WO2016167036A1 - はんだ電極の製造方法およびその用途 - Google Patents
はんだ電極の製造方法およびその用途 Download PDFInfo
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- WO2016167036A1 WO2016167036A1 PCT/JP2016/056214 JP2016056214W WO2016167036A1 WO 2016167036 A1 WO2016167036 A1 WO 2016167036A1 JP 2016056214 W JP2016056214 W JP 2016056214W WO 2016167036 A1 WO2016167036 A1 WO 2016167036A1
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- resist
- solder
- substrate
- electrode
- opening
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Definitions
- the present invention relates to a method for manufacturing a solder electrode, a solder electrode, a method for manufacturing a laminate, a laminate, and an electronic component.
- the IMS (Injection Molded Solder) method is one of the methods for forming solder patterns such as solder bumps.
- a solder paste method, a plating method or the like has been used as a method of forming a solder pattern on a substrate such as a wafer.
- these methods have limitations such as difficulty in controlling the height of solder bumps and inability to freely select a solder composition.
- the IMS method has an advantage that there is no such restriction.
- the IMS method is characterized in that solder is poured into an opening portion of a resist pattern while a nozzle capable of injection-molding molten solder is brought into close contact with the resist to fill the solder. Is the method.
- the IMS method is performed by pressing an IMS head heated to a high temperature, usually 250 ° C. or more, against the resist surface in order to fill the molten solder. For this reason, a load due to high heat is applied to the resist surface, cracks are generated on the resist surface, and the sagging of the resist occurs, resulting in a problem that the solder filling ability is lowered.
- An object of the present invention is to provide a technique capable of preventing the occurrence of cracks on the resist surface and improving the solder filling ability even when the resist receives high heat during solder filling, such as the IMS method. To do.
- the method for producing a solder electrode of the present invention includes a step (1) of forming a coating film of a photosensitive resin composition on a substrate having an electrode pad, selectively exposing the coating film, and further developing the coating film.
- the step (3) is preferably a step of heating the resist, and the heating temperature of the step (3) is preferably 100 to 300 ° C.
- the method for manufacturing a solder electrode may further include a step (5) of peeling the resist from the substrate.
- the solder electrode of the present invention is manufactured by the method for manufacturing a solder electrode.
- the manufacturing method of the 1st laminated body of this invention is the process (1) which forms the coating film of the photosensitive resin composition on the 1st board
- the manufacturing method of the 2nd laminated body of this invention is the process (1) which forms the coating film of the photosensitive resin composition on the 1st board
- the laminate of the present invention is manufactured by the method for manufacturing a laminate.
- the electronic component of the present invention has the laminate.
- the solder electrode manufacturing method of the present invention can prevent the occurrence of cracks on the resist surface and improve the solder filling ability even when the resist receives high heat during solder filling, such as the IMS method. Therefore, it is possible to accurately manufacture a solder electrode suitable for the purpose.
- the method for manufacturing a laminate of the present invention can accurately manufacture a solder electrode suitable for the purpose by the IMS method, it is possible to accurately manufacture a laminate having an electrical connection structure.
- FIG. 1 (1) to 1 (5) are schematic cross-sectional views of a structure including a substrate in each step of the method for manufacturing a solder electrode according to the present invention.
- 2 (6-1) and (6-2) are schematic cross-sectional views of the laminate according to the present invention.
- FIG. 3 is an electron microscopic image showing the state of the resist and solder electrodes provided on the substrate in Example 1.
- 4 is an electron microscopic image showing the state of solder electrodes provided on the substrate in Example 1.
- the method for producing a solder electrode of the present invention includes a step (1) of forming a coating film of a photosensitive resin composition on a substrate having an electrode pad, selectively exposing the coating film, and further developing the coating film.
- a resist having an opening is formed on a substrate having an electrode pad, and then the opening is filled with molten solder without heating or exposing the resist.
- the method for producing a solder electrode according to the present invention after forming a resist having an opening on a substrate having an electrode pad, the resist is heated and / or exposed before filling the opening with molten solder. It is characterized in that step (3) is performed. Except for this point, the operation may be the same as the conventional solder electrode manufacturing method using the IMS method or the like.
- step 1 a coating film 3 of a photosensitive resin composition is formed on a substrate 1 having electrode pads 2.
- the substrate 1 is, for example, a semiconductor substrate, a glass substrate, a silicon substrate, a substrate formed by providing various metal films on the surface of a semiconductor plate, a glass plate, and a silicon plate.
- the substrate 1 has a large number of electrode pads 2.
- the coating film 3 is formed by applying a photosensitive resin composition to the substrate 1.
- the photosensitive resin composition may be a photosensitive resin composition conventionally used for forming a resist in the IMS method.
- the photosensitive resin composition usually contains a crosslinking agent such as a polyfunctional acrylate, and the coating film 3 formed from the photosensitive resin composition is crosslinked in Step 2 described later.
- the coating method of the photosensitive resin composition is not particularly limited, and examples thereof include a spray method, a roll coating method, a spin coating method, a slit die coating method, a bar coating method, and an ink jet method.
- the film thickness of the coating film 3 is usually 0.001 to 10 ⁇ m, preferably 0.01 to 5 ⁇ m, more preferably 0.1 to 1 ⁇ m.
- step 2 As shown in FIG. 1B, the coating film 3 is selectively exposed and further developed to form a resist 5 having an opening 4 in a region corresponding to each electrode pad 2.
- the coating film 3 is partially exposed so that the openings 4 for accommodating the electrode pads 2 are formed, and then developed to form the openings 4 for accommodating the electrode pads 2. .
- a resist 5 having an opening 4 in a region corresponding to each electrode pad 2 is obtained.
- the opening 4 is a hole that penetrates the resist 5.
- the exposure and development can be performed according to conventional methods.
- the maximum width of the opening 4 is usually 0.1 to 10 times, preferably 0.5 to 2 times the film thickness of the coating film 3.
- step 3 as shown in FIG. 1 (3), the resist 5 is heated and / or exposed.
- the resist 5 is heated, and exposure is not performed, exposure is performed, heating is not performed, or heating and exposure are performed.
- step 2 the coating film 3 formed from the photosensitive resin composition is crosslinked by exposure.
- the crosslinking agent contained in the photosensitive resin composition is not completely consumed only by exposure, and the crosslinking agent that has not been consumed remains in the resist 5.
- the crosslinking of the resist 5 is incomplete, and the strength of the resist 5 is not sufficiently increased.
- the resist 5 cannot withstand the heat received from the IMS head, It is thought that drooling will occur.
- the resist 5 is heated and / or exposed as a step 3 after the completion of the step 2.
- the crosslinking reaction by the crosslinking agent remaining in the resist 5 proceeds, and the resist 5 is strengthened.
- the resist 5 has a strength sufficient to withstand the heat received from the IMS head. It is considered that the resist 5 does not generate cracks or dripping.
- the crosslinking reaction by the crosslinking agent proceeds in the resist 5 by heat while the molten solder is filled in the opening 4.
- the cross-linking agent such as polyfunctional acrylate used in the photosensitive resin composition has a slow cross-linking reaction rate, so that the heat received from the IMS head before the cross-linking reaction sufficiently proceeds. It is thought that cracks and dripping occur due to the above.
- the heating temperature is usually 100 to 300 ° C., preferably 150 to 250 ° C.
- the heating time is usually 5 to 120 minutes, preferably 5 to 60 minutes. When the heating temperature is high, the heating time is shortened, and when the heating temperature is low, the heating time is lengthened, and the time is adjusted according to the amount of heat.
- the exposure amount is usually 50 to 3,000 mJ / cm 2 , preferably 100 to 1,000 mJ / cm 2 .
- the exposure time is usually 1 second to 30 minutes.
- the heating temperature is usually 100 to 300 ° C., preferably 150 to 250 ° C.
- the heating time is usually 5 to 120 minutes, preferably 5 to 60. Minutes.
- the exposure dose is usually 50 to 3,000 mJ / cm 2 , preferably 100 to 2,000 mJ / cm 2 , and the exposure time is usually 1 second to 30 minutes.
- the cross-linking reaction by the cross-linking agent sufficiently proceeds in the resist 5, and the resist 5 has a strength capable of withstanding the heat received when the molten solder is filled.
- step 3 it is preferable to heat the resist 5 because the cross-linking reaction of the cross-linking agent in the resist 5 proceeds and the resist 5 is easily strengthened.
- step 4 the opening 4 is filled with molten solder while heating. Thereafter, by cooling, solder electrodes 6 are formed in the respective openings 4 as shown in FIG.
- the method of filling the opening 4 while heating the molten solder is not particularly limited, and a normal filling method by the IMS method can be adopted.
- filling is usually performed while heating the molten solder at 250 ° C. or higher.
- the method of manufacturing a solder electrode according to the present invention even when a high-temperature head is pressed against the surface of the resist 5 and filled with molten solder as in the IMS method, cracks on the surface of the resist 5 and the ablation occur. Generation can be suppressed.
- solder electrode manufactured as described above by the method for manufacturing a solder electrode according to the present invention is formed without causing cracks or dripping in the resist, the shape is not disturbed, and the electrode is suitable for the purpose. .
- the method for manufacturing a solder electrode may further include a step (5) of peeling the resist 5 from the substrate 1 after the step (4).
- FIG. 1 (5) shows a state where the resist 5 is peeled from the substrate 1 after the step (4).
- solder electrode manufactured by the solder electrode manufacturing method of the present invention can be used together with the resist 5 as shown in FIG. 1 (4), or without the resist 5 as shown in FIG. 1 (5). It can also be used.
- any photosensitive resin composition can be used as the photosensitive resin composition as long as it includes a component to be crosslinked.
- the method for producing a solder electrode of the present invention can also be performed using a positive photosensitive resin composition.
- the manufacturing method of the 1st laminated body of this invention is the process (1) which forms the coating film of the photosensitive resin composition on the 1st board
- the manufacturing method of the 2nd laminated body of this invention is the process (1) which forms the coating film of the photosensitive resin composition on the 1st board
- Steps (1) to (4) in the method for manufacturing the first and second laminates, and step (5) in the method for manufacturing the second laminate are steps (1) to ( 5) and substantially the same. That is, the first laminate manufacturing method is a method of performing the step (6) after the steps (1) to (4) in the solder electrode manufacturing method, and the second laminate manufacturing method is the above-described method. In this method, the step (6) is performed after the steps (1) to (5) in the solder electrode manufacturing method.
- the substrate in the solder electrode manufacturing method corresponds to the first substrate.
- Step (6) of forming a general connection structure is performed.
- FIG. 2 (6-1) shows the laminate 10 manufactured by the first laminate manufacturing method.
- the laminated body 10 has the electrode pad 2 of the first substrate 1 and the electrode pad 12 through the solder electrode 6 in the state shown in FIG. 1 (4) manufactured by the steps (1) to (4). It has an electrical connection structure formed by connecting the electrode pads 12 of the second substrate 11.
- the electrode pad 12 of the second substrate 11 faces the electrode pad 2 of the first substrate 1 when the first substrate 1 and the second substrate 11 are opposed to each other with the surfaces on which the electrode pads are formed facing each other. In the position.
- the electrode pads 12 of the second substrate 11 are brought into contact with the solder electrodes 6 in the state shown in FIG. 1 (4), and heated and / or pressurized, whereby the electrode pads 2 of the first substrate 1 and the electrode pads of the second substrate 11 are used. 12 are electrically connected to each other through the solder electrode 6 to form an electrical connection structure, whereby the laminate 10 is obtained.
- the heating temperature is usually 100 to 300 ° C.
- the pressing force is usually 0.1 to 10 MPa.
- the laminated body 10 is composed of the first substrate 1 and the solder electrodes as shown in FIG. 2 (6-1). 6, a second substrate 11, and a resist 5 sandwiched between the first substrate 1 and the second substrate 11.
- Step (6) of forming a general connection structure is performed.
- FIG. 2 (6-2) shows the laminate 20 produced by the second laminate production method.
- the laminate 20 has the electrode pad 2 of the first substrate 1 and the electrode pad 12 through the solder electrode 6 shown in FIG. 1 (5) manufactured by the steps (1) to (5). It has an electrical connection structure formed by connecting the electrode pads 12 of the second substrate 11.
- the electrode pads 12 of the first substrate 1 and the electrode pads of the second substrate 11 are brought into contact with the solder electrodes 6 in the state shown in FIG. 12 are electrically connected to each other through the solder electrode 6 to form an electrical connection structure, whereby the laminate 20 is obtained.
- the laminate 20 includes the first substrate 1 and the solder electrodes as shown in FIG. 2 (6-2). 6 and the second substrate 11.
- the laminate produced by the laminate production method of the present invention may or may not include a resist between the first substrate and the second substrate.
- the resist is used as an underfill.
- the laminate manufactured by the method for manufacturing a laminate of the present invention has an electrical connection structure suitable for the purpose by the IMS method, the selectivity of the solder composition is widened, so that the semiconductor element, the display element, and the power device It is applicable to various electronic parts such as.
- the laminate produced by the laminate production method of the present invention can be used for electronic components such as semiconductor elements, display elements, and power devices.
- Measurement method of physical properties measurement method of weight average molecular weight (Mw) of alkali-soluble resin (A)
- Mw weight average molecular weight
- A alkali-soluble resin
- the reaction product was dropped into a large amount of cyclohexane and solidified.
- the coagulated product was washed with water, and the coagulated product was redissolved in tetrahydrofuran having the same mass as the coagulated product, and then the obtained solution was dropped into a large amount of cyclohexane to coagulate again.
- the redissolving and coagulation operations were performed three times in total, and the obtained coagulated product was vacuum-dried at 40 ° C. for 48 hours to obtain an alkali-soluble resin 1.
- the weight average molecular weight of the alkali-soluble resin 1 was 10,000.
- the reaction product was dropped into a large amount of cyclohexane and solidified.
- the coagulated product was washed with water, and the coagulated product was redissolved in tetrahydrofuran having the same mass as the coagulated product, and then the obtained solution was dropped into a large amount of cyclohexane to coagulate again.
- the redissolving and coagulation operations were performed three times in total, and the obtained coagulated product was vacuum-dried at 40 ° C. for 48 hours to obtain an alkali-soluble resin 2.
- the weight average molecular weight of the alkali-soluble resin 2 was 10,000.
- Preparation Example 1 Preparation of photosensitive resin composition 1 100 parts of alkali-soluble resin 1 synthesized in Synthesis Example 1 above, 50 parts of polyester acrylate (trade name “Aronix M-8060” manufactured by Toagosei Co., Ltd.) 5 parts of methylolpropane triacrylate, 4 parts of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide (trade name “LUCIRIN TPO”, manufactured by BASF Corp.), 0.4 part of a compound represented by the following formula (1), 100 parts of propylene glycol monomethyl ether acetate and 0.1 part of a fluorosurfactant (trade name “Factent FTX-218” manufactured by Neos Co., Ltd.) were mixed and stirred to obtain a uniform solution. This solution was filtered through a capsule filter having a pore diameter of 10 ⁇ m to prepare a photosensitive resin composition 1.
- polyester acrylate trade name “Aronix M-8060” manufactured by Toagos
- Preparation Example 2 Preparation of photosensitive resin composition 2 100 parts of alkali-soluble resin 1 synthesized in Synthesis Example 1 above, 50 parts of polyester acrylate (trade name “Aronix M-8060” manufactured by Toagosei Co., Ltd.), diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide (trade name “LUCIRIN TPO”, manufactured by BASF Corp.) 4 parts, 2,2-dimethoxy-1,2-diphenylethane-1-one (trade name “IRGACURE”) 651 ", manufactured by BASF Corporation), 80 parts of propylene glycol monomethyl ether acetate, 0.1 part of a fluorosurfactant (trade name” Factent FTX-218 "manufactured by Neos Co., Ltd.) are mixed and stirred. And a homogeneous solution was obtained. This solution was filtered through a capsule filter having a pore diameter of 10 ⁇ m to prepare a photosensitive resin composition 2.
- polyester acrylate
- Preparation Example 3 Preparation of photosensitive resin composition 3 100 parts of alkali-soluble resin 1 synthesized in Synthesis Example 1 above, 50 parts of polyester acrylate (trade name “Aronix M-8060”, manufactured by Toagosei Co., Ltd.), Tri 5 parts of methylolpropane triacrylate, 4 parts of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide (trade name “LUCIRIN TPO”, manufactured by BASF Corporation), 0.4 part of the compound represented by the above formula (1), 100 parts of propylene glycol monomethyl ether acetate, 5 parts of methacryloxypropyltrimethoxysilane, 0.1 part of a fluorosurfactant (trade name “Factent FTX-218” manufactured by Neos Co., Ltd.) are mixed and stirred uniformly. Solution was obtained. This solution was filtered through a capsule filter having a pore diameter of 10 ⁇ m to prepare a photosensitive resin composition 3.
- polyester acrylate
- Preparation Example 4 Preparation of photosensitive resin composition 4 100 parts of alkali-soluble resin 1 synthesized in Synthesis Example 1 above, 50 parts of polyester acrylate (trade name “Aronix M-8060”, manufactured by Toagosei Co., Ltd.), Tri 5 parts of methylolpropane triacrylate, 4 parts of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide (trade name “LUCIRIN TPO”, manufactured by BASF Corporation), 0.4 part of the compound represented by the above formula (1), Mix 100 parts of propylene glycol monomethyl ether acetate, 5 parts of 3-glycidoxypropyltrimethoxysilane, 0.1 part of a fluorosurfactant (trade name “Factent FTX-218” manufactured by Neos Co., Ltd.) and stir. To obtain a uniform solution. This solution was filtered through a capsule filter having a pore diameter of 10 ⁇ m to prepare a photosensitive resin composition 4.
- polyester acrylate
- Preparation Example 6 Preparation of photosensitive resin composition 6 100 parts of alkali-soluble resin 2 synthesized in Synthesis Example 2 above, 50 parts of polyester acrylate (trade name “Aronix M-8060”, manufactured by Toagosei Co., Ltd.), Tri 5 parts methylolpropane triacrylate, 1 part ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime), propylene glycol monomethyl ether 100 parts of acetate and 0.1 part of a fluorosurfactant (trade name “Factent FTX-218” manufactured by Neos Co., Ltd.) were mixed and stirred to obtain a uniform solution. This solution was filtered through a capsule filter having a pore diameter of 10 ⁇ m to prepare a photosensitive resin composition 6.
- polyester acrylate trade name “Aronix M-8060”, manufactured by Toagosei Co., Ltd.
- Example 1 The photosensitive resin composition 1 prepared in Preparation Example 1 was applied to a substrate having a plurality of copper electrode pads on a silicon plate using a spin coater, and heated at 120 ° C. for 5 minutes on a hot plate to obtain a thickness. A 55 ⁇ m coating film was formed. Next, using an aligner (manufactured by Suss, model “MA-200”), light having a wavelength of 420 nm was exposed at an irradiation intensity of 300 mJ / cm 2 through a pattern mask.
- an aligner manufactured by Suss, model “MA-200”
- the coating film was brought into contact with an aqueous 2.38 mass% tetramethylammonium hydroxide solution for 240 seconds, and the coating film was washed with running water and developed. Subsequently, the substrate was heated in a convection oven at 200 ° C. for 10 minutes under a nitrogen flow to form a resist holding substrate having an opening at a portion corresponding to the electrode pad.
- the opening of each opening was circular with a diameter of 30 ⁇ m, and the depth of each opening was 50 ⁇ m. The maximum width of the opening was 30 ⁇ m.
- the resist holding substrate having the opening was immersed in a 1% by mass sulfuric acid aqueous solution at 23 ° C. for 1 minute, washed with water and dried. An opening of the substrate after drying was filled with molten solder obtained by melting SAC305 (lead-free solder, product name of Senju Metal Industry Co., Ltd.) at 250 ° C. over 10 minutes while heating to 250 ° C.
- SAC305 lead-free solder, product name of Senju Metal Industry Co., Ltd.
- FIG. 4 shows an electron microscope image of the solder electrode in a state where the resist is peeled off.
- substrate which has another copper electrode pad was mounted in the board
- a pressure of 0.3 MPa at 250 ° C. is applied for 30 seconds to the substrate having the two copper electrode pads so that they are pressed together, and the substrate having the copper electrode pad, the solder electrode, the copper electrode pad.
- Example 2 The photosensitive resin composition 2 prepared in Preparation Example 2 was applied to a substrate having a plurality of copper electrode pads on a silicon plate using a spin coater, and heated at 120 ° C. for 5 minutes on a hot plate to obtain a thickness. A 55 ⁇ m coating film was formed. Next, using an aligner (manufactured by Suss, model “MA-200”), light having a wavelength of 420 nm was exposed at an irradiation intensity of 300 mJ / cm 2 through a pattern mask. After the exposure, the coating film was brought into contact with an aqueous 2.38 mass% tetramethylammonium hydroxide solution for 240 seconds, and the coating film was washed with running water and developed.
- an aligner manufactured by Suss, model “MA-200”
- the substrate was heated in a convection oven at 200 ° C. for 10 minutes under a nitrogen flow to form a resist holding substrate having an opening at a portion corresponding to the electrode pad.
- the opening of each opening was circular with a diameter of 30 ⁇ m, and the depth of each opening was 50 ⁇ m.
- the maximum width of the opening was 30 ⁇ m.
- the resist holding substrate having the opening was immersed in a 1% by mass sulfuric acid aqueous solution at 23 ° C. for 1 minute, washed with water and dried. An opening of the substrate after drying was filled with molten solder obtained by melting SAC305 (lead-free solder, product name of Senju Metal Industry Co., Ltd.) at 250 ° C. over 10 minutes while heating to 250 ° C.
- SAC305 lead-free solder, product name of Senju Metal Industry Co., Ltd.
- Example 3 The photosensitive resin composition 1 prepared in Preparation Example 1 was applied to a substrate having a plurality of copper electrode pads on a silicon plate using a spin coater, and heated at 120 ° C. for 5 minutes on a hot plate to obtain a thickness. A 55 ⁇ m coating film was formed. Next, using an aligner (manufactured by Suss, model “MA-200”), light having a wavelength of 420 nm was exposed at an irradiation intensity of 300 mJ / cm 2 through a pattern mask. After the exposure, the coating film was brought into contact with an aqueous 2.38 mass% tetramethylammonium hydroxide solution for 240 seconds, and the coating film was washed with running water and developed.
- an aligner manufactured by Suss, model “MA-200”
- the developed coating film was exposed at 1000 mJ / cm 2 and then heated in a convection oven at 200 ° C. for 10 minutes under a nitrogen flow to form a resist holding substrate having an opening at a portion corresponding to the electrode pad. .
- the opening of each opening was circular with a diameter of 30 ⁇ m, and the depth of each opening was 50 ⁇ m.
- the maximum width of the opening was 30 ⁇ m.
- the resist holding substrate having the opening was immersed in a 1% by mass sulfuric acid aqueous solution at 23 ° C. for 1 minute, washed with water and dried. An opening of the substrate after drying was filled with molten solder obtained by melting SAC305 (lead-free solder, product name of Senju Metal Industry Co., Ltd.) at 250 ° C. over 10 minutes while heating to 250 ° C.
- SAC305 lead-free solder, product name of Senju Metal Industry Co., Ltd.
- Example 4 A resist holding substrate having an opening was produced in the same manner as in Example 2 except that the photosensitive resin composition 3 was used instead of the photosensitive resin composition 2.
- the opening of each opening was circular with a diameter of 30 ⁇ m, and the depth of each opening was 50 ⁇ m.
- the maximum width of the opening was 30 ⁇ m.
- the resist holding substrate having the opening was immersed in a 1% by mass sulfuric acid aqueous solution at 23 ° C. for 1 minute, washed with water and dried. An opening of the substrate after drying was filled with molten solder obtained by melting SAC305 (lead-free solder, product name of Senju Metal Industry Co., Ltd.) at 250 ° C. over 10 minutes while heating to 250 ° C.
- SAC305 lead-free solder, product name of Senju Metal Industry Co., Ltd.
- Example 5 A resist holding substrate having an opening was prepared in the same manner as in Example 2 except that the photosensitive resin composition 4 was used instead of the photosensitive resin composition 2.
- the opening of each opening was circular with a diameter of 30 ⁇ m, and the depth of each opening was 50 ⁇ m.
- the maximum width of the opening was 30 ⁇ m.
- the resist holding substrate having the opening was immersed in a 1% by mass sulfuric acid aqueous solution at 23 ° C. for 1 minute, washed with water and dried. An opening of the substrate after drying was filled with molten solder obtained by melting SAC305 (lead-free solder, product name of Senju Metal Industry Co., Ltd.) at 250 ° C. over 10 minutes while heating to 250 ° C.
- SAC305 lead-free solder, product name of Senju Metal Industry Co., Ltd.
- Example 6 A resist holding substrate having an opening was produced in the same manner as in Example 2 except that the photosensitive resin composition 5 was used instead of the photosensitive resin composition 2.
- the opening of each opening was circular with a diameter of 30 ⁇ m, and the depth of each opening was 50 ⁇ m.
- the maximum width of the opening was 30 ⁇ m.
- the resist holding substrate having the opening was immersed in a 1% by mass sulfuric acid aqueous solution at 23 ° C. for 1 minute, washed with water and dried. An opening of the substrate after drying was filled with molten solder obtained by melting SAC305 (lead-free solder, product name of Senju Metal Industry Co., Ltd.) at 250 ° C. over 10 minutes while heating to 250 ° C.
- SAC305 lead-free solder, product name of Senju Metal Industry Co., Ltd.
- Example 7 The photosensitive resin composition 6 prepared in Preparation Example 6 was applied to a substrate having a plurality of copper electrode pads on a silicon plate using a spin coater, and heated at 120 ° C. for 5 minutes on a hot plate to obtain a thickness. A 55 ⁇ m coating film was formed. Next, using an aligner (manufactured by Suss, model “MA-200”), light having a wavelength of 365 nm was exposed at an irradiation intensity of 200 mJ / cm 2 through a pattern mask. After the exposure, the coating film was brought into contact with an aqueous 2.38 mass% tetramethylammonium hydroxide solution for 240 seconds, and the coating film was washed with running water and developed.
- an aligner manufactured by Suss, model “MA-200”
- the substrate was heated in a convection oven at 200 ° C. for 10 minutes under a nitrogen flow to form a resist holding substrate having an opening at a portion corresponding to the electrode pad.
- the opening of each opening was circular with a diameter of 30 ⁇ m, and the depth of each opening was 50 ⁇ m.
- the maximum width of the opening was 30 ⁇ m.
- the resist holding substrate having the opening was immersed in a 1% by mass sulfuric acid aqueous solution at 23 ° C. for 1 minute, washed with water and dried. An opening of the substrate after drying was filled with molten solder obtained by melting SAC305 (lead-free solder, product name of Senju Metal Industry Co., Ltd.) at 250 ° C. over 10 minutes while heating to 250 ° C.
- SAC305 lead-free solder, product name of Senju Metal Industry Co., Ltd.
- the coating film After the exposure, the coating film is brought into contact with a 2.38 mass% tetramethylammonium hydroxide aqueous solution for 240 seconds, the coating film is washed with running water, developed, and a resist holding substrate having an opening corresponding to the electrode pad is formed. did. Heating and exposure were not performed after development.
- the opening of each opening was circular with a diameter of 30 ⁇ m, and the depth of each opening was 50 ⁇ m. The maximum width of the opening was 30 ⁇ m.
- the resist holding substrate having the opening was immersed in a 1% by mass sulfuric acid aqueous solution at 23 ° C. for 1 minute, washed with water and dried. An opening of the substrate after drying was filled with molten solder obtained by melting SAC305 (lead-free solder, product name of Senju Metal Industry Co., Ltd.) at 250 ° C. over 10 minutes while heating to 250 ° C.
- molten solder obtained by melting SAC305 (lead-free solder, product name of Senju Metal Industry Co., Ltd.) at 250 ° C. over 10 minutes while heating to 250 ° C.
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Abstract
Description
本発明のはんだ電極の製造方法は、電極パッドを有する基板上に感光性樹脂組成物の塗膜を形成する工程(1)、前記塗膜を選択的に露光し、さらに現像することにより、前記電極パッドに対応する領域に開口部を有するレジストを形成する工程(2)、前記レジストを加熱および/または露光する工程(3)、前記開口部に溶融はんだを加熱しながら充填する工程(4)を有する。
(工程1)
工程1では、図1(1)に示すように、電極パッド2を有する基板1上に感光性樹脂組成物の塗膜3を形成する。
工程2では、図1(2)に示すように、塗膜3を選択的に露光し、さらに現像することにより、各電極パッド2に対応する領域に開口部4を有するレジスト5を形成する。
工程3では、図1(3)に示すように、レジスト5を加熱および/または露光する。つまり、レジスト5に加熱を行い、露光を行わないか、露光を行い、加熱を行わないか、または加熱および露光を行う。この工程を行うことにより、その後IMS法のように高温のヘッドをレジスト5の表面に押し当てて溶融はんだを開口部4に充填した場合でも、レジスト5表面のクラックの発生およびただれの発生を抑制でき、はんだ充填能を改善することができ、その結果、目的に適合したはんだ電極を的確に製造することができるようになる。その理由は次のように考えることができる。
工程4では、開口部4に溶融はんだを加熱しながら充填する。その後冷却することによって、図1(4)に示すように、各開口部4にはんだ電極6が形成される。
<積層体の製造方法>
本発明の第1の積層体の製造方法は、電極パッドを有する第1基板上に感光性樹脂組成物の塗膜を形成する工程(1)、前記塗膜を選択的に露光し、さらに現像することにより、前記電極パッドに対応する領域に開口部を有するレジストを形成する工程(2)、前記レジストを加熱および/または露光する工程(3)、前記開口部に溶融はんだを加熱しながら充填して、はんだ電極を製造する工程(4)、および前記はんだ電極を介して、前記第1基板の電極パッドと電極パッドを有する第2基板の電極パッドとの電気的接続構造を形成する工程(6)を有する。
(アルカリ可溶性樹脂(A)の重量平均分子量(Mw)の測定方法)
下記条件下でゲルパーミエーションクロマトグラフィー法にて重量平均分子量(Mw)を測定した。
・カラム:東ソー社製カラムのTSK-MおよびTSK2500を直列に接続
・溶媒:テトラヒドロフラン
・温度:40℃
・検出方法:屈折率法
・標準物質:ポリスチレン
・GPC装置:東ソー製、装置名「HLC-8220-GPC」
[合成例1]アルカリ可溶性樹脂1の合成
窒素置換したドライアイス/メタノール還流器の付いたフラスコ中に、重合開始剤として2,2'-アゾビスイソブチロニトリル5.0g、および重合溶媒としてジエチレングリコールエチルメチルエーテル90gを仕込み、攪拌した。得られた溶液に、メタクリル酸10g、p-イソプロペニルフェノール15g、トリシクロ〔5.2.1.02,6〕デカニルメタクリレート25g、イソボルニルアクリレート20g、およびn-ブチルアクリレート30gを加え、攪拌を開始し、80℃まで昇温した。その後、80℃で6時間加熱した。
窒素置換したドライアイス/メタノール還流器の付いたフラスコ中に、重合開始剤として2,2'-アゾビスイソブチロニトリル5.0g、および重合溶媒としてジエチレングリコールエチルメチルエーテル90gを仕込み、攪拌した。得られた溶液に、メタクリル酸10g、p-イソプロペニルフェノール15g、トリシクロ〔5.2.1.02.6〕デカニルメタクリレート25g、トリシクロ〔5.2.1.02.6〕デカニルアクリレート20g、およびn-ブチルアクリレート30gを加え、攪拌を開始し、80℃まで昇温した。その後、80℃で6時間加熱した。
前記合成例1で合成したアルカリ可溶性樹脂1 100部、ポリエステルアクリレート(商品名「アロニックスM-8060」、東亞合成(株)製)50部、トリメチロールプロパントリアクリレート5部、ジフェニル(2,4,6-トリメチルベンゾイル)ホスフィンオキシド(商品名「LUCIRIN TPO」、BASF(株)製)4部、下記式(1)に示す化合物0.4部、プロピレングリコールモノメチルエーテルアセテート100部、フッ素系界面活性剤(商品名「フタージェントFTX-218」(株)ネオス製)0.1部を混合し、攪拌して均一な溶液を得た。この溶液を、孔径10μmのカプセルフィルターでろ過して、感光性樹脂組成物1を調製した。
前記合成例1で合成したアルカリ可溶性樹脂1 100部、ポリエステルアクリレート(商品名「アロニックスM-8060」、東亞合成(株)製)50部、ジフェニル(2,4,6-トリメチルベンゾイル)ホスフィンオキシド(商品名「LUCIRIN TPO」、BASF(株)製)4部、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン(商品名「IRGACURE 651」、BASF(株)製)19部、プロピレングリコールモノメチルエーテルアセテート80部、フッ素系界面活性剤(商品名「フタージェントFTX-218」(株)ネオス製)0.1部を混合、攪拌して均一な溶液を得た。この溶液を、孔径10μmのカプセルフィルターでろ過して、感光性樹脂組成物2を調製した。
前記合成例1で合成したアルカリ可溶性樹脂1 100部、ポリエステルアクリレート(商品名「アロニックスM-8060」、東亞合成(株)製)50部、トリメチロールプロパントリアクリレート5部、ジフェニル(2,4,6-トリメチルベンゾイル)ホスフィンオキシド(商品名「LUCIRIN TPO」、BASF(株)製)4部、上記式(1)に示す化合物0.4部、プロピレングリコールモノメチルエーテルアセテート100部、メタクリロキシプロピルトリメトキシシラン5部、フッ素系界面活性剤(商品名「フタージェントFTX-218」(株)ネオス製)0.1部を混合し、攪拌して均一な溶液を得た。この溶液を、孔径10μmのカプセルフィルターでろ過して、感光性樹脂組成物3を調製した。
前記合成例1で合成したアルカリ可溶性樹脂1 100部、ポリエステルアクリレート(商品名「アロニックスM-8060」、東亞合成(株)製)50部、トリメチロールプロパントリアクリレート5部、ジフェニル(2,4,6-トリメチルベンゾイル)ホスフィンオキシド(商品名「LUCIRIN TPO」、BASF(株)製)4部、上記式(1)に示す化合物0.4部、プロピレングリコールモノメチルエーテルアセテート100部、3-グリシドキシプロピルトリメトキシシラン5部、フッ素系界面活性剤(商品名「フタージェントFTX-218」(株)ネオス製)0.1部を混合し、攪拌して均一な溶液を得た。この溶液を、孔径10μmのカプセルフィルターでろ過して、感光性樹脂組成物4を調製した。
前記合成例1で合成したアルカリ可溶性樹脂1 100部、ポリエステルアクリレート(商品名「アロニックスM-8060」、東亞合成(株)製)50部、トリメチロールプロパントリアクリレート5部、ジフェニル(2,4,6-トリメチルベンゾイル)ホスフィンオキシド(商品名「LUCIRIN TPO」、BASF(株)製)4部、上記式(1)に示す化合物0.4部、プロピレングリコールモノメチルエーテルアセテート100部、トリス(3-(トリメトキシシリル)プロピル)イソシアヌレート5部、フッ素系界面活性剤(商品名「フタージェントFTX-218」(株)ネオス製)0.1部を混合し、攪拌して均一な溶液を得た。この溶液を、孔径10μmのカプセルフィルターでろ過して、感光性樹脂組成物5を調製した。
前記合成例2で合成したアルカリ可溶性樹脂2 100部、ポリエステルアクリレート(商品名「アロニックスM-8060」、東亞合成(株)製)50部、トリメチロールプロパントリアクリレート5部、エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)1部、プロピレングリコールモノメチルエーテルアセテート100部、フッ素系界面活性剤(商品名「フタージェントFTX-218」(株)ネオス製)0.1部を混合し、攪拌して均一な溶液を得た。この溶液を、孔径10μmのカプセルフィルターでろ過して、感光性樹脂組成物6を調製した。
[実施例1]
シリコン板上に複数の銅電極パッドを有する基板上にスピンコーターを用いて、調製例1で調製した感光性樹脂組成物1を塗布し、ホットプレートで120℃にて5分間加熱し、厚さ55μmの塗膜を形成した。次いでアライナー(Suss社製、型式「MA-200」)を用い、パターンマスクを介して、波長420nmの光を照射強度300mJ/cm2にて露光した。露光後、塗膜を2.38質量%テトラメチルアンモニウムハイドロオキサイド水溶液に240秒間接触させ、塗膜を流水で洗浄し、現像した。次いで、窒素フロー下、対流式オーブンで200℃にて10分間加熱し、電極パッドに対応する部分に開口部を有するレジスト保持基板を形成した。電子顕微鏡で観察したところ、各開口部の開口は直径30μmの円形であり、各開口部の深さは50μmであった。また、開口部の最大幅は30μmであった。
シリコン板上に複数の銅電極パッドを有する基板上にスピンコーターを用いて、調製例2で調製した感光性樹脂組成物2を塗布し、ホットプレートで120℃にて5分間加熱し、厚さ55μmの塗膜を形成した。次いでアライナー(Suss社製、型式「MA-200」)を用い、パターンマスクを介して、波長420nmの光を照射強度300mJ/cm2にて露光した。露光後、塗膜を2.38質量%テトラメチルアンモニウムハイドロオキサイド水溶液に240秒間接触させ、塗膜を流水で洗浄し、現像した。次いで、窒素フロー下、対流式オーブンで200℃にて10分間加熱し、電極パッドに対応する部分に開口部を有するレジスト保持基板を形成した。電子顕微鏡で観察したところ、各開口部の開口は直径30μmの円形であり、各開口部の深さは50μmであった。また、開口部の最大幅は30μmであった。
シリコン板上に複数の銅電極パッドを有する基板上にスピンコーターを用いて、調製例1で調製した感光性樹脂組成物1を塗布し、ホットプレートで120℃にて5分間加熱し、厚さ55μmの塗膜を形成した。次いでアライナー(Suss社製、型式「MA-200」)を用い、パターンマスクを介して、波長420nmの光を照射強度300mJ/cm2にて露光した。露光後、塗膜を2.38質量%テトラメチルアンモニウムハイドロオキサイド水溶液に240秒間接触させ、塗膜を流水で洗浄し、現像した。現像後の塗膜を1000mJ/cm2で露光し、次いで、窒素フロー下、対流式オーブンで200℃にて10分間加熱し、電極パッドに対応する部分に開口部を有するレジスト保持基板を形成した。電子顕微鏡で観察したところ、各開口部の開口は直径30μmの円形であり、各開口部の深さは50μmであった。また、開口部の最大幅は30μmであった。
感光性樹脂組成物2の代わりに、感光性樹脂組成物3を用いた以外は実施例2と同様の方法にて、開口部を有するレジスト保持基板を作成した。電子顕微鏡で観察したところ、各開口部の開口は直径30μmの円形であり、各開口部の深さは50μmであった。また、開口部の最大幅は30μmであった。
感光性樹脂組成物2の代わりに、感光性樹脂組成物4を用いた以外は実施例2と同様の方法にて、開口部を有するレジスト保持基板を作成した。電子顕微鏡で観察したところ、各開口部の開口は直径30μmの円形であり、各開口部の深さは50μmであった。また、開口部の最大幅は30μmであった。
感光性樹脂組成物2の代わりに、感光性樹脂組成物5を用いた以外は実施例2と同様の方法にて、開口部を有するレジスト保持基板を作成した。電子顕微鏡で観察したところ、各開口部の開口は直径30μmの円形であり、各開口部の深さは50μmであった。また、開口部の最大幅は30μmであった。
シリコン板上に複数の銅電極パッドを有する基板上にスピンコーターを用いて、調製例6で調製した感光性樹脂組成物6を塗布し、ホットプレートで120℃にて5分間加熱し、厚さ55μmの塗膜を形成した。次いでアライナー(Suss社製、型式「MA-200」)を用い、パターンマスクを介して、波長365nmの光を照射強度200mJ/cm2にて露光した。露光後、塗膜を2.38質量%テトラメチルアンモニウムハイドロオキサイド水溶液に240秒間接触させ、塗膜を流水で洗浄し、現像した。次いで、窒素フロー下、対流式オーブンで200℃にて10分間加熱し、電極パッドに対応する部分に開口部を有するレジスト保持基板を形成した。電子顕微鏡で観察したところ、各開口部の開口は直径30μmの円形であり、各開口部の深さは50μmであった。また、開口部の最大幅は30μmであった。
シリコン板上に複数の銅電極パッドを有する基板上にスピンコーターを用いて、調製例2で調製した感光性樹脂組成物2を塗布し、ホットプレートで120℃にて5分間加熱し、厚さ55μmの塗膜を形成した。次いでアライナー(Suss社製、型式「MA-200」)を用い、パターンマスクを介して、波長420nmの光を照射強度300mJ/cm2にて露光した。露光後、塗膜を2.38質量%テトラメチルアンモニウムハイドロオキサイド水溶液に240秒間接触させ、塗膜を流水で洗浄し、現像し、電極パッドに対応する部分に開口部を有するレジスト保持基板を形成した。現像後に加熱および露光は行わなかった。電子顕微鏡で観察したところ、各開口部の開口は直径30μmの円形であり、各開口部の深さは50μmであった。また、開口部の最大幅は30μmであった。
2、12 電極パッド
3 塗膜
4 開口部
5 レジスト
6 はんだ電極
10、20 積層体
Claims (9)
- 電極パッドを有する基板上に感光性樹脂組成物の塗膜を形成する工程(1)、前記塗膜を選択的に露光し、さらに現像することにより、前記電極パッドに対応する領域に開口部を有するレジストを形成する工程(2)、前記レジストを加熱および/または露光する工程(3)、前記開口部に溶融はんだを加熱しながら充填する工程(4)を有するはんだ電極の製造方法。
- 前記工程(3)が、前記レジストを加熱する工程である請求項1に記載のはんだ電極の製造方法。
- 前記工程(3)の加熱温度が、100~300℃である請求項2に記載のはんだ電極の製造方法。
- さらに、前記レジストを前記基板から剥離する工程(5)を有する請求項1~3のいずれかに記載のはんだ電極の製造方法。
- 請求項1~4のいずれかに記載のはんだ電極の製造方法によって製造されたはんだ電極。
- 電極パッドを有する第1基板上に感光性樹脂組成物の塗膜を形成する工程(1)、前記塗膜を選択的に露光し、さらに現像することにより、前記電極パッドに対応する領域に開口部を有するレジストを形成する工程(2)、前記レジストを加熱および/または露光する工程(3)、前記開口部に溶融はんだを加熱しながら充填して、はんだ電極を製造する工程(4)、および前記はんだ電極を介して、前記第1基板の電極パッドと電極パッドを有する第2基板の電極パッドとの電気的接続構造を形成する工程(6)を有する積層体の製造方法。
- 電極パッドを有する第1基板上に感光性樹脂組成物の塗膜を形成する工程(1)、前記塗膜を選択的に露光し、さらに現像することにより、前記電極パッドに対応する領域に開口部を有するレジストを形成する工程(2)、前記レジストを加熱および/または露光する工程(3)、前記開口部に溶融はんだを加熱しながら充填する工程(4)、前記レジストを前記第1基板から剥離する工程(5)、および前記はんだ電極を介して、前記第1基板の電極パッドと電極パッドを有する第2基板の電極パッドとの電気的接続構造を形成する工程(6)を有する積層体の製造方法。
- 請求項6又は7に記載の積層体の製造方法によって製造された積層体。
- 請求項8に記載の積層体を有する電子部品。
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JP2005250292A (ja) * | 2004-03-05 | 2005-09-15 | Hitachi Chem Co Ltd | 感光性樹脂組成物及び金属バンプ形成方法 |
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