WO2021100888A1 - Heat dissipation module comprising heat dissipation layer comprising light-sintered metal-nano composite, and lighting device comprising same - Google Patents

Abstract

The present application provides a heat dissipation module comprising a heat dissipation film having high thermal conductivity, and a lighting device comprising same. The present application provides a heat dissipation module comprising: a heat source; a heat dissipation layer for dissipating heat from the heat source; and a heat sink provided on the heat dissipation layer, wherein the heat dissipation layer comprises a light-sintered metal-nanocarbon composite, the amount of nanocarbon contained in the composite is less than 3 wt% with respect to the total weight of the metal, and the thermal conductivity of the heat dissipation layer is 15-30 W/mK.

Description

A heat dissipation module including a photo-sintered metal-nano composite heat dissipation layer and a lighting device including the same

The present application relates to a heat dissipation module including a photo-sintered metal-nano composite heat dissipation layer, and a lighting device including the same, and in detail, excellent high thermal conductivity is implemented by including the photo-sintered metal-nano composite heat dissipation layer. Provides heat dissipation modules and lighting devices.

In recent years, electronic devices used in automobiles and electric/electronic fields are pursuing weight reduction, thinness, miniaturization, and multifunctionalization. As such electronic devices become highly integrated, more heat is generated.This radiated heat not only degrades the function of the device, but also causes malfunction of peripheral devices and substrate deterioration.Therefore, there is much interest and research on technology that controls radiated heat. Is being done.

In particular, recently, lighting devices have been pursuing lighter, thinner, smaller, and multifunctional. In particular, special LED lighting devices that implement various functions by generating a specific level of light spectrum using a high-power light source are attracting attention.

These special LED lighting devices generate a lot of heat from a high-power light source, and this radiated heat causes wavelength shifts of the wavelengths emitted from the light source to deteriorate the function of the special lighting device, as well as malfunction of peripheral LED devices and substrate deterioration. As it is a cause, a lot of interest and research are being made on a technology for controlling radiated heat.

On the other hand, looking at the material components of heat dissipating materials, most of them are composite materials in which a high thermal conductivity filler material such as a carbon material or a ceramic material and a polymer material are mixed. However, in the case of a high thermoelectric filler material, there is a problem in that it is difficult to uniformly disperse in a matrix made of a polymer material, and for this reason, there is a problem in that there is a limitation in sufficiently dissipating heat generated from electronic parts and devices.

The present application provides a heat dissipation module including a photo-sintered metal-nano composite heat dissipation layer and a lighting device including the same.

The present application relates to a heat dissipation module including a photo-sintered metal-nano composite heat dissipation layer. Since the heat dissipation module includes a heat dissipation layer having high thermal conductivity including a metal-carbon nanocomposite manufactured through a photo-sintering process using light energy, it may contribute to improving performance and securing productivity when applied to a product.

1 is a cross-sectional view illustrating an exemplary heat dissipation module or lighting device according to the present application.

Referring to FIG. 1, the heat dissipation module includes a heat source 100, a heat dissipation layer 200 for dissipating heat from the heat source, and a heat sink 300 provided on the heat dissipation layer.

The heat source is a device that generates heat, and the type of the heat source is not particularly limited because it may vary depending on the field to which the heat dissipation module is applied. The heat dissipation layer functions to transfer heat generated from a heat source to a heat sink. The heat sink is a device that discharges heat transferred from the heat dissipation layer to the outside. For example, the heat sink includes a heat sink attached to the heat sink to transmit (or absorb) heat, and a plurality of heat sink fins connected to the heat sink to emit heat to the outside. The heat dissipation plate may be attached to the heat dissipation layer by fastening an adhesive or bolt. In addition, the heat dissipation fin may dissipate more heat by increasing the area of the heat dissipation plate.

In addition, the heat dissipation layer includes a photo-sintered metal-nanocarbon composite, the content of nano-carbon in the composite is less than 3% by weight based on the total weight of the metal, and the thermal conductivity of the heat dissipation layer is 15 to 30w/mK. . The metal may be a metal filler, and a specific type thereof will be described later. The thermal conductivity is measured using a known thermal conductivity measurement method such as a HotDisk method or a laser flash analysis (LFA) measurement method. According to the LFA measurement method, the thermal conductivity of the heat dissipation layer can be measured based on the ASTM E1461 standard with a netchwisa equipment (model name: LFA467) using an InSb sensor at room temperature.

As the heat dissipation layer includes a metal-carbon nanocomposite that is photo-sintered but the content of nano-carbon satisfies the above range, heat conduction heat may be controlled within the above range.

For example, the content of nano carbon in the composite may be less than 3% by weight, less than 2.8% by weight, less than 2.7% by weight, less than 2.5% by weight, less than 2.3% by weight, or less than 2.1% by weight. The lower limit of the content is not particularly limited, but may be more than 0.1% by weight, more than 0.3% by weight, more than 0.5% by weight, more than 0.7% by weight, or more than 0.9% by weight.

In addition, the thermal conductivity of the heat dissipation layer may be 15 to 30w/mK, 17 to 30w/mK, or 20 to 30w/mK. The thermal conductivity may be adjusted by the content of nano carbon. For example, as the nano-carbon content increases, the thermal conductivity tends to increase. However, when the nano-carbon content is 3% by weight or more, the thermal conductivity tends to decrease, which is due to partial agglomeration and partial sintering of the nano-carbon during the photo-sintering process. Here, partial sintering refers to a phenomenon in which nano-carbon interferes with sintering of metals in the periphery due to a high nano-carbon content during sintering. Means phenomenon.

In one example, the heat dissipation layer may be photo-sintered by applying a metal paste to one surface of a heat source, applying a nano-carbon paste onto the metal paste, and irradiating light toward the nano-carbon paste. The heat dissipation layer manufactured through the photo-sintering process as described above may include a photo-sintered metal-nano-carbon composite. On the other hand, in the case of thermal sintering rather than photo sintering, since the metal-nano-carbon composite is not formed with uniform physical properties, it may be difficult to implement the desired physical properties.

The metal paste may include a metal, a solvent, a polymer dispersant, and a binder. The polymeric dispersant has a molecular weight of 10,000 to 360,000, and a viscosity of 1 to 100000 cP, specifically 1 to 50000 cP, 5 to 40000 cP or 5 to 30000 cP, 5 to 25000 cP, or 5 to 20000 cP.

The molecular weight of the polymer dispersant that can be used in the present invention is 10,000 to 360,000, for example, 11,000 to 200,000, 12,000 to 100,000, or 15,000 to 70,000. When the molecular weight is within the above range, excellent dispersibility and viscosity required to apply the solution composition to the substrate can be secured.

The viscosity of the metal paste is 1 to 50000 cP, 5 to 40000 cP or 5 to 30000 cP, 5 to 25000 cP, or 5 to 20000 cP. When the viscosity as well as the molecular weight of the polymeric dispersant is adjusted to the above range, the dispersibility of the particles and the conditions of the coating process can be satisfied.

In the metal paste, the content of the polymer dispersant is, for example, 1 to 15% by weight, specifically 1 to 10% by weight, and 2 to 10% by weight based on the total weight of the solution composition. In order to control the thermal conductivity of the heat dissipating layer, it is necessary to control the content of the dispersant within the above range.

The kind of the polymer dispersant may be, for example, an amine polymer dispersant such as polyethylene imine and polyvinylpyrrolidone; Hydrocarbon-based polymer dispersants having a carboxylic acid group in a molecule such as polyacrylic acid and carboxymethylcellulose; And a polymer dispersant having a polar group such as a polyvinyl alcohol, a styrene-maleic acid copolymer, an olefin-maleic acid copolymer, or a copolymer having a polyethylene imine moiety and a polyethylene oxide moiety in one molecule. .

In one embodiment, the polymer dispersant may be a water-soluble polymer, specifically an amine-based polymer, particularly polyvinylpyrrolidone (PVP). When PVP is used, an aqueous solvent can be used, so environmental pollution can be minimized even when manufacturing a large-area heat dissipation layer.

In the metal paste, the type of the binder is not particularly limited, but for example, a cellulose resin, a polyvinyl chloride resin, a polyvinyl alcohol resin, a polyvinylpyrrolidone resin, an acrylic resin, a vinyl acetate-acrylic acid. It is at least one selected from the group consisting of ester copolymer resins, butyral resins, alkyd resins, epoxy resins, phenol resins, rosin ester resins, polyester resins, and silicone resins.

The content of the binder is, for example, 1 to 50% by weight, specifically 3 to 40% by weight, and 5 to 30% by weight based on the total weight of the solution composition. If the content of the binder exceeds 30% by weight, there is a concern that it may not be completely dissolved in the solvent, and may aggregate over time, and if it is less than 1% by weight, there is a concern that the adhesive strength with the substrate may decrease.

The type of the solvent is not particularly limited, but, for example, water, hydrocarbon-based solvent, chlorinated hydrocarbon-based solvent, cyclic ether-based solvent, ketone-based solvent, alcohol, polyhydric alcohol-based solvent, acetate-based solvent, polyhydric alcohol It is at least one selected from the group consisting of an ether-based solvent or a terpene-based solvent. The type of solvent may be appropriately selected depending on the polymeric binder and dispersant used, but in consideration of environmental factors, dispersion characteristics, and drying time, it is preferable to use a mixture of water and alcohol. Specifically, when considering wettability, it is preferable to use alcohol. The alcohol is not particularly limited, but an alcohol having a linear alkyl group having 2 to 6 carbon atoms, for example, ethanol, propanol, or butanol, may be used. In consideration of the drying time, it is preferable to use ethanol with a low boiling point.

In this case, the weight ratio of water and alcohol may be mixed and used in a ratio of, for example, 1: 0.5 to 1.5, specifically 1: 0.7 to 1.3, and 1: 0.8 to 1.2. When the weight ratio of water and alcohol is controlled within the above range, the binder and the dispersant can be sufficiently dissolved and an appropriate viscosity can be maintained.

In addition, as the solvent, an organic solvent may be used in addition to water and alcohol. For example, the organic solvent is from the group consisting of terpineol, dihydroterpineol, ethylcarbitol, butylcarbitol, dihydroterpineol acetate, ethylcarbitol acetate, butylcarbitol acetate, or mixtures thereof. It may include one or more selected.

In addition, the nano carbon paste may include nano carbon, a solvent, a polymer dispersant, and a binder. The solvent, polymer dispersant, and binder of the nano-carbon paste may have the same composition as the metal paste described above.

In another example, a photo-sintered composite and a heat dissipating layer having a desired thermal conductivity may be manufactured by appropriately designing the specific conditions of the photo-sintering process within a range to be described later.

Specifically, the light sintering condition may include the type of light, the applied voltage (output voltage), the pulse width, the number of pulses (the number of repeated irradiation of light), the pulse interval (frequency), and the like. For example, the light may be white light applied from a xenon lamp, a voltage of 10 to 1500 V, a pulse number of 1 to 500 times, a pulse interval of 1 to 10 Hz, and a pulse width of 0.1 to 10 ms.

As the number of pulses increases, the total energy increases to effectively remove the solvent. However, when the number of pulses increases, the total energy increases, thereby causing physical deformation of the heat dissipation layer. The total energy is determined by the output voltage, pulse width, pulse interval, and number of pulses. The number of pulses may be appropriate, for example, 1 to 400 times, 1 to 350 times, 1 to 200 times, or 1 to 100 times.

In addition, as the pulse interval decreases, the processing time may decrease due to an increase in average power applied per second. The average power is determined by the output voltage, pulse width, and pulse interval. However, evaporation of the solvent may occur from a pulse interval of 1 Hz or more, and if the pulse interval is less than 1 Hz, the bed temperature may rise rapidly, thereby causing physical deformation of the heat dissipation layer.

And, as the output voltage increases, the organic matter is effectively removed, but physical deformation of the heat dissipation layer may occur, and the appropriate voltage at which no physical deformation occurs is 10 to 1500V, 50 to 1500V, 100 to 1500V, 200 to 1300V, It may be in the range of 300 to 1200V or 300 to 1000V.

In addition, when the pulse width exceeds a certain number of times, physical deformation of the heat dissipation layer may occur, resulting in poor thermal conductivity, and if less than a certain number of times, a composite may not be formed. Thus, a suitable pulse width may be in the range of 0.1 to 10 ms, 0.5 to 8 ms, 0.9 to 5 ms, or 1 to 3 ms.

The heat dissipation layer may have porosity as a space between the aggregates is formed while adhesion between the metal-nanocarbon composites occurs during the photosintering process to form an aggregate (eg, cluster). Since the cluster formed by aggregation serves as a thermal path, thermal conductivity may be improved.

For example, the heat dissipation layer may have a porosity of 1 to 15%, 2 to 15%, 3 to 15%, 4 to 15%, or 5 to 15%. The size of the pores may be, for example, in the range of 1 to 100 nm.

On the other hand, even in the case of thermal sintering, a metal-nano-carbon composite may be formed if it proceeds for a long time.The metal-nano-carbon nanocomposite formed by heat sintering promotes adhesion with other adjacent composites, thereby rapidly increasing the pore size to reach the above range. It is difficult to control. Moreover, in the case of photosintering, since nano-carbons are randomly distributed in the metal matrix and dispersibility is secured by instantaneous irradiation of light energy, the uniformity of heat transfer characteristics can be ensured higher than that of heat sintering.

In one embodiment, the metal may be at least one selected from the group including silver, copper, nickel, tin, and gold, and preferably silver or copper. Silver has high oxidation resistance, especially because of the high thermal conductivity of silver oxide, so it exhibits stable heat transfer characteristics, and copper is more economical than silver, a noble metal in terms of price, and is a native oxide layer formed on the surface of the composite material after photo-sintering. It can exhibit stable thermal conductivity.

The nano-carbon may be at least one selected from the group including carbon nanotubes (CNT), graphene, fullerene, and diamond, and preferably carbon nanotubes (CNT) or graphene. For example, the carbon nanotubes may be single-walled carbon nanotubes or multi-walled carbon nanotubes. In the case of the carbon nanotubes or graphene, it has the advantage of being easy to manufacture as a paste.

The composite may have an average particle diameter of 15 to 1000 nm. The average particle diameter can be measured using various known methods.

The heat dissipation layer may have a thickness of 0.1 to 5 μm.

The heat dissipation layer may have a first surface facing the heat source and a second surface opposite to the first surface, and adhesive strengths between the first surface and the second surface may be different.

The present application also relates to a lighting device. Specifically, it relates to a special lighting device that performs a special function.

Specifically, a special lighting device performs a special function by generating a light spectrum of a specific wavelength using a high-power light source.If the heat generated from a light source that irradiates a specific wavelength is not sufficiently dissipated, a wavelength shift occurs. There may be difficulties in performing special functions. For example, pests are known to prefer light with a wavelength of 300 to 450 nm and hate light with a wavelength of 600 to 700 nm. Therefore, in order to combat pests, the light source must irradiate a wavelength of 600 to 700 nm. In this case, if heat dissipation is not sufficiently performed, the wavelengths in the above range are shifted to 700 nm or more, so that smooth pest control cannot be performed.

As the lighting device according to the present application includes a photo-sintered metal-carbon nanocomposite heat dissipation layer, excellent heat dissipation properties are implemented, and thus has an advantageous advantage when applied to a special lighting device that performs a special function as described above.

Referring to FIG. 1, the lighting device includes a light source 100, a heat dissipation layer 200 for dissipating heat from the heat source, and a heat sink 300 provided on the heat dissipation layer.

The light source is a device that generates light, and may be, for example, an LED module having a high output rated voltage of 20W or more, 30W or more, 40W or more, or 50W or more, but is not limited thereto. For example, in order to implement a pest control function in a special lighting device, an LED module having a rated voltage of 50w or more may be used as the light source.

Detailed descriptions related to the heat dissipation layer and the heat sink are redundant and will be omitted below.

In the lighting device according to the present application, as the heat dissipation layer satisfies the above-described thermal conductivity, a wavelength shift and a heat sink temperature during operation of a light source can be controlled within a range to be described later. As the wavelength shift and the temperature of the heat sink can be controlled within a range to be described later, a special function is improved when a special lighting device is applied, and even when used for a long time, the function can be maintained without modification.

In one example, the lighting device according to the present application may satisfy the following General Formula 1.

[General Formula 1]

△P _max <30nm

In General Formula 1, ΔP _max is the first measured maximum intensity peak when exposed for 3,000 hours at 85°C and 85% relative humidity after measuring the wavelength of the _{maximum intensity peak (P max} ) when the light source of the lighting device is operated. It represents the wavelength shift of (P _{max ).} For example, the lighting device may have a βmax value of 30 nm or less, 25 nm or less, 20 nm or less, 15 nm or less, 10 nm or less, 5 nm or less, 1 nm or less, or 0.1 nm or less according to the following General Formula 1.

The general formula 1 means that even when the light source is used for a long time, the change in wavelength shift of the maximum intensity peak is not large. Therefore, the lighting device satisfying the general formula 1 can stably emit light of the same wavelength continuously. In general, in a special lighting device, since a specific wavelength for a special function of a light source is implemented as a maximum intensity peak, when a lighting device that satisfies General Formula 1 is applied to a special lighting device, the special function can be maintained continuously.

In addition, when the light source is operated, the temperature of the heat sink may be maintained at 75°C or less. The fact that the temperature of the heat sink is maintained within the above range suggests that the heat generated from the light source is effectively released. The temperature of the heat sink is measured by measuring the temperature converged when the temperature of the bottom of the heat sink is heated for a sufficient time for 30 minutes or more with a thermocouple.

The heat dissipation module of the present application may have excellent thermal conductivity as a photo-sintered metal-nano composite heat dissipation layer is applied. In addition, since the lighting device of the present application has excellent thermal conductivity, there is no change in the wavelength shift of the light source, so when applied to a special lighting device, the maintenance of special functions is sustainable.

1 is a cross-sectional view illustrating an exemplary heat dissipation module or lighting device according to the present application.

2 is a graph of the thermal conductivity of the heat dissipation layer prepared in Examples and Comparative Examples.

3 is a graph of heat sink temperatures manufactured in Examples and Comparative Examples.

4 is an optical spectrum evaluation graph of the lighting device according to Example 1. FIG.

5 is an optical spectrum evaluation graph of the lighting device according to Example 1. FIG.

6 is an optical spectrum evaluation graph of the lighting device according to Comparative Example 2.

Hereinafter, the above-described contents will be described in more detail through Examples and Comparative Examples. However, the scope of the present application is not limited by the following examples.

Manufacturing example

Metal paste manufacturing

A metal paste (A) was prepared by mixing copper (Cu), α-terpineol (solvent), cellulose (binder), and polyvinylpyrrolidone (PVP, dispersant) in the following composition ratio.

	Cu (% by weight)	α-terpineol (% by weight)	Cellulose (% by weight)	PVP (% by weight)
A	6	2.25	0.75	One

Nano Carbon Paste Manufacturing

Nanocarbon paste (B) was prepared by mixing carbon nanotubes (CNT), α-terpineol (solvent), cellulose (binder), and polyvinylpyrrolidone (PVP, dispersant) in the following composition ratio.

	CNT weight%)	α-terpineol (% by weight)	Cellulose (% by weight)	PVP (% by weight)
B	5.5	2.5	One	One

Example 1

<Manufacture of heat dissipation module>

The metal paste (A) and the nano-carbon paste (B) prepared in the above Preparation Example were sequentially applied on the heat source so that the content of the nano-carbon tube was 2% by weight based on the total weight of copper. Then, light was irradiated to the side of the nano carbon paste to photo-sinter to prepare a heat dissipating layer. Then, a heat sink was attached to the heat radiation layer by bolting to fabricate a heat radiation module. The light sintering was performed using white light applied from a xenon lamp, the applied voltage was 500V, the number of pulses was 30 times, the pulse width was 2.0ms, the pulse interval was 1Hz, and the sintering atmosphere was used as an atmospheric atmosphere.

<Manufacture of lighting equipment>

The metal paste (A) and the nano carbon paste (B) prepared in Preparation Example were sequentially applied on a light source so that the content of the nano carbon tube was 2% by weight based on the total weight of copper. As the light source, a light source of an optical sintering system composed of a 400mm xenon lamp from Heraeus and a HI-PULSE 45000 power supply from PSTEK was used. In addition, light was irradiated to the nano carbon face side to lightly sinter to form a heat dissipating layer, which was bonded to a heat sink to manufacture a lighting device. The light sintering was performed using white light applied from a xenon lamp, the applied voltage was 500V, the number of pulses was 30 times, the pulse width was 2.0ms, the pulse interval was 1Hz, and the sintering atmosphere was used as an atmospheric atmosphere.

Example 2

A heat dissipation module and a lighting device were manufactured in the same manner as in Example 1, except that the metal paste (A) and the nano-carbon paste (B) prepared in Preparation Example were sequentially applied on a heat source, and an applied voltage of 300 V for light sintering was used. .

Example 3

A heat dissipation module and a lighting device were manufactured in the same manner as in Example 1, except that the metal paste (A) and the nano-carbon paste (B) prepared in Preparation Example were sequentially applied on a heat source, and an applied voltage of 700 V for light sintering was used. .

Example 4

The heat dissipation module in the same manner as in Example 1 except that the metal paste (A) and the nano-carbon paste (B) prepared in Preparation Example were sequentially applied on the heat source, and the applied voltage of light sintering was 700 V and a pulse width of 2.5 ms was used. And a lighting device.

Comparative Example 1

A heat dissipation module and a lighting device were manufactured in the same manner as in Example 1 without the metal paste (A) and the nano carbon paste (B).

Comparative Example 2

A heat dissipation module and a lighting device were manufactured in the same manner as in Example 1, except that only the metal paste (A) prepared in Preparation Example was applied on the heat source.

Comparative Example 3

The same method as in Example 1, except that the metal paste (A) and the nano carbon paste (B) prepared in Preparation Example were sequentially applied to the heat source so that the content of the nano carbon tube was 3% by weight based on the total weight of copper. A heat dissipation module and a lighting device were manufactured.

Experimental Example 1 -Evaluation of thermal conductivity and temperature of heat sink

The thermal conductivity of the heat dissipation layer was measured at room temperature using an InSb sensor, based on ASTM E1461 standard with a NETZSCH equipment (model name: LFA467). In addition, the temperature of the heat sink was measured when the temperature at the bottom of the heat sink was heated for a sufficient period of time for 30 minutes or more with a thermocouple, and the results are shown in Table 3, FIGS. 2 and 3 below. The results are shown in Table 3 and FIG. 2 below. 2 is a graph of the thermal conductivity of the heat dissipating layer manufactured in Examples and Comparative Examples, and FIG. 3 is a graph of the temperature of the heat sink manufactured in Examples and Comparative Examples.

Condition	Thermal conductivity of heat dissipation layer (W/mK)	Heat sink temperature (℃)
Example 1	27.15±1.40	70.9
Example 2	20.24±1.83	74.3
Example 3	26.64±1.55	71.3
Example 4	25.81±1.19	71.8
Comparative Example 1	-	107.5
Comparative Example 2	11.07±0.52	84.1
Comparative Example 3	13.85±0.74	82.0

Experimental Example 2 -Evaluation of the optical spectrum of the lighting device

_{The wavelengths of the maximum intensity peaks (P max} ) of the lighting devices prepared in Example 1 and Comparative Examples 1 and 2 when operating as a light source were 618 nm, 685 nm, and 655 nm, respectively. In addition, after 3,000 hours exposure of the lighting device to an accelerated environmental test condition of 85°C and 85% relative humidity, the spectrum was measured with a luminous flux to evaluate and compare how much the wavelength shift of the first measured peak of the highest intensity was achieved. . The results are shown in FIGS. 4 to 6. 4 is an optical spectrum evaluation graph of the lighting device according to Example 1, FIG. 5 is an optical spectrum evaluation graph of the lighting device according to Example 1, and FIG. 6 is an optical spectrum evaluation graph of the lighting device according to Comparative Example 2. . 4 to 5, it was confirmed that the lighting device according to Example 1 _{had almost no wavelength shift of P max} , whereas the lighting devices according to Comparative Examples 1 and 2 had a _{wavelength shift of P max} of 30 nm or more. Could.

Explanation of the sign

100: heat source or light source

200: heat dissipation layer

300: heat sink

Claims (11)

1. Heat source;

   A heat dissipation layer for dissipating heat from the heat source; And

   It includes a heat sink provided on the heat dissipation layer,

   The heat dissipation layer includes a photo-sintered metal-nanocarbon composite,

   The content of nano carbon in the composite is less than 3% by weight based on the total weight of the metal,

   The heat dissipation module having a thermal conductivity of 15 to 30W/mK of the heat dissipation layer.
2. The heat dissipation module according to claim 1, wherein the heat dissipation layer is photo-sintered by irradiating light to the nano-carbon paste after a metal paste is applied to one surface of the heat source and a nano-carbon paste is applied on the metal paste.
3. The heat dissipation module according to claim 1, wherein the heat dissipation layer has a porosity of 1 to 15%.
4. The heat dissipation module of claim 1, wherein the metal is at least one selected from the group comprising silver, copper, nickel, gold, tin, and aluminum.
5. The heat dissipation module of claim 1, wherein the nano-carbon is at least one selected from the group comprising CNT, graphene, fullerene, and diamond.
6. The heat dissipation module of claim 1, wherein the composite has an average particle diameter of 15 to 1000 nm.
7. The heat dissipation module of claim 1, wherein the heat dissipation layer has a thickness of 0.1 to 5 μm.
8. The method of claim 1, wherein the heat dissipation layer has a first surface facing the heat source and a second surface opposite to the first surface,

   The heat dissipation module, wherein the first and second surfaces have different adhesive strengths.
9. Light source;

   A heat dissipation layer for dissipating heat from the heat source; And

   It includes a heat sink provided on the heat dissipation layer,

   The heat dissipation layer includes a photo-sintered metal-nanocarbon composite,

   The content of nano-carbon in the composite is less than 3% by weight based on the total weight of the metal,

   A lighting device having a thermal conductivity of 15 to 30W/mK of the heat dissipation layer.
10. The lighting device according to claim 9, which satisfies the following general formula (1).

    [General Formula 1]

    △P _max <30nm

    In General Formula 1, ΔP _max is the first measured maximum intensity peak when exposed for 3,000 hours at 85°C and 85% relative humidity after measuring the wavelength of the _{maximum intensity peak (P max} ) when the light source of the lighting device is operated. It represents the wavelength shift of (P _{max ).}
11. The lighting device according to claim 9, wherein when the light source is operated, the temperature of the heat sink is maintained below 75°C.

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