) 2011-03-18 2011-03-18 照明装置、およびそれを備えた照明機器
JP2011-061029 2011-03-18

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WO2012127923A1 true WO2012127923A1 (fr) 2012-09-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014097578A1 (fr) * 2012-12-20 2014-06-26 パナソニック株式会社 Lampe et dispositif d'éclairage

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JP6478022B2 (ja) * 2014-12-16 2019-03-06 パナソニックＩｐマネジメント株式会社 照明用光源及び照明装置
JP6860380B2 (ja) * 2017-03-08 2021-04-14 大成建設株式会社 滑り免震装置の冷却装置及び該冷却装置を備えた免震構造

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JP2003297110A (ja) * 2002-04-03 2003-10-17 Matsushita Electric Works Ltd 口金型蛍光灯装置
US20080175003A1 (en) * 2007-01-22 2008-07-24 Cheng Home Electronics Co., Ltd. Led sunken lamp
WO2010053250A1 (fr) * 2008-11-10 2010-05-14 Lee Jung Kyu Appareil d’éclairage à diode électroluminescente
WO2010145925A1 (fr) * 2009-06-15 2010-12-23 Osram Gesellschaft mit beschränkter Haftung Corps de refroidissement pour éléments luminescents à semi-conducteur

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EP2479473A1 (fr) * 2009-09-14 2012-07-25 Panasonic Corporation Lampe en forme d'ampoule

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JP2003297110A (ja) * 2002-04-03 2003-10-17 Matsushita Electric Works Ltd 口金型蛍光灯装置
US20080175003A1 (en) * 2007-01-22 2008-07-24 Cheng Home Electronics Co., Ltd. Led sunken lamp
WO2010053250A1 (fr) * 2008-11-10 2010-05-14 Lee Jung Kyu Appareil d’éclairage à diode électroluminescente
WO2010145925A1 (fr) * 2009-06-15 2010-12-23 Osram Gesellschaft mit beschränkter Haftung Corps de refroidissement pour éléments luminescents à semi-conducteur

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014097578A1 (fr) * 2012-12-20 2014-06-26 パナソニック株式会社 Lampe et dispositif d'éclairage
JP5612800B1 (ja) * 2012-12-20 2014-10-22 パナソニック株式会社 ランプ及び照明装置

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