WO2017000330A1 - 柔性显示面板的制备方法及柔性显示面板 - Google Patents

柔性显示面板的制备方法及柔性显示面板 Download PDF

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Publication number
WO2017000330A1
WO2017000330A1 PCT/CN2015/084815 CN2015084815W WO2017000330A1 WO 2017000330 A1 WO2017000330 A1 WO 2017000330A1 CN 2015084815 W CN2015084815 W CN 2015084815W WO 2017000330 A1 WO2017000330 A1 WO 2017000330A1
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WIPO (PCT)
Prior art keywords
support plate
display panel
sealant
flexible display
flexible substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/084815
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English (en)
French (fr)
Inventor
余威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/773,427 priority Critical patent/US9935297B2/en
Publication of WO2017000330A1 publication Critical patent/WO2017000330A1/zh
Priority to US15/822,144 priority patent/US10158100B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of display technologies, and in particular, to a method for fabricating a flexible display panel and a flexible display panel.
  • OLED Organic Light-Emitting diodes
  • OLED Organic Light-Emitting Diode
  • the flexible substrate Since the flexible substrate has the characteristics of being easily deformed, in the existing process of the OLED flexible panel, the flexible substrate used for the flexible substrate is attached to the support plate, and then the manufacturing process is performed on the flexible substrate; After the fabrication process on the flexible substrate is completed, the flexible substrate is peeled off from the carrier to obtain a flexible OLED panel.
  • the flexible OLED panel is completely adhered to the support plate, the flexible substrate is easily bent during the above peeling process, thereby damaging the device fabricated on the flexible OLED panel, resulting in device failure.
  • the present application provides a method for preparing a flexible display panel and a flexible display panel, which can avoid damage to the device on the flexible display panel when the flexible display panel is peeled off from the support plate.
  • a first aspect of the present application provides a method for fabricating a flexible display panel, comprising: bonding a flexible substrate to a matrix of support columns on a support plate in a vacuum environment, and bonding the flexible substrate to the support by a sealant
  • the pallet is fixed, wherein the sealant is disposed around the matrix of the support column to surround the frame of the support column on the sealant and the support plate
  • Forming a flexible display panel on the flexible substrate forming the flexible display panel on the flexible substrate; cutting the support plate and the flexible display panel along an inner side of the sealant, such that the flexible display panel and the flexible display panel The support plate is detached.
  • the method further includes: supporting the plate Forming a film on the film; exposing, developing, baking, etching, or exposing, developing, and baking the film to obtain the matrix of the support pillar formed by the film; around the support plate Apply frame glue.
  • the film material is silicon nitride SiNx, black matrix BM, or spacer PS.
  • the method further includes:
  • the surface of the support plate is etched by exposure, development, and etching to obtain a matrix of support pillars formed by the support plates; and a sealant is applied to an area etched around the support plate.
  • the height of the frame glue coated by the support plate is higher than or equal to the height of the matrix of the support columns.
  • the sealant is an ultraviolet UV glue
  • the fixing the flexible substrate to the support plate by the sealant comprises: curing the sealant between the flexible substrate and the support plate by ultraviolet UV irradiation.
  • the forming a flexible display panel on the flexible substrate comprises: forming an OLED device on the surface of the flexible substrate, and packaging the OLED device to obtain a flexible display panel.
  • cutting the board and the flexible display panel are cut along the inner side of the sealant, so that the flexible display panel is detached from the support board, comprising: placing the support board along the The inner side of the sealant is cut to disengage the flexible display panel; the sealant around the flexible display panel is cut.
  • the support plate is a glass plate, and/or the flexible substrate is a plastic substrate.
  • a second aspect of the present invention provides a method for preparing a flexible display panel, comprising: growing a film on a support plate, exposing, developing, baking, etching, or exposing, developing, baking, or Obtaining the support column matrix formed by the film; or coating a surface of the support plate with a photoresist, and etching the surface of the support plate by exposure, development, and etching to obtain a substrate
  • the support plate forms a support column matrix; a frame seal is applied around the support plate, wherein the plastic frame is an ultraviolet UV glue; in a vacuum environment, the flexible substrate and the support column matrix on the support plate Laminating, and curing the sealant between the flexible substrate and the support plate by ultraviolet irradiation, wherein the sealant is disposed around the support column matrix to surround the support column matrix a seal space formed by the sealant and the support plate and the flexible substrate; forming a flexible display panel on the flexible substrate; and cutting the support plate and the flexible display panel along the inner side of the sealant To make the
  • the film material is silicon nitride SiNx, black matrix BM, or spacer PS.
  • the height of the frame glue coated by the support plate is higher than or equal to the height of the matrix of the support columns.
  • the forming a flexible display panel on the flexible substrate comprises: forming an OLED device on the surface of the flexible substrate, and packaging the OLED device to obtain a flexible display panel.
  • cutting the board and the flexible display panel are cut along the inner side of the sealant, so that the flexible display panel is detached from the support board, comprising: placing the support board along the The inner side of the sealant is cut to disengage the flexible display panel; the sealant around the flexible display panel is cut.
  • the support plate is a glass plate, and/or the flexible substrate is a plastic substrate.
  • a third aspect of the present application provides a flexible display panel which is fabricated by the above-described manufacturing method.
  • a support column matrix for supporting the flexible substrate is disposed on the support plate, and the flexible panel is attached to the support column matrix, and the flexible substrate is fixed on the support plate by the sealant, so that the flexible substrate and the flexible substrate A vacuum layer is formed between the support plates, and the suction force generated by the vacuum is large, so that the flexible substrate and the support plate can be tightly fixed, and the phenomenon that the surface of the flexible substrate protrudes during the preparation process can be avoided.
  • the flexible display panel and the support plate are cut along the inner side of the sealant, and the flexible display panel is automatically peeled off, so that the device on the flexible display panel is not damaged.
  • FIG. 1 is a flow chart of an embodiment of a method for preparing a flexible display panel of the present application
  • Figure 2 is a top plan view of the support plate in the step 110 shown in Figure 1;
  • Figure 3 is a side elevational view of the support plate and the flexible substrate obtained in step 110 of Figure 1;
  • FIG. 4 is a side elevational view of the receiving plate and the flexible display panel obtained in the 120 steps shown in FIG. 1.
  • FIG. 1 is a flow chart of an embodiment of a method for fabricating a flexible display panel of the present application
  • FIG. 2 is a top plan view of the support plate in step 110 shown in FIG. 1
  • FIG. 3 is a schematic view of the support plate in FIG. A side view of the support plate and the flexible substrate obtained in step 110
  • FIG. 4 is a side view of the support plate and the flexible display panel obtained in step 120 of FIG.
  • the flexible display panel is obtained by disposing a display device on the flexible substrate, wherein the display device can be an OLED device to form a flexible OLED display panel.
  • the display device can also be other types such as LED devices. Etc., there is no limit here.
  • the preparation method of the flexible display panel includes:
  • the flexible substrate in a vacuum environment, the flexible substrate is mated to the support column matrix on the support plate, and the flexible substrate is fixed to the support plate by a sealant, wherein the sealant is disposed on the support
  • the periphery of the column matrix surrounds the support column matrix in a sealed space formed by the sealant and the support plate and the flexible substrate.
  • the flexible substrate is easily bent, when the display device is disposed on the flexible substrate, the flexible substrate is first fixed on a support plate to facilitate the device fabrication process on the flexible substrate.
  • the support plate 210 of the present embodiment is provided with a support column matrix on one surface for providing a supporting force for the flexible substrate 221.
  • the support column matrix is formed by a plurality of spaced apart support columns 211.
  • the cross section of the support columns may be square, circular or other shapes, which is not limited herein.
  • the support post is not provided at the peripheral edge portion 212 of the support plate for setting the sealant 213.
  • the width of the edge portion may be set to 10-50 mm, preferably 20 mm.
  • the support column matrix of the support plate of the above configuration is bonded to the flexible substrate in a vacuum environment, and the flexible substrate and the support plate are bonded and fixed by a sealant.
  • the sealant is disposed around the matrix of the support column, that is, the peripheral edge portion of the support plate, to surround the frame of the support column and the support plate The sealed vacuum space formed by the flexible substrate. Therefore, the flexible substrate is tightly held by the surrounding frame seal and the vacuum between the support plate and the support plate.
  • the sealant may be an ultraviolet (English: ultraviolet, abbreviated as: uv) glue.
  • the fixing the flexible substrate and the support plate by the sealant specifically comprises: curing the sealant between the flexible substrate and the support plate by ultraviolet irradiation.
  • the flexible substrate may be a plastic substrate composed of a plastic material such as polyethylene naphthalate (PEN) or polyterephthalic acid (PET).
  • PEN polyethylene naphthalate
  • PET polyterephthalic acid
  • the support plate may be a substrate made of any hard material, such as a glass plate.
  • the flexible substrate 421 is fixed on the support plate 410, the flexible substrate is prevented from being bent and deformed due to the support of the support column matrix.
  • a fabrication process of the display device 422 such as an OLED device is performed on the flexible substrate 421, and the OLED device is packaged to form a flexible display panel 420.
  • the support plate and the flexible display panel that are still fixed together by the sealant are cut along the inner side of the sealant (as shown by the broken line a in FIG. 4). Since the sealant has been cut, the support plate is The flexible display panel is no longer fixed, and the vacuum between the support plate and the flexible display panel is broken, and the flexible substrate is automatically peeled off, and no peeling is required.
  • the support plate and the flexible display panel can be cut simultaneously along the inner side of the frame glue, or separately cut.
  • the support plate is first cut along the inner side of the sealant to disengage the flexible display panel; the sealant around the flexible display panel is cut.
  • the matrix of support columns on the support plate may be preformed or generated during the preparation of the flexible display panel described above.
  • the support column matrix may be generated by an additional film or by etching or yellowing the support plate.
  • the method for preparing the flexible display panel further includes:
  • a sealant is applied around the support plate.
  • the above film material is silicon nitride (English: SiNx), black matrix (English: Black Matrix, referred to as: BM), or spacer (English: photo spacer, referred to as: PS).
  • the method for preparing the flexible display panel further includes:
  • a sealant is applied to the etched area around the support plate.
  • the height of the sealant coated on the support plate is higher than or equal to the height of the support column matrix, so as to ensure the support post matrix and the flexible substrate after the support, the support plate
  • the flexible substrate and the frame glue can form a sealed space.
  • the sealant is not necessarily coated on the support plate, and the sealant may be applied around the flexible substrate, and then the flexible substrate coated with the sealant is bonded to the support column matrix of the support plate. And fixed by a frame glue.
  • the embodiment also provides an embodiment of a flexible display panel.
  • the flexible display panel includes a flexible substrate and a display device disposed on the flexible substrate, such as an OLED device. Wherein, the flexible display panel is made by the preparation method of the above embodiment.
  • a support column matrix for supporting the flexible substrate is disposed on the support plate, and the flexible panel is attached to the support column matrix, and the flexible substrate is fixed on the support plate by the sealant, so that the flexible substrate and the flexible substrate A vacuum layer is formed between the support plates, and the suction force generated by the vacuum is large, so that the flexible substrate and the support plate can be tightly fixed, and the phenomenon that the surface of the flexible substrate protrudes during the preparation process can be avoided.
  • the flexible display panel and the support plate are cut along the inner side of the sealant, and the flexible display panel is automatically peeled off, so that the device on the flexible display panel is not damaged.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种柔性显示面板（420）的制备方法及柔性显示面板（420），其中，所述方法包括：在真空环境下，将柔性基板（221，421）与承托板（210，410）上的支撑柱矩阵（211）贴合，且通过框胶（213）将所述柔性基板（221，421）与所述承托板（210，410）固定，其中，所述框胶（213）设置于所述支撑柱矩阵（211）的四周，以将所述支撑柱矩阵（211）包围在所述框胶（213）与所述承托板（210，410）、柔性基板（221，421）形成的密封空间中；在所述柔性基板（221，421）上形成柔性显示面板（420）；将所述承托板（210，410）和所述柔性显示面板（420）沿所述框胶（213）的内侧切割，使得所述柔性显示面板（420）与所述承托板（210，410）脱离。通过上述方式，能够避免在柔性基板（221，421）从承托板（210，410）剥离时，损坏柔性基板（221，421）上的器件。

Description

柔性显示面板的制备方法及柔性显示面板
【技术领域】
本申请涉及显示技术领域，特别是涉及柔性显示面板的制备方法及柔性显示面板。
【背景技术】
如今，有机发光二极管（英文：Organic Light-Emitting Diode，简称：OLED）显示器作为新一代的平板显示，已被应用于各种显示产品如手机和电视中。由于OLED显示器能够实现自发光，无需另设背光模组，故使得OLED显示器可采用柔性显示方式实现。
由于柔性基板具有易弯曲变形的特质，故在OLED柔性面板的现有制程中，需将其采用的柔性基板用胶材贴附在承托板上，然后在柔性基板上进行制作工艺；并在柔性基板上的制作工艺完成后，再将柔性基板从承托板上剥离，以得到柔性OLED面板。
然而，由于所述柔性OLED面板完全粘贴在承托板上，故在上述剥离过程中，容易弯折柔性基板，从而损坏制作在柔性OLED面板上的器件，导致器件失效。
【发明内容】
本申请提供柔性显示面板的制备方法及柔性显示面板，能够避免在柔性显示面板从承托板剥离时，损坏柔性显示面板上的器件。
本申请第一方面提供一种柔性显示面板的制备方法，包括：在真空环境下，将柔性基板与承托板上的支撑柱矩阵贴合，且通过框胶将所述柔性基板与所述承托板固定，其中，所述框胶设置于所述支撑柱矩阵的四周，以将所述支撑柱矩阵包围在所述框胶与所述承托板 、柔性基板形成的密封空间中；在所述柔性基板上形成柔性显示面板；将所述承托板和所述柔性显示面板沿所述框胶的内侧切割，使得所述柔性显示面板与所述承托板脱离。
其中，在所述在真空环境下，将柔性基板与承托板上的支撑柱矩阵贴合，且通过框胶将所述柔性基板与所述承托板固定之前，还包括：在承托板上生长一层薄膜；对所述薄膜进行曝光、显影、烘烤、刻蚀，或者曝光、显影、烘烤，得到由所述薄膜形成的所述支撑柱矩阵；在所述承托板的四周涂布框胶。
其中，所述薄膜材料为氮化硅SiNx、黑矩阵BM、或间隔物PS。
其中，在所述在真空环境下，将柔性基板与承托板上的支撑柱矩阵贴合，且通过框胶将所述柔性基板与所述承托板固定之前，还包括：
在所述承托板表面涂布光阻；
通过曝光、显影、刻蚀的方式对所述承托板表面进行刻蚀，得到由所述承托板形成支撑柱矩阵；在所述承托板四周被刻蚀的区域涂布框胶。
其中，所述承托板涂布的框胶的高度高于或等于所述支撑柱矩阵的高度。
其中，所述框胶为紫外线UV胶，所述通过框胶将所述柔性基板与所述承托板固定包括：通过紫外线UV照射固化所述柔性基板与所述承托板间的框胶。
其中，所述在所述柔性基板上形成柔性显示面板，包括：在所述柔性基板表面制作OLED器件，并对所述OLED器件进行封装，得到柔性显示面板。
其中，所述将所述承托板和所述柔性显示面板沿所述框胶的内侧切割，使得所述柔性显示面板与所述承托板脱离，包括:将所述承托板沿所述框胶的内侧切割，使得所述柔性显示面板脱离；将所述柔性显示面板四周的框胶进行裁切。
其中，所述承托板为玻璃板，和/或所述柔性基板为塑料基板。
本申请第二方面提供一种柔性显示面板的制备方法，包括：在承托板上生长一层薄膜，对所述薄膜进行曝光、显影、烘烤、刻蚀，或者曝光、显影、烘烤，得到由所述薄膜形成的所述支撑柱矩阵；或，在所述承托板表面涂布光阻，通过曝光、显影、刻蚀的方式对所述承托板表面进行刻蚀，得到由所述承托板形成支撑柱矩阵；在所述承托板的四周涂布框胶，其中，所述胶框为紫外线UV胶；在真空环境下，将柔性基板与承托板上的支撑柱矩阵贴合，且通过紫外线照射固化所述柔性基板与所述承托板间的所述框胶，其中，所述框胶设置于所述支撑柱矩阵的四周，以将所述支撑柱矩阵包围在所述框胶与所述承托板、柔性基板形成的密封空间中；在所述柔性基板上形成柔性显示面板；将所述承托板和所述柔性显示面板沿所述框胶的内侧切割，使得所述柔性显示面板与所述承托板脱离。
其中，所述薄膜材料为氮化硅SiNx、黑矩阵BM、或间隔物PS。
其中，所述承托板涂布的框胶的高度高于或等于所述支撑柱矩阵的高度。
其中，所述在所述柔性基板上形成柔性显示面板，包括：在所述柔性基板表面制作OLED器件，并对所述OLED器件进行封装，得到柔性显示面板。
其中，所述将所述承托板和所述柔性显示面板沿所述框胶的内侧切割，使得所述柔性显示面板与所述承托板脱离，包括:将所述承托板沿所述框胶的内侧切割，使得所述柔性显示面板脱离；将所述柔性显示面板四周的框胶进行裁切。
其中，所述承托板为玻璃板，和/或所述柔性基板为塑料基板。
本申请第三方面提供一种柔性显示面板，所述柔性显示面板由上述的制备方法制成。
上述方案中，在承托板上设置用于支撑柔性基板的支撑柱矩阵，并将柔性面板贴合在支撑柱矩阵上，且将柔性基板通过框胶固定在承托板上，使得柔性基板和承托板间形成真空层，由于真空产生的吸力大，使得柔性基板和承托板能够紧紧固定，且可避免在制备过程中出现柔性基板表面突起的现象。另外，在所述柔性基板上形成柔性显示面板后，沿框胶的内侧将柔性显示面板和承托板切割，柔性显示面板自动剥离，故不会损坏柔性显示面板上的器件。
【附图说明】
图1是本申请柔性显示面板的制备方法一实施方式的流程图；
图2是是图1所示的110步骤中的承托板的俯视示意图；
图3是图1所示的110步骤得到的承托板和柔性基板的侧视示意图；
图4是图1所示的120步骤得到的承托板和柔性显示面板的侧视示意图。
【具体实施方式】
以下描述中，为了说明而不是为了限定，提出了诸如特定系统结构、接口、技术之类的具体细节，以便透彻理解本申请。然而，本领域的技术人员应当清楚，在没有这些具体细节的其它实施方式中也可以实现本申请。在其它情况中，省略对众所周知的装置、电路以及方法的详细说明，以免不必要的细节妨碍本申请的描述。
请参阅图1-4，图1是本申请柔性显示面板的制备方法一实施方式的流程图，图2是图1所示的110步骤中的承托板的俯视示意图，图3是图1所示的110步骤得到的承托板和柔性基板的侧视示意图，图4是图1所示的120步骤得到的承托板和柔性显示面板的侧视示意图。本实施方式中，柔性显示面板是由在柔性基板上设置显示器件而得到，其中，该显示器件可为OLED器件，以形成柔性OLED显示面板，当然，该显示器件还可以为其他类型如LED器件等，在此不作限定。该柔性显示面板的制备方法包括：
110：在真空环境下，将柔性基板与承托板上的支撑柱矩阵贴合，且通过框胶将所述柔性基板与所述承托板固定，其中，所述框胶设置于所述支撑柱矩阵的四周，以将所述支撑柱矩阵包围在所述框胶与所述承托板、柔性基板形成的密封空间中。
由于柔性基板易弯折，故在该柔性基板上设置显示器件时，先将柔性基板固定在一承托板上，以便于在柔性基板上进行器件制作工艺。
如图2，3所示，本实施方式中的承托板210一表面设置有支撑柱矩阵，用于为柔性基板221提供支撑力。该支撑柱矩阵即为多个间隔设置的支撑柱211形成，其中，该支撑柱的横截面可以为方形、圆形或者其他形状，在此不再限定。而且，在承托板的四周边缘部分212不设置该支撑柱，以用于设置框胶213。该边缘部分的宽度可设置10-50毫米，优选为20毫米。
本实施方式中，在真空环境下，将上述结构的承托板的支撑柱矩阵和柔性基板贴合，并通过框胶将柔性基板和承托板进行粘贴固定。其中，框胶设置在支撑柱矩阵的四周，即上述承托板的四周边缘部分，以将支撑柱矩阵包围在所述框胶与所述承托板 、柔性基板形成的密封真空空间中。因此，柔性基板被四周的框胶及与承托板之间的真空紧紧固定住。
可选地，所述框胶可为紫外线（英文：ultraviolet，简称：uv）胶。所述通过框胶将所述柔性基板与所述承托板固定具体包括：通过紫外线照射固化所述柔性基板与所述承托板间的框胶。
可选地，上述柔性基板可为由聚萘二甲酸乙二醇酯（英文简称：PEN）或聚对苯二甲酸（英文简称：PET）等塑料材料构成的塑胶基板。上述承托板可为任意硬性材料构成的基板，例如为玻璃板。
120：在所述柔性基板上形成柔性显示面板。
如图4所示，当柔性基板421固定在上述承托板410上后，柔性基板由于支撑柱矩阵的支撑，而避免受力弯折变形。此时，在柔性基板421上进行显示器件422如OLED器件的制作工艺，并对OLED器件进行封装，形成柔性显示面板420。
130：将所述承托板和所述柔性显示面板沿所述框胶的内侧切割，使得所述柔性显示面板与所述承托板脱离。
本实施方式中，将仍然通过框胶固定在一起的承托板和柔性显示面板沿着框胶的内侧（如图4所示的虚线a）切割，由于框胶已被切割，故承托板与柔性显示面板不再固定，且承托板与柔性显示面板之间的真空被破坏，柔性基板即会自动脱落，不需要再进行剥离。
其中，承托板和柔性显示面板可沿框胶内侧同时切割，或者分别进行切割。例如，先将所述承托板沿所述框胶的内侧切割，使得所述柔性显示面板脱离；将所述柔性显示面板四周的框胶进行裁切。
上述实施方式中，承托板上的支撑柱矩阵可为预先形成的，或者在上述柔性显示面板的制备过程中生成。其中，所述支撑柱矩阵可由附加的薄膜生成或者对承托板进行刻蚀或黄光制程得到。
如在另一实施方式中，柔性显示面板的制备方法在上述110步骤之前，还包括：
在承托板上生长一层薄膜；
对所述薄膜进行曝光、显影、烘烤、刻蚀，或者曝光、显影、烘烤，得到由所述薄膜形成的所述支撑柱矩阵；
在所述承托板的四周涂布框胶。
其中，上述薄膜材料为氮化硅（英文：SiNx）、黑矩阵（英文：Black Matrix，简称:BM）、或间隔物（英文：photo spacer，简称：PS）。
又如在再一实施方式中，柔性显示面板的制备方法在上述110步骤之前，还包括：
在所述承托板表面涂布光阻；
通过曝光、显影、刻蚀的方式对所述承托板表面进行刻蚀，得到由所述承托板形成支撑柱矩阵；
在所述承托板四周被刻蚀的区域涂布框胶。
可以理解的是，上述实施方式中，所述承托板上涂布的框胶的高度高于或等于所述支撑柱矩阵的高度，以保证支撑柱矩阵与柔性基板贴合后，承托板、柔性基板和框胶能够形成密封空间。
当然，在其他实施方式中，未必在承托板上涂布框胶，还可以在柔性基板的四周涂布框胶，然后将涂布框胶的柔性基板与承托板的支撑柱矩阵贴合，并通过框胶固定。
本实施方式还提供一种柔性显示面板的实施方式。该柔性显示面板包括柔性基板和设置在柔性基板上的显示器件，如OLED器件。其中，所述柔性显示面板由上述实施方式的制备方法制成。
上述方案中，在承托板上设置用于支撑柔性基板的支撑柱矩阵，并将柔性面板贴合在支撑柱矩阵上，且将柔性基板通过框胶固定在承托板上，使得柔性基板和承托板间形成真空层，由于真空产生的吸力大，使得柔性基板和承托板能够紧紧固定，且可避免在制备过程中出现柔性基板表面突起的现象。另外，在所述柔性基板上形成柔性显示面板后，沿框胶的内侧将柔性显示面板和承托板切割，柔性显示面板自动剥离，故不会损坏柔性显示面板上的器件。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (16)

  1. 一种柔性显示面板的制备方法，其中，包括：
    在承托板上生长一层薄膜，对所述薄膜进行曝光、显影、烘烤、刻蚀，或者曝光、显影、烘烤，得到由所述薄膜形成的所述支撑柱矩阵；或，在所述承托板表面涂布光阻，通过曝光、显影、刻蚀的方式对所述承托板表面进行刻蚀，得到由所述承托板形成支撑柱矩阵；
    在所述承托板的四周涂布框胶，其中，所述胶框为紫外线UV胶；
    在真空环境下，将柔性基板与承托板上的支撑柱矩阵贴合，且通过紫外线照射固化所述柔性基板与所述承托板间的所述框胶，其中，所述框胶设置于所述支撑柱矩阵的四周，以将所述支撑柱矩阵包围在所述框胶与所述承托板、柔性基板形成的密封空间中；
    在所述柔性基板上形成柔性显示面板；
    将所述承托板和所述柔性显示面板沿所述框胶的内侧切割，使得所述柔性显示面板与所述承托板脱离。
  2. 根据权利要求1所述的方法，其中，所述薄膜材料为氮化硅SiNx、黑矩阵BM、或间隔物PS。
  3. 根据权利要求1或2所述的方法，其中，所述承托板涂布的框胶的高度高于或等于所述支撑柱矩阵的高度。
  4. 根据权利要求1所述的方法，其中，所述在所述柔性基板上形成柔性显示面板，包括：
    在所述柔性基板表面制作OLED器件，并对所述OLED器件进行封装，得到柔性显示面板。
  5. 根据权利要求1所述的方法，其中，所述将所述承托板和所述柔性显示面板沿所述框胶的内侧切割，使得所述柔性显示面板与所述承托板脱离，包括:
    将所述承托板沿所述框胶的内侧切割，使得所述柔性显示面板脱离；
    将所述柔性显示面板四周的框胶进行裁切。
  6. 根据权利要求1所述的方法，其中，所述承托板为玻璃板，和/或所述柔性基板为塑料基板。
  7. 一种柔性显示面板的制备方法，其中，包括：
    在真空环境下，将柔性基板与承托板上的支撑柱矩阵贴合，且通过框胶将所述柔性基板与所述承托板固定，其中，所述框胶设置于所述支撑柱矩阵的四周，以将所述支撑柱矩阵包围在所述框胶与所述承托板 、柔性基板形成的密封空间中；
    在所述柔性基板上形成柔性显示面板；
    将所述承托板和所述柔性显示面板沿所述框胶的内侧切割，使得所述柔性显示面板与所述承托板脱离。
  8. 根据权利要求7所述的方法，其中，在所述在真空环境下，将柔性基板与承托板上的支撑柱矩阵贴合，且通过框胶将所述柔性基板与所述承托板固定之前，还包括：
    在承托板上生长一层薄膜；
    对所述薄膜进行曝光、显影、烘烤、刻蚀，或者曝光、显影、烘烤，得到由所述薄膜形成的所述支撑柱矩阵；
    在所述承托板的四周涂布框胶。
  9. 根据权利要求8所述的方法，其中，所述薄膜材料为氮化硅SiNx、黑矩阵BM、或间隔物PS。
  10. 根据权利要求7所述的方法，其中，在所述在真空环境下，将柔性基板与承托板上的支撑柱矩阵贴合，且通过框胶将所述柔性基板与所述承托板固定之前，还包括：
    在所述承托板表面涂布光阻；
    通过曝光、显影、刻蚀的方式对所述承托板表面进行刻蚀，得到由所述承托板形成支撑柱矩阵；
    在所述承托板四周被刻蚀的区域涂布框胶。
  11. 根据权利要求8-10任一项所述的方法，其中，所述承托板涂布的框胶的高度高于或等于所述支撑柱矩阵的高度。
  12. 根据权利要求7所述的方法，其中，所述框胶为紫外线UV胶，
    所述通过框胶将所述柔性基板与所述承托板固定包括：
    通过紫外线UV照射固化所述柔性基板与所述承托板间的框胶。
  13. 根据权利要求7所述的方法，其中，所述在所述柔性基板上形成柔性显示面板，包括：
    在所述柔性基板表面制作OLED器件，并对所述OLED器件进行封装，得到柔性显示面板。
  14. 根据权利要求7所述的方法，其中，所述将所述承托板和所述柔性显示面板沿所述框胶的内侧切割，使得所述柔性显示面板与所述承托板脱离，包括:
    将所述承托板沿所述框胶的内侧切割，使得所述柔性显示面板脱离；
    将所述柔性显示面板四周的框胶进行裁切。
  15. 根据权利要求7所述的方法，其中，所述承托板为玻璃板，和/或所述柔性基板为塑料基板。
  16. 一种柔性显示面板，其中，所述柔性显示面板由权利要求1或7所述的制备方法制成。
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