WO2013024943A1 - Light-emitting diode lamp module - Google Patents

Light-emitting diode lamp module Download PDF

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Publication number
WO2013024943A1
WO2013024943A1 PCT/KR2011/009656 KR2011009656W WO2013024943A1 WO 2013024943 A1 WO2013024943 A1 WO 2013024943A1 KR 2011009656 W KR2011009656 W KR 2011009656W WO 2013024943 A1 WO2013024943 A1 WO 2013024943A1
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WO
WIPO (PCT)
Prior art keywords
light
heat dissipation
heat
power supply
led
Prior art date
Application number
PCT/KR2011/009656
Other languages
French (fr)
Korean (ko)
Inventor
안인규
이슬기
Original Assignee
Ahn In-Kyu
Lee Seul-Ki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ahn In-Kyu, Lee Seul-Ki filed Critical Ahn In-Kyu
Publication of WO2013024943A1 publication Critical patent/WO2013024943A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/023Power supplies in a casing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K2/00Non-electric light sources using luminescence; Light sources using electrochemiluminescence
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/02Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/04Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/043Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures mounted by means of a rigid support, e.g. bracket or arm
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00Controlling the distribution of the light emitted by adjustment of elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/0075Fastening of light sources or lamp holders of tubular light sources, e.g. ring-shaped fluorescent light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15Thermal insulation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14Adjustable mountings
    • F21V21/30Pivoted housings or frames
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/005Sealing arrangements therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light emitting diode lighting module, and more particularly, to form a small LED lighting module using a light emitting diode (LED) having a low heat generation and low power consumption as a light source, and using them, various lighting fixtures (for example, stairs). Lighting, floodlight, security light, landscape lighting, house or barn or factory lighting, living room lighting, signage indirect lighting and downlight etc.) can be easily manufactured and used. Molded using a magnesium (Mg) alloy, a light metal series alloy having high properties, but is formed in a streamlined column shape rather than a thin film form so that air can flow in all directions through die casting.
  • the converter housing enclosure which supplies power to the diode, is injected with conductive / polymer heat-resistant resin.
  • the multi-purpose LED lighting module invented to be able to significantly improve the heat dissipation function of the lighting fixtures itself by attaching and detachably fixed to the upper surface of the heat sink, and to reduce the weight and size of the lighting fixtures itself. will be.
  • a conventional security lamp or street lamp is mainly used by mercury lamp or sodium lamp as a light source to illuminate so that the energy consumption is high compared to the brightness and the life is short. It became necessary.
  • the above-mentioned materials have a problem of causing environmental pollution during disposal.
  • the light emitting diode generates a small number of carriers (electrons or holes) injected using a PN junction structure of a semiconductor having advantages such as fast response speed, low power consumption, and long life. It is used to emit light by recombination, and consumes about 1/10 of the power consumption of the conventional incandescent light bulb, which has the advantage of greatly reducing the electric energy.
  • the conventional lighting device using a light emitting diode has a difficulty in solving the heat dissipation problem, mainly using a low brightness light emitting diode.
  • a high brightness LED when used, a considerable amount of heat is generated. If the airing function is poor, this heat causes damage to the peripheral device, and the life of the LED is also shortened rapidly. I can't have a problem.
  • a light emitting device using a light emitting diode for example, a light emitting diode type security lamp or a street lamp, has a simple lighting circuit, unlike an ordinary fluorescent lamp or a street lamp, and does not require an inverter circuit and an iron ballast, and consumes power. Its low cost and long lifespan have the advantage of low maintenance and repair costs.
  • a printed circuit board such as a light emitting diode security light or a street lamp or floodlight, a landscape lighting, or a house or livestock lamp, a signboard indirect light, a down light, or a living room light may have a plurality of LEDs on a PCB.
  • a control circuit for controlling the blinking and a power circuit for supplying power from the outside to each LED are implemented, and the control board causes malfunction or failure due to thermal stress caused by heat generated in the plurality of LEDs.
  • heat sinks such as heat sinks or slugs using metal materials having excellent thermal conductivity
  • the thermal stress caused by the light emission of the LED is to be eliminated, but the thickness and volume of the heat sink are increased to satisfy the heat dissipation efficiency required due to the limitations of the metal materials constituting the heat sink.
  • the size and weight of the luminaire will increase.
  • the heat spreader of the conventional heat spreader (aka non-powered heat pump) principle is excellent in performance but limited in life, expensive and bulky, but in recent years it has been applied to expensive products such as notebooks and some LED lights, but In the case of appliances, the price becomes too expensive.
  • the heat dissipation structure which is provided as a structure in which a conventional aluminum thin film sheet is laminated after pressing and bundled into a bundle, has a heat conduction portion to some extent and improves heat spreading performance.
  • the air space in the narrow space between the thin plates has a problem of causing heat retention, and is also a heat dissipation method which is not recommended especially in a place where a lot of fine dust or dust is present.
  • the LED lighting module is used to produce various lighting fixtures such as staircase lighting, floodlight, security lamp, landscape lighting, house or barn or factory lighting, living room lighting, signboard indirect lighting, and downlight.
  • various lighting fixtures such as staircase lighting, floodlight, security lamp, landscape lighting, house or barn or factory lighting, living room lighting, signboard indirect lighting, and downlight.
  • a power supply converter directly on the module.
  • a large current limiter or color controller and a power supply converter are manufactured separately to connect power and signal lines to several lighting modules. You may have to.
  • the present invention has been devised to solve such a conventional problem, using a high-brightness light emitting diode (LED) as a light source with low illumination and low power consumption as a light source, the radiator is made of air flow in all directions
  • the thermal diffusivity is approximately 1.7 times higher than that of aluminum, and the specific gravity is about 35% lower, and it is formed through die casting using a magnesium alloy, which is a light metal alloy having light characteristics.
  • the heat dissipation function of the module itself can be greatly improved, and The overall volume and volume of each LED lighting module can be greatly reduced, which enables to reduce the weight and size, and significantly reduce the production cost of the product.
  • relatively high-power lighting fixtures such as floodlights and security lamps.
  • In the production of modules only the required number of LED lighting modules can be installed inside the reflector or case in the state of using existing props, reflector or case as it is, thereby greatly reducing the production cost and installation cost of the product. It is an object of the present invention to provide a light emitting diode lighting module that can reduce as well as prevent unnecessary resource waste.
  • Another object of the present invention in the case of the LED lighting module having a power supply converter integrally installed without detaching the case, such that the enclosure in which the power supply converter is built directly on the upper surface of the heat sink.
  • the heat generated from the power supply converter installed inside the enclosure by injection molding the enclosure with a conductive / polymer heat-dissipating resin material containing carbon nanotubes (CNT) having excellent thermal conductivity rather than general synthetic resin. Not only can the heat dissipate smoothly, but also some of the remaining heat of the light emitting diodes that are radiated through the radiator can also be radiated through the enclosure to provide a light emitting diode lighting module that can further reduce the weight and size of the LED lighting module itself. .
  • CNT carbon nanotubes
  • Another object of the present invention is to use the elastic fixtures in each LED lighting module in the case of a high-power lighting fixture that requires several LED lighting modules, such as floodlights or security lights, house or barn or factory lighting and living room lights, etc. Spiral sockets on enclosures, light projections, or diffusers, if it is necessary to easily fix them to the module mounting plate, and when one LED lighting module needs to be installed in the form of a bulb, such as staircase lighting, landscape lighting, signage indirect lighting, and downlights.
  • the present invention provides a light emitting diode lighting module that can be easily fixed and installed with a coupling or socket coupling and ventilation support, thereby improving compatibility of the LED lighting module itself to meet various user's various lighting fixtures.
  • LED lighting module that is used to perform a function of a lamp alone, or fixedly installed in the module fixed plate having a predetermined area to configure various lighting fixtures having a desired output
  • the configuration in the form of a square or disc shape and the LED substrate receiving groove and the waterproof ring insertion groove is formed on the back to transmit or diffuse the light generated from the LED and to block the inflow of various foreign substances and rainwater flowing from the outside Light floodlight or diffuser plate;
  • LEDs have a shape fixed by soldering at predetermined intervals and are installed in the LED substrate receiving groove of the light transmitting or diffusing plate to generate light for illumination under the control of a current limiter or a color controller and a power supply converter.
  • the LED lighting module used to perform various functions of the lamp alone, or fixed to the module fixing plate having a predetermined area to configure various lighting fixtures having a desired output
  • the configuration in the form of a square or disc shape and the LED substrate receiving groove and the waterproof ring insertion groove is formed on the back to transmit or diffuse the light generated from the LED and to block the inflow of various foreign substances and rainwater flowing from the outside Light floodlight or diffuser plate;
  • An LED substrate having a shape in which several LEDs are soldered at predetermined intervals and installed in the LED substrate receiving groove of the light transmission or diffusion plate to generate light for illumination when a power voltage is supplied from a power supply converter;
  • several streamlined heat-dissipating rods are formed of a light metal series alloy so as to protrude integrally on the upper surface, and the bottom of the LED substrate is closely adhered to the bottom of the light transmission or diffuser plate.
  • Including the heat generated by the power supply converter is formed in the injection molded shape of the conductive / polymer heat-dissipating resin material so that the lid body is provided with a lid body detachably fixed to the upper surface of the heat sink and housed therein
  • a power supply converter for supplying a power voltage necessary for driving the LED installed in the LED substrate in the state of being housed in the heat dissipation enclosure.
  • the light-metal alloys constituting the heat dissipation in the two embodiments has a heat diffusion coefficient of 1.3-1.4 [cm 2 / sec], a thermal conductivity of 60-90 [W / mK], and a density of 1.8 ⁇ 0.3 [ g / cm 3], a melting temperature of 595 [° C.], and a specific heat of 1.02-1.05 [J / gK].
  • the light metal-based alloy constituting the heat sink is characterized in that it comprises beryllium and titanium, duralumin and carbon-aluminum composite material.
  • the outer circumferential surface of the streamlined heat dissipating rod protruded to the upper surface of the heat dissipating member may be further protruded at a predetermined interval to increase the heat dissipation surface area.
  • the conductive / polymeric heat dissipating resin material constituting the lid including the heat dissipation enclosure has a heat diffusion coefficient of 0.75-0.8 [cm 2 / sec], a thermal conductivity of 90-150 [W / mK], and a density of 1.4 ⁇ . 0.2 [g / cm 3], a melting temperature of 105-160 [° C.], and carbon nanotubes (CNT) having a specific heat of 1.1 ⁇ 0.4 [J / gK].
  • both sides of the bottom surface of the lid body of the heat dissipation housing is characterized in that it is provided with a substrate guide groove to which both sides of the power supply converter is fitted, and side plates inserted into the heat dissipation enclosure.
  • the rear surface of the side plate protruding from the lid of the heat dissipation enclosure is characterized in that the insulation blocking film for preventing a short circuit between the soldering portion of the power supply converter and the conductive heat dissipation enclosure is further formed integrally.
  • the waterproof packing is further installed to prevent various foreign substances, including moisture from the outside into the interior of the heat dissipation enclosure.
  • a pair or two pairs of power supply terminal mounting holes are formed on the lid of the heat dissipation enclosure in order to install a power supply terminal for supplying AC power to the power supply converter.
  • the AC power supply line and the jump line are connected to the LED light modules adjacent to each other outside the heat dissipation enclosure of the LED lighting module by using a connector provided integrally. It is characterized by installing a power supply terminal for connector coupling to jump the power.
  • the power supply terminals bent and formed into a "c" shape on each pair to jump AC power supply lines to adjacent LED lighting modules. Characterized in that installed.
  • the spiral socket coupler for providing an AC voltage to the power supply converter and screwing the LED lighting module itself to the socket like a general electric bulb is insulated and bonded. It is characterized in that the fixed integrally installed using the adhesive provided with the function at the same time.
  • the front and rear surfaces of the heat dissipation housing is characterized in that the heat dissipation protrusions for further extending the heat dissipation surface area at a predetermined interval formed by further extrusion molding.
  • two streamlined heat dissipation rods having guide grooves are formed on the upper surfaces of the heat dissipation rods at one of the streamlined heat dissipation rods facing each other on one side of the heat dissipation rod.
  • a heat-dissipating cum wire passing rod protrudingly formed in the center of the heat dissipating body is formed in a rectangular shape, and a portion of the upper end of the heat dissipating cum wire passing rod having a rectangular cross section has a rectangular shape in the center of the bottom surface of the heat dissipating enclosure, thereby incorrectly coupling the heat dissipating enclosure.
  • the heat radiation and the wire passing rod coupling groove further formed to prevent the heat dissipation enclosure is rotated.
  • the light transmission is caught on the periphery of the radiator through hole in a state in which the radiator is inserted into the radiator through hole perforated on the module fixing plate of various lighting fixtures.
  • the screw coupling groove for fixing the diffusion plate itself with a screw or fixing the socket coupling and the ventilation support having a predetermined shape to the light transmission or the diffusion plate through the screw may be further drilled.
  • the socket coupling and the ventilation support is provided with a spiral socket coupling sphere for supplying an AC voltage to the converter for power supply, as well as screwing the LED lighting module itself into the socket like a general bulb; Is formed protruding downward from the peripheral portion of the body fixedly installed on the bottom of the spiral socket coupler at a predetermined interval, the screw passing through the screw coupled to the screw coupling groove formed in the light transmitting or diffuser plate at the bottom end Characterized in that it consists of a ventilation support which is injection-molded using a synthetic resin material so that several legs having a ball-punched form are integrally provided.
  • the more integrally molded molding fixture having a "c" shape is characterized in that the more integrally molded molding fixture having a "c" shape.
  • the elastic fastener is bent and formed by using a steel plate cut to have a predetermined width and length, the inner surface of the upper plate portion of the " ⁇ " shaped elastic fastener that is elastically hung to fit inside the fastener coupler It is formed integrally, and the plate spring portion having a form elastically in close contact with a portion of the inner surface of the module fixing plate in a form bent in a form that covers the outside of the fastener coupler outside the curved bent integrally formed,
  • the upper portion of the leaf spring portion is characterized in that for drilling a tool coupling hole for coupling the disassembly tool.
  • the elastic fastener is formed by using a steel wire having a predetermined diameter and length to form a pair of elastic fastening hooks that are elastically fastened by being fitted inside the fastener coupler at an upper side thereof, and a flat portion surrounding the upper surface of the fastener coupler at an upper portion thereof.
  • a portion of the bottom end is bent in a curved form, characterized in that it has a form integrally formed with a spring portion having a form in elastic contact with a portion of the inner surface of the module fixing plate.
  • the light angle adjusting means is formed by bending the iron plate cut to have a predetermined width and length in a "U" shape, the bottom portion is integrally provided with a coupler fixing portion to which the fastener coupler of the heat dissipating enclosure is fitted and fixed.
  • a pair of elastic connectors that are detachably coupled to the fixture coupler of the heat dissipation enclosure;
  • a steel plate cut to have a predetermined width and length is bent into a "c" shape, and a fixing piece integrally bent at both ends is inserted into a gap between the free ends of the elastic connectors to adjust the angle through the bolt and the butterfly nut.
  • the various lighting fixtures produced using the LED lighting module is characterized in that it includes a stairway light, floodlight, security light, landscape lighting, house or barn or factory lighting, living room lights, signage indirect lighting and down lights, etc. It is done.
  • a high luminance light emitting diode (LED) having high illuminance and low heat generation and low power consumption is used as a light source, and the radiator has several streamlined heat dissipation rods so that air flows easily in all directions.
  • the thermal diffusivity is approximately 1.7 times higher than aluminum
  • the specific gravity is 35% or more
  • users can easily make and use various lighting fixtures such as staircase lighting, floodlight, security lamp, landscape lighting, house or barn or factory lighting, living room lamp, signboard indirect lighting and down light.
  • the heat dissipation function of the LED lighting module itself can be greatly improved.
  • the overall volume and volume of the LED lighting module can be significantly reduced, making it possible to reduce the weight and size of the LED lighting module, and to significantly reduce the production cost of the product.
  • In manufacturing only the required number of LED lighting modules can be installed inside the reflector or case in the state of using existing props, reflector or case as it is, thereby greatly reducing and reducing the production cost and installation cost of the product. Of course, it can also prevent unnecessary waste of resources.
  • the housing in which the power supply converter is built is detachably installed on the upper surface of the heat sink without using a separate case.
  • the heat generated from the power supply converter installed inside the enclosure is smooth.
  • part of the remaining heat of the light emitting diodes remaining after being dissipated through the heat dissipation can also be dissipated through the housing, thereby making the LED lighting module itself lighter and smaller.
  • each LED lighting module may be configured using elastic fixtures.
  • Spiral sockets are combined with enclosures, light projections or diffusers when it is necessary to install a single LED lighting module in the form of a light bulb, such as a simple fixation to a fixed plate, and a stair light, landscape light, signage indirect light, and down light. It is a very useful invention that it can be used for various kinds of lighting fixtures of users that can greatly improve the compatibility of the LED lighting module itself by simply fixing and installing a sphere or socket coupling and a ventilation support. .
  • Figure 1 (a) (b) is a perspective view of the LED lighting module according to an embodiment of the present invention.
  • Figure 2 (a) (b) is a perspective view of the LED lighting module according to another embodiment of the present invention.
  • FIG. 3 is an exploded perspective view of FIG.
  • FIG. 4 is an exploded perspective view of FIG.
  • Figure 5 (a) (b) is a forward and side cross-sectional view of the LED lighting module according to another embodiment of the present invention.
  • Figure 6 (a) (b) is a planar and air flow diagram of the LED lighting module according to an embodiment of the present invention.
  • FIG. 7 and 8 are partially enlarged front views showing an example of a state in which a lighting fixture is configured by using a plurality of LED lighting modules according to another embodiment of the present invention with a built-in power supply converter and the AC power supply lines are interconnected. .
  • FIG. 9 is a partially enlarged view showing an example of a state in which a lighting fixture is configured using a plurality of LED lighting modules according to an embodiment of the present invention, and a power supply voltage is supplied using a current limiter or a color controller and a power supply converter.
  • Front view showing an example of a state in which a lighting fixture is configured using a plurality of LED lighting modules according to an embodiment of the present invention, and a power supply voltage is supplied using a current limiter or a color controller and a power supply converter.
  • Figure 10 (a) (b) is an enlarged front view showing a perspective view according to an embodiment of the elastic fixture of the present invention and the LED lighting module fixed using the same.
  • Figure 11 (a) (b) is an enlarged front view showing a perspective view according to another embodiment of the elastic fastener of the present invention and a state in which the LED lighting module is fixed using the same.
  • FIG. 12 is a perspective view of a light fixture having a spiral socket coupler directly fixed to the upper surface of the LED lighting module according to another embodiment of the present invention.
  • Figure 13 is an exploded perspective view of a lighting fixture coupled to the socket coupling and the ventilation support on the upper surface of the LED lighting module according to another embodiment of the present invention.
  • Figure 14 is an exploded perspective view of a lighting fixture coupled to the light angle control means to the LED lighting module according to another embodiment of the present invention.
  • Figure 15 is a side view showing a state of adjusting the light irradiation angle of the lighting fixture using the light angle adjusting means of the present invention.
  • Figure 16 (a) is a floodlight (e.g. factory and high ceiling fixture, etc.) and a square floodlight (e.g. playground or golf course, port having a circular reflector manufactured using the LED lighting modules of the present invention) And a bottom view illustrating stage lighting).
  • a floodlight e.g. factory and high ceiling fixture, etc.
  • a square floodlight e.g. playground or golf course, port having a circular reflector manufactured using the LED lighting modules of the present invention
  • Figure 1 (a) (b) is a perspective view of the LED lighting module according to an embodiment of the present invention.
  • Figure 2 (a) (b) is a perspective view of the LED lighting module according to another embodiment of the present invention.
  • FIG. 3 is an exploded perspective view of FIG.
  • FIG. 4 is an exploded perspective view of FIG.
  • Figure 5 (a) (b) is a forward and side cross-sectional view of the LED lighting module according to another embodiment of the present invention.
  • Figure 6 (a) (b) is a planar and air flow diagram of the LED lighting module according to an embodiment of the present invention.
  • FIG. 7 and 8 are partially enlarged front views showing an example of a state in which a lighting fixture is configured by using a plurality of LED lighting modules according to another embodiment of the present invention with a built-in power supply converter and the AC power supply lines are interconnected. .
  • FIG. 9 is a partially enlarged view showing an example of a state in which a lighting fixture is configured using a plurality of LED lighting modules according to an embodiment of the present invention, and a power supply voltage is supplied using a current limiter or a color controller and a power supply converter.
  • Front view showing an example of a state in which a lighting fixture is configured using a plurality of LED lighting modules according to an embodiment of the present invention, and a power supply voltage is supplied using a current limiter or a color controller and a power supply converter.
  • Figure 10 (a) (b) is an enlarged front view showing a perspective view according to an embodiment of the elastic fixture of the present invention and the LED lighting module fixed using the same.
  • Figure 11 (a) (b) is an enlarged front view showing a perspective view according to another embodiment of the elastic fastener of the present invention and a state in which the LED lighting module is fixed using the same.
  • FIG. 12 is a perspective view of a light fixture having a spiral socket coupler directly fixed to the upper surface of the LED lighting module according to another embodiment of the present invention.
  • Figure 13 is an exploded perspective view of a lighting fixture coupled to the socket coupling and the ventilation support on the upper surface of the LED lighting module according to another embodiment of the present invention.
  • Figure 14 is an exploded perspective view of a lighting fixture coupled to the light angle control means to the LED lighting module according to another embodiment of the present invention.
  • Figure 15 is a side view showing a state of adjusting the light irradiation angle of the lighting fixture using the light angle adjusting means of the present invention.
  • Figure 16 (a) is a floodlight (e.g. factory and high ceiling fixture, etc.) and a square floodlight (e.g. playground or golf course, port having a circular reflector manufactured using the LED lighting modules of the present invention) And a bottom view illustrating stage lighting).
  • a floodlight e.g. factory and high ceiling fixture, etc.
  • a square floodlight e.g. playground or golf course, port having a circular reflector manufactured using the LED lighting modules of the present invention
  • Light transmitting or diffusing plate 1a LED substrate receiving groove
  • LED substrate 2a LED
  • heat sink 3a streamline heat sink
  • fastener coupler 61 lid body
  • 61a side plate 61b: substrate guide groove
  • module fixing plate 8a heat sink through hole
  • an embodiment of the present invention performs a lamp function alone, or a module having a predetermined area LED boards in which several LEDs are fixed and fixed on the fixing plate 8 to be used to construct various lighting fixtures having desired outputs.
  • the main technical components include a heat sink (3), a waterproof ring (4) and a current limiter or a color controller and a power supply converter (5a) formed by die casting of a light metal series alloy. .
  • FIG. 2 (a) (b) to 5 (a) (b) of Figure 2, and Figures 7 and 8 alone or performs a predetermined light function
  • the LED lighting module which is fixedly installed on the module fixing plate 8 having an area and used to form various lighting fixtures having a desired output, is soldered with a light transmitting or diffuser plate 1 and several LEDs at a predetermined interval.
  • the light transmitting or diffusing plate 1 which is commonly used in the above two embodiments is injection molded into a transparent or translucent so as to have a square or disc shape, and the LED substrate is accommodated on the rear surface of the light transmitting or diffusing plate 1.
  • the groove 1a and the waterproof ring insertion groove 1b By forming the groove 1a and the waterproof ring insertion groove 1b, the light generated from the LEDs 2a may be transmitted or diffused, and various foreign substances and rainwater flowing in from the outside may be blocked.
  • the LED substrate 2 is configured to have a shape in which several LEDs 2a are soldered and fixed at predetermined intervals in response to a desired illuminance amount, and the LED substrate 2 is formed of the light transmitting or diffusing plate ( 1)
  • the current limiter or color controller and power supply converter 5a installed in the LED substrate accommodating groove 1a formed on the rear surface of the apparatus and the power supply mounted in the heat dissipation enclosure 6 are separately installed. When the power supply voltage is supplied from the converter 5b, it performs a function of generating light for illumination.
  • the heat sink 3 is formed by die-casting a light metal series alloy having a light characteristic of about 1.7 times higher than aluminum and having a specific gravity of more than 35% and a lightness, unlike the prior art, mostly formed of aluminum, the upper surface Several streamlined heat dissipating rods 3a protrude integrally at predetermined intervals and angles such that air flows in all directions as shown in FIGS. 1A, 2B, and 6A, 6B. It has a molded configuration and is detachably fixed in a form in which the bottom surface is in close contact with the back of the light transmitting or diffusing plate 1 on the rear surface of the LED substrate 2 to dissipate heat generated from the LED 2a. Will be performed.
  • the light metal alloy of the heat dissipating element 3 has a heat diffusion coefficient of 0.84 [cm 2 / sec], a thermal conductivity of 220-240 [W / mK], and a density of 2.7 [g / cm 3].
  • the heat sink 3 when the heat sink 3 is formed of a magnesium alloy or a light metal series alloy including beryllium and titanium, duralumin, and a carbon-aluminum composite material, in particular, a magnesium alloy is formed, the density and specific heat of the heat sink 3 are respectively increased. 1.8 ⁇ 0.3 [g / cm 3] and 1.02-1.05 [J / gK], so the density and specific heat are smaller than those of aluminum having 2.7 [g / cm 3] and 0.9 [J / gK], respectively, and the thermal diffusion coefficient is 0.84.
  • the heat sink 3 is formed from a magnesium alloy, which is one of the light metal series alloys, the heat dissipation performance of the hot electrons is higher than that of the heat sink formed of aluminum. It can be.
  • the thermal conductivity a factor that affects heat dissipation performance, is 60-90 [W / mK] lower than that of pure aluminum with 220-240 [W / mK] and aluminum alloy with 100-160 [W / mK].
  • the structure of the heat dissipation structure of the heat radiator molded with the characteristic magnesium has the cross-sectional area of the heat conduction part of the heat dissipation action based on aluminum and aluminum alloys, which is not in the form of a thin plate or a fine fin, as in the case of aluminum or aluminum alloy. It is highly preferable to design the column shape wider than about 1.5 to 2.5, and in the present invention, the actual technical contents thereof are shown in the drawings by the shapes (3a and 3d).
  • the heat sink 3 when heat-casting the heat sink 3 into a magnesium alloy, such as a light metal alloy, the heat sink 3 as shown in FIGS. 1B and 2B as necessary. Since the heat dissipation surface area of the heat dissipating body 3 can be increased by further protruding several heat dissipating protrusions 3b on the outer circumferential surface of the streamlined heat dissipating rods 3a protrudingly formed on the upper surface of the heat dissipating body 3a, The volume of the sieve 3 itself can be reduced, which is more advantageous for miniaturization of the LED lighting module.
  • the waterproof ring 4 commonly used in the two embodiments of the present invention is formed of rubber or silicon, and is formed in the waterproof ring insertion groove 1b formed on the rear surface of the light transmitting or diffusing plate 1. In the installed state to maintain the air tightness of the gap formed between the back of the light transmitting or diffuser plate 1 and the heat sink 3 to prevent the inflow of moisture, including moisture from the outside, and various foreign matters It will perform the function.
  • the LED lighting module itself is formed of only the light transmitting or diffusing plate 1 and the LED substrate 2, the heat sink 3 and the waterproof ring 4, and the LED substrate 2 Power and current control required for driving the LED 2a installed in the 1) may be controlled by a current limiter or a color controller and a power supply converter 5a separately manufactured from the LED lighting module. .
  • the current limiter or the color controller and the power supply converter 5a limit the current flowing through the LED 2a installed in the LED substrate 2 or control the color, as well as to drive the LED 2a. It performs the function of supplying the necessary power voltage.
  • Such a current limiter or a color controller and a power supply converter 5a may be applied to a lighting fixture such as a staircase lighting or a signage indirect lighting and a downlight where the LED lighting module itself is used as a single lighting fixture, as shown in FIG. 9. It is more preferable to apply to lighting fixtures such as floodlights, security lamps, landscape lighting, house or barn or factory lightings, in which a plurality of LED lighting modules are integrally installed.
  • (6) is formed by injection molding of a conductive / polymer heat-dissipating resin material to have a rectangular housing shape provided with a lid 61 and detachably fixed to the upper surface of the heat dissipator 3 through a screw (9) And heats some residual heat of the LED 2a transmitted through the heat sink 3, including heat generated by the power supply converter 5b stored therein.
  • the power supply converter 5b provided in the LED lighting module itself supplies a power supply voltage for driving the LED 2a installed in the LED substrate 2 in the state of being housed in the heat dissipation enclosure 6. Will be performed.
  • a conductive / polymer heat dissipating resin material containing carbon nanotubes (CNT) was used, and the density of the carbon nanotubes (CNT) was used.
  • specific heat have 1.4 ⁇ 0.2 [g / cm3] and 1.1 ⁇ 0.4 [J / gK], respectively, so that density and specific heat are smaller than aluminum having 2.7 [g / cm3] and 0.9 [J / gK], respectively.
  • the diffusion coefficient is 0.75-0.8 [cm 2 / sec], unlike the aluminum having 0.84 [cm 2 / sec], and thus the air emission performance of the hot electrons is increased even with a smaller surface area and volume than the heat-dissipating enclosure 6 formed of aluminum.
  • the heat dissipation action portion is provided by the conductive / polymeric heat dissipation resin material containing carbon nanotubes (CNT), it is possible to contribute to weight reduction and miniaturization and cost reduction in processing and manufacturing than those provided by aluminum plate or steel plate.
  • the heat-dissipating enclosure 6 when the heat-dissipating enclosure 6 is injection molded into a conductive / polymer heat-dissipating resin material containing carbon nanotubes (CNT), the heat dissipation type as shown in Figs.
  • CNT carbon nanotubes
  • the heat dissipation surface area of the heat dissipation enclosure 6 can be further increased under the same heat dissipation conditions. Since the volume of the heat dissipation enclosure 6 itself can be reduced, miniaturization and light weight of the LED lighting module can be expected more.
  • thermal diffusion coefficient and material average properties such as thermal conductivity, density, melting temperature and specific heat for the conductive / polymer heat-dissipating resin containing magnesium alloy and carbon nanotube (CNT) compared to the aluminum and aluminum alloy Is as follows.
  • thermal conductivity refers to a phenomenon in which heat is transferred from a high temperature portion to a low temperature portion which is in contact with it without accompanying a movement of a substance
  • a heat transfer rate of an inside of an object by heat conduction is a temperature gradient (unit length) within the material.
  • Sugar temperature difference but there is a big difference depending on the type of material.
  • Al alloy and “aluminum alloy” are very familiar heat dissipating materials, so the introduction is omitted.
  • aluminum alloy has the advantage of being able to be processed in various forms compared to pure aluminum, while the specific heat [J / gK] is very large.
  • the disadvantage is that diffusion (releasing heat into the atmosphere) is low, i.e., volume, volume and weight increase.
  • Carbon-Aluminum Composite is developed by American screw and Japan's AM Technology Co., Ltd., and is a composite material made by dissolving aluminum into carbon (carbon) mass. Although it is only used for high-end products, it is also expected that the price of the company will be greatly reduced as POSCO, Taiwan, and China's minority companies are in the stage of commercialization and commercialization.
  • the value varies slightly depending on the temperature, and may be regarded as a material constant having a nearly fixed value according to the type of material.
  • the thermal conduction in the metal occurs because free electrons carry heat from the high temperature portion to the low temperature portion in the form of kinetic energy, which causes a high thermal conductivity of the metal and a correlation between the thermal conductivity and the electrical conductivity. It is known that the higher the temperature, the lower the thermal conductivity is because the movement of free electrons is disturbed by the thermal vibration of the crystal lattice.
  • dielectrics insulators
  • the vibration of atoms and molecules generated in a part of them by heat has a kind of wave characteristic, which is reflected from the surface to create standing waves, and the energy of the standing waves is uniformly internal energy. Height transfers heat by the principle of action.
  • the heat dissipation structure design of the heat dissipation element 3, which is a structure that performs heat dissipation, is adopted to adopt a magnesium alloy having a relatively low thermal conductivity, a somewhat high thermal diffusivity, and the like, in order to achieve the purpose of weight reduction and miniaturization. Therefore, in order to increase the thermal conductivity, the cross-sectional area of the heat transfer path is increased by 40 to 60 [%] compared to that of the aluminum alloy, and since the thermal diffusivity is good, the surface area is reduced to about 30 to 50 [%] compared to the aluminum heat dissipation structure.
  • both sides of the bottom surface of the lid body 61 of the heat dissipation enclosure 6 are provided with substrate guide grooves 61b for engaging both sides of the power supply converter 5b so that the heat dissipation enclosure 6 is provided.
  • the power supply converter 5b itself is stably fixed to the inside of the heat dissipation enclosure 6.
  • the components of the power supply converter 5b housed in the heat dissipation enclosure 6 in the state of being fixedly installed on the lid 61 have a form installed on the front side of the substrate, and thus the front part of the substrate and the heat dissipation enclosure.
  • a sufficient space portion is formed between the inner wall of (6), but the space portion between the soldering portion, which is the rear side of the substrate, and the inner wall of the heat dissipating enclosure 6, is narrowly formed so that the soldered portion and the heat dissipating enclosure 6 may be electrically contacted and electrically shorted.
  • there is a fear that heat dissipation to the soldered portion may not be smooth.
  • an insulating shielding film 61c is further formed on the rear surface of both side plates 61a protruding from the lid 61 of the heat dissipation-type enclosure 6 to provide insulation between the soldered portion and the heat dissipation-containing enclosure 6. That is, it was possible to completely block the occurrence of a short circuit between the soldered portion of the power supply converter (5b) and the heat dissipation enclosure (6).
  • the guide groove (3c) is formed on the upper surface of the two streamlined heat-dissipating rod (3b) in a position opposite to each other on one side centerline of the streamlined heat-dissipating rod (3b) of the heat dissipator (3),
  • the guide rod 6b which is fitted to the guide groove 3c of the streamlined heat dissipation rod 3b, was installed to protrude on both sides.
  • the guide rod of the heat dissipation enclosure 6 is guided to the guide groove 3c of the streamlined heat dissipation rod 3b. Since the 6b is inserted and caught, the misalignment of the heat dissipation enclosure 6 can be prevented and the rotation of the heat dissipation enclosure 6 can be completely prevented when the heat dissipation enclosure 6 is fixed. It will be easier and more complete.
  • a heat dissipation cum wire passing rod 3d itself protrudingly formed in the center of the heat dissipation body 3 is formed in a rectangular shape, and a heat dissipation cum wire passing through the bottom surface of the heat dissipation enclosure 6 is provided.
  • the heat dissipation and electric wire having a flat cross section having a rectangular shape when a rod coupling groove 6c is formed and the heat dissipation enclosure 6 is placed on the top surface of the heat dissipation body 3 and fixedly installed using a screw 9.
  • Part of the upper end of the passing rod (3d) is inserted into the heat dissipation and wire through-rod coupling groove (6c) of the heat dissipation enclosure (6), thereby preventing the misalignment of the heat dissipation enclosure (6) as well as fixing the heat dissipation enclosure (6). It is completely prevented from being rotated on the upper surface of the heat dissipation body 3, so that the assembly of the heat dissipation enclosure 6 can be made more simply and completely.
  • the LED lighting module itself when the LED lighting module itself is to be used as a lighting fixture that can be screwed into the socket, such as a general bulb, a general bulb as shown in Figure 12 in the center of the upper surface of the lid body 61 of the heat dissipation enclosure (6) It is installed in the heat dissipating enclosure (6) through the spiral socket coupler (11) by fixedly installing the same spiral socket coupler (11) installed at the same time using an adhesive having both insulating and adhesive functions. Not only can supply AC voltage to power supply converter 5b smoothly, but also the LED lighting module itself is screwed into the socket like a general bulb, so that it is a staircase lamp, indirect lamp, and down light widely used as a single light fixture. Can be used as a light fixture for lighting fixtures.
  • the screw coupling grooves 1c are drilled at the edges of the light transmitting or diffusing plate 1 at predetermined intervals or at each corner thereof.
  • the LED lighting module itself is attached to the module fixing plate 8 of various lighting fixtures (for example, a floodlight, a security lamp, a landscape lighting lamp, a house, a barn, or a factory lighting lamp) in which a plurality of LED lighting modules are integrally installed.
  • various lighting fixtures for example, a floodlight, a security lamp, a landscape lighting lamp, a house, a barn, or a factory lighting lamp
  • the radiator 3 is inserted into the perforated radiator through hole 8a
  • the light transmitting or diffusing plate 1 itself caught on the periphery of the radiator through hole 8a as shown in FIGS. 9
  • the light transmission or diffusion to fix the socket coupling and the ventilation support 12 having a predetermined shape as shown in FIG. 13 to the light transmission or diffuser plate 1 through the screw (9)
  • screw coupling grooves 1c were further drilled at predetermined intervals or at each corner.
  • the socket coupling and the ventilation support 12 is composed of a ventilation support 12b injection-molded using a spiral socket coupling tool 12a and a synthetic resin material, as shown in FIG. 12a) supplies an AC voltage to the converter 5b for power supply as well as performs a function of screwing the LED lighting module itself into a socket like a general electric bulb, and the ventilation support 12b is a spiral socket coupler.
  • the ventilation support 12b is a spiral socket coupler.
  • the body 12b-1 which is fixedly installed on the bottom of 12a, several legs 12b-2 are formed to protrude downwardly at predetermined intervals, and the lower ends of the legs 12b-2 are formed.
  • the screw through hole (12b-3) through which the screw (9) coupled to the screw coupling groove (1c) formed in the light transmitting or diffusing plate (1) is passed through.
  • the socket coupling and the ventilation support 12 itself does not interfere at all with the heat dissipation function of the heat dissipating body 3 and the heat dissipating enclosure 6 (that is, the state does not interfere with the flow of air at all). Since the lighting module itself can be screwed into the socket like a general electric bulb, the LED lighting module itself equipped with the socket coupling and the ventilation support 12 is used as a single lighting device such as a stair lamp, a signboard indirect light, and a down light. It can be used as a light fixture.
  • the present invention by integrally further protruding molding fixture fastener (6d) having a flat surface in the bottom surface of both sides of the heat dissipation-type enclosure (6) "c" shape, several LED lighting module module fixing plate (8)
  • high-power lighting fixtures such as floodlights, security lamps, landscape lighting lamps, house or barn or factory lighting lamps
  • they have a predetermined shape as shown in FIGS. 10 (a) and 11 (a).
  • the elastic fastener 13 is coupled to the fastener coupler 6d so as to be integrally fixed to the module fixing plate 8 itself so as to integrally fix the LED lighting modules, or the light of the LED lighting module itself as shown in FIGS. 14 and 15.
  • the light angle adjusting means 14 can be coupled to adjust the irradiation angle.
  • the elastic fastener 13 is an elastic fixing piece 13a, a flat plate portion 13b, and a leaf spring portion having a " ⁇ " shape using an iron plate cut to have a predetermined width and length as shown in FIG.
  • the pair of elastic locking rings 13e and the flat portion 13f may be formed to have a form in which the 13c is integrally formed, and using a steel wire having a predetermined diameter and length as shown in FIG.
  • the pair of spacers 13g and the spring portion 13h may be molded to be integrally provided.
  • the elastic fastener 13 bent and formed using an iron plate cut to have a predetermined width and length has an inner side of the fastener about the upper plate portion 13b.
  • An elastic fixing piece 13a which is fitted inside the coupling member 6d and is elastically hung, is shaped into a " ⁇ " shape, and the outer side of the flat plate 13b passes in the form of covering the outer side of the fixing member coupling tool 6d.
  • the leaf spring portion 13c having a form elastically in close contact with a portion of the inner surface of the module fixing plate 8 is integrally formed.
  • the upper portion of the leaf spring portion 13c has a form in which a tool coupling hole 13d for forcibly disassembling by forcibly disassembling by coupling the disassembly tool is necessary.
  • the LED lighting modules are combined so that the heat sink 3 is fitted into the heat sink through hole 8a which is perforated in the module fixing plate 8, and then the When the " ⁇ " type elastic fixing piece 13a of the elastic fixture 13 having a leaf spring shape is fitted into the inside of the fixture coupling member 6d formed on both sides, the elastic fixing piece having a " ⁇ " shape.
  • the latching projection of 13a is elastically hung on both sides of the bottom of the fastener coupler 6d, and at the same time, the leaf spring portion 13c bent to the outside of the flat portion 13b of the elastic fastener 13 is LED light module because it has a form that covers the outside of the fastener coupler (6d) and the lower end portion is bent in a curved shape to a part of the inner surface of the module fixing plate 8 as shown in Figure 10 (b) Secured to the module mounting plate (8) Doemeun remains can of course be carried out the operation for fixing the LED lighting module in the module fixing plate 8 is very simple.
  • the elastic fastener 13 bent and formed using a steel wire having a predetermined diameter and length, as shown in FIG.
  • a pair of elastic locking rings 13e are formed to be fitted and elastically hooked, and a flat portion 13f surrounding the upper surface portion of the fastener coupler 6d is formed at an upper portion thereof, and a lower portion is formed outside the flat portion 13f.
  • a pair of gap holding portions 13g are formed to be bent so that the gap between the elastic catching rings 13e is maintained at a constant interval, and the fastener coupler 6d is formed at the bottom of the gap holding portions 13g.
  • a spring portion 13h having a form in which the lower end portion is bent in a curved manner through the outside and elastically contacted to a portion of the inner surface of the module fixing plate 8 is integrally bent.
  • the pair of elastic catching rings 13e is fixed to the fastener coupler of the heat dissipating enclosure 6.
  • a pair of elastic locking rings 13e are elastically fastened and fixed to the bottom surface of the fastener coupler 6d, respectively, and the outer side of the flat portion 13f of the elastic fastener 13 is fixed.
  • the pair of gap retaining portions 13g and the spring portion 13h which are bent to have a form covering the outside of the fastener coupler 6d and the remaining portion of the spring portion 13h are bent in a curved manner As shown in (b) of FIG. 11, the part of the inner surface of the module fixing plate 8 is elastically in close contact with each other, and thus, the LED lighting modules maintain a perfect fixing state to the module fixing plate 8 as well as the LED lighting modules. 8) small to fixed I can perform up very easily.
  • the light angle adjusting means 14 has a form consisting of a pair of elastic connector 14a, a support 14c and a fixed plate 14d as shown in Figure 14, wherein the pair of elastic type
  • the connector 14a is formed by bending the iron plate cut to have a predetermined width and length into a “U” shape, and the fitting fixture 14b to which the fixture fitting 6d of the heat dissipating enclosure 6 is fitted and fixed at the bottom thereof.
  • the support 14c has a form in which the iron plate cut to have a predetermined width and length is formed in a "c" shape, and the fixing piece 14c-1 integrally bent at both ends is the elastic connector. It is inserted into the gap between the free end of the (14a) has a form that is angularly coupled through the bolt 14e and the butterfly nut 14f, the fixing plate 14d is detachably fixed to the center of the support 14c Including the LED lighting module has a function of detachably fixing the light angle adjusting means 14 itself to a fixture such as a wall.
  • the light angle adjusting means 14 loosens the butterfly nut 14f installed at the connection portion of the pair of elastic connector 14a and the support 14c, and then hinges the LED lighting module itself with the bolt 14e.
  • Figure 16 (a) illustrates a bottom view of a state of manufacturing a factory and high ceiling fixtures, such as a floodlight having a circular reflector using the LED lighting modules of the present invention
  • Figure 5 illustrates a bottom view of a state of manufacturing a playground or golf course, a port, and a stage lighting, such as a square floodlight using the LED lighting modules of the present invention.

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  • General Engineering & Computer Science (AREA)
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to a light-emitting diode (LED) lamp module, and more particularly, to an LED lamp module which can perform a lamp function singly or can be fixed in plurality onto a module fixing plate having a predetermined area so as to form various lamp devices having desired outputs. The LED lamp module consists of: a light transmitting or diffusing plate; an LED substrate; a diecast heatsink made of a light metal-based alloy; a water-resistant ring; a current limiter or a color controller; and a power supply converter. Alternatively, the LED lamp module consists of: the light transmitting or diffusing plate; the LED substrate; the diecast heatsink made of the light metal-based alloy; the water-resistant ring; a heatsink container formed by injection molding a conductive polymer heat-dissipating resin material; and a power supply converter. Thus, various lamp devices can be easily manufactured and used, the heat-dissipating function of the LED lamp module itself can be significantly improved, the overall bulk and volume of each LED lamp module can be significantly reduced to enable weight and size reduction and significantly reduce manufacturing costs, manufacturing and installation costs can be significantly reduced, unnecessary waste of resources can be prevented, heat generated in the power supply converter installed within the container can be smoothly dissipated, a portion of the residual heat remaining in the LEDs after the heat dissipation of the heatsink can be dissipated through the container to further make the LED lamp module itself lighter and smaller, and the compatibility of the LED lamp module itself can be significantly improved to enable the LED lamp module to be suitable for use in various lamp devices of users which require various specifications.

Description

발광다이오드 조명 모듈LED Lighting Module
본 발명은 발광다이오드 조명 모듈에 관한 것으로 더욱 상세하게는 발열량이 적고 전력소모가 적은 발광다이오드(LED)를 광원으로 사용하여 작은 LED 조명 모듈을 형성하고, 이들을 이용하여 각종 조명등 기구(예를 들어 계단 조명등, 투광등, 보안등, 경관조명등, 하우스나 축사 또는 공장용 조명등, 거실등, 간판 간접 조명등 및 다운 라이트 등)를 손쉽게 제작하여 사용할 수 있도록 하고, 방열체는 열 확산도가 알루미늄보다 대략 1.7배 높은 특성을 갖는 경금속계열 합금인 마그네슘(Mg) 합금을 이용하여 성형하되, 다이케스팅을 통해 방열체의 방열봉들을 사방으로 공기의 흐름이 이루어질 수 있도록 박막 형태가 아닌 유선형 기둥 형태로 성형하고, 또한 발광다이오드에 전원을 공급시켜 주는 컨버터 수납되는 함체는 전도성/고분자 방열 수지재로 사출 성형하여 방열체의 상면에 착탈 가능하게 고정 설치하는 방식을 통해 조명등 기구 자체의 방열기능을 대폭 향상시킬 수 있을 뿐만 아니라, 조명등 기구 자체를 경량화 및 소형화시킬 수 있도록 발명한 다목적용 LED 조명 모듈에 관한 것이다.The present invention relates to a light emitting diode lighting module, and more particularly, to form a small LED lighting module using a light emitting diode (LED) having a low heat generation and low power consumption as a light source, and using them, various lighting fixtures (for example, stairs). Lighting, floodlight, security light, landscape lighting, house or barn or factory lighting, living room lighting, signage indirect lighting and downlight etc.) can be easily manufactured and used. Molded using a magnesium (Mg) alloy, a light metal series alloy having high properties, but is formed in a streamlined column shape rather than a thin film form so that air can flow in all directions through die casting. The converter housing enclosure, which supplies power to the diode, is injected with conductive / polymer heat-resistant resin. The multi-purpose LED lighting module invented to be able to significantly improve the heat dissipation function of the lighting fixtures itself by attaching and detachably fixed to the upper surface of the heat sink, and to reduce the weight and size of the lighting fixtures itself. will be.
일반적으로 종래의 보안등 또는 가로등 등은 주로 수은등이나 나트륨등을 광원으로 사용하여 조명을 하게 함으로써 밝기에 비하여 에너지 소비가 크다는 문제점과 수명이 짧아 시간경과에 따라 광량이 급격하게 저하되어 주기적인 관리가 필요하게 되었다.In general, a conventional security lamp or street lamp is mainly used by mercury lamp or sodium lamp as a light source to illuminate so that the energy consumption is high compared to the brightness and the life is short. It became necessary.
특히 위에 열거한 등은 수은가스를 이용하고 있으므로 폐기시 환경오염의 원인으로 작용하는 문제점을 갖고 있었다.In particular, since the mercury gas is used, the above-mentioned materials have a problem of causing environmental pollution during disposal.
따라서, 최근에는 전력소모가 적고 수명이 긴 발광다이오드(LED)를 광원으로 사용하는 조명등이 개발 출시되고 있다.Therefore, recently, a light lamp using a light emitting diode (LED) with low power consumption and long lifespan has been developed and released.
이때, 상기 발광다이오드(LED : Light Emitting Diode)는 빠른 응답속도, 저 전력 소모, 긴 수명 등의 장점을 가진 반도체의 P-N 접합 구조를 이용하여 주입된 소수캐리어(전자 또는 양공)를 만들어내고 이들의 재결합에 의해 발광시키는 것을 이용한 것으로, 종래의 조명용 백열전구보다 소비전력이 1/10 정도 소요되어 전기에너지를 크게 절감할 수 있는 장점을 가지고 있다.At this time, the light emitting diode (LED) generates a small number of carriers (electrons or holes) injected using a PN junction structure of a semiconductor having advantages such as fast response speed, low power consumption, and long life. It is used to emit light by recombination, and consumes about 1/10 of the power consumption of the conventional incandescent light bulb, which has the advantage of greatly reducing the electric energy.
특히, 교통신호등이나 보안등 또는 가로등, 투광등, 경관조명등 및 하우스나 축사용 조명등 등과 같이 전력이 많이 소요되는 부분에 있어서는, 이들 조명등기구에 많이 사용되는 나트륨등이나 수은등을 발광다이오드로 교체하게 되면 소비전력 절감효과는 매우 크다.In particular, in areas where high power is required, such as traffic lights, security lights, street lamps, floodlights, landscape lights, and house or livestock lamps, when sodium or mercury lamps, which are frequently used in these lighting fixtures, are replaced with light emitting diodes, The power savings effect is very large.
그런데 종래의 발광다이오드를 이용한 조명등기구는 방열문제를 해결하는데 어려움이 있어 주로 저휘도 발광다이오드를 이용하고 있었다. 다시 말해 고휘도 발광다이오드를 이용할 경우 상당한 열이 발생하게 되는바, 방영 작용 기능이 부실하면 이 열에 의해 주변장치의 손상을 초래하게 되며, 발광다이오드 수명도 급속히 짧아지게 되어, 실질적인 조명장치로써 열활을 할 수 없는 문제를 갖고 있다.By the way, the conventional lighting device using a light emitting diode has a difficulty in solving the heat dissipation problem, mainly using a low brightness light emitting diode. In other words, when a high brightness LED is used, a considerable amount of heat is generated. If the airing function is poor, this heat causes damage to the peripheral device, and the life of the LED is also shortened rapidly. I can't have a problem.
이와 같이 발광다이오드를 이용한 조명등기구, 예를 들어, 발광다이오드형 보안등 또는 가로등기구는 일반 형광등의 보안등 또는 가로등과는 달리 점등회로가 단순하고, 인버터 회로와 철심형 안정기가 불필요하며, 전력 소모가 적고 수명이 길기 때문에 유지나 보수비용이 적은 장점이 있다.As described above, a light emitting device using a light emitting diode, for example, a light emitting diode type security lamp or a street lamp, has a simple lighting circuit, unlike an ordinary fluorescent lamp or a street lamp, and does not require an inverter circuit and an iron ballast, and consumes power. Its low cost and long lifespan have the advantage of low maintenance and repair costs.
그러나, 이와 같은 발광다이오드형 보안등이나 가로등, 투광등, 경관조명등 및 하우스나 축사용 조명등, 간판 간접 조명등 및 다운 라이트 기구의 단점으로는 열적 스트레스로 인한 특성 열화 및 고장이 발생한다는 측면이다.However, disadvantages of such light emitting diode type security lamps, street lamps, floodlights, landscape lightings, house or livestock lightings, signage indirect lightings, and downlights are aspects of deterioration and failure due to thermal stress.
이는 발광다이오드를 동작시키기 위해 다수의 발광다이오드에 흐르는 전류가 높을수록 발생하는 열이 많아지기 때문에 고장 및 특성 열화가 발생하게 된다.The higher the current flowing through the plurality of light emitting diodes in order to operate the light emitting diodes, the more heat is generated, which leads to failure and deterioration of characteristics.
예를 들어, 발광다이오드 보안등 또는 가로등이나 투광등, 경관조명등 또는 하우스나 축사용 조명등, 간판 간접 조명등, 다운 라이트 및 거실등 등의 제어 보드(PCB : printed circuit board)는 PCB 상에 다수 LED의 점멸을 제어하는 제어 회로 및 각 LED에 외부로부터 공급되는 전원이 공급되도록 하는 전원 회로 등이 구현되며, 제어 보드는 다수의 LED에서 발생되는 열에 의한 열적 스트레스로 인해 오동작 또는 고장을 일으킨다.For example, a printed circuit board (PCB) such as a light emitting diode security light or a street lamp or floodlight, a landscape lighting, or a house or livestock lamp, a signboard indirect light, a down light, or a living room light may have a plurality of LEDs on a PCB. A control circuit for controlling the blinking and a power circuit for supplying power from the outside to each LED are implemented, and the control board causes malfunction or failure due to thermal stress caused by heat generated in the plurality of LEDs.
그래서 종래의 발광다이오드형 보안등 또는 가로등, 투광등, 경관조명등 및 하우스나 축사용 조명등, 간판 간접 조명등 및 다운 라이트 등에서는 열전도성이 우수한 금속 물질을 이용한 히트 싱크(heat sink) 또는 슬러그와 같은 방열판을 장착하여 LED의 발광에 의한 열적 스트레스를 해소하고자 하고 있는 경우가 많으나, 이는 방열판을 구성하는 금속 물질의 한계성으로 인해 요구되는 방열 효율을 만족시키기 위해서는 방열판의 두께 및 부피가 커지게 되므로, 각각의 조명등기구의 크기와 무게는 증가하게 된다.Therefore, in the conventional light emitting diode-type security light or street light, floodlight, landscape lighting, house or livestock lighting, signboard indirect lighting and down light, heat sinks such as heat sinks or slugs using metal materials having excellent thermal conductivity In many cases, the thermal stress caused by the light emission of the LED is to be eliminated, but the thickness and volume of the heat sink are increased to satisfy the heat dissipation efficiency required due to the limitations of the metal materials constituting the heat sink. The size and weight of the luminaire will increase.
뿐만 아니라, 종래 발광다이오드 조명 모듈 또는 가로등기구의 경우 그 특성상 밀폐를 유지시켜야만 외부로부터 습기의 유입을 차단할 수 있어 효율적인 방열을 위한 냉각장치의 설치가 곤란하며, 그렇다고 냉각장치를 설치하게 되면 보안등 또는 가로등, 투광등, 경관조명등 및 하우스나 축사용 조명등의 내부로 외부에서 물이나 습기를 포함하여 각종 이물질이 유입될 우려가 있다.In addition, in the case of a conventional light emitting diode lighting module or street light fixture, it is difficult to install a cooling device for efficient heat dissipation because it can block moisture from the outside only when it is kept closed due to its characteristics. Various foreign matters, including water and moisture, may enter from the outside of street lamps, floodlights, landscape lightings, and house or livestock lighting.
한편, 발광다이오드 조명 모듈에서 사용되고 있는 방열체를 알루미늄으로 다이케스팅 성형할 경우 그 두께와 부피 및 체적이 두껍고 커서 제품의 생산원가가 상승하게 될 뿐만 아니라 경량화가 불가능한 문제점이 있다.On the other hand, when die-casting the heat sink used in the light emitting diode lighting module with aluminum, its thickness, volume, and volume are so thick that the production cost of the product is increased, and there is a problem that it is impossible to reduce the weight.
뿐만 아니라, 종래 방전등형 보안등 및 투광등 등을 발광다이오드형 보안등 및 투광등 등으로 교체하고자 할 경우, 방전등형 보안등 및 투광등 등의 본체 내에 발광다이오드형 보안등 및 투광등에서 필요로 하는 방열기구를 내장시킬만한 공간이 부족하여 그대로 사용할 수 없으므로 이를 버리게 되어 불필요한 자원 낭비를 가져오는 문제점도 있다.In addition, in the case of replacing the conventional discharge lamp security lamp and floodlight with a light emitting diode type security lamp and floodlight, etc., the light emitting diode type security light and floodlight etc. Since there is not enough space to embed the heat dissipation mechanism can not be used as it is, there is also a problem that wastes unnecessary resources.
또한, 종래 방열 구조 중 알루미늄 압출 또는 다이케스팅 구조는 열전도는 어느 정도 우수 하지만, 밀폐된 곳에서는 열 방산 성능이 급격히 떨어진다.In addition, although the aluminum extrusion or die-casting structure of the conventional heat dissipation structure is somewhat superior in thermal conductivity, heat dissipation performance is drastically deteriorated in a sealed place.
그러한 이유로, 근래에 노트북이나 PC에는 거의 채용되지 않는 방열 구조인데도 불구하고, LED 조명의 대부분 방열 구성은 알루미늄 다이케스팅 또는 압출로 구성하고 있으나 전체적인 부피가 커지고, 무게가 증가되는 문제점을 갖고 있다.For this reason, despite the heat dissipation structure that is rarely employed in notebooks and PCs in recent years, most heat dissipation configurations of LED lighting are composed of aluminum die casting or extrusion, but the overall volume is increased and the weight is increased.
또, 종래 히트 스프레더(일명 무동력 히트 펌프) 원리의 방열장치는 성능은 우수 하지만 한정된 수명과 고가이며 부피가 큰데도 불구하고, 근래에 노트북 등의 고가 제품 및 일부의 LED 조명에 적용되어 지고 있으나 조명등 기구의 경우 가격이 너무 비싸지게 되는 문제점이 있다.In addition, the heat spreader of the conventional heat spreader (aka non-powered heat pump) principle is excellent in performance but limited in life, expensive and bulky, but in recent years it has been applied to expensive products such as notebooks and some LED lights, but In the case of appliances, the price becomes too expensive.
또한, 종래 알루미늄 박막 판재를 프레스 가공 후 적층하여 판재를 다발로 묶는 구조로 제공되는 방열 구조는 열전도 부분은 어느 정도 성능이 되고, 열 확산 성능도 많이 개선되지만, 밀폐된 공간에서는 열 확산에 한계가 따르며, 박만 판 사이의 좁은 공간의 공기층이 오히려 보온 작용을 일으키는 문제점을 지니고 있고, 특히 미세 먼지나 분진이 많은 곳에서는 권장되지 않는 방열 방식이기도 하다.In addition, the heat dissipation structure, which is provided as a structure in which a conventional aluminum thin film sheet is laminated after pressing and bundled into a bundle, has a heat conduction portion to some extent and improves heat spreading performance. As a result, the air space in the narrow space between the thin plates has a problem of causing heat retention, and is also a heat dissipation method which is not recommended especially in a place where a lot of fine dust or dust is present.
한편, 발광다이오드 조명 모듈을 이용하여 계단 조명등, 투광등, 보안등, 경관조명등, 하우스나 축사 또는 공장용 조명등, 거실등, 간판 간접 조명등 및 다운 라이트 등과 같은 각종 조명등 기구를 제작하다 보면 각각의 조명 모듈에 전원 공급용 컨버터를 단독으로 직접 설치할 필요가 있을 경우도 있고, 또 때에 따라서는 전류 제한기 또는 컬러 제어기와 전원 공급용 컨버터 자체를 별도로 크게 제작하여 전원 및 신호선을 수개의 조명 모듈에 각각 연결시켜 주어야 하는 경우가 있다.On the other hand, the LED lighting module is used to produce various lighting fixtures such as staircase lighting, floodlight, security lamp, landscape lighting, house or barn or factory lighting, living room lighting, signboard indirect lighting, and downlight. In some cases, it is necessary to directly install a power supply converter directly on the module.In some cases, a large current limiter or color controller and a power supply converter are manufactured separately to connect power and signal lines to several lighting modules. You may have to.
그런데, 상기한 두 예 중 각각의 조명 모듈에 전원 공급용 컨버터를 단독으로 직접 설치하는 경우 종래에는 열 확산 계수와 열 전도도가 매우 낮은 일반 합성수지재로 성형한 함체 내에 내장한 형태를 가지고 있어 각각의 조명 모듈에 설치되는 전원 공급용 컨버터 자체에서 발생되는 열을 원활히 방열시킬 수 없을 뿐만 아니라 발광다이오드에서 발생되는 열 역시 방열체를 통해서만 방열되므로 전원 공급용 컨버터 내장형 발광다이오드 조명 모듈을 구성하고 있는 전원 공급용 컨버터를 포함하여 발광다이오드의 수명이 짧은 문제점이 있다.However, in the case of directly installing a power supply converter alone in each of the above two lighting modules, it is conventionally formed in a housing molded of a general synthetic resin material having a very low thermal diffusion coefficient and thermal conductivity. Not only can't dissipate heat generated from the power supply converter itself installed in the lighting module, but also heat generated from the light emitting diode is radiated only through the heat sink, so the power supply that composes the light-emitting diode lighting module with built-in converter for power supply There is a problem that the lifetime of the light emitting diode including the converter for short.
본 발명은 이와 같은 종래의 제반 문제점을 해소하기 위하여 안출한 것으로, 조도가 높으면서도 발열량이 적고 전력소모가 적은 고휘도 발광다이오드(LED)를 광원으로 사용하고, 방열체는 사방으로 공기의 흐름이 이루어지도록 수개의 유선형 방열봉이 구비되도록 열 확산도는 알루미늄보다 대략 1.7배 높으며 비중은 대략 35%이상 낮고 가벼운 특성을 갖는 경금속계열 합금인 마그네슘 합금을 이용하여 다이케스팅을 통해 성형하여 작은 LED 조명 모듈을 성형함으로써 사용자가 이들을 이용하여 계단 조명등, 투광등, 보안등, 경관조명등, 하우스나 축사 또는 공장용 조명등, 거실등, 간판 간접 조명등 및 다운 라이트 등과 같은 각종 조명등 기구를 손쉽게 제작하여 사용할 수 있을 뿐만 아니라, LED 조명 모듈 자체의 방열기능을 대폭 향상시킬 수 있고, 또한 각각의 LED 조명 모듈에 대한 전체적인 부피와 체적을 크게 줄일 수 있어 경량화 및 소형화가 가능할 뿐만 아니라 제품의 생산원가를 대폭 저감시킬 수 있으며, 특히 투광등이나 보안등 등과 같이 비교적 고출력의 조명등 기구를 LED 조명 모듈로 제작함에 있어서 기존 지주대나 반사갓 또는 케이스를 그대로 사용한 상태에서 필요한 개수의 LED 조명 모듈만 반사갓 또는 케이스 등의 내부에 설치하여 원하는 조명출력을 얻을 수 있어 제품의 생산원가와 설치비용을 대폭 저감 및 감소시킬 수 있음은 물론 불필요한 자원낭비를 방지할 수 있는 발광다이오드 조명 모듈을 제공하는데 그 목적이 있다.The present invention has been devised to solve such a conventional problem, using a high-brightness light emitting diode (LED) as a light source with low illumination and low power consumption as a light source, the radiator is made of air flow in all directions The thermal diffusivity is approximately 1.7 times higher than that of aluminum, and the specific gravity is about 35% lower, and it is formed through die casting using a magnesium alloy, which is a light metal alloy having light characteristics. By using them, you can easily manufacture and use various lighting fixtures such as staircase lighting, floodlight, security lamp, landscape lighting, house or barn or factory lighting, living room lamp, indirect lighting and downlight, etc. The heat dissipation function of the module itself can be greatly improved, and The overall volume and volume of each LED lighting module can be greatly reduced, which enables to reduce the weight and size, and significantly reduce the production cost of the product. In particular, it is possible to use relatively high-power lighting fixtures such as floodlights and security lamps. In the production of modules, only the required number of LED lighting modules can be installed inside the reflector or case in the state of using existing props, reflector or case as it is, thereby greatly reducing the production cost and installation cost of the product. It is an object of the present invention to provide a light emitting diode lighting module that can reduce as well as prevent unnecessary resource waste.
본 발명의 다른 목적은, 전원 공급용 컨버터를 일체로 구비한 LED 조명 모듈의 경우 별도의 케이스 등을 사용하지 않고 상기 전원 공급용 컨버터가 내장되는 함체를 방열체의 상면에 직접 착탈 가능하게 설치하되, 상기 함체를 일반 합성수지가 아닌 열 전도성이 매우 우수한 특성을 가진 탄소나노튜브(CNT)가 함유된 전도성/고분자 방열 수지재로 사출 성형하여 줌으로써 함체의 내부에 설치되는 전원 공급용 컨버터에서 발생되는 열을 원활히 방열시킬 수 있을 뿐만 아니라, 방열체를 통해 방열되고 남은 발광다이오드의 잔열 일부도 함체를 통해서도 방열시킬 수 있어 LED 조명 모듈 자체를 보다 더 경량화 및 소형화시킬 수 있는 발광다이오드 조명 모듈을 제공하는데 있다.Another object of the present invention, in the case of the LED lighting module having a power supply converter integrally installed without detaching the case, such that the enclosure in which the power supply converter is built directly on the upper surface of the heat sink. The heat generated from the power supply converter installed inside the enclosure by injection molding the enclosure with a conductive / polymer heat-dissipating resin material containing carbon nanotubes (CNT) having excellent thermal conductivity rather than general synthetic resin. Not only can the heat dissipate smoothly, but also some of the remaining heat of the light emitting diodes that are radiated through the radiator can also be radiated through the enclosure to provide a light emitting diode lighting module that can further reduce the weight and size of the LED lighting module itself. .
본 발명의 또 다른 목적은 수개의 LED 조명 모듈을 필요로 하는 고출력 조명등 기구인 투광등이나 보안등, 하우스나 축사 또는 공장용 조명등 및 거실등 등과 같은 경우 각각의 LED 조명 모듈을 탄성 고정구들을 이용하여 모듈 고정판에 간단히 고정시킬 수 있도록 하고, 또 계단 조명등이나 경관조명등, 간판 간접 조명등 및 다운 라이트 등과 같이 하나의 LED 조명 모듈을 전구형태로 설치할 필요가 있는 경우에는 함체나 빛 투광 또는 확산판에 나선형 소켓 결합구 또는 소켓 결합겸 통풍 지지구를 간단히 고정 설치할 수 있도록 하여 LED 조명 모듈 자체의 호환성을 향상시켜 다양하게 요구되고 있는 사용자의 각종 조명등 기구에 부합시킬 수 있는 발광다이오드 조명 모듈을 제공하는데 있다.Another object of the present invention is to use the elastic fixtures in each LED lighting module in the case of a high-power lighting fixture that requires several LED lighting modules, such as floodlights or security lights, house or barn or factory lighting and living room lights, etc. Spiral sockets on enclosures, light projections, or diffusers, if it is necessary to easily fix them to the module mounting plate, and when one LED lighting module needs to be installed in the form of a bulb, such as staircase lighting, landscape lighting, signage indirect lighting, and downlights. The present invention provides a light emitting diode lighting module that can be easily fixed and installed with a coupling or socket coupling and ventilation support, thereby improving compatibility of the LED lighting module itself to meet various user's various lighting fixtures.
상기한 목적을 달성하기 의한 본 발명의 일 실시 예는, 단독으로 조명등 기능을 수행하거나, 소정 면적을 갖는 모듈 고정판에 수개가 고정 설치하여 원하는 출력을 갖는 각종 조명등 기구를 구성하는데 사용되는 LED 조명 모듈을 구성함에 있어서, 사각 또는 원판형상을 갖고 배면에는 LED 기판 수납홈과 방수 링 삽입홈이 형성된 형태에서 LED들에서 발생되는 빛은 투과 또는 확산시키고 외부에서 유입되는 각종 이물질과 우수의 유입은 차단하는 빛 투광 또는 확산판과; 수개의 LED가 정해진 간격을 두고 납땜 고정된 형태를 갖고 상기 빛 투광 또는 확산판의 LED 기판 수납홈 내에 설치되어 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터의 제어를 받아 조명에 필요한 빛을 발생시켜 주는 LED 기판과; 다이케스팅을 통해 사방으로 공기가 유통될 수 있도록 수개의 유선형 방열봉들이 상면에 일체로 돌출 형성되도록 경금속계열 합금으로 성형한 구성을 갖고 상기 LED 기판의 배면에서 빛 투광 또는 확산판의 배면에 저면이 밀착된 형태로 착탈 가능하게 고정 설치되어 발광다이오드에서 발생되는 열을 방열시켜 주는 방열체와; 상기 빛 투광 또는 확산판의 배면에 형성된 방수 링 삽입홈에 삽입 설치되어 상기 빛 투광 또는 확산판의 배면과 방열체 사이의 기밀을 유지시켜 주는 방수 링과; 상기 LED 기판에 설치된 LED에 흐르는 전류를 제한하거나 또는 컬러를 제어함은 물론 LED의 구동에 필요한 전원전압을 공급시켜 주는 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터;로 구성한 것을 특징으로 한다.One embodiment of the present invention to achieve the above object, LED lighting module that is used to perform a function of a lamp alone, or fixedly installed in the module fixed plate having a predetermined area to configure various lighting fixtures having a desired output In the configuration, in the form of a square or disc shape and the LED substrate receiving groove and the waterproof ring insertion groove is formed on the back to transmit or diffuse the light generated from the LED and to block the inflow of various foreign substances and rainwater flowing from the outside Light floodlight or diffuser plate; Several LEDs have a shape fixed by soldering at predetermined intervals and are installed in the LED substrate receiving groove of the light transmitting or diffusing plate to generate light for illumination under the control of a current limiter or a color controller and a power supply converter. Giving LED substrate; In order to allow air to flow in all directions through die casting, several streamlined heat-dissipating rods are formed of a light metal series alloy so as to protrude integrally on the upper surface, and the bottom of the LED substrate is closely adhered to the bottom of the light transmission or diffuser plate. A heat dissipator fixedly installed in a detachable form to dissipate heat generated from the light emitting diodes; A waterproof ring inserted into a waterproof ring insertion groove formed on a rear surface of the light transmitting or diffusing plate to maintain airtightness between the rear surface of the light transmitting or diffusing plate and the heat sink; It is characterized by consisting of; a current limiter or a color controller and a power supply converter to limit the current flowing to the LED installed on the LED substrate or to control the color as well as supply the power voltage required for driving the LED.
상기한 목적을 달성하기 의한 본 발명의 다른 실시 예는, 단독으로 조명등 기능을 수행하거나, 소정 면적을 갖는 모듈 고정판에 수개가 고정 설치하여 원하는 출력을 갖는 각종 조명등 기구를 구성하는데 사용되는 LED 조명 모듈을 구성함에 있어서, 사각 또는 원판형상을 갖고 배면에는 LED 기판 수납홈과 방수 링 삽입홈이 형성된 형태에서 LED들에서 발생되는 빛은 투과 또는 확산시키고 외부에서 유입되는 각종 이물질과 우수의 유입은 차단하는 빛 투광 또는 확산판과; 수개의 LED가 정해진 간격을 두고 납땜 고정된 형태를 갖고 상기 빛 투광 또는 확산판의 LED 기판 수납홈 내에 설치되어 전원 공급용 컨버터로부터 전원전압이 공급되면 조명에 필요한 빛을 발생시켜 주는 LED 기판과; 다이케스팅을 통해 사방으로 공기가 유통될 수 있도록 수개의 유선형 방열봉들이 상면에 일체로 돌출 형성되도록 경금속계열 합금으로 성형한 구성을 갖고 상기 LED 기판의 배면에서 빛 투광 또는 확산판의 배면에 저면이 밀착된 형태로 착탈 가능하게 고정 설치되어 발광다이오드에서 발생되는 열을 방열시켜 주는 방열체와; 상기 빛 투광 또는 확산판의 배면에 형성된 방수 링 삽입홈에 삽입 설치되어 상기 빛 투광 또는 확산판의 배면과 방열체 사이의 기밀을 유지시켜 주는 방수 링과; 뚜껑체가 구비된 사각 함체 형상을 갖도록 전도성/고분자 방열 수지재로 사출 성형된 형태를 갖고 상기 방열체의 상면에 착탈 가능하게 고정 설치되어 그 내부로 수납되는 전원 공급용 컨버터에서 발생되는 열을 포함하여 방열체를 통해 전달되는 LED의 일부 잔열을 방열시켜 주는 방열형 함체와; 상기 방열형 함체 내에 수납된 상태에서 LED 기판에 설치된 LED의 구동에 필요한 전원전압을 공급시켜 주는 전원 공급용 컨버터;로 구성한 것을 특징으로 한다.Another embodiment of the present invention to achieve the above object, the LED lighting module used to perform various functions of the lamp alone, or fixed to the module fixing plate having a predetermined area to configure various lighting fixtures having a desired output In the configuration, in the form of a square or disc shape and the LED substrate receiving groove and the waterproof ring insertion groove is formed on the back to transmit or diffuse the light generated from the LED and to block the inflow of various foreign substances and rainwater flowing from the outside Light floodlight or diffuser plate; An LED substrate having a shape in which several LEDs are soldered at predetermined intervals and installed in the LED substrate receiving groove of the light transmission or diffusion plate to generate light for illumination when a power voltage is supplied from a power supply converter; In order to allow air to flow in all directions through die casting, several streamlined heat-dissipating rods are formed of a light metal series alloy so as to protrude integrally on the upper surface, and the bottom of the LED substrate is closely adhered to the bottom of the light transmission or diffuser plate. A heat dissipator fixedly installed in a detachable form to dissipate heat generated from the light emitting diodes; A waterproof ring inserted into a waterproof ring insertion groove formed on a rear surface of the light transmitting or diffusing plate to maintain airtightness between the rear surface of the light transmitting or diffusing plate and the heat sink; Including the heat generated by the power supply converter is formed in the injection molded shape of the conductive / polymer heat-dissipating resin material so that the lid body is provided with a lid body detachably fixed to the upper surface of the heat sink and housed therein A heat dissipation enclosure for dissipating some residual heat of the LED transmitted through the heat dissipation body; And a power supply converter for supplying a power voltage necessary for driving the LED installed in the LED substrate in the state of being housed in the heat dissipation enclosure.
이때, 상기 두 실시 예에서 방열체를 구성하고 있는 경금속계열 합금은 열 확산 계수가 1.3-1.4[㎠/sec]이고, 열 전도도는 60-90[W/mK]이며, 밀도는 1.8±0.3[g/㎤]이고, 용융온도가 595[℃]이며, 비열이 1.02-1.05[J/gK]인 마그네슘 합금을 포함하는 것을 특징으로 한다.In this case, the light-metal alloys constituting the heat dissipation in the two embodiments has a heat diffusion coefficient of 1.3-1.4 [cm 2 / sec], a thermal conductivity of 60-90 [W / mK], and a density of 1.8 ± 0.3 [ g / cm 3], a melting temperature of 595 [° C.], and a specific heat of 1.02-1.05 [J / gK].
뿐만 아니라, 상기 방열체를 구성하고 있는 경금속계열 합금으로는 베릴륨과 티타늄, 두랄루민 및 탄소-알루미늄 복합소재를 포함하는 것을 특징으로 한다.In addition, the light metal-based alloy constituting the heat sink is characterized in that it comprises beryllium and titanium, duralumin and carbon-aluminum composite material.
또한, 상기 두 실시 예에서 방열체의 상면에 돌출 성형된 유선형 방열봉의 외주면에는 방열 표면적을 증대시켜 주기 위해 수개의 방열돌기를 정해진 간격을 두고 더 돌출 성형한 것을 특징으로 한다.In addition, in the above two embodiments, the outer circumferential surface of the streamlined heat dissipating rod protruded to the upper surface of the heat dissipating member may be further protruded at a predetermined interval to increase the heat dissipation surface area.
또, 상기 방열형 함체를 포함한 뚜껑체를 구성하고 있는 전도성/고분자 방열 수지재는 열 확산 계수가 0.75-0.8[㎠/sec]이고, 열 전도도는 90-150[W/mK]이며, 밀도는 1.4±0.2[g/㎤]이고, 용융온도가 105-160[℃]이며, 비열이 1.1±0.4[J/gK]인 탄소나노튜브(CNT)를 포함하는 것을 특징으로 한다.In addition, the conductive / polymeric heat dissipating resin material constituting the lid including the heat dissipation enclosure has a heat diffusion coefficient of 0.75-0.8 [cm 2 / sec], a thermal conductivity of 90-150 [W / mK], and a density of 1.4 ±. 0.2 [g / cm 3], a melting temperature of 105-160 [° C.], and carbon nanotubes (CNT) having a specific heat of 1.1 ± 0.4 [J / gK].
또한, 방열형 함체의 뚜껑체 저면 양측에는 전원 공급용 컨버터의 양측면이 끼워져 걸려지는 기판 가이드 홈을 구비하고 방열형 함체의 내부로 삽입되는 측판을 더 구비시킨 것을 특징으로 한다.In addition, both sides of the bottom surface of the lid body of the heat dissipation housing is characterized in that it is provided with a substrate guide groove to which both sides of the power supply converter is fitted, and side plates inserted into the heat dissipation enclosure.
또, 상기 방열형 함체의 뚜껑체에 돌출 형성된 측판의 배면에는 전원 공급용 컨버터의 납땜 부분과 도전성 방열형 함체 사이의 누전을 방지하기 위한 절연 차단막을 더 일체로 형성한 것을 특징으로 한다.In addition, the rear surface of the side plate protruding from the lid of the heat dissipation enclosure is characterized in that the insulation blocking film for preventing a short circuit between the soldering portion of the power supply converter and the conductive heat dissipation enclosure is further formed integrally.
또한, 상기 방열형 함체의 상면 개구부 주연부와 뚜껑체의 저면 사이에는 외부로부터 방열형 함체의 내부로 습기를 포함하여 각종 이물질이 유입되지 않도록 하는 방수 패킹을 더 설치한 것을 특징으로 한다.In addition, between the upper periphery of the upper surface opening of the heat dissipation enclosure and the bottom of the lid body is characterized in that the waterproof packing is further installed to prevent various foreign substances, including moisture from the outside into the interior of the heat dissipation enclosure.
또, 상기 방열형 함체의 뚜껑체 상에는 전원 공급용 컨버터에 교류전원을 공급하기 위한 전원공급단자를 설치하기 위하여 한 쌍 또는 두 쌍의 전원공급단자 설치공을 형성한 것을 특징으로 한다.In addition, a pair or two pairs of power supply terminal mounting holes are formed on the lid of the heat dissipation enclosure in order to install a power supply terminal for supplying AC power to the power supply converter.
이때, 상기 방열형 함체의 뚜껑체 상에 형성시킨 전원공급단자 설치공이 한 쌍인 경우 교류전원 공급선 및 점프선이 일체로 구비된 콘넥터를 이용하여 LED 조명 모듈의 방열형 함체 외부에서 서로 인접된 LED 조명 모듈에 교류전원을 점프시켜 주기 위해 콘넥터 결합용 전원공급단자를 설치한 것을 특징으로 한다.At this time, when there is a pair of power supply terminal installation holes formed on the lid of the heat dissipation enclosure, the AC power supply line and the jump line are connected to the LED light modules adjacent to each other outside the heat dissipation enclosure of the LED lighting module by using a connector provided integrally. It is characterized by installing a power supply terminal for connector coupling to jump the power.
또한, 상기 방열형 함체의 뚜껑체 상에 형성시킨 전원공급단자 설치공이 두 쌍인 경우 서로 인접된 LED 조명 모듈에 교류전원 공급선을 점프시켜 주기 위해 각 쌍에 "ㄷ"자 형상으로 절곡 성형한 전원공급단자를 설치한 것을 특징으로 한다.In addition, when there are two pairs of power supply terminal installation holes formed on the lid of the heat dissipation enclosure, the power supply terminals bent and formed into a "c" shape on each pair to jump AC power supply lines to adjacent LED lighting modules. Characterized in that installed.
또, 상기 방열형 함체의 뚜껑체 상면 중앙에는 전원 공급용 컨버터에 교류전압을 공급시켜 줌은 물론 LED 조명 모듈 자체를 일반전구와 같이 소켓에 나사 결합시킬 수 있도록 하는 나선형 소켓 결합구를 절연기능과 접착기능을 동시에 구비한 접착제를 이용하여 일체로 고정 설치한 것을 특징으로 한다.In addition, in the center of the upper surface of the lid body of the heat-dissipating enclosure, the spiral socket coupler for providing an AC voltage to the power supply converter and screwing the LED lighting module itself to the socket like a general electric bulb is insulated and bonded. It is characterized in that the fixed integrally installed using the adhesive provided with the function at the same time.
또한, 상기 방열형 함체의 전,후 표면에도 정해진 간격을 두고 방열 표면적을 넓혀주기 위한 방열돌출부들을 더 돌출 성형한 것을 특징으로 한다.In addition, the front and rear surfaces of the heat dissipation housing is characterized in that the heat dissipation protrusions for further extending the heat dissipation surface area at a predetermined interval formed by further extrusion molding.
또, 상기 방열체의 유선형 방열봉 중 일측 중심선 상에서 서로 대향된 위치에 있는 두 개의 유선형 방열봉 상면에는 가이드 홈을 형성하고, 상기 방열형 함체의 저면 중 일측 중심선 상에서 양측에는 방열형 함체를 방열체의 상면에 올려놓고 스크류를 이용하여 고정 설치할 때 상기 유선형 방열봉의 가이드 홈에 끼워져 방열형 함체가 회동되지 않도록 하는 가이드 봉을 더 돌출되게 설치한 것을 특징으로 한다.In addition, two streamlined heat dissipation rods having guide grooves are formed on the upper surfaces of the heat dissipation rods at one of the streamlined heat dissipation rods facing each other on one side of the heat dissipation rod. When installed on the fixed by using a screw on the guide groove of the streamlined heat dissipation rod is characterized in that the guide rod is further protruded to prevent the heat dissipation enclosure is rotated.
또는 상기 방열체의 중앙에 돌출 성형된 방열 겸 전선 통과봉을 장방형으로 형성하고, 상기 방열형 함체의 저면 중앙에 평단면이 장방형 형상을 갖는 상기 방열 겸 전선 통과봉의 상단 일부가 끼워져 방열형 함체의 오결합을 방지함은 물론 방열형 함체가 회동되지 않도록 하는 방열 겸 전선 통과봉 결합홈을 더 형성한 설치한 것을 특징으로 한다.Alternatively, a heat-dissipating cum wire passing rod protrudingly formed in the center of the heat dissipating body is formed in a rectangular shape, and a portion of the upper end of the heat dissipating cum wire passing rod having a rectangular cross section has a rectangular shape in the center of the bottom surface of the heat dissipating enclosure, thereby incorrectly coupling the heat dissipating enclosure. Of course, it characterized in that the heat radiation and the wire passing rod coupling groove further formed to prevent the heat dissipation enclosure is rotated.
또한, 상기 빛 투광 또는 확산판의 주연부에서 소정 간격을 두고 또는 각 모서리에는 각종 조명등 기구의 모듈 고정판에 천공된 방열체 통과공에 방열체를 끼운 상태에서 방열체 통과공의 주연부에 걸려진 빛 투광 또는 확산판 자체를 스크류로 고정시키기 위해, 또는 소정 형상을 갖는 소켓 결합겸 통풍 지지구를 스크류를 통해 빛 투광 또는 확산판에 고정시켜 주기 위한 스크류 결합홈을 더 천공한 것을 특징으로 한다.In addition, at a predetermined interval from the periphery of the light projection or diffuser plate or at each corner, the light transmission is caught on the periphery of the radiator through hole in a state in which the radiator is inserted into the radiator through hole perforated on the module fixing plate of various lighting fixtures. Alternatively, the screw coupling groove for fixing the diffusion plate itself with a screw or fixing the socket coupling and the ventilation support having a predetermined shape to the light transmission or the diffusion plate through the screw may be further drilled.
이때, 소켓 결합겸 통풍 지지구는 전원 공급용 컨버터에 교류전압을 공급시켜 줌은 물론 LED 조명 모듈 자체를 일반전구와 같이 소켓에 나사 결합시킬 수 있도록 하는 나선형 소켓 결합구와; 상기 나선형 소켓 결합구의 저면에 일체로 고정 설치되는 몸체의 주연부에서 정해진 간격을 두고 하방부를 향해 돌출 형성되되, 저단부에는 상기 빛 투광 또는 확산판에 형성된 스크류 결합홈에 결합되는 스크류가 통과되는 스크류 통과공이 천공된 형태를 갖는 수개의 다리가 일체로 구비되도록 합성수지재를 이용하여 사출 성형한 통풍 지지구;로 구성한 것을 특징으로 한다.At this time, the socket coupling and the ventilation support is provided with a spiral socket coupling sphere for supplying an AC voltage to the converter for power supply, as well as screwing the LED lighting module itself into the socket like a general bulb; Is formed protruding downward from the peripheral portion of the body fixedly installed on the bottom of the spiral socket coupler at a predetermined interval, the screw passing through the screw coupled to the screw coupling groove formed in the light transmitting or diffuser plate at the bottom end Characterized in that it consists of a ventilation support which is injection-molded using a synthetic resin material so that several legs having a ball-punched form are integrally provided.
한편, 상기 방열형 함체의 양측면 저부에는 수개의 LED 조명 모듈을 모듈 고정판에 고정 설치하여 각종 조명등 기구를 제작하고자 할 때 소정 형상을 갖는 탄성 고정구를 결합시키거나, 또는 LED 조명 모듈 자체의 빛 조사각도를 조절하기 위해 빛 각도 조절수단을 결합시키기 위하여 평단면이 "ㄷ"자 형상을 갖는 고정구 결합구를 일체로 더 돌출 성형한 것을 특징으로 한다.On the other hand, the bottom of both sides of the heat dissipation enclosure to install a number of LED lighting modules fixed to the module fixing plate when manufacturing a variety of lighting fixtures to combine an elastic fixture having a predetermined shape, or to adjust the light irradiation angle of the LED lighting module itself In order to adjust the light angle control means for adjusting the flat section is characterized in that the more integrally molded molding fixture having a "c" shape.
이때, 상기 탄성 고정구는 소정 폭과 길이를 갖도록 절단한 철판을 이용하여 절곡 성형하되, 상부 평판부를 중심으로 그 내측에는 상기 고정구 결합구 내측에 끼워져 탄력적으로 걸려지는 "π" 형상의 탄성 고정편을 일체로 형성하고, 외측에는 상기 고정구 결합구 외측을 덮는 형태로 지나 그 저단부 일부가 만곡지게 절곡된 형태에서 모듈 고정판의 내면 일부까지 탄력적으로 밀착된 형태를 갖는 판 스프링부를 일체로 형성하되, 상기 판 스프링부의 상부에는 분해용 공구를 결합하기 위한 공구 결합공을 천공한 것을 특징으로 한다. At this time, the elastic fastener is bent and formed by using a steel plate cut to have a predetermined width and length, the inner surface of the upper plate portion of the "π" shaped elastic fastener that is elastically hung to fit inside the fastener coupler It is formed integrally, and the plate spring portion having a form elastically in close contact with a portion of the inner surface of the module fixing plate in a form bent in a form that covers the outside of the fastener coupler outside the curved bent integrally formed, The upper portion of the leaf spring portion is characterized in that for drilling a tool coupling hole for coupling the disassembly tool.
또는, 상기 탄성 고정구는 소정 지름과 길이를 갖는 강선을 이용하여 상부 내측에는 상기 고정구 결합구 내측에 끼워져 탄력적으로 걸려지는 한 쌍의 탄성 걸림고리를 형성하고, 상부에는 고정구 결합구의 상면부를 감싸는 평면부를 형성하며, 상기 평면부의 외측에서 하방부를 향해서는 상기 탄성 걸림고리의 간격을 유지시켜 주도록 서로 대향되게 한 쌍의 간격 유지부를 절곡 형성하고, 상기 간격 유지부의 저부로는 상기 고정구 결합구 외측을 지나 그 저단부 일부가 만곡지게 절곡된 형태에서 모듈 고정판의 내면 일부까지 탄력적으로 접촉된 형태를 갖는 스프링부를 일체로 형성한 형태를 갖는 것을 특징으로 한다. Alternatively, the elastic fastener is formed by using a steel wire having a predetermined diameter and length to form a pair of elastic fastening hooks that are elastically fastened by being fitted inside the fastener coupler at an upper side thereof, and a flat portion surrounding the upper surface of the fastener coupler at an upper portion thereof. Forming a pair of gap holders facing each other so as to maintain the gap of the elastic catching ring from the outside of the plane to the lower part, and the bottom of the gap holder passes through the outside of the fastener coupler. A portion of the bottom end is bent in a curved form, characterized in that it has a form integrally formed with a spring portion having a form in elastic contact with a portion of the inner surface of the module fixing plate.
또한, 상기 빛 각도 조절수단은 소정 폭과 길이를 갖도록 절단한 철판을 "U"자 형상으로 절곡 성형하되, 저부에는 상기 방열형 함체의 고정구 결합구가 끼워져 고정되는 결합구 고정부를 일체로 구비하고 상기 방열형 함체의 고정구 결합구에 착탈 가능하게 결합되는 한 쌍의 탄성형 연결구와; 소정 폭과 길이를 갖도록 절단한 철판을 "ㄷ"자 형상으로 절곡 형성시킨 형태를 갖고 양 단부에 일체로 절곡 형성된 고정편이 상기 탄성형 연결구들의 자유 단부 틈새에 끼워져 볼트와 나비 너트를 통해 각도 조절 가능하게 결합되는 지지구와; 상기 지지구의 중앙에 착탈 가능하게 고정되어 LED 조명 모듈을 포함하여 빛 각도 조절수단 자체를 벽과 같은 고정구에 착탈 가능하게 고정시켜 주는 고정판;으로 구성한 것을 특징으로 한다.In addition, the light angle adjusting means is formed by bending the iron plate cut to have a predetermined width and length in a "U" shape, the bottom portion is integrally provided with a coupler fixing portion to which the fastener coupler of the heat dissipating enclosure is fitted and fixed. A pair of elastic connectors that are detachably coupled to the fixture coupler of the heat dissipation enclosure; A steel plate cut to have a predetermined width and length is bent into a "c" shape, and a fixing piece integrally bent at both ends is inserted into a gap between the free ends of the elastic connectors to adjust the angle through the bolt and the butterfly nut. A support that is securely coupled; Removably fixed to the center of the support is fixed including a fixing plate for detachably fixing the light angle control means itself to a fixture such as a wall, including an LED lighting module.
이때, 상기 LED 조명 모듈을 이용하여 제작되는 각종 조명등 기구는 계단 조명등, 투광등, 보안등, 경관조명등, 하우스나 축사 또는 공장용 조명등, 거실등, 간판 간접 조명등 및 다운 라이트 등을 포함하는 것을 특징으로 한다.At this time, the various lighting fixtures produced using the LED lighting module is characterized in that it includes a stairway light, floodlight, security light, landscape lighting, house or barn or factory lighting, living room lights, signage indirect lighting and down lights, etc. It is done.
이상에서 설명한 바와 같이 본 발명에 의하면, 조도가 높으면서도 발열량이 적고 전력소모가 적은 고휘도 발광다이오드(LED)를 광원으로 사용하고, 방열체는 사방으로 공기의 흐름이 쉽게 이루어지도록 수개의 유선형 방열봉(즉, 유선형 기둥 형상)이 구비되도록 열 확산도가 알루미늄보다 대략 1.7배 높고 비중은 35%이상 낮으며 가벼운 특성을 갖는 경금속계열 합금인 마그네슘 합금을 이용하여 다이케스팅을 통해 성형하여 작은 LED 조명 모듈을 성형함으로써 첫째 사용자가 이들을 이용하여 계단 조명등, 투광등, 보안등, 경관조명등, 하우스나 축사 또는 공장용 조명등, 거실등, 간판 간접 조명등 및 다운 라이트 등과 같은 각종 조명등 기구를 손쉽게 제작하여 사용할 수 있고, 둘째 LED 조명 모듈 자체의 방열기능을 대폭 향상시킬 수 있으며, 셋째 각각의 LED 조명 모듈에 대한 전체적인 부피와 체적을 크게 줄일 수 있어 경량화 및 소형화가 가능할 뿐만 아니라 제품의 생산원가를 대폭 저감시킬 수 있고, 넷째 투광등이나 보안등 등과 같이 비교적 고출력의 조명등 기구를 LED 조명 모듈로 제작함에 있어서 기존 지주대나 반사갓 또는 케이스를 그대로 사용한 상태에서 필요한 개수의 LED 조명 모듈만 반사갓 또는 케이스 등의 내부에 설치하여 원하는 조명출력을 얻을 수 있어 제품의 생산원가와 설치비용을 대폭 저감 및 감소시킬 수 있음은 물론 불필요한 자원낭비를 방지할 수 있다.As described above, according to the present invention, a high luminance light emitting diode (LED) having high illuminance and low heat generation and low power consumption is used as a light source, and the radiator has several streamlined heat dissipation rods so that air flows easily in all directions. (I.e. streamlined columnar shape), the thermal diffusivity is approximately 1.7 times higher than aluminum, the specific gravity is 35% or more, and formed through die-casting using a magnesium alloy, a light metal alloy having light characteristics, and molding a small LED lighting module. First, users can easily make and use various lighting fixtures such as staircase lighting, floodlight, security lamp, landscape lighting, house or barn or factory lighting, living room lamp, signboard indirect lighting and down light. The heat dissipation function of the LED lighting module itself can be greatly improved. The overall volume and volume of the LED lighting module can be significantly reduced, making it possible to reduce the weight and size of the LED lighting module, and to significantly reduce the production cost of the product. In manufacturing, only the required number of LED lighting modules can be installed inside the reflector or case in the state of using existing props, reflector or case as it is, thereby greatly reducing and reducing the production cost and installation cost of the product. Of course, it can also prevent unnecessary waste of resources.
또한, 본 발명에서는 전원 공급용 컨버터를 일체로 구비한 LED 조명 모듈의 경우 별도의 케이스 등을 사용하지 않고 상기 전원 공급용 컨버터가 내장되는 함체를 방열체의 상면에 직접 착탈 가능하게 설치하되, 상기 함체를 일반 합성수지가 아닌 열 전도성이 매우 우수한 특성을 가진 탄소나노튜브(CNT)가 함유된 전도성/고분자 방열 수지재로 사출 성형하여 줌으로써 함체의 내부에 설치되는 전원 공급용 컨버터에서 발생되는 열을 원활히 방열시킬 수 있을 뿐만 아니라, 방열체를 통해 방열되고 남은 발광다이오드의 잔열 일부도 함체를 통해서도 방열시킬 수 있어 LED 조명 모듈 자체를 보다 더 경량화 및 소형화시킬 수 있다.In addition, in the present invention, in the case of the LED lighting module having a power supply converter integrally, the housing in which the power supply converter is built is detachably installed on the upper surface of the heat sink without using a separate case. By injecting and molding the enclosure into conductive / polymer heat-dissipating resin containing carbon nanotubes (CNTs), which have excellent thermal conductivity, rather than general synthetic resins, the heat generated from the power supply converter installed inside the enclosure is smooth. In addition to heat dissipation, part of the remaining heat of the light emitting diodes remaining after being dissipated through the heat dissipation can also be dissipated through the housing, thereby making the LED lighting module itself lighter and smaller.
뿐만 아니라, 본 발명에서는 수개의 LED 조명 모듈을 필요로 하는 고출력 조명등 기구인 투광등이나 보안등, 하우스나 축사 또는 공장용 조명등 및 거실등 등과 같은 경우 각각의 LED 조명 모듈을 탄성 고정구들을 이용하여 모듈 고정판에 간단히 고정시킬 수 있도록 하고, 또 계단 조명등이나 경관조명등, 간판 간접 조명등 및 다운 라이트 등과 같이 하나의 LED 조명 모듈을 전구형태로 설치할 필요가 있는 경우에는 함체나 빛 투광 또는 확산판에 나선형 소켓 결합구 또는 소켓 결합겸 통풍 지지구를 간단히 고정 설치하여 사용할 수 있도록 함으로써 LED 조명 모듈 자체의 호환성을 대폭 향상시킬 수 있어 다양하게 요구되고 있는 사용자의 각종 조명등 기구에 적합시켜 사용할 수 있는 등 매우 유용한 발명인 것이다.In addition, in the present invention, in the case of a high-power lighting fixture that requires several LED lighting modules, such as a floodlight or a security light, a house or a barn or a factory lighting, a living room light, and the like, each LED lighting module may be configured using elastic fixtures. Spiral sockets are combined with enclosures, light projections or diffusers when it is necessary to install a single LED lighting module in the form of a light bulb, such as a simple fixation to a fixed plate, and a stair light, landscape light, signage indirect light, and down light. It is a very useful invention that it can be used for various kinds of lighting fixtures of users that can greatly improve the compatibility of the LED lighting module itself by simply fixing and installing a sphere or socket coupling and a ventilation support. .
도 1의 (a)(b)는 본 발명의 일 실시 예에 따른 LED 조명 모듈 사시도.Figure 1 (a) (b) is a perspective view of the LED lighting module according to an embodiment of the present invention.
도 2의 (a)(b)는 본 발명의 다른 실시 예에 따른 LED 조명 모듈 사시도.Figure 2 (a) (b) is a perspective view of the LED lighting module according to another embodiment of the present invention.
도 3은 도 2의 (a)에 대한 분해 사시도.3 is an exploded perspective view of FIG.
도 4는 도 2의 (b)에 대한 분해 사시도.4 is an exploded perspective view of FIG.
도 5의 (a)(b)는 본 발명의 다른 실시 예에 따른 LED 조명 모듈의 정방향 및 측방향 단면도.Figure 5 (a) (b) is a forward and side cross-sectional view of the LED lighting module according to another embodiment of the present invention.
도 6의 (a)(b)는 본 발명의 일 실시 예에 따른 LED 조명 모듈의 평면 및 공기 흐름도.Figure 6 (a) (b) is a planar and air flow diagram of the LED lighting module according to an embodiment of the present invention.
도 7 및 도 8은 전원 공급용 컨버터가 내장된 본 발명의 다른 실시 예에 따른 다수개의 LED 조명 모듈을 이용하여 조명등 기구를 구성하고 교류전원 공급선을 상호 연결시킨 상태의 예를 보인 일부 확대 정면도.7 and 8 are partially enlarged front views showing an example of a state in which a lighting fixture is configured by using a plurality of LED lighting modules according to another embodiment of the present invention with a built-in power supply converter and the AC power supply lines are interconnected. .
도 9는 본 발명의 일 실시 예에 따른 다수개의 LED 조명 모듈을 이용하여 조명등 기구를 구성하고 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터를 이용하여 전원전압을 공급시킨 상태의 예를 보인 일부 확대 정면도.9 is a partially enlarged view showing an example of a state in which a lighting fixture is configured using a plurality of LED lighting modules according to an embodiment of the present invention, and a power supply voltage is supplied using a current limiter or a color controller and a power supply converter. Front view.
도 10의 (a)(b)는 본 발명 중 탄성 고정구에 대한 일 실시 예에 따른 사시도 및 이를 이용하여 LED 조명 모듈을 고정시킨 상태를 보인 일부 확대 정면도.Figure 10 (a) (b) is an enlarged front view showing a perspective view according to an embodiment of the elastic fixture of the present invention and the LED lighting module fixed using the same.
도 11의 (a)(b)는 본 발명 중 탄성 고정구에 대한 다른 실시 예에 따른 사시도 및 이를 이용하여 LED 조명 모듈을 고정시킨 상태를 보인 일부 확대 정면도.Figure 11 (a) (b) is an enlarged front view showing a perspective view according to another embodiment of the elastic fastener of the present invention and a state in which the LED lighting module is fixed using the same.
도 12는 본 발명의 다른 실시 예에 따른 LED 조명 모듈 상면에 나선형 소켓 결합구를 직접 고정 설치한 조명등 기구의 사시도.12 is a perspective view of a light fixture having a spiral socket coupler directly fixed to the upper surface of the LED lighting module according to another embodiment of the present invention.
도 13은 본 발명의 다른 실시 예에 따른 LED 조명 모듈 상면에 소켓 결합겸 통풍 지지구를 결합시킨 조명등 기구의 분해 사시도.Figure 13 is an exploded perspective view of a lighting fixture coupled to the socket coupling and the ventilation support on the upper surface of the LED lighting module according to another embodiment of the present invention.
도 14는 본 발명의 다른 실시 예에 따른 LED 조명 모듈에 빛 각도 조절수단을 결합시킨 조명등 기구의 분해 사시도.Figure 14 is an exploded perspective view of a lighting fixture coupled to the light angle control means to the LED lighting module according to another embodiment of the present invention.
도 15는 본 발명의 빛 각도 조절수단을 이용하여 조명등 기구의 빛 조사각도를 조절한 상태를 보인 측면도.Figure 15 is a side view showing a state of adjusting the light irradiation angle of the lighting fixture using the light angle adjusting means of the present invention.
도 16의 (a)(b)는 본 발명의 LED 조명 모듈들을 이용하여 제조한 원형 반사갓을 갖는 투광등(예; 공장 및 고천정 고정등 등)과 사각형 투광등(예; 운동장이나 골프장, 항구 및 무대 조명등)을 예시한 저면도.Figure 16 (a) (b) is a floodlight (e.g. factory and high ceiling fixture, etc.) and a square floodlight (e.g. playground or golf course, port having a circular reflector manufactured using the LED lighting modules of the present invention) And a bottom view illustrating stage lighting).
도 1의 (a)(b)는 본 발명의 일 실시 예에 따른 LED 조명 모듈 사시도.Figure 1 (a) (b) is a perspective view of the LED lighting module according to an embodiment of the present invention.
도 2의 (a)(b)는 본 발명의 다른 실시 예에 따른 LED 조명 모듈 사시도.Figure 2 (a) (b) is a perspective view of the LED lighting module according to another embodiment of the present invention.
도 3은 도 2의 (a)에 대한 분해 사시도.3 is an exploded perspective view of FIG.
도 4는 도 2의 (b)에 대한 분해 사시도.4 is an exploded perspective view of FIG.
도 5의 (a)(b)는 본 발명의 다른 실시 예에 따른 LED 조명 모듈의 정방향 및 측방향 단면도.Figure 5 (a) (b) is a forward and side cross-sectional view of the LED lighting module according to another embodiment of the present invention.
도 6의 (a)(b)는 본 발명의 일 실시 예에 따른 LED 조명 모듈의 평면 및 공기 흐름도.Figure 6 (a) (b) is a planar and air flow diagram of the LED lighting module according to an embodiment of the present invention.
도 7 및 도 8은 전원 공급용 컨버터가 내장된 본 발명의 다른 실시 예에 따른 다수개의 LED 조명 모듈을 이용하여 조명등 기구를 구성하고 교류전원 공급선을 상호 연결시킨 상태의 예를 보인 일부 확대 정면도.7 and 8 are partially enlarged front views showing an example of a state in which a lighting fixture is configured by using a plurality of LED lighting modules according to another embodiment of the present invention with a built-in power supply converter and the AC power supply lines are interconnected. .
도 9는 본 발명의 일 실시 예에 따른 다수개의 LED 조명 모듈을 이용하여 조명등 기구를 구성하고 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터를 이용하여 전원전압을 공급시킨 상태의 예를 보인 일부 확대 정면도.9 is a partially enlarged view showing an example of a state in which a lighting fixture is configured using a plurality of LED lighting modules according to an embodiment of the present invention, and a power supply voltage is supplied using a current limiter or a color controller and a power supply converter. Front view.
도 10의 (a)(b)는 본 발명 중 탄성 고정구에 대한 일 실시 예에 따른 사시도 및 이를 이용하여 LED 조명 모듈을 고정시킨 상태를 보인 일부 확대 정면도.Figure 10 (a) (b) is an enlarged front view showing a perspective view according to an embodiment of the elastic fixture of the present invention and the LED lighting module fixed using the same.
도 11의 (a)(b)는 본 발명 중 탄성 고정구에 대한 다른 실시 예에 따른 사시도 및 이를 이용하여 LED 조명 모듈을 고정시킨 상태를 보인 일부 확대 정면도.Figure 11 (a) (b) is an enlarged front view showing a perspective view according to another embodiment of the elastic fastener of the present invention and a state in which the LED lighting module is fixed using the same.
도 12는 본 발명의 다른 실시 예에 따른 LED 조명 모듈 상면에 나선형 소켓 결합구를 직접 고정 설치한 조명등 기구의 사시도.12 is a perspective view of a light fixture having a spiral socket coupler directly fixed to the upper surface of the LED lighting module according to another embodiment of the present invention.
도 13은 본 발명의 다른 실시 예에 따른 LED 조명 모듈 상면에 소켓 결합겸 통풍 지지구를 결합시킨 조명등 기구의 분해 사시도.Figure 13 is an exploded perspective view of a lighting fixture coupled to the socket coupling and the ventilation support on the upper surface of the LED lighting module according to another embodiment of the present invention.
도 14는 본 발명의 다른 실시 예에 따른 LED 조명 모듈에 빛 각도 조절수단을 결합시킨 조명등 기구의 분해 사시도.Figure 14 is an exploded perspective view of a lighting fixture coupled to the light angle control means to the LED lighting module according to another embodiment of the present invention.
도 15는 본 발명의 빛 각도 조절수단을 이용하여 조명등 기구의 빛 조사각도를 조절한 상태를 보인 측면도.Figure 15 is a side view showing a state of adjusting the light irradiation angle of the lighting fixture using the light angle adjusting means of the present invention.
도 16의 (a)(b)는 본 발명의 LED 조명 모듈들을 이용하여 제조한 원형 반사갓을 갖는 투광등(예; 공장 및 고천정 고정등 등)과 사각형 투광등(예; 운동장이나 골프장, 항구 및 무대 조명등)을 예시한 저면도.Figure 16 (a) (b) is a floodlight (e.g. factory and high ceiling fixture, etc.) and a square floodlight (e.g. playground or golf course, port having a circular reflector manufactured using the LED lighting modules of the present invention) And a bottom view illustrating stage lighting).
(부호의 설명)(Explanation of the sign)
1 : 빛 투광 또는 확산판 1a : LED 기판 수납홈1: Light transmitting or diffusing plate 1a: LED substrate receiving groove
1b :방수 링 삽입홈 1c : 스크류 결합홈1b: Waterproof ring insert groove 1c: Screw coupling groove
2 : LED 기판 2a : LED2: LED substrate 2a: LED
3 : 방열체 3a : 유선형 방열봉3: heat sink 3a: streamline heat sink
3b : 방열돌기 3c : 가이드 홈3b: heat radiating protrusion 3c: guide groove
3d : 방열 겸 전선 통과봉3d: heat dissipation and wire through rod
4 : 방수 링4: waterproof ring
5a : 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터5a: current limiter or color controller and converter for power supply
5b : 전원 공급용 컨버터5b: Power supply converter
6 : 방열형 함체 6a : 방열돌출부6: heat dissipation enclosure 6a: heat dissipation protrusion
6b : 가이드 봉 6c : 방열 겸 전선 통과봉 결합홈6b: guide rod 6c: heat dissipation and wire passing rod coupling groove
6d : 고정구 결합구 61 : 뚜껑체6d: fastener coupler 61: lid body
61a : 측판 61b : 기판 가이드 홈61a: side plate 61b: substrate guide groove
61c : 절연 차단막 61d : 전원공급단자 설치공61c: insulation barrier 61d: power supply terminal installation
62 : 콘넥터 결합용 전원공급단자62: power supply terminal for connector coupling
7 : 방수 패킹7: waterproof packing
8 : 모듈 고정판 8a : 방열체 통과공8: module fixing plate 8a: heat sink through hole
9 : 스크류 10 : 콘넥터9: screw 10: connector
11 : 나선형 소켓 결합구11: spiral socket coupler
12 : 소켓 결합겸 통풍 지지구 12a : 나선형 소켓 결합구12: socket coupling and ventilation support 12a: spiral socket coupling
12b : 통풍 지지구 12b-1 : 몸체12b: ventilation support 12b-1: body
12b-2 : 다리 12b-3 : 스크류 통과공12b-2: leg 12b-3: screw through hole
13 : 탄성 고정구 13a : 탄성 고정편13: elastic fixture 13a: elastic fixture
13d : 평판부 13c : 판 스프링부13d: plate portion 13c: leaf spring portion
13d : 공구 결합공 13e : 탄성 걸림고리13d: tool engagement hole 13e: elastic hook
13f : 평면부 13g : 간격 유지부13f: flat part 13g: spacing part
13h : 스프링부13h: spring section
14 : 빛 각도 조절수단 14a : 탄성형 연결구14: light angle adjusting means 14a: elastic connector
14b : 결합구 고정부 14c : 지지구14b: coupler fixing portion 14c: support
14c-1 고정편 14d : 고정판14c-1 fixing piece 14d: fixing plate
14e : 볼트 14f : 나비 너트14e: bolt 14f: butterfly nut
이하, 첨부된 도면을 참조하여 본 발명에 따른 바람직한 실시 예를 포함하여 이들의 작용효과를 보다 상세히 설명하면 다음과 같다. Hereinafter, with reference to the accompanying drawings will be described in more detail the effects of these, including the preferred embodiment according to the present invention.
먼저, 본 발명의 일 실시 예는 도 1의 (a)(b)와 도 6의 (a)(b) 및 도 9에 도시된 바와 같이, 단독으로 조명등 기능을 수행하거나, 소정 면적을 갖는 모듈 고정판(8)에 수개가 고정 설치하여 원하는 출력을 갖는 각종 조명등 기구를 구성하는데 사용되는 LED 조명 모듈을, 빛 투광 또는 확산판(1)과, 수개의 LED가 정해진 간격을 두고 납땜 고정된 LED 기판(2), 경금속계열 합금으로 다이케스팅을 통해 성형한 방열체(3), 방수 링(4) 및 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터(5a)를 포함하여 구성한 것을 주요기술 구성요소로 한다.First, an embodiment of the present invention, as shown in Figure 1 (a) (b) and 6 (a) (b) and 9 of Figure 1, performs a lamp function alone, or a module having a predetermined area LED boards in which several LEDs are fixed and fixed on the fixing plate 8 to be used to construct various lighting fixtures having desired outputs. (2) The main technical components include a heat sink (3), a waterproof ring (4) and a current limiter or a color controller and a power supply converter (5a) formed by die casting of a light metal series alloy. .
또한, 본 발명의 다른 실시 예는 도 2의 (a)(b) 내지 도 5의 (a)(b)와, 도 7 및 도 8에 도시된 바와 같이, 단독으로 조명등 기능을 수행하거나, 소정 면적을 갖는 모듈 고정판(8)에 수개가 고정 설치하여 원하는 출력을 갖는 각종 조명등 기구를 구성하는데 사용되는 LED 조명 모듈을, 빛 투광 또는 확산판(1)과, 수개의 LED가 정해진 간격을 두고 납땜 고정된 LED 기판(2), 경금속계열 합금으로 다이케스팅을 통해 성형한 방열체(3), 방수 링(4), 전도성/고분자 방열 수지재로 사출 성형한 방열형 함체(6) 및 전원 공급용 컨버터(5b)를 포함하여 구성한 것을 주요기술 구성요소로 한다,In addition, another embodiment of the present invention, as shown in Figures 2 (a) (b) to 5 (a) (b) of Figure 2, and Figures 7 and 8, alone or performs a predetermined light function, or The LED lighting module, which is fixedly installed on the module fixing plate 8 having an area and used to form various lighting fixtures having a desired output, is soldered with a light transmitting or diffuser plate 1 and several LEDs at a predetermined interval. Fixed LED substrate (2), radiator (3) formed by die casting with light metal series alloy, waterproof ring (4), radiant enclosure (6) injection-molded with conductive / polymeric heat dissipating resin material, and power supply converter ( 5b), including the main technical components,
이때, 상기 두 실시 예에서 공통으로 사용되고 있는 상기 빛 투광 또는 확산판(1)은 사각 또는 원판형상을 갖도록 투명 또는 반투명으로 사출 성형하되, 상기 빛 투광 또는 확산판(1)의 배면에는 LED 기판 수납홈(1a)과 방수 링 삽입홈(1b)이 형성시켜 줌으로써 LED(2a)들에서 발생되는 빛은 투과 또는 확산시켜 줄 수 있고 외부에서 유입되는 각종 이물질과 우수의 유입은 차단할 수 있다.In this case, the light transmitting or diffusing plate 1 which is commonly used in the above two embodiments is injection molded into a transparent or translucent so as to have a square or disc shape, and the LED substrate is accommodated on the rear surface of the light transmitting or diffusing plate 1. By forming the groove 1a and the waterproof ring insertion groove 1b, the light generated from the LEDs 2a may be transmitted or diffused, and various foreign substances and rainwater flowing in from the outside may be blocked.
또, 상기 LED 기판(2)은 원하는 조도량에 부응하여 수개의 LED(2a)가 정해진 간격을 두고 납땜 고정된 형태를 갖도록 구성한 것으로, 이와 같은 LED 기판(2)은 상기 빛 투광 또는 확산판(1)의 배면에 형성된 LED 기판 수납홈(1a)에 수납 설치되어 외부에 별도로 설치되어 있는 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터(5a)나, 방열형 함체(6) 내에 실장된 전원 공급용 컨버터(5b)로부터 전원전압이 공급되면 조명에 필요한 빛을 발생시켜 주는 기능을 수행하게 된다.In addition, the LED substrate 2 is configured to have a shape in which several LEDs 2a are soldered and fixed at predetermined intervals in response to a desired illuminance amount, and the LED substrate 2 is formed of the light transmitting or diffusing plate ( 1) The current limiter or color controller and power supply converter 5a installed in the LED substrate accommodating groove 1a formed on the rear surface of the apparatus and the power supply mounted in the heat dissipation enclosure 6 are separately installed. When the power supply voltage is supplied from the converter 5b, it performs a function of generating light for illumination.
한편, 상기 방열체(3)는 대부분 알루미늄으로 성형하던 종래와 달리 열 확산도는 알루미늄보다 대략 1.7배 높으며 비중은 35%이상 낮고 가벼운 특성을 갖는 경금속계열 합금으로 다이케스팅을 통해 성형한 것으로, 그의 상면에는 도 1의 (a), 도 2의 (b) 및 6의 (a)(b)와 같이 사방으로 공기가 유통될 수 있도록 수개의 유선형 방열봉(3a)들을 정해진 간격 및 각도를 갖고 일체로 돌출 성형된 구성을 갖고 상기 LED 기판(2)의 배면에서 빛 투광 또는 확산판(1)의 배면에 저면이 밀착된 형태로 착탈 가능하게 고정 설치되어 LED(2a)에서 발생되는 열을 방열시켜 주는 기능을 수행하게 된다.On the other hand, the heat sink 3 is formed by die-casting a light metal series alloy having a light characteristic of about 1.7 times higher than aluminum and having a specific gravity of more than 35% and a lightness, unlike the prior art, mostly formed of aluminum, the upper surface Several streamlined heat dissipating rods 3a protrude integrally at predetermined intervals and angles such that air flows in all directions as shown in FIGS. 1A, 2B, and 6A, 6B. It has a molded configuration and is detachably fixed in a form in which the bottom surface is in close contact with the back of the light transmitting or diffusing plate 1 on the rear surface of the LED substrate 2 to dissipate heat generated from the LED 2a. Will be performed.
이때, 상기 방열체(3)를 구성하고 있는 경금속계열 합금은 열 확산 계수가 0.84[㎠/sec]이고, 열 전도도는 220-240[W/mK]이며, 밀도는 2.7[g/㎤]이고, 용융온도가 600-660[℃]이며, 비열은 0.9[J/gK]인 알루미늄과 달리, 열 확산 계수가 1.3-1.4[㎠/sec]이고, 열 전도도는 60-90[W/mK]이며, 밀도는 1.8±0.3[g/㎤]이고, 용융온도가 595[℃]이며, 비열이 1.02-1.05[J/gK]인 마그네슘 합금을 포함하여, 베릴륨과 티타늄, 두랄루민 및 탄소-알루미늄 복합소재 중 어느 한 소재로 성형하였다.At this time, the light metal alloy of the heat dissipating element 3 has a heat diffusion coefficient of 0.84 [cm 2 / sec], a thermal conductivity of 220-240 [W / mK], and a density of 2.7 [g / cm 3]. Unlike aluminum with melting temperature of 600-660 [℃], specific heat of 0.9 [J / gK], heat diffusion coefficient of 1.3-1.4 [cm2 / sec], thermal conductivity of 60-90 [W / mK] Beryllium and titanium, duralumin and carbon-aluminum composite, including a magnesium alloy having a density of 1.8 ± 0.3 [g / cm 3], a melting temperature of 595 [° C.], and a specific heat of 1.02-1.05 [J / gK]. Molded from any of the materials.
이와 같이 상기 방열체(3)를 마그네슘 합금이나 베릴륨과 티타늄, 두랄루민 및 탄소-알루미늄 복합소재를 포함하는 경금속계열 합금으로 성형, 특히 마그네슘 합금으로 성형하게 되면 방열체(3)의 밀도와 비열이 각각 1.8±0.3[g/㎤]와 1.02-1.05[J/gK]을 갖게 되므로 밀도와 비열이 각각 2.7[g/㎤]와 0.9[J/gK]를 갖는 알루미늄보다 작고, 또 열 확산 계수는 0.84[㎠/sec]인 알루미늄과 달리 1.3-1.4[㎠/sec]로 높으며, 또한 열 전도도에 있어서는 220-240[W/mK]를 갖는 알루미늄에 비해 60-90[W/mK]로 낮은 특성을 갖게 되어 알루미늄으로 성형한 방열체보다 적은 표면적으로도 열전자의 대기 방출 성능이 높게 되어 경금속계열 합금 중 하나인 마그네슘 합금으로 방열체(3)를 성형하게 되면 알루미늄으로 성형하는 것보다 대폭 경량화 및 소형화시킬 수 있는 것이다.As such, when the heat sink 3 is formed of a magnesium alloy or a light metal series alloy including beryllium and titanium, duralumin, and a carbon-aluminum composite material, in particular, a magnesium alloy is formed, the density and specific heat of the heat sink 3 are respectively increased. 1.8 ± 0.3 [g / cm 3] and 1.02-1.05 [J / gK], so the density and specific heat are smaller than those of aluminum having 2.7 [g / cm 3] and 0.9 [J / gK], respectively, and the thermal diffusion coefficient is 0.84. Unlike aluminum, which is [cm2 / sec], it is 1.3-1.4 [cm2 / sec] high and 60-90 [W / mK] lower than that of aluminum having 220-240 [W / mK]. When the heat sink 3 is formed from a magnesium alloy, which is one of the light metal series alloys, the heat dissipation performance of the hot electrons is higher than that of the heat sink formed of aluminum. It can be.
다만 방열 성능에 영향을 미치는 요소인 열전도성이, 220-240[W/mK]를 갖는 순수 알루미늄 및 100-160[W/mK]를 갖는 알루미늄 합금에 비해 60-90[W/mK]로 낮은 특성의 마그네슘으로 성형한 방열체의 방열 작용 구조의 구성은, 알루미늄 또는 알루미늄 합금의 경우처럼 박막 판 또는 미세 핀 형태가 아닌, 알루미늄 및 알루미늄 합금 기준 방열 작용의 열전도 작용 부분의 단면적을, 열전도성 비율만큼 대략 1.5 내지 2.5 이상 넓힌 기둥 형태로 설계하는 것이 매우 바람직하며, 본 발명에서는 그의 실현된 기술적 내용을 도면에 그 형태(도면 부호 3a 및 3d)를 도시하여 나타내고 있다. However, the thermal conductivity, a factor that affects heat dissipation performance, is 60-90 [W / mK] lower than that of pure aluminum with 220-240 [W / mK] and aluminum alloy with 100-160 [W / mK]. The structure of the heat dissipation structure of the heat radiator molded with the characteristic magnesium has the cross-sectional area of the heat conduction part of the heat dissipation action based on aluminum and aluminum alloys, which is not in the form of a thin plate or a fine fin, as in the case of aluminum or aluminum alloy. It is highly preferable to design the column shape wider than about 1.5 to 2.5, and in the present invention, the actual technical contents thereof are shown in the drawings by the shapes (3a and 3d).
뿐만 아니라, 본 발명에서는 상기 방열체(3)를 경금속계열 합금인 마그네슘 합금 등으로 다이케스팅 성형할 때 필요에 따라서는 도 1의 (b) 및 도 2의 (b)와 같이 상기 방열체(3)의 상면에 돌출 성형되는 유선형 방열봉(3a)들의 외주면에 수개의 방열돌기(3b)를 정해진 간격을 두고 더 돌출 성형하여 줌으로써 방열체(3)의 방열 표면적을 증대시킬 수 있으므로 동일 방열조건하에서 방열체(3) 자체의 체적은 줄일 수 있어 LED 조명 모듈에 대한 소형화에 더욱 유리하게 된다.In addition, in the present invention, when heat-casting the heat sink 3 into a magnesium alloy, such as a light metal alloy, the heat sink 3 as shown in FIGS. 1B and 2B as necessary. Since the heat dissipation surface area of the heat dissipating body 3 can be increased by further protruding several heat dissipating protrusions 3b on the outer circumferential surface of the streamlined heat dissipating rods 3a protrudingly formed on the upper surface of the heat dissipating body 3a, The volume of the sieve 3 itself can be reduced, which is more advantageous for miniaturization of the LED lighting module.
또한, 본 발명의 두 실시 예에서 공통으로 사용되고 있는 상기 방수 링(4)은 고무 또는 실리콘 등으로 성형한 것으로, 상기 빛 투광 또는 확산판(1)의 배면에 형성된 방수 링 삽입홈(1b)에 삽입 설치된 상태에서 상기 빛 투광 또는 확산판(1)의 배면과 방열체(3) 사이에 형성될 수 있는 틈새에 대한 기밀을 유지시켜 외부로부터 습기를 포함한 유수는 물론 각종 이물질이 유입되는 것을 방지하는 기능을 수행하게 된다. In addition, the waterproof ring 4 commonly used in the two embodiments of the present invention is formed of rubber or silicon, and is formed in the waterproof ring insertion groove 1b formed on the rear surface of the light transmitting or diffusing plate 1. In the installed state to maintain the air tightness of the gap formed between the back of the light transmitting or diffuser plate 1 and the heat sink 3 to prevent the inflow of moisture, including moisture from the outside, and various foreign matters It will perform the function.
또, 본 발명의 일 실시 예에서는 LED 조명 모듈 자체를 빛 투광 또는 확산판(1)과 LED 기판(2), 방열체(3) 및 방수 링(4)으로만 형성하고, 상기 LED 기판(2)에 설치되어 있는 LED(2a)의 구동에 필요한 전원 및 전류 제어는 LED 조명 모듈과 별개로 제작한 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터(5a)를 통해 제어할 수 있도록 한 형태를 갖는다.In addition, in an embodiment of the present invention, the LED lighting module itself is formed of only the light transmitting or diffusing plate 1 and the LED substrate 2, the heat sink 3 and the waterproof ring 4, and the LED substrate 2 Power and current control required for driving the LED 2a installed in the 1) may be controlled by a current limiter or a color controller and a power supply converter 5a separately manufactured from the LED lighting module. .
이때, 상기 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터(5a)는 상기 LED 기판(2)에 설치된 LED(2a)에 흐르는 전류를 제한하거나 또는 컬러를 제어하게 됨은 물론 LED(2a)의 구동에 필요한 전원전압을 공급시켜 주는 기능을 수행하게 된다.At this time, the current limiter or the color controller and the power supply converter 5a limit the current flowing through the LED 2a installed in the LED substrate 2 or control the color, as well as to drive the LED 2a. It performs the function of supplying the necessary power voltage.
이와 같은 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터(5a)는 LED 조명 모듈 자체가 단독 조명등 기구로 사용되는 계단 조명등이나 간판 간접 조명등 및 다운 라이트 등과 같은 조명등 기구에 적용시키는 것보다 도 9와 같이 다수개의 LED 조명 모듈이 일체로 설치되는 조명등 기구인 투광등이나, 보안등, 경관조명등, 하우스나 축사 또는 공장용 조명등 등과 같은 조명등 기구에 적용시키는 것이 더 바람직하다.Such a current limiter or a color controller and a power supply converter 5a may be applied to a lighting fixture such as a staircase lighting or a signage indirect lighting and a downlight where the LED lighting module itself is used as a single lighting fixture, as shown in FIG. 9. It is more preferable to apply to lighting fixtures such as floodlights, security lamps, landscape lighting, house or barn or factory lightings, in which a plurality of LED lighting modules are integrally installed.
한편, 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터(5a)를 적용한 본 발명의 일 실시 예와 달리 LED 조명 모듈 자체에 전원 공급용 컨버터(5b)를 직접 설치하는 다른 실시 예에서 사용되고 있는 방열형 함체(6)는 뚜껑체(61)가 구비된 사각 함체 형상을 갖도록 전도성/고분자 방열 수지재로 사출 성형한 형태를 갖고 상기 방열체(3)의 상면에 스크류(9)를 통해 착탈 가능하게 고정 설치되어 그 내부로 수납되는 전원 공급용 컨버터(5b)에서 발생되는 열을 포함하여 방열체(3)를 통해 전달되는 LED(2a)의 일부 잔열을 방열시켜 주는 기능을 수행하게 된다.On the other hand, unlike the embodiment of the present invention in which the current limiter or color controller and the power supply converter 5a is applied, the heat dissipation enclosure used in another embodiment in which the power supply converter 5b is directly installed in the LED lighting module itself. (6) is formed by injection molding of a conductive / polymer heat-dissipating resin material to have a rectangular housing shape provided with a lid 61 and detachably fixed to the upper surface of the heat dissipator 3 through a screw (9) And heats some residual heat of the LED 2a transmitted through the heat sink 3, including heat generated by the power supply converter 5b stored therein.
또한, LED 조명 모듈 자체에 구비된 전원 공급용 컨버터(5b)는 상기 방열형 함체(6) 내에 수납된 상태에서 LED 기판(2)에 설치된 LED(2a)의 구동에 필요한 전원전압을 공급시켜 주는 기능을 수행하게 된다.In addition, the power supply converter 5b provided in the LED lighting module itself supplies a power supply voltage for driving the LED 2a installed in the LED substrate 2 in the state of being housed in the heat dissipation enclosure 6. Will be performed.
이때, 상기 방열형 함체(6) 및 뚜껑체(61)를 사출 성형하기 위한 제료로는 탄소나노튜브(CNT)가 함유된 전도성/고분자 방열 수지재를 사용하였는데, 상기 탄소나노튜브(CNT)의 밀도와 비열이 각각 1.4±0.2[g/㎤]와 1.1±0.4[J/gK]을 갖게 되므로 밀도와 비열이 각각 2.7[g/㎤]와 0.9[J/gK]를 갖는 알루미늄보다 작고, 또 열 확산 계수는 0.84[㎠/sec]인 알루미늄과 달리 0.75-0.8[㎠/sec]로 비슷한 특성을 갖게 되므로 알루미늄으로 성형한 방열형 함체(6)보다 적은 표면적과 체적으로도 열전자의 대기 방출 성능이 높아지게 되어, 탄소나노튜브(CNT)가 함유된 전도성/고분자 방열 수지재로 방열 작용부가 제공되게 하면 알루미늄 판재 또는 철판재로 제공되는 것보다 경량화 및 소형화와 가공 제조 원가 절감에 기여할 수 있는 것이다.In this case, as a material for injection molding the heat dissipating enclosure 6 and the lid 61, a conductive / polymer heat dissipating resin material containing carbon nanotubes (CNT) was used, and the density of the carbon nanotubes (CNT) was used. And specific heat have 1.4 ± 0.2 [g / cm3] and 1.1 ± 0.4 [J / gK], respectively, so that density and specific heat are smaller than aluminum having 2.7 [g / cm3] and 0.9 [J / gK], respectively. The diffusion coefficient is 0.75-0.8 [cm 2 / sec], unlike the aluminum having 0.84 [cm 2 / sec], and thus the air emission performance of the hot electrons is increased even with a smaller surface area and volume than the heat-dissipating enclosure 6 formed of aluminum. When the heat dissipation action portion is provided by the conductive / polymeric heat dissipation resin material containing carbon nanotubes (CNT), it is possible to contribute to weight reduction and miniaturization and cost reduction in processing and manufacturing than those provided by aluminum plate or steel plate.
뿐만 아니라, 본 발명에서는 상기 방열형 함체(6)를 탄소나노튜브(CNT)가 함유된 전도성/고분자 방열 수지재로 사출 성형할 때 필요에 따라서는 도 2의 (a) 및 도 3과 같이 상기 방열형 함체(6)의 전,후 표면에도 정해진 간격을 두고 방열 표면적을 넓혀주기 위한 방열돌출부(6a)들을 더 돌출 성형하여 줌으로써 상기 방열형 함체(6)의 방열 표면적을 더 증대시킬 수 있어 동일 방열조건하에서 방열형 함체(6) 자체의 체적은 줄일 수 있어 LED 조명 모듈에 대한 소형화 및 경량화를 더욱 기대할 수 있다.In addition, in the present invention, when the heat-dissipating enclosure 6 is injection molded into a conductive / polymer heat-dissipating resin material containing carbon nanotubes (CNT), the heat dissipation type as shown in Figs. By further protruding the heat dissipation protrusions 6a for increasing the heat dissipation surface area at predetermined intervals on the front and rear surfaces of the enclosure 6, the heat dissipation surface area of the heat dissipation enclosure 6 can be further increased under the same heat dissipation conditions. Since the volume of the heat dissipation enclosure 6 itself can be reduced, miniaturization and light weight of the LED lighting module can be expected more.
상기한 알루미늄 및 알루미늄 합금 대비 마그네슘 합금과 탄소나노튜브(CNT)가 함유된 전도성/고분자 방열 수지재에 대한 열 확산 계수와 열 전도도, 밀도, 용융온도 및 비열 등의 재질학적 평균 특성을 도표로 비교하면 다음과 같다.Compare the thermal diffusion coefficient and material average properties such as thermal conductivity, density, melting temperature and specific heat for the conductive / polymer heat-dissipating resin containing magnesium alloy and carbon nanotube (CNT) compared to the aluminum and aluminum alloy Is as follows.
여기서 열 전도도라 함은 물질의 이동을 수반하지 않고 고온부에서 이것과 접하고 있는 저온부로 열이 전달되어 가는 현상을 말하며, 열전도에 의한 물체 내부에서의 열의 전달속도는 물질 내부에서의 온도구배(단위 길이당 온도차)에 비례하지만, 물질의 종류에 따라 큰 차이가 있다. Here, thermal conductivity refers to a phenomenon in which heat is transferred from a high temperature portion to a low temperature portion which is in contact with it without accompanying a movement of a substance, and a heat transfer rate of an inside of an object by heat conduction is a temperature gradient (unit length) within the material. Sugar temperature difference), but there is a big difference depending on the type of material.
또한 위 도표에서 나타내는 물질별 평균적 특성의 수치에 있어서, 방열작용과 방열 성능에 영향을 미치는 정도를 서술하자면, ?열 확산 계수?는 높을수록 좋으며 이는 방열 표면적을 축소 할 수 있는 장점을 제공하고; ?열 전도도?역시 높을수록 좋으며, 이는 방열 접촉 및 열전자 이동 역할을 하는 단면적을 축소시킬 수 있는 장점을 제공하고, 밀도와 비열은 낮을수록 좋으며 이는 방열 구조체(즉, 방열체와 방열형 함체)의 표면적 체적 무게를 축소시키는 장점을 제공한다.In addition, in the numerical value of the average characteristic of each material shown in the above chart, the degree of influence on the heat dissipation action and heat dissipation performance is described. The higher the heat spread coefficient is, the better the thermal dissipation surface area can be reduced; Higher thermal conductivity is also better, which provides the advantage of reducing the cross-sectional area that serves as thermal contact and thermal electron transfer, while lower density and specific heat are better, which is the surface area of the heat dissipation structure (i.e. heat sink and heat dissipation enclosure). It offers the advantage of reducing volume weight.
또한 위 도표에서 나타내는 물질들을 간략히 소개하자면, "카본나노튜브를 함유한 전도성/고분자 방열 수지재"는 미국의 듀폰사가 상용화의 선두 주자이며, 일본의 덴카사 및 유니티카주식회사 등등, 한국의 넥스텍사 및 애콜그린사 등이 개발하여 상용화하고 있으며, 신소재 분야로 각광을 받고 있는 물질이다. "마그네슘 합금"은 자동차 및 자전거 및 우주 항공 분야에 주로 사용되어지다가 합금 개량 개발 기술 및 성형 가공 기술 및 표면 처리 기술 등의 발전으로 가격이 많이 낮아져 무게를 낮춰야 하는 각종 방열 구조체에 적용되어지고 있으나, 엘이디 조명 분야에서는 열전도도가 낮은 문제로 적용이 미미한 실정이다.In addition, briefly introducing the materials shown in the above chart, "Conductive / Polymer Heat Dissipating Resin Containing Carbon Nanotubes" is a leader in commercialization of DuPont in the US, Nexatec Co., Ltd. of Japan, etc. And Acol Green Co., Ltd. have been developed and commercialized, the material is in the spotlight as a new material field. "Magnesium alloy" is mainly used in automobiles, bicycles and aerospace, but has been applied to various heat dissipation structures that need to be lowered due to low price due to the development of alloy improvement technology, molding processing technology and surface treatment technology. In the LED lighting field, the application of the thermal conductivity is insignificant due to the low problem.
"알루미늄"과 "알루미늄 합금"은 아주 익숙한 방열 재질이라 소개는 생략하고, 다만 알루미늄 합금은 순수 알루미늄에 비하여, 다양한 형태로 가공 할 수 있는 장점을 지닌 반면, 비열[J/gK]이 매우 커서 열 확산(열을 대기 중으로 방출하는)이 낮아지는 단점, 즉 부피와 체적과 무게가 커지는 단점이 있다."Aluminum" and "aluminum alloy" are very familiar heat dissipating materials, so the introduction is omitted. However, aluminum alloy has the advantage of being able to be processed in various forms compared to pure aluminum, while the specific heat [J / gK] is very large. The disadvantage is that diffusion (releasing heat into the atmosphere) is low, i.e., volume, volume and weight increase.
"탄소-알루미늄 복합 소재"는 미국의 나사, 일본의 에이엠테크놀로지사가 개발 상용화한 것으로서, 탄소(카본) 덩어리에 알루미늄을 녹여 스며들게 가공한 복합 소재로서, 비교적 방열 성능은 탁월 하지만, 가격 경쟁력 문제로 일부 고급 제품에만 채용되어 지고 있지만, 이 또한 한국의 포스코, 대만 및 중국의 소수 회사가 대발 및 상용화 단계에 있어 가격은 많이 하락 할 것으로 예상되며, 그에 따라 적용 범위도 많이 넓어질 것이라 예상한다. "Carbon-Aluminum Composite" is developed by American screw and Japan's AM Technology Co., Ltd., and is a composite material made by dissolving aluminum into carbon (carbon) mass. Although it is only used for high-end products, it is also expected that the price of the company will be greatly reduced as POSCO, Taiwan, and China's minority companies are in the stage of commercialization and commercialization.
예를 들면, 구리나 철과 같은 전기의 양도체에서는 열도 매우 빠르게 전달되지만, 황이나 플라스틱과 같은 전기적으로 절연체인 물질에서는 늦게 전달된다. 또 액체나 기체는 고체에 비해 매우 늦다. 이것은 열전도의 메커니즘이 각각의 물질에 따라 다르기 때문으로, 이것을 수치로 나타내는 데는 두께 1㎝의 물질 층의 양면에 1℃의 온도차를 두었을 때, 그 층의 1㎠의 넓이를 1초 사이에 통과하는 열량을 사용하며, 이것을 그 물질의 열전도도(Thermal conductivity)라고 한다.For example, heat transfers very quickly in electrical conductors such as copper and iron, but slower in electrically insulating materials such as sulfur and plastics. Liquids and gases are also very late compared to solids. This is because the mechanism of heat conduction differs for each material, and this is represented numerically by passing a width of 1 cm2 of the layer within 1 second when a temperature difference of 1 ° C. is placed on both sides of a layer of material 1 cm thick. The amount of heat used is called the thermal conductivity of the material.
일반적으로 그 값은 온도에 따라 다소 달라지는데, 물질의 종류에 따라 거의 정해진 값을 가지는 물질상수로 보아도 좋다. 또 금속의 열전도도와 전기전도도 사이에는 비례관계가 있으며, 동일 온도에서의 양쪽의 비는 금속의 종류에 관계없이 일정한 값을 가지고 있다는 사실이 1853년에 G.H.비데만과 R.프란츠에 의해 발견되어, 이것을 비데만-프란츠의 법칙이라고 한다.In general, the value varies slightly depending on the temperature, and may be regarded as a material constant having a nearly fixed value according to the type of material. In addition, there is a proportional relationship between the thermal and electrical conductivity of metals, and it was discovered by GH Bidemann and R. Franz in 1853 that both ratios at the same temperature had a constant value regardless of the type of metal. This is called the Bidemann-Franz's law.
이와 같이 금속 내의 열전도는 자유전자가 열을 고온부에서 저온부로 운동에너지 형태로 운반하기 때문에 일어나며, 이 때문에 금속의 열전도도는 높고, 열전도도와 전기전도도 사이에 상관관계가 나타난다. 온도가 더욱 높아지면 열전도도가 어느 정도 낮아지는 것은 자유전자의 운동이 결정격자의 열 진동에 의해 방해를 받기 때문인 것으로 알려져 있다. 한편 같은 자유전자를 가지지 않는 유전체(절연체)의 경우, 열에 의해 그 일부에 발생한 원자?분자의 진동이 일종의 파동성을 가져서 그것이 표면에서 반사되어 정상파를 만들며, 정상파 전체의 에너지가 균일하게 내부에너지를 높이는 작용원리에 의해 열을 전달한다.As such, the thermal conduction in the metal occurs because free electrons carry heat from the high temperature portion to the low temperature portion in the form of kinetic energy, which causes a high thermal conductivity of the metal and a correlation between the thermal conductivity and the electrical conductivity. It is known that the higher the temperature, the lower the thermal conductivity is because the movement of free electrons is disturbed by the thermal vibration of the crystal lattice. On the other hand, in the case of dielectrics (insulators) that do not have the same free electrons, the vibration of atoms and molecules generated in a part of them by heat has a kind of wave characteristic, which is reflected from the surface to create standing waves, and the energy of the standing waves is uniformly internal energy. Height transfers heat by the principle of action.
따라서, 본 발명에서는 방열 작용을 수행하는 구조물인 방열체(3)의 방열 구조 설계는 경량화 소형화 제조 원가 절감의 목적 달성을 위하여, 열전도도가 다소 낮고, 열확산도가 다소 높은 마그네슘 합금 등을 채용하기 때문에, 열전도도의 상승 효과을 위하여 열전달 통로의 단면적은 알루미늄 합금 대비 40~60[%] 정도 확대하고, 열 확산도가 좋으므로 표면적은 알루미늄 방열 구조 대비 30내지 50[%]로 정도 축소시키고, 공기의 통풍성을 높이기 위하여 360[°] 사방에서 공기의 유입 및 유출이 가능한 유선형 기둥 형태를 취하고, 모듈의 전체 구조에서 방열 작용 부분 전체가 외부로 노출되는 구조가 제공되게 설계되는 것이 바람직하다.Therefore, in the present invention, the heat dissipation structure design of the heat dissipation element 3, which is a structure that performs heat dissipation, is adopted to adopt a magnesium alloy having a relatively low thermal conductivity, a somewhat high thermal diffusivity, and the like, in order to achieve the purpose of weight reduction and miniaturization. Therefore, in order to increase the thermal conductivity, the cross-sectional area of the heat transfer path is increased by 40 to 60 [%] compared to that of the aluminum alloy, and since the thermal diffusivity is good, the surface area is reduced to about 30 to 50 [%] compared to the aluminum heat dissipation structure. In order to increase the ventilation, it is preferable to take a streamlined column shape capable of inflow and outflow of air from all sides of 360 [°], and to provide a structure in which the entire heat dissipating part is exposed to the outside in the entire structure of the module.
한편, 상기 방열형 함체(6)의 상면 개구부에 단순히 수개의 스크류(9)를 이용하여 뚜껑체(61)를 고정시킬 경우 이들의 틈새를 통해 외부로부터 습기 또는 각종 이물질이 유입되어 전원 공급용 컨버터(5b)의 구동에 지장을 줄 우려가 있다.On the other hand, when the lid 61 is fixed to the upper surface opening of the heat dissipation enclosure 6 simply by using a few screws 9, moisture or various foreign matters are introduced from the outside through these gaps, thereby providing a power supply converter ( There is a risk of disturbing the driving of 5b).
따라서, 본 발명에서는 상기 방열형 함체(6)의 상면 개구부 주연부와 뚜껑체(61)의 저면 사이에 방수 패킹(7)을 더 설치하여 외부로부터 방열형 함체(6)의 내부로 습기를 포함하여 각종 이물질이 유입되는 것을 방지할 수 있도록 하였다.Therefore, in the present invention, by further installing a waterproof packing 7 between the upper periphery of the upper opening of the heat dissipation enclosure 6 and the bottom of the lid 61, various foreign substances including moisture from the outside to the inside of the heat dissipation enclosure 6; It was to prevent the inflow.
또한, 본 발명에서는 상기 방열형 함체(6)의 뚜껑체(61) 저면 양측에는 상기 전원 공급용 컨버터(5b)의 양측면이 끼워져 걸려지도록 하는 기판 가이드 홈(61b)을 구비하고 방열형 함체(6)의 내부로 삽입되는 측판(61a)을 더 구비시켜 줌으로써 상기 전원 공급용 컨버터(5b) 자체가 방열형 함체(6)의 내부에 안정적으로 고정 설치된 상태를 유지하게 된다.In addition, in the present invention, both sides of the bottom surface of the lid body 61 of the heat dissipation enclosure 6 are provided with substrate guide grooves 61b for engaging both sides of the power supply converter 5b so that the heat dissipation enclosure 6 is provided. By further providing a side plate 61a inserted into the inside, the power supply converter 5b itself is stably fixed to the inside of the heat dissipation enclosure 6.
이때, 상기 뚜껑체(61)에 고정 설치된 상태에서 방열형 함체(6)의 내부로 수납된 전원 공급용 컨버터(5b)의 부품은 기판의 전면부에 설치된 형태를 가지므로 기판의 전면부와 방열형 함체(6)의 내벽 사이에는 충분한 공간부가 형성되나, 기판의 후면인 납땜부와 방열형 함체(6)의 내벽 사이의 공간부는 좁게 형성되어 납땜 부분과 방열형 함체(6)가 집적 접촉되어 전기적으로 단락될 우려가 있을 뿐만 아니라 납땜 부분에 대한 열 방출이 원활히 이루어지지 않을 우려가 있다.At this time, the components of the power supply converter 5b housed in the heat dissipation enclosure 6 in the state of being fixedly installed on the lid 61 have a form installed on the front side of the substrate, and thus the front part of the substrate and the heat dissipation enclosure. A sufficient space portion is formed between the inner wall of (6), but the space portion between the soldering portion, which is the rear side of the substrate, and the inner wall of the heat dissipating enclosure 6, is narrowly formed so that the soldered portion and the heat dissipating enclosure 6 may be electrically contacted and electrically shorted. In addition to the concern, there is a fear that heat dissipation to the soldered portion may not be smooth.
따라서, 본 발명에서는 상기 방열형 함체(6)의 뚜껑체(61)에 돌출 형성된 양 측판(61a)의 배면에 절연 차단막(61c)을 더 형성시켜 주어 납땜 부분과 방열형 함체(6) 사이에 대한 절연성을 향상 즉, 전원 공급용 컨버터(5b)의 납땜 부분과 방열형 함체(6) 사이에서 누전이 발생되는 것을 완벽히 차단할 수 있도록 하였다.Therefore, in the present invention, an insulating shielding film 61c is further formed on the rear surface of both side plates 61a protruding from the lid 61 of the heat dissipation-type enclosure 6 to provide insulation between the soldered portion and the heat dissipation-containing enclosure 6. That is, it was possible to completely block the occurrence of a short circuit between the soldered portion of the power supply converter (5b) and the heat dissipation enclosure (6).
뿐만 아니라, 본 발명에서는 상기 방열형 함체(6)의 뚜껑체(61) 상에는 전원 공급용 컨버터(5b)에 교류전원을 공급하기 위한 콘넥터 결합용 전원공급단자(62)를 설치하기 위하여 한 쌍 또는 두 쌍의 전원공급단자 설치공(61d)을 형성하였다.In addition, in the present invention, a pair or two in order to install a connector coupling power supply terminal 62 for supplying AC power to the power supply converter (5b) on the lid 61 of the heat dissipation enclosure (6) A pair of power supply terminal mounting holes 61d was formed.
이때, 상기 방열형 함체(6)의 뚜껑체(61) 상에 형성시킨 전원공급단자 설치공(61d)이 한 쌍인 경우 도 8과 같이 교류전원 공급선 및 점프선이 일체로 구비된 콘넥터(10)를 이용하여 LED 조명 모듈의 방열형 함체(6) 외부에서 서로 인접된 LED 조명 모듈에 교류전원을 점프시켜 주기 위하여 "I"자 형상을 갖는 콘넥터 결합용 전원공급단자(62)를 설치하였다.At this time, when there is a pair of power supply terminal installation holes 61d formed on the lid 61 of the heat dissipation enclosure 6, as shown in FIG. 8, an AC power supply line and a jump line are integrally provided. In order to jump AC power to the LED lighting modules adjacent to each other outside the heat dissipation enclosure 6 of the LED lighting module, a power supply terminal 62 for connector coupling having an “I” shape was installed.
그러나, 상기 방열형 함체(6)의 뚜껑체(61) 상에 형성시킨 전원공급단자 설치공(61d)이 두 쌍인 경우에는 도 5의 (a)(b) 및 7과 같이 서로 인접된 LED 조명 모듈에 교류전원 공급선을 점프시켜 주기 위해 각 쌍에 "ㄷ"자 형상으로 절곡 성형한 콘넥터 결합용 전원공급단자(62)를 설치하여 수개의 LED 조명 모듈이 설치되는 조명등 기구에서 각각의 LED 조명 모듈에 교류전압을 공급시켜 주는데에 따른 불편함을 해소시킬 수 있도록 한다.However, in the case of two pairs of power supply terminal mounting holes 61d formed on the lid 61 of the heat dissipation enclosure 6, adjacent LED lighting modules as shown in FIGS. In order to jump the AC power supply line in each pair, the power supply terminal 62 for coupling the connector bent and formed into a "c" shape is installed in each pair, so that each LED lighting module is installed in a lighting device having several LED lighting modules. The inconvenience caused by supplying AC voltage can be eliminated.
한편, 본 발명에서는 상기 방열체(3)의 유선형 방열봉(3b) 중 일측 중심선 상에서 서로 대향된 위치에 있는 두 개의 유선형 방열봉(3b) 상면에 소정깊이로 가이드 홈(3c)을 형성하고, 또 상기 방열형 함체(6)의 저면 중 일측 중심선 상에서 양측에는 상기 유선형 방열봉(3b)의 가이드 홈(3c)에 끼워져 걸리는 가이드 봉(6b)을 더 돌출되게 설치하여 주었다.On the other hand, in the present invention, the guide groove (3c) is formed on the upper surface of the two streamlined heat-dissipating rod (3b) in a position opposite to each other on one side centerline of the streamlined heat-dissipating rod (3b) of the heat dissipator (3), In addition, on one side of the bottom of the heat dissipation enclosure 6, the guide rod 6b, which is fitted to the guide groove 3c of the streamlined heat dissipation rod 3b, was installed to protrude on both sides.
따라서 상기 방열형 함체(6)를 방열체(3)의 상면에 올려놓고 스크류(9)를 이용하여 고정 설치할 때 상기 유선형 방열봉(3b)의 가이드 홈(3c)에 방열형 함체(6)의 가이드 봉(6b)이 끼워져 걸리게 되므로 방열형 함체(6)의 오결합이 방지됨은 물론 방열형 함체(6)의 고정시 방열체(3)의 상면에서 회동되는 것을 완벽히 방지할 수 있어 방열형 함체(6)의 조립을 보다 간편하고 완벽하게 할 수 있는 것이다.Therefore, when the heat dissipation enclosure 6 is placed on the upper surface of the heat dissipation body 3 and fixedly installed using the screw 9, the guide rod of the heat dissipation enclosure 6 is guided to the guide groove 3c of the streamlined heat dissipation rod 3b. Since the 6b is inserted and caught, the misalignment of the heat dissipation enclosure 6 can be prevented and the rotation of the heat dissipation enclosure 6 can be completely prevented when the heat dissipation enclosure 6 is fixed. It will be easier and more complete.
또한, 본 발명에서는 또 다른 방안으로 상기 방열체(3)의 중앙에 돌출 성형된 방열 겸 전선 통과봉(3d) 자체를 장방형으로 형성하고, 상기 방열형 함체(6)의 저면 중앙에는 방열 겸 전선 통과봉 결합홈(6c)을 형성하여 줌으로써 상기 방열형 함체(6)를 방열체(3)의 상면에 올려놓고 스크류(9)를 이용하여 고정 설치하고자 할 때 평단면이 장방형 형상을 갖는 상기 방열 겸 전선 통과봉(3d)의 상단 일부가 상기 방열형 함체(6)의 방열 겸 전선 통과봉 결합홈(6c)에 끼워지게 되므로 방열형 함체(6)의 오결합이 방지됨은 물론 상기 방열형 함체(6)의 고정시 방열체(3)의 상면에서 회동되는 것이 완벽히 방지되어 방열형 함체(6)의 조립을 보다 간편하고 완벽하게 할 수 있는 것이다.In addition, according to the present invention, a heat dissipation cum wire passing rod 3d itself protrudingly formed in the center of the heat dissipation body 3 is formed in a rectangular shape, and a heat dissipation cum wire passing through the bottom surface of the heat dissipation enclosure 6 is provided. The heat dissipation and electric wire having a flat cross section having a rectangular shape when a rod coupling groove 6c is formed and the heat dissipation enclosure 6 is placed on the top surface of the heat dissipation body 3 and fixedly installed using a screw 9. Part of the upper end of the passing rod (3d) is inserted into the heat dissipation and wire through-rod coupling groove (6c) of the heat dissipation enclosure (6), thereby preventing the misalignment of the heat dissipation enclosure (6) as well as fixing the heat dissipation enclosure (6). It is completely prevented from being rotated on the upper surface of the heat dissipation body 3, so that the assembly of the heat dissipation enclosure 6 can be made more simply and completely.
또, 본 발명에서는 LED 조명 모듈 자체를 일반전구와 같이 소켓에 나사 결합시킬 수 있는 조명등 기구로 사용하고자 할 때, 상기 방열형 함체(6)의 뚜껑체(61) 상면 중앙에 도 12와 같이 일반 전구에 설치된 것과 동일한 나선형 소켓 결합구(11)를 절연기능과 접착기능을 동시에 구비한 접착제를 이용하여 일체로 고정 설치하여 줌으로써 상기 나선형 소켓 결합구(11)를 통해 방열형 함체(6) 내에 설치되어 있는 전원 공급용 컨버터(5b)에 교류전압을 원활히 공급시켜 줄 수 있을 뿐만 아니라, LED 조명 모듈 자체를 일반전구와 같이 소켓에 나사 결합시켜 단독 조명등 기구로 널리 사용되고 있는 계단 조명등이나 간판 간접 조명등 및 다운 라이트 등과 같은 조명등 기구의 전등으로 사용할 수 있다.In addition, in the present invention, when the LED lighting module itself is to be used as a lighting fixture that can be screwed into the socket, such as a general bulb, a general bulb as shown in Figure 12 in the center of the upper surface of the lid body 61 of the heat dissipation enclosure (6) It is installed in the heat dissipating enclosure (6) through the spiral socket coupler (11) by fixedly installing the same spiral socket coupler (11) installed at the same time using an adhesive having both insulating and adhesive functions. Not only can supply AC voltage to power supply converter 5b smoothly, but also the LED lighting module itself is screwed into the socket like a general bulb, so that it is a staircase lamp, indirect lamp, and down light widely used as a single light fixture. Can be used as a light fixture for lighting fixtures.
또한, 본 발명에서는 상기 빛 투광 또는 확산판(1)의 주연부에서 소정 간격을 두고 또는 각 모서리에 스크류 결합홈(1c)을 각각 천공하여 주었다.In addition, in the present invention, the screw coupling grooves 1c are drilled at the edges of the light transmitting or diffusing plate 1 at predetermined intervals or at each corner thereof.
즉, LED 조명 모듈 자체를 각종 조명등 기구(예를 들어 다수개의 LED 조명 모듈이 일체로 설치되는 투광등이나, 보안등, 경관조명등, 하우스나 축사 또는 공장용 조명등 등)의 모듈 고정판(8)에 천공된 방열체 통과공(8a)에 방열체(3)를 끼운 상태에서 도 7 내지 도 9와 같이 방열체 통과공(8a)의 주연부에 걸려진 빛 투광 또는 확산판(1) 자체를 스크류(9)로 고정시켜 주거나, 또는 도 13과 같이 소정 형상을 갖는 소켓 결합겸 통풍 지지구(12)를 스크류(9)를 통해 빛 투광 또는 확산판(1)에 고정시켜 주기 위하여 상기 빛 투광 또는 확산판(1)의 주연부에서 소정 간격을 두고 또는 각 모서리에 스크류 결합홈(1c)을 각각 더 천공시켜 주었다.That is, the LED lighting module itself is attached to the module fixing plate 8 of various lighting fixtures (for example, a floodlight, a security lamp, a landscape lighting lamp, a house, a barn, or a factory lighting lamp) in which a plurality of LED lighting modules are integrally installed. In the state in which the radiator 3 is inserted into the perforated radiator through hole 8a, the light transmitting or diffusing plate 1 itself caught on the periphery of the radiator through hole 8a as shown in FIGS. 9), or the light transmission or diffusion to fix the socket coupling and the ventilation support 12 having a predetermined shape as shown in FIG. 13 to the light transmission or diffuser plate 1 through the screw (9) At the periphery of the plate 1, screw coupling grooves 1c were further drilled at predetermined intervals or at each corner.
이때, 상기한 소켓 결합겸 통풍 지지구(12)는 도 13과 같이 나선형 소켓 결합구(12a)와 합성수지재를 이용하여 사출 성형한 통풍 지지구(12b)로 이루어진 것으로, 상기 나선형 소켓 결합구(12a)는 전원 공급용 컨버터(5b)에 교류전압을 공급시켜 줌은 물론 LED 조명 모듈 자체를 일반전구와 같이 소켓에 나사 결합되는 기능을 수행하고, 상기 통풍 지지구(12b)는 나선형 소켓 결합구(12a)의 저면에 일체로 고정 설치되는 몸체(12b-1)의 주연부에서 정해진 간격을 두고 하방부를 향해 수개의 다리(12b-2)가 돌출 형성되되, 상기 다리(12b-2)들의 저단부에는 상기 빛 투광 또는 확산판(1)에 형성된 스크류 결합홈(1c)에 결합되는 스크류(9)가 통과되는 스크류 통과공(12b-3)이 천공된 형태를 가지고 있다.At this time, the socket coupling and the ventilation support 12 is composed of a ventilation support 12b injection-molded using a spiral socket coupling tool 12a and a synthetic resin material, as shown in FIG. 12a) supplies an AC voltage to the converter 5b for power supply as well as performs a function of screwing the LED lighting module itself into a socket like a general electric bulb, and the ventilation support 12b is a spiral socket coupler. At the periphery of the body 12b-1, which is fixedly installed on the bottom of 12a, several legs 12b-2 are formed to protrude downwardly at predetermined intervals, and the lower ends of the legs 12b-2 are formed. The screw through hole (12b-3) through which the screw (9) coupled to the screw coupling groove (1c) formed in the light transmitting or diffusing plate (1) is passed through.
따라서, 상기 소켓 결합겸 통풍 지지구(12) 자체가 방열체(3) 및 방열형 함체(6)의 방열기능에는 전혀 지장을 지주 않은 상태(즉, 공기의 흐름을 전혀 방해하지 않은 상태)에서 LED 조명 모듈 자체를 일반전구와 같이 소켓에 나사 결합시킬 수 있으므로 소켓 결합겸 통풍 지지구(12)가 구비된 LED 조명 모듈 자체를 단독 조명등 기구로 널리 사용되고 있는 계단 조명등이나 간판 간접 조명등 및 다운 라이트 등과 같은 조명등 기구의 전등으로 사용할 수 있는 것이다.Therefore, the socket coupling and the ventilation support 12 itself does not interfere at all with the heat dissipation function of the heat dissipating body 3 and the heat dissipating enclosure 6 (that is, the state does not interfere with the flow of air at all). Since the lighting module itself can be screwed into the socket like a general electric bulb, the LED lighting module itself equipped with the socket coupling and the ventilation support 12 is used as a single lighting device such as a stair lamp, a signboard indirect light, and a down light. It can be used as a light fixture.
한편, 본 발명에서는 상기 방열형 함체(6)의 양측면 저부에 평단면이 "ㄷ"자 형상을 갖는 고정구 결합구(6d)를 일체로 더 돌출 성형하여, 수개의 LED 조명 모듈을 모듈 고정판(8)에 고정 설치시켜 투광등이나, 보안등, 경관조명등, 하우스나 축사 또는 공장용 조명등 등과 같은 고출력 조명등 기구를 제작하고자 할 때에는 도 10의 (a) 및 도 11의 (a)와 같이 소정 형상을 갖는 탄성 고정구(13)를 고정구 결합구(6d)에 결합시켜 모듈 고정판(8) 자체에 LED 조명 모듈들을 일체로 고정시킬 수 있도록 결합시키거나, 또는 도 14 및 도 15와 같이 LED 조명 모듈 자체의 빛 조사각도를 조절하기 위해 빛 각도 조절수단(14)을 결합시킬 수 있도록 하였다.On the other hand, in the present invention by integrally further protruding molding fixture fastener (6d) having a flat surface in the bottom surface of both sides of the heat dissipation-type enclosure (6) "c" shape, several LED lighting module module fixing plate (8) In order to manufacture high-power lighting fixtures such as floodlights, security lamps, landscape lighting lamps, house or barn or factory lighting lamps, they have a predetermined shape as shown in FIGS. 10 (a) and 11 (a). The elastic fastener 13 is coupled to the fastener coupler 6d so as to be integrally fixed to the module fixing plate 8 itself so as to integrally fix the LED lighting modules, or the light of the LED lighting module itself as shown in FIGS. 14 and 15. The light angle adjusting means 14 can be coupled to adjust the irradiation angle.
이때, 상기 탄성 고정구(13)는 도 10의 (a)와 같이 소정 폭과 길이를 갖도록 절단한 철판을 이용하여 "π" 형상의 탄성 고정편(13a)과 평판부(13b) 및 판 스프링부(13c)가 일체로 구비된 형태를 갖도록 성형할 수 있고, 또 도 11의 (a)와 같이 소정 지름과 길이를 갖는 강선을 이용하여 한 쌍의 탄성 걸림고리(13e)와 평면부(13f), 한 쌍의 간격 유지부(13g) 및 스프링부(13h)가 일체로 구비되도록 성형할 수도 있다.At this time, the elastic fastener 13 is an elastic fixing piece 13a, a flat plate portion 13b, and a leaf spring portion having a "π" shape using an iron plate cut to have a predetermined width and length as shown in FIG. The pair of elastic locking rings 13e and the flat portion 13f may be formed to have a form in which the 13c is integrally formed, and using a steel wire having a predetermined diameter and length as shown in FIG. In addition, the pair of spacers 13g and the spring portion 13h may be molded to be integrally provided.
상기한 두 실시 예 중 도 10의 (a)와 같이 소정 폭과 길이를 갖도록 절단한 철판을 이용하여 절곡 성형한 탄성 고정구(13)는, 상부 평판부(13b)를 중심으로 그 내측에 상기 고정구 결합구(6d) 내측에 끼워져 탄력적으로 걸려지는 탄성 고정편(13a)이 "π" 형상으로 성형되고, 상기 평판부(13b)의 외측에는 상기 고정구 결합구(6d) 외측을 덮는 형태로 지나 그 저단부 일부가 만곡지게 절곡된 형태에서 도 10의 (b)와 같이 모듈 고정판(8)의 내면 일부까지 탄력적으로 밀착된 형태를 갖는 판 스프링부(13c)가 일체로 성형된 형태를 갖게 되는데, 이때 상기 판 스프링부(13c)의 상부에는 필요에따라 분해용 공구를 결합시켜 강제로 분해하기 위한 공구 결합공(13d)을 더 천공시켜 준 형태를 갖는다.Of the two embodiments, as shown in FIG. 10 (a), the elastic fastener 13 bent and formed using an iron plate cut to have a predetermined width and length has an inner side of the fastener about the upper plate portion 13b. An elastic fixing piece 13a, which is fitted inside the coupling member 6d and is elastically hung, is shaped into a "π" shape, and the outer side of the flat plate 13b passes in the form of covering the outer side of the fixing member coupling tool 6d. In the form in which the lower end portion is bent in a curved manner, as shown in FIG. 10 (b), the leaf spring portion 13c having a form elastically in close contact with a portion of the inner surface of the module fixing plate 8 is integrally formed. In this case, the upper portion of the leaf spring portion 13c has a form in which a tool coupling hole 13d for forcibly disassembling by forcibly disassembling by coupling the disassembly tool is necessary.
이와 같은 형태를 갖는 탄성 고정구(13)를 이용하여 모듈 고정판(8)에 천공된 방열체 통과공(8a)에 방열체(3)가 끼워지도록 LED 조명 모듈들을 결합한 다음 상기 방열형 함체(6)의 양측면에 성형된 고정구 결합구(6d)의 내측으로 판 스프링 형태를 갖는 상기 탄성 고정구(13)의 "π"형 탄성 고정편(13a)을 끼워 결합시키게 되면 "π" 형상을 갖는 상기 탄성 고정편(13a)의 걸림돌기가 고정구 결합구(6d)의 저면 양측에 각각 탄력적으로 걸려져 고정됨과 동시에, 상기 탄성 고정구(13)의 평판부(13b) 외측에 절곡 성형된 판 스프링부(13c)가 상기 고정구 결합구(6d) 외측을 덮는 형태로 지나 저단부 일부가 만곡지게 절곡된 형태에서 도 10의 (b)와 같이 모듈 고정판(8)의 내면 일부까지 탄력적으로 밀착된 형태를 갖게 되므로 LED 조명 모듈들이 모듈 고정판(8)에 완벽한 고정상태를 유지하게 됨은 물론 LED 조명 모듈들을 모듈 고정판(8)에 고정시키는 작업을 매우 간편하게 실시할 수 있다.By using the elastic fastener 13 having the shape as described above, the LED lighting modules are combined so that the heat sink 3 is fitted into the heat sink through hole 8a which is perforated in the module fixing plate 8, and then the When the "π" type elastic fixing piece 13a of the elastic fixture 13 having a leaf spring shape is fitted into the inside of the fixture coupling member 6d formed on both sides, the elastic fixing piece having a "π" shape. At the same time, the latching projection of 13a is elastically hung on both sides of the bottom of the fastener coupler 6d, and at the same time, the leaf spring portion 13c bent to the outside of the flat portion 13b of the elastic fastener 13 is LED light module because it has a form that covers the outside of the fastener coupler (6d) and the lower end portion is bent in a curved shape to a part of the inner surface of the module fixing plate 8 as shown in Figure 10 (b) Secured to the module mounting plate (8) Doemeun remains can of course be carried out the operation for fixing the LED lighting module in the module fixing plate 8 is very simple.
또한, 상기한 두 실시 예 중 도 11의 (a)와 같이 소정 지름과 길이를 갖는 강선을 이용하여 절곡 성형한 상기 탄성 고정구(13)는, 상부 내측에 상기 고정구 결합구(6d)의 내측으로 끼워져 탄력적으로 걸려지는 한 쌍의 탄성 걸림고리(13e)가 형성되고, 상부에는 고정구 결합구(6d)의 상면부를 감싸는 평면부(13f)가 형성되며, 상기 평면부(13f)의 외측에서 하방부를 향해서는 상기 탄성 걸림고리(13e)들의 간격이 일정간격을 유지되게 하는 한 쌍의 간격 유지부(13g)가 절곡 형성되고, 상기 간격 유지부(13g)의 저부로는 상기 고정구 결합구(6d) 외측을 지나 그 저단부 일부가 만곡지게 절곡된 형태에서 모듈 고정판(8)의 내면 일부까지 탄력적으로 접촉된 형태를 갖는 스프링부(13h)가 일체로 절곡 형성한 형태를 갖는다.In addition, the elastic fastener 13 bent and formed using a steel wire having a predetermined diameter and length, as shown in FIG. A pair of elastic locking rings 13e are formed to be fitted and elastically hooked, and a flat portion 13f surrounding the upper surface portion of the fastener coupler 6d is formed at an upper portion thereof, and a lower portion is formed outside the flat portion 13f. Towards, a pair of gap holding portions 13g are formed to be bent so that the gap between the elastic catching rings 13e is maintained at a constant interval, and the fastener coupler 6d is formed at the bottom of the gap holding portions 13g. A spring portion 13h having a form in which the lower end portion is bent in a curved manner through the outside and elastically contacted to a portion of the inner surface of the module fixing plate 8 is integrally bent.
이와 같이 강선 스프링 형태를 갖는 탄성 고정구(13)를 이용하여 LED 조명 모듈들을 모듈 고정판(8)에 고정시키고자 할 때에도, 한 쌍의 탄성 걸림고리(13e)를 방열형 함체(6)의 고정구 결합구(6d) 내측으로 끼워 결합시키게 되면 한 쌍의 탄성 걸림고리(13e)가 고정구 결합구(6d)의 저면에 각각 탄력적으로 걸려져 고정됨과 동시에, 상기 탄성 고정구(13)의 평면부(13f) 외측에 절곡 성형된 한 쌍의 간격 유지부(13g)와 스프링부(13h) 일부가 상기 고정구 결합구(6d) 외측을 덮는 형태를 갖고 상기 스프링부(13h)의 나머지 일부는 만곡지게 절곡된 형태에서 도 11의 (b)와 같이 모듈 고정판(8)의 내면 일부까지 탄력적으로 밀착된 형태를 갖게 되므로 LED 조명 모듈들이 모듈 고정판(8)에 완벽한 고정상태를 유지하게 됨은 물론 LED 조명 모듈들을 모듈 고정판(8)에 고정시키는 작업을 매우 간편하게 실시할 수 있는 것이다.As described above, even when the LED lighting modules are fixed to the module fixing plate 8 by using the elastic fastener 13 having the shape of the steel wire spring, the pair of elastic catching rings 13e is fixed to the fastener coupler of the heat dissipating enclosure 6. (6d) When the inner ring is engaged with each other, a pair of elastic locking rings 13e are elastically fastened and fixed to the bottom surface of the fastener coupler 6d, respectively, and the outer side of the flat portion 13f of the elastic fastener 13 is fixed. The pair of gap retaining portions 13g and the spring portion 13h which are bent to have a form covering the outside of the fastener coupler 6d and the remaining portion of the spring portion 13h are bent in a curved manner As shown in (b) of FIG. 11, the part of the inner surface of the module fixing plate 8 is elastically in close contact with each other, and thus, the LED lighting modules maintain a perfect fixing state to the module fixing plate 8 as well as the LED lighting modules. 8) small to fixed I can perform up very easily.
한편, 상기 빛 각도 조절수단(14)은 도 14와 같이 한 쌍의 탄성형 연결구(14a)와 지지구(14c) 및 고정판(14d)으로 구성된 형태를 갖게 되는데, 이때 상기한 한 쌍의 탄성형 연결구(14a)는 소정 폭과 길이를 갖도록 절단한 철판을 "U"자 형상으로 절곡 성형하되, 저부에는 상기 방열형 함체(6)의 고정구 결합구(6d)가 끼워져 고정되는 결합구 고정부(14b)를 일체로 구비하고 상기 방열형 함체(6)의 고정구 결합구(6d)에 착탈 가능하게 결합되는 형태를 갖는다.On the other hand, the light angle adjusting means 14 has a form consisting of a pair of elastic connector 14a, a support 14c and a fixed plate 14d as shown in Figure 14, wherein the pair of elastic type The connector 14a is formed by bending the iron plate cut to have a predetermined width and length into a “U” shape, and the fitting fixture 14b to which the fixture fitting 6d of the heat dissipating enclosure 6 is fitted and fixed at the bottom thereof. ) Is integrally formed and detachably coupled to the fastener coupler 6d of the heat dissipation enclosure 6.
또, 상기 지지구(14c)는 소정 폭과 길이를 갖도록 절단한 철판을 "ㄷ"자 형상으로 절곡 형성시킨 형태를 갖고 양 단부에 일체로 절곡 형성된 고정편(14c-1)이 상기 탄성형 연결구(14a)들의 자유 단부 틈새에 끼워져 볼트(14e)와 나비 너트(14f)를 통해 각도 조절 가능하게 결합되는 형태를 가지며, 상기 고정판(14d)는 지지구(14c)의 중앙에 착탈 가능하게 고정되어 LED 조명 모듈을 포함하여 빛 각도 조절수단(14) 자체를 벽과 같은 고정구에 착탈 가능하게 고정시켜 주는 기능을 갖는다.In addition, the support 14c has a form in which the iron plate cut to have a predetermined width and length is formed in a "c" shape, and the fixing piece 14c-1 integrally bent at both ends is the elastic connector. It is inserted into the gap between the free end of the (14a) has a form that is angularly coupled through the bolt 14e and the butterfly nut 14f, the fixing plate 14d is detachably fixed to the center of the support 14c Including the LED lighting module has a function of detachably fixing the light angle adjusting means 14 itself to a fixture such as a wall.
이와 같은 상기 빛 각도 조절수단(14)은 한 쌍의 탄성형 연결구(14a)와 지지구(14c)의 연결부에 설치된 나비 너트(14f)를 푼 다음 LED 조명 모듈 자체를 볼트(14e)를 힌지로 이용하여 도 15와 같이 원하는 각도로 조절시켜 원하는 빛 조사각을 설정한 다음 다시 나비 너트(14f)를 조여주면 되므로 본 발명의 LED 조명 모듈이 적용된 각종 종면등 기구 중 간판 간접 조명등이나 경관조명등 등에 적용하면 좋다.The light angle adjusting means 14 as described above loosens the butterfly nut 14f installed at the connection portion of the pair of elastic connector 14a and the support 14c, and then hinges the LED lighting module itself with the bolt 14e. By adjusting the desired angle to the desired angle as shown in Figure 15 by using, and then tighten the butterfly nut (14f) again, so applied to the signage indirect lighting or landscape lighting, etc. of various longitudinal lighting fixtures to which the LED lighting module of the present invention is applied. Do it.
한편, 도 16의 (a)는 본 발명의 LED 조명 모듈들을 이용하여 원형 반사갓을 갖는 투광등인 공장 및 고천정 고정등 등을 제조한 상태의 저면도를 예시한 것이고, 도 16의 (b)는 본 발명의 LED 조명 모듈들을 이용하여 사각형 투광등인 운동장이나 골프장, 항구 및 무대 조명등 등을 제조한 상태의 저면도를 예시한 것이다.On the other hand, Figure 16 (a) illustrates a bottom view of a state of manufacturing a factory and high ceiling fixtures, such as a floodlight having a circular reflector using the LED lighting modules of the present invention, Figure 16 (b) Figure 5 illustrates a bottom view of a state of manufacturing a playground or golf course, a port, and a stage lighting, such as a square floodlight using the LED lighting modules of the present invention.
상술한 실시 예는 본 발명의 가장 바람직한 예에 대하여 설명한 것이지만, 상기 실시 예에만 한정되는 것은 아니며, 본 발명의 기술사상을 벗어나지 않는 범위 내에서 다양한 변형이 가능하다는 것은 당업자에게 있어서 명백한 것이다.Although the above-described embodiments have been described with respect to the most preferred embodiments of the present invention, it is not limited to the above embodiments, and it will be apparent to those skilled in the art that various modifications can be made without departing from the technical spirit of the present invention.

Claims (23)

  1. 단독으로 조명등 기능을 수행하거나, 소정 면적을 갖는 모듈 고정판에 수개가 고정 설치하여 원하는 출력을 갖는 각종 조명등 기구를 구성하는데 사용되는 LED 조명 모듈을 구성함에 있어서,In the configuration of the LED lighting module that is used to perform a lighting function alone, or fixedly installed in the module fixing plate having a predetermined area to configure various lighting fixtures having a desired output,
    사각 또는 원판형상을 갖고 배면에는 LED 기판 수납홈과 방수 링 삽입홈이 형성된 형태에서 LED들에서 발생되는 빛은 투과 또는 확산시키고 외부에서 유입되는 각종 이물질과 우수의 유입은 차단하는 빛 투광 또는 확산판과;Light-transmitting or diffuser plate that has a square or disc shape and the LED substrate receiving groove and the waterproof ring insertion groove are formed on the back to transmit or diffuse the light generated from the LEDs and to block the inflow of various foreign substances and rainwater from the outside. and;
    상기 빛 투광 또는 확산판의 LED 기판 수납홈 내에 설치되어 전류 제한기 또는 컬러 제어기 및 전원 공급용 컨버터의 제어를 받아 조명에 필요한 빛을 발생시켜 주는 LED 기판과;An LED substrate installed in the LED substrate receiving groove of the light transmitting or diffusing plate to generate light for illumination under the control of a current limiter or a color controller and a power supply converter;
    다이케스팅을 통해 사방으로 공기가 유통될 수 있도록 수개의 유선형 방열봉들이 상면에 일체로 돌출 형성되도록 경금속계열 합금으로 성형한 구성을 갖고 상기 LED 기판의 배면에서 빛 투광 또는 확산판의 배면에 저면이 밀착된 형태로 착탈 가능하게 고정 설치되어 발광다이오드에서 발생되는 열을 방열시켜 주는 방열체와;In order to allow air to flow in all directions through die casting, several streamlined heat-dissipating rods are formed of a light metal series alloy so as to protrude integrally on the upper surface, and the bottom of the LED substrate is closely adhered to the bottom of the light transmission or diffuser plate. A heat dissipator fixedly installed in a detachable form to dissipate heat generated from the light emitting diodes;
    상기 빛 투광 또는 확산판 배면의 방수 링 삽입홈에 삽입 설치되어 상기 빛 투광 또는 확산판의 배면과 방열체 사이의 기밀을 유지시켜 주는 방수 링;으로 구성한 것을 특징으로 하는 발광다이오드 조명 모듈.And a waterproof ring inserted into the waterproof ring insertion groove of the back of the light transmitting or diffusing plate to maintain the airtightness between the back of the light transmitting or diffusing plate and the radiator.
  2. 단독으로 조명등 기능을 수행하거나, 소정 면적을 갖는 모듈 고정판에 수개가 고정 설치하여 원하는 출력을 갖는 각종 조명등 기구를 구성하는데 사용되는 LED 조명 모듈을 구성함에 있어서,In the configuration of the LED lighting module that is used to perform a lighting function alone, or fixedly installed in the module fixing plate having a predetermined area to configure various lighting fixtures having a desired output,
    사각 또는 원판형상을 갖고 배면에는 LED 기판 수납홈과 방수 링 삽입홈이 형성된 형태에서 LED들에서 발생되는 빛은 투과 또는 확산시키고 외부에서 유입되는 각종 이물질과 우수의 유입은 차단하는 빛 투광 또는 확산판과;Light-transmitting or diffuser plate that has a square or disc shape and the LED substrate receiving groove and the waterproof ring insertion groove are formed on the back to transmit or diffuse the light generated from the LEDs and to block the inflow of various foreign substances and rainwater from the outside. and;
    상기 빛 투광 또는 확산판의 LED 기판 수납홈 내에 설치되어 전원 공급용 컨버터로부터 전원전압이 공급되면 조명에 필요한 빛을 발생시켜 주는 LED 기판과;An LED substrate installed in the LED substrate receiving groove of the light transmitting or diffusing plate to generate light for illumination when a power supply voltage is supplied from a power supply converter;
    다이케스팅을 통해 사방으로 공기가 유통될 수 있도록 수개의 유선형 방열봉들이 상면에 일체로 돌출 형성되도록 경금속계열 합금으로 성형한 구성을 갖고 상기 LED 기판의 배면에서 빛 투광 또는 확산판의 배면에 저면이 밀착된 형태로 착탈 가능하게 고정 설치되어 발광다이오드에서 발생되는 열을 방열시켜 주는 방열체와;In order to allow air to flow in all directions through die casting, several streamlined heat-dissipating rods are formed of a light metal series alloy so as to protrude integrally on the upper surface, and the bottom of the LED substrate is closely adhered to the bottom of the light transmission or diffuser plate. A heat dissipator fixedly installed in a detachable form to dissipate heat generated from the light emitting diodes;
    상기 빛 투광 또는 확산판 배면의 방수 링 삽입홈에 삽입 설치되어 상기 빛 투광 또는 확산판의 배면과 방열체 사이의 기밀을 유지시켜 주는 방수 링과;A waterproof ring inserted into the waterproof ring insertion groove on the back of the light transmitting or diffusing plate to maintain the airtightness between the back of the light transmitting or diffusing plate and the heat sink;
    뚜껑체가 구비된 사각 함체 형상을 갖도록 전도성/고분자 방열 수지재로 사출 성형된 형태를 갖고 상기 방열체의 상면에 착탈 가능하게 고정 설치되어 그 내부로 수납되는 전원 공급용 컨버터에서 발생되는 열을 포함하여 방열체를 통해 전달되는 LED의 일부 잔열을 방열시켜 주는 방열형 함체와;Including the heat generated by the power supply converter is formed in the injection molded shape of the conductive / polymer heat-dissipating resin material so that the lid body is provided with a lid body detachably fixed to the upper surface of the heat sink and housed therein A heat dissipation enclosure for dissipating some residual heat of the LED transmitted through the heat dissipation body;
    상기 방열형 함체 내에 수납된 상태에서 LED 기판에 설치된 LED의 구동에 필요한 전원전압을 공급시켜 주는 전원 공급용 컨버터;로 구성한 것을 특징으로 하는 발광다이오드 조명 모듈.And a power supply converter for supplying a power voltage required for driving the LED installed in the LED substrate in the heat dissipation enclosure.
  3. 청구항 1 또는 청구항 2 중 어느 한 항에 있어서,The method according to claim 1 or 2,
    상기 경금속계열 합금은,The light metal series alloy,
    열 확산 계수가 1.3-1.4[㎠/sec]이고, 열 전도도는 60-90[W/mK]이며, 밀도는 1.8±0.3[g/㎤]이고, 용융온도가 595[℃]이며, 비열이 1.02-1.05[J/gK]인 마그네슘 합금을 포함하는 것을 특징으로하는 발광다이오드 조명 모듈.The thermal diffusion coefficient is 1.3-1.4 [cm 2 / sec], the thermal conductivity is 60-90 [W / mK], the density is 1.8 ± 0.3 [g / cm 3], the melting temperature is 595 [° C.], and the specific heat is A light emitting diode illumination module comprising a magnesium alloy of 1.02-1.05 [J / gK].
  4. 청구항 1 또는 청구항 2 중 어느 한 항에 있어서,The method according to claim 1 or 2,
    상기 경금속계열 합금은, 베릴륨과 티타늄, 두랄루민 및 탄소-알루미늄 복합소재를 포함하는 것을 특징으로 하는 발광다이오드 조명 모듈.The light metal-based alloy is a light emitting diode illumination module comprising a beryllium and titanium, duralumin and carbon-aluminum composite material.
  5. 청구항 1 또는 청구항 2 중 어느 한 항에 있어서,The method according to claim 1 or 2,
    상기 방열체의 상면에 돌출 성형된 유선형 방열봉의 외주면에는 방열 표면적을 증대시켜 주기 위해 수개의 방열돌기를 정해진 간격을 두고 더 돌출 성형한 것을 특징으로 하는 발광다이오드 조명 모듈.Light emitting diode illumination module, characterized in that the outer peripheral surface of the streamlined heat-dissipating rod protruded on the upper surface of the radiator further protruded at a predetermined interval in order to increase the heat dissipation surface area.
  6. 청구항 2에 있어서,The method according to claim 2,
    상기 전도성/고분자 방열 수지재는,The conductive / polymer heat dissipating resin material,
    열 확산 계수가 0.75-0.8[㎠/sec]이고, 열 전도도는 90-150[W/mK]이며, 밀도는 1.4±0.2[g/㎤]이고, 용융온도가 105-160[℃]이며, 비열이 1.1±0.4[J/gK]인 탄소나노튜브(CNT)가 함유된 것을 특징으로 하는 발광다이오드 조명 모듈.The thermal diffusion coefficient is 0.75-0.8 [cm 2 / sec], the thermal conductivity is 90-150 [W / mK], the density is 1.4 ± 0.2 [g / cm 3], the melting temperature is 105-160 [° C.], A light emitting diode illumination module comprising carbon nanotubes (CNT) having a specific heat of 1.1 ± 0.4 [J / gK].
  7. 청구항 2에 있어서,The method according to claim 2,
    상기 방열형 함체의 뚜껑체 저면 양측에는 전원 공급용 컨버터의 양측면이 끼워져 걸려지는 기판 가이드 홈을 구비하고 방열형 함체의 내부로 삽입되는 측판을 더 구비시킨 것을 특징으로 하는 발광다이오드 조명 모듈.Both sides of the bottom surface of the lid body of the heat dissipation housing has a substrate guide groove which is fitted to both sides of the converter for power supply, and further comprising a side plate inserted into the heat dissipation enclosure.
  8. 청구항 7에 있어서,The method according to claim 7,
    상기 방열형 함체의 뚜껑체에 돌출 형성된 측판의 배면에는 전원 공급용 컨버터의 납땜 부분과 방열형 함체 사이에서 누전이 발생되는 것을 위한 절연 차단막을 더 일체로 형성한 것을 특징으로 하는 발광다이오드 조명 모듈.The back light of the side plate protruding from the lid of the heat dissipation enclosure light emitting diode illumination module, characterized in that the insulation block for forming a short circuit between the soldering portion of the power supply converter and the heat dissipation enclosure further formed integrally.
  9. 청구항 2에 있어서,The method according to claim 2,
    상기 방열형 함체의 상면 개구부 주연부와 뚜껑체의 저면 사이에는 외부로부터 방열형 함체의 내부로 습기를 포함하여 각종 이물질이 유입되지 않도록 하는 방수 패킹을 더 설치한 것을 특징으로 하는 발광다이오드 조명 모듈.The light emitting diode lighting module further comprises a waterproof packing between the periphery of the upper opening of the heat dissipating enclosure and the bottom of the lid to prevent various foreign substances from entering the interior of the heat dissipating enclosure from the outside.
  10. 청구항 2에 있어서,The method according to claim 2,
    상기 방열형 함체의 뚜껑체 상에는 전원 공급용 컨버터에 교류전원을 공급하기 위한 전원공급단자를 설치하기 위하여 한 쌍 또는 두 쌍의 전원공급단자 설치공을 형성한 것을 특징으로 하는 발광다이오드 조명 모듈.The light emitting diode lighting module, characterized in that formed on the cover of the heat dissipation enclosure a pair or two pairs of power supply terminal installation holes for installing a power supply terminal for supplying AC power to the power supply converter.
  11. 청구항 10에 있어서,The method according to claim 10,
    상기 방열형 함체의 뚜껑체 상에 형성시킨 전원공급단자 설치공이 한 쌍인 경우, 교류전원 공급선 및 점프선이 일체로 구비된 콘넥터를 이용하여 LED 조명 모듈의 방열형 함체 외부에서 서로 인접된 LED 조명 모듈에 교류전원을 점프시켜 주기 위해 콘넥터 결합용 전원공급단자를 설치한 것을 특징으로 하는 발광다이오드 조명 모듈.When there is a pair of power supply terminal installation holes formed on the lid of the heat dissipation enclosure, AC power is supplied to the LED light modules adjacent to each other outside the heat dissipation enclosure of the LED lighting module by using a connector provided with an AC power supply line and a jump line integrally. Light emitting diode lighting module, characterized in that installed a power supply terminal for connector coupling to jump.
  12. 청구항 10에 있어서,The method according to claim 10,
    상기 방열형 함체의 뚜껑체 상에 형성시킨 전원공급단자 설치공이 두 쌍인 경우, 서로 인접된 LED 조명 모듈에 교류전원 공급선을 점프시켜 주기 위해 각 쌍에 "ㄷ"자 형상으로 절곡 성형한 전원공급단자를 설치한 것을 특징으로 하는 발광다이오드 조명 모듈.When there are two pairs of power supply terminal installation holes formed on the lid of the heat dissipation enclosure, the power supply terminals bent to have a "c" shape on each pair to jump the AC power supply lines to adjacent LED lighting modules. Light emitting diode illumination module characterized in that the installation.
  13. 청구항 2에 있어서,The method according to claim 2,
    상기 방열형 함체의 뚜껑체 상면 중앙에는 전원 공급용 컨버터에 교류전압을 공급시켜 줌은 물론 LED 조명 모듈 자체를 일반전구와 같이 소켓에 나사 결합시킬 수 있도록 하는 나선형 소켓 결합구를 더 고정 설치한 것을 특징으로 하는 발광다이오드 조명 모듈.In the center of the upper surface of the lid body of the heat dissipation enclosure, the AC socket is supplied to the power supply converter, and the spiral socket coupler for fixing the LED lighting module itself to the socket like a general electric bulb is further fixedly installed. Light emitting diode illumination module.
  14. 청구항 2에 있어서,The method according to claim 2,
    상기 방열형 함체의 전,후 표면에도 정해진 간격을 두고 방열 표면적을 넓혀주기 위한 방열돌출부들을 더 돌출 성형한 것을 특징으로 하는 발광다이오드 조명 모듈.Light emitting diode illumination module, characterized in that the heat dissipation protrusions for further extending the heat dissipation surface area at a predetermined interval on the front and rear surfaces of the heat dissipation enclosure further protruded.
  15. 청구항 2에 있어서,The method according to claim 2,
    상기 방열체의 유선형 방열봉 중 일측 중심선 상에서 서로 대향된 위치에 있는 두 개의 유선형 방열봉 상면에 가이드 홈을 형성하고, 상기 방열형 함체의 저면 중 일측 중심선 상에서 양측에는 방열형 함체를 방열체의 상면에 올려놓고 스크류로 고정 설치할 때 상기 유선형 방열봉의 가이드 홈에 끼워져 방열형 함체가 회동되지 않도록 하는 가이드 봉을 더 돌출되게 설치한 것을 특징으로 하는 발광다이오드 조명 모듈.Guide grooves are formed on the upper surface of the two streamlined heat dissipating rods at positions opposite to each other on the center line of the heat dissipating rod of the heat dissipating body, and the heat dissipating enclosures are placed on the upper surface of the heat dissipating body on both sides of the bottom side of the heat dissipating enclosure. And a guide rod which is inserted into the guide groove of the streamlined heat dissipation rod so that the heat dissipation enclosure is not rotated when it is placed and fixedly installed with a screw.
  16. 청구항 2에 있어서,The method according to claim 2,
    상기 방열체의 중앙에 돌출 성형된 방열 겸 전선 통과봉을 장방형으로 형성하고, 상기 방열형 함체의 저면 중앙에 평단면이 장방형 형상을 갖는 상기 방열 겸 전선 통과봉의 상단 일부가 끼워져 방열형 함체의 오결합을 방지함은 물론 방열형 함체가 회동되지 않도록 하는 방열 겸 전선 통과봉 결합홈을 더 형성한 설치한 것을 특징으로 하는 발광다이오드 조명 모듈.The heat dissipation and wire passing rods protrudingly formed in the center of the heat dissipation body are formed in a rectangular shape, and a portion of the upper end of the heat dissipation and wire passing rods having a rectangular cross-section is inserted into the center of the bottom surface of the heat dissipation housing to prevent misalignment of the heat dissipation enclosure. Light-emitting diode lighting module, characterized in that the installation is further formed with a heat dissipation and wire through rod coupling groove to prevent the heat dissipation enclosure is rotated.
  17. 청구항 1 또는 청구항 2 중 어느 한 항에 있어서,The method according to claim 1 or 2,
    상기 빛 투광 또는 확산판의 주연부에서 소정 간격을 두고 또는 각 모서리에는 각종 조명등 기구의 모듈 고정판에 천공된 방열체 통과공에 방열체를 끼운 상태에서 방열체 통과공의 주연부에 걸려진 빛 투광 또는 확산판 자체를 스크류로 고정시키기 위해, 또는 소정 형상을 갖는 소켓 결합겸 통풍 지지구를 스크류를 통해 빛 투광 또는 확산판에 고정시켜 주기 위한 스크류 결합홈을 더 천공한 것을 특징으로 하는 발광다이오드 조명 모듈.Light transmission or diffusion caught at the periphery of the heat dissipation through-holes at a predetermined interval from the periphery of the light transmission or diffuser plate or at each corner with the heat dissipation inserted into the heat dissipation through-hole perforated to the module fixing plate of various lighting fixtures. A light emitting diode illumination module, characterized in that a perforated screw coupling groove for fixing the plate itself with screws, or for fixing a socket coupling and ventilation support having a predetermined shape to the light transmission or diffuser plate through the screw.
  18. 청구항 17에 있어서,The method according to claim 17,
    상기 소켓 결합겸 통풍 지지구는,The socket coupling and the ventilation support,
    전원 공급용 컨버터에 교류전압을 공급시켜 줌은 물론 LED 조명 모듈 자체를 일반전구와 같이 소켓에 나사 결합시킬 수 있도록 하는 나선형 소켓 결합구와;A spiral socket coupler for supplying an AC voltage to the power supply converter and screwing the LED lighting module itself to the socket like a general electric bulb;
    상기 나선형 소켓 결합구의 저면에 일체로 고정 설치되는 몸체의 주연부에서 정해진 간격을 두고 하방부를 향해 돌출 형성되되, 저단부에는 상기 빛 투광 또는 확산판에 형성된 스크류 결합홈에 결합되는 스크류가 통과되는 스크류 통과공이 천공된 형태를 갖는 수개의 다리가 일체로 구비되도록 합성수지재를 이용하여 사출 성형한 통풍 지지구;로 구성한 것을 특징으로 하는 발광다이오드 조명 모듈.Is formed protruding downward from the peripheral portion of the body fixedly installed on the bottom of the spiral socket coupler at a predetermined interval, the screw passing through the screw coupled to the screw coupling groove formed in the light transmitting or diffuser plate at the bottom end Light emitting diode lighting module, characterized in that consisting of; a ventilation support which is injection-molded using a synthetic resin material so that several legs having a ball-punched form are integrally provided.
  19. 청구항 2에 있어서,The method according to claim 2,
    상기 방열형 함체의 양측면 저부에는 수개의 LED 조명 모듈을 모듈 고정판에 고정 설치하여 각종 조명등 기구를 제작하고자 할 때 소정 형상을 갖는 탄성 고정구를 결합시키거나, 또는 LED 조명 모듈 자체의 빛 조사각도를 조절하기 위해 빛 각도 조절수단을 결합시키기 위하여 평단면이 "ㄷ"자 형상을 갖는 고정구 결합구를 일체로 더 돌출 성형한 것을 특징으로 하는 발광다이오드 조명 모듈.When both sides of the heat dissipation enclosure to install a number of LED lighting modules fixed to the module fixing plate to manufacture a variety of lighting fixtures to combine the elastic fixture having a predetermined shape, or to adjust the light irradiation angle of the LED lighting module itself Light emitting diode illumination module, characterized in that the flat cross-section is further protruded integrally formed with a "c" shape in order to couple the light angle adjusting means.
  20. 청구항 19에 있어서,The method according to claim 19,
    상기 탄성 고정구는,The elastic fastener,
    소정 폭과 길이를 갖도록 절단한 철판을 이용하여 절곡 성형하되, 상부 평판부를 중심으로 그 내측에는 상기 고정구 결합구 내측에 끼워져 탄력적으로 걸려지는 "π" 형상의 탄성 고정편을 일체로 형성하고, 외측에는 상기 고정구 결합구 외측을 덮는 형태로 지나 그 저단부 일부가 만곡지게 절곡된 형태에서 모듈 고정판의 내면 일부까지 탄력적으로 밀착된 형태를 갖는 판 스프링부를 일체로 형성하되, 상기 판 스프링부의 상부에는 분해용 공구를 결합하기 위한 공구 결합공을 천공한 것을 특징으로 하는 발광다이오드 조명 모듈.It is formed by bending using an iron plate cut to have a predetermined width and length, and the inner side of the upper plate portion is formed integrally with the elastic fixing piece of "π" shape that fits inside the fastener coupler and is elastically hung. In the form of covering the outside of the fastener coupler is formed integrally with the leaf spring portion having a form that is elastically closely contacted to a portion of the inner surface of the module fixing plate in the form that the lower end portion is bent in a curved manner, the upper portion of the leaf spring Light emitting diode illumination module, characterized in that for drilling a tool coupling hole for coupling the tool.
  21. 청구항 19에 있어서,The method according to claim 19,
    상기 탄성 고정구는,The elastic fastener,
    소정 지름과 길이를 갖는 강선을 이용하여 상부 내측에는 상기 고정구 결합구 내측에 끼워져 탄력적으로 걸려지는 한 쌍의 탄성 걸림고리를 형성하고, 상부에는 고정구 결합구의 상면부를 감싸는 평면부를 형성하며, 상기 평면부의 외측에서 하방부를 향해서는 상기 탄성 걸림고리의 간격을 유지시켜 주도록 서로 대향되게 한 쌍의 간격 유지부를 절곡 형성하고, 상기 간격 유지부의 저부로는 상기 고정구 결합구 외측을 지나 그 저단부 일부가 만곡지게 절곡된 형태에서 모듈 고정판의 내면 일부까지 탄력적으로 접촉된 형태를 갖는 스프링부를 일체로 형성한 형태를 갖는 것을 특징으로 하는 발광다이오드 조명 모듈.Using a steel wire having a predetermined diameter and length, the upper inner side forms a pair of elastic hooks that are elastically hooked inside the fastener coupler, and form a flat part surrounding the upper surface of the fastener coupler, and the flat portion From the outside toward the lower portion is bent to form a pair of interval holding portions to face each other to maintain the gap of the elastic hook ring, and the bottom portion of the gap holding portion is passed through the outside of the fastener coupler so that a portion of the bottom end is curved The light emitting diode lighting module, characterized in that it has a form integrally formed with a spring portion having a form that is elastically contacted to a part of the inner surface of the module fixing plate in the bent form.
  22. 청구항 19에 있어서,The method according to claim 19,
    상기 빛 각도 조절수단은,The light angle adjusting means,
    소정 폭과 길이를 갖는 철판을 "U"자 형상으로 절곡 성형하되, 저부에는 상기 방열형 함체의 고정구 결합구가 끼워져 고정되는 결합구 고정부를 일체로 구비하고 상기 방열형 함체의 고정구 결합구에 착탈 가능하게 결합되는 한 쌍의 탄성형 연결구와;Bending a steel plate having a predetermined width and length into a "U" shape, the bottom portion is integrally provided with a fastener fastener to which the fastener coupler of the heat dissipation enclosure is fitted and fixed, and detachable to the fastener fastener of the heat dissipation enclosure. A pair of elastic connectors coupled to each other;
    소정 폭과 길이를 갖는 철판을 "ㄷ"자 형상으로 절곡 형성시킨 형태를 갖고 양 단부에 일체로 절곡 형성된 고정편이 상기 탄성형 연결구들의 자유 단부 틈새에 끼워져 볼트와 나비 너트를 통해 각도 조절 가능하게 결합되는 지지구와;A fixed piece having a predetermined width and length bent into a "c" shape and integrally bent at both ends is fitted into a gap between the free ends of the elastic connectors to be angularly adjustable through a bolt and a butterfly nut. Supporters;
    상기 지지구의 중앙에 착탈 가능하게 고정되어 LED 조명 모듈을 포함하여 빛 각도 조절수단 자체를 벽과 같은 고정구에 착탈 가능하게 고정시켜 주는 고정판;으로 구성한 것을 특징으로 하는 발광다이오드 조명 모듈.Removably fixed to the center of the support is fixed to the light-emitting diode lighting module including a LED lighting module for fixing the light angle control means detachably to a fixture such as a wall.
  23. 청구항 1 또는 청구항 2 중 어느 한 항에 있어서,The method according to claim 1 or 2,
    상기 LED 조명 모듈을 이용하여 제작되는 각종 조명등 기구는, Various lighting fixtures produced using the LED lighting module,
    계단 조명등, 투광등, 보안등, 경관조명등, 하우스나 축사 또는 공장용 조명등, 거실등, 간판 간접 조명등 및 다운 라이트를 포함하는 것을 특징으로 하는 발광다이오드 조명 모듈.A light emitting diode lighting module comprising a staircase light, floodlight, security light, landscape lighting, house or barn or factory lighting, living room lighting, signage indirect lighting and downlights.
PCT/KR2011/009656 2011-08-18 2011-12-15 Light-emitting diode lamp module WO2013024943A1 (en)

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