WO2017059609A1 - 柔性显示装置的制作方法及制得的柔性显示装置 - Google Patents

柔性显示装置的制作方法及制得的柔性显示装置 Download PDF

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WO2017059609A1
WO2017059609A1 PCT/CN2015/092791 CN2015092791W WO2017059609A1 WO 2017059609 A1 WO2017059609 A1 WO 2017059609A1 CN 2015092791 W CN2015092791 W CN 2015092791W WO 2017059609 A1 WO2017059609 A1 WO 2017059609A1
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layer
glass substrate
flexible
soft glass
substrate
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PCT/CN2015/092791
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English (en)
French (fr)
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余赟
张启沛
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深圳市华星光电技术有限公司
武汉华星光电技术有限公司
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Priority to US14/888,453 priority Critical patent/US9847500B2/en
Publication of WO2017059609A1 publication Critical patent/WO2017059609A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for fabricating a flexible display device and a manufactured flexible display device.
  • OLED Organic Light Emitting Display
  • OLED Organic Light Emitting Display
  • the flexible OLED display device Because of its characteristics of being bendable and easy to carry, it has become a major field of research and development in the field of display technology.
  • the substrates currently available for flexible OLED display devices are stainless steel sheets, polymer plastics, or soft glass substrates.
  • the surface roughness of the stainless steel sheet is too large, and the flattening layer needs to be added in the application, and the cost is high; the polymer plastic film and the soft glass substrate are the current research hotspots.
  • the complete separation process between the flexible substrate and the glass carrier is a key technology in the process.
  • FIG. 1 is a schematic structural view of a conventional flexible substrate mother board.
  • the flexible substrate mother board includes a carrier substrate 10, a peeling layer 20 disposed on the carrier substrate 10, and the peeling layer 20.
  • the upper bonding layer 30 and the soft glass substrate 40 attached to the bonding layer 30.
  • the flexible display device it is also necessary to fabricate the display structure unit and the package structure unit on the soft glass substrate 40, and finally the flexible display device is peeled off from the carrier substrate 10 by a laser lift-off process.
  • the existing OLED display device mostly adopts LTPS (Low Temperature Poly-Silicon) TFT process or Oxide Semiconductor (OS) TFT process in ELA (Excimer).
  • LTPS Low Temperature Poly-Silicon
  • OS Oxide Semiconductor
  • Laser Annealer, excimer laser annealing), other high-temperature processes, and laser stripping processes inevitably lead to an increase in the brittleness of the soft glass substrate, causing cracks and expansion of the soft glass substrate, affecting the display unit of the upper portion of the soft glass substrate. Performance, reducing product yield.
  • An object of the present invention is to provide a method for fabricating a flexible display device, which can reduce thermal shock of a high-temperature process and high heat on a soft glass substrate during laser laser to prevent cracking of the soft glass substrate and cause cracks, affecting performance of the display device and Product yield.
  • Another object of the present invention is to provide a flexible display device in which a soft glass substrate has no cracks, and the display device has good performance, is easy to manufacture, and has high product yield.
  • the present invention provides a method of fabricating a flexible display device, comprising the steps of:
  • Step 1 Providing a carrier substrate on which a connection layer is deposited by plasma enhanced chemical vapor deposition;
  • Step 2 forming a flexible substrate on the connecting layer, the flexible substrate comprising a soft glass substrate and a heat insulating layer disposed on at least one side of the soft glass substrate;
  • Step 3 forming a barrier layer on the flexible substrate
  • Step 4 forming a display structure unit on the barrier layer, and a package structure unit disposed on the display structure unit;
  • Step 5 separating the carrier substrate from the flexible substrate by laser laser, leaving the connection layer on the flexible substrate to obtain a flexible display device, the flexible display device comprising a flexible substrate, and the flexible substrate a connection layer on a lower surface of the substrate, a barrier layer provided on the flexible substrate, a display structure unit disposed on the barrier layer, and a package structure unit disposed on the display structure unit.
  • the flexible substrate comprises a soft glass substrate and a heat insulating layer disposed on a side of the soft glass substrate adjacent to the barrier layer.
  • the flexible substrate comprises a soft glass substrate and a heat insulation layer disposed on a side of the soft glass substrate adjacent to the connection layer.
  • the flexible substrate includes a soft glass substrate, a first heat insulating layer disposed on a side of the soft glass substrate adjacent to the connecting layer, and a second heat insulating layer disposed on a side of the soft glass substrate adjacent to the barrier layer.
  • the connecting layer is a SiO 2 layer or a SiN x layer; the insulating layer is made of a high temperature insulating and insulating material; the barrier layer is a SiO 2 layer, a SiN x layer, or a SiO 2 layer and a SiN x layer.
  • the present invention also provides a flexible display device including a flexible substrate, a connection layer disposed on a lower surface of the flexible substrate, a barrier layer disposed on the flexible substrate, a display structure unit disposed on the barrier layer, and a package structure unit disposed on the display structure unit;
  • the flexible substrate includes a soft glass substrate and a heat insulating layer disposed on at least one side of the soft glass substrate.
  • the flexible substrate includes a soft glass substrate, and the soft glass substrate is disposed adjacent to the barrier layer A layer of insulation on one side.
  • the flexible substrate comprises a soft glass substrate and a heat insulation layer disposed on a side of the soft glass substrate adjacent to the connection layer.
  • the flexible substrate includes a soft glass substrate, a first heat insulating layer disposed on a side of the soft glass substrate adjacent to the connecting layer, and a second heat insulating layer disposed on a side of the soft glass substrate adjacent to the barrier layer.
  • the connecting layer is a SiO 2 layer or a SiN x layer; the insulating layer is made of a high temperature insulating and insulating material; the barrier layer is a SiO 2 layer, a SiN x layer, or a SiO 2 layer and a SiN x layer.
  • the present invention also provides a flexible display device including a flexible substrate, a connection layer disposed on a lower surface of the flexible substrate, a barrier layer disposed on the flexible substrate, a display structure unit disposed on the barrier layer, and a package structure unit disposed on the display structure unit;
  • the flexible substrate includes a soft glass substrate and a heat insulating layer disposed on at least one side of the soft glass substrate;
  • the flexible substrate includes a soft glass substrate and a heat insulating layer disposed on a side of the soft glass substrate adjacent to the barrier layer;
  • the connecting layer is a SiO 2 layer or a SiN x layer
  • the material of the heat insulating layer is a high temperature resistant insulating and heat insulating material
  • the barrier layer is a SiO 2 layer, a SiN x layer, or a SiO 2 layer and a SiN layer.
  • the x layer overlaps and overlaps the composite layer.
  • the present invention provides a method of fabricating a flexible display device and a manufactured flexible display device, and a method of fabricating the flexible display device of the present invention, by using a connecting layer instead of a peeling layer and a paste in the prior art
  • the junction layer can not only enhance the bonding strength between the flexible substrate and the rigid carrier substrate, but also can easily separate the flexible substrate and the rigid carrier substrate as a peeling layer; and pass through one side of the soft glass substrate or
  • a heat-insulating layer is added on both sides to isolate the heat generated during the high-temperature process, the ELA process, and the laser stripping process, thereby alleviating the thermal shock generated by the heat on the soft glass substrate and the display device, and avoiding cracks caused by the increase in the brittleness of the soft glass substrate.
  • the performance of the resulting flexible display device is performed by using a connecting layer instead of a peeling layer and a paste in the prior art
  • 1 is a schematic structural view of a conventional flexible substrate mother board
  • FIG. 2 is a flow chart of a method of fabricating a flexible display device of the present invention
  • FIG. 3-4 is a schematic diagram of step 5 of the first embodiment of the flexible display device of the present invention.
  • FIG. 4 is a schematic structural view of the first embodiment of the flexible display device of the present invention.
  • FIG. 5-6 is a schematic diagram of a step 5 of a second embodiment of a method for fabricating a flexible display device according to the present invention.
  • FIG. 6 is a schematic structural view of a second embodiment of the flexible display device of the present invention.
  • FIG. 7-8 is a schematic diagram of step 5 of a third embodiment of a method for fabricating a flexible display device according to the present invention.
  • FIG. 8 is a schematic structural view of a third embodiment of the flexible display device of the present invention.
  • the present invention provides a method for fabricating a flexible display device, including the following steps:
  • Step 1 A carrier substrate 1 is provided on which a bonding layer 2 is deposited by a plasma enhanced chemical vapor deposition (PECVD) method.
  • PECVD plasma enhanced chemical vapor deposition
  • the carrier substrate 1 is a rigid substrate; preferably, the carrier substrate 1 is a glass substrate.
  • the connecting layer 2 may be an SiO 2 layer or a SiN x layer, and the connecting layer 2 can both increase the interfacial bonding strength between the flexible substrate 3 and the carrier substrate 1 and can be used as a peeling layer.
  • the separation of the flexible substrate 3 from the carrier substrate 1 is achieved, and at the same time, the isolation layer can also be used to reduce the damage to the soft glass substrate 31 in the flexible substrate 3 during the laser lift-off process.
  • Step 2 Form a flexible substrate 3 on the connecting layer 2, the flexible substrate 3 including a soft glass substrate 31 and a heat insulating layer 32 disposed on at least one side of the soft glass substrate 31.
  • the material of the heat insulating layer 32 is a high temperature resistant insulating and heat insulating material such as zirconium dioxide (ZrO 2 ) or the like.
  • the heat insulating layer 32 can effectively reduce the thermal shock of the high-energy density laser laser on the soft glass substrate 31 in the high-temperature process, the ELA process, and the laser stripping process, and prevent the soft glass substrate from being brittle.
  • Step 3 Form a barrier layer 4 on the flexible substrate 3.
  • the barrier layer 4 is an SiO 2 layer, a SiN x layer, or a composite layer in which the SiO 2 layer and the SiN x layer are overlapped.
  • Step 4 forming a display structure unit 5 on the barrier layer 4, and a package structure unit 6 disposed on the display structure unit 5.
  • Step 5 please refer to FIG. 3-7, the carrier substrate 1 is separated from the flexible substrate 3 by laser laser, and the connecting layer 2 is left on the flexible substrate 3 to obtain a flexible display device.
  • the flexible display device includes a flexible substrate 3, a connecting layer 2 disposed on a lower surface of the flexible substrate 3, a barrier layer 4 disposed on the flexible substrate 3, and a display structure unit 5 disposed on the barrier layer 4. And a package structure unit 6 provided on the display structure unit 5.
  • the flexible substrate 3-4 is a schematic diagram of a step 5 of a first embodiment of a method for fabricating a flexible display device according to the present invention.
  • the flexible substrate 3 includes a soft glass substrate 31 and is disposed on The soft glass substrate 31 is adjacent to a heat insulating layer 32 on the side of the barrier layer 4.
  • the flexible substrate 3 includes a soft glass substrate 31 and is disposed on The soft glass substrate 31 is adjacent to a heat insulating layer 32 on the side of the connection layer 2.
  • the flexible substrate 3 includes a soft glass substrate 31 disposed at the same.
  • the first heat insulating layer 320 on the side of the soft glass substrate 31 close to the connection layer 2 and the second heat insulating layer 321 provided on the side of the soft glass substrate 31 close to the barrier layer 4 are formed.
  • the display structure unit 5 is an OLED display device, so that the flexible display device of the present invention is a flexible OLED display device.
  • the manufacturing method of the above flexible display device can not only enhance the bonding strength between the flexible substrate substrate and the rigid carrier substrate, but also can be used as a peeling layer by using a connecting layer instead of the peeling layer and the bonding layer in the prior art.
  • the thermal shock generated by the glass substrate and the display device avoids cracking due to an increase in brittleness of the soft glass substrate, and improves the performance of the manufactured flexible display device.
  • the present invention further provides a flexible display device including a flexible substrate 3, a connecting layer 2 disposed on a lower surface of the flexible substrate 3, and a flexible substrate 3 disposed on the flexible substrate 3. a barrier layer 4, a display structure unit 5 disposed on the barrier layer 4, and a package structure unit 6 disposed on the display structure unit 5;
  • the flexible substrate 3 includes a soft glass substrate 31 and a heat insulating layer 32 disposed on at least one side of the soft glass substrate 31.
  • the flexible substrate 3 includes a soft glass substrate 31 and a side of the soft glass substrate 31 adjacent to the barrier layer 4 A thermal insulation layer 32.
  • a second embodiment of a flexible display device includes a soft glass substrate 31 and a side of the soft glass substrate 31 adjacent to the connection layer 2 .
  • the flexible substrate 3 includes a soft glass substrate 31 disposed on a side of the soft glass substrate 31 adjacent to the connection layer 2
  • the first heat insulating layer 320 and the second heat insulating layer 321 provided on the side of the soft glass substrate 31 close to the barrier layer 4 are provided.
  • the carrier substrate 1 is a rigid substrate; preferably, the carrier substrate 1 is a glass substrate.
  • the connecting layer 2 may be an SiO 2 layer or a SiN x layer, and the connecting layer 2 can both increase the interfacial bonding strength between the flexible substrate 3 and the carrier substrate 1 and can be used as a peeling layer.
  • the separation of the flexible substrate 3 from the carrier substrate 1 is achieved, and at the same time, the isolation layer can also be used to reduce the damage to the soft glass substrate 31 in the flexible substrate 3 during the laser lift-off process.
  • the material of the heat insulating layer 32 is a high temperature resistant insulating and heat insulating material, such as zirconium dioxide (ZrO 2 ), etc.; the heat insulating layer 32 can effectively reduce high energy in a high temperature process, an ELA process, and a laser stripping process.
  • the thermal shock of the laser laser of the density on the soft glass substrate 31 prevents the soft glass substrate from being brittle.
  • the barrier layer 4 is an SiO 2 layer, a SiN x layer, or a composite layer in which the SiO 2 layer and the SiN x layer are overlapped.
  • the display structure unit 5 is an OLED display device, so that the flexible display device of the present invention is a flexible OLED display device.
  • the present invention provides a method of fabricating a flexible display device and a manufactured flexible display device.
  • the method for fabricating the flexible display device of the present invention replaces the peeling layer and bonding in the prior art by using a connecting layer.
  • the layer can not only enhance the bonding strength between the flexible substrate and the rigid carrier substrate, but also can easily separate the flexible substrate and the rigid carrier substrate as a peeling layer; and pass one or both of the soft glass substrates
  • the heat insulation layer is added on the side to insulate the heat generated during the high-temperature process, the ELA process, and the laser stripping process, thereby alleviating the thermal shock generated by the heat on the soft glass substrate and the display device, and avoiding cracks caused by the increase in the brittleness of the soft glass substrate, thereby improving the production.
  • the performance of the flexible display device is added on the side to insulate the heat generated during the high-temperature process, the ELA process, and the laser stripping process, thereby alleviating the thermal shock generated by the heat on the soft glass substrate

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Abstract

一种柔性显示装置的制作方法及制得的柔性显示装置，其中柔性显示装置的制作方法，通过采用一连接层（2）代替现有技术中的剥离层（20）和粘结层（30），既能够增强柔性衬底基板（3）与硬质载体基板（1）之间的结合强度，又可以作为剥离层容易实现柔性衬底基板（3）与硬质载体基板（1）的分离；又通过在软玻璃基板（31）的一侧或两侧增设隔热层（32），能够隔绝高温制程、ELA过程、激光剥离过程中产生的热量，缓解热量对软玻璃基板（31）及显示器件（5）产生的热冲击，避免因软玻璃基板（31）脆性增加而造成裂纹，提高制得的柔性显示装置的性能。

Description

柔性显示装置的制作方法及制得的柔性显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性显示装置的制作方法及制得的柔性显示装置。
背景技术
有机发光二极管(Organic Light Emitting Display，OLED)显示装置具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，可实现柔性显示与大面积全色显示等诸多优点，应用范围越来越广泛，被业界公认为是最有发展潜力的显示装置。随着OLED技术的发展，利用OLED的柔性优势产生了柔性OLED显示装置，因其具有可弯折易携带的特点，已成为显示技术领域研究和开发的主要领域。
目前可用于柔性OLED显示装置的基板有不锈钢薄片、聚合物塑料、或软玻璃基板等。其中不锈钢薄片表面粗糙度太大，应用中需增加平坦化层，成本较高；聚合物塑料薄膜和软玻璃基板是目前研究的热点。在柔性OLED显示装置的制作过程中，把柔性基板与玻璃载体完整的分离工艺是制程中的关键技术。
如图1所示是现有的一种柔性基板母板的结构示意图，所述柔性基板母板包括载体基板10、设于所述载体基板10上的剥离层20、设于所述剥离层20上的粘结层30、及贴附于所述粘结层30上的软玻璃基板40。在制作柔性显示装置时，还需要在软玻璃基板40上制作显示结构单元和封装结构单元，最后通过激光剥离制程将柔性显示装置从载体基板10上剥离下来。
与塑料薄膜相比，软玻璃基板具有与硬质玻璃相同的电学性能，具有一定的阻挡水氧能力。但是上述现有技术也存在一定的问题：现有的OLED显示装置中多采用LTPS(Low Temperature Poly-Silicon，低温多晶硅)TFT工艺或氧化物半导体(Oxide Semiconductor，OS)TFT工艺，在ELA(Excimer Laser Annealer，准分子激光退火)制程中、其它高温制程、及激光剥离制程中都不可避免的导致软玻璃基板的脆性增加，使得软玻璃基板产生裂纹并扩展，影响软玻璃基板上部显示结构单元的性能，降低产品良率。
发明内容
本发明的目的在于提供一种柔性显示装置的制作方法，能够降低高温制程、及激光镭射过程中高热量对软玻璃基板的热冲击，以防止软玻璃基板脆性增加造成裂纹，影响显示器件的性能和产品良率。
本发明的目的还在于提供一种柔性显示装置，软玻璃基板没有裂纹，显示器件性能良好，易于制作且产品良率高。
为实现上述目的，本发明提供一种柔性显示装置的制作方法，包括如下步骤：
步骤1、提供一载体基板，在所述载体基板上采用等离子体增强化学气相沉积方法沉积一连接层；
步骤2、在所述连接层上制作柔性基板，所述柔性基板包括一软玻璃基板与至少设于所述软玻璃基板一侧的一隔热层；
步骤3、在所述柔性基板上形成阻挡层；
步骤4、在所述阻挡层上形成显示结构单元、及设于所述显示结构单元上的封装结构单元；
步骤5、采用激光镭射的方法将所述载体基板与柔性基板分离，所述连接层留在所述柔性基板上，得到一柔性显示装置，所述柔性显示装置包括柔性基板、设于所述柔性基板下表面的连接层、设于所述柔性基板上的阻挡层、设于所述阻挡层上的显示结构单元、及设于所述显示结构单元上的封装结构单元。
所述柔性基板包括一软玻璃基板、及设于所述软玻璃基板靠近阻挡层一侧的一隔热层。
所述柔性基板包括一软玻璃基板、及设于所述软玻璃基板靠近连接层一侧的一隔热层。
所述柔性基板包括一软玻璃基板、设于所述软玻璃基板靠近连接层一侧的第一隔热层、及设于所述软玻璃基板靠近阻挡层一侧的第二隔热层。
所述连接层为SiO2层或SiNx层；所述隔热层的材料为耐高温绝缘隔热材料；所述阻挡层为SiO2层、SiNx层、或者由SiO2层和SiNx层交叉重叠构成的复合层。
本发明还提供一种柔性显示装置，包括柔性基板、设于所述柔性基板下表面的连接层、设于所述柔性基板上的阻挡层、设于所述阻挡层上的显示结构单元、及设于所述显示结构单元上的封装结构单元；
其中，所述柔性基板包括一软玻璃基板与至少设于所述软玻璃基板一侧的一隔热层。
所述柔性基板包括一软玻璃基板、及设于所述软玻璃基板靠近阻挡层 一侧的一隔热层。
所述柔性基板包括一软玻璃基板、及设于所述软玻璃基板靠近连接层一侧的一隔热层。
所述柔性基板包括一软玻璃基板、设于所述软玻璃基板靠近连接层一侧的第一隔热层、及设于所述软玻璃基板靠近阻挡层一侧的第二隔热层。
所述连接层为SiO2层或SiNx层；所述隔热层的材料为耐高温绝缘隔热材料；所述阻挡层为SiO2层、SiNx层、或者由SiO2层和SiNx层交叉重叠构成的复合层。
本发明还提供一种柔性显示装置，包括柔性基板、设于所述柔性基板下表面的连接层、设于所述柔性基板上的阻挡层、设于所述阻挡层上的显示结构单元、及设于所述显示结构单元上的封装结构单元；
其中，所述柔性基板包括一软玻璃基板与至少设于所述软玻璃基板一侧的一隔热层；
其中，所述柔性基板包括一软玻璃基板、及设于所述软玻璃基板靠近阻挡层一侧的一隔热层；
其中，所述连接层为SiO2层或SiNx层；所述隔热层的材料为耐高温绝缘隔热材料；所述阻挡层为SiO2层、SiNx层、或者由SiO2层和SiNx层交叉重叠构成的复合层。
本发明的有益效果：本发明提供一种柔性显示装置的制作方法及制得的柔性显示装置，本发明的柔性显示装置的制作方法，通过采用一连接层代替现有技术中的剥离层和粘结层，既能够增强柔性衬底基板与硬质载体基板之间的结合强度，又可以作为剥离层容易实现柔性衬底基板与硬质载体基板的分离；又通过在软玻璃基板的一侧或两侧增设隔热层，能够隔绝高温制程、ELA过程、激光剥离过程中产生的热量，缓解热量对软玻璃基板及显示器件产生的热冲击，避免因软玻璃基板脆性增加而造成裂纹，提高制得的柔性显示装置的性能。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有的一种柔性基板母板的结构示意图；
图2为本发明的柔性显示装置的制作方法的流程图；
图3-4为本发明的柔性显示装置的制作方法第一实施例的步骤5的示意图；且图4为本发明的柔性显示装置第一实施例的结构示意图；
图5-6为本发明的柔性显示装置的制作方法第二实施例的步骤5的示意图；且图6为本发明的柔性显示装置第二实施例的结构示意图；
图7-8为本发明的柔性显示装置的制作方法第三实施例的步骤5的示意图；且图8为本发明的柔性显示装置第三实施例的结构示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明提供一种柔性显示装置的制作方法，包括如下步骤：
步骤1、提供一载体基板1，在所述载体基板1上采用等离子体增强化学气相沉积(PECVD)方法沉积一连接层2。
具体的，所述载体基板1为硬质基板；优选的，所述载体基板1为玻璃基板。
具体的，所述连接层2可以为SiO2层或SiNx层，所述连接层2既能起到增加柔性基板3与载体基板1之间的界面结合强度的作用，又可以作为剥离层容易实现柔性基板3与载体基板1的分离，同时还可以作为隔离层降低激光剥离过程中对柔性基板3中的软玻璃基板31的损伤。
步骤2、在所述连接层2上制作柔性基板3，所述柔性基板3包括一软玻璃基板31与至少设于所述软玻璃基板31一侧的一隔热层32。
具体的，所述隔热层32的材料为耐高温绝缘隔热材料，如二氧化锆(ZrO2)等。所述隔热层32可以有效的降低高温制程、ELA过程、激光剥离过程中高能量密度的激光镭射对软玻璃基板31的热冲击，防止软玻璃基板脆性增强。
步骤3、在所述柔性基板3上形成阻挡层4。
具体的，所述阻挡层4为SiO2层、SiNx层、或者由SiO2层和SiNx层交叉重叠构成的复合层。
步骤4、在所述阻挡层4上形成显示结构单元5、及设于所述显示结构单元5上的封装结构单元6。
步骤5、请参阅图3-7，采用激光镭射的方法将所述载体基板1与柔性基板3分离，所述连接层2留在所述柔性基板3上，得到一柔性显示装置， 所述柔性显示装置包括柔性基板3、设于所述柔性基板3下表面的连接层2、设于所述柔性基板3上的阻挡层4、设于所述阻挡层4上的显示结构单元5、及设于所述显示结构单元5上的封装结构单元6。
请参阅图3-4，为本发明柔性显示装置的制作方法的第一实施例的步骤5的示意图，在该第一实施例中，所述柔性基板3包括一软玻璃基板31、及设于所述软玻璃基板31靠近阻挡层4一侧的一隔热层32。
请参阅图5-6，为本发明柔性显示装置的制作方法的第二实施例的步骤5的示意图，在该第二实施例中，所述柔性基板3包括一软玻璃基板31、及设于所述软玻璃基板31靠近连接层2一侧的一隔热层32。
请参阅图7-8，为本发明柔性显示装置的制作方法的第三实施例的步骤5的示意图，在该第三实施例中，所述柔性基板3包括一软玻璃基板31、设于所述软玻璃基板31靠近连接层2一侧的第一隔热层320、及设于所述软玻璃基板31靠近阻挡层4一侧的第二隔热层321。
具体的，所述显示结构单元5为OLED显示器件，从而本发明的柔性显示装置为柔性OLED显示装置。
上述柔性显示装置的制作方法，通过采用一连接层代替现有技术中的剥离层和粘结层，既能够增强柔性衬底基板与硬质载体基板之间的结合强度，又可以作为剥离层容易实现柔性衬底基板与硬质载体基板的分离；又通过在软玻璃基板的一侧或两侧增设隔热层，能够隔绝高温制程、ELA过程、激光剥离过程中产生的热量，缓解热量对软玻璃基板及显示器件产生的热冲击，避免因软玻璃基板脆性增加而造成裂纹，提高制得的柔性显示装置的性能。
请参阅图4、图6、及图8，本发明还提供一种柔性显示装置，包括柔性基板3、设于所述柔性基板3下表面的连接层2、设于所述柔性基板3上的阻挡层4、设于所述阻挡层4上的显示结构单元5、及设于所述显示结构单元5上的封装结构单元6；
其中，所述柔性基板3包括一软玻璃基板31与至少设于所述软玻璃基板31一侧的一隔热层32。
请参阅图4，为本发明柔性显示装置的第一实施例，在该实施例中，所述柔性基板3包括一软玻璃基板31、及设于所述软玻璃基板31靠近阻挡层4一侧的一隔热层32。
请参阅图6，为本发明柔性显示装置的第二实施例，在该实施例中，所述柔性基板3包括一软玻璃基板31、及设于所述软玻璃基板31靠近连接层2一侧的一隔热层32。
请参阅图8，为本发明柔性显示装置的第三实施例，在该实施例中，所述柔性基板3包括一软玻璃基板31、设于所述软玻璃基板31靠近连接层2一侧的第一隔热层320、及设于所述软玻璃基板31靠近阻挡层4一侧的第二隔热层321。
具体的，所述载体基板1为硬质基板；优选的，所述载体基板1为玻璃基板。
具体的，所述连接层2可以为SiO2层或SiNx层，所述连接层2既能起到增加柔性基板3与载体基板1之间的界面结合强度的作用，又可以作为剥离层容易实现柔性基板3与载体基板1的分离，同时还可以作为隔离层降低激光剥离过程中对柔性基板3中的软玻璃基板31的损伤。
具体的，所述隔热层32的材料为耐高温绝缘隔热材料，如二氧化锆(ZrO2)等；所述隔热层32可以有效的降低高温制程、ELA过程、激光剥离过程中高能量密度的激光镭射对软玻璃基板31的热冲击，防止软玻璃基板脆性增强。
具体的，所述阻挡层4为SiO2层、SiNx层、或者由SiO2层和SiNx层交叉重叠构成的复合层。
具体的，所述显示结构单元5为OLED显示器件，从而本发明的柔性显示装置为柔性OLED显示装置。
综上所述，本发明提供一种柔性显示装置的制作方法及制得的柔性显示装置，本发明的柔性显示装置的制作方法，通过采用一连接层代替现有技术中的剥离层和粘结层，既能够增强柔性衬底基板与硬质载体基板之间的结合强度，又可以作为剥离层容易实现柔性衬底基板与硬质载体基板的分离；又通过在软玻璃基板的一侧或两侧增设隔热层，能够隔绝高温制程、ELA过程、激光剥离过程中产生的热量，缓解热量对软玻璃基板及显示器件产生的热冲击，避免因软玻璃基板脆性增加而造成裂纹，提高制得的柔性显示装置的性能。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (11)

  1. 一种柔性显示装置的制作方法，包括如下步骤：
    步骤1、提供一载体基板，在所述载体基板上采用等离子体增强化学气相沉积方法沉积一连接层；
    步骤2、在所述连接层上制作柔性基板，所述柔性基板包括一软玻璃基板与至少设于所述软玻璃基板一侧的一隔热层；
    步骤3、在所述柔性基板上形成阻挡层；
    步骤4、在所述阻挡层上形成显示结构单元、及设于所述显示结构单元上的封装结构单元；
    步骤5、采用激光镭射的方法将所述载体基板与柔性基板分离，所述连接层留在所述柔性基板上，得到一柔性显示装置，所述柔性显示装置包括柔性基板、设于所述柔性基板下表面的连接层、设于所述柔性基板上的阻挡层、设于所述阻挡层上的显示结构单元、及设于所述显示结构单元上的封装结构单元。
  2. 如权利要求1所述的柔性显示装置的制作方法，其中，所述柔性基板包括一软玻璃基板、及设于所述软玻璃基板靠近阻挡层一侧的一隔热层。
  3. 如权利要求1所述的柔性显示装置的制作方法，其中，所述柔性基板包括一软玻璃基板、及设于所述软玻璃基板靠近连接层一侧的一隔热层。
  4. 如权利要求1所述的柔性显示装置的制作方法，其中，所述柔性基板包括一软玻璃基板、设于所述软玻璃基板靠近连接层一侧的第一隔热层、及设于所述软玻璃基板靠近阻挡层一侧的第二隔热层。
  5. 如权利要求1所述的柔性显示装置的制作方法，其中，所述连接层为SiO2层或SiNx层；所述隔热层的材料为耐高温绝缘隔热材料；所述阻挡层为SiO2层、SiNx层、或者由SiO2层和SiNx层交叉重叠构成的复合层。
  6. 一种柔性显示装置，包括柔性基板、设于所述柔性基板下表面的连接层、设于所述柔性基板上的阻挡层、设于所述阻挡层上的显示结构单元、及设于所述显示结构单元上的封装结构单元；
    其中，所述柔性基板包括一软玻璃基板与至少设于所述软玻璃基板一侧的一隔热层。
  7. 如权利要求6所述的柔性显示装置，其中，所述柔性基板包括一软玻璃基板、及设于所述软玻璃基板靠近阻挡层一侧的一隔热层。
  8. 如权利要求6所述的柔性显示装置，其中，所述柔性基板包括一软 玻璃基板、及设于所述软玻璃基板靠近连接层一侧的一隔热层。
  9. 如权利要求6所述的柔性显示装置，其中，所述柔性基板包括一软玻璃基板、设于所述软玻璃基板靠近连接层一侧的第一隔热层、及设于所述软玻璃基板靠近阻挡层一侧的第二隔热层。
  10. 如权利要求6所述的柔性显示装置，其中，所述连接层为SiO2层或SiNx层；所述隔热层的材料为耐高温绝缘隔热材料；所述阻挡层为SiO2层、SiNx层、或者由SiO2层和SiNx层交叉重叠构成的复合层。
  11. 一种柔性显示装置，包括柔性基板、设于所述柔性基板下表面的连接层、设于所述柔性基板上的阻挡层、设于所述阻挡层上的显示结构单元、及设于所述显示结构单元上的封装结构单元；
    其中，所述柔性基板包括一软玻璃基板与至少设于所述软玻璃基板一侧的一隔热层；
    其中，所述柔性基板包括一软玻璃基板、及设于所述软玻璃基板靠近阻挡层一侧的一隔热层；
    其中，所述连接层为SiO2层或SiNx层；所述隔热层的材料为耐高温绝缘隔热材料；所述阻挡层为SiO2层、SiNx层、或者由SiO2层和SiNx层交叉重叠构成的复合层。
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