WO2016010350A1 - Dissipateur thermique à ailettes creuses émettrices de chaleur et dispositif d'éclairage le comportant - Google Patents

Dissipateur thermique à ailettes creuses émettrices de chaleur et dispositif d'éclairage le comportant Download PDF

Info

Publication number
WO2016010350A1
WO2016010350A1 PCT/KR2015/007317 KR2015007317W WO2016010350A1 WO 2016010350 A1 WO2016010350 A1 WO 2016010350A1 KR 2015007317 W KR2015007317 W KR 2015007317W WO 2016010350 A1 WO2016010350 A1 WO 2016010350A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat sink
heat
hub
disposed
Prior art date
Application number
PCT/KR2015/007317
Other languages
English (en)
Korean (ko)
Inventor
배영수
Original Assignee
주식회사 휴닉스
배영수
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 휴닉스, 배영수 filed Critical 주식회사 휴닉스
Publication of WO2016010350A1 publication Critical patent/WO2016010350A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades

Definitions

  • the present invention relates to a heat sink and a lighting device, and more particularly, to a heat sink and a lighting device having a heat dissipation structure that is formed to be well ventilated, air convection and air through the heat dissipation is innovatively improved. .
  • LEDs (or OLEDs) used for lighting have recently been spotlighted as light sources of high efficiency lighting because they have higher energy efficiency than fluorescent lamps, sodium lamps, mercury lamps, and incandescent lamps.
  • the LED (or OLED) is weak to heat, and in order to secure the lifetime and efficiency of the LED (or OLED), it is necessary to dissipate heat generated from the LED (or OLED). Therefore, the heat dissipation function has been regarded as an important function among the attributes that LED (or OLED) lighting equipment should have. If the heat dissipation function is insufficient, there is a problem that the life of the LED (or OLED) lighting device is also shortened rapidly.
  • LED (or OLED) lighting equipment Due to the limitation of the heat sink required to improve the heat dissipation performance, there is a limitation in the spread of LED (or OLED) lighting equipment. This problem is particularly aggravated in the case of LED (or OLED) lighting that generates a lot of heat, such as high power LED (or OLED) lighting.
  • the object of the present invention is formed to be well ventilated, air convection and air through the heat dissipation function is innovatively improved, the product size is small and light, the productivity is improved to improve the cost structure, the heat dissipation wing hollow type It is to provide a heat sink and a lighting device using the heat dissipation blade hollow heat sink.
  • the present invention a heat sink hub; A plurality of heat dissipation wings, one end of which is disposed on an outer circumference of the heat sink hub; A heat dissipation wing opening 529 formed between the heat dissipation wings; It provides a heat-dissipating blade hollow heat sink having a; air through the hollow (A5) is formed in the center of the heat-dissipating blade to make air ventilation and air convection.
  • the heat sink hub may be curved or flat.
  • the heat sink hub may have a heat sink hub through-hole so as to maximize air flow and heat dissipation.
  • the heat dissipation wing may be disposed at least two from the outer circumference of the heat sink hub, and the heat dissipation wing opening may be disposed between the heat dissipation wing.
  • one end of the heat dissipation blade may be radially disposed from the heat sink hub.
  • At least a part of the heat dissipation blade may be arranged in a curved or square shape from the circumference of the heat sink hub.
  • the heat dissipation wing includes: a heat dissipation wing body in which a light source module is disposed on an upper surface of the heat dissipation wing, and a length at which the heat dissipation wing is disposed from the heat sink hub to an outer end of the heat dissipation wing body. It may include a heat dissipation wing side line portion protruding along the direction to form a space in which the light source module is accommodated disposed in the heat dissipation wing body.
  • a heat dissipation wing light source module clip part may be disposed at at least a portion of an outer end of the heat dissipation wing body to prevent the light source module from being separated.
  • the other end of the heat dissipation blade which is connected to the outer circumference of the heat sink hub is disposed in a circumferential direction on a plane substantially perpendicular to the heat dissipation wing, and is adjacent to the heat dissipation wing. It may be provided with a heat dissipation wing connecting portion connecting the other end.
  • a heat dissipation fin may be further provided on the inner side of the heat dissipation blade toward the air through hollow.
  • a lighting device having a heat sink including the heat dissipation blade hollow heat sink.
  • the heat sink is a fixed position and a housing housing the power module; And a light source module disposed in the heat sink and configured to emit light to the outside according to an electrical signal from the power module.
  • the heat sink hub may be provided with a hub line through hole for enabling the passage of a wiring line for electrical connection between the light source module and the power module.
  • the light source of the light source module may be an LED or an OLED.
  • the light source module may be disposed on the heat dissipation wing body of the heat sink.
  • the light source module may be disposed in the heat sink hub of the heat sink for more uniform illuminance spread.
  • an optical adjustment unit may be provided to surround at least a portion of the outside of the heat dissipation wing hollow heat sink and to adjust an external emission of light output from the light source module.
  • the optical adjusting unit includes: an optical adjusting hub disposed at a corresponding position of the heat sink hub, and one end of which is connected to an outer circumference of the optical adjusting hub, and is connected to the heat dissipation wing outwardly from the optical adjusting hub. It may also include an optically adjusted heat dissipation wing disposed correspondingly.
  • the other end of the optical adjustment heat dissipation blade may be provided with an optical adjustment heat dissipation wing clip portion fastened to the housing.
  • the optical adjusting unit may be disposed to surround at least a portion of the heat dissipation blade hollow heat sink.
  • the heat sink may further include a plate heat sink disposed between the heat dissipation blade hollow heat sink and the housing and disposed perpendicular to the arrangement length direction of the housing.
  • a thermally conductive adhesive may be disposed between at least a portion of the heat sink and the light source module.
  • the thermally conductive adhesive may include one or more of a thermally conductive adhesive bond, a thermally conductive foam tape, a thermally conductive foam pad, and a thermally conductive grease.
  • At least a part of the heat sink portion is aluminum (Al), magnesium (Mg), iron (Fe). It may include one or more of galvanized iron, stainless steel, copper, aluminum alloy, magnesium alloy.
  • At least a part of the heat sink portion may be formed of gold (Au), silver (Ag), carbon nanotube (CNT), graphene, graphene, boron nitride (BN), and ceramic (ceramic). Surface coating).
  • At least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler may be formed in the heat sink.
  • At least a part of the heat sink is ABS (acrylonitrile-butadiene-styrene), polycarbonate (PC: Polycarbonate), polyimide (PI; Polyimide), PET (PET; polyethylene terephthalate), polyethylene ( Poly Ethylene (PE) and polyether ether ketone (PEEK).
  • ABS acrylonitrile-butadiene-styrene
  • PC Polycarbonate
  • PI Polyimide
  • PET PET
  • PET polyethylene terephthalate
  • PET polyethylene terephthalate
  • PEEK polyether ether ketone
  • At least a part of the heat sink portion may be formed of gold (Au), silver (Ag), carbon nanotube (CNT), graphene, graphene, boron nitride (BN), and ceramic (ceramic). Surface coating).
  • At least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler may be formed in the heat sink.
  • a heat sink protective layer may be formed on at least a portion of the heat sink portion.
  • the heat sink hub may be fixed to the housing.
  • the other end of the heat dissipation blade connected to the heat sink hub may be fixed to the housing.
  • the heat dissipation blade hollow heat sink and lighting device of the present invention is formed to be well ventilated, air convection, and air through the heat sink to provide a heat sink innovatively improved heat dissipation function in the optimal state And ultimately increase the operational performance efficiency of the luminaire.
  • the heat dissipation blade hollow heat sink and the lighting device of the present invention the compactness and size of the heat dissipation structure is innovatively improved and the assembly cost due to the minimization of the number of parts to improve the assemblage at the same time manufacturing cost reduction It can also increase environmental friendliness.
  • the heat dissipation wing hollow heat sink and the lighting device of the present invention can provide a lighting device that maximizes the mountability due to the compact size and weight reduction as a whole, and increases the use range and maintainability.
  • a lighting device due to the arrangement structure of the heat dissipation blade hollow heat sink and the light source module of the lighting device to form a sufficient light emitting surface to form the direction of the emitted light in multiple directions and widen the light evenly It is possible to provide a lighting device as an LED (or OLED) lighting device that can be illuminated on the area.
  • LED or OLED
  • FIG. 1 is a schematic perspective view of a heat dissipation blade hollow heat sink and a lighting device according to an embodiment of the present invention.
  • Figure 2 is a schematic exploded perspective view of the heat dissipation blade hollow heat sink and the lighting device according to an embodiment of the present invention.
  • FIG. 3 and 4 are schematic exploded perspective views of different heat dissipation blade hollow heat sinks and lighting apparatuses according to an embodiment of the present invention.
  • Figure 4 is a schematic partial cross-sectional projection overlapping perspective view of the heat dissipation wing hollow heat sink and the lighting device according to an embodiment of the present invention.
  • 5 and 6 are a schematic plan view and a partial cross-sectional view of the light source module of the heat dissipation blade hollow heat sink and the lighting device according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram illustrating a flow path of air of a heat dissipation blade hollow heat sink and a lighting device according to an embodiment of the present invention.
  • FIG. 8 is a partial cross-sectional view of a heat sink wing heat sink and a lighting device according to another embodiment of the present invention.
  • FIGS. 9 and 10 are a perspective view and an exploded perspective view of the heat dissipation blade hollow heat sink and the lighting device according to another embodiment of the present invention.
  • FIG. 11 is a perspective view of an optical control unit and an illuminating device surrounding all of the heat dissipation blade hollow heat sinks according to another embodiment of the present invention.
  • FIG. 12 is a perspective view and an exploded perspective view of the heat dissipation blade hollow heat sink and the lighting device according to another embodiment of the present invention.
  • FIG. 13 is a perspective view of a heat dissipation blade hollow heat sink in which a heat sink hub through hole is formed according to another embodiment of the present invention.
  • FIG. 14 to 20 is a perspective view and an exploded perspective view of the heat dissipation blade hollow heat sink and the lighting device according to another embodiment of the present invention.
  • Heat dissipation blade hollow heat sink 500 of the present invention takes the hollow type to maximize the heat dissipation area and form a heat dissipation performance optimization structure by securing an air flow path
  • the lighting device 10 of the present invention is the housing 100
  • the light source module 800 may include the substrate 200 in some cases.
  • the light source module 800 includes the substrate 200.
  • the housing 100 of the lighting device 10 forms an internal space, a power module such as SMPS for applying an electrical signal to the light source 300 of the present invention in the internal space of the housing base 110 (not shown) Is placed.
  • the housing 100 includes a housing base 110 and a housing socket 120.
  • the housing socket 120 may be disposed at an end of the housing base 110 to supply power through an electrical connection with an external connector. .
  • the heat sink 400 is positioned fixed to the housing 100.
  • the heat sink unit 400 receives heat generated from the light source 300 to be dissipated through the surface contact and dissipates to the outside to exhaust heat generated from the light source 300 to prevent performance degradation due to heat of the light source 300. To minimize.
  • the substrate 200 of the light source module 800 is disposed above the heat sink 400, and the substrate 200 may form an area contact with the heat sink 400 directly.
  • Various configurations are possible, such as to form a contact structure through.
  • the substrate 200 of the present invention may have a predetermined strip shape or may form a plurality of continuous arrangement structures of a predetermined rectangular type substrate.
  • the substrate 200 may take a plurality of connection arrangement structures of a conventional printed circuit board, or may be formed of a thermally conductive metal substrate.
  • the substrate 200 is formed of a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the substrate 200 formed of the FPCB according to the present embodiment includes a substrate hub 210 and a substrate heat dissipation wing 220.
  • the substrate hub portion 210 may be formed in a predetermined curved or planar structure.
  • the heat sink hub of the heat sink 400 is formed in a circular sheet structure that is opened and erased by a predetermined angle.
  • the 510 is formed in a curved surface, it is possible to form a smooth surface contact structure.
  • Substrate heat dissipation blade 220 extends in the radial direction from the outer circumference of the substrate hub portion 210, a plurality of substrate heat dissipation wings 220 may be tangled structure that extends in the radial direction from the outer circumference of the substrate hub portion 210 have.
  • One or more light sources 300 may be disposed on one surface of the substrate heat dissipation wing 220 and the substrate hub 210.
  • the light source 300 is disposed on one surface of the substrate 200, and the light source 300 is electrically connected to a power module (not shown) disposed in the housing 100 in accordance with a power source that is an electrical signal applied from the power module. Generates predetermined light and emits it to the outside.
  • the light source 300 may be implemented by a plurality of self-light emitting devices, and may be implemented by a self-light emitting device such as an LED or an organic light emit diode (OLED) or a combination thereof.
  • a self-light emitting device such as an LED or an organic light emit diode (OLED) or a combination thereof.
  • the substrate 200 is required, and in some cases, when the light source 300 is formed of oled used as a surface light source, the substrate 200 may be disposed directly on the heat sink without a substrate. have.
  • the light source 300 may maintain an optimal state maximizing efficiency even during a long time light emission operation or may prevent a sudden drop in the performance of the light source 300 due to at least rapid heat storage, thereby increasing the service life of the light source 300. Can be.
  • the lighting device 10 of the present invention forms a structure that can maximize the heat dissipation function of the heat sink. That is, the heat sink 400 (500, 600) of the present invention includes a heat dissipation blade hollow heat sink 500, the heat dissipation wing hollow heat sink 500 is formed in the longitudinal direction in which the housing 100 is disposed, It takes a structure in which the air flow space is formed at the center by penetrating in the direction perpendicular to the longitudinal direction in which the housing 100 is disposed.
  • the heat dissipation blade hollow heat sink 500 includes a heat sink hub 510 and a heat dissipation wing 520, and the heat dissipation wing 520 is disposed on an outer circumference of the heat sink hub 510.
  • the heat sink hub 510 and the heat dissipation blade 520 may be integrally formed, or may be formed separately, or may be integrally formed with the optical adjusting unit to which the heat sink hub is to be described.
  • the heatsink hub 510 is intersected in the longitudinal direction in which the housing 100 is disposed, in this embodiment vertically, that is, the heatsink hub 510 is disposed perpendicular to the Z axis in the drawing. .
  • the heat sink hub 510 may be formed in a planar or curved surface.
  • the housing 100 may be formed in a planar structure disposed substantially on the XY plane in the drawing, or in a curved structure forming a curved cross section along the longitudinal direction of the Z axis.
  • Various modifications are possible in the range where they are arranged to intersect or substantially perpendicular to the longitudinal direction in which they are disposed.
  • the heat sink hub 510 has a hub mounting portion 511 formed therethrough, which is engaged with the optical adjustment mounting portion 711 formed at the upper end of the optical adjustment portion 700 to be stably mounted to the optical adjustment portion 700.
  • the structure can be formed.
  • the heat sink hub 510 is provided with a hub line through hole 513, which is disposed inside the substrate 200 and the housing 100 disposed in the heat dissipation blade hollow heat sink through the hub line through hole 513. It forms a penetration of a wiring line (not shown) that forms a seamless connection with the power module (not shown).
  • the heat dissipation wing 40 has a structure in which one end is radially disposed from the heat sink hub 510. That is, the heat dissipation blade is disposed extending in the radial direction from the outer circumference of the heat sink hub 510, and formed in the longitudinal direction of the housing 100 as well as the radial direction of the heat sink hub 510, including a heat sink hub and a heat dissipation wing.
  • the hollow heat sink 500 may form a semicircular to parabolic structure having a generally cross section.
  • the heat dissipation wing 520 extends from the heat sink hub 510, and the heat dissipation wing 520 and the heat sink hub 510 form an inner space, and are externally disposed through a gap between the dimension heat sink 520. And form a structure that can extend the securing of the internal air flow path.
  • the heat dissipation wing 520 is disposed to extend at least two from the outer periphery of the heat sink hub 510, one end is connected to the heat sink hub 510 and the other end is in the longitudinal direction of the housing 100, that is, at least a part of the heat sink hub 510 direction
  • the heat dissipation blades 520 are formed to extend toward each other, and the plurality of heat dissipation blades 520 forms a structure in which one end is spaced apart from each other on the circumference of the heat sink hub 510, and the shell flow port is disposed between the heat dissipation wings 520 spaced apart from each other.
  • a 529 is formed to allow air flow between the inner space A5 and the outer space Ao of the heat dissipation wing 520 to facilitate heat dissipation through the heat dissipation wing 520.
  • the shell flow port 529 which is a gap formed by the heat dissipation blade 520, forms a structure in which the gap gradually widens in the direction extending from the heat sink hub 510 in the present embodiment.
  • the heat dissipation wing 520 forms a structure in which a plurality of heat dissipation blades 520 are formed, and the other end of the heat dissipation wing 520 is connected by the heat dissipation wing 520 to form a stable support structure at the other end.
  • the other end of the heat dissipation wing 520 and the heat dissipation wing 520 form a circular ring structure.
  • the heat dissipation blade hollow heat sink 520 has a bell shape as a whole, but has a structure in which a wagon flow port 529 is formed on the outer surface to allow air flow between the inside and the outside. Achieve.
  • the heat dissipation wing 520 includes a heat dissipation wing body 521 and a heat dissipation wing side line part 523.
  • the heat dissipation wing body 521 is disposed in a longitudinal direction in which the housing 100 is disposed from the outer circumference of the heat sink hub 510, that is, in a Z-axis direction, and a substrate is disposed on an upper surface of the heat dissipation wing side line part 523.
  • the heat dissipation wing body 521 is disposed radially from the center of the heat sink hub and the heat dissipation wing on the XY plane in a direction perpendicular to the longitudinal direction in which the housing 100 is disposed outside the heat dissipation wing body 521. ) To form a space in which the substrate 200 is accommodated.
  • the heat dissipation wing side line part 523 may be extended on both sides of the heat dissipation wing body 521 to form a stable accommodation mounting structure of the optical adjusting unit 700 in addition to the formation of an arrangement space of the substrate 200. That is, a structure for closing both sides of the optical adjusting unit 700 corresponding to the heat dissipation wing body 521 is formed to form an airtight sealed space together with the optical adjusting unit 700 and the heat dissipation wing body 521 to form an airtight space. Damage to the substrate 200 and the light source 300 disposed by moisture or dirt may be prevented.
  • At least a portion of the heat dissipation wing 520 has a curved or rectangular arrangement structure, wherein the heat dissipation wing body 521 of the heat dissipation wing 520 extends in the longitudinal direction of the housing 100, and has a cross-section as described above.
  • the general shape is a parabolic to circular curved structure in the Z-axis direction, in some cases, the heat dissipation wing body 521 of the heat dissipation wing 520 also takes a curved structure or peeling of the substrate 200 disposed on one surface It may take a square structure to prevent the.
  • the heat dissipation wing body 521 of the heat dissipation wing 520 is formed in the form of a parabolic to semi-circular structure having a generally cross-sectional tendency in the longitudinal direction of the housing 100, that is, the Z-axis direction.
  • the outer circumferential surface of the heat dissipation wing body 521 may have a continuous curved structure, but in this embodiment, the outer circumferential surface of the heat dissipation wing body 521 has a rectangular structure to form a plurality of planar continuous arrangement structures.
  • the heat dissipation efficiency transmitted from the light source 300 to the substrate 200 may be improved by smoothly contacting the substrate 200 with the outer circumferential surface of the heat dissipation wing body 521 through the continuous planar arrangement. It is possible to increase and prevent the peeling from the heat dissipation wing body 521 of the substrate 200.
  • the substrate 200 is disposed on an upper portion of the heat dissipation wing hollow heat sink 500. More specifically, the substrate hub 210 is disposed on one side of the heat sink hub 510, and the upper portion of the heat dissipation wing 520 is disposed on the substrate 200.
  • the substrate heat dissipation blade 220 may be disposed. In this case, the substrate and the heat dissipation blade hollow heat sink 500 may make direct surface contact but increase the efficiency of heat transfer between them, thereby increasing the contact area between the two to increase the heat transfer rate. ) May be further provided.
  • the thermally conductive adhesive 230 is disposed between at least a portion of the heat sinks 400 and 500 and 600 and the substrate 200.
  • the thermally conductive adhesive 230 is a heat dissipation blade hollow heat sink 500. And is disposed between the substrate and the substrate.
  • the thermally conductive adhesive 230 may include one or more of a thermally conductive adhesive bond, a thermally conductive foam tape, a thermally conductive foam pad, and a thermally conductive grease to increase the contact force between the substrate and the heat dissipation blade hollow heatsink. By performing the function of increasing the heat transfer performance can improve the heat transfer rate between the two.
  • the heat sink 400 of the present invention (400; 500, 600) may be formed of a material that improves the heat dissipation performance. At least a portion of the heat sink 400 (500; 600) of the present invention is aluminum (Al), magnesium (Mg), iron (Fe), galvanized iron (Gavanized iron), stainless steel (Stainless Steel), copper, aluminum alloy, It may comprise one or more of the magnesium alloys.
  • the heat generated from the light source module 800 to the power module (not shown) is rapidly dissipated to the outside due to the excellent heat dissipation performance by being formed of a metal material having such excellent heat capacity and / or excellent thermal conductivity. Attenuation can also keep the component's operating performance optimal.
  • the heat sinks 400, 500, and 600 may include gold (Au), silver (Ag), carbon nanotubes (CNT), graphene, graphene, boron nitride (BN), and It may take a structure that is surface coated with one or more of ceramics. That is, gold (Au), silver (Ag), carbon nanotubes (CNT), and graphene on at least a portion of an inner surface, an outer surface, or an inner and outer surface of the heat sinks 400 and 500 and 600 formed of a metal material. By coating one or more of, boron nitride (BN), and ceramic (ceramic) may be configured to maximize the thermal conductivity with the outside air.
  • boron nitride (BN), and ceramic (ceramic) may be configured to maximize the thermal conductivity with the outside air.
  • the heat sink is a material coated with carbon nanotube (CNT) material on a copper (Cu) metal material to selectively increase heat dissipation efficiency and prevent surface corrosion.
  • CNT Carbon Spiral Tube
  • Cu copper
  • CNT Carbon Spiral Tube
  • CNTs include single-walled CNTs (SWNTs), multi-walled CNTs (DWNTs), and multi-walled CNTs (MWNTs), depending on the honeycomb carbon layer.
  • CNTs carbon nanotubes
  • SWNTs single-walled CNTs
  • DWNTs multi-walled CNTs
  • MWNTs multi-walled CNTs
  • Thermal conductivity is further improved by coating carbon nanotubes (CNT) with excellent thermal conductivity compared to other materials such as copper (Cu) and diamonds. Maximized heat dissipation blade hollow heatsink.
  • CNT carbon nanotubes
  • At least a portion of the heat sinks 400 and 500 and 600 may have a structure in which at least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler is filled and formed. It may be. That is, at least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler is formed in the heat sinks 400 and 500 and 600 formed of a metal material to form thermal conductivity with external air. It may also take a configuration to maximize the.
  • CNT carbon nanotube
  • BN boron nitride
  • a method of coating carbon nanotubes (CNT) on a metal material such as copper (Cu) may be sprayed by mixing carbon nanotubes (CNT) with a solvent such as water, ethanol (IPA) or acetate, or carbon.
  • a solvent such as water, ethanol (IPA) or acetate, or carbon.
  • the material of the heat sink is referred to mainly as the thermal conductivity, but may be formed of a material having both weight reduction and thermal conductivity improvement at the same time.
  • At least a part of the heat sinks (400; 500, 600) of the present invention is ABS (acrylonitrile -butadiene-styrene), polycarbonate (PC: Polycarbonate), polyimide (PI; Polyimide), PET (PET; polyethylene terephthalate), polyethylene ( Poly Ethylene (PE) and polyether ether ketone (PEEK). It is also possible to improve the carrying and mounting properties through the heat sink of such a hard material.
  • At least a portion of the heat sinks 400, 500, and 600 may include gold (Au), silver (Ag), carbon nanotubes (CNT), graphene, and boron nitride (BN). And a structure that is surface coated with one or more of ceramics. That is, gold (Au), silver (Ag), carbon nanotubes (CNT), and graphene on at least a portion of an inner surface, an outer surface, or an inner and outer surface of the heat sinks 400 and 500 and 600 formed of a synthetic resin material.
  • the surface coating may be made of one or more of boron nitride (BN) and ceramic to maximize thermal conductivity with external air.
  • the heat sinks 400 and 500 and 600 may have a structure in which at least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler is filled and formed. It may be. That is, the heat sinks 400, 500, 600 formed of a synthetic resin are filled with one or more of carbon nanotube (CNT) fillers, boron nitride (BN) fillers, and ceramic fillers to form thermal conductivity with external air. It may also take a configuration to maximize the.
  • CNT carbon nanotube
  • BN boron nitride
  • the heat sink 400 (500; 600) of the present invention may be formed on at least a portion of the heat sink protective layer to increase the durability by preventing damage due to oxidation.
  • the heat sink protective layer 401 may be formed of a coating or an oxide coating, which may be surface coated by a powder coating or an electrodeposition coating, or may be formed by an oxide plating coating method for forming an oxide coating. Various methods may be used in the range of forming the surface protective film through the heat sink protective layer 401.
  • the other end of the heat dissipation wing body 521 of the present invention may be further provided with a component for fixing the position of the substrate 200. That is, at the other end of the heat dissipation wing body 521 toward the housing 100, a heat dissipation wing substrate clip portion 525 is disposed, and the heat dissipation wing substrate clip portion 525 has a heat dissipation wing body (at the end of the heat dissipation wing body).
  • the substrate of the substrate 200 is formed so as to be spaced apart from one surface of the 521, and at least a part of the end of the substrate 200 is disposed between the surface of the heat dissipation wing body 521 and the heat dissipation wing substrate clip 525.
  • An end portion of the heat dissipation wing 220 may be separated from one surface of the heat dissipation wing body 521 to prevent the end of the heat dissipation wing 220 from being extended toward the outside, thereby preventing assembly discomfort due to the substrate heat dissipation wing 220.
  • the heat dissipation blade hollow heat sink 500 of the present invention may further include a component for increasing the heat dissipation performance to discharge and attenuate heat. That is, the heat dissipation fin 540 may be further provided on the inner surface side of the heat dissipation wing 520 of the heat dissipation wing hollow heat sink 500.
  • the heat dissipation fin 540 is disposed along the Z-axis direction, that is, the length direction of the heat dissipation wing 520, in the longitudinal direction of the housing 100, and the heat dissipation fin 540 is predetermined toward the center of the heat dissipation wing hollow heat sink 500. It may have a width of.
  • a plurality of heat dissipation fins 540 may be arranged, but each of the heat dissipation fins 540 may be spaced apart from each other at a predetermined interval to achieve a space for a smooth flow of air.
  • a plate may be further disposed between the housing 100 of the present invention and the heat dissipation blade hollow heat sink 500 as a component for partitioning the internal space of the housing 100, but in some cases, the housing 100.
  • a component disposed between the heat dissipation blade hollow heat sink 500 may be configured as a separate heat sink.
  • the heat sink 400 of the present invention may further include a flat plate style heat sink 600 together with the heat dissipation wing hollow heat sink 500 of the structure to maximize the heat dissipation performance through the three-dimensional space structure.
  • the plate heat sink 600 is disposed between the heat dissipation blade hollow heat sink 500 and the housing 100 in a direction perpendicular to the longitudinal direction of the housing 100, that is, parallel to the X-Y plane.
  • the plate heat sink 600 may be formed of the same material as the heat dissipation blade hollow heat sink 500.
  • the plate heatsink 600 has a plate heatsink body 610 and a plate heatsink around 620.
  • the plate heatsink body 610 and the plate heatsink around 620 are the housing 100. It takes a structure having a predetermined step in the longitudinal direction, that is, the Z-axis direction, through which the power module (not shown) is arranged and the heat dissipation blade hollow heat sink is arranged to the area where heat transfer occurs It is also possible to take a configuration to achieve an efficient heat dissipation effect by separating.
  • the step is generated according to the design specification of the power module (not shown) disposed inside the housing 100, and in some cases, various modifications may be made according to the specification such that a step may be excluded. This is possible.
  • An around mounting portion 623 is formed at the plate heat sink around 620 of the plate heat sink 600, and a housing mounting portion 113 is formed at the housing 100 at a corresponding position thereof, and the heat dissipation blade hollow heat sink 500 is formed.
  • the shell mounting portion 528 is formed, and the around mounting portion 623, the housing mounting portion 113, and the shell mounting portion 528 are arranged in alignment with each other through a fastening means such as a bolt to form a predetermined fastening structure. It may be.
  • Illuminator 10 of the present invention includes an optical control unit 700, the optical control unit 700 is arranged to surround at least a portion of the heat dissipation wing hollow heat sink 500 outside the light output from the light source 300 Adjust the exit.
  • the optical adjusting unit 700 may be implemented by a plurality of micro lens type optical lenses, or may be implemented by a light cover of a light guiding material formed of a light guiding material. Various choices can be made in the range of adjusting the emitted light. In the present embodiment, the optical adjusting unit 700 will be described based on the case where the optical adjusting unit 700 is implemented as a light cover.
  • the optical adjusting unit 700 includes an optical adjusting hub 710 and an optical adjusting heat dissipation blade 720.
  • the optical adjusting hub 710 is disposed corresponding to the position of the heat sink hub 510, and the optical adjusting heat dissipation blade 720.
  • the optical adjustment hub 710 is formed with the optical adjustment mounting part 711, and the heat dissipation blade hollow heat sink 500 is engaged with the hub mounting part 511 formed in the heat sink hub 510. And a stable mounting structure between the optical adjusting unit 700 may be formed.
  • the optically adjusted heat dissipation wing 720 is disposed corresponding to the heat dissipation wing 520, and faces the heat dissipation wing body 521 of the heat dissipation wing 520 and contacts the heat dissipation wing side line part 523.
  • a predetermined internal space arranged to adjust the light quality, such as the uniformity of the light emitted from the light source 300, at the same time, damage to the substrate 200 to the light source 300 due to the inflow of moisture or foreign matter to degradation It can also prevent.
  • the end of the optical adjustment heat dissipation blade 720 may be further provided with a configuration for individual assembly. That is, the other end of the optical adjustment heat dissipation blade 720, the optical adjustment heat dissipation blade clip portion 725 is protruded, the plate heat sink of the plate heat sink 600 to the corresponding position of the optical adjustment heat dissipation blade clip 725.
  • An around clip portion 621 may be further formed in the around 620, and the other end of the heat dissipation blade hollow heat sink 500 may have a heat dissipation blade clip groove ( 527 is formed, when the optical adjustment unit 700, the heat dissipation blade hollow heat sink 500 and the plate heat sink 600 are sequentially assembled, the optical adjustment heat dissipation wing clip portion 725 is a heat dissipation wing clip groove 527 After being inserted into the) it may be formed to engage the engagement clip portion 621 to be fastened to each other. Through such a structure, it is possible to form a stable fastening structure without interference between each component.
  • the optical adjustment unit may have a shape corresponding to the heat dissipation wing hollow heat sink as described above, but as shown in FIG. 11, the optical adjustment unit 700 may have a cup-type optical adjustment unit 700 having only the upper end 701 opened.
  • various configurations are possible in the range including the heat dissipation blade hollow heat sink to achieve an air flow therein, such that the upper end may also have a closed structure.
  • the heat dissipation blade hollow heat sink of the heat sink of the lighting apparatus has a cross-sectional shape of which an outer parabolic shape is formed, but the present invention is not limited thereto, but an internal space is formed and a plurality of heat dissipation wings are spaced apart.
  • Various configurations are possible in the range in which the shell flow port is formed therebetween.
  • the lamp unit 10a of the present invention is shown. The same components as in the previous embodiment are denoted by the same reference numerals, and redundant description thereof will be omitted.
  • the heat dissipation blade hollow heat sink 500a of the heat sink 400a of the lighting device 10a includes a heat sink hub 510a and a heat dissipation wing 520a, and the heat dissipation wing 520a.
  • Heat dissipation fins 550 may be further provided on the other end outer surface of the substrate.
  • the arrangement position of the light source module 800 of the lighting device (10a) is less than the case of the previous embodiment, but the heat attenuation effect through the heat radiation fin 550 formed on the other end outer surface of the heat dissipation wing (520a). It may be further enhanced.
  • the heat sink hub has been described based on the curved structure in the above embodiments, the heat sink hub of the present invention is not limited thereto. That is, as shown in FIG. 14, the heat sink hub 510 has a planar structure, and the heat dissipation blade 520 is disposed on the outer circumference of the heat sink hub 510 but extends from the heat sink hub 510. Can be taken. At this time, it is apparent from the present technology that the heat dissipation wing may also have a straight structure or a curved structure.
  • the heat sink hub is described as only one curved to planar structure, but the heat sink hub may be formed as a ring structure having a center penetrated therein. That is, as shown in FIG. 15, the heat sink hub 510 may be formed in a ring structure and the heat dissipation wing 520 may be disposed on an outer circumference of the heat sink hub 510 of the ring structure. At least one hub mounting portion 511 is formed at the heat sink hub 510, and an optical adjustment mounting portion 711 is formed at the optical adjusting portion 700 at a corresponding position to form a fastening structure through engagement or fastening means. It may be.
  • the plurality of heat dissipation blades disposed on the outer circumference of the heat sink hub may have a structure connected to the heat sink hubs spaced apart from each other. That is, as illustrated in FIG. 16, a ring type heat sink hub 510b may be disposed, and a plurality of heat dissipation wings 520 may be connected to the ring type heat sink hub 510b.
  • the ring type heat sink hub 510b is provided with hub mounting portions 511b and 511c.
  • the hub mounting parts 511b and 511c include a hub first mounting part 511b disposed on the heat sink hub 510b and a hub second mounting part 511c disposed on the heat dissipation blade 520.
  • the hub first mounting portion 511b is formed on the ring-type heat sink hub 510b, and the hub second mounting portion 511c is disposed on the heat-dissipating blade 520 that is separately removable, but the hub first mounting portion 511b and the hub second
  • the mounting portion 511c may take a structure capable of engaging with each other to maintain a preset positional relationship between the heat dissipation blades 520.
  • the separate removable heat dissipation wing 520 connected to the ring-type heat sink hub 510b may be formed in a linear structure in addition to the curved structure, as described above. That is, the heat dissipation blade 520 (see FIG. 17) is also individualized, and each end is inserted into a through hole formed in the housing middle case 130 that is coupled to the housing base 110, and the other end is divided by the heat dissipation wing and disposed on the top.
  • the ring type heat sink hub 510b may be connected to the structure.
  • the substrate 200 disposed on the heat dissipation blade 520 may be connected to the optical substrate 201 disposed between the housing middle case 130 and the housing base 110, and disposed inside the housing 100.
  • the power supply unit may be connected to the power substrate 203, and may also be in electrical communication with the optical substrate 201 and the power substrate 203.
  • the optical adjusting unit 700 may also be individualized to have a structure in which the optical adjusting unit 700 is inserted into and mounted on the heat sink hub portion corresponding to the heat dissipating wing, and in this case, the optical adjusting unit 700.
  • Components that connect the individualized optical adjustments 700 may be disposed at the bottom to prevent relative displacement formation at the bottom of the.
  • the heat sink hub 510 is formed and disposed in a ring type close to a plate, and a plurality of heat dissipation wings in a vertical direction in individual regions of the ring type heat sink hub 510 b.
  • the optical adjusting unit 700 may have a structure in which the optical adjusting unit 700 is side mounted and supported by the heat sink hub 510 and the housing at both ends.
  • the ring-type heat sink hub may be configured as separate elements as individual elements, but the present invention is not limited thereto, and various configurations are possible. That is, as shown in FIGS. 19 and 20, the heat sink hub 510b is integrated with the optical adjusting unit 700 and is disposed toward the heat dissipation wing 520 toward the inner bottom of the optical adjusting unit 700, and the heat sink hub
  • the hub second mounting portion 511c is formed at 510b, and the hub second mounting portion 511c is formed at the hub first mounting portion 511b formed at the heat sink hub 510b formed integrally with the bottom surface of the optical adjusting unit 700.
  • the hub first mounting boom 511b and the optical adjustment mounting portion 711 may have a structure that is integrated with each other.
  • the heat sink of the present invention has been described with a focus on the case used for a lamp, but can be used in various fields requiring heat dissipation performance through heat transfer.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dissipateur thermique à ailettes creuses rayonnant de la chaleur et un dispositif d'éclairage où les performances de rayonnement thermique sont améliorées de façon innovante, celui-ci étant formé de façon à réaliser une bonne circulation d'air, une bonne convection par l'air et une bonne pénétration de l'air, et la facilité d'assemblage étant améliorée alors que dans le même temps, les coûts de production sont abaissés et le potentiel d'adoption en masse est renforcé et le respect de l'environnement est amélioré du fait de la minimisation des pièces et d'une conception compacte permettant d'améliorer de façon innovante la taille et le poids d'une structure rayonnant de la chaleur. La présente invention concerne un dissipateur thermique à ailettes creuses rayonnant de la chaleur comportant: un moyeu de dissipateur thermique; une pluralité d'ailettes rayonnant de la chaleur dont une des extrémités est formée de la circonférence extérieure du moyeu de dissipateur thermique; des parties ouvertes d'ailettes rayonnant de la chaleur qui sont formées entre les ailettes rayonnant de la chaleur et forment des espaces d'écoulement d'air; et un évidement de pénétration d'air formé de telle façon qu'une circulation d'air et une convection par l'air aient lieu au centre des ailettes rayonnant de la chaleur. Par ailleurs, la présente invention concerne un dispositif d'éclairage comportant: un logement dans lequel une unité de dissipateur thermique utilisée par le dissipateur thermique à ailettes creuses rayonnant de la chaleur est fixée en position, et dans lequel est logé un module de source d'alimentation; et un module de source lumineuse qui est disposé sur l'unité de dissipateur thermique et qui permet à de la lumière d'émerger vers l'extérieur suivant un signal électrique provenant du module de source d'alimentation.
PCT/KR2015/007317 2014-07-14 2015-07-14 Dissipateur thermique à ailettes creuses émettrices de chaleur et dispositif d'éclairage le comportant WO2016010350A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140088371A KR20160008338A (ko) 2014-07-14 2014-07-14 방열날개 중공형 히트싱크 및 이를 구비하는 조명기기
KR10-2014-0088371 2014-07-14

Publications (1)

Publication Number Publication Date
WO2016010350A1 true WO2016010350A1 (fr) 2016-01-21

Family

ID=55078768

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/007317 WO2016010350A1 (fr) 2014-07-14 2015-07-14 Dissipateur thermique à ailettes creuses émettrices de chaleur et dispositif d'éclairage le comportant

Country Status (2)

Country Link
KR (1) KR20160008338A (fr)
WO (1) WO2016010350A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107342792A (zh) * 2017-01-11 2017-11-10 深圳市兆驰数码科技股份有限公司 一种电力猫
CN113286209A (zh) * 2021-07-22 2021-08-20 深圳市美迪声科技有限公司 一种散热效果好的扬声器箱

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102022565B1 (ko) * 2016-01-25 2019-09-18 배영수 방사형 날개 라이트 캡 및 이를 구비하는 조명기기
KR102126348B1 (ko) * 2020-02-03 2020-06-24 (주)코리아반도체조명 Led모듈부가 설치된 방열판을 이용한 led조명
KR102126353B1 (ko) * 2020-02-03 2020-06-24 (주)코리아반도체조명 브릿지로 연결되어 광원을 지지하면서 열을 흡수하여 외부로 발산하는 히트싱크 구조체

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059305A (ja) * 2001-08-13 2003-02-28 Eitekkusu Kk Ｌｅｄ電球
US20080316755A1 (en) * 2007-06-22 2008-12-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp having heat dissipation structure
JP2013016493A (ja) * 2011-07-05 2013-01-24 Industrial Technology Research Inst 照明装置およびその組み立て方法
JP2013020911A (ja) * 2011-07-14 2013-01-31 Osram-Melco Ltd 発光ダイオードランプ及び照明器具
KR20130119632A (ko) * 2012-04-24 2013-11-01 고정호 분리형 하우징을 구비한 발광 다이오드 조명 기기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059305A (ja) * 2001-08-13 2003-02-28 Eitekkusu Kk Ｌｅｄ電球
US20080316755A1 (en) * 2007-06-22 2008-12-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp having heat dissipation structure
JP2013016493A (ja) * 2011-07-05 2013-01-24 Industrial Technology Research Inst 照明装置およびその組み立て方法
JP2013020911A (ja) * 2011-07-14 2013-01-31 Osram-Melco Ltd 発光ダイオードランプ及び照明器具
KR20130119632A (ko) * 2012-04-24 2013-11-01 고정호 분리형 하우징을 구비한 발광 다이오드 조명 기기

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107342792A (zh) * 2017-01-11 2017-11-10 深圳市兆驰数码科技股份有限公司 一种电力猫
CN113286209A (zh) * 2021-07-22 2021-08-20 深圳市美迪声科技有限公司 一种散热效果好的扬声器箱

Also Published As

Publication number Publication date
KR20160008338A (ko) 2016-01-22

Similar Documents

Publication Publication Date Title
WO2016010350A1 (fr) Dissipateur thermique à ailettes creuses émettrices de chaleur et dispositif d'éclairage le comportant
WO2014134850A1 (fr) Ampoule de lampe de réverbère à del très efficace et à économie d'énergie
WO2013047929A1 (fr) Dispositif d'éclairage à diodes électroluminescentes (led)
WO2013100308A1 (fr) Appareil d'éclairage à semi-conducteur optique
WO2010038982A2 (fr) Dispositif dissipateur de chaleur et dispositif d'éclairage par del en forme d'ampoule utilisant celui-ci
WO2010038983A2 (fr) Dispositif dissipateur thermique en spirale et dispositif d'éclairage par del en forme d'ampoule utilisant celui-ci
US8118449B2 (en) Threaded LED retrofit module
US20100165632A1 (en) Heat dissipation device and luminaire comprising the same
WO2013024943A1 (fr) Module de lampe à diode électroluminescente
WO2010064793A2 (fr) Dispositif de dissipation de la chaleur de forme radiale et appareil d'éclairage à del en forme d'ampoule utilisant ce dispositif
TW201235594A (en) LED lamp
WO2013053253A1 (fr) Structure de dissipation thermique pour lampe à del
WO2009157704A2 (fr) Boîtier de del et procédé de fabrication de celui-ci
TWI408312B (zh) 燈具
US20150036369A1 (en) Automobile led head lamp module using flexible substrate and heat sink structure thereof
TWI429849B (zh) 照明裝置
WO2010008186A2 (fr) Unité de dissipation thermique et appareil d'éclairage à del utilisant celle-ci
US8480262B2 (en) Light profile controllable light emitting device
WO2017095181A1 (fr) Dispositif d'éclairage à diodes électroluminescentes
KR20090000151U (ko) 엘이디조명기구용 방열기
WO2013081269A1 (fr) Lampe du type à diodes électroluminescentes à l'épreuve des explosions
KR20110106366A (ko) 발광 다이오드 루미네어
KR101393509B1 (ko) 엘이디 터널등기구
KR101231658B1 (ko) 방열기능을 개선한 엘이디 전구
KR101231078B1 (ko) 메탈 ｐｃｂ 기판을 갖는 ｌｅｄ 형광등

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15822875

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15822875

Country of ref document: EP

Kind code of ref document: A1