MY129418A - Composite processing method and composite processsing apparatus for leadless semiconductor devices - Google Patents
Composite processing method and composite processsing apparatus for leadless semiconductor devicesInfo
- Publication number
- MY129418A MY129418A MYPI20022193A MY129418A MY 129418 A MY129418 A MY 129418A MY PI20022193 A MYPI20022193 A MY PI20022193A MY 129418 A MY129418 A MY 129418A
- Authority
- MY
- Malaysia
- Prior art keywords
- semiconductor devices
- composite
- taping
- leadless
- leadless semiconductor
- Prior art date
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A METHOD AND APPARATUS FOR PROCESSING LEADLESS SEMICONDUCTOR DEVICE (1) WHICH IMPROVE PROCESSING EFFICIENCY AND YIELDS FOR COMBINED PROCESSING STEPS IN WHICH LEADLESS SEMICONDUCTOR DEVICES (1) ENCAPSULATED IN A CSP OR THE LIKE ARE INDIVIDUALLY SUBJECTED TO CHARACTERISTICS MEASUREMENTS, MARKING OR THE LIKE, AND FINALLY PACKAGED BY TAPING. A DICING SHEET (2) FOR SUSTAINING MULTIPLE LEADLESS SEMICONDUCTOR DEVICES AT HIGH DENSITIES IS SUPPLIED TO A FEED TABLE (10), ON WHICH THE DICING SHEET (2) IS EXTENDED TO SPACE THE SEMICONDUCTOR DEVICES APART FROM ONE ANOTHER.WITH THIS ARRANGEMENT. THE SEMICONDUCTOR DEVICES ARE MOVED ONE BY ONE ON THE FEED TABLE (10) TO A PICK-UP POSITION AND THEN PICKED UP WITH A VACUUM NOZZLE OF THE FIRST TURNTABLE. THE SEMICONDUCTOR DEVICES ARE MOVED IN SEQUENCE TO A PLURALITY OF TURNTABLES (20, 30, 40, 50) WHICH ARE CONSECUTIVELY DISPOSED.AT THE MEASURING TABLE (30) ON THE WAY. THE SEMICONDUCTOR DEVICES ARE SUBJECTED IN ONE OR MORE TO AN ALIGNMENT CHECK AND CHARACTERISTICS MEASUREMENTS AT THE SAME TIME. FINALLY, GOOD SEMICONDUCTOR DEVICES ARE PACKAGED BY TAPING AT A TAPING MACHINE (60) FOR SHIPPING. (FIG. 1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001199171A JP3655847B2 (en) | 2000-12-13 | 2001-06-29 | Compound processing method and compound processing apparatus for leadless semiconductor device |
JP2002006324A JP2003209157A (en) | 2002-01-15 | 2002-01-15 | Method and device for handling leadless semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
MY129418A true MY129418A (en) | 2007-03-30 |
Family
ID=47289783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20022193 MY129418A (en) | 2001-06-29 | 2002-06-12 | Composite processing method and composite processsing apparatus for leadless semiconductor devices |
Country Status (1)
Country | Link |
---|---|
MY (1) | MY129418A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016159755A1 (en) * | 2015-03-27 | 2016-10-06 | Intotest Sdn Bhd | A testing and taping machine |
WO2016159756A1 (en) * | 2015-03-27 | 2016-10-06 | Intotest Sdn Bhd | A testing and taping machine |
-
2002
- 2002-06-12 MY MYPI20022193 patent/MY129418A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016159755A1 (en) * | 2015-03-27 | 2016-10-06 | Intotest Sdn Bhd | A testing and taping machine |
WO2016159756A1 (en) * | 2015-03-27 | 2016-10-06 | Intotest Sdn Bhd | A testing and taping machine |
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