WO2013073744A1 - Éclairage à led, et dispositif de source de lumière pour unité de rétro-éclairage - Google Patents

Éclairage à led, et dispositif de source de lumière pour unité de rétro-éclairage Download PDF

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Publication number
WO2013073744A1
WO2013073744A1 PCT/KR2012/001122 KR2012001122W WO2013073744A1 WO 2013073744 A1 WO2013073744 A1 WO 2013073744A1 KR 2012001122 W KR2012001122 W KR 2012001122W WO 2013073744 A1 WO2013073744 A1 WO 2013073744A1
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WO
WIPO (PCT)
Prior art keywords
led
light source
substrate
light
pattern
Prior art date
Application number
PCT/KR2012/001122
Other languages
English (en)
Korean (ko)
Inventor
홍성천
정기석
Original Assignee
(주)파인테크닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)파인테크닉스 filed Critical (주)파인테크닉스
Publication of WO2013073744A1 publication Critical patent/WO2013073744A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

Definitions

  • the present invention relates to a light source device applied to LED lighting.
  • the present invention provides a configuration for dissipating heat emitted from LEDs more quickly and efficiently in the configuration of a product for supplying power to the LEDs, thereby reducing various defects caused by the heat of the LEDs. It relates to a light source device for LED lighting and backlight unit to minimize and improve the lighting efficiency.
  • Examples of lighting using a light emitting diode may include a back light unit (BLU) of a display panel using an LCD, an organic LED, a general lighting fixture, and the like.
  • BLU back light unit
  • the LED is applied as a light source of the illumination
  • the general luminaire using this is a printed circuit bord (PCB) mounted with a plurality of LEDs mounted inside the housing to perform the function of the light source, the light from the LED
  • PCB printed circuit bord
  • a transmission cover for diffusing and emitting a plurality of LED lights is coupled to the housing opening in front of the exit.
  • the backlight unit using the LED light is configured to be disposed on one side or directly below the light guide plate for forming a surface light source in a state where a plurality of LEDs are mounted on the PCB.
  • a configuration such as a lens for diffusing or refracting the light emitted from the LED is added between the LED and the light guide plate.
  • the LED light source as described above emits a considerable amount of heat during driving due to the device characteristics of the LED, and such heat becomes an overload factor of the LED itself, and in particular, adversely affects the device on the PCB for driving the LED.
  • a heat sink having excellent heat exchange performance is attached to the back of the PCB on which the LED is mounted, or a heat dissipation fan is installed to forcibly radiate heat to the outside.
  • Republic of Korea Patent Application No. 10-2005-8216 radiation device for LED backlight unit, hereinafter referred to as the present invention
  • the present invention has been proposed a configuration for effectively cooling by dissipating heat generated from the backlight of the LCD.
  • the heat dissipation device presented in the present invention combines a heatsink to the rear of the PCB on which the LED is mounted, connects them to the fixing plate, and then forms a heat dissipation hole in the fixing plate to force heat to be discharged at the point where the heat dissipation hole is formed. It is constructed by installing a heat radiating fan.
  • the prior invention has a one-to-one correspondence by dividing the PCB to each of the plurality of LEDs to improve the heat dissipation efficiency, and is configured by mounting a heat pipe between each PCB and the heat sink.
  • the present invention has a complicated structure for dissipating heat generated from the LED, so that the production cost is high and the production time is delayed.
  • the PCB applies a metal PCB (MCPCB) made of aluminum. Since such a metal PCB has a considerable thickness and weight, it cannot be applied to a display of a product seeking miniaturization as well as the weight of the product. The disadvantage of weighting is generated.
  • MCPCB metal PCB
  • the present invention has been invented to solve the above problems.
  • the present invention provides a configuration for quickly and efficiently dissipating heat emitted from the LED in the configuration of the product for supplying power to the LED, and the configuration is simplified and minimized in size and weight It is an object of the present invention to provide a light source device having a heat dissipation means to have a. It is an object of the present invention to provide a light source device having a heat dissipation means.
  • the present invention has the following configuration.
  • the present invention provides a light emitting device, comprising: a plurality of LEDs arranged in one or more columns or one or more columns and rows corresponding to a section for emitting light by receiving an external electric power; A pattern substrate having a substrate formed of an insulating thin thermal conductive sheet for mounting the plurality of LEDs, and a conductive pattern for connecting a plurality of LEDs to power on the substrate; And a heat sink having a plurality of heat dissipation fins formed on a rear surface of the surface on which the LED of the pattern board is mounted in contact with one side and facing the surface of the pattern board.
  • the pattern substrate is formed by dispersing thermally conductive particles made of non-ferrous metal oxide or CNT in a silicone-based resin.
  • the patterned substrate is formed by depositing or coating a sheet material formed by dispersing thermally conductive particles made of non-ferrous metal oxide or CNT in a silicone-based resin on the surface of a heatsink to form a thin substrate layer.
  • the present invention may be installed in the corner light source coupling type BLU coupled to the LED is arranged to emit light at least one side edge of the light guide plate for forming a surface light source.
  • the present invention can be installed in the direct light source coupling type BLU coupled to the LED is arranged so as to emit light in the direction immediately below the surface of the light guide plate for forming the surface light source.
  • the present invention is coupled to the tube-shaped transmission cover to the side of the surface of the heat sink is in contact with the surface of the heat sink, the light emitted from the LED of the pattern substrate is installed in the tube-type LED lamp configured to diffuse through the transmission cover do.
  • the present invention is disposed in the housing formed with an opening for emitting light to one side to the outside, the inside of the flat-panel LED lamp combined with a transmission cover for the light of the LED is diffused and emitted to the opening of the housing Can be installed.
  • the present invention has a simpler heat dissipation configuration for dissipating heat emitted from the LED more quickly and efficiently, thereby improving convenience and productivity according to a quick work process.
  • the present invention is because the substrate on which the LED is mounted is made ultra-thin and combined with the heat sink, the heat generated from the LED is conducted to the heat sink as quickly as possible, which can reduce the size and size of the product more excellent heat dissipation efficiency and weight You get an effect.
  • FIG. 1 is a perspective view of a light source device according to the present invention.
  • FIG. 2 is a cross-sectional view of a light source device according to the present invention.
  • Figure 3 is a process diagram of the pattern substrate manufacturing state of the light source device according to the present invention.
  • FIGS. 4A and 4B are diagrams illustrating a BLU to which a light source device according to the present invention is applied.
  • Figure 5a Figure 5b is an illustration of a lamp to which the light source device according to the present invention is applied.
  • FIG. 1 is a perspective view of a light source device according to the present invention
  • Figure 2 is a cross-sectional view of the light source device according to the present invention.
  • the light source device includes a plurality of LEDs 10, a pattern substrate 20, and a heat sink 30.
  • the LED 10 is arranged in a line
  • the pattern substrate 20 and the heat sink 30 are illustrated in a rectangular shape having a longitudinal direction, but according to the arrangement state of the LED 10, a circular, elliptical, triangular It may be formed in the above polygonal shape.
  • the LED 10 is a device for emitting light by receiving an external electric power source as is well known.
  • a plurality of the LED 10 is applied in the illumination is configured to be arranged in one or more columns or one or more columns and rows corresponding to the section for forming the illumination.
  • the LED 10 is applied to the Surface Mounting Technology (SMT) method to be surface-mounted on the pattern substrate 20.
  • SMT Surface Mounting Technology
  • the pattern substrate 20 is composed of a substrate 21 and a pattern 22.
  • the substrate 21 is formed of an ultra-thin sheet having insulation performance in order to mount a plurality of LEDs 10.
  • the pattern 22 is mainly formed of copper foil on the surface on which the LED 10 of the substrate 21 is mounted, and the pattern 22 of such copper foil is etched after depositing copper foil on the substrate 21. It can be produced by, alternatively can be formed by printing (preferably screen printing) the desired pattern 22 on the substrate 21.
  • the substrate 21 may be manufactured to have excellent thermal conductivity in order to quickly transfer heat of the LED 10 to the heat sink 30.
  • the substrate 21 is produced by dispersing thermally conductive particles made of non-ferrous metal oxide or carbon nanotube (CNT) in a polymer synthetic resin (preferably using a silicone-based resin).
  • the substrate 21 manufactured as described above may form the sheet material in which the above-described thermally conductive particles are mixed into a thin sheet, and then form the aforementioned pattern 22 to be attached to the heat sink 30 so as to be in contact with the heat sink 30. .
  • the substrate 21 is formed by coating and depositing a sheet material mixed with thermally conductive particles on the surface of the heat sink 30 to form a substrate layer coated on the surface of the heat sink 30 and the surface thereof. It may be produced by forming a pattern 22 in the.
  • the heat sink 30 is formed of an attachment or substrate layer such that the ultra-thin pattern substrate 20 is face-to-face contacted on one surface thereof, and a plurality of heat dissipation fins for improving heat exchange efficiency by expanding a heat dissipation area on the rear surface thereof ( 31) is formed and configured.
  • Figure 3 is a process chart of the pattern substrate manufacturing state of the light source device according to the present invention.
  • FIG 3 illustrates an exemplary embodiment of a process of attaching the pattern substrate 20 to the heat sink 30.
  • the pattern substrate 20 transfers the heat sink 30 and attaches the ultra-thin sheet-like substrate 21 wound in a roller state to the heat sink 30, and then, again, the ultra-thin pattern 22 wound in a roller state. It is produced by attaching.
  • the substrate 21 is formed of a raw material mixed with the thermally conductive particles as described above, it is preferable that the adhesive sheet for attaching the heat sink 30 and the pattern 22 is preferably formed.
  • the pattern 22 is preferably formed of ultra-thin copper foil to have excellent electrical conductivity.
  • FIGS. 4A and 4B are diagrams illustrating a BLU to which a light source device according to the present invention is applied.
  • the light source device is installed in the edge light source type BLU 60.
  • the light source device is coupled to the LED 10 is arranged to emit light toward the light guide plate 61 at at least one side edge of the light guide plate 61 for forming a surface light source.
  • the LED 10 disposed at one side of the light guide plate 61 emits light to the inside of the light guide plate 61 so that the light guide plate 61 forms a surface light source. At this time, heat generated from the LED 10 is transferred to the heat sink 30 through the pattern substrate 20 to radiate heat.
  • FIG. 4B illustrates a configuration in which the light source device is installed in the direct light source coupling type BLU 70.
  • the LED 10 is disposed and coupled in a direction directly below the surface on which the light of the light guide plate 71 is emitted.
  • the direct light source coupling type BLU 70 configured as described above, light emitted from the LED 10 disposed to face the light guide plate 71 is incident to the inside of the light guide plate 71 so that the light guide plate 71 forms a surface light source. In this case, heat generated by the LED 10 is transferred to the heat sink 30 through the pattern substrate 20 to radiate heat.
  • 5A and 5B are diagrams illustrating an illuminating lamp to which a light source device according to the present invention is applied.
  • the tubular LED lamp 40 is composed of a transparent cover 41 is coupled to the heat sink 30 is formed of a substrate layer or a pattern substrate 20 is a plurality of LED 10 is arranged in a row.
  • the transmission cover 41 is formed in a substantially circular cross-sectional shape, a portion of the section (upper part of the drawing) is cut off the coupling groove formed on the surface side where both ends of the pattern substrate 20 of the heat sink 30 is in contact with the surface. (32) is fitted to fit.
  • the tubular LED lamp 40 configured as described above is mainly formed in the form of a fluorescent lamp so that the light emitted from the LED 10 is diffused and emitted by the transmission cover 41, the illumination is implemented, the heat sink 30 is external
  • the heat generated from the LED 10 by being exposed to the pattern substrate 20 is conducted to heat dissipation by heat exchange with the outside air in the heat sink 30.
  • the flat LED lighting 50 is configured to be installed in the light source device inside the housing 51 is formed with an opening for emitting light to one side.
  • the opening portion of the housing 51 is configured to combine the transmission cover 52 to diffuse and emit the light of the LED (10).
  • the flat LED lamp 50 configured as described above is light emitted from the plurality of LEDs 10 diffused by the transmission cover 52 is emitted to implement the illumination, wherein the heat generated from the LED 10 is a pattern substrate Heat exchanged in the heat sink 30 through the heat dissipation (20) quickly.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention concerne un dispositif de source de lumière à appliquer à un éclairage à LED en obtenant une dissipation rapide et efficace de la chaleur émise par une LED dans un produit pour assurer un éclairage en envoyant de l'électricité à la LED, ce qui permet de minimiser les diverses défaillances dues à la chaleur de la LED et d'améliorer simultanément l'efficacité d'éclairage. L'invention comprend ainsi : plusieurs LED qui émettent de la lumière en recevant une électricité externe et qui sont disposées en une ou plusieurs colonnes ou une ou plusieurs rangées et colonnes en fonction d'une section afin d'assurer l'éclairage ; un substrat de motif dans lequel un substrat est formé d'une feuille conductrice de chaleur fine afin d'y monter lesdites plusieurs LED, et un motif conducteur afin de connecter lesdites plusieurs LED à une source d'alimentation sur le substrat ; et un dissipateur thermique dans lequel une surface opposée du substrat sur lequel les LED des substrats de motif sont montées, vient en contact avec une de ses surfaces, tandis que plusieurs ailettes de rayonnement sont formées sur la surface opposée de sa surface venant en contact avec le substrat de motif.
PCT/KR2012/001122 2011-11-17 2012-02-15 Éclairage à led, et dispositif de source de lumière pour unité de rétro-éclairage WO2013073744A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110120422A KR101118917B1 (ko) 2011-11-17 2011-11-17 엘이디 조명 및 백라이트 유닛용 광원장치
KR10-2011-0120422 2011-11-17

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WO2013073744A1 true WO2013073744A1 (fr) 2013-05-23

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WO (1) WO2013073744A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103277692A (zh) * 2013-06-19 2013-09-04 苏州信亚科技有限公司 一种带针状散热器的led灯具

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Publication number Priority date Publication date Assignee Title
CN102661533A (zh) * 2012-04-11 2012-09-12 深圳市华星光电技术有限公司 背光模组及液晶显示装置
KR101632000B1 (ko) * 2014-10-15 2016-06-20 김형태 사진촬영용 조명기기
KR102114775B1 (ko) * 2018-04-05 2020-05-25 주식회사 젬 식욕조절 스마트 조명등
KR102559601B1 (ko) 2022-11-07 2023-07-26 (주)비젼테크 전자파 차폐 성능이 우수한 조명용 외함 도료 조성물
KR20240078736A (ko) 2022-11-28 2024-06-04 주식회사 리더하이 조명용 외함 코팅용 도료 조성물
KR102541057B1 (ko) 2023-01-09 2023-06-13 (주)비젼테크 조명용 방열판에 장착되는 방열블록

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KR20060068371A (ko) * 2004-12-16 2006-06-21 알티전자 주식회사 고출력 발광 다이오드 패키지 및 그 제조방법
KR20090118293A (ko) * 2008-05-13 2009-11-18 (주)아크로젠텍 엘이디 조명 모듈
KR20100062040A (ko) * 2008-12-01 2010-06-10 주식회사 탑 엔지니어링 발광 다이오드 패키지 및 그의 제조 방법
KR20110094297A (ko) * 2008-11-25 2011-08-23 덴끼 가가꾸 고교 가부시키가이샤 발광 소자 패키지용 기판의 제조 방법 및 발광 소자 패키지

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060068371A (ko) * 2004-12-16 2006-06-21 알티전자 주식회사 고출력 발광 다이오드 패키지 및 그 제조방법
KR20090118293A (ko) * 2008-05-13 2009-11-18 (주)아크로젠텍 엘이디 조명 모듈
KR20110094297A (ko) * 2008-11-25 2011-08-23 덴끼 가가꾸 고교 가부시키가이샤 발광 소자 패키지용 기판의 제조 방법 및 발광 소자 패키지
KR20100062040A (ko) * 2008-12-01 2010-06-10 주식회사 탑 엔지니어링 발광 다이오드 패키지 및 그의 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103277692A (zh) * 2013-06-19 2013-09-04 苏州信亚科技有限公司 一种带针状散热器的led灯具

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