WO2010061746A1 - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
WO2010061746A1
WO2010061746A1 PCT/JP2009/069423 JP2009069423W WO2010061746A1 WO 2010061746 A1 WO2010061746 A1 WO 2010061746A1 JP 2009069423 W JP2009069423 W JP 2009069423W WO 2010061746 A1 WO2010061746 A1 WO 2010061746A1
Authority
WO
WIPO (PCT)
Prior art keywords
socket
lamp device
lamp
main body
socket device
Prior art date
Application number
PCT/JP2009/069423
Other languages
French (fr)
Japanese (ja)
Inventor
渡邉　智
清水　圭一
長田　武
清水　恵一
田中　敏也
大澤　滋
武志 久安
大武　寛和
河野　仁志
酒井　誠
Original Assignee
東芝ライテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008305584A external-priority patent/JP5477530B2/en
Priority claimed from JP2008305583A external-priority patent/JP5477529B2/en
Priority claimed from JP2008305585A external-priority patent/JP2010129489A/en
Priority claimed from JP2008333680A external-priority patent/JP5499475B2/en
Priority claimed from JP2008333678A external-priority patent/JP5477533B2/en
Priority to CN200980135603XA priority Critical patent/CN102149962B/en
Priority to KR1020117005381A priority patent/KR101220657B1/en
Application filed by 東芝ライテック株式会社 filed Critical 東芝ライテック株式会社
Priority to RU2011126378/07A priority patent/RU2482384C2/en
Priority to EP09828994.5A priority patent/EP2336631B1/en
Priority to US13/119,519 priority patent/US8613529B2/en
Publication of WO2010061746A1 publication Critical patent/WO2010061746A1/en
Priority to US13/233,827 priority patent/US8430535B2/en
Priority to US13/597,992 priority patent/US8540396B2/en
Priority to US13/597,953 priority patent/US8434908B2/en
Priority to US13/597,804 priority patent/US8540399B2/en
Priority to US13/597,893 priority patent/US8523402B2/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/73—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements being adjustable with respect to each other, e.g. hinged
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/945—Holders with built-in electrical component
    • H01R33/9456—Holders with built-in electrical component for bayonet type coupling devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/006—Fastening of light sources or lamp holders of point-like light sources, e.g. incandescent or halogen lamps, with screw-threaded or bayonet base
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49879—Spaced wall tube or receptacle

Definitions

  • the present invention relates to a luminaire that uses a lamp device that is flat and has a base on one side and a light source on the other side.
  • This lamp device uses a base part of the GX53 type standardized by IEC (International Electrotechnical Commission).
  • This lamp device has a flat lamp device main body, a GX53-type base portion is provided on the upper surface side of the lamp device main body, and a flat type using a fluorescent lamp, LED, or the like on the lower surface side of the lamp device main body.
  • a light source is arranged, and a lighting circuit for lighting the light source is accommodated inside the lamp device main body.
  • a pair of lamp pins having a large-diameter portion at the tip protrudes from the base portion.
  • the light source Since the light source generates heat when the lamp device is turned on, heat dissipation is necessary, and heat dissipation from the base portion of the lamp device is also effective.
  • This invention is made in view of such a point, and it aims at providing the lighting fixture which can efficiently radiate the heat
  • the lighting fixture according to claim 1 holds a base part provided on one side of a flat lamp device and supplies power to the base part to light a light source disposed on the other side of the lamp device.
  • a socket device that contacts the at least part of a cap portion of the lamp device held by the socket device; a contact direction between the cap portion of the lamp device held by the socket device and the heat sink And a pressing body that presses against the surface.
  • the base part of the lamp device has, for example, a GX53-type base structure, and a metal material having excellent thermal conductivity may be used at least at a place where it contacts the radiator.
  • the light source may be any flat and thin light source such as a semiconductor light emitting element such as an LED and an organic EL, or a flat discharge lamp. A globe covering this light source may be attached to the lamp device.
  • the socket device can, for example, be equipped with a cap unit of the lamp device GX53 type, hold the cap unit, and supply power to the cap unit.
  • the heat radiator is made of, for example, a metal excellent in thermal conductivity and heat dissipation, and may have a heat radiation structure such as a fin, or may be used as a metal reflector or an instrument body.
  • an elastic body such as a spring or rubber is used as the pressing body, and the base may be pressed against the base or the base may be pressed against the base.
  • the heat radiating body and the pressing body may be separate members, or the heat radiating body itself may have an integrated structure having a pressing function.
  • an integrated structure such as a metal bellows having a heat dissipation function and a pressing function may be used.
  • the lighting fixture according to claim 2 is the lighting fixture according to claim 1, further comprising a fixture main body on which the socket device is arranged, and the radiator is in contact with a base portion of the lamp device and the fixture main body. Is.
  • the instrument body and the radiator may be attached in close contact with each other in advance, or the instrument body and the radiator may be pressed in close contact with the pressing body that presses the base part and the radiator in the contact direction. Good.
  • the lighting fixture according to claim 3 is the lighting fixture according to claim 1, wherein the socket device has an insertion hole through which a protruding portion protruding from a center of a base portion of the lamp device is inserted, and the radiator. Is in surface contact with the end face of the projecting portion inserted through the socket device.
  • the protruding portion of the base portion may protrude from the socket device and come into contact with the heat radiating body, or the heat radiating member may enter and contact the socket device without protruding from the socket device.
  • the lighting fixture according to claim 4 is the lighting fixture according to claim 1, wherein the socket device is configured such that a socket support and a base portion of the lamp device are detachable, and are accommodated on the socket support side by the socket support. And a socket device main body supported so as to be movable between a storage position to be projected and a projecting position projecting from the socket support side.
  • the socket support body is attached to, for example, a fixture body of a lighting fixture, and supports the socket device body using any configuration as long as the socket device body can be moved between a storage position and a protruding position. It does not matter.
  • a locking structure that locks the socket device main body at the storage position may be used. This locking structure is such that the holding position protrudes by repeated pressing operations, such as a push button switch or a knock mechanism of a writing instrument.
  • a mechanism that sequentially switches to the storage state can be used. In other words, the lamp device is locked by pushing the socket device body from the protruding position to the storage position and moving it, and once again, the lamp device is released by slightly pushing the socket device body, and the socket device body is stored. It is only necessary to allow movement from the position to the protruding position.
  • An urging member such as a spring may be used in the direction in which the socket device main body projects.
  • the socket device body can be fitted with a lamp unit GX53 type cap portion, and can hold the cap portion and supply power to the cap portion.
  • the lighting fixture according to claim 5 is the lighting fixture according to claim 1, wherein the flat lamp device main body, a cap provided on one surface side of the lamp device main body, and the other surface side of the lamp device main body are provided.
  • a lamp device having a light source arranged and a lighting circuit for lighting the light source is provided.
  • the lamp device main body and the base part may be integrated or separated.
  • the lighting circuit may be housed in the lamp device main body or may be disposed together with the light source on the other surface side of the lamp device main body.
  • the lighting fixture according to claim 6 is the lighting fixture according to claim 5, wherein the lamp device includes a board mounting portion provided on the other surface side of the lamp device main body, the board mounting portion, and the base portion.
  • the heat-conducting connection means is connected to enable heat conduction, and the light-emitting module substrate mounted on the substrate mounting portion is mounted with a semiconductor light-emitting element as the light source.
  • the base part of the lamp device body and the board mounting part may be separate or integrated. If they are separate bodies, they are brought into close contact with each other by heat conduction connection means such as screwing or screwing together, and connected from the substrate mounting portion side to the base portion side so as to be capable of heat conduction. If a monolithic structure is used as the heat conduction connecting means, a state is established in which heat conduction is possible from the substrate mounting portion side to the base portion side.
  • the light emitting module substrate is attached so that, for example, a wiring pattern is formed on a metal substrate via an insulating layer, a semiconductor light emitting element is connected on the wiring pattern, and is closely attached to the substrate mounting portion of the lamp device body by screws or the like. It is done.
  • the lighting fixture according to claim 7 is the lighting fixture according to claim 5, wherein the lamp device is formed integrally with a substrate mounting portion provided on the other surface side of the lamp device main body, and the substrate mounting portion.
  • the substrate mounting portion includes a projecting portion protruding from the center of one surface side toward the base, and a light emitting module substrate on which a semiconductor light emitting element is mounted as the light source and is mounted on the substrate mounting portion.
  • the inner structure may be hollow or solid.
  • the light emitting module substrate is, for example, a wiring pattern formed on a metal substrate through an insulating layer, a semiconductor light emitting element is mounted on the wiring pattern, and is attached so as to be in close contact with the substrate mounting portion of the lamp device main body with a screw or the like It is done.
  • the lighting fixture according to claim 8 is the lighting fixture according to claim 1, wherein the socket device is configured to supply power to a socket device main body that holds a base portion of the lamp device and the lamp device held by the socket device main body. And a signal transmission unit that transmits a signal to the lamp device held in the socket device body, and the lamp device receives power supply from the power supply unit of the socket device.
  • a lamp pin connectable to the power supply unit, and a signal terminal connected to the signal transmission unit so as to receive a signal transmitted from the signal transmission unit of the socket device in a state where the lamp pin is connected to the power supply unit;
  • a lighting circuit for turning on the light source by receiving power supply from the lamp pin, and adjusting the output of the lighting circuit by receiving the signal input to the signal terminal In which and a control circuit.
  • the socket device body is formed of, for example, an insulating synthetic resin, and a power feeding unit and a signal transmission unit are arranged.
  • the power feeding unit is in electrical contact with the lamp pin of the lamp device held in the socket device body.
  • the signal transmission unit is in electrical contact with the signal terminal of the lamp device held in the socket device body.
  • the signal transmission unit may be disposed inside a hole formed on the surface of the socket device body, provided on the surface of the socket device body, or may protrude from the socket device body. As long as they can be electrically connected to each other, any configuration may be used.
  • the lamp pin for example, protrudes from the base part, has a large-diameter part at the tip part, and is hooked and held by the socket apparatus when attached to the socket apparatus, and the power supply part of the socket apparatus is electrically connected so that power can be supplied. Connected.
  • the signal terminal may protrude from the base part, may be provided on the surface of the base part, or may be disposed inside a hole provided on the surface of the base part.
  • the signal may be any signal as long as it controls the output of the light source such as a dimming signal or an RGB signal.
  • the lighting circuit may have any circuit configuration as long as it can be adjusted for output.
  • the control circuit may have any configuration as long as it can be adjusted by the output of the lighting circuit according to the input signal.
  • the base portion of the lamp device mounted on the socket device and the radiator are in contact with each other, and the base portion of the lamp device and the radiator are pressed in the contact direction by the pressing body.
  • the base part and the heat radiating body are securely brought into close contact with each other, and heat can be efficiently conducted from the base part to the heat radiating body, so that the heat of the lamp device can be efficiently radiated from the base part.
  • the radiator contacts the base portion of the lamp device and the fixture body, and efficiently conducts heat from the base portion to the fixture body. Therefore, the heat of the lamp device can be efficiently radiated from the base part.
  • the end surface of the protruding portion of the base portion inserted through the socket device and the radiator are in surface contact. Heat can be efficiently conducted from the protrusion to the radiator.
  • the socket device main body is placed between the storage position where the socket device body is stored on the socket support side and the protruding position where the socket support body protrudes from the socket support side. Therefore, the lamp device can be easily attached and detached by moving the socket device main body to the protruding position even when used in a small lighting fixture. In addition, by moving the socket device main body to the storage position, the base portion of the lamp device and the radiator can be brought into contact with each other.
  • the heat of the lamp device can be efficiently radiated from the base part.
  • the light emitting module substrate is attached to the substrate attachment portion of the lamp device main body, and heat conduction is performed from the substrate attachment portion side to the base portion side. Because it is connected by heat conduction connection means, it is possible to efficiently conduct heat generated by the semiconductor light emitting element to the board mounting part, and to conduct heat efficiently from the board mounting part side to the base part side. Can be improved.
  • the board mounting portion and the protruding portion protruding from the center of one surface side of the board mounting portion are integrally formed on the lamp device body.
  • the heat generated by the semiconductor light emitting element can be efficiently conducted from the substrate mounting portion to the projecting portion of the lamp device body. It is possible to collect heat and efficiently dissipate heat from the projecting portion, thereby improving heat dissipation.
  • the lighting fixture of claim 8 in addition to the effect of the lighting fixture of claim 1, power is supplied from the power feeding portion of the socket device to the lamp pin of the lamp device, and the power feeding portion and the lamp pin are connected. Since the signal can be transmitted from the signal transmission unit of the socket device to the signal terminal of the lamp device in a state where the lamp device is in the state, the lamp device receives the signal from the socket device and attaches the signal according to the signal by attaching the lamp device to the socket device. The output of the lighting circuit can be adjusted.
  • FIG. 1 is a sectional view of a lighting fixture in which a lamp device is mounted on a socket device
  • FIG. 2 is a sectional view of the lighting fixture with the lamp device removed
  • FIG. FIG. 4 is a perspective view of the lamp device.
  • the lighting fixture 11 is, for example, a downlight, and includes a fixture main body 12 as a radiator, a socket device 13 attached to the fixture main body 12, and a flat lamp device 14 that can be attached to and detached from the socket device 13. .
  • the directional relationship such as the vertical direction is based on the state in which the flat lamp device 14 is mounted horizontally, the base side, which is one surface side of the lamp device 14, being the upper surface side, and the other surface side of the lamp device 14
  • the light source side is described as the lower surface side.
  • the instrument body 12 is made of metal and is also used as a reflector, and has a circular flat plate portion 17 and a reflective plate portion 18 that is bent downwardly from the periphery of the flat plate portion 17. is doing. An opening 19 is formed on the lower surface of the reflector 18.
  • the socket device 13 has a cylindrical socket device main body 21 made of an insulating synthetic resin, and an insertion hole 22 is formed through the center of the socket device main body 21 in the vertical direction.
  • a pair of protrusions 23 protrude from the inner surface of the insertion hole 22 toward the center of the insertion hole 22.
  • a pair of socket portions 24 are formed on the lower surface of the socket device body 21.
  • connection holes 25 are formed, and a receiver (not shown) for supplying electric power to the inside of the connection holes 25 is disposed.
  • the connection hole 25 is an arc-shaped groove that is rotationally symmetric with respect to the center of the socket device main body 21, and a diameter-expanded portion 26 is formed at one end of the arc-shaped groove.
  • a plurality of recesses 27 are formed on the lower surface of the socket device body 21, and a screw shaft 29 of a screw 28 is inserted into the recess 27 from the instrument body 12, and an elastic material such as rubber is used as a pressing body on the screw shaft 29.
  • a nut 31 is screwed through the body 30.
  • the socket device 13 is attached to the flat plate portion 17 of the instrument body 12 by the screws 28, the elastic body 30, and the nut 31.
  • the lamp device 14 is a flat lamp device main body 34, a semiconductor light emitting element as a light source disposed on the lower surface side of the lamp device main body 34, a plurality of LEDs 35 as the semiconductor light emitting elements, and a globe that covers the LEDs 35 36 and a lighting circuit 37 for lighting the LED 35, and the height dimension is formed in a thin shape smaller than the lateral dimension.
  • the lamp device main body 34 is formed of a synthetic resin having insulation properties or a metal such as aluminum having excellent heat dissipation.
  • a base portion 38 of GX53 type is formed on the upper surface side, which is one surface side of the lamp device main body 34, and a planar substrate mounting portion 39 for attaching the LED 35 is formed on the lower surface side, which is the other surface side, and a lighting circuit 37 is provided inside.
  • An accommodating portion 40 for accommodating is formed.
  • An annular contact surface 41 that contacts the lower surface of the socket device 13 is formed in the base portion 38, and a cylindrical protrusion 42 that can be inserted into the insertion hole 22 of the socket device 13 from the center of the contact surface 41. Is protruding.
  • the projecting dimension of the projecting part 42 is larger than the height dimension of the socket device 13, that is, the hole depth dimension of the insertion hole 22, and the end surface 43 of the projecting part 42 is inserted into the insertion hole 22 when the lamp device 14 is mounted on the socket device 13. It is comprised so that it may penetrate and pass through.
  • the contact surface 41 has a pair of conductive metal lamp pins 44 protruding therefrom.
  • a large-diameter portion 45 is formed at the tip of these lamp pins 44. Then, the large diameter portion 45 of each lamp pin 44 is inserted into the enlarged diameter portion 26 of each connection hole 25 of the socket device 13, and the lamp pin 44 is moved from the enlarged diameter portion 26 into the connection hole 25 by the rotation of the lamp device 14. As a result, the lamp pin 44 is brought into electrical contact with the metal receiver, and the large diameter portion 45 is hooked on the edge of the metal receiver or the connection hole 25 to hold the lamp device 14 in the socket device 13.
  • the lamp pin 44 is attached to the lamp device main body 34 with an insulating material interposed.
  • a pair of guide grooves 46 with which the projections 23 of the socket device 13 are engaged are formed on the side surfaces of the protrusions 42.
  • the guide groove 46 includes an introduction groove 47 that opens to the end face 43 of the protrusion 42, an inclined groove 48 that is inclined from the introduction groove 47, and a holding groove 49 that is horizontal from the inclined groove 48. Then, the lamp device 14 is raised in accordance with the introduction groove portion 47 of the guide groove 46 to the projection portion 23 of the socket device 13 and then rotated in the mounting direction, whereby the projection portion 23 and the inclined groove portion 48 are engaged.
  • the position where the lamp device 14 is moved upward and the socket device 13 is relatively moved downward and the projection 23 and the holding groove 49 are engaged is the mounting position where the lamp device 14 is mounted on the socket device 13.
  • the plurality of LEDs 35 are mounted on the lower surface side of the light emitting module substrate 50.
  • the upper surface of the light emitting module substrate 50 is attached in close contact with the substrate attaching portion 39 of the lamp device main body 34.
  • a wiring pattern is formed on a metal substrate through an insulating layer, the LED 35 is mounted on the wiring pattern, and the light emitting module substrate 50 is in close contact with the substrate mounting portion 39 of the lamp device main body 21 by screws. It is attached.
  • the plurality of LEDs 35 and the light emitting module substrate 50 constitute a light emitting module.
  • the globe 36 is made of glass or synthetic resin having transparency or light diffusibility.
  • the lighting circuit 37 includes a lighting circuit board and a lighting circuit component mounted on the lighting circuit board, and the lamp pin 44 is electrically connected to the input portion of the lighting circuit board by a lead wire or the like.
  • the light emitting module substrate 50 is electrically connected to the output portion of the lighting circuit substrate by a lead wire or the like.
  • the socket device 13 without the lamp device 14 is pushed upward by the pressing of the elastic body 30, and the upper surface of the socket device 13 is brought into contact with the flat plate portion 17 of the instrument body 12. ing.
  • the protruding portion 42 of the lamp device 14 is inserted into the insertion hole 22 of the socket device 13 from below, and the guide groove 46 provided in the protruding portion 42 of the lamp device 14 is introduced.
  • the groove 47 is aligned with the protrusion 23 of the socket device 13, and the lamp pin 44 of the lamp device 14 is aligned with the enlarged diameter portion 26 of each connection hole 25 of the socket device 13, and the lamp device 14 is pushed up and rotated in the mounting direction.
  • the ramp device 14 is moved upward by the engagement between the projection 23 and the inclined groove 48 of the guide groove 46, and the end surface 43 of the projection 23 is the instrument body 12.
  • the socket device 13 presses the elastic body 30 against the lamp device 14 whose upward movement is restricted by contact with the flat plate portion 17 of the fixture body 12. Descends against As shown in FIG. 1, the projection 23 and the holding groove 49 of the guide groove 46 are engaged with each other so that the lamp device 14 is attached to the socket device 13, and the lamp pin 44 is received by the socket device 13. Electrical contact with gold.
  • the socket device 13 In a state where the lamp device 14 is mounted on the socket device 13, the socket device 13 is pushed upward by the pressing of the elastic body 30, so that the end surface 43 of the projecting portion 42 protruding from the upper surface of the socket device 13 is the flat plate of the instrument body 12.
  • the portion 17 can be pressed and brought into close contact with the surface 17.
  • the heat generated by the LED 35 is thermally conducted from the light emitting module substrate 50 to the base part 38, and the heat transmitted to the base part 38 is transferred from the end face 43 of the protruding part 42 to the instrument body 12.
  • the heat is efficiently conducted, and the heat transmitted to the instrument body 12 is efficiently dissipated into the air.
  • the lamp device 14 can obtain sufficient heat dissipation, can suppress the temperature rise of the LED 35, and can prevent the LED 35 from being thermally deteriorated to have a short life, and in some cases, to reduce the light emission efficiency.
  • At least one of the flat plate portion 17 of the fixture body 12 or the end face 43 of the lamp device 14 is a surface such as polished to increase the smoothness in order to improve the thermal conductivity from the base portion 38 to the fixture body 12.
  • FIG. 5 shows a second embodiment
  • FIG. 5 is a sectional view of the lighting fixture.
  • the instrument main body 12 has a cylindrical tube portion 52, a top plate portion 53 provided on the upper surface of the tube portion 52, and a reflector plate portion 54 that protrudes obliquely outward from the lower portion of the tube portion 52.
  • the socket device 13 is fixed to the lower side of the cylindrical portion 52 of the instrument body 12, and a space between the upper surface of the socket device 13 and the top plate portion 53 of the instrument body 12 is provided with a heat radiating plate 55 and a pressing member.
  • a spring 56 as a body is arranged.
  • the heat radiating plate 55 is made of metal, and a contact portion 57 having a substantially U-shaped cross section that is in surface contact with the end surface 43 of the protruding portion 42 protruding from the base portion 38 of the lamp device 14 is formed in the middle portion, and both end portions are the instrument body 12. And is arranged to be movable in the vertical direction with respect to the instrument body 12. Fins or the like may be provided at both ends of the heat radiating plate 55 to enhance the heat radiating effect.
  • the spring 56 is disposed in a compressed state between the upper surface of the contact portion 57 of the heat radiating plate 55 and the top plate portion 53 of the instrument main body 12, and presses the heat radiating plate 55 downward.
  • the contact portion 57 of the heat radiating plate 55 comes into contact with the end face 43 of the protruding portion 42 of the base portion 38, and the contact portion 57 of the heat radiating plate 55 is connected to the base by the spring 56. It is pressed and brought into close contact with the end surface 43 of the projecting portion 42 of the portion 38.
  • the heat generated by the LED 35 is thermally conducted from the light emitting module substrate 50 to the base part 38, and the heat transmitted to the base part 38 is efficiently transferred from the end face 43 of the projecting part 42 to the heat radiating plate 55.
  • the heat conducted and the heat transmitted to the heat radiating plate 55 is efficiently radiated into the air or the like.
  • the heat of the lamp device 14 can be efficiently radiated from the base portion 38.
  • the heat radiating plate 55 may be in close contact with the end surface 43 of the projecting portion 42 by the elasticity of the heat radiating plate 55 itself.
  • the radiator plate 55 can have a function of a pressing body.
  • FIGS. 6 and 7 show a third embodiment, in which FIG. 6 is a perspective view in which a part of the lighting fixture is sectioned, and FIG. 7 is a perspective view in which a portion of the lighting fixture is seen through.
  • the instrument body 12 has the same structure as that of the second embodiment.
  • a heat radiating plate 60 as a heat radiating member and a spring 61 as a pressing member are arranged.
  • the heat radiating plate 60 is made of a metal such as copper and is formed in a ring shape, and a flat contact portion 62 that is in surface contact with the end surface 43 of the protruding portion 42 of the base portion 38 of the lamp device 14 is formed on the lower surface. Further, a planar contact portion 63 that comes into surface contact with the instrument main body 12 is formed, and a curved side surface portion 64 that allows expansion and contraction of the distance between the contact portions 62 and 63 is formed between both sides of the contact portions 62 and 63. Yes.
  • the spring 61 is disposed in a compressed state between the upper and lower contact portions 62 and 63 inside the heat sink 60.
  • the end surface 43 of the protruding portion 42 of the base portion 38 protrudes from the upper surface of the socket device 13 and contacts the contact portion 62 on the lower surface of the heat sink 60.
  • the spring 61 disposed inside the heat sink 60 presses and contacts the contact portion 62 on the lower surface of the heat sink 60 so as to be in surface contact with the end surface 43 of the protruding portion 42 of the base portion 38, and the upper surface of the heat sink 60.
  • the contact part 63 is pressed and brought into close contact with the instrument body 12 in surface contact.
  • the heat generated by the LED 35 is thermally conducted from the light emitting module substrate 50 to the base part 38, and the heat transmitted to the base part 38 is efficiently transmitted from the end face 43 of the projecting part 42 to the heat sink 60.
  • heat is efficiently conducted from the heat radiating plate 60 to the instrument body 12, and the heat transmitted to the instrument body 12 is efficiently radiated into the air or the like.
  • the heat of the lamp device 14 can be efficiently radiated from the base portion 38.
  • the spring 61 is used as the pressing body, the spring 61 itself may be in close contact with the end surface 43 of the projecting portion 42 and the instrument body 12 due to the elasticity of the radiator plate 60. In this case, the spring 61 is omitted. In addition, the function of the pressing body can be given to the heat radiating plate 60.
  • FIG. 8 shows a fourth embodiment
  • FIG. 8 is a perspective view of a part of the lighting fixture.
  • the instrument main body 12 has the same structure as the second and third embodiments.
  • a heat radiating member 67 that is also used as a heat radiating body and a pressing body is disposed.
  • the heat radiating member 67 is made of a metal such as copper and is a cylindrical bellows, and is disposed in a compressed state between the upper surface of the socket device 13 and the top plate portion 53 of the instrument body 12.
  • the end surface 43 of the protruding portion 42 of the base portion 38 protrudes from the upper surface of the socket device 13 and contacts the lower portion of the heat radiating member 67. Due to the elasticity of the heat dissipating member 67, the lower portion of the heat dissipating member 67 is in close contact with the end face 43 of the protrusion 42, and the upper portion of the heat dissipating member 67 is in close contact with the instrument body 12.
  • the heat generated by the LED 35 is thermally conducted from the light emitting module substrate 50 to the base part 38, and the heat transmitted to the base part 38 is efficiently transmitted from the end face 43 of the projecting part 42 to the heat radiating member 67.
  • heat is efficiently conducted from the heat radiating member 67 to the instrument main body 12, and the heat transmitted to the instrument main body 12 is efficiently radiated into the air or the like.
  • the heat of the lamp device 14 can be efficiently radiated from the base portion 38.
  • the single heat radiating member 67 can be used as both a heat radiating body and a pressing body, and the number of parts can be reduced.
  • the reflector plate 54 may be separated from the fixture body 12 and the reflector plate 54 may be detachably attached to the lamp device 14. Thereby, the heat of the lamp device 14 is transmitted to the reflecting plate portion 54, and the heat dissipation can be improved.
  • the lamp device 14 can be attached to and detached from the socket device 13 with the reflecting plate portion 54, and the operability can be improved.
  • FIGS. 9 to 13 show a fifth embodiment.
  • 9 is a cross-sectional view of the luminaire in which the socket body of the socket device is disposed in the protruding position
  • FIG. 10 is a cross-sectional view of the luminaire in which the socket body of the socket device is disposed in the storage position
  • FIG. FIG. 12 is a perspective view showing a state in which the lamp device is attached to the socket body arranged at the protruding position of the socket device
  • FIG. 13 is a perspective view showing the state of the socket device. It is a perspective view which shows the state which moved the socket main body to the accommodation position.
  • the socket device 13 includes a socket support 71 attached to the flat plate portion 17 of the instrument main body 12, and a socket device main body 21 supported so as to be movable in the vertical direction with respect to the socket support 71.
  • the socket support 71 is made of, for example, metal and is opened downward, and the socket device main body 21 is fitted therein so as to be movable in the vertical direction.
  • the socket support body 71 supports the socket device main body 21 so as to be movable between a storage position where the socket device body 21 is stored in the socket support body 71 and a protruding position where the socket support body 71 protrudes downward.
  • a spring 72 is disposed between the socket support 71 and the socket device main body 21 as a biasing means for biasing the socket device main body 21 toward the protruding position.
  • the socket support 71 projects from the socket device main body 21.
  • a stopper (not shown) that restricts the protrusion at the position is provided.
  • a locking means for locking the socket device main body 21 in the storage position.
  • This locking means such as a push button switch, pushes the socket device body 21 from the protruding position to the storage position by the lamp device 14 and moves it to lock the socket device body 21 in the storage position.
  • the lamp device 14 is configured to allow the lamp device 14 to be unlocked by slightly pushing up the socket device body 21 and to allow the socket device body 21 to be lowered from the storage position to the protruding position.
  • Such a locking means can be realized by a spring for biasing the socket support 71 in the socket support 71 and a cam mechanism for regulating the rotation angle, but other well-known mechanisms may be used. .
  • a plurality of cylindrical ribs 73 project from the socket support 71 in the vertical direction and are semicircular in cross section that engage with the ribs 73 at a plurality of locations on the outer periphery of the socket device body 21.
  • 74 are formed along the vertical direction, and a locking member 75 is disposed in these groove portions 74 so as to be able to advance and retract.
  • the lock member 75 moves forward and backward in the groove portion 74 in conjunction with the turning operation of the lamp device 14 when the lamp device 14 is attached to and detached from the socket device main body 21 held at the protruding position. It can be configured by a cam mechanism that contacts 44.
  • the lock member 75 enters the groove 74 when the lamp device 14 is not attached to the socket device main body 21 located at the protruding position, and the rib 75 when the socket device main body 21 attempts to move from the protruding position to the storage position. 73, the movement of the socket device 21 is restricted, and when the lamp device 14 is connected to the socket device body 21 located at the protruding position, the socket device body 21 is retracted from the groove 74, and the socket device body 21 is moved from the protruding position to the retracted position. Allow to move.
  • the rib 73, the groove 74, the lock member 75, and the like allow the socket device body 21 to which the lamp device 14 is mounted to move between the protruding position and the storage position, and the lamp device 14 is mounted.
  • Locking means 76 is configured to restrict the movement of the socket device main body 21 not being moved from the protruding position to the storage position.
  • the rib 73 In a state where the socket device main body 21 is moved to the storage position, the rib 73 is located in a region where the lock member 75 enters the groove portion 74, and the lock member 75 cannot enter the groove portion 74.
  • the device 14 is in a state where it cannot be rotated in the direction to remove it from the socket device main body 21. Therefore, the rib 73, the groove 74, the lock member 75, and the like constitute a lamp device holding means 77 that restricts the lamp device 14 from being detached from the socket device main body 21 moved to the storage position.
  • the socket support 71 is provided with a heat conducting member 78 for connecting the lamp device 14 so that the lamp device 14 can conduct heat by moving the socket device main body 21 to which the lamp device 14 is mounted to the storage position.
  • the socket device main body 21 of the socket device 13 to which the lamp device 14 is not mounted is in a protruding position protruding downward with respect to the socket support 71, and the instrument main body 12 Is located close to the opening 19 side, and is held by the spring 72 at the protruding position.
  • the position of the lock member 75 of the socket device main body 21 is located below the rib 73, the lock member 75 enters the groove 74, and the upper surface of the lock member 75 is opposed to the tip surface of the rib 73.
  • the lamp device 14 is raised so that each lamp pin 44 of the lamp device 14 is inserted in accordance with the enlarged diameter portion 26 of each connection hole 25 of the socket device main body 21. At this time, even if the lamp pin 44 of the lamp device 14 is not aligned with the enlarged diameter portion 26 of each connection hole 25 of the socket device main body 21 and the socket device main body 21 is pushed up by the lamp pin 44, the lock member 75 remains at the tip of the rib 73. It is possible to prevent the lamp device 14 from becoming difficult to attach due to the contact with the surface and the socket device body 21 moving to the upper storage position.
  • each lamp pin 44 of the lamp device 14 is inserted into the enlarged diameter portion 26 of each connection hole 25 of the socket device main body 21, the lamp device 14 is rotated in the mounting direction as shown in FIG. Mounted on the apparatus main body 21.
  • the socket device main body 21 is in the protruding position and is close to the opening 19 side of the lower surface of the instrument main body 12.
  • Rotation of the lamp device 14 in the mounting direction allows the lock member 75 to be retracted from the groove portion 74 in conjunction with the rotation, and allow the socket device body 21 to move to the storage position.
  • the socket device body 21 is pushed up to the storage position, and the lamp device 14 is moved into the appliance body 12. It can be held at a predetermined mounting position.
  • the socket device body 21 moved to the storage position is locked by the locking means.
  • the base portion 38 of the lamp device 14 comes into surface contact with the heat conducting member 78 and is in close contact therewith. It becomes.
  • the rib 73 is located in a region where the lock member 75 in the groove portion 74 enters, and the lock member 75 cannot enter the groove portion 74, and the lamp device interlocks with the lock member 75. 14 cannot be rotated in the direction to remove it from the socket device main body 21.
  • the socket device body 21 and the lamp device 14 are urged together with the lamp device 14 by urging by the spring 72 by slightly pushing up the lamp device 14 located in the storage position and releasing the lock by the locking means. Lower to the protruding position.
  • the lamp device 14 When the socket device main body 21 is lowered to the protruding position, the lamp device 14 is removed from the connection hole 25 of the socket device main body 21 by removing the lamp pin 44 of the lamp device 14 by rotating the lamp device 14 in the removing direction and then lowering the lamp device 14. It can be removed from the socket device main body 21.
  • the socket device main body 21 is movable between the storage position stored on the socket support 71 side and the protruding position protruding from the socket support 71 side. Even when used in a lighting fixture, the socket device main body 21 is moved to the protruding position with respect to the socket support 71 attached to the fixture main body 12 side, so that the side surface of the lamp device 14 can be gripped and easily attached and detached. .
  • the lamp device holding means 77 restricts the lamp device 14 from being detached from the socket device main body 21 that has moved to the storage position, the lamp device 14 attached to the socket device 13 can be prevented from being detached, and the lamp device can be prevented from being detached.
  • the socket device 13 can always be held in the protruding position, and the lamp device 14 can be easily attached.
  • FIG. 14 shows a sixth embodiment
  • FIG. 14 is a sectional view of the lighting fixture.
  • the lamp device main body 34 of the lamp device 14 is entirely formed of a metal such as aluminum having excellent heat dissipation, and is made of, for example, aluminum die casting, and a base-side metal component 81 and a substrate constituting the base portion 38.
  • the light source side metal part 82 that constitutes the attachment part 39 is divided and formed.
  • the base metal part 81 is formed in a disk shape opened downward, and a contact surface 84 with which the light source side metal part 82 contacts is formed on the end face of the annular outer peripheral part 83.
  • the light source side metal part 82 is formed in a flat disk shape capable of closing the lower surface opening of the base side metal part 81, and the peripheral part of the upper surface can contact the contact surface of the base side metal part 81.
  • the light source side metal part 82 is fastened and fixed to the base side metal part 81 by a plurality of screws 85 as heat conduction connection means, and the light source side metal part 82 and the base side metal part 81 are closely connected so as to be capable of heat conduction. .
  • An insulating material 86 is interposed between the lamp device main body 34 and the lamp pin 44.
  • a light emitting module substrate 50 on which a plurality of LEDs 35 are mounted is attached in close contact with the substrate attachment portion 39 of the lamp device main body 34.
  • the lighting circuit 37 has a lighting circuit board 89 and a lighting circuit component 90 mounted on the lighting circuit board 89, and the lamp pin 44 is electrically connected to the input portion of the lighting circuit board 89 by a lead wire 91 to light up.
  • the light emitting module substrate 50 is electrically connected to the output portion of the circuit board 89 by a lead wire or the like.
  • the lighting circuit board 89 is accommodated in the accommodating portion 40 of the lamp device main body 34 with an insulating material (not shown) interposed therebetween.
  • the outer peripheral portion 83 of the lamp device main body 34 comes into contact with the reflecting plate portion 18 of the fixture main body 12 so as to be able to conduct heat, and the end surface of the protruding portion 42 of the lamp device main body 34 43 comes into contact with the flat plate portion 17 of the instrument body 12 so as to allow heat conduction.
  • the LED 35 of the lamp device 14 when the LED 35 of the lamp device 14 is lit, the heat generated from the LED 35 is efficiently radiated. That is, the light emitting module substrate 50 is attached in close contact with the substrate mounting portion 39 of the metal lamp device main body 34, and the screw 85 which is a heat conduction connecting means is capable of heat conduction from the substrate mounting portion 39 side to the base portion 38 side. Since it is connected, the heat generated by the LED 35 can be efficiently conducted to the board mounting portion 39 and also efficiently conducted from the board mounting portion 39 side to the base portion 38 side. The heat conducted to the base part 38 is thermally conducted to the instrument body 12 with which the base part 38 contacts, and can be efficiently radiated.
  • a plurality of slits that divide the reflector plate 18 in the circumferential direction are provided in the reflector plate 18 so that the small pieces of the divided reflector plate 18 have elasticity, and the outer periphery of the lamp device main body 34 83 and the reflector 18 may be configured to be in close contact with each other. Furthermore, a metal spring member that is in close contact with the outer peripheral portion 83 of the lamp device main body 34 may be separately received and thermally conducted.
  • FIG. 15 shows a seventh embodiment
  • FIG. 15 is a sectional view of a lighting fixture.
  • the screw unit 94 is used as a heat conduction connecting means for connecting the lamp device main body 34 from the substrate mounting part 39 side to the base part 38 side so as to allow heat conduction. That is, a screw portion 95 is formed on the outer peripheral portion 83 of the base metal component 81, and a screw portion 96 that is screwed to the screw portion 95 of the base metal component 81 is formed on the peripheral portion of the light source side metal component 82.
  • the lamp device main body 34 may be divided vertically by a dividing line in the height direction passing through the center of the lamp device main body 34, and these may be coupled by screwing or the like.
  • the substrate attachment portion 39 side and the base portion 38 side are integrated as a heat conduction connecting means, and heat can be efficiently conducted from the substrate attachment portion 39 side to the base portion 38 side.
  • FIG. 16 and FIG. 17 show an eighth embodiment
  • FIG. 16 is a side view of the lamp device
  • FIG. 17 is a cross-sectional view of the lighting fixture.
  • a flat substrate mounting portion 39 to which the light emitting module substrate 50 is mounted so as to be capable of conducting heat is formed on the lower surface of the base portion 38 of the lamp device main body 34, and the lighting circuit 37 is accommodated inside the protruding portion 42 of the base portion 38.
  • Part 40 is formed.
  • the lamp pin 44 and the lighting circuit 37 may be connected by forming a groove in the board mounting portion 39 and arranging a lead wire for connecting the lamp pin 44 and the lighting circuit 37 in the groove.
  • a part or all of the projecting portion 42 of the lamp device main body 34 is divided and formed so that the lighting circuit 37 can be accommodated in the accommodating portion 40.
  • the contact surface 41 of the base portion 38 of the lamp device 14 is configured to be in close contact with the instrument main body 12 so as to be able to conduct heat.
  • an opening is formed in the instrument main body 12 corresponding to the position of the lamp pin 44 of the lamp device 14, and the socket device 13 is arranged facing the opening, so that the lamp pin 44 does not contact the instrument main body 12.
  • the socket device 13 can be mounted.
  • the heat conducted to the base part 38 is efficiently conducted to the instrument body 12 with which the contact surface 41 of the base part 38 comes into contact, and can be radiated efficiently.
  • the lighting circuit 37 may be disposed together with the LED 35 on the lower surface side of the lamp device body 34.
  • the lamp device main body 34 does not need to be provided with the accommodating portion 40 for accommodating the lighting circuit 37 or is formed separately, and the lamp device main body 34 can be simplified.
  • FIG. 18 and FIG. 19 show a ninth embodiment
  • FIG. 18 is a sectional view of a lighting fixture
  • FIG. 19 is a perspective view of an exploded state of a lamp device.
  • the base portion 38 of the lamp device 14 includes a base 101, a cover 102 attached to the base 101, and a pair of lamp pins 44 protruding from the cover 102.
  • the base 101 is made of, for example, a metal having excellent thermal conductivity such as aluminum, and is a flat plate-shaped (annular) substrate mounting portion 39 and a cylindrical shape protruding from the center of the upper surface of the substrate mounting portion 39.
  • the protruding portion 42 and the annular wall portion 103 protruding from the periphery of the upper surface of the substrate mounting portion 39 are integrally formed.
  • An annular storage portion 40 for storing the lighting circuit 37 is formed between the protruding portion 42 and the wall portion 103 on the upper surface of the substrate mounting portion 39.
  • the light emitting module substrate 50 is attached to the lower surface of the substrate mounting portion 39 of the base 101 with screws so that the light emitting module substrate 50 comes into surface contact and comes into close contact therewith.
  • the cover 102 is made of an insulating synthetic resin and formed in a ring shape.
  • the cover 102 is attached so as to close the upper surface of the storage portion 40 of the base 101.
  • the lighting circuit 37 has a lighting circuit board 89 formed in an annular shape, and is housed and attached in the housing part 40 of the base part 38 with an insulating material (not shown) interposed therebetween.
  • the protruding portion 42 of the lamp device 14 When the lamp device 14 is mounted on the socket device 13, the protruding portion 42 of the lamp device 14 is inserted into the insertion hole 22 of the socket device 13, and the end surface 43 of the protruding portion 42 is the flat plate portion 17 of the instrument body 12. In contact with heat conduction. At this time, a plurality of slits that divide a part of the flat plate portion 17 of the instrument main body 12 are provided in the flat plate portion 17 so that the small pieces of the divided flat plate portion 17 have elasticity, so that the end surface 43 of the protruding portion 42 is provided. It may be in contact with the end face 43 of the projecting portion 42, or a metal spring member that is in close contact with the end face 43 may be provided separately so as to be able to conduct heat.
  • the LED 35 of the lamp device 14 when the LED 35 of the lamp device 14 is turned on, heat generated by the LED 35 is efficiently conducted from the light emitting module substrate 50 to the substrate mounting portion 39 of the base 101 of the base portion 38, and the substrate mounting portion 39 of the base 101 is transmitted.
  • the heat conducted to the projecting portion 42 formed integrally is efficiently conducted.
  • the heat conducted to the projection 42 is efficiently conducted from the end face 43 of the projection 42 to the instrument body 12, and the heat conducted to the instrument body 12 is radiated into the atmosphere.
  • the heat generated by the LED 35 that is thermally conducted to the board mounting portion 39 of the base 101 can be efficiently conducted to the projecting portion 42 that is integrally formed, and the heat is collected in the projecting portion 42 and the efficiency from the projecting portion 42 is increased. It is possible to release heat to the instrument body 12 and improve heat dissipation.
  • the heat conducted to the board mounting portion 39 of the base 101 is also efficiently conducted to the integrally formed wall 103, and the heat conducted to the wall 103 is transferred from the wall 103 to the atmosphere. Heat is dissipated inside. Therefore, the heat dissipation of the heat generated by the LED 35 can be improved.
  • the lamp device 14 according to the present embodiment has sufficient heat dissipation, can suppress the temperature rise of the LED 35, the LED 35 is thermally deteriorated and has a short life, and in some cases, the luminous efficiency is reduced. Can be prevented.
  • FIG. 20 shows a tenth embodiment.
  • FIG. 20 is a cross-sectional view of the lighting fixture.
  • the lamp device 14 has a protruding part 42 of the base 101 of the base part 38 in a cylindrical shape, and the inside of the protruding part 42 is solid.
  • the contact area with the board mounting portion 39 is increased, and the heat conduction efficiency is increased, so that the heat of the LED 35 can be easily conducted from the light emitting module substrate 50 to the end face 43 of the protruding portion 42.
  • the thermal conductivity from the board mounting portion 39 to the base 101 can be improved, and as a result, the heat dissipation of the heat generated by the LED 35 can be further improved.
  • FIG. 21 shows an eleventh embodiment.
  • FIG. 21 is a perspective view of a lighting fixture.
  • An exhaust hole 106 is provided in the flat plate portion 17 of the instrument body 12, and a fan 107 that exhausts the air in the instrument body 12 from the exhaust hole 106 to the outside is disposed.
  • the socket device 13 is provided with a plurality of vent holes 108 that communicate the outer peripheral surface of the socket device main body 21 and the inner peripheral surface of the insertion hole 22.
  • the air below the instrument body 12 is sucked into the instrument body 12 from the opening 19 on the lower surface of the instrument body 12, and the insertion hole 22 and this through the plurality of vent holes 108 of the socket device 13 A flow of air that flows upward through the gap with the projecting portion 42 of the lamp device 14 inserted through the insertion hole 22 and exhausted upward from the exhaust hole 106 to the upper part of the instrument body 12 is generated.
  • This air flow allows the heat conducted to the protrusion 42 to be efficiently radiated into the air, and as a result, the heat dissipation of the heat generated by the LED 35 can be improved.
  • FIG. 22 shows a twelfth embodiment.
  • FIG. 22 is a perspective view of the lighting fixture.
  • a fin 109 is provided on the projecting portion 42 of the lamp device 14, and this fin 109 increases the contact area with the air flowing through the operation of the fan 107 to dissipate heat. Can be improved.
  • FIGS. 23 to 27 show a thirteenth embodiment, in which FIG. 23 is a perspective view of a lamp device and a socket device of a lighting fixture in an exploded state, FIG. 24 is a plan view of the lamp device, and FIG. 25 is a lamp pin of the lamp device.
  • FIG. 26 is a partial cross-sectional view showing the relationship between the power supply unit of the socket device and FIGS. 26A and 26B show the relationship between the signal terminal of the lamp device and the signal transmission unit of the socket device.
  • FIG. 27 is a circuit diagram of a lighting apparatus.
  • the luminaire 11 is, for example, a downlight, a fixture main body (not shown), a socket device 13 that is attached to the fixture main body, and that can be attached to and detached from the socket device 13.
  • a lamp device 14 having
  • a pair of socket portions 24 are formed on the lower surface of the socket device body 21 of the socket device 13 at symmetrical positions with respect to the center of the socket device body 21. As shown in FIG. 25, these socket portions 24 are formed with connection holes 25 for power supply, and for power supply as power supply portions for supplying power to the lamp device 14 inside the connection holes 25.
  • a receipt 111 is arranged.
  • the connection hole 25 is an arc-shaped long hole that is concentric with the center of the socket device main body 21, and has an enlarged diameter portion 26 formed at one end thereof.
  • the power receiving metal 111 is disposed on the side of the other end of the connection hole 25 and is disposed at a position where it cannot be touched from the outside of the connection hole 25.
  • connection hole 112 is formed, and as shown in FIG. 26, a signal receiver 113 as a signal transmission unit that transmits a signal to the lamp device 14 is disposed inside the connection hole 112.
  • the connection hole 112 is configured as an arc-shaped elongated hole that is concentric with the center of the socket device main body 21, but a diameter-enlarged portion may be provided on one end side.
  • the signal receiver 113 is intruded and arranged at a position where the other end of the connection hole 112 faces the connection hole 112.
  • the power supply wire 111 is electrically connected to a power line wired to the instrument body 12, and the signal wire 113 is electrically connected to a signal line from a control device (not shown).
  • the contact surface 41 of the base portion 38 of the lamp device 14 has a pair of conductive metal lamp pins 44 in a symmetrical position with respect to the center of the lamp device 14. Is protruding. These lamp pins 44 are formed with a shaft portion 44a and a large-diameter portion 45 at the tip portion of the shaft portion 44a. Then, when the lamp device 14 is attached to the socket device 13, as shown in FIG. 25 (a), the large diameter portion 45 of each lamp pin 44 is inserted from the large diameter portion 26 of each connection hole 25 of the socket device 13, As shown in FIG.
  • the contact surface 41 of the base portion 38 of the lamp device 14 is a position orthogonal to the pair of lamp pins 44 and is symmetrical with respect to the center of the lamp device 14, and a pair of conductive metal signals.
  • a terminal 115 is projected.
  • These signal terminals 115 are constituted by cylindrical pins.
  • the lighting circuit 37 includes a lighting circuit board, and the power input side of the lighting circuit board and the lamp pin 44 are electrically connected by a lead wire or the like, and the lighting output side of the lighting circuit board and the light emitting module board 50 Are electrically connected by lead wires or the like. Further, a control circuit for adjusting the output of the lighting circuit 37 is mounted on the lighting circuit board, and the signal input section of the control circuit and the signal terminal 115 are electrically connected by a lead wire or the like.
  • FIG. 27 shows a circuit diagram of the luminaire 11.
  • the luminaire 11 controls the light output of the LED 35 of the lamp device 14, here the dimming of the LED 35, by a signal from the outside.
  • the socket device 13 is connected to a commercial power source e for receiving a power supply 111.
  • the lamp device 14 has a lamp pin 44 connected to the input side of a diode bridge DB1, which is a full-wave rectifier.
  • a smoothing capacitor C1 is connected to the output side of the diode bridge DB1, and a series circuit of a primary winding of the transformer Tr1 and an NPN transistor Q1 as a switching element for output control is connected. By controlling the driving of the transistor Q1 with a driving circuit, the DC current flowing on the secondary side of the transformer Tr1 is controlled.
  • a rectifying / smoothing circuit including a rectifying diode D1 and a smoothing electrolytic capacitor C2 is connected to the secondary side of the transformer Tr1, and resistors R1, R2, R3, LEDs 35, 35, 35, and transistors are connected to the rectifying / smoothing circuit.
  • Multiple series circuits of Q2, Q3, and Q4 are connected in parallel.
  • a series circuit of a resistor R4 and an electrolytic capacitor C3 is connected between the electrolytic capacitor C2 and the resistors R1, R2, and R3, and a control circuit 117 is connected in parallel with the electrolytic capacitor C3.
  • a PWM signal is supplied from the control circuit 117 to the bases of the transistors Q2, Q3, and Q4, and the transistors Q2, Q3, and Q4 are PWM-controlled.
  • a dimming signal from the outside is input to the control circuit 117 through the signal receiver 113 of the socket device 13 and the signal terminal 115 of the lamp device 14.
  • each signal terminal 115 is inserted into one end of each connection hole 112 of the socket device 13 as shown in FIG.
  • the shaft portion 44a of the lamp pin 44 moves to the connection hole 25, and the large diameter portion 45 of the lamp pin 44 feeds power.
  • the large diameter portion 45 is hooked on the edge portion of the connection hole 25 and the lamp device 14 is held by the socket device 13 while being in contact with and electrically connected to the metal receiver 111.
  • the signal terminal 115 moves to the other end side of the connection hole 112, and the signal terminal 115 contacts and is electrically connected to the signal receiver 113.
  • the lamp pin 44 of the lamp device 14 is electrically connected to the power receiving metal 111 of the socket device 13, and power can be supplied from the socket device 13 to the lamp device 14. It becomes.
  • the signal terminal 115 of the lamp device 14 is electrically connected to the signal receiver 113 of the socket device 13, and the signal can be transmitted from the socket device 13 to the lamp device 14.
  • the commercial power source e When the commercial power source e is turned on, the commercial power source e is rectified by the diode bridge DB1 and smoothed by the smoothing capacitor C1.
  • the transistor Q1 controls the current flowing on the primary side of the transformer Tr1, and the direct current flowing on the secondary side of the transformer Tr1 is controlled to a predetermined current value.
  • a direct current flowing on the secondary side of the transformer Tr1 is supplied to the LED 35, and the LED 35 is turned on.
  • the transistors Q2, Q3, and Q4 are PWM-controlled by the control circuit 117, and the LED 35 is turned on when the transistors Q2, Q3, and Q4 are on, and the LED 35 is turned off when the transistors Q2, Q3, and Q4 are off.
  • the LED 35 is repeatedly turned on and off, but since it blinks at high speed, it seems to the user that the lighting of the LED 35 is maintained.
  • a dimming signal from the outside is input to the control circuit 117, and the control circuit 117 performs PWM control on the transistors Q2, Q3, and Q4 based on the input signal to dim the LED 35.
  • the base portion 38 is provided with the signal terminal 115 for receiving the signal transmitted from the socket device 13 in addition to the lamp pin 44 for receiving power supply from the socket device 13, so that the signal received by the signal terminal 115 can be changed.
  • the LED 35 can be dimmed by adjusting the output of the lighting circuit 37.
  • the signal terminal 115 is connected to the signal receiver 113 when the lamp pin 44 is connected to the power receiver 111, dimming control of the LED 35 is possible by attaching the lamp device 14 to the socket device 13. It becomes.
  • the light control signal from the socket device 13 side is transmitted to the lamp device that does not have a light control function.
  • the lamp device that does not have the dimming function is lit at a predetermined output regardless of the dimming signal.
  • the lamp device 14 having a dimming function cannot be mounted on a socket device that does not support dimming because the signal terminal 115 protrudes from the base portion 38.
  • the pair of signal terminals 115 arranged in the base portion 38 of the lamp device 14 are arranged together in one direction orthogonal to the pair of lamp pins 44. May be. In this case, there is an advantage that the lamp pin 44 side having a high voltage can be separated from the signal terminal 115 side having a low voltage for transmitting a signal.
  • the pair of signal terminals 115 arranged on the base portion 38 of the lamp device 14 may be protruded from the side portion of the protruding portion 42.
  • a configuration corresponding to the connection hole 112 or the signal receiving metal 113 may be provided inside the insertion hole 22 of the socket device 13.
  • the pair of signal terminals 115 arranged on the base part 38 of the lamp device 14 may be provided on the end face of the protruding part 42 of the base part 38.
  • a configuration corresponding to the signal receiver 113 connected to the signal terminal 115 may be disposed on the instrument body 12 side.
  • the signal transmitted to the lamp device 14 is not limited to the dimming signal for dimming the LED 35, but may be an RGB signal for adjusting the color of the LED 35 as long as the lamp device 14 can perform color illumination.
  • the end face 43 of the protruding portion 42 of the base portion 38 is obtained. And can be pressed in the direction in which the radiator is in contact.
  • the present invention is used for downlights, recessed ceiling lighting fixtures, direct ceiling lighting fixtures, suspended lighting fixtures, wall front fixtures, and other lighting fixtures.
  • Lighting fixture Fixture body as radiator 13 Socket device 14 Lamp device 21 Socket device body 22 Insertion hole 30 Elastic body as pressing body 34 Lamp device body 35 LED as light source and semiconductor light emitting element 37 Lighting circuit 38 Base part 39 Board mounting part 42 Projection 44 Lamp pin 50 Light emitting module board 55 Heat sink as heat sink 56 Spring as pressure body 60 Heat sink as heat sink 61 Spring as pressure body 67 Heat sink and press Heat-dissipating member as a body 71 Socket support 85 Screw as a heat conduction connecting means 94 Screwed portion as a heat conduction connecting means 111 Feed receiving as a power feeding part 113 Signal receiving as a signal transmission part 115 Signal terminal 117 Control circuit

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

A lighting device (11) capable of efficiently dissipating heat of a lamp device (14) mounted to a socket device (13). When the lamp device (14) is mounted to the socket device (13), a fitting section (38) of the lamp device (14) makes contact with a device body (12) and, at the same time, an elastic body (30) presses the fitting section (38) to the device body (12) in such a manner that the fitting section (38) is in close contact with the device body (12).  Heat created by lighting of an LED (35) of the lamp device (14) is transferred from the fitting section (38) to the device body (12).  Thus, the heat of the lamp device (14) is efficiently dissipated.

Description

照明器具lighting equipment
　本発明は、扁平状で一面側に口金部が設けられるとともに他面側に光源が配置されたランプ装置を用いる照明器具に関する。 The present invention relates to a luminaire that uses a lamp device that is flat and has a base on one side and a light source on the other side.
　従来、ＩＥＣ（国際電気標準会議）で規格されたＧＸ５３形の口金部を用いたランプ装置がある。このランプ装置は、扁平状のランプ装置本体を有し、このランプ装置本体の上面側にＧＸ５３形の口金部が設けられ、ランプ装置本体の下面側に蛍光ランプやＬＥＤ等を用いた平面形の光源が配置され、ランプ装置本体の内部に光源を点灯させる点灯回路が収容されている。口金部には、先端に径大部を有する一対のランプピンが突出されている。そして、ランプ装置のランプピンをソケット装置に挿入し、ランプ装置を回動させてランプピンをソケット装置に引っ掛けることにより、ランプ装置をソケット装置に保持するとともに、ランプピンにソケット装置から電力を供給するように構成されている（例えば、特許文献１参照。）。 Conventionally, there is a lamp device using a base part of the GX53 type standardized by IEC (International Electrotechnical Commission). This lamp device has a flat lamp device main body, a GX53-type base portion is provided on the upper surface side of the lamp device main body, and a flat type using a fluorescent lamp, LED, or the like on the lower surface side of the lamp device main body. A light source is arranged, and a lighting circuit for lighting the light source is accommodated inside the lamp device main body. A pair of lamp pins having a large-diameter portion at the tip protrudes from the base portion. Then, by inserting the lamp pin of the lamp device into the socket device, rotating the lamp device and hooking the lamp pin on the socket device, the lamp device is held in the socket device and power is supplied to the lamp pin from the socket device. (For example, refer patent document 1).
特開２００７－１５７３６７号公報（第５－８頁、図１－２）JP 2007-157367 A (page 5-8, FIG. 1-2)
　ランプ装置の点灯時には、光源が発熱するため、放熱が必要であり、ランプ装置の口金部からの放熱も効果的である。 Since the light source generates heat when the lamp device is turned on, heat dissipation is necessary, and heat dissipation from the base portion of the lamp device is also effective.
　しかしながら、ランプ装置の口金部をソケット装置に装着した状態においては、取付構造上、外部に露出する口金部の面積が少なくなるため、放熱性が低下する。また、口金部からソケット装置側に熱を伝導させることも考えられるが、口金部とソケット装置との間には隙間が生じ、互いに密着されないため、口金部の熱がソケット装置側に効率よく伝達されず、十分な放熱性が得られない問題がある。 However, in the state in which the base part of the lamp device is mounted on the socket device, the area of the base part exposed to the outside is reduced due to the mounting structure, so that the heat dissipation is reduced. In addition, it is conceivable to conduct heat from the base part to the socket device side, but there is a gap between the base part and the socket device, so that the heat of the base part is efficiently transferred to the socket device side. There is a problem that sufficient heat dissipation is not obtained.
　本発明は、このような点に鑑みなされたもので、ソケット装置に装着されたランプ装置の熱を口金部から効率よく放熱させることができる照明器具を提供することを目的とする。 This invention is made in view of such a point, and it aims at providing the lighting fixture which can efficiently radiate the heat | fever of the lamp device with which the socket apparatus was mounted | worn from a nozzle | cap | die part.
　請求項１記載の照明器具は、扁平状のランプ装置の一面側に設けられた口金部を保持するとともに、ランプ装置の他面側に配置された光源を点灯させるための電力を口金部に供給するソケット装置と；このソケット装置に保持された前記ランプ装置の口金部の少なくとも一部と接触する放熱体と；前記ソケット装置に保持された前記ランプ装置の口金部と前記放熱体とを接触方向に押圧する押圧体と；を具備しているものである。 The lighting fixture according to claim 1 holds a base part provided on one side of a flat lamp device and supplies power to the base part to light a light source disposed on the other side of the lamp device. A socket device that contacts the at least part of a cap portion of the lamp device held by the socket device; a contact direction between the cap portion of the lamp device held by the socket device and the heat sink And a pressing body that presses against the surface.
　ランプ装置の口金部は、例えば、ＧＸ５３形の口金構造が用いられ、少なくとも放熱体と接触する箇所には熱伝導性に優れた金属材料を用いてもよい。また、光源は、ＬＥＤおよび有機ＥＬ等の半導体発光素子や、平面形の放電ランプなど、平面形で薄形の光源であればいずれでも構わない。この光源を覆うグローブがランプ装置に取り付けてもよい。 The base part of the lamp device has, for example, a GX53-type base structure, and a metal material having excellent thermal conductivity may be used at least at a place where it contacts the radiator. The light source may be any flat and thin light source such as a semiconductor light emitting element such as an LED and an organic EL, or a flat discharge lamp. A globe covering this light source may be attached to the lamp device.
　ソケット装置は、例えば、ランプ装置のＧＸ５３形の口金部を装着可能とし、その口金部を保持するとともに口金部に電力を供給可能とする。 The socket device can, for example, be equipped with a cap unit of the lamp device GX53 type, hold the cap unit, and supply power to the cap unit.
　放熱体は、例えば、熱伝導性および放熱性に優れた金属製で、フィンなどの放熱構造を備えていてもよく、また、金属製の反射体や器具本体などを兼用しても構わない。 The heat radiator is made of, for example, a metal excellent in thermal conductivity and heat dissipation, and may have a heat radiation structure such as a fin, or may be used as a metal reflector or an instrument body.
　押圧体は、例えば、スプリングやゴム等の弾性体が用いられ、放熱体を口金部に押圧しても、口金部を放熱体に押圧してもよい。 For example, an elastic body such as a spring or rubber is used as the pressing body, and the base may be pressed against the base or the base may be pressed against the base.
　放熱体と押圧体とは、別体でもよいし、放熱体自体が押圧機能を備えた一体構造でもよい。例えば、放熱機能と押圧機能とを備えた金属製のベローズのような一体構造でも構わない。 The heat radiating body and the pressing body may be separate members, or the heat radiating body itself may have an integrated structure having a pressing function. For example, an integrated structure such as a metal bellows having a heat dissipation function and a pressing function may be used.
　請求項２記載の照明器具は、請求項１記載の照明器具において、前記ソケット装置が配置された器具本体を具備し、前記放熱体は、前記ランプ装置の口金部と前記器具本体とに接触するものである。 The lighting fixture according to claim 2 is the lighting fixture according to claim 1, further comprising a fixture main body on which the socket device is arranged, and the radiator is in contact with a base portion of the lamp device and the fixture main body. Is.
　器具本体と放熱体とは予め密着するように取り付けてもよいし、口金部と放熱体とを接触方向に押圧する押圧体により器具本体と放熱体とを接触方向に押圧して密着させてもよい。 The instrument body and the radiator may be attached in close contact with each other in advance, or the instrument body and the radiator may be pressed in close contact with the pressing body that presses the base part and the radiator in the contact direction. Good.
　請求項３記載の照明器具は、請求項１記載の照明器具において、前記ソケット装置は、前記ランプ装置の口金部の中央から突出された突出部が挿通される挿通孔を有し、前記放熱体は、前記ソケット装置に挿通された前記突出部の端面と面接触するものである。 The lighting fixture according to claim 3 is the lighting fixture according to claim 1, wherein the socket device has an insertion hole through which a protruding portion protruding from a center of a base portion of the lamp device is inserted, and the radiator. Is in surface contact with the end face of the projecting portion inserted through the socket device.
　口金部の突出部は、ソケット装置から突出して放熱体と接触するようにしてもよいし、ソケット装置から突出せず放熱体がソケット装置側に入り込んで接触するようにしてもよい。 The protruding portion of the base portion may protrude from the socket device and come into contact with the heat radiating body, or the heat radiating member may enter and contact the socket device without protruding from the socket device.
　請求項４記載の照明器具は、請求項１記載の照明器具において、前記ソケット装置は、ソケット支持体と、前記ランプ装置の口金部を着脱可能とし、前記ソケット支持体により前記ソケット支持体側に収納される収納位置と前記ソケット支持体側から突出する突出位置との間で移動可能に支持されたソケット装置本体とを有しているものである。 The lighting fixture according to claim 4 is the lighting fixture according to claim 1, wherein the socket device is configured such that a socket support and a base portion of the lamp device are detachable, and are accommodated on the socket support side by the socket support. And a socket device main body supported so as to be movable between a storage position to be projected and a projecting position projecting from the socket support side.
　ソケット支持体は、例えば、照明器具の器具本体等に取り付けられるもので、ソケット装置本体を収納位置と突出位置との間で移動可能であればどのような構成を用いてソケット装置本体を支持していても構わない。また、収納位置でソケット装置本体を係止する係止構造を用いてもよく、この係止構造は、例えば押しボタンスイッチや筆記具のノック機構のように、押圧動作の繰り返しによって保持位置が突出状態、収納状態に順次切り換わる機構を用いることができる。すなわち、ランプ装置にてソケット装置本体を突出位置から収納位置に押して移動させることで係止し、さらにもう一度、ランプ装置にてソケット装置本体を少し押すことで係止が外れ、ソケット装置本体が収納位置から突出位置へ移動するのを許容するようにすればよい。ソケット装置本体を突出させる方向にはスプリングなどの付勢部材を用いてもよい。 The socket support body is attached to, for example, a fixture body of a lighting fixture, and supports the socket device body using any configuration as long as the socket device body can be moved between a storage position and a protruding position. It does not matter. In addition, a locking structure that locks the socket device main body at the storage position may be used. This locking structure is such that the holding position protrudes by repeated pressing operations, such as a push button switch or a knock mechanism of a writing instrument. A mechanism that sequentially switches to the storage state can be used. In other words, the lamp device is locked by pushing the socket device body from the protruding position to the storage position and moving it, and once again, the lamp device is released by slightly pushing the socket device body, and the socket device body is stored. It is only necessary to allow movement from the position to the protruding position. An urging member such as a spring may be used in the direction in which the socket device main body projects.
　ソケット装置本体は、ランプ装置のＧＸ５３形の口金部を装着可能とし、その口金部を保持するとともに口金部に電力を供給可能とする。 The socket device body can be fitted with a lamp unit GX53 type cap portion, and can hold the cap portion and supply power to the cap portion.
　請求項５記載の照明器具は、請求項１記載の照明器具において、扁平状のランプ装置本体と、このランプ装置本体の一面側に設けられた口金部と、前記ランプ装置本体の他面側に配置された光源と、この光源を点灯させる点灯回路とを有するランプ装置を具備しているものである。 The lighting fixture according to claim 5 is the lighting fixture according to claim 1, wherein the flat lamp device main body, a cap provided on one surface side of the lamp device main body, and the other surface side of the lamp device main body are provided. A lamp device having a light source arranged and a lighting circuit for lighting the light source is provided.
　ランプ装置本体と口金部とは、一体でも別体でも構わない。 The lamp device main body and the base part may be integrated or separated.
　点灯回路は、ランプ装置本体内に収納されていても、ランプ装置本体の他面側に光源と一緒に配置されていても構わない。 The lighting circuit may be housed in the lamp device main body or may be disposed together with the light source on the other surface side of the lamp device main body.
　なお、ランプ装置本体の他面側には光源を覆うグローブを取り付けてもよい。 In addition, you may attach the glove which covers a light source on the other surface side of a lamp apparatus main body.
　請求項６記載の照明器具は、請求項５記載の照明器具において、前記ランプ装置は、前記ランプ装置本体の他面側に設けられた基板取付部と、この基板取付部と前記口金部とを熱伝導可能に接続する熱伝導接続手段と、前記光源として半導体発光素子を搭載し、前記基板取付部に取り付けられた発光モジュール基板とを有しているものである。 The lighting fixture according to claim 6 is the lighting fixture according to claim 5, wherein the lamp device includes a board mounting portion provided on the other surface side of the lamp device main body, the board mounting portion, and the base portion. The heat-conducting connection means is connected to enable heat conduction, and the light-emitting module substrate mounted on the substrate mounting portion is mounted with a semiconductor light-emitting element as the light source.
　ランプ装置本体の口金部と基板取付部とは別体でも一体でも構わない。別体であれば、それらをねじ止めや互いに螺合するなどの熱伝導接続手段によって密着させ、基板取付部側から口金部側に熱伝導可能に接続する。熱伝導接続手段として一体構造を用いれば、基板取付部側から口金部側に熱伝導可能に接続された状態となる。 The base part of the lamp device body and the board mounting part may be separate or integrated. If they are separate bodies, they are brought into close contact with each other by heat conduction connection means such as screwing or screwing together, and connected from the substrate mounting portion side to the base portion side so as to be capable of heat conduction. If a monolithic structure is used as the heat conduction connecting means, a state is established in which heat conduction is possible from the substrate mounting portion side to the base portion side.
　発光モジュール基板は、例えば、金属製の基板に絶縁層を介して配線パターンが形成され、配線パターン上に半導体発光素子が接続され、ねじ等によってランプ装置本体の基板取付部に密着するように取り付けられる。 The light emitting module substrate is attached so that, for example, a wiring pattern is formed on a metal substrate via an insulating layer, a semiconductor light emitting element is connected on the wiring pattern, and is closely attached to the substrate mounting portion of the lamp device body by screws or the like. It is done.
　請求項７記載の照明器具は、請求項５記載の照明器具において、前記ランプ装置は、前記ランプ装置本体の他面側に設けられた基板取付部と、この基板取付部と一体に形成され、この基板取付部の一面側中央から前記口金側に突出する突出部と、前記光源として半導体発光素子が搭載され、前記基板取付部に取り付けられた発光モジュール基板とを有しているものである。 The lighting fixture according to claim 7 is the lighting fixture according to claim 5, wherein the lamp device is formed integrally with a substrate mounting portion provided on the other surface side of the lamp device main body, and the substrate mounting portion. The substrate mounting portion includes a projecting portion protruding from the center of one surface side toward the base, and a light emitting module substrate on which a semiconductor light emitting element is mounted as the light source and is mounted on the substrate mounting portion.
　突出部は、基板取付部と一体に形成されているものであれば、その内側の構造は中空でも中実でも構わない。 As long as the protruding portion is formed integrally with the substrate mounting portion, the inner structure may be hollow or solid.
　発光モジュール基板は、例えば、金属製の基板に絶縁層を介して配線パターンが形成され、配線パターン上に半導体発光素子が実装され、ねじ等によってランプ装置本体の基板取付部に密着するように取り付けられる。 The light emitting module substrate is, for example, a wiring pattern formed on a metal substrate through an insulating layer, a semiconductor light emitting element is mounted on the wiring pattern, and is attached so as to be in close contact with the substrate mounting portion of the lamp device main body with a screw or the like It is done.
　請求項８記載の照明器具は、請求項１記載の照明器具において、前記ソケット装置は、前記ランプ装置の口金部を保持するソケット装置本体と、このソケット装置本体に保持された前記ランプ装置に電力を供給する給電部と、前記ソケット装置本体に保持された前記ランプ装置に信号を伝送する信号伝送部とを有し、前記ランプ装置は、前記ソケット装置の給電部から電力供給を受けるように前記給電部と接続可能なランプピンと、このランプピンが前記給電部と接続している状態において前記ソケット装置の信号伝送部から伝送される信号を受信可能なように前記信号伝送部と接続する信号端子と、前記ランプピンから電力供給を受けて光源を点灯させる点灯回路と、前記信号端子に入力された信号を受けて前記点灯回路の出力を調整する制御回路とを有しているものである。 The lighting fixture according to claim 8 is the lighting fixture according to claim 1, wherein the socket device is configured to supply power to a socket device main body that holds a base portion of the lamp device and the lamp device held by the socket device main body. And a signal transmission unit that transmits a signal to the lamp device held in the socket device body, and the lamp device receives power supply from the power supply unit of the socket device. A lamp pin connectable to the power supply unit, and a signal terminal connected to the signal transmission unit so as to receive a signal transmitted from the signal transmission unit of the socket device in a state where the lamp pin is connected to the power supply unit; A lighting circuit for turning on the light source by receiving power supply from the lamp pin, and adjusting the output of the lighting circuit by receiving the signal input to the signal terminal In which and a control circuit.
　ソケット装置本体は、例えば、絶縁性を有する合成樹脂などで形成され、給電部および信号伝送部が配置される。 The socket device body is formed of, for example, an insulating synthetic resin, and a power feeding unit and a signal transmission unit are arranged.
　給電部は、ソケット装置本体に保持されたランプ装置のランプピンと接触して電気的に接続される。 The power feeding unit is in electrical contact with the lamp pin of the lamp device held in the socket device body.
　信号伝送部は、ソケット装置本体に保持されたランプ装置の信号端子と接触して電気的に接続される。信号伝送部は、ソケット装置本体の表面に形成された孔の内側に配置されていても、ソケット装置本体の表面に設けられていても、ソケット装置本体から突出していてもよく、信号端子の形態に対応して、互いに接触して電気的に接続可能であれば、どのような構成でも構わない。 The signal transmission unit is in electrical contact with the signal terminal of the lamp device held in the socket device body. The signal transmission unit may be disposed inside a hole formed on the surface of the socket device body, provided on the surface of the socket device body, or may protrude from the socket device body. As long as they can be electrically connected to each other, any configuration may be used.
　ランプピンは、例えば、口金部から突出し、先端部に径大部を有し、ソケット装置への装着によってソケット装置に引っ掛かって保持されるとともに電力の供給が可能なようにソケット装置の給電部に電気的に接続される。 The lamp pin, for example, protrudes from the base part, has a large-diameter part at the tip part, and is hooked and held by the socket apparatus when attached to the socket apparatus, and the power supply part of the socket apparatus is electrically connected so that power can be supplied. Connected.
　信号端子は、例えば、口金部から突出されていても、口金部の表面に設けられていても、口金部の表面に設けられた孔の内側に配置されていてもよく、ランプ装置がソケット装置に保持された状態でソケット装置側の信号伝送部と接触して電気的に接続されれば、いずれでも構わない。信号は、調光信号やＲＧＢ信号等の光源の出力を制御するものであればいずれでも構わない。 For example, the signal terminal may protrude from the base part, may be provided on the surface of the base part, or may be disposed inside a hole provided on the surface of the base part. As long as it is in contact with and electrically connected to the signal transmission unit on the socket device side, it does not matter. The signal may be any signal as long as it controls the output of the light source such as a dimming signal or an RGB signal.
　点灯回路は、出力調整可能に構成されていれば、どのような回路構成でも構わない。 The lighting circuit may have any circuit configuration as long as it can be adjusted for output.
　制御回路は、入力された信号に応じて点灯回路の出力で調整可能に構成されていれば、どのような構成でも構わない。 The control circuit may have any configuration as long as it can be adjusted by the output of the lighting circuit according to the input signal.
　請求項１記載の照明器具によれば、ソケット装置に装着されたランプ装置の口金部と放熱体とが接触するとともに、押圧体によりランプ装置の口金部と放熱体とを接触方向に押圧するため、口金部と放熱体とを確実に密着させ、口金部から放熱体に効率よく熱伝導することが可能となり、ランプ装置の熱を口金部から効率よく放熱させることができる。 According to the lighting fixture of the first aspect, the base portion of the lamp device mounted on the socket device and the radiator are in contact with each other, and the base portion of the lamp device and the radiator are pressed in the contact direction by the pressing body. The base part and the heat radiating body are securely brought into close contact with each other, and heat can be efficiently conducted from the base part to the heat radiating body, so that the heat of the lamp device can be efficiently radiated from the base part.
　請求項２記載の照明器具によれば、請求項１記載の照明器具の効果に加えて、放熱体がランプ装置の口金部と器具本体とに接触し、口金部から器具本体に効率よく熱伝導することが可能となり、ランプ装置の熱を口金部から効率よく放熱させることができる。 According to the lighting fixture of claim 2, in addition to the effect of the lighting fixture of claim 1, the radiator contacts the base portion of the lamp device and the fixture body, and efficiently conducts heat from the base portion to the fixture body. Therefore, the heat of the lamp device can be efficiently radiated from the base part.
　請求項３記載の照明器具によれば、請求項１記載の照明器具の効果に加えて、ソケット装置に挿通された口金部の突出部の端面と放熱体とが面接触するため、口金部の突出部から放熱体に効率よく熱伝導できる。 According to the lighting fixture of claim 3, in addition to the effect of the lighting fixture of claim 1, the end surface of the protruding portion of the base portion inserted through the socket device and the radiator are in surface contact. Heat can be efficiently conducted from the protrusion to the radiator.
　請求項４記載の照明器具によれば、請求項１記載の照明器具の効果に加えて、ソケット装置本体を、ソケット支持体側に収納される収納位置とソケット支持体側から突出する突出位置との間で移動可能としたため、小形の照明器具に用いた場合であっても、ソケット装置本体を突出位置に移動させることで、ランプ装置を容易に着脱できる。しかも、ソケット装置本体を収納位置に移動させることで、ランプ装置の口金部と放熱体とを接触させることができる。 According to the lighting fixture of claim 4, in addition to the effect of the lighting fixture of claim 1, the socket device main body is placed between the storage position where the socket device body is stored on the socket support side and the protruding position where the socket support body protrudes from the socket support side. Therefore, the lamp device can be easily attached and detached by moving the socket device main body to the protruding position even when used in a small lighting fixture. In addition, by moving the socket device main body to the storage position, the base portion of the lamp device and the radiator can be brought into contact with each other.
　請求項５記載の照明器具によれば、請求項１記載の照明器具の効果に加えて、ランプ装置をソケット装置に装着することにより、ランプ装置の熱を口金部から効率よく放熱できる。 According to the lighting fixture according to claim 5, in addition to the effect of the lighting fixture according to claim 1, by mounting the lamp device on the socket device, the heat of the lamp device can be efficiently radiated from the base part.
　請求項６記載の照明器具によれば、請求項５記載の照明器具の効果に加えて、ランプ装置本体の基板取付部に発光モジュール基板を取り付け、この基板取付部側から口金部側に熱伝導可能に熱伝導接続手段にて接続しているため、半導体発光素子が発生する熱を基板取付部に効率よく熱伝導できるとともにこの基板取付部側から口金部側に効率よく熱伝導でき、放熱性を向上できる。 According to the luminaire described in claim 6, in addition to the effect of the luminaire described in claim 5, the light emitting module substrate is attached to the substrate attachment portion of the lamp device main body, and heat conduction is performed from the substrate attachment portion side to the base portion side. Because it is connected by heat conduction connection means, it is possible to efficiently conduct heat generated by the semiconductor light emitting element to the board mounting part, and to conduct heat efficiently from the board mounting part side to the base part side. Can be improved.
　請求項７記載の照明器具によれば、請求項５記載の照明器具の効果に加えて、ランプ装置本体に基板取付部、および基板取付部の一面側中央から突出する突出部を一体に形成し、この基板取付部の他面側に発光モジュール基板を取り付けるため、半導体発光素子が発生する熱をランプ装置本体の基板取付部へ、この基板取付部から突出部へ効率よく熱伝導でき、突出部に熱を集めてこの突出部から効率よく放熱することが可能となり、放熱性を向上できる。 According to the lighting fixture of claim 7, in addition to the effect of the lighting fixture of claim 5, the board mounting portion and the protruding portion protruding from the center of one surface side of the board mounting portion are integrally formed on the lamp device body. In order to mount the light emitting module substrate on the other surface side of the substrate mounting portion, the heat generated by the semiconductor light emitting element can be efficiently conducted from the substrate mounting portion to the projecting portion of the lamp device body. It is possible to collect heat and efficiently dissipate heat from the projecting portion, thereby improving heat dissipation.
　請求項８記載の照明器具によれば、請求項１記載の照明器具の効果に加えて、ソケット装置の給電部からランプ装置のランプピンに電力を供給するとともに、この給電部とランプピンと接続している状態においてソケット装置の信号伝送部からランプ装置の信号端子に信号を伝送することができるため、ソケット装置へのランプ装置の装着により、ランプ装置では、ソケット装置から信号を受け、その信号に応じて点灯回路の出力を調整することができる。 According to the lighting fixture of claim 8, in addition to the effect of the lighting fixture of claim 1, power is supplied from the power feeding portion of the socket device to the lamp pin of the lamp device, and the power feeding portion and the lamp pin are connected. Since the signal can be transmitted from the signal transmission unit of the socket device to the signal terminal of the lamp device in a state where the lamp device is in the state, the lamp device receives the signal from the socket device and attaches the signal according to the signal by attaching the lamp device to the socket device. The output of the lighting circuit can be adjusted.
本発明の第１の実施の形態を示すソケット装置にランプ装置を装着した照明器具の断面図である。It is sectional drawing of the lighting fixture which attached the lamp | ramp apparatus to the socket apparatus which shows the 1st Embodiment of this invention. 同上ランプ装置を外した照明器具の断面図である。It is sectional drawing of the lighting fixture which removed the lamp device same as the above. 同上ソケット装置およびランプ装置の分解状態の斜視図である。It is a perspective view of the decomposition | disassembly state of a socket apparatus and a lamp device same as the above. 同上ランプ装置の斜視図である。It is a perspective view of a lamp device same as the above. 本発明の第２の実施の形態を示す照明器具の断面図である。It is sectional drawing of the lighting fixture which shows the 2nd Embodiment of this invention. 本発明の第３の実施の形態を示す照明器具の一部を断面にした斜視図である。It is the perspective view which made a cross section a part of lighting fixture which shows the 3rd Embodiment of this invention. 同上照明器具の一部を透視した斜視図である。It is the perspective view which saw through a part of lighting fixture same as the above. 本発明の第４の実施の形態を示す照明器具の一部を透視した斜視図である。It is the perspective view which saw through a part of lighting fixture which shows the 4th Embodiment of this invention. 本発明の第５の実施の形態を示すソケット装置のソケット本体が突出位置に配置された照明器具の断面図である。It is sectional drawing of the lighting fixture with which the socket main body of the socket apparatus which shows the 5th Embodiment of this invention was arrange | positioned in the protrusion position. 同上ソケット装置のソケット本体が収納位置に配置された照明器具の断面図である。It is sectional drawing of the lighting fixture by which the socket main body of the socket apparatus same as the above was arrange | positioned in the accommodation position. 同上ソケット装置の突出位置に配置されたソケット本体にランプ装置を着脱する状態を示す斜視図である。It is a perspective view which shows the state which attaches or detaches a lamp apparatus to the socket main body arrange | positioned in the protrusion position of a socket apparatus same as the above. 同上ソケット装置の突出位置に配置されたソケット本体にランプ装置を装着した状態を示す斜視図である。It is a perspective view which shows the state which mounted | wore the socket main body arrange | positioned in the protrusion position of a socket apparatus same as the above with the lamp | ramp apparatus. 同上ソケット装置のソケット本体を収納位置に移動させた状態を示す斜視図である。It is a perspective view which shows the state which moved the socket main body of the socket apparatus same as the above to the accommodation position. 本発明の第６の実施の形態を示す照明器具の断面図である。It is sectional drawing of the lighting fixture which shows the 6th Embodiment of this invention. 本発明の第７の実施の形態を示す照明器具の断面図である。It is sectional drawing of the lighting fixture which shows the 7th Embodiment of this invention. 本発明の第８の実施の形態を示すランプ装置の側面図である。It is a side view of the lamp device which shows the 8th Embodiment of this invention. 同上照明器具の断面図である。It is sectional drawing of a lighting fixture same as the above. 本発明の第９の実施の形態を示す照明器具の断面図である。It is sectional drawing of the lighting fixture which shows the 9th Embodiment of this invention. 同上ランプ装置の分解状態の斜視図である。It is a perspective view of the decomposition | disassembly state of a lamp device same as the above. 本発明の第１０の実施の形態を示す照明器具の断面図である。It is sectional drawing of the lighting fixture which shows the 10th Embodiment of this invention. 本発明の第１１の実施の形態を示す照明器具の斜視図である。It is a perspective view of the lighting fixture which shows the 11th Embodiment of this invention. 本発明の第１２の実施の形態を示す照明器具の斜視図である。It is a perspective view of the lighting fixture which shows the 12th Embodiment of this invention. 本発明の第１３の実施の形態を示す照明器具のランプ装置とソケット装置の分解状態の斜視図である。It is a perspective view of the decomposition | disassembly state of the lamp device and socket device of the lighting fixture which shows the 13th Embodiment of this invention. 同上ランプ装置の平面図である。It is a top view of a lamp device same as the above. 同上ランプ装置のランプピンとソケット装置の給電部との関係を(a)(b)に示す一部の断面図である。It is a partial cross section figure which shows the relationship between the lamp pin of a lamp device same as the above, and the electric power feeding part of a socket apparatus to (a) (b). 同上ランプ装置の信号端子とソケット装置の信号伝送部との関係を(a)(b)に示す一部の断面図である。It is a fragmentary sectional view which shows the relationship between the signal terminal of a lamp device same as the above, and the signal transmission part of a socket apparatus in (a) (b). 同上照明器具の回路図である。It is a circuit diagram of a lighting fixture same as the above. 本発明の第１４の実施の形態を示すランプ装置の平面図である。It is a top view of the lamp device which shows the 14th Embodiment of this invention. 本発明の第１５の実施の形態を示すランプ装置の平面図である。It is a top view of the lamp device which shows the 15th Embodiment of this invention. 本発明の第１６の実施の形態を示すランプ装置の平面図である。It is a top view of the lamp device which shows the 16th Embodiment of this invention.
　以下、本発明の一実施の形態を、図面を参照して説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
　図１ないし図４に第１の実施の形態を示し、図１はソケット装置にランプ装置を装着した照明器具の断面図、図２はランプ装置を外した照明器具の断面図、図３はソケット装置およびランプ装置の分解状態の斜視図、図４はランプ装置の斜視図である。 1 to 4 show a first embodiment, in which FIG. 1 is a sectional view of a lighting fixture in which a lamp device is mounted on a socket device, FIG. 2 is a sectional view of the lighting fixture with the lamp device removed, and FIG. FIG. 4 is a perspective view of the lamp device. FIG.
　照明器具11は、例えばダウンライトであり、放熱体としての器具本体12、この器具本体12に取り付けられたソケット装置13、およびこのソケット装置13に着脱可能な扁平状のランプ装置14を備えている。なお、以下、これらの上下方向などの方向関係は、扁平状のランプ装置14を水平に取り付ける状態を基準として、ランプ装置14の一面側である口金側を上面側、ランプ装置14の他面側である光源側を下面側として説明する。 The lighting fixture 11 is, for example, a downlight, and includes a fixture main body 12 as a radiator, a socket device 13 attached to the fixture main body 12, and a flat lamp device 14 that can be attached to and detached from the socket device 13. . In the following, the directional relationship such as the vertical direction is based on the state in which the flat lamp device 14 is mounted horizontally, the base side, which is one surface side of the lamp device 14, being the upper surface side, and the other surface side of the lamp device 14 The light source side is described as the lower surface side.
　器具本体12は、金属製で、反射体と兼用するように形成されており、円形の平板部17、およびこの平板部17の周辺部から下方へ湾曲状に折り曲げられた反射板部18を有している。反射板部18の下面には、開口部19が形成されている。 The instrument body 12 is made of metal and is also used as a reflector, and has a circular flat plate portion 17 and a reflective plate portion 18 that is bent downwardly from the periphery of the flat plate portion 17. is doing. An opening 19 is formed on the lower surface of the reflector 18.
　また、ソケット装置13は、絶縁性を有する合成樹脂製で円筒状のソケット装置本体21を有し、このソケット装置本体21の中央には挿通孔22が上下方向に貫通形成されている。挿通孔22の内面には、挿通孔22の中心に向かい、一対の突起部23が突出されている。 The socket device 13 has a cylindrical socket device main body 21 made of an insulating synthetic resin, and an insertion hole 22 is formed through the center of the socket device main body 21 in the vertical direction. A pair of protrusions 23 protrude from the inner surface of the insertion hole 22 toward the center of the insertion hole 22.
　ソケット装置本体21の下面には、一対のソケット部24が形成されている。これらソケット部24には、接続孔25が形成されているとともに、この接続孔25の内側に電力を供給する図示しない受金が配置されている。接続孔25は、ソケット装置本体21の中心に対して回転対称に位置する円弧状の溝であり、この円弧状の溝の一端には拡径部26が形成されている。 A pair of socket portions 24 are formed on the lower surface of the socket device body 21. In these socket portions 24, connection holes 25 are formed, and a receiver (not shown) for supplying electric power to the inside of the connection holes 25 is disposed. The connection hole 25 is an arc-shaped groove that is rotationally symmetric with respect to the center of the socket device main body 21, and a diameter-expanded portion 26 is formed at one end of the arc-shaped groove.
　ソケット装置本体21の下面には複数の凹部27が形成され、この凹部27には器具本体12からねじ28のねじ軸29が挿入配置され、このねじ軸29に押圧体としての例えばゴムなどの弾性体30を介在してナット31が螺着されている。これらねじ28、弾性体30およびナット31によってソケット装置13が器具本体12の平板部17に取り付けられている。 A plurality of recesses 27 are formed on the lower surface of the socket device body 21, and a screw shaft 29 of a screw 28 is inserted into the recess 27 from the instrument body 12, and an elastic material such as rubber is used as a pressing body on the screw shaft 29. A nut 31 is screwed through the body 30. The socket device 13 is attached to the flat plate portion 17 of the instrument body 12 by the screws 28, the elastic body 30, and the nut 31.
　また、ランプ装置14は、扁平状のランプ装置本体34、このランプ装置本体34の下面側に配置される光源としての半導体発光素子であり、この半導体発光素子としての複数のＬＥＤ35、ＬＥＤ35を覆うグローブ36、およびＬＥＤ35を点灯させる点灯回路37を有し、高さ方向の寸法が横方向の寸法より小さい薄形に形成されている。 The lamp device 14 is a flat lamp device main body 34, a semiconductor light emitting element as a light source disposed on the lower surface side of the lamp device main body 34, a plurality of LEDs 35 as the semiconductor light emitting elements, and a globe that covers the LEDs 35 36 and a lighting circuit 37 for lighting the LED 35, and the height dimension is formed in a thin shape smaller than the lateral dimension.
　ランプ装置本体34は、絶縁性を有する合成樹脂、あるいは放熱性に優れた例えばアルミニウムなどの金属によって形成されている。ランプ装置本体34の一面側である上面側にＧＸ５３形の口金部38が形成され、他面側である下面側にＬＥＤ35を取り付ける平面状の基板取付部39が形成され、内部に点灯回路37を収容する収容部40が形成されている。 The lamp device main body 34 is formed of a synthetic resin having insulation properties or a metal such as aluminum having excellent heat dissipation. A base portion 38 of GX53 type is formed on the upper surface side, which is one surface side of the lamp device main body 34, and a planar substrate mounting portion 39 for attaching the LED 35 is formed on the lower surface side, which is the other surface side, and a lighting circuit 37 is provided inside. An accommodating portion 40 for accommodating is formed.
　口金部38には、ソケット装置13の下面に当接する環状の当接面41が形成され、この当接面41の中央からソケット装置13の挿通孔22に挿通可能とする円柱状の突出部42が突出されている。この突出部42の突出寸法は、ソケット装置13の高さ寸法すなわち挿通孔22の孔深さ寸法より大きく、ランプ装置14をソケット装置13に装着した際に突出部42の端面43が挿通孔22を貫通して突出するように構成されている。 An annular contact surface 41 that contacts the lower surface of the socket device 13 is formed in the base portion 38, and a cylindrical protrusion 42 that can be inserted into the insertion hole 22 of the socket device 13 from the center of the contact surface 41. Is protruding. The projecting dimension of the projecting part 42 is larger than the height dimension of the socket device 13, that is, the hole depth dimension of the insertion hole 22, and the end surface 43 of the projecting part 42 is inserted into the insertion hole 22 when the lamp device 14 is mounted on the socket device 13. It is comprised so that it may penetrate and pass through.
　当接面41には、導電性を有する金属製の一対のランプピン44が突出されている。これらランプピン44の先端部には径大部45が形成されている。そして、各ランプピン44の径大部45をソケット装置13の各接続孔25の拡径部26に挿入し、ランプ装置14の回動によってランプピン44を拡径部26から接続孔25内に移動させることにより、ランプピン44を受金に電気的に接触させるとともに、径大部45が受金または接続孔25の縁部に引っ掛け、ランプ装置14をソケット装置13に保持させる。なお、ランプ装置本体34が金属の場合、ランプピン44は絶縁材を介在してランプ装置本体34に取り付けられる。 The contact surface 41 has a pair of conductive metal lamp pins 44 protruding therefrom. A large-diameter portion 45 is formed at the tip of these lamp pins 44. Then, the large diameter portion 45 of each lamp pin 44 is inserted into the enlarged diameter portion 26 of each connection hole 25 of the socket device 13, and the lamp pin 44 is moved from the enlarged diameter portion 26 into the connection hole 25 by the rotation of the lamp device 14. As a result, the lamp pin 44 is brought into electrical contact with the metal receiver, and the large diameter portion 45 is hooked on the edge of the metal receiver or the connection hole 25 to hold the lamp device 14 in the socket device 13. When the lamp device main body 34 is metal, the lamp pin 44 is attached to the lamp device main body 34 with an insulating material interposed.
　突出部42の側面には、ソケット装置13の各突起部23が係合する一対のガイド溝46が形成されている。このガイド溝46は、突出部42の端面43に開口する導入溝部47、この導入溝部47から傾斜した傾斜溝部48、およびこの傾斜溝部48から水平となる保持溝部49を有している。そして、ソケット装置13の突起部23にガイド溝46の導入溝部47に合わせて、ランプ装置14を上昇させた後に装着方向へ回動させることにより、突起部23と傾斜溝部48との係合によってランプ装置14が上方へ、ソケット装置13が下方へ相対的に移動し、突起部23と保持溝部49が係合した位置がランプ装置14をソケット装置13に装着した装着位置となる。 A pair of guide grooves 46 with which the projections 23 of the socket device 13 are engaged are formed on the side surfaces of the protrusions 42. The guide groove 46 includes an introduction groove 47 that opens to the end face 43 of the protrusion 42, an inclined groove 48 that is inclined from the introduction groove 47, and a holding groove 49 that is horizontal from the inclined groove 48. Then, the lamp device 14 is raised in accordance with the introduction groove portion 47 of the guide groove 46 to the projection portion 23 of the socket device 13 and then rotated in the mounting direction, whereby the projection portion 23 and the inclined groove portion 48 are engaged. The position where the lamp device 14 is moved upward and the socket device 13 is relatively moved downward and the projection 23 and the holding groove 49 are engaged is the mounting position where the lamp device 14 is mounted on the socket device 13.
　また、複数のＬＥＤ35は、発光モジュール基板50の下面側に搭載されている。この発光モジュール基板50の上面が、ランプ装置本体34の基板取付部39に面接触する密着状態に取り付けられている。この発光モジュール基板50は、例えば金属製の基板に絶縁層を介して配線パターンが形成され、この配線パターン上にＬＥＤ35が実装され、ねじによってランプ装置本体21の基板取付部39に密着するように取り付けられている。そして、複数のＬＥＤ35および発光モジュール基板50によって発光モジュールが構成されている。 Further, the plurality of LEDs 35 are mounted on the lower surface side of the light emitting module substrate 50. The upper surface of the light emitting module substrate 50 is attached in close contact with the substrate attaching portion 39 of the lamp device main body 34. In the light emitting module substrate 50, for example, a wiring pattern is formed on a metal substrate through an insulating layer, the LED 35 is mounted on the wiring pattern, and the light emitting module substrate 50 is in close contact with the substrate mounting portion 39 of the lamp device main body 21 by screws. It is attached. The plurality of LEDs 35 and the light emitting module substrate 50 constitute a light emitting module.
　また、グローブ36は、透明あるいは光拡散性を有するガラスや合成樹脂により形成されている。 Further, the globe 36 is made of glass or synthetic resin having transparency or light diffusibility.
　また、点灯回路37は、図示しないが、点灯回路基板、およびこの点灯回路基板に実装された点灯回路部品を有し、点灯回路基板の入力部にリード線などでランプピン44が電気的に接続され、点灯回路基板の出力部にリード線などで発光モジュール基板50が電気的に接続されている。ランプ装置本体34が金属の場合、絶縁材を介在してランプ装置本体34の収容部40に収容されている。 Although not shown, the lighting circuit 37 includes a lighting circuit board and a lighting circuit component mounted on the lighting circuit board, and the lamp pin 44 is electrically connected to the input portion of the lighting circuit board by a lead wire or the like. The light emitting module substrate 50 is electrically connected to the output portion of the lighting circuit substrate by a lead wire or the like. When the lamp device main body 34 is a metal, it is accommodated in the accommodating portion 40 of the lamp device main body 34 with an insulating material interposed.
　次に、第１の実施の形態の照明器具11の作用を説明する。 Next, the operation of the lighting fixture 11 of the first embodiment will be described.
　図２に示すように、ランプ装置14を装着していないソケット装置13は、弾性体30の押圧によって上方へ押し上げられていて、ソケット装置13の上面が器具本体12の平板部17に当接されている。 As shown in FIG. 2, the socket device 13 without the lamp device 14 is pushed upward by the pressing of the elastic body 30, and the upper surface of the socket device 13 is brought into contact with the flat plate portion 17 of the instrument body 12. ing.
　ランプ装置14をソケット装置13に装着するには、ランプ装置14の突出部42をソケット装置13の挿通孔22に下方から挿入し、ランプ装置14の突出部42に設けられたガイド溝46の導入溝部47をソケット装置13の突起部23に合わせるとともに、ランプ装置14のランプピン44をソケット装置13の各接続孔25の拡径部26に合わせ、ランプ装置14を押し上げ、装着方向へ回動させる。ランプ装置14を押し上げ、装着方向へ回動させることにより、突起部23とガイド溝46の傾斜溝部48との係合によってランプ装置14が上方へ移動し、突起部23の端面43が器具本体12の平板部17に当接する。さらに、ランプ装置14を装着方向へ回動させることにより、器具本体12の平板部17との当接によって上方への移動が規制されたランプ装置14に対し、ソケット装置13が弾性体30の押圧に抗して下降する。図１に示すように、突起部23とガイド溝46の保持溝部49とが係合することにより、ランプ装置14をソケット装置13に装着した装着位置となり、また、ランプピン44がソケット装置13の受金に電気的に接触する。 In order to attach the lamp device 14 to the socket device 13, the protruding portion 42 of the lamp device 14 is inserted into the insertion hole 22 of the socket device 13 from below, and the guide groove 46 provided in the protruding portion 42 of the lamp device 14 is introduced. The groove 47 is aligned with the protrusion 23 of the socket device 13, and the lamp pin 44 of the lamp device 14 is aligned with the enlarged diameter portion 26 of each connection hole 25 of the socket device 13, and the lamp device 14 is pushed up and rotated in the mounting direction. When the ramp device 14 is pushed up and rotated in the mounting direction, the ramp device 14 is moved upward by the engagement between the projection 23 and the inclined groove 48 of the guide groove 46, and the end surface 43 of the projection 23 is the instrument body 12. It contacts the flat plate portion 17. Further, by rotating the lamp device 14 in the mounting direction, the socket device 13 presses the elastic body 30 against the lamp device 14 whose upward movement is restricted by contact with the flat plate portion 17 of the fixture body 12. Descends against As shown in FIG. 1, the projection 23 and the holding groove 49 of the guide groove 46 are engaged with each other so that the lamp device 14 is attached to the socket device 13, and the lamp pin 44 is received by the socket device 13. Electrical contact with gold.
　ランプ装置14をソケット装置13に装着した状態では、弾性体30の押圧によってソケット装置13を上方へ押し上げているため、ソケット装置13の上面から突出する突出部42の端面43を器具本体12の平板部17に面接触するように押し付けて密着させることができる。 In a state where the lamp device 14 is mounted on the socket device 13, the socket device 13 is pushed upward by the pressing of the elastic body 30, so that the end surface 43 of the projecting portion 42 protruding from the upper surface of the socket device 13 is the flat plate of the instrument body 12. The portion 17 can be pressed and brought into close contact with the surface 17.
　そのため、ランプ装置14のＬＥＤ35の点灯時には、ＬＥＤ35が発生する熱が発光モジュール基板50から口金部38に熱伝導され、この口金部38に伝わった熱が突出部42の端面43から器具本体12に効率よく熱伝導され、この器具本体12に伝わった熱が空気中などに効率よく放熱される。 Therefore, when the LED 35 of the lamp device 14 is turned on, the heat generated by the LED 35 is thermally conducted from the light emitting module substrate 50 to the base part 38, and the heat transmitted to the base part 38 is transferred from the end face 43 of the protruding part 42 to the instrument body 12. The heat is efficiently conducted, and the heat transmitted to the instrument body 12 is efficiently dissipated into the air.
　したがって、ランプ装置14を器具本体12のソケット装置13に装着した状態でも、ランプ装置14の熱を口金部38から効率よく放熱させることができる。そのため、ランプ装置14は、十分な放熱性が得られ、ＬＥＤ35の温度上昇を抑制でき、ＬＥＤ35が熱劣化して短寿命となったり、場合によっては発光効率が低下するのを防止できる。 Therefore, even when the lamp device 14 is mounted on the socket device 13 of the fixture body 12, the heat of the lamp device 14 can be efficiently radiated from the base portion 38. Therefore, the lamp device 14 can obtain sufficient heat dissipation, can suppress the temperature rise of the LED 35, and can prevent the LED 35 from being thermally deteriorated to have a short life, and in some cases, to reduce the light emission efficiency.
　なお、器具本体12の平板部17またはランプ装置14の端面43の少なくとも一方には、口金部38から器具本体12への熱伝導性を向上させるために、平滑度を高めるための研磨などの表面処理を施したり、ゲル状材料や放熱シートなどの柔軟性または弾力性がありかつ熱伝導性に優れた熱伝導部材を配置してもよい。 It should be noted that at least one of the flat plate portion 17 of the fixture body 12 or the end face 43 of the lamp device 14 is a surface such as polished to increase the smoothness in order to improve the thermal conductivity from the base portion 38 to the fixture body 12. You may arrange | position a heat conductive member which has flexibility or elasticity, such as a gel-like material and a heat-radiation sheet, and was excellent in heat conductivity.
　また、以下には、他の実施の形態を示すが、第１の実施の形態と同様の構成については、同一符号を用いてその説明を省略する。 Further, although other embodiments are shown below, the same reference numerals are used for the same configurations as those in the first embodiment, and the description thereof is omitted.
　次に、図５に第２の実施の形態を示し、図５は照明器具の断面図である。 Next, FIG. 5 shows a second embodiment, and FIG. 5 is a sectional view of the lighting fixture.
　器具本体12は、円筒状の筒部52、この筒部52の上面に設けられた天板部53、および筒部52の下部から斜め外方へ突出する反射板部54を有している。 The instrument main body 12 has a cylindrical tube portion 52, a top plate portion 53 provided on the upper surface of the tube portion 52, and a reflector plate portion 54 that protrudes obliquely outward from the lower portion of the tube portion 52.
　ソケット装置13は器具本体12の筒部52の下部側に固定され、このソケット装置13の上面と器具本体12の天板部53との間の空間に、放熱体としての放熱板55、および押圧体としてのスプリング56が配置されている。 The socket device 13 is fixed to the lower side of the cylindrical portion 52 of the instrument body 12, and a space between the upper surface of the socket device 13 and the top plate portion 53 of the instrument body 12 is provided with a heat radiating plate 55 and a pressing member. A spring 56 as a body is arranged.
　放熱板55は、金属製で、中間部にランプ装置14の口金部38から突出する突出部42の端面43に面接触する断面略コ字形の接触部57が形成され、両端部が器具本体12に外部に導出され、器具本体12に対して上下方向に移動可能に配置されている。この放熱板55の両端部にはフィンなどを設けて放熱効果を高めるようにしてもよい。 The heat radiating plate 55 is made of metal, and a contact portion 57 having a substantially U-shaped cross section that is in surface contact with the end surface 43 of the protruding portion 42 protruding from the base portion 38 of the lamp device 14 is formed in the middle portion, and both end portions are the instrument body 12. And is arranged to be movable in the vertical direction with respect to the instrument body 12. Fins or the like may be provided at both ends of the heat radiating plate 55 to enhance the heat radiating effect.
　スプリング56は、放熱板55の接触部57の上面と器具本体12の天板部53との間に圧縮状態に配置され、放熱板55を下方へ押圧している。 The spring 56 is disposed in a compressed state between the upper surface of the contact portion 57 of the heat radiating plate 55 and the top plate portion 53 of the instrument main body 12, and presses the heat radiating plate 55 downward.
　そして、ランプ装置14をソケット装置13に装着することにより、口金部38の突出部42の端面43に放熱板55の接触部57が接触するとともに、スプリング56によって放熱板55の接触部57を口金部38の突出部42の端面43に面接触するように押し付けて密着させる。 Then, by attaching the lamp device 14 to the socket device 13, the contact portion 57 of the heat radiating plate 55 comes into contact with the end face 43 of the protruding portion 42 of the base portion 38, and the contact portion 57 of the heat radiating plate 55 is connected to the base by the spring 56. It is pressed and brought into close contact with the end surface 43 of the projecting portion 42 of the portion 38.
　そのため、ランプ装置14の点灯時に、ＬＥＤ35が発生する熱が発光モジュール基板50から口金部38に熱伝導され、この口金部38に伝わった熱が突出部42の端面43から放熱板55に効率よく熱伝導され、この放熱板55に伝わった熱が空気中などに効率よく放熱される。 Therefore, when the lamp device 14 is lit, the heat generated by the LED 35 is thermally conducted from the light emitting module substrate 50 to the base part 38, and the heat transmitted to the base part 38 is efficiently transferred from the end face 43 of the projecting part 42 to the heat radiating plate 55. The heat conducted and the heat transmitted to the heat radiating plate 55 is efficiently radiated into the air or the like.
　したがって、ランプ装置14を器具本体12のソケット装置13に装着した状態でも、ランプ装置14の熱を口金部38から効率よく放熱させることができる。 Therefore, even when the lamp device 14 is mounted on the socket device 13 of the fixture body 12, the heat of the lamp device 14 can be efficiently radiated from the base portion 38.
　なお、押圧体としてスプリング56を用いたが、放熱板55自体の弾性によって、この放熱板55が突出部42の端面43に密着するようにしてもよく、この場合、スプリング56を省略して、放熱板55に押圧体の機能を持たさせることができる。 Although the spring 56 is used as the pressing body, the heat radiating plate 55 may be in close contact with the end surface 43 of the projecting portion 42 by the elasticity of the heat radiating plate 55 itself. The radiator plate 55 can have a function of a pressing body.
　次に、図６および図７に第３の実施の形態を示し、図６は照明器具の一部を断面にした斜視図、図７は照明器具の一部を透視した斜視図である。 Next, FIGS. 6 and 7 show a third embodiment, in which FIG. 6 is a perspective view in which a part of the lighting fixture is sectioned, and FIG. 7 is a perspective view in which a portion of the lighting fixture is seen through.
　器具本体12は第２の実施の形態と同様の構造である。ソケット装置13の上面と器具本体12の天板部53との間の空間に、放熱体としての放熱板60、および押圧体としてのスプリング61が配置されている。 The instrument body 12 has the same structure as that of the second embodiment. In the space between the upper surface of the socket device 13 and the top plate portion 53 of the instrument main body 12, a heat radiating plate 60 as a heat radiating member and a spring 61 as a pressing member are arranged.
　放熱板60は、例えば銅などの金属製で、リング状に形成され、下面にランプ装置14の口金部38の突出部42の端面43と面接触する平面状の接触部62が形成され、上面に器具本体12に面接触する平面状の接触部63が形成され、これら接触部62，63の両側間に接触部62，63の間隔の伸縮を可能とする湾曲した側面部64が形成されている。 The heat radiating plate 60 is made of a metal such as copper and is formed in a ring shape, and a flat contact portion 62 that is in surface contact with the end surface 43 of the protruding portion 42 of the base portion 38 of the lamp device 14 is formed on the lower surface. Further, a planar contact portion 63 that comes into surface contact with the instrument main body 12 is formed, and a curved side surface portion 64 that allows expansion and contraction of the distance between the contact portions 62 and 63 is formed between both sides of the contact portions 62 and 63. Yes.
　スプリング61は、放熱板60の内側で、上下の接触部62，63間に圧縮状態に配置されている。 The spring 61 is disposed in a compressed state between the upper and lower contact portions 62 and 63 inside the heat sink 60.
　そして、ランプ装置14をソケット装置13に装着することにより、口金部38の突出部42の端面43がソケット装置13の上面から突出し、放熱板60の下面の接触部62に接触する。放熱板60の内側に配置されたスプリング61によって、放熱板60の下面の接触部62を口金部38の突出部42の端面43に面接触するように押し付けて密着させるとともに、放熱板60の上面の接触部63を器具本体12に面接触するように押し付けて密着させる。 Then, by attaching the lamp device 14 to the socket device 13, the end surface 43 of the protruding portion 42 of the base portion 38 protrudes from the upper surface of the socket device 13 and contacts the contact portion 62 on the lower surface of the heat sink 60. The spring 61 disposed inside the heat sink 60 presses and contacts the contact portion 62 on the lower surface of the heat sink 60 so as to be in surface contact with the end surface 43 of the protruding portion 42 of the base portion 38, and the upper surface of the heat sink 60. The contact part 63 is pressed and brought into close contact with the instrument body 12 in surface contact.
　そのため、ランプ装置14の点灯時に、ＬＥＤ35が発生する熱が発光モジュール基板50から口金部38に熱伝導され、この口金部38に伝わった熱が突出部42の端面43から放熱板60に効率よく熱伝導されるとともに、放熱板60から器具本体12に効率よく熱伝導され、この器具本体12に伝わった熱が空気中などに効率よく放熱される。 Therefore, when the lamp device 14 is turned on, the heat generated by the LED 35 is thermally conducted from the light emitting module substrate 50 to the base part 38, and the heat transmitted to the base part 38 is efficiently transmitted from the end face 43 of the projecting part 42 to the heat sink 60. In addition to being thermally conducted, heat is efficiently conducted from the heat radiating plate 60 to the instrument body 12, and the heat transmitted to the instrument body 12 is efficiently radiated into the air or the like.
　したがって、ランプ装置14を器具本体12のソケット装置13に装着した状態でも、ランプ装置14の熱を口金部38から効率よく放熱させることができる。 Therefore, even when the lamp device 14 is mounted on the socket device 13 of the fixture body 12, the heat of the lamp device 14 can be efficiently radiated from the base portion 38.
　なお、押圧体としてのスプリング61を用いたが、放熱板60自体の弾性によって突出部42の端面43と器具本体12とにそれぞれ密着するようにしてもよく、この場合、スプリング61を省略して、放熱板60に押圧体の機能を持たさせることができる。 Although the spring 61 is used as the pressing body, the spring 61 itself may be in close contact with the end surface 43 of the projecting portion 42 and the instrument body 12 due to the elasticity of the radiator plate 60. In this case, the spring 61 is omitted. In addition, the function of the pressing body can be given to the heat radiating plate 60.
　次に、図８に第４の実施の形態を示し、図８は照明器具の一部を透視した斜視図である。 Next, FIG. 8 shows a fourth embodiment, and FIG. 8 is a perspective view of a part of the lighting fixture.
　器具本体12は第２および第３の実施の形態と同様の構造である。ソケット装置13の上面と器具本体12の天板部53との間の空間に、放熱体および押圧体として兼用される放熱部材67が配置されている。この放熱部材67は、例えば銅などの金属製で、円筒状のベローズであり、ソケット装置13の上面と器具本体12の天板部53との間に圧縮状態に配置されている。 The instrument main body 12 has the same structure as the second and third embodiments. In the space between the upper surface of the socket device 13 and the top plate portion 53 of the instrument main body 12, a heat radiating member 67 that is also used as a heat radiating body and a pressing body is disposed. The heat radiating member 67 is made of a metal such as copper and is a cylindrical bellows, and is disposed in a compressed state between the upper surface of the socket device 13 and the top plate portion 53 of the instrument body 12.
　そして、ランプ装置14をソケット装置13に装着することにより、口金部38の突出部42の端面43がソケット装置13の上面から突出し、放熱部材67の下部に接触する。放熱部材67の弾性によって、放熱部材67の下部が突出部42の端面43に密着するとともに、放熱部材67の上部が器具本体12に密着する。 Then, by attaching the lamp device 14 to the socket device 13, the end surface 43 of the protruding portion 42 of the base portion 38 protrudes from the upper surface of the socket device 13 and contacts the lower portion of the heat radiating member 67. Due to the elasticity of the heat dissipating member 67, the lower portion of the heat dissipating member 67 is in close contact with the end face 43 of the protrusion 42, and the upper portion of the heat dissipating member 67 is in close contact with the instrument body 12.
　そのため、ランプ装置14の点灯時に、ＬＥＤ35が発生する熱が発光モジュール基板50から口金部38に熱伝導され、この口金部38に伝わった熱が突出部42の端面43から放熱部材67に効率よく熱伝導されるとともに、放熱部材67から器具本体12に効率よく熱伝導され、この器具本体12に伝わった熱が空気中などに効率よく放熱される。 Therefore, when the lamp device 14 is turned on, the heat generated by the LED 35 is thermally conducted from the light emitting module substrate 50 to the base part 38, and the heat transmitted to the base part 38 is efficiently transmitted from the end face 43 of the projecting part 42 to the heat radiating member 67. In addition to being thermally conducted, heat is efficiently conducted from the heat radiating member 67 to the instrument main body 12, and the heat transmitted to the instrument main body 12 is efficiently radiated into the air or the like.
　したがって、ランプ装置14を器具本体12のソケット装置13に装着した状態でも、ランプ装置14の熱を口金部38から効率よく放熱させることができる。 Therefore, even when the lamp device 14 is mounted on the socket device 13 of the fixture body 12, the heat of the lamp device 14 can be efficiently radiated from the base portion 38.
　しかも、１つの放熱部材67で放熱体と押圧体とを兼用でき、部品点数を削減できる。 Moreover, the single heat radiating member 67 can be used as both a heat radiating body and a pressing body, and the number of parts can be reduced.
　なお、器具本体12から反射板部54を分離し、この反射板部54をランプ装置14に着脱可能に取り付けるようにしてもよい。これにより、ランプ装置14の熱を反射板部54に伝え、放熱性を向上できる。しかも、反射板部54をもってランプ装置14をソケット装置13に着脱操作することができ、操作性を向上できる。 It should be noted that the reflector plate 54 may be separated from the fixture body 12 and the reflector plate 54 may be detachably attached to the lamp device 14. Thereby, the heat of the lamp device 14 is transmitted to the reflecting plate portion 54, and the heat dissipation can be improved. In addition, the lamp device 14 can be attached to and detached from the socket device 13 with the reflecting plate portion 54, and the operability can be improved.
　次に、図９ないし図１３に第５の実施の形態を示す。図９はソケット装置のソケット本体が突出位置に配置された照明器具の断面図、図１０はソケット装置のソケット本体が収納位置に配置された照明器具の断面図、図１１はソケット装置の突出位置に配置されたソケット本体にランプ装置を着脱する状態を示す斜視図、図１２はソケット装置の突出位置に配置されたソケット本体にランプ装置を装着した状態を示す斜視図、図１３はソケット装置のソケット本体を収納位置に移動させた状態を示す斜視図である。 Next, FIGS. 9 to 13 show a fifth embodiment. 9 is a cross-sectional view of the luminaire in which the socket body of the socket device is disposed in the protruding position, FIG. 10 is a cross-sectional view of the luminaire in which the socket body of the socket device is disposed in the storage position, and FIG. FIG. 12 is a perspective view showing a state in which the lamp device is attached to the socket body arranged at the protruding position of the socket device, and FIG. 13 is a perspective view showing the state of the socket device. It is a perspective view which shows the state which moved the socket main body to the accommodation position.
　ソケット装置13は、器具本体12の平板部17に取り付けられるソケット支持体71、およびこのソケット支持体71に対して上下方向に移動可能に支持されたソケット装置本体21を有している。 The socket device 13 includes a socket support 71 attached to the flat plate portion 17 of the instrument main body 12, and a socket device main body 21 supported so as to be movable in the vertical direction with respect to the socket support 71.
　ソケット支持体71は、例えば金属製で、下方に向けて開口され、その内側にソケット装置本体21が上下方向に移動可能に嵌合されている。すなわち、ソケット支持体71により、ソケット装置本体21がソケット支持体71に収納される収納位置とソケット支持体71から下方へ突出する突出位置との間で移動可能に支持されている。 The socket support 71 is made of, for example, metal and is opened downward, and the socket device main body 21 is fitted therein so as to be movable in the vertical direction. In other words, the socket support body 71 supports the socket device main body 21 so as to be movable between a storage position where the socket device body 21 is stored in the socket support body 71 and a protruding position where the socket support body 71 protrudes downward.
　ソケット支持体71とソケット装置本体21との間にはソケット装置本体21を突出位置へ向けて付勢する付勢手段としてのスプリング72が配置され、ソケット支持体71にはソケット装置本体21の突出位置で突出を規制する図示しないストッパが設けられている。 A spring 72 is disposed between the socket support 71 and the socket device main body 21 as a biasing means for biasing the socket device main body 21 toward the protruding position. The socket support 71 projects from the socket device main body 21. A stopper (not shown) that restricts the protrusion at the position is provided.
　ソケット支持体71とソケット装置本体21との間には、収納位置でソケット装置本体21を係止する図示しない係止手段が設けられている。この係止手段は、例えば押しボタンスイッチのような、ランプ装置14にてソケット装置本体21を突出位置から収納位置に押し上げて移動させることで、そのソケット装置本体21を収納位置に係止し、さらにもう一度、ランプ装置14にてソケット装置本体21を少し押し上げることで係止が外れ、ソケット装置本体21を収納位置から突出位置へ下降するのを許容するように構成されている。このような係止手段としては、ソケット支持体71内にソケット支持体71を付勢するスプリングと回転角度を規制するカム機構などで実現可能であるが、他の周知機構を用いても構わない。 Between the socket support 71 and the socket device main body 21, there is provided a locking means (not shown) for locking the socket device main body 21 in the storage position. This locking means, such as a push button switch, pushes the socket device body 21 from the protruding position to the storage position by the lamp device 14 and moves it to lock the socket device body 21 in the storage position. Further, the lamp device 14 is configured to allow the lamp device 14 to be unlocked by slightly pushing up the socket device body 21 and to allow the socket device body 21 to be lowered from the storage position to the protruding position. Such a locking means can be realized by a spring for biasing the socket support 71 in the socket support 71 and a cam mechanism for regulating the rotation angle, but other well-known mechanisms may be used. .
　ソケット支持体71には上下方向に軸方向を向けて複数の円柱状のリブ73が突設され、ソケット装置本体21の外周部の複数箇所に各リブ73に係合する断面半円状の溝部74が上下方向に沿って形成されているとともに、これら溝部74にはロック部材75が進退可能とする配置されている。ロック部材75は、突出位置に保持されるソケット装置本体21にランプ装置14を着脱する際にランプ装置14を回動操作するのに連動して溝部74に進退するものであり、例えば後述するランプピン44に当接するカム機構によって構成することができる。ロック部材75は、突出位置に位置するソケット装置本体21にランプ装置14が装着されていない状態では溝部74内に侵入し、ソケット装置本体21が突出位置から収納位置に移動しようとしたときにリブ73に当接してその移動を規制し、また、突出位置に位置するソケット装置本体21にランプ装置14が接続された状態では溝部74内から退避し、ソケット装置本体21が突出位置から収納位置に移動するのを許容する。したがって、これらリブ73、溝部74およびロック部材75などにより、ランプ装置14が装着されたソケット装置本体21が突出位置と収納位置との間で移動するのを許容するとともに、ランプ装置14が装着されていないソケット装置本体21が突出位置から収納位置に移動するのを規制するロック手段76が構成されている。 A plurality of cylindrical ribs 73 project from the socket support 71 in the vertical direction and are semicircular in cross section that engage with the ribs 73 at a plurality of locations on the outer periphery of the socket device body 21. 74 are formed along the vertical direction, and a locking member 75 is disposed in these groove portions 74 so as to be able to advance and retract. The lock member 75 moves forward and backward in the groove portion 74 in conjunction with the turning operation of the lamp device 14 when the lamp device 14 is attached to and detached from the socket device main body 21 held at the protruding position. It can be configured by a cam mechanism that contacts 44. The lock member 75 enters the groove 74 when the lamp device 14 is not attached to the socket device main body 21 located at the protruding position, and the rib 75 when the socket device main body 21 attempts to move from the protruding position to the storage position. 73, the movement of the socket device 21 is restricted, and when the lamp device 14 is connected to the socket device body 21 located at the protruding position, the socket device body 21 is retracted from the groove 74, and the socket device body 21 is moved from the protruding position to the retracted position. Allow to move. Therefore, the rib 73, the groove 74, the lock member 75, and the like allow the socket device body 21 to which the lamp device 14 is mounted to move between the protruding position and the storage position, and the lamp device 14 is mounted. Locking means 76 is configured to restrict the movement of the socket device main body 21 not being moved from the protruding position to the storage position.
　ソケット装置本体21が収納位置に移動した状態では、溝部74内のロック部材75が侵入する領域にリブ73が位置し、ロック部材75が溝部74に侵入できず、このロック部材75と連動するランプ装置14がソケット装置本体21から外す方向に回動させることができない状態となる。したがって、これらリブ73、溝部74およびロック部材75などにより、収納位置に移動したソケット装置本体21からランプ装置14が外れるのを規制するランプ装置保持手段77が構成されている。 In a state where the socket device main body 21 is moved to the storage position, the rib 73 is located in a region where the lock member 75 enters the groove portion 74, and the lock member 75 cannot enter the groove portion 74. The device 14 is in a state where it cannot be rotated in the direction to remove it from the socket device main body 21. Therefore, the rib 73, the groove 74, the lock member 75, and the like constitute a lamp device holding means 77 that restricts the lamp device 14 from being detached from the socket device main body 21 moved to the storage position.
　ソケット支持体71には、ランプ装置14が装着されたソケット装置本体21が収納位置に移動することにより、そのランプ装置14が熱伝導可能に接続する熱伝導部材78が配置されている。 The socket support 71 is provided with a heat conducting member 78 for connecting the lamp device 14 so that the lamp device 14 can conduct heat by moving the socket device main body 21 to which the lamp device 14 is mounted to the storage position.
　そして、図９および図１１に示すように、ランプ装置14を装着していないソケット装置13のソケット装置本体21は、ソケット支持体71に対して下方へ突出した突出位置にあって、器具本体12の下面の開口部19側に接近した位置にあり、その突出位置にスプリング72による付勢によって保持されている。 9 and 11, the socket device main body 21 of the socket device 13 to which the lamp device 14 is not mounted is in a protruding position protruding downward with respect to the socket support 71, and the instrument main body 12 Is located close to the opening 19 side, and is held by the spring 72 at the protruding position.
　ソケット装置本体21のロック部材75の位置がリブ73より下方に位置し、そのロック部材75が溝部74内に侵入しており、ロック部材75の上面がリブ73の先端面に対向されている。 The position of the lock member 75 of the socket device main body 21 is located below the rib 73, the lock member 75 enters the groove 74, and the upper surface of the lock member 75 is opposed to the tip surface of the rib 73.
　ソケット装置13にランプ装置14を装着するには、ランプ装置14の各ランプピン44をソケット装置本体21の各接続孔25の拡径部26に合わせて挿入するようにランプ装置14を上昇させる。このとき、ランプ装置14のランプピン44がソケット装置本体21の各接続孔25の拡径部26に合わず、ランプピン44でソケット装置本体21を押し上げてしまっても、ロック部材75がリブ73の先端面に当接して、ソケット装置本体21が上方の収納位置へ移動して、ランプ装置14が装着しにくくなってしまうのを防止できる。 To attach the lamp device 14 to the socket device 13, the lamp device 14 is raised so that each lamp pin 44 of the lamp device 14 is inserted in accordance with the enlarged diameter portion 26 of each connection hole 25 of the socket device main body 21. At this time, even if the lamp pin 44 of the lamp device 14 is not aligned with the enlarged diameter portion 26 of each connection hole 25 of the socket device main body 21 and the socket device main body 21 is pushed up by the lamp pin 44, the lock member 75 remains at the tip of the rib 73. It is possible to prevent the lamp device 14 from becoming difficult to attach due to the contact with the surface and the socket device body 21 moving to the upper storage position.
　ランプ装置14の各ランプピン44をソケット装置本体21の各接続孔25の拡径部26に挿入した後、図１２に示すように、ランプ装置14を装着方向へ回動させ、ランプ装置14をソケット装置本体21に装着する。 After each lamp pin 44 of the lamp device 14 is inserted into the enlarged diameter portion 26 of each connection hole 25 of the socket device main body 21, the lamp device 14 is rotated in the mounting direction as shown in FIG. Mounted on the apparatus main body 21.
　このように、ランプ装置14をソケット装置本体21に装着する際には、ソケット装置本体21が突出位置にあって、器具本体12の下面の開口部19側に接近した位置にあるため、このソケット装置本体21に装着するランプ装置14の周辺部と器具本体12の反射板部18との間に指が入るスペースができ、手でランプ装置14を保持してソケット装置本体21に容易に装着できる。 Thus, when the lamp device 14 is attached to the socket device main body 21, the socket device main body 21 is in the protruding position and is close to the opening 19 side of the lower surface of the instrument main body 12. There is a space for a finger to enter between the peripheral part of the lamp device 14 to be attached to the device body 21 and the reflector 18 of the fixture body 12, and the lamp device 14 can be held by hand and easily attached to the socket device body 21. .
　ランプ装置14の装着方向への回動により、それに連動してロック部材75が溝部74から退避し、ソケット装置本体21が収納位置に移動するのを許容できる。 Rotation of the lamp device 14 in the mounting direction allows the lock member 75 to be retracted from the groove portion 74 in conjunction with the rotation, and allow the socket device body 21 to move to the storage position.
　ランプ装置14をソケット装置本体21に装着した後、図１０および図１３に示すように、ランプ装置14を押し上げることにより、ソケット装置本体21を収納位置へ押し上げ、ランプ装置14を器具本体12内の所定の装着位置に保持させることができる。収納位置に移動したソケット装置本体21は係止手段で係止する。 After the lamp device 14 is mounted on the socket device body 21, as shown in FIGS. 10 and 13, by pushing up the lamp device 14, the socket device body 21 is pushed up to the storage position, and the lamp device 14 is moved into the appliance body 12. It can be held at a predetermined mounting position. The socket device body 21 moved to the storage position is locked by the locking means.
　ランプ装置14が装着されたソケット装置本体21が収納位置に移動することにより、そのランプ装置14の口金部38が熱伝導部材78に面接触して密着し、この状態で照明器具11の使用状態となる。 When the socket device main body 21 to which the lamp device 14 is mounted moves to the storage position, the base portion 38 of the lamp device 14 comes into surface contact with the heat conducting member 78 and is in close contact therewith. It becomes.
　ランプ装置14のＬＥＤ35の点灯時には熱を発生するが、ランプ装置14の口金部38が熱伝導部材78に面接触して密着しているため、ランプ装置14から発生する熱を熱伝導部材78を通じて器具本体12に効率よく熱伝導し、ランプ装置14の放熱性を向上できる。 When the LED 35 of the lamp device 14 is turned on, heat is generated. However, since the base portion 38 of the lamp device 14 is in close contact with the heat conducting member 78, the heat generated from the lamp device 14 is transmitted through the heat conducting member 78. Heat can be efficiently conducted to the fixture body 12, and the heat dissipation of the lamp device 14 can be improved.
　ソケット装置本体21が収納位置にある状態では、溝部74内のロック部材75が侵入する領域にリブ73が位置し、ロック部材75が溝部74に侵入できず、このロック部材75と連動するランプ装置14がソケット装置本体21から外す方向に回動させることができない。 When the socket device main body 21 is in the storage position, the rib 73 is located in a region where the lock member 75 in the groove portion 74 enters, and the lock member 75 cannot enter the groove portion 74, and the lamp device interlocks with the lock member 75. 14 cannot be rotated in the direction to remove it from the socket device main body 21.
　一方、ランプ装置14を外す場合には、収納位置に位置するランプ装置14を少し押し上げて係止手段による係止を解除することにより、スプリング72による付勢によってソケット装置本体21がランプ装置14とともに突出位置に下降する。 On the other hand, when the lamp device 14 is removed, the socket device body 21 and the lamp device 14 are urged together with the lamp device 14 by urging by the spring 72 by slightly pushing up the lamp device 14 located in the storage position and releasing the lock by the locking means. Lower to the protruding position.
　ソケット装置本体21が突出位置に下降したら、ランプ装置14を取外し方向に回動させた後に下降させることにより、ランプ装置14のランプピン44をソケット装置本体21の接続孔25から外し、ランプ装置14をソケット装置本体21から取り外すことができる。 When the socket device main body 21 is lowered to the protruding position, the lamp device 14 is removed from the connection hole 25 of the socket device main body 21 by removing the lamp pin 44 of the lamp device 14 by rotating the lamp device 14 in the removing direction and then lowering the lamp device 14. It can be removed from the socket device main body 21.
　ソケット装置本体21が突出位置に下降すると、ソケット装置本体21のロック部材75の位置がリブ73より下方に移動するため、ランプ装置14の取外し方向への回動に連動してロック部材75が溝部74内に侵入し、ソケット装置本体21が収納位置へ移動するのを規制する状態となる。 When the socket device main body 21 is lowered to the protruding position, the position of the lock member 75 of the socket device main body 21 is moved downward from the rib 73. Therefore, the lock member 75 is grooved in conjunction with the rotation of the lamp device 14 in the removal direction. 74 enters the state where the socket device main body 21 is restricted from moving to the storage position.
　このように、ソケット装置13によれば、ソケット装置本体21を、ソケット支持体71側に収納される収納位置とソケット支持体71側から突出する突出位置との間で移動可能としたため、小形の照明器具に用いた場合であっても、器具本体12側に取り付けるソケット支持体71に対してソケット装置本体21を突出位置に移動させることで、ランプ装置14の側面を把持して容易に着脱できる。 As described above, according to the socket device 13, the socket device main body 21 is movable between the storage position stored on the socket support 71 side and the protruding position protruding from the socket support 71 side. Even when used in a lighting fixture, the socket device main body 21 is moved to the protruding position with respect to the socket support 71 attached to the fixture main body 12 side, so that the side surface of the lamp device 14 can be gripped and easily attached and detached. .
　また、ランプ装置保持手段77により、収納位置に移動したソケット装置本体21からランプ装置14が外れるのを規制するため、ソケット装置13に装着したランプ装置14が外れるのを防止できるうえに、ランプ装置14を外した場合にはソケット装置13を突出位置に必ず保持させることができ、ランプ装置14の装着を容易にできる。 Further, since the lamp device holding means 77 restricts the lamp device 14 from being detached from the socket device main body 21 that has moved to the storage position, the lamp device 14 attached to the socket device 13 can be prevented from being detached, and the lamp device can be prevented from being detached. When 14 is removed, the socket device 13 can always be held in the protruding position, and the lamp device 14 can be easily attached.
　次に、図１４に第６の実施の形態を示し、図１４は照明器具の断面図である。 Next, FIG. 14 shows a sixth embodiment, and FIG. 14 is a sectional view of the lighting fixture.
　ランプ装置14のランプ装置本体34は、全体が放熱性に優れたアルミニウムなどの金属によって形成されたものであって、例えばアルミダイカスト製であり、口金部38を構成する口金側金属部品81と基板取付部39を構成する光源側金属部品82とに分割形成されている。口金側金属部品81は、下方へ向けて開口した円盤状に形成され、環状の外周部83の端面に光源側金属部品82が接触する接触面84が形成されている。光源側金属部品82は、口金側金属部品81の下面開口を閉塞可能な平円板状に形成され、上面の周辺部が口金側金属部品81の接触面に接触可能としている。そして、熱伝導接続手段としての複数のねじ85により光源側金属部品82が口金側金属部品81に締め付け固定され、光源側金属部品82から口金側金属部品81に熱伝導可能に密着接続されている。 The lamp device main body 34 of the lamp device 14 is entirely formed of a metal such as aluminum having excellent heat dissipation, and is made of, for example, aluminum die casting, and a base-side metal component 81 and a substrate constituting the base portion 38. The light source side metal part 82 that constitutes the attachment part 39 is divided and formed. The base metal part 81 is formed in a disk shape opened downward, and a contact surface 84 with which the light source side metal part 82 contacts is formed on the end face of the annular outer peripheral part 83. The light source side metal part 82 is formed in a flat disk shape capable of closing the lower surface opening of the base side metal part 81, and the peripheral part of the upper surface can contact the contact surface of the base side metal part 81. Then, the light source side metal part 82 is fastened and fixed to the base side metal part 81 by a plurality of screws 85 as heat conduction connection means, and the light source side metal part 82 and the base side metal part 81 are closely connected so as to be capable of heat conduction. .
　ランプ装置本体34とランプピン44との間には絶縁材86が介在されている。 An insulating material 86 is interposed between the lamp device main body 34 and the lamp pin 44.
　複数のＬＥＤ35を搭載した発光モジュール基板50がランプ装置本体34の基板取付部39に密着状態に取り付けられている。 A light emitting module substrate 50 on which a plurality of LEDs 35 are mounted is attached in close contact with the substrate attachment portion 39 of the lamp device main body 34.
　点灯回路37は、点灯回路基板89、およびこの点灯回路基板89に実装された点灯回路部品90を有し、点灯回路基板89の入力部にリード線91でランプピン44が電気的に接続され、点灯回路基板89の出力部にリード線などで発光モジュール基板50が電気的に接続されている。点灯回路基板89は、図示しない絶縁材を介在してランプ装置本体34の収容部40に収容されている。 The lighting circuit 37 has a lighting circuit board 89 and a lighting circuit component 90 mounted on the lighting circuit board 89, and the lamp pin 44 is electrically connected to the input portion of the lighting circuit board 89 by a lead wire 91 to light up. The light emitting module substrate 50 is electrically connected to the output portion of the circuit board 89 by a lead wire or the like. The lighting circuit board 89 is accommodated in the accommodating portion 40 of the lamp device main body 34 with an insulating material (not shown) interposed therebetween.
　そして、ランプ装置14をソケット装置13に装着した状態では、ランプ装置本体34の外周部83が器具本体12の反射板部18に熱伝導可能に接触し、ランプ装置本体34の突出部42の端面43が器具本体12の平板部17に熱伝導可能に接触する。 When the lamp device 14 is mounted on the socket device 13, the outer peripheral portion 83 of the lamp device main body 34 comes into contact with the reflecting plate portion 18 of the fixture main body 12 so as to be able to conduct heat, and the end surface of the protruding portion 42 of the lamp device main body 34 43 comes into contact with the flat plate portion 17 of the instrument body 12 so as to allow heat conduction.
　そのため、ランプ装置14のＬＥＤ35の点灯時においては、ＬＥＤ35から発生する熱が効率よく放熱される。すなわち、金属製のランプ装置本体34の基板取付部39に発光モジュール基板50を密着して取り付け、この基板取付部39側から口金部38側に熱伝導可能に熱伝導接続手段であるねじ85によって接続しているため、ＬＥＤ35が発生する熱を基板取付部39に効率よく熱伝導できるとともにこの基板取付部39側から口金部38側にも効率よく熱伝導できる。口金部38に熱伝導された熱は、口金部38が接触する器具本体12に熱伝導され、効率よく放熱できる。 Therefore, when the LED 35 of the lamp device 14 is lit, the heat generated from the LED 35 is efficiently radiated. That is, the light emitting module substrate 50 is attached in close contact with the substrate mounting portion 39 of the metal lamp device main body 34, and the screw 85 which is a heat conduction connecting means is capable of heat conduction from the substrate mounting portion 39 side to the base portion 38 side. Since it is connected, the heat generated by the LED 35 can be efficiently conducted to the board mounting portion 39 and also efficiently conducted from the board mounting portion 39 side to the base portion 38 side. The heat conducted to the base part 38 is thermally conducted to the instrument body 12 with which the base part 38 contacts, and can be efficiently radiated.
　なお、反射板部18を円周方向に分割するような複数のスリットを反射板部18に設け、分割された反射板部18の小片に弾性を持たせるようにしてランプ装置本体34の外周部83と反射板部18とを密着させるように構成してもよい。さらに、ランプ装置本体34の外周部83に密着する金属製のばね部材を別途も受けて熱伝導させるように構成しても構わない。 A plurality of slits that divide the reflector plate 18 in the circumferential direction are provided in the reflector plate 18 so that the small pieces of the divided reflector plate 18 have elasticity, and the outer periphery of the lamp device main body 34 83 and the reflector 18 may be configured to be in close contact with each other. Furthermore, a metal spring member that is in close contact with the outer peripheral portion 83 of the lamp device main body 34 may be separately received and thermally conducted.
　次に、図１５は第７の実施の形態を示し、図１５は照明器具の断面図である。 Next, FIG. 15 shows a seventh embodiment, and FIG. 15 is a sectional view of a lighting fixture.
　ランプ装置本体34の基板取付部39側から口金部38側に熱伝導可能に接続する熱伝導接続手段としての螺合部94を用いたものである。すなわち、口金側金属部品81の外周部83にねじ部95を形成し、光源側金属部品82の周縁部に口金側金属部品81のねじ部95に螺合するねじ部96を形成する。 The screw unit 94 is used as a heat conduction connecting means for connecting the lamp device main body 34 from the substrate mounting part 39 side to the base part 38 side so as to allow heat conduction. That is, a screw portion 95 is formed on the outer peripheral portion 83 of the base metal component 81, and a screw portion 96 that is screwed to the screw portion 95 of the base metal component 81 is formed on the peripheral portion of the light source side metal component 82.
　このように、熱伝導接続手段として螺合構造を用いた場合にも、基板取付部39側から口金部38側に効率よく熱伝導できる。 Thus, even when a screwed structure is used as the heat conduction connecting means, heat conduction can be efficiently performed from the substrate mounting portion 39 side to the base portion 38 side.
　なお、ランプ装置本体34を、このランプ装置本体34の中心を通る高さ方向の分割線で縦に分割し、これらをねじ止めなどで結合するようにしてもよい。この場合、熱伝導接続手段として基板取付部39側と口金部38側とを一体構造とし、基板取付部39側から口金部38側に効率よく熱伝導できる。 Note that the lamp device main body 34 may be divided vertically by a dividing line in the height direction passing through the center of the lamp device main body 34, and these may be coupled by screwing or the like. In this case, the substrate attachment portion 39 side and the base portion 38 side are integrated as a heat conduction connecting means, and heat can be efficiently conducted from the substrate attachment portion 39 side to the base portion 38 side.
　次に、図１６および図１７に第８の実施の形態を示し、図１６はランプ装置の側面図、図１７は照明器具の断面図である。 Next, FIG. 16 and FIG. 17 show an eighth embodiment, FIG. 16 is a side view of the lamp device, and FIG. 17 is a cross-sectional view of the lighting fixture.
　ランプ装置本体34の口金部38の下面に発光モジュール基板50が熱伝導可能に取り付けられる平面状の基板取付部39が形成され、口金部38の突出部42の内側に点灯回路37を収容する収容部40が形成されている。ランプピン44と点灯回路37との接続は、基板取付部39に溝を形成し、この溝にランプピン44と点灯回路37とを接続するリード線を配置するようにすればよい。ランプ装置本体34の突出部42の一部または全部を分割形成し、収容部40に点灯回路37を収容できるように構成されている。 A flat substrate mounting portion 39 to which the light emitting module substrate 50 is mounted so as to be capable of conducting heat is formed on the lower surface of the base portion 38 of the lamp device main body 34, and the lighting circuit 37 is accommodated inside the protruding portion 42 of the base portion 38. Part 40 is formed. The lamp pin 44 and the lighting circuit 37 may be connected by forming a groove in the board mounting portion 39 and arranging a lead wire for connecting the lamp pin 44 and the lighting circuit 37 in the groove. A part or all of the projecting portion 42 of the lamp device main body 34 is divided and formed so that the lighting circuit 37 can be accommodated in the accommodating portion 40.
　また、ランプ装置14をソケット装置13に装着することにより、ランプ装置14の口金部38の当接面41が器具本体12に熱伝導可能に密着接触するように構成されている。この場合、ランプ装置14のランプピン44の位置に対応して器具本体12に開口部が形成され、この開口部に臨んでソケット装置13が配置されており、ランプピン44が器具本体12に接触せずにソケット装置13に装着可能としている。 Further, by attaching the lamp device 14 to the socket device 13, the contact surface 41 of the base portion 38 of the lamp device 14 is configured to be in close contact with the instrument main body 12 so as to be able to conduct heat. In this case, an opening is formed in the instrument main body 12 corresponding to the position of the lamp pin 44 of the lamp device 14, and the socket device 13 is arranged facing the opening, so that the lamp pin 44 does not contact the instrument main body 12. The socket device 13 can be mounted.
　そして、熱伝導接続手段として基板取付部39側と口金部38側とを一体構造としているため、基板取付部39側から口金部38側に効率よく熱伝導できる。 And since the board attachment part 39 side and the base part 38 side are integrated as a heat conduction connection means, heat conduction can be efficiently conducted from the board attachment part 39 side to the base part 38 side.
　口金部38に熱伝導された熱は、口金部38の当接面41が接触する器具本体12に効率よく熱伝導され、効率よく放熱できる。 The heat conducted to the base part 38 is efficiently conducted to the instrument body 12 with which the contact surface 41 of the base part 38 comes into contact, and can be radiated efficiently.
　なお、点灯回路37はランプ装置本体34の下面側にＬＥＤ35と一緒に配置してもよい。この場合、ランプ装置本体34は点灯回路37を収容する収容部40を設けたり分割形成する必要がなく、ランプ装置本体34を簡単にできる。 Note that the lighting circuit 37 may be disposed together with the LED 35 on the lower surface side of the lamp device body 34. In this case, the lamp device main body 34 does not need to be provided with the accommodating portion 40 for accommodating the lighting circuit 37 or is formed separately, and the lamp device main body 34 can be simplified.
　次に、図１８および図１９に第９の実施の形態を示し、図１８は照明器具の断面図、図１９はランプ装置の分解状態の斜視図である。 Next, FIG. 18 and FIG. 19 show a ninth embodiment, FIG. 18 is a sectional view of a lighting fixture, and FIG. 19 is a perspective view of an exploded state of a lamp device.
　ランプ装置14の口金部38は、ベース101、このベース101に取り付けられたカバー102、およびこのカバー102から突出する一対のランプピン44を備えている。 The base portion 38 of the lamp device 14 includes a base 101, a cover 102 attached to the base 101, and a pair of lamp pins 44 protruding from the cover 102.
　ベース101は、例えば、アルミニウムなどの熱伝導性に優れた金属製で、平盤状であって円盤状（環状）の基板取付部39と、この基板取付部39の上面中央から突出する円筒状の突出部42と、基板取付部39の上面周辺部から突出する環状の壁部103とが一体に形成されている。基板取付部39の上面で突出部42と壁部103との間には、点灯回路37を収納する環状の収納部40が形成されている。このベース101の基板取付部39の下面には、発光モジュール基板50が面接触して密着するようにねじで取り付けられている。 The base 101 is made of, for example, a metal having excellent thermal conductivity such as aluminum, and is a flat plate-shaped (annular) substrate mounting portion 39 and a cylindrical shape protruding from the center of the upper surface of the substrate mounting portion 39. The protruding portion 42 and the annular wall portion 103 protruding from the periphery of the upper surface of the substrate mounting portion 39 are integrally formed. An annular storage portion 40 for storing the lighting circuit 37 is formed between the protruding portion 42 and the wall portion 103 on the upper surface of the substrate mounting portion 39. The light emitting module substrate 50 is attached to the lower surface of the substrate mounting portion 39 of the base 101 with screws so that the light emitting module substrate 50 comes into surface contact and comes into close contact therewith.
　カバー102は、絶縁性を有する合成樹脂製で、リング状に形成されている。このカバー102がベース101の収納部40の上面を閉塞する状態に取り付けられている。 The cover 102 is made of an insulating synthetic resin and formed in a ring shape. The cover 102 is attached so as to close the upper surface of the storage portion 40 of the base 101.
　また、点灯回路37は、点灯回路基板89が環状に形成され、図示しない絶縁材を介在して口金部38の収納部40に収納されて取り付けられている。 The lighting circuit 37 has a lighting circuit board 89 formed in an annular shape, and is housed and attached in the housing part 40 of the base part 38 with an insulating material (not shown) interposed therebetween.
　そして、ランプ装置14をソケット装置13に装着した状態では、ランプ装置14の突出部42がソケット装置13の挿通孔22に挿入されるとともに、突出部42の端面43が器具本体12の平板部17に熱伝導可能に接触する。このとき、器具本体12の平板部17の一部を分割するような複数のスリットを平板部17に設け、分割された平板部17の小片に弾性を持たせるようにして突出部42の端面43に熱伝導可能に接触させてもよく、あるいは、突出部42の端面43に密着する金属製のばね部材を別途設けて熱伝導可能に接触させてもよい。 When the lamp device 14 is mounted on the socket device 13, the protruding portion 42 of the lamp device 14 is inserted into the insertion hole 22 of the socket device 13, and the end surface 43 of the protruding portion 42 is the flat plate portion 17 of the instrument body 12. In contact with heat conduction. At this time, a plurality of slits that divide a part of the flat plate portion 17 of the instrument main body 12 are provided in the flat plate portion 17 so that the small pieces of the divided flat plate portion 17 have elasticity, so that the end surface 43 of the protruding portion 42 is provided. It may be in contact with the end face 43 of the projecting portion 42, or a metal spring member that is in close contact with the end face 43 may be provided separately so as to be able to conduct heat.
　また、ランプ装置14のＬＥＤ35の点灯時においては、ＬＥＤ35の発生する熱が発光モジュール基板50から口金部38のベース101の基板取付部39へ効率よく熱伝導され、このベース101の基板取付部39に熱伝導された熱が一体に形成されている突出部42へ効率よく熱伝導される。この突出部42に熱伝導された熱は突出部42の端面43から器具本体12へ効率よく熱伝導され、この器具本体12に熱伝導された熱が大気中に放熱される。 Further, when the LED 35 of the lamp device 14 is turned on, heat generated by the LED 35 is efficiently conducted from the light emitting module substrate 50 to the substrate mounting portion 39 of the base 101 of the base portion 38, and the substrate mounting portion 39 of the base 101 is transmitted. The heat conducted to the projecting portion 42 formed integrally is efficiently conducted. The heat conducted to the projection 42 is efficiently conducted from the end face 43 of the projection 42 to the instrument body 12, and the heat conducted to the instrument body 12 is radiated into the atmosphere.
　そのため、ベース101の基板取付部39に熱伝導されたＬＥＤ35の発生する熱を一体に形成されている突出部42へ効率よく熱伝導でき、突出部42に熱を集めるとともにこの突出部42から効率よく器具本体12へ熱を逃すことが可能となり、放熱性を向上できる。 Therefore, the heat generated by the LED 35 that is thermally conducted to the board mounting portion 39 of the base 101 can be efficiently conducted to the projecting portion 42 that is integrally formed, and the heat is collected in the projecting portion 42 and the efficiency from the projecting portion 42 is increased. It is possible to release heat to the instrument body 12 and improve heat dissipation.
　一方、ベース101の基板取付部39に熱伝導された熱は、一体に形成されている壁部103へも効率よく熱伝導され、この壁部103に熱伝導された熱が壁部103から大気中に放熱される。そのため、ＬＥＤ35の発生する熱の放熱性を向上できる。 On the other hand, the heat conducted to the board mounting portion 39 of the base 101 is also efficiently conducted to the integrally formed wall 103, and the heat conducted to the wall 103 is transferred from the wall 103 to the atmosphere. Heat is dissipated inside. Therefore, the heat dissipation of the heat generated by the LED 35 can be improved.
　したがって、本実施の形態のランプ装置14は、十分な放熱性が得られ、ＬＥＤ35の温度上昇を抑制でき、ＬＥＤ35が熱劣化して短寿命となったり、場合によっては発光効率が低下するのを防止できる。 Therefore, the lamp device 14 according to the present embodiment has sufficient heat dissipation, can suppress the temperature rise of the LED 35, the LED 35 is thermally deteriorated and has a short life, and in some cases, the luminous efficiency is reduced. Can be prevented.
　次に、図２０に第１０の実施の形態を示す。図２０は照明器具の断面図である。 Next, FIG. 20 shows a tenth embodiment. FIG. 20 is a cross-sectional view of the lighting fixture.
　ランプ装置14は、口金部38のベース101の突出部42を円柱状とし、突出部42の内側が中実に形成されている。このように構成した場合には、基板取付部39との接触面積が増大するとともに、熱伝導効率が高くなるのでＬＥＤ35の熱を発光モジュール基板50から突出部42の端面43へ伝導しやすくなることから、基板取付部39からベース101への熱伝導性を向上でき、その結果、ＬＥＤ35の発生する熱の放熱性を一層向上させることができる。 The lamp device 14 has a protruding part 42 of the base 101 of the base part 38 in a cylindrical shape, and the inside of the protruding part 42 is solid. When configured in this way, the contact area with the board mounting portion 39 is increased, and the heat conduction efficiency is increased, so that the heat of the LED 35 can be easily conducted from the light emitting module substrate 50 to the end face 43 of the protruding portion 42. Thus, the thermal conductivity from the board mounting portion 39 to the base 101 can be improved, and as a result, the heat dissipation of the heat generated by the LED 35 can be further improved.
　次に、図２１に第１１の実施の形態を示す。図２１は照明器具の斜視図である。 Next, FIG. 21 shows an eleventh embodiment. FIG. 21 is a perspective view of a lighting fixture.
　器具本体12の平板部17に、排気孔106を設けるとともに、この排気孔106から器具本体12内の空気を外部へ排気するファン107を配置する。 An exhaust hole 106 is provided in the flat plate portion 17 of the instrument body 12, and a fan 107 that exhausts the air in the instrument body 12 from the exhaust hole 106 to the outside is disposed.
　ソケット装置13には、ソケット装置本体21の外周面と挿通孔22の内周面とを連通する複数の通気孔108を設ける。 The socket device 13 is provided with a plurality of vent holes 108 that communicate the outer peripheral surface of the socket device main body 21 and the inner peripheral surface of the insertion hole 22.
　そして、ファン107の動作により、器具本体12の下方の空気が、器具本体12の下面の開口部19から器具本体12内に吸い込まれ、ソケット装置13の複数の通気孔108を通じて挿通孔22とこの挿通孔22に挿通されているランプ装置14の突出部42との隙間を通じて上方へ流れ、排気孔106から器具本体12の上方へ排気される空気の流れが発生する。 Then, by the operation of the fan 107, the air below the instrument body 12 is sucked into the instrument body 12 from the opening 19 on the lower surface of the instrument body 12, and the insertion hole 22 and this through the plurality of vent holes 108 of the socket device 13 A flow of air that flows upward through the gap with the projecting portion 42 of the lamp device 14 inserted through the insertion hole 22 and exhausted upward from the exhaust hole 106 to the upper part of the instrument body 12 is generated.
　この空気の流れにより、突出部42に熱伝導された熱が効率よく空気中に放熱させることができ、その結果、ＬＥＤ35の発生する熱の放熱性を向上できる。 This air flow allows the heat conducted to the protrusion 42 to be efficiently radiated into the air, and as a result, the heat dissipation of the heat generated by the LED 35 can be improved.
　次に、図２２に第１２の実施の形態を示す。図２２は照明器具の斜視図である。 Next, FIG. 22 shows a twelfth embodiment. FIG. 22 is a perspective view of the lighting fixture.
　図２１に示す第１１の実施の形態において、ランプ装置14の突出部42にフィン109を設けたものであり、このフィン109によってファン107の動作で流れる空気との接触面積を増大させて、放熱性をより向上できる。 In the eleventh embodiment shown in FIG. 21, a fin 109 is provided on the projecting portion 42 of the lamp device 14, and this fin 109 increases the contact area with the air flowing through the operation of the fan 107 to dissipate heat. Can be improved.
　図２３ないし図２７に第１３の実施の形態を示し、図２３は照明器具のランプ装置とソケット装置の分解状態の斜視図、図２４はランプ装置の平面図、図２５はランプ装置のランプピンとソケット装置の給電部との関係を(a)(b)に示す一部の断面図、図２６はランプ装置の信号端子とソケット装置の信号伝送部との関係を(a)(b)に示す一部の断面図、図２７は照明器具の回路図である。 FIGS. 23 to 27 show a thirteenth embodiment, in which FIG. 23 is a perspective view of a lamp device and a socket device of a lighting fixture in an exploded state, FIG. 24 is a plan view of the lamp device, and FIG. 25 is a lamp pin of the lamp device. FIG. 26 is a partial cross-sectional view showing the relationship between the power supply unit of the socket device and FIGS. 26A and 26B show the relationship between the signal terminal of the lamp device and the signal transmission unit of the socket device. FIG. 27 is a circuit diagram of a lighting apparatus.
　図２３に示すように、照明器具11は、例えばダウンライトであり、図示しない器具本体、この器具本体に取り付けられた出力調整対応のソケット装置13、およびこのソケット装置13に着脱可能な出力調整機能を有するランプ装置14を備えている。 As shown in FIG. 23, the luminaire 11 is, for example, a downlight, a fixture main body (not shown), a socket device 13 that is attached to the fixture main body, and that can be attached to and detached from the socket device 13. A lamp device 14 having
　ソケット装置13のソケット装置本体21の下面には、ソケット装置本体21の中心に対して対称位置に一対のソケット部24が形成されている。図２５に示すように、これらソケット部24には、給電用の接続孔25が形成されているとともに、この接続孔25の内側にランプ装置14に対して電力を供給する給電部としての給電用受金111が配置されている。接続孔25は、ソケット装置本体21の中心に対して同心円となる円弧状の長孔であり、その一端には拡径部26が形成されている。給電用受金111は、接続孔25の他端側の側部に配置されていて、接続孔25の外部から触れることがない位置に配置されている。 A pair of socket portions 24 are formed on the lower surface of the socket device body 21 of the socket device 13 at symmetrical positions with respect to the center of the socket device body 21. As shown in FIG. 25, these socket portions 24 are formed with connection holes 25 for power supply, and for power supply as power supply portions for supplying power to the lamp device 14 inside the connection holes 25. A receipt 111 is arranged. The connection hole 25 is an arc-shaped long hole that is concentric with the center of the socket device main body 21, and has an enlarged diameter portion 26 formed at one end thereof. The power receiving metal 111 is disposed on the side of the other end of the connection hole 25 and is disposed at a position where it cannot be touched from the outside of the connection hole 25.
　図２３に示すように、ソケット装置本体21の下面には、一対のソケット部24に対して直交する位置であって、ソケット装置本体21の中心に対して対称位置に、一対の信号用の接続孔112が形成されているとともに、図２６に示すように、この接続孔112の内側にランプ装置14に対して信号を伝達する信号伝送部としての信号用受金113が配置されている。接続孔112は、ソケット装置本体21の中心に対して同心円となる円弧状の長孔に構成されているが、一端側に拡径部を設けてもよい。信号用受金113は、接続孔112の他端側で一部が接続孔112内に臨む位置に侵入配置されている。 As shown in FIG. 23, on the lower surface of the socket device body 21, a pair of signal connections is located at a position orthogonal to the pair of socket portions 24 and symmetrical to the center of the socket device body 21. A hole 112 is formed, and as shown in FIG. 26, a signal receiver 113 as a signal transmission unit that transmits a signal to the lamp device 14 is disposed inside the connection hole 112. The connection hole 112 is configured as an arc-shaped elongated hole that is concentric with the center of the socket device main body 21, but a diameter-enlarged portion may be provided on one end side. The signal receiver 113 is intruded and arranged at a position where the other end of the connection hole 112 faces the connection hole 112.
　給電用受金111には器具本体12に配線される電源線が電気的に接続され、信号用受金113には図示しない制御装置などからの信号線が電気的に接続されている。 The power supply wire 111 is electrically connected to a power line wired to the instrument body 12, and the signal wire 113 is electrically connected to a signal line from a control device (not shown).
　また、図２３および図２４に示すように、ランプ装置14の口金部38の当接面41には、ランプ装置14の中心に対して対称位置に、導電性を有する金属製の一対のランプピン44が突出されている。これらランプピン44には、軸部44a、およびこの軸部44aの先端部に径大部45が形成されている。そして、ランプ装置14をソケット装置13に装着する際、図２５(a)に示すように、各ランプピン44の径大部45がソケット装置13の各接続孔25の拡径部26から挿入され、図２５(b)に示すように、ランプ装置14の回動にてランプピン44の軸部44aが接続孔25に移動することにより、ランプピン44の径大部45の周面が給電用受金111に接触して電気的に接続されるとともに、径大部45が接続孔25の縁部に引っ掛かって、ランプ装置14がソケット装置13に保持されるように構成されている。 Further, as shown in FIGS. 23 and 24, the contact surface 41 of the base portion 38 of the lamp device 14 has a pair of conductive metal lamp pins 44 in a symmetrical position with respect to the center of the lamp device 14. Is protruding. These lamp pins 44 are formed with a shaft portion 44a and a large-diameter portion 45 at the tip portion of the shaft portion 44a. Then, when the lamp device 14 is attached to the socket device 13, as shown in FIG. 25 (a), the large diameter portion 45 of each lamp pin 44 is inserted from the large diameter portion 26 of each connection hole 25 of the socket device 13, As shown in FIG. 25B, when the lamp device 14 is rotated, the shaft portion 44a of the lamp pin 44 moves to the connection hole 25, so that the peripheral surface of the large-diameter portion 45 of the lamp pin 44 is the power receiving 111. The large-diameter portion 45 is hooked on the edge of the connection hole 25 so that the lamp device 14 is held by the socket device 13.
　ランプ装置14の口金部38の当接面41には、一対のランプピン44とは直交する位置であって、ランプ装置14の中心に対して対称位置に、導電性を有する金属製の一対の信号端子115が突設されている。これら信号端子115は、円柱状のピンによって構成されている。そして、ランプ装置14をソケット装置13に装着する際、図２６(a)に示すように、各信号端子115がソケット装置13の各接続孔112の一端に挿入され、図２６(b)に示すように、ランプ装置14の回動にて信号端子115が接続孔112の他端側に移動することにより、信号端子115が信号用受金113に接触して電気的に接続されるように構成されている。 The contact surface 41 of the base portion 38 of the lamp device 14 is a position orthogonal to the pair of lamp pins 44 and is symmetrical with respect to the center of the lamp device 14, and a pair of conductive metal signals. A terminal 115 is projected. These signal terminals 115 are constituted by cylindrical pins. Then, when the lamp device 14 is mounted on the socket device 13, as shown in FIG. 26 (a), each signal terminal 115 is inserted into one end of each connection hole 112 of the socket device 13, and shown in FIG. 26 (b). Thus, the signal terminal 115 moves to the other end side of the connection hole 112 by the rotation of the lamp device 14 so that the signal terminal 115 is in contact with and electrically connected to the signal receiving plate 113. Has been.
　また、点灯回路37は、点灯回路基板を有し、この点灯回路基板の電源入力側とランプピン44とがリード線などで電気的に接続され、点灯回路基板の点灯出力側と発光モジュール基板50とがリード線などで電気的に接続されている。さらに、点灯回路基板には、点灯回路37の出力を調整する制御回路なども搭載されており、この制御回路の信号入力部と信号端子115とがリード線などで電気的に接続されている。 The lighting circuit 37 includes a lighting circuit board, and the power input side of the lighting circuit board and the lamp pin 44 are electrically connected by a lead wire or the like, and the lighting output side of the lighting circuit board and the light emitting module board 50 Are electrically connected by lead wires or the like. Further, a control circuit for adjusting the output of the lighting circuit 37 is mounted on the lighting circuit board, and the signal input section of the control circuit and the signal terminal 115 are electrically connected by a lead wire or the like.
　次に、図２７に照明器具11の回路図を示す。照明器具11は、外部からの信号によりランプ装置14のＬＥＤ35の光出力、ここではＬＥＤ35の調光を制御するものである。 Next, FIG. 27 shows a circuit diagram of the luminaire 11. The luminaire 11 controls the light output of the LED 35 of the lamp device 14, here the dimming of the LED 35, by a signal from the outside.
　ソケット装置13は、商用電源ｅに給電用受金111の受金が接続されている。 The socket device 13 is connected to a commercial power source e for receiving a power supply 111.
　ランプ装置14は、ランプピン44に全波整流器であるダイオードブリッジDB1の入力側が接続されている。 The lamp device 14 has a lamp pin 44 connected to the input side of a diode bridge DB1, which is a full-wave rectifier.
　ダイオードブリッジDB1の出力側には、平滑コンデンサC1が接続されているとともに、トランスTr1の一次巻線と出力制御用のスイッチング素子としてのＮＰＮ型のトランジスタQ1の直列回路が接続されている。このトランジスタQ1を駆動回路で駆動制御することにより、トランスTr1の二次側に流れる直流電流を制御する。 A smoothing capacitor C1 is connected to the output side of the diode bridge DB1, and a series circuit of a primary winding of the transformer Tr1 and an NPN transistor Q1 as a switching element for output control is connected. By controlling the driving of the transistor Q1 with a driving circuit, the DC current flowing on the secondary side of the transformer Tr1 is controlled.
　トランスTr1の二次側には、整流用のダイオードD1および平滑用の電解コンデンサC2を備えた整流平滑回路が接続され、この整流平滑回路に抵抗R1，R2，R3、ＬＥＤ35，35，35およびトランジスタQ2，Q3，Q4の複数の直列回路が並列に接続されている。 A rectifying / smoothing circuit including a rectifying diode D1 and a smoothing electrolytic capacitor C2 is connected to the secondary side of the transformer Tr1, and resistors R1, R2, R3, LEDs 35, 35, 35, and transistors are connected to the rectifying / smoothing circuit. Multiple series circuits of Q2, Q3, and Q4 are connected in parallel.
　電解コンデンサC2と抵抗R1，R2，R3と間に抵抗R4および電解コンデンサC3の直列回路が接続され、電解コンデンサC3と並列に制御回路117が接続されている。この制御回路117からトランジスタQ2，Q3，Q4のベースにＰＷＭ信号を供給し、トランジスタQ2，Q3，Q4をＰＷＭ制御する。この制御回路117には、外部からの調光信号がソケット装置13の信号用受金113およびランプ装置14の信号端子115を通じて入力される。 A series circuit of a resistor R4 and an electrolytic capacitor C3 is connected between the electrolytic capacitor C2 and the resistors R1, R2, and R3, and a control circuit 117 is connected in parallel with the electrolytic capacitor C3. A PWM signal is supplied from the control circuit 117 to the bases of the transistors Q2, Q3, and Q4, and the transistors Q2, Q3, and Q4 are PWM-controlled. A dimming signal from the outside is input to the control circuit 117 through the signal receiver 113 of the socket device 13 and the signal terminal 115 of the lamp device 14.
　そして、本実施の形態の照明器具11の動作を説明する。 And operation | movement of the lighting fixture 11 of this Embodiment is demonstrated.
　調光対応のソケット装置13に調光機能を有するランプ装置14を装着するには、図２５(a)に示すように、ランプ装置14の各ランプピン44の径大部45をソケット装置13の各接続孔25の拡径部26に挿入し、同時に、図２６(a)に示すように、各信号端子115をソケット装置13の各接続孔112の一端に挿入する。この状態で、ランプ装置14を装着方向に回動させることにより、図２５(b)に示すように、ランプピン44の軸部44aが接続孔25に移動し、ランプピン44の径大部45が給電用受金111に接触して電気的に接続されるとともに、径大部45が接続孔25の縁部に引っ掛かって、ランプ装置14がソケット装置13に保持される。同時に、図２６(b)に示すように、信号端子115が接続孔112の他端側に移動し、信号端子115が信号用受金113に接触して電気的に接続される。 In order to mount the lamp device 14 having a dimming function to the dimmable socket device 13, as shown in FIG. 25 (a), the large diameter portion 45 of each lamp pin 44 of the lamp device 14 is set to each of the socket devices 13. At the same time, each signal terminal 115 is inserted into one end of each connection hole 112 of the socket device 13 as shown in FIG. In this state, by rotating the lamp device 14 in the mounting direction, as shown in FIG. 25 (b), the shaft portion 44a of the lamp pin 44 moves to the connection hole 25, and the large diameter portion 45 of the lamp pin 44 feeds power. The large diameter portion 45 is hooked on the edge portion of the connection hole 25 and the lamp device 14 is held by the socket device 13 while being in contact with and electrically connected to the metal receiver 111. At the same time, as shown in FIG. 26 (b), the signal terminal 115 moves to the other end side of the connection hole 112, and the signal terminal 115 contacts and is electrically connected to the signal receiver 113.
　したがって、ソケット装置13にランプ装置14を装着することにより、ソケット装置13の給電用受金111にランプ装置14のランプピン44が電気的に接続され、ソケット装置13からランプ装置14に電力供給が可能となる。同時に、ソケット装置13の信号用受金113にランプ装置14の信号端子115が電気的に接続され、ソケット装置13からランプ装置14への信号の伝送が可能となる。 Therefore, by attaching the lamp device 14 to the socket device 13, the lamp pin 44 of the lamp device 14 is electrically connected to the power receiving metal 111 of the socket device 13, and power can be supplied from the socket device 13 to the lamp device 14. It becomes. At the same time, the signal terminal 115 of the lamp device 14 is electrically connected to the signal receiver 113 of the socket device 13, and the signal can be transmitted from the socket device 13 to the lamp device 14.
　そして、商用電源ｅの投入により、商用電源ｅがダイオードブリッジDB1で整流されるとともに平滑コンデンサC1で平滑される。トランジスタQ1によりトランスTr1の一次側に流れる電流を制御し、トランスTr1の二次側に流れる直流電流を所定の電流値に制御する。このトランスTr1の二次側に流れる直流電流がＬＥＤ35に供給され、ＬＥＤ35が点灯する。 When the commercial power source e is turned on, the commercial power source e is rectified by the diode bridge DB1 and smoothed by the smoothing capacitor C1. The transistor Q1 controls the current flowing on the primary side of the transformer Tr1, and the direct current flowing on the secondary side of the transformer Tr1 is controlled to a predetermined current value. A direct current flowing on the secondary side of the transformer Tr1 is supplied to the LED 35, and the LED 35 is turned on.
　このとき、制御回路117によりトランジスタQ2，Q3，Q4をＰＷＭ制御し、トランジスタQ2，Q3，Q4のオン期間にはＬＥＤ35が点灯し、トランジスタQ2，Q3，Q4のオフ期間にはＬＥＤ35が消灯する。ＬＥＤ35は点灯、消灯が繰り返されるが、高速での点滅であるため使用者にはＬＥＤ35の点灯が維持しているように見える。 At this time, the transistors Q2, Q3, and Q4 are PWM-controlled by the control circuit 117, and the LED 35 is turned on when the transistors Q2, Q3, and Q4 are on, and the LED 35 is turned off when the transistors Q2, Q3, and Q4 are off. The LED 35 is repeatedly turned on and off, but since it blinks at high speed, it seems to the user that the lighting of the LED 35 is maintained.
　外部からの調光信号が制御回路117に入力され、制御回路117は入力された信号に基づいて、トランジスタQ2，Q3，Q4をＰＷＭ制御し、ＬＥＤ35を調光する。 A dimming signal from the outside is input to the control circuit 117, and the control circuit 117 performs PWM control on the transistors Q2, Q3, and Q4 based on the input signal to dim the LED 35.
　このように、口金部38には、ソケット装置13から電力供給を受けるランプピン44の他に、ソケット装置13から伝送される信号を受ける信号端子115を設けたため、信号端子115に受ける信号に応じて点灯回路37の出力を調整し、ＬＥＤ35を調光できる。 As described above, the base portion 38 is provided with the signal terminal 115 for receiving the signal transmitted from the socket device 13 in addition to the lamp pin 44 for receiving power supply from the socket device 13, so that the signal received by the signal terminal 115 can be changed. The LED 35 can be dimmed by adjusting the output of the lighting circuit 37.
　特に、ランプピン44が給電用受金111に接続した状態において、信号用受金113に信号端子115が接続されるので、ランプ装置14をソケット装置13に装着することによってＬＥＤ35の調光制御が可能となる。 In particular, since the signal terminal 115 is connected to the signal receiver 113 when the lamp pin 44 is connected to the power receiver 111, dimming control of the LED 35 is possible by attaching the lamp device 14 to the socket device 13. It becomes.
　また、調光対応のソケット装置13に、調光機能を有さないランプ装置が接続された場合には、ソケット装置13側からの調光信号は調光機能を有さないランプ装置には伝送されず、調光機能を有さないランプ装置は調光信号に関係なく、所定の出力で点灯する。 In addition, when a lamp device that does not have a light control function is connected to the socket device 13 that supports light control, the light control signal from the socket device 13 side is transmitted to the lamp device that does not have a light control function. The lamp device that does not have the dimming function is lit at a predetermined output regardless of the dimming signal.
　また、調光機能を有するランプ装置14は、口金部38から信号端子115が突出しているため、調光対応でないソケット装置には装着することができない。 Also, the lamp device 14 having a dimming function cannot be mounted on a socket device that does not support dimming because the signal terminal 115 protrudes from the base portion 38.
　なお、図２８に示す第１４の実施の形態のように、ランプ装置14の口金部38に配置する一対の信号端子115は、一対のランプピン44に対して直交する方向の一方にまとめて配置してもよい。この場合、電圧の高いランプピン44側と信号を伝送する電圧の低い信号端子115側とを分離できる利点がある。 Note that, as in the fourteenth embodiment shown in FIG. 28, the pair of signal terminals 115 arranged in the base portion 38 of the lamp device 14 are arranged together in one direction orthogonal to the pair of lamp pins 44. May be. In this case, there is an advantage that the lamp pin 44 side having a high voltage can be separated from the signal terminal 115 side having a low voltage for transmitting a signal.
　また、図２９に示す第１５の実施の形態のように、ランプ装置14の口金部38に配置する一対の信号端子115は、突出部42の側部から突出させてもよい。この場合には、ソケット装置13の挿通孔22の内側に接続孔112や信号用受金113に相当する構成を設ければよい。 Further, as in the fifteenth embodiment shown in FIG. 29, the pair of signal terminals 115 arranged on the base portion 38 of the lamp device 14 may be protruded from the side portion of the protruding portion 42. In this case, a configuration corresponding to the connection hole 112 or the signal receiving metal 113 may be provided inside the insertion hole 22 of the socket device 13.
　また、図３０に示す第１６の実施の形態のように、ランプ装置14の口金部38に配置する一対の信号端子115は、口金部38の突出部42の端面に設けてもよい。この場合、信号端子115と接続される信号用受金113に相当する構成を器具本体12側に配置してもよい。 Further, as in the sixteenth embodiment shown in FIG. 30, the pair of signal terminals 115 arranged on the base part 38 of the lamp device 14 may be provided on the end face of the protruding part 42 of the base part 38. In this case, a configuration corresponding to the signal receiver 113 connected to the signal terminal 115 may be disposed on the instrument body 12 side.
　なお、ランプ装置14に伝送する信号は、ＬＥＤ35を調光する調光信号に限らず、ランプ装置14がカラー照明可能であれば、ＬＥＤ35の色を調整するＲＧＢ信号でもよい。 The signal transmitted to the lamp device 14 is not limited to the dimming signal for dimming the LED 35, but may be an RGB signal for adjusting the color of the LED 35 as long as the lamp device 14 can perform color illumination.
　なお、第５ないし第１６の実施の形態においても、第１ないし第４の実施の形態と同様に、ランプ装置14をソケット装置13に装着することにより、口金部38の突出部42の端面43と放熱体とが接触する方向に押圧するようにできる。 In the fifth to sixteenth embodiments, as in the first to fourth embodiments, by attaching the lamp device 14 to the socket device 13, the end face 43 of the protruding portion 42 of the base portion 38 is obtained. And can be pressed in the direction in which the radiator is in contact.
　本発明は、ダウンライト、天井埋込形照明器具、天井直付形照明器具、吊下げ形照明器具、壁面正面器具、およびその他の照明器具に利用される。 The present invention is used for downlights, recessed ceiling lighting fixtures, direct ceiling lighting fixtures, suspended lighting fixtures, wall front fixtures, and other lighting fixtures.
　11　　照明器具
　12　　放熱体としての器具本体
　13　　ソケット装置
　14　　ランプ装置
　21　　ソケット装置本体
　22　　挿通孔
　30　　押圧体としての弾性体
　34　　ランプ装置本体
　35　　光源、半導体発光素子としてのＬＥＤ
　37　　点灯回路
　38　　口金部
　39　　基板取付部
　42　　突出部
　44　　ランプピン
　50　　発光モジュール基板
　55　　放熱体としての放熱板
　56　　押圧体としてのスプリング
　60　　放熱体としての放熱板
　61　　押圧体としてのスプリング
　67　　放熱体および押圧体としての放熱部材
　71　　ソケット支持体
　85　　熱伝導接続手段としてのねじ
　94　　熱伝導接続手段としての螺合部
　111 　給電部としての給電用受金
　113 　信号伝送部としての信号用受金
　115 　信号端子
　117 　制御回路 11 Lighting fixture 12 Fixture body as radiator 13 Socket device 14 Lamp device 21 Socket device body 22 Insertion hole 30 Elastic body as pressing body 34 Lamp device body 35 LED as light source and semiconductor light emitting element
37 Lighting circuit 38 Base part 39 Board mounting part 42 Projection 44 Lamp pin 50 Light emitting module board 55 Heat sink as heat sink 56 Spring as pressure body 60 Heat sink as heat sink 61 Spring as pressure body 67 Heat sink and press Heat-dissipating member as a body 71 Socket support 85 Screw as a heat conduction connecting means 94 Screwed portion as a heat conduction connecting means 111 Feed receiving as a power feeding part 113 Signal receiving as a signal transmission part 115 Signal terminal 117 Control circuit

Claims (8)

  1. 　扁平状のランプ装置の一面側に設けられた口金部を保持するとともに、ランプ装置の他面側に配置された光源を点灯させるための電力を口金部に供給するソケット装置と；
    　このソケット装置に保持された前記ランプ装置の口金部の少なくとも一部と接触する放熱体と；
    　前記ソケット装置に保持された前記ランプ装置の口金部と前記放熱体とを接触方向に押圧する押圧体と；
    　を具備していることを特徴とする照明器具。     A socket device that holds a base portion provided on one side of the flat lamp device and supplies power to the base portion to light a light source disposed on the other side of the lamp device;
    A radiator that contacts at least a part of the cap portion of the lamp device held by the socket device;
    A pressing body that presses the base portion of the lamp device held by the socket device and the radiator in a contact direction;
    The lighting fixture characterized by comprising.
  2. 　前記ソケット装置が配置された器具本体を具備し、
    　前記放熱体は、前記ランプ装置の口金部と前記器具本体とに接触する
    　ことを特徴とする請求項１記載の照明器具。     Comprising an instrument body in which the socket device is disposed;
    The lighting device according to claim 1, wherein the radiator is in contact with a base portion of the lamp device and the fixture main body.
  3. 　前記ソケット装置は、前記ランプ装置の口金部の中央から突出された突出部が挿通される挿通孔を有し、
    　前記放熱体は、前記ソケット装置に挿通された前記突出部の端面と面接触する
    　ことを特徴とする請求項１記載の照明器具。     The socket device has an insertion hole through which a protruding portion protruding from the center of the base portion of the lamp device is inserted,
    The lighting device according to claim 1, wherein the heat dissipating member is in surface contact with an end surface of the protruding portion inserted through the socket device.
  4. 　前記ソケット装置は、ソケット支持体と、前記ランプ装置の口金部を着脱可能とし、前記ソケット支持体により前記ソケット支持体側に収納される収納位置と前記ソケット支持体側から突出する突出位置との間で移動可能に支持されたソケット装置本体とを有している
    　ことを特徴とする請求項１記載の照明器具。     The socket device is configured such that a socket support and a cap portion of the lamp device are detachable, and the socket device is housed on the socket support side by the socket support and a protruding position protruding from the socket support side. The lighting apparatus according to claim 1, further comprising a socket device body that is movably supported.
  5. 　扁平状のランプ装置本体と、このランプ装置本体の一面側に設けられた口金部と、前記ランプ装置本体の他面側に配置された光源と、この光源を点灯させる点灯回路とを有するランプ装置を具備している
    　ことを特徴とする請求項１記載の照明器具。     A lamp device having a flat lamp device main body, a base portion provided on one surface side of the lamp device main body, a light source disposed on the other surface side of the lamp device main body, and a lighting circuit for lighting the light source The lighting fixture according to claim 1, comprising:
  6. 　前記ランプ装置は、前記ランプ装置本体の他面側に設けられた基板取付部と、この基板取付部と前記口金部とを熱伝導可能に接続する熱伝導接続手段と、前記光源として半導体発光素子を搭載し、前記基板取付部に取り付けられた発光モジュール基板とを有している
    　ことを特徴とする請求項５記載の照明器具。     The lamp device includes a substrate mounting portion provided on the other surface side of the lamp device main body, heat conductive connection means for connecting the substrate mounting portion and the base portion so as to allow heat conduction, and a semiconductor light emitting element as the light source. The lighting fixture according to claim 5, further comprising: a light emitting module substrate mounted on the substrate mounting portion.
  7. 　前記ランプ装置は、前記ランプ装置本体の他面側に設けられた基板取付部と、この基板取付部と一体に形成され、この基板取付部の一面側中央から前記口金側に突出する突出部と、前記光源として半導体発光素子が搭載され、前記基板取付部に取り付けられた発光モジュール基板とを有している
    　ことを特徴とする請求項５記載の照明器具。     The lamp device includes a substrate mounting portion provided on the other surface side of the lamp device main body, and a protruding portion that is formed integrally with the substrate mounting portion and protrudes from the center of one surface side of the substrate mounting portion toward the base. The lighting apparatus according to claim 5, further comprising: a light emitting module substrate mounted with a semiconductor light emitting element as the light source and attached to the substrate attaching portion.
  8. 　前記ソケット装置は、前記ランプ装置の口金部を保持するソケット装置本体と、このソケット装置本体に保持された前記ランプ装置に電力を供給する給電部と、前記ソケット装置本体に保持された前記ランプ装置に信号を伝送する信号伝送部とを有し、
    　前記ランプ装置は、前記ソケット装置の給電部から電力供給を受けるように前記給電部と接続可能なランプピンと、このランプピンが前記給電部と接続している状態において前記ソケット装置の信号伝送部から伝送される信号を受信可能なように前記信号伝送部と接続する信号端子と、前記ランプピンから電力供給を受けて光源を点灯させる点灯回路と、前記信号端子に入力された信号を受けて前記点灯回路の出力を調整する制御回路とを有している
    　ことを特徴とする請求項１記載の照明器具。     The socket device includes a socket device main body that holds a base portion of the lamp device, a power supply unit that supplies power to the lamp device held by the socket device main body, and the lamp device held by the socket device main body. And a signal transmission unit for transmitting a signal to
    The lamp device has a lamp pin connectable to the power supply unit so as to receive power supply from the power supply unit of the socket device, and transmits from the signal transmission unit of the socket device in a state where the lamp pin is connected to the power supply unit. A signal terminal connected to the signal transmission unit so as to be able to receive a signal to be received, a lighting circuit for lighting a light source by receiving power supply from the lamp pin, and the lighting circuit receiving a signal input to the signal terminal The lighting apparatus according to claim 1, further comprising: a control circuit that adjusts the output of the lighting device.
PCT/JP2009/069423 2008-11-28 2009-11-16 Lighting device WO2010061746A1 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
US13/119,519 US8613529B2 (en) 2008-11-28 2009-11-16 Lighting fixture
EP09828994.5A EP2336631B1 (en) 2008-11-28 2009-11-16 Lighting device
RU2011126378/07A RU2482384C2 (en) 2008-11-28 2009-11-16 Illumination device
CN200980135603XA CN102149962B (en) 2008-11-28 2009-11-16 Lighting device
KR1020117005381A KR101220657B1 (en) 2008-11-28 2009-11-16 Lighting device
US13/233,827 US8430535B2 (en) 2008-11-28 2011-09-15 Socket device, lamp device and lighting device
US13/597,992 US8540396B2 (en) 2008-11-28 2012-08-29 Lighting system
US13/597,953 US8434908B2 (en) 2008-11-28 2012-08-29 Socket device
US13/597,804 US8540399B2 (en) 2008-11-28 2012-08-29 Socket device
US13/597,893 US8523402B2 (en) 2008-11-28 2012-08-29 Socket device

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JP2008305584A JP5477530B2 (en) 2008-11-28 2008-11-28 lighting equipment
JP2008305585A JP2010129489A (en) 2008-11-28 2008-11-28 Socket assembly and lighting fixture
JP2008-305585 2008-11-28
JP2008-305583 2008-11-28
JP2008305583A JP5477529B2 (en) 2008-11-28 2008-11-28 lighting equipment
JP2008-305584 2008-11-28
JP2008-333680 2008-12-26
JP2008333678A JP5477533B2 (en) 2008-12-26 2008-12-26 Lamp device, socket device and lighting device
JP2008-333678 2008-12-26
JP2008333680A JP5499475B2 (en) 2008-12-26 2008-12-26 Lamp device and lighting device

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US13/233,827 Continuation US8430535B2 (en) 2008-11-28 2011-09-15 Socket device, lamp device and lighting device
US13/597,804 Continuation US8540399B2 (en) 2008-11-28 2012-08-29 Socket device
US13/597,893 Continuation US8523402B2 (en) 2008-11-28 2012-08-29 Socket device
US13/597,992 Continuation US8540396B2 (en) 2008-11-28 2012-08-29 Lighting system
US13/597,953 Continuation US8434908B2 (en) 2008-11-28 2012-08-29 Socket device

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US20120320609A1 (en) 2012-12-20
US8523402B2 (en) 2013-09-03
RU2482384C2 (en) 2013-05-20
US8430535B2 (en) 2013-04-30
CN102149962B (en) 2013-09-25
TWI410582B (en) 2013-10-01
KR20110034697A (en) 2011-04-05
US8540399B2 (en) 2013-09-24
CN102149962A (en) 2011-08-10
RU2011126378A (en) 2013-01-10
EP2336631B1 (en) 2017-10-25
US8613529B2 (en) 2013-12-24
US20120320611A1 (en) 2012-12-20
US8434908B2 (en) 2013-05-07
EP2336631A4 (en) 2014-05-07
US20120320610A1 (en) 2012-12-20
US20120002429A1 (en) 2012-01-05
US20120320565A1 (en) 2012-12-20
US8540396B2 (en) 2013-09-24
TW201030276A (en) 2010-08-16
US20110261572A1 (en) 2011-10-27
KR101220657B1 (en) 2013-01-10
EP2336631A1 (en) 2011-06-22

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