WO2013143134A1 - 一种led、背光模组和液晶显示装置 - Google Patents

一种led、背光模组和液晶显示装置 Download PDF

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Publication number
WO2013143134A1
WO2013143134A1 PCT/CN2012/073367 CN2012073367W WO2013143134A1 WO 2013143134 A1 WO2013143134 A1 WO 2013143134A1 CN 2012073367 W CN2012073367 W CN 2012073367W WO 2013143134 A1 WO2013143134 A1 WO 2013143134A1
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WIPO (PCT)
Prior art keywords
inner cavity
angle
chip
backlight module
led
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PCT/CN2012/073367
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English (en)
French (fr)
Inventor
萧宇均
唐国富
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/503,849 priority Critical patent/US20130256704A1/en
Publication of WO2013143134A1 publication Critical patent/WO2013143134A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • the present invention relates to the field of electronic display, and more particularly to an LED, a backlight module, and a liquid crystal display device.
  • LEDs Light-emitting diodes
  • LCDs Light-emitting diodes
  • LEDs have been widely used in the fields of display, illumination, etc. due to their small size and high light efficiency.
  • LEDs In liquid crystal display devices, LEDs have also been used as backlights for liquid crystal displays.
  • the common structure of LED is shown in Figure 1.
  • the chip is fixed on the electrode by silver glue. Since the electrode is made of metal, the LED frame is made of plastic or ceramic material. The top of the electrode is filled with potting glue such as epoxy resin or silica gel. The expansion ratio of the material is different, so there is a crack at the junction of the plastic and the electrode and at the junction of the potting compound and the electrode, and the crack will grow along the electrode, at which time the outside air will enter along the crack at the joint and along the electrode surface. Diffusion, the main component of the silver paste on the electrode is Ag, which reacts with the oxygen of the air to form silver oxide, and the silver oxide is an insulator. Over time, the chip and the electrode are poorly connected.
  • the existing LED scheme adopts a sink set method, that is, the chip is placed at the bottom of the pole, and the counterbore is formed by metal electrode stamping, and the contact area between the electrode and the potting glue is increased.
  • the diffusion path of the air increases, and the diffusion force of the air is continuously reduced before encountering the silver paste, thereby avoiding the formation of silver oxide by the silver paste.
  • the lateral light emitted by the chip directly hits the side arm of the counterbore, so that the range of the angle of the light emitted by the LED becomes smaller, that is, the more concentrated the light.
  • the LED is used in a side-lit backlight module (not shown in the cross-sectional view)
  • the more scattered the light around the LED the less likely it is to generate a hot spot phenomenon.
  • the more concentrated the upper and lower rays the less light is lost.
  • the common hole placement of LED chips is not conducive to the dispersion of light.
  • the technical problem to be solved by the present invention is to provide an LED, a backlight module and a liquid crystal display device which reduce oxidation of an electrode and can alleviate a hot spot phenomenon.
  • the object of the present invention is achieved by the following technical solutions:
  • An LED includes an inner cavity, a chip is disposed at the bottom of the inner cavity, and four sidewalls are disposed around the bottom of the inner cavity, and electrodes are connected at both ends of the chip, and the bottom of the inner cavity is provided at at least two opposite side walls thereof A raised step surface, the electrodes at both ends of the chip extend from the bottom of the inner cavity to the step surface; and at least one of the other side walls adjacent to the step surface is provided with a sloped surface at an obtuse angle to the bottom of the inner cavity.
  • one of the two side walls adjacent to the step surface is provided with a sloped surface, the sloped surface intersecting the bottom of the inner cavity. This is a specific way of setting the bevel.
  • the two sidewalls adjacent to the step surface are provided with a slope, and the slope intersects the bottom of the cavity. This is another specific way of setting the bevel. Both sides are beveled, which can further expand the range of light emission.
  • the angle between the inclined surface of the two adjacent sidewalls of the step surface and the bottom surface is inconsistent.
  • the angle of inclination of the two bevels can be adjusted for the specific application so that the light exits at the optimum angle.
  • the angle between the inclined surface of the two adjacent sidewalls of the step surface and the bottom surface coincides.
  • the angle is the same and the processing is easy.
  • the electrode of one end of the chip is connected with a Zener tube, and the Zener tube is disposed on the step surface; the other end electrode of the chip extends directly from the bottom of the inner cavity to the outside of the inner cavity, and the corresponding side wall There is also a slope that intersects the bottom surface of the inner cavity.
  • the Zener tube prevents the chip from being electrostatically broken down, but the Zener tube absorbs light, so it is placed on the step surface to protect the chip and not absorb light.
  • the side wall is not provided with a stepped surface, and the bevel is also treated, so that the inner cavity has three side walls which are inclined surfaces, so that a larger exit light angle can be obtained.
  • the oblique angle of the bevel and the bottom plane of the inner cavity intersects between 0.5° and 89°.
  • the angle of the acute angle at which the bevel and the bottom plane of the lumen intersect is in the range of 30. To 60. between.
  • a backlight module includes the above LED.
  • a liquid crystal display device includes the above backlight module.
  • the invention is designed by the counterbore to increase the contact area between the electrode and the potting glue, and reduce the oxidation of the electrode.
  • a bevel is arranged on two adjacent sidewalls of the inner cavity electrode, so that the lateral light emitted by the chip is directly reflected by the inclined surface, thereby expanding the exit angle of the light, and the scattering of the emitted light can be flexibly controlled by selecting different inclined angles of the inclined surface.
  • the range and adaptability are especially suitable as the backlight of the liquid crystal display device. When the light enters the side, the large exit angle allows the light to be more uniformly injected into the light guide plate, thereby reducing the hot spot phenomenon.
  • 1 is a schematic view showing a diffusion path of an existing LED air without a counterbore design
  • FIG. 2 is a schematic view showing a diffusion path of an existing LED air using a counterbore design
  • FIG. 3 is a schematic perspective view of an existing LED using a counterbore design
  • FIG. 4 is a schematic diagram of the existing LED optical path diffusion using a counterbore design
  • FIG. 5 is a schematic diagram of optical path divergence of an existing LED with a counterbore design in a backlight module
  • FIG. 6 is a schematic structural view of a first embodiment of the present invention
  • Figure 7 is a schematic structural view of a second embodiment of the present invention.
  • Figure 8 is a schematic structural view of a third embodiment of the present invention.
  • Figure 9 is a schematic view of the present invention taken along the A-A section;
  • inner cavity; 310 first inclined surface; 311, second inclined surface; 320, chip; 330, electrode; 331, step surface; 340, pin; 350, Zener tube; 360, third slope; , side walls.
  • a liquid crystal display device includes a backlight module, and an LED is used as a backlight in the backlight module.
  • the LED includes a cavity 3, a chip 320 is disposed at the bottom of the cavity 3, and four sidewalls 370 are disposed around the bottom of the cavity 3.
  • the electrodes 320 are connected at both ends of the chip 320.
  • the bottom of the cavity 3 is provided with a convex stepped surface at two opposite side walls 370, and the electrode 330 passes through the inner cavity to form a pin 340 outside the inner cavity; the electrodes at both ends of the chip extend from the bottom of the inner cavity to the bottom Step surface 331 ; the other two
  • the side wall 370 adjacent to the stepped surface 331 is provided with a sloped surface.
  • one of the two side walls adjacent to the step surface is provided with a first slope 310, and the first slope 310 and the bottom plane of the cavity intersect at an acute angle ranging from 0.5° to 89. Preferably, it is 30. To 60. .
  • the electrode 330 may be disposed on the two short side walls of the inner cavity, and correspondingly, the first inclined surface 310 is disposed on the long side wall of the inner cavity.
  • the electrodes 330 may also be disposed on the two long side walls of the inner cavity, and correspondingly, the first inclined surface 310 is disposed on the short side wall of the inner cavity.
  • a Zener tube can be connected in series on one of the electrodes, and the Zener tube is arranged on the step surface, so that the Zener tube can be prevented from absorbing light.
  • the two side walls adjacent to the step surface are provided with inclined surfaces, which are a first inclined surface 310 and a second inclined surface 311, respectively, and the acute angle of the intersection of the inclined surface and the bottom surface of the inner cavity ranges from 0.5. To 89. Preferably, it is between 30 and 60. .
  • the electrode 330 may be disposed on the two short side walls of the inner cavity, and correspondingly, the first slope 310 and the second slope 311 are disposed on the long side wall of the inner cavity. Of course, the electrodes 330 may also be disposed on the two long side walls of the inner cavity. Accordingly, the first inclined surface 310 and the second inclined surface 311 are disposed on the short side walls of the inner cavity.
  • a Zener tube can be connected in series on one of the electrodes, and the Zener tube is arranged on the step surface, so that the Zener tube can be prevented from absorbing light.
  • one electrode 330 provided with the Zener tube 350 is formed with a stepped surface 331 at the bottom of the inner cavity, and the other electrode 330 is disposed at the bottom of the inner cavity, and the corresponding inner cavity is also provided at one side.
  • the embodiment can be combined with any one of the first embodiment and the second embodiment, especially in combination with the second embodiment, such that three of the four side walls of the inner cavity are provided with inclined surfaces to form the first
  • the inclined surface 310, the second inclined surface 311, and the third inclined surface 360 ensure maximum light emission range.
  • the electrode 330 is disposed on the two short side walls of the inner cavity, and correspondingly, the first inclined surface 310 and the second inclined surface 311 are disposed on the long side wall of the inner cavity. Of course, the electrodes 330 may also be disposed on the two long side walls of the inner cavity. Correspondingly, the first inclined surface 310 and the second inclined surface 311 are disposed on the short side wall side of the inner cavity.
  • Fig. 7 shows an effect of the present invention.
  • the electrode 330 having the Zener tube 350 has a stepped surface 331, and the light beam is laterally directed toward the side arm of the stepped surface 331, and the light converges, thereby reducing the angle of light, and the light is directed toward the inner cavity.
  • the inclined surface illustrated by the first inclined surface 310 as an example
  • the light reflected by the inclined surface no longer contracts, but continues to diverge outward, thereby expanding the angle of light emission.
  • the invention is designed according to the counterbore to increase the contact area between the electrode and the potting glue, and to reduce the oxidation of the electrode.
  • a bevel is arranged on two adjacent side walls of the inner cavity electrode, so that the lateral light emitted by the chip is directly reflected by the inclined surface. Therefore, the angle of light emission can be enlarged, and the scattering range of the emitted light can be flexibly controlled by selecting different inclined angles of the inclined surface, and the adaptability is strong, and is particularly suitable as a backlight of the liquid crystal display device, and the large exit angle can make the light when the side enters the light. More uniform shot into the light guide plate to reduce the hot spot phenomenon.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)

Abstract

一种LED、采用LED作为背光源的背光模组和包括背光模组的液晶显示装置。所述LED包括内腔（3），内腔底部设有芯片（320），环绕内腔底部设有四个侧壁（370），芯片两端连接有电极（33），内腔底部在其中两个相对的侧壁处设有至少一个凸起的台阶面（331），芯片两端的电极从内腔底部延伸到台阶面；另外两个与台阶面相邻的侧壁至少有一个设有跟内腔底部呈钝角的斜面。

Description

一种 LED、 背光模组和液晶显示装置
【技术领域】
本发明涉及电子显示领域， 更具体的说， 涉及一种 LED、 背光模组和液晶 显示装置。
【背景技术】
发光二级管 （LED ) 由于体积小， 光效率高， 目前已广泛应用于显示、 照 明等领域， 在液晶显示装置中， 也开始采用 LED作为液晶显示的背光源。
LED常见结构如图 1所示， 芯片通过银胶固定于电极上， 由于电极为金属 材质， LED框体为塑胶或陶瓷材料， 电极上方一般填充灌封胶例如环氧树脂或 硅胶， 这几种材质的膨胀率不一样， 因此在塑胶与电极结合处以及会灌封胶与 电极结合处存在裂缝， 裂缝将沿着电极生长， 此时外界空气将沿着结合处的裂 缝进入并沿着电极表面扩散， 电极上的银胶主要成份为 Ag, 可与空气的氧气反 应生成氧化银， 而氧化银为绝缘体， 久而久之， 芯片与电极导通不良。
如图 2、 3所示， 现有 LED方案为采用沉孔方式（Down set ), 即芯片放置 于极底部， 该沉孔由金属电极沖压成型， 电极与灌封胶的接触面积增加， 此时 空气的扩散路径增加， 空气的扩散力在遇到银胶前不断减小， 因此避免了银胶 生成氧化银。
如图 4所示， 芯片发出的侧向光直接射向沉孔侧臂， 从而 LED出射光线 角度范围变小， 即光线越集中。 LED用于侧入式背光模组时（截面图未示意）， LED左右的光线越分散， 越不容易产生热点（hot spot )现象， 上下光线越集中， 损失的光线越少。 常见的 LED芯片沉孔放置均不利于光线的分散。
【发明内容】
本发明所要解决的技术问题是提供一种降低电极氧化、 可减轻热点 （hot spot )现象的 LED、 背光模组和液晶显示装置。 本发明的目的是通过以下技术方案来实现的：
一种 LED, 包括内腔， 所述内腔底部设有芯片， 环绕内腔底部设有四个侧 壁， 芯片两端连接有电极， 内腔底部在其中两个相对的侧壁处设有至少一个凸 起的台阶面， 所述芯片两端的电极从内腔底部延伸到台阶面； 另外两个与台阶 面相邻的侧壁至少有一个设有跟内腔底部呈钝角的斜面。
优选的， 所述两个与台阶面相邻的侧壁中有一个侧壁设有斜面， 所述斜面 跟内腔底部相交。 此为一种具体的斜面设置方式。
优选的， 所述两个与台阶面相邻的侧壁都设有斜面， 所述斜面跟内腔底部 相交。 此为另一种具体的斜面设置方式， 两个边都为斜面， 可以进一步扩大光 线的出射范围。
优选的， 所述两个与台阶面相邻侧壁的斜面与底面夹角的角度不一致。 两 个斜面的倾斜角度可以根据具体应用场合调整， 以便光线以最佳角度出射。
优选的， 所述两个与台阶面相邻侧壁的斜面与底面夹角的角度一致。 角度 一致， 加工容易。
优选的， 所述芯片的其中一端的电极连接有齐纳管， 齐纳管设置在所述台 阶面上； 所述芯片另一端电极直接从内腔底部延伸出内腔外， 其对应的侧壁也 设有与内腔底面相交的斜面。 齐纳管可以防止芯片被静电击穿， 但齐纳管会吸 收光线， 因此将其设置在台阶面上， 既能保护芯片， 又不会吸收光线。 而另外 一个侧的侧壁不设置台阶面， 也采用斜面处理， 这样内腔就有 3个侧壁为斜面， 可以获得更大的出射光角度。
优选的， 所述斜面和内腔底部平面相交的锐角角度范围在 0.5° 至 89° 之 间。
优选的，所述斜面和内腔底部平面相交的锐角角度范围在 30。 至 60。 之间。 一种背光模组， 包括上述的一种 LED。
一种液晶显示装置， 包括上述的一种背光模组。
本发明由于沉孔设计， 以增加电极和灌封胶的接触面积， 减少电极氧化， 另外在内腔电极相邻的两个侧壁上设置斜面， 这样芯片射出的侧向光直接由斜 面反射出去， 从而扩大光线的出射角度， 通过选择不同的斜面倾斜角度可以灵 活控制出射光线的散射范围， 适应性强， 特别适合作为液晶显示装置的背光源， 在侧入光时，大出射角度可以让光线更为均匀地射入导光板，从而减轻热点（hot spot )现象。
【附图说明】
图 1是现有的一种不带沉孔设计的 LED空气的扩散路径示意图；
图 2是现有的一种采用沉孔设计的 LED空气的扩散路径示意图；
图 3是现有的一种采用沉孔设计的 LED立体示意图；
图 4是现有采用沉孔设计的 LED光路扩散示意图；
图 5是现有采用沉孔设计的 LED在背光模组中的光路发散示意图； 图 6是本发明实施例一结构示意图；
图 7是本发明实施例二结构示意图；
图 8是本发明实施例三结构示意图；
图 9是本发明沿 A-A剖面的示意图；
其中： 3、 内腔； 310、 第一斜面； 311、 第二斜面； 320、 芯片； 330、 电极； 331、 台阶面； 340、 引脚； 350、 齐纳管； 360、 第三斜面； 370、 侧壁。
【具体实施方式】
下面结合附图和较佳的实施例对本发明作进一步说明。
一种液晶显示装置， 包括背光模组， 背光模组内采用 LED作为背光源。 如图 6-9所示， 所述 LED包括内腔 3 , 所述内腔 3底部设有芯片 320, 环绕 内腔 3底部设有四个侧壁 370, 芯片 320两端连接有电极 330, 内腔 3底部在其 中两个相对的侧壁 370处设有凸起的台阶面， 电极 330从内腔穿出， 在内腔外 部形成引脚 340; 所述芯片两端的电极从内腔底部延伸到台阶面 331 ; 另外两个 与台阶面 331相邻的侧壁 370设有斜面。
实施例一
如图 6所示，所述两个与台阶面相邻的侧壁中有一个侧壁设有第一斜面 310, 第一斜面 310和内腔底部平面相交的锐角角度范围在 0.5° 至 89。 之间，优选的， 为 30。 至 60。 。 电极 330可以设置在内腔的两个短边侧壁， 相应的， 第一斜面 310设置在内腔的长边侧壁。当然，电极 330也可以设置在内腔的两个长边侧壁， 相应的， 第一斜面 310设置在内腔的短边侧壁。
为了防止芯片被静电击穿， 可以在其中一个电极上串接一个齐纳管， 齐纳 管设置在台阶面上， 这样可以避免齐纳管吸收光线。
实施例二
如图 7所示， 所述两个与台阶面相邻的侧壁都设有斜面， 分别为第一斜面 310和第二斜面 311 , 斜面和内腔底部平面相交的锐角角度范围在 0.5。 至 89。 之间， 优选的， 为 30° 至 60。 。 电极 330可以设置在内腔的两个短边侧壁， 相 应的， 第一斜面 310和第二斜面 311设置在内腔的长边侧壁。 当然， 电极 330 也可以设置在内腔的两个长边侧壁， 相应的， 第一斜面 310和第二斜面 311设 置在内腔的短边侧壁。
为了防止芯片被静电击穿， 可以在其中一个电极上串接一个齐纳管， 齐纳 管设置在台阶面上， 这样可以避免齐纳管吸收光线。
实施例三
如图 8所示， 设有齐纳管 350的一个电极 330在内腔底部凸起形成有台阶 面 331 , 而另一个电极 330设置在所述内腔的底部， 其对应的内腔一边也设有斜 面，形成第三斜面 360,斜面和内腔底部平面相交的锐角角度范围在 0.5。 至 89。 之间， 优选的， 为 30° 至 60。 。 本实施方式可以跟上述实施例一、 实施例二中 的任意一个结合， 特别是跟实施例二结合， 这样在内腔的四个侧壁中， 有三个 侧壁都设置有斜面， 形成第一斜面 310、 第二斜面 311、 第三斜面 360, 可以保 证光线出射范围最大化。 电极 330设置在内腔的两个短边侧壁， 相应的， 第一斜面 310和第二斜面 311设置在内腔的长边侧壁。当然，电极 330也可以设置在内腔的两个长边侧壁， 相应的， 第一斜面 310和第二斜面 311设置在内腔的短边侧壁侧。
图 7展示了本发明的实施效果，具有齐纳管 350的电极 330具有台阶面 331 , 光线侧向射向台阶面 331 的侧臂， 光线收敛， 从而缩小出光角度， 而光线射向 内腔的斜面 （以第一斜面 310 为例说明）后， 经过斜面反射的光线不再收缩， 而是继续向外发散， 从而扩大了光线的出射角度。
本发明由于沉孔设计， 以增加电极和灌封胶的接触面积， 减少电极氧化， 另外在内腔电极相邻的两个侧壁上设置斜面， 这样芯片射出的侧向光直接由斜 面反射出去， 从而扩大光线的出射角度， 通过选择不同的斜面倾斜角度可以灵 活控制出射光线的散射范围， 适应性强， 特别适合作为液晶显示装置的背光源， 在侧入光时，大出射角度可以让光线更为均勾地射入导光板，从而减轻热点（hot spot )现象。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明， 不 能认定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的普通 技术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干筒单推演或替 换， 都应当视为属于本发明的保护范围。

Claims

权利要求
1、 一种 LED, 包括内腔， 所述内腔底部设有芯片， 环绕内腔底部设有四个 侧壁， 芯片两端连接有电极， 内腔底部在其中两个相对的侧壁处设有至少一个 凸起的台阶面， 所述芯片两端的电极从内腔底部延伸到台阶面； 另外两个与台 阶面相邻的侧壁至少有一个设有跟内腔底部呈钝角的斜面。
2、 如权利要求 1所述的一种 LED, 其中， 所述两个与台阶面相邻的侧壁中 有一个侧壁设有斜面， 所述斜面跟内腔底部相交。
3、 如权利要求 1所述的一种 LED, 其中， 所述两个与台阶面相邻的侧壁都 设有斜面， 所述斜面跟内腔底部相交。
4、 如权利要求 3所述的一种 LED, 其中， 所述两个与台阶面相邻侧壁的斜 面与底面夹角的角度不一致。
5、 如权利要求 3所述的一种 LED, 其中， 所述两个与台阶面相邻侧壁的斜 面与底面夹角的角度一致。
6、 如权利要求 1所述的一种 LED, 其中， 所述芯片的其中一端的电极连接 有齐纳管， 齐纳管设置在所述台阶面上； 所述芯片另一端电极直接从内腔底部 延伸出内腔外， 其对应的侧壁也设有与内腔底面相交的斜面。
7、 如权利要求 1所述的一种 LED, 其中， 所述斜面和内腔底部平面相交的 锐角角度范围在 0.5° 至 89。 之间。
8、 如权利要求 7所述的一种 LED, 其中， 所述斜面和内腔底部平面相交的 锐角角度范围在 30。 至 60。 之间。
9、 一种背光模组， 包括一种 LED, 所述 LED包括内腔， 所述内腔底部设 有芯片， 环绕内腔底部设有四个侧壁， 芯片两端连接有电极， 内腔底部在其中 两个相对的侧壁处设有至少一个凸起的台阶面， 所述芯片两端的电极从内腔底 部延伸到台阶面； 另外两个与台阶面相邻的侧壁至少有一个设有跟内腔底部呈 钝角的斜面。
10、 如权利要求 9所述的一种背光模组， 其中， 所述两个与台阶面相邻的 侧壁中有一个侧壁设有斜面， 所述斜面跟内腔底部相交。
11、 如权利要求 9 所述的一种背光模组， 其中， 所述两个与台阶面相邻的 侧壁都设有斜面， 所述斜面跟内腔底部相交。
12、 如权利要求 11所述的一种背光模组， 其中， 所述两个与台阶面相邻侧 壁的斜面与底面夹角的角度不一致。
13、 如权利要求 11所述的一种背光模组， 其中， 所述两个与台阶面相邻侧 壁的斜面与底面夹角的角度一致。
14、 如权利要求 9所述的一种背光模组， 其中， 所述芯片的其中一端的电 极连接有齐纳管， 齐纳管设置在所述台阶面上； 所述芯片另一端电极直接从内 腔底部延伸出内腔外， 其对应的侧壁也设有与内腔底面相交的斜面。
15、 如权利要求 9所述的一种背光模组， 其中， 所述斜面和内腔底部平面 相交的锐角角度范围在 0.5° 至 89。 之间。
16、 如权利要求 15所述的一种背光模组， 其中， 所述斜面和内腔底部平面 相交的锐角角度范围在 30。 至 60。 之间。
17、 一种液晶显示装置， 包括如权利要求 9所述的一种背光模组。
PCT/CN2012/073367 2012-03-29 2012-03-31 一种led、背光模组和液晶显示装置 WO2013143134A1 (zh)

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