WO2016010350A1 - Hollow heatsink with heat-radiating fins, and lighting device comprising same - Google Patents

Abstract

The present invention relates to a hollow heatsink with heat-radiating fins, and a lighting device, which have innovatively improved heat-radiating performance by being formed so as to achieve good air ventilation, air convection and air penetration, and which enable improvement of the assembility, reduction of the production costs, increase of the potential for mass uptake, and improvement of the environmental friendliness due to minimisation of parts and a compact design allowing innovative improvement of the size and weight of a heat-radiating structure. The present invention provides a hollow heatsink with heat-radiating fins, comprising: a heatsink hub; a plurality of heat-radiating fins of which one of the ends is formed from the outer circumference of the heatsink hub; heat-radiating-fin open parts which are formed between the heat-radiating fins and form air flow spaces; and an air penetration hollow formed such that air ventilation and air convection occur in the centre of the heat-radiating fins. Also, the present invention provides a lighting device comprising: a housing in which a heatsink unit used by the hollow heatsink with heat-radiating fins is secured in position, and a power source module is accommodated; and the light source module which is disposed on the heatsink unit, and allows light to be emitted to the outside in accordance with an electrical signal from the power source module.

Description

Heat dissipation blade hollow heat sink and lighting equipment having the same

The present invention relates to a heat sink and a lighting device, and more particularly, to a heat sink and a lighting device having a heat dissipation structure that is formed to be well ventilated, air convection and air through the heat dissipation is innovatively improved. .

LEDs (or OLEDs) used for lighting have recently been spotlighted as light sources of high efficiency lighting because they have higher energy efficiency than fluorescent lamps, sodium lamps, mercury lamps, and incandescent lamps. However, the LED (or OLED) is weak to heat, and in order to secure the lifetime and efficiency of the LED (or OLED), it is necessary to dissipate heat generated from the LED (or OLED). Therefore, the heat dissipation function has been regarded as an important function among the attributes that LED (or OLED) lighting equipment should have. If the heat dissipation function is insufficient, there is a problem that the life of the LED (or OLED) lighting device is also shortened rapidly.

Various efforts are being made to improve the heat dissipation efficiency of LED (or OLED) lighting equipment in order to secure reliability, energy efficiency and product life of LED (or OLED) lighting equipment.

Conventional heat sinks used in LED (or OLED) lighting use high heat LED (or OLED) lighting products in order to increase the heat dissipation area. In this case, since the heat sources are generated in close proximity to each other, there is a problem that the heat dissipation efficiency is insufficient or the size of the high power LED (or OLED) lighting device is large and heavy.

In addition, the use of multiple pieces of heat sink fins, artificial heat sinks, or the development of new materials with high thermal conductivity and heat pipes are used, which are expensive due to the high cost of raw materials and the complicated production process of parts and products. There is a problem.

Due to the limitation of the heat sink required to improve the heat dissipation performance, there is a limitation in the spread of LED (or OLED) lighting equipment. This problem is particularly aggravated in the case of LED (or OLED) lighting that generates a lot of heat, such as high power LED (or OLED) lighting.

Accordingly, in the LED (or OLED) lighting industry, there is a demand for the development of heat sinks with an improved heat dissipation efficiency of heat emitted from LEDs (or OLEDs), and the heat dissipation efficiency of LED (or OLED) lights is good and the product size is small and light. In addition, there has been a demand for the development of a high efficiency heat sink capable of designing LED (or OLED) lighting with improved cost structure, and at the same time, there has been a continuous demand for the development of low-cost LED (or OLED) lighting with good heat dissipation characteristics and low cost.

The object of the present invention is formed to be well ventilated, air convection and air through the heat dissipation function is innovatively improved, the product size is small and light, the productivity is improved to improve the cost structure, the heat dissipation wing hollow type It is to provide a heat sink and a lighting device using the heat dissipation blade hollow heat sink.

The present invention, a heat sink hub; A plurality of heat dissipation wings, one end of which is disposed on an outer circumference of the heat sink hub; A heat dissipation wing opening 529 formed between the heat dissipation wings; It provides a heat-dissipating blade hollow heat sink having a; air through the hollow (A5) is formed in the center of the heat-dissipating blade to make air ventilation and air convection.

In the heat dissipation blade hollow heat sink, the heat sink hub may be curved or flat.

In the heat dissipation blade hollow heat sink, the heat sink hub may have a heat sink hub through-hole so as to maximize air flow and heat dissipation.

In the heat dissipation wing hollow heat sink, the heat dissipation wing may be disposed at least two from the outer circumference of the heat sink hub, and the heat dissipation wing opening may be disposed between the heat dissipation wing.

In the heat dissipation blade hollow heat sink, one end of the heat dissipation blade may be radially disposed from the heat sink hub.

In the heat dissipation blade hollow heat sink, at least a part of the heat dissipation blade may be arranged in a curved or square shape from the circumference of the heat sink hub.

In the heat dissipation blade hollow heat sink, the heat dissipation wing includes: a heat dissipation wing body in which a light source module is disposed on an upper surface of the heat dissipation wing, and a length at which the heat dissipation wing is disposed from the heat sink hub to an outer end of the heat dissipation wing body. It may include a heat dissipation wing side line portion protruding along the direction to form a space in which the light source module is accommodated disposed in the heat dissipation wing body.

In the heat dissipation blade hollow heat sink, a heat dissipation wing light source module clip part may be disposed at at least a portion of an outer end of the heat dissipation wing body to prevent the light source module from being separated.

In the heat dissipation blade hollow heat sink, the other end of the heat dissipation blade which is connected to the outer circumference of the heat sink hub is disposed in a circumferential direction on a plane substantially perpendicular to the heat dissipation wing, and is adjacent to the heat dissipation wing. It may be provided with a heat dissipation wing connecting portion connecting the other end.

In the heat dissipation blade hollow heat sink, a heat dissipation fin may be further provided on the inner side of the heat dissipation blade toward the air through hollow.

According to another aspect of the present invention, there is provided a lighting device having a heat sink including the heat dissipation blade hollow heat sink.

In the lighting device, the heat sink is a fixed position and a housing housing the power module; And a light source module disposed in the heat sink and configured to emit light to the outside according to an electrical signal from the power module.

In the above lighting apparatus, the heat sink hub may be provided with a hub line through hole for enabling the passage of a wiring line for electrical connection between the light source module and the power module.

In the lighting device, the light source of the light source module may be an LED or an OLED.

In the lighting device, the light source module may be disposed on the heat dissipation wing body of the heat sink.

In the lighting apparatus, the light source module may be disposed in the heat sink hub of the heat sink for more uniform illuminance spread.

In the lighting apparatus, an optical adjustment unit may be provided to surround at least a portion of the outside of the heat dissipation wing hollow heat sink and to adjust an external emission of light output from the light source module.

In the illuminating device, the optical adjusting unit includes: an optical adjusting hub disposed at a corresponding position of the heat sink hub, and one end of which is connected to an outer circumference of the optical adjusting hub, and is connected to the heat dissipation wing outwardly from the optical adjusting hub. It may also include an optically adjusted heat dissipation wing disposed correspondingly.

In the above lighting apparatus, the other end of the optical adjustment heat dissipation blade may be provided with an optical adjustment heat dissipation wing clip portion fastened to the housing.

In the lighting apparatus, the optical adjusting unit may be disposed to surround at least a portion of the heat dissipation blade hollow heat sink.

In the above lighting apparatus, the heat sink may further include a plate heat sink disposed between the heat dissipation blade hollow heat sink and the housing and disposed perpendicular to the arrangement length direction of the housing.

In the lighting apparatus, a thermally conductive adhesive may be disposed between at least a portion of the heat sink and the light source module.

In the above lighting apparatus, the thermally conductive adhesive may include one or more of a thermally conductive adhesive bond, a thermally conductive foam tape, a thermally conductive foam pad, and a thermally conductive grease.

In the lighting apparatus, at least a part of the heat sink portion is aluminum (Al), magnesium (Mg), iron (Fe). It may include one or more of galvanized iron, stainless steel, copper, aluminum alloy, magnesium alloy.

In the lighting device, at least a part of the heat sink portion may be formed of gold (Au), silver (Ag), carbon nanotube (CNT), graphene, graphene, boron nitride (BN), and ceramic (ceramic). Surface coating).

In the lighting apparatus, at least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler may be formed in the heat sink.

In the lighting device, at least a part of the heat sink is ABS (acrylonitrile-butadiene-styrene), polycarbonate (PC: Polycarbonate), polyimide (PI; Polyimide), PET (PET; polyethylene terephthalate), polyethylene ( Poly Ethylene (PE) and polyether ether ketone (PEEK).

In the lighting device, at least a part of the heat sink portion may be formed of gold (Au), silver (Ag), carbon nanotube (CNT), graphene, graphene, boron nitride (BN), and ceramic (ceramic). Surface coating).

In the lighting apparatus, at least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler may be formed in the heat sink.

In the lighting apparatus, a heat sink protective layer may be formed on at least a portion of the heat sink portion.

In the luminaire, the heat sink hub may be fixed to the housing.

In the lighting device, the other end of the heat dissipation blade connected to the heat sink hub may be fixed to the housing.

First, the heat dissipation blade hollow heat sink and lighting device of the present invention is formed to be well ventilated, air convection, and air through the heat sink to provide a heat sink innovatively improved heat dissipation function in the optimal state And ultimately increase the operational performance efficiency of the luminaire.

Second, the heat dissipation blade hollow heat sink and the lighting device of the present invention, the compactness and size of the heat dissipation structure is innovatively improved and the assembly cost due to the minimization of the number of parts to improve the assemblage at the same time manufacturing cost reduction It can also increase environmental friendliness.

Third, the heat dissipation wing hollow heat sink and the lighting device of the present invention can provide a lighting device that maximizes the mountability due to the compact size and weight reduction as a whole, and increases the use range and maintainability.

Fourth, due to the arrangement structure of the heat dissipation blade hollow heat sink and the light source module of the lighting device to form a sufficient light emitting surface to form the direction of the emitted light in multiple directions and widen the light evenly It is possible to provide a lighting device as an LED (or OLED) lighting device that can be illuminated on the area.

1 is a schematic perspective view of a heat dissipation blade hollow heat sink and a lighting device according to an embodiment of the present invention.

Figure 2 is a schematic exploded perspective view of the heat dissipation blade hollow heat sink and the lighting device according to an embodiment of the present invention.

3 and 4 are schematic exploded perspective views of different heat dissipation blade hollow heat sinks and lighting apparatuses according to an embodiment of the present invention.

Figure 4 is a schematic partial cross-sectional projection overlapping perspective view of the heat dissipation wing hollow heat sink and the lighting device according to an embodiment of the present invention.

5 and 6 are a schematic plan view and a partial cross-sectional view of the light source module of the heat dissipation blade hollow heat sink and the lighting device according to an embodiment of the present invention.

7 is a schematic diagram illustrating a flow path of air of a heat dissipation blade hollow heat sink and a lighting device according to an embodiment of the present invention.

8 is a partial cross-sectional view of a heat sink wing heat sink and a lighting device according to another embodiment of the present invention.

9 and 10 are a perspective view and an exploded perspective view of the heat dissipation blade hollow heat sink and the lighting device according to another embodiment of the present invention.

11 is a perspective view of an optical control unit and an illuminating device surrounding all of the heat dissipation blade hollow heat sinks according to another embodiment of the present invention.

12 is a perspective view and an exploded perspective view of the heat dissipation blade hollow heat sink and the lighting device according to another embodiment of the present invention.

FIG. 13 is a perspective view of a heat dissipation blade hollow heat sink in which a heat sink hub through hole is formed according to another embodiment of the present invention. FIG.

14 to 20 is a perspective view and an exploded perspective view of the heat dissipation blade hollow heat sink and the lighting device according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

Heat dissipation blade hollow heat sink 500 of the present invention takes the hollow type to maximize the heat dissipation area and form a heat dissipation performance optimization structure by securing an air flow path, the lighting device 10 of the present invention is the housing 100 And a heat sink 400 including the light source module 800 and the hollow heat sink 500, and optionally includes an optical adjusting unit 700. In addition, the light source module 800 may include the substrate 200 in some cases. In this embodiment, the light source module 800 includes the substrate 200.

First, the housing 100 of the lighting device 10 forms an internal space, a power module such as SMPS for applying an electrical signal to the light source 300 of the present invention in the internal space of the housing base 110 (not shown) Is placed. The housing 100 includes a housing base 110 and a housing socket 120. The housing socket 120 may be disposed at an end of the housing base 110 to supply power through an electrical connection with an external connector. .

The heat sink 400 is positioned fixed to the housing 100. The heat sink unit 400 receives heat generated from the light source 300 to be dissipated through the surface contact and dissipates to the outside to exhaust heat generated from the light source 300 to prevent performance degradation due to heat of the light source 300. To minimize.

The substrate 200 of the light source module 800 is disposed above the heat sink 400, and the substrate 200 may form an area contact with the heat sink 400 directly. Various configurations are possible, such as to form a contact structure through.

The substrate 200 of the present invention may have a predetermined strip shape or may form a plurality of continuous arrangement structures of a predetermined rectangular type substrate.

In this embodiment, the substrate 200 may take a plurality of connection arrangement structures of a conventional printed circuit board, or may be formed of a thermally conductive metal substrate. In this embodiment, the substrate 200 is formed of a flexible printed circuit board (FPCB). Although not limited thereto, various implementations may be made in a range corresponding to the structure of the heat sink unit described below.

The substrate 200 formed of the FPCB according to the present embodiment includes a substrate hub 210 and a substrate heat dissipation wing 220. The substrate hub portion 210 may be formed in a predetermined curved or planar structure. When the substrate hub portion 210 is formed in a curved surface, the heat sink hub of the heat sink 400 is formed in a circular sheet structure that is opened and erased by a predetermined angle. When the 510 is formed in a curved surface, it is possible to form a smooth surface contact structure.

Substrate heat dissipation blade 220 extends in the radial direction from the outer circumference of the substrate hub portion 210, a plurality of substrate heat dissipation wings 220 may be tangled structure that extends in the radial direction from the outer circumference of the substrate hub portion 210 have.

One or more light sources 300 may be disposed on one surface of the substrate heat dissipation wing 220 and the substrate hub 210.

The light source 300 is disposed on one surface of the substrate 200, and the light source 300 is electrically connected to a power module (not shown) disposed in the housing 100 in accordance with a power source that is an electrical signal applied from the power module. Generates predetermined light and emits it to the outside.

The light source 300 may be implemented by a plurality of self-light emitting devices, and may be implemented by a self-light emitting device such as an LED or an organic light emit diode (OLED) or a combination thereof. When the light source 300 of the light source module 800 is formed of leds, the substrate 200 is required, and in some cases, when the light source 300 is formed of oled used as a surface light source, the substrate 200 may be disposed directly on the heat sink without a substrate. have.

Through such a structure, heat generated in the light source 300 is emitted from the substrate 200 of the light source module 800 to the outside through the heat sink 400, and thus, due to heat attenuation in the light source 300, the light source ( 300 may maintain an optimal state maximizing efficiency even during a long time light emission operation or may prevent a sudden drop in the performance of the light source 300 due to at least rapid heat storage, thereby increasing the service life of the light source 300. Can be.

On the other hand, the lighting device 10 of the present invention forms a structure that can maximize the heat dissipation function of the heat sink. That is, the heat sink 400 (500, 600) of the present invention includes a heat dissipation blade hollow heat sink 500, the heat dissipation wing hollow heat sink 500 is formed in the longitudinal direction in which the housing 100 is disposed, It takes a structure in which the air flow space is formed at the center by penetrating in the direction perpendicular to the longitudinal direction in which the housing 100 is disposed.

More specifically, the heat dissipation blade hollow heat sink 500 includes a heat sink hub 510 and a heat dissipation wing 520, and the heat dissipation wing 520 is disposed on an outer circumference of the heat sink hub 510. In the present embodiment, the heat sink hub 510 and the heat dissipation blade 520 may be integrally formed, or may be formed separately, or may be integrally formed with the optical adjusting unit to which the heat sink hub is to be described.

In this embodiment, the heatsink hub 510 is intersected in the longitudinal direction in which the housing 100 is disposed, in this embodiment vertically, that is, the heatsink hub 510 is disposed perpendicular to the Z axis in the drawing. .

The heat sink hub 510 may be formed in a planar or curved surface. The housing 100 may be formed in a planar structure disposed substantially on the XY plane in the drawing, or in a curved structure forming a curved cross section along the longitudinal direction of the Z axis. Various modifications are possible in the range where they are arranged to intersect or substantially perpendicular to the longitudinal direction in which they are disposed.

The heat sink hub 510 has a hub mounting portion 511 formed therethrough, which is engaged with the optical adjustment mounting portion 711 formed at the upper end of the optical adjustment portion 700 to be stably mounted to the optical adjustment portion 700. The structure can be formed.

The heat sink hub 510 is provided with a hub line through hole 513, which is disposed inside the substrate 200 and the housing 100 disposed in the heat dissipation blade hollow heat sink through the hub line through hole 513. It forms a penetration of a wiring line (not shown) that forms a seamless connection with the power module (not shown).

The heat dissipation wing 40 has a structure in which one end is radially disposed from the heat sink hub 510. That is, the heat dissipation blade is disposed extending in the radial direction from the outer circumference of the heat sink hub 510, and formed in the longitudinal direction of the housing 100 as well as the radial direction of the heat sink hub 510, including a heat sink hub and a heat dissipation wing. The hollow heat sink 500 may form a semicircular to parabolic structure having a generally cross section.

The heat dissipation wing 520 extends from the heat sink hub 510, and the heat dissipation wing 520 and the heat sink hub 510 form an inner space, and are externally disposed through a gap between the dimension heat sink 520. And form a structure that can extend the securing of the internal air flow path.

The heat dissipation wing 520 is disposed to extend at least two from the outer periphery of the heat sink hub 510, one end is connected to the heat sink hub 510 and the other end is in the longitudinal direction of the housing 100, that is, at least a part of the heat sink hub 510 direction The heat dissipation blades 520 are formed to extend toward each other, and the plurality of heat dissipation blades 520 forms a structure in which one end is spaced apart from each other on the circumference of the heat sink hub 510, and the shell flow port is disposed between the heat dissipation wings 520 spaced apart from each other. A 529 is formed to allow air flow between the inner space A5 and the outer space Ao of the heat dissipation wing 520 to facilitate heat dissipation through the heat dissipation wing 520.

Through such a structure, a smooth flow path of air through the shell flow port 529 is allowed, and a smooth flow path is formed in the inner space A5, thereby increasing the thermal attenuation speed to be generated in the light source 300. By quickly dissipating heat, deterioration can be prevented and optimum operating performance can be maintained.

Meanwhile, the shell flow port 529, which is a gap formed by the heat dissipation blade 520, forms a structure in which the gap gradually widens in the direction extending from the heat sink hub 510 in the present embodiment.

The heat dissipation wing 520 forms a structure in which a plurality of heat dissipation blades 520 are formed, and the other end of the heat dissipation wing 520 is connected by the heat dissipation wing 520 to form a stable support structure at the other end. The other end of the heat dissipation wing 520 and the heat dissipation wing 520 form a circular ring structure. Through such a structure, the heat dissipation blade hollow heat sink 520 has a bell shape as a whole, but has a structure in which a wagon flow port 529 is formed on the outer surface to allow air flow between the inside and the outside. Achieve.

The heat dissipation wing 520 includes a heat dissipation wing body 521 and a heat dissipation wing side line part 523.

The heat dissipation wing body 521 is disposed in a longitudinal direction in which the housing 100 is disposed from the outer circumference of the heat sink hub 510, that is, in a Z-axis direction, and a substrate is disposed on an upper surface of the heat dissipation wing side line part 523. The heat dissipation wing body 521 is disposed radially from the center of the heat sink hub and the heat dissipation wing on the XY plane in a direction perpendicular to the longitudinal direction in which the housing 100 is disposed outside the heat dissipation wing body 521. ) To form a space in which the substrate 200 is accommodated.

The heat dissipation wing side line part 523 may be extended on both sides of the heat dissipation wing body 521 to form a stable accommodation mounting structure of the optical adjusting unit 700 in addition to the formation of an arrangement space of the substrate 200. That is, a structure for closing both sides of the optical adjusting unit 700 corresponding to the heat dissipation wing body 521 is formed to form an airtight sealed space together with the optical adjusting unit 700 and the heat dissipation wing body 521 to form an airtight space. Damage to the substrate 200 and the light source 300 disposed by moisture or dirt may be prevented.

At least a portion of the heat dissipation wing 520 has a curved or rectangular arrangement structure, wherein the heat dissipation wing body 521 of the heat dissipation wing 520 extends in the longitudinal direction of the housing 100, and has a cross-section as described above. The general shape is a parabolic to circular curved structure in the Z-axis direction, in some cases, the heat dissipation wing body 521 of the heat dissipation wing 520 also takes a curved structure or peeling of the substrate 200 disposed on one surface It may take a square structure to prevent the. That is, the heat dissipation wing body 521 of the heat dissipation wing 520 is formed in the form of a parabolic to semi-circular structure having a generally cross-sectional tendency in the longitudinal direction of the housing 100, that is, the Z-axis direction. The outer circumferential surface of the heat dissipation wing body 521 may have a continuous curved structure, but in this embodiment, the outer circumferential surface of the heat dissipation wing body 521 has a rectangular structure to form a plurality of planar continuous arrangement structures. As described above, the heat dissipation efficiency transmitted from the light source 300 to the substrate 200 may be improved by smoothly contacting the substrate 200 with the outer circumferential surface of the heat dissipation wing body 521 through the continuous planar arrangement. It is possible to increase and prevent the peeling from the heat dissipation wing body 521 of the substrate 200.

The substrate 200 is disposed on an upper portion of the heat dissipation wing hollow heat sink 500. More specifically, the substrate hub 210 is disposed on one side of the heat sink hub 510, and the upper portion of the heat dissipation wing 520 is disposed on the substrate 200. The substrate heat dissipation blade 220 may be disposed. In this case, the substrate and the heat dissipation blade hollow heat sink 500 may make direct surface contact but increase the efficiency of heat transfer between them, thereby increasing the contact area between the two to increase the heat transfer rate. ) May be further provided. The thermally conductive adhesive 230 is disposed between at least a portion of the heat sinks 400 and 500 and 600 and the substrate 200. In the present embodiment, the thermally conductive adhesive 230 is a heat dissipation blade hollow heat sink 500. And is disposed between the substrate and the substrate. The thermally conductive adhesive 230 may include one or more of a thermally conductive adhesive bond, a thermally conductive foam tape, a thermally conductive foam pad, and a thermally conductive grease to increase the contact force between the substrate and the heat dissipation blade hollow heatsink. By performing the function of increasing the heat transfer performance can improve the heat transfer rate between the two.

On the other hand, the heat sink 400 of the present invention (400; 500, 600) may be formed of a material that improves the heat dissipation performance. At least a portion of the heat sink 400 (500; 600) of the present invention is aluminum (Al), magnesium (Mg), iron (Fe), galvanized iron (Gavanized iron), stainless steel (Stainless Steel), copper, aluminum alloy, It may comprise one or more of the magnesium alloys. The heat generated from the light source module 800 to the power module (not shown) is rapidly dissipated to the outside due to the excellent heat dissipation performance by being formed of a metal material having such excellent heat capacity and / or excellent thermal conductivity. Attenuation can also keep the component's operating performance optimal.

In some cases, at least a portion of the heat sinks 400, 500, and 600 may include gold (Au), silver (Ag), carbon nanotubes (CNT), graphene, graphene, boron nitride (BN), and It may take a structure that is surface coated with one or more of ceramics. That is, gold (Au), silver (Ag), carbon nanotubes (CNT), and graphene on at least a portion of an inner surface, an outer surface, or an inner and outer surface of the heat sinks 400 and 500 and 600 formed of a metal material. By coating one or more of, boron nitride (BN), and ceramic (ceramic) may be configured to maximize the thermal conductivity with the outside air.

For example, the heat sink, especially the heat dissipation blade hollow heat sink, is a material coated with carbon nanotube (CNT) material on a copper (Cu) metal material to selectively increase heat dissipation efficiency and prevent surface corrosion. CNT (Carbon Spiral Tube) is a carbon fiber composite material in which a graphite sheet, one of the Allotrope of carbon, is rounded to a nano size diameter. Is a cylindrical (tube) structure carbon fiber composite material in which a carbon layer of hexagonal honeycomb structure composed of six carbons is thin and long connected.

CNTs include single-walled CNTs (SWNTs), multi-walled CNTs (DWNTs), and multi-walled CNTs (MWNTs), depending on the honeycomb carbon layer.CNTs (carbon nanotubes) are four times higher than steel and 50% higher than aluminum. It is ideally light, has excellent electrical conductivity, and has the highest thermal conductivity of diamond in nature (see Table 1).

Table 1

matter	Thermal Conductivity Kcal / m.hr.'C
Carbon nanotube	6,000
Graphene	5,000
Diamond	1,300-2,400
silver	360
Copper	320
gold	265
aluminum	175
plastic	0.2-0.5
paper	0.03-0.2

Thermal conductivity is further improved by coating carbon nanotubes (CNT) with excellent thermal conductivity compared to other materials such as copper (Cu) and diamonds. Maximized heat dissipation blade hollow heatsink.

In some cases, at least a portion of the heat sinks 400 and 500 and 600 may have a structure in which at least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler is filled and formed. It may be. That is, at least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler is formed in the heat sinks 400 and 500 and 600 formed of a metal material to form thermal conductivity with external air. It may also take a configuration to maximize the. For example, a method of coating carbon nanotubes (CNT) on a metal material such as copper (Cu) may be sprayed by mixing carbon nanotubes (CNT) with a solvent such as water, ethanol (IPA) or acetate, or carbon. There is a method of applying in the form of a nanotube (CNT) paste, it is possible to ensure the excellent properties of the coating of carbon nanotubes (CNT) through drying or UV treatment through a heat dryer after such coating.

In addition, the wet coating method of crushing or cutting CNT or graphene raw material on a metal material and then applying the CNT dispersion to the target film and coating the film immediately after producing CNT or graphene to reduce costs and processes. Dry coating methods can also be used to increase performance.

On the other hand, in the above embodiment, the material of the heat sink is referred to mainly as the thermal conductivity, but may be formed of a material having both weight reduction and thermal conductivity improvement at the same time.

At least a part of the heat sinks (400; 500, 600) of the present invention is ABS (acrylonitrile -butadiene-styrene), polycarbonate (PC: Polycarbonate), polyimide (PI; Polyimide), PET (PET; polyethylene terephthalate), polyethylene ( Poly Ethylene (PE) and polyether ether ketone (PEEK). It is also possible to improve the carrying and mounting properties through the heat sink of such a hard material.

In some cases, at the same time, at least a portion of the heat sinks 400, 500, and 600 may include gold (Au), silver (Ag), carbon nanotubes (CNT), graphene, and boron nitride (BN). And a structure that is surface coated with one or more of ceramics. That is, gold (Au), silver (Ag), carbon nanotubes (CNT), and graphene on at least a portion of an inner surface, an outer surface, or an inner and outer surface of the heat sinks 400 and 500 and 600 formed of a synthetic resin material. The surface coating may be made of one or more of boron nitride (BN) and ceramic to maximize thermal conductivity with external air.

In some cases, at least a portion of the heat sinks 400 and 500 and 600 may have a structure in which at least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler is filled and formed. It may be. That is, the heat sinks 400, 500, 600 formed of a synthetic resin are filled with one or more of carbon nanotube (CNT) fillers, boron nitride (BN) fillers, and ceramic fillers to form thermal conductivity with external air. It may also take a configuration to maximize the.

On the other hand, the heat sink 400 (500; 600) of the present invention may be formed on at least a portion of the heat sink protective layer to increase the durability by preventing damage due to oxidation. The heat sink protective layer 401 may be formed of a coating or an oxide coating, which may be surface coated by a powder coating or an electrodeposition coating, or may be formed by an oxide plating coating method for forming an oxide coating. Various methods may be used in the range of forming the surface protective film through the heat sink protective layer 401.

On the other hand, the other end of the heat dissipation wing body 521 of the present invention may be further provided with a component for fixing the position of the substrate 200. That is, at the other end of the heat dissipation wing body 521 toward the housing 100, a heat dissipation wing substrate clip portion 525 is disposed, and the heat dissipation wing substrate clip portion 525 has a heat dissipation wing body (at the end of the heat dissipation wing body). The substrate of the substrate 200 is formed so as to be spaced apart from one surface of the 521, and at least a part of the end of the substrate 200 is disposed between the surface of the heat dissipation wing body 521 and the heat dissipation wing substrate clip 525. An end portion of the heat dissipation wing 220 may be separated from one surface of the heat dissipation wing body 521 to prevent the end of the heat dissipation wing 220 from being extended toward the outside, thereby preventing assembly discomfort due to the substrate heat dissipation wing 220.

On the other hand, the heat dissipation blade hollow heat sink 500 of the present invention may further include a component for increasing the heat dissipation performance to discharge and attenuate heat. That is, the heat dissipation fin 540 may be further provided on the inner surface side of the heat dissipation wing 520 of the heat dissipation wing hollow heat sink 500. The heat dissipation fin 540 is disposed along the Z-axis direction, that is, the length direction of the heat dissipation wing 520, in the longitudinal direction of the housing 100, and the heat dissipation fin 540 is predetermined toward the center of the heat dissipation wing hollow heat sink 500. It may have a width of. A plurality of heat dissipation fins 540 may be arranged, but each of the heat dissipation fins 540 may be spaced apart from each other at a predetermined interval to achieve a space for a smooth flow of air.

In addition, a plate may be further disposed between the housing 100 of the present invention and the heat dissipation blade hollow heat sink 500 as a component for partitioning the internal space of the housing 100, but in some cases, the housing 100. And a component disposed between the heat dissipation blade hollow heat sink 500 may be configured as a separate heat sink.

That is, the heat sink 400 of the present invention may further include a flat plate style heat sink 600 together with the heat dissipation wing hollow heat sink 500 of the structure to maximize the heat dissipation performance through the three-dimensional space structure. . In this case, the plate heat sink 600 is disposed between the heat dissipation blade hollow heat sink 500 and the housing 100 in a direction perpendicular to the longitudinal direction of the housing 100, that is, parallel to the X-Y plane. The plate heat sink 600 may be formed of the same material as the heat dissipation blade hollow heat sink 500.

The plate heatsink 600 has a plate heatsink body 610 and a plate heatsink around 620. In this embodiment, the plate heatsink body 610 and the plate heatsink around 620 are the housing 100. It takes a structure having a predetermined step in the longitudinal direction, that is, the Z-axis direction, through which the power module (not shown) is arranged and the heat dissipation blade hollow heat sink is arranged to the area where heat transfer occurs It is also possible to take a configuration to achieve an efficient heat dissipation effect by separating. In addition, in the present embodiment, the step is generated according to the design specification of the power module (not shown) disposed inside the housing 100, and in some cases, various modifications may be made according to the specification such that a step may be excluded. This is possible.

An around mounting portion 623 is formed at the plate heat sink around 620 of the plate heat sink 600, and a housing mounting portion 113 is formed at the housing 100 at a corresponding position thereof, and the heat dissipation blade hollow heat sink 500 is formed. The shell mounting portion 528 is formed, and the around mounting portion 623, the housing mounting portion 113, and the shell mounting portion 528 are arranged in alignment with each other through a fastening means such as a bolt to form a predetermined fastening structure. It may be.

Illuminator 10 of the present invention includes an optical control unit 700, the optical control unit 700 is arranged to surround at least a portion of the heat dissipation wing hollow heat sink 500 outside the light output from the light source 300 Adjust the exit. The optical adjusting unit 700 may be implemented by a plurality of micro lens type optical lenses, or may be implemented by a light cover of a light guiding material formed of a light guiding material. Various choices can be made in the range of adjusting the emitted light. In the present embodiment, the optical adjusting unit 700 will be described based on the case where the optical adjusting unit 700 is implemented as a light cover.

The optical adjusting unit 700 includes an optical adjusting hub 710 and an optical adjusting heat dissipation blade 720. The optical adjusting hub 710 is disposed corresponding to the position of the heat sink hub 510, and the optical adjusting heat dissipation blade 720. ) Has a structure in which one end is connected to the outer circumference of the optical adjustment hub 710 and extends to correspond to the heat dissipation blade 520 outward from the optical adjustment hub 710. That is, the optical adjustment unit 700 also has a predetermined bell shape, but the side of the heat radiation wing hollow heat corresponding to the optical adjustment flow hole 730 is formed by the plurality of optical adjustment heat dissipation blades 720 are formed A smooth coupling state with the sink 500 is formed.

As described above, the optical adjustment hub 710 is formed with the optical adjustment mounting part 711, and the heat dissipation blade hollow heat sink 500 is engaged with the hub mounting part 511 formed in the heat sink hub 510. And a stable mounting structure between the optical adjusting unit 700 may be formed.

The optically adjusted heat dissipation wing 720 is disposed corresponding to the heat dissipation wing 520, and faces the heat dissipation wing body 521 of the heat dissipation wing 520 and contacts the heat dissipation wing side line part 523. By forming a predetermined internal space arranged to adjust the light quality, such as the uniformity of the light emitted from the light source 300, at the same time, damage to the substrate 200 to the light source 300 due to the inflow of moisture or foreign matter to degradation It can also prevent.

On the other hand, the end of the optical adjustment heat dissipation blade 720 may be further provided with a configuration for individual assembly. That is, the other end of the optical adjustment heat dissipation blade 720, the optical adjustment heat dissipation blade clip portion 725 is protruded, the plate heat sink of the plate heat sink 600 to the corresponding position of the optical adjustment heat dissipation blade clip 725. An around clip portion 621 may be further formed in the around 620, and the other end of the heat dissipation blade hollow heat sink 500 may have a heat dissipation blade clip groove ( 527 is formed, when the optical adjustment unit 700, the heat dissipation blade hollow heat sink 500 and the plate heat sink 600 are sequentially assembled, the optical adjustment heat dissipation wing clip portion 725 is a heat dissipation wing clip groove 527 After being inserted into the) it may be formed to engage the engagement clip portion 621 to be fastened to each other. Through such a structure, it is possible to form a stable fastening structure without interference between each component.

In addition, the optical adjustment unit may have a shape corresponding to the heat dissipation wing hollow heat sink as described above, but as shown in FIG. 11, the optical adjustment unit 700 may have a cup-type optical adjustment unit 700 having only the upper end 701 opened. In some cases, various configurations are possible in the range including the heat dissipation blade hollow heat sink to achieve an air flow therein, such that the upper end may also have a closed structure.

Meanwhile, in the above embodiments, the heat dissipation blade hollow heat sink of the heat sink of the lighting apparatus has a cross-sectional shape of which an outer parabolic shape is formed, but the present invention is not limited thereto, but an internal space is formed and a plurality of heat dissipation wings are spaced apart. Various configurations are possible in the range in which the shell flow port is formed therebetween. In the drawings, another example of the lamp unit 10a of the present invention is shown. The same components as in the previous embodiment are denoted by the same reference numerals, and redundant description thereof will be omitted.

As shown in the figure, the heat dissipation blade hollow heat sink 500a of the heat sink 400a of the lighting device 10a includes a heat sink hub 510a and a heat dissipation wing 520a, and the heat dissipation wing 520a. Heat dissipation fins 550 may be further provided on the other end outer surface of the substrate. In this case, the arrangement position of the light source module 800 of the lighting device (10a) is less than the case of the previous embodiment, but the heat attenuation effect through the heat radiation fin 550 formed on the other end outer surface of the heat dissipation wing (520a). It may be further enhanced.

In addition, in the above embodiments, a case in which the other end of the heat dissipation blade to which the heat sink hub is connected has been described in the housing, may be reversed. That is, as shown in FIGS. 12 and 13, the heat sink hub 510 faces the housing side, and a large through hole 512 is formed in the heat sink hub to maximize the air flow, Various modifications are possible, such as a wire (not shown) for electrical connection between the light source of the deployable light source module 800 and / or the power module disposed on the substrate and the housing may be disposed through the heat sink hub. Do.

In addition, although the heat sink hub has been described based on the curved structure in the above embodiments, the heat sink hub of the present invention is not limited thereto. That is, as shown in FIG. 14, the heat sink hub 510 has a planar structure, and the heat dissipation blade 520 is disposed on the outer circumference of the heat sink hub 510 but extends from the heat sink hub 510. Can be taken. At this time, it is apparent from the present technology that the heat dissipation wing may also have a straight structure or a curved structure.

In addition, in the above embodiments, the heat sink hub is described as only one curved to planar structure, but the heat sink hub may be formed as a ring structure having a center penetrated therein. That is, as shown in FIG. 15, the heat sink hub 510 may be formed in a ring structure and the heat dissipation wing 520 may be disposed on an outer circumference of the heat sink hub 510 of the ring structure. At least one hub mounting portion 511 is formed at the heat sink hub 510, and an optical adjustment mounting portion 711 is formed at the optical adjusting portion 700 at a corresponding position to form a fastening structure through engagement or fastening means. It may be.

In addition, the plurality of heat dissipation blades disposed on the outer circumference of the heat sink hub may have a structure connected to the heat sink hubs spaced apart from each other. That is, as illustrated in FIG. 16, a ring type heat sink hub 510b may be disposed, and a plurality of heat dissipation wings 520 may be connected to the ring type heat sink hub 510b.

The ring type heat sink hub 510b is provided with hub mounting portions 511b and 511c. The hub mounting parts 511b and 511c include a hub first mounting part 511b disposed on the heat sink hub 510b and a hub second mounting part 511c disposed on the heat dissipation blade 520. The hub first mounting portion 511b is formed on the ring-type heat sink hub 510b, and the hub second mounting portion 511c is disposed on the heat-dissipating blade 520 that is separately removable, but the hub first mounting portion 511b and the hub second The mounting portion 511c may take a structure capable of engaging with each other to maintain a preset positional relationship between the heat dissipation blades 520.

In addition, the separate removable heat dissipation wing 520 connected to the ring-type heat sink hub 510b may be formed in a linear structure in addition to the curved structure, as described above. That is, the heat dissipation blade 520 (see FIG. 17) is also individualized, and each end is inserted into a through hole formed in the housing middle case 130 that is coupled to the housing base 110, and the other end is divided by the heat dissipation wing and disposed on the top. The ring type heat sink hub 510b may be connected to the structure. In FIG. 17, the substrate 200 disposed on the heat dissipation blade 520 may be connected to the optical substrate 201 disposed between the housing middle case 130 and the housing base 110, and disposed inside the housing 100. The power supply unit may be connected to the power substrate 203, and may also be in electrical communication with the optical substrate 201 and the power substrate 203. In this case, as shown in FIG. 17, the optical adjusting unit 700 may also be individualized to have a structure in which the optical adjusting unit 700 is inserted into and mounted on the heat sink hub portion corresponding to the heat dissipating wing, and in this case, the optical adjusting unit 700. Components that connect the individualized optical adjustments 700 may be disposed at the bottom to prevent relative displacement formation at the bottom of the.

In addition, as shown in FIGS. 14 and 18, the heat sink hub 510 is formed and disposed in a ring type close to a plate, and a plurality of heat dissipation wings in a vertical direction in individual regions of the ring type heat sink hub 510 b. May take a structure in which the heat sink hub 510 and the heat dissipation blade are integrally formed or may be formed in a separate separation coupling structure, as described above. In this case, the optical adjusting unit 700 may have a structure in which the optical adjusting unit 700 is side mounted and supported by the heat sink hub 510 and the housing at both ends.

In addition, the ring-type heat sink hub may be configured as separate elements as individual elements, but the present invention is not limited thereto, and various configurations are possible. That is, as shown in FIGS. 19 and 20, the heat sink hub 510b is integrated with the optical adjusting unit 700 and is disposed toward the heat dissipation wing 520 toward the inner bottom of the optical adjusting unit 700, and the heat sink hub The hub second mounting portion 511c is formed at 510b, and the hub second mounting portion 511c is formed at the hub first mounting portion 511b formed at the heat sink hub 510b formed integrally with the bottom surface of the optical adjusting unit 700. To engage, the hub first mounting boom 511b and the optical adjustment mounting portion 711 may have a structure that is integrated with each other.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

The heat sink of the present invention has been described with a focus on the case used for a lamp, but can be used in various fields requiring heat dissipation performance through heat transfer.

Claims (32)

1. Heatsink hub;

   A plurality of heat dissipation wings, one end of which is disposed on an outer circumference of the heat sink hub;

   A heat dissipation wing opening 529 formed between the heat dissipation wings;

   Heat dissipation blade hollow heat sink comprising; air through the hollow (A5) is formed in the center of the heat dissipation blades so that the air ventilation and air convection.
2. The method of claim 1,

   The heat sink hub is a heat sink wing heat sink, characterized in that the curved surface or flat.
3. The method of claim 1,

   The heat sink hub is a heat dissipation blade hollow heat sink in which a heat sink hub through hole is formed to maximize airflow and heat dissipation.
4. The method of claim 1,

   The heat dissipation blade is a heat dissipation blade hollow heat sink, characterized in that two or more spaced apart from each other from the outer circumference of the heat sink hub and the heat dissipation wing opening is disposed between the heat dissipation wing.
5. The method of claim 1,

   The heat dissipation blade hollow heat sink, characterized in that one end is radially disposed from the heat sink hub.
6. The method of claim 1,

   At least a portion of the heat dissipation blade is a heat dissipation blade hollow heat sink, characterized in that the curved surface or the rectangular arrangement from the circumference of the heat sink hub.
7. The method of claim 1,

   The heat dissipation wing is:

   Heat dissipation wing body and the light source module can be disposed on one side,

   And a heat dissipation wing side line portion protruding from the heat sink hub along a length direction in which the heat dissipation wing is disposed to an outer end of the heat dissipation wing body to form a space in which the light source module is accommodated. Heat dissipation blade hollow heat sink, characterized in that.
8. The method of claim 7, wherein

   The heat dissipation blade hollow heat sink, characterized in that the heat dissipation wing light source module clip portion is disposed on at least a portion of the outer end of the heat dissipation wing body to prevent the light source module from being separated.
9. The method of claim 1,

   The other end end connected to the heat sink hub outer circumference of the heat dissipation wing is disposed in a circumferential direction on a plane substantially perpendicular to the heat dissipation wing, and has a heat dissipation wing connection part connecting the other end between the heat dissipation wing and another heat dissipation wing adjacent thereto. Heat dissipation blade hollow heat sink, characterized in that.
10. The method of claim 1,

    The heat dissipation blade hollow heat sink, characterized in that the heat dissipation wing is further provided with a heat dissipation fin disposed toward the air through the hollow.
11. 10. A lighting device comprising a heat sink comprising a heat dissipation blade hollow heat sink according to any one of claims 1 to 9.
12. The method of claim 11,

    A housing in which the heat sink is positioned and a power module is accommodated

    And a light source module disposed in the heat sink and configured to emit light to the outside according to an electrical signal from the power module.
13. The method of claim 11,

    The heat sink hub is provided with a hub line through hole for enabling the passage of the wiring line for the electrical connection between the light source module and the power module.
14. The method of claim 12,

    The light source of the light source module is an illumination device, characterized in that the LED or OLED.
15. The method of claim 12

    The light source module is a lighting device, characterized in that the light source module is disposed on the heat dissipation wing body of the heat sink.
16. The method of claim 12

    And the light source module is disposed in the heat sink hub of the heat sink.
17. The method of claim 12,

    Illumination apparatus, characterized in that provided with an optical control unit (light cover and optical lens) arranged to surround the outside of the heat dissipation blade hollow heat sink and adjust the external emission of the light output from the light source.
18. The method of claim 17,

    The optical adjusting unit:

    An optical adjustment hub disposed at a corresponding position of the heat sink hub;

    One end is connected to the outer periphery of the optical adjustment hub, and the illumination device comprising an optical adjustment heat dissipation blade disposed to correspond to the heat dissipation wing from the optical adjustment hub to the outside.
19. The method of claim 18,

    Illumination device, characterized in that the other end of the optical adjustment heat dissipation blade is provided with an optical control heat dissipation blade clip portion coupled to the housing.
20. The method of claim 17,

    And the optical control unit is disposed to surround at least a portion of the heat dissipation blade hollow heat sink.
21. The method of claim 13,

    The heat sink unit further comprises a plate heat sink disposed between the heat dissipation blade hollow heat sink and the housing and disposed perpendicular to the arrangement length direction of the housing.
22. The method of claim 12,

    And a thermally conductive attachment material disposed between at least a portion of the heat sink and the substrate.
23. The method of claim 22,

    The thermally conductive adhesive includes at least one of a thermally conductive adhesive bond, a thermally conductive foam tape, a thermally conductive foam pad, and a thermally conductive grease.
24. The method of claim 12,

    At least a part of the heat sink is aluminum (Al), magnesium (Mg), iron (Fe). A luminaire comprising at least one of galvanized iron, stainless steel, copper, an aluminum alloy and a magnesium alloy.
25. The method of claim 24,

    At least a portion of the heat sink portion is surfaced with at least one of gold (Au), silver (Ag), carbon nanotubes (CNT), graphene, graphene, boron nitride (BN), and ceramic (ceramic). Lighting equipment, characterized in that the coating.
26. The method of claim 23, wherein

    And at least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler is formed in the heat sink.
27. The method of claim 12,

    At least a portion of the heat sink portion may include ABS (ABS; acrylonitrile-butadiene-styrene), polycarbonate (PC: Polycarbonate), polyimide (PI; Polyimide), PET (PET; polyethylene terephthalate), polyethylene (PE; Poly Ethylene), Illuminator comprising at least one of polyetheretherketone (PEEK).
28. The method of claim 27,

    At least a portion of the heat sink portion is surfaced with at least one of gold (Au), silver (Ag), carbon nanotubes (CNT), graphene, graphene, boron nitride (BN), and ceramic (ceramic). Lighting equipment, characterized in that the coating.
29. The method of claim 27,

    And at least one of a carbon nanotube (CNT) filler, a boron nitride (BN) filler, and a ceramic filler is formed in the heat sink.
30. The method of claim 12,

    Lighting device, characterized in that the heat sink protective layer is formed on at least a portion of the heat sink.
31. The method of claim 11,

    And the heat sink hub is fixed to the housing.
32. The method of claim 11,

    Illumination device, characterized in that the other end of the heat dissipation blade connected to the heat sink hub is fixed to the housing.

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