JP2003209157A - Method and device for handling leadless semiconductor element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To raise a work index which tapes by a taping machine by dicing each leadless semiconductor element from a resin mold substrate formed in a state that a plurality of leadless semiconductor elements are connected. <P>SOLUTION: In a state that a resin mold substrate formed in a state that a plurality of leadless semiconductor elements are connected is adhered to a sheet, the resin mold substrate is diced and divided into respective leadless semiconductor elements, and in a state that each leadless semiconductor element is held in an alignment state and adhered to a sheet, the measurement of characteristics is carried out. Further, the result of the measurement of characteristics is stored in a memory, and only non-defective leadless semiconductor elements selected based on the result of the measurement of characteristics are picked up by being peeled off from the sheet sequentially to be transferred to a predetermined position for taping. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing sheet in which a large number of connected leadless semiconductor elements having electrode terminals exposed on the surface of a resin mold package are attached to a dicing sheet and after dicing between the leadless semiconductor elements. The present invention relates to a processing method and a processing apparatus for a leadless semiconductor element in a manufacturing system for picking up a leadless semiconductor element from a dicing sheet and packing it in a tape.

[0002]

2. Description of the Related Art Demand for CSP (Chip Size Package or Chip Scal) is increasing due to the spread of portable computers.
Leadless semiconductor devices such as e Package) are shown in Fig. 9 (A).
, A large number of leadless semiconductor elements 1, 1 ... Are formed on a single resin-molded substrate 100 in a connected state, and the resin-molded substrate 100 is formed between the semiconductor elements 1, 1 in the X and Y directions. Dicing lines 102, 10
3 is cut and separated by a dicing saw (not shown) along 3 to form an individual leadless semiconductor in which a large number of electrode terminals 1b are formed on the surface of a resin mold package 1a as shown in FIG. 9B. Element 1 is being manufactured.

A process flow for taping the leadless semiconductor element 1 from the resin-molded substrate 100 will be described with reference to FIG. 10. First, a thin plate in which a large number of leadless semiconductor elements 1 are formed in high density in series. A resin-molded substrate 100 having a shape is manufactured (A), the resin-molded substrate 100 is attached to an adhesive dicing sheet (B), and the peripheral edge of the dicing sheet is fixed to a metal flat plate ring. The individual leadless semiconductor chips 1 are diced (C), the leadless semiconductor elements 1 are separated from the dicing sheet (D), aligned on an alignment tray (E), and the leadless semiconductor elements 1 are picked up by a vacuum suction nozzle or the like. (F), electrical characteristics are measured with a characteristic measuring device (G), and one side of the front and back is visually inspected (H). (I), the other surface is visually inspected (J), and it is selected based on the electrical characteristic rank and the appearance inspection result (K), and the model name, product number, etc. are stamped according to the quality rank (L). Taping (M).

That is, the leadless semiconductor chips 1 manufactured by being individually cut in the dicing process are separated from the dicing sheet and separated, and are individually subjected to complex processing such as characteristic measurement, appearance inspection, and marking. Then, as shown in FIG. 11, the leadless semiconductor chip 1 is attached to the embossed portion 202 of the embossed tape 201 having the embossed portion 202 and the index holes 203 for each quality rank.
After they are housed one by one, a cover tape 204 is attached onto the embossed tape 201 and shipped as a so-called taping package 200.

By the way, conventionally, a leadless semiconductor device 1 finely divided into millimeter sizes on a dicing sheet is used.
Peel each piece from the dicing sheet, align a large number of pieces on an alignment tray (not shown), and send the leadless semiconductor devices 1 one by one from the alignment tray to a characteristic measuring device of a composite processing facility (not shown) when necessary. Finally, non-defective products are tape-packaged with a taping machine (not shown). Alternatively, individual leadless semiconductor elements 1 are collected from the dicing sheet into a parts feeder (not shown), and when necessary, the leadless semiconductor elements 1 are aligned with the parts feeder and sent to a composite processing facility for tape packaging. .

[0006] However, the above-mentioned complex processing equipment has a measuring device for positioning one or a plurality of semiconductor elements taken out from an alignment tray or a parts feeder to measure the characteristics, and a product number or the like on the resin package surface of each semiconductor element. A marking device for marking with a laser is continuously arranged on the floor of the factory, and a taping machine is arranged at the end of these devices.

Although not intended for small electronic components such as leadless semiconductor devices, a similar complex processing facility, for example, a plurality of types of turntables disclosed in Japanese Patent No. 531006 is disclosed. There is a manufacturing facility in which

[0008]

However, as described above, in the case of the manufacturing system in which the individual leadless semiconductor elements are aligned by the alignment tray or the parts feeder and sent to the composite processing facility, the individual leads separated from the dicing sheet are used. It is necessary to have a transfer facility and a work process for transferring the less semiconductor devices to the alignment tray and the parts feeder, and this work process lowers the work index of the entire manufacturing system and makes it possible to correspond inline with the preceding process of the composite processing process. Making it difficult. Further, since the individual leadless semiconductor elements are handled separately in the working process, the resin package of the semiconductor device is cracked, chipped, or soiled due to vibration or impact during the working process, and the leadless semiconductor is packaged in taping. The yield of the device may decrease.

Further, in the complex processing equipment in which a plurality of kinds of turntables are continuously arranged, electronic components are sucked and held by vacuum suction nozzles arranged at a predetermined interval on the peripheral portion of each turntable, and upstream. It is a facility that sequentially sends from the side turntable to the downstream turntable, performs desired processing such as characteristic measurement on each turntable, and finally packages by taping with a taping machine.

The electronic parts sent to this composite processing facility are SOP (Smal) in which leads are led out from a resin package.
l Outline package) and other surface-mounting semiconductor components, and the first turntable of the composite processing facility via a dedicated feed mechanism with each electronic component that leads derived from the resin package supported by the lead frame. Be delivered to.

In such a turntable type composite processing facility, the lead frame can be handled like the above-mentioned alignment tray, which is not a problem, but the above-mentioned millimeter-sized lead manufactured without using the lead frame. In the case of a target semiconductor device, it is difficult to handle a resin package substrate on which a large number of leadless semiconductor devices are formed with high density like a lead frame. Therefore, as described above, the leadless semiconductor elements individually cut from the resin package substrate are aligned in a dedicated alignment tray and fed to the first turntable of the composite processing facility. The above problems remain due to the use of alignment trays.

In addition, in order to measure the characteristics of the divided leadless semiconductor elements one by one on the turntable, it is indispensable to position the leadless semiconductor elements with a highly accurate positioning in order to align them with the probe position of the measuring device. Therefore, there is a problem that the number of work steps for this positioning increases.

Therefore, it is an object of the present invention to provide a processing method and a processing apparatus which are suitable for a miniaturized leadless semiconductor device and have a high throughput.

[0014]

According to the processing method of the present invention for achieving the above object, a large number of leadless semiconductor elements in a connected state are attached to a dicing sheet to form a dicing sheet unit, which is in a connected state. A dicing step of cutting between the leadless semiconductor elements, and measuring the characteristics of the individual leadless semiconductor elements attached while holding the aligned state on the dicing sheet, and measuring the characteristics by storing the measurement results in a storage unit. A step of picking up a non-defective leadless semiconductor element based on the characteristic measurement result from the dicing sheet, a transfer step of transferring the picked up leadless semiconductor element by a transfer means, and a transfer step transferred from the transfer means And a taping process for taping and packaging the leadless semiconductor device. To have.

Here, the dicing sheet unit is an existing product used for dicing a semiconductor wafer, and the method of the present invention uses it as a dicing sheet unit for dicing a resin mold substrate instead of the semiconductor wafer. That is, the leadless semiconductor element is a millimeter-sized chip component packaged in resin such as CSP.
A large number of resin-molded substrates are manufactured at once,
After printing the model name, etc. on the side opposite to the electrode terminal formation surface, it is attached to an expandable dicing sheet having adhesiveness, and the peripheral portion of the dicing sheet is fixed to the metal flat plate ring, and The mold substrate is diced and divided into a plurality of leadless semiconductor elements.

Further, as described above, the characteristics of the individual leadless semiconductor elements are divided into individual leadless semiconductor elements by dicing, and are attached to the dicing sheet while maintaining their aligned state. As the measurement is performed, the characteristic measurement result is stored in the storage unit.

Individual leadless semiconductor elements manufactured by using this dicing sheet are made into a dicing sheet unit while maintaining an aligned state without being peeled off from the dicing sheet as in the conventional case, and this dicing sheet unit is used as a lead in processing equipment. Used as a supply means for a semiconductor device.

Then, based on the characteristic data stored in the storage unit, good leadless semiconductor elements are picked up one by one from the dicing sheet unit, transferred to a predetermined position by the transfer means, and taped and packaged one by one. By doing so, the processing of a small leadless semiconductor device can be performed accurately and with a high index. A vacuum type suction nozzle is desirable as a pickup means for the leadless semiconductor element from the dicing sheet unit, and a turntable having the suction nozzle is desirable as a means for transferring the leadless semiconductor element from the dicing sheet unit.

That is, in the processing method of the present invention, the individual leadless semiconductor elements are cut and separated from the resin-molded substrate, and then the individual leadless semiconductor elements are separated into individual pieces, which are sequentially used in the characteristic measuring apparatus, as in the prior art. Rather than transfer and measure the characteristics, many leadless semiconductor elements connected to one resin mold substrate are cut and separated into individual leadless semiconductor elements by a dicing process, and then attached to a dicing sheet. The characteristic measurement is performed while maintaining the aligned state, and the characteristic measurement result is stored in the storage unit. Based on the stored data (characteristic measurement result), only the good leadless semiconductor element is stored. They are picked up and packed in taping.

As a result, the characteristic measurement can be performed in a state in which a large number of leadless semiconductor elements are aligned, that is, in a state in which a large number of leadless semiconductor elements are arranged in a matrix. Compared to the case of performing the characteristic measurement of the leadless semiconductor element in the open state, the highly accurate positioning required when moving the discrete leadless semiconductor elements one by one to the characteristic measurement position and performing the characteristic measurement becomes unnecessary. Therefore, the work index can be significantly speeded up.

Further, the processing method of the present invention may include a step of extending the dicing sheet of the dicing sheet unit to separate the leadless semiconductor elements after the characteristic measuring step.

As described above, by extending the dicing sheet to which the leadless semiconductor elements individually separated by dicing are attached and separating the individual leadless semiconductor elements, the individual leadless semiconductor elements are separated from the dicing sheet. It is possible to prevent adjacent leadless semiconductor elements from being peeled off when picked up by vacuum peeling with a vacuum suction nozzle.

Further, the processing method of the present invention may include a step of inspecting the external appearance of either the front surface or the back surface of the leadless semiconductor element being transferred by the transfer means.

The appearance inspection step is performed by, for example, a CCD camera, and the leadless semiconductor element determined to be defective by the appearance inspection is ejected from the transfer means by an appropriate ejection means. Therefore, only non-defective leadless semiconductor elements are transferred to the downstream side of the transfer means.

Further, the processing method of the present invention may include a step of inverting the leadless semiconductor element transferred from the transfer means.

That is, the leadless semiconductor element attached to the dicing sheet is held with the electrode terminals facing upward. Therefore, when the transfer means is transferred in that posture and the transfer means is transferred from the transfer means to the taping machine in that posture, the electrode terminals are naturally taped in an upward posture. However, in this type of leadless semiconductor element, so-called face-down bonding is performed, that is, the mounting surface on which the electrode terminals are formed is faced down, that is, so-called face-down bonding is performed.

Therefore, by providing a step of reversing the leadless semiconductor element transferred from the transfer means, the leadless semiconductor element is easily face-down bonded, and the electrode terminals are converted into a downward posture. Since it can be packaged by taping, in the bonding process of the leadless semiconductor element, the leadless semiconductor element can be picked up and bonded from the taping package with a vacuum suction nozzle or the like with its mounting surface facing down. .

Further, the processing method of the present invention may include a step of inspecting the appearance on the side opposite to the appearance inspection surface of the leadless semiconductor element during the front / back inversion step.

That is, in the appearance inspection of the leadless semiconductor element being transferred by the transfer means, only one of the front and back surfaces of the leadless semiconductor element, for example, the appearance of the back surface on which the electrode terminals are not formed can be inspected. Therefore, in the front / back inversion process, by performing a visual inspection on the side opposite to the visual inspection surface of the leadless semiconductor element being transferred by the above-described transfer means, for example, the mounting surface side on which the electrode terminals are formed, It is possible to eliminate the poor appearance.

The processing apparatus of the present invention which achieves the above object,
In the previous dicing process, resin-molded substrates with a large number of connected leadless semiconductor elements are attached to a dicing sheet, and the leadless semiconductor elements in the dicing sheet unit are diced and the individual leadless semiconductor elements are aligned. The measurement of the characteristics of the leadless semiconductor element is performed while the characteristic measurement process is performed while the characteristic measurement is performed in the state of being adhered to the sheet in the storage unit. In the apparatus, a reading unit for reading out stored characteristic measurement results of individual leadless semiconductor elements attached in an aligned state on the dicing sheet, and the individual leadless semiconductor elements in an aligned state on the dicing sheet. Support the attached dicing sheet unit in a detachable manner, and leadless half Among the body elements, a supply table for moving a non-defective leadless semiconductor element to a predetermined pickup position based on the reading result of the reading unit, and the leadless semiconductor element is tape-packaged at a fixed position apart from the supply table. A taping machine and a transfer means arranged between the supply table and the taping machine are provided, and the transfer means detachably holds the leadless semiconductor elements at the peripheral edge equidistant positions to transfer the leadless semiconductor elements. It is characterized by having a handling mechanism for

Here, the characteristic measurement step of storing the characteristic measurement result and the characteristic measurement result performed in the previous step and the dicing step may be carried out by independent equipments, respectively.
Alternatively, it may be implemented in a complex facility. That is, in a dicing sheet unit state in which a resin mold substrate to which a large number of leadless semiconductor elements are connected is attached to a dicing sheet and the peripheral portion is fixed to a metal flat plate ring, after dicing with a single dicing device, a single dicing device is used. While performing the characteristic measurement in the characteristic measuring device, the characteristic measurement result may be stored in the storage unit, or after dicing in a combined processing facility having a dicing mechanism unit and a characteristic measuring unit, the individual leadless semiconductor elements You may make it implement a characteristic measuring process.

As the supply table for supporting the dicing sheet unit on which the above-mentioned dicing step and characteristic measuring step have been carried out, an XY-θ table which is movable in the front-back and left-right directions and rotatable in a horizontal plane is applied. The dicing sheet unit is positioned and mounted on the
By moving the supply table forward, backward, leftward, rightward, and in the θ direction, individual leadless semiconductor elements are sequentially sent to a predetermined pickup position and picked up by the handling mechanism of the turntable.

Here, since the device of the present invention is provided with the reading section for reading the stored data in which the characteristic is measured in the previous step and the result is stored, the leadless of the non-defective product is read based on the read stored data. Only the semiconductor elements are sequentially sent one by one to a predetermined pickup position and picked up by a turntable handling mechanism. For this reason, it is possible to eliminate the waste of sending the defective leadless semiconductor elements one by one to the predetermined pick-up position one by one as in the conventional case, and further improve the processing speed.

Further, in the processing apparatus of the present invention, the supply table may have a sheet extending mechanism for extending the dicing sheet of the supported dicing sheet unit to separate the plurality of leadless semiconductor elements.

That is, since the dicing sheet is extended by using the sheet extension mechanism provided on the supply table so as to separate the laser dressing semiconductor elements from each other, the dicing sheet unit is carried into the supply table and then the dicing is performed. The sheet can be extended, in other words, the dicing sheet unit before the dicing sheet is extended can be carried into the supply table, and the dicing sheet unit can be easily handled.

Further, the processing apparatus of the present invention may be provided with an appearance inspection section near the transfer means for inspecting the appearance of one surface of the leadless semiconductor element held by the transfer means.

That is, even if the semiconductor device is a good product in the characteristic measurement, if the resin mold package is cracked or the mold resin is not sufficiently spread in the mold during resin molding, If a recess is formed, water may enter from the cracks or the recess during use, resulting in malfunction, so such defective products cannot be shipped. The appearance inspection of the package can be performed to remove the leadless semiconductor device having a defective appearance.

In the processing apparatus of the present invention, a front / back reversing device for reversing the front / back of the leadless semiconductor element can be arranged between the transfer means and the taping machine.

In this way, the leadless semiconductor elements are transferred one by one on the turntable, and only the good leadless semiconductor elements whose appearance has been inspected are inverted by the obverse / invertible reversing mechanism section. The back surface of the less semiconductor element on which the electrode terminals are not formed is the upper side. Therefore, when the leadless semiconductor element packaged in taping is unpacked, the leadless semiconductor element has the mounting surface side where the electrode terminals are formed on the lower side.
It can be sucked as it is by a vacuum suction nozzle or the like to perform face-down bonding on a bonding substrate or the like.

The processing apparatus of the present invention can also be provided with an appearance inspection section for inspecting the appearance of the other surface of the leadless semiconductor element in the vicinity of the front-back inverting device.

That is, in the appearance inspection apparatus for the leadless semiconductor element during transfer by the turntable, only one of the front and back sides of the leadless semiconductor element, for example, the turntable is the surface of the leadless semiconductor element (electrode terminal formation). With the one that sucks and transfers the side surface), only the appearance of the back surface of the leadless semiconductor element can be inspected, but by providing an appearance inspection section for inspecting the appearance of the leadless semiconductor element in the vicinity of the front / back inversion mechanism section, It is possible to inspect the appearance of the surface (mounting surface on which the electrode terminals are formed) opposite to the appearance inspection surface of the leadless semiconductor element during transfer by the turntable, and to inspect the appearance of both front and back surfaces of the resin mold package. Will be possible.

[0042]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a method for processing a leadless semiconductor device according to the present invention is shown in the process flow of the processing method of FIG. 1 and will be described in detail below. In FIG. 1, steps surrounded by solid lines indicate essential steps of the present invention, and steps surrounded by broken lines indicate steps that are added as necessary.

In the processing method shown in FIG. 1, a resin mold substrate 100 (see FIG. 9) having a large number of leadless semiconductor elements (hereinafter referred to as semiconductor elements) 1 formed in a connected state is manufactured (A). The resin mold substrate 100 is attached to a dicing sheet (hereinafter referred to as a sheet) (B), and a peripheral portion of the sheet is a metal flat plate ring (hereinafter referred to as a ring).
In the state of the dicing sheet unit (hereinafter referred to as a unit) fixed to the semiconductor device, if necessary, all semiconductor devices 1 are marked with a model name (C), and the semiconductor devices 1 and 1 are diced (D). The characteristic measurement is performed while 1 is attached to the sheet in an aligned state, and the characteristic measurement in which the measurement result is stored in the storage unit is performed (E), and the sheet is extended as necessary to expand the semiconductor element. 1 and 1 are separated from each other (F), and a good semiconductor element 1 based on the stored data.
Only the only one is sucked with a vacuum type suction nozzle and peeled from the sheet and picked up at the same time (G), and one of the front and back sides of the semiconductor element 1 is inspected for appearance (visual inspection A) (H). According to the above, the front and back of the semiconductor element 1 are reversed (I), and if necessary, the side opposite to the side already subjected to the visual inspection is subjected to the visual inspection (visual inspection B) (J),
As a result of the above-mentioned appearance inspection, only the good semiconductor element 1 is taped (K).

FIG. 1 is a process flow chart of the present invention shown in FIG.
Compared with the conventional process flow chart shown in FIG. 0, conventionally, the semiconductor element 1 was peeled from the sheet to be in a separated state and then picked up to measure the characteristics. It is clear that the characteristics of the adhered semiconductor element 1 while maintaining the aligned state are measured, and then the treatment methods of peeling from the sheet and picking up at the same time are different.

The processing method of adding the dicing sheet extending step (F) corresponds to the invention of claim 2. In addition, the first appearance inspection process (appearance inspection A)
The processing method of adding (H) corresponds to the invention of claim 3. Further, the processing method of adding the front and back reversing step (I) corresponds to the invention of claim 4. Also. The processing method of adding the second appearance inspection step (appearance inspection B) (J) corresponds to the invention of claim 5. Any one of the above-mentioned addition steps may be added selectively, or two or more of them may be selected and added (including all).

FIG. 2 shows a schematic block diagram of the processing apparatus of the present invention, FIG. 3 shows a schematic configuration plan view of the processing apparatus of the present invention, and FIG. 4 shows a schematic configuration front view. In FIG. 2, thick arrows indicate the flow of leadless semiconductor elements, especially good semiconductor elements, and thin arrows indicate the flow of characteristic measurement result data or defective semiconductor elements. First, in the previous step, a resin mold substrate 1 in which a large number of semiconductor elements 1 are connected
00 (see FIG. 9) is manufactured, and this resin molded substrate 10
0 is attached to a sheet to form a unit, and the resin mold substrate 100 attached to this sheet is used for the dicing apparatus 1
After dicing by 0, the individual semiconductor elements 1 and 1 separated by this dicing are characteristically measured by the characteristic measuring device 20 while being kept in the aligned state and being adhered to the sheet, and The measurement result is stored in the storage unit 30 together with the address. This pre-process is carried out in the equipment surrounded by the broken line in FIG.

In the apparatus of the embodiment of the present invention, the unit for which the dicing and the characteristic measurement have been completed is set, and the characteristic measurement which is the stored data stored in the storage unit 30 by the sheet extension mechanism 40A and the characteristic measuring apparatus 20 is performed. The reading unit 40B for reading out the result together with the address is provided, and the sheet of the set unit is extended and
Based on the stored data read by the reading unit 40A, a supply table 40 that sequentially transfers only the good semiconductor elements 1 to the pickup position, and a handling mechanism that sequentially picks up the good semiconductor elements 1 transferred to the pickup position. Means for transporting 5
0, for example, a turntable, a visual inspection unit 60A arranged near the transfer unit 50 for inspecting the external appearance of the semiconductor element 1, and a discharging unit 70A for discharging defective semiconductor elements from the transfer unit 50 as a result of the visual inspection. , A front / back reversing device 80 for reversing the front and back of a good semiconductor device 1, a visual inspection unit 60B arranged near the front / back reversing device 80 for inspecting the external appearance of the semiconductor device during the front / back reversal, and the visual inspection result. A discharge unit 70B for discharging the semiconductor device determined to be defective from the transfer means 50 and a taping machine 90 for taping and packing the non-defective semiconductor device 1 which has been turned upside down are continuously arranged.

Next, the operation of the above processing apparatus will be described. First, in a previous step, a resin mold substrate 100 (see FIG. 9) in which a large number of semiconductor elements 1 are connected is attached to a sheet 2 and its peripheral portion is fixed to a ring 3 to form a unit 4. This unit 4 has a seat 2 and a ring 3, and the periphery of the seat 2 is fixed to the ring 3 so that the seat 2
A resin mold substrate 100 having a plurality of semiconductor elements 1, ...
The resin mold substrate 100 attached to the sheet 2 of the unit 4 is diced by the dicing device 10 to be separated into each semiconductor element 1.

Next, in the same step as the previous step following the dicing step, the electric characteristics of the individual semiconductor elements 1 individually separated by dicing and attached to the sheet 2 while maintaining the aligned state are shown in FIG. The measurement is performed by the measuring device 20, and the characteristic measurement result is stored in the storage unit 30 together with the address. When measuring this characteristic, a large number of semiconductor elements 1,
, Are held on the sheet 2 in an aligned state, the position can be easily adjusted by the X and Y stages which are fed at a constant pitch in the X and Y directions, and the characteristics of the semiconductor elements 1, ... It is not necessary to position the device with high accuracy. The above is the pre-process until the supply to the device of the present invention.

The unit 4 to which a large number of semiconductor elements 1 having the characteristics measured by the characteristic measuring device 20 and the measurement results stored in the storage unit 30 are attached is the supply table 40.
The sheet 2 is extended by the sheet extension mechanism 40A provided on the supply table 40 and the space between the individual semiconductor elements 1 and 1 is expanded.

The supply table 40 is composed of an XY-θ table which is movable back and forth and left and right in a horizontal plane and is rotatable, and a plurality of semiconductor elements 1, 1 ... Are attached to the sheet 2 at appropriate intervals. Put on the ring 3 around the periphery of the seat 2.
The unit 4 held by is detachably supported. By moving the supply table 40 back and forth, left and right and rotating in the θ direction, one or more, for example, one semiconductor element 1 is supplied to a predetermined pickup position Pa, and the semiconductor element 1 is transferred at this position Pa. It is picked up by a vacuum type suction nozzle, which is a handling mechanism of.

Here, as described above, the supply table 40 is provided with the reading section 40B for reading out the characteristic measurement result measured by the characteristic measuring apparatus 20 in the previous step and stored in the storage section 30. The measurement result is read by the section 40B, and only the semiconductor device 1 having a good characteristic measurement result is transferred to a predetermined pickup position Pa, and at this position Pa, the good semiconductor device 1 is picked up by a suction nozzle or the like of the transfer means 50. As a result, the defective semiconductor element 1 can be skipped and picked up, and the total pick-up time of each unit 4 can be shortened.

The reading unit 40B may be, for example, a unit for directly reading the storage data transferred from the storage unit 30, or the storage data in the storage unit 30 may be temporarily stored in a floppy (registered trademark) disk, an IC card, or the like. The stored data may be read from these media after being stored in the media. It is preferable that the reading unit 40B includes a storage unit that temporarily stores the rolling data or the data stored in the medium.

The unit 4 has a seat 2 and a ring 3, and the periphery of the seat 2 is fixed to the ring 3 so that the seat 2
A plurality of semiconductor elements 1, ... Are attached in a matrix at the center of the. A plurality of units 4 are stored in a magazine 41 so that they can be taken in and out, and individual units 4 are sequentially cut out from the magazine 41 on the supply table 10 and positioned and held.

The unit 4 is provided on the supply table 40.
Is provided with a sheet extending mechanism 40B that extends the sheet 2 to expand the interval between the adjacent semiconductor elements 1, 1.
The seat extension mechanism 40B is a mechanism in which an extension table (not shown) is arranged below the seat 2 and the ring 3 of the unit 4 is lowered to press the lower surface of the central portion of the sheet 2 against the sheet extension table. , The plurality of semiconductor elements 1, 1 ... Affixed on the sheet 2 as shown in FIG. 5 (A) are expanded by radiating the sheet 2 in all directions as shown in FIG. 5 (B). The interval between the adjacent semiconductor elements 1, 1 ... Widens.

When the supply table 40 is moved while the sheet 2 of the unit 4 supplied on the supply table 40 is extended to move only the good semiconductor element 1 to the pickup position Pa, as shown in FIG. As shown in C), the push-up pin 42 arranged at the pickup position Pa pushes up the good semiconductor element 1 from below,
By reducing the adhesive area between the semiconductor chip 1 and the sheet 2, the adhesive force is reduced so that the suction nozzle 51 can easily separate from the sheet 2.

The semiconductor element 1 shown in FIG. 5 has a plurality of electrode terminals 1b formed on the upper surface of the millimeter-sized rectangular chip-shaped resin mold package 1a, as described above.
GA (Ball Grid Array) type or LGA (Land
It is a Grid Array) type leadless chip component (CSP). The electrode terminals 1b of the semiconductor element 1 are solder balls, gold-plated or solder-plated electrodes, and the semiconductor element 1 is mounted on a printed circuit board or the like with the surface on which the electrode terminals 1b are present facing down. The surface on which the electrode terminal 1b is present is called the mounting surface, and the opposite surface is called the molding surface.

On the lower surface of the peripheral portion of the turntable 50 shown as an example of the transfer means arranged between the supply table 40 and the taping machine 90, the semiconductor elements 1 can be attached and detached one by one at equal distribution positions in the circumferential direction. A suction nozzle 51 which is connected to a handling mechanism, for example, a vacuum system, and vacuum-sucks the central portion of the mounting surface or the molding surface of the semiconductor element 1.
Have.

The turntable 50 is the suction nozzle 5
The suction nozzles 51 are intermittently rotated at an arrangement pitch of 1 and the suction nozzles 51 are sent to the pickup position Pa one by one. Figure 5
As shown in (C), the suction nozzle 5 of the turntable 50
1 is downward, and when moved to the pickup position Pa, the lower end of the suction nozzle 51 vacuum-sucks the central portion of the mounting surface of one semiconductor element 1 of the supply table 40, and the semiconductor element 1 is peeled from the sheet 2. Along with picking up.

Such a pickup operation is shown in FIG.
The sheet 2 is extended as shown in FIG.
By pushing up the semiconductor element 1 with the push-up pin 42 as shown in (C), the adhesive area and / or the adhesive force of the semiconductor element 1 to the sheet 2 can be reduced, and it can be performed easily and reliably with a high index. . Further, the unit 4 supplied to the supply table 40 is moved to the supply table 40 as it is after completion of the dicing process {FIG. 1 (A)}, and is used as a semiconductor element supply means to the processing equipment. After dicing, it is not necessary to move the separated semiconductor elements 1 to an alignment tray or the like, and it is easy to improve the work index from being supplied to the supply table 40 to taping in the taping machine 90.

Further, since the semiconductor element 1 is directly transferred from the sheet 2 of the supply table 40 to the suction nozzle 51 of the turntable 50, and the individual semiconductor elements 1 are not treated as individual pieces, the turntable 50 or the turntable 50 is turned on. The possibility that the semiconductor element 1 will be cracked or chipped due to vibration or shock during the movement from the table 50 to the front-back inverting device described later is drastically reduced. As a result, the yield of semiconductor devices finally packaged by taping improves.

Below the appearance inspection position Pb where the turntable 50 rotates intermittently, an appearance inspection section 60A for inspecting the appearance of the semiconductor element 1 is arranged. The appearance inspection unit 60A is composed of, for example, a CCD camera.
This appearance inspection position Pb or turntable 50
At the discharge position Pc, which is further rotated intermittently, the discharge portion 70A for discharging the defective semiconductor element 1 determined to be defective as a result of the appearance inspection is arranged.

The discharge section 70A may be mechanically structured by a chuck claw or the like. For example, a vacuum suction of the suction nozzle 51 is cut off, or a non-contact type discharge section that blows compressed air when the vacuum suction is cut off. It is desirable to do. As a result, the discharge operation time is significantly shortened,
The work index is significantly improved.

When the suction table 51 that has sucked the semiconductor element 1 is moved to the delivery position Pd by the intermittent rotation of the turntable 50, the turntable 50 is moved so that the adjacent suction nozzle 51 at the same position Pd moves to the discharge position Pc. Rotates intermittently.

At the transfer position Pd of the turntable 50, the semiconductor element 1 is moved from the turntable 50 to the position shown in FIG.
One semiconductor element 1 is delivered to the front / back reversing device 80 as shown in FIG. The front / back reversing device 80 is provided with a plurality of, for example, eight arms 82 around a rotation shaft 81, and a vacuum suction hole 83 is provided at the tip of each arm 82.

FIG. 7 shows how the semiconductor element 1 is transferred from the turntable 50 to the front / back reversing device 80. That is, the suction nozzle 51 of the turntable 50 sucks the semiconductor element 1 with the electrode terminal 1b thereof facing upward, and therefore, the arm 8 at the uppermost position of the front / back reversing device 80 from the turntable 50.
The semiconductor device 1 transferred to the second device 2 has the electrode terminal 1b facing upward, and the back surface thereof is adsorbed and held by the arm 82.

The posture of the semiconductor element 1 whose back surface is adsorbed and held by the arm 82 is changed by the rotation of the front / back reversing device 80 in the direction of the arrow from the state in which the electrode terminal 1b is upward to the state in which it is downward. To be done. As the front / back reversing device 80 rotates by 180 degrees, the mounting surface of the semiconductor element 1 on which the electrode terminals 1b are formed faces downward as shown in FIG.

During the above-mentioned posture conversion, for example, the visual inspection unit 60B is arranged near the 90 ° rotated position of the front / back reversing device 80. That is, in the appearance inspection unit 60A arranged near the turntable 50, the mounting surface on which the electrode terminal 1b is formed is sucked by the suction nozzle 51, and thus the back surface of the resin package 1a opposite to the mounting surface. However, the appearance of the mounting surface on which the electrode terminals 1b are formed cannot be inspected. Therefore, the appearance inspection unit 60B provided in the vicinity of the front / back reversing device 80
Examines the appearance of the mounting surface side on which the electrode terminals 1b are formed.

The visual inspection section 60B is, for example, a CCD.
Consists of a camera. As a result of this visual inspection, the semiconductor element 1 determined to be defective is removed by vacuuming the discharge portion 70B, for example, the arm 82 of the front / back reversing device 80 which adsorbs the defective semiconductor element 1 and then falls naturally, or The vacuum suction of the arm 82 is cut off, and the compressed air is positively blown out from the arm 82 to forcibly discharge the compressed air to a lower or side discharge semiconductor element housing box (not shown). Alternatively, a take-out mechanism is provided to discharge to a dedicated tray.

The non-defective semiconductor element 1 whose front and back are reversed by the front and back reversing device 80 is tape-packaged by the taping machine 90. This taping package has the embossed tape 2 as shown in FIG. 8 as in the conventional case shown in FIG.
One semiconductor element 1 is inserted into one embossed portion 202 of No. 01 with the mounting surface downward, and then the embossed tape 2
This is performed by attaching a cover tape (see 204 in FIG. 11) to 01.

[0071]

According to the method of the present invention, a resin-molded substrate on which a large number of semiconductor elements such as CSP are formed is diced in a dicing process, and then the individual semiconductor elements are attached to a sheet while maintaining their aligned state. The characteristics are measured in the state of being worn, and the results of the characteristics measurement are stored in the storage unit. When the semiconductor elements individually separated from the sheet are peeled and picked up one by one, the storage is performed. Only non-defective semiconductor elements are picked up based on the data and passed to the transfer means, which has been a factor that delays the work index in the past. Supplying semiconductor elements to processing equipment without using an alignment tray or parts feeder. In addition, it is not necessary to position the semiconductor elements in a disjointed state one by one at the characteristic measurement position with high precision as in the conventional case. Since, there is an effect that it is possible to remarkably improve work index process.

Further, since only the good semiconductor elements are picked up from the sheet one by one and finally tape-packaged, the conventional method of mixing the good semiconductor elements and the defective semiconductor elements by the transfer means is used. In comparison, there is an effect that the transfer efficiency of the transfer means is increased.

When the leadless semiconductor element is picked up, the method further includes the step of expanding the dicing sheet of the dicing sheet unit to separate the plurality of leadless semiconductor elements after storing the measurement result in the storage unit. In addition, the adjacent leadless semiconductor element is not peeled off.

Further, by providing a step of inspecting the appearance of either the front side or the back side of the leadless semiconductor element being transferred by the transfer means, the semiconductor element having a defective appearance of the resin mold package is discharged to obtain a non-defective semiconductor. Only the element can be taped.

Further, by providing a step of reversing the leadless semiconductor element picked up from the transfer means, the mounting surface on which the electrode terminals are formed can face down, and the tape can be packed. When the package is unpacked, it can be mounted by sucking it in the same posture with a vacuum suction nozzle or the like.

In addition, by providing a step of inspecting the leadless semiconductor element in the front and back inversion step, the appearance inspection of the resin mold package on the opposite side of the semiconductor element, which cannot be inspected by the appearance inspection during the transfer by the transfer means, is performed. It is possible to discharge defective semiconductor elements having cracks or recesses on the front and back surfaces, and package only good semiconductor elements in taping packaging.

According to the processing apparatus of the present invention, in the previous step, after dicing a resin-molded substrate having a large number of semiconductor elements attached to a sheet in a connected state into individual semiconductor elements, the individual semiconductor elements are separated. While maintaining the aligned state and being adhered to the sheet, the characteristic measurement of each semiconductor element is measured, and the characteristic measurement result is stored in the storage unit, and based on the stored data in the supply table. Only non-defective semiconductor elements are moved to the pickup position, picked up by the handling mechanism of the transfer means, transferred by the intermittent rotation operation of the transfer means, and finally tape-packaged by the taping machine. Can be sent directly to the processing equipment without moving to an alignment tray, etc., increasing the work index of the processing equipment and performing in-line processing. Is it is easy to adapt pre-process and in-line semiconductor manufacturing.

Further, since the semiconductor element is delivered from the sheet of the supply table to the handling mechanism of the transfer means and finally packaged by taping, the semiconductor element can be smoothly moved and the semiconductor element is vibrated or shocked. The possibility of cracking or chipping is reduced, and the yield of semiconductor elements packaged in taping is improved.

Further, by equipping the supply table with a sheet extending mechanism for extending the sheet of the unit to separate a plurality of semiconductor elements, the unit which has undergone the slicing process and the characteristic measuring process can be moved to the supply table as it is. This makes the unit easier to handle.

Further, only the good semiconductor elements located at the pickup position can be picked up and transferred one by one by the pickup mechanism of the turntable adjacent to the supply table, and the transfer can be performed near the turntable. By providing an appearance inspection device for inspecting the appearance of either the front surface or the back surface of the semiconductor element in the means, the semiconductor element having a defective appearance can be discharged.

Further, by providing a front / back reversing device between the turntable and the taping machine, it is possible to perform taping with the mounting surface side on which the electrode terminals of the semiconductor element are formed facing down, so that the semiconductor element is mounted. At times, the semiconductor element unpacked from the taping package can be directly sucked by the suction nozzle and face down bonded.

In addition, by providing a visual inspection unit near the front / back reversing device for inspecting the outer surface of the semiconductor element in the front / back reversing step, which is opposite to the outer surface, the semiconductor being transferred by the turntable. The appearance inspection of the opposite side, which cannot be inspected by the element appearance inspection device, becomes possible, and defective semiconductor elements on the front and back surfaces can be discharged and only good semiconductor elements can be taped.

[Brief description of drawings]

FIG. 1 is a process flow chart of a method for processing a leadless semiconductor device according to an embodiment of the present invention.

FIG. 2 is a schematic block diagram of a processing apparatus for a leadless semiconductor device according to an embodiment of the present invention.

FIG. 3 is a schematic plan view of a processing apparatus for a leadless semiconductor device according to an embodiment of the present invention.

FIG. 4 is a schematic front view of the processing apparatus for the leadless semiconductor device shown in FIG.

FIG. 5A is an enlarged front view of an essential part of a dicing tape in which a leadless semiconductor element is attached, and FIG. 5B is an enlarged front view of an essential part when the tape is extended by a tape extension mechanism.
FIG. 6C is an enlarged front view of a main part of the leadless semiconductor device during pickup.

FIG. 6 is a schematic perspective view of a front / back inverting device in the processing apparatus of the present invention.

7 is a partial side view showing a situation at the time of delivery of a leadless semiconductor element from a transfer means to a front / back inverting device in the processing apparatus of FIG.

8 is a partial side cross-sectional view of the processing apparatus of FIG. 3 when the leadless semiconductor element is transferred from the front / back inverting device to the embossed tape.

9A is a plan view of a resin mold substrate on which a large number of leadless semiconductor elements are formed in a connected state, and FIG. 9B is an enlarged perspective view of a leadless semiconductor element diced from the resin mold substrate of FIG. Is.

FIG. 10 is a process flow diagram of a conventional leadless semiconductor device processing method.

FIG. 11 is a partial perspective view showing a state where a part of the cover tape of the taping package with the embossed tape is peeled off.

[Explanation of symbols]

1 Leadless semiconductor device 1a Resin package 1b Electrode terminal 2 dicing sheet 3 dicing ring 4 Dicing sheet unit 10 Dicing equipment 20 Characteristic measuring device 30 storage 40 supply table 40A sheet extension mechanism 40B storage data reading unit Pa pickup position Pb Appearance inspection position Pc defective semiconductor element discharge position Pd Semiconductor element delivery position 50 Transfer means (turntable) 51 Handling mechanism (suction nozzle) 60A, 60B Visual inspection section 70A, 70B discharge part 80 Front-back inverting device 90 taping machine 201 embossed tape 202 Embossed section 204 cover tape

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Claims (10)

[Claims] 1. A dicing step of adhering a plurality of connected leadless semiconductor elements to a dicing sheet to form a dicing sheet unit, and cutting the connected leadless semiconductor elements from each other; While measuring the characteristics of each leadless semiconductor element, a characteristic measurement step of storing the measurement result, a pickup step of picking up a good leadless semiconductor element based on the stored data of the characteristic measurement result from the dicing sheet, A processing method for a leadless semiconductor device, comprising: a transfer process of transferring the picked-up leadless semiconductor device by a transfer device; and a taping process of taping and packing the leadless semiconductor device transferred from the transfer device. 2. The leadless method according to claim 1, further comprising a sheet extending step of extending the dicing sheet of the dicing sheet unit to separate individual leadless semiconductor elements after the characteristic measuring step. Semiconductor device processing method. 3. The leadless semiconductor device according to claim 1, further comprising an appearance inspection step of inspecting the appearance of either the front surface or the back surface of the leadless semiconductor element being transferred by the transfer means. Processing method. 4. The method for treating a leadless semiconductor element according to claim 1, further comprising a step of reversing the front and back of the leadless semiconductor element transferred from the transfer means. . 5. The leadless semiconductor device according to claim 4, further comprising an appearance inspection step of inspecting an appearance of a side surface of the leadless semiconductor element opposite to the appearance inspection surface during the front-back inversion step. Processing method. 6. In the dicing step of the preceding step, dicing is performed between leadless semiconductor elements in a dicing sheet unit in which a resin mold substrate having a large number of connected leadless semiconductor elements is attached to a dicing sheet,
A dicing sheet unit in which a characteristic measurement process is performed in which the characteristic measurement is performed while the individual leadless semiconductor elements are attached to a sheet in an aligned state and the inspection result is stored in a storage unit. A processing apparatus for a supplied leadless semiconductor element, comprising: a read-out unit for reading out stored characteristic measurement results of the individual leadless semiconductor elements attached in an aligned state to the dicing sheet; A dicing sheet unit in which the semiconductor elements are adhered to the dicing sheet in an aligned state is detachably supported, and among the leadless semiconductor elements, a non-defective leadless semiconductor element is picked up by a predetermined pickup based on the reading result of the reading unit Feed table to be moved to position and leadless at a fixed position away from this supply table The semiconductor device includes a taping machine for taping and packing conductor elements, and a transfer means arranged between the supply table and the taping machine. A processing apparatus for a leadless semiconductor device, which has a handling mechanism for delivering and receiving a less semiconductor device. 7. The leadless device according to claim 6, wherein the supply table includes a sheet extension mechanism that extends the dicing sheet of the supported dicing sheet unit to separate the plurality of leadless semiconductor elements from each other. Semiconductor device processing equipment. 8. The leadless semiconductor according to claim 6, further comprising an appearance inspection unit near the transfer means for inspecting the appearance of one surface of the leadless semiconductor element held by the transfer means. Device processing equipment. 9. Between the transfer means and the taping machine,
9. The leadless semiconductor device processing apparatus according to claim 6, further comprising a front / back reversing device for reversing the front and back of the semiconductor element. 10. The processing apparatus for a leadless semiconductor element according to claim 9, further comprising an appearance inspection unit for inspecting the appearance of the other surface of the leadless semiconductor element in the vicinity of the front-back inverting device.