WO2016143152A1 - 発光素子及び映像表示装置 - Google Patents

発光素子及び映像表示装置 Download PDF

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Publication number
WO2016143152A1
WO2016143152A1 PCT/JP2015/067204 JP2015067204W WO2016143152A1 WO 2016143152 A1 WO2016143152 A1 WO 2016143152A1 JP 2015067204 W JP2015067204 W JP 2015067204W WO 2016143152 A1 WO2016143152 A1 WO 2016143152A1
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WIPO (PCT)
Prior art keywords
light emitting
emitting element
light
boundary surface
case
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PCT/JP2015/067204
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English (en)
French (fr)
Inventor
聡 切通
敏明 花村
将人 寺西
佳祐 中口
博信 川口
Original Assignee
三菱電機株式会社
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to US15/556,489 priority Critical patent/US20180053754A1/en
Priority to EP15884638.6A priority patent/EP3270428A1/en
Priority to JP2017504549A priority patent/JPWO2016143152A1/ja
Priority to CN201580077402.4A priority patent/CN107408611A/zh
Publication of WO2016143152A1 publication Critical patent/WO2016143152A1/ja
Priority to HK18103338.5A priority patent/HK1243826A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
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    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
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    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
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    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/3406—Control of illumination source
    • G09G3/3413—Details of control of colour illumination sources
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
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    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/3406—Control of illumination source
    • G09G3/342—Control of illumination source using several illumination sources separately controlled corresponding to different display panel areas, e.g. along one dimension such as lines
    • G09G3/3426—Control of illumination source using several illumination sources separately controlled corresponding to different display panel areas, e.g. along one dimension such as lines the different display panel areas being distributed in two dimensions, e.g. matrix
    • G—PHYSICS
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    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G09G3/3648—Control of matrices with row and column drivers using an active matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Definitions

  • the present invention relates to a light emitting element and an image display device including the light emitting element.
  • a large video display device in which a large number of light emitting elements are arranged in a matrix in the vertical and horizontal directions on a display screen is often installed outdoors such as sports facilities and building walls.
  • This video display device displays characters, figures, and other images on a display screen by changing the luminance and emission color of each light emitting element in accordance with a video signal input from the outside (for example, Patent Documents). 1, 2).
  • the light emitting element used in the video display device is configured by arranging a light source such as an LED (light emitting diode, light emitting diode) at the bottom of the concave portion of the case and filling the concave portion with a transparent resin.
  • the light rays emitted from the light source are transmitted to the outside through the transparent resin.
  • the boundary surface of the transparent resin in contact with the outer space of the case, that is, the light emitting surface of the light emitting element is formed flat (for example, Patent Documents 3 and 4).
  • the refractive index of the transparent resin provided in the light emitting element is larger than the refractive index of air, refraction occurs when the light emitted from the light source passes through the boundary surface between the transparent resin and the external air.
  • the angle of incidence on the boundary surface increases, so the refraction angle also increases.
  • the refraction angle is increased, the light emission of the light emitting element is diffused over a wide range, so that the directivity is deteriorated. If the directivity characteristic of the light emitting element is deteriorated, the image quality of the image of the image display device is deteriorated, which is not preferable.
  • the incident angle at the peripheral edge of the light emitting element is further increased, so that the refraction angle is further increased and the directivity is further deteriorated. If the incident angle exceeds the critical angle, total reflection occurs at the boundary surface, so that light emitted from the light source cannot exit the case. As a result, there also arises a problem that the substantial light amount of the light emitting element is reduced.
  • the present invention has been made based on such a background, and an object thereof is to improve the directivity characteristics of a light emitting element. It is another object of the present invention to suppress the total reflection at the boundary surface and increase the substantial light amount of the light emitting element. Another object of the present invention is to improve the image quality of an image displayed on a video display device.
  • the present invention comprises a case having a recess, a light source disposed in the recess of the case, and a transparent member that closes the recess and transmits light emitted from the light source. At least at the peripheral edge of the transparent member, the boundary surface where the transparent member is in contact with the space outside the case is inclined so as to gradually approach the bottom surface of the concave portion as the distance from the optical axis of the light source increases.
  • the boundary surface where the transparent member is in contact with the external space is provided with an inclined surface that gradually approaches the bottom surface of the recess as it moves away from the optical axis of the light source, at least at the peripheral portion of the transparent member.
  • the incident angle of emitted light incident on the boundary surface is reduced. If the incident angle is reduced, the refraction angle is also reduced, so that the range in which light emission is diffused is narrowed. As a result, the directivity characteristics of the light emitting element are improved. Further, if the inclination angle is selected so that the refraction angle is smaller than the critical angle, total reflection does not occur, so that the substantial light quantity of the light emitting element increases.
  • the directivity of the light emitting element is improved and the substantial amount of light is increased. Therefore, a bright and sharp image can be obtained by configuring the video display device with the light emitting element according to the present invention. That is, according to the present invention, the image quality of the video display device is improved.
  • FIG. 1 is a configuration diagram of a video display device according to an embodiment of the present invention. It is a block diagram which shows the usage condition of the video display apparatus shown in FIG. It is sectional drawing which shows the structure of the light emitting element which concerns on a modification. It is a side view which shows the structure of the light emitting element which concerns on another modification. It is a side view which shows the structure of the light emitting element which concerns on another modification.
  • FIG. 1A to 1C are configuration diagrams of a light emitting device 1 according to an embodiment of the present invention.
  • FIG. 1A is a plan view of the light emitting element 1
  • FIG. 1B is a side view of the light emitting element 1.
  • 1C is a cross-sectional view of the light-emitting element 1 taken along the line A-A ′ of FIG. 1A.
  • the light-emitting element 1 is configured by housing three LED chips 3r, 3g, and 3b that function as a light source of the light-emitting element 1 inside the case 2.
  • the LED chips 3r, 3g, and 3b include light emitting diodes that emit red, green, and blue light, respectively.
  • the light-emitting element 1 can obtain various emission colors by changing the emission intensity (luminance) of the LED chips 3r, 3g, and 3b. Further, the ends of the three sets of extraction electrodes 4r, 5r, 4g, 5g, 4b, and 5b are exposed outside the case 2.
  • the case 2 is a resin molded product that holds the LED chips 3r, 3g, 3b and the like and constitutes the outer shell of the light emitting element 1.
  • the material of the case 2 is, for example, a thermoplastic resin such as a polyphthalamide resin, or a thermosetting resin such as a silicone resin or an epoxy resin, but is not limited thereto.
  • the case 2 has a recess 6 formed therein.
  • extraction electrodes 4 g and 5 g are arranged in the recess 6, and the extraction electrodes 4g and 5g extend toward the outside of the case 2, and the end portions thereof are exposed to the outside of the case 2 as described above.
  • the extraction electrodes 4r, 5r, 4b, and 5b are similarly arranged.
  • the LED chip 3g disposed inside the recess 6 is placed on the extraction electrode 4g and electrically connected to the extraction electrode 4g.
  • One end of the bonding wire 7 is electrically connected to the upper surface of the LED chip 3g, and the other end of the bonding wire 7 is electrically connected to the extraction electrode 5g.
  • the LED chips 3r and 3b are also mounted on the extraction electrodes 4r and 4b, respectively, and are electrically connected to the extraction electrodes 4r and 4b.
  • the LED chips 3r and 3b are also electrically connected to the extraction electrodes 5r and 5b via the bonding wires 7, respectively.
  • the concave portion 6 is filled with a transparent resin to form a sealing member 8.
  • the sealing member 8 is a member that closes the concave portion 6 and seals the LED chips 3r, 3g, and 3b inside the concave portion 6, and is an example of the transparent member of the present invention.
  • the sealing member 8 is also a member that transmits light emitted from the LED chips 3r, 3g, and 3b.
  • the material of the sealing member 8 is, for example, an epoxy resin or a silicone resin, but is not limited thereto.
  • the sealing member 8 bulges outside the case 2, and the boundary surface 9 with the space outside the light emitting element 1 forms a convex curved surface having a convex lens shape.
  • the boundary surface 9 is the farthest from the bottom surface 6a of the recess 6 at the center, that is, the intersection 11 of the optical axis 10 of the LED chip 3g and the boundary surface 9, and the recess 9 6 is inclined so as to approach the bottom surface 6a. Further, the inclination of the boundary surface 9 increases as the distance from the intersection 11 increases.
  • the boundary surface 9 of the sealing member 8 is provided with a slope that gradually approaches the bottom surface 6a of the recess 6 as the distance from the optical axis 10 increases in the entire range from the intersection 11 with the optical axis 10 to the boundary with the recess 6. ing.
  • the light emitting element 1 is manufactured by the following process. First, the extraction electrodes 4r, 5r, 4g, 5g, 4b, and 5b are arranged inside a molding die (not shown), resin is injected into the molding die to mold the case 2, and at the same time, the extraction electrodes 4r and 5r. 4g, 5g, 4b and 5b are fixed to the case 2.
  • the material of the case 2 is, for example, a thermoplastic resin such as a polyphthalamide resin, or a thermosetting resin such as a silicone resin or an epoxy resin.
  • light reflecting particles such as titanium dioxide may be mixed in the resin.
  • the LED chips 3r, 3g, and 3b are joined to the extraction electrodes 4r, 4g, and 4b in the recess 6 of the case 2. Then, the LED chips 3r, 3g, 3b and the extraction electrodes 5r, 5g, 5b are electrically connected via the bonding wires 7.
  • a liquid transparent resin is injected into the recess 6 to form the sealing member 8.
  • an amount of resin exceeding the volume of the recess 6 is injected into the recess 6 at a low speed.
  • the resin is injected at a low speed, the liquid level of the resin overflowing from the concave portion 6 rises like a convex lens due to the action of surface tension.
  • a convex lens-shaped boundary surface 9 is formed.
  • the material of the sealing member 8 is, for example, an epoxy resin or a silicone resin.
  • the boundary surface 9 of the sealing member 8 is not inclined, that is, assuming that the boundary surface 9 of the sealing member 8 is a horizontal plane as shown in FIG. 2, the light emitted from the LED chip 3g is sealed. incident at an incident angle i 0 to the peripheral portion of the member 8, is emitted at angle of refraction r 0. Since the boundary surface 9 of the actual sealing member 8 is inclined toward the bottom surface 6a of the concave portion 6 at the peripheral portion, that is, the boundary surface 9 has an inclined surface as shown in FIG.
  • the light beam that has passed through the inclined surface is less inclined with respect to the optical axis 10 than the light beam that has passed through the horizontal plane. In this way, the light beam that has passed through the inclined surface spreads smaller than the light beam that has passed through the horizontal plane, so that the directivity is enhanced.
  • the inclination of the inclined surface is set so that the incident angle i 0 is smaller than the critical angle of the material constituting the sealing member 8, total reflection does not occur at the boundary surface 9 of the sealing member 8. That is, if the inclination of the inclined surface is set appropriately, total reflection at the boundary surface 9 can be prevented, and the substantial light quantity of the light emitting element 1 can be increased.
  • FIG. 3 is a configuration diagram of the video display device 12 according to the embodiment of the present invention.
  • the display screen 13 of the video display device 12 is configured by arranging a large number of light emitting elements 1 on a substrate 14 in a matrix in the vertical and horizontal directions. That is, a large number of light emitting elements 1 are arranged in the horizontal direction to form a light emitting element row 15, and a large number of light emitting element rows 15 are arranged in the vertical direction.
  • a wiring pattern (not shown) is formed on the substrate 14, and the extraction electrodes 4 r, 5 r, 4 g, 5 g, 4 b, and 5 b (not shown in FIG. 3) of each light emitting element 1 are respectively connected to the wiring pattern. Connected.
  • the video display device 12 includes a driver 16.
  • the driver 16 is an electric circuit that is connected to each light emitting element 1 through the wiring pattern described above, distributes the power supplied from the power source to a large number of light emitting elements 1 and individually adjusts the luminance and color of the light emitting element 1. is there.
  • the video display device 12 is used by being connected to a video signal source 18 via a host controller 17 as shown in FIG.
  • the video signal source 18 is, for example, a server that outputs a video signal stored in advance to the host controller 17.
  • the host controller 17 converts the video signal input from the video signal source 18 according to the arrangement of the light emitting elements 1 in the video display device 12, determines the luminance and color development of each light emitting element 1, and outputs them to the driver 16. Computer.
  • the video display device 12 individually adjusts the luminance and color of the light emitting elements 1 arranged on the substrate 14 and displays an image on the display screen 13. Then, the image is changed over time to display a moving image (video).
  • the display screen 13 of the video display device 12 corresponds to a small video display device, for example, a screen of a liquid crystal display, and one light emitting element 1 corresponds to one pixel.
  • the light emitting element 1 has improved directivity characteristics, is prevented from total reflection, and the substantial light quantity is increased. Therefore, the image display device 12 can obtain a sharp and bright image. That is, by providing the light emitting element 1 in the video display device 12, the image quality of the video display device 12 is improved.
  • the incident angle of the light emitted from the light source of the light emitting element to the boundary surface of the transparent member is reduced, and as a result, the refraction angle is reduced.
  • the directivity is improved.
  • by making the incident angle smaller than the critical angle it is possible to prevent total reflection and increase the substantial light quantity of the light emitting element.
  • the image quality of the video display apparatus is improved if the image display apparatus is constituted by the light emitting element according to the present invention.
  • the said embodiment is an illustration of the specific embodiment of this invention, and the technical scope of this invention is not limited by description of the said embodiment.
  • the present invention can be freely modified or improved within the scope of the technical idea shown in the claims.
  • the addition of the component which is not disclosed in the said embodiment is arbitrary.
  • the sealing member 8 in which liquid resin is injected and filled in the recess 6 of the case 2 and then cured is used as the transparent member. It is not limited to what is done.
  • the sealing member 8 manufactured in another process, that is, already solidified may be fitted into the recess 6.
  • the boundary surface 9 of the sealing member 8 in the shape of a convex lens was illustrated.
  • an inclined surface that gradually approaches the bottom surface 6a of the recess 6 as it moves away from the optical axis 10 is formed in the entire range of the boundary surface 9 of the sealing member 8, and the inclination toward the bottom surface 6a increases as the distance from the optical axis 10 increases.
  • An example was shown that was formed.
  • the shape of the boundary surface 9 is not limited to this.
  • the inclination of the boundary surface 9 may be constant regardless of the distance from the optical axis 10.
  • the boundary surface 9 of the sealing member 8 may be a conical surface.
  • the inclined surface is formed in a portion of the boundary surface 9 where the incident angle increases. It suffices if the inclined surface is formed at a part away from the optical axis 10, that is, at the peripheral edge of the boundary surface 9. This is because a portion that is not separated from the optical axis 10 has a small incident angle even when the boundary surface 9 is flat, and thus large refraction does not occur.
  • the boundary surface 9 of the sealing member 8 may have a truncated cone shape.
  • the number of LED chips 3r, 3g, 3b provided in the light emitting element 1 is not limited to three. One or two may be sufficient, and four or more may be sufficient. Further, the emission color of the light emitting element 1 is not limited. The combination of luminescent colors is arbitrary. A chip provided with a plurality of light emitting diodes with different colors on one substrate may be provided as a light source.
  • the host controller 17 is an external device of the video display device 12, but the host controller 17 may be incorporated in the video display device 12.
  • 1 light emitting element 2 case, 3r, 3g, 3b LED chip, 4r, 4g, 4b, 5r, 5g, 5b extraction electrode, 6 recess, 6a bottom surface, 7 bonding wire, 8 sealing member, 9 boundary surface, 10 light Axis, 11 intersections, 12 video display devices, 13 display screens, 14 substrates, 15 light emitting element rows, 16 drivers, 17 host controller, 18 video signal sources

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Abstract

　発光素子（１）は、凹部（６）を備えるケース（２）と、ケース（２）の凹部（６）の底面（６ａ）に配置されたＬＥＤチップ（３ｇ）と、凹部（６）を閉蓋するとともに、ＬＥＤチップ（３ｇ）の発光を透過させる封止部材（８）を備え、封止部材（８）がケース（２）の外部の空間と接する境界面（９）は、ＬＥＤチップ（３ｇ）の光軸から離れるに従って凹部（６）の底面（６ａ）に漸近する傾斜を、少なくとも封止部材（８）の周縁部に備える。

Description

発光素子及び映像表示装置
　この発明は、発光素子と、発光素子を備える映像表示装置に関する。
　表示画面上に多数個の発光素子を縦方向及び横方向にマトリクス状に配列した大型の映像表示装置は、スポーツ施設、建物壁等、屋外に設置されることが多い。この映像表示装置は、外部から入力されるビデオ信号に応じて、各発光素子の輝度と発光色を変化させて、表示画面上に、文字、図形及びその他の画像を表示する（例えば、特許文献１，２）。
　映像表示装置に使用される発光素子は、例えばＬＥＤ（light emitting diode、発光ダイオード）のような光源をケースの凹部の底に配置して、凹部に透明樹脂を充填して構成される。光源が放射する光線は透明樹脂を透過して外部に放出される。ケースの外部空間と接する透明樹脂の境界面、つまり、発光素子の発光面はフラットに形成される（例えば、特許文献３，４）。
特開平１１－３０５６８９号公報 特開２００６－３０８７１３号公報 特開２０１２－１０９４６１号公報 特開２０１５－２６８７１号公報
　発光素子が備える透明樹脂の屈折率は空気の屈折率より大きいので、光源を発した発光が透明樹脂と外部空気との境界面を通過する際には屈折が生じる。特に発光素子の光軸から離れた周縁部では、境界面への入射角が大きくなるので、屈折角も大きくなる。屈折角が大きくなると、発光素子の発光が広い範囲に拡散するので、指向特性が低下する。発光素子の指向特性が低下すると、映像表示装置の映像の画質が低下するので好ましくない。
　発光素子を小型化、薄型化すると、発光素子の周縁部における入射角はさらに大きくなるので、屈折角はさらに大きくなり、指向特性はさらに低下する。また、入射角が臨界角を超えると、境界面で全反射が生じるので、光源を発した発光はケースを出ることが出来なくなる。その結果、発光素子の実質的な光量が低下するという問題も生じる。
　この発明は、このような背景に基づいてなされたものであり、発光素子の指向特性を向上させることを目的とする。また、境界面での全反射を抑制して発光素子の実質的な光量を増加させることを目的とする。また、映像表示装置に表示される画像の画質を改善することを目的とする。
　上記目的を達成するために、この発明は、凹部を備えるケースと、ケースの凹部に配置された光源と、凹部を閉蓋するとともに、光源の発光を透過させる透明部材を備えて発光素子を構成し、少なくとも透明部材の周縁部において、透明部材がケースの外部の空間と接する境界面を、光源の光軸から離れるに従って凹部の底面に漸近するように傾斜させるものである。
　この発明によれば、透明部材が外部の空間と接する境界面は、光源の光軸から離れるに従って凹部の底面に漸近する斜面を、少なくとも透明部材の周縁部に備えるので、透明部材の周縁部において、境界面に入射する発光の入射角が小さくなる。入射角が小さくなれば、屈折角も小さくなるので、発光が拡散する範囲が狭くなる。その結果、発光素子の指向特性が向上する。また、屈折角が臨界角より小さくなるように、傾斜角度を選べば、全反射が生じないので、発光素子の実質的な光量が増加する。このように、発光素子の指向特性が向上し、実質的な光量が増加するので、この発明に係る発光素子で映像表示装置を構成すれば、明るくシャープな画像が得られる。つまり、この発明によれば、映像表示装置の画質が改善される。
本発明の実施形態に係る発光素子の平面図である。 図１Ａに示した発光素子の側面図である。 図１Ａに示した発光素子を、図１ＡのＡ－Ａ’線で切断した断面図である。 図１Ａから図１Ｃに示した発光素子の作用を説明する断面図である。 本発明の実施形態に係る映像表示装置の構成図である。 図３に示した映像表示装置の使用態様を示す構成図である。 変形例に係る発光素子の構成を示す断面図である。 別の変形例に係る発光素子の構成を示す側面図である。 更に別の変形例に係る発光素子の構成を示す側面図である。
　以下、この発明に係る発光素子及び映像表示装置の実施形態を、図面を参照しながら詳細に説明する。なお、各図面においては、同一または同等の部分に同一の符号を付している。
　図１Ａから図１Ｃまでの各図はこの発明の実施形態に係る発光素子１の構成図である。図１Ａは、発光素子１の平面図であり、図１Ｂは発光素子１の側面図である。また、図１Ｃは発光素子１を図１ＡのＡ－Ａ’線で切断した断面図である。
　図１Ａに示すように、発光素子１は、ケース２の内部に、発光素子１の光源として機能する３個のＬＥＤチップ３ｒ、３ｇ、３ｂを収容して構成される。ＬＥＤチップ３ｒ、３ｇ、３ｂは、それぞれ赤色、緑色、青色に発光する発光ダイオード（light emitting diode）を備える。発光素子１はＬＥＤチップ３ｒ、３ｇ、３ｂの発光強度（輝度）を変化させて、様々な発光色を得ることができる。また、ケース２の外部には、３組の引出電極４ｒ、５ｒ、４ｇ、５ｇ、４ｂ、５ｂの端部が露出している。なお、ケース２はＬＥＤチップ３ｒ、３ｇ、３ｂ等を保持して、発光素子１の外殻を構成する樹脂成形品である。ケース２の素材は、例えば、ポリフタルアミド樹脂等の熱可塑性樹脂、シリコーン樹脂、エポキシ樹脂等の熱硬化性樹脂であるが、これらには限定されない。
　図１Ｃに示すように、ケース２には凹部６が形成されている。凹部６には引出電極４ｇ、５ｇが配置されている。引出電極４ｇ、５ｇはケース２の外側に向かって延びていて、前述したように、その端部はケース２の外部に露出している。また、引出電極４ｒ、５ｒ、４ｂ、５ｂも同様に配置されている。
　凹部６の内部に配置されたＬＥＤチップ３ｇは引出電極４ｇの上に載置されて、引出電極４ｇに電気的に接続されている。ＬＥＤチップ３ｇの上面にはボンディングワイヤ７の一方端が電気的に接続され、ボンディングワイヤ７の他方端は引出電極５ｇに電気的に接続されている。同様に、ＬＥＤチップ３ｒ、３ｂも、それぞれ引出電極４ｒ、４ｂに載置され、引出電極４ｒ、４ｂに電気的に接続されている。そして、ＬＥＤチップ３ｒ、３ｂも、それぞれボンディングワイヤ７を介して引出電極５ｒ、５ｂに電気的に接続されている。凹部６には透明な樹脂が充填され、封止部材８を形成している。封止部材８は、凹部６を閉蓋して、ＬＥＤチップ３ｒ、３ｇ、３ｂを凹部６の内部に封止する部材であって、この発明の透明部材の例示である。また、封止部材８は、ＬＥＤチップ３ｒ、３ｇ、３ｂが発する光線を透過させる部材でもある。封止部材８の素材は、例えば、エポキシ樹脂やシリコーン樹脂であるが、これらに限定される訳ではない。
　封止部材８はケース２の外側に膨出していて、発光素子１の外側の空間との境界面９は凸レンズ状の凸曲面を形成している。図１Ｂに示すように、境界面９は、その中心、つまりＬＥＤチップ３ｇの光軸１０と境界面９の交点１１において凹部６の底面６ａから最も離隔していて、交点１１から遠ざかるに従って、凹部６の底面６ａに近づくように傾斜している。また、境界面９の傾斜は交点１１から遠ざかるに従って大きくなる。側面図（図１Ｂ）及び断面図（図１Ｃ）に現れる境界面９の傾斜は、凹部６との境界、つまり封止部材８の周縁部において最大になる。このように、封止部材８の境界面９は、光軸１０との交点１１から凹部６との境界に至る全範囲において、光軸１０から離れるに従って凹部６の底面６ａに漸近する斜面を備えている。
　発光素子１は、以下のようなプロセスで製造される。まず、図示しない成形型の内部に、引出電極４ｒ、５ｒ、４ｇ、５ｇ、４ｂ、５ｂを配置して、該成形型に樹脂を注入して、ケース２を成形すると同時に、引出電極４ｒ、５ｒ、４ｇ、５ｇ、４ｂ、５ｂをケース２に固定する。前述したように、ケース２の素材は、例えば、ポリフタルアミド樹脂等の熱可塑性樹脂、シリコーン樹脂、エポキシ樹脂等の熱硬化性樹脂である。また、光反射率を向上させるために、樹脂に二酸化チタン等の光反射粒子を混合しても良い。
　ケース２が成形されたら、ケース２の凹部６の内部において、ＬＥＤチップ３ｒ、３ｇ、３ｂを引出電極４ｒ、４ｇ、４ｂに接合する。そして、ボンディングワイヤ７を介して、ＬＥＤチップ３ｒ、３ｇ、３ｂと引出電極５ｒ、５ｇ、５ｂを電気的に接続する。
　最後に、凹部６に液状の透明な樹脂を注入して、封止部材８を形成する。この時、凹部６の容積を超える量の樹脂を、低速度で凹部６に注入する。樹脂を低速度で注入すると、凹部６から溢れた樹脂の液面は、表面張力の作用で凸レンズ状に盛り上がる。これをそのまま硬化させると、凸レンズ状の境界面９が形成される。なお、前述したように、封止部材８の素材は、例えば、エポキシ樹脂やシリコーン樹脂である。
　次に、図２を参照して、発光素子１の作用を説明する。封止部材８の境界面９が傾斜していないと仮定すると、つまり封止部材８の境界面９が図２に示すような水平面であると仮定すると、ＬＥＤチップ３ｇから発した光線は封止部材８の周縁部に入射角ｉ０で入射して、屈折角ｒ０で出射する。実際の封止部材８の境界面９は周縁部において、凹部６の底面６ａに向かって傾斜しているので、つまり境界面９は周縁部において、図２に示すような傾斜面を備えているので、ＬＥＤチップ３ｇから発した光線は封止部材８の周縁部に入射角ｉ１で入射し、屈折角ｒ１で出射する。入射角ｉ１は入射角ｉ０より小さいので、屈折角ｒ１は屈折角ｒ０よりも小さくなる。そのため、傾斜面を通過した光線は水平面を通過した光線よりも光軸１０に対する傾きが小さくなる。このように、傾斜面を通過した光線は水平面を通過した光線よりも小さく広がるので、指向特性が高くなる。
　また、入射角ｉ０が封止部材８を構成する材料の臨界角より小さくなるように、傾斜面の傾きを設定すれば、封止部材８の境界面９では全反射が生じない。つまり、傾斜面の傾きを適切に設定すれば、境界面９での全反射を防止して、発光素子１の実質的な光量を大きくすることができる。
　図３はこの発明の実施形態に係る映像表示装置１２の構成図である。図３に示すように、映像表示装置１２の表示画面１３は基板１４の上に多数の発光素子１を縦方向及び横方向にマトリクス状に配列して構成される。すなわち、多数の発光素子１を水平方向に配列して、発光素子列１５を形成し、多数の発光素子列１５を垂直方向に配列している。また、基板１４には図示されない配線パターンが形成されていて、各発光素子１の引出電極４ｒ、５ｒ、４ｇ、５ｇ、４ｂ、５ｂ（図３において図示せず）は、それぞれ、該配線パターンに接続される。
　また、映像表示装置１２は、ドライバ１６を備える。ドライバ１６は前述した配線パターンを介して各発光素子１に接続され、電源から供給される電力を多数の発光素子１に分配して、発光素子１の輝度と発色を個々に調整する電気回路である。
　映像表示装置１２は、図４に示すように、上位コントローラ１７を介してビデオ信号源１８に接続されて使用される。ビデオ信号源１８は、例えば、事前に保存されたビデオ信号を上位コントローラ１７に出力するサーバである。上位コントローラ１７はビデオ信号源１８から入力されたビデオ信号を、映像表示装置１２における発光素子１の配列に合わせて変換し、個々の発光素子１の輝度と発色を決定して、ドライバ１６に出力するコンピュータである。
　このように、映像表示装置１２は、基板１４上に多数配置された発光素子１の輝度と発色を個々に調整して、表示画面１３上に画像を表示する。そして、該画像を時間の経過に従って変化させて、動画像（映像）を表示する。映像表示装置１２の表示画面１３は、小型の映像表示装置、例えば液晶ディスプレイのスクリーンに相当し、１個の発光素子１は１画素に相当する。
　なお、前述したように、発光素子１は指向特性が改善されるとともに、全反射が防止され、実質的な光量が増大しているので、映像表示装置１２では、シャープで明るい画像が得られる。つまり、映像表示装置１２に発光素子１を備えることによって、映像表示装置１２の画質が改善される。
　以上、説明したように、この発明によれば、発光素子の光源から発せられる光線の透明部材の境界面への入射角が小さくされて、その結果、屈折角が小さくされるので、発光素子の指向特性が改善される。また、入射角を臨界角より小さくすることによって、全反射を防止して発光素子の実質的な光量を大きくすることができる。このように発光素子の指向特性と実質的な光量が改善されるので、この発明に係る発光素子で映像表示装置を構成すれば、映像表示装置の画質が改善される。
　なお、上記実施形態はこの発明の具体的な実施態様の例示であって、この発明の技術的範囲は、上記実施形態の記載によっては限定されない。この発明は、請求の範囲に示された技術的思想の範囲において、自由に変形あるいは改良して実施することが出来る。また、上記実施形態において開示されていない構成要素の追加は任意である。
　例えば、上記実施形態においては、液状の樹脂をケース２の凹部６に注入充填して、その後硬化させた封止部材８を透明部材とする例を示したが、透明部材は、かかるプロセスで製造されるものには限定されない。例えば、図５に示すように、別の工程で製造された、つまり、既に固体化された封止部材８を凹部６に嵌め込むようにしても良い。
　また、上記実施形態においては、封止部材８の境界面９を凸レンズ状に形成することを例示した。言い替えれば、光軸１０から離れるに従って凹部６の底面６ａに漸近する斜面が封止部材８の境界面９の全範囲に形成されていて、しかも光軸１０から離れるに従って底面６ａに向かう傾斜が大きくなるよう形成された例を示した。しかしながら、境界面９の形状は、このようなものには限定されない。
　境界面９の傾斜は、光軸１０からの距離に関係なく一定であっても良い。例えば、図６に示すように、封止部材８の境界面９が円錐面をなすようにしても良い。
　また、斜面は境界面９の内、入射角が大きくなる部位に形成されていれば足りる。斜面は光軸１０から離れた部位、つまり境界面９の周縁部に形成されていれば足りる。光軸１０から離れていない部位は、境界面９をフラットにしていても、入射角が小さいので大きな屈折は生じないからである。例えば、図７に示すように、封止部材８の境界面９が円錐台形をなすようにしても良い。
　発光素子１が備えるＬＥＤチップ３ｒ、３ｇ、３ｂの数は３個には限定されない。１個あるいは２個であっても良いし、４個以上であっても良い。また、発光素子１の発光色は限定されない。発光色の組合せは任意である。１個の基板に発色の異なる複数個の発光ダイオードを備えたチップを光源として備えても良い。
　上記実施形態においては、上位コントローラ１７を映像表示装置１２の外部装置としたが、上位コントローラ１７が映像表示装置１２の内部に組み込まれていても良い。
　本発明は、本発明の広義の精神と範囲を逸脱することなく、様々な実施形態及び変形が可能とされるものである。また、上述した実施形態は、本発明を説明するためのものであり、本発明の範囲を限定するものではない。つまり、本発明の範囲は、実施形態ではなく、請求の範囲によって示される。そして、請求の範囲内及びそれと同等の発明の意義の範囲内で施される様々な変形が、本発明の範囲内とみなされる。
　本出願は、２０１５年３月１２日に出願された、日本国特許出願特願２０１５－０４８９５４号に基づく。本明細書中に日本国特許出願特願２０１５－０４８９５４号の明細書、特許請求の範囲、図面全体を参照として取り込むものとする。
１　発光素子、２　ケース、３ｒ，３ｇ，３ｂ　ＬＥＤチップ、４ｒ，４ｇ，４ｂ，５ｒ，５ｇ，５ｂ　引出電極、６　凹部、６ａ　底面、７　ボンディングワイヤ、８　封止部材、９　境界面、１０　光軸、１１　交点、１２　映像表示装置、１３　表示画面、１４　基板、１５　発光素子列、１６　ドライバ、１７　上位コントローラ、１８　ビデオ信号源

Claims (5)

  1. 　凹部を備えるケースと、
    　前記ケースの前記凹部に配置された光源と、
    　前記凹部を閉蓋するとともに、前記光源の発光を透過させる透明部材を備え、
    　前記透明部材が前記ケースの外部の空間と接する境界面は、前記光源の光軸から離れるに従って前記凹部の底面に漸近する傾斜を、少なくとも前記透明部材の周縁部に備える
    　発光素子。
  2. 　前記境界面は凸レンズ状に形成されている
    　請求項１に記載の発光素子。
  3. 　前記境界面は円錐状に形成されている
    　請求項１に記載の発光素子。
  4. 　前記境界面は円錐台状に形成されている
    　請求項１に記載の発光素子。
  5. 　縦方向及び横方向にマトリクス状に配列された、請求項１から請求項４のいずれか一項に記載の複数個の発光素子を備える映像表示装置。
PCT/JP2015/067204 2015-03-12 2015-06-15 発光素子及び映像表示装置 WO2016143152A1 (ja)

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