TW540168B - LED package with metal substrates protrusion outside the glue - Google Patents

Abstract

This invention discloses a higher soldering reliability package for LED with extended metal substrates protrusion outside the protection glue. The solder material covers the up surface of the metal protrusion ends to enhance the solderabi1ity after the package mounted to a board. This application is different from a prior application submitted by the same applicant with Taiwan application number 090124223 is that this application features that the glue comprises fluorescent material or other light modification material to modify the light emission color different from the original light color of the chip.

Description

540168 V. Description of the invention (1) -------- 1 · Applicable fields of this technology This technology is applicable to the packaging technology of light-emitting diode chips. 2 · Background Description Figure 1 · Top view of conventional techniques. The technique is shown in Figure 1 (Taiwan Patent Application No. 08 9 1 0 99 99 and Mei, 1 = Ming Ming No. 09 / 596,907) The light-emitting diode metal substrate === road package, the metal substrate 11 · 12 · all of which is encapsulated above the gel = the bare metal substrate is provided for subsequent welding. FIG. 1 is a top view of the 刖 craft, showing a metal substrate 丨 丨 12 12 having a concave edge 14 and a groove 17, a light emitting diode wafer 10 is disposed above the first metal substrate 11 to wire 1 3 The surface electrode of the light-emitting diode wafer is coupled to the second metal substrate 12, and the bottom electrode of the light-emitting diode wafer is coupled to the first metal substrate 11. Finally, it is encapsulated with protective colloid, as shown in Figure 2. Figure 2. Section AA of Figure 1. Figure 2 is a cross-sectional view cut along line AA of Figure 1. It shows that the encapsulant i 5 will fill the groove 17 and the encapsulant will fill the side of the recess 14. The protective colloid 15 next to 14 connects the protective colloid 15 in the groove 17 with the metal substrate 11 · 1 2 · The upper protective colloid 15 is connected to form the protective colloid 15 as a whole, so that the protective colloid 15 can be firmly connected to Metal substrate 丨 丨 · 丨 2 · combined. This know-how only exposes the lower surface of the metal substrate 11 · 12 ·, which is provided as a rear

Page 5 540168 V. Description of the invention (2) ΪΠ: Since only the lower surface is provided for welding, its welding reliability: and No.-ί: Tishan welding reliability, left of the first metal substrate = metal base The right side of the material protrudes from the encapsulating gel 25.35. The material can be covered to the protruding metal feet β on the table. * 3 · Detailed description of the technique Figure 3 · Sectional view of the first embodiment of the technique Both sides of the base material 21 · 22 · are protruded from the encapsulating gel 25, as shown in the conventional art. Metal substrate 21. 22 · has a groove 25, and the body 25 is filled in the groove 27. The encapsulating gel dream gel in the groove 27 ^^^ The concave edge 14 shown in FIG. 1 and the metal substrate 21.22. Surface The seal ^ 二 Ϊμ is synthesized as a whole. The light-emitting diode wafer 20 is disposed on the pole coupled to the J material 21, and the surface electrode of the light-emitting diode wafer is metallized by wire bonding. The bottom surface of the light-emitting diode wafer 20 is electrically contact-coupled to the first metal. Substrate 21. It is the welding schematic diagram of Fig. 3: = substrate 21 · 22. The area B protruding from both sides of the protection body 25, when connected, the soldering material 26 can be covered in the area of [上 \ Β in the direction of the solder Reliability. Top, Fig. 5 · Sectional view of the second embodiment of the technique

Page 6 540168 V. Description of the invention (3) It is shown that the encapsulating colloid 25 can also cover the lower surface of the metal substrate 21 · 22 · as shown in thickness C to increase the interval between the encapsulating colloid 25 and the metal substrate 212g. ; Stability. ··· Figure 6. Sectional view of the third embodiment of the present technology shows a metal substrate 211 · 221 · With a groove 271, the groove 2n can be obtained by chemical etching or semi-etching, or by mechanical cutting, as shown in Figure 3 · The stamping groove 27 of 4.5 is different, but the filling effect of the encapsulation gel 25 is the same. Figure 7 · The fourth cross-sectional view of the fourth embodiment of the present technology shows that the metal substrate 31 · 32 · is L-shaped, and the function of the recess 37 is the same as that of the previous groove 27 · 271 ·. The bonding stability between the encapsulant 35 and the metal substrate 31 · 32 ·. Figure 8. The cross-sectional view of the fifth embodiment of the present technology shows that the recess 37 of the metal substrate 311.312. Is further increased by the groove 371, which is also to increase the filling volume of the encapsulating colloid 35, and to increase the gap between the encapsulating colloid 35 and the metal buff 311 · 321 ·. Combined stability. Figure 9 · Sectional view of the sixth embodiment of the present technology shows that the encapsulating colloid 35 can also be covered on the lower surface of the metal substrate 311 · 321 ·, compared with Fig. 8, the lower surface has an increased area]) covered by the encapsulating colloid. This can separate the solder area of the metal feet on both sides relatively far, reducing the solder

540168 V. Description of the invention (4) Opportunity of material short circuit. Figure 10. The top view of the seventh embodiment of the present technology shows that the metal substrate 311 · 321 · can also be dug out through holes 381, allowing the protective colloid 35 to be filled with 'improving the sealing colloid 35 and the metal substrate 3 丨 1β 321 • of Inter-bound stability. The concave edge 24 has the same function as the concave edge 14 in FIG. 1, and the protective colloid 3 5 in the groove is connected to the metal substrate 3 11 · 3 2 1 · the upper protective colloid 35 α Fig. 11 · Eighth embodiment of this technical embodiment The plan view shows that the upper surface of the metal substrate 311_321. Is roughened to improve the bonding stability between the encapsulant 35 and the metal substrate 311 · 321 ·. The lower surface of the metal substrate 311 · 3 21 · can also be roughened to provide the same effect. Fig. 12 · Ninth cross-sectional view of the embodiment of the present technology shows that a concave cup 39 can be made at the center of the encapsulating gel 35 to provide the function of enhancing light gathering. 3 Figure 1 3 · Ten cross-sectional views of the embodiment of the present technology show that the light-emitting monopolar wafer 201 has a double-surface electrode, which is respectively coupled to a metal substrate 31.32 by wire 131.132 ·. Figure 1 4. Sectional view of the eleventh embodiment of the present technology shows that the light emitting diode wafer 202 has double bottom electrodes, which are respectively in contact with light &

Page 8 540168 V. Description of the invention (5)

To the metal substrate 3 1 β 3 L Figure 1 5 · The twelve cross-sectional view of the embodiment of this technology The protective colloid 351 of the technology contains a fluorescent material or other light body ^ 枓: When the prepared wafer 202 emits light, 'fluorescent material or Other light modifiers

ϊ, the addition of light, or the effect of light transition, so that the output light of I and the original color of the chip are not different, increasing the change of excellent light color. The description reveals the preferred embodiment of the present invention and the design scheme, but the = scheme is only an example, and is not intended to limit the current day 2d: This' everything is implemented by equal means; The scope of rights covered by the "Scope of Patent Application" mentioned above and Beckett = the right of the applicant without departing from the spirit of the invention

540168 Brief description of the drawings 4. Brief description of the drawings-Figure 1. Top view of the conventional technique Figure 2. Figure 1, AA sectional view Figure 3. Sectional view of the embodiment of this technology _ Figure 4. Figure 3. Welding schematic diagram 5. Sectional view of the second embodiment of the technology-Fig. 6. Sectional view of the third embodiment of the technology. Figure 7 · Sectional view of the fourth embodiment of the technology. Stomach 1 Figure 8. Sectional view of the fifth embodiment of the technology. The sixth embodiment of the present invention is a cross-sectional view of FIG. 10. The seventh embodiment of the present art is a top view of FIG. 11. The eighth embodiment of the present art is a top view of FIG. 12. The ninth embodiment of the present art is a sectional view of FIG. 1 4. Sectional view of the eleventh embodiment of the technology FIG. 1 5. Sectional view of the twelveth embodiment of the technology 5. Part number table wafer 1 0. 2 0.20 1.2 0 2. Metal substrate 11. 12. 21. 22. 211 221. 31 · 32 · 311 · 321. Wired 1 3.

Page 540168 Simple illustration of the drawing. Concave edge 1, 4, 24. Concave groove 17. 27. 271, 37 · 371. Packaging gel 15.25 · 35 · 351. Solder footprint 2 6. Through hole 381. Rough surface 3 8 2 '' Concave cup 3 9.

Page 11

Claims (1)

540168 6. Scope of patent application-1 · A metal substrate with a light emitting diode chip package protruding from the colloid on both sides, including: a light emitting diode chip; a first metal substrate, which bears the aforementioned chip and is electrically coupled to I. The electrode of the f-sheet of the light-emitting diode described above; there is at least one first indented region on the periphery and the lower surface of the aforementioned first indented region has a first groove; the third metal substrate, electrical One of the electrodes 1 which is coupled to the aforementioned light-emitting diode wafer and has at least one second indented region on the periphery, and a second recess in the lower surface of the aforementioned second indented region; and In the aforementioned first metal substrate and the second indentation, the protective colloid described above exists in the aforementioned-. ^ The first dimple, the second dimple region, and the second indentation, ^ bare the aforementioned The first metal substrate and the two outer ends of the aforementioned second gold make the extension protrude out of the aforementioned protective colloid; ": said colloidal colloid, which includes a fluorescent material or other light modification J ' The color of the light is different Out of light 2 = 1, please refer to the metal substrate described in item 1 of the patent scope on both sides to protrude. S first-polar chip package, where the first metal-based-package No. 12 I MU168 6. Apply for a patent through a through-hole to provide the aforementioned encapsulation colloid filling to improve package stability. • The metal substrate as described in item 1 of the M patent scope is protruded from the colloid on both sides of the colloid = light-emitting polar chip package. Wherein, the second metal substrate further includes at least one through hole to provide the aforementioned encapsulation colloid filling and lifting stability. 4. The metal substrate as described in item 1 of the scope of the patent application is bilaterally protruded from the colloid = light emitting diode chip package, wherein the first metal substrate further includes a rough upper surface, providing the aforementioned Encapsulation stability of encapsulant. 5. The light emitting diode chip package with the metal substrate protruding from the colloid as described in item 1 of the scope of the patent application, wherein the first metal substrate further includes a rough lower surface to provide the aforementioned package. Packaging stability of colloid. 6. The light-emitting diode chip package with the metal substrate protruding from the colloid as described in item 1 of the scope of the patent application, wherein the second metal substrate further includes a rough upper surface to provide the aforementioned package. Packaging stability of colloid. 7. The light-emitting diode chip package with the metal substrate protruding from the adhesive on both sides as described in item 1 of the scope of the patent application, wherein the second metal substrate further includes a rough lower surface to provide the aforementioned Encapsulation of sealant ^ stability. Page 13 540168 6. Scope of patent application · 8 · The metal substrate described in item 1 of the scope of patent application is bilaterally protruding out of the colloid · The light-emitting diode chip package, wherein the encapsulation colloid includes a concave The 'cup' provides the function of spotlight. 9. The light-emitting diode chip package in which the metal substrate has two sides protruding from the colloid as described in item 1 of the scope of the patent application, where the engagement refers to contact coupling. 10. The light-emitting diode chip package with the metal substrate protruding bilaterally from the colloid as described in item 1 of the scope of patent application, wherein the coupling refers to wire-type coupling. 11 · The light-emitting diode chip package with the metal substrate protruding bilaterally from the colloid as described in item 1 of the scope of the patent application, wherein the first metal substrate and the first metal substrate refer to a plate-like substrate. Metal substrate. 1 2 · The light-emitting diode chip package with the metal substrate protruding bilaterally from the colloid as described in item 1 of the scope of patent application, wherein the first metal substrate and the second metal substrate refer to L-shaped metal Substrate. A method for packaging a light-emitting diode chip with a metal substrate protruding bilaterally from a colloid, comprising: preparing a light-emitting diode wafer;-540168 VI. Application for a patent Preparation of a first metal substrate, carrying the aforementioned wafer and electrically coupling One of the electrodes of the aforementioned light-emitting diode wafer; the periphery has at least one first indented region, and the lower surface of the first indented region has a first groove; a second metal substrate is prepared, and is electrically coupled to One of the electrodes of the aforementioned light-emitting diode wafer, the periphery of which has at least one second indented region, and the lower surface of the second indented region has a second recess; and a protective gel is prepared, and the package is protected and placed in the aforementioned one. The components on the surface of the first metal substrate and the second metal substrate; the aforementioned protective colloid exists in the aforementioned first retracted region, the first recessed groove, the second recessed region, and the second recessed groove; and is exposed The outer ends of the two sides of the first metal substrate and the second metal substrate make the extension protrude from the aforementioned protective colloid; the aforementioned packaging colloid includes a fluorescent material Or other light-modifying materials, the light color of the aforementioned wafer is converted into different colors of outgoing light. Page 15