WO2017057745A1 - 誘電体薄膜、容量素子および電子部品 - Google Patents
誘電体薄膜、容量素子および電子部品 Download PDFInfo
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- WO2017057745A1 WO2017057745A1 PCT/JP2016/079151 JP2016079151W WO2017057745A1 WO 2017057745 A1 WO2017057745 A1 WO 2017057745A1 JP 2016079151 W JP2016079151 W JP 2016079151W WO 2017057745 A1 WO2017057745 A1 WO 2017057745A1
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- thin film
- perovskite structure
- dielectric
- dielectric thin
- perovskite
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- 229910052779 Neodymium Inorganic materials 0.000 claims abstract description 10
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
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Definitions
- the present invention relates to a dielectric thin film, a capacitive element including the dielectric thin film, and an electronic component.
- metal oxide materials have been used as dielectric materials for thin film capacitors, and material properties have been improved for many years in order to make thin film electronic components with higher functions.
- the improvement in the characteristics of electronic components by metal oxides is reaching its limit, and new materials with higher characteristics are strongly demanded.
- materials having high dielectric properties other than metal oxides include metal oxynitride materials in which part of oxygen atoms in the oxygen octahedron of the perovskite crystal structure is replaced with nitrogen atoms.
- the perovskite structure is a structure generally represented by ABX 3 (X; O, N, C, F).
- Patent Document 1 discloses a technique related to metal oxynitrides having a relative dielectric constant of 11000, which exceeds the relative dielectric constant obtained with conventional barium titanate.
- the relative dielectric constant is calculated from a pellet obtained by CIP molding of a metal oxynitride powder.
- the relative dielectric constant is obtained from a bulk sintered body in which metal oxynitride particles are sintered. It is not calculated. With such a powder compact, it has been difficult to obtain sufficient insulation.
- Patent Document 2 evaluates the relative dielectric constant of a sintered metal oxynitride having a perovskite structure and states that its frequency dependence is small. However, the value of the relative dielectric constant is clearly described. It has not been. Further, it has not been verified whether the manufactured oxynitride sintered body has sufficient insulating properties.
- Non-Patent Document 1 describes an oxide ferroelectric having a perovskite layered structure different from the above perovskite structure.
- substances having a perovskite layered structure are mainly classified into three groups.
- the first is a substance called a Ruddlesden-Popper type and represented by the general formula A m + 1 B m O 3m + 1 .
- La 2-x Sr x CuO 4 which is a high-temperature superconducting oxide is exemplified.
- the second is a substance called the Aurevilleus type and represented by the general formula A m-1 Bi 2 B m O 3m + 3 .
- a specific material is SrBi 2 Ta 2 O 9 which is a Bi-based ferroelectric material that is expected to be applied to ferroelectric thin film memories.
- the third is a substance represented by a general formula A n B n O 3n + 2 called a perovskite slab structure.
- Typical examples of such a material include Sr 2 Ta 2 O 7 and La 2 Ti 2 O 7 .
- Non-Patent Document 2 describes that a metal oxynitride raw material powder and carbon powder are fired at a high temperature to obtain a metal oxynitride as a sintered body.
- Patent Document 2 a sintered body of a solid solution of metal oxynitrides having a perovskite structure, in which oxygen and nitrogen are represented by a composition formula ABO 2 N or ABON 2 in a stoichiometric ratio, is obtained. It is stated that the rate is realized.
- Patent Document 2 in a region where the content of nitrogen is less than the stoichiometric ratio, a solid solution having an intermediate composition between a metal oxide and a metal oxynitride is formed. No mention is made of compatibility between high dielectric constants.
- the thin film obtained by a vapor phase growth method etc. has a structure different from the sintered compact as described in patent document 2 due to the difference in the formation method.
- a thin film of a metal oxynitride for example, a substance having a perovskite structure represented by the composition formula ABO 2 N
- ABO 2 N a substance having a perovskite structure represented by the composition formula ABO 2 N
- the present invention has been made in view of the above-described conventional problems, and even if the amount of nitrogen contained in the metal oxynitride is controlled to be low, the dielectric can achieve both high dielectric constant and high insulation.
- An object of the present invention is to provide a thin film and a capacitive element including the dielectric thin film.
- the present inventors have found that a metal oxynitride having a perovskite structure can be stably formed as a solid solution by forming a dielectric thin film having a predetermined composition, and to complete the present invention. It came.
- a dielectric thin film comprising a dielectric composition containing a dielectric having a perovskite structure
- the dielectric composition has a chemical formula Ma z MbO x N y (Ma is one or more elements selected from Sr, Ba, Ca, La, Ce, Pr, Nd, Na, Mb is Ta, Nb, Ti, W One or more elements selected from the group consisting of: O is oxygen, and N is nitrogen)
- a represents the ionic valence indicated when the Ma occupies the A site in the perovskite structure
- b represents the ionic valence indicated when the Mb occupies the B site in the perovskite structure
- the a and b are 6.7 ⁇ a + b ⁇ 7.3 is satisfied
- X, y and z in the chemical formula are 0.8 ⁇ z ⁇ 1.2. 2.450 ⁇ x ⁇ 3.493 0.005
- a dielectric thin film comprising a dielectric composition containing a dielectric having a perovskite structure
- the dielectric composition has a chemical formula Ma z MbO x N y (Ma is one or more elements selected from Sr, Ba, Ca, La, Ce, Pr, Nd, Na, Mb is Ta, Nb, Ti, W One or more elements selected from the group consisting of: O is oxygen, and N is nitrogen)
- a represents the ionic valence indicated when the Ma occupies the A site in the perovskite structure
- b represents the ionic valence indicated when the Mb occupies the B site in the perovskite structure
- the a and b are 6.7 ⁇ a + b ⁇ 7.3 is satisfied
- X, y and z in the chemical formula are 0.8 ⁇ z ⁇ 1.2.
- the peak intensity of the diffracted X-rays not belonging to the perovskite structure is 100 when the peak intensity indicating the maximum intensity among the peak intensities of the diffracted X-rays belonging to the perovskite structure is 100.
- the dielectric thin film is characterized in that the peak intensity indicating the maximum intensity is 0 or more and 10 or less.
- a metal oxynitride dielectric thin film having the above characteristics By using a metal oxynitride dielectric thin film having the above characteristics, a high dielectric constant can be obtained even when the amount of nitrogen contained in the metal oxynitride is controlled to be low. And a high relative dielectric constant.
- a metal oxynitride dielectric thin film having the above characteristics By using a metal oxynitride dielectric thin film having the above characteristics, a high dielectric constant can be obtained even when the amount of nitrogen contained in the metal oxynitride is controlled to be low. And a high relative dielectric constant.
- a peak having a maximum intensity derived from a metal oxynitride composed of Ma and Mb existing at 2 ⁇ 30 ° to 35 ° when XRD analysis is performed with CuK ⁇ 1 radiation (wavelength of 1.54056 mm).
- Ma is one or more elements selected from Sr, Ba, Ca, La, Ce, Pr, Nd, and Na
- Mb is one or more elements selected from Ta, Nb, Ti, and W. Preferably there is.
- a capacitive element having the dielectric thin film is preferable.
- the dielectric composition according to the present invention it is possible to provide a capacitive element such as a thin film capacitor having a high capacitance which has not been obtained conventionally.
- both high dielectric constant (for example, 1000 or more) and high insulation (for example, 10 10 ⁇ cm or more) can be achieved.
- a dielectric thin film and a capacitor can be provided.
- X-ray diffraction pattern of the produced metal oxynitride SrTaO 2 N (Comparative Example 1 of the present invention) X-ray diffraction pattern of the produced metal oxide Sr 2 Ta 2 O 7 (normal temperature and normal pressure) (Comparative Example 5 of the present invention) An X-ray diffraction pattern of a mixed crystal of the produced metal oxynitride and metal oxide is shown (Comparative Example 3 of the present invention).
- X-ray diffraction pattern of solid solution of produced metal oxide Sr 2 Ta 2 O 7 (when stress is applied) and metal oxynitride SrTaO 2 N (Example 2 of the present invention) Schematic diagram of thin film capacitor
- the dielectric thin film according to the first aspect of the present invention is a dielectric thin film made of a dielectric composition having a perovskite structure.
- This dielectric composition has a chemical formula Ma z MbO x N y (Ma is one or more elements selected from Sr, Ba, Ca, La, Ce, Pr, Nd, Na, and Mb is Ta, Nb, Ti, W At least one element selected from the group consisting of O, oxygen, and N.
- the dielectric having a perovskite structure is a solid solution of oxide and nitride in which part of oxygen in an octahedron formed of oxygen is replaced by nitrogen.
- the content of nitrogen in Ma z MbO 2 N is large. Therefore, in the present embodiment, in the metal oxynitride solid solution having such a perovskite structure, the nitrogen content (y) is made smaller than 1.
- y is 0.005 or more, preferably 0.300 or more, and more preferably 0.500 or more.
- y is 0.700 or less, and preferably 0.600 or less.
- y is a high relative dielectric constant obtained from crystal distortion caused by the covalent bond of N. Even when “y” is within the above range, the dielectric thin film according to the present embodiment exists as a metal oxynitride solid solution in which the perovskite structure is maintained.
- the x is 2.450 or more, and preferably 2.600 or more.
- x is 3.493 or less, preferably 3.050 or less, and more preferably 2.750 or less.
- insulation is not obtained, and when x> 3.493, the effect obtained by being a metal oxynitride solid solution is not sufficiently obtained.
- the effect is a high relative dielectric constant obtained from crystal distortion caused by the covalent bond of N.
- z indicates the abundance ratio of Ma and Mb in the dielectric composition.
- z is 0.8 or more, and preferably 0.9 or more.
- z is 1.2 or less, and preferably 1.1 or less. Note that when z ⁇ 0.8, the insulating property is deteriorated.
- z> 1.2 for example, when Ma is Sr, segregation such as SrO occurs, and the relative permittivity tends to decrease. .
- y described above is preferably in the range of 0.500 to 0.700.
- the ion valence a and the ion valence b are each expressed as an average valence.
- the average valence is a value obtained by averaging the valences of ions present at the A site or the B site according to the abundance ratio. For example, a case where Sr and La exist at a ratio of 4: 1 at the A site will be described.
- the valence of Sr ions in the perovskite structure is 2, and the valence of La ions in the perovskite structure is 3. Therefore, the average valence a of the A site is calculated by the following (formula 1), and a is 2.2.
- the element of Ma is one or more elements selected from Sr, Ba, Ca, La, Ce, Pr, Nd, and Na.
- the Mb element is one or more elements selected from Ta, Nb, Ti, and W.
- Ma is preferably Sr and Mb is preferably Ta.
- a solid solution of a metal oxynitride having a perovskite structure can be easily obtained by using the above combination.
- the dielectric thin film which concerns on the 2nd viewpoint of this invention is a dielectric thin film which consists of a dielectric composition containing the dielectric material which has a perovskite structure.
- This dielectric composition has a chemical formula Ma z MbO x N y (Ma is one or more elements selected from Sr, Ba, Ca, La, Ce, Pr, Nd, Na, and Mb is Ta, Nb, Ti, W At least one element selected from the group consisting of O, oxygen and N represents nitrogen), and “x”, “y” and “z” in the chemical formula are Since it overlaps with the description in the dielectric thin film concerning a viewpoint, it abbreviate
- the ionic valence a, the ionic valence b, and their sum (a + b) are also omitted because they overlap with the description of the dielectric thin film according to the first aspect.
- the diffraction X-ray peak attributed to the perovskite structure appears in the X-ray diffraction pattern.
- This is a peak attributed to a dielectric contained in the dielectric thin film, and in this embodiment, a peak attributed to a metal oxynitride having a perovskite structure. Therefore, since the dielectric thin film has a metal oxynitride having a predetermined composition having a perovskite structure, the dielectric thin film containing the metal oxynitride can achieve both a high dielectric constant and a high insulating property.
- the X-ray diffraction pattern of the dielectric thin film may have a diffraction X-ray peak that does not belong to the perovskite structure as long as both a high relative dielectric constant and a high insulating property can be achieved.
- the peak intensity indicating the maximum intensity among the peak intensities of the diffracted X-rays belonging to the perovskite structure is 100
- the peak intensity indicating the maximum intensity among the peak intensities of the diffracted X-rays not belonging to the perovskite structure is 0 or more and 10 or less.
- the peak intensity is greater than 0, in such a dielectric thin film, a phase having a perovskite structure and a phase not having a perovskite structure coexist and are a so-called mixed crystal.
- the existence ratio of the substance having no perovskite structure is very small as compared with the existence ratio of the substance having the perovskite structure, it is possible to achieve both high dielectric constant and high insulation.
- the structure other than the perovskite structure is not particularly limited, but the substance having a perovskite structure in a mixed crystal state is preferably a substance capable of maintaining the perovskite structure.
- the structure other than the perovskite structure is preferably a perovskite slab structure.
- a material having a perovskite slab structure is suitable as a raw material (for example, a film formation target) for forming a dielectric thin film, and in addition, a perovskite within the composition range represented by the above chemical formula
- the structure and the perovskite slab structure can coexist as mixed crystals in the thin film.
- a compound having a perovskite slab structure does not exhibit a high relative dielectric constant, if the peak intensity of the perovskite slab structure is within the above range, both a high relative dielectric constant and high insulation can be achieved.
- the pyrochlore structure is represented by the same composition formula as the perovskite slab structure.
- the substance having the perovskite structure must maintain the perovskite structure. Therefore, a substance having a pyrochlore structure and a substance having a perovskite structure tend not to coexist. Therefore, when the dielectric thin film contains a substance having a pyrochlore structure, high dielectric constant and high insulation cannot be obtained.
- a solid solution of metal oxynitride containing Ma and Mb can be obtained by using such a metal oxide as a raw material.
- a solid solution of metal oxynitride containing Ma and Mb can be obtained by using such a metal oxide as a raw material.
- Easy to maintain perovskite structure Specifically, Sr 2 Ta 2 O 7 , Sr 2 Nb 2 O 7 , Ca 2 Nb 2 O 7 , Na 2 W 2 O 7 , La 2 Ti 2 O 7 , Ce 2 Ti 2 O 7 , Pr 2 Ti 2 O 7 and Nd 2 Ti 2 O 7 have a perovskite slab structure.
- Ba 2 Ta 2 O 7 is not present, (SrBa) 2 Ta 2 O 7 has a perovskite slab structure.
- Pb 2 Ta 2 O 7 , Cd 2 Ta 2 O 7 , Y 2 Si 2 O 7 , Cr 2 Ti 2 O 7 , and Tb 2 Ge which are combinations of elements other than those exemplified as Ma and Mb above.
- 2 O 7 , Sc 2 Si 2 O 7 and the like have a pyrochlore structure. Therefore, even if an attempt is made to form a metal oxynitride solid solution using these metal oxides, a perovskite structure is not obtained.
- the peak showing the maximum intensity among the peak intensities of the diffracted X-rays belonging to the perovskite structure and the peak showing the maximum intensity among the peak intensities of the diffracted X-rays not belonging to the perovskite structure are both 2 ⁇ of 30 to It preferably exists within a range of 35 °.
- the dielectric thin film according to the third aspect of the present invention has a chemical formula Ma z MbO x N y (Ma is a metal ion located at the A site of the perovskite structure, Mb is a metal ion located at the B site of the perovskite structure, and O is A dielectric thin film having a perovskite structure represented by oxygen ions, N represents nitrogen ions).
- x, y, and z are 0.8 ⁇ z ⁇ 1.2, 2.450 ⁇ x ⁇ 3.493, 0.005, similarly to the dielectric thin film according to the first and second aspects.
- Preferred ranges of “x”, “y” and “z” are the same as those of the dielectric thin film according to the first and second aspects.
- the average valences of Ma and Mb are a and b
- the average valence a and the average valence b can be obtained in the same manner as the dielectric thin film according to the first and second aspects.
- the dielectric thin film according to the third aspect is characterized by being composed of a solid solution of a metal oxide composed of Ma and Mb and a metal oxynitride composed of Ma and Mb.
- a solid solution of a metal oxide composed of Ma and Mb and a metal oxynitride composed of Ma and Mb is composed of a metal oxide composed of Ma and Mb and a metal oxynitride composed of Ma and Mb.
- prescribed ratio is shown.
- a solid solution of a metal oxide composed of Ma and Mb and a metal oxynitride composed of Ma and Mb is composed of a metal oxide composed of Ma and Mb and a metal oxynitride composed of Ma and Mb.
- An intermediate composition is shown.
- a metal oxide composed of Ma and Mb is represented by Ma 2 Mb 2 O 7 and a metal oxynitride composed of Ma and Mb is represented by MaMbO 2 N
- a metal oxide composed of Ma and Mb The composition of the solid solution of the product and the metal oxynitride composed of Ma and Mb ”is expressed by Ma z MbO x N y , and“ x ”indicating the content of“ O ”is 2.450 to 3.493. Within range. Further, “y” indicating the content of “N” is in the range of 0.005 to 0.700.
- a “solid solution of a metal oxide composed of Ma and Mb and a metal oxynitride composed of Ma and Mb” having a predetermined composition a pyrochlore structure or a perovskite type layer structure having a low relative dielectric constant as described above. It is possible to suppress the formation of a metal oxide phase having a structure and the dielectric composition to be a mixture of a metal oxynitride and a metal oxide, thereby achieving both a high dielectric constant and a high insulating property. It becomes possible.
- the metal oxynitride existing at 2 ⁇ 30 ° to 35 ° when XRD analysis is performed with CuK ⁇ 1 radiation (wavelength of 1.54056 ⁇ )
- the intensity of the peak derived from the metal oxide existing within 2 ⁇ 30 ° to 35 ° as shown in FIG. It is preferably 0 or more and 10 or less.
- the peak derived from a metal oxide means a peak resulting from the structure of the raw material used when forming the thin film.
- the dielectric thin film according to the present embodiment is a dielectric deposited film formed by depositing elements constituting the dielectric thin film using a thin film forming method or the like.
- a dielectric deposited film unlike a sintered body obtained by firing powder, it is affected by stress when formed on a substrate, or oxygen defects are present. By making it less likely to occur, even in a region where the content of nitrogen is less than the composition of the metal oxynitride having a perovskite structure, both high insulating properties and high relative dielectric constant can be achieved.
- the thickness of the dielectric thin film is preferably 10 nm to 2 ⁇ m. If the thickness is less than 10 nm, dielectric breakdown is likely to occur, and if it exceeds 2 ⁇ m, the industrial superiority over a cheaper metal oxide dielectric thin film such as BaTiO 3 is weakened.
- Capacitance elements mentioned here are elements using dielectric properties, such as capacitors, thermistors, filters, diplexers, resonators, oscillators, antennas, piezoelectric elements, transistors (using a dielectric insulating film for the gate), Includes ferroelectric memory.
- the dielectric thin film of the present invention may contain other elements within a range not impairing the effects of the present invention. Moreover, you may contain the other element inevitably introduced in a manufacturing process and a storage condition.
- Thin-film capacitors do not have a clear definition of their structure, but generally have fewer or one dielectric layer compared to multilayer capacitors, and require smaller and lower profile Used for. Since the number of layers is limited, a thin film capacitor is often required to have a higher relative dielectric constant, and it can be said that the present invention is a particularly suitable device.
- FIG. 5 shows a schematic diagram of a thin film capacitor which is an example of a capacitive element according to the present embodiment.
- the thin film capacitor shown in FIG. 5 includes a lower electrode 12 and a dielectric film 13 formed in this order on a support substrate 11, and an upper electrode 14 that functions as the other electrode of the thin film capacitor on the surface of the dielectric film 13.
- the material for forming the upper electrode 14 is not particularly limited as long as it has conductivity, and the upper electrode 14 can be formed of the same material as that of the lower electrode 12.
- each layer may be adjusted according to the application, and each layer need not be limited to one layer.
- the film thickness of the upper electrode 14 may function as an electrode, and is preferably 0.01 ⁇ m or more. A film thickness of 0.01 ⁇ m or less is not preferable as the upper electrode 14 because the conductivity deteriorates.
- the film forming method that can be used for forming the metal oxynitride to which the composition of the present invention is applied is not particularly limited as long as a film satisfying the above chemical formula can be obtained, and vacuum deposition, sputtering, PLD (pulse Various thin film forming methods such as laser vapor deposition method, MO-CVD (metal organic chemical vapor deposition method), MOD (metal organic decomposition method), sol-gel method, CSD (chemical solution deposition method) and the like are exemplified.
- known vapor phase growth methods such as sputtering, chemical vapor deposition, and PLD are preferable.
- the raw materials (evaporation material, various target materials, organometallic materials, etc.) used when forming the dielectric thin film may contain minute impurities and subcomponents, but greatly reduce the insulation. If it is not an impurity, there is no particular problem.
- the PLD method which is an example of a film forming method that can be used for forming the dielectric film 13 is a method in which a target containing a constituent element of a target film is placed in a film forming chamber, and a pulse laser is irradiated on the target surface.
- the plume is generated by instantly evaporating the surface of the target with the strong energy, and the evaporated material is deposited on the substrate arranged to face the target to form a thin film.
- a target in addition to a metal oxide sintered body containing a film constituent element, an alloy, a nitride sintered body, a metal oxynitride sintered body, etc. can be used as long as it contains a film constituent element. . Further, in the target, it is preferable that each element is distributed on the average of the scale of the pulse laser diameter to be used, but it is not necessary to be particularly uniform as long as the quality of the obtained metal oxynitride film is not affected. .
- the number of targets is not necessarily one, and a plurality of targets including a part of the film constituent elements can be prepared and used for film formation. The target shape may be appropriately selected in accordance with the film forming apparatus to be used.
- a metal oxide sintered body containing a film constituent element produced using a general solid phase method can be used as a target.
- a method of introducing nitrogen radicals into the deposition chamber during the formation of the metal oxide film a method using reactive sputtering using nitrogen gas, etc., a plasma treatment using nitrogen activated by plasma nitriding Etc. can be used.
- nitrogen can be introduced into the crystal structure of the metal oxide thin film without using a toxic gas.
- the metal oxynitride can be directly formed on the substrate without going through the metal oxide thin film.
- a partial oxidation treatment of a nitride film can also be used.
- a method of forming a dielectric thin film having a composition of SrTaO 3.2 N 0.2 as a more examples detailed below embodiments.
- a sintered body target of Sr 2 Ta 2 O 7 can be used.
- a dielectric film may be formed on the Pt lower electrode by the PLD method so as to have a thickness of 200 nm, for example.
- a metal mask is used to form a region where a dielectric film is not partially formed on the lower electrode.
- the film in order to crystallize the film, it is preferable to form the film at 600 ° C. to 800 ° C. by heating the substrate with an infrared laser at the time of film formation. At this time, if the substrate temperature is too low, crystallization does not occur, and if the temperature is too high, it is necessary to be careful because a crack or the like due to a difference in thermal expansion between the substrate and the film occurs during cooling.
- the optimum conditions may be selected accordingly, and the temperature range is not limited to the above range.
- the Curie temperature of metal oxynitrides is high, and generally the film formation temperature is equal to or lower than the Curie temperature. Therefore, no structural phase transition occurs when the temperature is lowered from the film formation temperature to room temperature after film formation. Therefore, compared with a barium titanate thin film having a Curie temperature of around 100 ° C., a metal oxynitride thin film is less susceptible to cracking.
- various gas types and gas pressures can be used during film formation.
- the state of the film thus obtained also depends on the size of the film forming chamber and the position of the gas introduction pipe. That is, even if the same partial pressure is used, the same film is not necessarily obtained. Therefore, attention should be paid to the ratio of Sr ions, that is, Ma and Ta ions, that is, Mb. Since this ratio varies depending on the gas pressure, the gas pressure may be adjusted according to the apparatus so as to obtain a desired composition ratio. In particular, since metal oxynitride contains O and N in its composition, attention should be paid to the ratio of oxygen partial pressure and nitrogen partial pressure. Also here, the partial pressure ratio and the total pressure may be adjusted according to the apparatus so that a desired composition can be obtained.
- nitrogen radicals are introduced into the metal oxide film.
- nitriding treatment may be performed.
- the amount of nitrogen in the deposited sample can be confirmed by X-ray photoelectron spectroscopy.
- an internal standard of an X-ray photoelectron spectrometer can be used, but it is preferable to calculate a sensitivity factor from a nitride single crystal wafer such as AlN and correct the quantification value. Since the progress of oxidation or nitridation varies depending on the constituent elements, the amount of nitrogen radicals introduced may be adjusted as appropriate depending on the selected element group.
- the SrTaO 3.2 N 0.2 oxynitride film formed as described above is used as a dielectric film layer, and Pt is formed as an upper electrode on the upper surface by a sputtering method.
- a thin film capacitor can be obtained.
- the capacitance of the thin film capacitor is measured using an impedance analyzer by connecting a lead wire to the upper electrode and the lower electrode via a probe. After the measurement of the capacitance, the cross section of the metal oxynitride film is observed using a scanning electron microscope, and the thickness d of the metal oxynitride film is measured from the observed image.
- ⁇ 0 is the dielectric constant of vacuum.
- a higher relative dielectric constant is preferable.
- the present invention is not limited to the embodiment and the examples described later.
- the constituent elements in the embodiments and examples include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the embodiments and examples may be appropriately combined or may be appropriately selected and used.
- the capacitive element of the present invention refers to an element that positively utilizes its dielectric characteristics, or an element whose dielectric characteristics are indispensable in terms of configuration for function expression, and other electronic devices that have a capacitive component accidentally Is not included.
- Example 1 to Example 7, Comparative Example 1 to Comparative Example 5 In Examples 1 to 7 and Comparative Example 4, thinning was performed. SrCO 3 , Ta 2 O 5 , La 2 O 3 , TiO 2 , Na 2 CO 3 , and WO 3 were used as raw materials for the sintered body used as the film formation target. Each was weighed to be Sr 2 Ta 2 O 7 , La 2 Ti 2 O 7 , Na 2 W 2 O 7 and mixed for 16 hours in a wet ball mill using ethanol as a solvent. The obtained mixed slurry was dried with a constant temperature dryer at 80 ° C. for 12 hours. The obtained mixture was lightly crushed in a mortar, placed in a ceramic crucible and heat-treated in an electric furnace at 1000 ° C. in an air atmosphere for 2 hours to obtain a calcined product.
- the obtained calcined product was pulverized again with a wet ball mill using ethanol as a solvent for 16 hours, and the pulverized slurry was dried at 80 ° C. for 12 hours with a constant temperature dryer to obtain a pulverized product.
- a polyvinyl alcohol solution as a binder was added in an amount of 0.6% by weight in terms of solid matter in the solution and mixed to obtain a granulated product.
- the granulated product was molded into a cylindrical shape having a diameter of about 23 mm and a height of about 9 mm to obtain a molded product.
- the molded product was fired in an electric furnace at 1400 ° C.
- the film-forming target obtained as described above was placed in a film-forming apparatus, and a Si substrate having a Pt film as a lower electrode on the surface was placed so as to face the target.
- films were formed to a thickness of 200 nm by the PLD method in which nitrogen radicals were introduced.
- the desired structure shown in Table 1 was obtained by controlling the gas pressures of oxygen and nitrogen. From the X-ray diffraction pattern of the obtained sample, it was confirmed that the thin film was crystallized.
- N (nitrogen) was doped.
- Comparative Examples 1 to 3 and Comparative Example 5 first, metal oxides Sr 2 Ta 2 O 7 , La 2 Ti 2 O 7 , and Na 2 W 2 O 7 were synthesized in the same manner as the procedure for synthesizing the target. Thereafter, nitriding was performed by a carbothermal reduction method as described in Non-Patent Document 2. Although nitriding is possible even in a normal ammonia atmosphere, according to the carbothermal reduction method, the amount of N to be introduced can be controlled by the amount of the corresponding C added.
- Metal oxide powder kneaded with carbon was pelletized and heat-treated. Heat treatment was performed in a batch furnace capable of reducing the pressure, and after the pressure in the furnace was sufficiently reduced, the furnace was filled with an N 2 atmosphere at atmospheric pressure at 1400 ° C. to obtain a sintered body. No C remained after nitriding. A Pt electrode was formed on the obtained sample by sputtering, and electrical characteristics were evaluated. In Comparative Example 5, the metal oxide powder was pelletized without kneading carbon, and the heat treatment was performed.
- N and O amounts of the samples of Examples 1 to 7 and Comparative Examples 1 to 5 were quantified by an impulse heating melt extraction method (infrared absorption method) using TC600 manufactured by LECO. Moreover, although the valence of the metal ion was determined from the chemical shift of XPS, there was no change in the valence compared with the raw material.
- Table 1 shows the crystal structure, insulating properties, and relative dielectric constant ( ⁇ ) of Examples 1 to 7 and Comparative Examples 1 to 5.
- the relative dielectric constant ( ⁇ ) is a value evaluated at a voltage of 1 Vrms / ⁇ m and a frequency of 1 kHz.
- the upper electrode for evaluating the relative dielectric constant was formed by vapor-depositing Ag with a diameter of 100 ⁇ m.
- the relative dielectric constant ( ⁇ ) is shown in Table 1 only when the tan ⁇ is lower than 100%, and the dielectric constant cannot be evaluated if the tan ⁇ is 100% or more. It was assumed that ⁇ ) was x (not observed).
- the XRD pattern was measured with CuK ⁇ 1 radiation (wavelength of 1.54056 mm).
- the insulation was evaluated by measuring the resistance value.
- the resistance value was measured using ADVANTEST R8340A and applying a voltage of 1 V / ⁇ m.
- Table 1 when the resistance value is 10 10 ⁇ cm or more, the insulation property is ⁇ (good), and when the resistance value is smaller than that, ⁇ (bad).
- “*” Means the intensity ratio of the main peak of the metal oxide when the intensity of the main peak of the metal oxynitride is set to 100 only when the metal oxide has a perovskite slab structure.
- the metal oxide strength ratio of 0 or more and 10 or less was marked as “O” (satisfied).
- the metal oxide strength ratio was greater than 10
- the perovskite structure derived from the metal oxynitride appeared on the pattern, but it was determined that it was not a solid solution with the oxide. satisfied).
- Comparative Example 1 is a sintered body of metal oxynitride SrTaO 2.000 N 1.000 , which was also shown by composition analysis and XRD analysis. Although Comparative Example 1 having a clear X-ray peak shown in FIG. 1 had a perovskite structure, it was confirmed that insulation could not be ensured because of the large amount of N. Further, Comparative Example 2 is a sintered body, and even when the intensity ratio of the main peak of the metal oxide is 12 when the intensity of the main peak of the metal oxynitride is 100, insulation can be ensured. It was confirmed that it was not possible.
- Comparative Example 5 is a sintered body of the metal oxide Sr 2 Ta 2 O 7 having a perovskite slab structure, and it was shown from the composition analysis and XRD analysis. The clear XRD pattern obtained is shown in FIG. In Comparative Example 5, sufficient insulation was obtained, but ⁇ was a low value of 50.
- Comparative Example 3 is a sintered body having an intermediate composition between the metal oxynitride SrTaO 2.000 N 1.000 and the metal oxide Sr 2 Ta 2 O 7 . Comparative Example 3 was not a solid solution, and therefore sufficient insulation was not obtained.
- the XRD pattern is shown in FIG. FIG. 3 shows that there is a perovskite structure peak derived from metal oxynitride and a perovskite slab structure peak derived from metal oxide, which is a mixed crystal state of these phases.
- black circles ⁇ are peaks derived from metal oxynitrides, and white circles ⁇ are peaks derived from metal oxides. The intensity ratio was calculated using these two peaks.
- Comparative Example 4 was a thin film doped with N after forming Sr 2 Ta 2 O 7 having a perovskite slab structure.
- a solid solution of metal oxynitride having a perovskite structure was hardly formed, and the existence ratio of the perovskite slab structure remained high.
- the electrical characteristics were evaluated in the same shape as in the example, but insulation was not obtained.
- Example 1 a metal oxynitride solid solution having a perovskite structure was sufficiently formed, and sufficient insulation was obtained.
- the relative dielectric constant ⁇ was also a high value of 2100.
- Example 2 showed a high relative dielectric constant ⁇ of 2200.
- the XRD pattern of Example 2 is shown in FIG. It was confirmed that a perovskite structure was obtained with the same composition ratio as that of Comparative Example 3 shown in FIG.
- Example 5 if the thin film is a mixed crystal state of a phase having a perovskite structure with a strength ratio controlled to 10 and a phase having a perovskite slab structure, high insulation and a high dielectric constant ⁇ are secured. I was able to confirm that it was possible. Thereby, when the intensity ratio of the main peak of the metal oxynitride is 100 or less when the intensity of the main peak of the metal oxynitride is set to 100, it is possible to achieve both high dielectric constant and high insulation. I found out that
- Example 8 to 15 Comparative Examples 6 to 7
- a metal oxide target was prepared and then thinned (nitrided when thinned) to synthesize.
- Each target was adjusted so that the composition of the thin film was as shown in Table 2.
- the mixing ratio is 80% and 20% in order from the left.
- the ratio of SrCO 3 and BaCO 3 as raw materials is adjusted so that Sr is 80% and Ba is 20% at the A site, and the target (Sr 0.8 Ba 0.2 ) to prepare a 2 Ta 2 O 7.
- ⁇ is a value evaluated at a voltage of 1 Vrms / ⁇ m and a frequency of 1 kHz. In all of Examples 8 to 15, ⁇ showed a high value of 1000 or more.
- Comparative Example 6 and Comparative Example 7 were synthesized using a composition outside the present invention to produce a film-forming target.
- Each of the obtained metal oxide targets had a pyrochlore structure.
- An attempt was made to form a metal oxynitride solid solution having a perovskite structure, but the obtained thin film did not have a perovskite structure, and insulation was not obtained.
- “*” Means the intensity ratio of the main peak of the metal oxide when the intensity of the main peak of the metal oxynitride is set to 100 only when the metal oxide has a perovskite slab structure.
- Example 16 to 19 and Comparative Examples 8 to 9 In Examples 16 to 19 and Comparative Examples 8 to 9, the same method as in Example 1 was used, and a metal oxide target was prepared and then thinned (nitrided when thinned) and synthesized. Each target was adjusted so that the composition of the thin film was as shown in Table 3. The obtained sample was evaluated for electrical characteristics. The results are summarized in Table 3. ⁇ is a value evaluated at a voltage of 1 Vrms / ⁇ m and a frequency of 1 kHz.
- “*” Means the intensity ratio of the main peak of the metal oxide when the intensity of the main peak of the metal oxynitride is set to 100 only when the metal oxide has a perovskite slab structure.
- Comparative Example 9 Although insulation was obtained, the dielectric constant was a relatively low value. When the microstructure of Comparative Example 9 was observed, segregation of SrO was observed.
- Example 20 to 21 and Comparative Examples 10 to 11 In Examples 20 to 21 and Comparative Examples 10 to 11, the same method as in Example 1 was used, and a metal oxide target was prepared and then thinned (nitrided when thinned) and synthesized. Each target was adjusted so that the composition of the thin film was as shown in Table 4. The obtained sample was evaluated for electrical characteristics. The results are summarized in Table 4.
- “*” Means the intensity ratio of the main peak of the metal oxide when the intensity of the main peak of the metal oxynitride is set to 100 only when the metal oxide has a perovskite slab structure.
- the dielectric thin film since the dielectric thin film has a crystal structure similar to the crystal structure in which N is the stoichiometric ratio, even in a region where N is less than the stoichiometric ratio, the dielectric thin film exhibits high resistance and high dielectric constant.
- a dielectric element can be provided.
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Abstract
Description
[1]ペロブスカイト構造を有する誘電体を含む誘電体組成物からなる誘電体薄膜であって、
前記誘電体組成物は、化学式MazMbOxNy(MaはSr、Ba、Ca、La、Ce、Pr、Nd、Naから選ばれる1種以上の元素、MbはTa、Nb、Ti、Wから選ばれる1種以上の元素、Oは酸素、Nは窒素を示す)で表される組成を有し、
前記Maが前記ペロブスカイト構造におけるAサイトを占めた場合に示すイオン価数をa、前記Mbが前記ペロブスカイト構造におけるBサイトを占めた場合に示すイオン価数をbとした場合、前記aおよびbが6.7≦a+b≦7.3である関係を満足し、
前記化学式のx、y、zが
0.8≦z≦1.2
2.450≦x≦3.493
0.005≦y≦0.700
であり、
MaとMbを含む金属酸窒化物固溶体であることを特徴とする誘電体薄膜である。
前記誘電体組成物は、化学式MazMbOxNy(MaはSr、Ba、Ca、La、Ce、Pr、Nd、Naから選ばれる1種以上の元素、MbはTa、Nb、Ti、Wから選ばれる1種以上の元素、Oは酸素、Nは窒素を示す)で表される組成を有し、
前記Maが前記ペロブスカイト構造におけるAサイトを占めた場合に示すイオン価数をa、前記Mbが前記ペロブスカイト構造におけるBサイトを占めた場合に示すイオン価数をbとした場合、前記aおよびbが6.7≦a+b≦7.3である関係を満足し、
前記化学式のx、y、zが
0.8≦z≦1.2
2.450≦x≦3.493
0.005≦y≦0.700
であり、
前記誘電体薄膜のX線回折パターンにおいて、前記ペロブスカイト構造に帰属する回折X線のピーク強度のうち最大強度を示すピーク強度を100とした時に、前記ペロブスカイト構造に帰属しない回折X線のピーク強度のうち最大強度を示すピーク強度が0以上10以下であることを特徴とする誘電体薄膜である。
前記MaとMbのそれぞれの平均価数をa、bとした場合、前記aとbとの関係が
a+b=7.0を満足し、
前記化学式のx、y、zが
0.8≦z≦1.2
2.450≦x≦3.493
0.005≦y≦0.700であり、
MaとMbからなる金属酸化物とMaとMbからなる金属酸窒化物との固溶体で構成されていることを特徴とする。
(式1)
(上記の場合の平均価数a)
=2(Srイオンの価数)×4/5(Srイオンの存在比)+3(Laイオンの価数)×1/5(Laイオンの存在比)
=8/5+3/5
=11/5
=2.2 … (1)
(式2)
(上記の場合の平均価数b)
=5(Taイオンの価数)×4/5(Taイオンの存在比)+4(Tiイオンの価数)×1/5(Tiイオンの存在比)
=20/5+4/5
=24/5=4.8 … (2)
次に、本実施形態に係る容量素子について説明する。ここで言う容量素子とは、誘電性を利用した素子のことであり、コンデンサ、サーミスタ、フィルター、ダイプレクサ、共振器、発信子、アンテナ、圧電素子、トランジスタ(ゲートに誘電体絶縁膜を使用)、強誘電体メモリ等を含む。
(式3)
C=ε0ε(S/d) … (3)
実施例1~実施例7および比較例4は薄膜化を行った。成膜用ターゲットとして用いる焼結体の原料として、SrCO3、Ta2O5、La2O3、TiO2、Na2CO3、WO3を用いた。各々をSr2Ta2O7、La2Ti2O7、Na2W2O7となるよう秤量し、エタノールを溶媒として用いた湿式ボールミルにて16時間混合を行った。得られた混合スラリーを恒温乾燥機にて80℃で12時間乾燥した。得られた混合物を乳鉢にて軽く解砕し、セラミック製のるつぼにいれ電気炉で1000℃、大気雰囲気中で2時間熱処理し、仮焼物を得た。
実施例8~15も実施例1と同様な方法を用いて、金属酸化物のターゲットを作製した後に薄膜化(薄膜時に窒化)して合成を行った。なお、それぞれのターゲットは、薄膜の組成が表2のものになるように調整した。なお、表2中のMaおよびMb欄に2種類の元素が記入してあるものは、左から順に80%、20%の混合比となっている。例えば、実施例8の場合はAサイトにSrが80%、Baが20%となるように原料であるSrCO3とBaCO3との比を調整して、ターゲット(Sr0.8Ba0.2)2Ta2O7を作製した。この時、SrイオンもBaイオンも2価であるためa=2である。また、実施例15の場合も実施例8と同様に作製した。実施例15の場合はAサイトにLaが80%、Naが20%、BサイトにTiが80%、Wが20%となるように原料であるSrCO3、Na2CO3、TiO2、WO3の比を調整して、ターゲット(La0.8Na0.2)2(Ti0.8W0.2)2O7を作製した。この時、Laイオンは3価、Naイオンは1価、Tiイオンは4価、Wイオンは6価であるため、aおよびbは以下のようになる。
a=3×0.8+1×0.2=2.4+0.2=2.6
b=4×0.8+6×0.2=3.2+1.2=4.4
実施例16~実施例19、比較例8~比較例9も実施例1と同様な方法を用いて、金属酸化物のターゲットを作製した後に薄膜化(薄膜時に窒化)して合成を行った。それぞれのターゲットは、薄膜の組成が表3のものになるように調整した。得られたサンプルについて電気特性評価を行った。結果は表3にまとめた。εは電圧1Vrms/μm、周波数1kHzにおいて評価した値を記載した。
実施例20~実施例21、比較例10~比較例11も実施例1と同様な方法を用いて、金属酸化物のターゲットを作製した後に薄膜化(薄膜時に窒化)して合成を行った。それぞれのターゲットは、薄膜の組成が表4のものになるように調整した。得られたサンプルについて電気特性評価を行った。結果は表4にまとめた。
12… 下部電極
13… 誘電体膜
14… 上部電極
Claims (10)
- ペロブスカイト構造を有する誘電体組成物からなる誘電体薄膜であって、
前記誘電体組成物は、化学式MazMbOxNy(MaはSr、Ba、Ca、La、Ce、Pr、Nd、Naから選ばれる1種以上の元素、MbはTa、Nb、Ti、Wから選ばれる1種以上の元素、Oは酸素、Nは窒素を示す)で表される組成を有し、
前記Maが前記ペロブスカイト構造におけるAサイトを占めた場合に示すイオン価数をa、前記Mbが前記ペロブスカイト構造におけるBサイトを占めた場合に示すイオン価数をbとした場合、前記aおよびbが6.7≦a+b≦7.3である関係を満足し、
前記化学式のx、y、zが
0.8≦z≦1.2
2.450≦x≦3.493
0.005≦y≦0.700
であり、
MaとMbを含む金属酸窒化物固溶体であることを特徴とする誘電体薄膜。 - ペロブスカイト構造を有する誘電体を含む誘電体組成物からなる誘電体薄膜であって、
前記誘電体組成物は、化学式MazMbOxNy(MaはSr、Ba、Ca、La、Ce、Pr、Nd、Naから選ばれる1種以上の元素、MbはTa、Nb、Ti、Wから選ばれる1種以上の元素、Oは酸素、Nは窒素を示す)で表される組成を有し、
前記Maが前記ペロブスカイト構造におけるAサイトを占めた場合に示すイオン価数をa、前記Mbが前記ペロブスカイト構造におけるBサイトを占めた場合に示すイオン価数をbとした場合、前記aおよびbが6.7≦a+b≦7.3である関係を満足し、
前記化学式のx、y、zが
0.8≦z≦1.2
2.450≦x≦3.493
0.005≦y≦0.700
であり、
前記誘電体薄膜のX線回折パターンにおいて、前記ペロブスカイト構造に帰属する回折X線のピーク強度のうち最大強度を示すピーク強度を100とした時に、前記ペロブスカイト構造に帰属しない回折X線のピーク強度のうち最大強度を示すピーク強度が0以上10以下であることを特徴とする誘電体薄膜。 - 前記ペロブスカイト構造に帰属する回折X線のピークのうち最大強度を示すピークおよび前記ペロブスカイト構造に帰属しない回折X線のピークのうち最大強度を示すピークが2θ=30~35°の範囲内に存在することを特徴とする請求項2に記載の誘電体薄膜。
- 前記ペロブスカイト構造に帰属しない回折X線は、ペロブスカイトスラブ構造に帰属する回折X線であることを特徴とする請求項2または3に記載の誘電体薄膜。
- 化学式MazMbOxNy(Maはペロブスカイト構造のAサイトに位置する金属イオン、Mbはペロブスカイト構造のBサイトに位置する金属イオン、Oは酸素イオン、Nは窒素イオンを示す)で表されるペロブスカイト構造を有する誘電体薄膜において、
前記MaとMbのそれぞれの平均価数をa、bとした場合、前記aとbとの関係が
a+b=7.0を満足し、
前記化学式のx、y、zが
0.8≦z≦1.2
2.450≦x≦3.493
0.005≦y≦0.700であり、
MaとMbからなる金属酸化物とMaとMbからなる金属酸窒化物との固溶体で構成されていることを特徴とする誘電体薄膜。 - 前記ペロブスカイト構造において、CuKα1放射線(1.54056Åの波長)によりXRD分析した際の2θ=30°~35°に存在するMaとMbからなる金属酸窒化物由来の最大強度を有するピークの強度を100とした時、2θ=30°~35°内に存在するMaとMbからなる金属酸化物由来のピークの強度が0以上10以下であることを特徴とする請求項5に記載の誘電体薄膜。
- 前記MaがSr、Ba、Ca、La、Ce、Pr、Nd、Naから選ばれる1種以上の元素であり、MbがTa、Nb、Ti、Wから選ばれる1種以上の元素であることを特徴とする請求項5または6に記載の誘電体薄膜。
- 請求項1から7のいずれかに記載の誘電体薄膜を有する容量素子。
- 請求項1から7のいずれかに記載の誘電体薄膜を有する電子部品。
- 請求項8に記載の容量素子を有する電子部品。
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013128073A (ja) * | 2011-12-19 | 2013-06-27 | Canon Inc | 圧電材料、圧電素子、液体吐出ヘッド、超音波モータおよび塵埃除去装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2573060B1 (fr) | 1984-11-13 | 1987-02-20 | Centre Nat Rech Scient | Composes azotes ou oxyazotes a structure perovskite, leur preparation et leur application a la fabrication de composants dielectriques |
KR20010030023A (ko) * | 1999-08-20 | 2001-04-16 | 마츠시타 덴끼 산교 가부시키가이샤 | 유전체막 및 그 제조방법 |
JP5807861B2 (ja) | 2011-06-21 | 2015-11-10 | 昭和電工株式会社 | 誘電体組成物及びその製造方法 |
CN102872727A (zh) * | 2012-09-28 | 2013-01-16 | 中国科学院大连化学物理研究所 | 一种钙钛矿型含钡铁系列中低温稳定的混合导体透氧膜 |
WO2017135294A1 (ja) * | 2016-02-01 | 2017-08-10 | Tdk株式会社 | 多結晶誘電体薄膜および容量素子 |
CN108603276B (zh) * | 2016-02-01 | 2020-07-03 | Tdk株式会社 | 多晶介电体薄膜及电容元件 |
-
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Non-Patent Citations (3)
Title |
---|
I.MAROZAU ET AL.: "Pulsed laser deposition and characterisation of perovskite-type LaTiO3-xNx thin films", ACTA MATERIALIA, vol. 59, 2011, pages 7145 - 7154, XP028310061 * |
MIRABBOS HOJAMBERDIEV ET AL.: "Fabrication of La2Ti207 Crystals Using an Alkali-Metal Molybdate Flux Growth Method and Their Nitridability To Form LaTiO2N Crystals under a High-Temperature NH3 Atmosphere", INORGANIC CHEMISTRY, vol. 54, 19 March 2015 (2015-03-19), pages 3237 - 3244, XP055386496 * |
See also references of EP3358039A4 * |
Cited By (3)
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JP2019091888A (ja) * | 2017-11-10 | 2019-06-13 | Tdk株式会社 | 金属酸窒化物薄膜および金属酸窒化物薄膜の製造方法、並びに、容量素子 |
US11078123B2 (en) | 2017-11-10 | 2021-08-03 | Tdk Corporation | Metal oxynitride thin film, process for producing metal oxynitride thin film, and capacitor element |
JP7192383B2 (ja) | 2017-11-10 | 2022-12-20 | Tdk株式会社 | 金属酸窒化物薄膜および金属酸窒化物薄膜の製造方法、並びに、容量素子 |
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