JP2012028523A - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP2012028523A JP2012028523A JP2010165154A JP2010165154A JP2012028523A JP 2012028523 A JP2012028523 A JP 2012028523A JP 2010165154 A JP2010165154 A JP 2010165154A JP 2010165154 A JP2010165154 A JP 2010165154A JP 2012028523 A JP2012028523 A JP 2012028523A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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Abstract
【解決手段】発光素子11が搭載される搭載面12の周囲に反射面140を配置する。発光素子11と反射面140との間の空間を封止部材16で封止する。封止部材16は、反射面よりも上側に突出する部分を有し、突出する部分は、円錐形である。反射面140は、発光素子からの入射する光を上方に向けて正反射するとともに、予め定めた割合で拡散光を生じる拡散反射面である。円錐形の封止部材16の円錐面は、発光素子11から出射され、拡散反射面で正反射された光が直接入射する位置にある。
【選択図】図3
Description
(第1の実施形態)
図3に、第1の実施形態の発光装置の断面図を示す。この発光装置は、リードフレーム12を表面に備えた樹脂製の基板13と、基板13上に搭載されたリフレクタ部14と、リードフレーム12上にダイボンディングされたLEDチップ11と、LEDチップ11を封止する封止樹脂16とを備えて構成される。LEDチップ11は、上面に一対の電極(不図示)を有し、これらの電極は、ボンディングワイヤ15によりリードフレーム12にそれぞれ接続されている。
本発明の第2の実施形態の発光装置について説明する。
第3の実施形態の砲弾型の発光装置を図9に示す。この発光装置は、リードフレーム12が拡散反射面140を備える形状に加工され、リフレクタを兼用している。リードフレーム12を内包するように封止樹脂16で封止されている。封止樹脂16は、少なくともリードフレーム12よりも上の部分が円錐形に形成されている。リードフレーム12がLEDチップ11を搭載する面には、高反射率膜が配置されていることが望ましい。拡散反射面140は、高反射率のリードフレーム12の表面を粗面加工することにより形成されている。
Claims (5)
- 発光素子が搭載される搭載面と、前記搭載面の前記発光素子の周囲に配置された反射面と、前記発光素子と反射面との間の空間を少なくとも封止する封止部材とを有し、
前記封止部材は、前記反射面よりも上側に突出する部分を有し、該突出する部分は、円錐形であり、
前記反射面は、前記発光素子からの入射する光を上方に向けて正反射するとともに、予め定めた割合で拡散光を生じる拡散反射面であることを特徴とする発光装置。 - 請求項1に記載の発光装置において、前記円錐形の封止部材の円錐面は、前記発光素子から出射され、前記拡散反射面で正反射された光が直接入射する位置にあることを特徴とする発光装置。
- 請求項1または2に記載の発光装置において、前記搭載面は、前記発光素子の光を反射する反射面であることを特徴とする発光装置。
- 請求項1ないし3のいずれか1項に記載の発光装置において、前記反射面は、光拡散性の粒子を分散させた樹脂、光拡散性のセラミック、および、表面が粗面の金属膜のいずれかにより構成されていることを特徴とする発光装置。
- 請求項1ないし4のいずれか1項に記載の発光装置において、前記発光素子は、複数であり、前記円錐形の封止部材の中心からずれた位置にそれぞれ搭載されていることを特徴とする発光装置。
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JP2010165154A JP5507372B2 (ja) | 2010-07-22 | 2010-07-22 | 発光装置 |
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JP2010165154A JP5507372B2 (ja) | 2010-07-22 | 2010-07-22 | 発光装置 |
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JP2012028523A true JP2012028523A (ja) | 2012-02-09 |
JP5507372B2 JP5507372B2 (ja) | 2014-05-28 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013143134A1 (zh) * | 2012-03-29 | 2013-10-03 | 深圳市华星光电技术有限公司 | 一种led、背光模组和液晶显示装置 |
JP2014107462A (ja) * | 2012-11-29 | 2014-06-09 | Mitsubishi Electric Corp | Ledパッケージ装置及びled表示装置 |
JP2014112604A (ja) * | 2012-12-05 | 2014-06-19 | Nichia Chem Ind Ltd | 発光ユニット |
WO2016143152A1 (ja) * | 2015-03-12 | 2016-09-15 | 三菱電機株式会社 | 発光素子及び映像表示装置 |
CN113302501A (zh) * | 2019-01-17 | 2021-08-24 | Koa株式会社 | 流量传感器装置以及带外罩的流量传感器装置 |
WO2021199614A1 (ja) * | 2020-04-01 | 2021-10-07 | 株式会社ジャパンディスプレイ | 表示装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58204575A (ja) * | 1982-05-24 | 1983-11-29 | Mitsubishi Rayon Co Ltd | 半導体発光素子 |
JP2004191718A (ja) * | 2002-12-12 | 2004-07-08 | Mitsubishi Electric Corp | Led光源装置 |
JP2006054396A (ja) * | 2004-08-16 | 2006-02-23 | Toshiba Discrete Technology Kk | 発光装置 |
JP2006216953A (ja) * | 2005-01-31 | 2006-08-17 | Samsung Electronics Co Ltd | 発光ダイオード素子 |
JP2008192928A (ja) * | 2007-02-06 | 2008-08-21 | Masaaki Kano | リードプレート型ledランプ及びled照明装置 |
-
2010
- 2010-07-22 JP JP2010165154A patent/JP5507372B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58204575A (ja) * | 1982-05-24 | 1983-11-29 | Mitsubishi Rayon Co Ltd | 半導体発光素子 |
JP2004191718A (ja) * | 2002-12-12 | 2004-07-08 | Mitsubishi Electric Corp | Led光源装置 |
JP2006054396A (ja) * | 2004-08-16 | 2006-02-23 | Toshiba Discrete Technology Kk | 発光装置 |
JP2006216953A (ja) * | 2005-01-31 | 2006-08-17 | Samsung Electronics Co Ltd | 発光ダイオード素子 |
JP2008192928A (ja) * | 2007-02-06 | 2008-08-21 | Masaaki Kano | リードプレート型ledランプ及びled照明装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013143134A1 (zh) * | 2012-03-29 | 2013-10-03 | 深圳市华星光电技术有限公司 | 一种led、背光模组和液晶显示装置 |
JP2014107462A (ja) * | 2012-11-29 | 2014-06-09 | Mitsubishi Electric Corp | Ledパッケージ装置及びled表示装置 |
JP2014112604A (ja) * | 2012-12-05 | 2014-06-19 | Nichia Chem Ind Ltd | 発光ユニット |
WO2016143152A1 (ja) * | 2015-03-12 | 2016-09-15 | 三菱電機株式会社 | 発光素子及び映像表示装置 |
JPWO2016143152A1 (ja) * | 2015-03-12 | 2017-08-31 | 三菱電機株式会社 | 発光素子及び映像表示装置 |
CN107408611A (zh) * | 2015-03-12 | 2017-11-28 | 三菱电机株式会社 | 发光元件及视频显示装置 |
CN113302501A (zh) * | 2019-01-17 | 2021-08-24 | Koa株式会社 | 流量传感器装置以及带外罩的流量传感器装置 |
WO2021199614A1 (ja) * | 2020-04-01 | 2021-10-07 | 株式会社ジャパンディスプレイ | 表示装置 |
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