WO2017095181A1

WO2017095181A1 - Led lighting device

Info

Publication number: WO2017095181A1
Application number: PCT/KR2016/014097
Authority: WO
Inventors: 방연호; 박승곤; 빈진혁
Original assignee: 주식회사 아모센스
Priority date: 2015-12-02
Filing date: 2016-12-02
Publication date: 2017-06-08
Also published as: KR101765857B1; CN108291692B; CN108291692A; KR20170065011A

Abstract

Disclosed is an LED lighting device wherein the heat sink is made of a composite material, and an area, which corresponds to the LED module, is formed using a material having a higher thermal conductivity than that of the composite material such that, compared with a heat sink made of aluminum, the same is less expensive and lighter, and secures an equal or better heat-radiating performance. The disclosed LED lighting device comprises: an LED module having a plurality of LED elements mounted on one surface thereof; a heat sink coupled to the other surface of the LED module; and an auxiliary heat-radiating substrate, which is inserted into the heat sink, and one end of which contacts the other surface of the LED module, wherein the auxiliary heat-radiating substrate has a higher thermal conductivity than that of the heat sink.

Description

LED lighting device

The present invention relates to an LED lighting device, and more particularly to an LED lighting device (LED LIGHTING DEVICE) having a heat sink that emits heat generated when driving the LED module for illumination.

An LED lighting apparatus is a lighting apparatus which uses LED as a light source. The LED lighting device greatly varies overall light efficiency and product life by managing heat generated from a light source.

Referring to FIG. 1, a conventional LED lighting apparatus includes an LED module and a heat sink.

The LED module is a substrate on which a plurality of LED elements 12 are mounted. In this case, the substrate may be composed of a printed circuit board or a flexible printed circuit board.

The heat sink contacts the LED module to radiate heat generated by the LED module to the outside. The heat sink is formed of aluminum (Al) and manufactured by die casting or extrusion.

However, since the conventional heat sink is formed of relatively expensive aluminum, the manufacturing cost increases and the weight is heavy.

In order to solve such a conventional problem, an LED lighting device in which a heat sink made of a composite material is combined with an LED module has been developed. In this case, the heat sink is made of a composite material in which a thermally conductive filler such as metal, ceramic, carbon, and the like are mixed.

Heat sinks made of composite materials can achieve the thermal conductivity required for general electronics (eg, about 1 to 30 W / mK), but it is difficult to replace aluminum having a thermal conductivity of about 230 W / mK. have.

In the LED lighting device, a heat transfer adhesive is interposed between a heat sink and a substrate for transferring heat generated from the LED module to the heat sink. At this time, the heat transfer adhesive is a thermal tape, thermal grease, etc. are mainly used, there is a problem that it is difficult to implement a constant heat dissipation performance due to the difference in heat dissipation effect according to the thermal conductivity, thickness and adhesive technology.

The present invention has been proposed to solve the above-described problems, the heat sink is made of a composite material, but the area corresponding to the LED module is formed of another material having a higher thermal conductivity than the composite material, compared to the aluminum heat sink It is an object of the present invention to provide an LED lighting device that is inexpensive, light and secures equal or more heat dissipation performance.

In addition, an object of the present invention is to provide an LED lighting device that is manufactured by the insert molding method of inserting the substrate mounted with the LED module into the heat sink to implement a constant heat dissipation performance without using a heat transfer adhesive.

In order to achieve the above object, the LED lighting apparatus according to an embodiment of the present invention is an LED module mounted with a plurality of LED elements on one surface, the insert molded in the heat sink and heat sink coupled to the other surface of the LED module, one end of the LED An auxiliary heat dissipation substrate in contact with the other side of the module, wherein the auxiliary heat dissipation substrate has a higher thermal conductivity than the heat sink.

The heat sink may be a composite material in which at least one of a graphite filler and a carbon nanotube filler is mixed with a polymer material.

The auxiliary heat dissipation substrate may be any one of aluminum, copper, silver, and nickel, or may be a mixed material in which two or more of aluminum, copper, silver, and nickel are mixed.

The auxiliary heat dissipation substrate may be in contact with the other surface opposite to the region where the LED element is formed.

The auxiliary heat dissipation substrate may be formed in a column shape divided into upper, lower, and central portions, and a length of at least one of the upper and lower portions in a horizontal direction may be greater than that of the central portion. In this case, the auxiliary heat dissipation substrate may have irregularities formed on at least one outer circumference of the upper and lower portions.

The auxiliary heat dissipation substrate may be formed in a plate shape, and one surface thereof may be exposed to the surface of the heat sink. In this case, the auxiliary heat dissipation substrate may have at least one of at least one bend and a groove on an outer circumference thereof.

The LED lighting apparatus according to the embodiment of the present invention may further include an auxiliary heat dissipation extension substrate which is insert molded into the heat sink and one end of which is disposed on the other side of the auxiliary heat dissipation substrate. In this case, at least a portion of the auxiliary heat dissipation extension substrate may be exposed to the outside of the protrusion of the heat sink.

In order to achieve the above object, the LED lighting apparatus according to another embodiment of the present invention includes an LED module having a plurality of LED elements mounted on one surface and a heat sink coupled to the other surface of the LED module, wherein the LED module is connected to the heat sink. It is insert molded and has a higher thermal conductivity than the heat sink.

The LED module may include a base substrate that is a metal substrate including at least one of aluminum and copper.

The LED lighting apparatus according to another embodiment of the present invention may be formed of a metal material having a higher thermal conductivity than that of the heat sink and insert molded into the heat sink, and may further include an auxiliary heat dissipation substrate having one end contacting the other surface of the LED module.

The auxiliary heat dissipation substrate may be one of aluminum, copper, silver, and nickel, or may be a mixed material in which two or more of aluminum, copper, silver, and nickel are mixed.

A part of the other end of the auxiliary heat dissipation substrate may be exposed to the outside of the protrusion of the heat sink.

According to the present invention, the LED lighting apparatus is made of a composite material heat sink, but by forming a region corresponding to the LED module of a different material having a higher thermal conductivity than the composite material, it is inexpensive compared to the heat sink formed of aluminum material as a whole While light, there is an effect that can ensure a high heat dissipation performance than the heat sink formed of a composite material.

In addition, the LED lighting device can secure the heat dissipation performance required by the electronic components in general, it is possible to prevent the light efficiency degradation due to deterioration, and to extend the life of the lighting product.

In addition, the LED lighting device has an effect that can efficiently transfer the heat generated from the substrate to the heat sink without the use of a heat transfer adhesive.

In addition, the LED lighting apparatus inserts an auxiliary heat dissipation substrate having a higher thermal conductivity than that of the heat sink into the heat sink, thereby ensuring a higher heat capacity than the heat sink of the composite material and improving heat transfer efficiency.

In addition, the LED lighting device has the effect of reducing the manufacturing cost, raw material cost by simplifying the manufacturing process.

1 is a view for explaining a conventional LED lighting device.

2 is a view for explaining the LED lighting apparatus according to the first embodiment of the present invention.

3 is a view for explaining the heat sink of FIG.

4 and 5 are diagrams for explaining an example of the auxiliary heat dissipation substrate of FIG.

6 is a view for explaining the LED lighting apparatus according to the first embodiment of the present invention.

7 to 9 are views for explaining another example of the auxiliary heat dissipation substrate of FIG. 2.

10 and 11 are views for explaining still another example of the auxiliary heat dissipation substrate of FIG.

12 to 14 are views for explaining the LED lighting apparatus according to a second embodiment of the present invention.

Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the technical idea of the present invention. . First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

2, the LED lighting apparatus according to the first embodiment of the present invention includes an LED module 110, a heat sink 130, an auxiliary heat dissipation substrate 150, a gasket 170, and a reflective member 190. It is configured by.

The LED module 110 includes a plurality of LED elements 114 mounted on the base substrate 112. In this case, the base substrate 112 is an example of a printed circuit board or a flexible printed circuit board on which a circuit pattern is formed.

The heat sink 130 is a heat dissipation member for dissipating heat generated by the LED module 110 and is coupled to one surface of the LED module 110. Referring to FIG. 3, the heat sink 130 includes a main body 131 and a protrusion 132.

The main body 131 is formed in a plate shape of a composite material and is coupled to one surface of the LED module 110. In this case, the main body 131 may have a first insertion groove 133 into which the LED module 110 is inserted. The main body 131 is spaced apart from the first insertion groove 133 by a predetermined interval, and is wound around the outer circumference of the first insertion groove 133 to be coupled to the second insertion groove 134, one surface into which the gasket 170 is inserted. A plurality of fastening holes 135 for fixing the gasket 170 and the reflective member 190 may be formed.

The protrusion 132 is formed on the other surface of the main body 131. The protrusion 132 may be formed in a pin shape to maximize the air contact area, or may be formed in a plate shape vertically coupled to the main body 131. In this case, the shape of the protrusion 132 may be changed due to various factors such as heat dissipation performance and space.

Here, the main body 131 and the protrusion 132 may be formed of the same composite material. That is, the main body 131 and the protrusion 132 are formed of a composite material in which a filler such as metal, ceramic, carbon, or the like is mixed with a polymer.

In this case, the composite material is an example of mixing a graphite filler or a carbon nanotube filler with a polymer. Here, graphite is a material in which a metal nano fusion is mixed with graphite. Fillers (ie, graphite, carbon nanotubes) may be mixed at about 10% or more and 70% or less.

In general, since graphite material has a low specific gravity, when mixed with a polymer (eg, a plastic resin), graphite uniformity occurs due to a decrease in graphite uniformity, resulting in uneven heat dissipation characteristics of the heat sink 130. .

Thus, by using the plasma method and the dopamine application method when forming the composite material, it is possible to uniformly form the heat dissipation characteristics of the heat sink 130 by improving the mixing uniformity of the graphite.

Referring to FIG. 4, the auxiliary heat dissipation substrate 150 is inserted and mounted inside the heat sink 130 through an insert molding process. That is, the auxiliary heat dissipation substrate 150 is insert molded and inserted into the main body 131 of the heat sink 130. One end of the auxiliary heat dissipation substrate 150 may be exposed to the surface of the main body 131 of the heat sink 130 (that is, the bottom surface of the first insertion groove 133) to directly contact the LED module 110. At this time, the auxiliary heat dissipation substrate 150 is in contact with a portion of the other surface of the LED module 110 opposite to the region where the LED element 114 is formed.

The auxiliary heat dissipation substrate 150 is formed of a metal material having a higher thermal conductivity than the heat sink 130. At this time, the auxiliary heat dissipation substrate 150 is one of copper (Cu), aluminum (Al), silver (Ag) and nickel (Ni), or an example that is formed of a mixed material of two or more mixed.

The auxiliary heat dissipation substrate 150 is inserted and mounted in the heat sink 130 through an insert molding process. In this case, one end of the auxiliary heat dissipation substrate 150 may be exposed to the surface of the main body 131 of the heat sink 130 (that is, the bottom surface of the first insertion groove 133) to be in direct contact with the LED module 110. .

The auxiliary heat dissipation substrate 150 is formed in a dumbbell shape in which a recess is formed in the center to increase the bonding force with the heat sink 130. At this time, the auxiliary heat dissipation substrate 150 may have a bend formed on the outer circumference thereof and a slit may be formed therein to widen the bonding force and the contact area with the heat sink 130.

For example, referring to FIG. 5, the auxiliary heat dissipation substrate 150 is formed in a pillar shape divided into an upper portion 151, a lower portion 152, and a central portion 153. In this case, the upper portion 151, the lower portion 152 and the central portion 153 may be integrally formed, or may be combined after being manufactured separately.

The width (diameter) of the upper part 151 and the lower part 152 of the auxiliary heat dissipation base material 150 is formed to be larger than the width (diameter) of the central part 153, so that the groove is formed on the outer circumference of the central part 153. do. Here, irregularities such as a sawtooth shape may be formed on the outer circumferences of the upper part 151 and the lower part 152 of the auxiliary heat dissipation base material 150.

The auxiliary heat dissipation substrate 150 may have a slit 154 (or a hole) passing through at least one of the upper portion 151, the lower portion 152, and the central portion 153 to increase the bonding force with the heat sink 130.

The auxiliary heat dissipation substrate 150 has at least one surface of the upper portion 151 and the lower portion 152 exposed to the surface of the body portion 131 of the heat sink 130 (that is, the bottom surface of the first insertion groove 133). To be in direct contact with the LED module 110.

As a result, the heat sink 130 forms an auxiliary heat dissipation substrate 150 to which the LED module 110 is in direct contact, thereby increasing the thermal diffusion area to lower the temperature of the LED elements 114.

A heat sink 130 formed entirely of aluminum (Al), a heat sink 130 formed entirely of a composite material (eg, graphite), and a heat sink formed of a composite material and molded with an auxiliary heat dissipation substrate 150. Heat dissipation characteristics and weight of 130 were measured, and the results are shown in FIG. 6.

Referring to FIG. 6, the heat sink 130 applied to the LED lighting apparatus according to the embodiment of the present invention is about 81 grams lighter in weight than the heat sink 130 made of aluminum alone, and is formed of only a composite material. Compared to the sink 130, heat dissipation characteristics are improved by about 5 ° C. That is, the heat sink 130 applied to the LED lighting apparatus according to the embodiment of the present invention has the effect of reducing the weight and heat dissipation characteristics.

As another example, referring to FIGS. 7 and 8, the auxiliary heat dissipation substrate 150 may be formed in a plate shape having a predetermined area. That is, the auxiliary heat dissipation substrate 150 is formed in a plate shape in order to increase the area in contact with the heat sink 130 to secure heat capacity. At this time, the auxiliary heat dissipation substrate 150 is inserted and mounted inside the heat sink 130 through an insert molding process.

The auxiliary heat dissipation substrate 150 is inserted and mounted in the main body 131 through an insert molding process. In this case, referring to FIG. 9, the auxiliary heat dissipation substrate 150 may be formed with a plurality of bent portions 155 and coupling holes 156 to increase coupling force with the heat sink 130 during insert molding. One surface of the auxiliary heat dissipation substrate 150 is exposed to the surface of the main body 131 of the heat sink 130 (that is, the bottom surface of the first insertion groove 133) and is in direct contact with the LED module 110.

10 and 11, the LED lighting apparatus may further include a plurality of auxiliary heat dissipation extension substrates 160 having a dumbbell shape in order to increase the bonding force and the contact area of the auxiliary heat dissipation substrate 150 and the heat sink 130. Can be.

The auxiliary heat dissipation extension substrate 160 may be integrally formed with the auxiliary heat dissipation substrate 150 through a die casing process, or may be coupled to the auxiliary heat dissipation substrate 150 through a riveting process.

The auxiliary heat dissipation extension substrate 160 is insert molded into the heat sink 130, and one end of the auxiliary heat dissipation extension substrate 160 is disposed on the bottom surface of the auxiliary heat dissipation substrate 150 to contact the other surface of the auxiliary heat dissipation substrate 150. In this case, the other end portion of the auxiliary heat dissipation extension substrate 160 may be exposed to the outside through the protrusion 132 of the heat sink 130.

One end of the auxiliary heat dissipation extension substrate 160 is inserted into the main body 131 of the heat sink 130, and the other end thereof is inserted into the protrusion 132 of the heat sink 130. At this time, one end of the auxiliary heat dissipation base material 150 is exposed to the surface of the main body 131 (that is, the bottom surface of the first insertion groove 133) to be in direct contact with the LED module 110. A portion of the other end of the 160 may be exposed to the outside of the protrusion 132 of the heat sink 130.

As a result, the heat sink 130 increases the area in which the auxiliary heat dissipation substrate 150 and the LED module 110 are coupled to each other, thereby increasing the thermal diffusion area to lower the temperature of the LED element 114.

The gasket 170 has a coupling protrusion formed on one surface thereof, and the coupling protrusion is inserted into the second insertion groove 134 of the main body 131. In this case, the gasket 170 blocks water from flowing into the LED module 110 mounted on the heat sink 130.

The reflective member 190 is coupled to the upper portion 151 of the gasket 170 to reflect the light generated from the LED module 110 to the outside.

The gasket 170 and the reflective member 190 are coupled to the heat sink 130 through a coupling member (not shown). At this time, the coupling member is a nut and bolt as an example, one end of the bolt is the heat sink 130 (that is, the fastening hole 135 formed in the body portion 131), the gasket 170 and the reflective member 190 After passing through, it is fastened with the nut.

12, the LED lighting apparatus according to the second embodiment of the present invention includes the LED module 210, the heat sink 230, the gasket 250, and the reflective member 270. Here, since the gasket 250 and the reflective member 270 are the same as the gasket 170 and the reflective member 190 of the first embodiment described above, a detailed description thereof will be omitted.

The LED module 210 includes a plurality of LED elements 214 mounted on the base substrate 212. At this time, the LED module 210 is composed of a printed circuit board made of a metal material with a circuit pattern. In the LED module 210, a plurality of LED elements 214 are mounted on the base substrate 212 through an SMT process.

The base substrate 212 is formed of a metal material having a higher thermal conductivity than the heat sink 230. At this time, the base substrate 212 is an example of a metal substrate containing at least one of aluminum (Al), copper (Cu). Here, the base substrate 212 may be laminated with various material substrates in addition to the metal substrate, and a circuit pattern (not shown) made of metal is formed on one surface on which the LED element 214 is mounted.

The heat sink 230 serves to dissipate heat generated by the LED module 210. The heat sink 230 is formed by inserting the LED module 210 is integrally formed with the LED module 210.

The heat sink 230 includes a main body 231 and a protrusion 232.

The main body 231 is formed in a plate shape of a composite material. The main body 231 is integrally formed by insert molding the LED module 210 on one surface thereof. At this time, the body portion 231 may be formed through the plurality of fastening holes 233 for fixing the insertion groove, the gasket 250 and the reflective member 270 into which the gasket 250 is inserted.

The body portion 231 has a plurality of protrusions 232 formed on the other surface thereof. In this case, the protrusion 232 may be formed in a pin shape to maximize the air contact area, or may be formed in a plate shape vertically coupled with the main body 231. Here, the shape of the protrusion 232 may be changed due to various factors such as heat dissipation performance and space.

Here, the main body 231 and the protrusion 232 may be formed of the same material. That is, the main body 231 and the protrusion 232 are formed of a composite material in which a filler such as metal, ceramic, carbon, or the like is mixed with a polymer. In this case, the composite material is an example of mixing a graphite filler or a carbon nanotube filler with a polymer. Here, graphite is a material in which a metal nano fusion is mixed with graphite, and the heat sink 230 may have a filler (that is, graphite and carbon nanotubes) of about 10% or more and 70% or less.

In general, since graphite material has a low specific gravity, when mixed with a polymer (eg, a plastic resin), graphite uniformity occurs due to a decrease in graphite uniformity, resulting in uneven heat dissipation characteristics of the heat sink 230. .

Thus, by using the plasma method and the dopamine application method when forming the composite material, it is possible to uniformly form the heat dissipation characteristics of the heat sink 230 by improving the mixing uniformity of the graphite.

13 and 14, the LED lighting apparatus may further include an auxiliary heat dissipation substrate 290 inserted into the heat sink 230.

The auxiliary heat dissipation substrate 290 is inserted and mounted inside the body 231 through an insert molding process. In this case, the auxiliary heat dissipation substrate 290 is formed of a metal material having a higher thermal conductivity than that of the heat sink 230. At this time, the auxiliary heat dissipation substrate 290 is one of copper (Cu), aluminum (Al), silver (Ag) and nickel (Ni), or an example that is formed of a mixed material of two or more mixed.

One end of the auxiliary heat dissipation substrate 290 may be exposed to the outside of the main body 231 of the heat sink 230 to be in direct contact with the LED module 210. In this case, the other end of the auxiliary heat dissipation substrate 290 may be exposed to the outside of the protrusion 232 of the heat sink 230.

To this end, the auxiliary heat dissipation substrate 290 is formed in a pillar shape divided into an upper portion, a lower portion, and a central portion. At this time, it may be formed integrally with the upper, lower and central portions, or may be combined after being manufactured separately.

Widths (diameters) of the upper and lower portions of the auxiliary heat dissipation base material 290 are formed in a dumbbell shape having grooves formed on the outer periphery of the central part as the width (diameter) of the auxiliary heat dissipation base material 290 is greater than that of the central part. Here, irregularities such as a sawtooth shape may be formed on outer peripheries of the upper and lower portions of the auxiliary heat dissipation substrate 290.

As a result, the heat sink 230 increases the area where the auxiliary heat dissipation substrate 290 and the LED module 210 are coupled to each other, thereby increasing the thermal diffusion area, thereby lowering the temperature of the LED element 214.

Although a preferred embodiment according to the present invention has been described above, it is possible to modify in various forms, and those skilled in the art to various modifications and modifications without departing from the claims of the present invention It is understood that it may be practiced.

Claims

An LED module having a plurality of LED elements mounted on one surface thereof;

A heat sink coupled to the other surface of the LED module; And

An auxiliary heat dissipation substrate inserted into the heat sink and having one end contacting the other surface of the LED module;

And the auxiliary heat dissipation substrate has a higher thermal conductivity than the heat sink.
The method of claim 1,

The heat sink is an LED lighting device of a composite material in which a filler and at least one of a graphite filler and a carbon nanotube filler is mixed with a polymer material.
The method of claim 1,

The auxiliary heat dissipation substrate is any one of aluminum, copper, silver and nickel, or an LED lighting device is a mixed material of two or more of aluminum, copper, silver and nickel.
The method of claim 1,

And the auxiliary heat dissipation base material is in contact with the other surface of the LED substrate, wherein the auxiliary heat dissipation substrate is opposed to a region where the LED element is formed.
The method of claim 1,

The auxiliary heat dissipation substrate is formed in a column shape divided into an upper portion, a lower portion, and a central portion, wherein the length of at least one of the horizontal direction in the at least one of the upper and lower portion is formed LED lighting device.
The method of claim 5,

The auxiliary heat dissipation substrate is an LED lighting device formed with irregularities on the outer circumference of at least one of the upper and lower.
The method of claim 1,

The auxiliary heat dissipation base material is formed in a plate shape, the LED lighting device exposed on one surface of the surface of the heat sink.
The method of claim 7, wherein

The auxiliary heat dissipation substrate is LED lighting device formed with at least one bend on the outer circumference.
The method of claim 7, wherein

The auxiliary heat dissipation substrate is an LED lighting device having at least one groove formed therein.
The method of claim 7, wherein

And an auxiliary heat dissipation extension substrate inserted into the heat sink and having one end disposed on the other surface of the auxiliary heat dissipation substrate.
The method of claim 10,

The auxiliary heat dissipation extension substrate at least partially exposed to the outside of the projection of the heat sink.
An LED module having a plurality of LED elements mounted on one surface thereof; And

A heat sink coupled to the other surface of the LED module,

And the LED module is insert molded into the heat sink and has a higher thermal conductivity than the heat sink.
The method of claim 12,

And the LED module includes a base substrate which is a metal substrate including at least one of aluminum and copper.
The method of claim 12,

And an auxiliary heat dissipation substrate formed of a metal material having a higher thermal conductivity than the heat sink and being molded in the heat sink, and having one end contacting the other surface of the LED module.
The method of claim 14,

The auxiliary heat dissipation substrate is one of aluminum, copper, silver and nickel, or an LED lighting device is a mixed material of two or more of aluminum, copper, silver and nickel.
The method of claim 14,

The auxiliary heat dissipation substrate is the LED lighting device, the other end portion is exposed to the outside of the projection of the heat sink.
The method of claim 14,

The auxiliary heat dissipation substrate is formed in a column shape divided into an upper portion, a lower portion, and a central portion, wherein the length of at least one of the horizontal direction in the at least one of the upper portion and the lower portion is formed LED lighting device.
The method of claim 17,

The auxiliary heat dissipation substrate of the LED lighting device is formed with irregularities on the outer periphery of at least one of the upper and lower.