WO2017088091A1 - 影像撷取模组及航拍飞行器 - Google Patents

影像撷取模组及航拍飞行器 Download PDF

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Publication number
WO2017088091A1
WO2017088091A1 PCT/CN2015/095271 CN2015095271W WO2017088091A1 WO 2017088091 A1 WO2017088091 A1 WO 2017088091A1 CN 2015095271 W CN2015095271 W CN 2015095271W WO 2017088091 A1 WO2017088091 A1 WO 2017088091A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
heat
module
aerial vehicle
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/095271
Other languages
English (en)
French (fr)
Inventor
张磊
刘浩
王雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SZ DJI Technology Co Ltd
Original Assignee
SZ DJI Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SZ DJI Technology Co Ltd filed Critical SZ DJI Technology Co Ltd
Priority to PCT/CN2015/095271 priority Critical patent/WO2017088091A1/zh
Priority to CN202010402907.6A priority patent/CN111432110B/zh
Priority to CN201580065525.6A priority patent/CN107113371B/zh
Publication of WO2017088091A1 publication Critical patent/WO2017088091A1/zh
Priority to US15/962,670 priority patent/US10674049B2/en
Anticipated expiration legal-status Critical
Priority to US16/885,928 priority patent/US11115567B2/en
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Definitions

  • the present invention relates to the field of image capturing, and in particular to an image capturing module for aerial shooting and an aerial vehicle having the image capturing module.
  • the image capturing module for example, a camera, a camera, or a monitoring device such as a surveillance camera mounted on the drone, or a unit for acquiring images in the terminal device, and the like, and generally includes a lens module and the lens module Connected boards.
  • a plurality of functional modules for implementing different functions such as an image sensing module, a photoelectric conversion module, an image processing module, an image transmission module, a power module, and a control module, are generally disposed on the circuit board.
  • An image capturing module includes a heat conducting housing, a camera module, a circuit board switching unit, and a thermal pad.
  • the camera module and the circuit board switching unit are both housed in the housing, and the circuit board switching unit is electrically connected to the camera module.
  • the thermal pad is attached to the camera module and located between the camera module and the housing to conduct heat generated by the camera module to the housing.
  • the camera module includes a circuit board, an image sensor carried on the circuit board and electrically connected to the circuit board, and a lens module carried on the circuit board and accommodating the image sensor, the lens module
  • the module includes a lens unit for receiving the lens and having both ends open, the circuit board enclosing the first open end of the lens unit, the second open end of the lens unit is exposed from the outer casing, and the thermal conductive sheet extends from the circuit board to the The side wall of the lens unit.
  • the lens unit includes a plurality of sidewalls, and the heat conducting sheet extends from any one surface of the circuit board to at least one sidewall of the lens unit.
  • the lens unit includes a cylindrical sidewall extending from any one surface of the circuit board to a cylindrical sidewall of the lens unit.
  • thermal conductive sheet on the side wall of the lens unit is in direct contact with the outer casing.
  • a thermal pad located on a sidewall of the lens unit is in indirect contact with the outer casing.
  • a heat conducting sheet located on a sidewall of the lens unit is spaced apart from the outer casing.
  • the heat conductive sheet is made of a metal material.
  • the thermally conductive sheet is made of a thermally conductive gold foil, a thermally conductive silver foil, a thermally conductive aluminum foil, or a thermally conductive copper foil.
  • thermally conductive sheet is made of a non-metallic material.
  • the thermally conductive sheet is made of a thermally conductive silicone sheet or a thermally conductive graphite sheet.
  • circuit board is electrically connected to the circuit board switching unit, and the first thermal conductive filler is filled between the circuit board and the circuit board switching unit.
  • the circuit board switching unit includes an adapter board and a plurality of first electronic components
  • the adapter board includes a first surface and a second surface opposite to each other
  • the plurality of first electronic components are electrically disposed at the first A surface of the circuit board is plugged onto the first surface.
  • the first heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • a male connector is disposed on the circuit board, and the first surface is provided with a female connector, and the male connector is inserted into the female connector;
  • the circuit board is provided with a female connector, and the first surface is provided with a male connector, and the male connector is inserted into the female connector.
  • the first thermally conductive filler covers the plurality of first electronic components.
  • the image capturing module further includes a heat sink disposed on the second surface and in contact with the outer casing, and the second heat conductive filler is filled between the heat sink and the second surface.
  • the second heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • the circuit board switching unit further includes a plurality of second electronic components electrically disposed on the second surface, the second thermal conductive filler completely covering the plurality of second electronic components .
  • the heat sink includes a heat dissipation body and a plurality of heat dissipation fins extending outward from the heat dissipation body, the heat dissipation body is disposed on the second surface, and the plurality of heat dissipation fins are located at a distance of the heat dissipation body away from the second surface On the side, the plurality of fins are spaced apart from each other.
  • the housing includes a first housing and a second housing, and the first housing is coupled to the second housing and encloses the camera module, the circuit board switching unit, and the heat sink. Containment space.
  • the first housing includes a connecting portion and a receiving portion extending outward from the connecting portion, the connecting portion is connected to the second housing to form the receiving space, and the lens unit is received in the receiving portion, the lens unit
  • the side wall corresponds to the side wall of the receiving portion.
  • the accommodating portion is provided with an optical opening, the second open end is aligned with the optical opening, and an inner wall of the second housing extends inwardly with a flange, and the plurality of fins are carried on the flange .
  • first housing and the second housing are coupled together by screwing, snapping, or gluing.
  • An aerial vehicle includes an aircraft and an image capturing module mounted on the aircraft.
  • the image capture module includes a heat conductive housing, a camera module, a circuit board switching unit, and a thermal pad.
  • the camera module and the circuit board switching unit are both housed in the housing.
  • the circuit board switching unit is electrically connected to the camera module.
  • the thermal pad is attached to the camera module and located between the camera module and the housing to conduct heat generated by the camera module to the housing.
  • the image capturing module is mounted on the aircraft through the pan/tilt.
  • the camera module includes a circuit board, an image sensor carried on the circuit board and electrically connected to the circuit board, and a lens module carried on the circuit board and accommodating the image sensor, the lens module
  • the module includes a lens unit for receiving the lens and having both ends open, the circuit board enclosing the first open end of the lens unit, the second open end of the lens unit is exposed from the outer casing, and the thermal conductive sheet extends from the circuit board to the The side wall of the lens unit.
  • the lens unit includes a plurality of sidewalls, and the heat conducting sheet extends from any one surface of the circuit board to at least one sidewall of the lens unit.
  • the lens unit includes a cylindrical sidewall extending from any one surface of the circuit board to a cylindrical sidewall of the lens unit.
  • thermal conductive sheet on the side wall of the lens unit is in direct contact with the outer casing.
  • a thermal pad located on a sidewall of the lens unit is in indirect contact with the outer casing.
  • a heat conducting sheet located on a sidewall of the lens unit is spaced apart from the outer casing.
  • the heat conductive sheet is made of a metal material.
  • the thermally conductive sheet is made of a thermally conductive gold foil, a thermally conductive silver foil, a thermally conductive aluminum foil, or a thermally conductive copper foil.
  • thermally conductive sheet is made of a non-metallic material.
  • the thermally conductive sheet is made of a thermally conductive silicone sheet or a thermally conductive graphite sheet.
  • circuit board is electrically connected to the circuit board switching unit, and the first thermal conductive filler is filled between the circuit board and the circuit board switching unit.
  • the circuit board switching unit includes an adapter board and a plurality of first electronic components
  • the adapter board includes a first surface and a second surface opposite to each other
  • the plurality of first electronic components are electrically disposed at the first A surface of the circuit board is plugged onto the first surface.
  • the first heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • a male connector is disposed on the circuit board, and the first surface is provided with a female connector, and the male connector is inserted into the female connector;
  • the circuit board is provided with a female connector, and the first surface is provided with a male connector, and the male connector is inserted into the female connector.
  • the first thermally conductive filler covers the plurality of first electronic components.
  • the image capturing module further includes a heat sink disposed on the second surface and in contact with the outer casing, and the second heat conductive filler is filled between the heat sink and the second surface.
  • the second heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • the circuit board switching unit further includes a plurality of second electronic components electrically disposed on the second surface, the second thermal conductive filler completely covering the plurality of second electronic components .
  • the heat sink includes a heat dissipation body and a plurality of heat dissipation fins extending outward from the heat dissipation body, the heat dissipation body is disposed on the second surface, and the plurality of heat dissipation fins are located at a distance of the heat dissipation body away from the second surface On the side, the plurality of fins are spaced apart from each other.
  • the housing includes a first housing and a second housing, and the first housing is coupled to the second housing and encloses the camera module, the circuit board switching unit, and the heat sink. Containment space.
  • the first housing includes a connecting portion and a receiving portion extending outward from the connecting portion, the connecting portion is connected to the second housing to form the receiving space, and the lens unit is received in the receiving portion, the lens
  • the side wall of the unit corresponds to the side wall of the receiving portion.
  • the accommodating portion is provided with an optical opening, the second open end is aligned with the optical opening, and an inner wall of the second housing extends inwardly with a flange, and the plurality of fins are carried on the flange .
  • first housing and the second housing are coupled together by screwing, snapping, or gluing.
  • An image capturing module includes a heat conducting housing, a camera module, a circuit board switching unit, and a first heat conductive filler.
  • the camera module and the circuit board switching unit are both housed in the housing.
  • the camera module is electrically disposed on the circuit board switching unit.
  • the first thermally conductive filler is filled between the camera module and the circuit board switching unit to conduct heat generated by the camera module to the housing via the circuit board switching unit.
  • the first heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • the image capturing module further includes a heat sink disposed on a side of the circuit board switching unit opposite to the camera module and in contact with the housing, the heat sink and the circuit board switching unit A second thermally conductive filler is filled between them.
  • the second heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • the camera module includes a circuit board, an image sensor carried on the circuit board and electrically connected to the circuit board, and a lens module carried on the circuit board and accommodating the image sensor, the lens module
  • the module includes a lens unit for receiving the lens and having both ends open, the circuit board enclosing the first open end of the lens unit, the second open end of the lens unit being exposed from the outer casing.
  • circuit board is electrically connected to the circuit board switching unit.
  • the circuit board switching unit includes an adapter board and a plurality of first electronic components
  • the adapter board includes a first surface and a second surface opposite to each other
  • the plurality of first electronic components are electrically disposed at the first A surface of the circuit board is plugged onto the first surface.
  • a male connector is disposed on the circuit board, and the first surface is provided with a female connector, and the male connector is inserted into the female connector;
  • the circuit board is provided with a female connector, and the first surface is provided with a male connector, and the male connector is inserted into the female connector.
  • the first thermally conductive filler covers the plurality of first electronic components.
  • the heat sink is disposed on the second surface and is in contact with the outer casing
  • the circuit board switching unit further includes a plurality of second electronic components, the plurality of second electronic components are electrically disposed on the second surface,
  • the second thermally conductive filler completely covers the plurality of second electronic components.
  • the heat sink includes a heat dissipation body and a plurality of heat dissipation fins extending outward from the heat dissipation body, the heat dissipation body is disposed on the second surface, and the plurality of heat dissipation fins are located at a distance of the heat dissipation body away from the second surface On the side, the plurality of fins are spaced apart from each other.
  • the housing includes a first housing and a second housing, and the first housing is coupled to the second housing and encloses the camera module, the circuit board switching unit, and the heat sink. Containment space.
  • the first housing includes a connecting portion and a receiving portion extending outward from the connecting portion, the connecting portion is connected to the second housing to form the receiving space, and the lens unit is received in the receiving portion, the lens
  • the side wall of the unit corresponds to the side wall of the receiving portion.
  • the accommodating portion is provided with an optical opening, the second open end is aligned with the optical opening, and an inner wall of the second housing extends inwardly with a flange, and the heat sink is carried on the flange.
  • first housing and the second housing are coupled together by screwing, snapping, or gluing.
  • the image capturing module further includes a heat conducting sheet attached to the camera module and located between the camera module and the outer casing, and the opposite sides of the first heat conductive filler respectively The chip is in contact with the circuit board switching unit.
  • the heat conductive sheet is made of a metal material.
  • the thermally conductive sheet is made of a thermally conductive gold foil, a thermally conductive silver foil, a thermally conductive aluminum foil, or a thermally conductive copper foil.
  • thermally conductive sheet is made of a non-metallic material.
  • the thermally conductive sheet is made of a thermally conductive silicone sheet or a thermally conductive graphite sheet.
  • the first heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • the camera module includes a carrying surface circuit board, an image sensor carried on the circuit board and electrically connected to the circuit board, and a lens module carried on the circuit board and accommodating the image sensor.
  • the circuit board includes a bearing surface carrying the image sensor and a connecting surface opposite to the bearing surface
  • the lens module includes a lens unit for receiving the lens and having both ends open
  • the circuit board closes the first opening of the lens unit The second open end of the lens unit is exposed from the outer casing, and the heat conducting sheet extends from the connecting surface to the side wall of the lens unit.
  • the lens unit includes a plurality of sidewalls, and the heat conducting sheet extends from the connecting surface to at least one sidewall of the lens unit.
  • the lens unit includes a cylindrical side wall from which the heat conducting sheet extends to a cylindrical side wall of the lens unit.
  • thermal conductive sheet on the side wall of the lens unit is in direct contact with the outer casing.
  • a thermal pad located on a sidewall of the lens unit is in indirect contact with the outer casing.
  • a heat conducting sheet located on a sidewall of the lens unit is spaced apart from the outer casing.
  • circuit board is electrically connected to the circuit board switching unit.
  • the circuit board switching unit includes an adapter board and a plurality of first electronic components
  • the adapter board includes a first surface and a second surface opposite to each other
  • the plurality of first electronic components are electrically disposed at the first A surface of the circuit board is plugged onto the first surface.
  • a male connector is disposed on the circuit board, and the first surface is provided with a female connector, and the male connector is inserted into the female connector;
  • the circuit board is provided with a female connector, and the first surface is provided with a male connector, and the male connector is inserted into the female connector.
  • the first thermally conductive filler covers the plurality of first electronic components.
  • the image capturing module further includes a heat sink disposed on the second surface and in contact with the outer casing, and the second heat conductive filler is filled between the heat sink and the second surface.
  • the second heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • the circuit board switching unit further includes a plurality of second electronic components electrically disposed on the second surface, the second thermal conductive filler completely covering the plurality of second electronic components .
  • the heat sink includes a heat dissipation body and a plurality of heat dissipation fins extending outward from the heat dissipation body, the heat dissipation body is disposed on the second surface, and the plurality of heat dissipation fins are located at a distance of the heat dissipation body away from the second surface On the side, the plurality of fins are spaced apart from each other.
  • the housing includes a first housing and a second housing, and the first housing is coupled to the second housing and encloses the camera module, the circuit board switching unit, and the heat sink. Containment space.
  • the first housing includes a connecting portion and a receiving portion extending outward from the connecting portion, the connecting portion is connected to the second housing to form the receiving space, and the lens unit is received in the receiving portion, the lens unit
  • the side wall corresponds to the side wall of the receiving portion.
  • the accommodating portion is provided with an optical opening, the second open end is aligned with the optical opening, and an inner wall of the second housing extends inwardly with a flange, and the plurality of fins are carried on the flange .
  • first housing and the second housing are coupled together by screwing, snapping, or gluing.
  • An aerial vehicle includes an aircraft and an image capturing module mounted on the aircraft.
  • the image capture module includes a thermally conductive housing, a camera module, a circuit board switching unit, and a first thermally conductive filler.
  • the camera module and the circuit board switching unit are both housed in the housing.
  • the camera module is electrically disposed on the circuit board switching unit.
  • the first thermally conductive filler is filled between the camera module and the circuit board switching unit to conduct heat generated by the camera module to the housing via the circuit board switching unit.
  • the first heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • the image capturing module further includes a heat sink disposed on a side of the circuit board switching unit opposite to the camera module and in contact with the housing, the heat sink and the circuit board switching unit A second thermally conductive filler is filled between them.
  • the second heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • the camera module includes a circuit board, an image sensor carried on the circuit board and electrically connected to the circuit board, and a lens module carried on the circuit board and accommodating the image sensor, the lens module
  • the module includes a lens unit for receiving the lens and having both ends open, the circuit board enclosing the first open end of the lens unit, the second open end of the lens unit being exposed from the outer casing.
  • circuit board is electrically connected to the circuit board switching unit.
  • the circuit board switching unit includes an adapter board and a plurality of first electronic components
  • the adapter board includes a first surface and a second surface opposite to each other
  • the plurality of first electronic components are electrically disposed at the first A surface of the circuit board is plugged onto the first surface.
  • a male connector is disposed on the circuit board, and the first surface is provided with a female connector, and the male connector is inserted into the female connector;
  • the circuit board is provided with a female connector, and the first surface is provided with a male connector, and the male connector is inserted into the female connector.
  • the first thermally conductive filler covers the plurality of first electronic components.
  • the heat sink is disposed on the second surface and is in contact with the outer casing
  • the circuit board switching unit further includes a plurality of second electronic components, the plurality of second electronic components are electrically disposed on the second surface,
  • the second thermally conductive filler completely covers the plurality of second electronic components.
  • the heat sink includes a heat dissipation body and a plurality of heat dissipation fins extending outward from the heat dissipation body, the heat dissipation body is disposed on the second surface, and the plurality of heat dissipation fins are located at a distance of the heat dissipation body away from the second surface On the side, the plurality of fins are spaced apart from each other.
  • the housing includes a first housing and a second housing, and the first housing is coupled to the second housing and encloses the camera module, the circuit board switching unit, and the heat sink. Containment space.
  • the first housing includes a connecting portion and a receiving portion extending outward from the connecting portion, the connecting portion is connected to the second housing to form the receiving space, and the lens unit is received in the receiving portion, the lens
  • the side wall of the unit corresponds to the side wall of the receiving portion.
  • the accommodating portion is provided with an optical opening, the second open end is aligned with the optical opening, and an inner wall of the second housing extends inwardly with a flange, and the heat sink is carried on the flange.
  • first housing and the second housing are coupled together by screwing, snapping, or gluing.
  • the image capturing module further includes a heat conducting sheet attached to the camera module and located between the camera module and the outer casing, and the opposite sides of the first heat conductive filler respectively The chip is in contact with the circuit board switching unit.
  • the heat conductive sheet is made of a metal material.
  • the thermally conductive sheet is made of a thermally conductive gold foil, a thermally conductive silver foil, a thermally conductive aluminum foil, or a thermally conductive copper foil.
  • thermally conductive sheet is made of a non-metallic material.
  • the thermally conductive sheet is made of a thermally conductive silicone sheet or a thermally conductive graphite sheet.
  • the first heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • the camera module includes a carrying surface circuit board, an image sensor carried on the circuit board and electrically connected to the circuit board, and a lens module carried on the circuit board and accommodating the image sensor.
  • the circuit board includes a bearing surface carrying the image sensor and a connecting surface opposite to the bearing surface
  • the lens module includes a lens unit for receiving the lens and having both ends open
  • the circuit board closes the first opening of the lens unit The second open end of the lens unit is exposed from the outer casing, and the heat conducting sheet extends from the connecting surface to the side wall of the lens unit.
  • the lens unit includes a plurality of sidewalls, and the heat conducting sheet extends from the connecting surface to at least one sidewall of the lens unit.
  • the lens unit includes a cylindrical side wall from which the heat conducting sheet extends to a cylindrical side wall of the lens unit.
  • thermal conductive sheet on the side wall of the lens unit is in direct contact with the outer casing.
  • a thermal pad located on a sidewall of the lens unit is in indirect contact with the outer casing.
  • a heat conducting sheet located on a sidewall of the lens unit is spaced apart from the outer casing.
  • circuit board is electrically connected to the circuit board switching unit.
  • the circuit board switching unit includes an adapter board and a plurality of first electronic components
  • the adapter board includes a first surface and a second surface opposite to each other
  • the plurality of first electronic components are electrically disposed at the first A surface of the circuit board is plugged onto the first surface.
  • a male connector is disposed on the circuit board, and the first surface is provided with a female connector, and the male connector is inserted into the female connector;
  • the circuit board is provided with a female connector, and the first surface is provided with a male connector, and the male connector is inserted into the female connector.
  • the first thermally conductive filler covers the plurality of first electronic components.
  • the image capturing module further includes a heat sink disposed on the second surface and in contact with the outer casing, and the second heat conductive filler is filled between the heat sink and the second surface.
  • the second heat conductive filler is a thermal conductive clay or a thermal conductive paste.
  • the circuit board switching unit further includes a plurality of second electronic components electrically disposed on the second surface, the second thermal conductive filler completely covering the plurality of second electronic components .
  • the heat sink includes a heat dissipation body and a plurality of heat dissipation fins extending outward from the heat dissipation body, the heat dissipation body is disposed on the second surface, and the plurality of heat dissipation fins are located at a distance of the heat dissipation body away from the second surface On the side, the plurality of fins are spaced apart from each other.
  • the housing includes a first housing and a second housing, and the first housing is coupled to the second housing and encloses the camera module, the circuit board switching unit, and the heat sink. Containment space.
  • the first housing includes a connecting portion and a receiving portion extending outward from the connecting portion, the connecting portion is connected to the second housing to form the receiving space, and the lens unit is received in the receiving portion, the lens unit
  • the sidewall of the lens unit corresponds to the sidewall of the receiving portion, and the sidewall of the lens unit is connected to the sidewall of the receiving portion through the heat conducting sheet.
  • the accommodating portion is provided with an optical opening, the second open end is aligned with the optical opening, and an inner wall of the second housing extends inwardly with a flange, and the plurality of fins are carried on the flange .
  • first housing and the second housing are coupled together by screwing, snapping, or gluing.
  • the image capturing module and the aerial vehicle provided by the invention are attached to the camera module by the thermal conductive sheet and located between the camera module and the heat conducting housing, so as to effectively transfer the heat generated by the camera module to the heat conducting housing.
  • FIG. 1 is a schematic perspective view of an image capturing module according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the image capturing module of FIG. 1.
  • FIG. 3 is an exploded perspective view of another view of the image capture module of FIG. 1.
  • FIG. 4 is a perspective view of the lens module of the image capturing module of FIG. 1.
  • FIG. 5 is a cross-sectional view of the image capturing module of FIG. 1 taken along line V-V.
  • an image capturing module 100 is an aerial imaging device, which is usually mounted on an aircraft (not shown) through a pan/tilt (not shown) to form an aerial vehicle, and can The aerial photography operation is performed by remote control. Further, the image capturing module 100 can wirelessly transmit the captured image to a ground receiving device (not shown).
  • the image capturing module 100 includes a housing 10, a camera module 20, a heat conducting sheet 30, a circuit board switching unit 40, a first heat conductive filler 50, a heat sink 60, and a second Thermally conductive filler 70.
  • the outer casing 10 is made of a thermally conductive material and includes a first casing 12 and a second casing 14.
  • the first housing 12 is connected to the second housing 14 and is configured to receive the camera module 20 , the thermal conductive sheet 30 , the circuit board switching unit 40 , the first thermal conductive filler 50 , and the heat sink 60 .
  • a receiving space 120 of the second heat conductive filler 70 may be a metal such as copper, aluminum or the like, or may be a non-metal such as carbon fiber or the like.
  • the first housing 12 includes a connecting portion 122 and a receiving portion 124 extending outward from the connecting portion 122 .
  • the connecting portion 122 is connected to the second housing 14 to form the receiving space 120.
  • the accommodating portion 124 communicates with the connecting portion 122.
  • the accommodating portion 124 has a cubic structure and includes four side walls 1240 and a top wall 1242 connected to the four side walls 1240.
  • the top wall 1242 is provided with an inlet port 1244.
  • the inner wall of the second housing 14 has a flange 142 extending inwardly.
  • the first housing 12 and the second housing 14 are coupled together by a snap fit.
  • the flange 142 is a continuous annular structure, such as a continuous toroidal structure.
  • first housing 12 and the second housing 14 can also be connected together by screwing, gluing, or welding.
  • the flange 142 may also be a four-sided annular shape, or a ring of other shapes, or alternatively, the flange 142 may be a discontinuous structure, such as an intermediate discontinuous annular structure.
  • the accommodating portion 124 is not limited to the cubic structure in the embodiment, and may also be a cylindrical structure. In this case, the accommodating portion 124 includes only one cylindrical side wall.
  • the camera module 20 includes a circuit board 22, an image sensor 24, and a lens module 26.
  • the circuit board 22 includes a bearing surface 222 and a connecting surface 224 opposite the bearing surface 222.
  • the image sensor 24 is carried on the carrying surface 222 and electrically connected to the circuit board 22 .
  • the lens module 26 is carried on the carrying surface 222 and houses the image sensor 24 .
  • the lens module 26 includes a lens unit 262 and a filter 264 for accommodating a lens (not shown) and having both ends open.
  • the lens unit 262 is a lens barrel having a cubic structure, and includes four side walls 2622, a first open end 2624, and a second open end 2626. The lens unit 262 is received in the accommodating portion 124.
  • the four side walls 2622 of the lens unit 262 are aligned with the four side walls 1240 of the accommodating portion 124.
  • the second open end 2626 and the light entrance 1244 are aligned. alignment.
  • the filter 264 is housed in the lens unit 262.
  • the circuit board 22 encloses the first open end 2624.
  • a male connector 226 is disposed on the connecting surface 224 of the circuit board 22.
  • the heat conducting sheet 30 is attached to the camera module 20 and located between the camera module 20 and the outer casing 10 to conduct heat generated by the camera module 20 to the outer casing 10. Specifically, please refer to FIG. 2 and FIG. 5 , the heat conducting sheet 30 extends from the connecting surface 224 of the circuit board 22 to the two side walls 2622 of the lens unit 262 , and is located on two sidewalls of the lens unit 262 . The heat conducting sheet 30 on the 2622 is in direct contact with the two side walls 1240 of the receiving portion 124.
  • the heat conductive sheet 30 is made of a metal material such as a heat conductive gold foil, a heat conductive silver foil, a heat conductive aluminum foil, or a heat conductive copper foil.
  • the thermally conductive sheet 30 is made of a thermally conductive copper foil.
  • the heat generated by the image sensor 24 is first conducted to the circuit board 22, and then conducted to the sidewall 1240 of the first housing 12 through the heat conductive sheet 30, and finally The first housing 12 is dissipated, thus forming a first heat dissipation path of the camera module 20.
  • the heat conductive sheet 30 is not limited to being made of a metal material in the embodiment, and the heat conductive sheet 30 may also be made of a non-metal material, for example, a heat conductive silicone sheet or a heat conductive graphite sheet.
  • the heat conductive sheet 30 is not limited to the two side walls 2622 of the lens unit 262 extending from the connecting surface 224 of the circuit board 22 in the embodiment, and is thermally conductive on the two side walls 2622 of the lens unit 262.
  • the sheet 30 is in direct contact with the two side walls 1240 of the receiving portion 124.
  • the heat conducting sheet 30 located on the two side walls 2622 of the lens unit 262 can also pass through other heat conducting medium and the receiving portion 124.
  • the two side walls 1240 are in indirect contact, or the two are neither in direct contact nor indirect contact, but are spaced apart by a certain distance and maintain a relative relationship.
  • the heat conducting sheet 30 located on one of the side walls 2622 of the lens unit 262 may be in direct contact with the corresponding side wall 1240 and located on the other side wall 2622 of the lens unit 262.
  • the thermally conductive sheet 30 is in indirect contact with the corresponding sidewall 1240 by other thermally conductive media.
  • the thermal conductive sheet 30 on one of the side walls 2622 of the lens unit 262 is in direct contact with the corresponding side wall 1240, and the thermal conductive sheet 30 on the other side wall 2622 of the lens unit 262 and the corresponding side wall 1240. interval.
  • the heat conductive sheet 30 on one of the side walls 2622 of the lens unit 262 is in indirect contact with the corresponding side wall 1240 through another heat conductive medium, and the heat conductive sheet 30 on the other side wall 2622 of the lens unit 262 corresponds to The side walls 1240 are spaced apart.
  • the heat conducting sheet 30 is not limited to the two side walls 2622 extending to the lens unit 262 in the embodiment, and the heat conducting sheet 30 may extend only to one side wall 2622 of the lens unit 262.
  • the heat conducting sheets 30 on the one side wall 2622 and the corresponding side walls 1240 of the receiving portion 124 may be in direct contact, indirect contact, or may be spaced apart from each other.
  • the heat conducting sheet 30 extends to the three side walls 2622 and even the four side walls 2622 of the lens unit 262.
  • the heat conducting sheet 30 on each side wall 2622 can be in direct contact with the corresponding side wall 1240. Contact can also be spaced apart from each other.
  • the heat conducting sheet 30 preferably extends to the plurality of side walls 2622 of the lens unit 262 at the same time, and the heat conducting sheets 30 on each of the side walls 2622 are in direct contact with the corresponding side walls 1240.
  • the heat conducting sheet 30 is not limited to extend from the connecting surface 224 of the circuit board 22 in the embodiment, and may extend from any surface of the circuit board 22.
  • the heat conducting sheet 30 may also be from the bearing surface. 222, or extending from the side of the connecting surface 222 and the connecting surface 224, only the heat conducting sheet 30 can be simultaneously contacted with the circuit board 22 and the side wall 2622 of the lens unit 262, and located in the lens unit 262.
  • the heat conducting sheet 30 on the side wall 2622 can in turn be in contact with the first housing 12.
  • the lens unit 262 can also be a cylindrical barrel having a cylindrical structure, and the lens unit 262 is received in the accommodating portion 124.
  • the lens unit 262 is included in the accommodating portion 124.
  • the cylindrical side wall corresponds to the cylindrical side wall of the receiving portion 124.
  • the heat conducting sheet 30 extends from the connecting surface 224 of the circuit board 22 to the cylindrical side wall of the lens unit 262, and the heat conducting sheet 30 on the cylindrical side wall of the lens unit 262 and the receiving portion 124 The cylindrical side wall is in contact.
  • the circuit board switching unit 40 is electrically connected to the camera module 20 and supplies power to the camera module 20.
  • the circuit board switching unit 40 includes an interposer 42 , a plurality of first electronic components 44 , and a plurality of second electronic components 46 .
  • the adapter plate 42 includes opposing first and second surfaces 422, 424.
  • the plurality of first electronic components 44 are electrically disposed on the first surface 422
  • the plurality of second electronic components 46 are electrically disposed on the second surface 424 .
  • a female connector 426 is disposed on the first surface 422.
  • the male connector 226 is inserted into the female connector 426 such that the circuit board 22 is plugged with the circuit board switching unit 40.
  • the male connector 226 is a plug
  • the female connector 426 is a socket.
  • the plurality of first electronic components 44 and the plurality of second electronic components 46 may include, but are not limited to, a shadow image processing module, an image transmission module, a power module, a control module, and the like.
  • the positional arrangement of the male connector 226 and the female connector 426 is not limited to the embodiment, and the positions of the two can be interchanged.
  • the male connector is disposed on the first surface 422, and the female connector is disposed on the connecting surface 224 of the circuit board 22.
  • the male connector 226 is not limited to the plug in the present embodiment, and the female connector 426 is not limited to the socket in the present embodiment, and may be another plug-in structure.
  • the first thermally conductive filler 50 is filled between the circuit board 22 and the circuit board switching unit 40. Specifically, the first thermal conductive filler 50 is filled between the thermal conductive sheet 30 on the connecting surface 224 and the first surface 422, and covers the plurality of first electronic components 44. In other words, the opposite sides of the first heat conductive filler 50 are in contact with the heat conductive sheet 30 and the first surface 422, respectively. It can be understood that when the heat conducting sheet 30 extends from the side connecting the bearing surface 222 and the connecting surface 224, the opposite sides of the first heat conductive filler 50 directly contact the connecting surface 224 and the first surface 422.
  • the first thermally conductive filler 50 can be a thermally conductive clay or a thermally conductive paste. In this embodiment, the first heat conductive filler 50 is a heat conductive clay.
  • the heat sink 60 is made of an aluminum alloy and is disposed on the second surface 424 and in contact with the outer casing 10. Specifically, the heat sink 60 includes a heat dissipation body 62 and a plurality of fins 64 extending outward from the heat dissipation body 62 .
  • the heat dissipation body 62 is disposed on the second surface 424.
  • the plurality of fins 64 are in the form of elongated strips and are arranged in parallel with each other at a side of the heat dissipating body 62 away from the second surface 424.
  • the plurality of fins 64 are wholly or partially carried on the flange 142.
  • the heat sink 64 is not limited to the long strip shape in the embodiment, and may be an annular structure surrounded by layers, or a columnar structure arranged in a discrete arrangement or a regular arrangement.
  • the cross section of the columnar structure It can be a regular or irregular shape such as a circle, a triangle, a rectangle, a square, or the like.
  • the heat sink 64 is not limited to the aluminum alloy material in the present embodiment, and may be another alloy material such as a copper alloy.
  • the second thermally conductive filler 70 is filled between the heat sink 60 and the second surface 424. Specifically, the second thermally conductive filler 70 is filled between the heat dissipation body 62 and the second surface 424 and completely covers the plurality of second electronic components 46. In other words, the opposite sides of the second heat conductive filler 70 are in contact with the heat dissipation body 62 and the second surface 424, respectively.
  • the second thermally conductive filler 70 can be a thermally conductive clay or a thermal paste. In the embodiment, the second heat conductive filler 70 is a heat conductive clay.
  • the image sensor 24 or other components in the camera module 20 When the camera module 20 is in operation, the image sensor 24 or other components in the camera module 20 generate heat sequentially through the circuit board 22, the thermal pad 30, the first thermal pad 50, and the circuit board.
  • the adapter unit 40, the second heat conductive filler 70, and the heat sink 60 are conducted to the second housing 14 and finally dispersed from the heat sink 60 and the second housing 14, thus forming the camera.
  • the second heat dissipation channel of the module 20 During this process, the heat generated by the circuit board switching unit 40 itself is also conducted to the heat sink 60 through the second heat conductive filler 70, and is dispersed by the heat sink 60 and the second housing 14.
  • the heat sink 60 is connected to the second casing 14, and the heat dissipation area is increased by the second casing 14, thereby further improving the heat dissipation efficiency.
  • the arrangement of the first heat dissipation channel can improve the heat dissipation efficiency of the camera module 20. After the second heat dissipation channel is added, the heat dissipation efficiency of the camera module 20 is improved by half compared with the heat dissipation efficiency when only the first heat dissipation channel is disposed.
  • the first heat conductive filler 50 covers the plurality of first electronic components 44
  • the second heat conductive filler 70 completely covers the plurality of second electronic components 46
  • the plurality of first electronic components 44 and The plurality of second electronic components 46 achieve the effect of immersion heat dissipation, and the heat dissipation efficiency of the circuit board switching unit 40 can be further improved.
  • the image capturing module 100 provided by the present invention is attached to the camera module 20 by the thermal conductive sheet 30 and located between the camera module 20 and the heat conducting housing 10, thereby effectively transferring the heat generated by the camera module 20 to the heat conducting housing 10. go with.
  • the heat generated by the camera module 20 can be sequentially conducted through the circuit board 22, the heat conductive sheet 30, the first heat conductive filler 50, the circuit board switching unit 40, the second heat conductive filler 70, and the heat sink 60 to reach the second housing.
  • the heat dissipation efficiency of the camera module 20 is further improved by dissipating from the heat sink 60 and the second casing 14.
  • first heat conductive filler 50 covers the plurality of first electronic components 44
  • second heat conductive filler 70 completely covers the plurality of second electronic components 46
  • the plurality of first electronic components 44 and the plurality of second electronic components The 46 has the effect of immersing heat dissipation, and further improves the overall heat dissipation efficiency of the image capturing module 100.
  • the heat conductive sheet 30 can also be omitted.
  • the image sensor 24 or other components in the camera module 20 generate heat sequentially through the circuit board 22, the first heat conduction.
  • the filler 50, the circuit board switching unit 40, the second heat conductive filler 70, and the heat sink 60 are conducted to reach the second housing 14, and finally from the heat sink 60 and the second housing 14. Scattered.
  • the heat sink 60 may be omitted.
  • the side of the circuit board switching unit 40 is in direct contact with the inner wall of the outer casing 10 or through other heat conductive medium (including the second heat conductive filler in the present invention).
  • the bottom surface of the circuit board adapter unit 40 is in direct contact with the flange 142 or through other thermally conductive medium (including the second thermally conductive filler 70 of the present invention) Indirect contact to dissipate heat to the outer casing 10; or alternatively, the side of the circuit board adapter unit 40 is in direct contact with the inner wall of the outer casing 10 or through other thermally conductive medium (including the second thermally conductive filler 70 of the present invention) Indirect contact, while the bottom surface of the circuit board switching unit 40 is in direct contact with the flange 142 or indirectly through other heat conducting medium to dissipate heat to the outer casing 10; or the circuit board switching unit 40 and the The outer casings 10 are neither in direct contact nor indirect contact, and only a portion of them are opposed to each other, so that heat transferred through the circuit board switching unit 40 can also be dissipated to the outer casing 10.
  • the heat conductive sheet including the second thermally conductive filler 70 of the present invention

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Abstract

一种影像撷取模组(100)，以及具有该影像撷取模组(100)的航拍飞行器，所述影像撷取模组(100)包括导热外壳(10)、相机模块(20)、电路板转接单元(40)以及导热片(30)，该相机模块(20)及该电路板转接单元(40)均收容在该外壳(10)内，该电路板转接单元(40)与该相机模块(20)电性连接，该导热片(30)贴覆在该相机模块(20)上并位于该相机模块(20)与该外壳(10)之间以将该相机模块(20)产生的热量传导至该外壳(10)上。

Description

影像撷取模组及航拍飞行器 技术领域
本发明涉及影像摄取领域，尤其涉及一种用于空中拍摄的影像撷取模组及具有该影像撷取模组的航拍飞行器。
背景技术
影像撷取模组，例如搭载在无人机上的相机、摄像机、或监控摄像头等终端装置，又或者是设置在这些终端装置中用于获取影像的单元等，通常包括镜头模块及与该镜头模块相连的电路板。电路板上一般会设置有用于实现不同功能的多个功能模块，例如：影像感测模块、光电转换模块、图像处理模块、图像传输模块、电源模块、以及控制模块等。
随着影像撷取模组越来越向紧凑型、小型化的方向发展，前述的这些功能模块的集成化程度也越来越高，换言之，这些功能模块需要整合在影像撷取模组的较小且密闭的空间内。在此种情况下，功能模块产生的热量往往难以有效地散去，如果热量累积到一定程度，将影响这些功能模块的性能，进而影响影像撷取模组的整体性能，严重时会导致影像撷取模组损坏。相应地，搭载有该影像撷取模组的航拍飞行器的拍摄性能也会受到影响。
发明内容
有鉴于此，有必要提供一种能够有效散热的影像撷取模组及具有该影像撷取模组的航拍飞行器。
一种影像撷取模组，包括导热外壳、相机模块、电路板转接单元以及导热片。该相机模块及该电路板转接单元均收容在该外壳内，该电路板转接单元与该相机模块电性连接。该导热片贴覆在该相机模块上并位于该相机模块与该外壳之间以将该相机模块产生的热量传导至该外壳上。
进一步地，该相机模块包括电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露，该导热片自该电路板延伸至该镜头单元的侧壁。
进一步地，该镜头单元包括多个侧壁，该导热片自该电路板的任意一个表面延伸至该镜头单元的至少一个侧壁上。
进一步地，该镜头单元包括圆柱形侧壁，该导热片自该电路板的任意一个表面延伸至该镜头单元的圆柱形侧壁上。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳直接接触。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳间接接触。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳间隔相对。
进一步地，该导热片由金属材料制成。
进一步地，该导热片由导热金箔、导热银箔、导热铝箔、或导热铜箔制成。
进一步地，该导热片由非金属材料制成。
进一步地，该导热片由导热硅胶片或导热石墨片制成。
进一步地，该电路板与该电路板转接单元电性插接在一起，该电路板与该电路板转接单元之间填充有第一导热填充物。
进一步地，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
进一步地，该第一导热填充物为导热黏土或导热膏。
进一步地，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
进一步地，该第一导热填充物包覆该多个第一电子元件。
进一步地，该影像撷取模组还包括散热器，该散热器设置在该第二表面并与该外壳接触，该散热器与该第二表面之间填充有第二导热填充物。
进一步地，该第二导热填充物为导热黏土或导热膏。
进一步地，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
进一步地，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
进一步地，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
进一步地，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应。
进一步地，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该多个散热片承载在该凸缘上。
进一步地，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
一种航拍飞行器，包括飞行器以及搭载在该飞行器上的影像撷取模组。该影像撷取模包括导热外壳、相机模块、电路板转接单元、以及导热片。该相机模块及该电路板转接单元均收容在该外壳内。该电路板转接单元与该相机模块电性连接。该导热片贴覆在该相机模块上并位于该相机模块与该外壳之间以将该相机模块产生的热量传导至该外壳上。
进一步地，该影像撷取模组通过云台搭载在该飞行器上。
进一步地，该相机模块包括电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露，该导热片自该电路板延伸至该镜头单元的侧壁。
进一步地，该镜头单元包括多个侧壁，该导热片自该电路板的任意一个表面延伸至该镜头单元的至少一个侧壁上。
进一步地，该镜头单元包括圆柱形侧壁，该导热片自该电路板的任意一个表面延伸至该镜头单元的圆柱形侧壁上。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳直接接触。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳间接接触。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳间隔相对。
进一步地，该导热片由金属材料制成。
进一步地，该导热片由导热金箔、导热银箔、导热铝箔、或导热铜箔制成。
进一步地，该导热片由非金属材料制成。
进一步地，该导热片由导热硅胶片或导热石墨片制成。
进一步地，该电路板与该电路板转接单元电性插接在一起，该电路板与该电路板转接单元之间填充有第一导热填充物。
进一步地，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
进一步地，该第一导热填充物为导热黏土或导热膏。
进一步地，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
进一步地，该第一导热填充物包覆该多个第一电子元件。
进一步地，该影像撷取模组还包括散热器，该散热器设置在该第二表面并与该外壳接触，该散热器与该第二表面之间填充有第二导热填充物。
进一步地，该第二导热填充物为导热黏土或导热膏。
进一步地，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
进一步地，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
进一步地，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
进一步地，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接以形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应。
进一步地，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该多个散热片承载在该凸缘上。
进一步地，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
一种影像撷取模组，包括导热外壳、相机模块、电路板转接单元、以及第一导热填充物。该相机模块及该电路板转接单元均收容在该外壳内。该相机模块电性设置在该电路板转接单元上。该第一导热填充物填充在该相机模块与该电路板转接单元之间以将该相机模块产生的热量经该电路板转接单元传导至该外壳上。
进一步地，该第一导热填充物为导热黏土或导热膏。
进一步地，该影像撷取模组还包括散热器，该散热器设置在该电路板转接单元与该相机模块相背的一侧并与该外壳接触，该散热器与该电路板转接单元之间填充有第二导热填充物。
进一步地，该第二导热填充物为导热黏土或导热膏。
进一步地，该相机模块包括电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露。
进一步地，该电路板电性插接在该电路板转接单元上。
进一步地，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
进一步地，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
进一步地，该第一导热填充物包覆该多个第一电子元件。
进一步地，该散热器设置在该第二表面并与该外壳接触，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
进一步地，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
进一步地，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
进一步地，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接以形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应。
进一步地，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该散热器承载在该凸缘上。
进一步地，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
进一步地，该影像撷取模组还包括导热片，该导热片贴覆在该相机模块上并位于该相机模块与该外壳之间，该第一导热填充物的相背两侧分别与该导热片及该电路板转接单元接触。
进一步地，该导热片由金属材料制成。
进一步地，该导热片由导热金箔、导热银箔、导热铝箔、或导热铜箔制成。
进一步地，该导热片由非金属材料制成。
进一步地，该导热片由导热硅胶片或导热石墨片制成。
进一步地，该第一导热填充物为导热黏土或导热膏。
进一步地，该相机模块包括承载面电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该电路板包括承载该影像感测器的承载面及与该承载面相背的连接面，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露，该导热片自该连接面延伸至该镜头单元的侧壁。
进一步地，该镜头单元包括多个侧壁，该导热片自该连接面延伸至该镜头单元的至少一个侧壁上。
进一步地，该镜头单元包括圆柱形侧壁，该导热片自该连接面延伸至该镜头单元的圆柱形侧壁上。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳直接接触。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳间接接触。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳间隔相对。
进一步地，该电路板与该电路板转接单元电性插接在一起。
进一步地，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
进一步地，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
进一步地，该第一导热填充物包覆该多个第一电子元件。
进一步地，该影像撷取模组还包括散热器，该散热器设置在该第二表面并与该外壳接触，该散热器与该第二表面之间填充有第二导热填充物。
进一步地，该第二导热填充物为导热黏土或导热膏。
进一步地，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
进一步地，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
进一步地，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
进一步地，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应。
进一步地，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该多个散热片承载在该凸缘上。
进一步地，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
一种航拍飞行器，包括飞行器以及搭载在该飞行器上的影像撷取模组。该影像撷取模组包括导热外壳、相机模块、电路板转接单元、以及第一导热填充物。该相机模块及该电路板转接单元均收容在该外壳内。该相机模块电性设置在该电路板转接单元上。该第一导热填充物填充在该相机模块与该电路板转接单元之间以将该相机模块产生的热量经该电路板转接单元传导至该外壳上。
进一步地，该第一导热填充物为导热黏土或导热膏。
进一步地，该影像撷取模组还包括散热器，该散热器设置在该电路板转接单元与该相机模块相背的一侧并与该外壳接触，该散热器与该电路板转接单元之间填充有第二导热填充物。
进一步地，该第二导热填充物为导热黏土或导热膏。
进一步地，该相机模块包括电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露。
进一步地，该电路板电性插接在该电路板转接单元上。
进一步地，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
进一步地，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
进一步地，该第一导热填充物包覆该多个第一电子元件。
进一步地，该散热器设置在该第二表面并与该外壳接触，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
进一步地，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
进一步地，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
进一步地，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接以形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应。
进一步地，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该散热器承载在该凸缘上。
进一步地，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
进一步地，该影像撷取模组还包括导热片，该导热片贴覆在该相机模块上并位于该相机模块与该外壳之间，该第一导热填充物的相背两侧分别与该导热片及该电路板转接单元接触。
进一步地，该导热片由金属材料制成。
进一步地，该导热片由导热金箔、导热银箔、导热铝箔、或导热铜箔制成。
进一步地，该导热片由非金属材料制成。
进一步地，该导热片由导热硅胶片或导热石墨片制成。
进一步地，该第一导热填充物为导热黏土或导热膏。
进一步地，该相机模块包括承载面电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该电路板包括承载该影像感测器的承载面及与该承载面相背的连接面，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露，该导热片自该连接面延伸至该镜头单元的侧壁。
进一步地，该镜头单元包括多个侧壁，该导热片自该连接面延伸至该镜头单元的至少一个侧壁上。
进一步地，该镜头单元包括圆柱形侧壁，该导热片自该连接面延伸至该镜头单元的圆柱形侧壁上。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳直接接触。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳间接接触。
进一步地，位于该镜头单元的侧壁上的导热片与该外壳间隔相对。
进一步地，该电路板与该电路板转接单元电性插接在一起。
进一步地，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
进一步地，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
进一步地，该第一导热填充物包覆该多个第一电子元件。
进一步地，该影像撷取模组还包括散热器，该散热器设置在该第二表面并与该外壳接触，该散热器与该第二表面之间填充有第二导热填充物。
进一步地，该第二导热填充物为导热黏土或导热膏。
进一步地，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
进一步地，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
进一步地，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
进一步地，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应，该镜头单元的侧壁通过该导热片与该收容部的侧壁连接。
进一步地，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该多个散热片承载在该凸缘上。
进一步地，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
本发明提供的影像撷取模组及航拍飞行器利用导热片贴覆在相机模块上并位于该相机模块与导热外壳之间，从而有效将相机模块产生的热量传导至导热外壳上散去。
 附图说明
图1是本发明一实施方式提供的影像撷取模组的立体组装示意图。
图2是图1中的影像撷取模组的分解示意图。
图3是图1中的影像撷取模组的另一视角的分解示意图。
图4是图1中的影像撷取模组的镜头模块的立体示意图。
图5是图1中的影像撷取模组沿线V-V的剖面示意图。
主要元件符号说明
影像撷取模组 100
外壳 10
第一壳体 12
收容空间 120
连接部 122
收容部 124
侧壁 1240
顶壁 1242
进光口 1244
第二壳体 14
凸缘 142
相机模块 20
电路板 22
承载面 222
连接面 224
公连接器 226
影像感测器 24
镜头模块 26
镜头单元 262
侧壁 2622
第一开放端 2624
第二开放端 2626
滤光片 264
导热片 30
电路板转接单元 40
转接板 42
第一表面 422
第二表面 424
母连接器 426
第一电子元件 44
第二电子元件 46
第一导热填充物 50
散热器 60
散热本体 62
散热片 64
第二导热填充物 70
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明一实施方式提供的影像撷取模组100为航拍用摄像装置，其通常通过云台(图未示)搭载在飞行器(图未示)上而组成航拍飞行器，并能够以遥控方式被操纵进行航拍作业。进一步地，该影像撷取模组100能够以无线方式传送所拍摄的影像至地面接收装置(图未示)。
请一并参阅图1及图2，该影像撷取模组100包括外壳10、相机模块20、导热片30、电路板转接单元40、第一导热填充物50、散热器60、以及第二导热填充物70。
该外壳10由导热材料制成，包括第一壳体12及第二壳体14。该第一壳体12与该第二壳体14连接并围成用于收容该相机模块20、该导热片30、该电路板转接单元40、该第一导热填充物50、该散热器60、以及该第二导热填充物70的收容空间120。本实施方式中，该外壳10的导热材料可以是金属，例如铜、铝等，也可为非金属，例如，碳纤维等。
具体地，请一并参阅图2至图4，该第一壳体12包括连接部122及自该连接部122向外延伸的收容部124。该连接部122与该第二壳体14连接形成该收容空间120。该收容部124与该连接部122连通。本实施方式中，该收容部124呈立方体结构，包括四个侧壁1240及与该四个侧壁1240均连接的顶壁1242。该顶壁1242开设有一个进光口1244。请参阅图5，该第二壳体14的内壁向内延伸有凸缘142。本实施方式中，该第一壳体12与该第二壳体14通过卡合方式连接在一起。该凸缘142为一个连续的环形结构、例如为连续的圆环形结构。
可以理解，在其他实施方式中，该第一壳体12与该第二壳体14还可以通过螺合、胶合、或者焊接等方式连接在一起。该凸缘142还可以为四边环形、或者其他形状的环形，又或者，该凸缘142为不连续的结构，例如中间间断的圆环形结构。另外，该收容部124也可不局限于本实施方式中呈立方体结构，还可以为圆柱体结构，此时，该收容部124只包括一个圆柱体形侧壁。
该相机模块20包括电路板22、影像感测器24、以及镜头模块26。该电路板22包括承载面222以及与该承载面222相背的连接面224。该影像感测器24承载在该承载面222上并与该电路板22电性连接。该镜头模块26承载在该承载面222上并收容该影像感测器24。具体地，该镜头模块26包括用于收容镜片(图未示)且两端开放的镜头单元262以及滤光片264。本实施方式中，该镜头单元262为呈立方体结构的镜筒，其包括四个侧壁2622、第一开放端2624、以及第二开放端2626。该镜头单元262收容在该收容部124内，该镜头单元262的四个侧壁2622与该收容部124的四个侧壁1240一一对准，该第二开放端2626与该进光口1244对准。该滤光片264收容在该镜头单元262内。该电路板22封闭该第一开放端2624。该电路板22的连接面224上设置有公连接器226。
该导热片30贴覆在该相机模块20上并位于该相机模块20与该外壳10之间以将该相机模块20产生的热量传导至该外壳10上。具体地，请一并参阅图2及图5，该导热片30自该电路板22的连接面224延伸至该镜头单元262的两个侧壁2622上，位于该镜头单元262的两个侧壁2622上的导热片30与该收容部124的两个侧壁1240直接接触。该导热片30由导热金箔、导热银箔、导热铝箔、或导热铜箔等金属材料制成。最优地，本实施方式中，该导热片30由导热铜箔制成。当该影像感测器24工作时，该影像感测器24产生的热量先传导到该电路板22上，再通过该导热片30传导至该第一壳体12的侧壁1240上，最后从该第一壳体12上散去，如此形成该相机模块20的第一散热通道。
可以理解，该导热片30并不局限于本实施方式中由金属材料制成，该导热片30还可由非金属材料制成，例如，由导热硅胶片或导热石墨片制成。该导热片30并不局限于本实施方式中自该电路板22的连接面224延伸至该镜头单元262的两个侧壁2622上，且位于该镜头单元262的两个侧壁2622上的导热片30与该收容部124的两个侧壁1240直接接触，在其他实施方式中，位于该镜头单元262的两个侧壁2622上的导热片30也可通过其他导热介质与该收容部124的两个侧壁1240间接接触，或者是二者既不直接接触，也不间接接触，而是间隔有一定距离并保持着相对关系。当然，在其他实施方式中，还可以是位于该镜头单元262的其中一个侧壁2622上的导热片30与对应的侧壁1240直接接触，而位于该镜头单元262的另一个侧壁2622上的导热片30通过其他导热介质与对应的侧壁1240间接接触。或者，位于该镜头单元262的其中一个侧壁2622上的导热片30与对应的侧壁1240直接接触，而位于该镜头单元262的另一个侧壁2622上的导热片30与对应的侧壁1240间隔。或者，位于该镜头单元262的其中一个侧壁2622上的导热片30通过其他导热介质与对应的侧壁1240间接接触，而位于该镜头单元262的另一个侧壁2622上的导热片30与对应的侧壁1240间隔。
另外，该导热片30并不局限于本实施方式中延伸至该镜头单元262的两个侧壁2622上，该导热片30还可以只延伸至该镜头单元262的一个侧壁2622上，此时，位于该一个侧壁2622上的导热片30与该收容部124的对应的侧壁1240可直接接触、间接接触、也可为相互间隔。或者，该导热片30同时延伸至该镜头单元262的三个侧壁2622、甚至是四个侧壁2622，位于每个侧壁2622上的导热片30与对应的侧壁1240可直接接触、间接接触、也可为相互间隔。为了提高导热效率，该导热片30最好同时延伸至该镜头单元262的多个侧壁2622，且位于每个侧壁2622上的导热片30与对应的侧壁1240均直接接触。而且，该导热片30也不局限于本实施方式中自该电路板22的连接面224延伸，还可以自该电路板22的任意一个表面延伸，例如，该导热片30还可自该承载面222、或者是自连接该承载面222与该连接面224的侧面延伸，只需要满足该导热片30能够同时与该电路板22及该镜头单元262的侧壁2622接触，且位于该镜头单元262的侧壁2622上的导热片30又能与该第一壳体12接触即可。
当该收容部124为圆柱体结构时，该镜头单元262还可为呈圆柱体形结构的镜筒，其包括一个圆柱形侧壁，该镜头单元262收容在该收容部124内，该镜头单元262的圆柱形侧壁与该收容部124的圆柱形侧壁对应。此时，该导热片30自该电路板22的连接面224延伸至该镜头单元262的圆柱形侧壁上，位于该镜头单元262的圆柱形侧壁上的导热片30与该收容部124的圆柱形侧壁接触。
该电路板转接单元40与该相机模块20电性连接并为该相机模块20供电。该电路板转接单元40包括转接板42、多个第一电子元件44、以及多个第二电子元件46。该转接板42包括相背的第一表面422及第二表面424。该多个第一电子元件44电性设置在该第一表面422，该多个第二电子元件46电性设置在该第二表面424。该第一表面422上设置有母连接器426。该公连接器226插接在该母连接器426内，从而使该电路板22与该电路板转接单元40插接在一起。本实施方式中，该公连接器226为插头，该母连接器426为插座。该多个第一电子元件44及该多个第二电子元件46可以包括但不限于，影图像处理模块、图像传输模块、电源模块、以及控制模块等。
可以理解，该公连接器226与该母连接器426的位置设置并不局限于本实施方式，二者的位置可以互换。具体为：公连接器设置在该第一表面422上，而母连接器设置在该电路板22的连接面224上。该公连接器226不局限于本实施方式中为插头，该母连接器426也不局限于本实施方式中为插座，还可是其他的插接结构。
该第一导热填充物50填充在该电路板22与该电路板转接单元40之间。具体地，该第一导热填充物50填充在位于该连接面224上的导热片30与该第一表面422之间，且包覆该多个第一电子元件44。换言之，该第一导热填充物50的相背两侧分别与该导热片30及该第一表面422接触。可以理解，当导热片30自连接该承载面222与该连接面224的侧面延伸，则该第一导热填充物50的相背两侧便直接与该连接面224及该第一表面422接触。该第一导热填充物50可为导热黏土或导热膏。本实施方式中，该第一导热填充物50为导热黏土。
该散热器60为铝合金材质，设置在该第二表面424并与该外壳10接触。具体地，该散热器60包括散热本体62及自该散热本体62向外延伸的多个散热片64。该散热本体62设置在该第二表面424。该多个散热片64呈长条片状，并彼此平行间隔排列在该散热本体62的远离该第二表面424的一侧。该多个散热片64全部或者部分承载在该凸缘142上。可以理解，该散热片64并不局限于本实施方式中呈长条状，还可以为层层包围的环状结构、或者是离散排列的或规则排列的柱状结构，当然，该柱状结构的截面可为圆形、三角形、长方形、正方形等等规则或不规则形状。该散热片64也不局限于本实施方式中为铝合金材质，还可以为其他的合金材质，例如铜合金等。
该第二导热填充物70填充在该散热器60与该第二表面424之间。具体地，该第二导热填充物70填充在该散热本体62与该第二表面424之间，且完全包覆该多个第二电子元件46。换言之，该第二导热填充物70的相背两侧分别与该散热本体62及该第二表面424接触。该第二导热填充物70可为导热黏土或导热膏。本实施方式中，该第二导热填充物70为导热黏土。
当该相机模块20工作时，该影像感测器24或者是该相机模块20内的其他元件产生的热量依次经该电路板22、该导热片30、该第一导热填充物50、该电路板转接单元40、该第二导热填充物70、及该散热器60传导后到达该第二壳体14上，最后从该散热器60及该第二壳体14上散去，如此形成该相机模块20的第二散热通道。在此过程中，该电路板转接单元40自身产生的热量也依次经过该第二导热填充物70传导至该散热器60上，通过该散热器60及该第二壳体14散去。而且，该散热器60与该第二壳体14相连，通过第二壳体14增大了散热面积，进一步提高了散热效率。其中，第一散热通道的设置已经能提高相机模块20的散热效率了，增加第二散热通道后，相机模块20的散热效率相较只设置第一散热通道时的散热效率提高了一半。另外，由于该第一导热填充物50包覆该多个第一电子元件44，该第二导热填充物70完全包覆该多个第二电子元件46，使该多个第一电子元件44及该多个第二电子元件46达到浸入式散热的效果，能够进一步提升该电路板转接单元40的散热效率。
本发明提供的影像撷取模组100利用导热片30贴覆在相机模块20上并位于该相机模块20与导热外壳10之间，从而有效将相机模块20产生的热量传导至导热外壳10上散去。相机模块20产生的热量还能依次经电路板22、导热片30、第一导热填充物50、电路板转接单元40、第二导热填充物70、及散热器60传导后到达第二壳体14上，最后从该散热器60及该第二壳体14上散去，进一步提高了相机模块20的散热效率。而且，第一导热填充物50包覆多个第一电子元件44，第二导热填充物70完全包覆多个第二电子元件46，对多个第一电子元件44及多个第二电子元件46起到浸入式散热的效果，又进一步提升影像撷取模组100的整体散热效率。
可以理解，在其他实施方式中，该导热片30也可以省略，此时，该影像感测器24或者是该相机模块20内的其他元件产生的热量依次经该电路板22、该第一导热填充物50、该电路板转接单元40、该第二导热填充物70、及该散热器60传导后到达该第二壳体14上，最后从该散热器60及该第二壳体14上散去。在又一实施方式中，该散热器60可以省略，此时，该电路板转接单元40的侧面与该外壳10的内壁直接接触或通过其他导热介质(包括本发明中的第二导热填充物70)间接接触，从而将热量散到该外壳10上；或者，该电路板转接单元40的底面与凸缘142直接接触或通过其他导热介质(包括本发明中的第二导热填充物70)间接接触，从而将热量散到该外壳10上；再或者，该电路板转接单元40的侧面与该外壳10的内壁直接接触或通过其他导热介质(包括本发明中的第二导热填充物70)间接接触，同时该电路板转接单元40的底面与凸缘142直接接触或通过其他导热介质间接接触，从而将热量散到该外壳10上；又或者，该电路板转接单元40与该外壳10之间既不直接接触，也不间接接触，二者仅仅有部分彼此相对，如此，经该电路板转接单元40传递的热量也可以散到该外壳10上。在再一实施方式中，该导热片30及该散热器60均可以省略。
本技术领域的普通技术人员应当认识到，以上的实施方式仅是用来说明本发明，而并非用作为对本发明的限定，只要在本发明的实质精神范围之内，对以上实施例所作的适当改变和变化都落在本发明要求保护的范围之内。

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  1. 一种影像撷取模组，包括导热外壳、相机模块、以及电路板转接单元，该相机模块及该电路板转接单元均收容在该外壳内，其特征在于，该电路板转接单元与该相机模块电性连接，该影像撷取模组还包括导热片，该导热片贴覆在该相机模块上并位于该相机模块与该外壳之间以将该相机模块产生的热量传导至该外壳上。
  2. 如权利要求1所述的影像撷取模组，其特征在于，该相机模块包括电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露，该导热片自该电路板延伸至该镜头单元的侧壁。
  3. 如权利要求2所述的影像撷取模组，其特征在于，该镜头单元包括多个侧壁，该导热片自该电路板的任意一个表面延伸至该镜头单元的至少一个侧壁上。
  4. 如权利要求2所述的影像撷取模组，其特征在于，该镜头单元包括圆柱形侧壁，该导热片自该电路板的任意一个表面延伸至该镜头单元的圆柱形侧壁上。
  5. 如权利要求2所述的影像撷取模组，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳直接接触。
  6. 如权利要求2所述的影像撷取模组，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳间接接触。
  7. 如权利要求2所述的影像撷取模组，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳间隔相对。
  8. 如权利要求1至7任一项所述的影像撷取模组，其特征在于，该导热片由金属材料制成。
  9. 如权利要求8所述的影像撷取模组，其特征在于，该导热片由导热金箔、导热银箔、导热铝箔、或导热铜箔制成。
  10. 如权利要求1至7任一项所述的影像撷取模组，其特征在于，该导热片由非金属材料制成。
  11. 如权利要求10所述的影像撷取模组，其特征在于，该导热片由导热硅胶片或导热石墨片制成。
  12. 如权利要求2至7任一项所述的影像撷取模组，其特征在于，该电路板与该电路板转接单元电性插接在一起，该电路板与该电路板转接单元之间填充有第一导热填充物。
  13. 如权利要求12所述的影像撷取模组，其特征在于，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
  14. 如权利要求12所述的影像撷取模组，其特征在于，该第一导热填充物为导热黏土或导热膏。
  15. 如权利要求13所述的影像撷取模组，其特征在于，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
    或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
  16. 如权利要求13所述的影像撷取模组，其特征在于，该第一导热填充物包覆该多个第一电子元件。
  17. 如权利要求13所述的影像撷取模组，其特征在于，该影像撷取模组还包括散热器，该散热器设置在该第二表面并与该外壳接触，该散热器与该第二表面之间填充有第二导热填充物。
  18. 如权利要求17所述的影像撷取模组，其特征在于，该第二导热填充物为导热黏土或导热膏。
  19. 如权利要求17所述的影像撷取模组，其特征在于，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
  20. 如权利要求19所述的影像撷取模组，其特征在于，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
  21. 如权利要求20所述的影像撷取模组，其特征在于，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
  22. 如权利要求21所述的影像撷取模组，其特征在于，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应。
  23. 如权利要求22所述的影像撷取模组，其特征在于，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该多个散热片承载在该凸缘上。
  24. 如权利要求21所述的影像撷取模组，其特征在于，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
  25. 一种航拍飞行器，包括飞行器以及搭载在该飞行器上的影像撷取模组，该影像撷取模包括导热外壳、相机模块、以及电路板转接单元，该相机模块及该电路板转接单元均收容在该外壳内，其特征在于，该电路板转接单元与该相机模块电性连接，该影像撷取模组还包括导热片，该导热片贴覆在该相机模块上并位于该相机模块与该外壳之间以将该相机模块产生的热量传导至该外壳上。
  26. 如权利要求25所述的航拍飞行器，其特征在于，该影像撷取模组通过云台搭载在该飞行器上。
  27. 如权利要求25所述的航拍飞行器，其特征在于，该相机模块包括电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露，该导热片自该电路板延伸至该镜头单元的侧壁。
  28. 如权利要求27所述的航拍飞行器，其特征在于，该镜头单元包括多个侧壁，该导热片自该电路板的任意一个表面延伸至该镜头单元的至少一个侧壁上。
  29. 如权利要求27所述的航拍飞行器，其特征在于，该镜头单元包括圆柱形侧壁，该导热片自该电路板的任意一个表面延伸至该镜头单元的圆柱形侧壁上。
  30. 如权利要求27所述的航拍飞行器，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳直接接触。
  31. 如权利要求27所述的航拍飞行器，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳间接接触。
  32. 如权利要求27所述的航拍飞行器，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳间隔相对。
  33. 如权利要求25至32任一项所述的航拍飞行器，其特征在于，该导热片由金属材料制成。
  34. 如权利要求33所述的航拍飞行器，其特征在于，该导热片由导热金箔、导热银箔、导热铝箔、或导热铜箔制成。
  35. 如权利要求25至32任一项所述的航拍飞行器，其特征在于，该导热片由非金属材料制成。
  36. 如权利要求35所述的航拍飞行器，其特征在于，该导热片由导热硅胶片或导热石墨片制成。
  37. 如权利要求27至32任一项所述的航拍飞行器，其特征在于，该电路板与该电路板转接单元电性插接在一起，该电路板与该电路板转接单元之间填充有第一导热填充物。
  38. 如权利要求37所述的航拍飞行器，其特征在于，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
  39. 如权利要求37所述的航拍飞行器，其特征在于，该第一导热填充物为导热黏土或导热膏。
  40. 如权利要求38所述的航拍飞行器，其特征在于，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
    或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
  41. 如权利要求38所述的航拍飞行器，其特征在于，该第一导热填充物包覆该多个第一电子元件。
  42. 如权利要求38所述的航拍飞行器，其特征在于，该影像撷取模组还包括散热器，该散热器设置在该第二表面并与该外壳接触，该散热器与该第二表面之间填充有第二导热填充物。
  43. 如权利要求42所述的航拍飞行器，其特征在于，该第二导热填充物为导热黏土或导热膏。
  44. 如权利要求42所述的航拍飞行器，其特征在于，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
  45. 如权利要求44所述的航拍飞行器，其特征在于，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
  46. 如权利要求45所述的航拍飞行器，其特征在于，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
  47. 如权利要求46所述的航拍飞行器，其特征在于，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接以形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应。
  48. 如权利要求47所述的航拍飞行器，其特征在于，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该多个散热片承载在该凸缘上。
  49. 如权利要求46所述的航拍飞行器，其特征在于，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
  50. 一种影像撷取模组，包括导热外壳、相机模块、以及电路板转接单元，该相机模块及该电路板转接单元均收容在该外壳内，其特征在于，该相机模块电性设置在该电路板转接单元上，该影像撷取模组还包括第一导热填充物，该第一导热填充物填充在该相机模块与该电路板转接单元之间以将该相机模块产生的热量经该电路板转接单元传导至该外壳上。
  51. 如权利要求50所述的影像撷取模组，其特征在于，该第一导热填充物为导热黏土或导热膏。
  52. 如权利要求51所述的影像撷取模组，其特征在于，该影像撷取模组还包括散热器，该散热器设置在该电路板转接单元与该相机模块相背的一侧并与该外壳接触，该散热器与该电路板转接单元之间填充有第二导热填充物。
  53. 如权利要求52所述的影像撷取模组，其特征在于，该第二导热填充物为导热黏土或导热膏。
  54. 如权利要求53所述的影像撷取模组，其特征在于，该相机模块包括电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露。
  55. 如权利要求54所述的影像撷取模组，其特征在于，该电路板电性插接在该电路板转接单元上。
  56. 如权利要求55所述的影像撷取模组，其特征在于，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
  57. 如权利要求56所述的影像撷取模组，其特征在于，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
    或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
  58. 如权利要求56所述的影像撷取模组，其特征在于，该第一导热填充物包覆该多个第一电子元件。
  59. 如权利要求56所述的影像撷取模组，其特征在于，该散热器设置在该第二表面并与该外壳接触，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
  60. 如权利要求56所述的影像撷取模组，其特征在于，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
  61. 如权利要求54至60任意一项所述的影像撷取模组，其特征在于，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
  62. 如权利要求61所述的影像撷取模组，其特征在于，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接以形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应。
  63. 如权利要求62所述的影像撷取模组，其特征在于，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该散热器承载在该凸缘上。
  64. 如权利要求61所述的影像撷取模组，其特征在于，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
  65. 如权利要求50所述的影像撷取模组，其特征在于，该影像撷取模组还包括导热片，该导热片贴覆在该相机模块上并位于该相机模块与该外壳之间，该第一导热填充物的相背两侧分别与该导热片及该电路板转接单元接触。
  66. 如权利要求65所述的影像撷取模组，其特征在于，该导热片由金属材料制成。
  67. 如权利要求65所述的影像撷取模组，其特征在于，该导热片由导热金箔、导热银箔、导热铝箔、或导热铜箔制成。
  68. 如权利要求65所述的影像撷取模组，其特征在于，该导热片由非金属材料制成。
  69. 如权利要求65所述的影像撷取模组，其特征在于，该导热片由导热硅胶片或导热石墨片制成。
  70. 如权利要求65~69任意一项所述的影像撷取模组，其特征在于，该第一导热填充物为导热黏土或导热膏。
  71. 如权利要求70所述的影像撷取模组，其特征在于，该相机模块包括承载面电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该电路板包括承载该影像感测器的承载面及与该承载面相背的连接面，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露，该导热片自该连接面延伸至该镜头单元的侧壁。
  72. 如权利要求71所述的影像撷取模组，其特征在于，该镜头单元包括多个侧壁，该导热片自该连接面延伸至该镜头单元的至少一个侧壁上。
  73. 如权利要求71所述的影像撷取模组，其特征在于，该镜头单元包括圆柱形侧壁，该导热片自该连接面延伸至该镜头单元的圆柱形侧壁上。
  74. 如权利要求71所述的影像撷取模组，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳直接接触。
  75. 如权利要求71所述的影像撷取模组，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳间接接触。
  76. 如权利要求71所述的影像撷取模组，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳间隔相对。
  77. 如权利要求71所述的影像撷取模组，其特征在于，该电路板与该电路板转接单元电性插接在一起。
  78. 如权利要求77所述的影像撷取模组，其特征在于，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
  79. 如权利要求78所述的影像撷取模组，其特征在于，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
    或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
  80. 如权利要求77所述的影像撷取模组，其特征在于，该第一导热填充物包覆该多个第一电子元件。
  81. 如权利要求80所述的影像撷取模组，其特征在于，该影像撷取模组还包括散热器，该散热器设置在该第二表面并与该外壳接触，该散热器与该第二表面之间填充有第二导热填充物。
  82. 如权利要求81所述的影像撷取模组，其特征在于，该第二导热填充物为导热黏土或导热膏。
  83. 如权利要求81所述的影像撷取模组，其特征在于，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
  84. 如权利要求83所述的影像撷取模组，其特征在于，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
  85. 如权利要求81所述的影像撷取模组，其特征在于，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
  86. 如权利要求85所述的影像撷取模组，其特征在于，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应。
  87. 如权利要求86所述的影像撷取模组，其特征在于，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该多个散热片承载在该凸缘上。
  88. 如权利要求85所述的影像撷取模组，其特征在于，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
  89. 一种航拍飞行器，包括飞行器以及搭载在该飞行器上的影像撷取模组，该影像撷取模组包括导热外壳、相机模块、以及电路板转接单元，该相机模块及该电路板转接单元均收容在该外壳内，其特征在于，该相机模块电性设置在该电路板转接单元上，该影像撷取模组还包括第一导热填充物，该第一导热填充物填充在该相机模块与该电路板转接单元之间以将该相机模块产生的热量经该电路板转接单元传导至该外壳上。
  90. 如权利要求89所述的航拍飞行器，其特征在于，该第一导热填充物为导热黏土或导热膏。
  91. 如权利要求90所述的航拍飞行器，其特征在于，该影像撷取模组还包括散热器，该散热器设置在该电路板转接单元与该相机模块相背的一侧并与该外壳接触，该散热器与该电路板转接单元之间填充有第二导热填充物。
  92. 如权利要求91所述的航拍飞行器，其特征在于，该第二导热填充物为导热黏土或导热膏。
  93. 如权利要求92所述的航拍飞行器，其特征在于，该相机模块包括电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露。
  94. 如权利要求93所述的航拍飞行器，其特征在于，该电路板电性插接在该电路板转接单元上。
  95. 如权利要求94所述的航拍飞行器，其特征在于，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
  96. 如权利要求95所述的航拍飞行器，其特征在于，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
    或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
  97. 如权利要求95所述的航拍飞行器，其特征在于，该第一导热填充物包覆该多个第一电子元件。
  98. 如权利要求95所述的航拍飞行器，其特征在于，该散热器设置在该第二表面并与该外壳接触，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
  99. 如权利要求95所述的航拍飞行器，其特征在于，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
  100. 如权利要求93至99任意一项所述的航拍飞行器，其特征在于，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
  101. 如权利要求100所述的航拍飞行器，其特征在于，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接以形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应。
  102. 如权利要求101所述的航拍飞行器，其特征在于，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该散热器承载在该凸缘上。
  103. 如权利要求100所述的航拍飞行器，其特征在于，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
  104. 如权利要求89所述的航拍飞行器，其特征在于，该影像撷取模组还包括导热片，该导热片贴覆在该相机模块上并位于该相机模块与该外壳之间，该第一导热填充物的相背两侧分别与该导热片及该电路板转接单元接触。
  105. 如权利要求104所述的航拍飞行器，其特征在于，该导热片由金属材料制成。
  106. 如权利要求104所述的航拍飞行器，其特征在于，该导热片由导热金箔、导热银箔、导热铝箔、或导热铜箔制成。
  107. 如权利要求104所述的航拍飞行器，其特征在于，该导热片由非金属材料制成。
  108. 如权利要求104所述的航拍飞行器，其特征在于，该导热片由导热硅胶片或导热石墨片制成。
  109. 如权利要求104~108任意一项所述的航拍飞行器，其特征在于，该第一导热填充物为导热黏土或导热膏。
  110. 如权利要求109所述的航拍飞行器，其特征在于，该相机模块包括承载面电路板、承载在该电路板上并与该电路板电性连接的影像感测器、以及承载在该电路板上并收容该影像感测器的镜头模块，该电路板包括承载该影像感测器的承载面及与该承载面相背的连接面，该镜头模块包括用于收容镜片且两端开放的镜头单元，该电路板封闭该镜头单元的第一开放端，该镜头单元的第二开放端从该外壳暴露，该导热片自该连接面延伸至该镜头单元的侧壁。
  111. 如权利要求110所述的航拍飞行器，其特征在于，该镜头单元包括多个侧壁，该导热片自该连接面延伸至该镜头单元的至少一个侧壁上。
  112. 如权利要求110所述的航拍飞行器，其特征在于，该镜头单元包括圆柱形侧壁，该导热片自该连接面延伸至该镜头单元的圆柱形侧壁上。
  113. 如权利要求110所述的航拍飞行器，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳直接接触。
  114. 如权利要求110所述的航拍飞行器，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳间接接触。
  115. 如权利要求110所述的航拍飞行器，其特征在于，位于该镜头单元的侧壁上的导热片与该外壳间隔相对。
  116. 如权利要求110所述的航拍飞行器，其特征在于，该电路板与该电路板转接单元电性插接在一起。
  117. 如权利要求116所述的航拍飞行器，其特征在于，该电路板转接单元包括转接板以及多个第一电子元件，该转接板包括相背的第一表面及第二表面，该多个第一电子元件电性设置在该第一表面，该电路板插接在该第一表面。
  118. 如权利要求117所述的航拍飞行器，其特征在于，该电路板上设置有公连接器，该第一表面上设置有母连接器，该公连接器插接在该母连接器内；
    或者，该电路板上设置有母连接器，该第一表面上设置有公连接器，该公连接器插接在该母连接器内。
  119. 如权利要求116所述的航拍飞行器，其特征在于，该第一导热填充物包覆该多个第一电子元件。
  120. 如权利要求119所述的航拍飞行器，其特征在于，该影像撷取模组还包括散热器，该散热器设置在该第二表面并与该外壳接触，该散热器与该第二表面之间填充有第二导热填充物。
  121. 如权利要求120所述的航拍飞行器，其特征在于，该第二导热填充物为导热黏土或导热膏。
  122. 如权利要求120所述的航拍飞行器，其特征在于，该电路板转接单元还包括多个第二电子元件，该多个第二电子元件电性设置在该第二表面，该第二导热填充物完全包覆该多个第二电子元件。
  123. 如权利要求122所述的航拍飞行器，其特征在于，该散热器包括散热本体及自该散热本体向外延伸的多个散热片，该散热本体设置在该第二表面，该多个散热片位于该散热本体的远离该第二表面的一侧，该多个散热片彼此间隔。
  124. 如权利要求120所述的航拍飞行器，其特征在于，该外壳包括第一壳体及第二壳体，该第一壳体与该第二壳体连接并围成用于收容该相机模块、该电路板转接单元、及该散热器的收容空间。
  125. 如权利要求124所述的航拍飞行器，其特征在于，该第一壳体包括连接部及自该连接部向外延伸的收容部，该连接部与该第二壳体连接形成该收容空间，该镜头单元收容在该收容部内，该镜头单元的侧壁与该收容部的侧壁对应，该镜头单元的侧壁通过该导热片与该收容部的侧壁连接。
  126. 如权利要求125所述的航拍飞行器，其特征在于，该收容部开设有进光口，该第二开放端与该进光口对准，该第二壳体的内壁向内延伸有凸缘，该多个散热片承载在该凸缘上。
  127. 如权利要求124所述的航拍飞行器，其特征在于，该第一壳体与该第二壳体通过螺合、卡合、或胶合方式连接在一起。
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