WO2015127698A1 - 一种led灯丝及照明器 - Google Patents

一种led灯丝及照明器 Download PDF

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Publication number
WO2015127698A1
WO2015127698A1 PCT/CN2014/073658 CN2014073658W WO2015127698A1 WO 2015127698 A1 WO2015127698 A1 WO 2015127698A1 CN 2014073658 W CN2014073658 W CN 2014073658W WO 2015127698 A1 WO2015127698 A1 WO 2015127698A1
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led filament
solid crystal
region
metal skeleton
crystal region
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PCT/CN2014/073658
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English (en)
French (fr)
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游志
裴小明
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深圳市瑞丰光电子股份有限公司
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Publication of WO2015127698A1 publication Critical patent/WO2015127698A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Definitions

  • the invention belongs to the technical field of illumination, and in particular relates to an LED filament and a illuminator.
  • LED filament light source products mainly achieve the purpose of large-angle illumination by forming circuit boards on transparent ceramics or glass substrates.
  • transparent ceramics and glass substrates are expensive, complicated to manufacture, and have low thermal conductivity.
  • the power is less than 1 W, and the packaged product cannot fundamentally solve the problem of blue leakage.
  • An object of the embodiments of the present invention is to provide an LED filament, which aims to solve the problem of blue leakage of the existing LED filament.
  • the embodiment of the present invention is achieved by an LED filament comprising a metal skeleton and a fluorescent glue, wherein a middle portion of the metal skeleton is a solid crystal region, and a plurality of LED chips are disposed in the solid crystal region, and both ends of the solid crystal region are Each of the plastic parts for preventing the overflow of the liquid fluorescent glue is disposed, and the liquid fluorescent glue is solidified to wrap a part of the metal skeleton where the solid crystal region is located.
  • Another object of embodiments of the present invention is to provide a luminaire that uses the LED filament described above.
  • the solid crystal region is disposed on the metal skeleton, and a plastic member for resisting the overflow of the liquid fluorescent rubber is disposed at each end of the solid crystal region, and the liquid fluorescent rubber is cured to wrap the portion where the solid crystal region is located.
  • the metal skeleton such that the light emitted by the LED chip located in the solid crystal region excites the peripheral fluorescent glue to generate light of a desired color, thereby solving the problem of blue leakage of the LED filament. Therefore, the LED filament can be widely applied to various illuminators, and the lighting effect is excellent.
  • FIG. 1 is a schematic structural view of a metal skeleton according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of molding a plastic member on the metal skeleton shown in FIG. 1;
  • Figure 3 is a cross-sectional view taken along line A-A of Figure 2;
  • Figure 4 is a cross-sectional view taken along line B-B of Figure 2;
  • Figure 5 is a cross-sectional view taken along line C-C of Figure 2;
  • FIG. 6 is a top plan view of an LED filament provided by an embodiment of the present invention.
  • Figure 7 is a side view of an LED filament provided by an embodiment of the present invention.
  • Figure 8 is a schematic cross-sectional view of the die bonding region shown in Figure 7.
  • the solid crystal region is disposed on the metal skeleton, and a plastic member for resisting the overflow of the liquid fluorescent rubber is disposed at each end of the solid crystal region, and the liquid fluorescent rubber is cured to wrap the portion where the solid crystal region is located.
  • the metal skeleton such that the light emitted by the LED chip located in the solid crystal region excites the peripheral fluorescent glue to generate light of a desired color, thereby solving the problem of blue leakage of the LED filament.
  • the LED filament provided by the embodiment of the invention comprises a metal skeleton 1 and a fluorescent glue 2, wherein the middle portion of the metal skeleton 1 is a solid crystal region 11 , and a plurality of LED chips 3 are disposed in the solid crystal region 11 .
  • a plastic member 4 for preventing overflow of the liquid fluorescent glue is disposed at each end of the solid crystal region 11 , and the liquid fluorescent rubber is cured to wrap a part of the metal skeleton where the solid crystal region 11 is located.
  • the plastic member 4 resists the liquid fluorescent glue to prevent it from overflowing and solidifies in the die bonding region 11 to wrap a part of the metal skeleton where the die bonding region 11 is located.
  • the light emitted by the LED chip 3 located in the die-bonding region 11 excites the peripheral fluorescent glue to generate light of a desired color, thereby solving the problem of blue leakage of the LED filament.
  • the metal skeleton 1 is used as a channel for supporting, dissipating, and electrically interconnecting the chip, and the thermal conductivity and the strength are high, thereby improving the reliability of the LED filament, or making a higher power LED filament.
  • the outer end of the plastic member 4 is cylindrical, the cross section of the inner end is polygonal, and the diameter of the cylindrical shape is larger than the length of any diagonal of the polygon, so that the saving is saved.
  • the plastic material enhances the bonding strength between the fluorescent rubber 2 and the plastic member 4.
  • a recess 40 is provided at the inner end of the plastic member 4.
  • the metal skeleton 1 is first processed by machining, chemical etching or other forming methods.
  • a line for electrically interconnecting the LED chip 3 with the outside is designed in the die bonding region 11.
  • the plastic member 4 is separately formed on both ends of the solid crystal region 11 by injection molding or molding, and the plastic member 4 is resisted by the liquid fluorescent rubber to prevent it from overflowing.
  • the fluorescent glue 2 is formed by a process such as injection molding or molding, so as to completely enclose the LED chip 3 and the solid crystal region 11 (ie, a part of the metal skeleton where the solid crystal region is located), thereby realizing a linear luminous body, which is similar to an incandescent lamp. effect.
  • the LED filament can be either a double-sided single electrode or a single-sided two-electrode, and the design is flexible.
  • the LED filament provided in this embodiment adopts a bilateral single-electrode pattern, wherein both ends of the metal skeleton 1 are the soldering regions 12, and one end of the solid crystal region 11 is disconnected from the soldering region 12, The positive and negative poles of the LED filament are broken, and the damage to the entire metal skeleton 1 is small.
  • both ends of the solid crystal region 11 may be disconnected from the corresponding solder regions 12.
  • the end of the die bonding region 11 disconnected from the bonding region 12 is provided with an extension portion 13.
  • the soldering region 12 disconnected from the die bonding region 11 is provided with an extending portion 14, and the extending portion 14 is parallel to the extending portion.
  • the extension 14 and the extension 13 are positioned by the plastic part 4 to be separated by a certain distance and parallel to each other.
  • the extension portion 14 and the extension portion 13 are preferably serrated to enhance the joint strength of the plastic member 4 with the extension portion 14 and the extension portion 13.
  • the extended portion 14 and the extended portion 13 are positioned by the cured plastic member 4 such that the extending portion 14 is parallel to the extended portion 13 to engage the broken positive and negative electrodes.
  • the extending portion 14 and the extending portion 13 are completely embedded in the plastic member 4, which ensures that the positive and negative positions are relatively stable, is not easily broken at the break, and improves the overall strength of the LED filament.
  • the plastic member 4 can be made of transparent or other colored plastic (such as thermoplastic or thermosetting material).
  • a through hole for filling the molten plastic is disposed at an end of the bonding zone 12 near the die bonding region 11 . 15.
  • the increased through hole 15 reduces the area of the molten plastic overflow, and also shortens the distance of the molten plastic on the surface of the metal skeleton 1.
  • the total length b of the metal skeleton 1 is not less than 8 mm, the width of the weld zone is greater than 0.2 mm, the thickness is greater than 0.1 mm, less than 0.5 mm; the length c of the solid crystal region 11 is greater than that of the metal skeleton 1 50% of the total length b, the width a of the die bonding region 11 is greater than 0.3 mm.
  • the surface of the die-bonding region 11 is plated with a nickel film, a silver film or a gold film, which enhances the light extraction rate of the LED filament.
  • the fluorescent glue 2 is a thermosetting material (such as silica gel or epoxy resin) mixed with a phosphor, and its cross section may be square, circular or elliptical.
  • the fluorescent glue 2 is cylindrical after being solidified, and the length thereof is larger than the length of the solid crystal region 11 and the diameter is not less than the width of the solid crystal region 11 to form a part of the metal skeleton where the solid crystal region 11 is located. Wrapped.
  • a plurality of through holes 17 for filling the fluorescent glue may be disposed in the solid crystal region 11, and the through holes 17 are located between the adjacent LED chips 3, as shown in FIGS.
  • part of the light emitted by the LED chip 3 is totally reflected in the fluorescent glue 2, and then exits through the through hole 17 from the back surface of the metal skeleton 1 (also referred to as the substrate), thereby improving the uniformity of the front and back of the LED filament, and increasing The bonding strength of the fluorescent glue 2 to the metal skeleton 1 is obtained.
  • the thickness m of the fluorescent glue 2 on the light emitting side of the chip is larger than the thickness n located on the non-light emitting side of the chip, as shown in FIG.
  • the amount of fluorescent glue located on the back surface of the metal skeleton 1 is small, and the luminous flux projected through the through hole 17 to the back surface of the metal skeleton 1 is also small, thereby contributing to the improvement of the color consistency of the front and back surfaces of the LED filament.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED灯丝及采用该LED灯丝的照明器，该LED灯丝包括金属骨架(1)和荧光胶(2)，金属骨架(1)中部为固晶区(11)，多个LED芯片(3)设于固晶区(11)，固晶区(11)两端各设一用以防止液态荧光胶(2)外溢的塑胶件(4)，液态荧光胶(2)固化后包裹住固晶区(11)所在的部分金属骨架。位于固晶区的LED芯片发出的光激发周边荧光胶产生所需颜色的光，从而解决LED灯丝漏蓝的问题。该LED灯丝可应用于各种照明器。

Description

一种LED灯丝及照明器
本发明属于照明技术领域，尤其涉及一种LED灯丝及照明器。
目前，LED灯丝光源产品主要是通过在透明陶瓷或是玻璃基板成型线路板，从而达到大角度发光的目的。但是透明陶瓷与玻璃基板价格昂贵，制成复杂，导热率低，一般使用功率<1W，而且封装成品无法从根本上解决漏蓝问题。
本发明实施例的目的在于提供一种LED灯丝，旨在解决现有LED灯丝存在漏蓝的问题。
本发明实施例是这样实现的，一种LED灯丝，包括金属骨架和荧光胶，所述金属骨架中部为固晶区，多个LED芯片设于所述固晶区，所述固晶区两端各设一用以防止液态荧光胶外溢的塑胶件，所述液态荧光胶固化后包裹住固晶区所在的部分金属骨架。
本发明实施例的另一目的在于提供一种照明器，所述照明器采用上述LED灯丝。
本发明实施例将固晶区设于金属骨架，于所述固晶区两端各设一用以抵挡液态荧光胶外溢的塑胶件，所述液态荧光胶固化后包裹住固晶区所在的部分金属骨架，这样位于所述固晶区的LED芯片发出的光激发周边荧光胶产生所需颜色的光，从而解决LED灯丝漏蓝的问题。因而，本LED灯丝可广泛应用于各种照明器，照明效果极佳。
图1是本发明实施例提供的金属骨架的结构示意图；
图2是于图1所示金属骨架上成型塑胶件的结构示意图；
图3是图2 A-A剖视图；
图4是图2 B-B剖视图；
图5是图2 C-C剖视图；
图6是本发明实施例提供的LED灯丝的俯视图；
图7是本发明实施例提供的LED灯丝的侧视图；
图8是于图7所示固晶区横截面示意图。
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明实施例将固晶区设于金属骨架，于所述固晶区两端各设一用以抵挡液态荧光胶外溢的塑胶件，所述液态荧光胶固化后包裹住固晶区所在的部分金属骨架，这样位于所述固晶区的LED芯片发出的光激发周边荧光胶产生所需颜色的光，从而解决LED灯丝漏蓝的问题。
以下结合具体实施例对本发明的实现进行详细描述。
如图1~8所示，本发明实施例提供的LED灯丝包括金属骨架1和荧光胶2，所述金属骨架1中部为固晶区11，多个LED芯片3设于所述固晶区11，所述固晶区11两端各设一用以防止液态荧光胶外溢的塑胶件4，所述液态荧光胶固化后包裹住固晶区11所在的部分金属骨架。此处由所述塑胶件4抵挡液态荧光胶，防止其外溢，并使之在所述固晶区11固化，从而包裹住固晶区11所在的部分金属骨架。这样位于所述固晶区11的LED芯片3发出的光激发周边荧光胶产生所需颜色的光，从而解决LED灯丝漏蓝的问题。另外，此处将所述金属骨架1作为芯片支撑、散热、电气互联的通道，导热率及强度均较高，提升了本LED灯丝的可靠性，或者说可以制作更大功率的LED灯丝。
如图3~5所示，本发明实施例中所述塑胶件4外端为圆柱形，里端的横截面为多边形，所述圆柱形的直径大于多边形任一对角线的长度，如此利于节省塑胶材料，同时增强了荧光胶2与塑胶件4的结合强度。为进一步增强荧光胶2与塑胶件4的结合强度，于所述塑胶件4里端设一凹陷部40。
通常，所述金属骨架1先通过机械加工、化学蚀刻或是其它成型方法加工而成。接着，于所述固晶区11设计使LED芯片3与外部电气互联的线路。然后，于所述固晶区11两端通过注塑或是模压等工艺分别成型塑胶件4，由所述塑胶件4抵挡液态荧光胶，防止其外溢。最后，通过注塑或是模压等工艺成型所述荧光胶2，使之完全包裹LED芯片3以及固晶区11（即固晶区所在的部分金属骨架），从而实现线性发光体，类似白炽灯发光效果。
应当说明的是，所述LED灯丝既可以是双边单电极，也可以是单边双电极，设计灵活。如图1、2所示，本实施例提供的LED灯丝采取双边单电极样式，其中所述金属骨架1两端为焊接区12，所述固晶区11有一端与焊接区12断开，如此将本LED灯丝的正、负极断开，而且对整个金属骨架1破坏较小。当然，所述固晶区11两端均与相应的焊接区12断开亦可。
其中，所述固晶区11与焊接区12断开的那一端设一延展部13，与所述固晶区11断开的焊接区12设一延伸部14，所述延伸部14平行于延展部13，如图1、2所示。在此通过所述塑胶件4定位延伸部14与延展部13，使之分开一定距离，且相互平行。所述延伸部14和延展部13优选为锯齿状，用以增强塑胶件4与延伸部14和延展部13的连接强度。同时，由固化后的塑胶件4对所述延伸部14、延展部13定位，使所述延伸部14平行于延展部13，从而衔接断开的正、负极。如此使所述延伸部14和延展部13完全嵌在塑胶件4中，保证了正、负极位置相对稳定，在断开处不易断裂，同时提高了本LED灯丝的整体强度。另外，所述塑胶件4可以由透明的或是其它有色塑胶（如热塑或是热固性材质）制成。
如图6、7所示，为增强扣胶力，保证所述塑胶件4与金属骨架1结合强度，于所述焊接区12靠近固晶区11的端部设用以填充熔融塑胶的透孔15。该增加的透孔15减小了所述熔融塑胶溢胶的面积，亦可缩短所述熔融塑胶在金属骨架1表面溢胶的距离。为优化本LED灯丝结构，所述金属骨架1总长b不小于8mm，所述焊接区的宽度大于0.2mm，厚度大于0.1mm、小于0.5mm；所述固晶区11的长度c大于金属骨架1总长b的50%，所述固晶区11的宽度a大于0.3mm。所述固晶区11的表面镀有镍膜、银膜或金膜，这样增强了本LED灯丝光取出率。所述荧光胶2为混合有荧光粉的热固性材料（如硅胶或环氧树脂），其横截面可为方形、圆形或椭圆形。本实施例中所述荧光胶2固化后呈圆柱状，其长度大于所述固晶区11的长度，直径不小于所述固晶区11的宽度，以将固晶区11所在的部分金属骨架包裹住。
此外，还可于所述固晶区11设多个用以填充荧光胶的通孔17，各通孔17位于相邻LED芯片3之间，如图1、2、8所示。这样所述LED芯片3发出的部分光线在荧光胶2内全反射后经由通孔17从金属骨架1（亦称基板）的背面出射，从而改善本LED灯丝正、反面光色一致性，同时增加了荧光胶2与金属骨架1的结合强度。
进一步地，为使本LED灯丝正、反面光色一致性更佳，所述荧光胶2位于芯片发光侧的厚度m大于位于芯片非发光侧的厚度n，如图7所示。此时位于所述金属骨架1背面的荧光胶较少，经所述通孔17投射至金属骨架1背面的光通量同样较少，因而有助于提升本LED灯丝正、反面光色一致性。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (11)

  1. 一种LED灯丝，其特征在于，包括金属骨架和荧光胶，所述金属骨架中部为固晶区，多个LED芯片设于所述固晶区，所述固晶区两端各设一用以防止液态荧光胶外溢的塑胶件，所述液态荧光胶固化后包裹住固晶区所在的部分金属骨架。
  2. 如权利要求1所述的LED灯丝，其特征在于，所述塑胶件外端为圆柱形，里端的横截面为多边形，所述圆柱形的直径大于多边形任一对角线的长度。
  3. 如权利要求1或2所述的LED灯丝，其特征在于，所述塑胶件里端设一凹陷部。
  4. 如权利要求3所述的LED灯丝，其特征在于，所述金属骨架两端均为焊接区，所述固晶区至少有一端与焊接区断开。
  5. 如权利要求4所述的LED灯丝，其特征在于，所述固晶区与焊接区断开的那一端设一延展部，与所述固晶区断开的焊接区设一延伸部，所述延伸部平行于延展部。
  6. 如权利要求5所述的LED灯丝，其特征在于，由其中一个塑胶件对所述延伸部、延展部定位衔接，使所述延伸部平行于延展部。
  7. 如权利要求1或2所述的LED灯丝，其特征在于，所述固晶区设多个用以填充荧光胶的通孔，各通孔位于相邻LED芯片之间。
  8. 如权利要求7所述的LED灯丝，其特征在于，所述固晶区的表面镀有镍膜、银膜或金膜。
  9. 如权利要求3所述的LED灯丝，其特征在于，所述金属骨架总长b不小于8mm，所述焊接区的宽度大于0.2mm，厚度大于0.1mm、小于0.5mm；所述固晶区的长度c大于金属骨架总长b的50%，所述固晶区的宽度a大于0.3mm。
  10. 如权利要求1或2所述的LED灯丝，其特征在于，所述荧光胶位于芯片发光侧的厚度大于位于芯片非发光侧的厚度。
  11. 一种照明器，其特征在于，所述照明器采用如权利要求1~9中任一项所述的LED灯丝。
PCT/CN2014/073658 2014-02-26 2014-03-19 一种led灯丝及照明器 WO2015127698A1 (zh)

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