JP2013016493A - Illumination device, and assembling method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an illumination device having wide illumination range and high heat dissipation effect and to provide an assembling method thereof.SOLUTION: An illumination device includes a base, a heat dissipation member, at least one flexible printed circuit board, and a plurality of light-emitting elements. The heat dissipation member disposed on the base has a central axis, a plurality of holding curvy surfaces and a plurality of heat dissipation channels extending along the central axis, wherein the holding curvy surfaces and the heat dissipation channels are staggered and arranged about the central axis, and each of the holding curvy surfaces radially extends along the central axis. The flexible printed circuit board is disposed on the holding curvy surfaces. The light-emitting elements are disposed on the flexible printed circuit board. An assembling method of the illumination device is also provided.

Description

  The present invention relates to a lighting device and a method for assembling the lighting device.

  A light-emitting diode (LED) is a semiconductor component. A material for forming a light-emitting chip using an LED mainly includes III-V group compounds such as gallium phosphide (Gap) and gallium arsenide (GaAs). By utilizing the light emission principle of a PN junction, an LED can convert electrical energy into light energy. The LED has a lifespan of 100,000 hours or more, has characteristics such as high-speed response, small size, low power consumption, low pollution, and high reliability, and is also suitable for mass production.

  As demand for energy conversion and environmental protection increases, people have become a global trend to use LEDs as lighting fixtures in everyday life. Generally, an LED becomes a lighting device by being attached to a carrier (for example, a printed circuit board).

  However, LEDs generate a lot of heat while generating light. As a result, the performance of the device is often degraded by the heat generated by the LEDs not being efficiently dissipated to the outside. When an LED bulb is described as an example, the LED bulb prevents overheating when the LED emits light by disposing a heat dissipation structure. If the heat dissipation effect of the heat dissipation structure of the LED bulb is poor, the durability of the LED bulb will be reduced. Furthermore, since it is limited by the light emission characteristics of the LED, the conventional LED bulb cannot reach the illumination range of the incandescent bulb. Achieving both the illumination range and the heat dissipation effect is an important issue for increasing the reliability of LEDs.

  The present invention is used to increase the reliability of a lighting device.

  In one embodiment, the lighting device includes a base, a heat dissipation member, at least one flexible printed circuit board (FPC), and a plurality of light emitting elements. The heat radiating member has a center axis, a plurality of holding curvy surfaces, and a plurality of heat radiating passages. The holding curved surface and the heat dissipation passage are arranged around the central axis. Each holding curved surface extends radially along the central axis. The flexible printed circuit board is disposed on the holding curved surface. The light emitting element is disposed on the flexible printed board.

  In one embodiment, a method for assembling a lighting device includes providing a base and assembling a heat dissipation member on the base. The heat radiating member has a central axis, a plurality of holding curved surfaces extending along the central axis, and a plurality of heat radiating passages. The holding curved surface and the heat dissipation passage are arranged around the central axis. The plurality of light emitting elements are disposed on at least one flexible printed board. The flexible printed circuit board is assembled on the heat radiating member, and the light emitting element is installed on the corresponding holding curved surface. At least one optical element is assembled to the heat radiating member to cover the light emitting element.

  The illumination device of the present invention has a wider illumination range and a higher heat dissipation effect.

It is the schematic which shows the illuminating device which concerns on one embodiment. It is an expanded view of the illuminating device of FIG. It is a fragmentary sectional view in alignment with plane P1 of the illuminating device of FIG. It is a light distribution diagram of the illuminating device of FIG. It is a light distribution diagram of the conventional A19 type incandescent lamp. It is a side view of the illuminating device which concerns on one embodiment. It is a top view along the viewing angle V1 of the illuminating device of FIG. It is a top view of the illuminating device which concerns on one embodiment. It is the schematic which shows the illuminating device which concerns on one embodiment. It is an expanded view of the illuminating device of FIG. It is the schematic which shows the illuminating device which concerns on one embodiment. It is an expanded view of the illuminating device of FIG. It is the schematic which shows the illuminating device which concerns on one embodiment. It is an assembly flowchart of the illuminating device of FIG. It is the partial schematic which shows the heat radiating member in the illuminating device of FIG. It is the schematic which shows a part of assembly of the illuminating device of FIG. It is the schematic which shows a part of assembly of the illuminating device of FIG. It is the schematic which shows a part of assembly of the illuminating device of FIG. It is the schematic which shows the illuminating device which concerns on another embodiment. It is an expanded view of the illuminating device of FIG. It is the assembly schematic which shows the illuminating device which concerns on one embodiment. It is the fragmentary sectional schematic of the illuminating device along the plane P1 of FIG. It is the schematic of the illuminating device which concerns on another embodiment. It is a partial expanded view of the illuminating device which concerns on another embodiment. It is the schematic of the illuminating device which concerns on another embodiment. It is the schematic of the illuminating device which concerns on another embodiment. It is the schematic of the illuminating device which concerns on another embodiment.

  FIG. 1 is a schematic diagram illustrating a lighting device according to one embodiment. FIG. 2 is a development view of the illumination device of FIG. Referring to FIGS. 1 and 2, the lighting device 100 includes a heat radiating member 110, a plurality of flexible printed circuit boards (FPCs) 120, a plurality of light emitting elements 130, a base 140, a circuit board 150, and an optical element 160. A bulb containing The heat radiating member 110 is made of, for example, a heat conductive plastic or a metal having excellent heat conductivity. The heat radiating member 110 includes a central axis C1, a plurality of heat radiating valves 112, and a plurality of heat radiating passages 114. Each heat release valve 112 has a holding curved surface W1, and at least one heat dissipation passage 114 exists between two adjacent holding curved surfaces W1 around the central axis C1. In the present embodiment, the heat radiating valve 112 and the heat radiating passage 114 are symmetrically twisted around the central axis C1, but the present invention is not limited to this. In another embodiment, the plurality of heat dissipation passages exist between the heat dissipation valves. As will be described later, the heat release valve and the heat release passage are symmetrically arranged around the central axis C1.

  Furthermore, each heat release valve 112 has two opposing side walls W2 and W3 adjacent to the holding curved surface W1, and each holding curved surface W1 extends radially along the central axis C1. Each heat radiation passage 114 is substantially a space between two opposing side walls W2 and W3 of two adjacent heat radiation valves 112. The flexible printed circuit board 120 is arranged on the holding curved surface W1 of the heat radiating valve 112 along the surface contour of the heat radiating member 110. However, the flexible printed circuit board 120 bridges the holding curved surface W1 of two adjacent heat radiating valves 112. May be. The light emitting element 130 is, for example, an LED mounted on the flexible printed circuit board 120, and is disposed on the flexible printed circuit board 120 using a surface-mount technology (SMT) or a COB (Chip On Board) process. However, the process of disposing the light emitting element 130 on the flexible printed circuit board 120 is not limited thereto.

  The circuit board 150 assembled between the base 140 and the heat radiating member 110 is electrically connected to the flexible printed circuit board 120 and the light emitting element 130 thereon. The base 140 is a conductive portion 142 to which the flexible printed board 120 is electrically connected. Electricity is transmitted through the conductive portion 142, the circuit board 150, and the flexible printed board 120, and the light emitting element is turned on. In another embodiment, the circuit board 150 is assembled between the base 140 and the heat radiating member 110, but is installed in the heat radiating member 110 due to the hollow structure of the heat radiating member 110. Further, the optical element 160 (for example, a cover) is assembled on the heat radiating member 110 to cover the flexible printed circuit board 120 and the light emitting element 130 thereon. The optical element 160 has at least one opening 162, and the maximum outer shape R1 of the heat dissipation member 110 is larger than the inner diameter R2 of the opening 162. Since the opening 162 of the optical element 160 has elasticity, it can be fitted into the heat dissipation member 110. In the present embodiment, the optical element 160 is a protective structure for the flexible printed circuit board 120 and the light emitting element 130. Since the optical element 160 has elasticity, after the optical element 160 is assembled to the heat dissipation member 110, the light emitting element 130 and the flexible printed circuit board 120 are pressed against the heat dissipation member 110. By adding a remote phosphor or diffuser in the raw material or on the inner wall of the optical element 160, the wavelength can be changed or the scattering effect of the illumination device 100 can be increased.

  As described above, the light emitting element 130 has the characteristics of the flexible printed circuit board 120 and can change the light emission range and direction according to the surface contour of the heat dissipation member 110. Specifically, by forming a light source having a flexible shape using the flexible printed circuit board 120 and the light emitting element 130, the light emitting direction and range of the light emitting element 130 are changed according to the outer contour of the attached component. be able to. As a result, the lighting device 100 has a wider illumination range and a high heat dissipation effect.

  FIG. 3 is a partial cross-sectional view along the plane P1 of the illuminating device of FIG. 2, and the central axis C1 is installed on the plane P1. Since the heat radiating valves 112 are arranged symmetrically around the central axis C1, only one heat radiating valve 112 will be described here, and the remaining heat radiating valves 112 are all the same as this description.

  In this embodiment, a cylindrical coordinate system having a vertical axis X1 and a polar axis X2 is provided. The central axis C1 is equal to the vertical axis X1 of the cylindrical coordinate system. As described above, the holding curved surface W1 extends radially along the central axis C1. The holding curved surface W1 is on the column surface, but has a variable radius along the central axis C1.

  1 to 3, the orthographic projection on the plane P1 of the holding curved surface W1 of the heat release valve 112 is a curve having an inflection point A1. In the further description of the lighting device 100 of FIG. 1, the portion of the holding curved surface W <b> 1 of the heat release valve 112 that is covered with the optical element 160 is substantially a part of a spherical surface. Specifically, in FIG. 3, the curve formed by orthographic projection on the plane P1 of the holding curved surface W1 has a valve opening angle (opening angle) larger than 90 degrees. Therefore, the flexible printed circuit board 120 arranged on the holding curved surface W1 is a curved surface having the same curvature as the holding curved surface W1.

  In the present embodiment, the orthographic projection on the central axis C1 of the heat release valve 112 is, for example, a line segment. The two light emitting elements 130A and 130B are disposed at two opposing ends on the central axis C1. The orthographic vectors L1a and L2a on the central axis C1 of the light emitting vectors L1 and L2 of the two light emitting elements 130A and 130B have opposite directions. As can be seen from this, the light emitting element 130 can be disposed on the holding curved surface W1 between the two light emitting elements 130A and 130B. Specifically, the light emitting device 130 of FIG. 3 is adapted to be disposed on the holding curved surface W1 beyond the inflection point A1 with the position of the flexible printed circuit board 120. Therefore, by arranging the light emitting element 130 along the surface contour of the holding curved surface W1, the light emitting range of the lighting device 100 is increased even when the light emitting angle (valve opening angle θ1) of the lighting device 100 is larger than 90 degrees. Can do. Specifically, the LED is used as a light source of the illumination device 100 in the present embodiment and can overcome the limitation of the light emission angle, and thus fits within the illumination range of a conventional incandescent bulb.

  Referring to FIG. 3, the heat radiating member 110 is divided into a head portion H1 and a neck portion N1 according to its appearance. The light emitting elements 130 are all installed on the head portion H1 of the heat dissipation member 110, and the minimum outer diameter of the head portion H1 is substantially larger than the maximum outer diameter of the neck portion N1. Specifically, the contour of the neck portion N1 is not as large as the contour of the head portion H1. As a result, it is possible to prevent the light emitted from the light emitting element 130 from being blocked by the neck portion N1 due to the neck portion N1 becoming too large and the light emitting effect of the lighting device 100 being reduced.

  4 is a light distribution diagram of the lighting device of FIG. 3, and FIG. 5 is a light distribution diagram of a conventional A19 incandescent bulb. The lighting device 100 of FIG. 4 and the incandescent lamp of FIG. 5 are both arranged in the same state (for example, the state of FIG. 3) in order to compare the light emission distributions. Referring to FIGS. 3, 4, and 5, in the lighting device 100 of FIG. 3, the light emitting elements 130 are arranged at equal distances along the holding curved surface W <b> 1 of the heat dissipation valve 112. The light distribution diagram generated by the light emitting device 130 is very similar to the brightness and range of an A19 incandescent bulb. Therefore, since the position of the light emitting element 130 can be further adjusted, the lighting device 100 can be adapted to the light emission requirements of the A19 type incandescent bulb.

  FIG. 6 is a side view of a lighting device according to one embodiment. Referring to FIG. 6, in the illumination device 200, the regular projection interval on the central axis C <b> 1 of the light emitting element 130 changes along the central axis C <b> 1. In other words, by increasing the arrangement density of the light emitting elements 130 from the optical element 160 toward the base 140, the luminance toward the base 140 can be increased when the lighting device 200 is used. In order to achieve a specific light distribution curve of the lighting device 200, the interval of the orthographic projection on the central axis C1 of the light emitting element 130 may increase, decrease, or a combination thereof along the central axis C1. May be. In addition to changing the arrangement density of the light emitting elements 130, by changing the luminous intensity of the light source, the light source can be replaced with a high-intensity LED having a higher arrangement density when higher brightness is required. The arrangement of the light-emitting elements 130 on the flexible printed circuit board 120 and the heat radiation valve 112 is not limited to the present embodiment, and may be appropriately adjusted according to usage requirements to form a necessary light distribution curve.

  Similarly, the outline of the heat release valve 112 is not limited to the above-described embodiment. The outline of the heat radiating valve 112 may be changed according to the demand for illumination along with the flexible printed circuit board 120 to adjust the illumination range of the illumination device 100. In another embodiment (not shown), the contour of the holding curved surface of the heat release valve may be a curved surface having a plurality of inflection points and generating a specific luminance and light emission range.

  Furthermore, the illumination mode (mode) of the illumination device 200 may be performed via a control circuit (or a microprocessor or the like, not shown). Hereinafter, drive modes in different regions will be described using the illumination device 200 of FIG. 6 as an example.

  The lighting device 200 of FIG. 6 is divided into installation areas A and B arranged vertically along the central axis C1 by the control circuit described above, and has independent brightness and illumination intensity. For example, the light emitting device 130 in the region A or the region B can be controlled to produce a completely bright or completely dark effect when a local light source in a specific direction is required, and the brightness of the light emitting device 130 is further increased. It can also be controlled.

  Furthermore, in another embodiment, the light emitting element 130 may be divided into a plurality of regions C depending on the position of the holding curved surface W1, and each region C may be independent or related to each other. Good. In an embodiment, the light emitting elements 130 in each region C may be controlled to emit light separately. In another embodiment, a part of the adjacent holding curved surface W1 or the holding curved surface W1 having a certain interval may be regarded as the same region so that the emitted light can be controlled.

  Further, the light emitting elements 130 having different wavelengths or different arrangement densities may be arranged on the holding curved surface W1, and at the same time, the light emission time or the light emission frequency may be adjusted by the control circuit. As a result, the application range of the lighting device 200 can be increased. Since the control method of the light emitting module of the light emitting element is not limited to these, appropriate changes can be made as required.

  On the other hand, FIG. 7 is a top view along the viewing angle V1 of the illumination device of FIG. Referring to FIGS. 1 and 7, the light emitting device 130 is disposed on the holding curved surface W <b> 1 of the heat radiating valve 112 having the flexible printed circuit board 120. Therefore, the heat generated by the light emitting element 130 is dissipated into the heat dissipation passage 114 via the two side walls W2 and W3. Depending on the mounting direction of the illuminating device 100 shown in FIG. 3, the heat dissipation passages 114 can be arranged vertically to create an air convection effect and promote heat dissipation. The above-described flexible printed circuit board 120 is in the form of a strip, and the orthographic projection on the normal plane P2 of the central axis C1 of the flexible printed circuit board 120 having the light emitting elements 130 is radial or radial as shown in FIG. Aligned. The heat radiation passage 114 is installed between the two side walls W1 and W2. Therefore, the side walls W <b> 2 and W <b> 3 of the heat dissipation valve 112 may be a heat dissipation interface of the lighting device 100. Specifically, the region where the flexible printed circuit board 120 and the light emitting element 130 are not disposed can be used for heat dissipation. Therefore, the heat dissipation effect of the lighting device 100 and the service life of the light emitting element 130 can be improved.

  FIG. 8 is a top view of a lighting device according to one embodiment. Referring to FIG. 8, the orthographic projection on the normal plane P2 of the central axis C1 of the flexible printed circuit board 320 of the lighting device 300 has a spiral shape on the holding curved surface W1 of the heat dissipation valve 112 shown in the above-described embodiment. Different from the plurality of flexible printed circuit boards 120 arranged. Specifically, the flexible printed circuit board 320 has a spiral structure and extends radially from the adjacent central axis C <b> 1 along the heat dissipation member 110. The light emitting element 130 is disposed on the spiral flexible printed circuit board 320 and is positioned on the holding curved surface of the heat radiation valve 112. The light emitting element 130 is located on the intersection of the flexible printed circuit board 320 and the holding curved surface W1 of the heat radiating valve 112, and dissipates heat generated by the light emitting element 130 through the heat radiating valve 112. In another embodiment (not shown), the orthographic projection on the normal plane of the central axis of the flexible printed circuit board may be arc-shaped, circular, or concentric.

  FIG. 9 is a schematic diagram illustrating a lighting device according to one embodiment. FIG. 10 is a development view of the illumination device of FIG. 9 and 10, the difference from the above-described embodiment is that the heat dissipation member 410 of the lighting device 400 is further connected between two heat dissipation valves 412 so as to cover a part of the heat dissipation passage 414 and release the air. The connection portion 416 having the same curvature as the holding curved surface W1 of the thermal valve 412 is included. As a result, the connection portion 416 strengthens the structural strength of the heat dissipation member 410, prevents air convection in the heat dissipation passage 414, and uses the connection portion 416 as an extending structure of the holding curved surface W1 of the heat dissipation valve 412. Thus, the flexible printed circuit board 120 and the light emitting element 130 can be held.

  The connecting portion 416 is installed at a portion having the maximum outer diameter of the head portion H2, and extends in the opposite direction along the central axis C1.

  Further, the optical element 460 has a plurality of openings 462. When the optical element 460 is assembled to the heat radiating member 410 and covers the flexible printed circuit board 120 and the light emitting element 130 thereon, these openings 462 face the heat radiating path 414 of the heat radiating member 410 and heat convection of the heat radiating path 414. Increase the effect.

  Furthermore, since the heat radiating member 410 is made of a metal material, the lighting device 400 further includes an insulating member 470. The insulating member 470 is assembled to the base 140 and insulates the heat dissipation member 410 from the base 140 so that the lighting device 400 does not malfunction during use.

  FIG. 11 is a schematic diagram illustrating a lighting device according to one embodiment. FIG. 12 is a development view of the illumination device of FIG. 11. Referring to FIGS. 11 and 12, lighting device 500 includes a plurality of optical elements 560 that are disposed on holding curved surface W <b> 1 of heat radiation valve 412 and cover flexible printed circuit board 120 and light emitting element 130 thereon. Further, since the circular circuit board 150 is disposed at the end E1 of the heat dissipation member 410 away from the base 140, the strip-shaped flexible printed circuit board 120 is connected to the edge of the circular circuit board 150, and the heat dissipation member 410. The central axis C <b> 1 passes through the center of the circular circuit board 150.

  Here, since the shape of the disclosed optical element is not limited to the present invention, for example, in the above-described embodiments of FIGS. 1, 9, and 11, the outer diameter of the optical element is changed according to the requirements of illumination and heat dissipation. May be. In an embodiment (not shown), a plurality of optical lenses respectively mounted on the light emitting element 130 may be used instead of the optical element 160 (cover) of FIG. You may adjust according to.

  FIG. 13 is a schematic diagram illustrating a lighting device according to one embodiment. FIG. 14 is an assembly flowchart of the illumination device of FIG. Referring to FIGS. 13 and 14, in order to complete the assembly of the illumination device 600 of the present embodiment, first, in step S140, the light emitting element 130 is disposed on the flexible printed circuit board 120, and then in step S150. The flexible printed circuit board 120 having the light emitting element 130 is disposed on the heat dissipation member 610, and the light emitting element 130 is disposed on the holding curved surface W1.

  FIG. 15 is a partial schematic view showing the inside of the heat dissipating member of the lighting device of FIG. 13. 16 to 18 are schematic views showing a part of the assembly of the lighting device of FIG. Referring to FIGS. 13 to 18 at the same time, it should be mentioned that the heat dissipating member 610 is constituted by a plurality of heat dissipating valves 612 removably assembled on the base 140. More specifically, the heat radiating member 610 is disposed on the base 140 and includes a cylinder 616 having a central axis C1. The cylinder 616 is disposed on a column surface of the cylinder 616 and extends along the central axis C1. It has a plurality of locking chutes 616a. Further, each heat release valve 612 has a first positioning pin 612a and a second positioning pin 612b extending away from the holding curved surface W1, and the base 140 is a plurality of a plurality of members disposed around the central axis C1. It has an insertion slot 144. Since the second positioning pins 612 b are locked in the corresponding insertion slots 144, each heat release valve 612 is fixed on the base 140. Therefore, in step S110, first, the cylinder 616 is assembled to the base 140. Next, in step S120, the first positioning pin 612a of the heat release valve 612 is locked in the locking chute 616a, and in step S130, the second positioning pin 612b of the heat release valve 612 is locked in the corresponding insertion slot 144. Until the first positioning pin 612a is slid in the locking chute 616a. In this manner, a heat radiation passage 614 is formed between two adjacent heat radiation valves 612 assembled to the cylinder 616.

  In step S160, the assembled heat dissipating member 610 and the base 140 are fixed on an assembling fixture J1. Each of the plurality of fixing bars J12 of the assembly tool J1 passes through the heat radiation passage 614. Further, referring to FIG. 13 and FIG. 17, the optical element 660 includes a hemispherical shell portion 662 and a plurality of extending portions 664 installed in the opening of the hemispherical shell portion 662. The extended portion 664 extending from the hemispherical shell portion 662 forms a fence structure, and the fence structure forms another opening 664 facing the hemispherical shell portion 662. The maximum outer diameter R1 of the heat dissipating member 610 is larger than the inner diameter R2 of the opening 665. Here, the optical element 660 is made of an elastic material and has a spherical shape without applying force. Therefore, in step S <b> 170, the optical element 660 fits the opening 665 formed by the fence structure toward the heat dissipation member 610. Each extending portion 664 is automatically aligned between two adjacent fixing bars J12 by the elastic recovery force of the optical element, and moves toward the bottom of the assembly tool J1, and at the same time from the fixing bar J12 to the optical element 660. The opening 665 is expanded by the centrifugal force that is directed. It should be noted that when both the heat radiating member 610 and the base 140 are fixed to the assembly tool J1, the fixing bar J12 penetrates the heat radiating passage 614 and protrudes from the heat radiating passage 614. Accordingly, the fixing bar J12 pushes the extending portion 664 during the assembly process of the optical element 660, enables the extending portion 664 and the light emitting element 130 located on the holding curved surface W1, and rubs each other to extend the extending portion 664. The distance is maintained so that the light emitting element 130 does not come into contact with the light emitting element 130.

  Subsequently, in step S180, the assembled optical element 660, heat radiation member 610, and base 140 are taken out from the assembly tool J1, and the extending portion 664 is coupled and fixed on the holding curved surface W1 by elasticity. As a result, the relative structure described above completes the lighting device process in a considerably simplified manner.

  FIG. 19 is a schematic view showing an illumination apparatus according to another embodiment. FIG. 20 is a development view of the illumination device of FIG. 19 and 20, the lighting device 700 includes a heat dissipation member 710, a plurality of flexible printed circuit boards (FPCs) 720, a plurality of light emitting elements 730, a base 740, a circuit board 750, and an optical element 760. And an insulating member 770. Since the base 740, the circuit board 750, and the insulating member 770 are similar to the embodiment of FIG. 10, their related description will not be repeated here. The heat radiating member 710 has a central axis C <b> 1 and a plurality of heat radiating valves 712. In the present embodiment, the plurality of heat radiation passages 714 a, 714 b and 714 c exist between two adjacent heat radiation valves 712. Compared with the embodiment of FIG. 1, in the embodiment of FIGS. 19 and 20, each heat release valve 712 has a holding curved surface W4 having a region wider than the holding curved surface W1, and the light emitting element 730 is above the holding curved surface W4. Arranged in an array.

  In addition, the heat dissipation member 710 of the lighting device 700 further includes a plurality of connection portions 716a and 716b installed between two adjacent holding curved surfaces W4 of the heat dissipation valve 712. Each connection portion 716a, 716b extends from one holding curved surface W4 to one of the heat radiation paths 714a, 714b, and 714c, covers the heat radiation paths 714a, 714b, and exposes the heat radiation path 714c. In the present embodiment, the more heat radiation passages, the larger the area for radiating heat, and as a result, the heat radiation effect on the heat radiation member 710 is further enhanced.

  Further, the holding curved surface W4 has a structure that is recessed relative to the connecting portions 716a and 716b on the opposite side. The flexible printed circuit board 720 and the light emitting element 730 thereon are configured in this recessed structure for better positioning. The optical element 760 is similar to the optical element 560 of FIGS. 11 and 12, but the curvature of the optical element 760 is the same as that of the heat dissipation member 710 after the optical element 760 is assembled to the heat dissipation member 710.

  FIG. 21 is an assembly schematic diagram illustrating a lighting device according to one embodiment. FIG. 22 is a partial cross-sectional schematic view of the illumination device along the plane P1 of FIG. Referring to FIGS. 21 and 22, lighting device 800 has the appearance of a spherical light bulb, and includes a plurality of light sources 810 (only one is shown) and heat dissipation member 820.

  The heat dissipating member 820 is formed of, for example, a heat conductive plastic or a metal having excellent heat conductivity, and thus the light bar 812 installed on the heat dissipating member 820 dissipates heat. Can do. Further, as shown in FIG. 21 (for example, FIG. 21 shows the structure of an arc-shaped gap, and the extending direction of each arc-shaped cap coincides with the central axis C1), the heat dissipation member 820 has a circular shape with the central axis C1. When configured or turned to surround a multi-curved strip shape relative to the disposed recess 822, the light bar 812 disposed inside the recess 822 also surrounds the curved strip shape, and the light emitting device The extending direction of the light bars 812 along the arrangement direction of 812a coincides with the central axis C1. The cover 814 is flexible and shares the same surface contour as the heat dissipation member 820 after being assembled to the heat dissipation member 820. In the present embodiment, each light emitting element 812a maintains a fixed distance relative to the cover 814. Each cover 814 has a plurality of openings 814a, and a part of the openings 814a directly faces the light emitting elements 812a, and the distribution density of the openings 814a is different from the corresponding positions of the light emitting elements 812a in different positions of the adjacent light emitting elements 812a. Increase towards. The distribution density of the openings 814a further increases from the corresponding position of the light emitting element 812a toward two opposing ends along the central axis C1. At the same time, a reflective diffusing material layer is also placed over the recess 822 and reflects light from the recess 822 through the opening 814a on the cover 814. The openings 814a have the same size, the distribution density of the openings 814a is fixed along the lateral direction X3, and the projection of the central axis C1 on the cover 814 is substantially perpendicular to the lateral direction X3.

  Therefore, when the light source 810 is disposed inside the recess 822 of the heat dissipation member 820, an illumination effect similar to that of a conventional light bulb can be generated. Furthermore, the uniformity and effectiveness of the luminance and illuminance of the lighting device 800 can be further improved by the distribution of the openings 814a on the cover 814. The light source of the present embodiment is not limited to a strip shape, a plate shape, or a curved strip shape. The number of light sources is not limited, and the user may appropriately adjust the number according to the use environment and the lighting style as long as the relationship between the dot light source and the opening on the cover is satisfied.

  FIG. 23 is a schematic view of a lighting device according to another embodiment. Referring to FIG. 23, lighting device 900A includes a heat dissipation member 910, a plurality of flexible printed circuit boards (FPC) 920, a plurality of light emitting elements 930, a base 940, a top circuit board 950, and a plurality of optical elements 960. including. The heat radiating member 910 is made of, for example, a heat conductive plastic by an injection molding technique or made of a metal having excellent heat conductivity. The heat dissipating element 910 has a central axis C1 and a plurality of holding curved surfaces S12. The central axis C1 passes through the base 940. The holding curved surface S12 surrounds the central axis C1. Each flexible printed circuit board 920 is disposed on the holding curved surface S12. A plurality of light emitting elements 930 are arranged on each flexible printed circuit board 920, and each flexible printed circuit board 920 is covered with an optical element 960. In the present embodiment, three flexible printed boards are illustrated, but each lighting device 900A may include three or more flexible printed boards 920. The number of the flexible printed circuit board 920, the corresponding holding curved surface S12, and the optical elements 960 may be adjusted according to actual requirements. Further, the size and shape of the flexible printed circuit board 920, the corresponding holding curved surface S12, and the optical element 960 may be different according to actual requirements.

  From the above, the light emitting element 930 can surround the surface contour of the heat dissipation member 910 and emit light in various directions by using the elasticity of the flexible printed circuit board 920. Further, the design in which the flexible printed circuit board 920 is disposed on the surface of the heat dissipation member 910 rapidly dissipates heat generated by the light emitting element 930 during use, improving the light emitting effect and extending the life of the lighting device 900A. Can do. In addition, the lighting device 900A of the present embodiment has a light emission mode (mode) similar to a conventional spiral energy saving bulb, and is free from defects such as mercury contamination and glass vulnerability.

  The light emitting element 930 of this embodiment is, for example, an LED mounted on a flexible printed circuit board 920, and the LED is flexible by using a surface-mount technology (SMT) or a COB (Chip On Board) process. Arranged on the printed circuit board 920. However, this embodiment does not limit the mounting method of the light emitting element 930. In another embodiment not shown, an optical lens may be arranged on each light emitting element 930 to adjust the light emitting angle of the light emitting element 930 to an ideal range. The optical element 960 of the present embodiment is an optional component that covers the light emitting element 930 of each flexible printed circuit board 920. The optical element 960 is not only a protective structure for the flexible printed circuit board 920 and the light emitting element 930, but also changes the wavelength of the light emitting element 930 by adding fluorescent powder or diffusing particles therein, or the light scattering effect of the lighting device 900A. Can also be improved. The top circuit board 950 of the present embodiment is also an optional element that is disposed on top of the heat dissipation element 910 away from the base 940. The central axis C1 passes through the center of the top circuit board 950, and the light emitting element 930 is also disposed on the top circuit board 950. The light emitting element 930 of the top circuit board 950 enhances the light emission luminance of the lighting device 900A upward. The top optical element 970 can cover the light emitting element 930 of the top circuit board 950. The function of the top optical element 970 is substantially the same as the optical element 960, but the contour of the top optical element 970 may differ from the contour of the optical element 960 to match the contour of the top circuit board 950.

  Although the heat radiating member 910 of this embodiment is formed as a single component, the heat radiating member 910 may be divided into a plurality of disk portions 912. The central axis C <b> 1 passes through the center of each disk portion 912 and is perpendicular to the disk portion 912. The outer end of the disk portion 912 is the holding curved surface S12 described above. The holding curved surface S12 may be parallel to the central axis C1, or may be an inclined surface (not shown) according to actual requirements, and the light emitted from the light emitting element 930 is inclined on the inclined surface. Propagated towards the corner. Each disk portion 912 has a plurality of through holes 9121. The through hole 9121 expands outward from the center of each disk portion 912. The through-hole 9121 disposed on the heat radiating member 910 not only reduces the weight of the heat radiating member 910 but also increases the strength of the structure, and further increases the heat radiating area of the heat radiating member 910 by the light emitting element 930. The generated heat can be dissipated rapidly. The center part of the disk part is connected and the remaining part of the disk part is made parallel to keep a distance from each other. Since the distance between the disk portions 912 provides air circulation, the heat dissipation effect can be increased.

  FIG. 24 is a partial development view of a lighting device according to another embodiment. Referring to FIG. 24, the illumination device 900B of the present embodiment is similar to the illumination device 900A of FIG. 23, and the difference is that each disk portion 912B of the present embodiment is an independent component, and both are mutually independent. It is connected to form a heat dissipation structure similar to the heat dissipation structure 910 of FIG. One of the side edges of each disk portion 912B has a plurality of J-type positioning grooves 912B1. The inner end of the positioning ring 970B has a plurality of positioning pins 972B. The positioning pins 972B are each adapted to slide into the entrance of the J-type positioning groove 912B1. Next, when the positioning pin 972B rotates relative to the disk portion 912B, the disk portion 912B slides through the central portion of the J-type positioning groove 912B1, respectively. Finally, when the positioning ring 970B is pulled away from the disk portion 912B, the positioning pins 972B are disposed at the ends of the J-type positioning grooves 912B1, respectively, so that the positioning pins 972B do not rotate again relative to the disk portion 912B. To. The positioning ring 970B has a plurality of hooks 974B configured to engage the center of another disk portion 912B. In this way, the assembly of the two disk portions 912B is completed. However, the hooks 974B and the positioning pins 972B provided by the positioning ring 970B may be disposed directly on the disk portion 912B. The present invention is not limited to only assembling the positioning ring 970B and the two disk portions 912B.

  Further, the circuit board 980B may be electrically connected to the flexible printed circuit board 920 outside the disk part 912B by disposing the circuit board 980B at the center of the disk part 912B. By placing the spring 990B between two adjacent flexible printed circuit boards 920, holding the positioning pin 972B at the end of the J-type positioning groove 912B1, and not returning to the center of the J-type positioning groove 912B1 , Stability of assembly may be ensured. With the modular design, the number of disk units 912B and the number of light emitting elements 930 of the lighting device 900B of this embodiment may be easily changed to adjust the luminance of the lighting device.

  Further, the luminance distribution may be adjusted by selectively lighting the light emitting elements 930 at different positions by controlling the circuit. Alternatively, a light emitting element 930 that provides light having different wavelengths may be arranged in the lighting device to provide warm white light, cold white light, red light, green light, blue light, or other mixed color light.

  FIG. 25 is a schematic view of a lighting device according to another embodiment. Referring to FIG. 25, the difference between the present embodiment and the above-described embodiment is that the holding curved surface S32 of the heat dissipating member 910C of the lighting device 900C has a streak shape and has a spiral shape that rotates a plurality of times around the central axis C1. Is to do. The flexible printed circuit board 920C disposed on the holding curved surface S32 also has a spiral shape that rotates a plurality of times around the central axis C1. The light emission mode (mode) of the illuminating device 900C of this embodiment is close to the light emission mode (mode) of the conventional spiral energy saving bulb.

  FIG. 26 and FIG. 27 are schematic views of an illumination device according to another embodiment. Referring to FIGS. 26 and 27, the illumination devices 900D and 900E of the two embodiments are similar to the illumination device 900A of FIG. 23 in both function and structure, but the heat dissipation member 910D of FIG. When viewed, it is divided into a plurality of rectangular disk portions 912D, and the heat dissipating member 910E of FIG. 27 is divided into a plurality of triangular disk portions 912E when viewed from the outside. The heat dissipating member of the lighting device of the present embodiment may be divided into a single part or a plurality of parts having other geometric shapes.

  As described above, by using the elasticity of the flexible printed circuit board, the flexible printed circuit board and the light emitting element disposed thereon can surround the surface contour of the heat dissipation member. In addition, since the arrangement of the light emitting elements on the flexible printed circuit board is different, the lighting device to which the LED is used as a light source can widen the light emission range of the lighting device. Furthermore, since the light emitting element is disposed on the heat radiating member, the heat generated by the light emitting element can be rapidly dissipated to increase the heat dissipation effect.

  Based on the above, according to the elasticity of a flexible printed circuit board, a flexible printed circuit board and a light emitting element on it can be arranged with the surface outline of a heat dissipation member. At the same time, since the arrangement positions of the light emitting elements on the flexible printed circuit board are different, the lighting device can match the light emission distribution of the conventional incandescent bulb, and the effect of the illumination range of the lighting device can be improved.

  Further, the heat radiating member is composed of a plurality of axially symmetric heat radiating valves and a heat radiating passage formed therebetween, and the light emitting element is disposed on the heat radiating valve. The heat generated by can be dissipated more effectively. In the disclosed lighting device, a region of the heat dissipation member that is not disposed on the light emitting element may be used as a heat dissipation interface in order to improve the heat dissipation effect of the lighting device.

  As described above, the present invention has been disclosed by the embodiments. However, the present invention is not intended to limit the present invention, and is within the scope of the technical idea of the present invention so that those skilled in the art can easily understand. Therefore, the scope of patent protection should be defined based on the scope of claims and the equivalent area.

100, 200, 300, 400, 500, 600, 700, 800, 900A, 900B, 900C, 900D, 900E Illuminating device 110, 410, 610, 710, 820, 910, 910C, 910D Heat radiation member 112, 412, 612, 712 Heat release valve 114, 414, 614, 714a, 714b, 714c Heat release passage 120, 320, 720, 920, 920C Flexible printed circuit board 130, 130A, 130B, 730, 812a, 930 Light emitting element 140, 740, 940 Base 142 Conductive Portion 144 Insertion slot 150, 750, 950 Circuit board 160, 460, 560, 760, 960 Optical element 416, 716a, 716b Connection portion 162, 665, 462, 814a Opening 470, 770 Insulating member 612 a first positioning pin 612b second positioning pin 616 cylinder 616a locking chute
662 Hemispherical shell portion 664 Stretched portion 810 Light source 812 Optical bar 822 Depression 814 Cover 912, 912B, 912D, 912E Disc portion 9121 Through hole 912B1 J-type positioning groove 970 Top optical element 970B Positioning ring 972B Positioning pin 974B Hook C1 H1 head part J1 assembly tool J12 fixed bar L1, L2 light emission vector L1a, L2a orthographic vector N1 neck part P1 plane P2 normal plane A1 inflection point V1 viewing angle W1, W4, S12, S32 holding curved surface W2, W3 side wall X1 vertical axis X2 Polar axis X3 Horizontal direction θ1 Valve opening angle

Claims (31)

Base and
A heat sink disposed on the base and having a central axis, a plurality of holding curved surfaces, and a plurality of heat radiating passages extending along the central axis, wherein the holding curved surfaces and the heat radiating passages surround the central axis. A member, wherein at least one of the heat dissipation passages is defined between two adjacent holding curved surfaces around the central axis, and each of the holding curved surfaces extends radially along the central axis. A heat dissipating member;
At least one flexible printed circuit board disposed on the holding curved surface;
A lighting device comprising: a plurality of light emitting elements disposed on the flexible printed board.   The illuminating device according to claim 1, wherein the orthographic projection on the plane of each holding curved surface is a curve having at least one inflection point, and the central axis is installed on the plane. The heat dissipation member is
Including a plurality of heat dissipating valves disposed around the central axis;
2. The lighting device according to claim 1, wherein the holding curved surface is configured on each of the heat radiation valves, and the heat radiation passage is installed between two adjacent heat radiation valves.   The lighting device according to claim 3, wherein the flexible printed circuit board bridges the holding curved surface of at least two adjacent heat radiation valves.   The lighting device according to claim 4, wherein the flexible printed circuit board on the normal plane of the central axis has a spiral shape, an arc shape, or a circular shape.   The lighting device according to claim 3, wherein at least one of the flexible printed boards includes a plurality of flexible printed boards arranged along the corresponding holding curved surfaces.   The illumination device according to claim 6, wherein orthographic projections on the normal plane of the central axis of the flexible printed circuit board are radial. The heat dissipating member is further
The lighting device according to claim 3, comprising a cylinder assembled on the base and having the central axis, wherein each of the heat release valves is detachably assembled to a column surface of the cylinder and the base.   Each of the heat release valves has a first positioning pin, the cylinder has a plurality of rocking chutes that are installed on the column surface and extend along the central axis, and the first positioning pin corresponds to The lighting device according to claim 8, wherein the lighting device is locked in the locking chute and the heat radiation valve is fixed to the column surface of the cylinder.   Each of the heat dissipating valves further includes a second positioning pin, the base further includes a plurality of insertion slots arranged around the central axis, and the second positioning pins are in the corresponding insertion slots. The lighting device according to claim 9, wherein each of the heat dissipating valves is fixed on the base.   The heat dissipating member is further connected between the two holding curved surfaces of two adjacent heat dissipating valves, and at least one connecting portion covering a part of the heat dissipating passage between the two adjacent heat dissipating valves. The illuminating device of Claim 3 containing.   The lighting device according to claim 11, wherein the connecting portion and the holding curved surface have the same curvature. The optical element which is arrange | positioned on the said heat radiating member and covers the said holding | maintenance curved surface and the said light emitting element on it is further included, The curvature of the surface outline of the said optical element and the surface outline of the said holding | maintenance curved surface is the same. Lighting equipment.   The lighting device according to claim 13, wherein the optical element includes at least one opening, and a maximum outer diameter of the heat radiating member is larger than an inner diameter of the opening.   The lighting device according to claim 13, wherein the optical element has a plurality of openings connected to the heat dissipation passage.   The optical element has a hemispherical shell part and a plurality of extending parts, the extending parts are individually extended from the hemispherical shell part, and the optical element has elasticity and an external force is applied. The illuminating device according to claim 13, wherein the lighting device has a spherical shape when not in a state.   The heat dissipation passage is suitable for accommodating a plurality of fixing bars of an assembly tool, and when the optical element is assembled to the heat dissipation valve, the extending portions are adjacent to each other by the elastic recovery force of the optical element. The lighting device of claim 16, wherein the lighting device automatically aligns between the fixed bars. The lighting device according to claim 1, further comprising a plurality of optical elements, wherein each of the optical elements is disposed corresponding to the holding curved surface and covers the light emitting element thereon. The lighting device according to claim 1, further comprising a plurality of optical elements, wherein each of the optical elements correspondingly covers the light emitting element. The lighting device according to claim 1, further comprising a circuit board disposed on a side of the heat dissipation member adjacent to the base and electrically connecting the flexible circuit board. The lighting device according to claim 1, further comprising: a circuit board disposed on a side of the heat dissipating member separated from the base, wherein an end from each of the flexible circuit boards is connected to the circuit board.   The lighting device according to claim 1, wherein the light emitting elements on the same holding curved surface are arranged at equal intervals along the central axis.   The lighting device according to claim 1, wherein the light emitting elements on the same holding curved surface are arranged at unequal intervals along the central axis.   The lighting device according to claim 1, wherein the light emitting elements on the same holding curved surface are arranged in an array.   A plurality of the heat dissipation passages are defined between two adjacent holding curved surfaces, and the heat dissipation member further includes a plurality of connecting portions between two adjacent holding curved surfaces, The lighting device according to claim 1, wherein the lighting device extends from one holding curved surface to one of the heat radiation paths, covers a part of the heat radiation path, and exposes at least one of the heat radiation paths.   The lighting device according to claim 11, wherein the holding curved surface has a concave structure with respect to the connection portion on the opposite side.   The lighting device according to claim 13, wherein the optical element has elasticity and presses the light emitting element and the flexible printed circuit board against the heat radiating member. Providing a base,
A heat radiating member having a central axis, a plurality of holding curved surfaces, and a plurality of heat radiating passages extending along the central axis is assembled to the base, and the holding curved surfaces and the heat radiating passages are arranged around the central axis. And
Disposing a plurality of light emitting elements on at least one flexible printed circuit board;
Assembling the flexible printed circuit board on the heat dissipation member, the light emitting element is installed on the corresponding holding curved surface,
Assembling at least one optical element on the heat dissipating member and covering the light emitting element. The optical element has a hemispherical shell part and a plurality of extending parts that are installed in the opening of the hemispherical shell part and extend from the hemispherical shell part, and the optical element has elasticity and a force is applied thereto. It is a method of assembling a spherical lighting device in a state where
Fixing the assembled heat dissipation member and the base on the assembly tool, and a plurality of fixing bars of the assembly tool penetrating the heat dissipation path;
The optical element fits the opening of the hemispherical shell portion toward the heat radiating member, and widens the opening of the hemispherical shell portion therefrom, and each extending portion has two elastic recovery forces of the optical element. Automatically aligning between adjacent said fixed bars;
The assembled optical element, the heat radiating member, and the base are removed from the assembly tool, and the extending portion is coupled and fixed onto the holding curved surface by the elastic recovery force of the optical element. 29. A method of assembling a lighting device according to claim 28.   When both the heat dissipating member and the base are fixed to the assembly tool, the fixing bar correspondingly penetrates the heat dissipating path and protrudes out of the heat dissipating path, and the fixing bar During the process of assembling the element, the extending part and the light emitting element are pushed up by pushing the extending part toward the assembly tool, and the extending part keeps a distance from the light emitting element installed on the holding curved surface. 30. The method of assembling a lighting device according to claim 29, wherein contact with the lighting device is prevented. The heat dissipating member includes a cylinder and a plurality of heat dissipating valves, and the cylinder includes the central axis, a plurality of rocking chutes and a plurality of insertion slots disposed around the central axis; Each of the heat dissipating valves is a method of assembling a lighting device having the holding curved surface, and a first positioning pin and a second positioning pin extending away from the holding curved surface,
Placing the cylinder on the base;
Locking the first positioning pin of the heat release valve in the corresponding locking chute;
The first positioning pin is slid in the locking chute until the second positioning pin of the heat release valve is inserted and locked into the corresponding insertion slot, and the two heat release valves are assembled to the cylinder. 29. The method of assembling an illumination device according to claim 28, further comprising: forming the heat radiation passage between the two heat radiation valves after the heat radiation passage.

Images