WO2016147977A1 - Dispositif de rendu d'image - Google Patents

Dispositif de rendu d'image Download PDF

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Publication number
WO2016147977A1
WO2016147977A1 PCT/JP2016/057324 JP2016057324W WO2016147977A1 WO 2016147977 A1 WO2016147977 A1 WO 2016147977A1 JP 2016057324 W JP2016057324 W JP 2016057324W WO 2016147977 A1 WO2016147977 A1 WO 2016147977A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
pattern
angle
glass substrate
information
Prior art date
Application number
PCT/JP2016/057324
Other languages
English (en)
Japanese (ja)
Inventor
友哉 中谷
英治 森
正則 田尾
Original Assignee
東レエンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Publication of WO2016147977A1 publication Critical patent/WO2016147977A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

Definitions

  • the present invention relates to a drawing apparatus.
  • a laser marking device that scans laser light in a two-dimensional direction and marks (draws) characters and figures on a workpiece such as a semiconductor device, a liquid crystal display substrate, or an electronic component (for example, Patent Document 1).
  • marking is performed by irradiating a workpiece with a single laser beam in a state where a predetermined spot diameter is set.
  • Patent Document 2 a laser processing apparatus that performs processing by distributing one pulsed laser beam emitted from one laser unit to a plurality of optical paths.
  • the drawing target is a glass substrate to be processed in a single wafer
  • a predetermined position correction operation called an alignment operation for accurately positioning the glass substrate on the holding unit. was there.
  • a predetermined pattern is drawn with a predetermined position accuracy in a drawing area set on the substrate after the position correction.
  • the resolution of the rotating mechanism affects the angle correction accuracy of the substrate, so that there is a problem that the positional accuracy away from the rotation center of the rotating mechanism is lowered. .
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a drawing apparatus capable of simultaneously improving machining accuracy and shortening work time with a simple configuration.
  • the present inventor examined whether the simplification of the alignment structure, the improvement of alignment accuracy, and the shortening of the alignment time can be achieved.
  • a drawing apparatus that draws a predetermined drawing pattern on a drawing target
  • a storage unit that stores the drawing pattern
  • a holding unit that holds the drawing target
  • a position angle detector that detects the position and angle of the drawing object, and a modified drawing pattern in which the drawing pattern is corrected based on the position and angle of the drawing object detected by the position angle detector
  • a drawing apparatus comprising: a drawing information generation unit; and a drawing unit that draws the modified drawing pattern on the drawing object.
  • FIG. 1 is a perspective view showing a schematic configuration of a drawing apparatus 1 according to an embodiment of the present invention.
  • 3 is a plan view showing an example of a glass substrate 100 that is a drawing target of the drawing apparatus 1.
  • FIG. It is a figure which shows the detail of the laser drawing part 11 of FIG. It is a figure which shows the example of board
  • 5 is a plan view illustrating an example of a drawing pattern 401.
  • FIG. FIG. 6 is a flowchart showing a drawing procedure using the drawing apparatus 1.
  • FIG. 5 is a diagram showing an example in which the substrate ID 111 of FIG. 4 is developed into a dot pattern 161. It is a top view which shows the case where the glass substrate 100 is mounted in the holding
  • FIG. 6 is a plan view illustrating an example of a modified drawing pattern 403.
  • FIG. 6 It is a figure for demonstrating S7 of FIG.
  • drawing apparatus 1 a drawing apparatus that draws an identification code on the surface of the glass substrate 100 using a laser is illustrated.
  • the drawing apparatus 1 includes a storage unit 3 that stores a drawing pattern, a holding unit 5 that holds a glass substrate 100 that is a drawing target, and a position and an angle of the glass substrate 100 on the holding unit 5.
  • a position angle detection unit 7 to detect, and a processing head controller 9 as a drawing information generation unit that generates a corrected drawing pattern in which the drawing pattern is corrected based on the position and angle of the glass substrate 100 detected by the position angle detection unit 7;
  • a laser drawing unit 11 is provided as a drawing unit for drawing a modified drawing pattern.
  • the drawing apparatus 1 includes a uniaxial slider 21 as a moving unit that moves the holding unit 5 relative to the laser drawing unit 11 in the first direction (here, directions A and B in FIG. 1), and a moving unit. Based on the current position of the glass substrate 100 detected by the encoder 33 (in the uniaxial slider 21 here) as the current position detecting unit for detecting the current position of the glass substrate 100 and the corrected drawing pattern.
  • the position information analysis controller 25 is provided as a timing instruction unit for instructing the laser drawing unit 11 (via the machining head controller 9) to draw a corrected drawing pattern.
  • the storage unit 3 is provided in the machining head controller 9.
  • the storage unit 3 also includes reference position information 201 indicating a reference position that is a position when the glass substrate 100 is not displaced on the holding unit 5.
  • the reference position information 201 is information on the position of the positioning reference portion when no positional deviation has occurred.
  • the positioning reference part is a specific part of the glass substrate 100, for example, information on alignment marks provided on the glass substrate 100, three points of predetermined positioning reference sides (two sides), or It is a corner of a glass substrate.
  • the positioning reference portion is the alignment mark 121 shown in FIG.
  • the holding unit 5 is a flat plate-like pedestal for holding the glass substrate 100.
  • the lower surface is held by the uniaxial slider 21, and the direction of A and B in FIG. It is movable in the plane direction of the flat plate.
  • the position angle detection unit 7 processes and processes an imaging camera 23 that captures a predetermined position (here, a positioning reference portion, that is, an alignment mark 121) of the glass substrate 100 on the holding unit 5, and an image captured by the imaging camera 23.
  • An image processing unit 26 that transmits to the head controller 9 is provided.
  • the processing head controller 9 is also a control unit that controls the laser drawing unit 11. From the storage unit 3 that receives and stores a drawing pattern via an external device or an I / F unit (not shown), the drawing pattern, and the image processing unit 26. A drawing information input unit 27 that generates a corrected drawing pattern based on the transmitted image and a drawing pattern generation unit 29 that converts the corrected drawing pattern into a data format that can be processed by the laser drawing unit 11 are provided.
  • the laser drawing unit 11 is a device that draws on the glass substrate 100 using a laser.
  • the laser drawing unit 11 is irradiated from a light source 51 that emits a laser such as a YAG (Yttrium Aluminum Garnet) laser, and the light source 51.
  • the beam expander 53 is a lens that is provided on the optical path of the laser and adjusts the dot diameter of the laser, and is incident from the corner mirrors 55 and 57 and the corner mirror 57 for changing the direction of the laser beam that has passed through the beam expander 53.
  • An XY galvano scanner 63 having mirrors 64x and 64y for adjusting the X-axis and Y-axis direction coordinates of the light transmitted through the objective lens 61; It has a laser processing unit PC39 that controls the operation of these components.
  • the laser irradiated with a predetermined output from the light source 51 is adjusted to a predetermined dot diameter by the beam expander 53, and the Z scanner 59, the objective lens 61, the XY galvano scanner 63 (the mirror 64x, 64y), the position coordinates and the focal point at that position are adjusted, and a desired position of the glass substrate 100 is irradiated with a predetermined dot diameter 303.
  • the glass substrate 100 is a substrate for a liquid crystal display here, and has a plurality of panel regions 101a to 101f on which members such as liquid crystal are mounted. That is, the glass substrate 100 is formed by previously forming panel regions 101a to 101f corresponding to a plurality of liquid crystal display substrates on a single glass substrate, and then cutting the glass substrate along cutting lines C1, C2, and C3. In this structure, the regions 101a to 101f are separated.
  • the glass substrate 100 includes a substrate ID 111 that is a unique identification code for each glass substrate 100, panel IDs 113a to 113f that are individual identification codes of the panel regions 101a to 101f, and a panel region that is arranged side by side. It has cut IDs 115, 117, and 119, which are identification codes for each.
  • the cut ID 115 corresponds to the panel area 101a and the panel area 101d
  • the cut ID 117 corresponds to the panel area 101b and the panel area 101e
  • the cut ID 119 corresponds to the panel area 101c and the panel area 101f.
  • the glass substrate 100 is first cut along the cutting lines C1 and C2, and separated into three regions corresponding to the cut IDs 115, 117, and 119. Furthermore, this is because a procedure is taken in which each region is cut along the cutting line C3 and separated into two.
  • the board ID 111 is, for example, an alphabet, a number, a barcode, or a combination thereof including information such as the type, lot, and board number of the panel to be manufactured. Further, the cut IDs 115, 117, and 119 include information related to the addresses of places to be cut, and the panel IDs 113a to 113f include information related to the addresses of the panel areas 101a to 101f.
  • Identification codes Information regarding these identification codes is received by the machining head controller 9 via an external device or an I / F unit (not shown).
  • the information of the identification code can be exemplified as image information such as a bitmap, but when the identification code is alphabetic or numeric, it may be only information of an ID that does not include an image, such as a character code.
  • the board ID 111 is a combination of an alphabet 111a and a two-dimensional barcode 111b.
  • the drawing apparatus 1 since the drawing apparatus 1 draws the substrate ID 111, the panel IDs 113a to 113f, and the cut IDs 115, 117, and 119, the drawing pattern 401 indicates the pattern and position of these IDs as shown in FIG. Contains information.
  • the above is the description of the example of the glass substrate 100 and the drawing pattern 401 to be drawn.
  • the glass substrate 100 is transported to the drawing device 1 using a transport device or the like (not shown) and mounted on the holding unit 5 (S1 in FIG. 6).
  • the processing head controller 9 of the drawing apparatus 1 receives the drawing pattern 401 corresponding to the glass substrate 100 via an external device or I / F unit (not shown) and stores it in the storage unit 3 (S2 in FIG. 6). Further, the machining head controller 9 also receives the reference position information 201 as necessary and stores it in the storage unit 3.
  • the drawing information input unit 27 develops the drawing pattern 401 into a bitmap and forms a dot pattern (S3 in FIG. 6). For example, if the substrate ID 111 in the drawing pattern 401 is a drawing pattern as shown in FIG. 4, it is developed into a dot pattern 161 as shown in FIG.
  • drawing pattern 401 in this state is a pattern when the glass substrate 100 is not displaced.
  • the position angle detection unit 7 images the alignment mark 121 of the glass substrate 100 on the holding unit 5 with the imaging camera 23, processes the captured image as necessary, and transmits the processed image to the laser drawing unit 11 (FIG. 6). S4).
  • the process as needed is a process which detects and digitizes the actual position and angle of the alignment mark 121, for example.
  • the laser drawing unit 11 compares the image transmitted from the position angle detection unit 7 (or information on the actual position and angle of the alignment mark 121) with the reference position information 201 to determine the reference position of the alignment mark 121.
  • the deviation of the position and angle from is calculated (S5 in FIG. 6).
  • the glass substrate 100 is placed on the holding unit 5 as shown in FIG. 8 in S1.
  • the position of the glass substrate 100 is shifted from the reference position 100a (position when there is no deviation).
  • the position 401 is shifted.
  • the position of the alignment mark 121 in the reference position information 201 is compared with the position of the actually drawn alignment mark 121a, and the positional deviation Dx in the x direction and the positional deviation in the y direction are compared. Dy and angular deviation ⁇ are calculated.
  • the drawing information input unit 27 corrects the drawing pattern 401 based on the position and angle deviation (Dx, Dy, ⁇ ) from the reference position of the alignment mark 121 to generate a corrected drawing pattern 403 shown in FIG. It transmits to the drawing pattern production
  • the modified drawing pattern 403 (that is, the glass substrate) which is a drawing pattern in which the position of the alignment mark 121 is offset to a position corresponding to the positional deviations Dx and Dy and rotated in accordance with the angular deviation ⁇ . 100, a drawing pattern corresponding to an actual position on the holding unit 5 is generated and transmitted to the drawing pattern generation unit 29.
  • the drawing apparatus 1 when the actual position on the holding unit 5 of the glass substrate 100 is displaced from the reference position, the drawing apparatus 1 does not physically move the position of the glass substrate 100 to correct the displacement.
  • the drawing pattern is corrected according to the deviation.
  • a device for physically moving the position of the glass substrate 100 (positioning pins or position correcting actuators) is not necessary in the drawing device 1, and the structure is simple.
  • the drawing apparatus 1 does not require a step of correcting the displacement by physically moving the position of the glass substrate 100, the work time for correcting the displacement can be shortened.
  • the drawing apparatus 1 does not require a step of correcting the displacement by physically moving the position of the glass substrate 100, the working time for correcting the displacement is not so dependent on the size of the glass substrate 100.
  • the drawing apparatus 1 can simultaneously improve machining accuracy and shorten work time with a simple configuration.
  • the drawing pattern generation unit 29 converts the corrected drawing pattern 403 into a data format that can be processed by the laser drawing unit 11 (S7 in FIG. 6).
  • the modified drawing pattern 403 is a bitmap here, specifically, position information based on the X axis and the Y axis.
  • the information on the drawing target position 141 obtained from the corrected drawing pattern 403 is represented as coordinates Px in the X-axis direction.
  • the Y-axis direction is not shown in FIG. 13, it is the same as the X-axis, and thus the description thereof is omitted.
  • the laser drawing unit 11 controls the position drawn by the XY galvano scanner 63, so when drawing the modified drawing pattern 403, based on the coordinates Px given as the position information, FIG. It is necessary to specify the angle 145 of the motor that drives the mirror 64x of the XY galvano scanner 63 shown in FIG. Therefore, the laser drawing unit 11 converts the position information into angle information.
  • the machining head controller 9 drives the uniaxial slider 21 to move the holding portion on which the glass substrate 100 is mounted in the direction of A in FIG. 1 (S8 in FIG. 6).
  • the position information analysis controller 25 instructs the encoder 33 to detect the current position of the glass substrate 100 (holding unit 5), and the encoder 33 transmits the detected current position information to the position information analysis controller 25 using a pulse signal or the like. To do.
  • the position information analysis controller 25 determines whether or not the glass substrate 100 is at a position where the laser drawing unit 11 can draw the corrected drawing pattern 403 based on the current position information. Advances to S10, otherwise returns to S8 (S9 in FIG. 6).
  • the position information analysis controller 25 transmits the drawing timing (via the processing head controller 9) to the laser drawing unit 11 (FIG. 6 S10).
  • the laser drawing unit 11 instructs the drawing position and timing based on the corrected drawing pattern 403 to the laser drawing unit 11, and the laser drawing unit 11 draws the corrected drawing pattern 403 on the glass substrate 100 based on the instruction (S11 in FIG. 6). .
  • the reason why the position information analysis controller 25 determines the drawing timing while the encoder 33 detects the current position is as follows.
  • the current position of the glass substrate 100 is the driving speed of the uniaxial slider 21 and the elapsed time from the start of driving. Since it can be calculated from time, it is not always necessary to detect the current position using the encoder 33.
  • the speed may not be constant due to the pulsation of the actuator or the like even if the constant-speed movement is instructed.
  • the drawing apparatus 1 includes the storage unit 3 that stores the drawing pattern 401, the holding unit 5 that holds the glass substrate 100 that is the drawing target, and the glass substrate on the holding unit 5.
  • the position angle detection unit 7 that detects the position and angle of 100, and the drawing information generation that generates the corrected drawing pattern 403 obtained by correcting the drawing pattern 401 based on the position and angle of the glass substrate 100 detected by the position angle detection unit 7
  • a machining head controller 9 as a unit and a laser drawing unit 11 as a drawing unit for drawing the modified drawing pattern 403 are provided.
  • the drawing apparatus 1 can simultaneously improve machining accuracy and shorten work time with a simple configuration.
  • the position information analysis controller 25 determines the drawing timing while the encoder 33 detects the current position.
  • the encoder 33 is not essential.
  • the drawing apparatus 1 is illustrated as an apparatus that performs drawing using a laser.
  • the present invention is not limited to this, and any apparatus that can draw on a workpiece can be used.
  • an apparatus that performs drawing using an application apparatus such as an inkjet or a dispenser may be used.
  • the holding unit 5 is moved with respect to the laser drawing unit 11.
  • the laser drawing unit 11 is conversely changed. You may move with respect to the holding
  • Drawing device 3 Storage unit 5: Holding unit 7: Position angle detection unit 9: Processing head controller 11: Laser drawing unit 21: One-axis slider 23: Imaging camera 25: Position information analysis controller 26: Image processing unit 27: Drawing information input unit 29: Drawing pattern generation unit 33: Encoder 100: Glass substrate 100a: Reference position 101a: Panel region 101b: Panel region 101c: Panel region 101d: Panel region 101e: Panel region 101f: Panel region 111a: Alphabet 111b: Two-dimensional barcode 113a: Panel ID 113b: Panel ID 113c: Panel ID 113d: Panel ID 113e: Panel ID 113f: Panel ID 115: Cut ID 117: Cut ID 119: Cut ID 121: alignment mark 121a: alignment mark 141: drawing target position 145: angle 161: dot pattern 201: reference position information 401: drawing pattern 403: modified drawing pattern

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Cette invention concerne un dispositif de rendu d'image avec permettant d'obtenir à la fois une meilleure précision de traitement et un temps de travail plus court, au moyen d'une caractéristique simple. Spécifiquement, l'invention comprend : une unité de stockage (3) pour stocker un modèle de rendu d'image ; un support (5) pour maintenir un substrat de verre (100) sur laquelle une image doit être rendue ; une unité de détection de position/angle (7) pour détecter la position et l'angle du substrat de verre (100) sur le support (5) ; un dispositif de commande de tête de traitement (9) pour générer un modèle de rendu d'image corrigé qui corrige le modèle de rendu d'image, sur la base de la position et de l'angle du substrat de verre (100) détectés par l'unité de détection de position/angle (7) ; et une unité de rendu d'image laser (11) servant d'unité de rendu d'image pour effectuer le rendu d'une image du modèle de rendu d'image corrigé.
PCT/JP2016/057324 2015-03-16 2016-03-09 Dispositif de rendu d'image WO2016147977A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015052188A JP2016172259A (ja) 2015-03-16 2015-03-16 描画装置
JP2015-052188 2015-03-16

Publications (1)

Publication Number Publication Date
WO2016147977A1 true WO2016147977A1 (fr) 2016-09-22

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PCT/JP2016/057324 WO2016147977A1 (fr) 2015-03-16 2016-03-09 Dispositif de rendu d'image

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JP (1) JP2016172259A (fr)
TW (1) TW201703911A (fr)
WO (1) WO2016147977A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7446169B2 (ja) 2020-06-26 2024-03-08 キヤノントッキ株式会社 基板搬送装置、基板処理システム、基板搬送方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7424927B2 (ja) 2020-06-26 2024-01-30 キヤノントッキ株式会社 膜厚測定装置、成膜装置、膜厚測定方法、電子デバイスの製造方法、プログラム及び記憶媒体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002046085A (ja) * 2000-08-04 2002-02-12 Sharp Corp レーザマーカ装置および印字方法
JP2007030378A (ja) * 2005-07-27 2007-02-08 Ngk Insulators Ltd セラミックス製品及びその製造方法
JP2012143785A (ja) * 2011-01-12 2012-08-02 Keyence Corp レーザー加工システム及びレーザー加工装置
JP2013184171A (ja) * 2012-03-06 2013-09-19 Toray Eng Co Ltd マーキング装置及び方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002046085A (ja) * 2000-08-04 2002-02-12 Sharp Corp レーザマーカ装置および印字方法
JP2007030378A (ja) * 2005-07-27 2007-02-08 Ngk Insulators Ltd セラミックス製品及びその製造方法
JP2012143785A (ja) * 2011-01-12 2012-08-02 Keyence Corp レーザー加工システム及びレーザー加工装置
JP2013184171A (ja) * 2012-03-06 2013-09-19 Toray Eng Co Ltd マーキング装置及び方法

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JP2016172259A (ja) 2016-09-29

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