KR20140055235A

KR20140055235A - Led illumination apparatus

Info

Publication number: KR20140055235A
Application number: KR1020120121752A
Authority: KR
Inventors: 김철주; 김규석; 김경온; 양휘석; 박현규; 김동희
Original assignee: 주식회사 포스코엘이디
Priority date: 2012-10-31
Filing date: 2012-10-31
Publication date: 2014-05-09

Abstract

The present invention relates to an LED lighting device capable of improving appearance characteristics and heat radiation efficiency. An LED lighting apparatus according to the present invention includes a light emitting module including at least one light emitting diode formed on a circuit board, a heat sink coupled to a lower surface of the light emitting module, and a heat sink coupled to a lower portion of the heat sink, A first driver that is mounted in the power base and converts an external power source to a rectified power source that is supplied to the LED, and a second driver that is mounted on the circuit board and controls the LED using a rectified power source applied from the first driver. And a driving circuit composed of two driving parts. Therefore, the size and area of the driving circuit portion mounted on the light emitting module become small, so that there is a margin in the mounting space and the effect of lowering the heat generation temperature can be obtained.

Description

LED ILLUMINATION APPARATUS [0001]

The present invention relates to an LED lighting device, and more particularly, to an LED lighting device that uses a light emitting diode as a light source to realize a bulb-type illumination.

In general, fluorescent lamps and incandescent lamps are widely used as indoor lighting devices installed in ceilings or walls of homes, offices, etc. However, since they have a short life span, low illumination and low energy efficiency, The use of an LED illumination device using a light emitting diode (LED) having a high illumination and a low power consumption as a light source is being widened.

In particular, a bulb-type LED lighting device capable of replacing a compact fluorescent lamp (CFL), which is used as a bulb-type lamp without the need of a separate luminaire, is being actively developed.

Typically, the CFL replacement LED illumination device is similar in design to the incandescent lamp replacement LED illumination device, so that the shape and design is not as complete as the others. That is, a circuit substrate on which LEDs are arranged in a hemispherical heat sink is mounted, and a dome-type diffusion cover forms an outer shape.

However, the majority of conventional heat sinks have external radiating fins protruding to the outside in order to increase the heat radiation efficiency, but there is a problem that the appearance characteristics of the product are remarkably deteriorated due to the formation of external radiating fins.

Meanwhile, the LED illumination device includes a driving circuit for converting an AC power inputted from the outside into a DC power suitable for driving the LED, and driving the LEDs. However, depending on the shape of the driving circuit, The concept may change. Accordingly, attempts have been made to change the configuration of the drive circuit portion in the direction of improving the appearance characteristics of the product and the heat radiation efficiency.

Accordingly, the present invention has been made in view of such considerations, and the present invention provides an LED lighting device capable of improving appearance characteristics and heat radiation efficiency of a product.

According to an aspect of the present invention, there is provided an LED lighting apparatus including a light emitting module including at least one light emitting diode formed on a circuit board, a heat sink coupled to a lower surface of the light emitting module, A first driving unit mounted in the power source base and converting an external power source into a rectified power source supplied to the light emitting diode, and a second driving unit mounted on the circuit board, And a second driver for controlling the light emitting diode using a power supply.

The first driving unit may include a bridge circuit for rectifying the AC power applied through the power source base.

The second driving unit may include a driving IC for controlling the driving of the light emitting diode using a rectified power rectified through the first driving unit.

The power supply base may include a power connection portion electrically connected to an external lamp socket, and an insulation member formed between the power connection portion and the heat sink to insulate the power connection portion from the heat sink.

The insulating member may include a receiving portion for receiving the first driving portion, and a heat sink coupling portion formed outside the receiving portion and coupled to the heat sink. The insulating member may further include a wire passage portion protruding from an upper end of the receiving portion and extending in the direction of the light emitting module support portion of the heat sink and receiving a wire electrically connecting the first driving portion and the second driving portion .

The heat sink may include a light emitting module supporting part for supporting the LED light emitting module, an external heat dissipating part extending downward from an outer side of the light emitting module supporting part, and at least one internal heat dissipating pin protruding inward from the external heat dissipating part .

The external heat dissipating unit may be formed by separating at least two or more of the external heat dissipating units to form a first air flow path through the heat sink.

The inner heat dissipating fin may include a protrusion protruding downwardly from the lowermost end of the outer heat dissipating part and coupled with the heat sink connecting part of the insulating member.

A second air passage may be formed between the space between the inner radiating fins and the insulating member.

The heat sink coupling portion of the insulating member may include a coupling groove into which the projection of the internal radiating fin is inserted.

At least a part of the accommodating portion of the insulating member may be inserted to the inside of the external heat-radiating portion.

And the wire passage portion of the insulating member may be formed at a position that is blocked by the external heat radiating portion and the internal radiating fin.

According to such an LED lighting device, the bridge circuit included in the driving circuit is separately formed instead of being formed in the light emitting module and mounted separately inside the power supply base, so that the AC power is not directly connected to the light emitting module, It becomes possible to implement authentication and specification freely.

In addition, the size and area of the driving circuit portion mounted on the light emitting module become small, so that there is a margin in the mounting space and the effect of lowering the heat generating temperature can be obtained.

1 is a plan view showing an LED illumination device according to an embodiment of the present invention.
FIG. 2 is a longitudinal sectional view of the LED illumination device shown in FIG. 1. FIG.
Fig. 3 is a perspective view of the heat sink shown in Fig. 1 as viewed from below. Fig.
4 is a plan view of the heat sink shown in Fig.
5 is a cross-sectional view of the heat sink taken along the line I-I 'in FIG.
6 is a perspective view showing the power supply base shown in FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings, It will be possible. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprising" or "having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

FIG. 1 is a plan view showing an LED illumination device according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of the LED illumination device shown in FIG.

1 and 2, an LED illumination apparatus according to an embodiment of the present invention includes a light emitting module 200 including at least one light emitting diode 220 formed on a Hiro substrate 210, A power source base 400 coupled to a lower portion of the heat sink 100 and electrically coupled to an external lamp socket and an external power source input from the power source base 400, And a driving circuit 500 for driving the light emitting module 200 using the driving circuit 500.

The heat sink 100 fixes the light emitting module 200 and discharges the heat generated from the light emitting module 200 to the outside. The heat sink 100 is formed of a material having a high thermal conductivity to increase the heat dissipation efficiency. For example, the heat sink 100 may be formed of a metal material such as aluminum (Al) or magnesium (Mg).

FIG. 3 is a perspective view of the heat sink shown in FIG. 1, and FIG. 4 is a plan view of the heat sink shown in FIG.

1, 3, and 4, the heat sink 100 includes a light emitting module support 110 for fixing and supporting the light emitting module 200, And at least one internal radiating fin 130 protruding from the external heat radiating portion 120 and the external heat radiating portion 120 to the inside of the heat sink 100.

The outer heat dissipating part 120 is a part that substantially determines the outer shape of the heat sink 100 and is divided into at least two or more to form the first air flow path 140 passing through the center of the heat sink 100 . For example, two outer heat dissipating units 120 may be formed to face each other with the first air passage 140 therebetween. Accordingly, the outside air can flow into the heat sink 100 through the first air flow path 140 and penetrate the heat sink 100, thereby improving the heat radiation efficiency.

The inner heat dissipation fin 130 is formed to increase the heat dissipation area to improve the heat dissipation efficiency and to protrude from the inner surface of the outer heat dissipation part 120 toward the inner side of the heat sink 100. For example, a plurality of the inner heat dissipation fins 130 are formed at regular intervals along the arc direction of the outer heat dissipation part 120. The protruding length of the inner radiating fin 130 can be appropriately adjusted in consideration of the coupling structure with the power supply base 400 and the prevention of the blocking of the first air passage 140.

The inner heat dissipation fin 130 includes a protrusion 132 protruding downward from the lowermost end of the outer heat dissipation unit 120 and coupled to the power supply base 400. A second air passage 150 through which air can flow is formed between the protrusion 132 and the power source base 400 and between the space between the inner radiating fins 130 and the power source base 400. The external air introduced into the heat sink 100 through the first air passage 140 is discharged to the outside through the second air passage 150 after contacting the internal radiating fin 130 and the external heat discharging portion 120 So that the heat radiation efficiency can be improved.

The bottom surface of the light emitting module supporting part 110 is easily guided to the inner heat dissipating fin 130 and the outer heat dissipating part 120 through the first air passage 140. [ It is desirable to design it.

5 is a cross-sectional view of the heat sink taken along the line I-I 'in FIG.

Referring to FIGS. 4 and 5, the first region R1 corresponding to the space between the external heat-radiating portions 120 of the bottom surface of the light-emitting module support portion 110 of the heat sink 100 is rounded in a convex shape. That is, a region corresponding to a portion of the lower surface of the light emitting module supporting portion 110 where the first air channel 140 is formed is rounded in a convex shape.

The second region R2 between the first region R1 and the external heat radiation portion 120 is rounded in a concave shape opposite to the first region R1, .

Accordingly, the outside air introduced through the first air passage 140 is guided to the inside of the heat sink 100 by the first region R1 having a convex shape, and then the second region R2 is formed into a concave shape And is naturally discharged to the outside through the second air passage 150 after being in contact with the inner heat dissipation fin 130 and the outer heat dissipation part 120 while being slid and moved.

The first air passage 140 is formed to cross the center of the heat sink 100 and the convex portion for guiding the flow of the air toward the inner radiating fin 130 is formed on the lower surface of the light emitting module supporting portion 110, By forming the concave portion, the heat radiation efficiency of the LED illumination device can be improved. Meanwhile, the second region R2 of the light emitting module supporting portion 110 may be formed in a flat shape instead of a concave shape.

Referring again to FIGS. 1 and 2, the light emitting module 200 is coupled to the upper surface of the light emitting module support 110 of the heat sink 100. The light emitting module 200 substantially generates light and may be fixed to the upper surface of the light emitting module supporting part 110 through various methods such as screw fastening, connector fastening, and boss fastening.

The light emitting module 200 includes a circuit board 210 coupled to the light emitting module support 110 and a plurality of light emitting diodes 220 mounted on the circuit board 210 to generate light. For example, the light emitting diodes 220 are formed to be circularly arranged along the circumferential direction of the circular circuit board 210. The light emitting diodes 220 may be used in both chip or package form.

The edge portion of the light emitting module supporting portion 110 is formed to protrude to a height higher than the mounting position of the light emitting module 200. If the mounting position of the light emitting module 200 is higher than or equal to the edge portion of the light emitting module supporting portion 110 because the light emitting diode 220 included in the light emitting module 200 has a limit in the directional angle of the emitted light, There arises a problem that a dark portion is generated at the lower end of the diffusion cover 300. [ Therefore, by forming the edge portion of the light emitting module supporting portion 110 higher than the mounting position of the LED light emitting module 200, the lower end arm portion generated at the lower end portion of the diffusion cover 300 can be removed.

The diffusion cover 300 is coupled to the light emitting module support 110 to cover the light emitting module 200. The diffusion cover 300 diffuses light in the form of a point light source emitted from the plurality of light emitting diodes 220 to realize uniform illumination. The light emitting diodes 220 are not visible from the outside of the LED illumination device The entirety of the LED illumination device is formed of a highly diffusive material so as to exhibit uniform brightness.

The diffusion cover 300 may have a structure in which a light diffusion agent is added to the synthetic resin, and the light distribution characteristics can be adjusted by adjusting the shape of the diffusion cover 300 and the content of the light diffusion agent. For example, the diffusion cover 300 is formed in a tapered cylindrical shape in order to replace a conventional compact fluorescent lamp (CFL). In order to prevent the upper end portion of the diffusion cover 300, 70 mm. Further, by adjusting the content of the light diffusing agent, it is possible to realize a light distribution characteristic of a directivity angle of about 160 to 260 degrees. Meanwhile, the diffusion cover 300 may be formed in a hemispherical shape to replace an existing bulb-type incandescent lamp.

Accordingly, by combining the diffusion cover 300 having a different shape with the heat sink 100 having the same shape, the conventional bulb-type fluorescent lamp and bulb-type incandescent lamp can be simultaneously replaced. As described above, the heat sink 100 can be commonly used to implement an LED lighting device having different light distribution characteristics according to the shape of the diffusion cover 300 with one heat sink 100, Loses.

The power source base 400 is electrically connected to an external lamp socket, and is formed at a lower portion of the heat sink 100.

6 is a perspective view showing the power supply base shown in FIG.

Referring to FIGS. 2, 4 and 6, the power supply base 400 is coupled to the heat sink 100 such that at least a portion of the first air passage 140 formed in the heat sink 100 is exposed. The power supply base 400 is electrically connected to an external lamp socket and may be formed in various types and shapes, such as an Edison type that is threadedly coupled or a Bipost type in which two pins are protruded have.

The power supply base 400 includes a power connection portion 410 electrically connected to the external lamp socket and an insulation member 420 formed between the power connection portion 410 and the heat sink 100 and electrically insulated from each other ). For example, the insulating member 420 may be formed of a ceramic material having electrical insulation and excellent heat dissipation performance.

The driving circuit 500 supplies a driving power (for example, a direct current power) suitable for driving the light emitting diodes 220 to an external power source (for example, 220 V or 110 V AC power) So as to control the driving of the light emitting diodes 220.

The driving circuit 500 is divided into a first driving part 510 mounted inside the power supply base 400 and a second driving part 520 mounted on the circuit board 210 of the light emitting module 200 Respectively. The first driving unit 510 converts the external power supplied through the power supply base 400 into a rectified power for driving the light emitting diode 220. For example, the first driving unit 510 includes a bridge circuit for rectifying the AC power applied through the power supply base 400. The second driving unit 520 controls the driving of the light emitting diode 220 using the rectified power supplied from the first driving unit 510. For example, the second driving unit 520 includes a driving IC that controls the driving of the light emitting diode 220 using the rectified power rectified through the first driving unit 510.

The insulating member 420 of the power supply base 400 includes a receiving part 421 for receiving the first driving part 510 and a heat sink coupling part 430 formed on the outer side of the receiving part 421 and coupled to the heat sink 100. [ (422). The insulating member 420 protrudes from the upper end of the housing part 421 and extends in the direction of the light emitting module supporting part 110 of the heat sink 100 so that the first driving part 510 and the second driving part 520 are electrically And an electric wire passage portion 423 for receiving the electric wire 530 connected to the electric wire 530.

The housing part 421 of the insulating member 420 is formed into a hollow cylindrical shape and at least a part thereof is inserted to the inside of the external heat radiation part 120. At this time, it is preferable that the accommodating portion 421 is inserted at a suitable height so that at least a part of the first air passage 140 formed in the heat sink 100 is exposed.

The heat sink coupling portion 422 of the insulation member 420 may be formed to surround the insertion portion 421 and may include an engagement groove 424 into which the protrusion 132 of the internal heat dissipation fin 130 is inserted. A second air passage 150 is formed between the heat sink 100 and the insulating member 400 through the coupling between the protrusion 132 and the coupling groove 424. The second air passage 150 is formed through the first air passage 140, The outside air that has flowed into the inside of the first air passage 100 passes through the second air passage 150 again to improve the heat radiation efficiency.

The insulating member 420 is formed so that the wire passage portion 423 is electrically connected to the first driving portion 510 housed in the housing portion 421 and the second driving portion 520 mounted on the circuit board 210 530) can pass. At this time, the electric wire passage part 423 is formed at a position covered by the external heat radiation part 120 and the internal heat radiation fin 130, so that the electric wire 530 can be prevented from being seen from the outside.

The insulating member 420 may further include a light emitting module coupling portion 425 protruding from the upper end of the receiving portion 421 and extending in the direction of the light emitting module supporting portion 110 as the electric wire passage portion 423 . The light emitting module joining portion 425 is for screw coupling of the light emitting module 200. For example, two light emitting module joining portions 425 may be spaced apart from each other, and one of the two may be integrally formed with the wire connecting portion 423. [ have. 4, the light emitting module supporting portion 110 of the heat sink 100 is provided with the first through hole 112 corresponding to the electric wire passage portion 423 and the light emitting module connecting portion 425 corresponding to the light emitting module connecting portion 425 A second through hole 114 may be formed.

The bridge circuit 510 included in the driving circuit 500 may be separately formed instead of being formed in the light emitting module 200 and separately mounted in the power supply base 400 so that the AC power is directly supplied to the light emitting module 200 Since rectified DC power can be connected instead of being connected, it is possible to realize the implementation free from certification or standard. Also, the size and area of the portion of the driving circuit 500 mounted on the light emitting module 200 become small, so that there is a margin in the mounting space and an effect of lowering the heat generation temperature can be obtained.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: heat sink 110: light emitting module supporting part
120: external heat radiating part 130: internal radiating fin
140: first air passage 150: second air passage
200: light emitting module 210: circuit board
220: light emitting diode 300: diffusion cover
400: power base 410: power connection
420: Insulation member 421:
422: heat sink connecting portion 423:
500: driving circuit 510: first driving part
520:

Claims

A light emitting module including at least one light emitting diode formed on a circuit board;
A heat sink coupled to a bottom surface of the light emitting module;
A power supply base coupled to a lower portion of the heat sink and electrically coupled to an external lamp socket; And
A first driving unit mounted in the power source base and converting an external power source into a rectified power source supplied to the light emitting diode, and a second driving unit mounted on the circuit board and controlling the light emitting diode using the rectified power source applied from the first driving unit And a driving circuit including a first driving unit and a second driving unit.

The method according to claim 1,
Wherein the first driver includes a bridge circuit for rectifying the AC power applied through the power supply base.

3. The method of claim 2,
Wherein the second driver includes a driving IC for controlling the driving of the light emitting diode using a rectified power rectified through the first driving unit.

The power supply apparatus according to claim 1, wherein the power supply base
A power connection portion electrically connected to an external lamp socket; And
And an insulation member formed between the power connection unit and the heat sink to insulate the power connection unit from the heat sink.

5. The connector according to claim 4, wherein the insulating member
A receiving part for receiving the first driving part; And
And a heat sink coupling portion formed on the outer side of the storage portion and coupled to the heat sink.

6. The method of claim 5,
The insulating member further includes a wire passage portion protruding from the upper end of the receiving portion and extending in the direction of the light emitting module support portion of the heat sink and receiving a wire electrically connecting the first driving portion and the second driving portion .

The heat sink according to claim 6, wherein the heat sink
A light emitting module supporter supporting the light emitting module;
An external heat radiating part extending downward from an outer side of the light emitting module supporting part; And
And at least one internal radiating fin protruding inward from the external radiating portion.

8. The method of claim 7,
Wherein the external heat dissipating unit is divided into at least two or more of the plurality of external heat dissipating units to form a first air flow path through the heat sink.

8. The method of claim 7,
Wherein the inner heat dissipating fin includes a protrusion protruding downwardly from a lower end of the outer heat dissipating unit and coupled to the heat sink connecting unit of the insulating member.

10. The method of claim 9,
And a second air flow path is formed between the space between the internal radiating fins and the insulating member.

10. The method of claim 9,
Wherein the heat sink connecting portion of the insulating member includes an engaging groove into which the protrusion of the internal radiating fin is inserted.

9. The method of claim 8,
Wherein at least a part of the accommodating portion of the insulating member is inserted to the inside of the external heat-radiating portion.

12. The method of claim 11,
Wherein the electric wire passage portion of the insulating member is formed at a position that is blocked by the external heat-radiating portion and the internal heat-radiating fin.