WO2016197961A1 - 一种led灯封装支架 - Google Patents

一种led灯封装支架 Download PDF

Info

Publication number
WO2016197961A1
WO2016197961A1 PCT/CN2016/085369 CN2016085369W WO2016197961A1 WO 2016197961 A1 WO2016197961 A1 WO 2016197961A1 CN 2016085369 W CN2016085369 W CN 2016085369W WO 2016197961 A1 WO2016197961 A1 WO 2016197961A1
Authority
WO
WIPO (PCT)
Prior art keywords
wire
led lamp
heat
light
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/085369
Other languages
English (en)
French (fr)
Inventor
吴少健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2016197961A1 publication Critical patent/WO2016197961A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Definitions

  • the invention relates to a mounting bracket for an LED lamp, in particular to an LED lamp package bracket.
  • LED Light Emitting Diode
  • the heart of the LED is a semiconductor wafer with one end attached to a holder, one end being the negative pole and the other end connected to the positive pole of the power supply, so that the entire wafer is encapsulated by epoxy.
  • the semiconductor wafer consists of two parts, one part is a P-type semiconductor, in which the hole dominates, and the other end is an N-type semiconductor, which is mainly electrons here. But when the two semiconductors are connected, they form a 'P-N junction' between them. When a current is applied to the wafer through the wire, the electrons are pushed toward the P region.
  • the electrons recombine with the holes, and then the energy is emitted in the form of photons.
  • This is the principle of LED illumination.
  • the wavelength of light which is the color of light, is determined by the material that forms the P-N junction.
  • the practical and commercialization of high-performance LEDs has brought a new revolution in lighting technology.
  • the pixel lamp composed of a plurality of ultra-high-brightness red, blue and green LEDs not only emits various color lights with continuously adjustable wavelengths, but also emits white light having a brightness of tens to 100 candles, thereby becoming an illumination source.
  • the latter consumes only 10%-20% of the former.
  • white LEDs are made by coating a blue LED with a light yellow phosphor coating.
  • This yellow phosphor is usually mixed by grinding the yttrium-doped yttrium aluminum garnet crystals into powder. Made from a dense binder.
  • the LED chip emits blue light, part of the blue light is efficiently converted by this crystal into a broad spectrum of mainly yellow light. Since the yellow light stimulates the red and green light receptors in the naked eye, the blue light of the LED itself is mixed. Make it look like white light.
  • the existing LED lamps are generally mounted directly on the mounting board.
  • the mounting board is generally a sheet-like structure, including three layers: a heat dissipation layer for heat dissipation, an insulation layer for insulation under the heat dissipation layer, and an insulation layer.
  • the circuit layer to be wired wherein the heat dissipation layer is generally an aluminum foil or an aluminum alloy sheet; the circuit layer is generally made of copper foil for wiring layout.
  • the LED lamp is mounted on the heat sink layer and soldered to the circuit layer.
  • the heat dissipation performance of the mounting plate of this type of LED largely depends on the thermal conductivity index of the insulating layer, and the thermal conductivity index of the insulating layer is often not high, resulting in poor heat dissipation performance of the entire LED lamp mounting strip.
  • the entire LED lamp mounting plate has only one layer, that is, the heat dissipation layer, and the LED lamp strip is directly soldered to the LED lamp mounting plate, so as to better dissipate heat. Since the insulation layer and the wiring layer are eliminated, the energization of the LED strip can only be connected by wires. However, if the wires are distributed on the mounting plate, since the LED lamps generate a large amount of heat during the illuminating process, the insulating layer on the outer surface of the wires is melted by heat, which may cause an open circuit or even cause an accident.
  • an LED lamp package bracket comprising:
  • Each of the substrate strips includes a first wire, a second wire, and a heat wire, wherein the first wire, the second wire, and the heat wire are disposed in parallel, and the lateral direction of the substrate tape is alternately provided with a light emitting region and a heat dissipation region.
  • the first wire passes through the light emitting region;
  • the light-emitting area is provided with an LED lamp holder, and an LED lamp cup is disposed on an upper portion of the LED lamp holder, and the first wire, the second wire and the heat-conducting wire pass through the LED lamp holder and are located at the bottom of the lamp cup.
  • the first wire in the light-emitting region is a symmetrically disposed 'L' shape, and the heat wire in the heat dissipation region has a downward convex portion. .
  • the hot wire has a through hole in a portion of the light emitting region.
  • the protruding portion is a convex trapezoid.
  • the hot wire is in a portion of the heat dissipation zone, and the protruding trapezoid includes a concave slope and a concave bottom plate.
  • the LED lamp package bracket is made of copper or aluminum.
  • the LED lamp package bracket of the invention has a plurality of substrate strips for mounting LED lights, and the LED lamps are no longer connected by insulated wires, but are directly connected; the heat wires are added, and the heat wires are The downward convex portion of the heat dissipation region may be connected to the heat sink by welding or the like, so that the heat dissipation performance of the substrate tape is better; the lamp cup on the LED lamp holder can directly inject the phosphor and the top adhesive mixture to form the LED lens, and the substrate tape Together with the LED socket and the LED lens, an LED string is formed.
  • FIG. 1 is a schematic structural view of a specific embodiment of an LED lamp package bracket of the present invention.
  • FIG. 2 is a schematic structural view of a hardware bracket of an LED lamp package bracket of the present invention
  • FIG. 3 is a partial enlarged view of a hardware bracket of a specific embodiment of the LED lamp package bracket of the present invention.
  • Figure 4 is an enlarged view of the LED lamp holder of Figure 1;
  • an LED lamp package bracket includes a plurality of substrate strips disposed in parallel; each substrate strip includes a first lead 1 , a second lead 2 , and a hot lead 3 .
  • the first wire 1, the second wire 2 and the heat wire 3 are arranged in parallel, and the substrate strip is alternately provided with the light-emitting area 4 and the heat-dissipating area 5 in the lateral direction.
  • the first wire 1 is symmetrically disposed.
  • the heat conductor 3 in the heat dissipation zone 5 has a downward convex portion; the light-emitting area 4 is provided with an LED lamp holder 8, and the LED lamp holder 8 is provided with an LED lamp cup 9, an upper wire 1, a second wire 2 and The heat conducting wire 3 passes through the LED socket 8 and is located at the bottom of the lamp cup 9.
  • the lamp cup 9 is used to inject a mixture of phosphor and die top glue into an LED lens.
  • the LED lamp package bracket may be configured to include a plurality of substrate strips each time the package holder is processed according to actual needs, and the length of the substrate strip may be adjusted as needed.
  • the invention is injection molded on the basis of the metal bracket, and the structure of the metal bracket is shown in Fig. 2.
  • the hot wire 3 preferably has a through hole in a portion of the light-emitting region 4. LED light beads will be disposed on the light-emitting area 4, and the through holes of the heat wire 3 can transfer heat to the heat-dissipating area 5 better.
  • the downward projection of the heat conductor 3 in the heat dissipating region 5 is preferably a convex trapezoidal portion.
  • the trapezoid is used for soldering or bonding to other heat conductors or thermally conductive sheets to make it more heat-dissipating. Preferably, it can be soldered directly to a mounting strip made of metal.
  • the hot wire 3 of the metal bracket includes a concave slope 6 and a concave bottom plate 7 in the convex trapezoidal portion of the heat dissipation region 5.
  • the concave slope 6 allows the convex portion to extend obliquely downward, and the concave bottom plate 7 is used for welding or bonding to other heat conductors or thermally conductive sheets, so that the heat dissipation performance is stronger, and preferably, it can be directly welded to the metal.
  • the mounting plate is attached.
  • the LED lamp package bracket is made of copper or aluminum. Copper or aluminum has good thermal conductivity and is inexpensive.
  • the plurality of first conductors 1 are preferably disconnected at the LED socket 8 of the illumination zone, the disconnected sections being spaced apart during the injection molding process.
  • the parallel or series connection of the LED lights on the entire light string can be realized by the communication or disconnection of the first wire 1 under some of the lamp beads.
  • the LED lens formed by the injected phosphor and the top mold mixture can be made hemispherical under the action of surface tension.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

一种发光二极管(LED)灯封装支架，包括多条平行设置的基板带；每条基板带包括第一导线（1）、第二导线（2）和热导线（3），其中所述第一导线（1）、第二导线（2）和热导线（3）平行设置，基板带纵向方向间隔地设置有发光区（4）和散热区（5）；所述发光区（4）设有LED灯座（8），LED灯座（8）上部设有LED灯杯(9)，所述第一导线（1）、第二导线（2）和热导线（3）穿过所述LED灯座（8），并位于所述灯杯（9）的底部；在发光区（4）内第一导线（1）为对称设置的倒"L"形，散热区（5）的热导线（3）具有向下的凸出的部。各个LED灯座（8）之间不再使用绝缘导线连接，而是直接连接；增加了热导线（3），热导线（3）在其散热区（5）的向下凸起的弧形可以通过焊接等方式连接到散热片上，使得封装支架的每条基板带的散热性能更好。

Description

一种LED灯封装支架 一种LED灯封装支架
技术领域
本发明涉及一种LED灯的安装支架，尤其是涉及一种LED灯封装支架。
背景技术
LED （Light Emitting Diode），发光二极管，是一种固态的半导体器件，它可以直接把电转化为光。LED的心脏是一个半导体的晶片，晶片的一端附在一个支架上，一端是负极，另一端连接电源的正极，使整个晶片被环氧树脂封装起来。半导体晶片由两部分组成，一部分是P型半导体，在它里面空穴占主导地位，另一端是N型半导体，在这边主要是电子。但这两种半导体连接起来的时候，它们之间就形成一个'P-N结'。当电流通过导线作用于这个晶片的时候，电子就会被推向P区，在P区里电子跟空穴复合，然后就会以光子的形式发出能量，这就是LED发光的原理。而光的波长也就是光的颜色，是由形成P-N结的材料决定的。
高性能LED的实用化和商品化，使照明技术面临一场新的革命。由多个超高亮度红、蓝、绿三色LED组成的像素灯不仅可以发出波长连续可调的各种色光，而且还可以发出亮度可达几十到一百烛光的白色光成为照明光源，对于相同发光亮度的白炽灯和LED固体照明灯来说，后者的功耗只占前者的10%-20%。
现时生产的白光LED大部分是通过在蓝光LED上覆盖一层淡黄色荧光粉涂层制成的，这种黄色磷光体通常是通过把掺了铈的钇铝石榴石晶体磨成粉末后混合在一种稠密的粘合剂中而制成的。当LED芯片发出蓝光，部分蓝光便会被这种晶体很高效地转换成一个光谱较宽的主要为黄色的光，由于黄光会刺激肉眼中的红光和绿光受体，再混合LED本身的蓝光，使它看起来就像白色光。
现有的LED灯一般是直接安装在安装板上，安装板一般是片状结构，包括三层：用来散热的散热层、散热层之下用来绝缘的绝缘层、绝缘层之下的用来布线的线路层，其中散热层一般为铝箔或者铝合金片；线路层一般为铜箔制成，用来做线路布局。LED灯安装在散热层上，与线路层焊接。该种类型的LED的安装板散热性能很大程度上取决于绝缘层的热导指数，而绝缘层的热导指数往往不高，造成整个LED灯安装板带的散热性能不佳。
最理想的情况就是整个LED灯安装板只有一层，那就是散热层，LED灯带直接焊接到LED灯安装板上，这样才能更好地散热。由于取消了绝缘层和线路层，LED灯带的通电只能通过电线连接。但是如果电线分布在安装板上，由于LED灯在发光过程中会产生大量的热，电线外表的绝缘层就会受热融化，从而造成断路，甚至会酿成事故。
发明内容
为了克服现有技术的不足，本发明提出一种LED灯封装支架包括：
多条平行设置的基板带；
每条基板带包括第一导线、第二导线和热导线，其中所述第一导线、第二导线和热导线平行设置，所述基板带的横向方向交替地设置有发光区和散热区，所述第一导线穿过所述发光区；
所述发光区设有LED灯座，LED灯座上部设有LED灯杯，所述第一导线、第二导线和导热线穿过所述LED灯座，并位于所述灯杯的底部, 在所述发光区内的第一导线为对称设置的'L'形，在所述散热区的热导线具有向下的凸出部。。
进一步地，若干所述的第一导线在所述发光区处断开。
进一步地，所述热导线在发光区的部分具有通孔。
进一步地，所述热导线在散热区的部分，其凸出部为凸出的梯形。
进一步地，所述热导线在散热区的部分，所述凸出的梯形包括下凹斜坡及下凹底板。
进一步地，所述LED灯封装支架材质为铜或铝。
本发明所述的LED灯封装支架，具有多条基板带，基板带用于安装LED灯，各个LED灯之间不再使用绝缘导线连接，而是直接连接；增加了热导线，热导线在其散热区的向下凸起部可以通过焊接等方式连接到散热片上，使得基板带的散热性能更好；LED灯座上的灯杯可以直接注入荧光粉和模顶胶混合物形成LED透镜，基板带与LED灯座和LED透镜一起形成LED灯串。
附图说明
为了更清楚地说明本发明的实施例，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一个实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本发明LED灯封装支架一个具体实施例结构示意图；
图2是本发明LED灯封装支架的五金支架结构示意图；
图3是本发明LED灯封装支架一个具体实施例的五金支架局部放大图；
图4是图1中LED灯座放大图；
图中：1-第一导线；2-第二导线；3-导热线；4-发光区；5-散热区；6-下凹斜坡；7-下凹底板；8-LED灯座；9-灯杯。
具体实施方式
下面结合具体实施方式对本发明作进一步的说明。其中，附图仅用于示例性说明，表示的仅是示意图，而非实物图，不能理解为对本专利的限制；为了更好地说明本发明的实施例，附图某些部件会有省略、放大或缩小，并不代表实际产品的尺寸；对本领域技术人员来说，附图中某些公知结构及其说明可能省略是可以理解的。
请参见图1、2和图4，本发明具体实施例，一种LED灯封装支架包括多条平行设置的基板带；每条基板带包括第一导线1、第二导线2和热导线3，其中第一导线1、第二导线2和热导线3平行设置，基板带横向方向交替地设置有发光区4和散热区5，在发光区4内第一导线1为对称设置的倒'L'形，散热区5内的热导线3具有向下的凸出部；发光区4设有LED灯座8，LED灯座8上部设有LED灯杯9，第一导线1、第二导线2和导热线3穿过LED灯座8，并位于灯杯9的底部。
灯杯9用于注入荧光粉和模顶胶混合物成型为LED透镜。
本发明具体实施例中，LED灯封装支架根据实际需要的不同，每次加工成的封装支架可以包括多条基板带，基板带的长度可以根据需要进行调整。
本发明是在五金支架的基础上注塑而成，五金支架的结构如图2所示。
在本发明的具体实施例中，热导线3在发光区4的部分优选具有通孔。发光区4上将会设置有LED灯珠，热导线3的通孔可以使得热量更好地传递到散热区5去。
在本发明的具体实施例中，散热区5内的热导线3向下的凸出部优选为凸出的梯形部。梯形用于焊接或粘接到其它导热体或导热片上，使得其散热性能更强，优选地，可以直接焊接到金属制成的安装板带上。
请参见图3，本发明的具体实施例中，五金支架的热导线3在散热区5的凸出的梯形部包括下凹斜坡6及下凹底板7。下凹斜坡6使得凸出部分斜向下延伸，而下凹底板7则用于焊接到或粘接到其它导热体或导热片上，使得其散热性能更强，优选地，可以直接焊接到金属制成的安装板带上。
在本发明具体实施例中，LED灯封装支架的材质为铜或铝。铜或铝的导热性能好，并且价格便宜。
在本发明具体实施例中，若干第一导线1优选在发光区的LED灯座8处是断开的，断开部分在注塑加工时被隔开。应用本发明的基板带制成的LED灯串中，通过某些灯珠下方的第一导线1的连通或断开，可以实现整个灯串上LED灯的并联或串联。调整灯杯9底部和开口的大小及其开口处边缘的形状，可以使得注入的荧光粉和模顶胶混合物成型的LED透镜在表面张力的作用下成为半球形。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (6)

  1. 一种LED灯封装支架，其特征在于，包括：
    多条平行设置的基板带；
    每条基板带包括第一导线、第二导线和热导线，其中所述第一导线、第二导线和热导线平行设置，所述基板带的横向方向交替地设置有发光区和散热区；
    所述发光区设有LED灯座，LED灯座上部设有LED灯杯，所述第一导线、第二导线和导热线穿过所述LED灯座，并位于所述灯杯的底部；在所述发光区内的第一导线为对称设置的“L”形，在所述散热区的热导线具有向下的凸出部。
  2. 根据权利要求1所述的LED灯封装支架，其特征在于，若干所述的第一导线在所述发光区处断开。
  3. 根据权利要求1所述的LED灯封装支架，其特征在于，所述热导线在发光区的部分具有通孔。
  4. 根据权利要求1所述的LED灯封装支架，其特征在于，所述热导线在散热区的部分，其凸出部为凸出的梯形。
  5. 根据权利要求4所述的LED灯封装支架，其特征在于，所述热导线在散热区的部分，所述凸出梯形包括下凹斜坡及下凹底板。
  6. 根据权利要求1-5任意一项所述的LED灯封装支架，其特征在于，所述LED灯封装支架的材质为铜或铝。
PCT/CN2016/085369 2015-06-11 2016-06-08 一种led灯封装支架 Ceased WO2016197961A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510320870.1 2015-06-11
CN201510320870.1A CN105047787A (zh) 2015-06-11 2015-06-11 一种led灯封装支架

Publications (1)

Publication Number Publication Date
WO2016197961A1 true WO2016197961A1 (zh) 2016-12-15

Family

ID=54454170

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/085369 Ceased WO2016197961A1 (zh) 2015-06-11 2016-06-08 一种led灯封装支架

Country Status (2)

Country Link
CN (1) CN105047787A (zh)
WO (1) WO2016197961A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104930476A (zh) * 2015-06-11 2015-09-23 吴少健 一种led灯五金支架
CN105047787A (zh) * 2015-06-11 2015-11-11 吴少健 一种led灯封装支架
CN107830430B (zh) * 2017-11-21 2023-10-03 浙江阳光美加照明有限公司 一种led灯条的基板及led灯条
CN110645487A (zh) * 2019-10-18 2020-01-03 吴少健 一种矩阵式led灯源

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013774A1 (en) * 2005-07-28 2007-02-01 Sailux, Inc. Light emitting device package structure, method of manufacturing the light emitting device package structure, and method of manufacturing light emitting device adopting the same
CN102364713A (zh) * 2011-11-08 2012-02-29 吕能兵 一种led支架及共晶方法
WO2012034888A1 (de) * 2010-09-16 2012-03-22 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches halbleiterbauteil und leiterrahmenverbund
CN103994359A (zh) * 2014-06-10 2014-08-20 吴锦星 一种模组化led灯条及其加工方法
CN203812910U (zh) * 2014-03-28 2014-09-03 木林森股份有限公司 一种高利用率和高光效的led阵列支架
CN104930476A (zh) * 2015-06-11 2015-09-23 吴少健 一种led灯五金支架
CN105047787A (zh) * 2015-06-11 2015-11-11 吴少健 一种led灯封装支架
CN204760382U (zh) * 2015-06-11 2015-11-11 吴少健 一种led灯封装支架
CN205014297U (zh) * 2015-06-11 2016-02-03 吴少健 一种led灯五金支架

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201594551U (zh) * 2009-11-05 2010-09-29 深圳市瑞丰光电子股份有限公司 一种led封装单元及发光装置
CN102200235A (zh) * 2010-03-26 2011-09-28 上海东熠光电有限公司 Led发光条
CN104332451B (zh) * 2014-11-24 2017-02-22 深圳市富美达五金有限公司 一种光耦封装支架

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013774A1 (en) * 2005-07-28 2007-02-01 Sailux, Inc. Light emitting device package structure, method of manufacturing the light emitting device package structure, and method of manufacturing light emitting device adopting the same
WO2012034888A1 (de) * 2010-09-16 2012-03-22 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches halbleiterbauteil und leiterrahmenverbund
CN102364713A (zh) * 2011-11-08 2012-02-29 吕能兵 一种led支架及共晶方法
CN203812910U (zh) * 2014-03-28 2014-09-03 木林森股份有限公司 一种高利用率和高光效的led阵列支架
CN103994359A (zh) * 2014-06-10 2014-08-20 吴锦星 一种模组化led灯条及其加工方法
CN104930476A (zh) * 2015-06-11 2015-09-23 吴少健 一种led灯五金支架
CN105047787A (zh) * 2015-06-11 2015-11-11 吴少健 一种led灯封装支架
CN204760382U (zh) * 2015-06-11 2015-11-11 吴少健 一种led灯封装支架
CN205014297U (zh) * 2015-06-11 2016-02-03 吴少健 一种led灯五金支架

Also Published As

Publication number Publication date
CN105047787A (zh) 2015-11-11

Similar Documents

Publication Publication Date Title
US8492777B2 (en) Light emitting diode package, lighting device and light emitting diode package substrate
US9874318B2 (en) LED assembly and LED bulb using the same
JP2016171147A (ja) 発光装置および照明装置
WO2013067945A1 (zh) 发光二极管灯芯和采用发光二极管作为光源的照明装置
CN104566292B (zh) 一种led全方位出光的高光效高导热散热结构
WO2016197961A1 (zh) 一种led灯封装支架
WO2016197957A1 (zh) 一种led灯五金支架
WO2016202213A1 (zh) 一种led日光管
US8664838B2 (en) Illumination apparatus and a method of assembling the illumination apparatus
WO2016011809A1 (zh) 高压发光二极管芯片及其制作方法
CN103956356A (zh) 一种高效导热的大功率led集成封装结构
CN105161602B (zh) 一种带加强筋的led线路板
CN207097867U (zh) 一种无荧光粉型黄白光led路灯
CN101286508A (zh) 大功率led封装结构
CN206361437U (zh) Led灯丝与led球泡灯
WO2016197963A1 (zh) 一种led灯板结构
CN204760382U (zh) 一种led灯封装支架
CN104930388A (zh) 一种led基板带
WO2017049669A1 (zh) 一种led线路板
CN205014297U (zh) 一种led灯五金支架
CN203413588U (zh) Led光源板组件、led灯芯和led照明装置
WO2016184372A2 (zh) Led光源组件、led光电一体化模组和led射灯
CN203707126U (zh) 一种新型陶瓷cob封装结构
CN205383455U (zh) 一种大芯片led灯丝及大芯片led灯丝灯泡
CN205900589U (zh) 一种led集成光源

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16806859

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16806859

Country of ref document: EP

Kind code of ref document: A1