TWI286721B - Heat-dissipating apparatus for a back light module of a liquid crystal display - Google Patents

Heat-dissipating apparatus for a back light module of a liquid crystal display Download PDF

Info

Publication number
TWI286721B
TWI286721B TW095128911A TW95128911A TWI286721B TW I286721 B TWI286721 B TW I286721B TW 095128911 A TW095128911 A TW 095128911A TW 95128911 A TW95128911 A TW 95128911A TW I286721 B TWI286721 B TW I286721B
Authority
TW
Taiwan
Prior art keywords
heat
backlight
circuit board
panel display
substrate
Prior art date
Application number
TW095128911A
Other languages
Chinese (zh)
Other versions
TW200809713A (en
Inventor
Alex Horng
Te-Chen Liu
Original Assignee
Sunonwealth Electr Mach Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunonwealth Electr Mach Ind Co filed Critical Sunonwealth Electr Mach Ind Co
Priority to TW095128911A priority Critical patent/TWI286721B/en
Priority to JP2007011265A priority patent/JP2008041638A/en
Priority to GB0701544A priority patent/GB2440748A/en
Priority to DE102007006594A priority patent/DE102007006594A1/en
Priority to FR0753815A priority patent/FR2904749A1/en
Application granted granted Critical
Publication of TWI286721B publication Critical patent/TWI286721B/en
Publication of TW200809713A publication Critical patent/TW200809713A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A heat-dissipating apparatus for a back light module of a liquid crystal display comprises at least one back light unit, at least one printed circuit board and at least one heat-dissipating board. The back light unit and the printed circuit board are combined to form a back light set. The back light unit provides a light emitting device and a heat-dissipating portion attached to an end thereof so as to absorb heat generated from the light emitting device. The printed circuit board is mounted on a rear surface of the heat-dissipating board, and the heat-dissipating portion of the back light unit is also attached to the rear surface of the heat-dissipating board through an assembling hole of the printed circuit board such that the heat-dissipating board dissipates the heat generated from the back light set.

Description

1286721 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種平面顯示器之背光源散熱裝置， 特別是關於在一電路板開設至少一組裝孔，且至少一背光 單元之一導熱部係經由該組裝孔直接貼接於一散熱基板之 背面’以提升散熱效率之平面顯示器之背光源散熱裝置。 【先前技術】 習用平面顯示器之背光源散熱裝置，請參照第i圖 所示，其包含數個背光單元6、一電路板7、一支撐框架 J及一散熱基板9。該背光單元6設置於該電路板7之一 侧，且與該電路板7電性連接，以便藉由該電路板7控制 該背光單元ό提供一背光源。該背光單元6具有一基座61 、一發光元件62及至少二極片63。該基座61係設有一 容置空間〔未標示〕，以便容置定位該發光元件62及極 片63。該發光元件62係選自一發光二極體〔led〕，以 提供足夠之光源。該極片63係由一導電金屬材質製成， 該極片63係穿設於該基座61之側面，且該極片63與該 發光元件62電性連接。 請再參照第1圖所示，該電路板7係選自一軟性印 刷電路板，該背光單元6利用該極片63電性連接於該電 路板7之一側。該支撐框架8設有一容置空間80，以供 容置該背光單元6及電路板7。該散熱基板9係由鋁或銅 等高導熱能力之金屬材質製成，其結合於該支撐框架8之 一侧，以便該電路板7經由該容置空間80與該散熱基板 —5 — C:\Limta\lt Pnt\PKI0134.doc 06/08/07/01:37 P« 1286721 9相互貼接。 當該背光單元6之發光元件62產生一背光源供一平 面顯示器〔未繪示，flat panel display〕形成影像時，該發 光元件62產生之熱能經由熱傳導方式傳遞至該電路板7 ，接著再由該散熱基板9之金屬材質間接吸收該電路板7 上之熱能。由於該高導熱能力之散熱基板9之一側設有數 個鰭片構造〔未標示〕，進而增加該散熱基板9與空氣之 熱交換面積，以便快速將所吸收之熱能釋放至大氣中，進 一步達到快速冷卻降溫之功效。 一般而言，上述習用平面顯示器之背光源散熱裝置The invention relates to a backlight heat sink device for a flat panel display, in particular to at least one assembly hole in a circuit board, and at least one heat conducting portion of the backlight unit is via The assembly hole is directly attached to the back surface of a heat dissipation substrate to improve the heat dissipation efficiency of the backlight of the flat panel display. [Prior Art] A backlight heat sink of a conventional flat panel display, as shown in Fig. i, includes a plurality of backlight units 6, a circuit board 7, a support frame J, and a heat dissipation substrate 9. The backlight unit 6 is disposed on one side of the circuit board 7 and electrically connected to the circuit board 7 to control the backlight unit to provide a backlight by the circuit board 7. The backlight unit 6 has a base 61 , a light emitting element 62 and at least a diode piece 63 . The pedestal 61 is provided with an accommodating space (not shown) for accommodating the illuminating element 62 and the pole piece 63. The illuminating element 62 is selected from a light emitting diode to provide a sufficient light source. The pole piece 63 is made of a conductive metal material. The pole piece 63 is disposed on the side of the base 61, and the pole piece 63 is electrically connected to the light emitting element 62. Referring to Fig. 1, the circuit board 7 is selected from a flexible printed circuit board, and the backlight unit 6 is electrically connected to one side of the circuit board 7 by the pole piece 63. The support frame 8 is provided with an accommodating space 80 for accommodating the backlight unit 6 and the circuit board 7. The heat-dissipating substrate 9 is made of a metal material having a high thermal conductivity such as aluminum or copper, and is coupled to one side of the support frame 8 so that the circuit board 7 and the heat-dissipating substrate are connected via the accommodating space 80: \Limta\lt Pnt\PKI0134.doc 06/08/07/01:37 P« 1286721 9 are attached to each other. When the light-emitting element 62 of the backlight unit 6 generates a backlight for a flat panel display (the flat panel display) to form an image, the heat generated by the light-emitting element 62 is transferred to the circuit board 7 via thermal conduction, and then The metal material of the heat dissipation substrate 9 indirectly absorbs the thermal energy on the circuit board 7. Since one side of the heat-dissipating substrate 9 having the high thermal conductivity is provided with a plurality of fin structures (not shown), the heat exchange area between the heat-dissipating substrate 9 and the air is increased, so that the absorbed heat energy is quickly released into the atmosphere, further achieving The effect of rapid cooling and cooling. In general, the backlight heat sink of the above conventional flat panel display

散熱基板9進行一熱交換動作，而必須間接透過該電路板 7將該背光單元6產生之減傳導魏散熱基板9進行散 熱，以致大幅降低該背光單元6之散熱效率。再者，該電 路板7大部分係選自-雛印刷f路板，其構造之材質必 d 3有導熱旎力較低之材質〔例如··玻璃纖維等〕，導致 降低該電路板7之導熱效率，進而造成該f光單元6之散 熱效率低^。基於上述原因，其確實有必要進—步改良上 述習用平面顯示器之背光源散熱裴置。 夕電路板開設至少一組裝孔， 之一導熱部經由該組裝孔直接貼 面，以提升散熱效率。再者，該 小^於此’本發明改良上述之缺點，其储由在至 且分別將至少一背光單元 設於至少一散熱基板之背 一基座的底部具有一預定高度差， w亥導熱部相對該背光單元之 差’該預定高度差不小於於 一 6 —The heat dissipation substrate 9 performs a heat exchange operation, and the heat dissipation substrate 9 generated by the backlight unit 6 must be indirectly radiated through the circuit board 7, so that the heat dissipation efficiency of the backlight unit 6 is greatly reduced. Furthermore, the majority of the circuit board 7 is selected from the group of printed boards, and the material of the structure is required to have a material having a low thermal conductivity (for example, glass fiber, etc.), resulting in a reduction of the circuit board 7. The heat conduction efficiency, in turn, causes the heat dissipation efficiency of the f-light unit 6 to be low. For the above reasons, it is indeed necessary to further improve the backlight heat sink of the conventional flat panel display. The circuit board has at least one assembly hole, and a heat conducting portion is directly attached through the assembly hole to improve heat dissipation efficiency. Furthermore, the present invention improves the above-mentioned disadvantages, and the storage has a predetermined height difference from the bottom of the back substrate of the at least one backlight unit disposed on at least one of the heat dissipation substrates, respectively. The difference between the portion and the backlight unit 'the predetermined height difference is not less than a 6 -

M/0«/07/01:37 W 1286721 … 該組裝孔之厚度，以便該導熱部經由該組裝孔緊密的貼設 於該散熱基板之背面，進一步增進組裝可靠度。藉此，本 發明確實能有效提升背光源散熱效率，進而延長平面顯示 器之使用壽命。 ^ 【發明内容】 本發明之主要目的係提供一種平面顯示器之背光源 散熱裝置，其係藉由在至少一電路板開設至少一組裝孔， 且分別將至少一背光單元之一導熱部經由該組裝孔直接貼 • 設於至少一散熱基板之背面，使得本發明具有提升背光源 散熱效率之功效。 I々 本發明之次要目的係提供一種平面顯示器之背光源 散熱裝置，其中至少一背光單元之一導熱部相對該背光單 元之一基座的底部具有一預定高度差，以便該背光單元之, 導熱部得以經由該組裝孔緊密的貼設於該散熱基板之背面 ，使彳于本發明具有提升背光源散熱效率及組裝可靠度之功 效。 籲 根據本發明之平面顯示器之背光源散熱裝置，其包 3至少一背光單元、至少一電路板及至少一散熱基板。該背 光單元及電路板共同構成一背光源模組。該背光單元設有一 發光元件及一導熱部，該導熱部係設置於該發光元件之一 端，以吸收該發光元件產生之熱能。該電路板設置於該散 熱基板之背面，且該發光單元之導熱部係通過該電路板之 ^ 至少一組裝孔直接貼設於談散熱基板之背面，以便該散熱 基板直接吸收及驅散該背光源模組產生之熱能。 —7 — C:\Linda\K Pttt\PKI0|34. doc 0β/08/07/0|：37 Ρ« 1286721 【實施方式】 為讓本發明之上述及其他目的、特徵及優點能更明 顯易懂’下文特舉本發明之較佳實施例，並配合所附圖式 ，作詳細說明如下：M/0 «/07/01: 37 W 1286721 ... The thickness of the assembly hole is such that the heat conducting portion is closely attached to the back surface of the heat dissipation substrate via the assembly hole, thereby further improving assembly reliability. Therefore, the present invention can effectively improve the heat dissipation efficiency of the backlight, thereby prolonging the service life of the flat display. The main purpose of the present invention is to provide a backlight heat sink device for a flat panel display, which is characterized in that at least one assembly hole is opened in at least one circuit board, and one heat conduction portion of at least one backlight unit is respectively assembled through the assembly. The hole is directly attached to the back surface of at least one heat dissipation substrate, so that the invention has the effect of improving the heat dissipation efficiency of the backlight. A secondary object of the present invention is to provide a backlight heat sink of a flat display, wherein a heat conducting portion of at least one of the backlight units has a predetermined height difference from a bottom of a base of the backlight unit, so that the backlight unit The heat conducting portion is closely attached to the back surface of the heat dissipating substrate via the assembly hole, so that the invention has the effects of improving the heat dissipation efficiency and assembly reliability of the backlight. According to the backlight heat sink of the flat panel display of the present invention, the package includes at least one backlight unit, at least one circuit board and at least one heat dissipation substrate. The backlight unit and the circuit board together form a backlight module. The backlight unit is provided with a light-emitting element and a heat-conducting portion disposed at one end of the light-emitting element to absorb thermal energy generated by the light-emitting element. The heat dissipation portion of the light-emitting unit is directly attached to the back surface of the heat-dissipating substrate through at least one assembly hole of the circuit board, so that the heat-dissipating substrate directly absorbs and disperses the backlight. The heat generated by the module. —7 — C:\Linda\K Pttt\PKI0|34. doc 0β/08/07/0|:37 Ρ« 1286721 [Embodiment] The above and other objects, features and advantages of the present invention are made more apparent. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings.

請參照第2及4圖所示，本發明第一實施例之平面 顯示器之背光源散熱裝置較佳係用以結合於一平面顯示器 a〔 flat panel display，FPD〕之背面，該平面顯示器a較 佳可選自液晶顯示器〔liquid crystal display，LCD〕或電 漿顯示器〔plasma display panel，PDP〕等，以便提供背 光之光線，同時進行散熱動作。 請參照第2及3圖所示，本發明第一實施例之平面 顯示器之背光源散熱裝置其係包含至少一背光源模組工、 一支撐框架2及至少一散熱基板3，該背光源模組丨與該 支撑框架2係緊密貼設於該散熱基板3之背面，以便對該 平面顯示器a進行散熱動作。該背光源模組丨具有至少一 背光單元11及-電路板12，該f光單元u係與該電路 板12電性連接，藉由該電路板12控制該背光單元u之 發光動作，以提供一背光源。該電路板12較佳選自一軟 性印刷電路板，但亦可選自—硬性印刷電路板。該電路板 12開設至少-組裝孔⑵’以供該背光單元u透過該組 裝孔121與該散熱基板3相貼接。 =參照第2及3圖所示，本發明第—實施例之支 擇框架2具有至少—容置空間2()，且該 侧可用以結合該散熱基板3，及其另―側可用^Μ平 —8 一 C:\Linda\PK Pat\PII0i3Cdoc 1286721 3不$ a。更詳言之，該支撐购2較佳係選擇由一高 了、性金屬或合金所製成，例純、銅、金、銀或其合金 該#仁亦可選擇由非金屬材料製成，例如塑膠或泡棉等。 2置工間2G係對應該背光賴組1之雜開設形成在 二擇框架2上，該容置空間2〇用以組裝容置該背光源 m ’以便該背光源模組1不致凸出至該支撐框架2外 0 埶π再參照帛2及3圖所示，本發明第一實施例之散 了基板3係由—高導熱性金屬或合金所製成，例如銘、銅 為，：掉金銀或其合金等。該散熱基板3之正面設有數個散熱 及數個散熱鰭片32。該散熱鰭片係相對於該 散熱基板3之縱向凸設排列於該散熱基板3之正面，且各 相4該散熱鰭片32之間係形成該散熱槽道31，該散熱 :道31、亦相對於該散熱基板3之縱向排列形成。藉由該 、槽道31及政熱鰭片32增加該散熱基板3與空氣之熱 交換面積，以驅散該散熱基板3所吸收之熱能。 、…咕再參照第2及3圖所示，本發明第一實施例之背 光疋件11各設有一基座lu、一發光元件112、至少二導 ，件113及-導熱部114。該基座ln之中心位置具有〆 容置空間〔未標示〕，其可供容設定位該發光元件112及 該導熱部114。該發光元件112較佳選自一發光二極體〔 LEf〕’特別是-白光發光二極體。該導接件113係由一 :、同導電忐力之金屬材質製成，例如銅、銀或其合金等， 該導接件113係穿設於該基座lu之側面，其一端與位於 C:\Linda\PK P«mi0l34. docReferring to Figures 2 and 4, the backlight heat sink of the flat panel display of the first embodiment of the present invention is preferably coupled to the back surface of a flat panel display (FPD). Canon can be selected from a liquid crystal display (LCD) or a plasma display panel (PDP) to provide backlight light while performing heat dissipation. Referring to FIGS. 2 and 3, the backlight heat sink of the flat panel display according to the first embodiment of the present invention includes at least one backlight module, a support frame 2, and at least one heat sink substrate 3. The backlight module The set frame 2 and the support frame 2 are closely attached to the back surface of the heat dissipation substrate 3 to perform heat dissipation operation on the flat display display a. The backlight module 丨 has at least one backlight unit 11 and a circuit board 12 , and the f-light unit u is electrically connected to the circuit board 12 , and the light-emitting action of the backlight unit u is controlled by the circuit board 12 to provide A backlight. The circuit board 12 is preferably selected from a flexible printed circuit board, but may alternatively be selected from the group consisting of rigid printed circuit boards. The circuit board 12 defines at least an assembly hole (2) for the backlight unit u to adhere to the heat dissipation substrate 3 through the assembly hole 121. Referring to Figures 2 and 3, the support frame 2 of the first embodiment of the present invention has at least an accommodation space 2(), and the side can be used to bond the heat dissipation substrate 3, and the other side can be used.平—8 A C:\Linda\PK Pat\PII0i3Cdoc 1286721 3 Not $ a. More specifically, the support 2 is preferably made of a high, metallic or alloy, such as pure copper, gold, silver or alloys thereof. The # kernel may also be made of a non-metallic material. For example, plastic or foam. 2 The 2G system of the working room is formed on the second frame 2, and the accommodating space 2 组装 is used for assembling and accommodating the backlight m′ so that the backlight module 1 does not protrude to The support frame 2 is 0 埶π and then 帛 2 and 3, the scattered substrate 3 of the first embodiment of the present invention is made of a high thermal conductivity metal or alloy, such as Ming, copper, and the like. Gold and silver or its alloys. The heat dissipation substrate 3 has a plurality of heat dissipation surfaces and a plurality of heat dissipation fins 32 on the front surface thereof. The heat dissipating fins are arranged on the front surface of the heat dissipating substrate 3 with respect to the longitudinal direction of the heat dissipating substrate 3, and the heat dissipating fins 31 are formed between the heat dissipating fins 32 of the respective phases 4, and the heat dissipating channel 31 is also The longitudinal arrangement is formed with respect to the heat dissipation substrate 3. The heat exchange area between the heat dissipation substrate 3 and the air is increased by the channel 31 and the political fins 32 to dissipate the heat energy absorbed by the heat dissipation substrate 3. Referring to Figures 2 and 3, the backlight unit 11 of the first embodiment of the present invention is provided with a base lu, a light-emitting element 112, at least two guides, a member 113 and a heat-conducting portion 114. The center of the pedestal ln has a 容 accommodating space (not shown) for accommodating the illuminating element 112 and the heat conducting portion 114. The light-emitting element 112 is preferably selected from a light-emitting diode [LEf]', particularly a white light-emitting diode. The guiding member 113 is made of a metal material of a conductive force, such as copper, silver or an alloy thereof. The guiding member 113 is disposed on the side of the base lu, and one end thereof is located at C. :\Linda\PK P«mi0l34. doc

0β/0«/Ο7/ΟΙ:37 W —9 — I2S6721 該基座111内之發光元件112電性連接，而該導接件113 之另一端用以電性連接該電路板12。該導熱部114係, 自一具咼導熱月b力之金屬或合金材質製成，例如銘、銅、 金、銀或其合金等。該導熱部114選擇設置於該基座ηι 之底部’且其一端與該發光元件112相接觸。另外，該導 熱部114之另一端相對該基座ln之底部凸出且裸露於外 部，該導熱部114與該基座in之底部形成一預定高度差 〔未標示〕，該預定高度差不小於該電路板12之組裝孔 121之厚度，且該組裝孔121之直徑係大於該導熱部H4 之直徑，以便該導熱部114恰可透過該組裝孔121貼接於 該散熱基板3之背面。 二二》‘請再參照第2至4圖所示，當使用本發明第一實施 例之平面顯示器之背光源散熱裝置時，將該支撐框架2之 一侧結合於該平面顯示器a之背面。該背光單元u之發 光元件112發射一背光源供該平面顯示器a形成影像，同 時該發光元件112亦產生廢熱。由於該背光單元η之導 熱部114對應穿過該電路板12之組裝孔121直接貼設於 該散熱基板3之背面，以致該背光單元u之導熱部114 藉由熱傳導方式吸收該廢熱之熱能，且經由該導熱部114 本身之高導熱能力，直接將熱能傳導至該散熱基板3。藉 此，本發明確實可有效提升該背光源模組1之散熱效率。 再者，請參照本案第5及6圖所示，本發明第一實 轭例係另設有數個散熱風扇b,由於該散熱槽道31及散 熱鰭片32係相對該散熱基板3形成縱向排列，因此有利 C:\Linda\ft ΡΜΜΤΕΙΟ丨％ joe —10 — 0β/0β/07/0!:37 Μ 1286721 於藉由熱空氣上升之對流原理產生熱對流，以增進散熱效 率。藉此，該散熱風扇b較佳係選擇設置於該散熱基板3 之下方，且該散熱風扇b之出風口〔未標示〕亦相對該散 熱槽道31之通道方向設置，以便藉由該扇熱風扇b加速 該散熱槽道31内之空氣對流，進而提昇該散熱基板3之 散熱效率。 請參照第7至8圖所示，其揭示本發明第二實施例 多平面顯示器之背光源散熱裝置。相較於第一實施例，第 三實施例之電路板12係進一步選擇直接成型於該散熱基 板3之背面，且該電路板12預留至少一組裝孔121，該 散熱基板3之背面經由該電路板12之組裝孔121而可供 該背光單元11之導熱部114直接貼設，藉此有效提昇該 背光源模組1之散熱效率。 另外，當本發明第一實施例或第二實施例之背光單 元11經由該組裝孔121貼設於該散熱基板3之背面時， 該該背光單元11之導熱部114的結合侧可預設一焊料層 〔未、、、日示〕’透過一表面黏著技術〔Surface M〇unt Technology，SMT〕製程加熱熔融該焊料層，藉此將該背 光單元11穩m的結合於該散熱基板3之背面，以提升該 背光源模組1與該散熱基板3間之結合可靠度。另外，該 焊料層之材f較佳係選自—具高導熱能力之焊料〔例如Γ 錫膏等〕’進而增_背光源模組1與該散熱基板3間之 熱傳導效率。 如上所述才目較於第i圖之習用平面顯示器之背光 C:\Limk\PK Pftt\PK1013idoc °6/Οβ/〇7/〇|：37 η 〜11 — 12867210β/0«/Ο7/ΟΙ: 37 W — 9 — I2S6721 The light-emitting element 112 in the susceptor 111 is electrically connected, and the other end of the conductive member 113 is electrically connected to the circuit board 12. The heat conducting portion 114 is made of a metal or alloy material of a heat transfer month b force, such as ingot, copper, gold, silver or alloys thereof. The heat conducting portion 114 is selectively disposed at the bottom portion of the susceptor ηι and one end thereof is in contact with the light emitting element 112. In addition, the other end of the heat conducting portion 114 protrudes from the bottom of the base ln and is exposed to the outside, and the heat conducting portion 114 forms a predetermined height difference (not labeled) with the bottom of the base in, and the predetermined height difference is not less than The thickness of the assembly hole 121 of the circuit board 12 is greater than the diameter of the heat conducting portion H4 so that the heat conducting portion 114 can be attached to the back surface of the heat dissipation substrate 3 through the assembly hole 121. [22] ‘Please refer to FIGS. 2 to 4 again. When the backlight heat sink of the flat panel display of the first embodiment of the present invention is used, one side of the support frame 2 is bonded to the back surface of the flat display a. The light-emitting element 112 of the backlight unit u emits a backlight for the planar display a to form an image, and the light-emitting element 112 also generates waste heat. The heat conducting portion 114 of the backlight unit η is directly attached to the back surface of the heat dissipating substrate 3 through the assembly hole 121 of the circuit board 12, so that the heat conducting portion 114 of the backlight unit u absorbs the heat energy of the waste heat by heat conduction. And the thermal energy is directly transmitted to the heat dissipation substrate 3 via the high thermal conductivity of the heat conduction portion 114 itself. Therefore, the present invention can effectively improve the heat dissipation efficiency of the backlight module 1. In addition, as shown in the fifth and sixth figures of the present invention, the first embodiment of the present invention is further provided with a plurality of heat dissipation fans b, wherein the heat dissipation channels 31 and the heat dissipation fins 32 are longitudinally arranged with respect to the heat dissipation substrate 3. Therefore, it is advantageous to C:\Linda\ft ΡΜΜΤΕΙΟ丨% joe —10 — 0β/0β/07/0!:37 Μ 1286721 to generate heat convection by the convection principle of hot air rising to improve heat dissipation efficiency. Therefore, the heat dissipation fan b is preferably disposed below the heat dissipation substrate 3, and the air outlet (not shown) of the heat dissipation fan b is also disposed in the channel direction of the heat dissipation channel 31 so as to be heated by the fan. The fan b accelerates the convection of the air in the heat dissipation channel 31, thereby improving the heat dissipation efficiency of the heat dissipation substrate 3. Referring to Figures 7 to 8, there is disclosed a backlight heat sink of a multi-plane display according to a second embodiment of the present invention. Compared with the first embodiment, the circuit board 12 of the third embodiment is further selected to be directly formed on the back surface of the heat dissipation substrate 3, and the circuit board 12 reserves at least one assembly hole 121 through which the back surface of the heat dissipation substrate 3 passes. The assembly hole 121 of the circuit board 12 can be directly attached to the heat conducting portion 114 of the backlight unit 11, thereby effectively improving the heat dissipation efficiency of the backlight module 1. In addition, when the backlight unit 11 of the first embodiment or the second embodiment of the present invention is attached to the back surface of the heat dissipation substrate 3 via the assembly hole 121, the bonding side of the heat conduction portion 114 of the backlight unit 11 can be preset. The solder layer is heated and melted by a Surface M〇unt Technology (SMT) process, thereby bonding the backlight unit 11 to the back surface of the heat dissipation substrate 3 The bonding reliability between the backlight module 1 and the heat dissipation substrate 3 is improved. Further, the material f of the solder layer is preferably selected from a solder having a high thermal conductivity (e.g., solder paste or the like) to further increase the heat transfer efficiency between the backlight module 1 and the heat dissipation substrate 3. As described above, it is the backlight of the conventional flat panel display of the first picture C:\Limk\PK Pftt\PK1013idoc °6/Οβ/〇7/〇|:37 η 〜11 — 1286721

源散熱裝置必賴接豸過一電路板7#-背光單元6所產 生之熱能傳導至—散熱基板9進行熱交換動作，以致大幅 降低該發光單元6之散熱效率等缺點，第2圖之本發明藉 由在該電路板12開設該組裝孔121，且分別將該背光^ 兀11之導熱部114係經由該組裝孔121直接貼接於該散 熱基板3之背面，以提升該發光單元u之散熱效率。再 者，該導熱部114相對該背光單元u之基座ln的底部 具有一預定高度差，該預定高度差不小於於該組裝孔ΐ2ι 之厚度，以便該導熱部114經由該組裝孔121緊密的貼接 缝該散熱基板3之背面，增進崎可靠度。藉此，本發明 讀實能有效提升背絲散熱料，進而延長平面顯示器之 使用壽命。 雖然本發明已利用上述較佳實施例揭示，然其並非 用以限定本發明’任何熟習此技藝者，在不脫離本發明之 精神和範圍之内，當可作各種更動與修改，因此本發明之 保護範圍當視後附之t請專·圍所界定者為準。 C:\Linda\PK Pftt\PX10I34.docThe source heat sink device must be connected to the thermal energy generated by the circuit board 7#-backlight unit 6 to the heat-dissipating substrate 9 for heat exchange operation, so as to greatly reduce the heat dissipation efficiency of the light-emitting unit 6, and the like. In the invention, the assembly hole 121 is opened in the circuit board 12, and the heat transfer portion 114 of the backlight 11 is directly attached to the back surface of the heat dissipation substrate 3 via the assembly hole 121 to enhance the light-emitting unit u. Cooling efficiency. Furthermore, the heat conducting portion 114 has a predetermined height difference from the bottom of the base ln of the backlight unit u, and the predetermined height difference is not less than the thickness of the assembly hole ΐ2ι, so that the heat conducting portion 114 is tight via the assembly hole 121. The back surface of the heat dissipation substrate 3 is spliced to improve the reliability of the substrate. Thereby, the reading of the invention can effectively improve the heat dissipation material of the back wire, thereby prolonging the service life of the flat display. The present invention has been disclosed in the above-described preferred embodiments, and it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection shall be subject to the definition of t. C:\Linda\PK Pftt\PX10I34.doc

06/08/07/01:37 PN 〜12 — 1286721 【圖式簡單說明】 第1圖：習用平面顯示器之背光源散熱裝置之分解立 體圖。 第 2圖 第 3圖 .第 4圖 第 5圖 .扉第 6圖 第 7圖 第 8圖06/08/07/01:37 PN ~12 — 1286721 [Simple description of the diagram] Figure 1: Decomposition of the backlight unit of the conventional flat panel display. Fig. 2 Fig. 3 Fig. 4 Fig. 5 Fig. 扉 Fig. 6 Fig. 7 Fig. 8

••本發明第一實施例之平面顯示器之背光源散 熱裝置之分解立體及放大圖。 :本發明第一實施例之平面顯示器之背光源散 熱裝置之組合剖視圖。 :本發明第一實施例之平面顯示器之背光源散 熱裝置之分解立體圖。 ••本發明第一實施例之平面顯示器之背光源散 熱裝置及散熱風扇之分解立體圖。 ••本發明第一實施例之平面顯示器之背光源散 熱裝置及散熱風扇之組合剖視及示意圖。 :本發明第二實施例之平面顯示器之背光源散 熱裝置之分解立體圖。 :本發明第二實施例之平面顯示器之背光源散 熱裝置之組合剖視圖。 【主要元件符號說明】 1 背光源模組 111基座 113導接件 12 電路板 2 支撐框架 11背光單元 112發光元件 114導熱部 121組裝孔 20 容置空間• An exploded perspective view and an enlarged view of a backlight heat sink of the flat panel display of the first embodiment of the present invention. A cross-sectional view of a combination of a backlight heat sink of a flat panel display according to a first embodiment of the present invention. An exploded perspective view of a backlight heat sink of a flat panel display according to a first embodiment of the present invention. • An exploded perspective view of a backlight heat sink and a heat sink fan for a flat panel display according to a first embodiment of the present invention. • A combined cross-sectional view and schematic view of a backlight heat sink and a heat sink of the flat panel display according to the first embodiment of the present invention. An exploded perspective view of a backlight heat sink of a flat panel display according to a second embodiment of the present invention. A cross-sectional view of a combination of a backlight heat sink of a flat panel display according to a second embodiment of the present invention. [Main component symbol description] 1 Backlight module 111 Base 113 Guide member 12 Circuit board 2 Support frame 11 Backlight unit 112 Light-emitting element 114 Heat-conducting part 121 Assembly hole 20 accommodating space

—13 — 06/08/07/01:37 PM 1286721 3 散熱基板 31 32 散熱鰭片 6 61 基座 62 63 極片 7 8 支撐框架 80 9 散熱基板 a b 散熱風扇 散熱槽道 背光單元 發光元件 電路板 容置空間 平面顯示器 CAUndaVPC Pat\PCIOI34. doc—13 — 06/08/07/01:37 PM 1286721 3 Heat Dissipation Board 31 32 Heat Sink 6 61 Base 62 63 Pole 7 8 Support Frame 80 9 Heat Dissipation Board ab Cooling Fan Cooling Channel Backlight Unit Light-emitting Component Board Included space flat panel display CAUndaVPC Pat\PCIOI34. doc

Claims (1)

1286721 十、申請專利範圍： ’ 1、一種平面顯示器之背光源散熱裝置，其包含： 至少一背光單元，其設有一發光元件及一導熱部，該 導熱部用以吸收該發光元件產生之熱能； 一電路板，其設有至少一組裝孔，且該電路板與該背 光單元電性連接，以構成一背光源模組； 至少一散熱基板’其中該電路板設置於該散熱基板之 馨月面’且該發光皁元之導熱部係通過該電路板之組穿 孔直接貼設於該散熱基板之背面，以便該散熱基板吸 收及驅散該背光源模組產生之熱能。 2、 依申請專利範圍第1項所述之平面顯示器之背光源散 歸置，其中該背光單元另設有—基座，其用以容置 定位該發光元件及導熱部。 3、 依申請專利範圍第丨項所述之平面顯示器之背光源散 熱裝置，其中該背光單元另設有至少二導接件，該導 • 接件一端與該發光元件電性連接，其另一端與該電路 板電性連接，以便藉由該電路板控制該發光元件提供 一背光源。 ’、 4、 依申請專利範圍第2項所述之平面顯示器之背光源散 ”、、裝置其中該導熱部之一端相對該基座之底部凸出 • 路於外部，且該導熱部與該基座之底部形成一預 • 疋同度差，該預定高度差不小於該電路板之組裝孔的 厚度。 巾θ專利範圍第1項所述之平面顯示器之背光源散 C:\Linda\K Pkt\PKIOI34.tk)c 06/08/07/01:37 PM —15 — 1286721 • -· 熱裝置，其中該組裝孔之直徑大於該導熱部之直徑， ， 則更該導熱部恰可透過該組裝孔貼言史於該散熱基板之 背面。 6依申明專利範圍第i項所述之平面顯示器之背光源散 齡置另包含-讀框架，其對應該背統模組之形 狀開汉有至少一容置空間，以便組裝容置該背光源模 組。 7依申°月專利範圍第1項所述之平面顯示器之背光源散 熱裝置’其巾該f路板係直接成型於概熱基板之背 面。 8、 依申料鄕圍第1項所述之平面顯示器之背光源散 齡置，財該導熱部與該賴基板之結合侧係設有 一焊料層。 9、 依申料截圍第8項所述之平面顯示器之背光源散 熱裝置，其中該焊料層係選自一錫膏。 φ 1〇、依申請專利範圍第1項所述之平面顯示器之背光源散 熱裝置，其中該散熱基板之正面設有數個散熱鰭片及 數個散熱槽道，該散熱鰭片及散熱槽道相對該散熱基 板之縱向形成延伸，該散熱槽道用以導引空氣由下而 上縱向流動，以驅散該散熱鰭片表面之熱能。 .U、依申㈣利範圍第1項所述之平面顯示ϋ之背光源散 熱裝置，其中該電路板選自一軟性印刷電路板及一硬 ， 性印刷電路板之一。 12依申巧專利範圍第！項所述之平面顯示器之背光源散 C:\Linda\K Pat\PICIOI34. doc 0«/0β/07/01：37 Ρ« —16 — 1286721 熱裝置，其中該發光元件選自一發光二極體〔LED〕 應 〇 ’ 13、依申請專利範圍第6項所述之平面顯示器之背光源散 熱裝置，其中另設有數個散熱風扇，該散熱風扇設置 於該散熱基板之下方，以提昇該散熱基板之散熱效率 〇 14、依申請專利範圍第1項所述之平面顯示器之背光源散 熱裝置，其中該導熱部係設置於該發光元件之一端。 • 15、依申請專利範圍第1項所述之平面顯示器之背光源散 熱裝置，其中該導熱部之材質係選自銘、銅、金及銀 — 01286721 X. Patent application scope: '1. A backlight heat sink device for a flat panel display, comprising: at least one backlight unit, comprising a light emitting component and a heat conducting portion, wherein the heat conducting portion is configured to absorb heat energy generated by the light emitting component; a circuit board having at least one assembly hole, and the circuit board is electrically connected to the backlight unit to form a backlight module; at least one heat dissipation substrate, wherein the circuit board is disposed on the smog surface of the heat dissipation substrate And the heat conducting portion of the luminescent soap element is directly attached to the back surface of the heat dissipating substrate through the set of perforations of the circuit board, so that the heat dissipating substrate absorbs and dissipates the heat energy generated by the backlight module. 2. The backlight of the flat panel display according to claim 1 is disposed, wherein the backlight unit is further provided with a base for accommodating the light emitting component and the heat conducting portion. 3. The backlight heat sink of the flat panel display according to the invention of claim 2, wherein the backlight unit is further provided with at least two guiding members, one end of the guiding member is electrically connected to the light emitting element, and the other end thereof is The circuit board is electrically connected to provide a backlight by controlling the light emitting component by the circuit board. '4. The backlight of the flat panel display according to claim 2, wherein the one end of the heat conducting portion protrudes from the bottom of the base, and the heat conducting portion and the base The bottom of the seat forms a pre-difference degree difference, which is not less than the thickness of the assembly hole of the circuit board. The backlight of the flat-panel display described in the first paragraph of the patent scope is C:\Linda\K Pkt \PKIOI34.tk)c 06/08/07/01:37 PM —15 — 1286721 • -· The thermal device, wherein the diameter of the assembly hole is larger than the diameter of the heat conducting portion, the heat conducting portion is just through the assembly The hole is affixed to the back side of the heat-dissipating substrate. 6 The backlight of the flat-panel display according to the scope of claim ii of the patent scope includes a read-read frame, which has at least one shape corresponding to the shape of the back-end module. Storing a space for assembling and accommodating the backlight module. 7 The backlight heat sink of the flat panel display according to claim 1 of the patent scope of the invention is directly formed on the back surface of the heat-generating substrate. 8. According to the application mentioned in item 1 The backlight of the surface display is disposed on the side of the substrate, and a solder layer is disposed on the side of the heat conducting portion and the substrate. 9. The backlight heat sink of the flat panel display according to Item 8 of the application, wherein the solder The layer is selected from a solder paste. φ 1〇, the backlight heat sink of the flat panel display according to claim 1, wherein the front surface of the heat dissipation substrate is provided with a plurality of heat dissipation fins and a plurality of heat dissipation channels, The heat dissipating fins and the heat dissipating channels are formed to extend in a longitudinal direction of the heat dissipating substrate, and the heat dissipating channels are used for guiding the air to flow vertically from bottom to top to dissipate heat energy of the surface of the heat dissipating fins. U, Essence (4) The flat panel display device of claim 1 is characterized in that the circuit board is selected from the group consisting of a flexible printed circuit board and a hard printed circuit board. The backlight of the display is C:\Linda\K Pat\PICIOI34. doc 0«/0β/07/01:37 Ρ« —16 — 1286721 The thermal device, wherein the illuminating element is selected from a light-emitting diode (LED) 〇' 13, according to the application The backlight heat sink of the flat panel display according to the sixth aspect of the invention, wherein a plurality of heat dissipating fans are disposed under the heat dissipating substrate to improve the heat dissipating efficiency of the heat dissipating substrate. The backlight heat sink of the flat panel display according to the first aspect of the invention, wherein the heat conducting portion is disposed at one end of the light emitting element. The material of the heat transfer part is selected from Ming, copper, gold and silver - 0 C:\Linda\PK Pat\PKlOI34.doc ——17—— 06/08/07/01:37 PMC:\Linda\PK Pat\PKlOI34.doc ——17—— 06/08/07/01:37 PM
TW095128911A 2006-08-07 2006-08-07 Heat-dissipating apparatus for a back light module of a liquid crystal display TWI286721B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW095128911A TWI286721B (en) 2006-08-07 2006-08-07 Heat-dissipating apparatus for a back light module of a liquid crystal display
JP2007011265A JP2008041638A (en) 2006-08-07 2007-01-22 Heat dissipation device for backlight light source for flat panel display
GB0701544A GB2440748A (en) 2006-08-07 2007-01-26 Heat-dissipating device for a back light source in a flat panel display
DE102007006594A DE102007006594A1 (en) 2006-08-07 2007-02-09 Heat dissipation device for background light source for flat screens
FR0753815A FR2904749A1 (en) 2006-08-07 2007-03-14 THERMAL DISSIPATION DEVICE FOR BACKLIGHT SOURCE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095128911A TWI286721B (en) 2006-08-07 2006-08-07 Heat-dissipating apparatus for a back light module of a liquid crystal display

Publications (2)

Publication Number Publication Date
TWI286721B true TWI286721B (en) 2007-09-11
TW200809713A TW200809713A (en) 2008-02-16

Family

ID=37872861

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128911A TWI286721B (en) 2006-08-07 2006-08-07 Heat-dissipating apparatus for a back light module of a liquid crystal display

Country Status (5)

Country Link
JP (1) JP2008041638A (en)
DE (1) DE102007006594A1 (en)
FR (1) FR2904749A1 (en)
GB (1) GB2440748A (en)
TW (1) TWI286721B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5266879B2 (en) * 2008-05-28 2013-08-21 岩崎電気株式会社 Surface lighting device
TWI385343B (en) * 2008-07-24 2013-02-11 Advanced Optoelectronic Tech Light source and passive thermal heat dissipation apparatus thereof
KR100910917B1 (en) 2009-01-21 2009-08-05 주식회사 지앤에이치 Heat sink device of light emitting diode module for lighting equipment
JP2011146225A (en) * 2010-01-14 2011-07-28 Sharp Corp Light source device and backlight device equipped therewith
KR101079151B1 (en) 2011-08-18 2011-11-02 이슬기 Led light-module for lighting system
EP2584245A1 (en) * 2011-10-17 2013-04-24 Luminova GmbH LED module with a sheet metal heat sink
CN102661533A (en) * 2012-04-11 2012-09-12 深圳市华星光电技术有限公司 Backlight module and LCD (liquid crystal display) device
CN108337857B (en) * 2018-02-01 2020-04-07 深圳创维－Rgb电子有限公司 Television receiver

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001043594A (en) * 1999-07-30 2001-02-16 Matsushita Electric Ind Co Ltd Cassette carrier device
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
US6966674B2 (en) * 2004-02-17 2005-11-22 Au Optronics Corp. Backlight module and heat dissipation structure thereof
TWI255377B (en) * 2004-11-05 2006-05-21 Au Optronics Corp Backlight module
TWI262342B (en) * 2005-02-18 2006-09-21 Au Optronics Corp Device for fastening lighting unit in backlight module
TWI307799B (en) * 2005-05-25 2009-03-21 Coretronic Corp Backlight module
TWI256454B (en) * 2005-06-03 2006-06-11 Au Optronics Corp Light module

Also Published As

Publication number Publication date
TW200809713A (en) 2008-02-16
GB2440748A (en) 2008-02-13
DE102007006594A1 (en) 2008-02-21
GB0701544D0 (en) 2007-03-07
JP2008041638A (en) 2008-02-21
FR2904749A1 (en) 2008-02-08

Similar Documents

Publication Publication Date Title
TWI286721B (en) Heat-dissipating apparatus for a back light module of a liquid crystal display
TWI302590B (en) Heat-dissipating module for a back light set of a liquid crystal display
US20080068807A1 (en) Heat-dissipating device for back light source for flat panel display
US8100567B2 (en) Light-emitting devices and related systems
TWI322915B (en) Heat dissipation structure of backliht module
TWI722195B (en) Electronic device and heat radiation structure of electronic device
TWI301047B (en) Light-emitting heat-dissipating device and manufacturing method thereof
JP4819389B2 (en) Backlight unit and liquid crystal display device
JP4777469B1 (en) Illumination device and image display device including the same
JP2004235657A (en) Heat radiating device
TWI431365B (en) Backlight module having light-emitting diode
TWI285078B (en) A structure for dissipating heat used in the flat panel display
JP2011091384A (en) Heat dissipation device with heat pipeheat pipe heat radiator
JP2007017497A (en) Backlight unit and liquid crystal display device
CN101140057A (en) Back light source of planar display heat radiating device
TWI258332B (en) A heat sink apparatus utilizing the heat sink shroud to dissipate heat
TWM435618U (en) Light-emitting module and display apparatus
JP4842390B1 (en) Illumination device and image display device including the same
TW201226791A (en) Heat sinking sheet metal member and applications of the same
JP2009010050A (en) Light source device
JP4717603B2 (en) Display-integrated electronic device
WO2011077692A1 (en) Planar light-source device, display device, and method for manufacturing a planar light-source device
JP4849987B2 (en) heatsink
TW201106510A (en) Light emitting module
JP6167311B2 (en) Display device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees