WO2017076101A1 - 封装基板及其制作方法、oled显示装置及其制作方法 - Google Patents
封装基板及其制作方法、oled显示装置及其制作方法 Download PDFInfo
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- WO2017076101A1 WO2017076101A1 PCT/CN2016/095673 CN2016095673W WO2017076101A1 WO 2017076101 A1 WO2017076101 A1 WO 2017076101A1 CN 2016095673 W CN2016095673 W CN 2016095673W WO 2017076101 A1 WO2017076101 A1 WO 2017076101A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- retaining wall
- package substrate
- adhesive
- display device
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 172
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 238000002360 preparation method Methods 0.000 title abstract 4
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims description 82
- 230000001070 adhesive effect Effects 0.000 claims description 82
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000007767 bonding agent Substances 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 15
- 239000011521 glass Substances 0.000 description 15
- 229910052760 oxygen Inorganic materials 0.000 description 15
- 239000001301 oxygen Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000003292 glue Substances 0.000 description 9
- 239000002699 waste material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Definitions
- Embodiments of the present invention relate to a package substrate, a method of fabricating the same, an OLED display device, and a method of fabricating the same.
- the OLED display device Organic Light Emitting Display
- OLED display device has become a major development trend of display devices due to its advantages of self-illumination, high brightness, high response speed, light weight, full color, and no difference in viewing angle.
- a package substrate includes a base substrate including an adhesive region for coating an adhesive.
- the package substrate further includes a first retaining wall on the base substrate, the first retaining wall being disposed along an outer edge of the bonding region.
- the first retaining wall is made of silicon oxide.
- the first retaining wall is made of metal.
- the base substrate is further provided with an alignment mark, and the contrast mark and the first retaining wall are formed of the same material.
- the first retaining wall is disposed around all of the outer edges of the bonded area to form a closed frame.
- a side of the first barrier wall adjacent to the bonding region is perpendicular to the base substrate 1.
- the longitudinal shape of the first retaining wall is a rectangle.
- the height of the first retaining wall is less than the height of the adhesive applied to the bonded area.
- the height of the first retaining wall is 0.7 ⁇ m to 1.2 ⁇ m.
- the package substrate further includes a second retaining wall disposed along an inner edge of the bonded region.
- a method of fabricating a package substrate for fabricating a package substrate as described above includes: providing a substrate, the substrate comprising an adhesive region for coating an adhesive; and an outer region of the bonded region on the substrate The side edges form a first retaining wall.
- a first retaining wall is formed on the base substrate along an outer edge of the bonding region while forming an alignment mark, the alignment mark being used to provide a pair when bonding the package substrate and the display substrate Bit.
- an OLED display device including a display substrate and a package substrate as described above, the package substrate and the display substrate being bonded to each other by an adhesive located at the bonding region Bonding.
- the manufacturing method of the OLED display device includes: coating the adhesive along the inner side of the first barrier wall on the bonding region; covering the package substrate on the display substrate, An adhesive is in contact with the display substrate; and the adhesive is cured.
- FIG. 1 is a plan view 1 of a package substrate according to an embodiment of the present invention.
- Figure 2 is a schematic cross-sectional view taken along line A-A' of Figure 1;
- FIG. 3 is a schematic cross-sectional view showing a package substrate after applying an adhesive according to an embodiment of the present invention
- FIG. 4 is a plan view 2 of a package substrate according to an embodiment of the present invention.
- Figure 5 is a schematic cross-sectional view taken along line A-A' of Figure 4.
- FIG. 6 is a flow chart of fabricating a package substrate according to an embodiment of the present invention.
- FIG. 7 is a schematic cross-sectional view of an OLED display device according to an embodiment of the present invention.
- FIG. 8 is a flow chart of manufacturing an OLED display device according to an embodiment of the present invention.
- the OLED display device includes a display substrate on which a cathode, an anode, and an organic functional layer between the cathode and the anode are disposed.
- the organic functional layer is very sensitive to water vapor and oxygen, and is easily oxidized after contact with water vapor or oxygen to cause failure, thereby affecting the display effect of the OLED display device.
- the display substrate can be packaged by the package substrate to achieve the purpose of blocking external water vapor and oxygen and avoiding failure of the organic functional layer.
- the display substrate is packaged by the package substrate in the following manner: coating the glass paste on the adhesive region of the package substrate; covering the package substrate on the display substrate; and irradiating the glass paste with laser light to cure the glass paste The package substrate and the display substrate are bonded.
- the inventors have found that the glass glue is viscous, so that the glass glue flows outward after the application of the glass paste, thereby causing burrs on the edge of the glass glue.
- the glass glue is irradiated with laser light, since the laser can only be irradiated to the glass glue located in the bonding area, the glass glue in the region where the burr is located cannot be cured, and thus the function of sticking the display substrate and the package substrate cannot be performed, thereby causing The waste of the glass glue; at the same time, the portion between the adjacent burrs on the outer edge of the glass glue is easily invaded by the external water vapor and oxygen, which seriously affects the life of the OLED display device.
- the package substrate includes a base substrate 1 including a bonding region 11 for coating an adhesive, the package substrate Also included is a first retaining wall 2 on the base substrate 1, the first retaining wall 2 being disposed along an outer edge of the bonding region 11, the first retaining wall 2 for blocking an adhesive applied to the bonding region 11. Flowing outward.
- the adhesive is a glass glue.
- the first retaining wall 2 effectively blocks the adhesive 3 from flowing outward, so that the outer edge of the adhesive 3 is neat, without any The burrs, in turn, effectively avoid the waste of the adhesive 3.
- the adhesive portion forming the burr when the first retaining wall 2 is absent is also located in the bonded region 11 in the case where the first retaining wall 2 is provided, so that the amount of the adhesive 3 in the bonded region 11 is increased. Due to the pressing action of the first retaining wall 2 on the adhesive 3, the top of the adhesive 3 is gently curved, so that the top of the adhesive 3 is more fully contacted with the display substrate, and the adhesive is added.
- the first retaining wall 2 and the adhesive 3 together act to block the intrusion of external water vapor and oxygen, and improve the resistance of the OLED display device to external water vapor and oxygen intrusion. The ability to extend the life of OLED display devices.
- the material of the first retaining wall 2 may be various as long as it can block the adhesive 3 applied to the bonding region 11 from flowing outward.
- the material of the first retaining wall 2 may be silicon oxide (SiOx) or metal. Since the base substrate 1 is usually a glass substrate as a package substrate and generally the adhesive 3 includes a glass frit and a viscous component, when the material of the first retaining wall 2 is silicon oxide, the first retaining wall 2 and the base substrate 1 It can be well matched with the adhesive 3 so that the three can be firmly connected.
- the first retaining wall 2 when the material of the first retaining wall 2 is metal, the first retaining wall 2 can be formed by using a lower cost wet etching without using a costly dry etching, so that the cost of the package substrate is higher. low.
- a substrate mark 1 such as a package substrate is further provided with an alignment mark 6 for providing alignment when the package substrate and the display substrate are bonded.
- the first retaining wall 2 can be formed in the same patterning process as the alignment mark 6, further reducing the cost of the package substrate.
- the material of the first retaining wall 2 and the alignment mark is molybdenum (Mo).
- the registration mark 6 is located outside the first retaining wall 2.
- the positional relationship between the first retaining wall 2 and the bonding region 11 can be various.
- the first retaining wall 2 may be disposed around all of the outer edges of the bonded region 11, or the first retaining wall 2 may be disposed only around the outer edge of the partially bonded region 11.
- the first retaining wall 2 is disposed around all outer edges of the bonded area 11 and constitutes a closed frame. That is, when the package substrate is viewed from above, the shape of the first retaining wall 2 is a square shape so that the first retaining wall 2 can surround the entire bonding region 11 of the base substrate 1 to block coating in the entire bonding region 11.
- the adhesive 3 flows outward, further avoiding the waste of the adhesive 3, improving the adhesion of the adhesive 3 to the display substrate and the package substrate, and further improving the resistance of the OLED display device to external moisture and oxygen intrusion. The ability to extend the life of OLED display devices.
- the longitudinal section of the first retaining wall 2 may have various shapes, and when the side of the first retaining wall 2 near the bonding region 11 is perpendicular to the base substrate 1, The first retaining wall 2 prevents the burr of the outer edge of the adhesive 3 from being optimal.
- the shape of the longitudinal section of the first retaining wall 2 may be rectangular, may be L-shaped (bent in a direction away from the bonding region 11), or may be a shape such as a rectangular trapezoid.
- the shape of the longitudinal section of the first retaining wall 2 is a rectangle, the structure of the first retaining wall 2 is simple and the manufacturing process is simple.
- the longitudinal cross-section of the first retaining wall 2 is L-shaped or right-angled, the contact area of the first retaining wall 2 with the base substrate 1 is large, so that the first retaining wall 2 and the base substrate 1 can be stably connected.
- the inventors have found that if the height of the first retaining wall 2 is too small, the adhesive 3 flows outward. If the height of the first retaining wall 2 is too large, the first retaining wall 2 may touch the display substrate during the process of bonding the package substrate and the display substrate, thereby causing damage to the display substrate. Therefore, it is necessary to make a reasonable setting of the height of the first retaining wall 2.
- the height of the first retaining wall 2 is smaller than the height of the adhesive 3.
- the height of the first retaining wall 2 is 0.7 ⁇ m to 1.2 ⁇ m. After considering various factors such as the manufacturing cost of the first retaining wall 2, the blocking effect on the outward flow of the adhesive 3, and whether or not the display substrate is damaged, for example, the height of the first retaining wall 2 is 1 ⁇ m.
- the package substrate of the embodiment of the present invention further includes a second retaining wall 4 disposed along an inner edge of the bonding region 11, and the second retaining wall 4 is for blocking coating on the bonding region 11.
- the adhesive 3 flows inwardly, so that burrs can be prevented from being generated on the inner edge of the adhesive 3 coated on the adhesive region 11, so that after the adhesive 3 is cured (for example, curing is irradiated with laser light), There is also no burr on the inner edge of the adhesive 3, which further avoids the waste of the adhesive 3 and improves the adhesion of the adhesive 3 to the display substrate and the package substrate.
- the structure of the second retaining wall 4 is similar to that of the first retaining wall 2, and the description of the first retaining wall 2 is not described herein.
- the package substrate provided by the embodiment of the present invention has the structure as described above, since the package substrate includes the first retaining wall 2 disposed along the outer edge of the bonding region 11 on the substrate substrate 1 so as to be coated on the subsequent package substrate.
- the first retaining wall 2 can effectively block the adhesive 3 coated on the adhesive region 11 from flowing outward, thereby preventing the outer edge of the adhesive 3 from being burred and avoiding the adhesive 3
- the waste increases the adhesion of the adhesive 3 to the display substrate and the package substrate, and the first retaining wall 2 and the adhesive 3 together act to block the intrusion of external moisture and oxygen, and improve the resistance of the OLED display device.
- the ability of outside water vapor and oxygen to invade extends the life of OLED display devices.
- the embodiment of the invention further provides a method for fabricating a package substrate for fabricating the package substrate described above.
- the manufacturing method of the package substrate includes:
- Step S601 providing a base substrate 1 including a bonding region 11 for coating the adhesive 3.
- Step S602 forming a first retaining wall 2 along the outer edge of the bonding region 11 on the base substrate 1, the first retaining wall 2 for blocking the outward flow of the adhesive 3 coated on the bonding region 11.
- the material of the first retaining wall 2 can be various. Therefore, when the materials of the first retaining wall 2 are different, the manufacturing method thereof may also be different.
- the first retaining wall 2 may be formed on the base substrate 1 along the outer edge of the bonding region 11 by first: for example, plasma-enhanced chemistry A method of vapor deposition forms a silicon oxide layer on the base substrate 1; then, a patterning process is performed on the silicon oxide layer to form a pattern including the first barrier 2 to form on the base substrate 1 along the outer edge of the bonding region 11.
- the patterning process herein includes the steps of: coating a photoresist, exposing, developing, dry etching, and stripping the photoresist using a mask having a corresponding pattern.
- the method of fabricating the package substrate further includes the step of forming an alignment mark 6 on the base substrate 1, wherein the alignment mark is used to provide alignment when bonding the package substrate and the display substrate.
- the step of forming the alignment mark on the base substrate 1 includes first depositing an identification layer on the base substrate 1, and then patterning the identification layer to form a pattern including the alignment mark.
- the patterning process herein includes a step of coating a photoresist, exposing, developing, wet etching, and stripping the photoresist using a mask having a corresponding pattern.
- the first retaining wall 2 may be formed on the base substrate 1 along the outer edge of the bonding region 11 while forming the alignment mark, thereby simplifying the manufacturing method of the package substrate and reducing the cost of the package substrate.
- the step of forming the first barrier 2 along the outer edge of the bonding region 11 on the base substrate 1 while forming the alignment mark includes depositing a marking layer on the substrate substrate 1 to pattern the marking layer
- the process forms a pattern including the alignment mark and the first retaining wall 2.
- the patterning process herein includes a step of coating a photoresist, exposing, developing, wet etching, and stripping the photoresist using a mask having a corresponding pattern.
- the registration mark and the first retaining wall 2 are formed of molybdenum.
- the alignment mark may also be formed before or after the first retaining wall 2 is formed.
- first retaining wall 2 can be formed on the base substrate 1 along the outer edge of the bonding region 11 by other means, which is not limited in the embodiment of the present invention. Further, before the respective structures are formed on the base substrate 1, the base substrate 1 can be cleaned.
- the manufacturing method of the package substrate further includes forming the second retaining wall 4 along the inner edge of the bonding region 11.
- the manufacturing process of the second retaining wall 4 is the same as that of the first retaining wall 2, and details are not described herein again.
- the first retaining wall 2 and the second retaining wall 4 are simultaneously formed.
- the manufacturing method of the package substrate provided by the embodiment of the present invention is as described above, and the manufacturing method includes the step of forming the first barrier wall 2 along the outer edge of the bonding region 11 on the substrate substrate 1 so as to be subsequently applied to the package substrate.
- the first retaining wall 2 can effectively block coating in the bonding area
- the adhesive 3 on the field 11 flows outward, thereby avoiding burrs on the outer edge of the adhesive 3, avoiding waste of the adhesive 3, and improving the adhesion of the adhesive 3 to the display substrate and the package substrate.
- the first retaining wall 2 and the adhesive 3 jointly act to block the intrusion of external water vapor and oxygen, improve the ability of the OLED display device to resist external water vapor and oxygen intrusion, and prolong the life of the OLED display device.
- the embodiment of the present invention further provides an OLED display device.
- the OLED display device includes a display substrate 5 and the package substrate 1 described above, and the package substrate 1 and the display substrate 5 pass through the bonding region 11 .
- the adhesive 3 on the bond is bonded. Since the above OLED display device includes the package substrate described above, the outer edge of the adhesive 3 is free from burrs, the waste of the adhesive 3 is avoided, and the adhesion of the adhesive 3 to the display substrate 5 and the package substrate is improved.
- the effect is that the first retaining wall 2 and the adhesive 3 together prevent the intrusion of external water vapor and oxygen, improve the ability of the OLED display device to resist external water vapor and oxygen intrusion, and prolong the life of the OLED display device.
- the embodiment of the invention further provides a method for fabricating an OLED display device for fabricating the OLED display device described above.
- the manufacturing method of the OLED display device includes: in step S801, applying an adhesive 3 along the inner side of the first retaining wall 2 on the bonding region 11 of the base substrate 1 of the package substrate.
- the package substrate is covered on the display substrate 5, and the adhesive 3 is brought into contact with the display substrate 5.
- the adhesive 3 is cured.
- the adhesive 3 can be cured by means of laser irradiation.
- the manufacturing method of the OLED display device provided by the embodiment of the present invention is as described above, and the manufacturing method includes the step of coating the adhesive 3 along the inner side of the first retaining wall 2, so that the first retaining wall 2 can effectively block the coating on the sticky
- the adhesive 3 on the region 11 flows outward, thereby avoiding burrs on the outer edge of the adhesive 3, avoiding waste of the adhesive 3, and improving the adhesion of the adhesive 3 to the display substrate 5 and the package substrate.
- the effect is that the first retaining wall 2 and the adhesive 3 jointly prevent the intrusion of external water vapor and oxygen, improve the ability of the OLED display device to resist the invasion of external water vapor and oxygen, and prolong the life of the OLED display device.
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Abstract
Description
Claims (14)
- 一种封装基板,包括衬底基板,其中,所述衬底基板包括用于涂布粘合剂的粘合区域,所述封装基板还包括位于所述衬底基板上的第一挡墙,所述第一挡墙沿所述粘合区域的外侧边缘设置。
- 根据权利要求1所述的封装基板,其中,所述第一挡墙的材质为氧化硅。
- 根据权利要求1所述的封装基板,其中,所述第一挡墙的材质为金属。
- 根据权利要求3所述的封装基板,其中,所述衬底基板上还设置有对位标识,所述对比标识和所述第一挡墙由相同的材料形成。
- 根据权利要求1所述的封装基板,其中,所述第一挡墙围绕所述粘合区域的所有外侧边缘设置,以形成封闭的框。
- 根据权利要求1所述的封装基板,其中,所述第一挡墙靠近所述粘合区域的一侧垂直于所述衬底基板1。
- 根据权利要求6所述的封装基板,其中,所述第一挡墙的纵截面形状为矩形。
- 根据权利要求1所述的封装基板,其中,所述第一挡墙的高度小于涂布在所述粘合区域的粘合剂的高度。
- 根据权利要求1所述的封装基板,其中,所述第一挡墙的高度为0.7μm~1.2μm。
- 根据权利要求1~9任一项所述的封装基板,其中,所述封装基板还包括沿所述粘合区域的内侧边缘设置的第二挡墙。
- 一种封装基板的制作方法,用于制作如权利要求1~10任一项所述的封装基板,其中,所述封装基板的制作方法包括:提供衬底基板,所述衬底基板包括用于涂布粘合剂的粘合区域;在所述衬底基板上沿所述粘合区域的外侧边缘形成第一挡墙。
- 根据权利要求11所述的封装基板的制作方法,其中,在所述衬底基板上沿所述粘合区域的外侧边缘形成第一挡墙的同时形成对位标识,所述对位标识用于在粘合所述封装基板和显示基板时提供对位。
- 一种OLED显示装置,包括显示基板以及如权利要求1~10任一项 所述的封装基板,所述封装基板和所述显示基板通过位于所述粘合区域的粘合剂彼此粘合。
- 一种OLED显示装置的制作方法,用于制作如权利要求13所述的OLED显示装置,其中,所述OLED显示装置的制作方法包括:在所述粘合区域上,沿所述第一挡墙内侧涂布所述粘合剂;将所述封装基板覆盖在所述显示基板上,使所述粘合剂与所述显示基板接触;以及使所述粘合剂固化。
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CN105226202A (zh) * | 2015-11-04 | 2016-01-06 | 京东方科技集团股份有限公司 | 封装基板及其制作方法、oled显示装置及其制作方法 |
CN106025094B (zh) * | 2016-05-04 | 2018-12-28 | 京东方科技集团股份有限公司 | 封装玻璃上的对位标记及其制造方法、oled及其生产方法 |
CN107275517A (zh) | 2017-06-30 | 2017-10-20 | 京东方科技集团股份有限公司 | 一种显示基板及其制备方法和显示装置 |
CN107264008B (zh) * | 2017-07-05 | 2019-07-16 | 京东方科技集团股份有限公司 | 一种印刷掩膜板及胶液图案的印刷方法 |
CN108615745B (zh) * | 2018-04-25 | 2020-11-17 | 云谷(固安)科技有限公司 | 显示面板及其制造方法和显示终端 |
CN208781850U (zh) * | 2018-10-31 | 2019-04-23 | 京东方科技集团股份有限公司 | 显示基板、显示面板及显示装置 |
CN110416441B (zh) * | 2019-08-16 | 2021-11-26 | 京东方科技集团股份有限公司 | 一种显示面板的制备方法、显示面板及显示装置 |
KR20210077101A (ko) * | 2019-12-16 | 2021-06-25 | 삼성디스플레이 주식회사 | 표시 장치 |
CN114883510A (zh) * | 2022-05-11 | 2022-08-09 | 深圳市华星光电半导体显示技术有限公司 | 有机发光显示面板和有机发光显示装置 |
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CN104037363A (zh) * | 2014-06-17 | 2014-09-10 | 深圳市华星光电技术有限公司 | 基板的封装方法 |
CN104112765A (zh) * | 2014-07-17 | 2014-10-22 | 深圳市华星光电技术有限公司 | 显示面板及其制作方法 |
CN104201291A (zh) * | 2014-08-26 | 2014-12-10 | 京东方科技集团股份有限公司 | 一种有机电致发光器件及其制备方法 |
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