WO2022000297A1 - 一种相机模块及可移动平台 - Google Patents

一种相机模块及可移动平台 Download PDF

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Publication number
WO2022000297A1
WO2022000297A1 PCT/CN2020/099387 CN2020099387W WO2022000297A1 WO 2022000297 A1 WO2022000297 A1 WO 2022000297A1 CN 2020099387 W CN2020099387 W CN 2020099387W WO 2022000297 A1 WO2022000297 A1 WO 2022000297A1
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WO
WIPO (PCT)
Prior art keywords
image acquisition
circuit board
thermally conductive
unit
camera
Prior art date
Application number
PCT/CN2020/099387
Other languages
English (en)
French (fr)
Inventor
彭泽林
谢成浩
李红山
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2020/099387 priority Critical patent/WO2022000297A1/zh
Priority to CN202080006253.3A priority patent/CN113170035B/zh
Publication of WO2022000297A1 publication Critical patent/WO2022000297A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors

Definitions

  • the present invention generally relates to the field of cameras, and more particularly, to a camera module and a movable platform.
  • the camera acts as the "eye" of the vehicle in autonomous driving. By collecting the images collected by the camera, it achieves the function of obtaining information such as road conditions, traffic flow, and obstacles.
  • cameras installed on movable platforms are relatively small in size, and cannot adopt active cooling methods such as fans, while movable platforms may need to be exposed to high ambient temperature and outdoor environment for a long time, especially in summer, if the camera
  • the module does not have good thermal conductivity and heat dissipation performance, which will cause its internal components to be damaged at high temperatures or reduce their service life; if the camera is connected to the outside in order to promote the heat dissipation of the camera, the camera cannot be guaranteed to be waterproof and dustproof. This affects the safety and service life of internal components.
  • a first aspect of the embodiments of the present invention provides a camera module, the camera module includes:
  • a camera housing with an accommodating space inside the camera housing
  • a heat conduction unit respectively in contact with the image acquisition unit and the camera casing, so as to conduct the heat of the image acquisition unit to the camera casing;
  • the heat conduction unit includes a middle part and an edge part, the middle part is in contact with the image acquisition unit; the edge part is attached to the camera housing, so that the heat conduction unit and the camera housing Basically sealed.
  • a second aspect of the embodiments of the present invention provides a movable platform, where the movable platform includes:
  • the camera module mounted on the movable platform body, the camera module includes:
  • a camera housing with an accommodating space inside the camera housing
  • a heat conduction unit respectively in contact with the image acquisition unit and the camera casing, so as to conduct the heat of the image acquisition unit to the camera casing;
  • the heat conduction unit includes a middle part and an edge part, the middle part is in contact with the image acquisition unit; the edge part is attached to the camera housing, so that the heat conduction unit and the camera housing Basically sealed.
  • the camera module and the movable platform of the embodiment of the present invention conduct the heat from the image acquisition unit to the heat conduction unit by arranging the heat conduction unit in contact with the image acquisition unit with a large heat generation, and directly contact the camera housing through the heat conduction unit.
  • the heat is conducted to the camera housing, and finally to the air or other parts in contact with the housing, thereby effectively alleviating the problem of shortening the life span of the image acquisition unit caused by overheating.
  • the thermal conduction unit is attached to the camera casing, and the two are basically sealed, ensuring the waterproof and dustproof effect.
  • FIG. 1 is an exploded view of a camera module according to an embodiment of the present invention
  • FIG. 2 is a schematic perspective view of a camera module at an angle according to an embodiment of the present invention
  • FIG. 3 is a schematic perspective view of a camera module from another angle according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a camera module according to an embodiment of the present invention.
  • FIG. 5 is another schematic cross-sectional view of a camera module according to an embodiment of the present invention.
  • FIG. 6 is a structural block diagram of a movable platform according to an embodiment of the present invention.
  • the camera module applied to the mobile platform is mainly concerned with the performance requirements of waterproof and anti-fogging of the external camera module, and the heat conduction and heat dissipation of the image sensor is not considered as the power consumption is getting higher and higher, and the heat generation is getting bigger and bigger.
  • the conventional in-vehicle camera module does not have a heat dissipation structure, because the image sensor consumes less power and generates less heat. Even if the heat accumulates inside the camera module, the impact on the service life of the components is relatively small.
  • the requirements for image resolution and the number of captured video frames are getting higher and higher, the power consumption and heat generation of image sensors are also increasing, and the heat problem of camera modules used in mobile platforms is gradually exposed.
  • cameras installed on movable platforms are relatively small in size, and cannot adopt active cooling methods such as fans, while movable platforms may need to be exposed to high ambient temperature and outdoor environment for a long time, especially in summer, if the camera
  • the module does not have good thermal conductivity and heat dissipation performance, which will cause its internal components to be damaged at high temperatures or reduce their service life; if the camera is connected to the outside in order to promote the heat dissipation of the camera, the camera cannot be guaranteed to be waterproof and dustproof. This affects the safety and service life of internal components.
  • the embodiments of the present invention provide a camera module with good heat conduction and heat dissipation performance and a movable platform including the camera module.
  • a heat conduction unit to the camera module, the heat generated by the image acquisition unit is conducted to the camera case.
  • the body is used to dissipate heat and avoid the shortening of the life of the components under high temperature conditions for a long time.
  • the edge of the heat-conducting unit is attached to the camera casing, and the two are basically sealed to ensure the effect of waterproof and dustproof.
  • it has excellent heat dissipation, waterproof and dustproof functions.
  • FIG. 1 is an exploded view of a camera module according to an embodiment of the present invention
  • FIG. 2 is a perspective view of a camera module of an embodiment of the present invention from an angle
  • FIG. 3 is an implementation of the present invention
  • FIG. 4 is a schematic cross-sectional view of the camera module according to an embodiment of the present invention
  • FIG. 5 is another schematic cross-sectional view of the camera module according to an embodiment of the present invention.
  • a camera module includes a camera housing 103 , and the camera housing 103 has an accommodating space inside.
  • An image acquisition unit and a heat conduction unit are arranged in the accommodating space, and the heat conduction unit is respectively in contact with the image acquisition unit and the camera housing 103 to conduct the heat of the image acquisition unit to the camera housing 103, and finally to the air or to the camera housing 103. on other parts that the shell contacts.
  • the camera housing 103 is a hollow housing, so as to form an accommodating space inside; at the same time, the front part of the camera housing 103 protrudes forward to form a boss, and the front part of the boss is The external space is communicated for installing the optical lens assembly 101 in the image capturing unit, so that the optical lens assembly 101 can receive external light, referring to FIG. 2 .
  • the camera housing 103 may be made of a thermally conductive material to improve heat dissipation.
  • the camera housing 103 may be made of a metal material.
  • the exterior of the camera housing 103 may be provided with other heat dissipation structures, or the outer surface of the camera housing 103 may be provided in a form that facilitates heat dissipation, for example, increasing the surface area of the outer surface of the camera housing 103 to further Improve heat dissipation.
  • the camera housing 103 is provided with an image acquisition unit for realizing the image acquisition function.
  • the image capturing unit also includes an optical lens assembly 101, an image sensor 105 and an image capturing circuit board 106, which are arranged in sequence. That is, the optical lens assembly 101 is disposed in front of the image sensor 105 , and the image capturing circuit board 106 is disposed behind the image sensor 105 .
  • the optical lens assembly 101 includes a lens barrel and at least one lens disposed in the lens barrel.
  • the lens barrel may be formed of a metal-based material with high thermal conductivity.
  • the lens may be fixed to the inside of the lens barrel by an adhesive or the like.
  • the optical lens assembly 101 may be adhered and fixed to the boss by the lens adhesive glue 102 .
  • the outside of the lens barrel may be provided with a male screw portion for attachment to the camera housing 103 .
  • Inside the boss of the camera housing 103 is an inner thread part so as to be connected with the outer thread part.
  • image sensors include, but are not limited to, CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) sensors.
  • the image sensor 105 is mounted on the image pickup circuit board 106 together with peripheral circuit components.
  • the image sensor 105 and the image acquisition circuit board 106 may be fixed by welding with electronic components.
  • the image capture circuit board 106 and the camera housing 103 can be fixed by screw connection.
  • positioning posts are provided on the camera housing 103
  • positioning holes are provided on the image capture circuit board 106 , and precise positioning of the image capture circuit board can be achieved through the cooperation of the positioning posts and the positioning holes.
  • a dust-proof structure 104 is further disposed between the camera housing 103 and the image acquisition circuit board 106 , and the image sensor is isolated by the compression and sealing of the dust-proof structure 104 The contact of 105 with air reduces the risk of image sensor 105 being contaminated with dust in the air.
  • the dustproof structural member 104 can be made of foam, which has a certain compressibility, and the dustproof structural member 104 can be compressed through the fixing process of the image acquisition circuit board 106 and the camera housing 103 .
  • the pore size of the compressed foam is smaller than the size of dust in the air, so that the image sensor 105 can be isolated from the dust in the air.
  • the external ambient light enters the protective case camera housing 103 through the optical lens assembly 101 from the front, and then irradiates the image sensor 105 so that the image sensor 105 can receive the external ambient light and record the ambient image.
  • the image sensor 105 will generate a large amount of heat during the working process, and thus becomes the main heating device in the camera module. Since the image sensor 105 is disposed on the image acquisition circuit board 106 to conduct heat to the image acquisition circuit board 106 , the heat conduction unit of the embodiment of the present invention is in contact with at least one side of the image acquisition circuit board 106 , so that the image acquisition circuit board 106 is exposed to heat. to dissipate heat.
  • the heat conduction unit is in contact with the back of the image acquisition circuit board 106 .
  • the heat conduction unit includes a middle part 114 and an edge part 115, the middle part 114 is in contact with the image acquisition unit, so as to conduct the heat of the image acquisition unit; the edge part 115 is attached to the camera casing, on the one hand, conducts the heat to the camera casing
  • the thermal conduction unit and the camera housing are basically sealed, which has the effect of waterproof and dustproof.
  • the middle portion 114 of the thermally conductive unit includes a platform portion.
  • the edge portion 115 of the thermally conductive unit includes a side wall portion and an outer edge portion. The side wall portion extends downward along the edge of the platform portion, and the outer edge portion extends outward along the bottom of the side wall.
  • the platform portion is parallel to the image acquisition circuit board 106 .
  • the side wall portion extends downward along the edge of the platform portion, so as to fit with the inner wall of the camera housing 103 and form a larger contact surface.
  • the outer edge portion extending outward along the bottom of the side wall portion fits with the bottom of the camera housing 103 , and the upper and lower sides of the outer edge portion are pressed and fixed by the camera housing 103 and the control circuit board 112 respectively.
  • the thermally conductive unit includes a thermally conductive structural member 110 and a thermally conductive medium 109 .
  • the thermally conductive medium 109 is located in the middle portion 114 , one side of which is attached to the image acquisition circuit board 106 in the image acquisition unit, and the other side is attached to the thermally conductive structural member 110 .
  • the thermally conductive structural member 110 is partially located in the middle portion 114 and partially located in the edge portion 115 .
  • the thermally conductive structural member 110 is in contact with the thermally conductive medium 109 and the camera housing 103 respectively; the thermally conductive medium 109 is in close contact with the image acquisition circuit board 106 and the thermally conductive structural member 110 , thereby conducting the heat of the image acquisition circuit board 106 to the thermally conductive structural member 110 ;
  • the thermal conductive structure 110 conducts heat to the camera housing 103 . In this way, the heat dissipation of the image capture circuit board 106 can be ensured, and the camera casing 103 does not need to be penetrated, thereby ensuring the sealing effect inside the camera casing 103 .
  • the thermally conductive structural member 110 includes a platform portion, a side wall portion extending downward along the edge of the platform portion, and an outer edge portion extending outward along the bottom of the side wall.
  • the platform portion is parallel to the image acquisition circuit board 106 .
  • the side wall portion extends downward along the edge of the platform portion, so as to fit with the inner wall of the camera housing 103 and form a larger contact surface.
  • the outer edge portion extending outward along the bottom of the side wall portion fits with the bottom of the camera housing 103 , and the upper and lower sides of the outer edge portion are pressed and fixed by the camera housing 103 and the control circuit board 112 respectively.
  • a certain distance is spaced between the platform portion of the thermally conductive structural member and the image capturing circuit board 106 .
  • a convex structure such as a boss or a convex hull, is provided at a position corresponding to the image acquisition circuit board on the platform portion to fill the above-mentioned distance.
  • the heat-conducting medium is disposed between the image acquisition circuit board 106 and the protruding structure, and is in close contact with the two respectively.
  • the thermally conductive structural member 110 as described above has a compact structure, occupies less space, and has less impact on the volume of the camera module. It should be noted, however, that the thermally conductive structural member 110 is not limited to the above-mentioned shape, and this embodiment is merely an example here, as long as the thermally conductive structural member 110 can be in contact with the image acquisition circuit board 106 and the inner wall of the camera housing 103 to capture the image The heat of the circuit board 106 can be quickly dissipated through the camera housing 103 .
  • the thermally conductive structural member 110 is used for heat conduction between the image capture circuit board 106 and the camera housing 103 , it is made of a material with high thermal conductivity, such as a metal material. Further, the thermally conductive structural member 110 may be made of red copper having both high thermal conductivity and high ductility.
  • the thermally conductive medium 109 is mainly used to improve the thermal conduction efficiency between the image acquisition circuit board 106 and the thermally conductive structural member 110 .
  • the thermally conductive medium 109 is in contact with or adhered to the image acquisition circuit board 106 and the protruding structures of the thermally conductive structural member 110, respectively.
  • the thermally conductive medium 109 uses a material with high thermal conductivity to ensure the effect of heat conduction; in addition, since the thermally conductive medium is provided in a small space inside the camera housing 103 , it is preferably a flexible material. Based on the above considerations, the material of the thermal conductive medium can be selected from thermal conductive grease.
  • the thermally conductive grease is a glued object with high thermal conductivity, which can increase the thermal conduction area between the image acquisition circuit board 106 and the thermally conductive structural member 110 .
  • the camera module of the embodiment of the present invention further includes a control circuit unit, which is responsible for connecting with the movable platform.
  • the host of the mobile platform performs signal connection for signal control and transmission.
  • control circuit unit is located behind the heat conduction unit, and mainly includes the control circuit board 112 .
  • the control circuit board 112 and the camera housing 103 are enclosed to form an accommodating space, that is, the rear of the accommodating space is sealed by the control circuit board 112 .
  • the control circuit board 112 and the camera housing 103 can be fixed by screw connection.
  • the control circuit board 112 is connected to the image acquisition circuit board 106 to receive the image information acquired by the image acquisition unit, and send the image information acquired by the image acquisition unit to the host of the movable platform.
  • a board-to-board connector may be used for connection between the image capture circuit board 106 and the control circuit board 112 .
  • the board-to-board connector includes a board-to-board connector male seat 107 and a board-to-board connector female seat 111 , and the board-to-board connector male seat 107 is fixed to the image acquisition circuit board 106 by welding electronic components , the board-to-board connector female seat 111 is fixed to the control circuit board 112 by welding electronic components, and the image acquisition circuit board 106 and the board-to-board connector female seat 111 are joined by the joint of the board-to-board connector male seat 107 Control the electrical connection of the circuit board 112 .
  • the control circuit unit further includes an electrical connector 113 , one end of the electrical connector 113 is connected to the control circuit board 112 , and the other end is an external interface, which extends out of the camera housing 103 and is connected to other interfaces.
  • Electrical connectors 113 include, but are not limited to, Farka electrical connectors.
  • the control circuit board 112 has a plurality of sockets, and the electrical connectors 113 are inserted into the corresponding sockets for soldering of electronic components.
  • the camera module according to the embodiment of the present invention is provided with a heat-conducting unit that is in contact with the image acquisition unit with a large heat generation, so that the heat on the image acquisition unit is conducted to the heat-conducting unit, and the heat-conducting unit is in direct contact with the camera housing.
  • the heat is conducted to the camera housing, and finally to the air or other parts in contact with the camera housing, thereby effectively alleviating the problem of shortening the life span of the image acquisition unit caused by overheating.
  • the movable platform 600 provided by the embodiment of the present invention includes a movable platform body 610 and a camera module 620 mounted on the movable platform body 610 .
  • the camera module 620 may be the above-mentioned camera module, which specifically includes: a camera housing, with an accommodating space inside the camera housing; an image acquisition unit, arranged in the accommodating space; a heat conduction unit, respectively connected to the image acquisition unit and the camera
  • the housing is in contact with the image capturing unit to conduct the heat of the image capturing unit to the camera housing, wherein the heat conducting unit includes a middle part and an edge part, the middle part is in contact with the image capturing unit; the edge part is in contact with the image capturing unit.
  • the camera housing is fitted so that the thermally conductive unit and the camera housing are substantially sealed.
  • the movable platform 600 includes at least one of a car, a remote control car, a robot, an unmanned aerial vehicle or a boat.
  • the movable platform body 610 is the body of the automobile.
  • the movable platform 600 is a remote control car
  • the movable platform body 610 is the body of the remote control car.
  • the movable platform 600 is a robot
  • the movable platform body 610 is the body of the robot, and so on.
  • the image acquisition unit includes: an image acquisition circuit board, and the heat conduction unit is in contact with at least one side of the image acquisition circuit board.
  • the image acquisition unit further includes an optical lens assembly and an image sensor arranged in sequence, and the image sensor is provided on the image acquisition circuit board.
  • the thermally conductive unit includes a thermally conductive structural member and a thermally conductive medium, the thermally conductive medium is located in the middle portion, and the thermally conductive structural member is partially located in the intermediate portion and partially located in the edge portion.
  • thermally conductive medium One side of the thermally conductive medium is attached to the image acquisition unit, and the other side of the thermally conductive medium is attached to the thermally conductive structural member, and the thermally conductive structural member is respectively in contact with the thermally conductive medium and the camera housing .
  • the image acquisition unit includes an image acquisition circuit board, and the thermally conductive medium is attached to the image acquisition circuit board
  • the thermally conductive structural member includes a platform portion, a sidewall portion extending downwardly along an edge of the platform portion, and an outer rim portion extending outwardly along a bottom of the sidewall, the sidewall portion being connected to the sidewall portion.
  • the inner wall of the camera casing is fitted, and the outer edge is fitted with the bottom of the camera casing.
  • the platform portion is provided with a protruding structure, and the thermally conductive medium is in contact with the protruding structure.
  • the material of the thermally conductive medium includes thermally conductive grease.
  • the material of the thermally conductive structure includes metal.
  • the camera module 620 further includes a control circuit unit, and the heat conduction unit is disposed between the image acquisition unit and the control circuit unit.
  • the control circuit unit includes a control circuit board, the control circuit board is connected to the image acquisition circuit board, and the camera housing and the control circuit board are enclosed to form the accommodating space.
  • the heat-conducting unit is disposed between the image acquisition circuit board and the control circuit unit, an opening is provided in the heat-conducting structural member, and the camera module 620 further includes a board-to-board connector penetrating the opening for connecting The image acquisition circuit board and the control circuit board.
  • control circuit unit further includes an electrical connector, one end of the electrical connector is connected to the control circuit board, and the other end is an external interface.
  • a dustproof structural member is disposed between the camera housing and the image acquisition circuit board.
  • the camera module 620 For other specific details of the camera module 620 , reference may be made to the camera module described above with reference to FIGS. 1 to 5 , and details are not described herein.
  • the camera module used in the movable platform of the embodiment of the present invention is provided with a heat-conducting unit in contact with the image acquisition unit with a large heat generation, so as to conduct the heat on the image acquisition unit to the heat-conducting unit, and directly connect with the camera housing through the heat-conducting unit. contact, conduct heat to the camera housing, and finally to the air or other parts in contact with the housing, thereby effectively alleviating the problem of shortening the life span of the image acquisition unit due to overheating.
  • the disclosed apparatus and method may be implemented in other manners.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined or May be integrated into another device, or some features may be omitted, or not implemented.
  • Various component embodiments of the present invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof.
  • a microprocessor or a digital signal processor (DSP) may be used in practice to implement some or all of the functions of some modules according to the embodiments of the present invention.
  • DSP digital signal processor
  • the present invention may also be implemented as apparatus programs (eg, computer programs and computer program products) for performing part or all of the methods described herein.
  • Such a program implementing the present invention may be stored on a computer-readable medium, or may be in the form of one or more signals. Such signals may be downloaded from Internet sites, or provided on carrier signals, or in any other form.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)

Abstract

一种相机模块及可移动平台，相机模块包括：相机壳体（103），其内部具有容置空间；图像采集单元，设置于容置空间内；导热单元，分别与图像采集单元和相机壳体（103）相接触，以将图像采集单元的热量传导到相机壳体（103）上；其中，导热单元包括中间部（114）和边缘部（115），中间部（114）与图像采集单元相接触；边缘部（115）与相机壳体（103）贴合，以使所述单元与相机壳体（103）之间基本密封。图像采集单元上的热量通过导热单元传导至相机壳体上，有效缓解了图像采集单元过热导致寿命降低的问题。

Description

一种相机模块及可移动平台
说明书
技术领域
本发明总地涉及相机领域，更具体地涉及一种相机模块及可移动平台。
背景技术
随着科技的进步，各行各业都朝着自动化和智能化的方向发展。例如，对于汽车行业来说，高级辅助驾驶或自动驾驶作为汽车行业未来发展的一个重要目标，其实现必须依赖于利用各类传感器带来道路规则、车流或者障碍物等信息以调整行驶状态。相机作为汽车上常用的传感器，在自动驾驶中充当车辆“眼睛”的角色，通过收集相机采集的图像，从而达到获取路况、车流、障碍物等信息的功能。
一般设置在可移动平台上的相机外形尺寸都相对较小，无法采用风扇等主动散热方式，而可移动平台可能需要长时间处于较高的环境温度、以及室外环境下，尤其是夏季，若相机模块没有较好的导热散热性能不好，会导致其内部的元器件在高温下损坏或使用寿命降低；若为促进相机的散热而使相机内部与外界相通，则无法保证相机的防水防尘，从而影响内部元器件的使用安全和使用寿命。
发明内容
在发明内容部分中引入了一系列简化形式的概念，这将在具体实施方式部分中进一步详细说明。本发明的发明内容部分并不意味着要试图限定出所要求保护的技术方案的关键特征和必要技术特征，更不意味着试图确定所要求保护的技术方案的保护范围。
针对现有技术的不足，本发明实施例第一方面提供一种相机模块，所述相机模块包括：
相机壳体，所述相机壳体内部具有容置空间；
图像采集单元，设置于所述容置空间内；
导热单元，分别与所述图像采集单元和所述相机壳体相接触，以将所述图像采集单元的热量传导到所述相机壳体上；
其中，所述导热单元包括中间部和边缘部，所述中间部与所述图像采集单元相接触；所述边缘部与所述相机壳体贴合，以使所述导热单元与所述相机壳体之间基本密封。
本发明实施例第二方面提供一种可移动平台，所述可移动平台包括：
可移动平台本体；
搭载于所述可移动平台本体上的相机模块，所述相机模块包括：
相机壳体，所述相机壳体内部具有容置空间；
图像采集单元，设置于所述容置空间内；
导热单元，分别与所述图像采集单元和所述相机壳体相接触，以将所述图像采集单元的热量传导到所述相机壳体上；
其中，所述导热单元包括中间部和边缘部，所述中间部与所述图像采集单元相接触；所述边缘部与所述相机壳体贴合，以使所述导热单元与所述相机壳体之间基本密封。
本发明实施例的相机模块和可移动平台通过设置与发热量较大的图像采集单元接触的导热单元，将图像采集单元上的热量传导到导热单元上，通过导热单元与相机壳体直接接触，将热量传导至相机壳体上，并最终传导到空气或与壳体接触的其他零件上，从而有效缓解了图像采集单元过热导致寿命降低的问题。同时，导热单元与相机壳体相贴合，两者基本密封，保证了防水防尘效果。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本发明一个实施例的相机模块的爆炸图；
图2是本发明一个实施例的相机模块于一角度下的立体示意图；
图3是本发明一个实施例的相机模块于另一角度下的立体示意图；
图4是本发明一个实施例的相机模块的剖面示意图；
图5是本发明一个实施例的相机模块的另一剖面示意图；
图6是本发明一个实施例的可移动平台的结构框图。
具体实施方式
为了使得本发明的目的、技术方案和优点更为明显，下面将参照附图详细描述根据本发明的示例实施例。显然，所描述的实施例仅仅是本发明的一部分实施例，而不是本发明的全部实施例，应理解，本发明不受这里描述的示例实施例的限制。基于本发明中描述的本发明实施例，本领域技术人员在没有付出创造性劳动的情况下所得到的所有其它实施例都应落入本发明的保护范围之内。
在下文的描述中，给出了大量具体的细节以便提供对本发明更为彻底的理解。然而，对于本领域技术人员而言显而易见的是，本发明可以无需一个或多个这些细节而得以实施。在其他的例子中，为了避免与本发明发生混淆，对于本领域公知的一些技术特征未进行描述。
应当理解的是，本发明能够以不同形式实施，而不应当解释为局限于这里提出的实施例。相反地，提供这些实施例将使公开彻底和完全，并且将本发明的范围完全地传递给本领域技术人员。
在此使用的术语的目的仅在于描述具体实施例并且不作为本发明的限制。在此使用时，单数形式的“一”、“一个”和“所述/该”也意图包括复数形式，除非上下文清楚指出另外的方式。还应明白术语“组成”和/或“包括”，当在该说明书中使用时，确定所述特征、整数、步骤、操作、元件和/或部件的存在，但不排除一个或更多其它的特征、整数、步骤、操作、元件、部件和/或组的存在或添加。在此使用时，术语“和/或”包括相关所列项目的任何及所有组合。
为了彻底理解本发明，将在下列的描述中提出详细的结构，以便阐释本发明提出的技术方案。本发明的可选实施例详细描述如下，然而除了这些详细描述外，本发明还可以具有其他实施方式。
目前应用于可移动平台上的相机模块考虑较多的是外置相机模块防水防起雾的性能要求，对于功耗越来越高，发热量越来越大图像传感器的导热散热问题没有考虑。例如，以往的车内相机模块不设置散热结构，因为图像传感器功耗小，发热量低，即使热量堆积于相机模块内部，对于元器件的使用寿命影响也比较小。然而，随着对于图像分辨率及采集视频帧数的要求越来越高，图像传感器的功耗及发热量也越来越大，用于可移动平台的相机模块的发热问题也逐渐暴露出来。
一般设置在可移动平台上的相机外形尺寸都相对较小，无法采用风扇等主动散热方式，而可移动平台可能需要长时间处于较高的环境温度、以及室外环境下，尤其是夏季，若相机模块没有较好的导热散热性能不好，会导致其内部的元器件在高温下损坏或使用寿命降低；若为促进相机的散热而使相机内部与外界相通，则无法保证相机的防水防尘，从而影响内部元器件的使用安全和使用寿命。
针对以上问题，本发明实施例提供了一种具有良好导热散热性能的相机模块以及包括该相机模块的可移动平台，通过在相机模块中增加导热单元，将图像采集单元产生的热量传导至相机壳体以进行散热，避免元器件长时间处于高温情况下而出现寿命降低的情况。同时，导热单元的边缘与相机壳体相贴合，两者之间基本密封，保证了防水防尘的效果。在可移动平台应用场景中，具有优异的散热、防水防尘功能。
下面结合附图对本发明实施例的相机模块做进一步的说明。参见图1至图5，其中图1为本发明一个本实施例的相机模块的爆炸图；图2是本发明一个实施例的相机模块于一角度下的立体示意图；图3是本发明一个实施例的相机模块于另一角度下的立体示意图；图4是本发明一个实施例的相机模块的剖面示意图；图5是本发明一个实施例的相机模块的另一剖面示意图。
参照图1，本发明实施例的相机模块包括相机壳体103，所述相机壳体103内部具有容置空间。容置空间中设置有图像采集单元和导热单元，导热单元分别与图像采集单元和相机壳体103相接触，以将图像采集单元的热量传导到相机壳体103上，并最终传导到空气或与壳体接触的其他零件上。
具体地，参照图4和图5，相机壳体103为中空壳体，从而在内部形成容置空间；同时，相机壳体103的前部向前凸出形成凸台，该凸台前部连通外部空间，以用于安装图像采集单元中的光学镜头组件101，使光学镜头组件101能够接收外部光线，参照图2。在一些实施例中，相机壳体103可以由热传导材料制成，以提高散热效果。例如，相机壳体103可以采用金属材料制成。
在一些实施例中，相机壳体103的外部可以设置其他散热结构，或者，相机壳体103的外表面可以设置为易于散热的形式，例如，增大相机壳体103外表面的表面积，以进一步提高散热效果。
相机壳体103中设置有图像采集单元，用于实现图像采集功能。图像采 集单元还包括依次设置的光学镜头组件101和图像传感器105和图像采集电路板106。也就是说，光学镜头组件101设置于图像传感器105的前方，且图像采集电路板106设置于图像传感器105的后方。
示例性地，光学镜头组件101包括透镜镜筒以及设置于透镜镜筒中的至少一片透镜。透镜镜筒可以采用高导热性的金属类材料形成。透镜可以通过粘接剂等固定到透镜镜筒内部。示例性地，参照图1，光学镜头组件101可以通过镜头粘接胶水102与凸台粘接固定。或者，透镜镜筒外部也可以设置有用于安装到相机壳体103的外螺纹部。相机壳体103的凸台内部设置有内螺纹部，从而与外螺纹部配合连接。
示例性地，图像传感器包括但不限于CCD(电荷耦合器件)或CMOS(互补金属氧化物半导体)传感器。图像传感器105与周边电路部件一起安装于图像采集电路板106。图像传感器105与图像采集电路板106之间可以通过电子元器件焊接固定。图像采集电路板106与相机壳体103之间可以通过螺丝连接固定。在一些实施例中，相机壳体103上设置定位柱，图像采集电路板106上设置定位孔，通过定位柱和定位孔的配合可以实现图像采集电路板的精确定位。
在一个实施例中，由于光学镜头组件101与外部连通，因而相机壳体103与图像采集电路板106之间还设置有防尘结构件104，通过防尘结构件104的压缩密封，隔绝图像传感器105与空气的接触，降低图像传感器105沾染空气中灰尘的风险。
其中，防尘结构件104可以采用泡棉，其具有一定可压缩量，可以通过图像采集电路板106和相机壳体103的固定过程对防尘结构件104进行压缩。压缩后泡棉孔径小于空气中灰尘大小，从而能够对图像传感器105起到隔绝空气灰尘的作用。
由此设置，外部的环境光线即从前方经光学镜头组件101进入保护壳相机壳体103，随后照射于图像传感器105上，以便于图像传感器105接收外部的环境光线，记录环境影像。
其中，随着图像分辨率及采集视频帧数的提高，图像传感器105在工作过程中会产生大量的热量，因而成为相机模块中的主要发热器件。由于图像传感器105设于图像采集电路板106，从而将热量传导至图像采集电路板106，因而本发明实施例的导热单元与图像采集电路板106的至少一面相接触，从 而对图像采集电路板106进行散热。
进一步地，由于图像传感器105设于图像采集电路板106的前方，为了避免影响相机模块的正常装配，导热单元与图像采集电路板106的背面接触。
导热单元包括中间部114和边缘部115，中间部114与所述图像采集单元相接触，从而传导图像采集单元的热量；边缘部115与所述相机壳体贴合，一方面将热量传导至相机壳体，另一方面，导热单元与相机壳体之间基本密封，起到防水防尘效果。导热单元的中间部114包括平台部。导热单元的边缘部115包括侧壁部和外沿部。侧壁部沿平台部的边缘向下延伸、外沿部沿侧壁的底部向外延伸。其中，平台部与图像采集电路板106相平行。侧壁部沿平台部的边缘向下延伸，从而与相机壳体103的内壁相贴合，并构成了较大的接触面。沿侧壁部的底部向外延伸的外沿部与相机壳体103的底部相贴合，外沿部的上下两侧分别由相机壳体103和控制电路板112压紧固定。
具体地，导热单元包括导热结构件110和导热介质109。导热介质109位于中间部114，其一侧贴合图像采集单元中的图像采集电路板106，另一侧贴合导热结构件110。导热结构件110部分位于所述中间部114，部分位于所述边缘部115。导热结构件110分别与导热介质109和相机壳体103相接触；导热介质109与图像采集电路板106和导热结构件110紧密贴合，从而将图像采集电路板106的热量传导至导热结构件110；导热结构件110将热量传导至相机壳体103。由此，既能够保证图像采集电路板106的散热，又无需贯穿相机壳体103，保证了相机壳体103内部的密封效果。
其中，参照图1、图4和图5，导热结构件110包括平台部、沿平台部的边缘向下延伸的侧壁部、以及沿侧壁的底部向外延伸的外沿部。其中，平台部与图像采集电路板106相平行。侧壁部沿平台部的边缘向下延伸，从而与相机壳体103的内壁相贴合，并构成了较大的接触面。沿侧壁部的底部向外延伸的外沿部与相机壳体103的底部相贴合，外沿部的上下两侧分别由相机壳体103和控制电路板112压紧固定。
在一些实施例中，由于图像采集电路板106下方还包括固定螺丝108等结构，因而导热结构件的平台部与图像采集电路板106之间间隔一定距离。平台部上与图像采集电路板相对应的位置处设有凸起结构，例如凸台或凸包，以填补上述距离。导热介质设置在图像采集电路板106与凸起结构之间，与 二者分别紧密接触。
如上所述的导热结构件110结构紧凑，所占用的空间较小，对相机模块体积的影响较小。但需要注意的是，导热结构件110并不限于上述形状，本实施例此处只是举例说明，只要导热结构件110能够与图像采集电路板106和相机壳体103的内壁接触，以将图像采集电路板106的热量通过相机壳体103快速导出即可。
由于导热结构件110用于图像采集电路板106与相机壳体103之间的热传导，因而采用高热导率的材料，例如金属材料制成。进一步地，导热结构件110可以采用兼具高热导率和高延展性的紫铜制成。
导热介质109主要用于提高图像采集电路板106与导热结构件110之间的热传导效率。导热介质109分别与图像采集电路板106和导热结构件110的凸起结构接触或粘接。导热介质109使用高导热率的材料以保证热传导效果；此外，由于导热介质设置在相机壳体103的内部的狭小空间中，因而优选为柔性材料。综合以上考虑，导热介质的材料可以选用导热凝脂。导热凝脂为具有高热导率的胶装物体，能够增加图像采集电路板106与导热结构件110之间的导热面积。
此外，整体来说，当相机模块应用于可移动平台时，需要额外的电路组件来与可移动平台的主机进行连接，因而本发明实施例的相机模块还包括控制电路单元，用于负责与可移动平台的主机进行信号连接，以便信号控制及传递。
具体地，控制电路单元位于导热单元后方，主要包括控制电路板112。控制电路板112与相机壳体103围合构成容置空间，也就是说，该容置空间的后方由控制电路板112实现密封。控制电路板112与相机壳体103之间可以通过螺丝连接固定。
控制电路板112连接图像采集电路板106，以接收图像采集单元采集的图像信息，并将图像采集单元采集的图像信息发送至可移动平台的主机。
作为示例，图像采集电路板106和控制电路板112之间可以采用板对板连接器连接。参照图5，板对板连接器包括板对板连接器公座107和板对板连接器母座111，板对板连接器公座107通过电子元器件焊接的方式固定于图像采集电路板106，板对板连接器母座111通过电子元器件焊接的方式固定于控制电路板112，通过板对板连接器公座107和板对板连接器母座111的接合 实现图像采集电路板106与控制电路板112的电性连接。
进一步地，由于图像采集电路板106与控制电路板112之间具有板对板连接器，例如上述的板对板连接器公座107和板对板连接器母座111，而导热结构件110设置在图像采集电路板106与控制电路板112之间，因而导热结构件的相应位置处设置有开口，板对板连接器贯穿所述开口，从而连接图像采集电路板106和控制电路板112。
进一步地，参见图4，控制电路单元还包括电连接器113，电连接器113一端连接控制电路板112，另一端为外部接口，其伸出相机壳体103以外与其他接口连接。电连接器113包括但不限于法卡电连接器。示例性地，控制电路板112具有多个插孔，电连接器113插入相应的插孔中进行电子元器件焊接。
基于以上描述，本发明实施例的相机模块过设置与发热量较大的图像采集单元接触的导热单元，将图像采集单元上的热量传导到导热单元上，通过导热单元与相机壳体直接接触，将热量传导至相机壳体上，并最终传导到空气或与相机壳体接触的其他零件上，从而有效缓解了图像采集单元过热导致寿命降低的问题。
本发明实施例另一方面提供了一种可移动平台，参照图6，本发明实施例提供的可移动平台600包括可移动平台本体610和搭载于可移动平台本体610上的相机模块620，该相机模块620可以是如上所述的相机模块，其具体包括：相机壳体，相机壳体内部具有容置空间；图像采集单元，设置于容置空间内；导热单元，分别与图像采集单元和相机壳体相接触，以将图像采集单元的热量传导到相机壳体上，其中，所述导热单元包括中间部和边缘部，所述中间部与所述图像采集单元相接触；所述边缘部与所述相机壳体贴合，以使所述导热单元与所述相机壳体之间基本密封。
其中，可移动平台600包括汽车、遥控车、机器人、无人机或船中的至少一种。当可移动平台600为汽车时，可移动平台本体610为汽车的车身。当可移动平台600为遥控车时，可移动平台本体610为遥控车的车身。当可移动平台600为机器人时，可移动平台本体610为机器人的本体，以此类推。
在一个实施例中，所述图像采集单元包括：图像采集电路板，所述导热单元与所述图像采集电路板的至少一面相接触。所述图像采集单元还包括依 次设置的光学镜头组件、以及图像传感器，所述图像传感器设于所述图像采集电路板。
所述导热单元包括导热结构件和导热介质，所述导热介质位于所述中间部，所述导热结构件部分位于所述中间部，部分位于所述边缘部。
所述导热介质的一侧贴合所述图像采集单元，所述导热介质的另一侧贴合所述导热结构件，所述导热结构件分别与所述导热介质和所述相机壳体相接触。
在一个实施例中，所述图像采集单元包括图像采集电路板，所述导热介质贴合所述图像采集电路板
在一个实施例中，所述导热结构件包括平台部、沿平台部的边缘向下延伸的侧壁部、以及沿侧壁的底部向外延伸的外沿部，所述侧壁部与所述相机壳体的内壁相贴合，所述外沿部与所述相机壳体的底部相贴合。
在一个实施例中，所述平台部上设有凸起结构，所述导热介质与所述凸起结构相接触。
在一个实施例中，所述导热介质的材料包括导热凝脂。所述导热结构件的材料包括金属。
在一个实施例中，相机模块620还包括控制电路单元，所述导热单元设置在所述图像采集单元与所述控制电路单元之间。所述控制电路单元包括控制电路板，所述控制电路板连接所述图像采集电路板，所述相机壳体与所述控制电路板围合构成所述容置空间。所述导热单元设置于所述图像采集电路板与所述控制电路单元之间，所述导热结构件中设置有开口，相机模块620还包括贯穿所述开口的板对板连接器，用于连接所述图像采集电路板和所述控制电路板。
在一个实施例中，所述控制电路单元还包括电连接器，所述电连接器一端连接所述控制电路板，另一端为外部接口。
在一个实施例中，所述相机壳体与所述图像采集电路板之间设置有防尘结构件。
相机模块620的其他具体细节可以参照上文参照图1至图5描述的相机模块，在此不做赘述。
本发明实施例的可移动平台所采用的相机模块过设置与发热量较大的图像采集单元接触的导热单元，将图像采集单元上的热量传导到导热单 元上，通过导热单元与相机壳体直接接触，将热量传导至相机壳体上，并最终传导到空气或与壳体接触的其他零件上，从而有效缓解了图像采集单元过热导致寿命降低的问题。
尽管这里已经参考附图描述了示例实施例，应理解上述示例实施例仅仅是示例性的，并且不意图将本发明的范围限制于此。本领域普通技术人员可以在其中进行各种改变和修改，而不偏离本发明的范围和精神。所有这些改变和修改意在被包括在所附权利要求所要求的本发明的范围之内。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本发明的范围。
在本申请所提供的几个实施例中，应该理解到，所揭露的设备和方法，可以通过其它的方式实现。例如，以上所描述的设备实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个设备，或一些特征可以忽略，或不执行。
在此处所提供的说明书中，说明了大量具体细节。然而，能够理解，本发明的实施例可以在没有这些具体细节的情况下实践。在一些实例中，并未详细示出公知的方法、结构和技术，以便不模糊对本说明书的理解。
类似地，应当理解，为了精简本发明并帮助理解各个发明方面中的一个或多个，在对本发明的示例性实施例的描述中，本发明的各个特征有时被一起分组到单个实施例、图、或者对其的描述中。然而，并不应将该本发明的方法解释成反映如下意图：即所要求保护的本发明要求比在每个权利要求中所明确记载的特征更多的特征。更确切地说，如相应的权利要求书所反映的那样，其发明点在于可以用少于某个公开的单个实施例的所有特征的特征来解决相应的技术问题。因此，遵循具体实施方式的权利要求书由此明确地并入该具体实施方式，其中每个权利要求本身都作为本发明的单独实施例。
本领域的技术人员可以理解，除了特征之间相互排斥之外，可以采用任何组合对本说明书(包括伴随的权利要求、摘要和附图)中公开的所有特征以及如此公开的任何方法或者设备的所有过程或单元进行组合。除非另外明 确陈述，本说明书(包括伴随的权利要求、摘要和附图)中公开的每个特征可以由提供相同、等同或相似目的替代特征来代替。
此外，本领域的技术人员能够理解，尽管在此所述的一些实施例包括其它实施例中所包括的某些特征而不是其它特征，但是不同实施例的特征的组合意味着处于本发明的范围之内并且形成不同的实施例。例如，在权利要求书中，所要求保护的实施例的任意之一都可以以任意的组合方式来使用。
本发明的各个部件实施例可以以硬件实现，或者以在一个或者多个处理器上运行的软件模块实现，或者以它们的组合实现。本领域的技术人员应当理解，可以在实践中使用微处理器或者数字信号处理器(DSP)来实现根据本发明实施例的一些模块的一些或者全部功能。本发明还可以实现为用于执行这里所描述的方法的一部分或者全部的装置程序(例如，计算机程序和计算机程序产品)。这样的实现本发明的程序可以存储在计算机可读介质上，或者可以具有一个或者多个信号的形式。这样的信号可以从因特网网站上下载得到，或者在载体信号上提供，或者以任何其他形式提供。
应该注意的是上述实施例对本发明进行说明而不是对本发明进行限制，并且本领域技术人员在不脱离所附权利要求的范围的情况下可设计出替换实施例。在权利要求中，不应将位于括号之间的任何参考符号构造成对权利要求的限制。本发明可以借助于包括有若干不同元件的硬件以及借助于适当编程的计算机来实现。在列举了若干装置的单元权利要求中，这些装置中的若干个可以是通过同一个硬件项来具体体现。单词第一、第二、以及第三等的使用不表示任何顺序。可将这些单词解释为名称。

Claims (31)

  1. 一种相机模块，用于可移动平台，其特征在于，所述相机模块包括：
    相机壳体，所述相机壳体内部具有容置空间；
    图像采集单元，设置于所述容置空间内；
    导热单元，分别与所述图像采集单元和所述相机壳体相接触，以将所述图像采集单元的热量传导到所述相机壳体上；
    其中，所述导热单元包括中间部和边缘部，所述中间部与所述图像采集单元相接触；所述边缘部与所述相机壳体贴合，以使所述导热单元与所述相机壳体之间基本密封。
  2. 如权利要求1所述的相机模块，其特征在于，所述图像采集单元包括：图像采集电路板，所述导热单元与所述图像采集电路板的至少一面相接触。
  3. 如权利要求2所述的相机模块，其特征在于，所述图像采集单元还包括依次设置的光学镜头组件、以及图像传感器，所述图像传感器设于所述图像采集电路板。
  4. 如权利要求1所述的相机模块，其特征在于，所述导热单元包括导热介质和导热结构件；所述导热介质位于所述中间部，所述导热结构件部分位于所述中间部，部分位于所述边缘部。
  5. 如权利要求4所述的相机模块，其特征在于，所述导热介质的一侧贴合所述图像采集单元，所述导热介质的另一侧贴合所述导热结构件，所述导热结构件分别与所述导热介质和所述相机壳体相接触。
  6. 如权利要求5所述的相机模块，其特征在于，所述图像采集单元包括图像采集电路板，所述导热介质贴合所述图像采集电路板。
  7. 如权利要求4所述的相机模块，其特征在于，所述导热结构件包括平台部、沿平台部的边缘向下延伸的侧壁部、以及沿侧壁的底部向外延伸的外沿部，所述侧壁部与所述相机壳体的内壁相贴合，所述外沿部与所述相机壳体的底部相贴合。
  8. 如权利要求4所述的相机模块，其特征在于，所述平台部上设有凸起结构，所述导热介质与所述凸起结构相接触。
  9. 如权利要求4所述的相机模块，其特征在于，所述导热介质的材料包括导热凝脂；和/或，
    所述导热结构件的材料包括金属。
  10. 如权利要求2-9之一所述的相机模块，其特征在于，还包括控制电路单元，所述导热单元设置在所述图像采集单元与所述控制电路单元之间。
  11. 如权利要求10所述的相机模块，其特征在于，所述控制电路单元包括控制电路板，所述控制电路板连接所述图像采集电路板，所述相机壳体与所述控制电路板围合构成所述容置空间。
  12. 如权利要求11所述的相机模块，其特征在于，所述导热单元设置于所述图像采集电路板与所述控制电路单元之间。
  13. 如权利要求12所述的相机模块，其特征在于，所述导热结构件中设置有开口，所述相机模块还包括贯穿所述开口的板对板连接器，用于连接所述图像采集电路板和所述控制电路板。
  14. 如权利要求11所述的相机模块，其特征在于，所述控制电路单元还包括电连接器，所述电连接器一端连接所述控制电路板，另一端为外部接口。
  15. 如权利要求2所述的相机模块，其特征在于，所述相机壳体与所述图像采集电路板之间设置有防尘结构件。
  16. 一种可移动平台，其特征在于，所述可移动平台包括：
    可移动平台本体；
    搭载于所述可移动平台本体上的相机模块，所述相机模块包括：
    相机壳体，所述相机壳体内部具有容置空间；
    图像采集单元，设置于所述容置空间内；
    导热单元，分别与所述图像采集单元和所述相机壳体相接触，以将所述图像采集单元的热量传导到所述相机壳体上；
    其中，所述导热单元包括中间部和边缘部，所述中间部与所述图像采集单元相接触；所述边缘部与所述相机壳体贴合，以使所述导热单元与所述相机壳体之间基本密封。
  17. 如权利要求16所述的可移动平台，其特征在于，所述可移动平台包括汽车、遥控车、机器人、无人机或船。
  18. 如权利要求16所述的可移动平台，其特征在于，所述图像采集单元包括：图像采集电路板，所述导热单元与所述图像采集电路板的至少一面相接触。
  19. 如权利要求18所述的可移动平台，其特征在于，所述图像采集单元还包括依次设置的光学镜头组件、以及图像传感器，所述图像传感器设于所述图像采集电路板。
  20. 如权利要求16所述的可移动平台，其特征在于，所述导热单元包括导热介质和导热结构件；所述导热介质位于所述中间部，所述导热结构件部分位于所述中间部，部分位于所述边缘部。
  21. 如权利要求17所述的可移动平台，其特征在于，所述导热介质的一侧贴合所述图像采集单元，所述导热介质的另一侧贴合所述导热结构件，所述导热结构件分别与所述导热介质和所述相机壳体相接触。
  22. 如权利要求20所述的可移动平台，其特征在于，所述图像采集单元包括图像采集电路板，所述导热介质贴合所述图像采集电路板
  23. 如权利要求20所述的可移动平台，其特征在于，所述导热结构件包括平台部、沿平台部的边缘向下延伸的侧壁部、以及沿侧壁的底部向外延伸的外沿部，所述侧壁部与所述相机壳体的内壁相贴合，所述外沿部与所述相机壳体的底部相贴合。
  24. 如权利要求20所述的可移动平台，其特征在于，所述平台部上设有凸起结构，所述导热介质与所述凸起结构相接触。
  25. 如权利要求20所述的可移动平台，其特征在于，所述导热介质的材料包括导热凝脂；和/或，
    所述导热结构件的材料包括金属。
  26. 如权利要求18-25之一所述的可移动平台，其特征在于，还包括控制电路单元，所述导热单元设置在所述图像采集单元与所述控制电路单元之间。
  27. 如权利要求26所述的可移动平台，其特征在于，所述控制电路单元包括控制电路板，所述控制电路板连接所述图像采集电路板，所述相机壳体与所述控制电路板围合构成所述容置空间。
  28. 如权利要求27所述的可移动平台，其特征在于，所述导热单元设置于所述图像采集电路板与所述控制电路单元之间。
  29. 如权利要求28所述的可移动平台，其特征在于，所述导热结构件中设置有开口，所述相机模块还包括贯穿所述开口的板对板连接器，用于连接 所述图像采集电路板和所述控制电路板。
  30. 如权利要求26所述的可移动平台，其特征在于，所述控制电路单元还包括电连接器，所述电连接器一端连接所述控制电路板，另一端为外部接口。
  31. 如权利要求18所述的可移动平台，其特征在于，所述相机壳体与所述图像采集电路板之间设置有防尘结构件。
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CN107113371B (zh) * 2015-11-23 2020-06-05 深圳市大疆创新科技有限公司 影像撷取模组及航拍飞行器
CN105573014A (zh) * 2016-01-22 2016-05-11 南昌欧菲光电技术有限公司 具有对焦及防抖功能的摄像头模组
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DE102022108087A1 (de) 2022-04-05 2023-10-05 B. Braun Melsungen Aktiengesellschaft Analysevorrichtung mit separater und außenliegender Probenaufnahmevorrichtung

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