CN102623614A - 一种 led、背光模组和液晶显示装置 - Google Patents
一种 led、背光模组和液晶显示装置 Download PDFInfo
- Publication number
- CN102623614A CN102623614A CN2012100875907A CN201210087590A CN102623614A CN 102623614 A CN102623614 A CN 102623614A CN 2012100875907 A CN2012100875907 A CN 2012100875907A CN 201210087590 A CN201210087590 A CN 201210087590A CN 102623614 A CN102623614 A CN 102623614A
- Authority
- CN
- China
- Prior art keywords
- plane
- led
- chip
- step surface
- intracavity bottom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 13
- 230000001154 acute effect Effects 0.000 claims description 7
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 238000007743 anodising Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 229910001923 silver oxide Inorganic materials 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210087590.7A CN102623614B (zh) | 2012-03-29 | 2012-03-29 | 一种 led、背光模组和液晶显示装置 |
PCT/CN2012/073367 WO2013143134A1 (zh) | 2012-03-29 | 2012-03-31 | 一种led、背光模组和液晶显示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210087590.7A CN102623614B (zh) | 2012-03-29 | 2012-03-29 | 一种 led、背光模组和液晶显示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102623614A true CN102623614A (zh) | 2012-08-01 |
CN102623614B CN102623614B (zh) | 2014-10-29 |
Family
ID=46563399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210087590.7A Expired - Fee Related CN102623614B (zh) | 2012-03-29 | 2012-03-29 | 一种 led、背光模组和液晶显示装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN102623614B (zh) |
WO (1) | WO2013143134A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013143134A1 (zh) * | 2012-03-29 | 2013-10-03 | 深圳市华星光电技术有限公司 | 一种led、背光模组和液晶显示装置 |
CN103615677A (zh) * | 2013-12-12 | 2014-03-05 | 天津理工大学 | 一种用于促进植物生长的led同步红蓝光平板光源 |
WO2016065886A1 (zh) * | 2014-10-31 | 2016-05-06 | 厦门市三安光电科技有限公司 | 一种led结构及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200520257A (en) * | 2003-12-11 | 2005-06-16 | South Epitaxy Corp | Light-emitting diode packaging structure |
JP2009206228A (ja) * | 2008-02-27 | 2009-09-10 | Toshiba Corp | 側面型発光装置及びその製造方法、照明装置 |
JP2010171294A (ja) * | 2009-01-26 | 2010-08-05 | Rohm Co Ltd | 発光装置 |
CN102054829A (zh) * | 2010-11-05 | 2011-05-11 | 深圳市华星光电技术有限公司 | 发光二极管封装构造 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100845856B1 (ko) * | 2006-12-21 | 2008-07-14 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
US8625053B2 (en) * | 2010-06-28 | 2014-01-07 | Lg Display Co., Ltd. | Light emitting diode and backlight unit and liquid crystal display device with the same |
JP5507372B2 (ja) * | 2010-07-22 | 2014-05-28 | スタンレー電気株式会社 | 発光装置 |
CN201868467U (zh) * | 2010-09-23 | 2011-06-15 | 富士康(昆山)电脑接插件有限公司 | 发光二极管导线架 |
CN102623614B (zh) * | 2012-03-29 | 2014-10-29 | 深圳市华星光电技术有限公司 | 一种 led、背光模组和液晶显示装置 |
-
2012
- 2012-03-29 CN CN201210087590.7A patent/CN102623614B/zh not_active Expired - Fee Related
- 2012-03-31 WO PCT/CN2012/073367 patent/WO2013143134A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200520257A (en) * | 2003-12-11 | 2005-06-16 | South Epitaxy Corp | Light-emitting diode packaging structure |
JP2009206228A (ja) * | 2008-02-27 | 2009-09-10 | Toshiba Corp | 側面型発光装置及びその製造方法、照明装置 |
JP2010171294A (ja) * | 2009-01-26 | 2010-08-05 | Rohm Co Ltd | 発光装置 |
CN102054829A (zh) * | 2010-11-05 | 2011-05-11 | 深圳市华星光电技术有限公司 | 发光二极管封装构造 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013143134A1 (zh) * | 2012-03-29 | 2013-10-03 | 深圳市华星光电技术有限公司 | 一种led、背光模组和液晶显示装置 |
CN103615677A (zh) * | 2013-12-12 | 2014-03-05 | 天津理工大学 | 一种用于促进植物生长的led同步红蓝光平板光源 |
WO2016065886A1 (zh) * | 2014-10-31 | 2016-05-06 | 厦门市三安光电科技有限公司 | 一种led结构及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102623614B (zh) | 2014-10-29 |
WO2013143134A1 (zh) | 2013-10-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Light-emitting diode (LED), backlight module and liquid crystal display device Effective date of registration: 20190426 Granted publication date: 20141029 Pledgee: Bank of Beijing Limited by Share Ltd Shenzhen branch Pledgor: Shenzhen Huaxing Optoelectronic Technology Co., Ltd. Registration number: 2019440020032 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201016 Granted publication date: 20141029 Pledgee: Bank of Beijing Limited by Share Ltd. Shenzhen branch Pledgor: Shenzhen China Star Optoelectronics Technology Co.,Ltd. Registration number: 2019440020032 |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141029 Termination date: 20210329 |