WO2015103813A1 - 一种led灯丝及灯具 - Google Patents

一种led灯丝及灯具 Download PDF

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Publication number
WO2015103813A1
WO2015103813A1 PCT/CN2014/073652 CN2014073652W WO2015103813A1 WO 2015103813 A1 WO2015103813 A1 WO 2015103813A1 CN 2014073652 W CN2014073652 W CN 2014073652W WO 2015103813 A1 WO2015103813 A1 WO 2015103813A1
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die bonding
led
substrate
led filament
bonding region
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PCT/CN2014/073652
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English (en)
French (fr)
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游志
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深圳市瑞丰光电子股份有限公司
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Publication of WO2015103813A1 publication Critical patent/WO2015103813A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Definitions

  • the invention belongs to the technical field of illumination, and in particular relates to an LED filament and a lamp.
  • the LED filament product is made of BT board or opaque substrate such as FR4 or metal substrate. After lighting, there is a dark area on the back side of the substrate, and the light color consistency is poor, which affects the lighting effect.
  • An object of the embodiments of the present invention is to provide an LED filament, which aims to solve the problem of poor color consistency of the existing LED filament.
  • an LED filament comprising a substrate and a fluorescent glue, wherein the middle portion of the substrate is a die bonding region, and a plurality of LED chips electrically connected by wires are disposed on the front and back sides of the die bonding region.
  • a support column higher than a predetermined height of the wire is disposed on each side of each LED chip, and the solid crystal region and the LED chip are completely covered by the fluorescent glue.
  • Another object of embodiments of the present invention is to provide a luminaire that uses the LED filament described above.
  • a support pillar higher than a wire for connecting the LED chip is disposed on the front surface and the back surface of the substrate solid crystal region, so that the front surface of the LED chip is fixed on the back surface (front surface) of the die bonding region ( The back side) the soldered LED chip and its wire will be protected by the support column, and the LED chip can be fixed on both sides of the substrate without changing the existing process and without adding a fixture.
  • the front and back sides of the filament can be evenly illuminated, completely solving the problem of inconsistent light color on the front and back of the existing filament products. Therefore, the LED filament can be widely applied to various lamps.
  • FIG. 1 is a schematic structural view of an LED filament provided by an embodiment of the present invention.
  • Figure 2 is a schematic cross-sectional view taken along line A-A of Figure 1;
  • Figure 3 is a cross-sectional view taken along line B-B of Figure 1.
  • a support pillar higher than a wire for connecting the LED chip is disposed on the front surface and the back surface of the substrate solid crystal region, so that the front surface of the LED chip is fixed on the back surface (front surface) of the die bonding region ( The back side) the soldered LED chip and its wire will be protected by the support column, and the LED chip can be fixed on both sides of the substrate without changing the existing process and without adding a fixture.
  • the front and back sides of the filament can be evenly illuminated, completely solving the problem of inconsistent light color on the front and back of the existing filament products.
  • the LED filament provided by the embodiment of the present invention comprises a substrate 1 and a fluorescent glue.
  • the middle portion of the substrate 1 is a die bonding region 11 , and a plurality of LED chips 3 electrically connected by the wires 4 are disposed in the
  • the front and back sides of the solid crystal region 11 are provided with support pillars 5 higher than the predetermined height of the wires 4 on both sides of the LED chip 3.
  • the solid crystal region 11 and the LED chip 3 are completely covered by the fluorescent glue.
  • the substrate 1 is an opaque hard substrate such as a BT plate, an FR4 plate, a metal plate or a ceramic plate.
  • the support column 5 can be made of transparent or other colored plastic (such as thermoplastic or thermosetting material).
  • the LED chip 3 when the LED chip 3 is bonded to the LED chip 3 on the back surface (front surface) of the die bonding region 11, the front surface (back surface) of the LED chip 3 and the wire 4 which have been soldered are protected by the support column 5,
  • the LED chip 3 is fixed on both sides of the substrate without changing the existing process and without additional fixtures.
  • the LED filaments thus produced can be uniformly illuminated on both sides, completely solving the front and back color of the existing filament products. Inconsistent issues.
  • the cross section of the support column 5 is "H", and the distance d between the highest point and the same side surface of the substrate is greater than 0.15 mm, and is located on the same side of the substrate.
  • the support columns 5 are of the same height, which ensures that the wires 4 connecting the LED chips 3 are located in the recesses 50 of the support columns.
  • the side of the support post 5 facing the LED chip 3 is beveled, as shown in the side faces 17, 18 of Figures 1, 3, which facilitates light extraction.
  • the LED filament can be either a double-sided single electrode or a single-sided two-electrode, and the design is flexible.
  • the LED filament provided in this embodiment adopts a bilateral single-electrode pattern, wherein both ends of the substrate 1 are soldering regions 12, and one end of the solid crystal region 11 is disconnected from the soldering region 12, so that The positive and negative poles of the LED filament are broken, and the damage to the entire substrate is small.
  • both ends of the solid crystal region 11 may be disconnected from the corresponding solder regions 12.
  • the lands 12 which are disconnected from the die bonding region 11 are provided with a notch 13 , and the smaller end 14 of the die bonding region is received in the notch 13 as shown in FIG. 1 .
  • the smaller end 14 of the solid crystal region is positioned and engaged by the support column located at the end of the soldering region 12, so that the smaller end 14 of the solid crystal region is located in the middle of the notch 13 and parallel to each other, thereby disconnecting
  • the positive and negative poles of the LED filament are described. This enhances the connection strength between the die-bonding region 11 and the break of the soldering region 12, and further improves the reliability of the LED filament.
  • the substrate 1 is embedded in the support column 16 and may be partially or completely wrapped in the plastic. This ensures that the positive and negative positions are relatively stable, is not easily broken at the break, and improves the overall strength of the substrate 1.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED灯丝及灯具，LED灯丝包括基板（1）和荧光胶，基板（1）中间部分为固晶区（11），多个由导线（4）电连接的LED芯片（3）设于固晶区（11）的正面及背面，各LED芯片（3）两旁均设高于导线（4）预定高度的支撑柱（5），荧光胶完全覆盖固晶区（11）及LED芯片（3）。在固晶区（11）的背面或正面对LED芯片（3）固晶焊线时，其正面或背面已固焊好的LED芯片（3）及其导线（4）将由支撑柱（5）所保护，则可在不改变现有制程和不另外添加治具的条件下实现基板（1）正反两面固焊LED芯片（3），如此制成的LED灯丝正反两面可均匀发光，彻底解决了现有灯丝产品正面、背面光色不一致的问题。本LED灯丝可广泛应用于各种灯具。

Description

一种LED灯丝及灯具
本发明属于照明技术领域，尤其涉及一种LED灯丝及灯具。
目前，LED灯丝产品由BT板或是FR4，金属基板等不透明基板制成，点亮后往往会在基板背面存在暗区，光色一致性差，影响照明效果。
本发明实施例的目的在于提供一种LED灯丝，旨在解决现有LED灯丝光色一致性差的问题。
本发明实施例是这样实现的，一种LED灯丝，包括基板和荧光胶，所述基板中间部分为固晶区，多个由导线电连接的LED芯片设于所述固晶区的正面及背面，各LED芯片两旁均设高于所述导线预定高度的支撑柱，由所述荧光胶完全覆盖固晶区及LED芯片。
本发明实施例的另一目的在于提供一种灯具，所述灯具采用上述LED灯丝。
本发明实施例先于基板固晶区的正面及背面设置高于用以连接LED芯片的导线的支撑柱，这样在固晶区的背面（正面）对LED芯片固晶焊线时，其正面（背面）已固焊好的LED芯片及其导线将由支撑柱所保护，则可在不改变现有制程和不另外添加治具的条件下实现基板正反两面固焊LED芯片，如此制成的LED灯丝正反两面可均匀发光，彻底解决了现有灯丝产品正面、背面光色不一致的问题。因而，本LED灯丝可广泛应用于各种灯具。
图1是本发明实施例提供的LED灯丝的结构示意图；
图2是图1 A-A截面示意图；
图3是图1 B-B截面示意图。
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明实施例先于基板固晶区的正面及背面设置高于用以连接LED芯片的导线的支撑柱，这样在固晶区的背面（正面）对LED芯片固晶焊线时，其正面（背面）已固焊好的LED芯片及其导线将由支撑柱所保护，则可在不改变现有制程和不另外添加治具的条件下实现基板正反两面固焊LED芯片，如此制成的LED灯丝正反两面可均匀发光，彻底解决了现有灯丝产品正面、背面光色不一致的问题。
以下结合具体实施例对本发明的实现进行详细描述。
如图1~3所示，本发明实施例提供的LED灯丝包括基板1和荧光胶，所述基板1中间部分为固晶区11，多个由导线4电连接的LED芯片3设于所述固晶区11的正面及背面，各LED芯片3两旁均设高于所述导线4预定高度的支撑柱5，由所述荧光胶完全覆盖固晶区11及LED芯片3。其中，所述基板1为不透明硬质基板，如BT板、FR4板、金属板或陶瓷板等。所述支撑柱5可以由透明的或是其它有色塑胶（如热塑或是热固性材质）制成。这样在所述固晶区11的背面（正面）对LED芯片3固晶焊线时，其正面（背面）已固焊好的LED芯片3及其导线4将由支撑柱5所保护，则可在不改变现有制程和不另外添加治具的条件下实现基板正反两面固焊LED芯片3，如此制成的LED灯丝正反两面可均匀发光，彻底解决了现有灯丝产品正面、背面光色不一致的问题。
如图2所示，本发明实施例中所述支撑柱5的横截面呈“H”型，其最高点与所述基板同侧表面的距离d大于0.15mm，且位于所述基板同一侧的支撑柱5高度相同，如此可确保连接所述LED芯片3的导线4位于支撑柱的凹槽50内。另外，所述支撑柱5朝向LED芯片3的侧面均为斜面，如图1、3中的侧面17、18，这有利于出光。
通常，所述LED灯丝既可以是双边单电极，也可以是单边双电极，设计灵活。如图1所示，本实施例提供的LED灯丝采取双边单电极样式，其中所述基板1两端均为焊接区12，所述固晶区11有一端与焊接区12断开，如此可将本LED灯丝的正、负极断开，而且对整个基板破坏较小。当然，所述固晶区11两端均与相应的焊接区12断开亦可。
其中，与所述固晶区11断开的焊接区12设一缺口13，所述固晶区较小端14容置于该缺口13，如图1所示。在此由位于所述焊接区12端部的支撑柱对固晶区较小端14进行定位衔接，使所述固晶区较小端14位于缺口13的中部，且相互平行，从而断开所述LED灯丝的正、负极。这样增强了所述固晶区11与焊接区12的断开处的连接强度，进一步提升本LED灯丝的可靠性。前述基板1嵌在所述支撑柱16中，可以是部分或是全部包裹在塑胶中，如此保证正、负极位置相对稳定，在断开处不易断裂，同时提高了基板1的整体强度。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (9)

  1. 一种LED灯丝，其特征在于，包括基板和荧光胶，所述基板中间部分为固晶区，多个由导线电连接的LED芯片设于所述固晶区的正面及背面，各LED芯片两旁均设高于所述导线预定高度的支撑柱，由所述荧光胶完全覆盖固晶区及LED芯片。
  2. 如权利要求1所述的LED灯丝，其特征在于，所述支撑柱的横截面呈“H”型，其最高点与所述基板同侧表面的距离d大于0.15mm。
  3. 如权利要求1或2所述的LED灯丝，其特征在于，所述支撑柱朝向LED芯片的侧面均为斜面。
  4. 如权利要求3所述的LED灯丝，其特征在于，所述基板两端均为焊接区，所述固晶区至少有一端与焊接区断开。
  5. 如权利要求4所述的LED灯丝，其特征在于，与所述固晶区断开的焊接区设一缺口，所述固晶区较小端容置于该缺口。
  6. 如权利要求5所述的LED灯丝，其特征在于，由位于所述焊接区端部的支撑柱对固晶区较小端进行定位衔接，使之位于所述缺口的中部，从而断开所述LED灯丝的正、负极。
  7. 如权利要求6所述的LED灯丝，其特征在于，所述基板为金属板、FR4板、BT板或陶瓷板。
  8. 如权利要求7所述的LED灯丝，其特征在于，所述基板表面镀有银膜或金膜。
  9. 一种灯具，其特征在于，所述灯具采用如权利要求1~8中任一项所述的LED灯丝。
PCT/CN2014/073652 2014-01-13 2014-03-19 一种led灯丝及灯具 WO2015103813A1 (zh)

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US11326746B2 (en) 2018-12-13 2022-05-10 Signify Holding B.V. Lighting device with light-emitting filaments
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CN101907241A (zh) * 2009-06-08 2010-12-08 刘世全 一种改进型led灯条
CN202691739U (zh) * 2012-07-20 2013-01-23 深圳市壹流明光电科技有限公司 四面发光软灯条
CN202834962U (zh) * 2012-08-08 2013-03-27 安徽兆利光电科技有限公司 Led软灯条

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CN107101093B (zh) * 2017-03-13 2023-09-01 浙江鼎鑫工艺品有限公司 一种灯具
USD834740S1 (en) 2017-09-29 2018-11-27 Pt. Ho Wah Genting Worklight
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