WO2016159756A1

WO2016159756A1 - A testing and taping machine

Info

Publication number: WO2016159756A1
Application number: PCT/MY2016/050017
Authority: WO
Inventors: Bukhari ABDUL RAZAK
Original assignee: Intotest Sdn Bhd
Priority date: 2015-03-27
Filing date: 2016-03-24
Publication date: 2016-10-06
Also published as: MY184645A

Abstract

The present invention discloses an apparatus for testing and taping semiconductor devices comprises: at least two rotary testing tables (100, 200), each carrying at least one testing station (107, 207) for testing the semiconductor devices; a feeding means (101, 201) associated to each testing tables (100, 200) for feeding the semiconductor devices to its designated testing table (100, 200); a rotary taping table (300) carrying at least one taping device (304, 305, 306, 307, 308) for taping the semiconductor devices; means (400, 500) for transferring the semiconductor devices from the testing tables (100, 200) to the taping table (300); wherein the transfer of the semiconductor devices from the testing tables (100, 200) to the taping table (300) are synchronized in a way such that the semiconductor devices do not stack on the taping table (300).

Description

A TESTING AND TAPING MACHINE

FIELD OF INVENTION The invention relates to a testing and packing machine. More particularly, the invention relates to an apparatus for apparatus for testing and taping semiconductor devices.

BACKGROUND OF THE INVENTION

The testing and packaging process of the semiconductor devices is a continuous process, and any delays or occurrence of malfunction in any part of the testing and packaging machine will greatly reduce the productivity. There are a few patented technologies over the prior art relating to such machinery. Of interest in respect to a Testing, sorting, marking and braiding integrative machine of semiconductor device is CN201438454U. The patent discloses a testing, sorting, marking and braiding integrative machine of a semiconductor device; the proposal is that: the semiconductor device is conveyed to device processing systems arranged at all working stations for processing by the integrative machine, the integrative machine comprises a machine body and all the device processing systems, main turret systems and laser marking turret systems of sixteen working stations are arranged on the machine body, and each working station of the main turret system is provided with a suction nozzle mechanism for device picking and placing and conveying, and a suction nozzle pushing mechanism is arranged on the main turret system; each working station of the laser marking turret system is provided with a device conveying mechanism; the suction nozzle mechanism and the device conveying mechanism convey the semiconductor device to each device processing system to carry out one-stop continuous processing sequentially. By adopting the embodiment of the utility model, the testing, sorting, marking and braiding output functions, which are realized by various kinds of the equipment originally, are integrated into one set of equipment, thereby saving the cost and improving the working efficiency.

A similar machine is disclosed in CN101989535B. The patent provides an all-in-one machine of a semiconductor device for testing, sorting, marking and braiding and a one-stop processing method. A scheme in the invention is as follows: the semiconductor device is transported to a device processing system arranged on each station to be processed by the all-in-one machine. The all-in-one machine comprises a machine body and each device processing system, wherein the machine body is provided with a main turret system and a laser marking turret system respectively with 16 working positions; each station of the main turret system is provided with a suction nozzle mechanism for picking, placing and transporting the device; the main turret system is also provided with a suction nozzle pressing mechanism; each station of the laser marking turret system is provided with a device transmission mechanism; and the suction nozzle mechanism and the device transmission mechanism successively transmit the semiconductor device to each device processing system to finish one-stop continuous processing.; By the implementation of the invention, various functions such as testing, sorting, marking, braiding, outputting and the like which originally need to be finished by various equipment are finished on one equipment, thus saving cost and improving working efficiency.

When the semiconductor devices are transferred from one rotary table to the other, the semiconductor devices may be damaged during the transferring process and a faster operation speed will incur more damaged semiconductor devices. The main drawback of the two patents is that the feeding device is arranged in a way such that each semiconductor devices being transferred from a rotary taping table to a rotary testing table for testing purpose, and then the tested semiconductor devices being transferred back to the taping table for packaging purpose. As a result, the two transferring processes greatly limit the operation speed of the machine. Furthermore, the time duration of the testing process may vary by the type of the semiconductor device, some types of semiconductor device may require longer testing duration. Consequently, the rotation speed of the rotary tables must be reduced to compensate the time loss from the testing process and eventually reduces the productivity of the machine.

Therefore, a need exist for the prior machines to be capable of adjusting the operation speed to compensate the time loss from the testing process without the need of reducing the production rate and the present invention provides such an apparatus.

SUMMARY OF INVENTION The invention provides an apparatus for testing and taping semiconductor devices comprises at least two rotary testing tables, each carrying at least one testing station for testing the semiconductor devices, a feeding means associated to each testing tables for feeding the semiconductor devices to its designated testing table, a rotary taping table carrying at least one taping device for taping the semiconductor devices, means for transferring the semiconductor devices from the testing tables to the taping table, wherein the transfer of the semiconductor devices from the testing tables to the taping table are synchronized in a way such that the semiconductor devices do not stack on the taping table. Furthermore, the rotary testing tables rotate at a rate slower than the rotary taping table (300) so that the residence time of the semiconductor device during the testing operation can be adjusted.

In one embodiment of the invention, the system further includes means for detecting the orientation of the semiconductor devices. In another embodiment of the invention, the system further includes means for adjusting the orientation of the semiconductor devices.

Yet in another embodiment of the invention, the system further includes one or more bins for retrieving the semiconductor devices.

Advantageously, the feed is coupled with means for transferring the semiconductor devices from the feed to its designated rotary testing tables, wherein the transferring means is a mechanical arm configured to pick and place the semiconductor device from the feed to its designated rotary table.

One skilled in the art will readily appreciate that the invention is well adapted to carry out the objects and obtain the ends and advantages mentioned, as well as those inherent therein. The embodiments described herein are not intended as limitations on the scope of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS For the purpose of facilitating an understanding of the invention, there is illustrated in the accompanying drawing the preferred embodiments from an inspection of which when considered in connection with the following description, the invention, its construction and operation and many of its advantages would be readily understood and appreciated.

Figure 1 is a plan view of an apparatus for testing and taping semiconductor device which embodies therein the principle features of the invention. Figure 1A is an enlarge view of a section of the apparatus. DETAILED DESCRIPTION OF THE INVENTION

The invention will now be described in greater detail, by way of example, with reference to the drawings.

Referring to the figures, an overall view of the apparatus as illustrated therein comprises a pair of self-aligned vibration feeding stations (101, 201), each having a channel (102, 202) extending to a first (103) and second (203) transferring point adjacent a first (100) and second (200) rotary testing table, a mechanical arm (104, 204) being provided at the distal end of each channel (102, 202), configured to pick a semiconductor device from the end section of each channel (102, 202) and then place on the first (100) or second (200) testing table, when the first (100) or second (200) testing table receives the semiconductor device, it intermittently rotates and transfers the semiconductor device to a rotary taping table (300), a plurality of conveying blocks are disposed along the periphery of each rotary table (100, 200, 300), each for carrying a semiconductor device. The apparatus is also provided with means (106, 206, 301) for adjusting the orientation of the semiconductor module, means (107, 207) for testing the semiconductor device, and means (304, 305, 306, 307, 308) for taping the semiconductor device, sequentially arranged along the periphery of the rotary tables (100, 200, 300).

Preferably, at least one open short checking station (105, 205) or polarity vision checking station is provided on the first (100) and second (200) testing tables, configured to check the orientation of the semiconductor device, at least one turner device (106, 206) is provided on the first (100) and second (200) testing tables, configured to turnover or to adjust the orientation of the semiconductor devices, at least one testing station (107, 207) is provided on the first (100) and second (200) testing tables, configured to test the semiconductor devices, at least one taping device (304, 305, 306, 307, 308) is provided on the taping table (300), configured to pack the tested semiconductor devices.

In addition, the apparatus may further comprise at least one rejection bin for collecting rejected semiconductor devices, at least one clear bin (303) for retrieving and clearing the semiconductor devices from a rotary table (100, 200, 300), a plurality of sorting bins, each disposed at a different location, for retrieving the semiconductor devices of different qualities so that the semiconductor devices can be sorted according to their tested quality, and at least one vision imaging station (302) for inspecting the semiconductor device.

In operation, the first (100) and second (200) testing tables are fed with the semiconductor devices by the mechanical arms (104, 204) from each corresponding self-aligned vibration feeding stations (101, 201). Then, the semiconductor devices on the first (100) and second (200) testing tables are conveyed to their corresponding open short checking station (105, 205) or polarity vision checking station for checking if each semiconductor device is seated at a right orientation. Next, the semiconductor devices are conveyed to their corresponding turner device (106, 206) for adjusting the orientation. If the semiconductor device is seated at the correct orientation, the operation of the turner device (106, 206) will not be triggered. Later on, the semiconductor devices are conveyed to their corresponding testing station (107, 207) for testing the quality of the semiconductor device. The tested semiconductor devices are then further conveyed to their corresponding transferring point (400, 500) where a conveying unit of the first (100) or second (200) testing table and a conveying unit of the taping table (300) are displacedly aligned while both of rotary tables transiently stop and permitting the semiconductor device to be held by the corresponding conveying unit of the taping table (300) through suction. On the taping table (300), the tested semiconductor devices are conveyed to the taping stations (304, 305, 306, 307, 308). Depending on user requirement, a turner device (106, 206), a passive precision device (301), and open short checking station (105, 205) or polarity vision checking station can be provided and arranged before the taping stations (304, 305, 306, 307, 308) for checking and adjusting the orientation of the semiconductor device. A control panel (600) coupled with a display and input means can be provided to govern the entire operation.

The purpose of introducing the second testing table (200) is to enable the rotational speed of each rotary table (100, 200, 300) to be adjustable in a way such that the input rate of the taping table (300) can be maintained or even improved while the rotational speed of the first (100) and second (200) testing tables is being reduced to increase the time duration for testing. Also, the transfer of the semiconductor devices from the first (100) and second (200) testing tables to the taping table (300) is synchronically operated so that the semiconductor devices of the first (100) and second (200) testing tables do not stack with those on the taping table (300).

The present disclosure includes as contained in the appended claims, as well as that of the foregoing description. Although this invention has been described in its preferred form with a degree of particularity, it is understood that the present disclosure of the preferred form has been made only by way of example and that numerous changes in the details of construction and the combination and arrangements of parts may be resorted to without departing from the scope of the invention.

Claims

1. An apparatus for testing and taping semiconductor devices comprising:

at least two rotary testing tables (100, 200), each carrying at least one testing station (107, 207) for testing the semiconductor devices;

a feeding means (101, 201) associated to each testing tables (100, 200) for feeding the semiconductor devices to its designated testing table (100, 200);

a rotary taping table (300) carrying at least one taping device (304, 305, 306, 307, 308) for taping the semiconductor devices;

means (400, 500) for transferring the semiconductor devices from the testing tables (100, 200) to the taping table (300);

wherein the transfer of the semiconductor devices from the testing tables (100, 200) to the taping table (300) are synchronized in a way such that the semiconductor devices do not stack on the taping table (300).

2. An apparatus according to claim 1, wherein the rotary testing tables (100, 200) rotate at a rate slower than the rotary taping table (300) so that the residence time of the semiconductor device during the testing operation can be adjusted.

3. An apparatus according to claim 1 or claim 2, wherein a testing station (107, 207) being provided on the rotary taping table (300).

4. An apparatus according to any one of claim 1 to 3, further comprising means (105, 205) for detecting the orientation of the semiconductor devices.

5. An apparatus according to any one of claims 1 to 4, further comprising means (106, 206, 301) for adjusting the orientation of the semiconductor devices.

6. An apparatus according to any one of claims 1 to 5, further comprising one or more bins (303) for retrieving the semiconductor devices.

7. An apparatus according to any one of claims 1 to 6, wherein each feed (101, 201) is coupled with means (104, 204) for transferring the semiconductor devices from the feed (101, 201) to its designated rotary testing table (100, 200).

8. An apparatus according to claim 7, wherein the transferring means (104, 204) is a mechanical arm configured to pick and place the semiconductor device from the feed ( 101 , 201 ) to its designated rotary testing table ( 100, 200) .