WO2016117224A1 - Procédé et dispositif de marquage, dispositif de production de motif et pièce à travailler - Google Patents

Procédé et dispositif de marquage, dispositif de production de motif et pièce à travailler Download PDF

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Publication number
WO2016117224A1
WO2016117224A1 PCT/JP2015/083087 JP2015083087W WO2016117224A1 WO 2016117224 A1 WO2016117224 A1 WO 2016117224A1 JP 2015083087 W JP2015083087 W JP 2015083087W WO 2016117224 A1 WO2016117224 A1 WO 2016117224A1
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Prior art keywords
drawing pattern
marking
pattern
unit
workpiece
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PCT/JP2015/083087
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English (en)
Japanese (ja)
Inventor
正則 田尾
岡部　均
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東レエンジニアリング株式会社
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Publication of WO2016117224A1 publication Critical patent/WO2016117224A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring

Definitions

  • the present invention relates to a marking apparatus and method, a pattern generation apparatus, and a workpiece.
  • the marking device is a device that prints (marks) or draws (patterns) a predetermined shape such as a character, a symbol, a figure, or a wiring pattern on a workpiece such as a semiconductor device, a liquid crystal display substrate, or an electronic component.
  • a laser marking device for converging a laser beam with a predetermined dot diameter and irradiating the surface of the work piece in a two-dimensional direction to mark characters or figures on the surface of the work piece has been proposed (for example, Patent Document 1).
  • a configuration of the laser marking device a configuration is also known in which one pulsed laser beam irradiated from one laser unit is processed by being distributed to a plurality of optical paths (for example, Patent Document 2).
  • JP 2005-66611 A Japanese Patent Laid-Open No. 2005-74479 JP 2009-285693 A
  • the requirement required for the marking device is that the processing accuracy is high, but in consideration of productivity, a reduction in work time is also required.
  • Patent Documents 1 to 3 have a problem that it is difficult to achieve both machining accuracy and shortening of work time.
  • Patent Document 1 has a problem that the processing accuracy and the reduction in work time are in a trade-off relationship.
  • Patent Document 2 the technique of distributing and marking a plurality of laser beams from a single laser light source to a plurality of optical paths reduces the working time compared to the case of marking using only one optical path.
  • the machining accuracy cannot be improved, and there is a problem that there is no change in the point that the machining accuracy and the shortening of the working time are in a trade-off relationship.
  • Patent Document 3 in the structure of marking while changing the dot diameter irradiated from one laser light source, both the processing accuracy can be reduced to some extent and the work time can be shortened. In addition, fine setting changes of the laser optical system and laser output are required.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a marking device capable of simultaneously improving machining accuracy and shortening work time.
  • a first aspect of the present invention is a marking device for drawing a predetermined drawing pattern in a marking area set on a workpiece, and marking the workpiece with a first dot diameter.
  • a first marking portion to be performed a second marking portion for marking the workpiece with a second dot diameter smaller than the first dot diameter, and the drawing pattern at the first marking portion.
  • a divided drawing pattern registration unit that divides and registers a first drawing pattern to be drawn and a second drawing pattern to be drawn by the second marking unit, wherein the first drawing pattern and the second drawing pattern are ,
  • the predetermined drawing pattern is formed on the workpiece by being superimposed on each other, and the second drawing pattern includes the first drawing pattern. It contains contour patterns to fill the edges of the image pattern, a marking device.
  • an overall drawing pattern registration unit for registering the entire drawing pattern to be marked by the marking device according to the first aspect as an overall drawing pattern, and the first drawing pattern from the whole drawing pattern.
  • a pattern generation device including a divided drawing pattern generation unit that generates the second drawing pattern in a divided manner.
  • the third aspect of the present invention is: In a marking method for drawing a predetermined drawing pattern in a marking area set on a workpiece, The drawing pattern is divided and registered into a first drawing pattern set with a first dot diameter and a second drawing pattern set with a second dot diameter smaller than the first dot diameter.
  • Have The first drawing pattern and the second drawing pattern are formed by overlapping each other to form a predetermined drawing pattern on the workpiece,
  • the second drawing pattern includes a contour pattern that fills an edge of the first drawing pattern.
  • a fourth aspect of the present invention is the workpiece that is marked by the marking method according to the third aspect.
  • the present invention it is possible to provide a marking device and method, a pattern generation device, and a workpiece that can simultaneously improve processing accuracy and shorten work time.
  • FIG. 1 is a block diagram of a marking device 1 according to an embodiment of the present invention, in which a thick line indicates a connection by a dedicated line, a waveform line indicates a connection by communication, a thin line indicates a connection by an I / O (input / output) port, and a dotted line Means an analog line connection.
  • a thick line indicates a connection by a dedicated line
  • a waveform line indicates a connection by communication
  • a thin line indicates a connection by an I / O (input / output) port
  • a dotted line Means an analog line connection.
  • FIG. 4 is a plan view showing an example of an overall drawing pattern 113 formed on a film 100.
  • FIG. FIG. 7 is a plan view showing an example of an overall drawing pattern 113 formed on the film 100, and is an enlarged view of the vicinity of the wiring pattern 70 of FIG.
  • FIG. 8 is a plan view illustrating an example of a first drawing pattern 115, corresponding to FIG.
  • FIG. 8 is a plan view showing an example of a second drawing pattern 117, corresponding to FIG.
  • FIG. 11 is an enlarged view of region A in FIG. 10, and also shows a first dot diameter 303 and a second dot diameter 304. It is a figure which shows the drawing pattern assumed that the area
  • the marking device 1 a laser marking device that performs marking on the surface of the film 100 using a laser is illustrated.
  • the marking device 1 according to the present invention includes a plurality of marking portions. In this example, first and second marking portions are provided.
  • the illustrated marking device 1 includes two first laser processing units 3a and 3b as first marking units for marking a workpiece with a laser having a first dot diameter 303, and first dots.
  • Two second laser processing parts 5a and 5b are provided as second marking parts for marking a workpiece with a laser having a second dot diameter 304 smaller than the diameter 303.
  • the device PC7 shown in FIG. 2 operates together with a PLC (Programmable Logic Controller) 37 as a control device that controls marking described later.
  • PLC Programmable Logic Controller
  • the apparatus PC7 includes a control unit 6 and a storage unit 7a.
  • the storage unit 7a stores a storage area 12 for storing an overall drawing pattern 113 (described later), which is information on the overall pattern shape to be marked, and the first laser.
  • a first partial storage area 14 for storing a first drawing pattern 115 (described later) drawn by the processing units 3a and 3b and a second drawing pattern 117 (described later) for drawing by the second laser processing units 5a and 5b are stored. 2 partial storage areas 16.
  • the apparatus PC 7 operates as a divided drawing pattern registration unit that divides and registers the entire drawing pattern 113.
  • the apparatus PC 7 also operates as a contour column number setting unit for setting the number of columns of the contour pattern 120 in the second drawing pattern 117.
  • the apparatus PC 7 also operates as an overlap amount setting unit for setting overlap amounts Vx and Vy (details will be described later) between the first drawing pattern 115 and the second drawing pattern 117, and the edge of the overall drawing pattern 113. It also operates as an offset amount setting unit for setting offset amounts Gx and Gy (details will be described later) of the edge of the first drawing pattern 115 with respect to 313.
  • the apparatus PC7 since the apparatus PC7 performs the process of registering the entire drawing pattern 113 and generating the first drawing pattern 115 and the second drawing pattern 117 by dividing the entire drawing pattern 113, the apparatus PC7 It has functions as a drawing pattern registration unit and a divided drawing pattern generation unit.
  • the configuration of the marking device 1 will be described in more detail with reference to FIGS.
  • the marking device 1 has an unwinder 11 for unwinding a film 100 as a workpiece, and a winder 13 for unwinding the film 100 unwound from the unwinder 11. is doing.
  • the film 100 is obtained by forming a metal layer 103 on a base material 101 such as a polymer film, and the first laser processing portions 3 a and 3 b and the second laser processing are formed on the metal layer 103.
  • a predetermined wiring pattern 70 (details will be described later) is formed.
  • a processing table as a relative moving unit that holds the marking area 203 (details will be described later) of the film 100 between the unwinder 11 and the winder 13 and below the film 100. 21 is provided.
  • the processing table 21 is driven by the drive unit 23 in directions parallel to the transport direction of the film 100, + x and ⁇ x in FIG. 1, and + z and ⁇ z that are parallel to the normal direction of the surface of the film 100. It is possible to move in the direction.
  • the processing table 21 has a movable distance in the + x and ⁇ x directions limited to the distance H in FIG. 1, and holding tables 25 for temporarily adsorbing and holding the film 100 at both ends of the movement limit. Is provided.
  • the holding table 25 can be moved in the directions of + z and ⁇ z in FIG. 1 by an actuator (not shown).
  • the processing table 21 adsorbs the film 100 at the time of marking, and prevents the positional deviation of the film 100 by moving following the film 100 when the film 100 is transported.
  • the processing table 21 When the processing table 21 reaches the movement limit due to the conveyance of the film 100, the film 100 is temporarily sucked by the holding table 25, and the processing table 21 is separated from the film 100 to the upstream side (unwinder 11 side). Return the processing table 21 to.
  • first laser processing units 3a, 3b and second laser processing units 5a, 5b are provided, and an alignment unit 27 for alignment correction described later is further provided.
  • the alignment unit 27 is provided with an imaging unit 28 such as a CCD (Charge Coupled Device) camera as a reference mark imaging unit.
  • CCD Charge Coupled Device
  • the first laser processing units 3a and 3b are fixed, but the second laser processing units 5a and 5b are provided with a driving stage 29 such as an XY ⁇ stage or a UVW stage as a marking position correction unit.
  • the second laser processing units 5a and 5b can move relative to the film 100 and the first laser processing units 3a and 3b in the horizontal (XY) direction and the rotation ( ⁇ ) direction with the z direction as the rotation axis. It has become.
  • the marking device 1 has a laser power meter 33 and a converter 35 for measuring the output of the laser.
  • the device PC7 is a computer that drives and controls each component of the marking device 1.
  • the device PC7 is provided with a monitor 8 and a keyboard 10 for operating the device PC7 as input / output devices. These input / output devices may be tablet-type input / output devices.
  • the apparatus PC7 controls the processing table 21 (and the unwinder 11 and the winder 13) to move the first laser processing units 3a and 3b and the second laser processing units 5a and 5b relative to the film 100. It also has a function as a movement marking control unit that performs marking while moving.
  • the apparatus PC 7 and the PLC 37 operate as a control apparatus that controls marking described later. More specifically, the apparatus PC7 uses the laser processing conditions (laser current value, laser oscillation frequency, galvano scanning speed, conveyance speed of the processing table 21) of the first laser processing units 3a, 3b and the second laser processing units 5a, 5b.
  • laser processing conditions laser current value, laser oscillation frequency, galvano scanning speed, conveyance speed of the processing table 21
  • the conveyance distance of the processing table 21, the conditions of the alignment unit 27, the conditions of the laser power meter 33, the layout of the laser processing, the accuracy correction data of the laser processing, and the first laser processing units 3a, 3b and the second laser processing unit In addition to mainly performing processing instruction control related to 5a and 5b, it also plays a role of transmitting information (processing completion trigger) indicating that processing is completed to the PLC 37.
  • the PLC 37 controls the operation of the processing table 21, the operation of the holding table 25, the vacuum suction and the suction release control of the processing table 21 and the holding table 25, the operations of a dust collector, a laser chiller, a table nip, etc. (not shown).
  • Control of operations other than the first laser processing units 3a and 3b and the second laser processing units 5a and 5b, such as control and control of the opening / closing operation of the mechanical shutter of the laser, and the completion of the control of the operation It also plays a role of transmitting information (trigger) to be shown to the apparatus PC 7.
  • first laser processing units 3a, 3b, second laser processing units 5a, 5b, unwinder 11, winder 13, processing table 21, holding table 25, alignment unit 27, drive stage 29, laser power meter 33 (converter 35) is connected via a PLC (Programmable Logic Controller) 37.
  • PLC Programmable Logic Controller
  • the illustrated first laser processing units 3a and 3b, second laser processing units 5a and 5b are in the direction in which the first laser processing units 3a and 3b and the second laser processing units 5a and 5b are in the transport direction of the film 100. It is arranged in parallel (perpendicular to the conveying direction).
  • the regions (marking area 203) for marking at one time on the film 100 are rough processing regions 103a and 103b processed by the first laser processing units 3a and 3b and the second laser processing unit 5a as shown in FIG. 5b is divided into four finely processed regions 105a and 105b to be processed.
  • the first laser processing unit 3 a is provided on a light source 51 that emits a laser such as a YAG (Yttrium Aluminum Garnet) laser, and on the optical path of the laser emitted from the light source 51.
  • a beam expander 53 that is a lens to be adjusted, corner mirrors 55 and 57 for changing the direction of the laser beam that has passed through the beam expander 53, and the focal point of the laser beam incident from the corner mirror 57 in the Z-axis (see FIG. 5) direction.
  • the laser irradiated with a predetermined output from the light source 51 is adjusted to a predetermined dot diameter by the beam expander 53, and irradiated by the Z scanner 59, the objective lens 61, and the XY galvano scanner 63.
  • the position coordinates and the focal point at that position are adjusted, and a desired position on the film 100 is irradiated with the first dot diameter 303.
  • the dot diameter can be varied by adjusting the Z scanner 59, the objective lens 61, and the like.
  • the present invention adjusts the plurality of laser processing portions so that lasers with different dot diameters have substantially the same energy on the film 100.
  • the output of the first laser processing units 3a and 3b is 11 watts, and the repetition frequency is 40 kHz.
  • the second laser processing units 5a and 5b differ from the first laser processing units 3a and 3b only in that the laser is irradiated with the second dot diameter 304.
  • the size of the second dot diameter 304 is not particularly limited as long as it is smaller than the first dot diameter 303.
  • the diameter of the first dot diameter 303 and that of the second dot diameter 304 are not limited.
  • the diameter ratio is about 4: 1.
  • the output of the second laser processing units 5a and 5b is 2 watts, and the repetition frequency is 40 kHz.
  • the entire drawing pattern 113 in the rectangular marking area 203 is provided with 16 wiring patterns 70, and further, alignment confirmation reference marks 71 for alignment are provided at the four corners of the marking area 203. It has been.
  • first drawing pattern 115 is divided into the first drawing pattern 115 and the second drawing pattern 117 as described above.
  • the first drawing pattern 115 and the second drawing pattern 117 will be described in detail with reference to FIGS.
  • the first laser processing units 3a and 3b for drawing the first drawing pattern 115 have a larger laser dot diameter at the time of drawing than the second laser processing units 5a and 5b for drawing the second drawing pattern 117. Since it is possible to draw a large area at high speed, it is originally desirable that the area (area 310) that can be drawn with the first dot diameter 303 is set as the first drawing pattern 115.
  • the second drawing pattern 117 is set as a pattern having the contour pattern 120 that fills the edge 116 of the first drawing pattern 115.
  • the edge portion 116 of the first drawing pattern 115 has a shape offset inward with respect to the edge portion 313 of the overall drawing pattern 113.
  • the outer edge 114 (including the contour pattern 120) of the second drawing pattern 117 coincides with the edge 313 of the overall drawing pattern 113.
  • the first drawing pattern 115 becomes the pattern shown in FIG. 8
  • the second drawing pattern 117 becomes the pattern shown in FIG.
  • the overlay amount in the X direction in the first rendering pattern 115 and the second rendering pattern 117 is referred to as Vx, and the overlay amount in the Y direction is referred to as Vy.
  • the offset amount in the X direction from the edge portion of the first drawing pattern 115 with respect to the edge portion 313 of the overall drawing pattern 113 is referred to as Gx, and the offset amount in the Y direction is referred to as Gy.
  • the edge of the first drawing pattern 115 is set as the contour pattern 120 of the second drawing pattern 117 for the following two reasons.
  • the first laser processing units 3a, 3b and the second laser processing units 5a, 5b perform marking based on the first drawing pattern 115 and the second drawing pattern 117, but the laser dot shape is a planar shape. Is circular. Therefore, as shown in FIG. 12, if the entire region 310 larger than D is marked as the first drawing pattern 115 using only the first laser processing portions 3a and 3b, the edge of the first drawing pattern 115 is actually A certain gap 315 is generated between the drawn patterns.
  • Such a gap 315 is generated even when drawing is performed in the region 310 using the second laser processing parts 5a and 5b.
  • the first dot diameter 303 is larger than the second dot diameter 304, the first The gap 315 is larger when the drawing is performed using the one laser processing portion 3a, 3b.
  • the gap 315 is formed as compared with the case where the entire region 310 is the first drawing pattern 115.
  • the accuracy of the entire drawing pattern 113 can be improved. This is the first reason.
  • the position of the pattern actually drawn is first due to the alignment accuracy of the first laser processing units 3 a, 3 b and the second laser processing units 5 a, 5 b, changes with time during marking, and the like. There may be a deviation from the drawing pattern 115 and the second drawing pattern 117.
  • the displacement amount of the first drawing pattern 115 is larger than that of the second drawing pattern 117. This is because the first laser processed parts 3a and 3b have a larger dot diameter than the second laser processed parts 5a and 5b. Therefore, the deviation of the first drawing pattern 115 is particularly problematic.
  • the first drawing pattern when the offset amounts Gx and Gy from the outer periphery of the first drawing pattern 115 with respect to the edge 313 of the entire drawing pattern 113 are equal to or less than the overlapping amounts Vx and Vy, the first drawing pattern If the amount of deviation 115 is equal to or less than Gx and Gy, the amount of deviation is drawn in the area of the second drawing pattern 117 or the area of the overlapping area 118.
  • the amount of deviation can be absorbed within the range of the offset amounts Gx, Gy or the overlay amounts Vx, Vy, and the actually drawn pattern itself is the same as the entire drawing pattern 113 regardless of whether or not there is a deviation. Can be shaped. This is the second reason.
  • the above is a method of dividing the entire drawing pattern 113 into the first drawing pattern 115 and the second drawing pattern 117.
  • the marking device 1 can simultaneously improve processing accuracy and shorten work time.
  • the marking device 1 sets the edge of the first drawing pattern 115 as the contour pattern 120 of the second drawing pattern 117, so that the region to be drawn with the first drawing pattern 115 is actually misaligned. However, the amount of deviation is drawn in the area of the second drawing pattern 117.
  • the marking device 1 can realize further improvement of processing accuracy and reduction of working time at the same time.
  • the width of the pattern that fills the edge of the first drawing pattern 115 in the second drawing pattern 117 (in FIG. 11, the width in the X direction is denoted by Sx and the width in the Y direction is denoted by Sy) is the second width. This is the same as the diameter of the dot diameter 304. That is, the second drawing pattern 117 is formed by a single line of dots.
  • the second drawing pattern 117 is not necessarily formed by a single line of dots, and may be formed by a plurality of lines as shown in FIG.
  • the overlay amounts Vx and Vy and the offset amounts Gx and Gy can be increased as compared with the case of one row.
  • the allowable shift amount of the first drawing pattern 115 (and the second drawing pattern 117) can be further increased.
  • the positions of the first drawing pattern 115 and the second drawing pattern 117 that are assumed to be the marking positions due to the alignment accuracy of the first laser processing units 3a and 3b and the second laser processing units 5a and 5b, the change with time during marking, and the like. If the deviations are ⁇ and ⁇ , respectively, the overlapping amounts Vx and Vy require ⁇ + ⁇ at least. Furthermore, when the first drawing pattern 115 and the second drawing pattern 117 are displaced by the maximum amount in the opposite directions, a gap (see the gap 315 in FIG. 12) derived from the dot diameter being a circle may occur. Therefore, if the amount that can fill this gap is ⁇ , the actual overlay amounts Vx and Vy are ⁇ + ⁇ + ⁇ .
  • the number of columns of the second drawing pattern 117 increases or decreases depending on the size of the overlay amounts Vx and Vy and the size of the offset amounts Gx and Gy. That is, it is desirable to increase the number of columns as the overlay amounts Vx, Vy and offset amounts Gx, Gy increase, and it is desirable to decrease the number of columns as the overlay amounts Vx, Vy and offset amounts Gx, Gy decrease.
  • the apparatus PC7 (the control unit 6) of the marking apparatus 1 determines whether or not the entire drawing pattern 113 and the first drawing pattern 115 and the second drawing pattern 117 corresponding to the entire drawing pattern 113 are registered in the storage unit 7a. (S1 in FIG. 14), if registered, marking (pattern drawing) is performed according to the registered pattern (S2 in FIG. 14).
  • the control unit 6 of the apparatus PC 7 When the first drawing pattern 115 and the second drawing pattern 117 are not registered, the control unit 6 of the apparatus PC 7 generates the first drawing pattern 115 and the second drawing pattern 117 (divided drawing pattern) according to the following procedure. sign up.
  • the apparatus PC7 is used as a divided drawing pattern generation unit (or a divided drawing pattern generation apparatus) for generating a divided drawing pattern, but the divided drawing pattern is not produced by the apparatus PC7 but another computer (pattern generation). Apparatus).
  • control unit 6 of the apparatus PC 7 reads pattern shape data such as CAD data corresponding to the entire drawing pattern 113 (S3 in FIG. 14).
  • the control unit 6 of the apparatus PC7 superimposes Vx and Vy of the first drawing pattern 115 and the second drawing pattern 117, and offset amounts Gx, Gy of the first drawing pattern 115 with respect to the edge 313 of the entire drawing pattern 113.
  • the number of columns of the second drawing pattern 117 is set (S4 in FIG. 14). Specifically, the operator inputs the overlay amounts Vx, Vy, the offset amounts Gx, Gy, and the number of columns of the second drawing pattern 117, or reads these data from another PC or storage medium.
  • control unit 6 of the apparatus PC 7 converts the read CAD data into Gerber data (S5 in FIG. 14).
  • the control unit 6 of the apparatus PC 7 divides the Gerber data into a plurality of areas corresponding to the number of laser processing units (S6 in FIG. 14).
  • the way of division and the shape of the region are the same as in FIG. That is, since the marking device 1 has four laser processing parts, the first laser processing parts 3a and 3b and the second laser processing parts 5a and 5b, the Gerber data is divided into four regions.
  • control unit 6 of the apparatus PC 7 generates and registers the first drawing pattern 115 and the second drawing pattern 117 from the divided areas and registers them (S7 in FIG. 14).
  • a specific method of division generation is as described with reference to FIGS. 6 to 14, but will be briefly described below.
  • the divided drawing pattern generation unit sets the shape of the entire drawing pattern 113, the overlapping amounts Vx and Vy of the first drawing pattern 115 and the second drawing pattern 117 set in S4, and the first to the edge 313 of the entire drawing pattern 113.
  • the second drawing pattern 117 is divided and generated based on the offset amounts Gx and Gy of the one drawing pattern 115 and the number of columns of the second drawing pattern 117.
  • the marking device 1 (PLC 37 of the device PC7) drives the unwinder 11 and the winder 13 with a motor or the like (not shown), and the marking area of the film 100 at a position where the first laser processing units 3a and 3b can draw.
  • the film 100 is conveyed so that 203 is arranged (S11 in FIG. 15).
  • the processing table 21 moves under the control of the PLC 37 while adsorbing and holding the lower surface of the marking area 203.
  • the PLC 37 transmits information (movement completion trigger) indicating that the movement is completed and position information of the machining table 21 to the apparatus PC7.
  • the apparatus PC 7 that has received the movement completion trigger and the position information of the processing table 21 matches the position information from the processing layout of the storage unit 7 a based on the position information of the processing table 21 (first drawing pattern). 115) is selected, and processing is instructed to the first laser processing units 3a and 3b (laser processing unit PC39) based on the selected processing layout.
  • the first laser processing units 3a and 3b perform patterning by irradiating the rough processing regions 103a and 103b with laser based on the first drawing pattern 115 (S12 in FIG. 15).
  • the reference mark 71 for position confirmation is drawn in the rough processing regions 103a and 103b by the first laser processing units 3a and 3b.
  • the position confirmation reference mark 71 depicted by the first laser processing parts 3a and 3b is referred to as a first position confirmation reference mark 73.
  • the apparatus PC 7 transmits information (machining completion trigger) indicating that the machining is completed to the PLC 37.
  • the PLC 37 that has received the processing completion trigger drives the unwinder 11 and the winder 13 with a motor or the like (not shown), and the regions corresponding to the previous rough processing regions 103a and 103b are the next micro-processing regions 105a and 105b.
  • the film 100 is conveyed in the + x direction to the position overlapping with (S13 in FIG. 15).
  • the processing table 21 also moves following the conveyance while adsorbing and holding the lower surface of the marking area 203.
  • the PLC 37 uses the alignment unit 27 to image the first position confirmation reference mark 73 moved to the microfabrication areas 105a and 105b by the imaging unit 28, and cause the alignment unit 27 to calculate the position shift. Is not within the allowable range, and if the deviation is not within the allowable range, alignment correction is performed (S14 in FIG. 15, FIG. 16A). The alignment correction is performed, for example, by the PLC 37 controlling the drive stage 29 to correct the positions of the second laser processing units 5a and 5b. When the alignment correction is finished or the calculation of the position deviation is completed (when the position deviation is within an allowable range), the PLC 37 obtains information indicating that the alignment is completed (alignment completion trigger) and the position information of the processing table 21. It transmits to apparatus PC7.
  • the apparatus PC 7 that has received the alignment completion trigger and the position information of the processing table 21, based on the position information of the processing table 21, the first drawing pattern 115 that matches the position information from the processing layout of the storage unit 7 a and The second drawing pattern 117 is selected, and processing is instructed to the first laser processing units 3a and 3b and the second laser processing units 5a and 5b (laser processing unit PC39) based on the selected drawing pattern.
  • the first laser processing units 3a, 3b and the second laser processing units 5a, 5b that have received the instructions are based on the first drawing pattern 115 and the second drawing pattern 117, and the rough processing regions 103a, 103b, and the fine processing region 105a, 105b is irradiated with laser to perform patterning (S15 in FIG. 15, FIG. 16B).
  • the second drawing pattern 117 is formed so that the microfabrication regions 105a and 105b overlap the region where the first drawing pattern 115 is formed in S12, and the entire drawing pattern 113 is drawn.
  • the first laser processing units 3a and 3b depict the first position confirmation reference marks 73 in the rough processing regions 103a and 103b, similarly to S12.
  • the second laser processing parts 5a and 5b also draw the position confirmation reference marks 71 in the micro-processed areas 105a and 105b.
  • the reference mark 71 for position confirmation depicted by the second laser processing parts 5a and 5b is referred to as a second reference mark 75 for position confirmation.
  • the first position confirmation reference mark 73 and the second position confirmation reference mark 75 are drawn so as to overlap with the place where the position confirmation reference mark 71 is to be drawn. .
  • the apparatus PC 7 transmits a machining completion trigger to the PLC 37.
  • the PLC 37 that has received the processing completion trigger uses the alignment unit 27 to pick up an image of a portion where the first position check reference mark 73 and the second position check reference mark 75 are overlapped by the image pickup unit 28, as shown in FIG.
  • the alignment unit 27 measures the relative displacement P between the first position confirmation reference mark 73 and the second position confirmation reference mark 75. If the positional deviation P is not within the allowable range, alignment correction is performed (S16 in FIG. 15, FIG. 16C).
  • As a specific alignment correction method there is a method of correcting the laser irradiation condition using the laser processing unit PC39 in addition to the method described in S14.
  • the PLC 37 of the marking device 1 determines whether or not the position of the processing table 21 is at the movement limit on the downstream side (winder 13 side) (S17 in FIG. 15). If not, the process returns to S13.
  • the marking device 1 When the position of the machining table 21 is at the downstream movement limit, the marking device 1 needs to return the machining table 21 to the upstream side (unwinder 11 side), and therefore moves the machining table 21 according to the following procedure.
  • the PLC 37 of the marking device 1 moves the holding table 25 in the + z direction by using an actuator (not shown) or the like, and sucks and holds the film 100 (S18 in FIG. 15, FIG. 16 (d)).
  • the PLC 37 of the marking device 1 releases the adsorption of the film 100 by the processing table 21, and moves the processing table 21 in the -z direction using the driving unit 23 to separate it from the film 100 (S19 in FIG. 15, FIG. 17 (a)).
  • the PLC 37 of the marking device 1 uses the drive unit 23 to move the processing table 21 in the -x direction and moves it upstream (S20 in FIG. 15, FIG. 17 (b)).
  • the PLC 37 of the marking device 1 uses the driving unit 23 to move the processing table 21 in the direction of + z to come into contact with the film 100 again to attract the film 100 (S21 in FIG. 15, FIG. 17C). .
  • the PLC 37 of the marking device 1 releases the suction of the holding table 25 to the film 100, moves the holding table 25 in the -z direction, and pulls it away from the film 100 (S22 in FIG. 15, FIG. 17 (d)). .
  • the processing table 21 since the processing table 21 always holds the marking area 203 by suction from below, the positional deviation of the film 100 at the time of marking can be minimized.
  • the marking device 1 includes the first laser processing units 3a and 3b as the first marking unit for marking the workpiece with the first dot diameter 303, and the first dots.
  • 2nd laser processing part 5a, 5b as a 2nd marking part which marks a to-be-processed object with the 2nd dot diameter 304 smaller than the diameter 303, and the whole drawing pattern 113 are drawn by the 1st marking part.
  • the first drawing pattern 115 and the second laser processing unit 5a which are drawn by the first laser processing units 3a and 3b, which are divided and registered into the first drawing pattern 115 and the second drawing pattern 117 which is drawn by the second marking unit.
  • An apparatus PC7 serving as a divided drawing pattern registration unit that divides and registers the second drawing pattern 117 to be drawn in 5b, and the first drawing pattern 115;
  • the second drawing pattern 117 is a pattern in which a predetermined overall drawing pattern 113 is formed on a drawing object by being drawn one on top of the other, and the second drawing pattern 117 includes the first drawing pattern 115.
  • a contour pattern that fills the edge 313 is included.
  • the marking device 1 can simultaneously improve processing accuracy and shorten work time.
  • the marking device 1 sets the edge of the first drawing pattern 115 as the second drawing pattern 117, so that even if the region to be drawn with the first drawing pattern 115 actually shifts, the deviation is shifted.
  • the generated amount is drawn in the area of the second drawing pattern 117.
  • the marking device 1 can realize further improvement of processing accuracy and reduction of working time at the same time.
  • the entire drawing pattern 113 is printed with dots that are larger than the first drawing pattern 115 set with the first dot diameter 303 and the first dot diameter 303.
  • a divided drawing pattern registration step (registered in the apparatus PC7 of the marking device 1), which is divided and registered in the second drawing pattern 117 set with the second dot diameter 304 having a small diameter;
  • a first marking step for marking the workpiece based on the first drawing pattern 115 (marking by the first laser processing units 3a and 3b of the marking device 1);
  • a second marking step for marking the workpiece based on the second drawing pattern 117 marking by the second laser processing portions 5a and 5b of the marking device 1);
  • the first drawing pattern 115 and the second drawing pattern 117 are drawn so as to overlap each other, whereby a predetermined overall drawing pattern 113 is formed on the work piece.
  • the pattern 117 includes a contour pattern that fills the edge 313 of the first drawing pattern 115.
  • a predetermined overall drawing pattern 113 in which the first drawing pattern 115 and the second drawing pattern 117 are overlaid on each other is formed on the workpiece marked by the marking apparatus and method according to the present invention.
  • the marking device 1 is exemplified by a device that performs marking using a laser.
  • the present invention is not limited to this, and any device that can mark a workpiece is used.
  • an apparatus for marking using a coating apparatus such as an inkjet or a dispenser may be used.
  • the alignment correction is performed every time the film 100 is moved.
  • the condition for performing the alignment correction is not limited to this, and is constant every time the film 100 is moved several times.
  • the alignment correction may be performed under various conditions such as after a lapse of time or after a new drawing pattern is registered.
  • marking is performed by arranging the first laser processing units 3a and 3b and the second laser processing units 5a and 5b in parallel two by two, but each one or three or more You may arrange a laser processing part.
  • the first drawing pattern 115 is first drawn by the first laser processing units 3a and 3b for the entire drawing pattern 113, and then the film 100 is moved and the second laser processing units 5a and 5b perform the first drawing.
  • the two drawing patterns 117 are drawn, the first drawing pattern 115 and the second drawing pattern 117 may be drawn simultaneously. That is, the drawing may be performed without dividing the processing region into the rough processing region 103a and the fine processing region 105a.
  • the marking object (workpiece) to which the present invention can be applied is not limited to a long sheet such as the film 100, but a rectangular substrate such as a glass plate or a printed board, or a circular substrate such as a semiconductor wafer or a glass wafer. Etc. can be illustrated.
  • the marking according to the present invention includes not only a narrowly-defined marking that prints a predetermined shape such as characters, symbols, and figures on a small area on a large-area workpiece, but also on a large area of the workpiece. Also included are broad markings for drawing (patterning) predetermined shapes such as figures and wiring patterns.

Abstract

L'invention concerne un dispositif de marquage (1) comprenant : une première unité d'usinage laser (3a, 3b) destinée à marquer une pièce à travailler au niveau d'un premier diamètre de point ; une seconde unité d'usinage laser (5a, 5b) en guise de seconde unité de marquage destinée à marquer la pièce à travailler au niveau d'un second diamètre de point qui est inférieur au premier diamètre de point ; et un dispositif (PC7) destiné à enregistrer un motif de dessin divisé en un premier motif de dessin dessiné par la première unité d'usinage laser (3a, 3b) et un second motif de dessin dessiné par la seconde unité d'usinage laser (5a, 5b). Le premier motif de dessin et le second motif de dessin, en étant dessinés de manière mutuellement superposés, forment un motif de dessin prescrit sur la pièce à travailler et le second motif de dessin présente un motif de contour qui remplit la partie de bord du premier motif de dessin, ce qui permet d'obtenir simultanément une précision d'usinage améliorée et un temps de travail raccourci.
PCT/JP2015/083087 2015-01-20 2015-11-25 Procédé et dispositif de marquage, dispositif de production de motif et pièce à travailler WO2016117224A1 (fr)

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JP2015-008320 2015-01-20
JP2015008320 2015-01-20

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WO2016117224A1 true WO2016117224A1 (fr) 2016-07-28

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JP6717353B2 (ja) 2018-10-22 2020-07-01 株式会社Sumco レーザマーク付きシリコンウェーハの製造方法

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JPH10315425A (ja) * 1997-05-20 1998-12-02 Dainippon Screen Mfg Co Ltd レーザ製版装置
JPH11156564A (ja) * 1997-11-28 1999-06-15 Toshiba Ceramics Co Ltd 耐熱性透明体およびその製造方法
JPH10229268A (ja) * 1998-03-26 1998-08-25 Matsushita Electric Works Ltd 回路板の製造方法
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CN109148260B (zh) * 2017-06-19 2023-04-25 胜高股份有限公司 激光标记的刻印方法、带激光标记的硅晶片及其制造方法

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