WO2017086097A1 - 発光素子光源モジュール - Google Patents

発光素子光源モジュール Download PDF

Info

Publication number
WO2017086097A1
WO2017086097A1 PCT/JP2016/081516 JP2016081516W WO2017086097A1 WO 2017086097 A1 WO2017086097 A1 WO 2017086097A1 JP 2016081516 W JP2016081516 W JP 2016081516W WO 2017086097 A1 WO2017086097 A1 WO 2017086097A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
cooling medium
channel
light source
emitting element
Prior art date
Application number
PCT/JP2016/081516
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
隆博 井上
松島　竹夫
中島　敏博
Original Assignee
ウシオ電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ウシオ電機株式会社 filed Critical ウシオ電機株式会社
Priority to CN201680064470.1A priority Critical patent/CN108351092A/zh
Publication of WO2017086097A1 publication Critical patent/WO2017086097A1/ja

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes

Definitions

  • the present invention relates to a light emitting element light source module provided with a plurality of light emitting elements such as LED (light emitting diode) elements.
  • UV curing technology technologies for curing ultraviolet curable resins (UV curing technology) are used in various fields, specifically, for example, liquid crystal panel manufacturing processes (ODF method), printed circuit board manufacturing processes (exposure processing), and printing inks. It is used in the fixing process (drying process).
  • a light emitting element light source module using a light emitting element such as an LED element as a light source is used as a light source in an ultraviolet irradiation apparatus used in such a UV curing process (ultraviolet curing process).
  • a light-emitting element light source module that uses LED elements as a light-emitting source is usually configured by arranging a large number of LED elements at high density.
  • each of the large number of LED elements is likely to increase in temperature due to its own heat generation or heat received from the surroundings, resulting in the LED element itself.
  • the luminous efficiency is lowered.
  • a light-emitting element light source module having a large number of LED elements a plurality of substrates on which a plurality of LED elements are arranged are each arranged on a heat sink, and each of the plurality of heat sinks is arranged.
  • exchange is possible on the support stand which consists of metals through the spacer which consists of insulating materials is proposed (refer patent document 1).
  • a cooling flow path for circulating a cooling medium is formed inside each heat sink.
  • a cooling medium supply channel through which the cooling medium supplied to the cooling channels in the plurality of heat sinks flows, and a cooling medium discharge channel through which the cooling medium discharged from the cooling channels flows Is formed.
  • the spacer is formed with a cooling medium supply through-hole and a cooling medium discharge through-hole communicating with each of the cooling flow paths in the plurality of heat sinks, and the cooling medium supply flow path and the cooling medium discharge flow path in the support base.
  • the heat sink formed by bonding the substrate on which the LED element that needs to be replaced is bonded is removed from the support base, and a new heat sink (specifically, a heat sink formed by bonding the substrate) is attached.
  • a new heat sink specifically, a heat sink formed by bonding the substrate
  • the channel structure of the cooling channel has not been sufficiently studied, and therefore, a large number of LED elements cannot be efficiently and uniformly cooled. There is a problem.
  • the present invention has been made based on the above circumstances, and an object thereof is to provide a light emitting element light source module capable of cooling a plurality of light emitting elements efficiently and with high uniformity. is there.
  • the light emitting element light source module of the present invention includes a light source unit in which a plurality of light emitting elements are arranged on the surface of a heat sink made of a heat conductive material, and a cooling block arranged on the back surface of the heat sink.
  • a cooling channel for circulating a cooling medium is formed in the heat sink
  • the cooling flow path has a flat cross-sectional shape in which the flow path width is larger than the flow path height and extends along the surface of the heat sink, and the cooling medium supply port and the cooling medium discharge port in the cooling flow path are respectively Connected to the cooling medium supply channel and the cooling medium discharge channel formed in the cooling block,
  • the cooling flow path has a plurality of flow path portions that are continuous with each other and are adjacent to each other via a thermally conductive partition wall in a region immediately below the light emitting element arrangement region on the surface of the heat sink where a plurality of light emitting elements are arranged.
  • the thickness of the thermally conductive partition wall portion is smaller than the channel width of the cooling channel.
  • the cooling flow path is continuous with a first flow path portion extending along one edge of the light emitting element arrangement region and a cooling medium outlet of the first flow path portion. And it is preferable to have the 2nd flow-path part extended in the same direction as the said 1st flow-path part through the said heat conductive partition part. In the light emitting element light source module of the present invention having such a configuration, it is preferable that the cooling medium supply port and the cooling medium discharge port are respectively provided outside the region immediately below.
  • the cooling channel preferably has a ratio of the channel width to the channel height of 1.5 to 3.5.
  • the area of the area occupied by the cooling flow path in the light emitting element arrangement area is the light emitting element. It is preferably 80% or more with respect to the area of the arrangement region.
  • the cooling block is common to the plurality of light source units, It is preferable that the cooling medium supply port and the cooling medium discharge port of each of the cooling channels in the plurality of light source units are connected to a common cooling medium supply channel and a common cooling medium discharge channel in the cooling block.
  • the cooling flow path formed inside the heat sink has a plurality of flow path portions in a region immediately below the light emitting element arrangement area where the plurality of light emitting elements are arranged on the surface of the heat sink.
  • heat is exchanged between the cooling media flowing through the adjacent flow path portions, temperature uniformity in the plurality of flow path portions is achieved, so that a large temperature gradient does not occur in the cooling flow paths. .
  • the cooling block is formed on the back surface of the heat sink. Therefore, since the temperature of the cooling medium flowing through the cooling medium supply channel is suppressed from being increased by heat received from the light emitting element, a large temperature gradient is not generated in the cooling medium supply channel. Moreover, it can suppress that the cooling medium which distribute
  • FIG. 1 is a cross-sectional view for explaining an example of the configuration of the light-emitting element light source module of the present invention
  • FIG. 2 shows the surface of the assembly of the cooling block and the light source unit constituting the light-emitting element light source module of FIG.
  • FIG. 3 is an explanatory view showing a (light emitting surface) side
  • FIG. 3 is an explanatory view showing a cross section of an assembly of a cooling block and a light source unit constituting the light emitting element light source module of FIG. 1, and
  • the light-emitting element light source module 10 includes a plurality of (three in the illustrated example) light source units 20.
  • Each of the plurality of light source units 20 includes a rectangular flat plate-like substrate 22 having a plurality of light emitting elements 21 disposed on the surface (the lower surface in FIG. 1 and the upper surface in FIG. 3). It is located on the surface of 31 (the lower surface in FIG. 1 and the upper surface in FIG. 3). Further, in each of the plurality of light source units 20, a cooling flow path 35 for circulating a cooling medium such as water is formed inside the heat sink 31.
  • the plurality of light source units 20 are arranged on the surface of the substantially rectangular flat plate-like cooling block 40 (the lower surface in FIG. 1 and the upper surface in FIG.
  • the plurality of heat sinks 31 and the cooling block 40 constitute a water cooling structure for cooling a large number of light emitting elements 21 (a plurality of light emitting elements 21 constituting each of the plurality of light source units 20) with a cooling medium.
  • the plurality of light source units 20 and the cooling block 40 are covered with an aluminum cover member 12 having a substantially rectangular parallelepiped appearance.
  • the cover member 12 has a rectangular opening formed in a region facing the light emitting elements 21 on the bottom surface (the lower surface in FIG. 1) of the cover member 12, and this opening is a window made of borosilicate glass. It is closed by the member 13.
  • a power supply unit (not shown) connected to an external power source is provided on one side surface of the cover member 12, and a cooling medium supply opening (not shown) and a cooling medium discharge opening (not shown) are provided. Is formed.
  • a region 12 ⁇ / b> A surrounding a space in which an optical path from the light emitting elements 21 provided on each of the plurality of substrates 22 to the window member 13 is formed.
  • mirror processing may be performed from the viewpoint of emitting light from the light emitting elements 21 from the window member 13 with high efficiency.
  • the light emitting element light source module 10 may be configured to reflect or refract light from a large number of light emitting elements 21 by optical members such as mirrors and lenses in order to obtain desired illuminance and illuminance distribution. Good.
  • the large number of light emitting elements 21 and the window member 13 are such that most of the light emitted from the large number of light emitting elements 21 at a radiation angle (half angle) of about 60 ° is transmitted through the window member 13. Are arranged as close as possible.
  • Each of the plurality of light source units 20 is bonded to the surface of the heat sink 31 with the substrate 22 having the plurality of light emitting elements 21 disposed on the surface in a state where the back surface of the substrate 22 and the surface of the heat sink 31 face each other. It is a thing.
  • a bonding layer (not shown) made of a heat conductive bonding material is formed between the heat sink 31 and the substrate 22.
  • the heat conductive bonding material for example, a heat conductive adhesive and a heat conductive double-sided adhesive sheet are used.
  • the heat sink 31 is configured by a rectangular flat plate-shaped large diameter portion 31A and rectangular flat plate-shaped small diameter portions 31B stacked on the large diameter portion 31A.
  • the large diameter portion 31A has a dimension that is larger than the dimension in the longitudinal direction of the substrate 22 in the longitudinal direction, while the dimension in the lateral direction is slightly smaller than the dimension in the lateral direction of the substrate 22.
  • the small diameter portion 31B has a dimension equivalent to the dimension in the longitudinal direction of the substrate 22 in the longitudinal direction, while the dimension equivalent to the dimension in the short direction of the large diameter part 31A in the lateral direction. have.
  • the small-diameter portion 31B is located at the center in the longitudinal direction on the surface of the large-diameter portion 31A (the lower surface in FIG. 1 and the upper surface in FIG. 3), and both end portions in the longitudinal direction on the surface of the large-diameter portion 31A. The surface is exposed.
  • the substrate 22 is disposed on the surface of the small diameter portion 31 ⁇ / b> B in a state in which both sides of the substrate 22 are slightly projected from the heat sink 31.
  • the light source units 20 adjacent to each other are in a state in which the substrate 22 is in close proximity and the heat sink 31 is in a state of being slightly separated.
  • the water-cooled structure constituted by the plurality of heat sinks 31 and the cooling block 40 is one in which a flow path for a cooling medium is formed inside the water-cooled structure.
  • This circulation channel has a cooling channel 35 in the plurality of heat sinks 31, a cooling medium supply channel 42 and a cooling medium discharge channel 44 in the cooling block 40.
  • the water cooling structure includes a supply portion 17 for supplying a cooling medium to the flow passage and a discharge portion 18 for discharging the cooling medium from the flow passage. In the area other than the area where the light source unit 20 is located.
  • the supply unit 17 and the discharge unit 18 are constituted by joint members, and a cooling medium supply opening (not shown) and a cooling medium discharge opening formed in the cover member 12 in the cooling block 40. It is provided on one side facing (not shown).
  • the leading end portion of the supply unit 17 protrudes outward from the cooling medium supply opening to the cover member 12, and the leading end portion of the discharge portion 18 protrudes outward from the cooling medium discharge opening to the cover member 12. Yes.
  • the water-cooled structure is formed by each of the plurality of light source units 20 being disposed so as to be replaceable with the back surface of the heat sink 31 being in close contact with the surface of the cooling block 40. More specifically, each of the plurality of light source units 20 is fixed by a plurality of (four in the example of this figure) fixing screws 28 so that the back surface of the heat sink 31 is in close contact with the surface of the cooling block 40. It is fixed to the cooling block 40.
  • the supply communication passage 26 extending in the stacking direction of the heat sink 31 and the cooling block 40 is formed between each of the plurality of cooling passages 35 and the cooling medium supply passage 42. Each of the plurality of cooling flow paths 35 and the cooling medium supply flow path 42 communicate with each other through these supply communication paths 26.
  • the supply communication path 26 includes a supply communication path hole 26 ⁇ / b> A in the heat sink 31 and a supply communication path hole 26 ⁇ / b> B in the cooling block 40. Further, a discharge communication passage 27 extending in the stacking direction of the heat sink 31 and the cooling block 40 is formed between each of the plurality of cooling flow paths 35 and the cooling medium discharge flow path 44. Each of the plurality of cooling channels 35 and the cooling medium discharge channel 44 are communicated with each other by the passage 27.
  • the discharge communication path 27 is configured by a discharge communication path hole 27 ⁇ / b> A in the heat sink 31 and a discharge communication path hole 27 ⁇ / b> B in the cooling block 40.
  • An annular seal member 29 is arranged between each of the plurality of light source units 20 and the cooling block 40 so as to surround each of the supply communication path 26 and the discharge communication path 27.
  • the plurality of light source units 20 are fixed to the cooling block 40 in an exchangeable manner, and the liquid tightness of the supply communication passage 26 and the discharge communication passage 27 is realized, whereby a water cooling structure is formed.
  • each of the plurality of light source units 20 is fixed to the cooling block 40 by fixing screws 28 at each of the four corners of the surface of the heat sink 31 (the surface of the large diameter portion 31A).
  • annular seal member arranging groove 41 is formed on the surface of the cooling block 40 so as to make a round of an opening communicating with the supply communication passage hole 26B and an opening communicating with the discharge communication passage hole 27B.
  • a seal member 29 made of an O-ring is arranged in the seal member arrangement groove 41, and the seal member 29 is clamped.
  • each of the plurality of light source units 20 a plurality (160 in the illustrated example) of light emitting elements 21 are two-dimensionally arranged on the surface of the substrate 22 at regular intervals.
  • the plurality of light emitting elements 21 are arranged in a substantially rectangular light emitting element arrangement region located in the center of the substrate 22 in the longitudinal direction on the surface of the substrate 22 in the short direction of the light emitting element arrangement region.
  • 10 in the vertical direction (FIG. 2) and 16 in the longitudinal direction of the light emitting element arrangement region (left and right direction in FIG. 2) are arranged in a staggered pattern.
  • On the surface of the substrate 22, a plurality of (two in the illustrated example) electrical connection portions 23 are disposed at both ends in the longitudinal direction of the substrate 22. All the light emitting elements 21 on the substrate 22 are electrically connected to the electrical connection portion 23.
  • an LED element As the light emitting element 21, an LED element, an LD (laser diode) element, or the like is used. Specifically, for example, those having peak emission wavelengths of 365 nm, 385 nm, 395 nm, 405 nm, and 450 nm are used. In the example of this figure, as the light emitting element 21, an LED element having a peak emission wavelength of 365 nm is used.
  • the base material constituting the substrate 22 an appropriate material according to the type of the light emitting element 21 or the like is used.
  • the material of the substrate 22 include thermally conductive ceramics such as aluminum nitride (AlN) and aluminum oxide (Al 2 O 3 ).
  • the base material of the substrate 22 is made of aluminum nitride.
  • each of the plurality of light source units 20 one cooling channel 35 is formed inside the heat sink 31.
  • the cooling flow path 35 is provided in parallel to the surface of the heat sink 31 so that the cooling medium can flow along the surface of the heat sink 31, and a cooling medium supply port 35A is formed at one end and the other end.
  • a cooling medium discharge port 35B is formed.
  • the heat of the plurality of light emitting elements 21 is received by the cooling medium via the substrate 22 and the heat sink 31, whereby the light emitting elements 21 are cooled.
  • the cooling channel 35 has a flat cross-sectional shape that has a channel width larger than the channel height and extends along the surface of the heat sink 31.
  • the ratio of the channel width to the channel height is preferably 1.5 to 3.5 from the viewpoint of cooling efficiency.
  • the cooling channel 35 has a cross-sectional shape having a width (channel width) of 5 mm and a height (channel height) of 2.5 mm, and the ratio of the channel width to the channel height. Is a flat rectangular shape of 2.
  • the cooling flow path 35 is a part of the light emitting element arrangement region in the area immediately below the light emitting element arrangement area where the plurality of light emitting elements 21 are located on the surface of the heat sink 31 (hereinafter also referred to as “light source immediately below area”).
  • the first flow path portion extending along the edge and the cooling medium outlet of the first flow path portion are continuous and extend in the same direction as the first flow path portion via the heat conductive partition wall 39A. It has a meandering shape with the second flow path portion. More specifically, the cooling flow path 35 extends in parallel along the region edge (specifically, the region edge extending in the short direction of the heat sink 31) 33A and 33C of the region directly below the light source in the region directly below the light source.
  • inward linear portions 36 are provided.
  • the “inner straight portion” indicates a straight flow path portion that is entirely located in the region directly under the light source.
  • the inward linear portions 36 that are adjacent to each other via the heat conductive partition wall 39A are provided as cooling medium outlets of the one inward linear portion 36.
  • the other inward linear portion 36 is communicated via a bent flow passage portion (hereinafter, also simply referred to as “bent portion”) 38A so that the cooling medium inflow port is continuous.
  • the inward linear portions 36 located on both ends in the longitudinal direction of the heat sink 31 in the region immediately below the light source extend in the region edge of the region directly below the light source (specifically, in the short direction of the heat sink 31).
  • (Region edge) 33A and 33C are located slightly inward.
  • the bent portion 38A is located slightly inward from the region edges (specifically, region edges extending in the longitudinal direction of the heat sink 31) 33B and 33D of the region directly below the light source.
  • the inward linear portions 36 located on both ends in the longitudinal direction of the heat sink 31 in the region directly below the light source are straight lines each partially located outside the region directly below the light source via a bent flow path portion (bent portion) 38B.
  • outer straight portion 37 Is communicated with a cylindrical channel portion (hereinafter also referred to as “outward linear portion”) 37.
  • outer straight portion 37 are arranged in parallel along the inner straight portion 36.
  • the thermally conductive partition wall 39B located between the outer straight portion 37 and the inner straight portion 36 is located in the region directly under the light source.
  • the cooling medium supply port 35A is formed by the cooling medium inflow port of one outer straight portion 37
  • the cooling medium discharge port 35B is formed by the cooling medium outflow port of the other outer straight portion 37.
  • the flow path lengths of these two outer straight portions 37 are such that the cooling medium supply port 35A and the cooling medium discharge port 35B are located in the center in the short direction of the heat sink 31, respectively. Is approximately half the flow path length.
  • the cooling channel 35 has a meandering shape as a whole.
  • the flow direction of the cooling medium in the cooling flow path 35 is indicated by arrows.
  • the region directly under the light source is a region surrounded by a one-dot chain line.
  • the heat conductive partition wall 39 ⁇ / b> A has a thickness smaller than the channel width of the cooling channel 35. Since the thickness of the heat conductive partition wall 39A is smaller than the channel width of the cooling channel 35, the adjacent inner straight portions 36 are located close to each other. Heat exchange is performed between the cooling media flowing through the portion 36.
  • the thickness of the thermally conductive partition wall 39A is preferably less than or equal to half the channel width of the cooling channel 35 from the viewpoint of thermal conductivity (thermal diffusion). In the example of this figure, the thickness of the heat conductive partition wall 39B is smaller than the channel width of the cooling channel 35 and is not more than half the channel width.
  • the thickness of the thermally conductive partition wall 39A is required to be equal to or greater than the thickness capable of withstanding the pressure from the cooling medium flowing through the cooling flow path 35. Furthermore, the material of the heat sink 31 and the cooling Depending on the width of the flow path 35 and in consideration of the type of the light emitting element 21 and the like, it is determined as appropriate, for example 0.5 to 2.5 mm. In the example of this figure, the thickness of the heat conductive partition wall 39A is 1 mm. The thickness of the heat conductive partition wall 39B is also 1 mm.
  • cooling flow path formation area 80% of the area of the light emitting element arrangement area (hereinafter also referred to as “light emitting element arrangement area”). The above is preferable. Since the cooling flow path formation area is 80% or more of the light emitting element arrangement area, specifically, all the light emitting elements on the substrate 22 regardless of the positional relationship between the plurality of light emitting elements 21 and the cooling flow path 35.
  • the cooling channel forming area is 83.3% of the light emitting element arrangement area.
  • the cooling medium supply port 35A and the cooling medium discharge port 35B are provided outside the region directly below the light source. It is preferable that Since the cooling medium supply port 35A and the cooling medium discharge / discharge port 35B are provided outside the region directly under the light source, it is possible to achieve more uniform temperature in the plurality of inwardly linear portions 36. Therefore, the plurality of light emitting elements 21 can be cooled with higher uniformity.
  • the cooling flow path 35 is preferably provided at a position level close to the surface of the heat sink 31 from the viewpoint of increasing the cooling efficiency by reducing the thermal resistance with the light emitting element 21.
  • the cooling channel 35 is at a position level where the depth from the surface of the heat sink 31 (the surface of the small diameter portion 31B) is 2.5 mm, that is, the distance from the surface of the heat sink 31 is 2.5 mm. It is formed to become.
  • the heat sink 31 is made of a heat conductive material.
  • the heat conductive material used for the heat sink 31 include high heat conductive metals such as copper and aluminum.
  • the thickness of the heat sink 31 is appropriately determined according to the arrangement interval of the plurality of light emitting elements 21, the cross-sectional shape of the cooling flow path 35 (specifically, the flow path height and the flow path width), and the like.
  • the heat sink 31 having such a configuration, two substantially rectangular plate-shaped base materials (specifically, a large-diameter portion base material and a small-diameter portion base material) made of a heat conductive material are joined by brazing.
  • the cooling channel 35 is formed by sealing the groove formed on the bonding surface of one of the base materials by joining the two base materials. More specifically, a cooling channel groove is formed on the joint surface of the small diameter portion base material.
  • the supply communication passage hole 26A and the discharge communication passage hole 27A are provided in the large diameter portion base material in a state where the large diameter portion base material is joined to the small diameter portion base material.
  • the two base materials constituting the heat sink 31 may be made of the same type of heat conductive material, or may be made of different types of heat conductive material.
  • the base material for a small diameter part and the base material for a large diameter part which constitute the heat sink 31 are both made of copper.
  • the cooling medium supply flow path 42 and the cooling medium discharge flow path 44 are provided in parallel to the surface of the cooling block 40, and the cooling medium supply flow path 42 is the cooling medium supplied from the supply unit 17.
  • the medium is circulated toward each of the cooling medium supply ports 35 ⁇ / b> A of the plurality of cooling channels 35, while the cooling medium discharge channel 44 is each of the cooling medium discharge ports 35 ⁇ / b> B of the plurality of cooling channels 35.
  • the cooling medium discharged from the refrigerant is circulated toward the discharge unit 18.
  • a supply opening is formed at one end of the cooling medium supply channel 42, and a supply member 17 is configured by inserting a joint member into the supply opening.
  • a discharge opening is formed at one end of the cooling medium discharge flow path 44, and a discharge member 18 is configured by inserting a joint member into the discharge opening.
  • the water cooling structure is constituted by the cooling block 40 and the plurality of heat sinks 31 as shown in the example of this figure, that is, when the plurality of cooling flow paths 35 are provided, the plurality of these cooling structures are provided.
  • the cooling medium supply channel 42 and the cooling medium discharge channel 44 preferably have the same shape (specifically, the overall shape and the cross-sectional shape) and are provided in parallel.
  • each of the cooling medium supply channel 42 and the cooling medium discharge channel 44 has a linear shape extending in the longitudinal direction of the cooling block 40, that is, in the direction in which the plurality of light source units 20 are arranged in parallel.
  • the cross-sectional shape is circular with a diameter of 6 mm.
  • the cooling medium supply channel 42 and the cooling medium discharge channel 44 are each configured by inserting a sealing member 48 on the other end side of the linear through hole formed in the cooling block 40. Yes.
  • each of the cooling medium supply channel 42 and the cooling medium discharge channel 44 it is preferable that a buffer 46 is provided from the viewpoint of controlling the pressure of the cooling medium in the flow channel.
  • each of the cooling medium supply channel 42 and the cooling medium discharge channel 44 is provided with a buffer 46.
  • the cooling block 40 is made of an appropriate metal depending on the material of the heat sink 31 from the viewpoints of mechanical strength and electric corrosion resistance. Moreover, it is preferable that the metal constituting the cooling block 40 has a lower thermal conductivity than the thermally conductive material constituting the heat sink 31. Since the cooling block 40 is made of a metal having low thermal conductivity, heat transfer between the cooling medium supply channel 42 and the cooling medium discharge channel 44 can be suppressed. Therefore, it is possible to prevent the temperature gradient of the cooling medium from increasing in the cooling medium supply flow path 42 due to the heat received from the cooling medium flowing through the cooling medium discharge flow path 44, and thus more efficient. Thus, a large number of light emitting elements 21 can be cooled. In the example of this figure, the cooling block 40 is made of stainless steel.
  • the cooling medium supplied from the supply unit 17 is discharged.
  • the path to the portion 18 is formed by the number of the cooling channels 35 connected in parallel by the cooling medium supply channel 42 and the cooling medium discharge channel 44.
  • the supply opening (supply unit 17) which is the most upstream position of the cooling medium supply flow path 42, passes through the cooling flow path 35 and reaches the uppermost position of the cooling medium discharge flow path 44. It is preferable that the length of the path to the discharge opening (discharge section 18) which is the downstream position is the same for each of the plurality of cooling flow paths 35.
  • the cooling medium is supplied from the supply unit 17 to the water cooling structure and supplied from the supply unit 17.
  • the cooling medium is distributed and flows into each of the plurality of cooling flow paths 35 via the cooling medium supply flow path 42 and the supply communication path 26.
  • the cooling medium passes through each of the plurality of cooling flow paths 35 and is then discharged from the discharge unit 18 to the outside of the water cooling structure via the discharge communication path 27 and the cooling medium discharge flow path 44. In this way, the cooling medium flows through the water-cooled structure, whereby the plurality of light emitting elements 21 are cooled by the cooling medium flowing through the heat sink 31 and the cooling flow path 35 in each of the plurality of light source units 20. Become.
  • the cooling flow path 35 formed inside the heat sink 31 has a plurality of inner straight portions 36 and a plurality of outer straight shapes in the region directly below the light source and its peripheral region.
  • the portion 37 has a channel structure in which the portions 37 are densely arranged. Therefore, the contact area between the heat sink 31 and the cooling medium can be increased without excessively increasing the flow path width of the cooling flow path 35, so that the plurality of light emitting elements 21 can be cooled with high efficiency.
  • cooling medium flow path 35 heat exchange is performed between the cooling medium flowing through the inner straight portion 36 and the outer straight portion 37 that are adjacent to each other through the heat conductive partition walls 39A and 39B, so that a plurality of inner portions Since temperature uniformity is achieved in the linear portion 36 and the plurality of outward linear portions 37, a large temperature gradient does not occur in the cooling flow path 35.
  • a cooling medium supply channel 42 and a cooling medium discharge channel 44 are formed in the cooling block 40. For this reason, the temperature of the cooling medium flowing through the cooling medium supply flow path 42 is suppressed from rising due to the heat received from the light emitting element 21, so that a large temperature gradient does not occur in the cooling medium supply flow path 42.
  • the surface temperature of the substrate 22 is within a temperature range of ⁇ 3 ° C. with an average temperature of 60 ° C. or less. can do.
  • the cooling medium supply port 35 ⁇ / b> A and the cooling medium discharge port 35 ⁇ / b> B are each provided outside the region directly under the light source, so that the temperature in the plurality of inward linear portions 36 is further increased. Uniformity can be achieved.
  • the water cooling structure is constituted by the heat sink 31 made of copper and the cooling block 40 made of stainless steel, the occurrence of electrolytic corrosion is prevented or sufficiently suppressed.
  • the cooling medium supply flow path 42 and the cooling flow path 35 are provided between the cooling medium supply flow path 42 and the cooling medium discharge flow path 44. Heat transfer between the cooling medium discharge channel 44 and the cooling channel 35 is suppressed. Therefore, the temperature gradient can be prevented from occurring in the cooling medium supply channel 42 and the cooling channel 35, so that the light emitting element 21 can be cooled more effectively.
  • a plurality of cooling channels 35 are connected in parallel by the cooling medium supply channel 42 and the cooling medium discharge channel 44, and each of the plurality of cooling channels 35 is connected.
  • the cooling medium having the same temperature as the cooling medium flowing through the supply opening in the cooling medium supply channel 42 can be caused to flow. Therefore, even if the light emitting element light source module 10 includes a plurality of light source units 20, a large number of light emitting elements 21 constituting the plurality of light source units 20 are cooled efficiently and with high uniformity. can do.
  • the light emitting element light source module 10 since the plurality of light source units 20 are fixed to the cooling block 40 so as to be replaceable, the light source unit including the light emitting element 21 that needs to be replaced. By removing 20 from the cooling block 40 and attaching a new light source unit 20, the light emitting element 21 can be replaced.
  • the light-emitting element light source module 10 is suitable as a light source for an ultraviolet irradiation device used in, for example, a liquid crystal panel manufacturing process (ODF method), a printed circuit board manufacturing process (exposure process), and a printing ink fixing process (drying process). Can be used.
  • ODF method liquid crystal panel manufacturing process
  • exposure process a printed circuit board manufacturing process
  • drying process a printing ink fixing process
  • the cooling flow path has a plurality of flow path portions that are adjacent to each other through the partition wall portion in the region immediately below the light source, and are located between the adjacent flow path portions. 1 may have a shape other than the shape shown in FIG. 1, as long as the thickness has a shape smaller than the channel width of the cooling channel. That is, the cooling channel has a bent portion or a curved portion, and in the region directly below the light source, a plurality of channel portions that run side by side through a thermally conductive partition wall having a thickness smaller than the channel width of the cooling channel. What is necessary is just to have.
  • the shape of the region directly below the light source of the cooling channel is continuous with the first channel part extending along one edge of the light emitting element arrangement region and the cooling medium outlet of the first channel part. Also, it may be U-shaped with a second flow path portion extending in the same direction as the first flow path portion via a thermally conductive partition wall portion. Further, the shape of the region immediately below the light source in the cooling channel may be a meandering shape extending meandering along the short direction of the heat sink in FIG. 4, or may be a spiral shape (specifically, a circular spiral shape or a rectangular shape). It may be a spiral shape.
  • the cooling medium supply port and the cooling medium discharge port are provided outside the region directly below the light source from the viewpoint of cooling efficiency. It is preferable. Further, when the shape of the region immediately below the light source of the cooling channel is spiral, from the viewpoint of cooling efficiency, the cooling medium supply port is provided in the region immediately below the light source, and the cooling medium discharge port is the light source. It is preferable to be provided outside the region immediately below.
  • the light emitting element light source module may have a configuration in which one light source unit is disposed on the surface of the cooling block.
  • the light emitting element is directly arranged on the surface of the heat sink, and the wiring pattern is applied to the surface of the heat sink, that is, the heat sink has a function as a substrate. There may be. In such a case, since the light emitting element is directly cooled by the heat sink, the light emitting element can be cooled more effectively.
  • a light-emitting element light source module having the configuration of FIG. 1 (hereinafter, also referred to as “light-emitting element light source module (1)”) was manufactured.
  • the substrate is made of aluminum nitride in which 160 LED elements having a peak emission wavelength of 365 nm are arranged in a 10-by-16 pattern in a staggered pattern.
  • the heat sink is formed by joining two substantially rectangular plate-shaped base materials made of copper by brazing, and the cross-sectional shape is 5 mm wide and high in the heat sink.
  • a cooling flow path having a flat rectangular shape with a ratio of the flow path width to the flow path height of 2 and a meandering shape is formed.
  • the cooling channel formation area is 83.3% of the light emitting element arrangement area.
  • the cooling medium supply port and the cooling medium discharge port have a circular shape with a diameter of 6 mm.
  • the cooling block is made of stainless steel, and the cooling block has a circular cross section having a diameter of 6 mm and a linear cooling medium supply channel and cooling medium discharge inside the cooling block.
  • the produced light-emitting element light source module (1) under the environmental condition of a temperature of 25 ° C., 160 light-emitting elements constituting each of the three light source units emit light under the condition of a heating value of 1.82 W, and the water-cooling structure A cooling medium made of cooling water having a temperature of 25 ⁇ 5 ° C. was supplied to the body circulation channel under the condition of a flow rate of 3 L / min.
  • the calorific value in each light source unit was 291.2W.
  • substrate is 59 +/- 3 degreeC
  • the temperature of the cooling medium at the supply port was 37 ° C.
  • the temperature of the cooling medium at the cooling medium discharge port was 38 ° C.
  • the surface temperature of the substrate, the temperature of the cooling medium at the cooling medium supply port, and the temperature of the cooling medium at the cooling medium discharge port were measured in the same manner as in Experimental Example 1.
  • the surface temperature was 80 ⁇ 16 ° C.
  • the temperature of the cooling medium at the cooling medium supply port was 45 ° C.
  • the temperature of the cooling medium at the cooling medium discharge port was 48 ° C.
  • the surface temperature of the substrate, the temperature of the cooling medium at the cooling medium supply port, and the temperature of the cooling medium at the cooling medium discharge port were measured in the same manner as in Experimental Example 1.
  • the surface temperature was 72 ⁇ 8 ° C.
  • the temperature of the cooling medium at the cooling medium supply port was 47 ° C.
  • the temperature of the cooling medium at the cooling medium discharge port was 50 ° C.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
PCT/JP2016/081516 2015-11-16 2016-10-25 発光素子光源モジュール WO2017086097A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201680064470.1A CN108351092A (zh) 2015-11-16 2016-10-25 发光元件光源模块

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015223810A JP6558222B2 (ja) 2015-11-16 2015-11-16 発光素子光源モジュール
JP2015-223810 2015-11-16

Publications (1)

Publication Number Publication Date
WO2017086097A1 true WO2017086097A1 (ja) 2017-05-26

Family

ID=58718729

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/081516 WO2017086097A1 (ja) 2015-11-16 2016-10-25 発光素子光源モジュール

Country Status (3)

Country Link
JP (1) JP6558222B2 (enrdf_load_stackoverflow)
CN (1) CN108351092A (enrdf_load_stackoverflow)
WO (1) WO2017086097A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019200478A1 (de) * 2019-01-16 2020-07-16 Heraeus Noblelight Gmbh Lichtquelle mit mindestens einem ersten lichtemittierenden halbleiterbauelement, einem ersten trägerelement und einem verteilerelement

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009065128A (ja) * 2007-08-10 2009-03-26 Panasonic Electric Works Co Ltd ヒートシンクおよびヒートシンクを備えた半導体装置
JP2013168330A (ja) * 2012-02-16 2013-08-29 Nk Works Kk 光照射装置、及び光照射システム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102549743B (zh) * 2009-08-10 2014-12-24 富士电机株式会社 半导体模块和冷却单元
JP4893806B2 (ja) * 2009-11-12 2012-03-07 ウシオ電機株式会社 発光素子光源ユニット
JP6161497B2 (ja) * 2013-10-01 2017-07-12 商研株式会社 Ｌｅｄ回路基板構体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009065128A (ja) * 2007-08-10 2009-03-26 Panasonic Electric Works Co Ltd ヒートシンクおよびヒートシンクを備えた半導体装置
JP2013168330A (ja) * 2012-02-16 2013-08-29 Nk Works Kk 光照射装置、及び光照射システム

Also Published As

Publication number Publication date
JP2017091945A (ja) 2017-05-25
JP6558222B2 (ja) 2019-08-14
CN108351092A (zh) 2018-07-31

Similar Documents

Publication Publication Date Title
JP6140672B2 (ja) 絶縁ｌｅｄ装置
US9434151B2 (en) LED unit
KR101548781B1 (ko) 광원 장치
JP4893806B2 (ja) 発光素子光源ユニット
JP2009064987A (ja) 光源ユニット
JP6558222B2 (ja) 発光素子光源モジュール
JP2019175871A (ja) 発光素子光源モジュール
JP2016025165A (ja) 光照射装置
JP2017033779A (ja) 光源装置、表示装置及び電子機器
JP5271849B2 (ja) Ｌｅｄ照射装置
JP2016062677A (ja) 光照射装置
JP2019087561A (ja) 冷却構造体、及び光源ユニット
JP6171301B2 (ja) 光源ユニット
CN203377483U (zh) 激光光源、发光装置及投影系统
CN208197825U (zh) Uv-led固化光源系统
JP2009010047A (ja) 発光ダイオードを用いた光源
KR20160100712A (ko) 직접 냉각식 발광다이오드 조명기기
JP4552845B2 (ja) 熱交換器、光源装置、プロジェクタ、電子機器
CN206573853U (zh) 一种大面积uvled阵列用高效散热装置
JP2019061819A (ja) 光照射装置
TW201346178A (zh) Ｌｅｄ照明裝置
US12350393B2 (en) Surface radiator, device comprising the surface radiator and use of the surface radiator
JPWO2012014516A1 (ja) Ｌｅｄ発光装置
JP2019114547A (ja) 照射体及び照射装置
EP4397498B1 (en) Light irradiation device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16866099

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16866099

Country of ref document: EP

Kind code of ref document: A1