WO2016159755A1

WO2016159755A1 - A testing and taping machine

Info

Publication number: WO2016159755A1
Application number: PCT/MY2016/050016
Authority: WO
Inventors: Bukhari ABDUL RAZAK
Original assignee: Intotest Sdn Bhd
Priority date: 2015-03-27
Filing date: 2016-03-24
Publication date: 2016-10-06
Also published as: MY177498A

Abstract

The present invention discloses an apparatus for testing and taping semiconductor devices comprises: a first indexing table (300) for receiving and orientating the semiconductor devices; a second indexing table (500) carrying a tapping device (505, 506) for taping the semiconductor devices, the two tables (300, 500) synchronically operatable to transfer the semiconductor devices from the first indexing table (300) to the second indexing table (500); means (100) for feeding the semiconductor devices to the apparatus; characterised in that instead of feeding the semiconductor device to the second indexing table (500), the feed (100) is fed directly to the first indexing table (300).

Description

A TESTING AND TAPING MACHINE

FIELD OF INVENTION The invention relates to a testing and packing machine. More particularly, the invention relates to an apparatus for apparatus for testing and taping semiconductor devices.

BACKGROUND OF THE INVENTION

The testing and packaging process of the semiconductor devices is a continuous process, and any delays or occurrence of malfunction in any part of the testing and packaging machine will greatly reduce the productivity. There are a few patented technologies over the prior art relating to such machinery. Of interest in respect to a Testing, sorting, marking and braiding integrative machine of semiconductor device is CN201438454U. The patent discloses a testing, sorting, marking and braiding integrative machine of a semiconductor device; the proposal is that: the semiconductor device is conveyed to device processing systems arranged at all working stations for processing by the integrative machine, the integrative machine comprises a machine body and all the device processing systems, main turret systems and laser marking turret systems of sixteen working stations are arranged on the machine body, and each working station of the main turret system is provided with a suction nozzle mechanism for device picking and placing and conveying, and a suction nozzle pushing mechanism is arranged on the main turret system; each working station of the laser marking turret system is provided with a device conveying mechanism; the suction nozzle mechanism and the device conveying mechanism convey the semiconductor device to each device processing system to carry out one-stop continuous processing sequentially. By adopting the embodiment of the utility model, the testing, sorting, marking and braiding output functions, which are realized by various kinds of the equipment originally, are integrated into one set of equipment, thereby saving the cost and improving the working efficiency.

A similar machine is disclosed in CN101989535B. The patent provides an all-in-one machine of a semiconductor device for testing, sorting, marking and braiding and a one-stop processing method. A scheme in the invention is as follows: the semiconductor device is transported to a device processing system arranged on each station to be processed by the all-in-one machine. The all-in-one machine comprises a machine body and each device processing system, wherein the machine body is provided with a main turret system and a laser marking turret system respectively with 16 working positions; each station of the main turret system is provided with a suction nozzle mechanism for picking, placing and transporting the device; the main turret system is also provided with a suction nozzle pressing mechanism; each station of the laser marking turret system is provided with a device transmission mechanism; and the suction nozzle mechanism and the device transmission mechanism successively transmit the semiconductor device to each device processing system to finish one-stop continuous processing.; By the implementation of the invention, various functions such as testing, sorting, marking, braiding, outputting and the like which originally need to be finished by various equipment are finished on one equipment, thus saving cost and improving working efficiency.

When the semiconductor devices are transferred from one indexing table to the other, the semiconductor devices may be damaged during the transferring process and a faster operation speed will incur more damaged semiconductor devices. The main drawback of the two patents is that the feeding device is arranged in a way such that each semiconductor devices being transferred from a first indexing table to a second indexing table for testing purpose, and then the tested semiconductor devices being transferred back to the first indexing table for packaging purpose. As a result, the two transferring processes greatly limit the operation speed of the machine. Therefore, a need exist for the prior machines to increase the operation speed by reducing the transferring process of semiconductor devices from one indexing table to the other so that the productivity of the machine can hence be enhanced. The present invention provides such an apparatus.

SUMMARY OF INVENTION The invention provides an apparatus for testing and taping semiconductor devices comprises: a first indexing table for receiving and orientating the semiconductor devices; a second indexing table carrying a tapping device for taping the semiconductor devices, the two tables synchronically operatable to transfer the semiconductor devices from the first indexing table to the second indexing table; means for feeding the semiconductor devices to the apparatus; characterised in that instead of feeding the semiconductor device to the second indexing table, the feed is fed directly to the first indexing table. Preferably, the feed is coupled with means for transferring the semiconductor devices from the feed to the first indexing table. The transferring means can be a mechanical arm configured to pick and place the semiconductor device from the feed to the first indexing table.

In one embodiment of the invention, the apparatus may further include a testing station being provided on either or both the indexing tables for testing the semiconductor devices.

In another embodiment of the invention, the apparatus may further include means for detecting the orientation of the semiconductor devices being provided on the first or second indexing table. Yet in another embodiment of the invention, the apparatus may further include means for adjusting the orientation of the semiconductor devices being provided on the first or second indexing table. Still in another embodiment of the invention, the apparatus may further include one or more bins for retrieving the semiconductor devices from either or both the indexing tables.

One skilled in the art will readily appreciate that the invention is well adapted to carry out the objects and obtain the ends and advantages mentioned, as well as those inherent therein. The embodiments described herein are not intended as limitations on the scope of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

For the purpose of facilitating an understanding of the invention, there is illustrated in the accompanying drawing the preferred embodiments from an inspection of which when considered in connection with the following description, the invention, its construction and operation and many of its advantages would be readily understood and appreciated.

Figure 1 is a plan view of an apparatus for testing and taping semiconductor device which embodies therein the principle features of the invention.

DETAILED DESCRIPTION OF THE INVENTION

The invention will now be described in greater detail, by way of example, with reference to the drawings.

Referring to figure 1, an overall view of the apparatus as illustrated therein comprises a self-aligned vibration feeding station 100, having a channel 101 extending to a first transferring point 200 adjacent a first indexing table 300, a mechanical arm 201 being provided at the distal end of the channel 101, configured to pick a semiconductor device from the end section of the channel 101 and then place on the first indexing table 300, when the first indexing table 300 receives the semiconductor device, it intermittently rotates and transfers the semiconductor device to a second indexing table 500, a plurality of conveying blocks 301, 501 are disposed along the periphery of each indexing table 300, 500, each for carrying a semiconductor device. The apparatus is also provided with means 303, 304, 502, 503 for adjusting the orientation of the semiconductor module, means 305, 306 for testing the semiconductor device, and means 505, 506 for taping the semiconductor device, sequentially arranged along the periphery of the indexing tables 300, 500.

Preferably, at least one open short checking station or polarity vision checking station 302 is provided on the first indexing table 300, configured to check the orientation of the semiconductor device, at least one turner device 303, 304 is provided on the first indexing table 300, configured to turnover the semiconductor devices, at least one testing station 305, 306 is provided on the first indexing table 300, configured to test the semiconductor devices, at least one taping device 505, 506 is provided on the second indexing table 500, configured to pack the tested semiconductor devices. In addition, the apparatus may further comprise at least one rejection bin for collecting rejected semiconductor devices, at least one clear bin 507 for retrieving and clearing the semiconductor devices off an indexing table 300, 500, and at least one vision imaging station 504 for inspecting the semiconductor device. In operation, the semiconductor devices are firstly conveyed by the first indexing table 300 to the open short checking station or polarity vision checking station 302 for checking if each semiconductor device is seated at a right orientation. Next, the semiconductor devices are conveyed to the turner device 303, 304 for adjusting the orientation. If the semiconductor devices are seated at the correct orientation, the operation of the turner device 303, 304 will not be triggered. Later on, the semiconductor devices are conveyed to the testing station 305, 306 for testing the quality of the semiconductor devices. The tested semiconductor devices are further conveyed to second transferring point 400 where a conveying unit 301 of the first indexing table 300 and a conveying unit 501 of the second indexing table 500 are displacedly aligned while both of indexing tables 300, 500 transiently stop and permitting the semiconductor device to be held by the corresponding conveying unit 501 of the second indexing table 500 through suction. On the second indexing table 500, the tested semiconductor devices are conveyed to the taping station 505, 506. Depending on user requirement, a turner device 502 and a passive precision device 503, can be provided and arranged before the taping station 505, 506 for checking and adjusting the orientation of the semiconductor devices. A control panel coupled with a display and input means can be provided to govern the entire operation. Instead of feeding the semiconductor device to the second indexing table 500, the feed 100 is fed directly to the first indexing table 300. Not only has such arrangement reduced the distance travelled by the semiconductor devices, it also reduce the transferring points 200, 400 in relative to the aforementioned patents. Consequently, the operation speed can be enhanced. Also, the feeding station 100 is coupled with the mechanical arm 201 so that the semiconductor devices can directly transfer to the first indexing table 300.

The present disclosure includes as contained in the appended claims, as well as that of the foregoing description. Although this invention has been described in its preferred form with a degree of particularity, it is understood that the present disclosure of the preferred form has been made only by way of example and that numerous changes in the details of construction and the combination and arrangements of parts may be resorted to without departing from the scope of the invention.

Claims

1. An apparatus for testing and taping semiconductor devices comprising:

a first indexing table (300) for receiving and orientating the semiconductor devices; a second indexing table (500) carrying a tapping device (505, 506) for taping the semiconductor devices, the two tables (300, 500) synchronically operatable to transfer the semiconductor devices from the first indexing table (300) to the second indexing table (500);

means (100) for feeding the semiconductor devices to the apparatus;

characterised in that instead of feeding the semiconductor device to the second indexing table (500), the feed (100) is fed directly to the first indexing table (300).

2. An apparatus according to claim 1, further comprising a testing station (305, 306) being provided on either or both the indexing tables (300, 500) for testing the semiconductor devices.

3. An apparatus according to claim 1 or claim 2, further comprising means (302) for detecting the orientation of the semiconductor devices being provided on the first indexing table (300).

4. An apparatus according to any one of claim 1 to 3, further comprising means (302) for detecting the orientation of the semiconductor devices being provided on the second indexing table (500).

5. An apparatus according to any one of claims 1 to 4, further comprising means (303, 304) for adjusting the orientation of the semiconductor devices being provided on the first indexing table (300).

6. An apparatus according to any one of claims 1 to 5, further comprising means (502, 503) for adjusting the orientation of the semiconductor devices being provided on the second indexing table (500).

7. An apparatus according to any one of claims 1 to 6, further comprising one or more bins (507) for retrieving the semiconductor devices from either or both the indexing tables (300, 500).

8. An apparatus according to any one of claims 1 to 7, wherein the feed (100) is coupled with means (201) for transferring the semiconductor devices from the feed

(100) to the first indexing table (300).

9. An apparatus according to claim 8, wherein the transferring means (201) is a mechanical arm configured to pick and place the semiconductor device from the feed (100) to the first indexing table (300).