WO2017076101A1 - 封装基板及其制作方法、oled显示装置及其制作方法 - Google Patents

封装基板及其制作方法、oled显示装置及其制作方法 Download PDF

Info

Publication number
WO2017076101A1
WO2017076101A1 PCT/CN2016/095673 CN2016095673W WO2017076101A1 WO 2017076101 A1 WO2017076101 A1 WO 2017076101A1 CN 2016095673 W CN2016095673 W CN 2016095673W WO 2017076101 A1 WO2017076101 A1 WO 2017076101A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
retaining wall
package substrate
adhesive
display device
Prior art date
Application number
PCT/CN2016/095673
Other languages
English (en)
French (fr)
Inventor
敖宁
绰洛鹏
闵天圭
许瑾
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/502,390 priority Critical patent/US20170278897A1/en
Publication of WO2017076101A1 publication Critical patent/WO2017076101A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • Embodiments of the present invention relate to a package substrate, a method of fabricating the same, an OLED display device, and a method of fabricating the same.
  • the OLED display device Organic Light Emitting Display
  • OLED display device has become a major development trend of display devices due to its advantages of self-illumination, high brightness, high response speed, light weight, full color, and no difference in viewing angle.
  • a package substrate includes a base substrate including an adhesive region for coating an adhesive.
  • the package substrate further includes a first retaining wall on the base substrate, the first retaining wall being disposed along an outer edge of the bonding region.
  • the first retaining wall is made of silicon oxide.
  • the first retaining wall is made of metal.
  • the base substrate is further provided with an alignment mark, and the contrast mark and the first retaining wall are formed of the same material.
  • the first retaining wall is disposed around all of the outer edges of the bonded area to form a closed frame.
  • a side of the first barrier wall adjacent to the bonding region is perpendicular to the base substrate 1.
  • the longitudinal shape of the first retaining wall is a rectangle.
  • the height of the first retaining wall is less than the height of the adhesive applied to the bonded area.
  • the height of the first retaining wall is 0.7 ⁇ m to 1.2 ⁇ m.
  • the package substrate further includes a second retaining wall disposed along an inner edge of the bonded region.
  • a method of fabricating a package substrate for fabricating a package substrate as described above includes: providing a substrate, the substrate comprising an adhesive region for coating an adhesive; and an outer region of the bonded region on the substrate The side edges form a first retaining wall.
  • a first retaining wall is formed on the base substrate along an outer edge of the bonding region while forming an alignment mark, the alignment mark being used to provide a pair when bonding the package substrate and the display substrate Bit.
  • an OLED display device including a display substrate and a package substrate as described above, the package substrate and the display substrate being bonded to each other by an adhesive located at the bonding region Bonding.
  • the manufacturing method of the OLED display device includes: coating the adhesive along the inner side of the first barrier wall on the bonding region; covering the package substrate on the display substrate, An adhesive is in contact with the display substrate; and the adhesive is cured.
  • FIG. 1 is a plan view 1 of a package substrate according to an embodiment of the present invention.
  • Figure 2 is a schematic cross-sectional view taken along line A-A' of Figure 1;
  • FIG. 3 is a schematic cross-sectional view showing a package substrate after applying an adhesive according to an embodiment of the present invention
  • FIG. 4 is a plan view 2 of a package substrate according to an embodiment of the present invention.
  • Figure 5 is a schematic cross-sectional view taken along line A-A' of Figure 4.
  • FIG. 6 is a flow chart of fabricating a package substrate according to an embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view of an OLED display device according to an embodiment of the present invention.
  • FIG. 8 is a flow chart of manufacturing an OLED display device according to an embodiment of the present invention.
  • the OLED display device includes a display substrate on which a cathode, an anode, and an organic functional layer between the cathode and the anode are disposed.
  • the organic functional layer is very sensitive to water vapor and oxygen, and is easily oxidized after contact with water vapor or oxygen to cause failure, thereby affecting the display effect of the OLED display device.
  • the display substrate can be packaged by the package substrate to achieve the purpose of blocking external water vapor and oxygen and avoiding failure of the organic functional layer.
  • the display substrate is packaged by the package substrate in the following manner: coating the glass paste on the adhesive region of the package substrate; covering the package substrate on the display substrate; and irradiating the glass paste with laser light to cure the glass paste The package substrate and the display substrate are bonded.
  • the inventors have found that the glass glue is viscous, so that the glass glue flows outward after the application of the glass paste, thereby causing burrs on the edge of the glass glue.
  • the glass glue is irradiated with laser light, since the laser can only be irradiated to the glass glue located in the bonding area, the glass glue in the region where the burr is located cannot be cured, and thus the function of sticking the display substrate and the package substrate cannot be performed, thereby causing The waste of the glass glue; at the same time, the portion between the adjacent burrs on the outer edge of the glass glue is easily invaded by the external water vapor and oxygen, which seriously affects the life of the OLED display device.
  • the package substrate includes a base substrate 1 including a bonding region 11 for coating an adhesive, the package substrate Also included is a first retaining wall 2 on the base substrate 1, the first retaining wall 2 being disposed along an outer edge of the bonding region 11, the first retaining wall 2 for blocking an adhesive applied to the bonding region 11. Flowing outward.
  • the adhesive is a glass glue.
  • the first retaining wall 2 effectively blocks the adhesive 3 from flowing outward, so that the outer edge of the adhesive 3 is neat, without any The burrs, in turn, effectively avoid the waste of the adhesive 3.
  • the adhesive portion forming the burr when the first retaining wall 2 is absent is also located in the bonded region 11 in the case where the first retaining wall 2 is provided, so that the amount of the adhesive 3 in the bonded region 11 is increased. Due to the pressing action of the first retaining wall 2 on the adhesive 3, the top of the adhesive 3 is gently curved, so that the top of the adhesive 3 is more fully contacted with the display substrate, and the adhesive is added.
  • the first retaining wall 2 and the adhesive 3 together act to block the intrusion of external water vapor and oxygen, and improve the resistance of the OLED display device to external water vapor and oxygen intrusion. The ability to extend the life of OLED display devices.
  • the material of the first retaining wall 2 may be various as long as it can block the adhesive 3 applied to the bonding region 11 from flowing outward.
  • the material of the first retaining wall 2 may be silicon oxide (SiOx) or metal. Since the base substrate 1 is usually a glass substrate as a package substrate and generally the adhesive 3 includes a glass frit and a viscous component, when the material of the first retaining wall 2 is silicon oxide, the first retaining wall 2 and the base substrate 1 It can be well matched with the adhesive 3 so that the three can be firmly connected.
  • the first retaining wall 2 when the material of the first retaining wall 2 is metal, the first retaining wall 2 can be formed by using a lower cost wet etching without using a costly dry etching, so that the cost of the package substrate is higher. low.
  • a substrate mark 1 such as a package substrate is further provided with an alignment mark 6 for providing alignment when the package substrate and the display substrate are bonded.
  • the first retaining wall 2 can be formed in the same patterning process as the alignment mark 6, further reducing the cost of the package substrate.
  • the material of the first retaining wall 2 and the alignment mark is molybdenum (Mo).
  • the registration mark 6 is located outside the first retaining wall 2.
  • the positional relationship between the first retaining wall 2 and the bonding region 11 can be various.
  • the first retaining wall 2 may be disposed around all of the outer edges of the bonded region 11, or the first retaining wall 2 may be disposed only around the outer edge of the partially bonded region 11.
  • the first retaining wall 2 is disposed around all outer edges of the bonded area 11 and constitutes a closed frame. That is, when the package substrate is viewed from above, the shape of the first retaining wall 2 is a square shape so that the first retaining wall 2 can surround the entire bonding region 11 of the base substrate 1 to block coating in the entire bonding region 11.
  • the adhesive 3 flows outward, further avoiding the waste of the adhesive 3, improving the adhesion of the adhesive 3 to the display substrate and the package substrate, and further improving the resistance of the OLED display device to external moisture and oxygen intrusion. The ability to extend the life of OLED display devices.
  • the longitudinal section of the first retaining wall 2 may have various shapes, and when the side of the first retaining wall 2 near the bonding region 11 is perpendicular to the base substrate 1, The first retaining wall 2 prevents the burr of the outer edge of the adhesive 3 from being optimal.
  • the shape of the longitudinal section of the first retaining wall 2 may be rectangular, may be L-shaped (bent in a direction away from the bonding region 11), or may be a shape such as a rectangular trapezoid.
  • the shape of the longitudinal section of the first retaining wall 2 is a rectangle, the structure of the first retaining wall 2 is simple and the manufacturing process is simple.
  • the longitudinal cross-section of the first retaining wall 2 is L-shaped or right-angled, the contact area of the first retaining wall 2 with the base substrate 1 is large, so that the first retaining wall 2 and the base substrate 1 can be stably connected.
  • the inventors have found that if the height of the first retaining wall 2 is too small, the adhesive 3 flows outward. If the height of the first retaining wall 2 is too large, the first retaining wall 2 may touch the display substrate during the process of bonding the package substrate and the display substrate, thereby causing damage to the display substrate. Therefore, it is necessary to make a reasonable setting of the height of the first retaining wall 2.
  • the height of the first retaining wall 2 is smaller than the height of the adhesive 3.
  • the height of the first retaining wall 2 is 0.7 ⁇ m to 1.2 ⁇ m. After considering various factors such as the manufacturing cost of the first retaining wall 2, the blocking effect on the outward flow of the adhesive 3, and whether or not the display substrate is damaged, for example, the height of the first retaining wall 2 is 1 ⁇ m.
  • the package substrate of the embodiment of the present invention further includes a second retaining wall 4 disposed along an inner edge of the bonding region 11, and the second retaining wall 4 is for blocking coating on the bonding region 11.
  • the adhesive 3 flows inwardly, so that burrs can be prevented from being generated on the inner edge of the adhesive 3 coated on the adhesive region 11, so that after the adhesive 3 is cured (for example, curing is irradiated with laser light), There is also no burr on the inner edge of the adhesive 3, which further avoids the waste of the adhesive 3 and improves the adhesion of the adhesive 3 to the display substrate and the package substrate.
  • the structure of the second retaining wall 4 is similar to that of the first retaining wall 2, and the description of the first retaining wall 2 is not described herein.
  • the package substrate provided by the embodiment of the present invention has the structure as described above, since the package substrate includes the first retaining wall 2 disposed along the outer edge of the bonding region 11 on the substrate substrate 1 so as to be coated on the subsequent package substrate.
  • the first retaining wall 2 can effectively block the adhesive 3 coated on the adhesive region 11 from flowing outward, thereby preventing the outer edge of the adhesive 3 from being burred and avoiding the adhesive 3
  • the waste increases the adhesion of the adhesive 3 to the display substrate and the package substrate, and the first retaining wall 2 and the adhesive 3 together act to block the intrusion of external moisture and oxygen, and improve the resistance of the OLED display device.
  • the ability of outside water vapor and oxygen to invade extends the life of OLED display devices.
  • the embodiment of the invention further provides a method for fabricating a package substrate for fabricating the package substrate described above.
  • the manufacturing method of the package substrate includes:
  • Step S601 providing a base substrate 1 including a bonding region 11 for coating the adhesive 3.
  • Step S602 forming a first retaining wall 2 along the outer edge of the bonding region 11 on the base substrate 1, the first retaining wall 2 for blocking the outward flow of the adhesive 3 coated on the bonding region 11.
  • the material of the first retaining wall 2 can be various. Therefore, when the materials of the first retaining wall 2 are different, the manufacturing method thereof may also be different.
  • the first retaining wall 2 may be formed on the base substrate 1 along the outer edge of the bonding region 11 by first: for example, plasma-enhanced chemistry A method of vapor deposition forms a silicon oxide layer on the base substrate 1; then, a patterning process is performed on the silicon oxide layer to form a pattern including the first barrier 2 to form on the base substrate 1 along the outer edge of the bonding region 11.
  • the patterning process herein includes the steps of: coating a photoresist, exposing, developing, dry etching, and stripping the photoresist using a mask having a corresponding pattern.
  • the method of fabricating the package substrate further includes the step of forming an alignment mark 6 on the base substrate 1, wherein the alignment mark is used to provide alignment when bonding the package substrate and the display substrate.
  • the step of forming the alignment mark on the base substrate 1 includes first depositing an identification layer on the base substrate 1, and then patterning the identification layer to form a pattern including the alignment mark.
  • the patterning process herein includes a step of coating a photoresist, exposing, developing, wet etching, and stripping the photoresist using a mask having a corresponding pattern.
  • the first retaining wall 2 may be formed on the base substrate 1 along the outer edge of the bonding region 11 while forming the alignment mark, thereby simplifying the manufacturing method of the package substrate and reducing the cost of the package substrate.
  • the step of forming the first barrier 2 along the outer edge of the bonding region 11 on the base substrate 1 while forming the alignment mark includes depositing a marking layer on the substrate substrate 1 to pattern the marking layer
  • the process forms a pattern including the alignment mark and the first retaining wall 2.
  • the patterning process herein includes a step of coating a photoresist, exposing, developing, wet etching, and stripping the photoresist using a mask having a corresponding pattern.
  • the registration mark and the first retaining wall 2 are formed of molybdenum.
  • the alignment mark may also be formed before or after the first retaining wall 2 is formed.
  • first retaining wall 2 can be formed on the base substrate 1 along the outer edge of the bonding region 11 by other means, which is not limited in the embodiment of the present invention. Further, before the respective structures are formed on the base substrate 1, the base substrate 1 can be cleaned.
  • the manufacturing method of the package substrate further includes forming the second retaining wall 4 along the inner edge of the bonding region 11.
  • the manufacturing process of the second retaining wall 4 is the same as that of the first retaining wall 2, and details are not described herein again.
  • the first retaining wall 2 and the second retaining wall 4 are simultaneously formed.
  • the manufacturing method of the package substrate provided by the embodiment of the present invention is as described above, and the manufacturing method includes the step of forming the first barrier wall 2 along the outer edge of the bonding region 11 on the substrate substrate 1 so as to be subsequently applied to the package substrate.
  • the first retaining wall 2 can effectively block coating in the bonding area
  • the adhesive 3 on the field 11 flows outward, thereby avoiding burrs on the outer edge of the adhesive 3, avoiding waste of the adhesive 3, and improving the adhesion of the adhesive 3 to the display substrate and the package substrate.
  • the first retaining wall 2 and the adhesive 3 jointly act to block the intrusion of external water vapor and oxygen, improve the ability of the OLED display device to resist external water vapor and oxygen intrusion, and prolong the life of the OLED display device.
  • the embodiment of the present invention further provides an OLED display device.
  • the OLED display device includes a display substrate 5 and the package substrate 1 described above, and the package substrate 1 and the display substrate 5 pass through the bonding region 11 .
  • the adhesive 3 on the bond is bonded. Since the above OLED display device includes the package substrate described above, the outer edge of the adhesive 3 is free from burrs, the waste of the adhesive 3 is avoided, and the adhesion of the adhesive 3 to the display substrate 5 and the package substrate is improved.
  • the effect is that the first retaining wall 2 and the adhesive 3 together prevent the intrusion of external water vapor and oxygen, improve the ability of the OLED display device to resist external water vapor and oxygen intrusion, and prolong the life of the OLED display device.
  • the embodiment of the invention further provides a method for fabricating an OLED display device for fabricating the OLED display device described above.
  • the manufacturing method of the OLED display device includes: in step S801, applying an adhesive 3 along the inner side of the first retaining wall 2 on the bonding region 11 of the base substrate 1 of the package substrate.
  • the package substrate is covered on the display substrate 5, and the adhesive 3 is brought into contact with the display substrate 5.
  • the adhesive 3 is cured.
  • the adhesive 3 can be cured by means of laser irradiation.
  • the manufacturing method of the OLED display device provided by the embodiment of the present invention is as described above, and the manufacturing method includes the step of coating the adhesive 3 along the inner side of the first retaining wall 2, so that the first retaining wall 2 can effectively block the coating on the sticky
  • the adhesive 3 on the region 11 flows outward, thereby avoiding burrs on the outer edge of the adhesive 3, avoiding waste of the adhesive 3, and improving the adhesion of the adhesive 3 to the display substrate 5 and the package substrate.
  • the effect is that the first retaining wall 2 and the adhesive 3 jointly prevent the intrusion of external water vapor and oxygen, improve the ability of the OLED display device to resist the invasion of external water vapor and oxygen, and prolong the life of the OLED display device.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种封装基板及其制作方法、OLED显示装置及其制作方法。该封装基板包括衬底基板（1），该衬底基板（1）包括用于涂布粘合剂的粘合区域（11）。该封装基板还包括位于该衬底基板（1）上的第一挡墙（2），该第一挡墙（2）沿该粘合区域（11）的外侧边缘设置。

Description

封装基板及其制作方法、OLED显示装置及其制作方法 技术领域
本发明的实施例涉及一种封装基板及其制作方法、OLED显示装置及其制作方法。
背景技术
OLED显示装置(Organic Light Emitting Display)因其具有自发光、高亮度、高反应速度、轻薄、全彩色、无视角差等优点，逐渐成为了显示装置的主要发展趋势。
发明内容
根据本发明的实施例，提供一种封装基板。该封装基板包括衬底基板，所述衬底基板包括用于涂布粘合剂的粘合区域。所述封装基板还包括位于所述衬底基板上的第一挡墙，所述第一挡墙沿所述粘合区域的外侧边缘设置。
例如，所述第一挡墙的材质为氧化硅。
例如，所述第一挡墙的材质为金属。
例如，所述衬底基板上还设置有对位标识，所述对比标识和所述第一挡墙由相同的材料形成。
例如，所述第一挡墙围绕所述粘合区域的所有外侧边缘设置，以形成封闭的框。
例如，所述第一挡墙靠近所述粘合区域的一侧垂直于所述衬底基板1。
例如，所述第一挡墙的纵截面形状为矩形。
例如，所述第一挡墙的高度小于涂布在所述粘合区域的粘合剂的高度。
例如，所述第一挡墙的高度为0.7μm～1.2μm。
例如，所述封装基板还包括沿所述粘合区域的内侧边缘设置的第二挡墙。
根据本发明的实施例，提供一种封装基板的制作方法，用于制作如上所述的封装基板。所述封装基板的制作方法包括：提供衬底基板，所述衬底基板包括用于涂布粘合剂的粘合区域；在所述衬底基板上沿所述粘合区域的外 侧边缘形成第一挡墙。
例如，在所述衬底基板上沿所述粘合区域的外侧边缘形成第一挡墙的同时形成对位标识，所述对位标识用于在粘合所述封装基板和显示基板时提供对位。
根据本发明的实施例，提供一种OLED显示装置，该OLED显示装置包括显示基板以及如上所述的封装基板，所述封装基板和所述显示基板通过位于所述粘合区域的粘合剂彼此粘合。
根据本发明的实施例，提供一种OLED显示装置的制作方法，用于制作如上所述的OLED显示装置。所述OLED显示装置的制作方法包括：在所述粘合区域上，沿所述第一挡墙内侧涂布所述粘合剂；将所述封装基板覆盖在所述显示基板上，使所述粘合剂与所述显示基板接触；以及使所述粘合剂固化。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为本发明实施例的封装基板的平面示意图一；
图2为图1中A-A’方向的截面示意图；
图3为本发明实施例的涂布粘合剂后封装基板的截面示意图；
图4为本发明实施例的封装基板的平面示意图二；
图5为图4中A-A’方向的截面示意图；
图6为本发明实施例的封装基板的制作流程图；
图7为本发明实施例的OLED显示装置的截面示意图；
图8为本发明实施例的OLED显示装置的制作流程图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实 施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
OLED显示装置包括显示基板，显示基板上设置有阴极、阳极和位于阴极和阳极之间的有机功能层。有机功能层对水汽和氧气非常敏感，与水汽或者氧气接触后极易被氧化而导致失效，进而影响OLED显示装置的显示效果。例如，可以通过封装基板对显示基板进行封装，以达到阻隔外界的水汽和氧气并避免有机功能层失效的目的。具体地，通过封装基板对显示基板进行封装的方式如下：在封装基板的粘合区域上涂布玻璃胶；将封装基板覆盖在显示基板上；对玻璃胶进行激光照射，以使玻璃胶固化进而将封装基板和显示基板粘合。
然而发明人发现，由于玻璃胶呈粘稠状，从而使得玻璃胶涂布到封装基板后会向外流动，进而导致玻璃胶边缘产生毛刺。在对玻璃胶进行激光照射时，由于激光只能照射到位于粘合区域内的玻璃胶，进而使得毛刺所在区域的玻璃胶无法固化，进而无法起到粘连显示基板和封装基板的作用，造成了玻璃胶的浪费；同时，玻璃胶外侧边缘的相邻的毛刺之间的部分容易受到外界水汽和氧气的侵入，严重影响了OLED显示装置的寿命。
本发明实施例提供了一种封装基板，如图1和图2所示，该封装基板包括衬底基板1，衬底基板1包括用于涂布粘合剂的粘合区域11，该封装基板还包括位于衬底基板1上的第一挡墙2，第一挡墙2沿粘合区域11的外侧边缘设置，第一挡墙2用于阻挡涂布在粘合区域11上的粘合剂向外流动。
例如，粘合剂为玻璃胶。
在具有上述结构的封装基板上涂布粘合剂后，如图3所示，第一挡墙2有效阻挡了粘合剂3向外流动，从而使得粘合剂3的外侧边缘整齐，无任何毛刺，进而有效避免了粘合剂3的浪费。在无第一挡墙2时形成毛刺的粘合剂部分在设置第一挡墙2的情况下也会位于粘合区域11内，从而粘合区域11内的粘合剂3的量增加。由于第一挡墙2对粘合剂3的挤压作用，使得粘合剂3的顶部为平缓的弧形，进而使得粘合剂3的顶部与显示基板的接触更加充分，增加了粘合剂3与显示基板之间的附着力，从而提高了粘合剂3对显示基板和封装基板的粘合效果。第一挡墙2和粘合剂3共同起到了阻挡外界水汽和氧气侵入的作用，提高了OLED显示装置的抗外界水汽和氧气侵入 的能力，延长了OLED显示装置的寿命。
第一挡墙2的材质可以为多种，只要能起到阻挡涂布在粘合区域11上的粘合剂3向外流动即可。示例性地，第一挡墙2的材质可以为氧化硅(SiOx)或者金属。由于通常以玻璃基板作为封装基板的衬底基板1并且通常粘合剂3包括玻璃粉和黏合成分，因此当第一挡墙2的材质为氧化硅时，第一挡墙2与衬底基板1和粘合剂3能够很好的匹配，以使三者之间均能稳固的连接。另外，当第一挡墙2的材质为金属时，采用成本较低的湿法刻蚀即可形成第一挡墙2，而无需使用成本较高的干法刻蚀，使得封装基板的成本较低。进一步地，例如封装基板的衬底基板1上还设置有在粘合封装基板和显示基板时提供对位的对位标识6。第一挡墙2可以和对位标识6在同一次构图工艺中形成，进一步降低了封装基板的成本。例如，第一挡墙2和对位标识的材质都为钼(Mo)。例如，对位标识6位于第一挡墙2的外侧。
第一挡墙2与粘合区域11的位置关系可以有多种。示例性地，第一挡墙2可以围绕粘合区域11的所有外侧边缘设置，或者，第一挡墙2仅围绕部分粘合区域11的外侧边缘设置。如图1所示，第一挡墙2围绕粘合区域11的所有外侧边缘设置且构成一个封闭的框。也就是，俯视封装基板时，第一挡墙2的形状为口字形，以使第一挡墙2能够包围衬底基板1的整个粘合区域11，以阻挡涂布在整个粘合区域11内的粘合剂3向外流动，进一步避免了粘合剂3的浪费，提高了粘合剂3对显示基板和封装基板的粘合效果，并且进一步提高了OLED显示装置的抗外界水汽和氧气侵入的能力，延长了OLED显示装置的寿命。
第一挡墙2的纵截面(即，沿A-A’方向截取的截面)的形状也可以有多种，当第一挡墙2靠近粘合区域11的一侧垂直于衬底基板1时，第一挡墙2避免粘合剂3的外侧边缘产生毛刺的效果最优。示例性地，第一挡墙2的纵截面的形状可以为矩形，也可以为L形(沿远离粘合区域11的方向弯折)，或者为直角梯形等形状。第一挡墙2的纵截面的形状为矩形时，第一挡墙2的结构简单，制作过程简单。第一挡墙2的纵截面的形状为L形或者直角梯形时，第一挡墙2与衬底基板1的接触面积大，使得第一挡墙2与衬底基板1能够稳定连接。
另外，发明人发现，若第一挡墙2的高度过小则对粘合剂3向外流动的 阻挡效果不好，若第一挡墙2的高度过大则会导致在将封装基板与显示基板粘合的过程中第一挡墙2会触碰到显示基板，进而对显示基板造成损伤。因此，需要对第一挡墙2的高度进行合理的设定。例如，第一挡墙2的高度小于粘合剂3的高度。示例性地，第一挡墙2的高度为0.7μm～1.2μm。在综合考虑第一挡墙2的制作成本、对粘合剂3向外流动的阻挡效果、以及是否会损伤显示基板等多个因素后，例如第一挡墙2的高度为1μm。
如图4和图5所示，本发明实施例的封装基板还包括沿粘合区域11的内侧边缘设置的第二挡墙4，第二挡墙4用于阻挡涂布在粘合区域11上的粘合剂3向内流动，从而能够避免涂布在粘合区域11上的粘合剂3的内侧边缘产生毛刺，使得在对粘合剂3进行固化(例如，固化采用激光照射)后，粘合剂3内侧边缘也不存在毛刺，进一步避免了粘合剂3的浪费，提高了粘合剂3对显示基板和封装基板的粘合效果。第二挡墙4的结构与第一挡墙2的结构相似，参见之前关于第一挡墙2的描述即可，本发明实施例对此不再进行赘述。
本发明实施例提供的封装基板具有如上所述的结构，由于封装基板包括沿衬底基板1上的粘合区域11的外侧边缘设置的第一挡墙2，从而使得在后续往封装基板上涂布粘合剂3时，第一挡墙2能够有效阻挡涂布在粘合区域11上的粘合剂3向外流动，进而避免粘合剂3的外侧边缘产生毛刺，避免了粘合剂3的浪费，提高了粘合剂3对显示基板和封装基板的粘合效果，同时第一挡墙2和粘合剂3共同起到了阻挡外界水汽和氧气侵入的作用，提高了OLED显示装置的抗外界水汽和氧气侵入的能力，延长了OLED显示装置的寿命。
本发明实施例还提供了一种封装基板的制作方法，用于制作以上所述的封装基板。例如，如图6所示，该封装基板的制作方法包括：
步骤S601、提供衬底基板1，衬底基板1包括用于涂布粘合剂3的粘合区域11。
步骤S602、在衬底基板1上沿粘合区域11的外侧边缘形成第一挡墙2，第一挡墙2用于阻挡涂布在粘合区域11上的粘合剂3向外流动。
由以上描述可知，第一挡墙2的材质可以有多种。因此，当第一挡墙2的材质不同时，其制作方法也可以有所不同。
示例性地，当第一挡墙2的材质为氧化硅时，可以通过以下方式在衬底基板1上沿粘合区域11的外侧边缘形成第一挡墙2：首先，通过例如等离子体增强化学气相沉积的方法在衬底基板1上形成氧化硅层；然后，对氧化硅层进行构图工艺形成包括第一挡墙2的图形，以在衬底基板1上沿粘合区域11的外侧边缘形成第一挡墙2。例如，此处的构图工艺包括：涂布光刻胶，使用具有相应图案的掩膜板进行曝光，显影，干法刻蚀和剥离光刻胶的步骤。
例如，封装基板的制作方法还包括：在衬底基板1上形成对位标识6的步骤，其中，该对位标识用于在粘合封装基板和显示基板时提供对位。示例性地，在衬底基板1上形成对位标识的步骤包括：首先，在衬底基板1上沉积标识层，然后，对标识层进行构图工艺形成包括对位标识的图形。例如，此处的构图工艺包括：涂布光刻胶，使用具有相应图案的掩膜板进行曝光，显影，湿法刻蚀和剥离光刻胶的步骤。
示例性地，可以在形成对位标识的同时，在衬底基板1上沿粘合区域11的外侧边缘形成第一挡墙2，以简化封装基板的制作方法，降低封装基板的成本。例如，在形成对位标识的同时在衬底基板1上沿粘合区域11的外侧边缘形成第一挡墙2的步骤包括：在衬底基板1上沉积一层标识层，对标识层进行构图工艺形成包括对位标识和第一挡墙2的图形。例如，此处的构图工艺包括：涂布光刻胶，使用具有相应图案的掩膜板进行曝光，显影，湿法刻蚀和剥离光刻胶的步骤。例如，对位标识和第一挡墙2由钼形成。
需要说明的是，对位标识也可以在形成第一挡墙2之前或之后形成。
需要说明的是，还可以通过其他方式在衬底基板1上沿粘合区域11的外侧边缘形成第一挡墙2，本发明实施例对此不进行限定。此外，在衬底基板1上形成各结构之前，还可以对衬底基板1进行清洗。
例如，封装基板的制作方法还包括：沿粘合区域11的内侧边缘形成第二挡墙4。例如，第二挡墙4的制作过程与第一挡墙2的制作过程相同，在此不再赘述。例如，为了简化封装基板的制作工艺和制作成本，第一挡墙2和第二挡墙4同时形成。
本发明实施例提供的封装基板的制作方法如上所述，该制作方法包括在衬底基板1上沿粘合区域11的外侧边缘形成第一挡墙2的步骤，从而使得在后续往封装基板上涂布粘合剂3时，第一挡墙2能够有效阻挡涂布在粘合区 域11上的粘合剂3向外流动，进而避免粘合剂3的外侧边缘产生毛刺，避免了粘合剂3的浪费，提高了粘合剂3对显示基板和封装基板的粘合效果，同时第一挡墙2和粘合剂3共同起到了阻挡外界水汽和氧气侵入的作用，提高了OLED显示装置的抗外界水汽和氧气侵入的能力，延长了OLED显示装置的寿命。
本发明实施例还提供了一种OLED显示装置，如图7所示，该OLED显示装置包括显示基板5和以上所述的封装基板1，并且封装基板1和显示基板5通过位于粘合区域11上的粘合剂3粘合。由于上述OLED显示装置包括以上所述的封装基板，从而使得粘合剂3的外侧边缘不存在毛刺，避免了粘合剂3的浪费，提高了粘合剂3对显示基板5和封装基板的粘合效果，同时第一挡墙2和粘合剂3共同起到了阻挡外界水汽和氧气侵入的作用，提高了OLED显示装置的抗外界水汽和氧气侵入的能力好，延长了OLED显示装置的寿命。
本发明实施例还提供了一种OLED显示装置的制作方法，用于制作以上所述的OLED显示装置。例如，如图8所示，该OLED显示装置的制作方法包括：步骤S801、在封装基板的衬底基板1的粘合区域11上，沿第一挡墙2内侧涂布粘合剂3。步骤S802、将封装基板覆盖在显示基板5上，使粘合剂3与显示基板5接触。步骤S803、使粘合剂3固化。示例性地，可以通过激光照射的方式使粘合剂3固化。
本发明实施例提供的OLED显示装置的制作方法如上所述，该制作方法包括沿第一挡墙2内侧涂布粘合剂3的步骤，从而使得第一挡墙2能够有效阻挡涂布在粘合区域11上的粘合剂3向外流动，进而避免粘合剂3的外侧边缘产生毛刺，避免了粘合剂3的浪费，提高了粘合剂3对显示基板5和封装基板的粘合效果，同时第一挡墙2和粘合剂3共同起到了阻挡外界水汽和氧气侵入的作用，提高了OLED显示装置的抗外界水汽和氧气侵入的能力，延长了OLED显示装置的寿命。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2015年11月4日递交的第201510742598.6号中国专利申请的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一 部分。

Claims (14)

  1. 一种封装基板，包括衬底基板，其中，所述衬底基板包括用于涂布粘合剂的粘合区域，所述封装基板还包括位于所述衬底基板上的第一挡墙，所述第一挡墙沿所述粘合区域的外侧边缘设置。
  2. 根据权利要求1所述的封装基板，其中，所述第一挡墙的材质为氧化硅。
  3. 根据权利要求1所述的封装基板，其中，所述第一挡墙的材质为金属。
  4. 根据权利要求3所述的封装基板，其中，所述衬底基板上还设置有对位标识，所述对比标识和所述第一挡墙由相同的材料形成。
  5. 根据权利要求1所述的封装基板，其中，所述第一挡墙围绕所述粘合区域的所有外侧边缘设置，以形成封闭的框。
  6. 根据权利要求1所述的封装基板，其中，所述第一挡墙靠近所述粘合区域的一侧垂直于所述衬底基板1。
  7. 根据权利要求6所述的封装基板，其中，所述第一挡墙的纵截面形状为矩形。
  8. 根据权利要求1所述的封装基板，其中，所述第一挡墙的高度小于涂布在所述粘合区域的粘合剂的高度。
  9. 根据权利要求1所述的封装基板，其中，所述第一挡墙的高度为0.7μm～1.2μm。
  10. 根据权利要求1～9任一项所述的封装基板，其中，所述封装基板还包括沿所述粘合区域的内侧边缘设置的第二挡墙。
  11. 一种封装基板的制作方法，用于制作如权利要求1～10任一项所述的封装基板，其中，所述封装基板的制作方法包括：
    提供衬底基板，所述衬底基板包括用于涂布粘合剂的粘合区域；
    在所述衬底基板上沿所述粘合区域的外侧边缘形成第一挡墙。
  12. 根据权利要求11所述的封装基板的制作方法，其中，在所述衬底基板上沿所述粘合区域的外侧边缘形成第一挡墙的同时形成对位标识，所述对位标识用于在粘合所述封装基板和显示基板时提供对位。
  13. 一种OLED显示装置，包括显示基板以及如权利要求1～10任一项 所述的封装基板，所述封装基板和所述显示基板通过位于所述粘合区域的粘合剂彼此粘合。
  14. 一种OLED显示装置的制作方法，用于制作如权利要求13所述的OLED显示装置，其中，所述OLED显示装置的制作方法包括：
    在所述粘合区域上，沿所述第一挡墙内侧涂布所述粘合剂；
    将所述封装基板覆盖在所述显示基板上，使所述粘合剂与所述显示基板接触；以及
    使所述粘合剂固化。
PCT/CN2016/095673 2015-11-04 2016-08-17 封装基板及其制作方法、oled显示装置及其制作方法 WO2017076101A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/502,390 US20170278897A1 (en) 2015-11-04 2016-08-17 Package substrate and manufacturing method thereof, and oled display device and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510742598.6A CN105226202A (zh) 2015-11-04 2015-11-04 封装基板及其制作方法、oled显示装置及其制作方法
CN201510742598.6 2015-11-04

Publications (1)

Publication Number Publication Date
WO2017076101A1 true WO2017076101A1 (zh) 2017-05-11

Family

ID=54995031

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/095673 WO2017076101A1 (zh) 2015-11-04 2016-08-17 封装基板及其制作方法、oled显示装置及其制作方法

Country Status (3)

Country Link
US (1) US20170278897A1 (zh)
CN (1) CN105226202A (zh)
WO (1) WO2017076101A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105226202A (zh) * 2015-11-04 2016-01-06 京东方科技集团股份有限公司 封装基板及其制作方法、oled显示装置及其制作方法
CN106025094B (zh) * 2016-05-04 2018-12-28 京东方科技集团股份有限公司 封装玻璃上的对位标记及其制造方法、oled及其生产方法
CN107275517A (zh) 2017-06-30 2017-10-20 京东方科技集团股份有限公司 一种显示基板及其制备方法和显示装置
CN107264008B (zh) * 2017-07-05 2019-07-16 京东方科技集团股份有限公司 一种印刷掩膜板及胶液图案的印刷方法
CN108615745B (zh) * 2018-04-25 2020-11-17 云谷（固安）科技有限公司 显示面板及其制造方法和显示终端
CN208781850U (zh) * 2018-10-31 2019-04-23 京东方科技集团股份有限公司 显示基板、显示面板及显示装置
CN110416441B (zh) * 2019-08-16 2021-11-26 京东方科技集团股份有限公司 一种显示面板的制备方法、显示面板及显示装置
KR20210077101A (ko) * 2019-12-16 2021-06-25 삼성디스플레이 주식회사 표시 장치
CN114883510A (zh) * 2022-05-11 2022-08-09 深圳市华星光电半导体显示技术有限公司 有机发光显示面板和有机发光显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104851904A (zh) * 2015-05-13 2015-08-19 合肥鑫晟光电科技有限公司 一种有机电致发光显示面板、其制作方法及显示装置
CN105226202A (zh) * 2015-11-04 2016-01-06 京东方科技集团股份有限公司 封装基板及其制作方法、oled显示装置及其制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1212662C (zh) * 2002-01-16 2005-07-27 翰立光电股份有限公司 显示元件的封装构造
US7508063B2 (en) * 2005-04-05 2009-03-24 Texas Instruments Incorporated Low cost hermetically sealed package
TW200738046A (en) * 2006-03-23 2007-10-01 Ritdisplay Corp Organic light-emitting apparatus having glue-blocking structure
KR101074812B1 (ko) * 2010-01-05 2011-10-19 삼성모바일디스플레이주식회사 유기전계발광 표시 장치와 그 제조 방법
CN103325958A (zh) * 2013-06-19 2013-09-25 京东方科技集团股份有限公司 有机电致发光器件封装盖板、有机电致发光器件及显示器
US20150008819A1 (en) * 2013-07-05 2015-01-08 Shenzhen China Star Optoelectronics Technology Co., Ltd. OLED Panel and Package Method Thereof
CN104037363A (zh) * 2014-06-17 2014-09-10 深圳市华星光电技术有限公司 基板的封装方法
CN104112765A (zh) * 2014-07-17 2014-10-22 深圳市华星光电技术有限公司 显示面板及其制作方法
CN104201291A (zh) * 2014-08-26 2014-12-10 京东方科技集团股份有限公司 一种有机电致发光器件及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104851904A (zh) * 2015-05-13 2015-08-19 合肥鑫晟光电科技有限公司 一种有机电致发光显示面板、其制作方法及显示装置
CN105226202A (zh) * 2015-11-04 2016-01-06 京东方科技集团股份有限公司 封装基板及其制作方法、oled显示装置及其制作方法

Also Published As

Publication number Publication date
US20170278897A1 (en) 2017-09-28
CN105226202A (zh) 2016-01-06

Similar Documents

Publication Publication Date Title
WO2017076101A1 (zh) 封装基板及其制作方法、oled显示装置及其制作方法
TW533611B (en) Encapsulation for OLED devices
US8552643B2 (en) Display apparatus
WO2020063530A1 (zh) 封装结构、电子装置及封装方法
WO2016115777A1 (zh) Oled的封装方法及oled封装结构
WO2019042299A1 (zh) Oled显示母板及其制备方法、oled显示面板的制备方法及其oled显示装置
WO2018219270A1 (zh) Oled显示器件的封装结构、封装方法、显示装置
US11164921B2 (en) Array substrate, method of manufacturing thereof, and display device
WO2016026225A1 (zh) 一种有机发光显示装置及有机发光二极管的封装方法
US10613402B2 (en) Display panel with array substrate having thickness varying in packaging area, method of manufacturing display panel and display device
WO2015014036A1 (zh) 柔性有机发光二极管显示器及其制备方法
WO2020029390A1 (zh) 显示面板及其制造方法
WO2016065829A1 (zh) 一种阵列基板及其制备方法、显示面板和显示装置
WO2017117931A1 (zh) Oled显示面板的封装方法、oled显示面板及oled显示装置
WO2020124892A1 (zh) 一种柔性显示面板及其制作方法
US11770948B2 (en) Organic light emitting component, fabrication method, and display device each having anti-shrinkage stop structures
TW202002275A (zh) 顯示面板及其製作方法
WO2020034269A1 (zh) Oled显示面板及其制作方法
WO2019157813A1 (zh) Oled封装方法与oled封装结构
KR20190029820A (ko) 유기 발광 표시 장치
CN110854289A (zh) 一种oled显示面板及显示装置
US10033010B2 (en) OLED substrate and preparation method thereof, OLED panel, and display apparatus
WO2018119886A1 (zh) 一种oled显示面板及oled显示面板的封装方法
KR102363276B1 (ko) 증착용 마스크 및 이의 제조 방법
WO2018161536A1 (zh) 用于显示面板的基板及其制作方法、显示面板及封装方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 15502390

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16861370

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16861370

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 16861370

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 04/12/2018)

122 Ep: pct application non-entry in european phase

Ref document number: 16861370

Country of ref document: EP

Kind code of ref document: A1